WO2019069835A1 - Composition, cured product, and method for producing cured product - Google Patents

Composition, cured product, and method for producing cured product Download PDF

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Publication number
WO2019069835A1
WO2019069835A1 PCT/JP2018/036598 JP2018036598W WO2019069835A1 WO 2019069835 A1 WO2019069835 A1 WO 2019069835A1 JP 2018036598 W JP2018036598 W JP 2018036598W WO 2019069835 A1 WO2019069835 A1 WO 2019069835A1
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group
carbon atoms
compound
composition
alkyl group
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PCT/JP2018/036598
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French (fr)
Japanese (ja)
Inventor
有希子 金原
光裕 岡田
哲千 中屋敷
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株式会社Adeka
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Priority to CN201880045851.4A priority Critical patent/CN110869467B/en
Priority to KR1020197035706A priority patent/KR102629376B1/en
Priority to JP2019546685A priority patent/JP7236386B2/en
Publication of WO2019069835A1 publication Critical patent/WO2019069835A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/06Ethers; Acetals; Ketals; Ortho-esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/07Aldehydes; Ketones
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472Five-membered rings
    • C08K5/3475Five-membered rings condensed with carbocyclic rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K15/00Anti-oxidant compositions; Compositions inhibiting chemical change
    • C09K15/04Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
    • C09K15/06Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing oxygen
    • C09K15/08Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing oxygen containing a phenol or quinone moiety
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere

Definitions

  • the present invention relates to a composition.
  • Patent Documents 1 to 3 In order to improve the durability such as light resistance and heat resistance of the curable composition, methods of stabilizing by adding an ultraviolet absorber, an antioxidant and the like are known (Patent Documents 1 to 3).
  • the present inventors have found that the phenolic antioxidant has an action of trapping radicals which greatly affect the deterioration of the polymer, and in order to have such an action, the phenolic antioxidant It has been found that, when added into the polymerization system, it generally acts as a so-called polymerization inhibitor and may cause curing inhibition.
  • latent additives such as latent antioxidants and latent ultraviolet light absorbers are known which are inactivated in the polymerization system and which can be activated after curing.
  • latent additives such as latent antioxidants and latent ultraviolet light absorbers are known which are inactivated in the polymerization system and which can be activated after curing.
  • the present invention has been made in view of the above problems, and for example, it is a main object of the present invention to provide a composition capable of producing a cured product having durability and facilitating the production of the cured product. .
  • the inventors of the present invention conducted intensive studies to solve the above problems, and as a result, the phenolic hydroxyl group is protected by a protecting group, and after removal of the protecting group, the compound exhibiting an antioxidant ability after removal of the protecting group and UV absorption after removal of the protecting group. It has been found that by using both of the compounds exhibiting an ability together, it is possible to obtain a cured product having excellent durability and to facilitate the production of the cured product, and the present invention has been completed.
  • the present invention provides a composition comprising a compound A represented by the following general formula (A1), (A2) or (A3), and a compound B represented by the following general formula (B).
  • the compound A and the compound B each have a structure represented by the above general formula, ultraviolet light is released when R 9 and R 11 protecting the phenolic hydroxyl group are eliminated. It shows absorption capacity and antioxidant capacity.
  • the composition can obtain a cured product having excellent durability.
  • R 9 and R 11 are preferably an alkyl group having 1 to 20 carbon atoms in which the terminal methylene group at the oxygen atom side is replaced by —CO—O—. This is because compound A and compound B facilitate elimination of R 9 and R 11 .
  • the content of the compound A is preferably 1 part by mass to 99 parts by mass with respect to a total of 100 parts by mass of the compound A and the compound B. It is because the said composition has the outstanding durability because the said content is the above-mentioned range.
  • the composition preferably contains a polymerizable compound. It is because the said composition can exhibit the effect that manufacture of hardened
  • the present invention provides a cured product of the above composition.
  • the above-mentioned composition is used, the above-mentioned cured product is easy to manufacture and is excellent in durability.
  • the present invention provides a method for producing a cured product, which comprises the step of forming a cured product of the composition described above.
  • the production method of the cured product becomes easy by using the above-mentioned composition and having the above-mentioned steps.
  • the step of removing the protecting group R 9 contained in the compound A and the protecting group R 11 contained in the compound B after the above steps a cured product having durability can be easily obtained. Can.
  • the present invention relates to a composition, a cured product thereof and a method for producing the cured product.
  • a method for producing the composition, the cured product and the cured product of the present invention will be described in detail.
  • composition of the present invention is characterized by containing a compound A represented by the following general formula (A1), (A2) or (A3), and a compound B represented by the following general formula (B) It is a thing.
  • the compound A can exhibit an ultraviolet absorbing ability by the elimination of R 9 protecting the phenolic hydroxyl group. Further, the compounds B, by R 11 protecting the phenolic hydroxyl group is eliminated, it is possible to indicate the antioxidant ability. For this reason, for example, the said composition can manufacture the hardened
  • the reason why a cured product having excellent durability can be obtained by using Compound A and Compound B in combination is presumed as follows.
  • the compound A absorbs less light irradiated for photocuring, as compared to a state in which the phenolic hydroxyl group is not protected by R 9 .
  • Compound B as compared to the state of the phenolic hydroxyl group by R 11 is not protected, a lower scavenging radicals. For this reason, Compound A and Compound B, by phenolic hydroxyl groups with R 9 and R 11 each is protected, for example, the occurrence of curing inhibition of such photocurable composition can be suppressed.
  • the above-mentioned function of inhibiting the inhibition of curing may not be sufficiently exhibited.
  • the phenolic antioxidant is combined with the compound A
  • the curing inhibition occurs due to the action of trapping the radical by the phenolic antioxidant.
  • the durability is lowered due to insufficient curing, and the compound A and the like after desorption of the phenolic antioxidant and R 9 easily bleed out.
  • the ultraviolet light absorber is combined with the compound B
  • the light absorption by the ultraviolet light absorber also absorbs the light irradiated for the curing, and the curing inhibition occurs.
  • the decrease in durability caused by the UV absorber, the compound B and the like after release of R 11 easily bleed out occurs.
  • the compound A and the compound B are used independently and combined with a conventionally well-known antioxidant etc., for example, the hardened
  • the compound A and the compound B are used in combination, it is possible to suppress the occurrence of curing inhibition as described above, and it becomes easy to sufficiently cure and bleed out is suppressed.
  • the obtained cured product can exhibit excellent durability.
  • the antioxidant and the ultraviolet light absorber having a phenolic hydroxyl group are easily aggregated in the composition under the influence of the phenolic hydroxyl group, and it is difficult to increase the addition amount to the composition, and the aggregation functions as well. Can not demonstrate enough.
  • the compound A and the compound B have excellent dispersion stability in the composition by having a structure in which the phenolic hydroxyl group is protected by R 9 and R 11 respectively.
  • Compound A and Compound B are easy to disperse in the cured product, as well as easy to increase the amount added to the composition, as compared with the conventional antioxidant and UV absorber having phenolic hydroxyl group.
  • the compound A and the compound B can suppress generation of curing inhibition of, for example, a photocurable composition and the like because the phenolic hydroxyl group is protected by R 9 and R 11 . From such a thing, manufacture of hardened
  • the phenolic ultraviolet absorber when the phenolic ultraviolet absorber is combined with the compound B, the amount of light transmission is greatly reduced along the thickness direction of the composition, for example, the adhesion between the cured product and the substrate is reduced. There is also a problem that the cured product is likely to be peeled off from the substrate.
  • Compound A and Compound B are used in combination, as described above, absorption of light irradiated during curing can be suppressed, and as a result, it is possible to obtain a cured product in which peeling from the substrate is suppressed. it can.
  • the composition contains, as a resin component, a component whose solubility in an alkali developer changes due to light irradiation, such as a photosensitive resin, for example, absorption of light irradiated for photosensitive expression Performance is low and light sensitivity can be stably expressed. From such a thing, the said composition can be made into the photosensitive composition excellent in photosensitivity, durability, etc., for example.
  • composition of the present invention comprises compound A and compound B.
  • compound A and compound B.
  • each component of the composition of the present invention will be described in detail.
  • the content of the compound A may be any one as long as the composition can produce a cured product having desired durability.
  • 100 parts by mass of the solid content of the composition The amount can be 0.001 parts by mass or more and 20 parts by mass or less, and is preferably 0.005 parts by mass or more and 10 parts by mass or less, and particularly preferably 0.1 parts by mass or more and 8 parts by mass It is preferable that it is the following, Especially, it is preferable that it is 1 to 6 mass parts especially. It is because the said composition which contains the compound A in such an amount is easy to manufacture the hardened
  • the lower limit of the content of the above compound A is 100% of the solid content of the above composition from the viewpoint of exhibiting sufficient ultraviolet light absorbability.
  • the amount is preferably 2 parts by mass or more, more preferably 3 parts by mass or more, and preferably 5 parts by mass or more.
  • solid content is what contains all the components other than a solvent. Further, in the present description, the content is on a mass basis unless otherwise noted.
  • the content of the compound A varies depending on the content of the solvent and the like, and can be, for example, 0.001 parts by mass or more and 20 parts by mass or less in 100 parts by mass of the composition. It is because it is easy to disperse
  • the content of the compound A may be any as long as the composition can produce a cured product having desired durability, and, for example, 1 part by mass with respect to a total of 100 parts by mass of the compound A and the compound B
  • the amount can be set to 99 parts by mass or less, preferably 15 parts by mass to 85 parts by mass, and particularly preferably 20 parts by mass to 80 parts by mass. It is because the said composition which contains the compound A in such an amount is easy to manufacture the hardened
  • a composition should just be what can manufacture the hardened
  • the content can be in the range of not less than 20 parts by mass, preferably not less than 0.005 parts by mass and not more than 10 parts by mass, and particularly preferably 0.1 parts by mass to 8 parts by mass, Especially, it is preferable that it is 1 to 6 parts by mass.
  • the composition containing the compound B in such an amount is easy to manufacture a cured product having durability, and it is easier to produce a cured product.
  • the content of the compound B varies depending on the content of the solvent and the like, and can be, for example, 0.001 parts by mass or more and 20 parts by mass or less in 100 parts by mass of the composition. It is because it is easy to disperse
  • the total content of the compound A and the compound B may be any as long as the composition can produce a cured product having a desired durability, for example, with respect to 100 parts by mass of the solid content of the composition, It can be 0.01 parts by weight or more and 20 parts by weight or less, and more preferably 0.05 parts by weight or more and 15 parts by weight or less, and particularly preferably 0.1 parts by weight or more and 10 parts by weight or less Are particularly preferable, and in particular, 1 part by mass or more and 8 parts by mass or less are preferable. It is because the said composition containing the compound A and the compound B in such an amount is easy to manufacture the hardened
  • the lower limit of the content of the above compound A and compound B is the solid content of the composition from the viewpoint of exhibiting sufficient ultraviolet absorbing ability.
  • the amount is preferably 2 parts by mass or more, more preferably 3 parts by mass or more, and particularly preferably 4 parts by mass or more with respect to 100 parts by mass of each component.
  • the total content of the compound A and the compound B varies depending on the content of the solvent and the like, for example, it may be 0.001 parts by mass or more and 20 parts by mass or less in 100 parts by mass of the composition.
  • the compound A is represented by the above-mentioned general formula (A1), (A2) or (A3).
  • the compound A may have a structure in which a phenolic hydroxyl group is protected by a protecting group R 9 and may have an ultraviolet absorbing ability after the removal of the protecting group R 9 .
  • Having ultraviolet absorptivity can be, for example, capable of absorbing light in a wavelength range of 250 nm to 450 nm.
  • having ultraviolet absorbing ability can be such that the maximum absorption wavelength is 250 nm or more and 400 nm or less in a wavelength range of 250 nm or more and 600 nm or less, and in particular, is 260 nm or more and 390 nm or less Are preferable, and in particular, those which are 280 nm or more and 380 nm or less are preferable. It is because the said composition becomes easy to manufacture the hardened
  • a measuring method of the maximum absorption wavelength below what was melt
  • a sample for evaluation is filled in a quartz cell (optical path length 10 mm, thickness 1.25 mm), and the absorbance is measured using an absorptiometer (for example, U-3900 (manufactured by Hitachi High-Tech Science) Can be obtained by measuring
  • the compound A can have a maximum absorption wavelength on the short wavelength side in a wavelength range of 250 nm to 600 nm as compared with that after removal of the protective group R 9 .
  • the difference of the maximum absorption wavelength of the compound A from that after removal of the protecting group R 9 can be 1 nm or more, preferably 1 nm to 100 nm, and particularly preferably 1 nm to 50 nm. Is preferred. It is because the said compound A becomes a thing excellent in the hardening inhibitory inhibitory effect because the difference of the largest absorption wavelength is the said range.
  • the compound A can be such that the protecting group R 9 is released by heating.
  • the temperature at which the protective group R 9 contained in the compound A is eliminated may be, for example, 100 ° C. or more and 300 ° C. or less, and in particular, preferably 120 ° C. or more and 250 ° C. or less, 150 ° C. or more It is preferable that it is 230 degrees C or less. It is because the said composition becomes easy to manufacture of the hardened
  • the desorption temperature can be measured using STA (differential thermal thermal simultaneous measurement device), and can be the start temperature of the first weight loss.
  • the measurement conditions of the start temperature of the first weight loss can be, for example, 10 mg of the compound A in a measurement container to set a measurement temperature range: 30 ° C. to 350 ° C., and a temperature rising rate: 10 ° C./min.
  • STA7000 manufactured by Hitachi High-Tech Science Co., Ltd.
  • STA7000 manufactured by Hitachi High-Tech Science Co., Ltd.
  • the compound A is preferably a compound represented by the above general formula (A1) or (A3).
  • Such a composition is because it is easy to produce a cured product having durability.
  • R 1, R 2, R 1 ', R 2', R 1 ", R 2", R 3, R 4, R 5, R 6, R 7 and R 8 and R 9 are collectively The alkyl group having 1 to 40 carbon atoms which is used for R 1 etc.
  • may be methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl , Iso-amyl, tert-amyl, cyclopentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, 1-octyl, Iso-octyl, tert-octyl, adamantyl and the like can be mentioned.
  • Examples of the alkyl group having 1 to 20 carbon atoms used for R 9 include those having a predetermined number of carbon atoms among the alkyl groups having 1 to 40 carbon atoms used for the above R 1 and the like. it can.
  • Examples of the aryl group having 6 to 20 carbon atoms used for the above R 1 and the like include phenyl, naphthyl, anthracenyl and the like.
  • Examples of the arylalkyl group having 7 to 20 carbon atoms used for the above R 1 and the like include benzyl, fluorenyl, indenyl, 9-fluorenylmethyl and the like.
  • heterocycle-containing group having 2 to 20 carbon atoms used for R 1 and the like described above examples include, for example, pyridyl, pyrimidyl, pyridazyl, piperidyl, pyranyl, pyrazolyl, triazyl, pyrrolyl, quinolyl, isoquinolyl, imidazolyl, benzimidazolyl, triazolyl, furyl 2, furanyl, benzofuranyl, thienyl, thiophenyl, benzothiophenyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, isoxazolyl, indolyl, 2-pyrrolidinone-1-yl, 2-piperidone-1-yl, 2, 4-dioxyimidazolidin-3-yl, 2,4-dioxazolidin-3-yl and the like can be mentioned.
  • Examples of the alkenyl group having 2 to 20 carbon atoms used for R 9 include vinyl, allyl, 1-propenyl, isopropenyl, 2-butenyl, 1,3-butadienyl, 2-pentenyl, 2-octenyl and the like.
  • Examples of trialkylsilyl groups used for R 9 include trimethylsilane, triethylsilane, ethyldimethylsilane and the like.
  • Examples of the alkyl group having 1 to 8 carbon atoms used for R ′ include those exemplified as the alkyl group used for R 1 and the like, which can satisfy the predetermined number of carbon atoms.
  • each group such as the above-mentioned alkyl group, aryl group, arylalkyl group, heterocycle-containing group, alkenyl group and trialkylsilyl group may have a substituent, and in particular, unless otherwise specified. Or have no substituent or have a substituent.
  • a substituent which substitutes hydrogen atoms such as such an alkyl group, an aryl group, an arylalkyl group, a heterocyclic containing group, an alkenyl group, and a trialkylsilyl group
  • ethylenic properties such as vinyl, an allyl, an acryl, methacryl
  • Unsaturated groups halogen atoms such as fluorine, chlorine, bromine and iodine
  • Acyl groups such as oxaloyl, stearoyl, methoxycarbonyl, ethoxycarbonyl, t-butoxycarbonyl, n-
  • the number of carbon atoms of the group defines the number of carbon atoms of the group after the substitution.
  • the term "C1 to 40 carbon atoms” refers to the number of carbon atoms after the hydrogen atom has been substituted, and the hydrogen atom is substituted Does not refer to the number of carbon atoms before the
  • the alkoxy group in which the methylene group at the end of the alkyl group is replaced by -O- includes methyloxy, ethyloxy, iso-propyloxy, butyloxy, sec-butyloxy, tert-butyloxy, iso-butyloxy, amyloxy, iso-amyloxy, tert-amyloxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert- Heptyloxy, 1-octyloxy, iso-octyloxy, tert-octyloxy and the like.
  • the number of carbon atoms of the group defines the number of carbon atoms of the group after the replacement.
  • the “1 to 40 carbon atoms” means a group after a methylene group is replaced. It does not refer to the number of carbon atoms before the methylene group is replaced.
  • an alkyl group having 1 to 20 carbon atoms in which the terminal methylene group is replaced by -CO-O- is -CO-O-R 200 (where R 200 is an alkyl group having 1 to 19 carbon atoms) It corresponds to).
  • an alkyl group having 1 to 20 carbon atoms in which the terminal methylene group is replaced by —O— corresponds to —O—R 201 (R 201 is an alkyl group having 1 to 20 carbon atoms) It is
  • At least one of R 1 and R 2 is -O-R 9 above. It is preferable that one of the above R 1 and R 2 is the above-described —O—R 9 from the viewpoint of easy synthesis and further facilitates the production of a cured product having durability. It said R 1 and R 2, from the viewpoint of the larger the change in ultraviolet absorbing ability, it is preferable both R 1 and R 2 are -O-R 9.
  • R 1 and R 2 when only one is —O—R 9 , the other is a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 40 carbon atoms, an aryl group having 6 to 20 carbon atoms, the number of carbon atoms It is preferably an arylalkyl group of 7 to 20 or a heterocyclic group having 2 to 20 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 40 carbon atoms, and particularly preferably a hydrogen atom,
  • the alkyl group is preferably an alkyl group of 1 to 5 carbon atoms, and particularly preferably a hydrogen atom or an unsubstituted alkyl group of 1 to 5 carbon atoms.
  • R 9 is preferably an alkyl group having 1 to 20 carbon atoms or an alkenyl group having 2 to 20 carbon atoms, and particularly preferably an alkyl group having 1 to 20 carbon atoms, particularly preferably It is preferable that it is an alkyl group having 1 to 8 carbon atoms. It is because the said compound A will become a thing with a large change of ultraviolet-ray absorptivity. Moreover, it is because the said composition becomes easy to manufacture of the hardened
  • R 9 represents an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms or 2 carbon atoms
  • a heterocycle-containing group of -20 those in which the terminal methylene group on the oxygen atom side is replaced by -CO-O-, that is, -CO-O- is bonded to the terminal on the oxygen atom side Is preferable.
  • R 9 is an alkyl group having 1 to 20 carbon atoms or an alkenyl group having 2 to 20 carbon atoms in which the terminal methylene group on the oxygen atom side is replaced by —CO—O— Is preferred.
  • An alkyl group having 1 to 20 carbon atoms or an alkenyl group having 2 to 20 carbon atoms in which the terminal methylene group at the oxygen atom side is replaced by —CO—O— is “* —CO—O—R It is a group represented by 300 ". In the formulas in “,” * represents a bond with an oxygen atom, and R 300 represents an alkyl group having 1 to 19 carbon atoms or an alkenyl group having 2 to 19 carbon atoms.
  • the terminal methylene group on the oxygen atom side is replaced by —CO—O— and it has 1 to 20 carbon atoms It is preferably an alkyl group, particularly preferably an alkyl group having 1 to 8 carbon atoms in which the terminal methylene group on the oxygen atom side is replaced by -CO-O-, and above all, especially on the oxygen atom side
  • the terminal methylene group of is substituted by —CO—O— and is an alkyl group having 1 to 8 carbon atoms which has no substituent, among which —CO—O—C 4 H 9 It is preferable that it is a group represented, and it is particularly preferable that it is a -CO-O-tert-butyl group.
  • R 3 , R 4 , R 5 , R 6 , R 7 and R 8 each represents a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, 6 to 20 carbon atoms Or an arylalkyl group having 7 to 20 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms, preferably a halogen atom or an alkyl group having 1 to 40 carbon atoms, and the substituent Alkyl groups having 1 to 40 carbon atoms which do not have an alkyl group, alkyl groups having 1 to 40 carbon atoms having an ethylenically unsaturated group as a substituent, and carbons in which the methylene group at the end is replaced by -O- An alkyl group having 1 to 40 atoms (an alkoxy group having 1 to 40 carbon atoms), an alkyl group having 1 to 40 carbon atoms in
  • R 3 is preferably a halogen atom.
  • R 4 is preferably an alkoxy group having 1 to 10 carbon atoms which has no substituent.
  • an alkyl group having 1 to 20 carbon atoms which does not have a substituent can also be preferably used, and among them, an alkyl group having 3 to 15 carbon atoms having no substituent is preferable. Is preferable, and an alkyl group having 5 to 12 carbon atoms which does not have a substituent is preferable.
  • R 5 and R 6 an alkyl group having 1 to 10 carbon atoms which does not have a substituent can also be preferably used, and among them, an alkyl group having 1 to 5 carbon atoms having no substituent is particularly preferable. Is preferred.
  • R 7 is preferably a C 1 to C 10 alkoxy group having at least an ethylenically unsaturated group as a C 1 to C 10 alkyl group having no substituent or a substituent. It is preferable that it is an alkyl group having 1 to 5 carbon atoms which does not have a substituent, or an alkoxy group having 2 to 6 carbon atoms which has at least an ethylenically unsaturated group as a substituent. R 7 represents an alkoxy group having 1 to 15 carbon atoms having no substituent can be preferably used. It is possible inter alia, an alkoxy group having 2 to 8 carbon atoms having no substituent Is preferred.
  • the compound etc. which are represented by general formula (A3-1) mentioned later can be mentioned, for example.
  • the substituent having at least an ethylenically unsaturated group and having an alkoxy group having 1 to 10 carbon atoms include, for example, compounds represented by General Formula (A3-2) described later, and the like.
  • R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are the groups described above, the composition can easily produce a cured product having durability.
  • the bonding position of R 4 may be any position that can be bonded, but for example, it is preferable that it is para to the bonding position of —O—R 9 .
  • the bonding position of R 5 may be any position that can be bonded, but for example, the meta position is preferable with respect to the bonding position of —O—R 9 .
  • the bonding position of R 6 may be any position that can be bonded, but for example, the meta position is preferable with respect to the bonding position of —O—R 9 .
  • the bonding position of R 7 may be any position that can be bonded, but may be, for example, an ortho position or a meta position with respect to the bonding position of —O—R 9 .
  • a1 and a3 are integers of 0 to 4, the production of a cured product having durability is facilitated, and from the viewpoint of easiness of synthesis, they are each independently an integer of 0 to 3 Among these, an integer of 0 to 2 is preferable, and in particular, 0 to 1 is preferable.
  • the a 2 is an integer of 0 to 2, but is preferably 1 to 2 from the viewpoint of solubility. It is because the said composition becomes easy to manufacture of the hardened
  • the above a4 and a5 are integers of 0 to 3, but they are preferably integers of 0 to 2 from the viewpoint of easiness of synthesis because they facilitate the production of a cured product having durability.
  • a 6 is an integer of 0 to 3 m 3, it is preferable that it is an integer of 0 to 1, and it is 0, from the viewpoint of easiness of production of a cured product having durability and ease of synthesis.
  • the above m1 is an integer of 1 to 10, but is preferably 2 or more from the viewpoint of obtaining a cured product excellent in durability, and in particular, is preferably an integer of 2 to 6, In particular, an integer of 2 to 4 is preferable.
  • m 2 is an integer of 1 to 10, it is preferably an integer of 1 to 5 and particularly preferably an integer of 1 to 2 from the viewpoint of obtaining a cured product excellent in durability.
  • the above m3 is an integer of 1 to 3, but from the viewpoint of obtaining a cured product excellent in durability, it is preferably 2 or more, and more preferably 3 in particular.
  • the compounds A represented by the above general formulas (A1) and (A2) are each an m monovalent or m divalent (hereinafter referred to as m valence) represented by X a1 and X a2 (hereinafter sometimes referred to as X).
  • m valence m monovalent or m divalent
  • X a1 and X a2 hereinafter sometimes referred to as X
  • a direct bond, or a specific atom or group or a direct bond may have a structure in which m1 or m2 (hereinafter sometimes referred to as m) specific groups are bonded.
  • the m specific groups are identical to or different from one another.
  • the above X represents an m-valent atom or a bonding group or a direct bond.
  • a hydrogen atom, a nitrogen atom, an oxygen atom, a sulfur atom, a phosphorus atom, a group represented by the following (II-a) or (II-b),> C O,> NR 53 , -OR 53 , -SR 53 , -NR 53 R 54 or an aliphatic hydrocarbon group having 1 to 120 carbon atoms having the same number of valences as m, an aromatic ring having 6 to 35 carbon atoms
  • R 53 and R 54 each represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms, or an aromatic having 6 to 35 carbon atoms.
  • a ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms wherein the aliphatic hydrocarbon group, the aromatic ring-containing hydrocarbon group and the heterocyclic ring-containing group are —O—, —S— and —CO -, -O-CO-, -CO-O-, -O-CO-O-, -O-CO-O- -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S-, -CO-NH-, -NH-CO-, -NH-CO-O-, -NH -CO-O -, - NR ' -, - S-S -, - SO 2 -, might be replaced by nitrogen atoms, or combinations thereof, aromatic or heterocyclic ring-containing in the aromatic ring-containing hydrocarbon radical
  • the heterocycle in the group may be fused to another ring.
  • the bonding group X is a nitrogen atom, a phosphorus atom or a bonding group represented by the following (II-a) or (II-b)
  • m 3 and the bonding group X is an oxygen atom or a sulfur atom
  • C O
  • m 2 and when the linking group X is —OR 53 , —SR 53 or —NR 53 R 54 , m is And the linking group X may form a ring together with the benzene ring.
  • m is monovalent, for example, methyl, ethyl, propyl, isopropyl, cyclopropyl and the like , Butyl, sec-butyl, tert-butyl, isobutyl, amyl, iso-amyl, tert-amyl, cyclopentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, bicyclohexyl, 1-methylcyclohexyl, heptyl, 2-heptyl, 3 Alkyl groups such as heptyl, isoheptyl, tertiary heptyl, n-octyl, isooctyl, tertiary octyl, 2-ethylhexyl, nonyl,
  • n is bivalent; alkylene such as methylene, ethylene, propylene, butylene and butyldiyl; the methylene chain of the above alkylene is replaced by -O-, -S-, -CO-O- or -O-CO- Residues of diols such as ethanediol, propanediol, butanediol, pentanediol, hexanediol, etc.
  • Residues of dithiols such as ethanedithiol, propanedithiol, butanedithiol, pentanedithiol, hexanedithiol and these groups will be described later Groups substituted by substituents, etc.
  • m is trivalent, for example, alkylpyridines such as propyridine and 1,1,3-butyridine and the like, and groups in which these groups are substituted by a substituent described later can be mentioned.
  • m is monovalent and arylalkylalkyl such as benzyl, phenethyl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl etc. Groups; aryl groups such as phenyl and naphthyl; aryloxy groups such as phenoxy and naphthyloxy; arylthio groups such as phenylthio and naphthylthio; and groups in which these groups are substituted by a substituent described later, etc.
  • arylalkylalkyl such as benzyl, phenethyl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl etc.
  • aryl groups such as phenyl and naphthyl
  • aryloxy groups such as phenoxy and naphthyloxy
  • arylthio groups such as phenylthio and naphthylthio
  • arylene and arylene groups such as phenylene and naphthylene; and residues of bifunctional phenols such as catechol and bisphenol as m is a divalent group; 2,4,8,10-tetraoxaspiro [5,5] undecane etc. and groups thereof Groups substituted by a substituent described later, and Examples of trivalent m include phenyl-1,3,5-trimethylene and a group in which these groups are substituted by a substituent described later.
  • a C2-C35 heterocycle-containing group having the same number of valences as m pyridyl, pyrimidyl, pyridazyl, piperidyl, pyranyl, pyrazolyl, triazyl, pyrrolyl, quinolyl, isoquinolyl, as m is a monovalent group.
  • Examples of the aliphatic hydrocarbon group R 53 and the carbon atoms 1 to 35 for use in R 54, an aliphatic hydrocarbon group or an aliphatic hydrocarbon group having a carbon number of 1 to 120 for use in the linking group X is later Among the groups substituted by the substituent to be substituted, those having a predetermined number of carbon atoms can be mentioned,
  • the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms or the heterocyclic ring-containing group having 2 to 35 carbon atoms, which is used for R 53 and R 54, includes 6 to 35 carbon atoms used for the bonding group X Examples thereof include an aromatic ring-containing hydrocarbon group, a heterocyclic ring-containing group having 2 to 35 carbon atoms, or a group in which these groups are substituted by a substituent described later.
  • Each group such as the above-mentioned aliphatic hydrocarbon group, aromatic ring-containing hydrocarbon group and heterocyclic group-containing group may have a substituent, and unless otherwise noted, has a substituent. It is absent or has a substituent.
  • the substituent such as the aliphatic hydrocarbon group, the aromatic ring-containing hydrocarbon group and the heterocyclic group-containing group has the same content as the substituent that substitutes a hydrogen atom such as an alkyl group used for R 1 etc. be able to.
  • the linking group X can be a group represented by the following general formula (2).
  • m is 4 as the linking group X
  • a group represented by the following general formula (3) can be used.
  • m is 5 as the bonding group X
  • a group represented by the following general formula (4) can be used.
  • the linking group X can be a group represented by the following general formula (5).
  • Y 1 represents a single bond, —CR 55 R 56 —, —NR 57 —, divalent aliphatic hydrocarbon group having 1 to 35 carbon atoms, 6 to 35 carbon atoms Or an aromatic ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms, or any substituent represented by the following (1-1) to (1-3):
  • the methylene group in the aliphatic hydrocarbon group of 1 to 35, the aromatic ring-containing hydrocarbon group of 6 to 35 carbon atoms, and the heterocyclic ring-containing group of 2 to 35 carbon atoms is -O-, -S-,- CO-, -CO-O-, -O-CO- or -NH- or a combination of these groups may be substituted
  • R 55 and R 56 each represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an arylalkyl group
  • R 59 represents a hydrogen atom, a phenyl group which may have a substituent, or a cycloalkyl group having 3 to 10 carbon atoms
  • R 60 represents an alkyl group having 1 to 10 carbon atoms
  • an alkoxy group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms or a halogen atom, and the above alkyl group, alkoxy group and alkenyl group may have a substituent
  • c1 is 0 It is an integer of ⁇ 5, and * means that it bonds to an adjacent group at the * part.
  • R 61 and R 62 each independently represent an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aryloxy group having 6 to 20 carbon atoms, or the like An arylthio group of 6 to 20, an arylalkenyl group of 6 to 20 carbon atoms, an arylalkyl group of 7 to 20 carbon atoms, a heterocycle-containing group of 2 to 20 carbon atoms, or a halogen atom;
  • the methylene group in the arylalkyl group may be replaced by an unsaturated bond, -O- or -S-, R 61 may form a ring between adjacent R 61 's , c2 represents a number from 0 to 4; c3 represents a number from 0 to 8, c4 represents a number from 0 to 4; c5 represents a number from 0 to 4;
  • the sum of the numbers of c4 and c5 is 2 to 4,
  • Y 11 is a trivalent aliphatic hydrocarbon group having 3 to 35 carbon atoms, an alicyclic hydrocarbon group having 3 to 35 carbon atoms, or 6 to 35 carbon atoms Represents an aromatic ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms
  • Z 1 , Z 2 and Z 3 are each independently a direct bond, -O-, -S-,> CO, -CO-O-, -O-CO-, -SO 2- , -SS-,- SO—,> NR 62 , PR 62 , an aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or a heterocyclic ring-containing group having 2 to 35 carbon atoms
  • R 62 represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to
  • Y 12 represents a carbon atom or a tetravalent aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or 2 carbon atoms Represents a heterocyclic ring-containing group of-35, and in the aliphatic hydrocarbon group having 1 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, and the heterocyclic ring-containing group having 2 to 35 carbon atoms
  • the methylene group of may be replaced by -CO-O-, -O-, -O-CO-, -NH-CO-, -NH- or -CO-NH-, and Z 1 to Z 4 may be And each independently a group in the same range as the groups represented by Z 1 to Z 3 in the above general formula (2) * represents a part *, which means to bond to an adjacent group)
  • Y 13 is a pentavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 30 carbon atoms, or 2 to 30 carbon atoms Represents a hetero ring-containing group, and is an aliphatic hydrocarbon group having 2 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, and a methylene group in the heterocyclic ring containing group having 2 to 35 carbon atoms May be replaced by -CO-O-, -O-, -O-CO-, -NH-CO-, -NH- or -CO-NH-, and Z 1 to Z 5 are each independently In the above general formula (2), it is a group in the same range as the groups represented by Z 1 to Z 3. * indicates that * part is to be bonded to an adjacent group.)
  • Y 14 is a single bond, a hexavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or 2 carbon atoms Represents a heterocycle-containing group of -35, wherein the aliphatic hydrocarbon group having 2 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or the heterocycle-containing group having 2 to 35 carbon atoms In which the methylene group may be replaced by -CO-O-, -O-, -O-CO-, -NH-CO-, -NH- or -CO-NH-, and Z 1 to Z 6 is And each independently a group in the same range as the groups represented by Z 1 to Z 3 in the above general formula (2) * represents a part *, which means to bond to an adjacent group)
  • the divalent aliphatic hydrocarbon group having 1 to 35 carbon atoms used for Y 1 in the group represented by the above general formula (1) is methane, ethane, propane, iso-propane, butane, sec-butane Tert-butane, iso-butane, hexane, 2-methylhexane, 3-methylhexane, heptane, 2-methylheptane, 3-methylheptane, iso-heptane, tert-heptane, 1-methyloctane, iso-octane, tert-octane, cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, 2,4-dimethylcyclobutane, 4-methylcyclohexane and the like, and divalent groups substituted with Z 1 and Z 2 can be mentioned.
  • the group is -O-, -S-, -CO-, -CO-O-, -O-CO-, -NH- or Might be replaced by a group composed of a combination of these
  • divalent aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms include divalent groups in which groups such as phenylene, naphthylene and biphenyl are substituted with Z 1 and Z 2 , and the like
  • divalent heterocyclic groups having 2 to 35 carbon atoms include pyridine, pyrazine, piperidine, piperazine, pyrimidine, pyridazine, triazine, hexahydrotriazine, furan, tetrahydrofuran, chromane, xanthene, thiophene, thiolane and the like.
  • Divalent groups substituted with 1 and Z 2 can be mentioned. These groups may be further substituted by a halogen atom, a cyano group, a nitro group or an alkoxy group having 1 to 8 carbon atoms.
  • Each group such as the above-mentioned aliphatic hydrocarbon group, aromatic ring-containing hydrocarbon group and heterocyclic group-containing group may have a substituent, and unless otherwise noted, has a substituent. There are no unsubstituted or substituted ones.
  • the substituent such as the aliphatic hydrocarbon group, the aromatic ring-containing hydrocarbon group and the heterocyclic group-containing group has the same content as the substituent that substitutes a hydrogen atom such as an alkyl group used for R 1 etc. be able to.
  • the heterocycle-containing group of 2 to 35 can be the same as the contents exemplified as R 53 and R 54 described above.
  • the cycloalkyl group having 3 to 10 carbon atoms used for R 59 in the group represented by the above general formula (1-1) includes cyclopropyl, cyclobutyl, cyclopentyl, cyclobutyl, cyclooctyl and the like, and groups thereof Is a C 1 -C 10 alkyl group or a group substituted with a C 1 -C 10 alkoxy group,
  • Examples of the alkyl group having 1 to 10 carbon atoms and the alkoxy group having 1 to 10 carbon atoms which are used for R 60 include those having a predetermined number of carbon atoms among the contents exemplified as the above R 1 and the like, As the alkenyl group having 2 to 10 carbon atoms, among those exemplified as the above R 1 and the like, those having a predetermined number of carbon atoms can be mentioned.
  • the phenyl group, the alkyl group, the alkoxy group and the alkenyl group in the general formula (1-1) may have a substituent.
  • Such a substituent may have the same contents as the substituent that substitutes a hydrogen atom such as an alkyl group used for R 1 and the like.
  • the alkyl group, alkoxy group and alkenyl group in the above R 60 may be, for example, those substituted with a halogen atom, and the position of substitution is not limited.
  • the alkyl group having 1 to 10 carbon atoms the aryl group having 6 to 20 carbon atoms, and the arylalkyl group having 7 to 20 carbon atoms, which are used for the group represented by the above general formula (1-3)
  • the aryloxy group having 6 to 20 carbon atoms include phenyloxy, naphthyloxy, 2-methylphenyloxy, 3-methylphenyloxy, 4-methylphenyloxy, 4-vinylphenyldioxy, 3-iso-propylphenyl Oxy, 4-iso-propylphenyloxy, 4-butylphenyloxy, 4-tert-butylphenyloxy, 4-hexylphenyloxy, 4-cyclohexylphenyloxy, 4-octylphenyloxy, 4- (2-ethylhexyl) Phenyloxy, 2,3
  • an oxygen atom of the aryloxy group having 6 to 20 carbon atoms which may be substituted by the above-mentioned halogen atom can be vinyl, allyl, 1-propenyl, isopropenyl, 2 And groups substituted with an alkenyl group such as butenyl, 1,3-butadienyl, 2-pentenyl, 2-octenyl and the like.
  • heterocycle-containing group having 2 to 20 carbon atoms examples include pyridine, pyrazine, piperidine, piperazine, pyrimidine, pyridazine, triazine, hexahydrotriazine, furan, tetrahydrofuran, chromane, xanthene, thiophene, thiofuran and the like, and groups thereof Are groups substituted with a halogen atom.
  • each group such as the above aryloxy group, arylthio group, arylalkenyl group, heterocyclic group and the like may have a substituent, and unless otherwise noted, has a substituent. There are no unsubstituted or substituted ones.
  • Examples of the substituent that substitutes a hydrogen atom such as an aryloxy group, an arylthio group, an arylalkenyl group, and a heterocycle-containing group are the same as the substituents that substitute a hydrogen atom such as an alkyl group used for R 1 and the like. It can be content.
  • the trivalent aliphatic hydrocarbon group having 3 to 35 carbon atoms used for Y 11 in the group represented by the general formula (2) is exemplified in the description of the bonding group X in the general formula (1)
  • Examples thereof include trivalent groups in which an aliphatic hydrocarbon group having 1 to 120 carbon atoms is substituted by Z 1 , Z 2 and Z 3 , and methylene groups in these groups are —O—, —S— , -CO-, -CO-O-, -O-CO-, -SO 2- , -NH- or a combination thereof may be substituted
  • the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms is And trivalent groups substituted with 1 , Z 2 and Z 3 ;
  • Examples of the trivalent heterocyclic group having 2 to 35 carbon atoms include the heterocyclic group having 2 to 35 carbon
  • the hydrogen group and the heterocycle-containing group having 2 to 35 carbon atoms can be the same as the contents exemplified as R 53 and R 54 described above.
  • the tetravalent aliphatic hydrocarbon group having 1 to 35 carbon atoms used for Y 12 in the group represented by the general formula (3) is exemplified in the description of the bonding group X in the general formula (1)
  • Examples thereof include tetravalent groups in which an aliphatic hydrocarbon group having 1 to 120 carbon atoms is substituted with Z 1 , Z 2 , Z 3 and Z 4 , and a methylene group in the aliphatic hydrocarbon group is O-, -S-, -CO-, -COO-, -OCO-, -NH- or a combination of these groups may be substituted
  • the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms is And tetravalent groups substituted with 1 , Z 2 , Z 3 and Z 4 , As the tetravalent heterocycl
  • the pentavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms used for Y 13 in the group represented by the general formula (4) is exemplified in the description of the bonding group X in the general formula (1) And a pentavalent group in which the aliphatic hydrocarbon group having 1 to 120 carbon atoms is substituted with Z 1 , Z 2 , Z 3 , Z 4 and Z 5 , and a methylene group in the aliphatic hydrocarbon group.
  • the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is Z And pentavalent groups substituted with 1 , Z 2 , Z 3 , Z 4 and Z 5, and
  • the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is Z 1 ,
  • the pentavalent group substituted by Z ⁇ 2 >, Z ⁇ 3 >, Z ⁇ 4 > and Z ⁇ 5> is mentioned.
  • the hexavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms used for Y 14 in the above general formula (5) includes 1 to 8 carbon atoms exemplified in the description of the bonding group X in the above general formula (1)
  • a hexavalent group in which the aliphatic hydrocarbon group of 120 is substituted by Z 1 , Z 2 , Z 3 , Z 4 , Z 5 and Z 6 , and the methylene group in the aliphatic hydrocarbon group is O-, -S-, -CO-, -COO-, -OCO-, -SO 2- , -NH- or a combination of these groups may be substituted
  • the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms is A hexavalent group substituted by 1 , Z 2 , Z 3
  • an aliphatic hydrocarbon group having 1 to 120 carbon atoms can be preferably used, and in particular, an alkylene group having 1 to 10 carbon atoms or a residue of a diol is preferable. It is preferably an alkylene group having 1 to 5 carbon atoms such as a methylene group having 1 carbon atom, and particularly preferably an alkylene group having 1 to 3 carbon atoms. This is because the production of a cured product having durability is easy and the production of compound A is easy.
  • the above-mentioned X is preferably a substituent represented by the following general formula (101) or (102) or a group selected from the following group 1.
  • the above X is a group selected from the following group 2 when (2) m is 3, and a group selected from the following group 3 when (3) m is 4, and (4) m is 5 It is preferable that it is a group selected from the following group 4 and (5) a group selected from the following group 5 when m is 6. It is because manufacture of the hardened
  • each of Y 111 and Y 115 independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms which may have a substituent
  • Y 112 and Y 114 each independently, -O -, - CO -, - CO-O -, - O-CO -, - NR 13 -, - CO-NR 13 - or -NR 13 -CO- in Represents a group to be represented
  • R 13 represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent
  • Y 113 is, -CR 14 R 15 -, - NR 16 -, a divalent a group which may have a substituent aliphatic hydrocarbon group having a carbon number of 1 to 35, have a substituent
  • R 6 represents an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms which may be substituted or a substituent represented by the following general formula (103):
  • each of Y 116 and Y 118 independently represents —NR 17 — or an aliphatic hydrocarbon group having 1 to 8 carbon atoms in which a methylene group may be replaced by an oxygen atom
  • Y 117 is a direct bond, -O-, -S-, -SO 2- , -CR 18 R 19 -or the above (1-1), (1-2) or (1-3)
  • R 17 represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent
  • R 18 and R 19 each independently represent an alkyl group having 1 to 8 carbon atoms which may be substituted with a hydrogen atom or a halogen atom
  • R 31 represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent, or 6 to 35 carbon atoms which may have a substituent
  • R 31 represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent, or 6 to 35 carbon atoms which may have a substituent
  • an aromatic ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms which may have a substituent * Represents a bonding point.
  • Y 119 and Y 120 each independently represent an aliphatic hydrocarbon group having 1 to 8 carbon atoms which may have a substituent, * Represents a bonding point.
  • R 32 is the same group as R 57 in the above general formula (1), and when there are two or more in the group, it may be the same or different, and Z 11 may be the above general formula (2 Group in the same range as the group represented by Z 1 to Z 3 in * Represents a bonding point. )
  • R 32 is the same group as R 57 in the above general formula (1), and when there are two or more in the group, it may be the same or different, and Z 11 may be the above general formula (2 Group in the same range as the group represented by Z 1 to Z 3 in * Represents a bonding point. )
  • Z 10 , Z 11 , Z 12 , Z 13 , Z 14 and Z 15 each represent a group in the same range as the groups represented by Z 1 to Z 3 in the above general formula (2), * Represents a bonding point.
  • examples of the aliphatic hydrocarbon group having 1 to 8 carbon atoms which may have a substituent used for Y 111 , Y 115 , Y 116 , Y 118 , Y 119 and Y 120 include Y 1 and the like.
  • the contents exemplified as the aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a divalent substituent used in the above one having a predetermined number of carbon atoms can be mentioned.
  • Y 111 and Y 115 may be the same or different.
  • Y 116 and Y 118 in the above formula (102) and Y 119 and Y 120 in the above formula (103) may be identical to or different from each other.
  • the ring-containing hydrocarbon group may have a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a divalent substituent used for Y 1 or the like.
  • the same content as the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms can be used.
  • the aromatic ring-containing hydrocarbon group having 6 to 35 and the heterocyclic ring-containing group having 2 to 35 carbon atoms which may have a substituent include substituents used for R 53 and R 54 and the like
  • the aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms which may have a substituent, and the substituent may be The content may be similar to that of a heterocyclic group having a carbon number of 2 to 35.
  • Examples of the alkyl group having 1 to 8 carbon atoms, the aryl group having 6 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms used for R 14 , R 15 , R 18 and R 19 include R 1 and the like The same contents as those satisfying the predetermined number of carbon atoms among the alkyl group having 1 to 40 carbon atoms, the aryl group having 6 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms used for Can.
  • a plurality of Z 11 each other included in each equation of the group 2 and group 3, Z 10 ⁇ Z 15 contained in the formula of Z 10 ⁇ 14 and the group 5 included in each equation of the group 4 May be identical or different.
  • the bonding position of the bonding group X to the benzene ring may be any bondable position within the benzene ring, for example, the ortho position or the meta position relative to the bonding position of -O-R 9 Is preferred. It is because manufacture of the hardened
  • the Xa1, when the m1 1, is preferably the same group as a hydrogen atom or an R 4.
  • the Xa2, when the m @ 2 1, is preferably the same group as a hydrogen atom or R 6.
  • the compound A includes the compounds specifically described in WO 2014/021023, such as the compounds represented below.
  • the compound A may contain a phenolic hydroxyl group not protected by the protecting group R 9 , the number of phenolic hydroxyl groups contained in the compound A is preferably 2 or less, and 0 Is preferred. It is because the said compound A can suppress generation
  • the molecular weight of the compound A can be set according to the application of the compound A and the like.
  • the molecular weight can be, for example, 250 or more and 5000 or less, can be 300 or more and 2500 or less, and can be 350 or more and 1500 or less.
  • the said molecular weight can be represented by a weight average molecular weight (Mw), when the compound A is a polymer which contains a repeating structure as the structure.
  • the weight average molecular weight (Mw) can be determined as a standard polystyrene equivalent value by gel permeation chromatography (GPC).
  • the weight average molecular weight Mw is, for example, HLC-8120 GPC manufactured by Tosoh Corp., and the elution solvent is N-methylpyrrolidone to which 0.01 mol / liter of lithium bromide is added, and the polystyrene standard for calibration curve is Mw 377400 210500, 96000, 50400, 20650, 10850, 5460, 2930, 1300, 580 (above, Easi PS-2 series manufactured by Polymer Laboratories) and Mw 1090000 (manufactured by Tosoh Corp.), and the measurement column is TSK-GEL ALPHA- It can be obtained by measurement as M ⁇ 2 (made by Tosoh Corp.). Also, the measurement temperature can be 40 ° C., and the flow rate can be 1.0 mL / min.
  • the manufacturing method of the said compound A will not be specifically limited if it is a method which can obtain a desired structure, For example, it can be made into the method similar to the method as described in WO 2014/021023.
  • Compound B The compound B is represented by the general formula (B). Further, the compound B has a phenolic hydroxyl group is protected by a protecting group R 11 structure, after elimination of the protective group R 11, can be assumed to have antioxidant ability. More specifically, having the ability to prevent oxidation means that it has a function of suppressing oxidation by heat, light and other energy of the substance after elimination of the above-mentioned protecting group R 11 and has a radical scavenging action. be able to.
  • the compound B as compared to after elimination of the protective group R 11, those radicals scavenging is low.
  • the difference (%) in residual film ratio between the compound B and the compound after removal of the protective group R 11 may be at least 0.1%, but may be 1.0% or more. And preferably 5.0% or more, and more preferably 10% or more. It is because manufacture of the hardened
  • the residual film ratio (%) is the film thickness after exposure and development with respect to the film thickness before exposure relative to the photocurable composition (film thickness after exposure and film thickness after exposure / film thickness before exposure ⁇ 100 (% Can be obtained from
  • the photocurable composition can include a radically polymerizable compound, a radical photopolymerization initiator, and a compound after elimination of the compound B or the protective group R 11 , for example, as described in Examples to be described later. It can be made to be the same as the composition of Comparative Example 2 or Comparative Example 4 described in the section. Further, as a method of measuring the residual film rate, for example, the method of “1. sensitivity evaluation 1” described in the embodiment described later can be used.
  • the compound B can be such that the protective group R 11 is released by heating.
  • the temperature at which the protecting group R 11 contained in the compound B is eliminated may be, for example, the same as the contents described in the section “2. Compound A”.
  • Examples of the heterocycle-containing group or trialkylsilyl group of 2 to 20 include the same ones as described above as the group represented by R 9 in the section of “2. Compound A” above.
  • the heterocycle-containing group having 2 to 20 atoms can be the same as the contents exemplified as R 1 and the like in the section of “2.
  • Compound A above.
  • Examples of the alkyl group having 1 to 8 carbon atoms represented by R ′ in —NR′— which may replace a methylene group in each group represented as R 11 , R 12 , R 13 and R 14 include the above “ 2.
  • the same contents as exemplified as R ′ can be used.
  • R 11 protects the phenolic hydroxyl group.
  • R 11 can be the same as R 9 described in the section “2. Compound A” above.
  • R 12 and R 13 are preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 10 carbon atoms having no substituent. , in particular, it is preferred that either or both of R 12 and R 13 is a group represented by -C 4 H 9, among others in either or both of tert- butyl group R 12 and R 13 Is preferred. It is because manufacture of the hardened
  • Both of R 12 and R 13 are preferably, for example, an alkyl group having 1 to 10 carbon atoms which does not have a substituent such as a tert-butyl group. It is because manufacture of the hardened
  • the R 14 is preferably an alkyl group having 1 to 40 carbon atoms. It is because manufacture of the hardened
  • n is an integer of 1 to 10, but is preferably an integer of 2 to 6 and more preferably an integer of 3 to 5 from the viewpoint of easiness of synthesis. It is because it becomes easy to obtain the hardened
  • the above b1 is an integer of 0 to 2, but it is preferably 0 to 1 from the viewpoint of easiness of synthesis because it facilitates the production of a cured product having durability.
  • the compound B has a structure in which a specific n-valent atom represented by X b and n specific groups are bonded.
  • the n specific groups are identical to or different from one another.
  • the bonding group X b represents an n-valent bonding group.
  • a linking group X b the same contents as those of the linking group X described in the above “2. Compound A” can be used.
  • the bonding group X b is preferably a group represented by the above general formula (3), for example, when n is 4. It is because manufacture of the hardened
  • Y 12 in the general formula (3) is preferably a carbon atom or a tetravalent aliphatic hydrocarbon group having 1 to 35 carbon atoms, and more preferably a carbon atom. It is because manufacture of the hardened
  • Z 1 to Z 4 in the above general formula (3) are -O-, -S-,> CO, -CO-O-, -O-CO-, -SO 2- , -SS-, -SO- > NR 62 , PR 62 and is preferably an aliphatic hydrocarbon group having 1 to 35 carbon atoms, more preferably an aliphatic hydrocarbon group having 1 to 35 carbon atoms, and the methylene group is —COO— It is preferable that it is a C1-C40 aliphatic hydrocarbon group which is substituted by -O-, -OCO-, -NHCO-, -NH- or -CONH-, and the methylene at the terminal of Y 12 side
  • An aliphatic hydrocarbon group having 1 to 40 carbon atoms which does not have a substituent in which the group is replaced by -COO- or -OCO- can also be preferably used, and among them, a methylene group at the terminal of Y 12 side I
  • the X b group is preferably a group represented by the above general formula (101).
  • Y 111 is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms which may have a substituent, and in particular, one or more unsubstituted carbon atoms may be substituted. It is preferable that it is an alkylene group of -3.
  • Y 112 is preferably -O- or -CO-O-, and Y 114 is preferably -O- or -O-CO-.
  • Y 113 is preferably a group represented by the general formula (103).
  • Y 119 and Y 120 are preferably aliphatic hydrocarbon groups having 1 to 5 carbon atoms which may have a substituent, and in particular, 2 or more carbon atoms It is preferably a linear or branched alkylene group of -5.
  • n is 2, as the X b group, a group represented by the above general formula (102) can also be preferably used.
  • Y 117 is, -CR 18 R 19 - is preferably, among others, an aliphatic hydrocarbon group of R 18 and R 19 is a hydrogen atom or 1 to 4 carbon atoms It is preferable that R 18 be a hydrogen atom, and R 19 be an aliphatic hydrocarbon group having 1 to 4 carbon atoms.
  • the group X b is preferably a group represented by (II-2), (II-3) or (II-6) in group 2.
  • Z 11 is a direct bond or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent And is preferably a direct bond or an unsubstituted C 1 -C 5 alkylene group.
  • a plurality of Z 11 included in each formula may be the same or different.
  • at least one of three Z 11 in the general formula (II-2) is a direct bond, and at least one is an unsubstituted alkylene group having 1 to 5 carbon atoms preferable.
  • R 32 is preferably a hydrogen atom or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent, Among them, a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms which may have a substituent is preferable, and a hydrogen atom is particularly preferable.
  • the group X b be a group represented by (III-1) in group 3, instead of or in addition to the above-mentioned preferable group.
  • Z 11 may have a substituent, and the methylene group is a carbon-carbon double bond, -O-, -CO-, -O-CO-, -CO It is preferably an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may be substituted by -O- or -SO 2- , and the methylene group is substituted by -O-CO- or -CO-O-. Preferably, it is an alkylene group having 1 to 5 carbon atoms.
  • the X b group is the above-mentioned group, the compound B can stably exhibit the antioxidant ability after the removal of the protecting group R 102 . Moreover, as a result, it is because manufacture of the hardened
  • the bonding position of the bonding group X b to the benzene ring may be any bondable position within the benzene ring, and for example, it is para to the bonding position of R 11 -O-. Is preferred.
  • the coupling position is the position described above, the compound B is a leaving before and after the protective group R 11, because becomes large changes in antioxidant capacity.
  • the compound B include the compounds specifically described in WO 2014/021023, such as the compounds represented below.
  • the number, molecular weight, production method and the like of the phenolic hydroxyl group contained in the compound B can be the same as the contents described in the section of “2. Compound A”.
  • the above composition can contain a resin component.
  • a resin component the above-mentioned compounds A and B can be held, and it is suitably set according to the use etc. of a composition.
  • the said composition can exhibit the effect that manufacture of hardened
  • the composition described above is able to more effectively exhibit the effect of facilitating the production of a cured product by containing the compound A having a small absorption of the irradiated light.
  • the said composition can be used as a photocurable composition, a thermosetting composition, etc., for example by including a polymeric compound as said resin component.
  • the above-mentioned polymerizable compound may be any one capable of forming a polymer, and usually has a polymerizable group.
  • Such polymerizable compounds differ depending on the type of polymerizable group, that is, the type of polymerization reaction, and examples thereof include radically polymerizable compounds, cationically polymerizable compounds, anionically polymerizable compounds, etc.
  • the above composition is capable of more effectively exerting the effect that the production of a cured product is easy by containing the compound B in which the radical supplementing action is suppressed.
  • the radically polymerizable compound may have one or more radically polymerizable group and may contain two or more radically polymerizable group.
  • the above-mentioned radical polymerizable compound is usually used together with a radical polymerization initiator.
  • a radically polymerizable polymerizable group ethylenic unsaturated double bond groups, such as a (meth) acryl group and a vinyl group, can be mentioned, for example.
  • (meth) acryl is used by the meaning containing an acryl and methacryl.
  • (meth) acrylate is used in the meaning including acrylate and methacrylate.
  • the radically polymerizable compound may be a compound having an acid value, or may be a compound having no acid value.
  • a compound which has an acid value the compound etc. which have a carboxyl group can be mentioned, for example.
  • the composition can be used, for example, as a photosensitive composition whose solubility in a solvent such as an alkaline developer changes before and after light irradiation. More specifically, the above-mentioned composition can be used as a negative working composition by including a compound having an acid value.
  • an alkali developing solution what is generally used as alkali developing solutions, such as tetramethyl ammonium hydroxide (TMAH) aqueous solution and potassium hydroxide aqueous solution, can be used.
  • TMAH tetramethyl ammonium hydroxide
  • compounds having an ethylenically unsaturated double bond group and having an acid value include (meth) acrylic acid, ⁇ -chloroacrylic acid, itaconic acid, maleic acid, citraconic acid , Fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinyl acetate, allyl acetate, cinnamic acid, sorbic acid, sorbic acid, mesaconic acid, mono [2- (meth) acryloyloxyethyl] succinate, mono [2- (phthalate) Mono (meth) acrylate, hydroxyethyl (meth) acrylate malate, hydroxypropyl (meth) acryloyloxy ethyl ester], ⁇ -carboxy polycaprolactone mono (meth) acrylate, and other polymers having a carboxy group and a hydroxyl group at both ends Meta) acrylate malate, di
  • X 41 represents a direct bond, an alkylidene group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 3 to 20 carbon atoms, -O-, -S-, -SO 2- , -SS- Or —SO—, —CO—, —OCO— or a substituent represented by (1-1) to (1-3) above, R 41 , R 42 , R 44 and R 44 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkenyl group having 2 to 5 carbon atoms or Represents a halogen atom, d is an integer of 0 to 10; )
  • Examples of the alkyl group having 1 to 5 carbon atoms, the alkoxy group having 1 to 8 carbon atoms, and the alkenyl group having 2 to 5 carbon atoms include those exemplified as R 1 and the like in the section of “2. Compound A”. Among them, those having a predetermined number of carbon atoms can be mentioned.
  • Examples of the alkylidene group having 1 to 4 carbon atoms include methylidene, ethylidene, propylidene and butylidene.
  • Examples of the alicyclic hydrocarbon group include cyclopropyl, cyclopentyl, cyclohexyl, cycloheptyl and the like.
  • alkyl group, alkoxy group, alkenyl group, alkylidene group, alicyclic hydrocarbon group etc. may have a substituent, and unless otherwise noted, has a substituent. There are no unsubstituted or substituted ones.
  • the content of the compound having an acid value can be appropriately set according to the application of the composition, etc., but can be, for example, 30 parts by mass or more and 90 parts by mass or less with respect to 100 parts by mass of the resin component
  • the content is preferably 35 parts by mass or more and 70 parts by mass or less, and particularly preferably 40 parts by mass or more and 60 parts by mass or less.
  • the composition can be used as a negative composition excellent in sensitivity.
  • radical polymerizable compounds for example, as a compound having an ethylenically unsaturated double bond group and not having an acid value, (meth) acrylic acid-2-hydroxyethyl, (meth) acrylic acid-2- Hydroxypropyl, glycidyl (meth) acrylate, the following compound No. 1 A1 to No.
  • A4 methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate ( (Meth) acrylate isooctyl, (meth) acrylate isononyl, (meth) acrylate stearyl, (meth) acrylate lauryl, (meth) acrylate methoxyethyl, (meth) acrylate dimethylaminomethyl, (meth) acrylate dimethyl (meth) acrylate Aminoethyl, aminopropyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, ethoxyethyl (meth) acrylate, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxye
  • the number of radically polymerizable polymerizable groups contained in the compound having no acid value may be 1 or more, preferably 2 or more and 10 or less, and more preferably 3 or more and 8 or less.
  • the compound having no acid value may be a mixture of compounds having different numbers of polymerizable groups. This is because, for example, the adjustment of the curing speed and the hardness of the cured product becomes easy.
  • the compound having no acid value is, for example, a mixture of a compound having 3 polymerizable groups and a compound having 4 polymerizable groups, a compound having 5 polymerizable groups, and 6 polymerizable groups. And the like, and the like.
  • the content of the compound not having an acid value can be appropriately set according to the application etc. of the composition, but can be, for example, 10 parts by mass to 70 parts by mass with respect to 100 parts by mass of the resin component. And 30 parts by mass or more and 60 parts by mass or less, and more preferably 40 parts by mass or more and 50 parts by mass or less.
  • the composition can be used as a negative composition excellent in sensitivity.
  • the said radically polymerizable compound can be used individually or in mixture of 2 or more types.
  • the radically polymerizable compound has an ethylenically unsaturated double bond group, and uses a compound having an acid value and a compound having an ethylenically unsaturated double bond group and not having an acid value in combination.
  • a radically polymerizable compound is used in mixture of 2 or more types, they may be copolymerized beforehand and it may be used as a copolymer.
  • the cationic polymerizable compound may be one having one or more cationically polymerizable groups.
  • the cationically polymerizable compound is usually used together with a cationic polymerization initiator.
  • the cationically polymerizable polymerizable group include cyclic ether groups such as an epoxy group and an oxetane group, and a vinyl ether group. That is, as a cationically polymerizable compound, cyclic ether compounds, such as an epoxy compound and an oxetane compound, a vinyl ether compound, etc. are mentioned.
  • Examples of the above epoxy compounds include methyl glycidyl ether, 2-ethylhexyl glycidyl ether, butyl glycidyl ether, decyl glycidyl ether, C12 to 13 mixed alkyl glycidyl ether, phenyl 2-methyl glycidyl ether, cetyl glycidyl ether, stearyl glycidyl ether, p-sec-butylphenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, glycidyl methacrylate, isopropyl glycidyl ether, allyl glycidyl ether, ethyl glycidyl ether, 2-methyloctyl glycidyl ether, phenyl glycidyl ether, 4-n-butylphenyl Glycidyl
  • an epoxidized polyolefin can also be used as said epoxy compound.
  • the epoxidized polyolefin is a polyolefin in which an epoxy group is introduced by modifying the polyolefin with an epoxy group-containing monomer. It can be produced by copolymerizing ethylene or an ⁇ -olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer, and, if necessary, another monomer, by any of a copolymerization method and a graft method. Ethylene or an ⁇ -olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer and another monomer may be polymerized alone or in combination with other monomers.
  • the double bond of a non-conjugated polybutadiene having a hydroxyl group at the end can be obtained by epoxidation by the peracetic acid method, and one having a hydroxyl group in the molecule may be used.
  • a hydroxyl group can be urethane-ized with isocyanate, and a primary hydroxyl group-containing epoxy compound can be made to react here, and an epoxy group can be introduce
  • ethylene or ⁇ -olefins of 3 to 20 carbon atoms examples include ethylene, propylene, butylene, isobutylene, 1,3-butadiene, 1,4-butadiene, 1,3-pentadiene, 2,3-dimethyl-1,3 -Butadiene, piperylene, 3-butyl-1,3-octadiene, isoprene and the like can be mentioned.
  • Examples of the epoxy group-containing monomer include glycidyl esters of ⁇ , ⁇ -unsaturated acids, vinyl benzyl glycidyl ether and allyl glycidyl ether.
  • Specific examples of glycidyl esters of ⁇ , ⁇ -unsaturated acids include glycidyl acrylate, glycidyl methacrylate and glycidyl ethacrylic acid, with glycidyl methacrylate being particularly preferred.
  • Examples of the other monomers include unsaturated aliphatic hydrocarbons such as vinyl chloride, vinylidene chloride, vinylidene fluoride and tetrafluoroethylene; (meth) acrylic acid, ⁇ -chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, Fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinyl acetic acid, allyl acetic acid, cinnamic acid, sorbic acid, sorbic acid, mesaconic acid, mono [2- (meth) acryloyloxyethyl] succinate, mono [2- (metha] phthalic acid ) Acryloyloxyethyl], ⁇ -carboxypolycaprolactone mono (meth) acrylate, etc.
  • unsaturated aliphatic hydrocarbons such as vinyl chloride, vinylidene chloride, vinylidene fluoride and tetrafluoroethylene
  • a commercial item can also be used as said epoxidized polyolefin,
  • Epolide PB3600, Epolide PB4700 made by Daicel
  • BF-1000, FC-3000 made by ADEKA
  • Bond first 2C bond first E
  • JP-100, JP-200 (Nippon Soda Co., Ltd.)
  • Poly bd R And -45 HT Poly bd R-15 HT
  • Ricon 657 manufactured by Arkema
  • oxetane compounds examples include 3,7-bis (3-oxetanyl) -5-oxa-nonane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, and 1,2-bis [(3-Ethyl-3-oxetanylmethoxy) methyl] ethane, 1,3-bis [(3-ethyl-3-oxetanylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, Triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, 1,4-bis (3-ethyl-3-oxetanylmethoxy) butane, 1 , 6-Bis (3-ethyl-3-oxet
  • vinyl ether compounds examples include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2- Examples thereof include hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether and 1,6-cyclohexane dimethanol divinyl ether.
  • anionically polymerizable compound those having one or more polymerizable groups capable of anionic polymerization may be used.
  • the above-mentioned anionically polymerizable compound is usually used together with an anionic polymerization initiator.
  • an anionizable polymerizable group an epoxy group, a lactone group, a (meth) acryl group etc. can be mentioned, for example. That is, as the above-mentioned anion polymerization compound, an epoxy compound, a lactone compound, a compound which has a (meth) acryl group, etc. are mentioned. Examples of the lactone compound include ⁇ -propiolactone and ⁇ -caprolactone.
  • an epoxy compound the epoxy compound illustrated as said cationically polymerizable compound can be used.
  • a compound which has a (meth) acryl group what was illustrated as said radically polymerizable compound can be used.
  • the said cationically polymerizable compound and anionically polymerizable compound can be used individually or in mixture of 2 or more types, respectively.
  • (C) Molecular Weight of Polymerizable Compound The molecular weight of the above-mentioned polymerizable compound is appropriately set according to the use of the composition etc. be able to. In addition, said molecular weight can be represented by a weight average molecular weight (Mw), when a polymeric compound is a polymer which contains a repeating structure as the structure.
  • Mw weight average molecular weight
  • the content of the polymerizable compound may be any amount as long as the composition can be used as a curable composition, but 1 part by mass or more in a total of 100 parts by mass of the compound A, the compound B and the polymerizable compound It can be 99 parts by mass or less, preferably 50 parts by mass or more and 99 parts by mass or less, and particularly preferably 80 parts by mass or more and 99 parts by mass or less.
  • the content is in the above-mentioned range, the composition is easy to use as a curable composition, and the effect of improving the durability such as light resistance and heat resistance of the curable composition is improved. It is because it can demonstrate more effectively.
  • the above-mentioned polymer has no polymerizable group.
  • any polymer having a repeating structure may be used, and a photosensitive resin having photosensitivity, a non-photosensitive resin having no photosensitivity, and the like can be mentioned.
  • the said composition can be used as a photosensitive composition, for example by including photosensitive resin as a resin component.
  • Photosensitive resin The above-mentioned photosensitive resin has photosensitivity, and is used together with an acid generator, for example, dissolution of a chemical bond such as an ester group or acetal group by the action of an acid, etc. Mention may be made of positive resins which change in the direction in which the properties increase.
  • the composition described above contains a positive resin as a resin component, whereby the solubility of the light-irradiated portion in the alkali developer is increased. Therefore, the composition can be used, for example, as a positive type composition, more specifically, as a photosensitive composition whose solubility in a solvent such as an alkaline developer changes before and after light irradiation.
  • polystyrene and derivatives thereof polyhydroxystyrene and derivatives thereof; polyacrylic acid and derivatives thereof; polymethacrylic acid and derivatives thereof; hydroxystyrene, acrylic acid, methacrylic acid and derivatives thereof and two or more formed Copolymer: two or more copolymers selected from hydroxystyrene, styrene and their derivatives, cycloolefin and its derivatives, maleic anhydride, and three or more copolymers selected from acrylic acid and its derivatives Combined; cycloolefin and derivatives thereof, maleimide, and three or more copolymers selected from acrylic acid and derivatives thereof; polynorbornene; at least one polymer selected from the group consisting of metathesis ring-opening polymers Etc.
  • the acid labile group to be introduced into the above-mentioned polymer includes heteroalicyclic groups such as tertiary alkyl group, trialkylsilyl group, oxoalkyl group, aryl group substituted alkyl group, tetrahydropyran-2-yl group, etc.
  • heteroalicyclic groups such as tertiary alkyl group, trialkylsilyl group, oxoalkyl group, aryl group substituted alkyl group, tetrahydropyran-2-yl group, etc.
  • Tertiary alkylcarbonyl groups, tertiary alkylcarbonylalkyl groups, alkyloxycarbonyl groups and the like can be mentioned.
  • positive resin Detailed examples of the positive resin are the same as the contents described in, for example, JP-A-2003-192665, JP-A-2004-323704, claim 3, JP-A-10-10733, etc. Can.
  • a well-known acid generator can be used as an acid generator used with said positive resin.
  • the photocationic polymerization initiator mentioned later, a thermal cationic polymerization initiator, etc. can be mentioned.
  • the above-mentioned non-photosensitive resin may be any one which does not have photosensitivity, for example, polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymer, poly (meth) acrylic acid, styrene -(Meth) acrylic acid copolymer, (meth) acrylic acid-methyl methacrylate copolymer, ethylene-vinyl chloride copolymer, ethylene-vinyl copolymer, polyvinyl chloride resin, ABS resin, nylon 6, nylon 66 Nylon 12, urethane resin, polycarbonate polyvinyl butyral, cellulose ester, polyacrylamide, saturated polyester, phenol resin, phenoxy resin, polyamide imide resin, polyamic acid resin, epoxy resin and the like.
  • the non-photosensitive resin for example, a polymer of the above-mentioned polymerizable compound can also be used.
  • the weight average molecular weight (Mw) of the polymer is appropriately set according to the application etc. of the composition, but can be, for example, 1500 or more, and 1500 or more and 300000 or less It can be done.
  • Resin component The content of the above-mentioned resin component is appropriately set according to the application etc. of the composition, for example, 1 to 99 parts by mass with respect to 100 parts by mass of solid content.
  • the amount is preferably 20 parts by mass or more and 95 parts by mass or less, and more preferably 30 parts by mass or more and 90 parts by mass or less. It is because the said composition can hold
  • the content of the resin component can be 1 part by mass or more and 99 parts by mass or less, and is 50 parts by mass or more and 99 parts by mass or less in 100 parts by mass of the compound A, the compound B and the resin component.
  • the total content of the resin component, the compound A and the compound B can be 1 part by mass or more in 100 parts by mass of the composition, and in particular, 10 parts by mass or more and 99 parts by mass or less.
  • the amount is preferably 30 parts by mass or more and 95 parts by mass or less, and more preferably 50 parts by mass or more and 70 parts by mass or less. It is because the said composition becomes easy to manufacture of the hardened
  • the type of the resin component may be only one type or a combination of two or more types.
  • the resin component may contain, for example, only one or both of the polymerizable compound and the polymer.
  • the content of the polymerizable compound can be appropriately set according to the application etc. of the composition, for example, the polymerizable compound and the polymer It can be 1 part by mass or more and 99 parts by mass or less with respect to 100 parts by mass.
  • the above composition may contain other components, as necessary, in addition to the compound A, the compound B and the resin component.
  • the above-mentioned other components can include a polymerization initiator, a colorant, a solvent, a chain transfer agent, a sensitizer, a surfactant, a silane coupling agent, a melamine compound, an acid catalyst, a base catalyst and the like.
  • the above-mentioned polymerization initiator is contained as a curable component, and is usually used together with a polymerizable compound or the like.
  • the above-mentioned polymerization initiator may be any one capable of polymerizing a polymerizable compound, for example, a photopolymerization initiator capable of polymerizing a polymerizable compound by receiving light irradiation, and can polymerize a polymerizable compound by heating And thermal polymerization initiators.
  • the polymerization initiator is preferably a photopolymerization initiator from the viewpoint of effectively exerting the effect that the composition can be easily cured even when the composition contains the compound A and the compound B.
  • photopolymerization initiator may be any one capable of polymerizing the polymerizable compound by receiving light irradiation, for example, photo radical polymerization initiator, photo cationic polymerization initiator, photo anion A polymerization initiator etc. can be mentioned.
  • the photo radical polymerization initiator is not particularly limited as long as it generates radicals by light irradiation, and conventionally known compounds can be used.
  • an acetophenone type compound, a benzyl type compound, a benzophenone series compound, a thioxanthone type compound, an oxime ester type compound etc. can be illustrated as a preferable thing, for example.
  • acetophenone compounds include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 4'-isopropyl-2-hydroxy-2-methylpropiophenone, 2-hydroxymethyl- 2-Methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p-dimethylaminoacetophenone, p-tertiary butyl dichloroacetophenone, p-tertiary butyl trichloroacetophenone, p-azidoben Salacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl ) -Butanone-1, b Zoin, benzoin methyl ether, benzoin ethyl-N-phenyl
  • benzyl compound examples include benzyl and the like.
  • benzophenone compounds include benzophenone, methyl o-benzoylbenzoate, Michler's ketone, 4,4'-bisdiethylaminobenzophenone, 4,4'-dichlorobenzophenone and 4-benzoyl-4'-methyldiphenyl sulfide.
  • thioxanthone compound examples include thioxanthone, 2-methyl thioxanthone, 2-ethyl thioxanthone, 2-chloro thioxanthone, 2-isopropyl thioxanthone, 2,4-diethyl thioxanthone and the like.
  • oxime compound particularly, a compound represented by the following general formula (IV) can be mentioned because the sensitivity and heat resistance are good.
  • R 71 and R 72 each independently represent a hydrogen atom, a cyano group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl having 7 to 30 carbon atoms
  • R 73 and R 74 each independently represent a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group, R 75 , OR 76 , SR 77 , NR 78 R 79 , COR 80 , SOR 81 , SO 2 R 82 or It represents CONR 83 R 84, R 73 and R 74 are, may have bonded to each other to form a ring, R 75 , R 76 , R 77 , R 78 , R 79 , R 80 , R 81 , R 82 , R 83 and R 84 are each
  • Examples of the alkyl group of -20, the aryl group of 6 to 30 carbon atoms, the arylalkyl group of 7 to 30 carbon atoms, the heterocycle-containing group of 2 to 20 carbon atoms, and the substituents thereof include the above-mentioned "2.
  • R 1 and the like in the item of the compound A those having a predetermined number of carbon atoms can be mentioned.
  • Examples of the oxime-based compound include: ethanone-1- [9-ethyl-6- (2-methylbenzoyl-9H-carbazol-3-yl] -1- (O-acetyloxime), 1- [9-ethyl -6-Benzoyl-9H-carbazol-3-yl-octan-1-one oxime-O-acetate, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -ethane- 1-one oxime-O-benzoate, 1- [9-n-butyl-6- (2-ethylbenzoyl) -9H-carbazol-3-yl] -ethan-1-one oxime-O-benzoate, ethanone-1- [ 9-ethyl-6- (2-methyl-4-tetrahydrofuranylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime),
  • an indole oxime ester compound having an indole structure can also be used.
  • an indole type oxime ester compound the oxime ester compound etc. which are represented by the following general formula (V) described in international publication 2017/051680 can be mentioned, for example.
  • R 201 and R 202 each independently represent R 211 , OR 211 , COR 211 , SR 211 , CONR 212 R 213 or CN
  • R 211 , R 212 and R 213 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a carbon atom
  • the hydrogen atoms of the groups represented by R 211 , R 212 and R 213 further include R 221 , OR 221 , COR 221 , SR 221 , NR 222 R 223 , CONR 222 R 223 , NR 222 OR 223 , NCOR 222 OCOR 223 , NR 222 COR 221 , OCOR 221 , COOR 221 , SCOR 221 , OCSR 221 , COSR
  • the hydrogen atom of the group represented by R 203 is further R 221 , OR 221 , COR 221 , SR 221 , NR 222 R 223 , CONR 222 R 223 , NR 222 OR 223 , NCOR 222 OCOR 223 , NR 222 COR 221 , OCOR 221 , COOR 221 , SCOR 221 , OCSR 221 , COSR 221 , CSOR 221 , and may be substituted with a hydroxyl group, a nitro group, CN, a halogen atom, or COOR 221 , R 204 , R 205 , R 206 and R 207 are each independently R 211 , OR 211 , SR 211 , COR 214 , CONR 215 R 216 , NR 212 COR 211 , OCOR 211 , COOR 214 , SCOR 211 , OCSR 211 , CO
  • the hydrogen atoms of the groups represented by R 204 , R 205 , R 206 and R 207 are further R 221 , OR 221 , COR 221 , SR 221 , NR 222 R 223 , CONR 222 R 223 , NR 222 OR 223 , NCOR 222 It may be substituted by OCOR 223 , NR 222 COR 221 , OCOR 221 , COOR 221 , SCOR 221 , OCSR 221 , COSR 221 , CSOR 221 , a hydroxyl group, a nitro group, CN, a halogen atom or COOR 221 , R 214 , R 215 and R 216 each represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms,
  • the alkyl part of the groups represented by R 214 , R 215 and R 216 may have branched side chains and may be cyclic alkyl
  • R 208 represents
  • Examples of the alkyl group, the aryl group having 6 to 30 carbon atoms, the arylalkyl group having 7 to 30 carbon atoms, and the heterocycle-containing group having 2 to 20 carbon atoms include R 1 in the section of “2. Among the contents exemplified as etc., those satisfying a predetermined number of carbon atoms are mentioned.
  • radical polymerization initiators include phosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenyl phosphine oxide and bis (cyclopentadienyl) -bis [2,6-difluoro-3- (pill-1) -Yl)] Titanocene compounds such as titanium etc. may be mentioned.
  • radical polymerization initiators include Adeka optomer N-1414, N-1717, N-1919, Adeka Arkles NCI-831, NCI-930 (manufactured by ADEKA Corporation), IRGACURE 184, IRGACURE 369, IRGACURE 651, IRGACURE 907, IRGACURE OXE 01, IRGACURE OXE 02, OXE 03, OXE 04, IRGACURE 784 (manufactured by BASF), TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-314 (manufactured by Tronly) and the like. Be
  • radical photopolymerization initiators can be used alone or in combination of two or more depending on the desired performance.
  • the photocationic polymerization initiator is not particularly limited as long as it is a compound capable of releasing a substance that causes cationic polymerization to be initiated by light irradiation, and it is possible to use an existing compound, and preferably an energy ray.
  • the compound is a double salt which is an onium salt that releases a Lewis acid upon irradiation with or a derivative thereof.
  • Representative examples of such compounds include the following general formula: [A1] r + [B1] r- And salts of cations and anions represented by
  • the cation [A1] r + is preferably onium, and the structure thereof can be represented by, for example, the following general formula. [(R 101 ) f 1 Q] r +
  • R 101 is an organic group having 1 to 60 carbon atoms and which may contain several atoms other than carbon atoms.
  • f1 is an integer of 1 to 5;
  • the f1 Rs 101 are independent of each other, and may be the same or different.
  • at least one of R 101 is preferably an organic group as described above having an aromatic ring. For example, when substituted by an alkyl group, alkoxy group, hydroxy group, hydroxyalkoxy group, halogen atom, benzyl group, thiophenoxy group, 4-benzoylphenylthio group, 2-chloro-4-benzoylphenylthio group, etc. A certain phenyl group is mentioned.
  • the anion [B1] r- is preferably a halide complex, and its structure can be represented, for example, by the following general formula, [LX f2 ] r- .
  • L is a metal or metalloid (Metalloid) which is a central atom of a halide complex, and B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co and the like.
  • anion [LX f2 ] r- of the above general formula examples include tetrakis (pentafluorophenyl) borate, tetra (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroborate (BF 4 ) ⁇ , Hexafluorophosphate (PF 6 ) ⁇ , hexafluoroantimonate (SbF 6 ) ⁇ , hexafluoroarsenate (AsF 6 ) ⁇ and hexachloroantimonate (SbCl 6 ) ⁇ can be mentioned.
  • the anion [B1] r- has the following general formula, [LX f2-1 (OH)] r-
  • L, X and f2 are the same as above.
  • Other anions which can be used include perchlorate ion (ClO 4 ) ⁇ , Trifluoromethyl sulfite (CF 3 SO 3 ) ⁇ , fluorosulfonate ion (FSO 3 ) ⁇ , toluenesulfonate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadeca There may be mentioned fluorooctane sulfonate, tetraaryl borate and tetrakis (pentafluorophenyl) borate.
  • 1 type can be used individually or in mixture of 2 or more types.
  • aryldiazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate and 4-methylphenyldiazonium hexafluorophosphate.
  • Diaryls such as diphenyliodonium hexafluoroantimonate, di (4-methylphenyl) iodonium hexafluorophosphate, di (4-tert-butylphenyl) iodonium hexafluorophosphate and tolycamyliodonium tetrakis (pentafluorophenyl) borate Iodonium salt.
  • Sulfonium salts represented by the following Group I or Group II: sulfonium salts such as hexafluoroantimony ion, tetrakis (pentafluorophenyl) borate ion and the like.
  • other preferable ones are ( ⁇ 5-2, 4-cyclopentadien-1-yl) [(1, 2, 3, 4, 5, 6 ⁇ )-(1-methylethyl) benzene] -iron- Iron-arene complexes such as hexafluorophosphate; aluminum complexes such as tris (acetylacetonato) aluminum, tris (ethylacetonatoacetato) aluminum, tris (salicylaldehyde) aluminum; mixtures with silanols such as triphenylsilanol : Etc. can also be mentioned.
  • a commercial item can also be used as said photocationic polymerization initiator, For example, IRUGACURE 261 (made by BASF Corporation), Adeka optomer SP-150, SP-151, SP-152, SP-170, SP-171, SP -172 (made by Adeka), UVE-1014 (made by General Electronics), CD-1012 (made by Sartmar), CI-2064, CI-2481 (made by Nippon Soda Co., Ltd.), Uvacure 1590, 1591 (Daicel UCB), CYRACURE UVI-6990 (manufactured by Union Carbide), BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103 and NDS-103 (manufactured by Midori Chemical Co., Ltd.), and the like.
  • aromatic iodonium salts, aromatic sulfonium salts and iron-arene complexes are preferably used from the viewpoint of practical use and light sensitivity.
  • photoanion polymerization initiator what generate
  • the photoanion polymerization initiator include acetophenone O-aroyloxime (acetophenone O-aroyloxime), nifedipine and the like.
  • thermal polymerization initiator any one capable of polymerizing a polymerizable compound by heating may be used, and a radical polymerization initiator, a cationic polymerization initiator, an anionic polymerization initiator, etc. may be mentioned. Can.
  • thermal radical polymerization initiator what generate
  • a thermal radical polymerization initiator an azo compound, a peroxide, a persulfate, etc. can be illustrated as a preferable thing, for example.
  • azo compounds examples include 2,2'-azobisisobutyronitrile, 2,2'-azobis (methylisobutyrate), 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1 ' And -azobis (1-acetoxy-1-phenylethane) and the like.
  • peroxides examples include benzoyl peroxide, di-t-butyl benzoyl peroxide, t-butyl peroxypivalate and di (4-t-butylcyclohexyl) peroxy dicarbonate.
  • persulfate examples include persulfates such as ammonium persulfate, sodium persulfate and potassium persulfate.
  • thermal cationic polymerization initiator what generate
  • Specific examples of the thermal cationic polymerization initiator include salts such as sulfonium salts, thiophenium salts, thiolanium salts, benzyl ammonium, pyridinium salts and hydrazinium salts; and polyalkylpolyamines such as diethylenetriamine, triethylenetriamine and tetraethylenepentamine.
  • Alicyclic polyamines such as 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane and isophorone diamine; Aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane and diaminodiphenyl sulfone Glycidyl ethers such as the above polyamines and phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether and bisphenol F-diglycidyl ether Or a polyepoxy adduct modified product produced by reaction with various epoxy resins such as glycidyl esters of carboxylic acid according to a conventional method; the above organic polyamines and carboxylic acids such as phthalic acid, isophthalic acid and dimer acid Amidated modified products produced by reaction according to a conventional method; the above-mentioned polyamines
  • a commercial item can also be used as said thermal cationic polymerization initiator,
  • Adeka opton CP-77 Adeka opton CP-66 (made by ADEKA), CI-2639, CI-2624 (made by Nippon Soda Co., Ltd.), Sun Aid SI -60 L, San Aid SI-80 L, San Aid SI-100 L (manufactured by Sanshin Chemical Industry Co., Ltd.), and the like.
  • thermal anion polymerization initiator what generate
  • Specific examples of the anionic polymerization initiator include aliphatic amine compounds, aromatic amine compounds, secondary or tertiary amine compounds, imidazole compounds, polymercaptan compounds, and boron trifluoride-amine complex. , Dicyandiamide, organic acid hydrazide and the like can be used.
  • the content of the polymerization initiator may be any as long as it can impart desired curability and photosensitivity. It can be in the range of not less than 30 parts by mass and preferably in the range of 0.5 parts by mass to 10 parts by mass. It is because a composition is excellent in curability etc. and is excellent also in dispersibility etc. by being said content.
  • the content of the polymerization initiator may be any as long as it can impart desired curability and photosensitivity. For example, it is 0.001 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the polymerizable compound.
  • the amount is preferably 0.01 parts by mass or more and 10 parts by mass or less, and more preferably 0.1 parts by mass or more and 5 parts by mass or less. It is because a composition is excellent in curability etc. and is excellent also in dispersibility etc. by being said content.
  • coloring agent As said coloring agent, what is necessary is just to be able to provide desired coloring to hardened
  • the dye a compound having absorption at 380 to 1200 nm can be used, and for example, azo compound, anthraquinone compound, indigoid compound, triarylmethane compound, xanthene compound, alizarin compound, acridine compound, stilbene compound, thiazole compound, naphthol Compound, quinoline compound, nitro compound, indamine compound, oxazine compound, phthalocyanine compound, cyanine compound, diimmonium compound, cyanoethenyl compound, dicyanostyrene compound, rhodamine compound, perylene compound, polyene naphtholactam compound, coumarin compound, squalilium compound, squarylium compound, Spiropyran compounds, spirooxazine compounds, merocyanine
  • an inorganic pigment or an organic pigment can be used.
  • Carbon black one prepared by coating the above carbon black with an epoxy resin and coated, one obtained by dispersing the carbon black in a solvent beforehand with a resin and adsorbing a resin of 20 to 200 mg / g, the above carbon black is acidic or alkaline Surface-treated, with an average particle diameter of 8 nm or more and a DBP oil absorption of 90 ml / 100 g or less, CO in volatiles at 950 ° C., total oxygen amount calculated from CO 2 is 9 mg per 100 m 2 of surface area of carbon black Graphite, graphitized carbon black, activated carbon, carbon fiber, carbon nanotube, carbon micro coil, carbon nanohorn, carbon aerogel, fullerene; aniline black, pigment black 7, titanium black; hydrophobic resin, chromium oxide green, Miroli Blue, Baltic green, cobalt blue, manganese based, ferrocyanide, phosphate group blue, bitumen, ultramarine, cerulian blue, pyridinian, emerald green, lead
  • pigments can also be used as the above-mentioned inorganic pigment or organic pigment, and for example, pigment red 1, 2, 3, 9, 10, 14, 17, 22, 22, 31, 31, 38, 41, 48, 49, 88, 90, 97, 112, 119, 122, 123, 144, 149, 166, 168, 169, 171, 177, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 254; pigment oranges 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 65, 71; pigment yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86 93, 95, 97, 98, 100, 109, 110, 113, 114, 117, 120, 126, 127, 129, 137, 138, 139
  • content of the said coloring agent it can be referred to as 0.01 mass part or more and 50 mass parts or less with respect to 100 mass parts of solid content of a composition.
  • the solvent may be any solvent as long as it can dissolve or disperse the above components.
  • BTX solvents such as benzene, toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane and cyclohexane; turpentine oil, D-limonene, Terpene-based hydrocarbon oils such as Nene; paraffin spirits such as Mineral Spirit, Swazor # 310 (Cosmo Matsuyama Oil Co., Ltd.), Solvesso # 100 (Exxon Chemical Co., Ltd.); Carbon tetrachloride, chloroform, trichloroethylene, methylene chloride Halogenated aliphatic hydrocarbon solvents such as 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethyl
  • the content of the solvent can be appropriately set according to the application etc. of the above composition, but preferably, the amount of components (solid content) other than the solvent in the above composition is preferably 1% by mass to 99% by mass
  • the amount is as follows, and in particular, it is preferably 10% by mass to 90% by mass, and particularly preferably 30% by mass to 70% by mass. It is because the said composition becomes what was excellent in coating property etc. because the said content is the above-mentioned range.
  • the sensitivity of the composition can be adjusted, and a sulfur atom-containing compound is generally used.
  • C1 aliphatic polyfunctional thiol compounds, such as tri-mercaptopropionic acid tris (2-hydroxyethyl) isocyanurate, manufactured by Showa Denko KK Karenz MT BD1, PE1, NR 1, and the like.
  • Surfactant As the above-mentioned surfactant, those which can improve the dispersion stability, coatability and the like of the composition can be used, and fluorine such as perfluoroalkyl phosphate, perfluoroalkyl carboxylate and the like can be used.
  • anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates and alkyl sulfates, cationic surfactants such as higher amine halides and quaternary ammonium salts, polyethylene glycol alkyl ether, polyethylene Nonionic surfactants such as glycol fatty acid esters, sorbitan fatty acid esters, fatty acid monoglycerides, surfactants such as amphoteric surfactants and silicone surfactants can be used, and these may be used in combination.
  • the above silane coupling agent is a silane compound having a reactive group chemically bonded to an inorganic material such as glass and a reactive group chemically bonded to an organic material such as a synthetic resin, which is cured What can improve the adhesiveness etc. of a thing can be used.
  • a silane coupling agent manufactured by Shin-Etsu Chemical Co., Ltd. can be used.
  • An agent is preferably used.
  • melamine Compound As the above-mentioned melamine compound, those which can improve the curability can be used.
  • (poly) methylol melamine, (poly) methylol glycoluril, (poly) methylol benzoguanamine, (poly) methylol urea, etc. of active methylol groups of the nitrogen compound (CH 2 OH groups) of all or part (at least two) can be exemplified compounds alkyl etherified.
  • an alkyl group which comprises an alkyl ether a methyl group, an ethyl group, or a butyl group is mentioned, A mutually may be the same, It may differ.
  • the methylol group which is not alkyletherified may be self-condensing within one molecule, or may be condensed between two molecules to form an oligomer component as a result.
  • hexamethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylglycoluril, tetrabutoxymethylglycoluril and the like can be used.
  • alkyletherified melamines such as hexamethoxymethylmelamine and hexabutoxymethylmelamine are preferable.
  • the acid catalyst and the base catalyst are capable of promoting the elimination of the protective groups R 9 and R 11 of the phenolic hydroxyl group contained in the compound A and the compound B.
  • the composition contains an acid catalyst and a base catalyst so that the protective groups R 9 and R 11 can be removed at a lower temperature as compared with the case where the acid catalyst and the base catalyst are not contained.
  • inorganic acids such as hydrochloric acid, phosphoric acid and sulfuric acid
  • Organic acids such as formic acid, acetic acid, oxalic acid, citric acid, methanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid and monoisopropyl phosphate Acids
  • the base catalyst include inorganic bases such as sodium hydroxide, potassium hydroxide, lithium hydroxide and ammonia; and amine compounds (organic bases) such as trimethylamine, triethylamine, monoethanolamine and diethanolamine.
  • the content of the acid catalyst and the base catalyst is appropriately set according to the type and the desired desorption temperature, etc., and 0.1 parts by weight with respect to a total of 100 parts by weight of the compound A and the compound B. It can be from 10 parts by mass to 10 parts by mass.
  • thermal polymerization inhibitors such as p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, phenothiazine, etc .
  • plasticizers such as p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, phenothiazine, etc .
  • adhesion promoters fillers; Agents; leveling agents; surface conditioners; antioxidants other than the above compound B such as phenolic antioxidants, phosphite antioxidants, thioether antioxidants, etc .
  • ultraviolet absorbers other than the above compound A
  • dispersion Coagents may be included such as an anticoagulant, a catalyst, an effect accelerator, a crosslinker, and a thickener.
  • the total content of the additives can be 30 parts by mass or less in 100 parts by mass of the solid content of the composition.
  • the composition described above can provide a cured product having desired durability, and can contain a phenolic antioxidant and a UV absorber in addition to the compound A and the compound B, as long as the cured product can be easily produced. Although it may exist, it is preferable not to contain substantially.
  • “not substantially contained” can be 1 part by mass or less in 100 parts by mass of the solid content of the composition, and in particular, it is preferably 0.01 part by mass or less, and 0.005 mass It is preferable that it is a part or less, It is preferable that it is 0.001 mass part or less, It is preferable that it is 0.0001 mass part or less.
  • the content of the above-mentioned phenolic antioxidant and ultraviolet absorber can be 1 part by mass or less with respect to a total of 100 parts by mass of the above compound A and compound B, and in particular, 0.01 parts by mass or less Is preferably 0.005 parts by mass or less, preferably 0.001 parts by mass or less, and preferably 0.0001 parts by mass or less. It is because it becomes possible to obtain a cured product excellent in durability. Moreover, as said ultraviolet absorber, the ultraviolet absorber which has phenolic hydroxyl group can be mentioned.
  • the ultraviolet absorber examples include 2-hydroxybenzophenones described in JP-A-2017-008221, 2- (2′-hydroxyphenyl) benzotriazoles, benzoates, triaryltriazines, and the like.
  • the benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, etc. described in JP-A-97224 can be used.
  • As said phenolic antioxidant it can be generally used as antioxidant which has phenolic hydroxyl group.
  • examples of the above-mentioned antioxidant include phenol based antioxidants described in JP-A-6-17998, JP-A-11-71355, JP-A-2002-97224, etc., JP-A-7-109380.
  • the alkyl-substituted phenolic antioxidants described can be used.
  • the viscosity of the composition may be, for example, 200 mPa ⁇ s or less, and 1 mPa ⁇ s or more and 200 mPa ⁇ s or less, from the viewpoint of having coatability. It is because the said composition is excellent in coatability.
  • the method for producing the above composition may be any method as long as the above-mentioned components can be blended at a desired content, and may be a method in which the above-mentioned components are simultaneously added and mixed. It may be a method of mixing.
  • thermosetting coatings thermosetting coatings, photocurable coatings or varnishes, thermosetting adhesives, photocurable adhesives, printed circuit boards, or color televisions such as color televisions, PC monitors, personal digital assistants, digital cameras, etc.
  • Color filters for liquid crystal display panels for display color filters for CCD image sensors, photo spacers, black column spacers, electrode materials for plasma display panels, touch panels, touch sensors, powder coatings, printing inks, printing plates, adhesives, for dental use
  • Composition resin for photolithography, gel coat, photoresist for electronics, electroplating resist, etching resist, both liquid and dry film, solder resist, for manufacturing color filters for various display applications or plasma display
  • Resists for forming structures compositions for encapsulating electric and electronic parts, solder resists, magnetic recording materials, micromechanical parts, waveguides, optical switches, plating masks, etching masks, color test systems, glass Fiber cable coatings, stencils for screen printing, materials for producing
  • the above-mentioned application is not limited to the application requiring durability when used as a product, and for example, it can be suitably used also for a member which receives ultraviolet irradiation or the like in the manufacturing process.
  • a member which receives ultraviolet irradiation etc. in a manufacturing process in order to aim at surface modification of surface wettability improvement, adhesion improvement, etc., a member which receives irradiation, such as ultraviolet light, can be mentioned, for example.
  • the members required to have the above-mentioned wettability improvement and adhesion improvement include members laminated with other members.
  • various members such as a plasma display panel, an organic electroluminescence display, a liquid crystal display, etc.
  • Image display various sensors such as touch panels, color filters, photo spacers, brightness enhancement plates, light guide plates, light guide plates, TFT substrates, alignment films, liquid crystal layers, insulating films, acoustic elements such as speakers, members for constituting circuit boards etc.
  • a member include a surface modification in the manufacturing process of a lens, a keypad, a magnetic head for an HDD, and the like, and the prevention of deterioration of the member.
  • members required to prevent surface modification and deterioration of members in the above-mentioned manufacturing process members to be laminated with other members via an adhesive, members to be covered with other members by paints, etc. should also be mentioned.
  • the base material may be irradiated with ultraviolet light or the like together with the base material for surface modification of the exposed base material.
  • required in such a manufacturing process for example, a member used together with a member requiring surface cleaning or surface modification such as plastic film, glass, silicon wafer, various engineering plastics, optical lens, metal surface, plating, ceramic, mold etc. It can be mentioned.
  • the thin film member can be, for example, a member having a film thickness of 100 ⁇ m or less, preferably 50 ⁇ m or less, and particularly preferably 20 ⁇ m or less.
  • the cured product of the present invention is characterized in that it is a cured product of the above-mentioned composition. More specifically, the cured product of the present invention is a cured product of a composition, and the above composition is characterized in that it contains a compound A, a compound B and a polymerizable compound.
  • the production is easy and the durability is excellent.
  • the cured product of the present invention uses the composition described above. Hereinafter, the cured product of the present invention will be described in detail.
  • the composition contains the compound A, the compound B and the polymerizable compound.
  • the composition may include components other than the compound A, the compound B, and the polymerizable compound.
  • the composition can contain, for example, resin components other than the polymerizable compound, other components, and the like. About the content of each component of such a composition, it can be made to be the same as the content as described in the said "A. composition" term.
  • the cured product may be a cured product of the above composition, and the compound A and the compound B contained in the cured product are desorbed even before removal of the protective groups (for example, R 9 and R 11 ). Although it may be after separation, it is preferable after separation. It is because the said hardened
  • the above-mentioned cured product usually contains a polymer of a polymerizable compound.
  • the residual ratio of the polymerizable compound contained in the cured product is appropriately set according to the application etc. of the cured product, and is, for example, 10 parts by mass or less with respect to 100 parts by mass of the cured product. It is preferable that it is below a mass part.
  • Such composition since it can be made to be the same as the contents described in the section of the above-mentioned "A. composition", explanation here is omitted.
  • the cured product may be substantially free of a solvent.
  • cured material it can be 1 mass part or less with respect to 100 mass parts of hardened
  • the elastic modulus of the cured product is usually higher than that of the composition, and can be, for example, 10 -3 M or more, and can be 10 MPa or more. It is because the said hardened
  • the elastic modulus refers to the compressive elastic modulus and can be measured at 23 ° C. in accordance with JIS K7181.
  • a cube-shaped test piece having a side length of 6 mm can be prepared or cut out, and measurement can be performed at a test speed of 1 ⁇ 0.2 mm / min according to JIS K7181.
  • cured material it can set suitably according to the use etc. of the said hardened
  • the thickness of the cured product can be appropriately set according to the application etc. of the cured product, and, for example, compound A and compound B are excellent in dispersion stability, and it is easy to increase the addition amount thereof From the viewpoint, for example, a thin film is preferable, for example, 0.1 ⁇ m or more and 100 ⁇ m or less, preferably 50 ⁇ m or less, particularly preferably 20 ⁇ m or less, and particularly 10 ⁇ m or less Is preferred.
  • the method for producing the cured product is not particularly limited as long as the cured product of the composition can be formed into a desired shape.
  • a manufacturing method for example, since it can be the same as the contents described in the section of “C. Manufacturing method of cured product” described later, the description here is omitted.
  • the method for producing a cured product of the present invention is characterized by comprising the step of forming a cured product of the composition described above. More specifically, the method for producing a cured product of the present invention is characterized by comprising a step of forming a cured product of a composition containing compound A, compound B and a polymerizable compound.
  • the production method of the cured product becomes easy by using the above-mentioned composition and having the above-mentioned steps.
  • the step of removing the protecting group R 9 contained in the compound A and the protecting group R 11 contained in the compound B after the above steps a cured product having durability can be easily obtained. It is because
  • the production method of the present invention includes the step of forming a cured product.
  • each process of the manufacturing method of this invention is demonstrated in detail.
  • Step of forming a cured product is a step of forming a cured product of the composition described above.
  • a method of forming a cured product of such a composition any method capable of forming a cured product of a desired shape may be used, and the method differs depending on the components contained in the composition.
  • the method of forming the cured product for example, when the composition contains a photopolymerization initiator as a polymerization initiator together with a polymerizable compound, the composition is irradiated with light to polymerize the polymerizable compounds with each other. Methods can be used.
  • the light irradiated to the composition may include light with a wavelength of 300 nm to 450 nm.
  • a light source of the said light irradiation an ultra-high pressure mercury, a mercury vapor arc, a carbon arc, a xenon arc etc. can be mentioned, for example.
  • Laser light may be used as the light to be irradiated.
  • the laser light one containing light with a wavelength of 340 to 430 nm can be used.
  • those emitting light in the visible to infrared region such as argon ion laser, helium neon laser, YAG laser, and semiconductor laser can also be used.
  • the said composition can contain the sensitizing dye which absorbs the said area
  • the composition is subjected to a heat treatment to polymerize the polymerizable compounds.
  • the heating temperature may be such that the removal of the protective group from compound A and compound B can be suppressed.
  • the heating temperature may be, for example, 60 ° C. or more, preferably 100 ° C. or more and 300 ° C. or less.
  • heating temperature can be made into the temperature of the coating-film surface of a composition.
  • the heating time can be about 10 seconds to 3 hours.
  • the type of the method of forming the cured product may include only one type, or may include two or more types.
  • the composition contains the compound A, the compound B and the polymerizable compound.
  • the composition may include components other than the compound A, the compound B, and the polymerizable compound.
  • the composition can contain, for example, resin components other than the polymerizable compound, other components, and the like.
  • the above-mentioned production method can include, after the step of forming the cured product, the step of removing the protecting group R 9 contained in the compound A and the protecting group R 11 contained in the compound B. .
  • a cured product having durability can be easily obtained.
  • any method capable of stably removing the above protecting group may be used, for example, It can be set as the method of heat-processing with respect to the said hardened
  • the heating temperature for the cured product may be a temperature at which the protective group R 9 and the protective group R 11 are eliminated, for example, a temperature higher than the desorption temperature of the protective group R 9 and the protective group R 11 .
  • the heating temperature can be equal to or less than the desorption temperature observed for the protective group R 9 and the protective group R 11 alone.
  • the heating temperature can be, for example, 50 ° C. or more and 250 ° C. or less, preferably 60 ° C. or more and 200 ° C. or less, and particularly preferably 80 ° C. or more and 200 ° C. or less. It is because deterioration of a resin component etc., deterioration of the base material which supports hardened
  • the above-mentioned production method may include other steps, as necessary, in addition to the step of forming a cured product and the step of removing.
  • coating the said composition on a base material etc. can be mentioned, for example.
  • known methods such as spin coater, roll coater, bar coater, die coater, curtain coater, various printing, immersion and the like can be used.
  • the substrate can be appropriately set depending on the application of the cured product and the like, and examples thereof include soda glass, quartz glass, semiconductor substrates, metals, paper, plastics and the like.
  • after the cured product is formed on a substrate it may be used after being peeled off from the substrate or may be transferred from the substrate to another adherend.
  • the present invention is not limited to the above embodiment.
  • the above embodiment is an exemplification, and it has substantially the same configuration as the technical idea described in the claims of the present invention, and any one having the same function and effect can be used. It is included in the technical scope of the invention.
  • the phenol compound used was a compound in which two —COO-tert-butyl groups in the following A1-1 were substituted by hydrogen atoms.
  • Production Example 1 30.0 g of 1,1-bis [4- (2,3-epoxypropyloxy) phenyl] indane, 7.52 g of acrylic acid, 0.080 g of 2,6-di-t-butyl-p-cresol, tetrabutyl 0.183 g of ammonium chloride and 11.0 g of PGMEA were charged, and stirred at 90 ° C. for 1 hour, 105 ° C. for 1 hour and 120 ° C. for 17 hours. The reaction solution was cooled to room temperature, and 8.11 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride and 11.1 g of PGMEA were added and stirred at 100 ° C.
  • Examples 1 to 20 and Comparative Examples 1 to 28 Compound A, ultraviolet light absorber, compound B, antioxidant, polymerizable compound having an acid value, polymerizable compound having no acid value, photopolymerization initiator, silane coupling according to the composition described in Tables 2 to 5 below The agent and the solvent were blended to obtain a composition. Moreover, the following materials were used for each component. In addition, the compounding quantity in a table
  • Compound A-1 Compound A-2 represented by the above-mentioned general formula (A1-1): Compound A-3 represented by the above-mentioned general formula (A2-1): represented by the above-mentioned general formula (A3-1)
  • Compound A-4 Compound A-5 represented by the above general formula (A3-2): compound represented by the above general formula (A3-3)
  • UV absorber (UV absorber) A′-1: UV Absorber LA-29 manufactured by ADEKA A′-2: UV Absorber LA-31 manufactured by ADEKA A'-3: UV Absorber LA-F70 manufactured by ADEKA
  • Antioxidant B '-1 Antioxidant AO-60 manufactured by ADEKA
  • C-1 Radically polymerizable compound (Lipoxy SPC-1000 manufactured by Showa Denko 29% by mass PGMEA solution)
  • C-2 Resin No. 1 produced in Production Example 1 1
  • D-1 Radically polymerizable compound (Aronix M-450 (a mixture of pentaerythritol tri and tetraacrylates 3 to 4 manufactured by Toagosei Co., Ltd.))
  • D-2 Radically polymerizable compound (Kayarad DPHA (a mixture of dipentaerythritol penta and hexaacrylate) manufactured by Nippon Kayaku Co., Ltd.)
  • D-3 Cationic polymerizable compound (NK Oligo EA-1020 (bisphenol A epoxy acrylate) manufactured by Shin-Nakamura Chemical Co., Ltd.)
  • D-4 Radically polymerizable compound (Art resin UN-3320 (urethane acrylate) manufactured by Rootskami Kogyo Co., Ltd.)
  • D-5 Cationic polymerizable compound (EP-4100E (bisphenol A epoxy resin) manufactured by ADEKA Co., Ltd.)
  • D-6 Cationic polymerizable compound (Cell
  • E-1 Compound represented by the following formula (E1) (oxime ester photo radical polymerization initiator)
  • E-2 Compound represented by the following formula (E2) (oxime ester photo radical polymerization initiator)
  • E-3 Irgacure TPO manufactured by BASF (phosphine oxide radical polymerization initiator)
  • E-4 SP-171 (sulfonium salt photo cationic polymerization initiator) manufactured by ADEKA Corporation
  • silane coupling agent F-1 Shine Chemical Industry Co., Ltd. silane coupling agent KBE-403
  • Sensitivity evaluation 1 Among the compositions prepared in the respective Examples and Comparative Examples, Examples 1 to 12, 17 to 20, and Comparative Examples 1 to 9, 12 to 17, 20, 25 to 28 containing a polymerizable compound having an acid value The following line width sensitivity and residual film sensitivity were evaluated as the sensitivity evaluation of the composition. The results are shown in Tables 2-5. First, the compositions of Examples 1 to 12, 17 to 20 and Comparative Examples 1 to 9, 12 to 17, 20, and 25 to 28 were spin-coated on a glass substrate (500 rpm, 2 seconds, 900 rpm, 5 The coated film was formed to have a thickness of 10 ⁇ m after drying (pre-baking). Next, the coated film is prebaked at 90 ° C.
  • Line width sensitivity line width of cured product / 20 ⁇ m is 1.0 or more.
  • X The line width of the cured product / 20 ⁇ m is less than 1.0.
  • Remaining film sensitivity Film thickness after post-baking / film thickness after pre-baking ⁇ 100 (%) was calculated. When the line width sensitivity is “ ⁇ ” and the residual film sensitivity is 70% or more, the composition is inhibited from occurrence of curing inhibition and shows that the composition is sufficiently cured.
  • Sensitivity evaluation 2 Of the compositions prepared in the respective Examples and Comparative Examples, evaluation using the step tablet was conducted as the sensitivity evaluation of the compositions of Examples 13 to 16 and Comparative Examples 21 to 24 not containing a polymerizable compound having an acid value. Did. Specifically, the above composition was applied to a PET film with a bar coater to a thickness of about 3 ⁇ m. Next, after prebaking at 80 ° C. for 30 minutes, exposure was performed (20 mW / cm 2 ) using an ultra-high pressure mercury lamp (UL 750) as a light source. The exposure was performed so that the exposure light amount was 400 mJ.
  • UL 750 ultra-high pressure mercury lamp
  • the negative film made so that light transmittance might be decreased in steps in order to measure a photosensitivity
  • the optical density 0.05 is made into the 1st step, The optical density is 0.15 at a time for every step.
  • An increasing step tablet was used.
  • development was carried out by washing for 10 seconds in an environment of 25 ° C. using isopropanol (IPA). It was then dried at 80 ° C. for 30 minutes.
  • the photosensitivity was evaluated by measuring the number of steps of the step tablet of the cured product formed on the PET film. The results are shown in Table 4 below. The higher the number of steps of the step tablet, the higher the light sensitivity.
  • the number of steps of the step tablet is 10 or more, the composition is inhibited from occurrence of inhibition of curing and shows that the composition is sufficiently cured.
  • a sample for evaluation was obtained in the same manner as in "1. Sensitivity evaluation 1" except that heat resistance development processing and washing with water were not performed. Then, using an oven, a heat resistance test was performed in which the evaluation sample was heat-treated at 200 ° C. for 2 hours. The difference in transmittance (%) at a wavelength of 430 nm before and after the heat resistance test of the sample for evaluation ((transmittance (% before heat resistance test-transmittance (%) before heat resistance test) was measured, and The heat resistance was evaluated on the basis of the standard, and the results are shown in Tables 2 to 5. Good: The transmittance difference (%) is less than 1% with respect to the transmittance before the heat resistance test. X: The difference in transmittance (%) is 1% or more with respect to the transmittance before the heat resistance test. In addition, a hardened
  • Preparation Example 2 Preparation of Blue Pigment Dispersion As a dispersant, DISPERBYK-161 (8.4 parts by mass; manufactured by BIC Chemie Japan) and pigment blue 15: 6 (14 parts by mass) as a coloring agent were mixed with PGMEA (77.6). A blue pigment dispersion (solid content concentration: 22.4 mass%, pigment concentration in solid content: 62.5 mass%, solvent PGMEA) was produced by dispersing the pigment using a bead mill.
  • Example 21 Comparative Examples 29 to 33
  • a solvent and a colorant were blended to obtain a composition.
  • the compounding amounts in the table represent parts by mass of each component.
  • the components other than C-3 and H-1 represent the same components as those used in Examples 1 to 20 and Comparative Examples 1 to 28 and the like.
  • H-1 Blue pigment dispersion (blue pigment dispersion prepared in the above-mentioned Preparation Example 2, solid content concentration 22.4 mass%, pigment concentration in solid content 62.5 mass%, solvent PGMEA)
  • Sensitivity evaluation line width sensitivity
  • compositions of Examples and Comparative Examples were spin-coated on a heat resistant glass substrate, prebaked at 90 ° C. for 120 seconds using a hot plate, and then cooled at 23 ° C. for 60 seconds.
  • post-baking was performed at 230 ° C. for 20 minutes using a clean oven to prepare an evaluation sample. The obtained sample was heated at 250 ° C.
  • the difference in transmittance (%) at a wavelength of 430 nm before and after the light resistance test of the sample for evaluation was measured.
  • the light resistance was evaluated based on the criteria, and the results are shown in Table 6 below.
  • Good The transmittance difference (%) is less than 2% with respect to the transmittance before the light resistance test.
  • X The difference in transmittance (%) is 2% or more with respect to the transmittance before the light resistance test.
  • cured material shows that it is excellent in light resistance in light resistance evaluation being "O".
  • the present invention has the effect of being able to produce a cured product having durability and capable of providing a composition that is easy to produce a cured product.

