WO2019067841A1 - Jig apparatus of reflective layer coating for reflector and manufacturing method of reflector - Google Patents

Jig apparatus of reflective layer coating for reflector and manufacturing method of reflector Download PDF

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Publication number
WO2019067841A1
WO2019067841A1 PCT/US2018/053315 US2018053315W WO2019067841A1 WO 2019067841 A1 WO2019067841 A1 WO 2019067841A1 US 2018053315 W US2018053315 W US 2018053315W WO 2019067841 A1 WO2019067841 A1 WO 2019067841A1
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WO
WIPO (PCT)
Prior art keywords
jig
molding plate
reflector
assembly
molding
Prior art date
Application number
PCT/US2018/053315
Other languages
French (fr)
Inventor
Jung Sik Choi
Hyun Jong Ko
Original Assignee
Molex, Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex, Llc filed Critical Molex, Llc
Publication of WO2019067841A1 publication Critical patent/WO2019067841A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/08—Mirrors; Reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0808—Mirrors having a single reflecting layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0019—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having reflective surfaces only (e.g. louvre systems, systems with multiple planar reflectors)
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Definitions

  • the present disclosure relates to a reflector used in an iris recognition sensor, a light emitting diode (LED), or etc., and more particularly, to a reflective layer manufacturing apparatus for forming a reflective layer on a reflective surface of an insulation mold, and a reflector manufacturing method using the same.
  • a reflector 10 has a cup-like mounting recess 12 formed in a center of a molding portion 11 using an insulating resin.
  • An LED package 22 mounted on a substrate 21 is mounted in the mounting recess 12.
  • the mounting recess 12 may have a flat surface formed in a circular or polygonal shape and have an inner wall surface having an inclined surface 13, such that the mounting recess 12 becomes gradually wider toward the top.
  • the reflector 10 has a reflective layer 14 formed on a surface of the insulating resin to reflect light distributed to the inner space of the mounting recess 12 to the front.
  • the reflector having the above-described reflective layer and the manufacturing method thereof are introduced in Korean Patent Registration No. 10-0963735, Japanese Patent Publication No. P2008-172125A, or etc.
  • the related-art reflector introduced in the above-mentioned prior art documents is manufactured by forming an insulation mold having a plurality of mounting recesses, forming a reflective layer on a surface of the insulation mold by using Ag, etc., and then dicing into a unit reflector.
  • forming the reflective layer includes a step of depositing a metal film, a step of patterning a circuit forming portion and a non-circuit forming portion by lasers, a step of forming a passivation on the circuit forming portion, a step of removing the non-circuit forming portion by etching, a step of separating the passivation, and a step of forming a plating layer on the circuit forming portion.
  • the related-art process of forming the reflective layer requires laser processing, passivation processing, and etching. Accordingly, the related-art reflector should go through various steps to form a reflective layer, and thus has disadvantages that the manufacturing process is complicated, and much time is required.
  • the related-art process of forming the reflective layer for the reflector essentially requires laser processing and etching, and thus there is a disadvantage that manufacturing costs rise.
  • the related-art process of forming the reflective layer for the reflector has difficulty in processing chemicals such as sulfuric acid, nitric acid, hydrochloric acid, etc., and waste of the chemicals used in etching may cause an environmental pollution problem.
  • the LDS technology is to apply laser processing to a molding surface to enhance adhesion of plating but is not suitable to a reflector since reflectivity is reduced due to roughness of the molding surface.
  • the Miptec should go through the etching process for a plating layer, and thus in consideration of this, an initial plating layer should have a thick thickness.
  • the Miptic has a limit to forming a plating layer only with an electroplating process, and also, there is a problem that the plating layer is damaged in a reflector dicing process.
  • Patent Document 1 Korean Patent Registration No. 10-0963735
  • Patent Document2 Japanese Patent Publication No. P2008-172125A
  • the present disclosure has been suggested to solve the above-mentioned problems, and an object of the present disclosure is to provide a jig apparatus for forming a reflective layer for a reflector, which can simplify a manufacturing process and reduce a manufacturing cost by applying patterning and plating to an insulation mold surface simultaneously.
  • Another object of the present disclosure is to provide a jig apparatus which guarantees high reflectivity, while forming a thin plating layer.
  • Still another object of the present disclosure is to provide a jig apparatus which can form a plating layer by selectively applying electroplating and electroless plating and can prevent a damage to the plating layer in a dicing process.
  • the present disclosure provides a jig apparatus which forms a metal layer on a surface of a molding plate having a plurality of reflector portions formed thereon to receive various sensors or light sources, the jig apparatus having an assembly having a plurality of plates stacked one on another and assembled with one another therein, the jig apparatus including: a middle jig which has a center opened to receive the molding plate; a top jig which has a deposition hole including a reflector hole formed therein, and is assembled to an upper surface of the middle jig and masks an upper surface of the molding plate; a bottom jig which is assembled to a lower surface of the middle jig and masks a lower surface of the molding plate; and an assembly member which fixes the assembly of the top jig, the middle jig, and the bottom jig, wherein the molding plate is assembled to the molding receiving portion, and a metal layer is formed on a surface of the
  • the jig apparatus may further include a support jig which is provided with a plurality of mounting portions protruding from a border of a plate to be mounted in a chamber and is assembled to a lower surface of the bottom jig.
  • the jig apparatus may further include a guide pin which includes a head portion and a guide portion protruding from one surface of the head portion, and the guide pin may guide the assembly of the top jig, the middle jig, and the bottom jig when the guide portion is inserted into guide holes formed on plates of the top jig, the middle jig, and the bottom jig.
  • the assembly member may be formed of a plurality of magnets having magnetism, and the assembly member may be inserted into an assembly hole formed in the middle jig and may press the top jig and the bottom jig which are made of SUS to the middle jig.
  • the jig apparatus may further include a cover jig which is assembled between the top jig and the middle jig and prevents the magnets from being released.
  • the trace hole may further include a connection portion for connecting the plurality of reflector portions, and a contact portion extending outward from the reflector portion on both side edges.
  • the top jig may have a concave and convex structure formed on a lower surface thereof and having an assembly recess and an assembly protrusion, and the assembly protrusion may be in close contact with an upper surface of the molding plate on the periphery of the mounting recess, and may prevent a metal layer from being deposited onto an upper surface of the molding plate other than the mounting recess.
  • the molding plate may have a stepped structure formed on an upper surface of the mounting recess and having a stepped recess and a stepped protrusion continuously formed, and the assembly protrusion may be in close contact with an upper surface of the stepped recess and may prevent a metal layer from being deposited onto the stepped recess.
  • the bottom jig may have a penetrating hole penetrating to allow metal particles flowing into the mounting recess to be discharged to a lower side.
  • the present disclosure provides a method for manufacturing a reflector having a reflective layer, the method including the steps of: (a) forming a molding plate having a plurality of mounting recesses formed thereon; (b) assembling a middle jig having a molding receiving portion to a bottom jig, assembling the molding plate to the molding receiving portion, and assembling a top jig having a trace hole formed thereon to correspond to the mounting recess to an upper surface of the middle jig, and masking the molding plate; (c) mounting the jig apparatus in a chamber and forming a metal layer on a surface of the molding plate exposed to the trace hole; (d) separating the molding plate from the jig apparatus; (e) forming a plating layer on the metal layer of the molding plate; and (f separating the molding plate in the unit of the mounting recess.
  • the plating layer at step (e) may be formed by electroplating or electroless plating.
  • the reflector manufacturing process using the jig apparatus of the present disclosure does not apply a laser patterning process for patterning a reflective layer, and an etching process for forming the reflective layer, and thus can be simplified and can reduce a manufacturing cost.
  • the jig apparatus of the present disclosure can manufacture a metal layer for electroplating or electroless plating on all molding plates according to user's selection.