Abstract

Provided is a composition that contains a compound A represented by general formula (A1), (A2), or (A3) and a compound B represented by general formula (B). The R9 in general formulas (A1), (A2), and (A3) and the R11 in general formula (B) preferably are each an alkyl group having 1 to 20 carbon atoms wherein the methylene group at the end on the oxygen atom side is substituted by -CO-O-. (Refer to the description for the symbols in the formulas.)

Description

組成物、硬化物及び硬化物の製造方法Composition, cured product and method for producing cured product
 本発明は、組成物に関するものである。 The present invention relates to a composition.
 硬化性組成物の耐光性や耐熱性等の耐久性を向上させるために、紫外線吸収剤、酸化防止剤等を添加して安定化させる方法が知られている(特許文献1~3)。 In order to improve the durability such as light resistance and heat resistance of the curable composition, methods of stabilizing by adding an ultraviolet absorber, an antioxidant and the like are known (Patent Documents 1 to 3).
特開2011-048382号公報JP, 2011-048382, A US2016016919A1US2016016919A1 特開2015-108649号公報JP, 2015-108649, A
 しかしながら、上述の酸化防止剤を添加した場合でも十分な耐久性を有する硬化物を得ることができない場合がある。
 このような問題に対して、本発明者等は、フェノール系酸化防止剤がポリマーの劣化に大きく影響するラジカルをトラップする作用があること、このような作用を有するために、フェノール系酸化防止剤を重合系内に添加すると、一般に、いわゆる重合禁止剤として作用し、硬化阻害を生じる場合があることを見出した。
 このような問題に対して、重合系内では上述の作用が不活性化され、硬化後に活性化可能な潜在性酸化防止剤、潜在性紫外線吸収剤等の潜在性添加剤が知られている。
 しかしながら、潜在性添加剤を用いた場合でも、十分な耐久性を有する硬化物を得ることができない場合及び硬化物の製造が困難な場合がある。
However, even when the above-mentioned antioxidant is added, a cured product having sufficient durability may not be obtained.
With respect to such problems, the present inventors have found that the phenolic antioxidant has an action of trapping radicals which greatly affect the deterioration of the polymer, and in order to have such an action, the phenolic antioxidant It has been found that, when added into the polymerization system, it generally acts as a so-called polymerization inhibitor and may cause curing inhibition.
To address such problems, latent additives such as latent antioxidants and latent ultraviolet light absorbers are known which are inactivated in the polymerization system and which can be activated after curing.
However, even when a latent additive is used, there are cases where a cured product having sufficient durability can not be obtained, and it may be difficult to produce a cured product.
 本発明は、上記問題点に鑑みてなされたものであり、例えば、耐久性を有する硬化物を製造可能であり、かつ、硬化物の製造が容易な組成物を提供することを主目的とする。 The present invention has been made in view of the above problems, and for example, it is a main object of the present invention to provide a composition capable of producing a cured product having durability and facilitating the production of the cured product. .
 本発明者らは上記課題を解決するために鋭意検討を行った結果、フェノール性水酸基が保護基により保護され、保護基の脱離後に酸化防止能を示す化合物及び保護基の脱離後に紫外線吸収能を示す化合物の両者を併用することにより、優れた耐久性を有する硬化物を得られること、及び硬化物の製造が容易となることを見出し、本発明を完成させるに至った。 The inventors of the present invention conducted intensive studies to solve the above problems, and as a result, the phenolic hydroxyl group is protected by a protecting group, and after removal of the protecting group, the compound exhibiting an antioxidant ability after removal of the protecting group and UV absorption after removal of the protecting group. It has been found that by using both of the compounds exhibiting an ability together, it is possible to obtain a cured product having excellent durability and to facilitate the production of the cured product, and the present invention has been completed.
 すなわち、本発明は、下記一般式(A1)、(A2)又は(A3)で表される化合物Aと、下記一般式(B)で表される化合物Bと、を含む組成物を提供する。 That is, the present invention provides a composition comprising a compound A represented by the following general formula (A1), (A2) or (A3), and a compound B represented by the following general formula (B).
Figure JPOXMLDOC01-appb-C000005
Figure JPOXMLDOC01-appb-C000005

Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000006

Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000007
Figure JPOXMLDOC01-appb-C000008
Figure JPOXMLDOC01-appb-C000008
(式中、R、R、R’、R’、R”及びR”は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又は-O-Rを表し、
 R及びRの少なくとも一方は、上記-O-Rであり、
 R’及びR’の少なくとも一方は、上記-O-Rであり、
 R”及びR”の少なくとも一方は、上記-O-Rであり、
 R、R、R、R、R及びR並びにR14は、それぞれ独立に、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
 R及びR11は、それぞれ独立に、炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又はトリアルキルシリル基を表し、
 R12及びR13は、それぞれ独立に、水素原子又は炭素原子数1~40のアルキル基を表し、
 上記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基中のメチレン基は、炭素-炭素二重結合、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NR'-、>P=O、-S-S-、-SO-又はこれらの組み合わせで置き換わっている場合があり、
 前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基は置換基を有している場合があり、
 R’は、水素原子又は炭素原子数1~8のアルキル基を表し、
 複数のR同士、複数のR同士、複数のR同士、複数のR同士及び複数のR同士並びに複数のR14同士は、それぞれ結合してベンゼン環又はナフタレン環を形成している場合があり、
 複数のR、R、R、R、R及びR並びにR14は、それぞれ同じである場合も異なっている場合もあり、
m1及びm2は、それぞれ独立に、1~10の整数を表し、
m3は、1~3の整数を表し、
nは、1~10の整数を表し、
a1は、0~4の整数を表し、
a2は、0~2の整数を表し、
a3は、0~4の整数を表し、
a4は、0~3の整数を表し、
a5は、0~3の整数を表し、
a6は、0~3-m3の整数を表し、
b1は、0~2の整数を表し、
a1は、直接結合又はm1価の原子若しくは結合基を表し、Xa2は、直接結合又はm2価の原子若しくは結合基を表し、Xは、直接結合又はn価の原子若しくは結合基を表す。)
(Wherein, R 1, R 2, R 1 ', R 2', R 1 " and R 2" are each independently a hydrogen atom, a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, a carbon atom And an alkyl group of 1 to 40, an aryl group of 6 to 20 carbon atoms, an arylalkyl group of 7 to 20 carbon atoms, a heterocyclic group having 2 to 20 carbon atoms, or -O-R 9
At least one of R 1 and R 2 is -O-R 9 above;
At least one of R 1 ′ and R 2 ′ is —O—R 9 above,
At least one of R 1 ′ ′ and R ′ ′ 2 is —O—R 9 above,
R 3 , R 4 , R 5 , R 6 , R 7 and R 8 and R 14 are each independently a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, An aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, or a heterocycle-containing group having 2 to 20 carbon atoms,
R 9 and R 11 each independently represent an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an arylalkyl having 7 to 20 carbon atoms A group, a heterocycle-containing group having 2 to 20 carbon atoms or a trialkylsilyl group,
R 12 and R 13 each independently represent a hydrogen atom or an alkyl group having 1 to 40 carbon atoms,
The methylene group in the above alkyl group, aryl group, arylalkyl group, heterocyclic group and trialkylsilyl group is a carbon-carbon double bond, -O-, -S-, -CO-, -O-CO- , -CO-O-, -O-CO-O-, -O-CO-O-, -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S- When substituted by -CO-NH-, -NH-CO-, -NH-CO-O-, -NR'-,> P = O, -S-S-, -SO 2 -or a combination thereof There is
The alkyl group, the aryl group, the arylalkyl group, the heterocycle-containing group and the trialkylsilyl group may have a substituent,
R ′ represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms,
A plurality of R 3 's , a plurality of R 4' s , a plurality of R 5 's , a plurality of R 6' s and a plurality of R 7 's and a plurality of R 14 ' s are combined to form a benzene ring or a naphthalene ring May be
The plurality of R 3 , R 4 , R 5 , R 6 , R 7 and R 8 and R 14 may be identical to or different from each other,
m1 and m2 each independently represent an integer of 1 to 10,
m3 represents an integer of 1 to 3;
n represents an integer of 1 to 10,
a1 represents an integer of 0 to 4;
a2 represents an integer of 0 to 2;
a3 represents an integer of 0 to 4;
a4 represents an integer of 0 to 3;
a5 represents an integer of 0 to 3;
a6 represents an integer of 0 to 3-m3,
b1 represents an integer of 0 to 2;
X a1 represents a direct bond or an m1-valent atom or a bond group, X a2 represents a direct bond or an m-bivalent atom or a bond group, and X b represents a direct bond or an n-valent atom or a bond group . )
 本発明によれば、上記化合物A及び上記化合物Bは、それぞれ上記一般式で表される構造を有するため、フェノール性水酸基を保護しているR及びR11が脱離することで、それぞれ紫外線吸収能及び酸化防止能を示す。
 このような化合物A及び化合物Bを併用することで、組成物は、耐久性に優れた硬化物を得ることができる。
 また、上記化合物A及び上記化合物Bはそれぞれ、R及びR11によりフェノール性水酸基が保護されていることで、硬化阻害の発生を抑制できる。このため、上記組成物は、容易に硬化できる。
 このようなことから、上記組成物は、耐久性を有する硬化物を製造可能であり、かつ、硬化物の製造が容易なものとなる。
According to the present invention, since the compound A and the compound B each have a structure represented by the above general formula, ultraviolet light is released when R 9 and R 11 protecting the phenolic hydroxyl group are eliminated. It shows absorption capacity and antioxidant capacity.
By using such a compound A and the compound B in combination, the composition can obtain a cured product having excellent durability.
Further, each of the compound A and the compound B, by the phenolic hydroxyl group is protected by R 9 and R 11, can suppress the occurrence of curing inhibition. Therefore, the composition can be easily cured.
As such, the composition can produce a cured product having durability and can easily produce the cured product.
 本発明においては、上記R及びR11は、酸素原子側の末端のメチレン基が-CO-O-に置き換えられている炭素原子数1~20のアルキル基であることが好ましい。化合物A及び化合物Bは、R及びR11の脱離が容易なものとなるからである。 In the present invention, R 9 and R 11 are preferably an alkyl group having 1 to 20 carbon atoms in which the terminal methylene group at the oxygen atom side is replaced by —CO—O—. This is because compound A and compound B facilitate elimination of R 9 and R 11 .
 本発明においては、上記化合物Aの含有量が、上記化合物A及び上記化合物Bの合計100質量部に対して、1質量部以上99質量部以下であることが好ましい。上記含有量が上述の範囲であることで、上記組成物は、優れた耐久性を有するからである。 In the present invention, the content of the compound A is preferably 1 part by mass to 99 parts by mass with respect to a total of 100 parts by mass of the compound A and the compound B. It is because the said composition has the outstanding durability because the said content is the above-mentioned range.
 本発明においては、上記組成物は、重合性化合物を含むことが好ましい。上記組成物は、硬化物の製造が容易であるとの効果をより効果的に発揮できるからである。 In the present invention, the composition preferably contains a polymerizable compound. It is because the said composition can exhibit the effect that manufacture of hardened | cured material is easy more effectively.
 本発明は、上述の組成物の硬化物を提供する。 The present invention provides a cured product of the above composition.
 本発明によれば、上述の組成物を用いているため、上記硬化物は、製造が容易であり、また、耐久性に優れる。 According to the present invention, since the above-mentioned composition is used, the above-mentioned cured product is easy to manufacture and is excellent in durability.
 本発明は、上述の組成物の硬化物を形成する工程を有する硬化物の製造方法を提供する。 The present invention provides a method for producing a cured product, which comprises the step of forming a cured product of the composition described above.
 本発明によれば、上記製造方法は、上述の組成物を用い、かつ、上記工程を有することにより、例えば、硬化物の製造が容易となる。また、上記工程の後に、上記化合物Aに含まれる保護基R及び上記化合物Bに含まれる保護基R11を脱離する工程を実施することで、耐久性を有する硬化物を容易に得ることができる。 According to the present invention, for example, the production method of the cured product becomes easy by using the above-mentioned composition and having the above-mentioned steps. In addition, by carrying out the step of removing the protecting group R 9 contained in the compound A and the protecting group R 11 contained in the compound B after the above steps, a cured product having durability can be easily obtained. Can.
 本発明は、組成物、その硬化物及び硬化物の製造方法に関するものである。
 以下、本発明の組成物、硬化物及び硬化物の製造方法について詳細に説明する。
The present invention relates to a composition, a cured product thereof and a method for producing the cured product.
Hereinafter, the method for producing the composition, the cured product and the cured product of the present invention will be described in detail.
A.組成物
 まず、本発明の組成物について説明する。
 本発明の組成物は、下記一般式(A1)、(A2)又は(A3)で表される化合物Aと、下記一般式(B)で表される化合物Bと、を含むことを特徴とするものである。
A. Composition First, the composition of the present invention will be described.
The composition of the present invention is characterized by containing a compound A represented by the following general formula (A1), (A2) or (A3), and a compound B represented by the following general formula (B) It is a thing.
Figure JPOXMLDOC01-appb-C000009
Figure JPOXMLDOC01-appb-C000009