  • FIG. 1 is a cross-sectional view illustrating a schematic structure of a related-art reflector
  • FIG.2 is a perspective view illustrating a jig apparatus according to an exemplary embodiment of the present disclosure
  • FIG 3 is an exploded perspective view illustrating the jig apparatus of FIG 2;
  • FIG. 4 is a perspective view illustrating a molding plate according to an exemplary embodiment of the present disclosure
  • FIG 5 is a perspective view illustrating a metal layer of a thin film formed on the molding plate of FIG. 4;
  • FIG 6 is a cross-sectional view illustrating a reflector portion of the jig apparatus according to an exemplary embodiment of the present disclosure
  • FIG. 7 is a cross-sectional view illustrating a guide fastening portion of the jig apparatus according to an exemplary embodiment of the present disclosure
  • FIG 8 is a cross-sectional view illustrating a thin film deposition process of the jig apparatus according to an exemplary embodiment of the present disclosure
  • FIG 9 is a cross-sectional view illustrating a reflector bar having a thin film deposited thereon by the process of FIG. 8 in detail;
  • FIG 10 is an exploded perspective view illustrating a jig apparatus according to another exemplary embodiment of the present disclosure.
  • FIG. 11 is a perspective view illustrating a molding plate according to another exemplary embodiment of the present disclosure.
  • FIG. 12 is a perspective view illustrating a metal layer of a thin film formed on the molding plate of FIG. 11;
  • FIG. 13 is a process view illustrating a reflector manufacturing process according to an exemplary embodiment of the present disclosure
  • FIG. 14 is a top view illustrating a dicing process of the molding plate according to an exemplary embodiment of the present disclosure.
  • FIG IS is a top view illustrating a dicing process of the molding plate according to another exemplary embodiment of the present disclosure.
  • FIG.2 is a perspective view illustrating a jig apparatus according to an exemplary embodiment
  • FIG. 3 is an exploded perspective view illustrating the jig apparatus of FIG. 2.
  • the jig apparatus 100 has a plurality of plates stacked one on another and assembled and includes a molding plate 200 assembled therein to manufacture a reflector and masks some regions of the molding plate 200 and thereby forms a metal layer 250 of a thin film (see FIG. 5) on a surface of the molding plate 200 which is opened.
  • the jig apparatus 100 includes atop jig llO formasking an upper portion, a middle jig 120 receiving the molding plate 200, a cover jig 130 covering an upper surface of the middle jig, a bottom jig 140 for masking a lower portion, a support jig 150 for coupling the jig apparatus to a chamber, a guide pin 160 for guiding assembly of these jigs, and an assembly member 170 for assembling these jigs.
  • the jigs are formed in a plate shape having a predetermined thickness, and the support jig 150, the bottom jig 140, the middle jig 120, the cover jig 130, and the top jig 110 are stacked in sequence, thereby forming an assembly, and the molding plate 200 is assembled into an inner space formed by the middle jig 120.
  • the top jig 110 which is the uppermost plate of the jig apparatus 100, performs a masking function of the jig apparatus 100, and may be formed of a rectangular plate of stainless steel (SUS).
  • the top jig 110 has a deposition hole 111 formed on a center thereof and penetrating therethrough so as to form a metal layer according to a desired shape.
  • the deposition hole 111 includes a plurality of reflector holes 112 corresponding to a shape of a reflector portion 220 (see FIG. 4) of the molding plate 200, and a trace hole 113 connecting the respective reflector holes 112.
  • the trace hole 113 allows metals layers 250 of thin films, deposited on inclined surfaces 222 of the reflector portions 220 through the respective reflector holes 112, to be electrically connected with one another, such that plating layers 260 (see FIG. 14) can be uniformly formed on the respective metal layers 250 through electroplating, simultaneously. Accordingly, the top jig 110 having the trace hole 113 enables the molding plate having the metal layers 250 formed thereon to have the plating layers 260 formed thereon through electroplating.
  • a plurality of deposition holes 111 may be formed at predetermined intervals, and each of the deposition holes 111 may further include contact holes 114 formed at both ends thereof to electrically connect the metal layers 250.
  • the top jig 110 is provided with a guide hole 115 penetrating through each corner or edge region thereof so as to be assembled with the middle jig 120, the bottom jig 140, or the like.