Figure JPOXMLDOC01-appb-C000010
Figure JPOXMLDOC01-appb-C000010

Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000011
Figure JPOXMLDOC01-appb-C000012
Figure JPOXMLDOC01-appb-C000012
(式中、R、R、R’、R’、R”及びR”は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又は-O-Rを表し、
 R及びRの少なくとも一方は、上記-O-Rであり、
 R’及びR’の少なくとも一方は、上記-O-Rであり、
 R”及びR”の少なくとも一方は、上記-O-Rであり、
 R、R、R、R、R及びR並びにR14は、それぞれ独立に、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
 R及びR11は、それぞれ独立に、炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又はトリアルキルシリル基を表し、
 R12及びR13は、それぞれ独立に、水素原子又は炭素原子数1~40のアルキル基を表し、
 上記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基中のメチレン基は、炭素-炭素二重結合、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NR'-、>P=O、-S-S-、-SO-又はこれらの組み合わせで置き換わっている場合があり、
 前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基は置換基を有している場合があり、
 R’は、水素原子又は炭素原子数1~8のアルキル基を表し、
 複数のR同士、複数のR同士、複数のR同士、複数のR同士及び複数のR同士並びに複数のR14同士は、それぞれ結合してベンゼン環又はナフタレン環を形成している場合があり、
 複数のR、R、R、R、R及びR並びにR14は、それぞれ同じである場合も異なっている場合もあり、
m1及びm2は、それぞれ独立に、1~10の整数を表し、
m3は、1~3の整数を表し、
nは、1~10の整数を表し、
a1は、0~4の整数を表し、
a2は、0~2の整数を表し、
a3は、0~4の整数を表し、
a4は、0~3の整数を表し、
a5は、0~3の整数を表し、
a6は、0~3-m3の整数を表し、
b1は、0~2の整数を表し、
a1は、直接結合又はm1価の原子若しくは結合基を表し、Xa2は、直接結合又はm2価の原子若しくは結合基を表し、Xは、直接結合又はn価の原子若しくは結合基を表す。)
(Wherein, R 1, R 2, R 1 ', R 2', R 1 " and R 2" are each independently a hydrogen atom, a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, a carbon atom And an alkyl group of 1 to 40, an aryl group of 6 to 20 carbon atoms, an arylalkyl group of 7 to 20 carbon atoms, a heterocyclic group having 2 to 20 carbon atoms, or -O-R 9
At least one of R 1 and R 2 is -O-R 9 above;
At least one of R 1 ′ and R 2 ′ is —O—R 9 above,
At least one of R 1 ′ ′ and R ′ ′ 2 is —O—R 9 above,
R 3 , R 4 , R 5 , R 6 , R 7 and R 8 and R 14 are each independently a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, An aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, or a heterocycle-containing group having 2 to 20 carbon atoms,
R 9 and R 11 each independently represent an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an arylalkyl having 7 to 20 carbon atoms A group, a heterocycle-containing group having 2 to 20 carbon atoms or a trialkylsilyl group,
R 12 and R 13 each independently represent a hydrogen atom or an alkyl group having 1 to 40 carbon atoms,
The methylene group in the above alkyl group, aryl group, arylalkyl group, heterocyclic group and trialkylsilyl group is a carbon-carbon double bond, -O-, -S-, -CO-, -O-CO- , -CO-O-, -O-CO-O-, -O-CO-O-, -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S- When substituted by -CO-NH-, -NH-CO-, -NH-CO-O-, -NR'-,> P = O, -S-S-, -SO 2 -or a combination thereof There is
The alkyl group, the aryl group, the arylalkyl group, the heterocycle-containing group and the trialkylsilyl group may have a substituent,
R ′ represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms,
A plurality of R 3 's , a plurality of R 4' s , a plurality of R 5 's , a plurality of R 6' s and a plurality of R 7 's and a plurality of R 14 ' s are combined to form a benzene ring or a naphthalene ring May be
The plurality of R 3 , R 4 , R 5 , R 6 , R 7 and R 8 and R 14 may be identical to or different from each other,
m1 and m2 each independently represent an integer of 1 to 10,
m3 represents an integer of 1 to 3;
n represents an integer of 1 to 10,
a1 represents an integer of 0 to 4;
a2 represents an integer of 0 to 2;
a3 represents an integer of 0 to 4;
a4 represents an integer of 0 to 3;
a5 represents an integer of 0 to 3;
a6 represents an integer of 0 to 3-m3,
b1 represents an integer of 0 to 2;
X a1 represents a direct bond or an m1-valent atom or a bond group, X a2 represents a direct bond or an m-bivalent atom or a bond group, and X b represents a direct bond or an n-valent atom or a bond group . )
 本発明によれば、上記化合物Aは、フェノール性水酸基を保護しているRが脱離することで、紫外線吸収能を示すことができる。
 また、上記化合物Bは、フェノール性水酸基を保護しているR11が脱離することで、酸化防止能を示すことができる。
 このため、例えば、上記組成物は、耐光性及び耐熱性の両者に優れた耐久性に優れた硬化物等を製造できる。
 ここで、化合物A及び化合物Bを併用することで、耐久性に優れた硬化物を得ることができる理由については、以下のように推察される。
According to the present invention, the compound A can exhibit an ultraviolet absorbing ability by the elimination of R 9 protecting the phenolic hydroxyl group.
Further, the compounds B, by R 11 protecting the phenolic hydroxyl group is eliminated, it is possible to indicate the antioxidant ability.
For this reason, for example, the said composition can manufacture the hardened | cured material etc. excellent in durability excellent in both light resistance and heat resistance.
Here, the reason why a cured product having excellent durability can be obtained by using Compound A and Compound B in combination is presumed as follows.
 すなわち、化合物Aは、Rによりフェノール性水酸基が保護されていない状態と比較して、光硬化のために照射された光の吸収が少ない。
 また、化合物Bは、R11によりフェノール性水酸基が保護されていない状態と比較して、ラジカルの捕捉作用が低い。
 このようなことから、化合物A及び化合物Bは、それぞれR及びR11によりフェノール性水酸基が保護されていることで、例えば、光硬化性組成物等の硬化阻害の発生を抑制できる。
 しかしながら、化合物A又は化合物Bの一方を用いて、例えば、従来公知の酸化防止剤、紫外線吸収剤等と組み合わせた場合には、上述のような硬化阻害抑制の機能を十分に発揮できない場合がある。
 例えば、フェノール系酸化防止剤を化合物Aと組み合わせた場合だと、フェノール系酸化防止剤によるラジカルをトラップする作用により、硬化阻害が生じる。その結果、硬化が不十分となることによる耐久性の低下と共に、フェノール系酸化防止剤、R脱離後の化合物A等がブリードアウトし易くなることにより生じる耐久性の低下が生じる。
 一方、紫外線吸収剤を化合物Bと組み合わせた場合だと、紫外線吸収剤による光吸収作用により、硬化のために照射される光も吸収し、硬化阻害が生じる。その結果、硬化が不十分となることによる耐久性の低下と共に、紫外線吸収剤、R11脱離後の化合物B等がブリードアウトし易くなることにより生じる耐久性の低下が生じる。
 このようなことから、例えば、化合物A及び化合物Bを、単独で用い、従来公知の酸化防止剤等と組み合わせた場合には、耐久性に優れた硬化物を得られない場合がある。
 これに対して、本発明においては、化合物A及び化合物Bを併用するため、上述のような、硬化阻害の発生を抑制でき、十分に硬化することが容易となり、ブリードアウトが抑制されるため、得られた硬化物は優れた耐久性を発揮できる。
That is, the compound A absorbs less light irradiated for photocuring, as compared to a state in which the phenolic hydroxyl group is not protected by R 9 .
Moreover, Compound B, as compared to the state of the phenolic hydroxyl group by R 11 is not protected, a lower scavenging radicals.
For this reason, Compound A and Compound B, by phenolic hydroxyl groups with R 9 and R 11 each is protected, for example, the occurrence of curing inhibition of such photocurable composition can be suppressed.
However, when one of the compound A or the compound B is used in combination with, for example, a conventionally known antioxidant, ultraviolet absorber, etc., the above-mentioned function of inhibiting the inhibition of curing may not be sufficiently exhibited. .
For example, when the phenolic antioxidant is combined with the compound A, the curing inhibition occurs due to the action of trapping the radical by the phenolic antioxidant. As a result, the durability is lowered due to insufficient curing, and the compound A and the like after desorption of the phenolic antioxidant and R 9 easily bleed out.
On the other hand, when the ultraviolet light absorber is combined with the compound B, the light absorption by the ultraviolet light absorber also absorbs the light irradiated for the curing, and the curing inhibition occurs. As a result, along with the decrease in durability due to insufficient curing, the decrease in durability caused by the UV absorber, the compound B and the like after release of R 11 easily bleed out occurs.
From such a thing, when the compound A and the compound B are used independently and combined with a conventionally well-known antioxidant etc., for example, the hardened | cured material excellent in durability may not be obtained.
On the other hand, in the present invention, since the compound A and the compound B are used in combination, it is possible to suppress the occurrence of curing inhibition as described above, and it becomes easy to sufficiently cure and bleed out is suppressed. The obtained cured product can exhibit excellent durability.
 また、フェノール性水酸基を有する酸化防止剤及び紫外線吸収剤は、フェノール性水酸基の影響により、組成物中で凝集しやすく、組成物に対する添加量の増量が困難であるとともに、凝集することでその機能を十分に発揮できない。
 これに対して、化合物A及び化合物Bは、フェノール性水酸基がそれぞれR及びR11により保護された構造を有することで、組成物中での分散安定性に優れる。
 その結果、化合物A及び化合物Bは、従来のフェノール性水酸基を有する酸化防止剤及び紫外線吸収剤と比較して、組成物に対する添加量の増量が容易であるとともに、硬化物内で分散容易であることで、その機能を十分に発揮できる。
 このような点からも、化合物A及び化合物Bを併用して、酸化防止能及び紫外線吸収能を付与することで、耐久性に優れた硬化物を得ることができるのである。
Further, the antioxidant and the ultraviolet light absorber having a phenolic hydroxyl group are easily aggregated in the composition under the influence of the phenolic hydroxyl group, and it is difficult to increase the addition amount to the composition, and the aggregation functions as well. Can not demonstrate enough.
On the other hand, the compound A and the compound B have excellent dispersion stability in the composition by having a structure in which the phenolic hydroxyl group is protected by R 9 and R 11 respectively.
As a result, Compound A and Compound B are easy to disperse in the cured product, as well as easy to increase the amount added to the composition, as compared with the conventional antioxidant and UV absorber having phenolic hydroxyl group. Can fully demonstrate its function.
From this point of view as well, a compound A and a compound B can be used in combination to provide the antioxidant ability and the ultraviolet ray absorbing ability, whereby a cured product having excellent durability can be obtained.
 さらに、上述のように、化合物A及び化合物Bは、R及びR11によりフェノール性水酸基が保護されていることで、例えば、光硬化性組成物等の硬化阻害の発生を抑制できる。
 このようなことから、上記組成物により、硬化物の製造が容易なものとなる。
Furthermore, as described above, the compound A and the compound B can suppress generation of curing inhibition of, for example, a photocurable composition and the like because the phenolic hydroxyl group is protected by R 9 and R 11 .
From such a thing, manufacture of hardened | cured material becomes easy by the said composition.
 また、フェノール系紫外線吸収剤を化合物Bと組み合わせた場合では、組成物の厚み方向に沿って光の透過量が大きく低下することで、例えば、硬化物及び基材の間の密着力が低下し、硬化物が基材から剥離しやすくなるといった不具合も生じる。
 しかしながら、本発明においては、化合物A及び化合物Bを併用するため、上述のような、硬化時に照射される光の吸収を抑制できる結果、基材との剥離が抑制された硬化物を得ることができる。
In addition, when the phenolic ultraviolet absorber is combined with the compound B, the amount of light transmission is greatly reduced along the thickness direction of the composition, for example, the adhesion between the cured product and the substrate is reduced. There is also a problem that the cured product is likely to be peeled off from the substrate.
However, in the present invention, since Compound A and Compound B are used in combination, as described above, absorption of light irradiated during curing can be suppressed, and as a result, it is possible to obtain a cured product in which peeling from the substrate is suppressed. it can.
 さらに、上記組成物は、例えば、樹脂成分として、感光性樹脂等の光照射によりアルカリ現像液に対する溶解性が変化する成分を含む場合に、例えば、感光性発現のために照射される光の吸収能が低く、感光性を安定的に発現可能となる。
 このようなことから、上記組成物は、例えば、感光性、耐久性等に優れた感光性組成物とすることができる。
Furthermore, for example, when the composition contains, as a resin component, a component whose solubility in an alkali developer changes due to light irradiation, such as a photosensitive resin, for example, absorption of light irradiated for photosensitive expression Performance is low and light sensitivity can be stably expressed.
From such a thing, the said composition can be made into the photosensitive composition excellent in photosensitivity, durability, etc., for example.
 本発明の組成物は、化合物A及び化合物Bを有するものである。
 以下、本発明の組成物の各成分について詳細に説明する。
The composition of the present invention comprises compound A and compound B.
Hereinafter, each component of the composition of the present invention will be described in detail.
1.化合物A及び化合物Bの含有量
 上記化合物Aの含有量としては、組成物が、所望の耐久性を有する硬化物を製造可能なものであればよく、例えば、上記組成物の固形分100質量部に対して、0.001質量部以上20質量部以下とすることができ、なかでも、0.005質量部以上10質量部以下であることが好ましく、特に、0.1質量部以上8質量部以下であることが好ましく、なかでも特に、1質量部以上6質量部以下であることが好ましい。化合物Aをこのような量で含有する上記組成物は、耐久性を有する硬化物を製造容易であり、かつ、硬化物の製造が一層容易となるからである。また、上述の含有量であることで、組成物中に安定に分散容易だからである。
 また紫外線吸収剤は通常、用いられる部材の膜厚が薄いほど、その含有量の増加が求められる場合がある。したがって、上記組成物の硬化物を薄膜部材に用いた場合でも、十分な紫外線吸収能を発揮できるものとするとの観点からは、上記化合物Aの含有量の下限は、上記組成物の固形分100質量部に対して、例えば、2質量部以上であることが好ましく、なかでも、3質量部以上であることが好ましく、5質量部以上であることが好ましい。上記下限であることで、例えば、薄膜部材である場合でも十分な紫外線吸収能を容易に付与できるからである。
 なお、固形分とは、溶剤以外のすべての成分を含むものである。
 また、本稿において、特に断りがない場合には、含有量は質量基準である。
 上記化合物Aの含有量としては、溶剤等の含有量によって異なるものであるが、例えば、上記組成物100質量部中に、0.001質量部以上20質量部以下とすることができる。上述の含有量であることで、組成物中に安定に分散容易だからである。
1. Content of Compound A and Compound B The content of the compound A may be any one as long as the composition can produce a cured product having desired durability. For example, 100 parts by mass of the solid content of the composition The amount can be 0.001 parts by mass or more and 20 parts by mass or less, and is preferably 0.005 parts by mass or more and 10 parts by mass or less, and particularly preferably 0.1 parts by mass or more and 8 parts by mass It is preferable that it is the following, Especially, it is preferable that it is 1 to 6 mass parts especially. It is because the said composition which contains the compound A in such an amount is easy to manufacture the hardened | cured material which has durability, and manufacture of hardened | cured material becomes still easier. Moreover, it is because it is easy to disperse | distribute stably in a composition as it is the above-mentioned content.
In addition, in general, as the film thickness of the member to be used is thinner, the content of the ultraviolet absorber may be required to be increased. Therefore, even when the cured product of the above composition is used for a thin film member, the lower limit of the content of the above compound A is 100% of the solid content of the above composition from the viewpoint of exhibiting sufficient ultraviolet light absorbability. For example, the amount is preferably 2 parts by mass or more, more preferably 3 parts by mass or more, and preferably 5 parts by mass or more. By being the said minimum, it is because sufficient ultraviolet-ray absorptivity can be easily provided, even when it is a thin film member, for example.
In addition, solid content is what contains all the components other than a solvent.
Further, in the present description, the content is on a mass basis unless otherwise noted.
The content of the compound A varies depending on the content of the solvent and the like, and can be, for example, 0.001 parts by mass or more and 20 parts by mass or less in 100 parts by mass of the composition. It is because it is easy to disperse | distribute stably in a composition by being said content.
 上記化合物Aの含有量は、組成物が、所望の耐久性を有する硬化物を製造可能なものであればよく、例えば、上記化合物A及び上記化合物Bの合計100質量部に対して、1質量部以上99質量部以下とすることができ、なかでも、15質量部以上85質量部以下であることが好ましく、特に、20質量部以上80質量部以下であることが好ましい。化合物Aをこのような量で含有する上記組成物は、耐久性を有する硬化物を製造容易であり、かつ、硬化物の製造が一層容易となるからである。 The content of the compound A may be any as long as the composition can produce a cured product having desired durability, and, for example, 1 part by mass with respect to a total of 100 parts by mass of the compound A and the compound B The amount can be set to 99 parts by mass or less, preferably 15 parts by mass to 85 parts by mass, and particularly preferably 20 parts by mass to 80 parts by mass. It is because the said composition which contains the compound A in such an amount is easy to manufacture the hardened | cured material which has durability, and manufacture of hardened | cured material becomes still easier.
 上記化合物Bの含有量としては、組成物が、所望の耐久性を有する硬化物を製造可能なものであればよく、例えば、上記組成物の固形分100質量部に対する含有量として、0.001質量部以上20質量部以下とすることができ、なかでも、0.005質量部以上10質量部以下であることが好ましく、特に、0.1質量部以上8質量部以下であることが好ましく、なかでも特に、1質量部以上6質量部以下であることが好ましい。化合物Bをこのような量で含有する上記組成物は、耐久性を有する硬化物を製造容易であり、かつ、硬化物の製造が一層容易となるからである。
 上記化合物Bの含有量としては、溶剤等の含有量によって異なるものであるが、例えば、上記組成物100質量部中に、0.001質量部以上20質量部以下とすることができる。上述の含有量であることで、組成物中に安定に分散容易だからである。また、化合物Bをこのような量で含有する上記組成物は、耐久性を有する硬化物を製造容易であり、かつ、硬化物の製造が一層容易となるからである。
As content of the said compound B, a composition should just be what can manufacture the hardened | cured material which has desired durability, for example, 0.001 as a content with respect to solid content of 100 mass parts of the said composition The content can be in the range of not less than 20 parts by mass, preferably not less than 0.005 parts by mass and not more than 10 parts by mass, and particularly preferably 0.1 parts by mass to 8 parts by mass, Especially, it is preferable that it is 1 to 6 parts by mass. The composition containing the compound B in such an amount is easy to manufacture a cured product having durability, and it is easier to produce a cured product.
The content of the compound B varies depending on the content of the solvent and the like, and can be, for example, 0.001 parts by mass or more and 20 parts by mass or less in 100 parts by mass of the composition. It is because it is easy to disperse | distribute stably in a composition by being said content. Moreover, it is because the said composition which contains the compound B in such an amount is easy to manufacture the hardened | cured material which has durability, and manufacture of hardened | cured material becomes still easier.
 上記化合物A及び上記化合物Bの合計の含有量は、組成物が、所望の耐久性を有する硬化物を製造可能なものであればよく、例えば、組成物の固形分100質量部に対して、0.01質量部以上20質量部以下とすることができ、なかでも、0.05量部以上15質量部以下であることが好ましく、特に、0.1質量部以上10質量部以下であることが好ましく、なかでも特に、1質量部以上8質量部以下であることが好ましい。化合物A及び化合物Bをこのような量で含有する上記組成物は、耐久性を有する硬化物を製造容易であり、かつ、硬化物の製造が一層容易となるからである。
 また、上記組成物の硬化物を薄膜部材に用いた場合でも、十分な紫外線吸収能を発揮できるものとするとの観点からは、上記化合物A及び化合物Bの含有量の下限は、組成物の固形分100質量部に対して、2質量部以上であることが好ましく、なかでも3質量部以上であることが好ましく、特に、4質量部以上であることが好ましい。上記下限であることで、例えば、薄膜部材である場合にも十分な紫外線吸収能を容易に付与できるからである。
 上記化合物A及び上記化合物Bの合計の含有量は、溶剤等の含有量によって異なるものであるが、例えば、組成物100質量部中に、0.001質量部以上20質量部以下とすることができる。上述の含有量であることで、組成物中に安定に分散容易だからである。化合物A及び化合物Bをこのような量で含有する上記組成物は、耐久性を有する硬化物を製造容易であり、かつ、硬化物の製造が一層容易となるからである。
The total content of the compound A and the compound B may be any as long as the composition can produce a cured product having a desired durability, for example, with respect to 100 parts by mass of the solid content of the composition, It can be 0.01 parts by weight or more and 20 parts by weight or less, and more preferably 0.05 parts by weight or more and 15 parts by weight or less, and particularly preferably 0.1 parts by weight or more and 10 parts by weight or less Are particularly preferable, and in particular, 1 part by mass or more and 8 parts by mass or less are preferable. It is because the said composition containing the compound A and the compound B in such an amount is easy to manufacture the hardened | cured material which has durability, and manufacture of hardened | cured material becomes still easier.
In addition, even when the cured product of the above composition is used for a thin film member, the lower limit of the content of the above compound A and compound B is the solid content of the composition from the viewpoint of exhibiting sufficient ultraviolet absorbing ability. The amount is preferably 2 parts by mass or more, more preferably 3 parts by mass or more, and particularly preferably 4 parts by mass or more with respect to 100 parts by mass of each component. By being the said minimum, it is because sufficient ultraviolet-ray absorptivity can be easily provided, for example, also when it is a thin film member.
Although the total content of the compound A and the compound B varies depending on the content of the solvent and the like, for example, it may be 0.001 parts by mass or more and 20 parts by mass or less in 100 parts by mass of the composition. it can. It is because it is easy to disperse | distribute stably in a composition by being said content. It is because the said composition containing the compound A and the compound B in such an amount is easy to manufacture the hardened | cured material which has durability, and manufacture of hardened | cured material becomes still easier.
2.化合物A
 上記化合物Aは、上述した一般式(A1)、(A2)又は(A3)で表されるものである。
 また、上記化合物Aは、フェノール性水酸基が保護基Rにより保護された構造を有し、上記保護基Rの脱離後に、紫外線吸収能を有するものとすることができる。
 紫外線吸収能を有するとは、例えば、波長250nm以上450nm以下の範囲の光を吸収できるものとすることができる。
 紫外線吸収能を有するとは、より具体的には、波長250nm以上600nm以内の範囲で、最大吸収波長が、250nm以上400nm以下であるものとすることができ、なかでも、260nm以上390nm以下であるものが好ましく、特に、280nm以上380nm以下であるものが好ましい。上記組成物は、耐久性を有する硬化物を製造容易となるからである。
 なお、以下、最大吸収波長の測定方法としては、例えば、溶媒、例えばクロロホルム中に0.01g/Lの濃度となるように溶解したものを用いることができる。
 また、最大吸収波長は、例えば、評価用サンプルを、石英セル(光路長10mm、厚み1.25mm)に充填し、吸光光度計(例えば、U-3900(日立ハイテクサイエンス社製)を用いて吸光度を測定することで得ることができる。
2. Compound A
The compound A is represented by the above-mentioned general formula (A1), (A2) or (A3).
The compound A may have a structure in which a phenolic hydroxyl group is protected by a protecting group R 9 and may have an ultraviolet absorbing ability after the removal of the protecting group R 9 .
Having ultraviolet absorptivity can be, for example, capable of absorbing light in a wavelength range of 250 nm to 450 nm.
More specifically, having ultraviolet absorbing ability can be such that the maximum absorption wavelength is 250 nm or more and 400 nm or less in a wavelength range of 250 nm or more and 600 nm or less, and in particular, is 260 nm or more and 390 nm or less Are preferable, and in particular, those which are 280 nm or more and 380 nm or less are preferable. It is because the said composition becomes easy to manufacture the hardened | cured material which has durability.
In addition, as a measuring method of the maximum absorption wavelength below, what was melt | dissolved so that it may become a density | concentration of 0.01 g / L in a solvent, for example, chloroform, can be used, for example.
For the maximum absorption wavelength, for example, a sample for evaluation is filled in a quartz cell (optical path length 10 mm, thickness 1.25 mm), and the absorbance is measured using an absorptiometer (for example, U-3900 (manufactured by Hitachi High-Tech Science) Can be obtained by measuring
 上記化合物Aは、上記保護基Rの脱離後と比較して、波長250nm以上600nm以下の範囲で、最大吸収波長が、短波長側であるものとすることができる。
 上記化合物Aの、上記保護基Rの脱離後との最大吸収波長の差は、1nm以上とすることができ、なかでも1nm以上100nm以下であることが好ましく、特に、1nm以上50nm以下であることが好ましい。最大吸収波長の差が上記範囲であることで、上記化合物Aは、硬化阻害抑制効果に優れたものとなるからである。
The compound A can have a maximum absorption wavelength on the short wavelength side in a wavelength range of 250 nm to 600 nm as compared with that after removal of the protective group R 9 .
The difference of the maximum absorption wavelength of the compound A from that after removal of the protecting group R 9 can be 1 nm or more, preferably 1 nm to 100 nm, and particularly preferably 1 nm to 50 nm. Is preferred. It is because the said compound A becomes a thing excellent in the hardening inhibitory inhibitory effect because the difference of the largest absorption wavelength is the said range.
 上記化合物Aは、加熱により保護基Rが脱離するものとすることができる。
 上記化合物Aに含まれる保護基Rが脱離する温度としては、例えば、100℃以上300℃以下とすることができ、なかでも、120℃以上250℃以下であることが好ましく、150℃以上230℃以下であることが好ましい。上記脱離温度であることで、上記組成物は、耐久性を有する硬化物の製造が容易となるからである。
 脱離温度は、STA(示差熱熱重量同時測定装置)を用いて測定し、第1重量減少の開始温度とすることができる。
 第1重量減少の開始温度の測定条件は、例えば、測定容器に化合物A10mgを充填して、測定温度範囲:30℃~350℃、昇温速度:10℃/minとすることができる。
 示差熱熱重量同時測定装置としては、STA7000((株)日立ハイテクサイエンス製)を用いることができる。
The compound A can be such that the protecting group R 9 is released by heating.
The temperature at which the protective group R 9 contained in the compound A is eliminated may be, for example, 100 ° C. or more and 300 ° C. or less, and in particular, preferably 120 ° C. or more and 250 ° C. or less, 150 ° C. or more It is preferable that it is 230 degrees C or less. It is because the said composition becomes easy to manufacture of the hardened | cured material which has durability because it is the said detachment temperature.
The desorption temperature can be measured using STA (differential thermal thermal simultaneous measurement device), and can be the start temperature of the first weight loss.
The measurement conditions of the start temperature of the first weight loss can be, for example, 10 mg of the compound A in a measurement container to set a measurement temperature range: 30 ° C. to 350 ° C., and a temperature rising rate: 10 ° C./min.
As a differential thermal thermal simultaneous measurement device, STA7000 (manufactured by Hitachi High-Tech Science Co., Ltd.) can be used.
 上記化合物Aは、なかでも、上記一般式(A1)又は(A3)で表されるものであることが好ましい。そのような上記組成物は、耐久性を有する硬化物を製造容易だからである。 Above all, the compound A is preferably a compound represented by the above general formula (A1) or (A3). Such a composition is because it is easy to produce a cured product having durability.
 上記R、R、R’、R’、R”、R” 、R、R、R、R、R及びR並びにR(以下、これらをまとめてR等と称する場合がある。)に用いられる炭素原子数1~40のアルキル基としては、メチル、エチル、プロピル、iso-プロピル、ブチル、sec-ブチル、tert-ブチル、iso-ブチル、アミル、iso-アミル、tert-アミル、シクロペンチル、ヘキシル、2-ヘキシル、3-ヘキシル、シクロヘキシル、4-メチルシクロヘキシル、ヘプチル、2-ヘプチル、3-ヘプチル、iso-ヘプチル、tert-ヘプチル、1-オクチル、iso-オクチル、tert-オクチル、アダマンチル等を挙げることができる。
 なお、Rに用いられる炭素原子数1~20のアルキル基としては、上記R等に用いられる炭素原子数1~40のアルキル基のうち、所定の炭素原子数を満たすものを挙げることができる。
 上記R等に用いられる炭素原子数6~20のアリール基としては、例えば、フェニル、ナフチル、アントラセニル等を挙げることができる。
 上記R等に用いられる炭素原子数7~20のアリールアルキル基としては、例えば、ベンジル、フルオレニル、インデニル、9-フルオレニルメチル基等を挙げることができる。
 上記R等に用いられる炭素原子数2~20の複素環含有基としては、例えば、ピリジル、ピリミジル、ピリダジル、ピペリジル、ピラニル、ピラゾリル、トリアジル、ピロリル、キノリル、イソキノリル、イミダゾリル、ベンゾイミダゾリル、トリアゾリル、フリル、フラニル、ベンゾフラニル、チエニル、チオフェニル、ベンゾチオフェニル、チアジアゾリル、チアゾリル、ベンゾチアゾリル、オキサゾリル、ベンゾオキサゾリル、イソチアゾリル、イソオキサゾリル、インドリル、2-ピロリジノン-1-イル、2-ピペリドン-1-イル、2,4-ジオキシイミダゾリジン-3-イル、2,4-ジオキシオキサゾリジン-3-イル等を挙げることができる。
 Rに用いられる炭素原子数2~20のアルケニル基としては、ビニル、アリル、1-プロペニル、イソプロペニル、2-ブテニル、1,3-ブタジエニル、2-ペンテニル、2-オクテニル等が挙げられる。
 Rに用いられるトリアルキルシリル基としては、トリメチルシラン、トリエチルシラン、エチルジメチルシラン等が挙げられる。
 上記R’に用いられる炭素原子数1~8のアルキル基としては、R等に用いられるアルキル基として例示したものうち、所定の炭素原子数を満たすものを挙げることができる。
 なお、上記アルキル基、アリール基、アリールアルキル基、複素環含有基、アルケニル基及びトリアルキルシリル基等の各基は、置換基を有している場合があるものであり、特に断りがない限り、置換基を有していないか又は置換基を有しているものである。
 このようなアルキル基、アリール基、アリールアルキル基、複素環含有基、アルケニル基及びトリアルキルシリル基等の水素原子を置換する置換基としては、例えば、ビニル、アリル、アクリル、メタクリル等のエチレン性不飽和基;フッ素、塩素、臭素、ヨウ素等のハロゲン原子;アセチル、2-クロロアセチル、プロピオニル、オクタノイル、アクリロイル、メタクリロイル、フェニルカルボニル(ベンゾイル)、フタロイル、4-トリフルオロメチルベンゾイル、ピバロイル、サリチロイル、オキザロイル、ステアロイル、メトキシカルボニル、エトキシカルボニル、t-ブトキシカルボニル、n-オクタデシルオキシカルボニル、カルバモイル等のアシル基;アセチルオキシ、ベンゾイルオキシ等のアシルオキシ基;アミノ、エチルアミノ、ジメチルアミノ、ジエチルアミノ、ブチルアミノ、シクロペンチルアミノ、2-エチルヘキシルアミノ、ドデシルアミノ、アニリノ、クロロフェニルアミノ、トルイジノ、アニシジノ、N-メチル-アニリノ、ジフェニルアミノ,ナフチルアミノ、2-ピリジルアミノ、メトキシカルボニルアミノ、フェノキシカルボニルアミノ、アセチルアミノ、ベンゾイルアミノ、ホルミルアミノ、ピバロイルアミノ、ラウロイルアミノ、カルバモイルアミノ、N,N-ジメチルアミノカルボニルアミノ、N,N-ジエチルアミノカルボニルアミノ、モルホリノカルボニルアミノ、メトキシカルボニルアミノ、エトキシカルボニルアミノ、t-ブトキシカルボニルアミノ、n-オクタデシルオキシカルボニルアミノ、N-メチル-メトキシカルボニルアミノ、フェノキシカルボニルアミノ、スルファモイルアミノ、N,N-ジメチルアミノスルホニルアミノ、メチルスルホニルアミノ、ブチルスルホニルアミノ、フェニルスルホニルアミノ等の置換アミノ基;スルホンアミド基、スルホニル基、カルボキシル基、シアノ基、スルホ基、水酸基、ニトロ基、メルカプト基、イミド基、カルバモイル基、スルホンアミド基、ホスホン酸基、リン酸基又はカルボキシル基、スルホ基、ホスホン酸基、リン酸基の塩等を挙げることができる。
Said R 1, R 2, R 1 ', R 2', R 1 ", R 2", R 3, R 4, R 5, R 6, R 7 and R 8 and R 9 (hereinafter, these are collectively The alkyl group having 1 to 40 carbon atoms which is used for R 1 etc. may be methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl , Iso-amyl, tert-amyl, cyclopentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, 1-octyl, Iso-octyl, tert-octyl, adamantyl and the like can be mentioned.
Examples of the alkyl group having 1 to 20 carbon atoms used for R 9 include those having a predetermined number of carbon atoms among the alkyl groups having 1 to 40 carbon atoms used for the above R 1 and the like. it can.
Examples of the aryl group having 6 to 20 carbon atoms used for the above R 1 and the like include phenyl, naphthyl, anthracenyl and the like.
Examples of the arylalkyl group having 7 to 20 carbon atoms used for the above R 1 and the like include benzyl, fluorenyl, indenyl, 9-fluorenylmethyl and the like.
Examples of the heterocycle-containing group having 2 to 20 carbon atoms used for R 1 and the like described above include, for example, pyridyl, pyrimidyl, pyridazyl, piperidyl, pyranyl, pyrazolyl, triazyl, pyrrolyl, quinolyl, isoquinolyl, imidazolyl, benzimidazolyl, triazolyl, furyl 2, furanyl, benzofuranyl, thienyl, thiophenyl, benzothiophenyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, isoxazolyl, indolyl, 2-pyrrolidinone-1-yl, 2-piperidone-1-yl, 2, 4-dioxyimidazolidin-3-yl, 2,4-dioxazolidin-3-yl and the like can be mentioned.
Examples of the alkenyl group having 2 to 20 carbon atoms used for R 9 include vinyl, allyl, 1-propenyl, isopropenyl, 2-butenyl, 1,3-butadienyl, 2-pentenyl, 2-octenyl and the like.
Examples of trialkylsilyl groups used for R 9 include trimethylsilane, triethylsilane, ethyldimethylsilane and the like.
Examples of the alkyl group having 1 to 8 carbon atoms used for R ′ include those exemplified as the alkyl group used for R 1 and the like, which can satisfy the predetermined number of carbon atoms.
In addition, each group such as the above-mentioned alkyl group, aryl group, arylalkyl group, heterocycle-containing group, alkenyl group and trialkylsilyl group may have a substituent, and in particular, unless otherwise specified. Or have no substituent or have a substituent.
As a substituent which substitutes hydrogen atoms, such as such an alkyl group, an aryl group, an arylalkyl group, a heterocyclic containing group, an alkenyl group, and a trialkylsilyl group, ethylenic properties, such as vinyl, an allyl, an acryl, methacryl, are mentioned, for example Unsaturated groups; halogen atoms such as fluorine, chlorine, bromine and iodine; acetyl, 2-chloroacetyl, propionyl, octanoyl, acryloyl, methacryloyl, phenylcarbonyl (benzoyl), phthaloyl, 4-trifluoromethylbenzoyl, pivaloyl, salicyloyl, Acyl groups such as oxaloyl, stearoyl, methoxycarbonyl, ethoxycarbonyl, t-butoxycarbonyl, n-octadecyloxycarbonyl, carbamoyl; acyloxy groups such as acetyloxy and benzoyloxy; amino, ethyl Mino, dimethylamino, diethylamino, butylamino, cyclopentylamino, 2-ethylhexylamino, dodecylamino, anilino, chlorophenylamino, toluidino, anisidino, N-methyl-anilino, diphenylamino, naphthylamino, 2-pyridylamino, methoxycarbonylamino, Phenoxycarbonylamino, acetylamino, benzoylamino, formylamino, pivaloylamino, lauroylamino, carbamoylamino, N, N-dimethylaminocarbonylamino, N, N-diethylaminocarbonylamino, morpholinocarbonylamino, methoxycarbonylamino, ethoxycarbonylamino, t-butoxycarbonylamino, n-octadecyloxycarbonylamino, N-methyl-methoxycarbo Substituted amino groups such as lamino, phenoxycarbonylamino, sulfamoylamino, N, N-dimethylaminosulfonylamino, methylsulfonylamino, butylsulfonylamino, phenylsulfonylamino, etc .; sulfonamide group, sulfonyl group, carboxyl group, cyano group, A sulfo group, a hydroxyl group, a nitro group, a mercapto group, an imide group, a carbamoyl group, a sulfonamide group, a phosphonic acid group, a phosphoric acid group or a carboxyl group, a sulfo group, a phosphonic acid group, a salt of a phosphoric acid group etc. can be mentioned. .
 本発明において、基の炭素原子数は、基中の水素原子が置換基で置換されている場合、その置換後の基の炭素原子数を規定する。例えば、上記炭素原子数1~40のアルキル基の水素原子が置換されている場合、炭素原子数1~40とは、水素原子が置換された後の炭素原子数を指し、水素原子が置換される前の炭素原子数を指すのではない。 In the present invention, when the hydrogen atom in the group is substituted by a substituent, the number of carbon atoms of the group defines the number of carbon atoms of the group after the substitution. For example, when the hydrogen atom of the alkyl group having 1 to 40 carbon atoms is substituted, the term "C1 to 40 carbon atoms" refers to the number of carbon atoms after the hydrogen atom has been substituted, and the hydrogen atom is substituted Does not refer to the number of carbon atoms before the
 R、R、R’、R’、R”及びR”で表されるアルキル基、アリール基、アリールアルキル基、複素環含有基、R、R、R、R、R及びRで表されるアルキル基、アリール基、アリールアルキル基及び複素環含有基、並びに、Rで表されるアルキル基、アルケニル基、アリール基、アリールアルキル基、複素環含有基、トリアルキルシリル基の各基におけるメチレン基は、炭素-炭素二重結合、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NR'-、>P=O、-S-S-、-SO-又はこれらの組み合わせで置き換わっている場合がある。但し、置き換わり後の各基の炭素原子数は1以上である。
 例えば、上記アルキル基の端部のメチレン基が-O-で置き換えられたアルコキシ基としては、メチルオキシ、エチルオキシ、iso-プロピルオキシ、ブチルオキシ、sec-ブチルオキシ、tert-ブチルオキシ、iso-ブチルオキシ、アミルオキシ、iso-アミルオキシ、tert-アミルオキシ、ヘキシルオキシ、2-ヘキシルオキシ、3-ヘキシルオキシ、シクロヘキシルオキシ、4-メチルシクロヘキシルオキシ、ヘプチルオキシ、2-ヘプチルオキシ、3-ヘプチルオキシ、iso-ヘプチルオキシ、tert-ヘプチルオキシ、1-オクチルオキシ、iso-オクチルオキシ、tert-オクチルオキシ等が挙げられる。
R 1, R 2, R 1 ', R 2', alkyl group represented by R 1 "and R 2", aryl group, arylalkyl group, heterocyclic ring-containing group, R 3, R 4, R 5, R 6 , alkyl groups represented by R 7 and R 8 , aryl groups, arylalkyl groups and heterocycle-containing groups, and alkyl groups represented by R 9 , alkenyl groups, aryl groups, arylalkyl groups, heterocycle-containing groups Group in each of the groups and trialkylsilyl groups is a carbon-carbon double bond, -O-, -S-, -CO-, -O-CO-, -CO-O-, -O-CO- O-, -O-CO-O-, -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S-, -CO-NH-, -NH-CO- , -NH-CO-O-, -NR'-,> P = O, -S-S-, -SO 2 -or a combination thereof It may have been replaced. However, the number of carbon atoms of each group after replacement is 1 or more.
For example, the alkoxy group in which the methylene group at the end of the alkyl group is replaced by -O- includes methyloxy, ethyloxy, iso-propyloxy, butyloxy, sec-butyloxy, tert-butyloxy, iso-butyloxy, amyloxy, iso-amyloxy, tert-amyloxy, hexyloxy, 2-hexyloxy, 3-hexyloxy, cyclohexyloxy, 4-methylcyclohexyloxy, heptyloxy, 2-heptyloxy, 3-heptyloxy, iso-heptyloxy, tert- Heptyloxy, 1-octyloxy, iso-octyloxy, tert-octyloxy and the like.
 本発明において、基の炭素原子数は、基中のメチレン基が上記2価の基で置き換わっている場合、その置換後の基の炭素原子数を規定する。例えば、本明細書中、炭素原子数1~40のアルキル基中のメチレン基が上記2価の基で置き換わっている場合、該「炭素原子数1~40」とは、メチレン基が置き換わった後の炭素原子数を指し、メチレン基が置き換わる前の炭素原子数を指すのではない。従って「末端のメチレン基が-CO-O-で置き換えられている、炭素原子数1~20のアルキル基」は、-CO-O-R200(R200は炭素原子数1~19のアルキル基)に該当するものである。また、「末端のメチレン基が-O-で置き換えられている、炭素原子数1~20のアルキル基」は、-O-R201(R201は炭素原子数1~20のアルキル基)に該当するものである。 In the present invention, when the methylene group in the group is replaced by the above divalent group, the number of carbon atoms of the group defines the number of carbon atoms of the group after the replacement. For example, in the present specification, when a methylene group in an alkyl group having 1 to 40 carbon atoms is replaced by the above divalent group, the “1 to 40 carbon atoms” means a group after a methylene group is replaced. It does not refer to the number of carbon atoms before the methylene group is replaced. Therefore, "an alkyl group having 1 to 20 carbon atoms in which the terminal methylene group is replaced by -CO-O-" is -CO-O-R 200 (where R 200 is an alkyl group having 1 to 19 carbon atoms) It corresponds to). In addition, “an alkyl group having 1 to 20 carbon atoms in which the terminal methylene group is replaced by —O—” corresponds to —O—R 201 (R 201 is an alkyl group having 1 to 20 carbon atoms) It is
 上記R及びRの少なくとも一方が、上記-O-Rである。
 上記R及びRは、耐久性を有する硬化物の製造が容易となり、さらに合成容易の観点からは、一方が、上記-O-Rであることが好ましい。
 上記R及びRは、紫外線吸収能の変化を大きいものとする観点からは、R及びRの両者が-O-Rであることが好ましい。
 上記R及びRは、一方のみが-O-Rである場合、他方は水素原子、水酸基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基であることが好ましく、なかでも水素原子、炭素原子数1~40のアルキル基であることが好ましく、特に、水素原子、炭素原子数1~5のアルキル基であることが好ましく、中でも特に、水素原子、無置換の炭素原子数1~5のアルキル基であることが好ましい。上記R及びRの他方が、上記の基であることで、上記化合物Aは、紫外線吸収能の変化が大きいものとなるからである。また、上記化合物Aは、硬化阻害の発生が抑制できるからである。R及びRについて上記で述べた事項は全て、R’及びR’に当てはまり、またR”及びR”にも当てはまる。
At least one of R 1 and R 2 is -O-R 9 above.
It is preferable that one of the above R 1 and R 2 is the above-described —O—R 9 from the viewpoint of easy synthesis and further facilitates the production of a cured product having durability.
It said R 1 and R 2, from the viewpoint of the larger the change in ultraviolet absorbing ability, it is preferable both R 1 and R 2 are -O-R 9.
In the above R 1 and R 2 , when only one is —O—R 9 , the other is a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 40 carbon atoms, an aryl group having 6 to 20 carbon atoms, the number of carbon atoms It is preferably an arylalkyl group of 7 to 20 or a heterocyclic group having 2 to 20 carbon atoms, more preferably a hydrogen atom or an alkyl group having 1 to 40 carbon atoms, and particularly preferably a hydrogen atom, The alkyl group is preferably an alkyl group of 1 to 5 carbon atoms, and particularly preferably a hydrogen atom or an unsubstituted alkyl group of 1 to 5 carbon atoms. It is because the said compound A will become a thing with a large change of ultraviolet-ray absorptivity by the other of said R < 1 > and R < 2 > being said group. Moreover, it is because the said compound A can suppress generation | occurrence | production of hardening inhibition. All matters set forth for R 1 and R 2 above may apply to R 1 'and R 2', also holds true for the R 1 "and R 2".
 上記Rは、炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基であることが好ましく、なかでも、炭素原子数1~20のアルキル基であることが好ましく、特に、炭素原子数1~8のアルキル基であることが好ましい。上記化合物Aは、紫外線吸収能の変化が大きいものとなるからである。また、上記組成物は、耐久性を有する硬化物の製造が容易となるからである。
 上記Rは、炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基である場合に、酸素原子側の末端のメチレン基が-CO-O-に置き換えられているもの、すなわち、酸素原子側の末端に-CO-O-が結合しているものであることが好ましい。
 上記Rは、より具体的には酸素原子側の末端のメチレン基が-CO-O-に置き換えられている、炭素原子数1~20のアルキル基又は炭素原子数2~20のアルケニル基であることが好ましい。
 酸素原子側の末端のメチレン基が-CO-O-に置き換えられている、炭素原子数1~20のアルキル基又は炭素原子数2~20のアルケニル基とは、「*-CO-O-R300」で表される基である。「」内の式中、*は酸素原子との結合手を示し、R300は炭素原子数1~19のアルキル基又は炭素原子数2~19のアルケニル基を示す。
 Rとしては、「*-CO-O-R300」で表される基のなかでも、酸素原子側の末端のメチレン基が-CO-O-に置き換えられている炭素原子数1~20のアルキル基であることが好ましく、特に、酸素原子側の末端のメチレン基が-CO-O-に置き換えられている炭素原子数1~8のアルキル基であることが好ましく、中でも特に、酸素原子側の末端のメチレン基が-CO-O-に置き換えられている、置換基を有していない炭素原子数1~8のアルキル基であることが好ましく、中でも-CO-O-Cで表される基であることが好ましく、特に-CO-O-tert-ブチル基であることが好ましい。上記化合物Aは、例えば、加熱により容易にRが脱離し、フェノール性水酸基を生成できるからである。またその結果、上記組成物は、耐久性を有する硬化物の製造が容易となるからである。
 なお、酸素原子側の末端のメチレン基が-CO-O-に置き換えられているアルキル基を有するものとしては、例えば、後述する一般式(A1-1)で表される化合物等を挙げることができる。
R 9 is preferably an alkyl group having 1 to 20 carbon atoms or an alkenyl group having 2 to 20 carbon atoms, and particularly preferably an alkyl group having 1 to 20 carbon atoms, particularly preferably It is preferable that it is an alkyl group having 1 to 8 carbon atoms. It is because the said compound A will become a thing with a large change of ultraviolet-ray absorptivity. Moreover, it is because the said composition becomes easy to manufacture of the hardened | cured material which has durability.
R 9 represents an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms or 2 carbon atoms In the case of a heterocycle-containing group of -20, those in which the terminal methylene group on the oxygen atom side is replaced by -CO-O-, that is, -CO-O- is bonded to the terminal on the oxygen atom side Is preferable.
More specifically, R 9 is an alkyl group having 1 to 20 carbon atoms or an alkenyl group having 2 to 20 carbon atoms in which the terminal methylene group on the oxygen atom side is replaced by —CO—O— Is preferred.
An alkyl group having 1 to 20 carbon atoms or an alkenyl group having 2 to 20 carbon atoms in which the terminal methylene group at the oxygen atom side is replaced by —CO—O— is “* —CO—O—R It is a group represented by 300 ". In the formulas in “,” * represents a bond with an oxygen atom, and R 300 represents an alkyl group having 1 to 19 carbon atoms or an alkenyl group having 2 to 19 carbon atoms.
As R 9 , among the groups represented by “* —CO—O—R 300 ”, the terminal methylene group on the oxygen atom side is replaced by —CO—O— and it has 1 to 20 carbon atoms It is preferably an alkyl group, particularly preferably an alkyl group having 1 to 8 carbon atoms in which the terminal methylene group on the oxygen atom side is replaced by -CO-O-, and above all, especially on the oxygen atom side Preferably, the terminal methylene group of is substituted by —CO—O— and is an alkyl group having 1 to 8 carbon atoms which has no substituent, among which —CO—O—C 4 H 9 It is preferable that it is a group represented, and it is particularly preferable that it is a -CO-O-tert-butyl group. This is because, for example, R 9 can be easily eliminated by heating to generate a phenolic hydroxyl group. Moreover, as a result, the composition described above facilitates the production of a cured product having durability.
In addition, as what has the alkyl group by which the methylene group of the terminal of the oxygen atom side is substituted by -CO-O-, the compound etc. which are represented by general formula (A1-1) mentioned later are mentioned, for example it can.
 上記R、R、R、R、R及びRは、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基であるが、ハロゲン原子、炭素原子数1~40のアルキル基であることが好ましく、置換基を有していない炭素原子数1~40のアルキル基、置換基として、エチレン性不飽和基を有する炭素原子数1~40のアルキル基、端部のメチレン基が-O-で置き換えられた炭素原子数1~40のアルキル基(炭素原子数1~40のアルコキシ基)、メチレン基が-O-CO-で置き換えられた炭素原子数1~40のアルキル基、又は端部のメチレン基が-O-で置き換えられ、且つ、鎖中のメチレン基が-O-CO-で置き換えられた炭素原子数1~40のアルキル基(炭素原子数1~40のアルコキシ基)であることが好ましく、置換基を有していない炭素原子数1~20のアルキル基、置換基を有していない炭素原子数1~20のアルコキシ基、置換基として、エチレン性不飽和基を少なくとも有する、炭素原子数1~20のアルコキシ基、メチレン基が-O-CO-で置き換えられた置換基を有していない炭素原子数1~20のアルキル基、又は鎖中のメチレン基が-O-CO-で置き換えられた置換基を有していない炭素原子数1~20のアルコキシ基であることが好ましく、特に、置換基を有していない炭素原子数1~10のアルキル基、置換基を有していない炭素原子数1~10のアルコキシ基、置換基として、エチレン性不飽和基を少なくとも有する、炭素原子数1~10のアルコキシ基、メチレン基が-O-CO-で置き換えられた置換基を有していない炭素原子数1~10のアルキル基、又は鎖中のメチレン基が-O-CO-で置き換えられた置換基を有していない炭素原子数1~10のアルコキシ基であることが好ましい。
 上記Rは、なかでもハロゲン原子であることが好ましい。
 上記Rは、なかでも、置換基を有していない炭素原子数1~10のアルコキシ基であることが好ましい。
 上記Rは、置換基を有していない炭素原子数1~20のアルキル基も好ましく用いることができ、なかでも、置換基を有していない炭素原子数3~15のアルキル基であることが好ましく、置換基を有していない炭素原子数5~12のアルキル基であることが好ましい。
 上記R及びRは、置換基を有していない炭素原子数1~10のアルキル基も好ましく用いることができ、なかでも、置換基を有していない炭素原子数1~5のアルキル基であることが好ましい。
 上記Rは、置換基を有していない炭素原子数1~10のアルキル基又は置換基として、エチレン性不飽和基を少なくとも有する、炭素原子数1~10のアルコキシ基であることが好ましく、置換基を有していない炭素原子数1~5のアルキル基、置換基として、エチレン性不飽和基を少なくとも有する、炭素原子数2~6のアルコキシ基であることが好ましい。
 上記Rは、置換基を有していない炭素原子数1~15のアルコキシ基も好ましく用いることができ、なかでも、置換基を有していない炭素原子数2~8のアルコキシ基であることが好ましい。
 なお、置換基を有していない炭素原子数1~10のアルコキシ基を有するものとしては、例えば、後述する一般式(A3-1)で表される化合物等を挙げることができ、
 置換基として、エチレン性不飽和基を少なくとも有する、炭素原子数1~10のアルコキシ基を有するものとしては、例えば、後述する一般式(A3-2)で表される化合物等を挙げることができる。
 上記R、R、R、R、R及びRが、上述の基であることで、上記組成物は、耐久性を有する硬化物の製造が容易となるからである。
 また、Rの結合位置は、結合し得るいずれの位置であってもよいが、例えば、-O-Rの結合位置に対して、パラ位であることが好ましい。
 また、Rの結合位置は、結合し得るいずれの位置であってもよいが、例えば、-O-Rの結合位置に対して、メタ位であることが好ましい。
 また、Rの結合位置は、結合し得るいずれの位置であってもよいが、例えば、-O-Rの結合位置に対して、メタ位であることが好ましい。
 また、Rの結合位置は、結合し得るいずれの位置であってもよいが、例えば、-O-Rの結合位置に対して、オルト位又はメタ位であってもよい。
R 3 , R 4 , R 5 , R 6 , R 7 and R 8 each represents a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, 6 to 20 carbon atoms Or an arylalkyl group having 7 to 20 carbon atoms or a heterocyclic group having 2 to 20 carbon atoms, preferably a halogen atom or an alkyl group having 1 to 40 carbon atoms, and the substituent Alkyl groups having 1 to 40 carbon atoms which do not have an alkyl group, alkyl groups having 1 to 40 carbon atoms having an ethylenically unsaturated group as a substituent, and carbons in which the methylene group at the end is replaced by -O- An alkyl group having 1 to 40 atoms (an alkoxy group having 1 to 40 carbon atoms), an alkyl group having 1 to 40 carbon atoms in which a methylene group is replaced by -O-CO-, or a methylene group at an end is- Replaced by O- Preferably, it is an alkyl group having 1 to 40 carbon atoms (an alkoxy group having 1 to 40 carbon atoms) in which the methylene group in the chain is replaced by —O—CO—, and has a substituent An alkyl group having 1 to 20 carbon atoms, an alkoxy group having 1 to 20 carbon atoms having no substituent, an alkoxy having 1 to 20 carbon atoms having at least an ethylenically unsaturated group as a substituent Group, an alkyl group having 1 to 20 carbon atoms which has no substituent in which a methylene group is replaced by -O-CO-, or a substituent in which a methylene group in the chain is replaced by -O-CO- It is preferably an alkoxy group having 1 to 20 carbon atoms which is not contained, and in particular, an alkyl group having 1 to 10 carbon atoms not having a substituent, or 1 to 10 carbon atoms having no substituent. 10 alkoxy groups, As the group, an alkoxy group having 1 to 10 carbon atoms having at least an ethylenically unsaturated group, an alkyl group having 1 to 10 carbon atoms having no substituent in which a methylene group is replaced by —O—CO— It is preferable that the methylene group in the chain is an alkoxy group having 1 to 10 carbon atoms which does not have a substituent substituted with —O—CO—.
Above R 3 is preferably a halogen atom.
Above all, R 4 is preferably an alkoxy group having 1 to 10 carbon atoms which has no substituent.
As R 4 , an alkyl group having 1 to 20 carbon atoms which does not have a substituent can also be preferably used, and among them, an alkyl group having 3 to 15 carbon atoms having no substituent is preferable. Is preferable, and an alkyl group having 5 to 12 carbon atoms which does not have a substituent is preferable.
As R 5 and R 6 , an alkyl group having 1 to 10 carbon atoms which does not have a substituent can also be preferably used, and among them, an alkyl group having 1 to 5 carbon atoms having no substituent is particularly preferable. Is preferred.
R 7 is preferably a C 1 to C 10 alkoxy group having at least an ethylenically unsaturated group as a C 1 to C 10 alkyl group having no substituent or a substituent. It is preferable that it is an alkyl group having 1 to 5 carbon atoms which does not have a substituent, or an alkoxy group having 2 to 6 carbon atoms which has at least an ethylenically unsaturated group as a substituent.
R 7 represents an alkoxy group having 1 to 15 carbon atoms having no substituent can be preferably used. It is possible inter alia, an alkoxy group having 2 to 8 carbon atoms having no substituent Is preferred.
In addition, as what has a C1-C10 alkoxy group which does not have a substituent, the compound etc. which are represented by general formula (A3-1) mentioned later can be mentioned, for example.
Examples of the substituent having at least an ethylenically unsaturated group and having an alkoxy group having 1 to 10 carbon atoms include, for example, compounds represented by General Formula (A3-2) described later, and the like. .
When R 3 , R 4 , R 5 , R 6 , R 7 and R 8 are the groups described above, the composition can easily produce a cured product having durability.
Also, the bonding position of R 4 may be any position that can be bonded, but for example, it is preferable that it is para to the bonding position of —O—R 9 .
Further, the bonding position of R 5 may be any position that can be bonded, but for example, the meta position is preferable with respect to the bonding position of —O—R 9 .
Further, the bonding position of R 6 may be any position that can be bonded, but for example, the meta position is preferable with respect to the bonding position of —O—R 9 .
Further, the bonding position of R 7 may be any position that can be bonded, but may be, for example, an ortho position or a meta position with respect to the bonding position of —O—R 9 .
 上記a1及びa3は、0~4の整数であるが、耐久性を有する硬化物の製造が容易となり、さらに合成の容易さの観点からは、それぞれ独立に、0~3の整数であることが好ましく、なかでも、0~2の整数であることが好ましく、特に、0~1であることが好ましい。
 上記a2は、0~2の整数であるが、溶解性の観点から、1~2であることが好ましい。上記組成物は、耐久性を有する硬化物の製造が容易となるからである。
 上記a4及びa5は、0~3の整数であるが、耐久性を有する硬化物の製造が容易となり、さらに、合成の容易さの観点から、0~2の整数であることが好ましく、なかでも1~2であることが好ましい。
 上記a6は、0~3-m3の整数であるが、耐久性を有する硬化物の製造が容易となり、さらに合成の容易さの観点から、0~1の整数であることが好ましく、0であることが好ましい。
 上記m1は、1~10の整数であるが、耐久性に優れた硬化物を得るとの観点からは、2以上であることが好ましく、なかでも、2~6の整数であることが好ましく、特に、2~4の整数であることが好ましい。
 上記m2は、1~10の整数であるが、耐久性に優れた硬化物を得るとの観点からは、1~5の整数であることが好ましく、特に、1~2の整数であることが好ましい。
 上記m3は、1~3の整数であるが、耐久性に優れた硬化物を得るとの観点からは、2以上であることが好ましく、なかでも、3であることが好ましい。
Although the above a1 and a3 are integers of 0 to 4, the production of a cured product having durability is facilitated, and from the viewpoint of easiness of synthesis, they are each independently an integer of 0 to 3 Among these, an integer of 0 to 2 is preferable, and in particular, 0 to 1 is preferable.
The a 2 is an integer of 0 to 2, but is preferably 1 to 2 from the viewpoint of solubility. It is because the said composition becomes easy to manufacture of the hardened | cured material which has durability.
The above a4 and a5 are integers of 0 to 3, but they are preferably integers of 0 to 2 from the viewpoint of easiness of synthesis because they facilitate the production of a cured product having durability. It is preferably 1 or 2.
Although the above a 6 is an integer of 0 to 3 m 3, it is preferable that it is an integer of 0 to 1, and it is 0, from the viewpoint of easiness of production of a cured product having durability and ease of synthesis. Is preferred.
The above m1 is an integer of 1 to 10, but is preferably 2 or more from the viewpoint of obtaining a cured product excellent in durability, and in particular, is preferably an integer of 2 to 6, In particular, an integer of 2 to 4 is preferable.
Although m 2 is an integer of 1 to 10, it is preferably an integer of 1 to 5 and particularly preferably an integer of 1 to 2 from the viewpoint of obtaining a cured product excellent in durability. preferable.
The above m3 is an integer of 1 to 3, but from the viewpoint of obtaining a cured product excellent in durability, it is preferably 2 or more, and more preferably 3 in particular.
 上記一般式(A1)及び(A2)で表される化合物Aは、それぞれXa1及びXa2(以下、Xと称する場合がある。)で表されるm1価又はm2価(以下、m価と称する場合がある。)の特定の原子若しくは基又は直接結合に、m1個又はm2個(以下、m個と称する場合がある。)の特定の基が結合した構造を有する。このm個の特定の基は、互いに同じであるか又は異なる。 The compounds A represented by the above general formulas (A1) and (A2) are each an m monovalent or m divalent (hereinafter referred to as m valence) represented by X a1 and X a2 (hereinafter sometimes referred to as X). Or a direct bond, or a specific atom or group or a direct bond, may have a structure in which m1 or m2 (hereinafter sometimes referred to as m) specific groups are bonded. The m specific groups are identical to or different from one another.
 上記Xは、m価の原子若しくは結合基又は直接結合を表すものである。
 上記原子又は結合基Xとしては、具体的には、水素原子、窒素原子、酸素原子、硫黄原子、リン原子、下記(II-a)若しくは(II-b)で表される基、>C=O、>NR53、-OR53、-SR53、-NR5354又はmと同数の価数を有する炭素原子数1~120の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基若しくは炭素原子数2~35の複素環含有基を表し、R53及びR54は、水素原子、炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基又は炭素原子数2~35の複素環含有基を表し、該脂肪族炭化水素基、芳香環含有炭化水素基及び複素環含有基は、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NH-CO-O-、-NR-、-S-S-、-SO-、窒素原子又はこれらの組み合わせで置き換わっている場合があり、上記芳香環含有炭化水素基における芳香環又は複素環含有基における複素環は、他の環と縮合されている場合がある。
 但し、結合基Xが窒素原子、リン原子又は下記(II-a)若しくは(II-b)で表される結合基の場合、mは3であり、結合基Xが酸素原子又は硫黄原子、>C=O、-NH-CO-、-CO-NH-又は>NR53の場合、mは2であり、結合基Xが-OR53、-SR53又は-NR5354の場合、mは1であり、結合基Xは、ベンゼン環と一緒になって環を形成している場合がある。
The above X represents an m-valent atom or a bonding group or a direct bond.
Specifically as the above atom or bonding group X, a hydrogen atom, a nitrogen atom, an oxygen atom, a sulfur atom, a phosphorus atom, a group represented by the following (II-a) or (II-b),> C = O,> NR 53 , -OR 53 , -SR 53 , -NR 53 R 54 or an aliphatic hydrocarbon group having 1 to 120 carbon atoms having the same number of valences as m, an aromatic ring having 6 to 35 carbon atoms And R 53 and R 54 each represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms, or an aromatic having 6 to 35 carbon atoms. And a ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms, wherein the aliphatic hydrocarbon group, the aromatic ring-containing hydrocarbon group and the heterocyclic ring-containing group are —O—, —S— and —CO -, -O-CO-, -CO-O-, -O-CO-O-, -O-CO-O- -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S-, -CO-NH-, -NH-CO-, -NH-CO-O-, -NH -CO-O -, - NR ' -, - S-S -, - SO 2 -, might be replaced by nitrogen atoms, or combinations thereof, aromatic or heterocyclic ring-containing in the aromatic ring-containing hydrocarbon radical The heterocycle in the group may be fused to another ring.
However, in the case where the bonding group X is a nitrogen atom, a phosphorus atom or a bonding group represented by the following (II-a) or (II-b), m is 3 and the bonding group X is an oxygen atom or a sulfur atom, In the case of C = O, —NH—CO—, —CO—NH— or> NR 53 , m is 2 and when the linking group X is —OR 53 , —SR 53 or —NR 53 R 54 , m is And the linking group X may form a ring together with the benzene ring.
Figure JPOXMLDOC01-appb-C000013
Figure JPOXMLDOC01-appb-C000013
(*は、*部分で、隣接する基と結合することを意味する。) (* Indicates that it is a bond to an adjacent group in the * part.)
 上記結合基Xに用いられるmと同数の価数を有する炭素原子数1~120の脂肪族炭化水素基としては、mが1価のものとして、例えば、メチル、エチル、プロピル、イソプロピル、シクロプロピル、ブチル、第二ブチル、第三ブチル、イソブチル、アミル、イソアミル、第三アミル、シクロペンチル、ヘキシル、2-ヘキシル、3-ヘキシル、シクロヘキシル、ビシクロヘキシル、1-メチルシクロヘキシル、ヘプチル、2-ヘプチル、3-ヘプチル、イソヘプチル、第三ヘプチル、n-オクチル、イソオクチル、第三オクチル、2-エチルヘキシル、ノニル、イソノニル、デシル等のアルキル基;メチルオキシ、エチルオキシ、プロピルオキシ、イソプロピルオキシ、ブチルオキシ、第二ブチルオキシ、第三ブチルオキシ、イソブチルオキシ、アミルオキシ、イソアミルオキシ、第三アミルオキシ、ヘキシルオキシ、シクロヘキシルオキシ、ヘプチルオキシ、イソヘプチルオキシ、第三ヘプチルオキシ、n-オクチルオキシ、イソオクチルオキシ、第三オクチルオキシ、2-エチルヘキシルオキシ、ノニルオキシ、デシルオキシ等のアルコキシ基;メチルチオ、エチルチオ、プロピルチオ、イソプロピルチオ、ブチルチオ、第二ブチルチオ、第三ブチルチオ、イソブチルチオ、アミルチオ、イソアミルチオ、第三アミルチオ、ヘキシルチオ、シクロヘキシルチオ、ヘプチルチオ、イソヘプチルチオ、第三ヘプチルチオ、n-オクチルチオ、イソオクチルチオ、第三オクチルチオ、2-エチルヘキシルチオ等のアルキルチオ基;ビニル、1-メチルエテニル、2-メチルエテニル、2-プロペニル、1-メチル-3-プロペニル、3-ブテニル、1-メチル-3-ブテニル、イソブテニル、3-ペンテニル、4-ヘキセニル、シクロヘキセニル、ビシクロヘキセニル、ヘプテニル、オクテニル、デセニル、ぺンタデセニル、エイコセニル、トリコセニル等のアルケニル基及びこれらの基が後述する置換基により置換された基等が挙げられ、
 mが2価のものとして、メチレン、エチレン、プロピレン、ブチレン、ブチルジイル等のアルキレン;上記アルキレンのメチレン鎖が-O-、-S-、-CO-O-、-O-CO-で置き換えられたもの;エタンジオール、プロパンジオール、ブタンジオール、ペンタンジオール、ヘキサンジオール等のジオールの残基;エタンジチオール、プロパンジチオール、ブタンジチオール、ペンタンジチオール、ヘキサンジチオール等のジチオールの残基及びこれらの基が後述する置換基により置換された基等が挙げられ、
 mが3価のものとして、例えば、プロピリジン、1,1,3-ブチリジン等のアルキリジン及びこれらの基が後述する置換基により置換された基が挙げられる。
 mと同数の価数を有する炭素原子数6~35の芳香環含有炭化水素基としては、mが1価のものとして、ベンジル、フェネチル、ジフェニルメチル、トリフェニルメチル、スチリル、シンナミル等のアリールアルキル基;フェニル、ナフチル等のアリール基;フェノキシ、ナフチルオキシ等のアリールオキシ基;フェニルチオ、ナフチルチオ等のアリールチオ基及びこれらの基が後述する置換基により置換された基等が挙げられ、
 mが2価のものとして、フェニレン、ナフチレン等のアリーレン基;カテコール、ビスフェノール等の二官能フェノールの残基;2,4,8,10-テトラオキサスピロ[5,5]ウンデカン等及びこれらの基が後述する置換基により置換された基が挙げられ、
mが3価のものとして、フェニル-1,3,5-トリメチレン及びこれらの基が後述する置換基により置換された基が挙げられる、
 mと同数の価数を有する炭素原子数2~35の複素環含有基としては、mが1価のものとして、ピリジル、ピリミジル、ピリダジル、ピペリジル、ピラニル、ピラゾリル、トリアジル、ピロリル、キノリル、イソキノリル、イミダゾリル、ベンゾイミダゾリル、トリアゾリル、フリル、フラニル、ベンゾフラニル、チエニル、チオフェニル、ベンゾチオフェニル、チアジアゾリル、チアゾリル、ベンゾチアゾリル、オキサゾリル、ベンゾオキサゾリル、イソチアゾリル、イソオキサゾリル、インドリル、2-ピロリジノン-1-イル、2-ピペリドン-1-イル、2,4-ジオキシイミダゾリジン-3-イル、2,4-ジオキシオキサゾリジン-3-イル、ベンゾトリアゾイル等及びこれらの基が後述する置換基により置換された基等が挙げられ、
 mが2価のものとして、ピリジン環、ピリミジン環、ピペリジン環、ピペラジン環、トリアジン環、フラン環、チオフェン環、インドール環等を有する基及びこれらの基が後述する置換基により置換された基が挙げられ、
 mが3価のものとしては、イソシアヌル環を有する基、トリアジン環を有する基及びこれらの基が後述する置換基により置換された基が挙げられる。
 R53及びR54に用いられる炭素原子数1~35の脂肪族炭化水素基としては、上記結合基Xに用いられる炭素原子数1~120の脂肪族炭化水素基又は脂肪族炭化水素基が後述する置換基により置換された基のうち、所定の炭素原子数を満たすものが挙げられ、
 R53及びR54に用いられる炭素原子数6~35の芳香環含有炭化水素基又は炭素原子数2~35の複素環含有基としては、上記結合基Xに用いられる炭素原子数6~35の芳香環含有炭化水素基若しくは炭素原子数2~35の複素環含有基又はこれらの基が後述する置換基により置換された基が挙げられる。
 上記脂肪族炭化水素基、芳香環含有炭化水素基及び複素環含有基等の各基は、置換基を有している場合があるものであり、特に断りがない限り、置換基を有していないか又は置換基を有しているものである。
 このような脂肪族炭化水素基、芳香環含有炭化水素基及び複素環含有基等の置換基としては、R等に用いられるアルキル基等の水素原子を置換する置換基と同様の内容とすることができる。
As the aliphatic hydrocarbon group having 1 to 120 carbon atoms and having the same valence as m used for the bonding group X, as m is monovalent, for example, methyl, ethyl, propyl, isopropyl, cyclopropyl and the like , Butyl, sec-butyl, tert-butyl, isobutyl, amyl, iso-amyl, tert-amyl, cyclopentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, bicyclohexyl, 1-methylcyclohexyl, heptyl, 2-heptyl, 3 Alkyl groups such as heptyl, isoheptyl, tertiary heptyl, n-octyl, isooctyl, tertiary octyl, 2-ethylhexyl, nonyl, isononyl, decyl and the like; methyloxy, ethyloxy, propyloxy, isopropyloxy, butyloxy, sec-butyloxy, Tert-Butyloxy, isobutylo S, amyloxy, isoamyloxy, tertiary amyloxy, hexyloxy, cyclohexyloxy, heptyloxy, isoheptyloxy, tertiary heptyloxy, n-octyloxy, isooctyloxy, tertiary octyloxy, 2-ethylhexyloxy, nonyloxy, Alkoxy groups such as decyloxy and the like; methylthio, ethylthio, propylthio, isopropylthio, butylthio, sec-butylthio, tert-butylthio, isobutylthio, amylthio, isoamylthio, tert-amylthio, hexylthio, cyclohexylthio, heptylthio, isoheptylthio, tert-heptylthio, Alkylthio groups such as n-octylthio, isooctylthio, tertiary octylthio, 2-ethylhexylthio and the like; vinyl, 1-methylethenyl, 2-methylethenyl 2-propenyl, 1-methyl-3-propenyl, 3-butenyl, 1-methyl-3-butenyl, isobutenyl, 3-pentenyl, 4-hexenyl, cyclohexenyl, bicyclohexenyl, heptenyl, octenyl, decenyl, pentadecenyl, eicosenyl And alkenyl groups such as tricocenyl, and groups in which these groups are substituted by a substituent described later, and the like.
m is bivalent; alkylene such as methylene, ethylene, propylene, butylene and butyldiyl; the methylene chain of the above alkylene is replaced by -O-, -S-, -CO-O- or -O-CO- Residues of diols such as ethanediol, propanediol, butanediol, pentanediol, hexanediol, etc. Residues of dithiols such as ethanedithiol, propanedithiol, butanedithiol, pentanedithiol, hexanedithiol and these groups will be described later Groups substituted by substituents, etc.,
As m is trivalent, for example, alkylpyridines such as propyridine and 1,1,3-butyridine and the like, and groups in which these groups are substituted by a substituent described later can be mentioned.
As a C6-C35 aromatic ring containing hydrocarbon group which has valence of the same number as m, m is monovalent and arylalkylalkyl such as benzyl, phenethyl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl etc. Groups; aryl groups such as phenyl and naphthyl; aryloxy groups such as phenoxy and naphthyloxy; arylthio groups such as phenylthio and naphthylthio; and groups in which these groups are substituted by a substituent described later, etc.
and arylene and arylene groups such as phenylene and naphthylene; and residues of bifunctional phenols such as catechol and bisphenol as m is a divalent group; 2,4,8,10-tetraoxaspiro [5,5] undecane etc. and groups thereof Groups substituted by a substituent described later, and
Examples of trivalent m include phenyl-1,3,5-trimethylene and a group in which these groups are substituted by a substituent described later.
As a C2-C35 heterocycle-containing group having the same number of valences as m, pyridyl, pyrimidyl, pyridazyl, piperidyl, pyranyl, pyrazolyl, triazyl, pyrrolyl, quinolyl, isoquinolyl, as m is a monovalent group. Imidazolyl, benzimidazolyl, triazolyl, furyl, furanyl, benzofuranyl, thienyl, thiophenyl, benzothiophenyl, thiadiazolyl, thiazolyl, benzothiazolyl, oxazolyl, benzoxazolyl, isothiazolyl, isoxazolyl, indolyl, 2-pyrrolidinone-1-yl, 2-piperidone -1-yl, 2,4-dioxyimidazolidin-3-yl, 2,4-dioxazolidin-3-yl, benzotriazolyl and the like, and groups in which these groups are substituted by the substituents described below Raising It is,
Groups in which m is a divalent ring and which have a pyridine ring, pyrimidine ring, piperidine ring, piperidine ring, piperazine ring, triazine ring, furan ring, thiophene ring, indole ring and the like, and groups in which these groups are substituted by substituents Listed
Examples of the group in which m is trivalent include a group having an isocyanuric ring, a group having a triazine ring, and a group in which these groups are substituted by a substituent described later.
Examples of the aliphatic hydrocarbon group R 53 and the carbon atoms 1 to 35 for use in R 54, an aliphatic hydrocarbon group or an aliphatic hydrocarbon group having a carbon number of 1 to 120 for use in the linking group X is later Among the groups substituted by the substituent to be substituted, those having a predetermined number of carbon atoms can be mentioned,
The aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms or the heterocyclic ring-containing group having 2 to 35 carbon atoms, which is used for R 53 and R 54, includes 6 to 35 carbon atoms used for the bonding group X Examples thereof include an aromatic ring-containing hydrocarbon group, a heterocyclic ring-containing group having 2 to 35 carbon atoms, or a group in which these groups are substituted by a substituent described later.
Each group such as the above-mentioned aliphatic hydrocarbon group, aromatic ring-containing hydrocarbon group and heterocyclic group-containing group may have a substituent, and unless otherwise noted, has a substituent. It is absent or has a substituent.
The substituent such as the aliphatic hydrocarbon group, the aromatic ring-containing hydrocarbon group and the heterocyclic group-containing group has the same content as the substituent that substitutes a hydrogen atom such as an alkyl group used for R 1 etc. be able to.
 上記結合基Xは、mが2であるとき、下記一般式(1)で表される基を用いることができる。
 上記結合基Xは、mが3であるとき、下記一般式(2)で表される基を用いることができる。
 上記結合基Xは、mが4であるとき、下記一般式(3)で表される基を用いることができる。
 上記結合基Xは、mが5であるとき、下記一般式(4)で表される基を用いることができる。
 上記結合基Xは、mが6であるとき、下記一般式(5)で表される基を用いることができる。
When m is 2 as the bonding group X, a group represented by the following general formula (1) can be used.
When m is 3, the linking group X can be a group represented by the following general formula (2).
When m is 4 as the linking group X, a group represented by the following general formula (3) can be used.
When m is 5 as the bonding group X, a group represented by the following general formula (4) can be used.
When m is 6, the linking group X can be a group represented by the following general formula (5).
Figure JPOXMLDOC01-appb-C000014
Figure JPOXMLDOC01-appb-C000014
(上記一般式(1)中、Yは、単結合、-CR5556-、-NR57-、二価の炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基若しくは炭素原子数2~35の複素環含有基、又は、下記(1-1)~(1-3)で表されるいずれかの置換基を表し、該炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基及び炭素原子数2~35の複素環含有基中のメチレン基は、-O-、-S-、-CO-、-CO-O-、-O-CO-若しくは-NH-又はこれらの組み合わせの結合基で置き換わっている場合があり、
55及びR56は、水素原子、炭素原子数1~8のアルキル基、炭素原子数6~20のアリール基又は炭素原子数7~20のアリールアルキル基を表し、
及びZは、それぞれ独立に、直接結合、-O-、-S-、>CO、-CO-O-、-O-CO-、-SO-、-SS-、-SO-、>NR58又は>PR58を表し、
57及びR58は、水素原子、炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基又は炭素原子数2~35の複素環含有基を表し、
 *は、*部分で、隣接する基と結合することを意味する。)
(In the above general formula (1), Y 1 represents a single bond, —CR 55 R 56 —, —NR 57 —, divalent aliphatic hydrocarbon group having 1 to 35 carbon atoms, 6 to 35 carbon atoms Or an aromatic ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms, or any substituent represented by the following (1-1) to (1-3): The methylene group in the aliphatic hydrocarbon group of 1 to 35, the aromatic ring-containing hydrocarbon group of 6 to 35 carbon atoms, and the heterocyclic ring-containing group of 2 to 35 carbon atoms is -O-, -S-,- CO-, -CO-O-, -O-CO- or -NH- or a combination of these groups may be substituted,
R 55 and R 56 each represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an arylalkyl group having 7 to 20 carbon atoms,
Z 1 and Z 2 are each independently a direct bond, -O-, -S-,> CO, -CO-O-, -O-CO-, -SO 2- , -SS-, -SO-, Represents> NR 58 or> PR 58 ,
R 57 and R 58 each represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or a heterocycle containing group having 2 to 35 carbon atoms ,
The * means that at the * part, it bonds to an adjacent group. )
Figure JPOXMLDOC01-appb-C000015
Figure JPOXMLDOC01-appb-C000015
(上記式中、R59は水素原子、置換基を有している場合があるフェニル基、又は炭素原子数3~10のシクロアルキル基を表し、R60は炭素原子数1~10のアルキル基、炭素原子数1~10のアルコキシ基、炭素原子数2~10のアルケニル基又はハロゲン原子を表し、上記アルキル基、アルコキシ基及びアルケニル基は置換基を有している場合があり、c1は0~5の整数であり、*は、*部分で、隣接する基と結合することを意味する。) (Wherein, R 59 represents a hydrogen atom, a phenyl group which may have a substituent, or a cycloalkyl group having 3 to 10 carbon atoms, and R 60 represents an alkyl group having 1 to 10 carbon atoms) And an alkoxy group having 1 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms or a halogen atom, and the above alkyl group, alkoxy group and alkenyl group may have a substituent, and c1 is 0 It is an integer of ~ 5, and * means that it bonds to an adjacent group at the * part.)
Figure JPOXMLDOC01-appb-C000016
Figure JPOXMLDOC01-appb-C000016
(*は、*部分で、隣接する基と結合することを意味する。) (* Indicates that it is a bond to an adjacent group in the * part.)
Figure JPOXMLDOC01-appb-C000017
Figure JPOXMLDOC01-appb-C000017
(上記式中、R61及びR62は、それぞれ独立に、炭素原子数1~10のアルキル基、炭素原子数6~20のアリール基、炭素原子数6~20のアリールオキシ基、炭素原子数6~20のアリールチオ基、炭素原子数6~20のアリールアルケニル基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又はハロゲン原子を表し、該アルキル基及びアリールアルキル基中のメチレン基は不飽和結合、-O-又は-S-で置き換わっている場合があり、
 R61は、隣接するR61同士で環を形成している場合があり、
 c2は0~4の数を表し、
 c3は0~8の数を表し、
 c4は0~4の数を表し、
 c5は0~4の数を表し、
 c4とc5の数の合計は2~4であり、
 *は、*部分で、隣接する基と結合することを意味する。)
(In the above formula, R 61 and R 62 each independently represent an alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, an aryloxy group having 6 to 20 carbon atoms, or the like An arylthio group of 6 to 20, an arylalkenyl group of 6 to 20 carbon atoms, an arylalkyl group of 7 to 20 carbon atoms, a heterocycle-containing group of 2 to 20 carbon atoms, or a halogen atom; The methylene group in the arylalkyl group may be replaced by an unsaturated bond, -O- or -S-,
R 61 may form a ring between adjacent R 61 's ,
c2 represents a number from 0 to 4;
c3 represents a number from 0 to 8,
c4 represents a number from 0 to 4;
c5 represents a number from 0 to 4;
The sum of the numbers of c4 and c5 is 2 to 4,
The * means that at the * part, it bonds to an adjacent group. )
Figure JPOXMLDOC01-appb-C000018
Figure JPOXMLDOC01-appb-C000018
(上記一般式(2)中、Y11は、三価の炭素原子数3~35の脂肪族炭化水素基、炭素原子数3~35の脂環族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基又は炭素原子数2~35の複素環含有基を表し、
 Z、Z及びZは、それぞれ独立に、直接結合、-O-、-S-、>CO、-CO-O-、-O-CO-、-SO-、-SS-、-SO-、>NR62、PR62、炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基又は炭素原子数2~35の複素環含有基を表し、
 R62は、水素原子、炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基又は炭素原子数2~35の複素環含有基を表し、
 上記各脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基及び炭素原子数2~35の複素環含有基中のメチレン基は、炭素-炭素二重結合、-O-、-CO-、-O-CO-、-CO-O-又は-SO-で置き換わっている場合がある。*は*部分で、隣接する基と結合することを意味する。)
(In the above general formula (2), Y 11 is a trivalent aliphatic hydrocarbon group having 3 to 35 carbon atoms, an alicyclic hydrocarbon group having 3 to 35 carbon atoms, or 6 to 35 carbon atoms Represents an aromatic ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms,
Z 1 , Z 2 and Z 3 are each independently a direct bond, -O-, -S-,> CO, -CO-O-, -O-CO-, -SO 2- , -SS-,- SO—,> NR 62 , PR 62 , an aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or a heterocyclic ring-containing group having 2 to 35 carbon atoms ,
R 62 represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms or a heterocycle containing group having 2 to 35 carbon atoms,
The methylene group in each of the above aliphatic hydrocarbon groups, aromatic ring-containing hydrocarbon groups having 6 to 35 carbon atoms and heterocyclic ring containing groups having 2 to 35 carbon atoms has a carbon-carbon double bond, -O-, It may be replaced by -CO-, -O-CO-, -CO-O- or -SO 2- . * Represents a part of *, which means to bond to an adjacent group. )
Figure JPOXMLDOC01-appb-C000019
Figure JPOXMLDOC01-appb-C000019
(上記一般式(3)中、Y12は、炭素原子又は四価の炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基若しくは炭素原子数2~35の複素環含有基を表し、該炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基及び炭素原子数2~35の複素環含有基中のメチレン基は、-CO-O-、-O-、-O-CO-、-NH-CO-、-NH-又は-CO-NH-で置き換わっている場合があり、Z~Zは、それぞれ独立に、上記一般式(2)におけるZ~Zで表される基と同じ範囲の基である。*は*部分で、隣接する基と結合することを意味する。) (In the above general formula (3), Y 12 represents a carbon atom or a tetravalent aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or 2 carbon atoms Represents a heterocyclic ring-containing group of-35, and in the aliphatic hydrocarbon group having 1 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, and the heterocyclic ring-containing group having 2 to 35 carbon atoms The methylene group of may be replaced by -CO-O-, -O-, -O-CO-, -NH-CO-, -NH- or -CO-NH-, and Z 1 to Z 4 may be And each independently a group in the same range as the groups represented by Z 1 to Z 3 in the above general formula (2) * represents a part *, which means to bond to an adjacent group)
Figure JPOXMLDOC01-appb-C000020
Figure JPOXMLDOC01-appb-C000020
(上記一般式(4)中、Y13は、五価の炭素原子数2~35の脂肪族炭化水素基、炭素原子数6~30の芳香環含有炭化水素基又は炭素原子数2~30の複素環含有基を表し、該炭素原子数2~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基及び炭素原子数2~35の複素環含有基中のメチレン基は、-CO-O-、-O-、-O-CO-、-NH-CO-、-NH-又は-CO-NH-で置き換わっている場合があり、Z~Zは、それぞれ独立に、上記一般式(2)におけるZ~Zで表される基と同じ範囲の基である。*は*部分で、隣接する基と結合することを意味する。) (In the above general formula (4), Y 13 is a pentavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 30 carbon atoms, or 2 to 30 carbon atoms Represents a hetero ring-containing group, and is an aliphatic hydrocarbon group having 2 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, and a methylene group in the heterocyclic ring containing group having 2 to 35 carbon atoms May be replaced by -CO-O-, -O-, -O-CO-, -NH-CO-, -NH- or -CO-NH-, and Z 1 to Z 5 are each independently In the above general formula (2), it is a group in the same range as the groups represented by Z 1 to Z 3. * indicates that * part is to be bonded to an adjacent group.)
Figure JPOXMLDOC01-appb-C000021
Figure JPOXMLDOC01-appb-C000021
(上記一般式(5)中、Y14は、単結合、六価の炭素原子数2~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基又は炭素原子数2~35の複素環含有基を表し、該炭素原子数2~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基若しくは炭素原子数2~35の複素環含有基中のメチレン基は、-CO-O-、-O-、-O-CO-、-NH-CO-、-NH-又は-CO-NH-で置き換わっている場合があり、Z~Zは、それぞれ独立に、上記一般式(2)におけるZ~Zで表される基と同じ範囲の基である。*は*部分で、隣接する基と結合することを意味する。) (In the above general formula (5), Y 14 is a single bond, a hexavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or 2 carbon atoms Represents a heterocycle-containing group of -35, wherein the aliphatic hydrocarbon group having 2 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, or the heterocycle-containing group having 2 to 35 carbon atoms In which the methylene group may be replaced by -CO-O-, -O-, -O-CO-, -NH-CO-, -NH- or -CO-NH-, and Z 1 to Z 6 is And each independently a group in the same range as the groups represented by Z 1 to Z 3 in the above general formula (2) * represents a part *, which means to bond to an adjacent group)
 上記一般式(1)で表される基におけるYに用いられる二価の炭素原子数1~35の脂肪族炭化水素基としては、メタン、エタン、プロパン、iso-プロパン、ブタン、sec-ブタン、tert-ブタン、iso-ブタン、ヘキサン、2-メチルヘキサン、3-メチルヘキサン、ヘプタン、2-メチルヘプタン、3-メチルヘプタン、iso-ヘプタン、tert-ヘプタン、1-メチルオクタン、iso-オクタン、tert-オクタン、シクロプロパン、シクロブタン、シクロペンタン、シクロヘキサン、シクロヘプタン、2,4-ジメチルシクロブタン、4-メチルシクロヘキサン等が、Z及びZで置換された二価の基が挙げられ、これらの基は、-O-、-S-、-CO-、-CO-O-、-O-CO-、-NH-又はこれらを組み合わせた基で置き換わっている場合があり、
 二価の炭素原子数6~35の芳香環含有炭化水素基としては、フェニレン、ナフチレン、ビフェニル等の基が、Z及びZで置換された二価の基等が挙げられ、
 二価の炭素原子数2~35の複素環含有基としては、ピリジン、ピラジン、ピペリジン、ピペラジン、ピリミジン、ピリダジン、トリアジン、ヘキサヒドロトリアジン、フラン、テトラヒドロフラン、クロマン、キサンテン、チオフェン、チオラン等が、Z及びZで置換された二価の基が挙げられる。
 これらの基はハロゲン原子、シアノ基、ニトロ基又は炭素原子数1~8のアルコキシ基でさらに置換されている場合がある。
 上記脂肪族炭化水素基、芳香環含有炭化水素基及び複素環含有基等の各基は、置換基を有している場合があるものであり、特に断りがない限り、置換基を有していない無置換である又は置換基を有しているものである。
 このような脂肪族炭化水素基、芳香環含有炭化水素基及び複素環含有基等の置換基としては、R等に用いられるアルキル基等の水素原子を置換する置換基と同様の内容とすることができる。
The divalent aliphatic hydrocarbon group having 1 to 35 carbon atoms used for Y 1 in the group represented by the above general formula (1) is methane, ethane, propane, iso-propane, butane, sec-butane Tert-butane, iso-butane, hexane, 2-methylhexane, 3-methylhexane, heptane, 2-methylheptane, 3-methylheptane, iso-heptane, tert-heptane, 1-methyloctane, iso-octane, tert-octane, cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, 2,4-dimethylcyclobutane, 4-methylcyclohexane and the like, and divalent groups substituted with Z 1 and Z 2 can be mentioned. The group is -O-, -S-, -CO-, -CO-O-, -O-CO-, -NH- or Might be replaced by a group composed of a combination of these,
Examples of the divalent aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms include divalent groups in which groups such as phenylene, naphthylene and biphenyl are substituted with Z 1 and Z 2 , and the like
Examples of divalent heterocyclic groups having 2 to 35 carbon atoms include pyridine, pyrazine, piperidine, piperazine, pyrimidine, pyridazine, triazine, hexahydrotriazine, furan, tetrahydrofuran, chromane, xanthene, thiophene, thiolane and the like. Divalent groups substituted with 1 and Z 2 can be mentioned.
These groups may be further substituted by a halogen atom, a cyano group, a nitro group or an alkoxy group having 1 to 8 carbon atoms.
Each group such as the above-mentioned aliphatic hydrocarbon group, aromatic ring-containing hydrocarbon group and heterocyclic group-containing group may have a substituent, and unless otherwise noted, has a substituent. There are no unsubstituted or substituted ones.
The substituent such as the aliphatic hydrocarbon group, the aromatic ring-containing hydrocarbon group and the heterocyclic group-containing group has the same content as the substituent that substitutes a hydrogen atom such as an alkyl group used for R 1 etc. be able to.
 上記一般式(1)で表される基におけるR55及びR56に用いられる炭素原子数1~8のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基等は、上述したR等として例示した内容のうち、所定の炭素原子数を満たすものが挙げられる。 The alkyl group having 1 to 8 carbon atoms, the aryl group having 6 to 20 carbon atoms, and the arylalkyl group having 7 to 20 carbon atoms which are used for R 55 and R 56 in the group represented by the above general formula (1) Among the contents exemplified as R 1 and the like described above, those having a predetermined number of carbon atoms can be mentioned.
 上記一般式(1)で表される基におけるR57及びR58に用いられる炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基及び炭素原子数2~35の複素環含有基は、上述したR53及びR54として例示した内容と同様とすることができる。 An aliphatic hydrocarbon group having 1 to 35 carbon atoms, an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, and a carbon atom number used for R 57 and R 58 in the group represented by the above general formula (1) The heterocycle-containing group of 2 to 35 can be the same as the contents exemplified as R 53 and R 54 described above.
 上記一般式(1-1)で表される基におけるR59に用いられる炭素原子数3~10のシクロアルキル基としては、シクロプロピル、シクロブチル、シクロペンチル、シクロへブチル、シクロオクチル等及びこれらの基が炭素原子数1~10のアルキル基若しくは炭素原子数1~10のアルコキシ基で置換された基等が挙げられ、
 R60に用いられる炭素原子数1~10のアルキル基及び炭素原子数1~10のアルコキシ基としては、上記R等として例示した内容のうち、所定の炭素原子数を満たすものが挙げられ、
 炭素原子数2~10のアルケニル基としては、上記R等として例示したもののうち、所定の炭素原子数を満たすものを挙げることができる。
 一般式(1-1)中のフェニル基、アルキル基、アルコキシ基及びアルケニル基は置換基を有している場合がある。このような置換基としては、R等に用いられるアルキル基等の水素原子を置換する置換基と同様の内容とすることができる。
 上記R60におけるアルキル基、アルコキシ基及びアルケニル基は例えば、ハロゲン原子で置換されているものとすることができ、その置換位置は制限されない。
The cycloalkyl group having 3 to 10 carbon atoms used for R 59 in the group represented by the above general formula (1-1) includes cyclopropyl, cyclobutyl, cyclopentyl, cyclobutyl, cyclooctyl and the like, and groups thereof Is a C 1 -C 10 alkyl group or a group substituted with a C 1 -C 10 alkoxy group,
Examples of the alkyl group having 1 to 10 carbon atoms and the alkoxy group having 1 to 10 carbon atoms which are used for R 60 include those having a predetermined number of carbon atoms among the contents exemplified as the above R 1 and the like,
As the alkenyl group having 2 to 10 carbon atoms, among those exemplified as the above R 1 and the like, those having a predetermined number of carbon atoms can be mentioned.
The phenyl group, the alkyl group, the alkoxy group and the alkenyl group in the general formula (1-1) may have a substituent. Such a substituent may have the same contents as the substituent that substitutes a hydrogen atom such as an alkyl group used for R 1 and the like.
The alkyl group, alkoxy group and alkenyl group in the above R 60 may be, for example, those substituted with a halogen atom, and the position of substitution is not limited.
 上記一般式(1-3)で表される基に用いられる炭素原子数1~10のアルキル基、炭索原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基としては、上記R等として例示した内容のうち、所定の炭素原子数を満たすものが挙げられ、
 炭素原子数6~20のアリールオキシ基としては、フェニルオキシ、ナフチルオキシ、2-メチルフェニルオキシ、3-メチルフェニルオキシ、4-メチルフェニルオキシ、4-ビニルフェニル二オキシ、3-iso-プロピルフェニルオキシ、4-iso-プロピルフェニルオキシ、4-ブチルフェニルオキシ、4-tert-ブチルフェニルオキシ、4-へキシルフェニルオキシ、4-シクロヘキシルフェニルオキシ、4-オクチルフェニルオキシ、4-(2-エチルヘキシル)フェニルオキシ、2,3-ジメチルフェニルオキシ、2,4-ジメチルフェニルオキシ、2,5-ジメチルフェニルオキシ、2.6-ジメチルフェニルオキシ、3.4-ジメチルフェニルオキシ、3.5-ジメチルフェニルオキシ、2,4-ジーtert-ブチルフェニルオキシ、2,5-ジーtert-ブチルフェニルオキシ、2,6-ジーtert-ブチルフェニルオキシ、2.4-ジーtert-ペンチルフェニルオキシ、2,5-tert-アミルフェニルオキシ、4-シクロへキシルフェニルオキシ、2,4,5-トリメチルフェニルオキシ、フェロセニルオキシ等の基及びこれらの基がハロゲン原子で置換された基が奉げられ、
 炭素原子数6~20のアリールチオ基としては、上記ハロゲン原子で置換されている場合がある炭素原子数6~20のアリールオキシ基の酸素原子を硫黄原子に置換した基等が奉げられ、
 炭素原子数8~20のアリールアルケニル基としては、上記ハロゲン原子で置換されている場合がある炭素原子数6-20のアリールオキシ基の酸素原子をビニル、アリル、1-プロペニル、イソプロペニル、2-ブテニル、1,3-ブタジエニル、2-ペンテニル、2-オクテニル等のアルケニル基で置換した基等が挙げられ、
 炭素原子数2~20の複素環含有基としては、ピリジン、ピラジン、ピペリジン、ピペラジン、ピリミジン、ピリダジン、トリアジン、ヘキサヒドロトリアジン、フラン、テトラヒドロフラン、クロマン、キサンテン、チオフェン、チオフラン等の基及びこれらの基がハロゲン原子で置換された基等が挙げられる。
 なお、上記アリールオキシ基、アリールチオ基、アリールアルケニル基、複素環含有基等の各基は、置換基を有している場合があるものであり、特に断りがない限り、置換基を有していない無置換である又は置換基を有しているものである。
 このようなアリールオキシ基、アリールチオ基、アリールアルケニル基、複素環含有基等の水素原子を置換する置換基としては、R等に用いられるアルキル基等の水素原子を置換する置換基と同様の内容とすることができる。
As the alkyl group having 1 to 10 carbon atoms, the aryl group having 6 to 20 carbon atoms, and the arylalkyl group having 7 to 20 carbon atoms, which are used for the group represented by the above general formula (1-3), Among the contents exemplified as the above R 1 etc., those satisfying a predetermined number of carbon atoms are mentioned,
Examples of the aryloxy group having 6 to 20 carbon atoms include phenyloxy, naphthyloxy, 2-methylphenyloxy, 3-methylphenyloxy, 4-methylphenyloxy, 4-vinylphenyldioxy, 3-iso-propylphenyl Oxy, 4-iso-propylphenyloxy, 4-butylphenyloxy, 4-tert-butylphenyloxy, 4-hexylphenyloxy, 4-cyclohexylphenyloxy, 4-octylphenyloxy, 4- (2-ethylhexyl) Phenyloxy, 2,3-dimethylphenyloxy, 2,4-dimethylphenyloxy, 2,5-dimethylphenyloxy, 2.6-dimethylphenyloxy, 3.4-dimethylphenyloxy, 3.5-dimethylphenyloxy , 2,4-di tert-bu Rephenyloxy, 2,5-di-tert-butylphenyloxy, 2,6-di-tert-butylphenyloxy, 2.4-di-tert-pentylphenyloxy, 2,5-tert-amylphenyloxy, 4-cyclo Groups such as hexylphenyloxy, 2,4,5-trimethylphenyloxy, ferrocenyloxy and the like, and groups in which these groups are substituted with a halogen atom;
As the arylthio group having 6 to 20 carbon atoms, a group in which an oxygen atom of an aryloxy group having 6 to 20 carbon atoms which may be substituted with the above-mentioned halogen atom is substituted with a sulfur atom, etc.
As the arylalkenyl group having 8 to 20 carbon atoms, an oxygen atom of the aryloxy group having 6 to 20 carbon atoms which may be substituted by the above-mentioned halogen atom can be vinyl, allyl, 1-propenyl, isopropenyl, 2 And groups substituted with an alkenyl group such as butenyl, 1,3-butadienyl, 2-pentenyl, 2-octenyl and the like.
Examples of the heterocycle-containing group having 2 to 20 carbon atoms include pyridine, pyrazine, piperidine, piperazine, pyrimidine, pyridazine, triazine, hexahydrotriazine, furan, tetrahydrofuran, chromane, xanthene, thiophene, thiofuran and the like, and groups thereof Are groups substituted with a halogen atom.
In addition, each group such as the above aryloxy group, arylthio group, arylalkenyl group, heterocyclic group and the like may have a substituent, and unless otherwise noted, has a substituent. There are no unsubstituted or substituted ones.
Examples of the substituent that substitutes a hydrogen atom such as an aryloxy group, an arylthio group, an arylalkenyl group, and a heterocycle-containing group are the same as the substituents that substitute a hydrogen atom such as an alkyl group used for R 1 and the like. It can be content.
 上記一般式(2)で表される基におけるY11に用いられる三価の炭素原子数3~35の脂肪族炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数1~120の脂肪族炭化水素基が、Z、Z及びZで置換された三価の基が挙げられ、これらの基中のメチレン基は、-O-、-S-、-CO-、-CO-O-、-O-CO-、-SO-、-NH-又はこれらを組み合わせた基で置き換えられている場合があり、
 三価の炭素原子数6~35の芳香環含有炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数6~35の芳香環含有炭化水素基が、Z、Z及びZで置換された三価の基が挙げられ、
 三価の炭素原子数2~35の複素環含有基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数2~35の複素環含有基が、Z、Z及びZで置換された三価の基が挙げられる。
The trivalent aliphatic hydrocarbon group having 3 to 35 carbon atoms used for Y 11 in the group represented by the general formula (2) is exemplified in the description of the bonding group X in the general formula (1) Examples thereof include trivalent groups in which an aliphatic hydrocarbon group having 1 to 120 carbon atoms is substituted by Z 1 , Z 2 and Z 3 , and methylene groups in these groups are —O—, —S— , -CO-, -CO-O-, -O-CO-, -SO 2- , -NH- or a combination thereof may be substituted,
As the trivalent aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is And trivalent groups substituted with 1 , Z 2 and Z 3 ;
Examples of the trivalent heterocyclic group having 2 to 35 carbon atoms include the heterocyclic group having 2 to 35 carbon atoms exemplified in the description of the bonding group X in the above general formula (1) includes Z 1 and Z 2 and include trivalent group substituted by Z 3.
 上記一般式(2)で表される基におけるZ、Z及びZ並びにR62に用いられる炭素原子数1~35の脂肪族炭化水素基、炭素原子数6~35の芳香環含有炭化水素基及び炭素原子数2~35の複素環含有基は、上述したR53及びR54として例示した内容と同様とすることができる。 Aliphatic hydrocarbon group having 1 to 35 carbon atoms, aromatic ring-containing carbon having 6 to 35 carbon atoms, which is used for Z 1 , Z 2 and Z 3 and R 62 in the group represented by the above general formula (2) The hydrogen group and the heterocycle-containing group having 2 to 35 carbon atoms can be the same as the contents exemplified as R 53 and R 54 described above.
 上記一般式(3)で表される基におけるY12に用いられる四価の炭素原子数1~35の脂肪族炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数1~120の脂肪族炭化水素基が、Z、Z、Z及びZで置換された四価の基が挙げられ、該脂肪族炭化水素基中のメチレン基は、-O-、-S-、-CO-、-COO-、-OCO-、-NH-又はこれらを組み合わせた基で置き換えられている場合があり、
 四価の炭素原子数6~35の芳香環含有炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数6~35の芳香環含有炭化水素基が、Z、Z、Z及びZで置換された四価の基が挙げられ、
 四価の炭素原子数2~35の複素環含有基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数2~35の複素環含有基が、Z、Z、Z及びZで置換された四価の基が挙げられる。
The tetravalent aliphatic hydrocarbon group having 1 to 35 carbon atoms used for Y 12 in the group represented by the general formula (3) is exemplified in the description of the bonding group X in the general formula (1) Examples thereof include tetravalent groups in which an aliphatic hydrocarbon group having 1 to 120 carbon atoms is substituted with Z 1 , Z 2 , Z 3 and Z 4 , and a methylene group in the aliphatic hydrocarbon group is O-, -S-, -CO-, -COO-, -OCO-, -NH- or a combination of these groups may be substituted,
As the tetravalent aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is And tetravalent groups substituted with 1 , Z 2 , Z 3 and Z 4 ,
As the tetravalent heterocyclic group having 2 to 35 carbon atoms, the heterocyclic group having 2 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is exemplified by Z 1 and Z 2 , Z 3 and Z 4 substituted tetravalent groups.
 上記一般式(4)で表される基におけるY13に用いられる五価の炭素原子数2~35の脂肪族炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数1~120の脂肪族炭化水素基が、Z、Z、Z、Z及びZで置換された五価の基が挙げられ、該脂肪族炭化水素基中のメチレン基は-O-、-S-、-CO-、-CO-O-、-O-CO-、-SO-、-NH-又はこれらを組み合わせた基で置き換えられている場合があり、
 五価の炭素原子数6~35の芳香環含有炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数6~35の芳香環含有炭化水素基が、Z、Z、Z、Z及びZ5で置換された五価の基が挙げられ、
 五価の炭素原子数2~35の複素環含有基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数6~35の芳香環含有炭化水素基が、Z、Z、Z、Z及びZ5で置換された五価の基が挙げられる。
The pentavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms used for Y 13 in the group represented by the general formula (4) is exemplified in the description of the bonding group X in the general formula (1) And a pentavalent group in which the aliphatic hydrocarbon group having 1 to 120 carbon atoms is substituted with Z 1 , Z 2 , Z 3 , Z 4 and Z 5 , and a methylene group in the aliphatic hydrocarbon group. May be replaced by -O-, -S-, -CO-, -CO-O-, -O-CO-, -SO 2- , -NH- or a combination of these,
As the pentavalent aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is Z And pentavalent groups substituted with 1 , Z 2 , Z 3 , Z 4 and Z 5, and
As the pentavalent heterocyclic group having 2 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is Z 1 , The pentavalent group substituted by Z < 2 >, Z < 3 >, Z < 4 > and Z <5> is mentioned.
 上記一般式(5)におけるY14に用いられる六価の炭素原子数2~35の脂肪族炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数1~120の脂肪族炭化水素基が、Z、Z、Z、Z、Z5及びZで置換された六価の基が挙げられ、該脂肪族炭化水素基中のメチレン基は、-O-、-S-、-CO-、-COO-、-OCO-、-SO-、-NH-又はこれらを組み合わせた基で置き換えられている場合があり、
 六価の炭素原子数6~35の芳香環含有炭化水素基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数6~35の芳香環含有炭化水素基が、Z、Z、Z、Z、Z5及びZで置換された六価の基が挙げられ、
 六価の炭素原子数2~35の複素環含有基としては、上記一般式(1)における結合基Xの説明で例示した炭素原子数2~35の複素環含有基が、Z、Z、Z、Z、Z及びZで置換された六価の基が挙げられる。
The hexavalent aliphatic hydrocarbon group having 2 to 35 carbon atoms used for Y 14 in the above general formula (5) includes 1 to 8 carbon atoms exemplified in the description of the bonding group X in the above general formula (1) And a hexavalent group in which the aliphatic hydrocarbon group of 120 is substituted by Z 1 , Z 2 , Z 3 , Z 4 , Z 5 and Z 6 , and the methylene group in the aliphatic hydrocarbon group is O-, -S-, -CO-, -COO-, -OCO-, -SO 2- , -NH- or a combination of these groups may be substituted,
As the hexavalent aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is A hexavalent group substituted by 1 , Z 2 , Z 3 , Z 4 , Z 5 and Z 6 ,
As the hexavalent heterocyclic group having 2 to 35 carbon atoms, the heterocyclic group having 2 to 35 carbon atoms exemplified in the description of the bonding group X in the general formula (1) is exemplified by Z 1 and Z 2 And Z 3 , Z 4 , Z 5 and Z 6 substituted hexavalent groups.
 上記結合基Xは、mが2である場合、炭素原子数1~120の脂肪族炭化水素基を好ましく用いることができ、なかでも、炭素原子数1~10のアルキレン基又はジオールの残基であることが好ましく、特に、炭素原子数1のメチレン基等の炭素原子数1~5のアルキレン基であることが好ましく、なかでも特に、炭素原子数1~3のアルキレン基であることが好ましい。耐久性を有する硬化物の製造が容易となり、さらに化合物Aの製造が容易だからである。 When m is 2 as the bonding group X, an aliphatic hydrocarbon group having 1 to 120 carbon atoms can be preferably used, and in particular, an alkylene group having 1 to 10 carbon atoms or a residue of a diol is preferable. It is preferably an alkylene group having 1 to 5 carbon atoms such as a methylene group having 1 carbon atom, and particularly preferably an alkylene group having 1 to 3 carbon atoms. This is because the production of a cured product having durability is easy and the production of compound A is easy.
 本発明において、上記Xは、(1)mが2のとき、下記一般式(101)若しくは(102)で表される置換基又は下記群1から選ばれる基であることも好ましい。また上記Xは、(2)mが3のとき、下記群2から選ばれる基であり、(3)mが4のとき、下記群3から選ばれる基であり、(4)mが5のとき、下記群4から選ばれる基であり、(5)mが6のとき、下記群5から選ばれる基、であることが好ましい。耐久性を有する硬化物の製造が容易となり、さらに原料の入手や製造が容易であるためである。 In the present invention, when (1) m is 2, the above-mentioned X is preferably a substituent represented by the following general formula (101) or (102) or a group selected from the following group 1. The above X is a group selected from the following group 2 when (2) m is 3, and a group selected from the following group 3 when (3) m is 4, and (4) m is 5 It is preferable that it is a group selected from the following group 4 and (5) a group selected from the following group 5 when m is 6. It is because manufacture of the hardened | cured material which has durability is easy, and also acquisition and manufacture of a raw material are easy.
Figure JPOXMLDOC01-appb-C000022
Figure JPOXMLDOC01-appb-C000022
(式中、Y111及びY115は、それぞれ独立に、置換基を有している場合がある炭素原子数1~8の脂肪族炭化水素基を表し、
 Y112及びY114は、それぞれ独立に、-O-、-CO-、-CO-O-、-O-CO-、-NR13-、-CO-NR13-又は-NR13-CO-で表される基を表し、
 R13は、水素原子又は置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基を表し、
 Y113は、-CR1415-、-NR16-、二価の基であって置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基、置換基を有している場合がある炭素原子数6~35の芳香環含有炭化水素基又は下記一般式(103)で表される置換基を表し、
 R14及びR15は、それぞれ独立に、水素原子、炭素原子数1~8のアルキル基、炭素原子数6~20のアリール基又は炭素原子数7~20のアリールアルキル基を表し、
 R16は、水素原子、置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基、置換基を有している場合がある炭素原子数6~35の芳香環含有炭化水素基又は置換基を有している場合がある炭素原子数2~35の複素環含有基を表し、
 Y111、Y115、R13、Y113及びR16に用いられる脂肪族炭化水素基、芳香環含有炭化水素基及び複素環含有基中のメチレン基の1つ又は2つ以上は、-COO-、-O-、-OCO-、-NHCO-、-NH-又は-CONH-で置き換わっている場合があり、
 *は、結合箇所を表す。)
( Wherein , each of Y 111 and Y 115 independently represents an aliphatic hydrocarbon group having 1 to 8 carbon atoms which may have a substituent,
Y 112 and Y 114 each independently, -O -, - CO -, - CO-O -, - O-CO -, - NR 13 -, - CO-NR 13 - or -NR 13 -CO- in Represents a group to be represented,
R 13 represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent,
Y 113 is, -CR 14 R 15 -, - NR 16 -, a divalent a group which may have a substituent aliphatic hydrocarbon group having a carbon number of 1 to 35, have a substituent R 6 represents an aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms which may be substituted or a substituent represented by the following general formula (103):
R 14 and R 15 each independently represent a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an arylalkyl group having 7 to 20 carbon atoms,
R 16 is a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent, an aromatic ring having 6 to 35 carbon atoms which may have a substituent Represents a heterocyclic group having 2 to 35 carbon atoms which may have a hydrocarbon group or a substituent,
One or more of the aliphatic hydrocarbon group, the aromatic ring-containing hydrocarbon group, and the methylene group in the heterocycle-containing group used for Y 111 , Y 115 , R 13 , Y 113 and R 16 are —COO— , -O-, -OCO-, -NHCO-, -NH- or -CONH- in some cases,
* Represents a bonding point. )
Figure JPOXMLDOC01-appb-C000023
Figure JPOXMLDOC01-appb-C000023
(式中、Y116及びY118は、それぞれ独立に、-NR17-又はメチレン基が酸素原子で置き換わっている場合がある炭素原子数1~8の脂肪族炭化水素基を表し、
 Y117は、直接結合、-O-、-S-、-SO-、-CR1819-又は上述の(1-1)、(1-2)若しくは(1-3)で表されるいずれかの置換基を表し、
 R17は、水素原子又は置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基を表し、
 R18及びR19は、それぞれ独立に、水素原子又はハロゲン原子で置換されている場合がある炭素原子数1~8のアルキル基を表し、
 *は、結合箇所を表す。)
(Wherein, each of Y 116 and Y 118 independently represents —NR 17 — or an aliphatic hydrocarbon group having 1 to 8 carbon atoms in which a methylene group may be replaced by an oxygen atom,
Y 117 is a direct bond, -O-, -S-, -SO 2- , -CR 18 R 19 -or the above (1-1), (1-2) or (1-3) Represents any substituent,
R 17 represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent,
R 18 and R 19 each independently represent an alkyl group having 1 to 8 carbon atoms which may be substituted with a hydrogen atom or a halogen atom,
* Represents a bonding point. )
Figure JPOXMLDOC01-appb-C000024
Figure JPOXMLDOC01-appb-C000024
(式中、R31は、水素原子、置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基、置換基を有している場合がある炭素原子数6~35の芳香環含有炭化水素基又は置換基を有している場合がある炭素原子数2~35の複素環含有基を表し、
 *は、結合箇所を表す。)
(Wherein, R 31 represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent, or 6 to 35 carbon atoms which may have a substituent) Or an aromatic ring-containing hydrocarbon group or a heterocyclic ring-containing group having 2 to 35 carbon atoms which may have a substituent,
* Represents a bonding point. )
Figure JPOXMLDOC01-appb-C000025