  • the guide hole 115 has the guide pin 160 inserted thereinto, and guides assembly of the plates forming the respective jigs.
  • the middle jig 120 which is a rectangular plate for guiding assembly of the molding plate 200, has a center portion opened to include a molding receiving portion 121 to receive the molding plate 200.
  • the middle jig 120 may have a predetermined thickness corresponding to the thickness of the molding plate 200 and may be formed of a rectangular plate of SUS.
  • the inner surface of the middle jig 120 comes into contact with the outer surface of the molding plate 200 and guides the molding plate 200 to be in position inside the molding receiving portion 121.
  • the middle jig 120 receives an assembly member 170, and has an assembly hole 122 formed along a border of the plate to receive the assembly member 170.
  • a plurality of assembly holes 122 are formed along the border of the rectangular plate.
  • the middle jig 120 has an avoidance recess 123 formed on an inner side of the plate forming the molding receiving portion 121 to allow the molding plate 200 to be easily assembled and disassembled.
  • the avoidance recess 123 may be formed at a corer or on a side portion of the plate.
  • the cover jig 130 covers the upper surface of the middle jig 120 and prevents the assembly member 170 from being released from the middle jig 120 and may be formed of a rectangular plate of SUS.
  • the cover jig 130 forms the molding receiving portion 121 and an avoidance recess 133 in the same shapes as those of the middle jig 120 but has no assembly hole formed thereon. Therefore, the cover jig 130 prevents the assembly member 170 from being released by covering the assembly hole 122 of the middle jig 120 when being assembled with the middle jig 120.
  • the cover jig 130 may complement the thickness of the middle jig 120. That is, when the molding plate 200 received in the middle jig 120 is thicker than the middle jig 120, the cover jig 130 compensates for the thickness of the middle jig 120, thereby having the same thickness as that of the molding plate 200. To achieve this, the cover jig 130 is formed of a plate having a thin thickness compared with the middle jig 120. [0053] The bottom jig 140 fixes the assembly while supporting the molding plate 200.
  • the bottom jig 140 may be formed of a rectangular plate of SUS, and an upper surface of the bottom jig 140 has a structure corresponding to a shape of a lower surface of the molding plate 200.
  • the bottom jig 140 covers a lower portion of the middle jig 120 and prevents metal particles from being deposited onto a rear surface of the molding plate 200 when the metal layer 250 of the thin film is formed.
  • the bottom jig 140 may be provided with a guide hole 145 to allow the guide pin 160 to be inserted thereinto and to be assembled with each jig and may be provided with an assembly hole 142 formed along the border of the plate to receive the assembly member 170.
  • the bottom jig 140 may have a deposition hole 143 to allow a metal layer for electric connection to be deposited onto a rear surface of the molding plate 200.
  • the support jig 150 is configured to support the plates forming the respective jigs, and to fix the jig apparatus 100 to a deposition chamber (not shown) in a thin film deposition process.
  • the support jig 150 may be formed of a rectangular plate of SUS and has a relatively thick thickness compared with the top jig 110, the cover jig 130, and the bottom jig 140, so as to stably support the respective jig plates.
  • the support jig 150 may have a plurality of mounting portions 151 protruding from side portions of the plate outwardly to be mounted in the chamber, and a chamber hole 152 may be formed on the mounting portion 151.
  • the bottom jig 140 may have a guide hole 155 to allow the guide pin 160 to be inserted thereinto and to be assembled with each jig and may have a deposition hole 153 to allow the metal layer for electric connection to be deposited onto the rear surface of the molding plate 200.
  • the support jig 150 As a configuration for supporting the jig apparatus 100 and mounting the same in the chamber, the support jig 150 is illustrated.
  • the bottom jig 140 may be configured to support the jig apparatus 100 and to mount the same in the chamber. That is, the bottom jig 140 may be formed of a plate having predetermined rigidity, and may be provided with a separate mounting potion, and may be replaced for the support jig 150.
  • the guide pin 160 guides the plates forming the respective jigs to be assembled in position and includes a head portion 161 having a predetermined diameter, and a guide portion 162 protruding upwardly from a center ofthe head portion.