(式中、Y119及びY120は、それぞれ独立に、置換基を有している場合がある炭素原子数1~8の脂肪族炭化水素基を表し、
 *は、結合箇所を表す。)
Figure JPOXMLDOC01-appb-C000025

(Wherein, Y 119 and Y 120 each independently represent an aliphatic hydrocarbon group having 1 to 8 carbon atoms which may have a substituent,
* Represents a bonding point. )
Figure JPOXMLDOC01-appb-C000026
Figure JPOXMLDOC01-appb-C000026
(式中、R32は、上記一般式(1)におけるR57と同じ基であり、基中に二つ以上ある場合、同じである場合も異なる場合もあり、Z11は上記一般式(2)におけるZ~Zで表される基と同じ範囲の基を表し、
 *は、結合箇所を表す。)
(Wherein, R 32 is the same group as R 57 in the above general formula (1), and when there are two or more in the group, it may be the same or different, and Z 11 may be the above general formula (2 Group in the same range as the group represented by Z 1 to Z 3 in
* Represents a bonding point. )
Figure JPOXMLDOC01-appb-C000027
Figure JPOXMLDOC01-appb-C000027
(式中、R32は、上記一般式(1)におけるR57と同じ基であり、基中に二つ以上ある場合、同じである場合も異なる場合もあり、Z11は上記一般式(2)におけるZ~Zで表される基と同じ範囲の基を表し、
 *は、結合箇所を表す。)
(Wherein, R 32 is the same group as R 57 in the above general formula (1), and when there are two or more in the group, it may be the same or different, and Z 11 may be the above general formula (2 Group in the same range as the group represented by Z 1 to Z 3 in
* Represents a bonding point. )
Figure JPOXMLDOC01-appb-C000028
Figure JPOXMLDOC01-appb-C000028
(式中、Z10、Z11、Z12、Z13及びZ14は上記一般式(2)におけるZ~Zで表される基と同じ範囲の基を表し、
 *は、結合箇所を表す。)
(Wherein, Z 10 , Z 11 , Z 12 , Z 13 and Z 14 each represent a group in the same range as the groups represented by Z 1 to Z 3 in the general formula (2),
* Represents a bonding point. )
Figure JPOXMLDOC01-appb-C000029
Figure JPOXMLDOC01-appb-C000029
(上記式中、Z10、Z11、Z12、Z13、Z14及びZ15は上記一般式(2)におけるZ~Zで表される基と同じ範囲の基を表し、
 *は、結合箇所を表す。)
(In the above formula, Z 10 , Z 11 , Z 12 , Z 13 , Z 14 and Z 15 each represent a group in the same range as the groups represented by Z 1 to Z 3 in the above general formula (2),
* Represents a bonding point. )
 なお、Y111、Y115、Y116、Y118、Y119及びY120に用いられる置換基を有している場合がある炭素原子数1~8の脂肪族炭化水素基としては、Y等に用いられる2価の置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基として例示した内容のうち、所定の炭素原子数を満たすものが挙げられる。
 上記式(101)において、Y111及びY115は、同一であっても、異なるものであってもよい。
 上記式(102)におけるY116及びY118も、上記式(103)におけるY119及びY120も、同様に、同一であっても、異なるものであってもよい。
 Y113に用いられる、二価の置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基、置換基を有している場合がある炭素原子数6~35の芳香環含有炭化水素基としては、Y等に用いられる二価の置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基、置換基を有している場合がある炭素原子数6~35の芳香環含有炭化水素基と同様の内容とすることができる。
 R13、R16、R17及びR31に用いられる置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基、置換基を有している場合がある炭素原子数6~35の芳香環含有炭化水素基及び置換基を有している場合がある炭素原子数2~35の複素環含有基としては、R53及びR54等に用いられる置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基、置換基を有している場合がある炭素原子数6~35の芳香環含有炭化水素基及び置換基を有している場合がある炭素原子数2~35の複素環含有基と同様の内容とすることができる。
 R14、R15、R18及びR19に用いられる炭素原子数1~8のアルキル基、炭素原子数6~20のアリール基及び炭素原子数7~20のアリールアルキル基としては、R等に用いられる炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基及び炭素原子数7~20のアリールアルキル基のうち所定の炭素原子数を満たすものと同様の内容とすることができる。
 上記群2及び群3の各式中に含まれる複数のZ11同士、上記群4の各式中に含まれるZ1014及び上記群5の各式中に含まれるZ10~Z15は、同一であってもよく、異なるものであってもよい。
In addition, examples of the aliphatic hydrocarbon group having 1 to 8 carbon atoms which may have a substituent used for Y 111 , Y 115 , Y 116 , Y 118 , Y 119 and Y 120 include Y 1 and the like. Among the contents exemplified as the aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a divalent substituent used in the above, one having a predetermined number of carbon atoms can be mentioned.
In the above formula (101), Y 111 and Y 115 may be the same or different.
Similarly, Y 116 and Y 118 in the above formula (102) and Y 119 and Y 120 in the above formula (103) may be identical to or different from each other.
An aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a divalent substituent and an aromatic having 6 to 35 carbon atoms which may have a substituent, which may be used for Y 113 The ring-containing hydrocarbon group may have a substituted or unsubstituted aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a divalent substituent used for Y 1 or the like. The same content as the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms can be used.
Aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent used for R 13 , R 16 , R 17 and R 31 , and carbon atom number which may have a substituent The aromatic ring-containing hydrocarbon group having 6 to 35 and the heterocyclic ring-containing group having 2 to 35 carbon atoms which may have a substituent include substituents used for R 53 and R 54 and the like The aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have, the aromatic ring-containing hydrocarbon group having 6 to 35 carbon atoms which may have a substituent, and the substituent may be The content may be similar to that of a heterocyclic group having a carbon number of 2 to 35.
Examples of the alkyl group having 1 to 8 carbon atoms, the aryl group having 6 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms used for R 14 , R 15 , R 18 and R 19 include R 1 and the like The same contents as those satisfying the predetermined number of carbon atoms among the alkyl group having 1 to 40 carbon atoms, the aryl group having 6 to 20 carbon atoms and the arylalkyl group having 7 to 20 carbon atoms used for Can.
A plurality of Z 11 each other included in each equation of the group 2 and group 3, Z 10 ~ Z 15 contained in the formula of Z 10 ~ 14 and the group 5 included in each equation of the group 4 , May be identical or different.
 上記結合基Xのベンゼン環との結合位置としては、ベンゼン環内の結合し得るいずれの位置であってもよいが、例えば、-O-Rの結合位置に対して、オルト位又はメタ位であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。 The bonding position of the bonding group X to the benzene ring may be any bondable position within the benzene ring, for example, the ortho position or the meta position relative to the bonding position of -O-R 9 Is preferred. It is because manufacture of the hardened | cured material which has durability becomes easy.
 上記Xa1は、m1=1のとき、水素原子又はRと同様の基であることが好ましい。
 上記Xa2は、m2=1のとき、水素原子又はRと同様の基であることが好ましい。
The Xa1, when the m1 = 1, is preferably the same group as a hydrogen atom or an R 4.
The Xa2, when the m @ 2 = 1, is preferably the same group as a hydrogen atom or R 6.
 上記化合物Aの具体例としては、具体的には、下記で表される化合物のように、国際公開第2014/021023号に具体的に記載された化合物等を挙げることができる。 Specific examples of the compound A include the compounds specifically described in WO 2014/021023, such as the compounds represented below.
Figure JPOXMLDOC01-appb-C000030
Figure JPOXMLDOC01-appb-C000030
 上記化合物Aは、保護基Rにより保護されていないフェノール性水酸基を含むものであってもよいが、上記化合物Aに含まれるフェノール性水酸基の数は2個以下であることが好ましく、0個であることが好ましい。上記化合物Aは、硬化阻害の発生を抑制できるからである。 Although the compound A may contain a phenolic hydroxyl group not protected by the protecting group R 9 , the number of phenolic hydroxyl groups contained in the compound A is preferably 2 or less, and 0 Is preferred. It is because the said compound A can suppress generation | occurrence | production of hardening inhibition.
 上記化合物Aの分子量としては、化合物Aの用途等に応じて設定することができる。
 上記分子量は、例えば、250以上5000以下とすることができ、300以上2500以下とすることができ、350以上1500以下とすることができる。
 なお、上記分子量は、化合物Aがその構造として繰り返し構造を含む重合体である場合には、重量平均分子量(Mw)で表すものとすることができる。
 以下、重量平均分子量(Mw)は、ゲル・パーミエーション・クロマトグラフィー(GPC)により、標準ポリスチレン換算値として求めることができる。
 上記重量平均分子量Mwは、例えば、東ソー(株)製のHLC-8120GPCを用い、溶出溶剤を0.01モル/リットルの臭化リチウムを添加したN-メチルピロリドンとし、校正曲線用ポリスチレンスタンダードをMw377400、210500、96000、50400、20650、10850、5460、2930、1300、580(以上、Polymer Laboratories社製 Easi PS-2シリーズ)及びMw1090000(東ソー(株)製)とし、測定カラムをTSK-GEL ALPHA-M×2本(東ソー(株)製)として測定して得ることができる。
 また、測定温度は40℃とすることができ、流速は1.0mL/分とすることができる。
The molecular weight of the compound A can be set according to the application of the compound A and the like.
The molecular weight can be, for example, 250 or more and 5000 or less, can be 300 or more and 2500 or less, and can be 350 or more and 1500 or less.
In addition, the said molecular weight can be represented by a weight average molecular weight (Mw), when the compound A is a polymer which contains a repeating structure as the structure.
The weight average molecular weight (Mw) can be determined as a standard polystyrene equivalent value by gel permeation chromatography (GPC).
The weight average molecular weight Mw is, for example, HLC-8120 GPC manufactured by Tosoh Corp., and the elution solvent is N-methylpyrrolidone to which 0.01 mol / liter of lithium bromide is added, and the polystyrene standard for calibration curve is Mw 377400 210500, 96000, 50400, 20650, 10850, 5460, 2930, 1300, 580 (above, Easi PS-2 series manufactured by Polymer Laboratories) and Mw 1090000 (manufactured by Tosoh Corp.), and the measurement column is TSK-GEL ALPHA- It can be obtained by measurement as M × 2 (made by Tosoh Corp.).
Also, the measurement temperature can be 40 ° C., and the flow rate can be 1.0 mL / min.
 上記化合物Aの製造方法は、所望の構造を得ることができる方法であれば特に限定されないが、例えば、国際公開第2014/021023号に記載の方法と同様の方法とすることができる。 Although the manufacturing method of the said compound A will not be specifically limited if it is a method which can obtain a desired structure, For example, it can be made into the method similar to the method as described in WO 2014/021023.
3.化合物B
 上記化合物Bは、上記一般式(B)で表されるものである。
 また、上記化合物Bは、フェノール性水酸基が保護基R11により保護された構造を有し、上記保護基R11の脱離後に、酸化防止能を有するものとすることができる。
 酸化防止能を有するとは、より具体的には、上記保護基R11の脱離後に、物質の熱や光、その他エネルギーによる酸化を抑制する機能を有し、ラジカル捕捉作用を有するものとすることができる。
3. Compound B
The compound B is represented by the general formula (B).
Further, the compound B has a phenolic hydroxyl group is protected by a protecting group R 11 structure, after elimination of the protective group R 11, can be assumed to have antioxidant ability.
More specifically, having the ability to prevent oxidation means that it has a function of suppressing oxidation by heat, light and other energy of the substance after elimination of the above-mentioned protecting group R 11 and has a radical scavenging action. be able to.
 上記化合物Bは、上記保護基R11の脱離後と比較して、ラジカル捕捉作用が低いものである。
 上記化合物Bは、上記保護基R11の脱離後と比較して、ラジカル捕捉作用が低く、光硬化性組成物の露光前後の残膜率(%)が高いものとすることができる。
 上記化合物Bの、上記保護基R11の脱離後のものとの残膜率の差(%)は、0.1%より大きいものであればよいが、1.0%以上とすることができ、5.0%以上であることが好ましく、なかでも、10%以上であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。
 なお、残膜率(%)は、光硬化性組成物に対して、露光前の膜厚に対する露光後及び現像後の膜厚(露光後及び現像後膜厚/露光前膜厚×100(%))から求めることができる。
 上記光硬化性組成物としては、ラジカル重合性化合物及び光ラジカル重合開始剤と、化合物B又は保護基R11の脱離後の化合物と、を含むものとすることができ、例えば、後述する実施例の項に記載の比較例2又は比較例4の配合と同様とすることができる。
 また、残膜率の測定方法は、例えば、後述する実施例記載の「1.感度評価1」の方法を用いることができる。
The compound B, as compared to after elimination of the protective group R 11, those radicals scavenging is low.
The compound B, as compared to after elimination of the protective group R 11, low radical scavenging action, residual film ratio before and after exposure of the photocurable composition (%) can be high.
The difference (%) in residual film ratio between the compound B and the compound after removal of the protective group R 11 may be at least 0.1%, but may be 1.0% or more. And preferably 5.0% or more, and more preferably 10% or more. It is because manufacture of the hardened | cured material which has durability becomes easy.
The residual film ratio (%) is the film thickness after exposure and development with respect to the film thickness before exposure relative to the photocurable composition (film thickness after exposure and film thickness after exposure / film thickness before exposure × 100 (% Can be obtained from
The photocurable composition can include a radically polymerizable compound, a radical photopolymerization initiator, and a compound after elimination of the compound B or the protective group R 11 , for example, as described in Examples to be described later. It can be made to be the same as the composition of Comparative Example 2 or Comparative Example 4 described in the section.
Further, as a method of measuring the residual film rate, for example, the method of “1. sensitivity evaluation 1” described in the embodiment described later can be used.
 上記化合物Bは、加熱により保護基R11が脱離するものとすることができる。
 上記化合物Bに含まれる保護基R11が脱離する温度は、例えば、上記「2.化合物A」の項に記載の内容と同様とすることができる。
The compound B can be such that the protective group R 11 is released by heating.
The temperature at which the protecting group R 11 contained in the compound B is eliminated may be, for example, the same as the contents described in the section “2. Compound A”.
 上記R11に用いられる炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又はトリアルキルシリル基の例としては、上記「2.化合物A」の項においてRで表される基として上述したものと同様のものが挙げられる。
 上記R12、R13及びR14に用いられる炭素原子数1~40のアルキル基、R14で表される炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基としては、上記「2.化合物A」の項において、R等として例示した内容と同様とすることができる。
 R11、R12、R13及びR14として表される各基におけるメチレン基を置き換えてもよい-NR'-におけるR'で表される炭素原子数1~8のアルキル基としては、上記「2.化合物A」の項において、R'として例示した内容と同様とすることができる。
The alkyl group having 1 to 20 carbon atoms, the alkenyl group having 2 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms, the arylalkyl group having 7 to 20 carbon atoms, and the number of carbon atoms used for R 11 Examples of the heterocycle-containing group or trialkylsilyl group of 2 to 20 include the same ones as described above as the group represented by R 9 in the section of “2. Compound A” above.
The alkyl group having 1 to 40 carbon atoms used for R 12 , R 13 and R 14 , the aryl group having 6 to 20 carbon atoms represented by R 14 , the arylalkyl group having 7 to 20 carbon atoms, carbon The heterocycle-containing group having 2 to 20 atoms can be the same as the contents exemplified as R 1 and the like in the section of “2. Compound A” above.
Examples of the alkyl group having 1 to 8 carbon atoms represented by R ′ in —NR′— which may replace a methylene group in each group represented as R 11 , R 12 , R 13 and R 14 include the above “ 2. In the section of Compound A, the same contents as exemplified as R ′ can be used.
 上記R11は、フェノール性水酸基を保護するものである。
 このようなR11としては、上記「2.化合物A」の項に記載のRと同様とすることができる。
The above R 11 protects the phenolic hydroxyl group.
Such R 11 can be the same as R 9 described in the section “2. Compound A” above.
 上記R12及びR13は、水素原子、炭素原子数1~10のアルキル基であることが好ましく、なかでも、置換基を有していない炭素原子数1~10のアルキル基であることが好ましく、特に、R12及びR13の何れか一方又は両方が-Cで表される基であることが好ましく、中でも特にR12及びR13の何れか一方又は両方がtert-ブチル基であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。
 上記R12及びR13は、少なくとも一方が、炭素原子数1~40のアルキル基であることが好ましく、なかでも、R12及びR13の両者が、炭素原子数1~40のアルキル基であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。
 上記R12及びR13の両者は、例えば、tert-ブチル基等の置換基を有していない炭素原子数1~10のアルキル基であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。
R 12 and R 13 are preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 10 carbon atoms having no substituent. , in particular, it is preferred that either or both of R 12 and R 13 is a group represented by -C 4 H 9, among others in either or both of tert- butyl group R 12 and R 13 Is preferred. It is because manufacture of the hardened | cured material which has durability becomes easy.
At least one of R 12 and R 13 is preferably an alkyl group having 1 to 40 carbon atoms, and in particular, both R 12 and R 13 are an alkyl group having 1 to 40 carbon atoms. Is preferred. It is because manufacture of the hardened | cured material which has durability becomes easy.
Both of R 12 and R 13 are preferably, for example, an alkyl group having 1 to 10 carbon atoms which does not have a substituent such as a tert-butyl group. It is because manufacture of the hardened | cured material which has durability becomes easy.
 上記R14としては、炭素原子数1~40のアルキル基であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。 The R 14 is preferably an alkyl group having 1 to 40 carbon atoms. It is because manufacture of the hardened | cured material which has durability becomes easy.
 上記nは、1~10の整数であるが、合成の容易さの観点からは、2~6の整数であることが好ましく、なかでも、3~5の整数であることが好ましい。耐久性に優れた硬化物を得ることが容易となるからである。 The above n is an integer of 1 to 10, but is preferably an integer of 2 to 6 and more preferably an integer of 3 to 5 from the viewpoint of easiness of synthesis. It is because it becomes easy to obtain the hardened | cured material excellent in durability.
 上記b1は、0~2の整数であるが、耐久性を有する硬化物の製造が容易となり、さらに合成の容易さの観点から、0~1であることが好ましい。 The above b1 is an integer of 0 to 2, but it is preferably 0 to 1 from the viewpoint of easiness of synthesis because it facilitates the production of a cured product having durability.
 上記化合物Bは、Xで表されるn価の特定の原子及びn個の特定の基が結合した構造を有する。このn個の特定の基は、互いに同じであるか又は異なる。 The compound B has a structure in which a specific n-valent atom represented by X b and n specific groups are bonded. The n specific groups are identical to or different from one another.
 上記結合基Xは、n価の結合基を表すものである。
 このような結合基Xとしては、上記「2.化合物A」の項に記載の結合基Xと同様の内容とすることができる。
 上記結合基Xは、例えば、nが4である場合、上記一般式(3)で表される基であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。
 上記一般式(3)中のY12は、炭素原子又は四価の炭素原子数1~35の脂肪族炭化水素基であることが好ましく、なかでも、炭素原子であることが好ましい。耐久性を有する硬化物の製造が容易となるからである。
 上記一般式(3)中のZ~Zは、-O-、-S-、>CO、-CO-O-、-O-CO-、-SO-、-SS-、-SO-、>NR62、PR62、炭素原子数1~35の脂肪族炭化水素基であることが好ましく、炭素原子数1~35の脂肪族炭化水素基であることが好ましく、メチレン基が-COO-、-O-、-OCO-、-NHCO-、-NH-又は-CONH-で置き換わっている、炭素原子数1~40の脂肪族炭化水素基であることが好ましく、Y12側の末端のメチレン基が-COO-又は-OCO-で置き換わっている置換基を有していない炭素原子数1~40の脂肪族炭化水素基も好ましく用いることができ、なかでも、Y12側の末端のメチレン基が-COO-又は-OCO-で置き換わっている置換基を有していない炭素原子数1~10の脂肪族炭化水素基であることが好ましい。耐久性を有する硬化物の製造が容易となるり、さらに、化合物Bの製造が容易だからである。
The bonding group X b represents an n-valent bonding group.
As such a linking group X b , the same contents as those of the linking group X described in the above “2. Compound A” can be used.
The bonding group X b is preferably a group represented by the above general formula (3), for example, when n is 4. It is because manufacture of the hardened | cured material which has durability becomes easy.
Y 12 in the general formula (3) is preferably a carbon atom or a tetravalent aliphatic hydrocarbon group having 1 to 35 carbon atoms, and more preferably a carbon atom. It is because manufacture of the hardened | cured material which has durability becomes easy.
Z 1 to Z 4 in the above general formula (3) are -O-, -S-,> CO, -CO-O-, -O-CO-, -SO 2- , -SS-, -SO- > NR 62 , PR 62 and is preferably an aliphatic hydrocarbon group having 1 to 35 carbon atoms, more preferably an aliphatic hydrocarbon group having 1 to 35 carbon atoms, and the methylene group is —COO— It is preferable that it is a C1-C40 aliphatic hydrocarbon group which is substituted by -O-, -OCO-, -NHCO-, -NH- or -CONH-, and the methylene at the terminal of Y 12 side An aliphatic hydrocarbon group having 1 to 40 carbon atoms which does not have a substituent in which the group is replaced by -COO- or -OCO- can also be preferably used, and among them, a methylene group at the terminal of Y 12 side Is substituted by -COO- or -OCO- A it is preferably to 1 to 10 carbon atoms is not aliphatic hydrocarbon group. This is because the production of a cured product having durability is easy, and furthermore, the production of compound B is easy.
 本発明においては、nが2である場合、X基は、上記一般式(101)で表される基であることが好ましい。
 上記一般式(101)中、Y111は、置換基を有している場合がある炭素原子数1~3の脂肪族炭化水素基であることが好ましく、なかでも、無置換の炭素原子数1~3のアルキレン基であることが好ましい。
 上記一般式(101)中、Y112は-O-又は-CO-O-であることが好ましく、Y114は、-O-又は-O-CO-であることが好ましい。
 上記一般式(101)中、Y113は、一般式(103)で表される基であることが好ましい。
 上記一般式(103)中、Y119及びY120は、置換基を有している場合がある炭素原子数1~5の脂肪族炭化水素基であることが好ましく、なかでも、炭素原子数2~5の直鎖又は分岐のアルキレン基であることが好ましい。
 本発明においては、nが2である場合、X基は、上記一般式(102)で表される基も好ましく用いることができる。
 上記一般式(102)中、Y117は、-CR1819-であることが好ましく、なかでも、R18及びR19が水素原子又は炭素原子数1~4の脂肪族炭化水素基であることが好ましく、R18が水素原子で、R19が、炭素原子数1~4の脂肪族炭化水素基であることが好ましい。
 本発明においては、nが3である場合、X基は、群2中の(II-2)、(II-3)又は(II-6)で表される基であることが好ましい。
 一般式(II-2)、(II-3)及び(II-6)中、Z11は、直接結合又は置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基であることが好ましく、直接結合又は無置換の炭素原子数1~5のアルキレン基であることが好ましい。
 一般式(II-2)、(II-3)及び(II-6)中、各式に含まれる複数のZ11は、同一であってもよく、異なるものであってもよい。
 なかでも本発明においては、一般式(II-2)中の3つのZ11のうち、少なくとも1つが直接結合であり、少なくとも1つが無置換の炭素原子数1~5のアルキレン基であることが好ましい。また、一般式(II-3)及び(II-6)中、Z11の全てが、無置換の炭素原子数1~5のアルキル基であることが好ましい。
 一般式(II-2)及び(II-3)中、R32は、水素原子又は置換基を有している場合がある炭素原子数1~35の脂肪族炭化水素基であることが好ましく、なかでも、水素原子又は置換基を有している場合がある炭素原子数1~5の脂肪族炭化水素基であることが好ましく、特に、水素原子であることが好ましい。
 本発明においては、nが4である場合、上述した好ましい基に替えて、又は加えて、X基は、群3中の(III-1)で表される基であることが好ましい。一般式(III-1)中、Z11は、置換基を有している場合があり、メチレン基が炭素-炭素二重結合、-O-、-CO-、-O-CO-、-CO-O-又は-SO-で置き換わっている場合がある炭素原子数1~35の脂肪族炭化水素基であることが好ましく、メチレン基が、-O-CO-又は-CO-O-で置き換わっている炭素原子数1~5のアルキレン基であることが好ましい。
 X基が上述の基であることで、上記化合物Bは、保護基R102の脱離後に、安定的に酸化防止能を発揮可能となるからである。またその結果、耐久性を有する硬化物の製造が容易となるからである。
In the present invention, when n is 2, the X b group is preferably a group represented by the above general formula (101).
In the above general formula (101), Y 111 is preferably an aliphatic hydrocarbon group having 1 to 3 carbon atoms which may have a substituent, and in particular, one or more unsubstituted carbon atoms may be substituted. It is preferable that it is an alkylene group of -3.
In the above general formula (101), Y 112 is preferably -O- or -CO-O-, and Y 114 is preferably -O- or -O-CO-.
In the general formula (101), Y 113 is preferably a group represented by the general formula (103).
In the above general formula (103), Y 119 and Y 120 are preferably aliphatic hydrocarbon groups having 1 to 5 carbon atoms which may have a substituent, and in particular, 2 or more carbon atoms It is preferably a linear or branched alkylene group of -5.
In the present invention, when n is 2, as the X b group, a group represented by the above general formula (102) can also be preferably used.
In the general formula (102), Y 117 is, -CR 18 R 19 - is preferably, among others, an aliphatic hydrocarbon group of R 18 and R 19 is a hydrogen atom or 1 to 4 carbon atoms It is preferable that R 18 be a hydrogen atom, and R 19 be an aliphatic hydrocarbon group having 1 to 4 carbon atoms.
In the present invention, when n is 3, the group X b is preferably a group represented by (II-2), (II-3) or (II-6) in group 2.
In the general formulas (II-2), (II-3) and (II-6), Z 11 is a direct bond or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent And is preferably a direct bond or an unsubstituted C 1 -C 5 alkylene group.
In the general formulas (II-2), (II-3) and (II-6), a plurality of Z 11 included in each formula may be the same or different.
Among them, in the present invention, at least one of three Z 11 in the general formula (II-2) is a direct bond, and at least one is an unsubstituted alkylene group having 1 to 5 carbon atoms preferable. In general formulas (II-3) and (II-6), it is preferable that all of Z 11 be unsubstituted alkyl groups having 1 to 5 carbon atoms.
In formulas (II-2) and (II-3), R 32 is preferably a hydrogen atom or an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may have a substituent, Among them, a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms which may have a substituent is preferable, and a hydrogen atom is particularly preferable.
In the present invention, when n is 4, it is preferable that the group X b be a group represented by (III-1) in group 3, instead of or in addition to the above-mentioned preferable group. In the general formula (III-1), Z 11 may have a substituent, and the methylene group is a carbon-carbon double bond, -O-, -CO-, -O-CO-, -CO It is preferably an aliphatic hydrocarbon group having 1 to 35 carbon atoms which may be substituted by -O- or -SO 2- , and the methylene group is substituted by -O-CO- or -CO-O-. Preferably, it is an alkylene group having 1 to 5 carbon atoms.
When the X b group is the above-mentioned group, the compound B can stably exhibit the antioxidant ability after the removal of the protecting group R 102 . Moreover, as a result, it is because manufacture of the hardened | cured material which has durability becomes easy.
 上記結合基Xのベンゼン環との結合位置は、ベンゼン環内の結合し得るいずれの位置であってもよいが、例えば、上記R11-O-の結合位置に対して、パラ位であることが好ましい。上記結合位置が上述の位置であることで、上記化合物Bは、保護基R11の脱離前後で、酸化防止能の変化が大きいものとなるからである。 The bonding position of the bonding group X b to the benzene ring may be any bondable position within the benzene ring, and for example, it is para to the bonding position of R 11 -O-. Is preferred. By the coupling position is the position described above, the compound B is a leaving before and after the protective group R 11, because becomes large changes in antioxidant capacity.
 上記Xは、n=1の場合、水素原子又はR14と同様の基であることが好ましい。 The above X b is preferably a hydrogen atom or a group similar to R 14 when n = 1.
 上記化合物Bの具体例としては、具体的には、下記で表される化合物のように、国際公開第2014/021023号に具体的に記載された化合物等を挙げることができる。 Specific examples of the compound B include the compounds specifically described in WO 2014/021023, such as the compounds represented below.
Figure JPOXMLDOC01-appb-C000031
Figure JPOXMLDOC01-appb-C000031
 上記化合物Bに含まれるフェノール性水酸基の数、分子量及び製造方法等としては、上記「2.化合物A」の項に記載の内容と同様とすることができる。 The number, molecular weight, production method and the like of the phenolic hydroxyl group contained in the compound B can be the same as the contents described in the section of “2. Compound A”.
4.樹脂成分
 上記組成物は、樹脂成分を含むことができる。
 このような樹脂成分としては、上記化合物A及びBを保持できるものとすることができ、組成物の用途等に応じて適宜設定されるものであるが、例えば、重合性基を有する重合性化合物、重合性基を有しない重合体等を挙げることができ、なかでも、重合性化合物を含むことが好ましい。上記組成物は、硬化物の製造が容易であるとの効果をより効果的に発揮できるからである。
 具体的には、上記組成物は、照射された光の吸収が少ない化合物Aを含むことで、硬化物の製造が容易であるとの効果をより効果的に発揮できるからである。
 また、上記樹脂成分として重合性化合物を含むことにより、上記組成物は、例えば、光硬化性組成物、熱硬化性組成物等として用いることができるからである。
4. Resin Component The above composition can contain a resin component.
As such a resin component, the above-mentioned compounds A and B can be held, and it is suitably set according to the use etc. of a composition. And polymers having no polymerizable group, and the like, and among them, it is preferable to contain a polymerizable compound. It is because the said composition can exhibit the effect that manufacture of hardened | cured material is easy more effectively.
Specifically, the composition described above is able to more effectively exhibit the effect of facilitating the production of a cured product by containing the compound A having a small absorption of the irradiated light.
Moreover, it is because the said composition can be used as a photocurable composition, a thermosetting composition, etc., for example by including a polymeric compound as said resin component.
(1)重合性化合物
 上記重合性化合物は、重合体を形成可能なものであればよく、通常、重合性基を有するものである。
 このような重合性化合物は、重合性基の種類、すなわち、重合反応の種類により異なるものであり、例えば、ラジカル重合性化合物、カチオン重合性化合物、アニオン重合性化合物等を挙げることができ、なかでも、ラジカル重合性化合物を含むことが好ましい。上記組成物は、硬化物の製造が容易であるとの効果をより効果的に発揮できるからである。
 具体的には、上記組成物は、ラジカルの補足作用が抑制された化合物Bを含むことで、硬化物の製造が容易であるとの効果をより効果的に発揮できるからである。
(1) Polymerizable Compound The above-mentioned polymerizable compound may be any one capable of forming a polymer, and usually has a polymerizable group.
Such polymerizable compounds differ depending on the type of polymerizable group, that is, the type of polymerization reaction, and examples thereof include radically polymerizable compounds, cationically polymerizable compounds, anionically polymerizable compounds, etc. However, it is preferable to include a radically polymerizable compound. It is because the said composition can exhibit the effect that manufacture of hardened | cured material is easy more effectively.
Specifically, the above composition is capable of more effectively exerting the effect that the production of a cured product is easy by containing the compound B in which the radical supplementing action is suppressed.
(a)ラジカル重合性化合物
 上記ラジカル重合性化合物は、ラジカル重合可能な重合性基を1以上有するものであればよく、2以上含むものであってもよい。
 上記ラジカル重合性化合物は、通常、ラジカル重合開始剤と共に用いられるものである。
 ラジカル重合可能な重合性基としては、例えば、(メタ)アクリル基、ビニル基等のエチレン性不飽和二重結合基を挙げることができる。
 なお、(メタ)アクリルは、アクリル及びメタクリルを含む意味で用いるものである。また、(メタ)アクリレートは、アクリレート及びメタクリレートを含む意味で用いるものである。
(A) Radically Polymerizable Compound The radically polymerizable compound may have one or more radically polymerizable group and may contain two or more radically polymerizable group.
The above-mentioned radical polymerizable compound is usually used together with a radical polymerization initiator.
As a radically polymerizable polymerizable group, ethylenic unsaturated double bond groups, such as a (meth) acryl group and a vinyl group, can be mentioned, for example.
In addition, (meth) acryl is used by the meaning containing an acryl and methacryl. Also, (meth) acrylate is used in the meaning including acrylate and methacrylate.
 また、ラジカル重合性化合物としては、酸価を有する化合物であってもよく、酸価を有しない化合物であってもよい。
 酸価を有する化合物としては、例えば、カルボキシル基を有する化合物等を挙げることができる。
 上記組成物は、ラジカル重合性化合物として酸価を有する化合物を含むことにより、例えば、光照射部位のアルカリ現像液への溶解性が低下する。このため、上記組成物は、例えば、アルカリ現像液等の溶媒への溶解性が光照射前後で変化する感光性組成物として用いることができる。より具体的には、上記組成物は、酸価を有する化合物を含むことで、ネガ型組成物として用いることができる。
 アルカリ現像液としては、テトラメチルアンモニウムヒドロキシド(TMAH)水溶液や、水酸化カリウム水溶液等のアルカリ現像液として一般的に使用されているものを用いることができる。
The radically polymerizable compound may be a compound having an acid value, or may be a compound having no acid value.
As a compound which has an acid value, the compound etc. which have a carboxyl group can be mentioned, for example.
By containing the compound which has an acid value as a radically polymerizable compound, the said composition reduces the solubility to the alkali developing solution of a light irradiation site | part, for example. Therefore, the composition can be used, for example, as a photosensitive composition whose solubility in a solvent such as an alkaline developer changes before and after light irradiation. More specifically, the above-mentioned composition can be used as a negative working composition by including a compound having an acid value.
As an alkali developing solution, what is generally used as alkali developing solutions, such as tetramethyl ammonium hydroxide (TMAH) aqueous solution and potassium hydroxide aqueous solution, can be used.
 上記ラジカル重合性化合物のうち、例えば、エチレン性不飽和二重結合基を有し、酸価を有する化合物としては、(メタ)アクリル酸、α―クロルアクリル酸、イタコン酸、マレイン酸、シトラコン酸、フマル酸、ハイミック酸、クロトン酸、イソクロトン酸、ビニル酢酸、アリル酢酸、桂皮酸、ソルビン酸、メサコン酸、コハク酸モノ[2-(メタ)アクリロイロキシエチル]、フタル酸モノ[2-(メタ)アクリロイロキシエチル]、ω-カルボキシポリカプロラクトンモノ(メタ)アクリレート等の両末端にカルボキシ基と水酸基とを有するポリマーのモノ(メタ)アクリレート、ヒドロキシエチル(メタ)アクリレート・マレート、ヒドロキシプロピル(メタ)アクリレート・マレート、ジシクロペンタジエン・マレート或いは1個のカルボキシル基と2個以上の(メタ)アクリロイル基とを有する多官能(メタ)アクリレート等の不飽和多塩基酸;フェノール及び/又はクレゾールノボラックエポキシ樹脂、ビフェニル骨格、ナフタレン骨格を有するノボラックエポキシ樹脂、ビスフェノールAノボラック型エポキシ化合物、ジシクロペンタジエンノボラック型エポキシ化合物等のノボラック型エポキシ化合物、多官能エポキシ基を有するポリフェニルメタン型エポキシ樹脂、下記一般式(III)で表されるエポキシ化合物等のエポキシ樹脂のエポキシ基に不飽和一塩基酸を作用させた樹脂、下記一般式(III)で表されるエポキシ化合物等のエポキシ樹脂のエポキシ基に不飽和一塩基酸を作用させ、更に多塩基酸無水物を作用させて得られた樹脂、ペンタエリスリトールトリアクリレート、ジペンタエリスリトールペンタアクリレート等の水酸基含有多官能アクリレートと無水コハク酸、無水フタル酸、テトラヒドロ無水フタル酸等の二塩基酸無水物の反応物である酸価を有する多官能アクリレート等が挙げられる。 Among the above radical polymerizable compounds, for example, compounds having an ethylenically unsaturated double bond group and having an acid value include (meth) acrylic acid, α-chloroacrylic acid, itaconic acid, maleic acid, citraconic acid , Fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinyl acetate, allyl acetate, cinnamic acid, sorbic acid, sorbic acid, mesaconic acid, mono [2- (meth) acryloyloxyethyl] succinate, mono [2- (phthalate) Mono (meth) acrylate, hydroxyethyl (meth) acrylate malate, hydroxypropyl (meth) acryloyloxy ethyl ester], ω-carboxy polycaprolactone mono (meth) acrylate, and other polymers having a carboxy group and a hydroxyl group at both ends Meta) acrylate malate, dicyclopentadiene malate or one Unsaturated polybasic acids such as polyfunctional (meth) acrylates having a ruboxyl group and two or more (meth) acryloyl groups; phenol and / or cresol novolac epoxy resin, novolac epoxy resin having a biphenyl skeleton and a naphthalene skeleton, bisphenol Anovolak type epoxy compounds, novolac type epoxy compounds such as dicyclopentadiene novolac type epoxy compounds, polyphenylmethane type epoxy resins having a multifunctional epoxy group, epoxy resins such as epoxy compounds represented by the following general formula (III) An epoxy group of an epoxy resin such as a resin obtained by reacting an unsaturated monobasic acid with an epoxy group or an epoxy compound represented by the following general formula (III) is reacted with an unsaturated monobasic acid, and a polybasic acid anhydride is further Resin obtained by reaction, pentaerythritol Examples include polyfunctional acrylates having an acid value, which are reaction products of hydroxyl group-containing polyfunctional acrylates such as triacrylate and dipentaerythritol pentaacrylate and dibasic acid anhydrides such as succinic anhydride, phthalic anhydride and tetrahydrophthalic anhydride. Be
Figure JPOXMLDOC01-appb-C000032
Figure JPOXMLDOC01-appb-C000032
(式中、X41は直接結合、炭素原子数1~4のアルキリデン基、炭素原子数3~20の脂環式炭化水素基、-O-、-S-、-SO-、-SS-、-SO-、-CO-、-OCO-又は上記(1-1)~(1-3)で表される置換基を表し、
41、R42、R44及びR44は、それぞれ独立に、水素原子、炭素原子数1~5のアルキル基、炭素原子数1~8のアルコキシ基、炭素原子数2~5のアルケニル基又はハロゲン原子を表し、
dは0~10の整数である。)
(Wherein, X 41 represents a direct bond, an alkylidene group having 1 to 4 carbon atoms, an alicyclic hydrocarbon group having 3 to 20 carbon atoms, -O-, -S-, -SO 2- , -SS- Or —SO—, —CO—, —OCO— or a substituent represented by (1-1) to (1-3) above,
R 41 , R 42 , R 44 and R 44 each independently represent a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 8 carbon atoms, an alkenyl group having 2 to 5 carbon atoms or Represents a halogen atom,
d is an integer of 0 to 10; )
 上記炭素原子数1~5のアルキル基及び炭素原子数1~8のアルコキシ基及び炭素原子数2~5のアルケニル基としては、上記「2.化合物A」の項にR等として例示したもののうち、所定の炭素原子数を満たすものを挙げることができる。
 上記炭素原子数1~4のアルキリデン基としては、例えば、メチリデン、エチリデン、プロピリデン、ブチリデン等を挙げることができる。
 上記脂環式炭化水素基としては、シクロプロピル、シクロペンチル、シクロヘキシル、シクロヘプチル等が挙げられる。
 なお、上記アルキル基、アルコキシ基、アルケニル基、アルキリデン基、脂環式炭化水素基等は、置換基を有している場合があるものであり、特に断りがない限り、置換基を有していない無置換である又は置換基を有しているものである。
Examples of the alkyl group having 1 to 5 carbon atoms, the alkoxy group having 1 to 8 carbon atoms, and the alkenyl group having 2 to 5 carbon atoms include those exemplified as R 1 and the like in the section of “2. Compound A”. Among them, those having a predetermined number of carbon atoms can be mentioned.
Examples of the alkylidene group having 1 to 4 carbon atoms include methylidene, ethylidene, propylidene and butylidene.
Examples of the alicyclic hydrocarbon group include cyclopropyl, cyclopentyl, cyclohexyl, cycloheptyl and the like.
The above-mentioned alkyl group, alkoxy group, alkenyl group, alkylidene group, alicyclic hydrocarbon group etc. may have a substituent, and unless otherwise noted, has a substituent. There are no unsubstituted or substituted ones.
 上記酸価を有する化合物の含有量としては、組成物の用途等に応じて適宜設定できるが、例えば、樹脂成分100質量部に対して、30質量部以上90質量部以下とすることができ、35質量部以上70質量部以下であることが好ましく、なかでも、40質量部以上60質量部以下であることが好ましい。上記含有量が上述の範囲であることで、例えば、上記組成物は、感度に優れたネガ型組成物として用いることができるからである。 The content of the compound having an acid value can be appropriately set according to the application of the composition, etc., but can be, for example, 30 parts by mass or more and 90 parts by mass or less with respect to 100 parts by mass of the resin component The content is preferably 35 parts by mass or more and 70 parts by mass or less, and particularly preferably 40 parts by mass or more and 60 parts by mass or less. When the content is in the above-mentioned range, for example, the composition can be used as a negative composition excellent in sensitivity.
 上記ラジカル重合性化合物のうち、例えば、エチレン性不飽和二重結合基を有し、酸価を有しない化合物としては、(メタ)アクリル酸-2-ヒドロキシエチル、(メタ)アクリル酸-2-ヒドロキシプロピル、(メタ)アクリル酸グリシジル、下記化合物No.A1~No.A4、(メタ)アクリル酸メチル、(メタ)アクリル酸ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸-t-ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸n-オクチル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸ステアリル、(メタ)アクリル酸ラウリル、(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸ジメチルアミノメチル、(メタ)アクリル酸ジメチルアミノエチル、(メタ)アクリル酸アミノプロピル、(メタ)アクリル酸ジメチルアミノプロピル、(メタ)アクリル酸エトキシエチル、(メタ)アクリル酸ポリ(エトキシ)エチル、(メタ)アクリル酸ブトキシエトキシエチル、(メタ)アクリル酸エチルヘキシル、(メタ)アクリル酸フェノキシエチル、(メタ)アクリル酸テトラヒドロフリル、(メタ)アクリル酸ビニル、(メタ)アクリル酸アリル、(メタ)アクリル酸ベンジル、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリシクロデカンジメチロールジ(メタ)アクリレート、トリ[(メタ)アクリロイルエチル]イソシアヌレート、ポリエステル(メタ)アクリレートオリゴマー等の不飽和一塩基酸及び多価アルコール又は多価フェノールのエステル;(メタ)アクリル酸亜鉛、(メタ)アクリル酸マグネシウム等の不飽和多塩基酸の金属塩;マレイン酸無水物、イタコン酸無水物、シトラコン酸無水物、メチルテトラヒドロ無水フタル酸、テトラヒドロ無水フタル酸、トリアルキルテトラヒドロ無水フタル酸、5-(2,5-ジオキソテトラヒドロフリル)-3-メチル-3-シクロヘキセン-1,2-ジカルボン酸無水物、トリアルキルテトラヒドロ無水フタル酸-無水マレイン酸付加物、ドデセニル無水コハク酸、無水メチルハイミック酸等の不飽和多塩基酸の酸無水物;(メタ)アクリルアミド、メチレンビス-(メタ)アクリルアミド、ジエチレントリアミントリス(メタ)アクリルアミド、キシリレンビス(メタ)アクリルアミド、α-クロロアクリルアミド、N-2-ヒドロキシエチル(メタ)アクリルアミド等の不飽和一塩基酸及び多価アミンのアミド;アクロレイン等の不飽和アルデヒド;(メタ)アクリロニトリル、α-クロロアクリロニトリル、シアン化ビニリデン、シアン化アリル等の不飽和ニトリル;スチレン、4-メチルスチレン、4-エチルスチレン、4-メトキシスチレン、4-ヒドロキシスチレン、4-クロロスチレン、ジビニルベンゼン、ビニルトルエン、ビニル安息香酸、ビニルフェノール、ビニルスルホン酸、4-ビニルベンゼンスルホン酸、ビニルベンジルメチルエーテル、ビニルベンジルグリシジルエーテル等の不飽和芳香族化合物;メチルビニルケトン等の不飽和ケトン;ビニルアミン、アリルアミン、N-ビニルピロリドン、ビニルピペリジン等の不飽和アミン化合物;ビニルメチルエーテル、ビニルエチルエーテル、n-ブチルビニルエーテル、イソブチルビニルエーテル、アリルグリシジルエーテル等のビニルエーテル;マレイミド、N-フェニルマレイミド、N-シクロヘキシルマレイミド等の不飽和イミド類;インデン、1-メチルインデン等のインデン類;1,3-ブタジエン、イソプレン、クロロプレン等の脂肪族共役ジエン類;ポリスチレン、ポリメチル(メタ)アクリレート、ポリ-n-ブチル(メタ)アクリレート、ポリシロキサン等の重合体分子鎖の末端にモノ(メタ)アクリロイル基を有するマクロモノマー類;(メタ)アクリロニトリル、エチレン、プロピレン、ブチレン、塩化ビニル、酢酸ビニル等のその他のビニル化合物、及びポリメチルメタクリレートマクロモノマー、ポリスチレンマクロモノマー等のマクロモノマー類、トリシクロデカン骨格のモノメタクリレート、N-フェニルマレイミド、メタクリロイルオキシメチル-3-エチルオキセタン等と、(メタ)アクリル酸との共重合体及びこれらに昭和電工(株)社製カレンズMOI、AOIのような不飽和結合を有するイソシアネート化合物を反応させた(メタ)アクリル酸の共重合体や、ビニルクロリド、ビニリデンクロリド、ジビニルスクシナート、ジアリルフタラート、トリアリルホスファート、トリアリルイソシアヌラート、ビニルチオエーテル、ビニルイミダゾール、ビニルオキサゾリン、ビニルカルバゾール、ビニルピロリドン、ビニルピリジン、水酸基含有ビニルモノマー及びポリイソシアネート化合物のビニルウレタン化合物、水酸基含有ビニルモノマー及びポリエポキシ化合物のビニルエポキシ化合物、ペンタエリスリトールトリアクリレート、ジペンタエリスリトールペンタアクリレート等の水酸基含有多官能アクリレートとトリレンジイソシアネート、ヘキサメチレンジイソシアネート等の多官能イソシアネートの反応物等が挙げられる。
 上記酸価を有しない化合物に含まれるラジカル重合可能な重合性基の数は、1以上であればよいが、2以上10以下であるものが好ましく、3以上8以下であるものが好ましい。
 上記酸価を有しない化合物は、重合性基の数が異なる化合物の混合物であってもよい。上記組成物は、例えば、硬化速度や、硬化物の硬度の調整が容易となるからである。
 上記酸価を有しない化合物は、例えば、重合性基の数が3の化合物及び重合性基の数が4の化合物の混合物、重合性基の数が5の化合物及び重合性基の数が6の化合物の混合物等とすることができる。
Among the above radical polymerizable compounds, for example, as a compound having an ethylenically unsaturated double bond group and not having an acid value, (meth) acrylic acid-2-hydroxyethyl, (meth) acrylic acid-2- Hydroxypropyl, glycidyl (meth) acrylate, the following compound No. 1 A1 to No. A4, methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, n-octyl (meth) acrylate ( (Meth) acrylate isooctyl, (meth) acrylate isononyl, (meth) acrylate stearyl, (meth) acrylate lauryl, (meth) acrylate methoxyethyl, (meth) acrylate dimethylaminomethyl, (meth) acrylate dimethyl (meth) acrylate Aminoethyl, aminopropyl (meth) acrylate, dimethylaminopropyl (meth) acrylate, ethoxyethyl (meth) acrylate, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, (meth ) Ethyl hexyl acrylate, (meth) acrylic acid Phenoxyethyl, tetrahydrofuryl (meth) acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (Meth) acrylate, polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylolethane tri ( Meta) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol Unsaturated monobasic acids such as tra (meth) acrylate, pentaerythritol tri (meth) acrylate, tricyclodecane dimethylol di (meth) acrylate, tri [(meth) acryloyl ethyl] isocyanurate, polyester (meth) acrylate oligomers and the like Polyhydric alcohol or ester of polyhydric phenol; Metal salt of unsaturated polybasic acid such as zinc (meth) acrylate and magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyl Tetrahydrophthalic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrofuran Phthalic anhydride-anhydrous Acid anhydride of unsaturated polybasic acid such as leic acid adduct, dodecenyl succinic anhydride, methyl hymic acid anhydride; (meth) acrylamide, methylene bis (meth) acrylamide, diethylene triamine tris (meth) acrylamide, xylylene bis (meth) Unsaturated monobasic acids such as acrylamide, α-chloroacrylamide, N-2-hydroxyethyl (meth) acrylamide and amides of polyhydric amines; unsaturated aldehydes such as acrolein; (meth) acrylonitrile, α-chloroacrylonitrile, cyanation Unsaturated nitriles such as vinylidene and allyl cyanide; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene, vinylbenzoic acid, vinylene Unsaturated aromatic compounds such as 2-phenol, vinyl sulfonic acid, 4-vinyl benzene sulfonic acid, vinyl benzyl methyl ether, vinyl benzyl glycidyl ether; unsaturated ketones such as methyl vinyl ketone; vinyl amine, allylamine, N-vinyl pyrrolidone, vinyl Unsaturated amine compounds such as piperidine; vinyl ethers such as vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether, isobutyl vinyl ether, allyl glycidyl ether; unsaturated imides such as maleimide, N-phenyl maleimide, N-cyclohexyl maleimide; And indenes such as 1-methylindene; aliphatic conjugated dienes such as 1,3-butadiene, isoprene and chloroprene; polystyrene, polymethyl (meth) acrylate, poly-n- Macromonomers having a mono (meth) acryloyl group at the end of polymer molecular chain such as chill (meth) acrylate and polysiloxane; (meth) acrylonitrile, other vinyl such as ethylene, propylene, butylene, vinyl chloride and vinyl acetate Compounds, and macromonomers such as polymethyl methacrylate macromonomer and polystyrene macromonomer, monomethacrylate of tricyclodecane skeleton, N-phenylmaleimide, methacryloyloxymethyl-3-ethyl oxetane, etc., and (meth) acrylic acid Polymers and copolymers of (meth) acrylic acid obtained by reacting an isocyanate compound having an unsaturated bond such as Karenz MOI manufactured by Showa Denko KK and AOI with these, vinyl chloride, vinylidene chloride, divinyl succ Nath, Allyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, vinyl carbazole, vinyl pyrrolidone, vinyl pyridine, vinyl urethane compound of hydroxyl group-containing vinyl monomer and polyisocyanate compound, hydroxyl group-containing vinyl monomer And vinyl epoxy compounds of polyepoxy compounds, and reaction products of hydroxyl group-containing polyfunctional acrylates such as pentaerythritol triacrylate and dipentaerythritol pentaacrylate with polyfunctional isocyanates such as tolylene diisocyanate and hexamethylene diisocyanate.
The number of radically polymerizable polymerizable groups contained in the compound having no acid value may be 1 or more, preferably 2 or more and 10 or less, and more preferably 3 or more and 8 or less.
The compound having no acid value may be a mixture of compounds having different numbers of polymerizable groups. This is because, for example, the adjustment of the curing speed and the hardness of the cured product becomes easy.
The compound having no acid value is, for example, a mixture of a compound having 3 polymerizable groups and a compound having 4 polymerizable groups, a compound having 5 polymerizable groups, and 6 polymerizable groups. And the like, and the like.
Figure JPOXMLDOC01-appb-C000033
Figure JPOXMLDOC01-appb-C000033
Figure JPOXMLDOC01-appb-C000034
Figure JPOXMLDOC01-appb-C000034
Figure JPOXMLDOC01-appb-C000035
Figure JPOXMLDOC01-appb-C000035
Figure JPOXMLDOC01-appb-C000036
Figure JPOXMLDOC01-appb-C000036
 上記酸価を有しない化合物の含有量としては、組成物の用途等に応じて適宜設定できるが、例えば、樹脂成分100質量部に対して、10質量部以上70質量部以下とすることができ、30質量部以上60質量部以下であることが好ましく、なかでも、40質量部以上50質量部以下であることが好ましい。上記含有量が上述の範囲であることで、例えば、上記組成物は、感度に優れたネガ型組成物として用いることができるからである。 The content of the compound not having an acid value can be appropriately set according to the application etc. of the composition, but can be, for example, 10 parts by mass to 70 parts by mass with respect to 100 parts by mass of the resin component. And 30 parts by mass or more and 60 parts by mass or less, and more preferably 40 parts by mass or more and 50 parts by mass or less. When the content is in the above-mentioned range, for example, the composition can be used as a negative composition excellent in sensitivity.
 上記ラジカル重合性化合物は、単独で又は2種以上を混合して使用することができる。また、ラジカル重合性化合物は、エチレン性不飽和二重結合基を有し、酸価を有する化合物及びエチレン性不飽和二重結合基を有し、酸価を有しない化合物を組み合わせて使用することができる。
 ラジカル重合性化合物は、2種以上を混合して使用する場合には、それらを予め共重合して共重合体として使用してもよい。
The said radically polymerizable compound can be used individually or in mixture of 2 or more types. In addition, the radically polymerizable compound has an ethylenically unsaturated double bond group, and uses a compound having an acid value and a compound having an ethylenically unsaturated double bond group and not having an acid value in combination. Can.
When a radically polymerizable compound is used in mixture of 2 or more types, they may be copolymerized beforehand and it may be used as a copolymer.
(b)カチオン重合性化合物及びアニオン重合性化合物
 上記カチオン重合性化合物は、カチオン重合可能な重合性基を1以上有するものであればよい。
 上記カチオン重合性化合物は、通常、カチオン重合開始剤と共に用いられるものである。
 カチオン重合可能な重合性基としては、例えば、エポキシ基及びオキセタン基等の環状エーテル基並びにビニルエーテル基等を挙げることができる。
 すなわち、カチオン重合性化合物としては、エポキシ化合物及びオキセタン化合物等の環状エーテル化合物並びにビニルエーテル化合物等が挙げられる。
(B) Cationic Polymerizable Compound and Anionic Polymerizable Compound The cationic polymerizable compound may be one having one or more cationically polymerizable groups.
The cationically polymerizable compound is usually used together with a cationic polymerization initiator.
Examples of the cationically polymerizable polymerizable group include cyclic ether groups such as an epoxy group and an oxetane group, and a vinyl ether group.
That is, as a cationically polymerizable compound, cyclic ether compounds, such as an epoxy compound and an oxetane compound, a vinyl ether compound, etc. are mentioned.
 上記エポキシ化合物としては、例えば、メチルグリシジルエーテル、2-エチルヘキシルグリシジルエーテル、ブチルグリシジルエーテル、デシルグリシジルエーテル、C12~13混合アルキルグリシジルエーテル、フェニル-2-メチルグリシジルエーテル、セチルグリシジルエーテル、ステアリルグリシジルエーテル、p-sec-ブチルフェニルグリシジルエーテル、p-tert-ブチルフェニルグリシジルエーテル、グリシジルメタクリレート、イソプロピルグリシジルエーテル、アリルグリシジルエーテル、エチルグリシジルエーテル、2-メチルオクチルグリシジルエーテル、フェニルグリシジルエーテル、4-n-ブチルフェニルグリシジルエーテル、4-フェニルフェノールグリシジルエーテル、クレジルグリシジルエーテル、ジブロモクレジルグリシジルエーテル、デシルグリシジルエーテル、メトキシポリエチレングリコールモノグリシジルエーテル、エトキシポリエチレングリコールモノグリシジルエーテル、ブトキシポリエチレングリコールモノグリシジルエーテル、フェノキシポリエチレングリコールモノグリシジルエーテル、ジブロモフェニルグリシジルエーテル、1,4-ブタンジオールジグリシジルエーテル、1,5-ペンタンジオールジグリシジルエーテル、1,6-ヘキサンジオールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、1,1,2,2-テトラキス(グリシジルオキシフェニル)エタン及びペンタエリスリトールテトラグリシジルエーテル等のグリシジルエーテル化物;グリシジルアセテート、グリシジルステアレート等のグリシジルエステル類;2-(3,4-エポキシシクロヘキシル-5,5-スピロ-3,4-エポキシ)シクロヘキサン-メタジオキサン、メチレンビス(3,4-エポキシシクロヘキサン)、プロパン-2,2-ジイル-ビス(3,4-エポキシシクロヘキサン)、2,2-ビス(3,4-エポキシシクロヘキシル)プロパン、エチレンビス(3,4-エポキシシクロヘキサンカルボキシレート)、ビス(3,4-エポキシシクロヘキシルメチル)アジペート、3,4-エポキシシクロヘキシルメチル 3,4-エポキシシクロヘキサンカルボキシレート、3,4-エポキシ-1-メチルシクロヘキシル 3,4-エポキシ-1-メチルヘキサンカルボキシレート、6-メチル-3,4-エポキシシクロヘキシルメチル 6-メチル-3,4-エポキシシクロヘキサンカルボキシレート、3,4-エポキシ-3-メチルシクロヘキシルメチル 3,4-エポキシ-3-メチルシクロヘキサンカルボキシレート、3,4-エポキシ-5-メチルシクロヘキシルメチル 3,4-エポキシ-5-メチルシクロヘキサンカルボキシレート、1-エポキシエチル-3,4-エポキシシクロヘキサン、1,2-エポキシ-2-エポキシエチルシクロヘキサン、ジシクロペンタジエンジエポキサイド、3,4-エポキシ-6-メチルシクロヘキシルカルボキシレート、α-ピネンオキシド、スチレンオキシド、シクロヘキセンオキサイド及びシクロペンテンオキサイド等のエポキシシクロアルキル型化合物及びN-グリシジルフタルイミド等が挙げられる。 Examples of the above epoxy compounds include methyl glycidyl ether, 2-ethylhexyl glycidyl ether, butyl glycidyl ether, decyl glycidyl ether, C12 to 13 mixed alkyl glycidyl ether, phenyl 2-methyl glycidyl ether, cetyl glycidyl ether, stearyl glycidyl ether, p-sec-butylphenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, glycidyl methacrylate, isopropyl glycidyl ether, allyl glycidyl ether, ethyl glycidyl ether, 2-methyloctyl glycidyl ether, phenyl glycidyl ether, 4-n-butylphenyl Glycidyl ether, 4-phenylphenol glycidyl ether, cresyl glycidyl Ether, dibromocresyl glycidyl ether, decyl glycidyl ether, methoxy polyethylene glycol monoglycidyl ether, ethoxy polyethylene glycol monoglycidyl ether, butoxy polyethylene glycol monoglycidyl ether, phenoxy polyethylene glycol monoglycidyl ether, dibromophenyl glycidyl ether, 1,4-butane Diol diglycidyl ether, 1,5-pentanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,1,2,2-tetrakis (glycidyloxyphenyl) ethane and pentaerythritol Glycidyl ether compounds such as tetraglycidyl ether; glycidyl acetate, Glycidyl esters such as sidyl stearate; 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane-metadioxane, methylene bis (3,4-epoxycyclohexane), propane-2, 2-Diyl-bis (3,4-epoxycyclohexane), 2,2-bis (3,4-epoxycyclohexyl) propane, ethylene bis (3,4-epoxycyclohexane carboxylate), bis (3,4-epoxycyclohexyl) Methyl) adipate, 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl 3,4-epoxy-1-methylhexanecarboxylate, 6-methyl-3,4 -Epoxycyclohexyl 6-Methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl 3,4-epoxy-3-methylcyclohexanecarboxylate, 3,4-epoxy-5-methylcyclohexylmethyl , 4-Epoxy-5-methylcyclohexanecarboxylate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, dicyclopentadiene diepoxide, 3,4-epoxy-6- Examples thereof include epoxy cycloalkyl type compounds such as methyl cyclohexyl carboxylate, α-pinene oxide, styrene oxide, cyclohexene oxide and cyclopentene oxide, and N-glycidyl phthalimide.
 また上記エポキシ化合物としては、エポキシ化ポリオレフィンを用いることもできる。エポキシ化ポリオレフィンとは、ポリオレフィンをエポキシ基含有単量体で変性して、エポキシ基を導入したポリオレフィンである。エチレン又は炭素数3~20のα-オレフィン、エポキシ基含有単量体、及び必要に応じて他のモノマーを、共重合法及びグラフト法のいずれかにより共重合させることによって製造することができる。エチレン又は炭素数3~20のα-オレフィン、エポキシ基含有単量体及び他のモノマーは、それぞれ単独で重合させてもよく、他の単量体と複数で重合させてもよい。また、末端に水酸基を有する非共役のポリブタジエンの二重結合を、過酢酸法によりエポキシ化して得ることもでき、分子内に水酸基を持つものを使用してもよい。また、水酸基をイソシアネートでウレタン化し、ここに1級水酸基含有エポキシ化合物を反応させてエポキシ基を導入することもできる。 Moreover, an epoxidized polyolefin can also be used as said epoxy compound. The epoxidized polyolefin is a polyolefin in which an epoxy group is introduced by modifying the polyolefin with an epoxy group-containing monomer. It can be produced by copolymerizing ethylene or an α-olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer, and, if necessary, another monomer, by any of a copolymerization method and a graft method. Ethylene or an α-olefin having 3 to 20 carbon atoms, an epoxy group-containing monomer and another monomer may be polymerized alone or in combination with other monomers. Also, the double bond of a non-conjugated polybutadiene having a hydroxyl group at the end can be obtained by epoxidation by the peracetic acid method, and one having a hydroxyl group in the molecule may be used. Moreover, a hydroxyl group can be urethane-ized with isocyanate, and a primary hydroxyl group-containing epoxy compound can be made to react here, and an epoxy group can be introduce | transduced.
 上記エチレン又は炭素数3~20のα-オレフィンとしては、エチレン、プロピレン、ブチレン、イソブチレン、1,3-ブタジエン、1,4-ブタジエン、1,3-ペンタジエン、2,3-ジメチル-1,3-ブタジエン、ピペリレン、3-ブチル-1,3-オクタジエン及びイソプレン等が挙げられる。 Examples of ethylene or α-olefins of 3 to 20 carbon atoms include ethylene, propylene, butylene, isobutylene, 1,3-butadiene, 1,4-butadiene, 1,3-pentadiene, 2,3-dimethyl-1,3 -Butadiene, piperylene, 3-butyl-1,3-octadiene, isoprene and the like can be mentioned.
 上記エポキシ基含有単量体としては、たとえばα,β-不飽和酸のグリシジルエステル、ビニルベンジルグリシジルエーテル及びアリルグリシジルエーテル等が挙げられる。α,β-不飽和酸のグリシジルエステルとしては、具体的にはアクリル酸グリシジル、メタクリル酸グリシジル及びエタクリル酸グリシジル等が挙げられ、特にメタクリル酸グリシジルが好ましい。 Examples of the epoxy group-containing monomer include glycidyl esters of α, β-unsaturated acids, vinyl benzyl glycidyl ether and allyl glycidyl ether. Specific examples of glycidyl esters of α, β-unsaturated acids include glycidyl acrylate, glycidyl methacrylate and glycidyl ethacrylic acid, with glycidyl methacrylate being particularly preferred.
 上記他のモノマーとしては、塩化ビニル、塩化ビニリデン、フッ化ビニリデン及びテトラフルオロエチレン等の不飽和脂肪族炭化水素;(メタ)アクリル酸、α―クロルアクリル酸、イタコン酸、マレイン酸、シトラコン酸、フマル酸、ハイミック酸、クロトン酸、イソクロトン酸、ビニル酢酸、アリル酢酸、桂皮酸、ソルビン酸、メサコン酸、コハク酸モノ[2-(メタ)アクリロイロキシエチル]、フタル酸モノ[2-(メタ)アクリロイロキシエチル]、ω-カルボキシポリカプロラクトンモノ(メタ)アクリレート等の両末端にカルボキシ基と水酸基とを有するポリマーのモノ(メタ)アクリレート、ヒドロキシエチル(メタ)アクリレート・マレート、ヒドロキシプロピル(メタ)アクリレート・マレート、ジシクロペンタジエン・マレート及び1個のカルボキシル基と2個以上の(メタ)アクリロイル基とを有する多官能(メタ)アクリレート等の不飽和多塩基酸;(メタ)アクリル酸-2-ヒドロキシエチル、(メタ)アクリル酸-2-ヒドロキシプロピル、(メタ)アクリル酸メチル、(メタ)アクリル酸ブチル、(メタ)アクリル酸イソブチル、(メタ)アクリル酸-t-ブチル、(メタ)アクリル酸シクロヘキシル、(メタ)アクリル酸n-オクチル、(メタ)アクリル酸イソオクチル、(メタ)アクリル酸イソノニル、(メタ)アクリル酸ステアリル、(メタ)アクリル酸ラウリル、(メタ)アクリル酸メトキシエチル、(メタ)アクリル酸ジメチルアミノメチル、(メタ)アクリル酸ジメチルアミノエチル、(メタ)アクリル酸アミノプロピル、(メタ)アクリル酸ジメチルアミノプロピル、(メタ)アクリル酸エトキシエチル、(メタ)アクリル酸ポリ(エトキシ)エチル、(メタ)アクリル酸ブトキシエトキシエチル、(メタ)アクリル酸エチルヘキシル、(メタ)アクリル酸フェノキシエチル、(メタ)アクリル酸テトラヒドロフリル、(メタ)アクリル酸ビニル、(メタ)アクリル酸アリル、(メタ)アクリル酸ベンジル、エチレングリコールジ(メタ)アクリレート、ジエチレングリコールジ(メタ)アクリレート、トリエチレングリコールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート、プロピレングリコールジ(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、トリメチロールエタントリ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、トリシクロデカンジメチロールジ(メタ)アクリレート、トリ[(メタ)アクリロイルエチル]イソシアヌレート及びポリエステル(メタ)アクリレートオリゴマー等の不飽和一塩基酸及び多価アルコール又は多価フェノールのエステル;(メタ)アクリル酸亜鉛、(メタ)アクリル酸マグネシウム等の不飽和多塩基酸の金属塩;マレイン酸無水物、イタコン酸無水物、シトラコン酸無水物、メチルテトラヒドロ無水フタル酸、テトラヒドロ無水フタル酸、トリアルキルテトラヒドロ無水フタル酸、5-(2,5-ジオキソテトラヒドロフリル)-3-メチル-3-シクロヘキセン-1,2-ジカルボン酸無水物、トリアルキルテトラヒドロ無水フタル酸-無水マレイン酸付加物、ドデセニル無水コハク酸及び無水メチルハイミック酸等の不飽和多塩基酸の酸無水物;(メタ)アクリルアミド、メチレンビス-(メタ)アクリルアミド、ジエチレントリアミントリス(メタ)アクリルアミド、キシリレンビス(メタ)アクリルアミド、α-クロロアクリルアミド、N-2-ヒドロキシエチル(メタ)アクリルアミド等の不飽和一塩基酸及び多価アミンのアミド;アクロレイン等の不飽和アルデヒド;(メタ)アクリロニトリル、α-クロロアクリロニトリル、シアン化ビニリデン、シアン化アリル等の不飽和ニトリル;スチレン、4-メチルスチレン、4-エチルスチレン、4-メトキシスチレン、4-ヒドロキシスチレン、4-クロロスチレン、ジビニルベンゼン、ビニルトルエン、ビニル安息香酸、ビニルフェノール、ビニルスルホン酸、4-ビニルベンゼンスルホン酸、ビニルベンジルメチルエーテル及びビニルナフタレン等の不飽和芳香族化合物;メチルビニルケトン等の不飽和ケトン;ビニルアミン、アリルアミン、N-ビニルピロリドン及びビニルピペリジン等の不飽和アミン化合物;アリルアルコール及びクロチルアルコール等のビニルアルコール;ビニルメチルエーテル、ビニルエチルエーテル、n-ブチルビニルエーテル及びイソブチルビニルエーテル等のビニルエーテル;マレイミド、N-フェニルマレイミド及びN-シクロヘキシルマレイミド等の不飽和イミド類;インデン及び1-メチルインデン等のインデン類;ポリスチレン、ポリメチル(メタ)アクリレート、ポリ-n-ブチル(メタ)アクリレート及びポリシロキサン等の重合体分子鎖の末端にモノ(メタ)アクリロイル基を有するマクロモノマー類;ビニルクロリド、ビニリデンクロリド、ジビニルスクシナート、ジアリルフタラート、トリアリルホスファート、トリアリルイソシアヌラート、ビニルチオエーテル、ビニルイミダゾール、ビニルオキサゾリン、ビニルカルバゾール、ビニルピロリドン、ビニルピリジン、水酸基含有ビニルモノマー及びポリイソシアネート化合物のビニルウレタン化合物、水酸基含有ビニルモノマー及びポリエポキシ化合物のビニルエポキシ化合物、ペンタエリスリトールトリアクリレート及びジペンタエリスリトールペンタアクリレート等の水酸基含有多官能アクリレート;トリレンジイソシアネート及びヘキサメチレンジイソシアネート等の多官能イソシアネートの反応物;ペンタエリスリトールトリアクリレート及びジペンタエリスリトールペンタアクリレート等の水酸基含有多官能アクリレートと無水コハク酸、無水フタル酸及びテトラヒドロ無水フタル酸等の二塩基酸無水物の反応物である酸価を有する多官能アクリレートが挙げられる。 Examples of the other monomers include unsaturated aliphatic hydrocarbons such as vinyl chloride, vinylidene chloride, vinylidene fluoride and tetrafluoroethylene; (meth) acrylic acid, α-chloroacrylic acid, itaconic acid, maleic acid, citraconic acid, Fumaric acid, hymic acid, crotonic acid, isocrotonic acid, vinyl acetic acid, allyl acetic acid, cinnamic acid, sorbic acid, sorbic acid, mesaconic acid, mono [2- (meth) acryloyloxyethyl] succinate, mono [2- (metha] phthalic acid ) Acryloyloxyethyl], ω-carboxypolycaprolactone mono (meth) acrylate, etc. Mono (meth) acrylate of a polymer having a carboxy group and a hydroxyl group at both ends, hydroxyethyl (meth) acrylate malate, hydroxypropyl (meth) ) Acrylate malate, dicyclopentadiene · And unsaturated polybasic acids such as polyfunctional (meth) acrylates having one carboxyl group and two or more (meth) acryloyl groups; 2-hydroxyethyl (meth) acrylate, (meth) acrylate -2-Hydroxypropyl, methyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, n (meth) acrylate -Octyl, isooctyl (meth) acrylate, isononyl (meth) acrylate, stearyl (meth) acrylate, lauryl (meth) acrylate, methoxyethyl (meth) acrylate, dimethylaminomethyl (meth) acrylate, (meth ) Dimethylaminoethyl acrylate, aminopropyl (meth) acrylate, (meth) acrylic acid Dimethylaminopropyl, ethoxyethyl (meth) acrylate, poly (ethoxy) ethyl (meth) acrylate, butoxyethoxyethyl (meth) acrylate, ethylhexyl (meth) acrylate, phenoxyethyl (meth) acrylate, (meth) Tetrahydrofuryl acrylate, vinyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, Polyethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, trimethylol ethane Li (meth) acrylate, trimethylolpropane tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, pentaerythritol tri (meth) acrylate, tri Unsaturated monobasic acids such as cyclodecane dimethylol di (meth) acrylate, tri [(meth) acryloylethyl] isocyanurate and polyester (meth) acrylate oligomers and esters of polyhydric alcohols or polyhydric phenols; (meth) acrylic acid Zinc, metal salts of unsaturated polybasic acids such as magnesium (meth) acrylate; maleic anhydride, itaconic anhydride, citraconic anhydride, methyltetrahydrophthalic anhydride, tetrahydroanhydride Phthalic acid, trialkyltetrahydrophthalic anhydride, 5- (2,5-dioxotetrahydrofuryl) -3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trialkyltetrahydrophthalic anhydride-maleic anhydride Adducts, acid anhydrides of unsaturated polybasic acids such as dodecenyl succinic anhydride and methyl hymic acid anhydride; (meth) acrylamide, methylene bis- (meth) acrylamide, diethylene triamine tris (meth) acrylamide, xylylene bis (meth) acrylamide, Amides of unsaturated monobasic acids and polyvalent amines such as α-chloroacrylamide, N-2-hydroxyethyl (meth) acrylamide, unsaturated aldehydes such as acrolein, (meth) acrylonitrile, α-chloroacrylonitrile, vinylidene cyanide, Shea Unsaturated nitriles such as allyl chloride; styrene, 4-methylstyrene, 4-ethylstyrene, 4-methoxystyrene, 4-hydroxystyrene, 4-chlorostyrene, divinylbenzene, vinyltoluene, vinylbenzoic acid, vinylphenol, vinylsulfone Acids, unsaturated aromatic compounds such as 4-vinylbenzene sulfonic acid, vinyl benzyl methyl ether and vinyl naphthalene; unsaturated ketones such as methyl vinyl ketone; unsaturated amine compounds such as vinyl amine, allylamine, N-vinyl pyrrolidone and vinyl piperidine Vinyl alcohols such as allyl alcohol and crotyl alcohol; vinyl ethers such as vinyl methyl ether, vinyl ethyl ether, n-butyl vinyl ether and isobutyl vinyl ether; maleimide, N-phenyl maleate Unsaturated imides such as nmid and N-cyclohexyl maleimide; indens such as indene and 1-methyl indene; polymer molecular chains such as polystyrene, polymethyl (meth) acrylate, poly-n-butyl (meth) acrylate and polysiloxane Macromonomers having a mono (meth) acryloyl group at the terminal of: vinyl chloride, vinylidene chloride, divinyl succinate, diallyl phthalate, triallyl phosphate, triallyl isocyanurate, vinyl thioether, vinyl imidazole, vinyl oxazoline, Vinylcarbazole, vinylpyrrolidone, vinylpyridine, vinyl urethane compound of hydroxyl group-containing vinyl monomer and polyisocyanate compound, vinyl epoxy compound of hydroxyl group-containing vinyl monomer and polyepoxy compound Hydroxyl group-containing polyfunctional acrylate such as pentaerythritol triacrylate and dipentaerythritol pentaacrylate; Reactant of polyfunctional isocyanate such as tolylene diisocyanate and hexamethylene diisocyanate; Hydroxyl group-containing polyfunctional such as pentaerythritol triacrylate and dipentaerythritol pentaacrylate A multifunctional acrylate having an acid value which is a reaction product of an acrylate and a dibasic acid anhydride such as succinic anhydride, phthalic anhydride and tetrahydrophthalic anhydride can be mentioned.
 上記エポキシ化ポリオレフィンとしては、市販品を用いることもでき、例えば、エポリードPB3600、エポリードPB4700(ダイセル社製);BF-1000、FC-3000(ADEKA社製);ボンドファースト2C、ボンドファーストE、ボンドファーストCG5001、ボンドファーストCG5004、ボンドファースト2B、ボンドファースト7B、ボンドファースト7L、ボンドファースト7M、ボンドファーストVC40(住友化学社製);JP-100、JP-200(日本曹達社製);Poly bd R-45HT、Poly bd R-15HT(出光興産社製)及びRicon657(アルケマ社製)等が挙げられる。 A commercial item can also be used as said epoxidized polyolefin, For example, Epolide PB3600, Epolide PB4700 (made by Daicel); BF-1000, FC-3000 (made by ADEKA); Bond first 2C, bond first E, bond First CG 5001, Bond First CG 5004, Bond First 2 B, Bond First 7 B, Bond First 7 L, Bond First 7 M, Bond First VC 40 (Sumitomo Chemical Co., Ltd.); JP-100, JP-200 (Nippon Soda Co., Ltd.); Poly bd R And -45 HT, Poly bd R-15 HT (manufactured by Idemitsu Kosan Co., Ltd.) and Ricon 657 (manufactured by Arkema).
 耐熱性が良好なことから、上記エポキシ化合物としては、カルド骨格を有する化合物を使用することがより好ましい。 From the viewpoint of good heat resistance, it is more preferable to use a compound having a cardo skeleton as the above-mentioned epoxy compound.
 上記オキセタン化合物としては、例えば、3,7-ビス(3-オキセタニル)-5-オキサ-ノナン、1,4-ビス[(3-エチル-3-オキセタニルメトキシ)メチル]ベンゼン、1,2-ビス[(3-エチル-3-オキセタニルメトキシ)メチル]エタン、1,3-ビス[(3-エチル-3-オキセタニルメトキシ)メチル]プロパン、エチレングリコールビス(3-エチル-3-オキセタニルメチル)エーテル、トリエチレングリコールビス(3-エチル-3-オキセタニルメチル)エーテル、テトラエチレングリコールビス(3-エチル-3-オキセタニルメチル)エーテル、1,4-ビス(3-エチル-3-オキセタニルメトキシ)ブタン、1,6-ビス(3-エチル-3-オキセタニルメトキシ)ヘキサン、3―エチル―3-[(フェノキシ)メチル]オキセタン、3―エチル―3-(ヘキシロキシメチル)オキセタン、3―エチル―3-(2-エチルヘキシロキシメチル)オキセタン、3―エチル―3-(ヒドロキシメチル)オキセタン及び3―エチル―3-(クロロメチル)オキセタン等が挙げられる。 Examples of the above-mentioned oxetane compounds include 3,7-bis (3-oxetanyl) -5-oxa-nonane, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, and 1,2-bis [(3-Ethyl-3-oxetanylmethoxy) methyl] ethane, 1,3-bis [(3-ethyl-3-oxetanylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, Triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, 1,4-bis (3-ethyl-3-oxetanylmethoxy) butane, 1 , 6-Bis (3-ethyl-3-oxetanylmethoxy) hexane, 3-ethyl-3- (Phenoxy) methyl] oxetane, 3-ethyl-3- (hexyloxymethyl) oxetane, 3-ethyl-3- (2-ethylhexyloxymethyl) oxetane, 3-ethyl-3- (hydroxymethyl) oxetane and 3- Ethyl 3- (chloromethyl) oxetane and the like can be mentioned.
 上記ビニルエーテル化合物としては、例えば、ジエチレングリコールモノビニルエーテル、トリエチレングリコールジビニルエーテル、n-ドデシルビニルエーテル、シクロヘキシルビニルエーテル、2-エチルヘキシルビニルエーテル、2-クロロエチルビニルエーテル、エチルビニルエーテル、イソブチルビニルエーテル、トリエチレングリコールビニルエーテル、2-ヒドロキシエチルビニルエーテル、4-ヒドロキシブチルビニルエーテル、1,6-シクロヘキサンジメタノールモノビニルエーテル、エチレングリコールジビニルエーテル、1,4-ブタンジオールジビニルエーテル及び1,6-シクロヘキサンジメタノールジビニルエーテル等が挙げられる。 Examples of the vinyl ether compounds include diethylene glycol monovinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene glycol vinyl ether, 2- Examples thereof include hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 1,6-cyclohexanedimethanol monovinyl ether, ethylene glycol divinyl ether, 1,4-butanediol divinyl ether and 1,6-cyclohexane dimethanol divinyl ether.
 上記アニオン重合性化合物としては、アニオン重合可能な重合性基を1以上有するものであればよい。
 上記アニオン重合性化合物は、通常、アニオン重合開始剤と共に用いられるものである。
 上記アニオン重合可能な重合性基としては、例えば、エポキシ基、ラクトン基、(メタ)アクリル基等を挙げることができる。
 すなわち、上記アニオン重合性化合物としては、エポキシ化合物、ラクトン化合物、(メタ)アクリル基を有する化合物等が挙げられる。
 上記ラクトン化合物としては、β-プロピオラクトン、ε-カプロラクトン等を挙げることができる。
 なお、エポキシ化合物については、上記カチオン重合性化合物として例示したエポキシ化合物を用いることができる。また、(メタ)アクリル基を有する化合物としては、上記ラジカル重合性化合物として例示したものを用いることができる。
As the above-mentioned anionically polymerizable compound, those having one or more polymerizable groups capable of anionic polymerization may be used.
The above-mentioned anionically polymerizable compound is usually used together with an anionic polymerization initiator.
As said anionizable polymerizable group, an epoxy group, a lactone group, a (meth) acryl group etc. can be mentioned, for example.
That is, as the above-mentioned anion polymerization compound, an epoxy compound, a lactone compound, a compound which has a (meth) acryl group, etc. are mentioned.
Examples of the lactone compound include β-propiolactone and ε-caprolactone.
In addition, as an epoxy compound, the epoxy compound illustrated as said cationically polymerizable compound can be used. Moreover, as a compound which has a (meth) acryl group, what was illustrated as said radically polymerizable compound can be used.
 上記カチオン重合性化合物及びアニオン重合性化合物は、それぞれ単独で又は2種以上を混合して使用することができる。 The said cationically polymerizable compound and anionically polymerizable compound can be used individually or in mixture of 2 or more types, respectively.
(c)重合性化合物の分子量
 上記重合性化合物の分子量としては、組成物の用途等に応じて適宜設定されるものであるが、例えば、50以上とすることができ、50以上3000以下とすることができる。
 なお、上記分子量は、重合性化合物がその構造として繰り返し構造を含む重合体である場合には、重量平均分子量(Mw)で表すものとすることができる。
 上記重合性化合物の含有量は、上記組成物を硬化性組成物として使用可能となるものであればよいが、化合物A、化合物B及び重合性化合物の合計100質量部中に、1質量部以上99質量部以下とすることができ、50質量部以上99質量部以下であることが好ましく、なかでも、80質量部以上99質量部以下であることが好ましい。上記含有量が上述の範囲であることにより、上記組成物は、硬化性組成物としての使用が容易であり、また、硬化性組成物の耐光性や耐熱性等の耐久性を向上するとの効果をより効果的に発揮できるからである。
(C) Molecular Weight of Polymerizable Compound The molecular weight of the above-mentioned polymerizable compound is appropriately set according to the use of the composition etc. be able to.
In addition, said molecular weight can be represented by a weight average molecular weight (Mw), when a polymeric compound is a polymer which contains a repeating structure as the structure.
The content of the polymerizable compound may be any amount as long as the composition can be used as a curable composition, but 1 part by mass or more in a total of 100 parts by mass of the compound A, the compound B and the polymerizable compound It can be 99 parts by mass or less, preferably 50 parts by mass or more and 99 parts by mass or less, and particularly preferably 80 parts by mass or more and 99 parts by mass or less. When the content is in the above-mentioned range, the composition is easy to use as a curable composition, and the effect of improving the durability such as light resistance and heat resistance of the curable composition is improved. It is because it can demonstrate more effectively.
(2)重合体
 上記重合体は、重合性基を有しないものである。
 このような重合体としては、繰り返し構造を含むものであればよく、感光性を有する感光性樹脂、感光性を有しない非感光性樹脂等を挙げることができる。
 上記組成物は、例えば、樹脂成分として感光性樹脂を含むことにより、感光性組成物として用いることができる。
(2) Polymer The above-mentioned polymer has no polymerizable group.
As such a polymer, any polymer having a repeating structure may be used, and a photosensitive resin having photosensitivity, a non-photosensitive resin having no photosensitivity, and the like can be mentioned.
The said composition can be used as a photosensitive composition, for example by including photosensitive resin as a resin component.
(a)感光性樹脂
 上記感光性樹脂は、感光性を有するものであり、例えば、酸発生剤と共に用いられ、酸の作用でエステル基またはアセタール基等の化学結合の切断等、現像液に対する溶解性が増加する方向に変化するポジ型樹脂を挙げることができる。
 上記組成物は、樹脂成分としてポジ型樹脂を含むことにより、光照射部位のアルカリ現像液への溶解性が増加する。
 このため、上記組成物は、例えば、アルカリ現像液等の溶媒への溶解性が光照射前後で変化する感光性組成物として、より具体的には、ポジ型組成物として用いることができる。
(A) Photosensitive resin The above-mentioned photosensitive resin has photosensitivity, and is used together with an acid generator, for example, dissolution of a chemical bond such as an ester group or acetal group by the action of an acid, etc. Mention may be made of positive resins which change in the direction in which the properties increase.
The composition described above contains a positive resin as a resin component, whereby the solubility of the light-irradiated portion in the alkali developer is increased.
Therefore, the composition can be used, for example, as a positive type composition, more specifically, as a photosensitive composition whose solubility in a solvent such as an alkaline developer changes before and after light irradiation.
 上記ポジ型樹脂としては、高分子重合体を、アルカリ溶解制御能を有する酸不安定基に部分的に置換したものを用いることができる。
 上記高分子重合体としては、ポリヒドロキシスチレン及びその誘導体;ポリアクリル酸及びその誘導体;ポリメタクリル酸及びその誘導体;ヒドロキシスチレン、アクリル酸、メタクリル酸及びそれらの誘導体から選ばれ形成される2以上の共重合体;ヒドロキシスチレン、スチレン及びそれらの誘導体から選ばれ形成される2以上の共重合体;シクロオレフィン及びその誘導体、無水マレイン酸、並びに、アクリル酸及びその誘導体から選ばれる3以上の共重合体;シクロオレフィン及びその誘導体、マレイミド、並びに、アクリル酸及びその誘導体から選ばれる3以上の共重合体;ポリノルボルネン;メタセシス開環重合体からなる一群から選択される1種以上の高分子重合体等を挙げることができる。
 上記高分子重合体に導入される酸不安定基としては、三級アルキル基、トリアルキルシリル基、オキソアルキル基、アリール基置換アルキル基、テトラヒドロピラン-2-イル基等の複素脂環基、三級アルキルカルボニル基、三級アルキルカルボニルアルキル基、アルキルオキシカルボニル基等が挙げられる。
As the positive resin, those obtained by partially replacing a high molecular weight polymer with an acid labile group having alkali solubility control ability can be used.
As the above-mentioned polymer, polyhydroxystyrene and derivatives thereof; polyacrylic acid and derivatives thereof; polymethacrylic acid and derivatives thereof; hydroxystyrene, acrylic acid, methacrylic acid and derivatives thereof and two or more formed Copolymer: two or more copolymers selected from hydroxystyrene, styrene and their derivatives, cycloolefin and its derivatives, maleic anhydride, and three or more copolymers selected from acrylic acid and its derivatives Combined; cycloolefin and derivatives thereof, maleimide, and three or more copolymers selected from acrylic acid and derivatives thereof; polynorbornene; at least one polymer selected from the group consisting of metathesis ring-opening polymers Etc. can be mentioned.
The acid labile group to be introduced into the above-mentioned polymer includes heteroalicyclic groups such as tertiary alkyl group, trialkylsilyl group, oxoalkyl group, aryl group substituted alkyl group, tetrahydropyran-2-yl group, etc. Tertiary alkylcarbonyl groups, tertiary alkylcarbonylalkyl groups, alkyloxycarbonyl groups and the like can be mentioned.
 上記ポジ型樹脂の詳細な具体例は、例えば、特開2003-192665号公報、特開2004-323704号公報の請求項3、特開平10-10733号公報等に記載の内容と同様とすることができる。 Detailed examples of the positive resin are the same as the contents described in, for example, JP-A-2003-192665, JP-A-2004-323704, claim 3, JP-A-10-10733, etc. Can.
 上記ポジ型樹脂と共に用いられる酸発生剤としては、公知の酸発生剤を用いることができる。上記酸発生剤としては、具体的には、後述する光カチオン重合開始剤、熱カチオン重合開始剤等を挙げることができる。 A well-known acid generator can be used as an acid generator used with said positive resin. Specifically as said acid generator, the photocationic polymerization initiator mentioned later, a thermal cationic polymerization initiator, etc. can be mentioned.
(b)非感光性樹脂
 上記非感光性樹脂は、感光性を有しないものであればよく、例えば、ポリスチレン、ポリメチルメタクリレート、メチルメタクリレート-エチルアクリレート共重合体、ポリ(メタ)アクリル酸、スチレン-(メタ)アクリル酸共重合体、(メタ)アクリル酸-メチルメタクリレート共重合体、エチレン-塩化ビニル共重合体、エチレン-ビニル共重合体、ポリ塩化ビニル樹脂、ABS樹脂、ナイロン6、ナイロン66、ナイロン12、ウレタン樹脂、ポリカーボネートポリビニルブチラール、セルロースエステル、ポリアクリルアミド、飽和ポリエステル、フェノール樹脂、フェノキシ樹脂、ポリアミドイミド樹脂、ポリアミック酸樹脂、エポキシ樹脂等が挙げられる。
 上記非感光性樹脂は、例えば、上述の重合性化合物の重合物も用いることができる。
(B) Non-Photosensitive Resin The above-mentioned non-photosensitive resin may be any one which does not have photosensitivity, for example, polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymer, poly (meth) acrylic acid, styrene -(Meth) acrylic acid copolymer, (meth) acrylic acid-methyl methacrylate copolymer, ethylene-vinyl chloride copolymer, ethylene-vinyl copolymer, polyvinyl chloride resin, ABS resin, nylon 6, nylon 66 Nylon 12, urethane resin, polycarbonate polyvinyl butyral, cellulose ester, polyacrylamide, saturated polyester, phenol resin, phenoxy resin, polyamide imide resin, polyamic acid resin, epoxy resin and the like.
As the non-photosensitive resin, for example, a polymer of the above-mentioned polymerizable compound can also be used.
(c)重合体の分子量
 上記重合体の重量平均分子量(Mw)は、組成物の用途等に応じて適宜設定されるものであるが、例えば、1500以上とすることができ、1500以上300000以下とすることができる。
(C) Molecular Weight of Polymer The weight average molecular weight (Mw) of the polymer is appropriately set according to the application etc. of the composition, but can be, for example, 1500 or more, and 1500 or more and 300000 or less It can be done.
(3)樹脂成分
 上記樹脂成分の含有量としては、組成物の用途等に応じて適宜設定されるものであり、例えば、固形分100質量部に対して、1質量部以上99質量部以下とすることができ、20質量部以上95質量部以下であることが好ましく、なかでも、30質量部以上90質量部以下であることが好ましい。上記含有量が上述の範囲であることにより、上記組成物は、例えば、上記化合物Bを安定的に保持可能だからである。
 上記樹脂成分の含有量は、化合物A、化合物B及び樹脂成分の合計100質量部中に、1質量部以上99質量部以下とすることができ、50質量部以上99質量部以下であることが好ましく、なかでも、80質量部以上99質量部以下であることが好ましい。上記含有量が上述の範囲であることにより、上記組成物は、例えば、上記化合物A及び化合物Bを安定的に保持可能だからである。また、硬化性組成物の耐光性や耐熱性等の耐久性を向上するとの効果をより効果的に発揮できるからである。
 上記樹脂成分、化合物A及び化合物Bの合計の含有量は、上記組成物100質量部中に、1質量部以上とすることができ、なかでも、10質量部以上99質量部以下であることが好ましく、30質量部以上95質量部以下であることが好ましく、50質量部以上70質量部以下であることが好ましい。上記組成物は、耐久性を有する硬化物の製造が容易となるからである。
(3) Resin component The content of the above-mentioned resin component is appropriately set according to the application etc. of the composition, for example, 1 to 99 parts by mass with respect to 100 parts by mass of solid content. The amount is preferably 20 parts by mass or more and 95 parts by mass or less, and more preferably 30 parts by mass or more and 90 parts by mass or less. It is because the said composition can hold | maintain the said compound B stably, for example, because the said content is the above-mentioned range.
The content of the resin component can be 1 part by mass or more and 99 parts by mass or less, and is 50 parts by mass or more and 99 parts by mass or less in 100 parts by mass of the compound A, the compound B and the resin component. Among them, 80 parts by mass or more and 99 parts by mass or less are preferable. It is because the said composition can hold | maintain the said compound A and the compound B stably, for example, because the said content is the above-mentioned range. Moreover, it is because the effect of improving durability, such as light resistance of a curable composition and heat resistance, can be exhibited more effectively.
The total content of the resin component, the compound A and the compound B can be 1 part by mass or more in 100 parts by mass of the composition, and in particular, 10 parts by mass or more and 99 parts by mass or less The amount is preferably 30 parts by mass or more and 95 parts by mass or less, and more preferably 50 parts by mass or more and 70 parts by mass or less. It is because the said composition becomes easy to manufacture of the hardened | cured material which has durability.
 上記樹脂成分の種類は、1種類のみであってもよく、2種類以上の組み合わせであってもよい。
 上記樹脂成分は、例えば、重合性化合物および上記重合体のいずれか一方のみを含むもの又は両者を含むものとすることができる。
 上記樹脂成分が重合性化合物及び重合体の両者を含む場合、上記重合性化合物の含有量としては、組成物の用途等に応じて適宜設定することができるが、例えば、重合性化合物及び重合体100質量部に対して、1質量部以上99質量部以下とすることができる。
The type of the resin component may be only one type or a combination of two or more types.
The resin component may contain, for example, only one or both of the polymerizable compound and the polymer.
When the resin component contains both a polymerizable compound and a polymer, the content of the polymerizable compound can be appropriately set according to the application etc. of the composition, for example, the polymerizable compound and the polymer It can be 1 part by mass or more and 99 parts by mass or less with respect to 100 parts by mass.
5.その他の成分
 上記組成物は、化合物A、化合物B及び樹脂成分以外にも、必要に応じてその他の成分を含むことができる。
 上記他の成分としては、重合開始剤、着色剤、溶剤、連鎖移動剤、増感剤、界面活性剤、シランカップリング剤、メラミン化合物、酸触媒、塩基触媒等を含むことができる。
5. Other Components The above composition may contain other components, as necessary, in addition to the compound A, the compound B and the resin component.
The above-mentioned other components can include a polymerization initiator, a colorant, a solvent, a chain transfer agent, a sensitizer, a surfactant, a silane coupling agent, a melamine compound, an acid catalyst, a base catalyst and the like.
(1)重合開始剤
 上記重合開始剤は、硬化性成分として含まれるものであり、通常、重合性化合物等と共に用いられるものである。
 上記重合開始剤としては、重合性化合物を重合可能なものであればよく、例えば、光照射を受けることにより重合性化合物を重合可能な光重合開始剤、加熱することにより重合性化合物を重合可能な熱重合開始剤等を挙げることができる。
 上記重合開始剤は、上記組成物が、化合物A及び化合物Bを含む場合でも容易に硬化できるとの効果を効果的に発揮する観点からは、光重合開始剤であることが好ましい。
(1) Polymerization Initiator The above-mentioned polymerization initiator is contained as a curable component, and is usually used together with a polymerizable compound or the like.
The above-mentioned polymerization initiator may be any one capable of polymerizing a polymerizable compound, for example, a photopolymerization initiator capable of polymerizing a polymerizable compound by receiving light irradiation, and can polymerize a polymerizable compound by heating And thermal polymerization initiators.
The polymerization initiator is preferably a photopolymerization initiator from the viewpoint of effectively exerting the effect that the composition can be easily cured even when the composition contains the compound A and the compound B.
(a)光重合開始剤
 上記光重合開始剤としては、光照射を受けることにより重合性化合物を重合可能なものであればよく、例えば、光ラジカル重合開始剤、光カチオン重合開始剤、光アニオン重合開始剤等を挙げることができる。
(A) Photopolymerization initiator The above-mentioned photopolymerization initiator may be any one capable of polymerizing the polymerizable compound by receiving light irradiation, for example, photo radical polymerization initiator, photo cationic polymerization initiator, photo anion A polymerization initiator etc. can be mentioned.
 上記光ラジカル重合開始剤としては、光照射によりラジカルを発生するものであれば特に制限されず従来既知の化合物を用いることができる。
 上記光ラジカル重合開始剤としては、例えば、アセトフェノン系化合物、ベンジル系化合物、ベンゾフェノン系化合物、チオキサントン系化合物及びオキシムエステル系化合物等を好ましいものとして例示することができる。
The photo radical polymerization initiator is not particularly limited as long as it generates radicals by light irradiation, and conventionally known compounds can be used.
As said photo radical polymerization initiator, an acetophenone type compound, a benzyl type compound, a benzophenone series compound, a thioxanthone type compound, an oxime ester type compound etc. can be illustrated as a preferable thing, for example.
 上記アセトフェノン系化合物としては例えば、ジエトキシアセトフェノン、2-ヒドロキシ-2-メチル-1-フェニルプロパン-1-オン、4’-イソプロピル-2-ヒドロキシ-2-メチルプロピオフェノン、2-ヒドロキシメチル-2-メチルプロピオフェノン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、p-ジメチルアミノアセトフェノン、p-ターシャリブチルジクロロアセトフェノン、p-ターシャリブチルトリクロロアセトフェノン、p-アジドベンザルアセトフェノン、1-ヒドロキシシクロヘキシルフェニルケトン、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルフォリノプロパノン-1、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、ベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、ベンゾイン-n-ブチルエーテル、ベンゾインイソブチルエーテル及び1-[4-(2-ヒドロキシエトキシ)-フェニル]-2-ヒドロキシ-2-メチル-1-プロパン-1-オン等が挙げられる。 Examples of the above-mentioned acetophenone compounds include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 4'-isopropyl-2-hydroxy-2-methylpropiophenone, 2-hydroxymethyl- 2-Methylpropiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, p-dimethylaminoacetophenone, p-tertiary butyl dichloroacetophenone, p-tertiary butyl trichloroacetophenone, p-azidoben Salacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1,2-benzyl-2-dimethylamino-1- (4-morpholinophenyl ) -Butanone-1, b Zoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether and 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propane -1- on and the like.
 上記ベンジル系化合物としては、ベンジル等が挙げられる。 Examples of the above-mentioned benzyl compound include benzyl and the like.
 上記ベンゾフェノン系化合物としては、例えば、ベンゾフェノン、o-ベンゾイル安息香酸メチル、ミヒラーケトン、4,4’-ビスジエチルアミノベンゾフェノン、4,4’-ジクロロベンゾフェノン及び4-ベンゾイル-4’-メチルジフェニルスルフィド等が挙げられる。 Examples of the benzophenone compounds include benzophenone, methyl o-benzoylbenzoate, Michler's ketone, 4,4'-bisdiethylaminobenzophenone, 4,4'-dichlorobenzophenone and 4-benzoyl-4'-methyldiphenyl sulfide. Be
 上記チオキサントン系化合物としては、チオキサントン、2-メチルチオキサントン、2-エチルチオキサントン、2-クロロチオキサントン、2-イソプロピルチオキサントン、2,4-ジエチルチオキサントン等が挙げられる。 Examples of the thioxanthone compound include thioxanthone, 2-methyl thioxanthone, 2-ethyl thioxanthone, 2-chloro thioxanthone, 2-isopropyl thioxanthone, 2,4-diethyl thioxanthone and the like.
 上記オキシム系化合物としては、感度及び耐熱性が良好なことから特に、下記一般式(IV)で表される化合物を挙げることができる。 As the above-mentioned oxime compound, particularly, a compound represented by the following general formula (IV) can be mentioned because the sensitivity and heat resistance are good.
Figure JPOXMLDOC01-appb-C000037
Figure JPOXMLDOC01-appb-C000037
(式中、R71及びR72は、それぞれ独立に、水素原子、シアノ基、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
 R73及びR74は、それぞれ独立に、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基、R75、OR76、SR77、NR7879、COR80、SOR81、SO82又はCONR8384を表し、R73及びR74は、互いに結合して環を形成している場合があり、
 R75、R76、R77、R78、R79、R80、R81、R82、R83及びR84は、それぞれ独立に、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
 Xは、酸素原子、硫黄原子、セレン原子、CR8586、CO、NR87又はPR88を表し、
 Xは、単結合又はCOを表し、
 R85、R86、R87及びR88は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~20のアリール基又は炭素原子数7~20のアリールアルキル基を表し、
 上記各アルキル基又はアリールアルキル基は、ハロゲン原子、ニトロ基、シアノ基、水酸基、カルボキシル基又は複素環含有基で置換されている場合があり、
 上記各アルキル基又はアリールアルキル基中のメチレン基は、-O-で置き換えられている場合があり、
 R73及びR74は、それぞれ独立に、隣接するどちらかのベンゼン環と一緒になって環を形成している場合があり、
 e1は、0~4の整数を表し、
 e2は、0~5の整数を表す。)
(Wherein, R 71 and R 72 each independently represent a hydrogen atom, a cyano group, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl having 7 to 30 carbon atoms A group or a heterocycle-containing group having 2 to 20 carbon atoms,
R 73 and R 74 each independently represent a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group, R 75 , OR 76 , SR 77 , NR 78 R 79 , COR 80 , SOR 81 , SO 2 R 82 or It represents CONR 83 R 84, R 73 and R 74 are, may have bonded to each other to form a ring,
R 75 , R 76 , R 77 , R 78 , R 79 , R 80 , R 81 , R 82 , R 83 and R 84 are each independently an alkyl group having 1 to 20 carbon atoms and 6 to 6 carbon atoms 30 aryl groups, arylalkyl groups having 7 to 30 carbon atoms, or heterocycle-containing groups having 2 to 20 carbon atoms,
X 3 represents an oxygen atom, a sulfur atom, a selenium atom, CR 85 R 86 , CO, NR 87 or PR 88 ,
X 4 represents a single bond or CO;
R 85 , R 86 , R 87 and R 88 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms or an arylalkyl group having 7 to 20 carbon atoms Represents
Each of the above alkyl groups or arylalkyl groups may be substituted with a halogen atom, a nitro group, a cyano group, a hydroxyl group, a carboxyl group or a heterocycle-containing group,
The methylene group in each of the above alkyl groups or arylalkyl groups may be replaced by -O-,
R 73 and R 74 may independently form a ring together with either of adjacent benzene rings,
e1 represents an integer of 0 to 4;
e2 represents an integer of 0 to 5; )
 上記一般式(IV)中のR71、R72、R75、R76、R77、R78、R79、R80、R85、R86、R87及びR88に用いられる炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基並びにこれらの置換基としては、上記「2.化合物A」の項にR等として例示した内容のうち、所定の炭素原子数を満たすものが挙げられる。 The carbon number of 1 used in R 71 , R 72 , R 75 , R 76 , R 77 , R 78 , R 79 , R 80 , R 85 , R 86 , R 87 and R 88 in the above general formula (IV) Examples of the alkyl group of -20, the aryl group of 6 to 30 carbon atoms, the arylalkyl group of 7 to 30 carbon atoms, the heterocycle-containing group of 2 to 20 carbon atoms, and the substituents thereof include the above-mentioned "2. Among the contents exemplified as R 1 and the like in the item of the compound A, those having a predetermined number of carbon atoms can be mentioned.
 上記オキシム系化合物としては、例えば、エタノン-1-〔9-エチル-6-(2-メチルベンゾイル-9H-カルバゾール-3-イル〕-1-(O-アセチルオキシム)、1-〔9-エチル-6-ベンゾイル-9H-カルバゾール-3-イル-オクタン-1-オンオキシム-O-アセテート、1-〔9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル〕-エタン-1-オンオキシム-O-ベンゾエート、1-〔9-n-ブチル-6-(2-エチルベンゾイル)-9H-カルバゾール-3-イル〕-エタン-1-オンオキシム-O-ベンゾエート、エタノン-1-〔9-エチル-6-(2-メチル-4-テトラヒドロフラニルベンゾイル)-9H-カルバゾール-3-イル〕-1-(O-アセチルオキシム)、エタノン-1-〔9-エチル-6-(2-メチル-4-テトラヒドロピラニルベンゾイル)-9H-カルバゾール-3-イル〕-1-(O-アセチルオキシム)、エタノン-1-〔9-エチル-6-(2-メチル-5-テトラヒドロフラニルベンゾイル)-9H-カルバゾール-3-イル〕-1-(O-アセチルオキシム)、エタノン-1-〔9-エチル-6-{2-メチル-4-(2,2-ジメチル-1,3-ジオキソラニル)メトキシベンゾイル}-9H-カルバゾール-3-イル〕-1-(O-アセチルオキシム)、エタノン-1-〔9-エチル-6-(2-メチル-4-テトラヒドロフラニルメトキシベンゾイル)-9H-カルバゾール-3-イル〕-1-(O-アセチルオキシム)等のカルバゾール構造を有するカルバゾール系オキシムエステル化合物が挙げられる。 Examples of the oxime-based compound include: ethanone-1- [9-ethyl-6- (2-methylbenzoyl-9H-carbazol-3-yl] -1- (O-acetyloxime), 1- [9-ethyl -6-Benzoyl-9H-carbazol-3-yl-octan-1-one oxime-O-acetate, 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -ethane- 1-one oxime-O-benzoate, 1- [9-n-butyl-6- (2-ethylbenzoyl) -9H-carbazol-3-yl] -ethan-1-one oxime-O-benzoate, ethanone-1- [ 9-ethyl-6- (2-methyl-4-tetrahydrofuranylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime), Non-1- [9-ethyl-6- (2-methyl-4-tetrahydropyranylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime), ethanone-1- [9-ethyl -6- (2-Methyl-5-tetrahydrofuranylbenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime), ethanone-1- [9-ethyl-6- {2-methyl-4 -(2,2-Dimethyl-1,3-dioxolanyl) methoxybenzoyl} -9H-carbazol-3-yl] -1- (O-acetyloxime), ethanone-1- [9-ethyl-6- (2-) Carbazole-based ox having a carbazole structure such as methyl-4-tetrahydrofuranyl methoxybenzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime) Muesuteru compounds.
 上記オキシム系化合物としては、例えば、インドール構造を有するインドール系オキシムエステル化合物も用いることができる。
 インドール系オキシムエステル化合物としては、例えば、国際公開第2017/051680号に記載される下記一般式(V)で表されるオキシムエステル化合物等を挙げることができる。
As the oxime compound, for example, an indole oxime ester compound having an indole structure can also be used.
As an indole type oxime ester compound, the oxime ester compound etc. which are represented by the following general formula (V) described in international publication 2017/051680 can be mentioned, for example.
Figure JPOXMLDOC01-appb-C000038
Figure JPOXMLDOC01-appb-C000038
(式中、R201及びR202は、それぞれ独立に、R211、OR211、COR211、SR211、CONR212213又はCNを表し、
 R211、R212及びR213は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
 R211、R212及びR213で表わされる基の水素原子は、更にR221、OR221、COR221、SR221、NR222223、CONR222223、NR222OR223、NCOR222OCOR223、NR222COR221、OCOR221、COOR221、SCOR221、OCSR221、COSR221、CSOR221、水酸基、ニトロ基、CN、ハロゲン原子、又はCOOR221で置換されている場合があり、
 R221、R222及びR223は、それぞれ独立に、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
 R221、R222及びR223で表される基の水素原子は、更に水酸基、ニトロ基、CN、ハロゲン原子、水酸基又はカルボキシル基で置換されている場合があり、
 R211、R212、R213、R221、R222及びR223で表される基のアルキレン部分のメチレン基は、-O-、-S-、-COO-、-OCO-、-OCOO-、-CONR224-、-NR224-、-NR224CO-、-NR224COO-、-OCONR224-、-SCO-、-COS-、-OCS-又は-SCOO-により置き換えられている場合があり、
 R224は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
 R211、R212、R213、R221、R222、R223及びR224で表される基のアルキル部分は、分岐側鎖がある場合があり、環状アルキルである場合があり、
 R203は、水素原子、炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、R203で表される基のアルキル部分は、分岐側鎖がある場合があり、環状アルキルである場合があり、また、R203とR207及びR203とR208はそれぞれ一緒になって環を形成している場合があり、
 R203で表わされる基の水素原子は、更にR221、OR221、COR221、SR221、NR222223、CONR222223、NR222OR223、NCOR222OCOR223、NR222COR221、OCOR221、COOR221、SCOR221、OCSR221、COSR221、CSOR221、水酸基、ニトロ基、CN、ハロゲン原子、又はCOOR221で置換されている場合があり、
 R204、R205、R206及びR207は、それぞれ独立に、R211、OR211、SR211、COR214、CONR215216、NR212COR211、OCOR211、COOR214、SCOR211、OCSR211、COSR214、CSOR211、水酸基、CN又はハロゲン原子を表し、R204とR205、R205とR206及びR206とR207はそれぞれ一緒になって環を形成している場合があり、
 R204、R205、R206及びR207で表わされる基の水素原子は、更にR221、OR221、COR221、SR221、NR222223、CONR222223、NR222OR223、NCOR222OCOR223、NR222COR221、OCOR221、COOR221、SCOR221、OCSR221、COSR221、CSOR221、水酸基、ニトロ基、CN、ハロゲン原子又はCOOR221で置換されている場合があり、
 R214、R215及びR216は、水素原子又は炭素原子数1~20のアルキル基を表し、
 R214、R215及びR216で表される基のアルキル部分は、分岐側鎖がある場合があり、環状アルキルである場合があり、
 R208は、R211、OR211、SR211、COR211、CONR212213、NR212COR211、OCOR211、COOR211、SCOR211、OCSR211、COSR211、CSOR211、水酸基、CN又はハロゲン原子を表し、
 n1は、0又は1を表す。)
(Wherein, R 201 and R 202 each independently represent R 211 , OR 211 , COR 211 , SR 211 , CONR 212 R 213 or CN,
R 211 , R 212 and R 213 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a carbon atom Represents a heterocycle-containing group of 2 to 20,
The hydrogen atoms of the groups represented by R 211 , R 212 and R 213 further include R 221 , OR 221 , COR 221 , SR 221 , NR 222 R 223 , CONR 222 R 223 , NR 222 OR 223 , NCOR 222 OCOR 223 , NR 222 COR 221 , OCOR 221 , COOR 221 , SCOR 221 , OCSR 221 , COSR 221 , CSOR 221 , and may be substituted with a hydroxyl group, a nitro group, CN, a halogen atom, or COOR 221 ,
R 221 , R 222 and R 223 each independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a carbon atom Represents a heterocycle-containing group of 2 to 20,
The hydrogen atom of the group represented by R 221 , R 222 and R 223 may be further substituted by a hydroxyl group, a nitro group, CN, a halogen atom, a hydroxyl group or a carboxyl group,
Methylene groups in the alkylene portion of the group represented by R 211, R 212, R 213 , R 221, R 222 and R 223 is, -O -, - S -, - COO -, - OCO -, - OCOO-, -CONR 224 -, - NR 224 - , - NR 224 CO -, - NR 224 COO -, - OCONR 224 -, - SCO -, - COS -, - OCS- or it may have been replaced by -SCOO- ,
R 224 is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a heterocycle-containing group having 2 to 20 carbon atoms Represent
The alkyl part of the group represented by R 211 , R 212 , R 213 , R 221 , R 222 , R 223 and R 224 may have branched side chains and may be cyclic alkyl,
R 203 represents a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms or a heterocycle-containing group having 2 to 20 carbon atoms And the alkyl portion of the group represented by R 203 may have branched side chains and may be cyclic alkyl, and R 203 and R 207 and R 203 and R 208 together respectively. May form a ring,
The hydrogen atom of the group represented by R 203 is further R 221 , OR 221 , COR 221 , SR 221 , NR 222 R 223 , CONR 222 R 223 , NR 222 OR 223 , NCOR 222 OCOR 223 , NR 222 COR 221 , OCOR 221 , COOR 221 , SCOR 221 , OCSR 221 , COSR 221 , CSOR 221 , and may be substituted with a hydroxyl group, a nitro group, CN, a halogen atom, or COOR 221 ,
R 204 , R 205 , R 206 and R 207 are each independently R 211 , OR 211 , SR 211 , COR 214 , CONR 215 R 216 , NR 212 COR 211 , OCOR 211 , COOR 214 , SCOR 211 , OCSR 211 , COSR 214 , CSOR 211 , a hydroxyl group, CN or a halogen atom, and R 204 and R 205 , R 205 and R 206, and R 206 and R 207 may together form a ring, respectively.
The hydrogen atoms of the groups represented by R 204 , R 205 , R 206 and R 207 are further R 221 , OR 221 , COR 221 , SR 221 , NR 222 R 223 , CONR 222 R 223 , NR 222 OR 223 , NCOR 222 It may be substituted by OCOR 223 , NR 222 COR 221 , OCOR 221 , COOR 221 , SCOR 221 , OCSR 221 , COSR 221 , CSOR 221 , a hydroxyl group, a nitro group, CN, a halogen atom or COOR 221 ,
R 214 , R 215 and R 216 each represent a hydrogen atom or an alkyl group having 1 to 20 carbon atoms,
The alkyl part of the groups represented by R 214 , R 215 and R 216 may have branched side chains and may be cyclic alkyl,
R 208 represents R 211 , OR 211 , SR 211 , COR 211 , CONR 212 R 213 , NR 212 COR 211 , OCOR 211 , COOR 211 , SCOR 211 , OCSR 211 , COSR 211 , CSOR 211 , a hydroxyl group, CN or a halogen atom Represents
n1 represents 0 or 1; )
 上記一般式(V)中のR203、R211、R212、R213、R214、R215、R216、R221、R222、R223及びR224に用いられる炭素原子数1~20のアルキル基、炭素原子数6~30のアリール基、炭素原子数7~30のアリールアルキル基又は炭素原子数2~20の複素環含有基としては、上記「2.化合物A」の項にR等として例示した内容のうち、所定の炭素原子数を満たすものが挙げられる。 The number of carbon atoms used in R 203 , R 211 , R 212 , R 213 , R 214 , R 215 , R 216 , R 221 , R 222 , R 223 and R 224 in the above general formula (V) Examples of the alkyl group, the aryl group having 6 to 30 carbon atoms, the arylalkyl group having 7 to 30 carbon atoms, and the heterocycle-containing group having 2 to 20 carbon atoms include R 1 in the section of “2. Among the contents exemplified as etc., those satisfying a predetermined number of carbon atoms are mentioned.
 その他のラジカル重合開始剤としては、2,4,6-トリメチルベンゾイルジフェニルフォスフィンオキサイド等のホスフィンオキサイド系化合物及びビス(シクロペンタジエニル)-ビス[2,6-ジフルオロ-3-(ピル-1-イル)]チタニウム等のチタノセン系化合物等が挙げられる。 Other radical polymerization initiators include phosphine oxide compounds such as 2,4,6-trimethylbenzoyl diphenyl phosphine oxide and bis (cyclopentadienyl) -bis [2,6-difluoro-3- (pill-1) -Yl)] Titanocene compounds such as titanium etc. may be mentioned.
 市販のラジカル重合開始剤としては、アデカオプトマーN-1414、N-1717、N-1919、アデカアークルズNCI-831、NCI-930(ADEKA社製)、IRGACURE184、IRGACURE369、IRGACURE651、IRGACURE907、IRGACURE OXE 01、IRGACURE OXE 02、OXE 03、OXE 04、IRGACURE784(BASF社製)、TR-PBG-304、TR-PBG-305、TR-PBG-309及びTR-PBG-314(Tronly社製)等が挙げられる。 Commercially available radical polymerization initiators include Adeka optomer N-1414, N-1717, N-1919, Adeka Arkles NCI-831, NCI-930 (manufactured by ADEKA Corporation), IRGACURE 184, IRGACURE 369, IRGACURE 651, IRGACURE 907, IRGACURE OXE 01, IRGACURE OXE 02, OXE 03, OXE 04, IRGACURE 784 (manufactured by BASF), TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-314 (manufactured by Tronly) and the like. Be
 これらの光ラジカル重合開始剤は1種あるいは2種以上のものを所望の性能に応じて配合して使用することができる。 These radical photopolymerization initiators can be used alone or in combination of two or more depending on the desired performance.
 上記光カチオン重合開始剤としては、光照射によりカチオン重合を開始させる物質を放出させることが可能な化合物であれば特に制限されず、既存の化合物を用いることが可能であり、好ましくは、エネルギー線の照射によってルイス酸を放出するオニウム塩である複塩、又はその誘導体である。かかる化合物の代表的なものとしては、下記一般式、
[A1]r+[B1]r-
で表される陽イオンと陰イオンの塩を挙げることができる。
The photocationic polymerization initiator is not particularly limited as long as it is a compound capable of releasing a substance that causes cationic polymerization to be initiated by light irradiation, and it is possible to use an existing compound, and preferably an energy ray. The compound is a double salt which is an onium salt that releases a Lewis acid upon irradiation with or a derivative thereof. Representative examples of such compounds include the following general formula:
[A1] r + [B1] r-
And salts of cations and anions represented by
 上記陽イオン[A1]r+はオニウムであることが好ましく、その構造は、例えば、下記一般式で表すことができる。
[(R101f1Q]r+
The cation [A1] r + is preferably onium, and the structure thereof can be represented by, for example, the following general formula.
[(R 101 ) f 1 Q] r +
 更にここで、R101は炭素原子数が1~60であり、炭素原子以外の原子をいくつも含んでいる場合がある有機の基である。f1は1~5のいずれかの整数である。f1個のR101は各々独立で、同じである場合も異なっている場合もある。また、R101の少なくとも1つは、芳香環を有する上記の如き有機の基であることが好ましい。例えば、アルキル基、アルコキシ基、ヒドロキシ基、ヒドロキシアルコキシ基、ハロゲン原子、ベンジル基、チオフェノキシ基、4-ベンゾイルフェニルチオ基、2-クロロ-4-ベンゾイルフェニルチオ基等で置換されている場合があるフェニル基が挙げられる。QはS,N,Se,Te,P,As,Sb,Bi,O,I,Br,Cl,F,N=Nからなる群から選ばれる原子或いは原子団である。また、陽イオン[A1]r+中のQの原子価をqとしたとき、r=f1-qとなる関係が成り立つことが必要である(但し、N=Nは原子価0として扱う)。 Furthermore, here, R 101 is an organic group having 1 to 60 carbon atoms and which may contain several atoms other than carbon atoms. f1 is an integer of 1 to 5; The f1 Rs 101 are independent of each other, and may be the same or different. Further, at least one of R 101 is preferably an organic group as described above having an aromatic ring. For example, when substituted by an alkyl group, alkoxy group, hydroxy group, hydroxyalkoxy group, halogen atom, benzyl group, thiophenoxy group, 4-benzoylphenylthio group, 2-chloro-4-benzoylphenylthio group, etc. A certain phenyl group is mentioned. Q is an atom or atomic group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N = N. Also, when the valence of Q in the cation [A1] r + is q, it is necessary that the relationship r = f1-q holds (where N = N is treated as having a valence of 0).
 また、陰イオン[B1]r-は、ハロゲン化物錯体であることが好ましく、その構造は、例えば、下記一般式、[LXf2r-で表すことができる。 The anion [B1] r- is preferably a halide complex, and its structure can be represented, for example, by the following general formula, [LX f2 ] r- .
 更にここで、Lはハロゲン化物錯体の中心原子である金属又は半金属(Metalloid)であり、B,P,As,Sb,Fe,Sn,Bi,Al,Ca,In,Ti,Zn,Sc,V,Cr,Mn及びCo等である。
 Xf2は、ハロゲン原子、又は、ハロゲン原子やアルコキシ基等で置換されている場合があるフェニル基である。f2は3~7の整数である。
 また、陰イオン[B1]r-中のLの原子価をpとしたとき、r=f2-pとなる関係が成り立つことが必要である。
Furthermore, here, L is a metal or metalloid (Metalloid) which is a central atom of a halide complex, and B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co and the like.
X f2 is a halogen atom or a phenyl group which may be substituted by a halogen atom, an alkoxy group or the like. f2 is an integer of 3 to 7;
Also, when the valence of L in the anion [B1] r -is p, it is necessary that the relationship r = f2-p holds.
 上記一般式の陰イオン[LXf2r-の具体例としては、テトラキス(ペンタフルオロフェニル)ボレート、テトラ(3,5-ジフルオロ-4-メトキシフェニル)ボレート、テトラフルオロボレート(BF4、ヘキサフルオロフォスフェート(PF6、ヘキサフルオロアンチモネート(SbF6、ヘキサフルオロアルセネート(AsF6及びヘキサクロロアンチモネート(SbCl6等を挙げることができる。 Specific examples of the anion [LX f2 ] r- of the above general formula include tetrakis (pentafluorophenyl) borate, tetra (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroborate (BF 4 ) , Hexafluorophosphate (PF 6 ) , hexafluoroantimonate (SbF 6 ) , hexafluoroarsenate (AsF 6 ) and hexachloroantimonate (SbCl 6 ) can be mentioned.
 また、陰イオン[B1]r-は、下記一般式、
[LXf2-1(OH)]r-
で表される構造のものも好ましく用いることができる。L,X,f2は上記と同様である。また、その他用いることのできる陰イオンとしては、過塩素酸イオン(ClO4
トリフルオロメチル亜硫酸イオン(CF3SO3、フルオロスルホン酸イオン(FSO3、トルエンスルホン酸陰イオン、トリニトロベンゼンスルホン酸陰イオン、カンファースルフォネート、ノナフロロブタンスルフォネート、ヘキサデカフロロオクタンスルフォネート、テトラアリールボレート及びテトラキス(ペンタフルオロフェニル)ボレート等を挙げることができる。
Further, the anion [B1] r- has the following general formula,
[LX f2-1 (OH)] r-
The thing of the structure represented by can also be used preferably. L, X and f2 are the same as above. Other anions which can be used include perchlorate ion (ClO 4 ) ,
Trifluoromethyl sulfite (CF 3 SO 3 ) , fluorosulfonate ion (FSO 3 ) , toluenesulfonate anion, trinitrobenzenesulfonate anion, camphorsulfonate, nonafluorobutanesulfonate, hexadeca There may be mentioned fluorooctane sulfonate, tetraaryl borate and tetrakis (pentafluorophenyl) borate.
 本発明では、このようなオニウム塩の中でも、下記の(ホ)~(ト)の芳香族オニウム塩を使用することが特に有効であり、好ましい。これらの中から、その1種を単独で、又は2種以上を混合して使用することができる。 In the present invention, among such onium salts, it is particularly effective and preferable to use an aromatic onium salt of the following (e) to (t). Among these, 1 type can be used individually or in mixture of 2 or more types.
 (ホ)フェニルジアゾニウムヘキサフルオロホスフェート、4-メトキシフェニルジアゾニウムヘキサフルオロアンチモネート及び4-メチルフェニルジアゾニウムヘキサフルオロホスフェート等のアリールジアゾニウム塩。 (E) aryldiazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate and 4-methylphenyldiazonium hexafluorophosphate.
 (へ)ジフェニルヨードニウムヘキサフルオロアンチモネート、ジ(4-メチルフェニル)ヨードニウムヘキサフルオロホスフェート、ジ(4-tert-ブチルフェニル)ヨードニウムヘキサフルオロホスフェート及びトリルクミルヨードニウムテトラキス(ペンタフルオロフェニル)ボレート等のジアリールヨードニウム塩。 (F) Diaryls such as diphenyliodonium hexafluoroantimonate, di (4-methylphenyl) iodonium hexafluorophosphate, di (4-tert-butylphenyl) iodonium hexafluorophosphate and tolycamyliodonium tetrakis (pentafluorophenyl) borate Iodonium salt.
 (ト)下記群I又は群IIで表されるスルホニウムカチオンとヘキサフルオロアンチモンイオン、テトラキス(ペンタフルオロフェニル)ボレートイオン等のスルホニウム塩。 (G) Sulfonium salts represented by the following Group I or Group II: sulfonium salts such as hexafluoroantimony ion, tetrakis (pentafluorophenyl) borate ion and the like.
Figure JPOXMLDOC01-appb-C000039
Figure JPOXMLDOC01-appb-C000039
Figure JPOXMLDOC01-appb-C000040
Figure JPOXMLDOC01-appb-C000040
 また、その他好ましいものとしては、(η5-2,4-シクロペンタジエン-1-イル)〔(1,2,3,4,5,6-η)-(1-メチルエチル)ベンゼン〕-アイアン-ヘキサフルオロホスフェート等の鉄-アレーン錯体;トリス(アセチルアセトナト)アルミニウム、トリス(エチルアセトナトアセタト)アルミニウム、トリス(サリチルアルデヒダト)アルミニウム等のアルミニウム錯体;トリフェニルシラノール等のシラノール類との混合物:等も挙げることができる。 In addition, other preferable ones are (η5-2, 4-cyclopentadien-1-yl) [(1, 2, 3, 4, 5, 6 η)-(1-methylethyl) benzene] -iron- Iron-arene complexes such as hexafluorophosphate; aluminum complexes such as tris (acetylacetonato) aluminum, tris (ethylacetonatoacetato) aluminum, tris (salicylaldehyde) aluminum; mixtures with silanols such as triphenylsilanol : Etc. can also be mentioned.
 上記光カチオン重合開始剤としては、市販品を用いることもでき、例えば、IRUGACURE261(BASF社製)、アデカオプトマーSP-150、SP-151、SP-152、SP-170、SP-171、SP-172(ADEKA社製)、UVE-1014(ゼネラルエレクトロニクス社製)、CD-1012(サートマー社製)、CI-2064、CI-2481(日本曹達社製)、Uvacure1590、1591(ダイセルUCB)、CYRACURE UVI-6990(ユニオンカーバイド社製)、BBI-103、MPI-103、TPS-103、MDS-103、DTS-103、NAT-103及びNDS-103(ミドリ化学社製)等が挙げられる。 A commercial item can also be used as said photocationic polymerization initiator, For example, IRUGACURE 261 (made by BASF Corporation), Adeka optomer SP-150, SP-151, SP-152, SP-170, SP-171, SP -172 (made by Adeka), UVE-1014 (made by General Electronics), CD-1012 (made by Sartmar), CI-2064, CI-2481 (made by Nippon Soda Co., Ltd.), Uvacure 1590, 1591 (Daicel UCB), CYRACURE UVI-6990 (manufactured by Union Carbide), BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103 and NDS-103 (manufactured by Midori Chemical Co., Ltd.), and the like.
 これらの中でも、実用面と光感度の観点から、芳香族ヨードニウム塩、芳香族スルホニウム塩、鉄-アレーン錯体を用いることが好ましい。 Among these, aromatic iodonium salts, aromatic sulfonium salts and iron-arene complexes are preferably used from the viewpoint of practical use and light sensitivity.
 上記光アニオン重合開始剤としては、光により塩基を発生するものを用いることができ、光アニオン重合開始剤として公知のものを用いることができる。
 上記光アニオン重合開始剤としては、例えば、アセトフェノン O-アロイルオキシム(acetophenoneO-aroyloxime)、ニフェジピン(nifedipine)等を挙げることができる。
As said photoanion polymerization initiator, what generate | occur | produces a base with light can be used, and what is well-known as a photoanion polymerization initiator can be used.
Examples of the photoanion polymerization initiator include acetophenone O-aroyloxime (acetophenone O-aroyloxime), nifedipine and the like.
(b)熱重合開始剤
 上記熱重合開始剤としては、加熱することにより重合性化合物を重合可能なものであればよく、ラジカル重合開始剤、カチオン重合開始剤、アニオン重合開始剤等を挙げることができる。
(B) Thermal polymerization initiator As the above-mentioned thermal polymerization initiator, any one capable of polymerizing a polymerizable compound by heating may be used, and a radical polymerization initiator, a cationic polymerization initiator, an anionic polymerization initiator, etc. may be mentioned. Can.
 上記熱ラジカル重合開始剤としては、加熱によりラジカルを発生するものを用いることができ、熱ラジカル重合開始剤として公知のものを用いることができる。
 上記熱ラジカル重合開始剤としては、例えば、アゾ系化合物、過酸化物及び過硫酸塩等を好ましいものとして例示することができる。
As said thermal radical polymerization initiator, what generate | occur | produces a radical can be used by heating, and a well-known thing can be used as a thermal radical polymerization initiator.
As said thermal radical polymerization initiator, an azo compound, a peroxide, a persulfate, etc. can be illustrated as a preferable thing, for example.
 上記アゾ系化合物としては、2,2′-アゾビスイソブチロニトリル、2,2′-アゾビス(メチルイソブチレ-ト)、2,2’-アゾビス-2,4-ジメチルバレロニトリル、1,1’-アゾビス(1-アセトキシ-1-フェニルエタン)等が挙げられる。 Examples of the above azo compounds include 2,2'-azobisisobutyronitrile, 2,2'-azobis (methylisobutyrate), 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1 ' And -azobis (1-acetoxy-1-phenylethane) and the like.
 過酸化物としては、ベンゾイルパーオキサイド、ジ-t-ブチルベンゾイルパーオキサイド、t-ブチルパーオキシピバレート及びジ(4-t-ブチルシクロヘキシル)パーオキシジカーボネート等が挙げられる。 Examples of peroxides include benzoyl peroxide, di-t-butyl benzoyl peroxide, t-butyl peroxypivalate and di (4-t-butylcyclohexyl) peroxy dicarbonate.
 上記過硫酸塩としては、過硫酸アンモニウム、過硫酸ナトリウム及び過硫酸カリウム等の過硫酸塩等が挙げられる。 Examples of the persulfate include persulfates such as ammonium persulfate, sodium persulfate and potassium persulfate.
 上記熱カチオン重合開始剤としては、加熱によりカチオン種又はルイス酸を発生するものを用いることができ、熱カチオン重合開始剤として公知のものを用いることができる。
 上記熱カチオン重合開始剤としては、具体的には、スルホニウム塩、チオフェニウム塩、チオラニウム塩、ベンジルアンモニウム、ピリジニウム塩及びヒドラジニウム塩等の塩;ジエチレントリアミン、トリエチレントリアミン及びテトラエチレンペンタミン等のポリアルキルポリアミン類;1,2-ジアミノシクロヘキサン、1,4-ジアミノ-3,6-ジエチルシクロヘキサン及びイソホロンジアミン等の脂環式ポリアミン類;m-キシリレンジアミン、ジアミノジフェニルメタン及びジアミノジフェニルスルホン等の芳香族ポリアミン類;上記ポリアミン類と、フェニルグリシジルエーテル、ブチルグリシジルエーテル、ビスフェノールA-ジグリシジルエーテル及びビスフェノールF-ジグリシジルエーテル等のグリシジルエーテル類又はカルボン酸のグリシジルエステル類等の各種エポキシ樹脂とを常法によって反応させることによって製造されるポリエポキシ付加変性物;上記有機ポリアミン類と、フタル酸、イソフタル酸及びダイマー酸等のカルボン酸類とを常法によって反応させることによって製造されるアミド化変性物;上記ポリアミン類とホルムアルデヒド等のアルデヒド類及びフェノール、クレゾール、キシレノール、第三ブチルフェノール及びレゾルシン等の核に少なくとも一個のアルデヒド化反応性場所を有するフェノール類とを常法によって反応させることによって製造されるマンニッヒ化変性物;多価カルボン酸(シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、ドデカン二酸、2-メチルコハク酸、2-メチルアジピン酸、3-メチルアジピン酸、3-メチルペンタン二酸、2-メチルオクタン二酸、3,8-ジメチルデカン二酸、3,7-ジメチルデカン二酸、水添ダイマー酸及びダイマー酸等の脂肪族ジカルボン酸類;フタル酸、テレフタル酸、イソフタル酸及びナフタレンジカルボン酸等の芳香族ジカルボン酸類;シクロヘキサンジカルボン酸等の脂環式ジカルボン酸類;トリメリット酸、トリメシン酸及びひまし油脂肪酸等の三量体等のトリカルボン酸類;ピロメリット酸等のテトラカルボン酸類等)の酸無水物;ジシアンジアミド、イミダゾール類、カルボン酸エステル、スルホン酸エステル及びアミンイミド等を挙げることができる。
 上記熱カチオン重合開始剤としては、市販品を用いることもでき、例えば、アデカオプトンCP-77、アデカオプトンCP-66(ADEKA社製)、CI-2639、CI-2624(日本曹達社製)、サンエイドSI-60L、サンエイドSI-80L、サンエイドSI-100L(三新化学工業社製)等が挙げられる。
As said thermal cationic polymerization initiator, what generate | occur | produces cationic seed | species or a Lewis acid by heating can be used, and a well-known thing can be used as a thermal cationic polymerization initiator.
Specific examples of the thermal cationic polymerization initiator include salts such as sulfonium salts, thiophenium salts, thiolanium salts, benzyl ammonium, pyridinium salts and hydrazinium salts; and polyalkylpolyamines such as diethylenetriamine, triethylenetriamine and tetraethylenepentamine. Alicyclic polyamines such as 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane and isophorone diamine; Aromatic polyamines such as m-xylylenediamine, diaminodiphenylmethane and diaminodiphenyl sulfone Glycidyl ethers such as the above polyamines and phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether and bisphenol F-diglycidyl ether Or a polyepoxy adduct modified product produced by reaction with various epoxy resins such as glycidyl esters of carboxylic acid according to a conventional method; the above organic polyamines and carboxylic acids such as phthalic acid, isophthalic acid and dimer acid Amidated modified products produced by reaction according to a conventional method; the above-mentioned polyamines and aldehydes such as formaldehyde and the like, having at least one aldehyded reactive site in the nucleus such as phenol, cresol, xylenol, tert-butylphenol and resorcin Mannich modified products produced by reacting phenols in a usual manner; polyvalent carboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid) , Dodecanedioic acid, 2 Methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylpentanedioic acid, 2-methyloctanedioic acid, 3,8-dimethyldecanedioic acid, 3,7-dimethyldecanedioic acid, hydrogenated dimer Aliphatic dicarboxylic acids such as acid and dimer acid; aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid and naphthalene dicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexane dicarboxylic acid; trimellitic acid, trimesic acid and castor oil fatty acid Etc .; acid anhydrides of tetracarboxylic acids such as pyromellitic acid etc.); dicyandiamide, imidazoles, carboxylic acid esters, sulfonic acid esters, amine imides and the like.
A commercial item can also be used as said thermal cationic polymerization initiator, For example, Adeka opton CP-77, Adeka opton CP-66 (made by ADEKA), CI-2639, CI-2624 (made by Nippon Soda Co., Ltd.), Sun Aid SI -60 L, San Aid SI-80 L, San Aid SI-100 L (manufactured by Sanshin Chemical Industry Co., Ltd.), and the like.
 上記熱アニオン重合開始剤としては、熱により塩基を発生するものを用いることができ、熱アニオン重合開始剤として公知のものを用いることができる。
 上記アニオン重合開始剤としては、具体的には、脂肪族アミン系化合物、芳香族アミン系化合物、二級又は三級アミン系化合物、イミダゾール系化合物、ポリメルカプタン系化合物、三フッ化ホウ素-アミン錯体、ジシアンジアミド、有機酸ヒドラジッド等を用いることができる。
As said thermal anion polymerization initiator, what generate | occur | produces a base by heat can be used, and what is well-known as a thermal anion polymerization initiator can be used.
Specific examples of the anionic polymerization initiator include aliphatic amine compounds, aromatic amine compounds, secondary or tertiary amine compounds, imidazole compounds, polymercaptan compounds, and boron trifluoride-amine complex. , Dicyandiamide, organic acid hydrazide and the like can be used.
(c)重合開始剤の含有量
 上記重合開始剤の含有量としては、所望の硬化性や感光性を付与できるものであればよいが、例えば、固形分100質量部に対して、0.1質量部以上30質量部以下とすることができ、0.5質量部以上10質量部以下であることが好ましい。上記含有量であることで、組成物は、硬化性等に優れ、また、分散性等にも優れるからである。
 上記重合開始剤の含有量としては、所望の硬化性や感光性を付与できるものであればよいが、例えば、重合性化合物100質量部に対して、0.001質量部以上20質量部以下とすることができ、0.01質量部以上10質量部以下であることが好ましく、0.1質量部以上5質量部以下であることが好ましい。上記含有量であることで、組成物は、硬化性等に優れ、また、分散性等にも優れるからである。
(C) Content of Polymerization Initiator The content of the polymerization initiator may be any as long as it can impart desired curability and photosensitivity. It can be in the range of not less than 30 parts by mass and preferably in the range of 0.5 parts by mass to 10 parts by mass. It is because a composition is excellent in curability etc. and is excellent also in dispersibility etc. by being said content.
The content of the polymerization initiator may be any as long as it can impart desired curability and photosensitivity. For example, it is 0.001 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the polymerizable compound. The amount is preferably 0.01 parts by mass or more and 10 parts by mass or less, and more preferably 0.1 parts by mass or more and 5 parts by mass or less. It is because a composition is excellent in curability etc. and is excellent also in dispersibility etc. by being said content.
(2)着色剤
 上記着色剤としては、硬化物に所望の着色を付与できるものであればよく、染料あるいは顔料が挙げられる。
 染料としては、380~1200nmに吸収を有する化合物を用いることができ、例えば、アゾ化合物、アントラキノン化合物、インジゴイド化合物、トリアリールメタン化合物、キサンテン化合物、アリザリン化合物、アクリジン化合物、スチルベン化合物、チアゾール化合物、ナフトール化合物、キノリン化合物、ニトロ化合物、インダミン化合物、オキサジン化合物、フタロシアニン化合物、シアニン化合物、ジインモニウム化合物、シアノエテニル化合物、ジシアノスチレン化合物、ローダミン化合物、ペリレン化合物、ポリエンナフトラクタム化合物、クマリン化合物、スクアリリウム化合物、クロコニウム化合物、スピロピラン化合物、スピロオキサジン化合物、メロシアニン化合物、オキソノール化合物、スチリル化合物、ピリリウム化合物、ローダニン化合物、オキサゾロン化合物、フタルイミド化合物、シンノリン化合物、ナフトキノン化合物、アザアントラキノン化合物、ポルフィリン化合物、アザポルフィリン化合物、ピロメテン化合物、キナクリドン化合物、ジケトピロロピロール化合物、インジゴ化合物、アクリジン化合物、アジン化合物、アゾメチン化合物、アニリン化合物、キナクリドン化合物、キノフタロン化合物、キノンイミン化合物、イリジウム錯体化合物、ユーロピウム錯体化合物等の染料等が挙げられ、これらは複数を混合して用いてもよい。
(2) Coloring agent As said coloring agent, what is necessary is just to be able to provide desired coloring to hardened | cured material, and a dye or a pigment is mentioned.
As the dye, a compound having absorption at 380 to 1200 nm can be used, and for example, azo compound, anthraquinone compound, indigoid compound, triarylmethane compound, xanthene compound, alizarin compound, acridine compound, stilbene compound, thiazole compound, naphthol Compound, quinoline compound, nitro compound, indamine compound, oxazine compound, phthalocyanine compound, cyanine compound, diimmonium compound, cyanoethenyl compound, dicyanostyrene compound, rhodamine compound, perylene compound, polyene naphtholactam compound, coumarin compound, squalilium compound, squarylium compound, Spiropyran compounds, spirooxazine compounds, merocyanine compounds, oxonol compounds, styryl compounds, pi Lithium compounds, rhodanine compounds, oxazolone compounds, phthalimide compounds, cinnoline compounds, naphthoquinone compounds, azaanthraquinone compounds, porphyrin compounds, azaporphyrin compounds, pyromethene compounds, quinacridone compounds, diketopyrrolopyrrole compounds, indigo compounds, acridine compounds, azine compounds, Azomethine compounds, aniline compounds, quinacridone compounds, quinophthalone compounds, quinone imine compounds, iridium complex compounds, dyes such as europium complex compounds, and the like may be mentioned, and a plurality of these may be mixed and used.
 顔料としては、無機顔料あるいは有機顔料を用いることができ、例えば、ニトロソ化合物、ニトロ化合物、アゾ化合物、ジアゾ化合物、キサンテン化合物、キノリン化合物、アントラキノン化合物、クマリン化合物、フタロシアニン化合物、イソインドリノン化合物、イソインドリン化合物、キナクリドン化合物、アンタンスロン化合物、ペリノン化合物、ペリレン化合物、ジケトピロロピロール化合物、チオインジゴ化合物、ジオキサジン化合物、トリフェニルメタン化合物、キノフタロン化合物、ナフタレンテトラカルボン酸;アゾ染料、シアニン染料の金属錯体化合物;レーキ顔料;ファーネス法、チャンネル法、サーマル法によって得られるカーボンブラック、或いはアセチレンブラック、ケッチェンブラック又はランプブラック等のカーボンブラック;上記カーボンブラックをエポキシ樹脂で調整、被覆したもの、上記カーボンブラックを予め溶媒中で樹脂により分散処理し、20~200mg/gの樹脂を吸着させたもの、上記カーボンブラックを酸性又はアルカリ性表面処理したもの、平均粒径が8nm以上でDBP吸油量が90ml/100g以下のもの、950℃における揮発分中のCO、CO2から算出した全酸素量が、カーボンブラックの表面積100m当たり9mg以上であるもの;黒鉛、黒鉛化カーボンブラック、活性炭、炭素繊維、カーボンナノチューブ、カーボンマイクロコイル、カーボンナノホーン、カーボンエアロゲル、フラーレン;アニリンブラック、ピグメントブラック7、チタンブラック;疎水性樹脂、酸化クロム緑、ミロリブルー、コバルト緑、コバルト青、マンガン系、フェロシアン化物、リン酸塩群青、紺青、ウルトラマリン、セルリアンブルー、ピリジアン、エメラルドグリーン、硫酸鉛、黄色鉛、亜鉛黄、べんがら(赤色酸化鉄(III))、カドミウム赤、合成鉄黒、アンバー等の無機含量又は有機顔料を用いることができる。これらの顔料は単独で、或いは複数を混合して用いることができる。 As the pigment, an inorganic pigment or an organic pigment can be used. For example, nitroso compound, nitro compound, azo compound, diazo compound, xanthene compound, quinoline compound, anthraquinone compound, coumarin compound, phthalocyanine compound, isoindolinone compound, iso Indoline compounds, quinacridone compounds, anthrone compounds, perinone compounds, perylene compounds, diketopyrrolopyrrole compounds, thioindigo compounds, dioxazine compounds, triphenylmethane compounds, quinophthalone compounds, naphthalenetetracarboxylic acids; metal complex compounds of azo dyes, cyanine dyes; Lake pigment; carbon black obtained by furnace method, channel method, thermal method, or acetylene black, ketjen black or lamp black, etc. Carbon black: one prepared by coating the above carbon black with an epoxy resin and coated, one obtained by dispersing the carbon black in a solvent beforehand with a resin and adsorbing a resin of 20 to 200 mg / g, the above carbon black is acidic or alkaline Surface-treated, with an average particle diameter of 8 nm or more and a DBP oil absorption of 90 ml / 100 g or less, CO in volatiles at 950 ° C., total oxygen amount calculated from CO 2 is 9 mg per 100 m 2 of surface area of carbon black Graphite, graphitized carbon black, activated carbon, carbon fiber, carbon nanotube, carbon micro coil, carbon nanohorn, carbon aerogel, fullerene; aniline black, pigment black 7, titanium black; hydrophobic resin, chromium oxide green, Miroli Blue, Baltic green, cobalt blue, manganese based, ferrocyanide, phosphate group blue, bitumen, ultramarine, cerulian blue, pyridinian, emerald green, lead sulfate, yellow lead, zinc yellow, red iron oxide (red iron oxide (III)), Inorganic contents such as cadmium red, synthetic iron black, amber and organic pigments can be used. These pigments may be used alone or in combination of two or more.
 上記無機顔料又は有機顔料としては、市販の顔料を用いることもでき、例えば、ピグメントレッド1、2、3、9、10、14、17、22、23、31、38、41、48、49、88、90、97、112、119、122、123、144、149、166、168、169、170、171、177、179、180、184、185、192、200、202、209、215、216、217、220、223、224、226、227、228、240、254;ピグメントオレンジ13、31、34、36、38、43、46、48、49、51、52、55、59、60、61、62、64、65、71;ピグメントイエロー1、3、12、13、14、16、17、20、24、55、60、73、81、83、86、93、95、97、98、100、109、110、113、114、117、120、125、126、127、129、137、138、139、147、148、150、151、152、153、154、166、168、175、180、185;ピグメントグリ-ン7、10、36;ピグメントブルー15、15:1、15:2、15:3、15:4、15:5、15:6、22、24、56、60、61、62、64;ピグメントバイオレット1、19、23、27、29、30、32、37、40、50等が挙げられる。 Commercially available pigments can also be used as the above-mentioned inorganic pigment or organic pigment, and for example, pigment red 1, 2, 3, 9, 10, 14, 17, 22, 22, 31, 31, 38, 41, 48, 49, 88, 90, 97, 112, 119, 122, 123, 144, 149, 166, 168, 169, 171, 177, 179, 180, 184, 185, 192, 200, 202, 209, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 254; pigment oranges 13, 31, 34, 36, 38, 43, 46, 48, 49, 51, 52, 55, 59, 60, 61, 62, 64, 65, 71; pigment yellow 1, 3, 12, 13, 14, 16, 17, 20, 24, 55, 60, 73, 81, 83, 86 93, 95, 97, 98, 100, 109, 110, 113, 114, 117, 120, 126, 127, 129, 137, 138, 139, 147, 148, 150, 151, 152, 153, 154, 154, 154, 154, 154, 154, 154, 166, 168, 175, 180, 185; pigment green 7, 10, 36; pigment blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 5, 15: 6, 22, 24, 56, 60, 61, 62, 64; pigment violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 50 and the like.
 上記着色剤の含有量としては、組成物の固形分100質量部に対して0.01質量部以上50質量部以下とすることができる。 As content of the said coloring agent, it can be referred to as 0.01 mass part or more and 50 mass parts or less with respect to 100 mass parts of solid content of a composition.
(3)溶剤
 上記溶剤としては、上記の各成分を溶解又は分散し得るものであればよく、例えば、メチルエチルケトン、メチルアミルケトン、ジエチルケトン、アセトン、メチルイソプロピルケトン、メチルイソブチルケトン、シクロヘキサノン、2-ヘプタノン等のケトン類;エチルエーテル、ジオキサン、テトラヒドロフラン、1,2-ジメトキシエタン、1,2-ジエトキシエタン、ジプロピレングリコールジメチルエーテル等のエーテル系溶媒;酢酸メチル、酢酸エチル、酢酸-n-プロピル、酢酸イソプロピル、酢酸n-ブチル、酢酸シクロヘキシル、乳酸エチル、コハク酸ジメチル、テキサノール等のエステル系溶媒;エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル等のセロソルブ系溶媒;メタノール、エタノール、イソ-又はn-プロパノール、イソ-又はn-ブタノール、アミルアルコール、ジアセトンアルコール等のアルコール系溶媒;エチレングリコールモノメチルアセテート、エチレングリコールモノエチルアセテート、プロピレングリコール-1-モノメチルエーテル-2-アセテート(PGMEA)、ジプロピレングリコールモノメチルエーテルアセテート、3-メトキシブチルアセテート、エトキシエチルプロピオネート、1-t-ブトキシ-2-プロパノール、3-メトキシブチルアセテート、シクロヘキサノールアセテート等のエーテルエステル系溶媒;ベンゼン、トルエン、キシレン等のBTX系溶媒;ヘキサン、ヘプタン、オクタン、シクロヘキサン等の脂肪族炭化水素系溶媒;テレピン油、D-リモネン、ピネン等のテルペン系炭化水素油;ミネラルスピリット、スワゾール#310(コスモ松山石油(株))、ソルベッソ#100(エクソン化学(株))等のパラフィン系溶媒;四塩化炭素、クロロホルム、トリクロロエチレン、塩化メチレン、1,2-ジクロロエタン等のハロゲン化脂肪族炭化水素系溶媒;クロロベンゼン等のハロゲン化芳香族炭化水素系溶媒;カルビトール系溶媒、アニリン、トリエチルアミン、ピリジン、酢酸、アセトニトリル、二硫化炭素、N,N-ジメチルホルムアミド、N,N-ジメチルアセトアミド、N-メチルピロリドン、ジメチルスルホキシド、水等が挙げられ、これらの溶媒は1種又は2種以上の混合溶媒として使用することができる。
(3) Solvent The solvent may be any solvent as long as it can dissolve or disperse the above components. For example, methyl ethyl ketone, methyl amyl ketone, diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, 2- Ketones such as heptanone; ether solvents such as ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, dipropylene glycol dimethyl ether; methyl acetate, ethyl acetate, n-propyl acetate, Ester solvents such as isopropyl acetate, n-butyl acetate, cyclohexyl acetate, ethyl lactate, dimethyl succinate and texanol; cellosolve solvents such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; Alcohol solvents such as ethanol, iso- or n-propanol, iso- or n-butanol, amyl alcohol and diacetone alcohol; ethylene glycol monomethyl acetate, ethylene glycol monoethyl acetate, propylene glycol-1-monomethyl ether-2 -Ether ester solvents such as acetate (PGMEA), dipropylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, ethoxyethyl propionate, 1-t-butoxy-2-propanol, 3-methoxybutyl acetate, cyclohexanol acetate, etc. BTX solvents such as benzene, toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane and cyclohexane; turpentine oil, D-limonene, Terpene-based hydrocarbon oils such as Nene; paraffin spirits such as Mineral Spirit, Swazor # 310 (Cosmo Matsuyama Oil Co., Ltd.), Solvesso # 100 (Exxon Chemical Co., Ltd.); Carbon tetrachloride, chloroform, trichloroethylene, methylene chloride Halogenated aliphatic hydrocarbon solvents such as 1,2-dichloroethane; halogenated aromatic hydrocarbon solvents such as chlorobenzene; carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N-dimethylformamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, water and the like can be mentioned, and these solvents can be used as one or two or more mixed solvents.
 溶剤の含有量は、上記組成物の用途等に応じて適宜設定することができるが、例えば、好ましくは上記組成物中の溶剤以外の成分(固形分)の量が1質量%以上99質量%以下となる量であり、なかでも、10質量%以上90質量%以下であることが好ましく、特に、30質量%以上70質量%以下となる量であることが好ましい。上記含有量が上述の範囲であることで、上記組成物は、塗工性等に優れたものとなるからである。 The content of the solvent can be appropriately set according to the application etc. of the above composition, but preferably, the amount of components (solid content) other than the solvent in the above composition is preferably 1% by mass to 99% by mass The amount is as follows, and in particular, it is preferably 10% by mass to 90% by mass, and particularly preferably 30% by mass to 70% by mass. It is because the said composition becomes what was excellent in coating property etc. because the said content is the above-mentioned range.
(4)連鎖移動剤及び増感剤
 上記連鎖移動剤、増感剤としては、組成物の感度等を調整できるものとすることができ、一般的に硫黄原子含有化合物が用いられる。例えばチオグリコール酸、チオリンゴ酸、チオサリチル酸、2-メルカプトプロピオン酸、3-メルカプトプロピオン酸、3-メルカプト酪酸、N-(2-メルカプトプロピオニル)グリシン、2-メルカプトニコチン酸、3-[N-(2-メルカプトエチル)カルバモイル]プロピオン酸、3-[N-(2-メルカプトエチル)アミノ]プロピオン酸、N-(3-メルカプトプロピオニル)アラニン、2-メルカプトエタンスルホン酸、3-メルカプトプロパンスルホン酸、4-メルカプトブタンスルホン酸、ドデシル(4-メチルチオ)フェニルエーテル、2-メルカプトエタノール、3-メルカプト-1,2-プロパンジオール、1-メルカプト-2-プロパノール、3-メルカプト-2-ブタノール、メルカプトフェノール、2-メルカプトエチルアミン、2-メルカプトイミダゾール、2-メルカプトベンゾイミダゾール、2-メルカプト-3-ピリジノール、2-メルカプトベンゾチアゾール、メルカプト酢酸、トリメチロールプロパントリス(3-メルカプトプロピオネート)、ペンタエリスリトールテトラキス(3-メルカプトプロピオネート)等のメルカプト化合物、該メルカプト化合物を酸化して得られるジスルフィド化合物、ヨード酢酸、ヨードプロピオン酸、2-ヨードエタノール、2-ヨードエタンスルホン酸、3-ヨードプロパンスルホン酸等のヨード化アルキル化合物、トリメチロールプロパントリス(3-メルカプトイソブチレート)、ブタンジオールビス(3-メルカプトイソブチレート)、ヘキサンジチオール、デカンジチオール、1,4-ジメチルメルカプトベンゼン、ブタンジオールビスチオプロピオネート、ブタンジオールビスチオグリコレート、エチレングリコールビスチオグリコレート、トリメチロールプロパントリスチオグリコレート、ブタンジオールビスチオプロピオネート、トリメチロールプロパントリスチオプロピオネート、トリメチロールプロパントリスチオグリコレート、ペンタエリスリトールテトラキスチオプロピオネート、ペンタエリスリトールテトラキスチオグリコレート、トリスヒドロキシエチルトリスチオプロピオネート、下記化合物No.C1、トリメルカプトプロピオン酸トリス(2-ヒドロキシエチル)イソシアヌレート等の脂肪族多官能チオール化合物、昭和電工社製カレンズMT BD1、PE1、NR等が挙げられる。
(4) Chain Transfer Agent and Sensitizer As the chain transfer agent and the sensitizer, the sensitivity of the composition can be adjusted, and a sulfur atom-containing compound is generally used. For example, thioglycolic acid, thiomalic acid, thiosalicylic acid, 2-mercaptopropionic acid, 3-mercaptopropionic acid, 3-mercaptobutyric acid, N- (2-mercaptopropionyl) glycine, 2-mercaptonicotinic acid, 3- [N- ( 2-mercaptoethyl) carbamoyl] propionic acid, 3- [N- (2-mercaptoethyl) amino] propionic acid, N- (3-mercaptopropionyl) alanine, 2-mercaptoethanesulfonic acid, 3-mercaptopropanesulfonic acid, 4-Mercaptobutanesulfonic acid, dodecyl (4-methylthio) phenyl ether, 2-mercaptoethanol, 3-mercapto-1,2-propanediol, 1-mercapto-2-propanol, 3-mercapto-2-butanol, mercaptophenol , 2-me Captoethylamine, 2-mercaptoimidazole, 2-mercaptobenzimidazole, 2-mercapto-3-pyridinol, 2-mercaptobenzothiazole, mercaptoacetic acid, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3- 3- Mercapto compounds such as mercapto propionate), disulfide compounds obtained by oxidizing the mercapto compounds, iodoacetic acid, iodopropionic acid, 2-iodoethanol, 2-iodoethanesulfonic acid, iodomethane such as 3-iodopropanesulfonic acid Alkylated compounds, trimethylolpropane tris (3-mercaptoisobutyrate), butanediol bis (3-mercaptoisobutyrate), hexanedithiol, decanedithiol, 1,4- Methyl mercaptobenzene, butanediol bisthiopropionate, butanediol bisthioglycolate, ethylene glycol bisthioglycolate, trimethylolpropane tristhioglycolate, butanediol bisthiopropionate, trimethylolpropane tristhiopropionate Trimethylolpropane tristhioglycolate, pentaerythritol tetrakisthiopropionate, pentaerythritol tetrakisthioglycolate, tris hydroxyethyl tris thiopropionate, compound No. 1 below. C1, aliphatic polyfunctional thiol compounds, such as tri-mercaptopropionic acid tris (2-hydroxyethyl) isocyanurate, manufactured by Showa Denko KK Karenz MT BD1, PE1, NR 1, and the like.
Figure JPOXMLDOC01-appb-C000041
Figure JPOXMLDOC01-appb-C000041
(5)界面活性剤
 上記界面活性剤としては、組成物の分散安定性、塗工性等を改善できるものを用いることができ、パーフルオロアルキルリン酸エステル、パーフルオロアルキルカルボン酸塩等のフッ素界面活性剤、高級脂肪酸アルカリ塩、アルキルスルホン酸塩、アルキル硫酸塩等のアニオン系界面活性剤、高級アミンハロゲン酸塩、第四級アンモニウム塩等のカチオン系界面活性剤、ポリエチレングリコールアルキルエーテル、ポリエチレングリコール脂肪酸エステル、ソルビタン脂肪酸エステル、脂肪酸モノグリセリド等の非イオン界面活性剤、両性界面活性剤、シリコーン系界面活性剤等の界面活性剤を用いることができ、これらは組み合わせて用いてもよい。
(5) Surfactant As the above-mentioned surfactant, those which can improve the dispersion stability, coatability and the like of the composition can be used, and fluorine such as perfluoroalkyl phosphate, perfluoroalkyl carboxylate and the like can be used. Surfactants, anionic surfactants such as higher fatty acid alkali salts, alkyl sulfonates and alkyl sulfates, cationic surfactants such as higher amine halides and quaternary ammonium salts, polyethylene glycol alkyl ether, polyethylene Nonionic surfactants such as glycol fatty acid esters, sorbitan fatty acid esters, fatty acid monoglycerides, surfactants such as amphoteric surfactants and silicone surfactants can be used, and these may be used in combination.
(6)シランカップリング剤
 上記シランカップリング剤としては、ガラスなどの無機材料と化学結合する反応基と、合成樹脂などの有機材料と化学結合する反応基と、を有するシラン化合物であり、硬化物の密着性等を改善できるものを用いることができる。シランカップリング剤としては、例えば信越化学社製シランカップリング剤を用いることができ、その中でもKBE-9007、KBM-502、KBE-403等、イソシアネート基、メタクリロイル基、エポキシ基を有するシランカップリング剤が好適に用いられる。
(6) Silane Coupling Agent The above silane coupling agent is a silane compound having a reactive group chemically bonded to an inorganic material such as glass and a reactive group chemically bonded to an organic material such as a synthetic resin, which is cured What can improve the adhesiveness etc. of a thing can be used. As the silane coupling agent, for example, a silane coupling agent manufactured by Shin-Etsu Chemical Co., Ltd. can be used. Among them, KBE-9007, KBM-502, KBE-403, etc., silane coupling having an isocyanate group, methacryloyl group or epoxy group An agent is preferably used.
(7)メラミン化合物
 上記メラミン化合物としては、硬化性を改善できるものを用いることができ、例えば、(ポリ)メチロールメラミン、(ポリ)メチロールグリコールウリル、(ポリ)メチロールベンゾグアナミン、(ポリ)メチロールウレア等の窒素化合物中の活性メチロール基(CH2OH基)の全部又は一部(少なくとも2つ)がアルキルエーテル化された化合物を挙げることができる。ここで、アルキルエーテルを構成するアルキル基としては、メチル基、エチル基又はブチル基が挙げられ、互いに同一である場合があるし、異なる場合がある。また、アルキルエーテル化されていないメチロール基は、一分子内で自己縮合していてもよく、二分子間で縮合して、その結果オリゴマー成分が形成されていてもよい。具体的には、ヘキサメトキシメチルメラミン、ヘキサブトキシメチルメラミン、テトラメトキシメチルグリコールウリル、テトラブトキシメチルグリコールウリル等を用いることができる。これらのなかでも、ヘキサメトキシメチルメラミン、ヘキサブトキシメチルメラミン等のアルキルエーテル化されたメラミンが好ましい。
(7) Melamine Compound As the above-mentioned melamine compound, those which can improve the curability can be used. For example, (poly) methylol melamine, (poly) methylol glycoluril, (poly) methylol benzoguanamine, (poly) methylol urea, etc. of active methylol groups of the nitrogen compound (CH 2 OH groups) of all or part (at least two) can be exemplified compounds alkyl etherified. Here, as an alkyl group which comprises an alkyl ether, a methyl group, an ethyl group, or a butyl group is mentioned, A mutually may be the same, It may differ. Moreover, the methylol group which is not alkyletherified may be self-condensing within one molecule, or may be condensed between two molecules to form an oligomer component as a result. Specifically, hexamethoxymethylmelamine, hexabutoxymethylmelamine, tetramethoxymethylglycoluril, tetrabutoxymethylglycoluril and the like can be used. Among these, alkyletherified melamines such as hexamethoxymethylmelamine and hexabutoxymethylmelamine are preferable.
(8)酸触媒及び塩基触媒
 酸触媒及び塩基触媒は、化合物A及び化合物Bに含まれるフェノール性水酸基の保護基R及びR11の脱離を促進可能なものである。
 組成物は、酸触媒及び塩基触媒を含むことで、酸触媒及び塩基触媒を含まない場合と比較して、より低温で、保護基R及びR11が脱離可能となる。
 このような酸触媒としては、塩酸、リン酸、硫酸等の無機酸類;ギ酸、酢酸、シュウ酸、クエン酸、メタンスルホン酸、ベンゼンスルホン酸、p-トルエンスルホン酸、リン酸モノイソプロピル等の有機酸類が挙げられる。
 上記塩基触媒としては、水酸化ナトリウム、水酸化カリウム、水酸化リチウム、アンモニア等の無機塩基類;トリメチルアミン、トリエチルアミン、モノエタノールアミン、ジエタノールアミン等のアミン化合物(有機塩基)類等が挙げられる。
 上記酸触媒及び塩基触媒の含有量は、それぞれの種類及び所望の脱離温度等に応じて適宜設定されるものであるが、化合物A及び化合物Bの合計100質量部に対して、0.1質量部以上10質量部以下とすることができる。
(8) Acid Catalyst and Base Catalyst The acid catalyst and the base catalyst are capable of promoting the elimination of the protective groups R 9 and R 11 of the phenolic hydroxyl group contained in the compound A and the compound B.
The composition contains an acid catalyst and a base catalyst so that the protective groups R 9 and R 11 can be removed at a lower temperature as compared with the case where the acid catalyst and the base catalyst are not contained.
As such an acid catalyst, inorganic acids such as hydrochloric acid, phosphoric acid and sulfuric acid; Organic acids such as formic acid, acetic acid, oxalic acid, citric acid, methanesulfonic acid, benzenesulfonic acid, p-toluenesulfonic acid and monoisopropyl phosphate Acids can be mentioned.
Examples of the base catalyst include inorganic bases such as sodium hydroxide, potassium hydroxide, lithium hydroxide and ammonia; and amine compounds (organic bases) such as trimethylamine, triethylamine, monoethanolamine and diethanolamine.
The content of the acid catalyst and the base catalyst is appropriately set according to the type and the desired desorption temperature, etc., and 0.1 parts by weight with respect to a total of 100 parts by weight of the compound A and the compound B. It can be from 10 parts by mass to 10 parts by mass.
(9)その他
 上記他の成分は、更に必要に応じて、p-アニソール、ハイドロキノン、ピロカテコール、t-ブチルカテコール、フェノチアジン等の熱重合抑制剤;可塑剤;接着促進剤;充填剤;消泡剤;レベリング剤;表面調整剤;フェノール系酸化防止剤、ホスファイト系酸化防止剤、チオエーテル系酸化防止剤等の上述の化合物B以外の酸化防止剤;上述の化合物A以外の紫外線吸収剤;分散助剤;凝集防止剤;触媒;効果促進剤;架橋剤;増粘剤等の添加剤を含むことができる。
(9) Others The above-mentioned other components are, if necessary, further, thermal polymerization inhibitors such as p-anisole, hydroquinone, pyrocatechol, t-butylcatechol, phenothiazine, etc .; plasticizers; adhesion promoters; fillers; Agents; leveling agents; surface conditioners; antioxidants other than the above compound B such as phenolic antioxidants, phosphite antioxidants, thioether antioxidants, etc .; ultraviolet absorbers other than the above compound A; dispersion Coagents may be included such as an anticoagulant, a catalyst, an effect accelerator, a crosslinker, and a thickener.
 上記添加剤の合計の含有量は、組成物の固形分100質量部中に30質量部以下とすることができる。
 上記組成物は、所望の耐久性を有する硬化物を得ることができ、硬化物を容易に製造できる範囲で、化合物A及び化合物B以外に、フェノール系酸化防止剤及び紫外線吸収剤を含むものであってもよいが、実質的に含まないことが好ましい。
 ここで、実質的に含まないとは、組成物の固形分100質量部中に1質量部以下とすることができ、なかでも、0.01質量部以下であることが好ましく、0.005質量部以下であることが好ましく、0.001質量部以下であることが好ましく、0.0001質量部以下であることが好ましい。
 上記フェノール系酸化防止剤及び紫外線吸収剤の含有量としては、上記化合物A及び化合物Bの合計100質量部に対して、1質量部以下とすることができ、なかでも、0.01質量部以下であることが好ましく、0.005質量部以下であることが好ましく、0.001質量部以下であることが好ましく、0.0001質量部以下であることが好ましい。耐久性に優れた硬化物を得ることが可能となるからである。
 また、上記紫外線吸収剤としては、フェノール性水酸基を有する紫外線吸収剤を挙げることができる。上記紫外線吸収剤としては、例えば、特開2017-008221号公報に記載の2-ヒドロキシベンゾフェノン類、2-(2'-ヒドロキシフェニル)ベンゾトリアゾール類、ベンゾエート類、トリアリールトリアジン類等、特開2002-97224号公報に記載のベンゾトリアゾール系紫外線吸収剤、ベンゾフェノン系紫外線吸収剤等を用いることができる。
 上記フェノール系酸化防止剤としては、フェノール性水酸基を有する酸化防止剤として一般的に用いられるものとすることができる。上記酸化防止剤としては、例えば、特開平6-179798号公報、特開平11-71355号公報、特開2002-97224号公報等に記載のフェノール系酸化防止剤、特開平7-109380号公報に記載のアルキル置換フェノール系酸化防止剤等を用いることができる。
The total content of the additives can be 30 parts by mass or less in 100 parts by mass of the solid content of the composition.
The composition described above can provide a cured product having desired durability, and can contain a phenolic antioxidant and a UV absorber in addition to the compound A and the compound B, as long as the cured product can be easily produced. Although it may exist, it is preferable not to contain substantially.
Here, “not substantially contained” can be 1 part by mass or less in 100 parts by mass of the solid content of the composition, and in particular, it is preferably 0.01 part by mass or less, and 0.005 mass It is preferable that it is a part or less, It is preferable that it is 0.001 mass part or less, It is preferable that it is 0.0001 mass part or less.
The content of the above-mentioned phenolic antioxidant and ultraviolet absorber can be 1 part by mass or less with respect to a total of 100 parts by mass of the above compound A and compound B, and in particular, 0.01 parts by mass or less Is preferably 0.005 parts by mass or less, preferably 0.001 parts by mass or less, and preferably 0.0001 parts by mass or less. It is because it becomes possible to obtain a cured product excellent in durability.
Moreover, as said ultraviolet absorber, the ultraviolet absorber which has phenolic hydroxyl group can be mentioned. Examples of the ultraviolet absorber include 2-hydroxybenzophenones described in JP-A-2017-008221, 2- (2′-hydroxyphenyl) benzotriazoles, benzoates, triaryltriazines, and the like. The benzotriazole-based ultraviolet absorbers, benzophenone-based ultraviolet absorbers, etc. described in JP-A-97224 can be used.
As said phenolic antioxidant, it can be generally used as antioxidant which has phenolic hydroxyl group. Examples of the above-mentioned antioxidant include phenol based antioxidants described in JP-A-6-17998, JP-A-11-71355, JP-A-2002-97224, etc., JP-A-7-109380. The alkyl-substituted phenolic antioxidants described can be used.
6.組成物
 上記組成物の粘度としては、例えば、塗工性を有するものとする観点からは、200mPa・s以下とすることができ、1mPa・s以上200mPa・s以下とすることができる。上記組成物は、塗工性に優れるからである。
 上記粘度は、JIS Z 8803:2011に準じて、回転式粘度計(例えば、アントンパール社製、Physica MCR01等)を用いて、測定される値のことを指す。また、本明細書で、特に、温度の指定がない処理、測定は、25℃で行うものとすることができる。
6. Composition The viscosity of the composition may be, for example, 200 mPa · s or less, and 1 mPa · s or more and 200 mPa · s or less, from the viewpoint of having coatability. It is because the said composition is excellent in coatability.
The viscosity, JIS Z 8803: according to the 2011, rotational viscometer (e.g., Anton Paar, Physica MCR 3 01, etc.) using, refers to the measured values. In the present specification, in particular, processing without temperature designation and measurement may be performed at 25 ° C.
 上記組成物の製造方法は、上記各成分を所望の含有量で配合可能な方法であればよく、上記各成分を同時に添加して混合する方法であってもよく、各成分を順次添加しながら混合する方法であってもよい。 The method for producing the above composition may be any method as long as the above-mentioned components can be blended at a desired content, and may be a method in which the above-mentioned components are simultaneously added and mixed. It may be a method of mixing.
 上記組成物の用途は、熱硬化性塗料、光硬化性塗料或いはワニス、熱硬化性接着剤、光硬化性接着剤、プリント基板、或いはカラーテレビ、PCモニタ、携帯情報端末、デジタルカメラ等のカラー表示の液晶表示パネルにおけるカラーフィルタ、CCDイメージセンサのカラーフィルタ、フォトスペーサ、ブラックカラムスペーサ、プラズマ表示パネル用の電極材料、タッチパネル、タッチセンサー、粉末コーティング、印刷インク、印刷版、接着剤、歯科用組成物、光造形用樹脂、ゲルコート、電子工学用のフォトレジスト、電気メッキレジスト、エッチングレジスト、液状及び乾燥膜の双方、はんだレジスト、種々の表示用途用のカラーフィルタを製造するための或いはプラズマ表示パネル、電気発光表示装置、及びLCDの製造工程において構造を形成するためのレジスト、電気及び電子部品を封入するための組成物、ソルダーレジスト、磁気記録材料、微小機械部品、導波路、光スイッチ、めっき用マスク、エッチングマスク、カラー試験系、ガラス繊維ケーブルコーティング、スクリーン印刷用ステンシル、ステレオリトグラフィによって三次元物体を製造するための材料、ホログラフィ記録用材料、画像記録材料、微細電子回路、脱色材料、画像記録材料のための脱色材料、マイクロカプセルを使用する画像記録材料用の脱色材料、印刷配線板用フォトレジスト材料、UV及び可視レーザー直接画像系用のフォトレジスト材料、プリント回路基板の逐次積層における誘電体層形成に使用するフォトレジスト材料、3D実装用フォトレジスト材料或いは保護膜等の各種の用途に使用することができ、その用途に特に制限はない。
 また、上記用途としては、製品としての使用時等に耐久性が要求される用途に限定されず、例えば、製造過程において紫外線照射等を受ける部材にも好適に用いることができる。
 製造過程において紫外線照射等を受ける部材としては、例えば、表面の濡れ性向上、密着性向上等の表面改質を図るために、紫外線等の照射を受ける部材を挙げることができる。
 上述の濡れ性向上、密着性向上等が要求される部材としては、他の部材と積層される部材を挙げることができ、例えば、プラズマ表示パネル、有機エレクトロルミネッセンス表示装置、液晶表示装置等の各種画像表示、タッチパネル等の各種センサ、回路基板等を構成する部材としてカラーフィルタ、フォトスペーサ、輝度向上板、導光板、TFT基板、配向膜、液晶層、絶縁膜、スピーカーなどの音響素子、撮像用レンズ、キーパッド、HDD用磁気ヘッドなどの製造過程での表面改質や部材の劣化防止が要求される部材が挙げられる。
 上述の製造過程での表面改質や部材の劣化防止が要求される部材としては、接着剤を介して他の部材と積層される部材、塗料等により他の部材により被覆される部材も挙げることができ、例えば、自動車、航空機の内外装部材等の運搬機器、冷蔵庫、洗濯機等の家電製品、住宅建材等の各種用途の構成部材も挙げることができる。
 また、基材上にパターン状の部材を形成した後、露出する基材の表面改質等のために基材と共に上記部材に対して紫外線照射等を実施する場合がある。上記用途としては、このような製造過程において表面改質等が要求される部材と共に用いられる部材にも好ましく用いることができる。上記用途としては、例えば、プラスチックフィルムやガラス、シリコンウエハー、各種エンジニアリングプラスチック、光学レンズ、金属表面、めっき、セラミック、金型などの表面洗浄や表面改質などが要求される部材と共に用いられる部材が挙げられる。
 上記用途としては、なかでも、化合物A及び化合物Bは分散安定性に優れることで、その添加量の増加が容易であるとの観点からは、例えば、薄膜部材の製造に用いられることが好ましい。薄膜部材としては、例えば、膜厚が100μm以下の部材とすることができ、なかでも、50μm以下であることが好ましく、特に、20μm以下であることが好ましい。
Applications of the above composition are thermosetting coatings, photocurable coatings or varnishes, thermosetting adhesives, photocurable adhesives, printed circuit boards, or color televisions such as color televisions, PC monitors, personal digital assistants, digital cameras, etc. Color filters for liquid crystal display panels for display, color filters for CCD image sensors, photo spacers, black column spacers, electrode materials for plasma display panels, touch panels, touch sensors, powder coatings, printing inks, printing plates, adhesives, for dental use Composition, resin for photolithography, gel coat, photoresist for electronics, electroplating resist, etching resist, both liquid and dry film, solder resist, for manufacturing color filters for various display applications or plasma display In the manufacturing process of panels, electroluminescent displays and LCDs Resists for forming structures, compositions for encapsulating electric and electronic parts, solder resists, magnetic recording materials, micromechanical parts, waveguides, optical switches, plating masks, etching masks, color test systems, glass Fiber cable coatings, stencils for screen printing, materials for producing three-dimensional objects by stereolithography, materials for holographic recording, image recording materials, microelectronics, bleaching materials, bleaching materials for image recording materials, microcapsules Decoloring materials for image recording materials using the same, photoresist materials for printed wiring boards, photoresist materials for UV and visible laser direct imaging systems, photoresist materials used for forming a dielectric layer in sequential lamination of printed circuit boards, Various kinds of photoresist materials or protective films for 3D mounting It can be used for developing, and there is no particular limitation on the application.
Further, the above-mentioned application is not limited to the application requiring durability when used as a product, and for example, it can be suitably used also for a member which receives ultraviolet irradiation or the like in the manufacturing process.
As a member which receives ultraviolet irradiation etc. in a manufacturing process, in order to aim at surface modification of surface wettability improvement, adhesion improvement, etc., a member which receives irradiation, such as ultraviolet light, can be mentioned, for example.
Examples of the members required to have the above-mentioned wettability improvement and adhesion improvement include members laminated with other members. For example, various members such as a plasma display panel, an organic electroluminescence display, a liquid crystal display, etc. Image display, various sensors such as touch panels, color filters, photo spacers, brightness enhancement plates, light guide plates, light guide plates, TFT substrates, alignment films, liquid crystal layers, insulating films, acoustic elements such as speakers, members for constituting circuit boards etc. Examples of such a member include a surface modification in the manufacturing process of a lens, a keypad, a magnetic head for an HDD, and the like, and the prevention of deterioration of the member.
As members required to prevent surface modification and deterioration of members in the above-mentioned manufacturing process, members to be laminated with other members via an adhesive, members to be covered with other members by paints, etc. should also be mentioned. For example, components of various uses such as vehicles, transport devices such as interior and exterior members of aircraft, household appliances such as refrigerators and washing machines, and housing materials can also be mentioned.
In addition, after forming a pattern-like member on a base material, the base material may be irradiated with ultraviolet light or the like together with the base material for surface modification of the exposed base material. As said use, it can use preferably also for the member used with the member by which surface modification etc. are requested | required in such a manufacturing process. As the above-mentioned application, for example, a member used together with a member requiring surface cleaning or surface modification such as plastic film, glass, silicon wafer, various engineering plastics, optical lens, metal surface, plating, ceramic, mold etc. It can be mentioned.
From the viewpoint that the compound A and the compound B are excellent in the dispersion stability and the addition amount thereof is easy to be used as the above-mentioned application, for example, it is preferable to be used, for example, for manufacturing a thin film member. The thin film member can be, for example, a member having a film thickness of 100 μm or less, preferably 50 μm or less, and particularly preferably 20 μm or less.
B.硬化物
 次に、本発明の硬化物について説明する。
 本発明の硬化物は、上述の組成物の硬化物であることを特徴とするものである。
 より具体的には、本発明の硬化物は、組成物の硬化物であって、上記組成物は、化合物A、化合物B及び重合性化合物を含むことを特徴とするものとするものである。
B. Cured Product Next, the cured product of the present invention will be described.
The cured product of the present invention is characterized in that it is a cured product of the above-mentioned composition.
More specifically, the cured product of the present invention is a cured product of a composition, and the above composition is characterized in that it contains a compound A, a compound B and a polymerizable compound.
 本発明によれば、上述の組成物を用いているため、製造が容易であり、また、耐久性に優れる。 According to the present invention, since the above-mentioned composition is used, the production is easy and the durability is excellent.
 本発明の硬化物は、上述の組成物を用いるものである。
 以下、本発明の硬化物について詳細に説明する。
The cured product of the present invention uses the composition described above.
Hereinafter, the cured product of the present invention will be described in detail.
 上記組成物は、上記化合物A、化合物B及び重合性化合物を含むものである。
 また、上記組成物は、上記化合物A、化合物B及び重合性化合物以外の成分を含むものであってもよい。
 上記組成物は、例えば、重合性化合物以外の樹脂成分、その他の成分等を含むことができる。
 このような組成物の各成分の内容については、上記「A.組成物」の項に記載の内容と同様とすることができる。
The composition contains the compound A, the compound B and the polymerizable compound.
In addition, the composition may include components other than the compound A, the compound B, and the polymerizable compound.
The composition can contain, for example, resin components other than the polymerizable compound, other components, and the like.
About the content of each component of such a composition, it can be made to be the same as the content as described in the said "A. composition" term.
 上記硬化物は、上記組成物の硬化物であればよく、硬化物に含まれる上記化合物A及び化合物Bはそれぞれ保護基(例えば、R及びR11)の脱離前であっても、脱離後であってもよいが、脱離後であることが好ましい。上記硬化物は、優れた耐久性を有するものとなるからである。
 なお、保護基の脱離後である場合、上記硬化物は、通常、化合物A及び化合物から保護基(例えば、R及びR11)が脱離した化合物を少なくとも有する。また、保護基の脱離後である場合、上記硬化物は、さらに、上記R由来の脱離物及びR11由来の脱離物と、を含むことができる。
The cured product may be a cured product of the above composition, and the compound A and the compound B contained in the cured product are desorbed even before removal of the protective groups (for example, R 9 and R 11 ). Although it may be after separation, it is preferable after separation. It is because the said hardened | cured material will have the outstanding durability.
Incidentally, if it is after removal of the protecting group, the cured product typically has at least a compound A and a protecting group from a compound (e.g., R 9 and R 11) compound is eliminated. In the case where the protective group has been removed, the cured product may further contain the R 9 derived release and the R 11 derived release.
 上記硬化物は、通常、重合性化合物の重合物を含むものである。
 上記硬化物に含まれる重合性化合物の残存率としては、硬化物の用途等に応じて適宜設定されるものであるが、例えば、硬化物100質量部に対して10質量部以下であり、1質量部以下であることが好ましい。
 このような組成物については、上記「A.組成物」の項に記載の内容と同様とすることができるため、ここでの説明は省略する。
The above-mentioned cured product usually contains a polymer of a polymerizable compound.
The residual ratio of the polymerizable compound contained in the cured product is appropriately set according to the application etc. of the cured product, and is, for example, 10 parts by mass or less with respect to 100 parts by mass of the cured product. It is preferable that it is below a mass part.
About such composition, since it can be made to be the same as the contents described in the section of the above-mentioned "A. composition", explanation here is omitted.
 上記硬化物としては、溶剤を実質的に含まないものとすることができる。
 上記硬化物に含まれる溶剤の含有量としては、例えば、硬化物100質量部に対して、1質量部以下とすることができ、0.5質量部以下とすることができる。
The cured product may be substantially free of a solvent.
As content of the solvent contained in the said hardened | cured material, it can be 1 mass part or less with respect to 100 mass parts of hardened | cured material, for example, can be 0.5 mass part or less.
 上記硬化物の弾性率は、通常、上記組成物より高いものであり、例えば、10-3M以上とすることができ、10MPa以上とすることができる。上記弾性率であることで、上記硬化物は、安定的に化合物A及び化合物B等を保持できるからである。
 上記弾性率の上限については、硬化物の用途等に応じて適宜設定できるが、例えば、106MPa以下とすることができる。
 なお以下、弾性率は、圧縮弾性率をいうものであり、JIS K7181に準拠して、23℃で、測定することができる。
 測定サンプルについては、例えば、一辺の長さが6mmの立方体の試験片を作成又は切り出し、JISK7181に準じ、試験速度1±0.2mm/分の条件で測定することができる。
The elastic modulus of the cured product is usually higher than that of the composition, and can be, for example, 10 -3 M or more, and can be 10 MPa or more. It is because the said hardened | cured material can hold | maintain the compound A, the compound B, etc. stably by being the said elasticity modulus.
About the upper limit of the above-mentioned elastic modulus, although it can set suitably according to the use etc. of hardened material, it can be made into 10 6 MPa or less, for example.
Hereinafter, the elastic modulus refers to the compressive elastic modulus and can be measured at 23 ° C. in accordance with JIS K7181.
For the measurement sample, for example, a cube-shaped test piece having a side length of 6 mm can be prepared or cut out, and measurement can be performed at a test speed of 1 ± 0.2 mm / min according to JIS K7181.
 上記硬化物の平面視形状については、上記硬化物の用途等に応じて適宜設定することができ、例えば、ドット状、ライン状等のパターン状とすることができる。
 上記硬化物の厚みは、上記硬化物の用途等に応じて適宜設定することができ、例えば、化合物A及び化合物Bは分散安定性に優れることで、その添加量の増加が容易であるとの観点からは、例えば、薄膜であることが好ましく、例えば、0.1μm以上100μm以下とすることができ、50μm以下であることが好ましく、なかでも、20μm以下であることが好ましく、特に、10μm以下であることが好ましい。
About the planar view shape of the said hardened | cured material, it can set suitably according to the use etc. of the said hardened | cured material, For example, it can be set as pattern shapes, such as a dot form and a line form.
The thickness of the cured product can be appropriately set according to the application etc. of the cured product, and, for example, compound A and compound B are excellent in dispersion stability, and it is easy to increase the addition amount thereof From the viewpoint, for example, a thin film is preferable, for example, 0.1 μm or more and 100 μm or less, preferably 50 μm or less, particularly preferably 20 μm or less, and particularly 10 μm or less Is preferred.
 上記硬化物の用途等については、上記「A.組成物」の項に記載の内容と同様とすることができる。 About the use etc. of the said hardened | cured material, it can be made to be the same as that of the content as described in the term of the said "A. composition".
 上記硬化物の製造方法としては、上記組成物の硬化物を所望の形状となるように形成できる方法であれば特に限定されるものではない。
 このような製造方法としては、例えば、後述する「C.硬化物の製造方法」の項に記載の内容と同様とすることができるため、ここでの説明は省略する。
The method for producing the cured product is not particularly limited as long as the cured product of the composition can be formed into a desired shape.
As such a manufacturing method, for example, since it can be the same as the contents described in the section of “C. Manufacturing method of cured product” described later, the description here is omitted.
C.硬化物の製造方法
 次に、本発明の硬化物の製造方法について説明する。
 本発明の硬化物の製造方法は、上述の組成物の硬化物を形成する工程を有することを特徴とするものである。
 より具体的には、本発明の硬化物の製造方法は、化合物A、化合物B及び重合性化合物を含む組成物の硬化物を形成する工程を有することを特徴とするものである。
C. Method of Producing Cured Product Next, a method of producing the cured product of the present invention will be described.
The method for producing a cured product of the present invention is characterized by comprising the step of forming a cured product of the composition described above.
More specifically, the method for producing a cured product of the present invention is characterized by comprising a step of forming a cured product of a composition containing compound A, compound B and a polymerizable compound.
 本発明によれば、上記製造方法は、上述の組成物を用い、かつ、上記工程を有することにより、例えば、硬化物の製造が容易となる。また、上記工程の後に、上記化合物Aに含まれる保護基R及び上記化合物Bに含まれる保護基R11を脱離する工程を実施することで、耐久性を有する硬化物を容易に得ることができるからである。 According to the present invention, for example, the production method of the cured product becomes easy by using the above-mentioned composition and having the above-mentioned steps. In addition, by carrying out the step of removing the protecting group R 9 contained in the compound A and the protecting group R 11 contained in the compound B after the above steps, a cured product having durability can be easily obtained. It is because
 本発明の製造方法は、硬化物を形成する工程を含むものである。
 以下、本発明の製造方法の各工程について詳細に説明する。
The production method of the present invention includes the step of forming a cured product.
Hereinafter, each process of the manufacturing method of this invention is demonstrated in detail.
1.硬化物を形成する工程
 上記硬化物を形成する工程は、上述の組成物の硬化物を形成する工程である。
 このような組成物の硬化物を形成する方法としては、所望の形状の硬化物を形成可能な方法であればよく、組成物に含まれる成分に応じて異なるものである。
 上記硬化物を形成する方法は、例えば、組成物が、重合性化合物と共に重合開始剤として光重合開始剤を含む場合には、組成物に対して光照射を行い、重合性化合物同士を重合する方法を用いることができる。
 組成物に照射される光としては、波長300nm~450nmの光を含むものとすることができる。
 上記光照射の光源としては、例えば、超高圧水銀、水銀蒸気アーク、カーボンアーク、キセノンアーク等を挙げることができる。
 上記照射される光としては、レーザー光を用いてもよい。レーザー光としては、波長340~430nmの光を含むものを用いることができる。
 レーザー光の光源としては、アルゴンイオンレーザー、ヘリウムネオンレーザー、YAGレーザー、及び半導体レーザー等の可視から赤外領域の光を発するものも用いることができる。
 なお、これらのレーザーを使用する場合には、上記組成物は、可視から赤外の当該領域を吸収する増感色素を含むことができる。
1. Step of forming a cured product The step of forming the cured product is a step of forming a cured product of the composition described above.
As a method of forming a cured product of such a composition, any method capable of forming a cured product of a desired shape may be used, and the method differs depending on the components contained in the composition.
In the method of forming the cured product, for example, when the composition contains a photopolymerization initiator as a polymerization initiator together with a polymerizable compound, the composition is irradiated with light to polymerize the polymerizable compounds with each other. Methods can be used.
The light irradiated to the composition may include light with a wavelength of 300 nm to 450 nm.
As a light source of the said light irradiation, an ultra-high pressure mercury, a mercury vapor arc, a carbon arc, a xenon arc etc. can be mentioned, for example.
Laser light may be used as the light to be irradiated. As the laser light, one containing light with a wavelength of 340 to 430 nm can be used.
As a light source of laser light, those emitting light in the visible to infrared region such as argon ion laser, helium neon laser, YAG laser, and semiconductor laser can also be used.
In addition, when using these lasers, the said composition can contain the sensitizing dye which absorbs the said area | region of visible to infrared.
 上記硬化物を形成する方法は、例えば、組成物が、重合性化合物と共に重合開始剤として熱重合開始剤を含む場合には、組成物に対して加熱処理を行い、重合性化合物同士を重合する方法を用いることができる。
 加熱温度としては、化合物A及び化合物Bから保護基の脱離を抑制できるものとすることができる。
 上記加熱温度は、例えば、60℃以上、好ましくは100℃以上300℃以下とすることができる。
 なお、加熱温度は、組成物の塗膜表面の温度とすることができる。
 加熱時間としては、10秒~3時間程度とすることができる。
In the method of forming the cured product, for example, when the composition contains a thermal polymerization initiator as a polymerization initiator together with a polymerizable compound, the composition is subjected to a heat treatment to polymerize the polymerizable compounds. Methods can be used.
The heating temperature may be such that the removal of the protective group from compound A and compound B can be suppressed.
The heating temperature may be, for example, 60 ° C. or more, preferably 100 ° C. or more and 300 ° C. or less.
In addition, heating temperature can be made into the temperature of the coating-film surface of a composition.
The heating time can be about 10 seconds to 3 hours.
 上記硬化物を形成する方法の種類は、1種類のみを含むものであってもよく、2種類以上を含むものであってもよい。 The type of the method of forming the cured product may include only one type, or may include two or more types.
 上記組成物は、上記化合物A、化合物B及び重合性化合物を含むものである。
 また、上記組成物は、上記化合物A、化合物B及び重合性化合物以外の成分を含むものであってもよい。
 上記組成物は、例えば、重合性化合物以外の樹脂成分、その他の成分等を含むことができる。
 このような組成物の各成分の内容については、上記「A.組成物」の項に記載の内容と同様とすることができるので、ここでの説明は省略する。
The composition contains the compound A, the compound B and the polymerizable compound.
In addition, the composition may include components other than the compound A, the compound B, and the polymerizable compound.
The composition can contain, for example, resin components other than the polymerizable compound, other components, and the like.
About the content of each component of such a composition, since it can be made to be the same as the content as described in the term of the said "A. composition", description here is abbreviate | omitted.
2.脱離する工程
 上記製造方法は、上記硬化物を形成する工程の後に、上記化合物Aに含まれる保護基R及び上記化合物Bに含まれる保護基R11を脱離する工程を含むことができる。
 このような工程を含むことで、耐久性を有する硬化物を容易に得ることができるからである。
2. The above-mentioned production method can include, after the step of forming the cured product, the step of removing the protecting group R 9 contained in the compound A and the protecting group R 11 contained in the compound B. .
By including such a step, a cured product having durability can be easily obtained.
 本工程における上記化合物Aに含まれる保護基R及び上記化合物Bに含まれる保護基R11を脱離する方法としては、上記保護基を安定的に脱離できる方法であればよく、例えば、上記硬化物に対して加熱処理する方法とすることができる。
 硬化物に対する加熱温度としては、保護基R及び保護基R11が脱離する温度であればよく、例えば、保護基R及び保護基R11の脱離温度以上の温度とすることができる。
 また、上記加熱温度は、上記組成物が酸触媒、塩基触媒等を含む場合には、保護基R及び保護基R11単独で観察される脱離温度以下とすることができる。
 上記加熱温度は、例えば、50℃以上250℃以下とすることができ、60℃以上200℃以下であることが好ましく、なかでも80℃以上200℃以下であることが好ましい。上記加熱温度であることで、樹脂成分等の劣化、硬化物を支持する基材の劣化等を抑制できるからである。
 なお、上記硬化物の温度は、硬化物表面の温度とすることができる。
As a method of removing the protecting group R 9 contained in the above compound A and the protecting group R 11 contained in the above compound B in this step, any method capable of stably removing the above protecting group may be used, for example, It can be set as the method of heat-processing with respect to the said hardened | cured material.
The heating temperature for the cured product may be a temperature at which the protective group R 9 and the protective group R 11 are eliminated, for example, a temperature higher than the desorption temperature of the protective group R 9 and the protective group R 11 .
Further, when the composition contains an acid catalyst, a base catalyst and the like, the heating temperature can be equal to or less than the desorption temperature observed for the protective group R 9 and the protective group R 11 alone.
The heating temperature can be, for example, 50 ° C. or more and 250 ° C. or less, preferably 60 ° C. or more and 200 ° C. or less, and particularly preferably 80 ° C. or more and 200 ° C. or less. It is because deterioration of a resin component etc., deterioration of the base material which supports hardened | cured material, etc. can be suppressed by being said heating temperature.
In addition, the temperature of the said hardened | cured material can be made into the temperature of the hardened | cured material surface.
3.その他の工程
 上記製造方法は、硬化物を形成する工程及び脱離する工程以外に、必要に応じてその他の工程を含むものであってもよい。
 上記その他の工程としては、例えば、上記組成物を基材上に塗布する工程等を挙げることができる。
 組成物を塗布する方法としては、スピンコーター、ロールコーター、バーコーター、ダイコーター、カーテンコーター、各種の印刷、浸漬等の公知の方法を用いることができる。
 上記基材としては、硬化物の用途等に応じて適宜設定することができ、ソーダガラス、石英ガラス、半導体基板、金属、紙、プラスチック等を含むものを挙げることができる。
 また、上記硬化物は、基材上で形成された後、基材から剥離して用いても、基材から他の被着体に転写して用いてもよい。
3. Other Steps The above-mentioned production method may include other steps, as necessary, in addition to the step of forming a cured product and the step of removing.
As said other process, the process of apply | coating the said composition on a base material etc. can be mentioned, for example.
As a method of applying the composition, known methods such as spin coater, roll coater, bar coater, die coater, curtain coater, various printing, immersion and the like can be used.
The substrate can be appropriately set depending on the application of the cured product and the like, and examples thereof include soda glass, quartz glass, semiconductor substrates, metals, paper, plastics and the like.
In addition, after the cured product is formed on a substrate, it may be used after being peeled off from the substrate or may be transferred from the substrate to another adherend.
4.その他
 上記製造方法により製造される硬化物及び用途等については、上記「B.硬化物」の項に記載の内容と同様とすることができる。
4. Others The cured product produced according to the above-mentioned production method, the use and the like can be the same as the contents described in the section of "B. cured product".
 本発明は、上記実施形態に限定されるものではない。上記実施形態は、例示であり、本発明の特許請求の範囲に記載された技術的思想と実質的に同一な構成を有し、同様な作用効果を奏するものは、いかなるものであっても本発明の技術的範囲に包含される。 The present invention is not limited to the above embodiment. The above embodiment is an exemplification, and it has substantially the same configuration as the technical idea described in the claims of the present invention, and any one having the same function and effect can be used. It is included in the technical scope of the invention.
 以下、実施例等を挙げて本発明をさらに詳細に説明するが、本発明はこれらの実施例に限定されるものではない。 Hereinafter, the present invention will be described in more detail by way of examples and the like, but the present invention is not limited to these examples.
 [製造例A1-1]
 フェノール化合物0.01mol、二炭酸ジ-tert-ブチル0.05mol及びピリジン30gを混合し、窒素雰囲気下、室温で4-ジメチルアミノピリジン0.025molを加え、60℃で3時間撹拌した。室温まで冷却後、反応液をイオン交換水150gに注ぎ、クロロホルム200gを加えて油水分離を行った。有機層を無水硫酸ナトリウムで乾燥後、溶媒を留去し、残渣にメタノール100gを加えて晶析を行った。得られた白色粉状結晶を60℃で3時間減圧乾燥させ、目的物(下記一般式(A1-1)で表される化合物)を得た。得られた白色粉状結晶が目的物であることはH-NMRにて確認した。結果を下記表1及び表2に示す。なお、用いたフェノール化合物は、下記A1-1における2つの-COO-tert-ブチル基が水素原子に置換された化合物であった。
[Production Example A1-1]
0.01 mol of a phenol compound, 0.05 mol of di-tert-butyl dicarbonate and 30 g of pyridine were mixed, 0.025 mol of 4-dimethylaminopyridine was added at room temperature under a nitrogen atmosphere, and the mixture was stirred at 60 ° C. for 3 hours. After cooling to room temperature, the reaction solution was poured into 150 g of ion exchanged water, and 200 g of chloroform was added to conduct oil-water separation. The organic layer was dried over anhydrous sodium sulfate, the solvent was distilled off, and 100 g of methanol was added to the residue for crystallization. The obtained white powdery crystals were dried under reduced pressure at 60 ° C. for 3 hours to obtain the desired product (a compound represented by the following general formula (A1-1)). It was confirmed by 1 H-NMR that the obtained white powdery crystals were the desired product. The results are shown in Tables 1 and 2 below. The phenol compound used was a compound in which two —COO-tert-butyl groups in the following A1-1 were substituted by hydrogen atoms.
[製造例A2-1、A3-1、A3-2、A3-3]
 フェノール化合物として、下記A2-1、A3-1、A3-2、A3-3にそれぞれ対応したフェノール化合物を用いた以外は、製造例A1-1と同様にして、下記一般式(A2-1)、(A3-1)、(A3-2)及び(A3-3)で表される化合物を合成した。得られた白色粉状結晶が目的物であることはH-NMRにて確認した。結果を下記表1に示す。
[Production Examples A2-1, A3-1, A3-2, A3-3]
A compound of the following general formula (A2-1) was prepared in the same manner as in Production Example A1-1, except that phenol compounds corresponding to the following A2-1, A3-1, A3-2, and A3-3 were used as the phenol compound. Compounds (A3-1), (A3-2) and (A3-3) were synthesized. It was confirmed by 1 H-NMR that the obtained white powdery crystals were the desired product. The results are shown in Table 1 below.
Figure JPOXMLDOC01-appb-C000042
Figure JPOXMLDOC01-appb-C000042

[製造例B-1~B-3]
 フェノール化合物として、下記B-1~B-3にそれぞれ対応したフェノール化合物を用いた以外は、製造例A1-1と同様にして、下記一般式B-1~B-3で表される化合物を合成した。得られた白色粉状結晶が目的物であることはH-NMRにて確認した。結果を下記表1に示す。
[Production Examples B-1 to B-3]
Compounds represented by the following general formulas B-1 to B-3 were produced in the same manner as in Production Example A1-1 except that phenol compounds corresponding to the following B-1 to B-3 were used as the phenol compound. Synthesized. It was confirmed by 1 H-NMR that the obtained white powdery crystals were the desired product. The results are shown in Table 1 below.
Figure JPOXMLDOC01-appb-C000043
Figure JPOXMLDOC01-appb-C000043
Figure JPOXMLDOC01-appb-T000044
Figure JPOXMLDOC01-appb-T000044
 [製造例1]
 1,1-ビス〔4-(2,3-エポキシプロピルオキシ)フェニル〕インダンの30.0g、アクリル酸7.52g、2,6-ジ-t-ブチル-p-クレゾール0.080g、テトラブチルアンモニウムクロリド0.183g及び、PGMEA11.0gを仕込み、90℃で1時間、105℃で1時間及び120℃で17時間撹拌した。室温まで冷却し、無水コハク酸8.11g、テトラブチルアンモニウムクロリド0.427g及びPGMEA11.1gを加えて、100℃で5時間撹拌した。さらに、1,1-ビス〔4-(2,3-エポキシプロピルオキシ)フェニル〕インダン12.0g、2,6-ジ-t-ブチル-p-クレゾール0.080g及び、PGMEA0.600gを加えて、90℃で90分、120℃で5時間撹拌後、PGMEA24.0gを加えて、PGMEA溶液として樹脂No.1を得た(Mw=4900、Mn=2250,酸価(固形分)47mg・KOH/g、固形分45.0質量%)。
Production Example 1
30.0 g of 1,1-bis [4- (2,3-epoxypropyloxy) phenyl] indane, 7.52 g of acrylic acid, 0.080 g of 2,6-di-t-butyl-p-cresol, tetrabutyl 0.183 g of ammonium chloride and 11.0 g of PGMEA were charged, and stirred at 90 ° C. for 1 hour, 105 ° C. for 1 hour and 120 ° C. for 17 hours. The reaction solution was cooled to room temperature, and 8.11 g of succinic anhydride, 0.427 g of tetrabutylammonium chloride and 11.1 g of PGMEA were added and stirred at 100 ° C. for 5 hours. Furthermore, 12.0 g of 1,1-bis [4- (2,3-epoxypropyloxy) phenyl] indane, 0.080 g of 2,6-di-t-butyl-p-cresol and 0.600 g of PGMEA are added. After stirring at 90 ° C. for 90 minutes and at 120 ° C. for 5 hours, 24.0 g of PGMEA was added, and a resin no. 1 was obtained (Mw = 4900, Mn = 2250, acid value (solid content) 47 mg · KOH / g, solid content 45.0% by mass).
[実施例1~20及び比較例1~28]
 下記表2~5に記載の配合に従って、化合物A、紫外線吸収剤、化合物B、酸化防止剤、酸価を有する重合性化合物、酸価を有しない重合性化合物、光重合開始剤、シランカップリング剤及び溶剤を配合して組成物を得た。
 また、各成分は以下の材料を用いた。
 なお、表中の配合量は、各成分の質量部を表すものである。
[Examples 1 to 20 and Comparative Examples 1 to 28]
Compound A, ultraviolet light absorber, compound B, antioxidant, polymerizable compound having an acid value, polymerizable compound having no acid value, photopolymerization initiator, silane coupling according to the composition described in Tables 2 to 5 below The agent and the solvent were blended to obtain a composition.
Moreover, the following materials were used for each component.
In addition, the compounding quantity in a table | surface represents the mass part of each component.
(化合物A)
A-1:上記一般式(A1-1)で表される化合物
A-2:上記一般式(A2-1)で表される化合物
A-3:上記一般式(A3-1)で表される化合物
A-4:上記一般式(A3-2)で表される化合物
A-5:上記一般式(A3-3)で表される化合物
(Compound A)
A-1: Compound A-2 represented by the above-mentioned general formula (A1-1): Compound A-3 represented by the above-mentioned general formula (A2-1): represented by the above-mentioned general formula (A3-1) Compound A-4: Compound A-5 represented by the above general formula (A3-2): compound represented by the above general formula (A3-3)
(紫外線吸収剤)
A´-1:ADEKA社製紫外線吸収剤LA-29
A´-2:ADEKA社製紫外線吸収剤LA-31
A´-3:ADEKA社製紫外線吸収剤LA-F70
(UV absorber)
A′-1: UV Absorber LA-29 manufactured by ADEKA
A′-2: UV Absorber LA-31 manufactured by ADEKA
A'-3: UV Absorber LA-F70 manufactured by ADEKA
(化合物B)
B-1:上記一般式(B-1)で表される化合物
B-2:上記一般式(B-2)で表される化合物
B-3:上記一般式(B-3)で表される化合物
(Compound B)
B-1: Compound B-2 represented by Formula (B-1): Compound B-3 represented by Formula (B-2): Formula (B-3) Compound
(酸化防止剤)
B´-1:ADEKA社製酸化防止剤AO-60
(Antioxidant)
B '-1: Antioxidant AO-60 manufactured by ADEKA
(酸価を有する重合性化合物)
C-1:ラジカル重合性化合物(昭和電工社製リポキシSPC-1000 固形分29質量%PGMEA溶液)
C-2:製造例1で製造した樹脂No.1
(A polymerizable compound having an acid value)
C-1: Radically polymerizable compound (Lipoxy SPC-1000 manufactured by Showa Denko 29% by mass PGMEA solution)
C-2: Resin No. 1 produced in Production Example 1 1
(酸価を有しない重合性化合物)
D-1:ラジカル重合性化合物(東亜合成社製アロニックスM-450(ペンタエリスリトールトリ及びテトラアクリレート3~4の混合物)
D-2:ラジカル重合性化合物(日本化薬社製カヤラッドDPHA(ジペンタエリスリトール ペンタ及びヘキサアクリレートの混合物))
D-3:カチオン重合性化合物(新中村化学工業社製NKオリゴEA-1020(ビスフェノールA型エポキシアクリレート)
D-4:ラジカル重合性化合物(根上工業社製アートレジンUN-3320(ウレタンアクリレート))
D-5:カチオン重合性化合物(株式会社ADEKA社製EP-4100E(ビスフェノールA型エポキシ樹脂))
D-6:カチオン重合性化合物(株式会社ダイセル社製セロキサイド2021P(脂環式エポキシ化合物))
(A polymerizable compound having no acid value)
D-1: Radically polymerizable compound (Aronix M-450 (a mixture of pentaerythritol tri and tetraacrylates 3 to 4 manufactured by Toagosei Co., Ltd.))
D-2: Radically polymerizable compound (Kayarad DPHA (a mixture of dipentaerythritol penta and hexaacrylate) manufactured by Nippon Kayaku Co., Ltd.)
D-3: Cationic polymerizable compound (NK Oligo EA-1020 (bisphenol A epoxy acrylate) manufactured by Shin-Nakamura Chemical Co., Ltd.)
D-4: Radically polymerizable compound (Art resin UN-3320 (urethane acrylate) manufactured by Rootskami Kogyo Co., Ltd.)
D-5: Cationic polymerizable compound (EP-4100E (bisphenol A epoxy resin) manufactured by ADEKA Co., Ltd.)
D-6: Cationic polymerizable compound (Celloxide 2021 P (alicyclic epoxy compound) manufactured by Daicel Corporation)
(光重合開始剤)
E-1:下記式(E1)で表される化合物(オキシムエステル系光ラジカル重合開始剤)
E-2:下記式(E2)で表される化合物(オキシムエステル系光ラジカル重合開始剤)
E-3:BASF社製イルガキュアTPO(ホスフィンオキサイド系ラジカル重合開始剤)
E-4:ADEKA社製SP-171(スルホニウム塩系光カチオン重合開始剤)
(Photopolymerization initiator)
E-1: Compound represented by the following formula (E1) (oxime ester photo radical polymerization initiator)
E-2: Compound represented by the following formula (E2) (oxime ester photo radical polymerization initiator)
E-3: Irgacure TPO manufactured by BASF (phosphine oxide radical polymerization initiator)
E-4: SP-171 (sulfonium salt photo cationic polymerization initiator) manufactured by ADEKA Corporation
Figure JPOXMLDOC01-appb-C000045
Figure JPOXMLDOC01-appb-C000045
(シランカップリング剤)
F-1:信越化学工業社製シランカップリング剤KBE-403
(Silane coupling agent)
F-1: Shine Chemical Industry Co., Ltd. silane coupling agent KBE-403
(溶剤)
G-1:PGMEA
(solvent)
G-1: PGMEA
 上記実施例及び比較例の評価を以下の方法に従って行った。但し、比較例10、11、18、19の組成物は調製時に固体が析出してしまったため、下記の評価はできなかった。 Evaluation of the said Example and comparative example was performed in accordance with the following method. However, in the compositions of Comparative Examples 10, 11, 18, and 19, the following evaluation could not be performed because solids were precipitated at the time of preparation.
1.感度評価1
 各実施例及び比較例で調製した組成物のうち、酸価を有する重合性化合物を含む実施例1~12、17~20、及び比較例1~9、12~17、20、25~28の組成物の感度評価として、下記線幅感度及び残膜感度の評価を行った。結果を表2~5に示す。
 まず、上記実施例1~12、17~20、及び比較例1~9、12~17、20、25~28の各組成物を、ガラス基板上にスピンコート(500rpm、2秒間、900rpm、5秒間)し、乾燥後(プリベーク後)の膜厚が10μmとなる塗膜を形成した。次いで、塗膜に対して、ホットプレートを用いて、90℃で90秒間プリベークを行い、光源として高圧水銀ランプを用いてマスク(開口部の線幅20μm)を介して露光(40mJ/cm)し、硬化物を得た。次いで、現像液として2.5質量%炭酸ナトリウム水溶液を用い現像後、よく水洗し、オーブンを用いて、230℃で30分ポストベークを行い、パターンを定着させた。
 得られたパターンの線幅を電子顕微鏡で測定し、以下の基準で線幅感度の評価を行った。
 得られたパターンの膜厚を電子顕微鏡で測定し、以下の方法で残膜感度の評価を行った。
(線幅感度)
〇:硬化物の線幅/20μmが1.0以上である。
×:硬化物の線幅/20μmが1.0未満である。
(残膜感度)
ポストベーク後の膜厚/プリベーク後の膜厚×100(%)を計算した。
 なお、線幅感度が「〇」であり、かつ、残膜感度が70%以上であると、組成物は硬化阻害の発生が抑制され、十分に硬化したことを示す。
1. Sensitivity evaluation 1
Among the compositions prepared in the respective Examples and Comparative Examples, Examples 1 to 12, 17 to 20, and Comparative Examples 1 to 9, 12 to 17, 20, 25 to 28 containing a polymerizable compound having an acid value The following line width sensitivity and residual film sensitivity were evaluated as the sensitivity evaluation of the composition. The results are shown in Tables 2-5.
First, the compositions of Examples 1 to 12, 17 to 20 and Comparative Examples 1 to 9, 12 to 17, 20, and 25 to 28 were spin-coated on a glass substrate (500 rpm, 2 seconds, 900 rpm, 5 The coated film was formed to have a thickness of 10 μm after drying (pre-baking). Next, the coated film is prebaked at 90 ° C. for 90 seconds using a hot plate, and exposed (40 mJ / cm 2 ) through a mask (opening line width 20 μm) using a high pressure mercury lamp as a light source And a cured product was obtained. Then, after developing using a 2.5 mass% sodium carbonate aqueous solution as a developing solution, it was thoroughly washed with water, and post baked at 230 ° C. for 30 minutes using an oven to fix the pattern.
The line width of the obtained pattern was measured by an electron microscope, and the line width sensitivity was evaluated based on the following criteria.
The film thickness of the obtained pattern was measured with an electron microscope, and the residual film sensitivity was evaluated by the following method.
(Line width sensitivity)
:: line width of cured product / 20 μm is 1.0 or more.
X: The line width of the cured product / 20 μm is less than 1.0.
(Remaining film sensitivity)
Film thickness after post-baking / film thickness after pre-baking × 100 (%) was calculated.
When the line width sensitivity is “〇” and the residual film sensitivity is 70% or more, the composition is inhibited from occurrence of curing inhibition and shows that the composition is sufficiently cured.
2.感度評価2
 各実施例及び比較例で調製した組成物のうち、酸価を有する重合性化合物を含まない実施例13~16、及び比較例21~24の組成物の感度評価として、ステップタブレットを用いて評価を行った。
 具体的には、上記組成物を、PETフィルムにバーコーターで約3μmの厚さに塗布した。次いで、80℃で30分間プリベークを行った後、光源として超高圧水銀ランプ(UL750)を用いて露光した(20mW/cm)。なお、露光は、露光光量が、400mJとなるように行った。この際、光感度を測定できるように、光透過率が段階的に少なくなるように作られたネガフィルム(光学密度0.05を1段目とし、1段毎に光学密度が0.15ずつ増加するステップタブレット)を用いた。次いで、イソプロパノール(IPA)を用いて、25℃の環境下、10秒間かけ洗いを行って現像した。次いで、80℃で30分間乾燥した。次いで、PETフィルム上に形成された硬化物のステップタブレットの段数を測定することにより光感度を評価した。その結果を下記表4に示す。
 なお、ステップタブレットの段数が高いほど光感度が高いことを示す。また、ステップタブレットの段数が、10以上であると、組成物は硬化阻害の発生が抑制され、十分に硬化したことを示す。
2. Sensitivity evaluation 2
Of the compositions prepared in the respective Examples and Comparative Examples, evaluation using the step tablet was conducted as the sensitivity evaluation of the compositions of Examples 13 to 16 and Comparative Examples 21 to 24 not containing a polymerizable compound having an acid value. Did.
Specifically, the above composition was applied to a PET film with a bar coater to a thickness of about 3 μm. Next, after prebaking at 80 ° C. for 30 minutes, exposure was performed (20 mW / cm 2 ) using an ultra-high pressure mercury lamp (UL 750) as a light source. The exposure was performed so that the exposure light amount was 400 mJ. Under the present circumstances, the negative film made so that light transmittance might be decreased in steps in order to measure a photosensitivity (The optical density 0.05 is made into the 1st step, The optical density is 0.15 at a time for every step. An increasing step tablet was used. Then, development was carried out by washing for 10 seconds in an environment of 25 ° C. using isopropanol (IPA). It was then dried at 80 ° C. for 30 minutes. Next, the photosensitivity was evaluated by measuring the number of steps of the step tablet of the cured product formed on the PET film. The results are shown in Table 4 below.
The higher the number of steps of the step tablet, the higher the light sensitivity. In addition, when the number of steps of the step tablet is 10 or more, the composition is inhibited from occurrence of inhibition of curing and shows that the composition is sufficiently cured.
3.耐熱性
 現像処理及び水洗を行わなかった以外は、「1.感度評価1」と同様にして評価用サンプルを得た。次いで、オーブンを用いて、評価用サンプルを200℃で2時間熱処理する耐熱性試験を行った。
 評価用サンプルの耐熱性試験前後の波長430nmでの透過率(%)の差((耐熱性試験前の透過率(%)-耐熱性試験前の透過率(%))を測定し、以下の基準で耐熱性評価を行った。結果を表2~5に示す。
〇:透過率差(%)が耐熱性試験前の透過率に対して1%未満である。
×:透過率差(%)が耐熱性試験前の透過率に対して1%以上である。
 なお、耐熱性評価が「〇」であると、硬化物は、耐熱性に優れることを示す。
3. A sample for evaluation was obtained in the same manner as in "1. Sensitivity evaluation 1" except that heat resistance development processing and washing with water were not performed. Then, using an oven, a heat resistance test was performed in which the evaluation sample was heat-treated at 200 ° C. for 2 hours.
The difference in transmittance (%) at a wavelength of 430 nm before and after the heat resistance test of the sample for evaluation ((transmittance (% before heat resistance test-transmittance (%) before heat resistance test) was measured, and The heat resistance was evaluated on the basis of the standard, and the results are shown in Tables 2 to 5.
Good: The transmittance difference (%) is less than 1% with respect to the transmittance before the heat resistance test.
X: The difference in transmittance (%) is 1% or more with respect to the transmittance before the heat resistance test.
In addition, a hardened | cured material shows that it is excellent in heat resistance in heat resistance evaluation being "O".
4.耐光性
 現像処理及び水洗を行わなかった以外は、「1.感度評価1」と同様にして評価用サンプルを得た。スガ試験機製キセノン耐光性試験機テーブルサンXT-1500Lを用いて、評価用サンプルに対して96時間耐光性試験を実施した。評価用サンプルの耐光性試験前後の波長430nmでの透過率(%)の差((耐光性試験前の透過率(%)-耐光性試験後の透過率(%))を測定し、以下の基準で耐光性評価を行った。結果を表2~5に示す。
〇:透過率差(%)が耐光性試験前の透過率に対して3%未満である。
×:透過率差(%)が耐光性試験前の透過率に対して3%以上である。
 なお、耐光性評価が「〇」であると、硬化物は、耐光性に優れることを示す。
4. Light Resistance A sample for evaluation was obtained in the same manner as in “1. Sensitivity evaluation 1” except that development processing and washing with water were not performed. A 96-hour light resistance test was performed on the sample for evaluation using a Suga Test Instruments xenon light resistance tester Table Sun XT-1500L. The difference in transmittance (%) at a wavelength of 430 nm before and after the light resistance test of the sample for evaluation ((transmittance (%) before light resistance test-transmittance (%) after light resistance test) was measured. The light resistance was evaluated on the basis of the standard, and the results are shown in Tables 2 to 5.
Good: The transmittance difference (%) is less than 3% with respect to the transmittance before the light resistance test.
X: The difference in transmittance (%) is 3% or more with respect to the transmittance before the light resistance test.
In addition, a hardened | cured material shows that it is excellent in light resistance in light resistance evaluation being "O".
Figure JPOXMLDOC01-appb-T000046
Figure JPOXMLDOC01-appb-T000046
Figure JPOXMLDOC01-appb-T000047
Figure JPOXMLDOC01-appb-T000047
Figure JPOXMLDOC01-appb-T000048
Figure JPOXMLDOC01-appb-T000048
Figure JPOXMLDOC01-appb-T000049
Figure JPOXMLDOC01-appb-T000049
[まとめ]
 表2~5より、実施例の組成物は、化合物A及び化合物Bを含む場合でも硬化阻害の発生が抑制され、十分に硬化できることが確認できた。この結果から、実施例の組成物は、硬化物の製造が容易であることが確認できた。
 また、実施例の組成物は、耐熱性及び耐光性の両者が良好な結果であり、耐久性に優れることが確認できた。
[Summary]
From Tables 2 to 5, it was confirmed that the compositions of the examples were able to be sufficiently cured because the occurrence of inhibition of curing was suppressed even when the compounds A and B were contained. From this result, it was confirmed that the compositions of the examples are easy to produce a cured product.
Further, it was confirmed that the compositions of the examples were good results in both heat resistance and light resistance, and were excellent in durability.
[製造例2]青色顔料分散液の製造
 分散剤としてDISPERBYK-161(8.4質量部;ビックケミージャパン製)及び着色剤としてピグメントブルー15:6(14質量部)を、PGMEA(77.6質量部)に、ビーズミルを使用して分散させて青色顔料分散液(固形分濃度22.4質量%、固形分中の顔料濃度62.5質量%、溶剤PGMEA)を製造した。
Preparation Example 2 Preparation of Blue Pigment Dispersion As a dispersant, DISPERBYK-161 (8.4 parts by mass; manufactured by BIC Chemie Japan) and pigment blue 15: 6 (14 parts by mass) as a coloring agent were mixed with PGMEA (77.6). A blue pigment dispersion (solid content concentration: 22.4 mass%, pigment concentration in solid content: 62.5 mass%, solvent PGMEA) was produced by dispersing the pigment using a bead mill.
 [実施例21、比較例29~33]
 下記表6に記載の配合に従って、化合物A、紫外線吸収剤、化合物B、酸化防止剤、酸価を有する重合性化合物、酸価を有しない重合性化合物、光重合開始剤、シランカップリング剤、溶剤及び着色剤を配合して組成物を得た。表中の配合量は、各成分の質量部を表す。
 なお、C-3及びH-1以外の成分は、実施例1~20及び比較例1~28等で使用したものと同様の成分を示すものである。
Example 21, Comparative Examples 29 to 33
Compound A, UV absorber, compound B, antioxidant, polymerizable compound having an acid value, polymerizable compound having no acid value, a photopolymerization initiator, a silane coupling agent, according to the composition described in Table 6 below A solvent and a colorant were blended to obtain a composition. The compounding amounts in the table represent parts by mass of each component.
The components other than C-3 and H-1 represent the same components as those used in Examples 1 to 20 and Comparative Examples 1 to 28 and the like.
 C-3:SPC-3000(昭和電工社製、固形分42.7質量%、PGMEA溶液)
 H-1:青色顔料分散液(上述の製造例2で製造した青色顔料分散液、固形分濃度22.4質量%、固形分中の顔料濃度62.5質量%、溶剤PGMEA)
C-3: SPC-3000 (made by Showa Denko, solid content 42.7% by mass, PGMEA solution)
H-1: Blue pigment dispersion (blue pigment dispersion prepared in the above-mentioned Preparation Example 2, solid content concentration 22.4 mass%, pigment concentration in solid content 62.5 mass%, solvent PGMEA)
  [評価]
 実施例及び比較例で得た組成物について、下記の評価を行った。結果を下記表6に示す。
[Evaluation]
The following evaluation was performed about the composition obtained by the Example and the comparative example. The results are shown in Table 6 below.
1.感度評価(線幅感度) 
 ガラス基板上に実施例及び比較例の組成物をスピンコートし、ホットプレートを用いて、90℃で120秒間プリベークを行った後、23℃で60秒間冷却した。スピンコート条件はポストベイク後の色度座標(x、y)=(0.135,0.098)になる塗膜の厚みとなるように調整した。その後、超高圧水銀ランプを用いてフォトマスク(マスク開口30μm)を介して露光した(露光ギャップ300μm、露光量40mJ/cm)。現像液として0.04質量%KOH水溶液を用いて現像した後、よく水洗し、クリーンオーブンを用いて230℃で20分ポストベイクを行い、パターンを定着させた。得られたパターンを電子顕微鏡で観察し、マスク開口に対応する部分の線幅を測定し、以下の基準で評価した。結果を下記表6に示す。
 A 線幅が35μm以上
 B 線幅が35μm未満30μm以上
 C 線幅が30μm未満
 なお、線幅が大きいほど感度が良好であると判断できる。
1. Sensitivity evaluation (line width sensitivity)
The compositions of Examples and Comparative Examples were spin-coated on a glass substrate, prebaked at 90 ° C. for 120 seconds using a hot plate, and cooled at 23 ° C. for 60 seconds. Spin-coating conditions were adjusted so that it might become the thickness of the coating film which becomes the chromaticity coordinate (x, y) = (0.135, 0.098) after post-baking. Then, it exposed through a photomask (mask opening 30 micrometers) using the ultrahigh pressure mercury lamp (exposure gap 300 micrometers, exposure amount 40 mJ / cm < 2 >). After developing using a 0.04 mass% KOH aqueous solution as a developing solution, it was thoroughly washed with water, and postbaked at 230 ° C. for 20 minutes using a clean oven to fix the pattern. The obtained pattern was observed with an electron microscope, and the line width of the portion corresponding to the mask opening was measured and evaluated according to the following criteria. The results are shown in Table 6 below.
A line width 35 μm or more B less than 35 μm 30 μm or more C line width less than 30 μm It can be judged that the larger the line width, the better the sensitivity.
2.耐熱性
 ガラス基板上に実施例及び比較例の組成物をスピンコートし、ホットプレートを用いて、90℃で120秒間プリベークを行った後、23℃で60秒間冷却した。スピンコート条件はポストベイク後の色度座標(x、y)=(0.135,0.098)になる塗膜の厚みとなるように調整した。
 その後、超高圧水銀ランプを用いて150mJ/cmで露光後、クリーンオーブンを用いて230℃で20分ポストベイクを行い、評価サンプルを作成した。得られたサンプルをクリーンオーブンを用いて250℃で1時間加熱して、加熱前後の380~780nmにおける透過率から、JIS Z8701に準拠してY値を求めた。得られたY値から保持率(%)=耐熱性試験後のY値/耐熱性試験前のY値×100を算出し、以下の基準で耐熱性評価を行った。結果を下記表6に示す。
〇:保持率(%)が99%以上である。
×:保持率(%)が99%未満である。
 なお、耐熱性評価が「〇」であると、硬化物は、耐熱性に優れることを示す。
2. The compositions of Examples and Comparative Examples were spin-coated on a heat resistant glass substrate, prebaked at 90 ° C. for 120 seconds using a hot plate, and then cooled at 23 ° C. for 60 seconds. Spin-coating conditions were adjusted so that it might become the thickness of the coating film which becomes the chromaticity coordinate (x, y) = (0.135, 0.098) after post-baking.
Thereafter, after exposure at 150 mJ / cm 2 using an extra-high pressure mercury lamp, post-baking was performed at 230 ° C. for 20 minutes using a clean oven to prepare an evaluation sample. The obtained sample was heated at 250 ° C. for 1 hour using a clean oven, and the Y value was determined from the transmittance at 380 to 780 nm before and after heating according to JIS Z8701. From the obtained Y value, retention (%) = Y value after heat resistance test / Y value before heat resistance test × 100 was calculated, and heat resistance evaluation was performed based on the following criteria. The results are shown in Table 6 below.
Good: The retention rate (%) is 99% or more.
X: The retention rate (%) is less than 99%.
In addition, a hardened | cured material shows that it is excellent in heat resistance in heat resistance evaluation being "O".
3.耐光性
 ガラス基板上に実施例及び比較例の組成物をスピンコートし、ホットプレートを用いて、90℃で120秒間プリベークを行った後、23℃で60秒間冷却した。スピンコート条件はポストベイク後の色度座標(x、y)=(0.135,0.098)になる塗膜の厚みとなるように調整した。その後、超高圧水銀ランプを用いて150mJ/cmで露光後、クリーンオーブンを用いて230℃で20分ポストベイクを行い、評価サンプルを作成した。スガ試験機製キセノン耐光性試験機テーブルサンXT-1500Lを用いて、評価用サンプルに対して200時間耐光性試験を実施した。
 評価用サンプルの耐光性試験前後の波長430nmでの透過率(%)の差((耐光性試験前の透過率(%)-耐光性試験後の透過率(%))を測定し、以下の基準で耐光性評価を行った。結果を下記表6に示す。
〇:透過率差(%)が耐光性試験前の透過率に対して2%未満である。
×:透過率差(%)が耐光性試験前の透過率に対して2%以上である。 
 なお、耐光性評価が「〇」であると、硬化物は、耐光性に優れることを示す。
3. Light Resistance The compositions of Examples and Comparative Examples were spin-coated on a glass substrate, prebaked at 90 ° C. for 120 seconds using a hot plate, and cooled at 23 ° C. for 60 seconds. Spin-coating conditions were adjusted so that it might become the thickness of the coating film which becomes the chromaticity coordinate (x, y) = (0.135, 0.098) after post-baking. Thereafter, after exposure at 150 mJ / cm 2 using an extra-high pressure mercury lamp, post-baking was performed at 230 ° C. for 20 minutes using a clean oven to prepare an evaluation sample. A 200 hour light resistance test was performed on the sample for evaluation using a Suga Test Instruments Xenon Light Resistance Tester Table Sun XT-1500L.
The difference in transmittance (%) at a wavelength of 430 nm before and after the light resistance test of the sample for evaluation ((transmittance (%) before light resistance test-transmittance (%) after light resistance test) was measured. The light resistance was evaluated based on the criteria, and the results are shown in Table 6 below.
Good: The transmittance difference (%) is less than 2% with respect to the transmittance before the light resistance test.
X: The difference in transmittance (%) is 2% or more with respect to the transmittance before the light resistance test.
In addition, a hardened | cured material shows that it is excellent in light resistance in light resistance evaluation being "O".
Figure JPOXMLDOC01-appb-T000050
Figure JPOXMLDOC01-appb-T000050
 本発明は、耐久性を有する硬化物を製造可能であり、かつ、硬化物の製造が容易な組成物を提供できるという効果を奏する。 The present invention has the effect of being able to produce a cured product having durability and capable of providing a composition that is easy to produce a cured product.

Claims (6)

  1.  下記一般式(A1)、(A2)又は(A3)で表される化合物Aと、
     下記一般式(B)で表される化合物Bと、を含む組成物。
    Figure JPOXMLDOC01-appb-C000001

    (式中、R及びRは、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又は-O-Rを表し、
     R及びRの少なくとも一方は、前記-O-Rであり、
     R及びRは、それぞれ独立に、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
     Rは、炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又はトリアルキルシリル基を表し、 前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基中のメチレン基は、炭素-炭素二重結合、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NR'-、>P=O、-S-S-、-SO-又はこれらの組み合わせで置き換わっている場合があり、
     前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基は置換基を有している場合があり、
     R’は、水素原子又は炭素原子数1~8のアルキル基を表し、
     複数のR同士及び複数のR同士は、それぞれ結合してベンゼン環又はナフタレン環を形成している場合があり、
     複数のR及び複数のRは、それぞれ同じである場合も異なっている場合もあり、
    m1は、1~10の整数を表し、
    a1は、0~4の整数を表し、
    a2は、0~2の整数を表し、
    a1は、直接結合又はm1価の原子若しくは結合基を表す。)
    Figure JPOXMLDOC01-appb-C000002

    (式中、R’及びR’は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又は-O-Rを表し、
     R’及びR’の少なくとも一方は、前記-O-Rであり、
     R及びRは、それぞれ独立に、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
     Rは、式(A1)と同義であり、
     前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基中のメチレン基は、炭素-炭素二重結合、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NR'-、>P=O、-S-S-、-SO-又はこれらの組み合わせで置き換わっている場合があり、
     前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基は置換基を有している場合があり、
     R’は、水素原子又は炭素原子数1~8のアルキル基を表し、
     複数のR同士及び複数のR同士は、それぞれ結合してベンゼン環又はナフタレン環を形成している場合があり、
     複数のR及び複数のRは、それぞれ同じである場合も異なっている場合もあり、
    m2は、1~10の整数を表し、
    a3は、0~4の整数を表し、
    a4は、0~3の整数を表し、
    a2は、直接結合又はm2価の原子若しくは結合基を表す。)
    Figure JPOXMLDOC01-appb-C000003

    (式中、R”及びR”は、それぞれ独立に、水素原子、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又は-O-Rを表し、
     R”及びR”の少なくとも一方は、前記-O-Rであり、
     R及びRは、それぞれ独立に、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
     Rは、式(A1)と同義であり、
     前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基中のメチレン基は、炭素-炭素二重結合、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NR'-、>P=O、-S-S-、-SO-又はこれらの組み合わせで置き換わっている場合があり、
     前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基は置換基を有している場合があり、
     R’は、水素原子又は炭素原子数1~8のアルキル基を表し、
     複数のR同士は、結合してベンゼン環又はナフタレン環を形成している場合があり、
     複数のR及び複数のRは、それぞれ同じである場合も異なっている場合もあり、
    m3は、1~3の整数を表し、
    a5は、0~3の整数を表し、
    a6は、0~3-m3の整数を表す。)
    Figure JPOXMLDOC01-appb-C000004

    (式中、R11は、炭素原子数1~20のアルキル基、炭素原子数2~20のアルケニル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基、炭素原子数2~20の複素環含有基又はトリアルキルシリル基を表し、
     R12及びR13は、それぞれ独立に、水素原子又は炭素原子数1~40のアルキル基を表し、
     R14は、ハロゲン原子、シアノ基、水酸基、ニトロ基、カルボキシル基、炭素原子数1~40のアルキル基、炭素原子数6~20のアリール基、炭素原子数7~20のアリールアルキル基又は炭素原子数2~20の複素環含有基を表し、
     前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基中のメチレン基は、炭素-炭素二重結合、-O-、-S-、-CO-、-O-CO-、-CO-O-、-O-CO-O-、-O-CO-O-、-S-CO-、-CO-S-、-S-CO-O-、-O-CO-S-、-CO-NH-、-NH-CO-、-NH-CO-O-、-NR'-、>P=O、-S-S-、-SO-又はこれらの組み合わせで置き換わっている場合があり、
     前記アルキル基、アリール基、アリールアルキル基、複素環含有基及びトリアルキルシリル基は置換基を有している場合があり、
     R’は、水素原子又は炭素原子数1~8のアルキル基を表し、
     複数のR14同士は、結合してベンゼン環又はナフタレン環を形成している場合があり、
     複数のR14は、それぞれ同じである場合も異なっている場合もあり、
    nは、1~10の整数を表し、
    b1は、0~2の整数を表し、
    は、直接結合又はn価の原子若しくは結合基を表す。)
    A compound A represented by the following general formula (A1), (A2) or (A3),
    The composition containing the compound B represented by following General formula (B).
    Figure JPOXMLDOC01-appb-C000001

    (Wherein, R 1 and R 2 each independently represent a hydrogen atom, a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, an aryl having 6 to 20 carbon atoms A group, an arylalkyl group having 7 to 20 carbon atoms, a heterocycle-containing group having 2 to 20 carbon atoms, or -O-R 9 ,
    At least one of R 1 and R 2 is -O-R 9 above;
    R 3 and R 4 each independently represent a halogen atom, cyano group, hydroxyl group, nitro group, carboxyl group, alkyl group having 1 to 40 carbon atoms, aryl group having 6 to 20 carbon atoms, or 7 to carbon atoms 20 arylalkyl groups or heterocyclic groups containing 2 to 20 carbon atoms,
    R 9 represents an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, or 2 to 6 carbon atoms 20 a heterocyclic group or a trialkylsilyl group, wherein the alkyl group, the aryl group, the arylalkyl group, the heterocyclic group and the methylene group in the trialkylsilyl group have a carbon-carbon double bond, -O- , -S-, -CO-, -O-CO-, -CO-O-, -O-CO-O-, -O-CO-O-, -S-CO-, -CO-S-,- S-CO-O-, -O-CO-S-, -CO-NH-, -NH-CO-, -NH-CO-O-, -NR'-,> P = O, -S-S- , -SO 2 -or a combination of these may be substituted,
    The alkyl group, the aryl group, the arylalkyl group, the heterocycle-containing group and the trialkylsilyl group may have a substituent,
    R ′ represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms,
    The plurality of R 3 s and the plurality of R 4 s may be bonded to each other to form a benzene ring or a naphthalene ring,
    The plurality of R 3 and the plurality of R 4 may be the same as or different from each other,
    m1 represents an integer of 1 to 10,
    a1 represents an integer of 0 to 4;
    a2 represents an integer of 0 to 2;
    X a1 represents a direct bond or an m monovalent atom or a bonding group. )
    Figure JPOXMLDOC01-appb-C000002

    (Wherein, R 1 ′ and R 2 ′ are each independently a hydrogen atom, a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, 6 to 20 carbon atoms And an arylalkyl group having 7 to 20 carbon atoms, a heterocyclic group having 2 to 20 carbon atoms, or -O-R 9 ,
    At least one of R 1 ′ and R 2 ′ is the above-described —O—R 9 ,
    R 5 and R 6 each independently represent a halogen atom, cyano group, hydroxyl group, nitro group, carboxyl group, alkyl group having 1 to 40 carbon atoms, aryl group having 6 to 20 carbon atoms, or 7 to carbon atoms 20 arylalkyl groups or heterocyclic groups containing 2 to 20 carbon atoms,
    R 9 has the same meaning as in formula (A1),
    The methylene group in the alkyl group, aryl group, arylalkyl group, heterocyclic group and trialkylsilyl group is a carbon-carbon double bond, -O-, -S-, -CO-, -O-CO- , -CO-O-, -O-CO-O-, -O-CO-O-, -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S- When substituted by -CO-NH-, -NH-CO-, -NH-CO-O-, -NR'-,> P = O, -S-S-, -SO 2 -or a combination thereof There is
    The alkyl group, the aryl group, the arylalkyl group, the heterocycle-containing group and the trialkylsilyl group may have a substituent,
    R ′ represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms,
    The plurality of R 5 s and the plurality of R 6 s may be bonded to each other to form a benzene ring or a naphthalene ring,
    Several R < 5 > and several R < 6 > may be same or different, respectively,
    m2 represents an integer of 1 to 10,
    a3 represents an integer of 0 to 4;
    a4 represents an integer of 0 to 3;
    X a2 represents a direct bond or an m-bivalent atom or a bonding group. )
    Figure JPOXMLDOC01-appb-C000003

    (Wherein, R 1 ′ ′ and R 2 ′ ′ each independently represent a hydrogen atom, a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, or 6 to 20 carbon atoms And an arylalkyl group having 7 to 20 carbon atoms, a heterocyclic group having 2 to 20 carbon atoms, or -O-R 9 ,
    At least one of R 1 ′ ′ and R 2 ′ ′ is the above-described —O—R 9 ,
    R 7 and R 8 each independently represent a halogen atom, a cyano group, a hydroxyl group, a nitro group, a carboxyl group, an alkyl group having 1 to 40 carbon atoms, an aryl group having 6 to 20 carbon atoms, or 7 to 7 carbon atoms 20 arylalkyl groups or heterocyclic groups containing 2 to 20 carbon atoms,
    R 9 has the same meaning as in formula (A1),
    The methylene group in the alkyl group, aryl group, arylalkyl group, heterocyclic group and trialkylsilyl group is a carbon-carbon double bond, -O-, -S-, -CO-, -O-CO- , -CO-O-, -O-CO-O-, -O-CO-O-, -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S- When substituted by -CO-NH-, -NH-CO-, -NH-CO-O-, -NR'-,> P = O, -S-S-, -SO 2 -or a combination thereof There is
    The alkyl group, the aryl group, the arylalkyl group, the heterocycle-containing group and the trialkylsilyl group may have a substituent,
    R ′ represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms,
    Several R 7 may be combined to form a benzene ring or a naphthalene ring,
    The plurality of R 7 and the plurality of R 8 may be identical to or different from each other,
    m3 represents an integer of 1 to 3;
    a5 represents an integer of 0 to 3;
    a6 represents an integer of 0 to 3-m3. )
    Figure JPOXMLDOC01-appb-C000004

    (Wherein, R 11 represents an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 20 carbon atoms, carbon Represents a heterocyclic group having 2 to 20 atoms or a trialkylsilyl group,
    R 12 and R 13 each independently represent a hydrogen atom or an alkyl group having 1 to 40 carbon atoms,
    R 14 is a halogen atom, cyano group, hydroxyl group, nitro group, carboxyl group, alkyl group having 1 to 40 carbon atoms, aryl group having 6 to 20 carbon atoms, arylalkyl group having 7 to 20 carbon atoms, or carbon Represents a heterocycle-containing group having 2 to 20 atoms,
    The methylene group in the alkyl group, aryl group, arylalkyl group, heterocyclic group and trialkylsilyl group is a carbon-carbon double bond, -O-, -S-, -CO-, -O-CO- , -CO-O-, -O-CO-O-, -O-CO-O-, -S-CO-, -CO-S-, -S-CO-O-, -O-CO-S- When substituted by -CO-NH-, -NH-CO-, -NH-CO-O-, -NR'-,> P = O, -S-S-, -SO 2 -or a combination thereof There is
    The alkyl group, the aryl group, the arylalkyl group, the heterocycle-containing group and the trialkylsilyl group may have a substituent,
    R ′ represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms,
    Several R 14 may be combined to form a benzene ring or a naphthalene ring,
    Several R 14 may be the same or different.
    n represents an integer of 1 to 10,
    b1 represents an integer of 0 to 2;
    X b represents a direct bond or an n-valent atom or a bonding group. )
  2.  前記R及びR11は、酸素原子側の末端のメチレン基が-CO-O-に置き換えられている炭素原子数1~20のアルキル基である、請求項1に記載の組成物。 The composition according to claim 1, wherein each of R 9 and R 11 is an alkyl group having 1 to 20 carbon atoms in which the terminal methylene group at the oxygen atom side is replaced by -CO-O-.
  3.  前記化合物Aの含有量が、前記化合物A及び前記化合物Bの合計100質量部に対して、1質量部以上99質量部以下である、請求項1又は請求項2に記載の組成物。 The composition according to claim 1 or 2, wherein a content of the compound A is 1 part by mass or more and 99 parts by mass or less with respect to a total of 100 parts by mass of the compound A and the compound B.
  4.  重合性化合物を含む、請求項1から請求項3のいずれか1項に記載の組成物。 The composition according to any one of claims 1 to 3, comprising a polymerizable compound.
  5.  請求項4に記載の組成物の硬化物。 A cured product of the composition according to claim 4.
  6.  請求項4に記載の組成物の硬化物を形成する工程を有する、硬化物の製造方法。 The manufacturing method of hardened | cured material which has the process of forming hardened | cured material of the composition of Claim 4.
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WO2023126786A1 (en) * 2021-12-30 2023-07-06 3M Innovative Properties Company Crosslinkable compositions including a latent uv-absorber

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TW201922889A (en) 2019-06-16
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KR20200061318A (en) 2020-06-02

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