  • a plurality of guide pins 160 may be provided, and for example, four guide pins 160 may be provided for the jigs of the rectangular plate shape and may be coupled to the respective corners.
  • the guide pin 160 guides the assembly ofthe respective jigs with the guide portion 162 being inserted into the guide holes 115, 145, 155 formed at respective corners of the top jig 110, the bottom jig 140, and the support jig 150.
  • the assembly member 170 is to assemble the respective jigs and to fix the assembly of the jigs, and in the present disclosure, the assembly member 170 is formed of a magnet to assemble the respective jigs with magnetism.
  • the magnet has a predetermined diameter and a predetermined thickness and is inserted into the assembly hole 122 formed on the middle jig 120.
  • a plurality of magnets may be inserted along the border ofthe middle jig 120, and for example, two magnets on each side portion ofthe middle jig 120 of the rectangular plate shape, that is, eight magnets in total, may be provided.
  • the assembly member 170 described above is inserted into the middle jig 120 and presses the top jig 110 and the cover jig 130 on the upper portion of the assembly member 170 and the bottom jig 140 and the support jig 150 on the lower portion of the assembly member 170 to the middle jig 120 with strong magnetism, and thereby assemblies the jigs.
  • the assembly member 170 may be formed of other means such as a screw or a clamp, in addition to the magnet, and the magnet has the merit of being able to strongly press the respective jigs without a separate fastening process.
  • the respective jigs may be formed of the plate of SUS which reacts to magnetism.
  • the middle jig 120 may be formed of a magnetic plate having magnetism.
  • FIG. 4 is a perspective view illustrating the molding plate according to an exemplary embodiment
  • FIG. 5 is a perspective view illustrating the metal layer of the thin film formed on the molding plate of FIG. 4.
  • the metal layer 250 of the thin film is formed on the inclined surface 222 of the reflector portion 220 with the molding plate 200 being assembled to the jig apparatus 100, and the molding plate 200 is separated from the jig apparatus 100 and a plating layer is formed on the metal layer 250, and then the molding plate 200 is divided into a plurality of individual reflectors.
  • the molding plate 200 is formed in the shape of a rectangular plate having a predetermined thickness as shown in FIG. 4, and has a width corresponding to the molding receiving portion 121 of the middle jig 120.
  • the molding plate 200 may be formed by injection molding using an insulating resin and may have a guide hole 205 formed on an edge thereof to allow the guide pin 160 to be inserted thereinto and to be assembled with the jig apparatus 100.
  • the molding plate 200 is provided with the reflector portion 220 including a mounting recess 221 formed on the center thereof to mount a sensor or an LED, and the inclined surface 222 for forming a reflective layer.
  • a plurality of reflector portions 220 may be formed along a reflector bar 210 at predetermined intervals, and a plurality of reflector bars 210 may be arranged at predetermined intervals.
  • the reflector portion 220 has a penetrating hole 220a penetrating through a bottom surface thereof.
  • a trace portion 211 may be formed on an upper surface of the reflector bar 210 to connect the plurality of reflector portions 220.
  • the molding plate 200 may have contact portions 230 formed on both sides of the reflector bar 210 and penetrating through the rear surface of the molding plate 200 to electrically connect the metal layers 250 to be formed on the inclined surface 222 of each reflector portion 220 and the trace portion 211.
  • the molding plate 200 having the above-described configuration is received in the molding receiving portion 121 of the middle jig 120, and the top jig 110 and the bottom jig 140 are assembled to the front surface and the rear surface of the middle jig 120, respectively, such that the front surface and the rear surface of the molding plate 200 are masked.
  • the jig apparatus 100 having the molding plate 200 mounted therein is mounted in the chamber for thin film deposition, and metal particles are made to be deposited, and as a result, the metal layer 250 of the thin film is formed along the reflector portion 220, the trace portion 211, and the contact portion 230 on the front surface of the molding plate 200 as shown in FIG. 5.
  • FIG. 6 is a cross-sectional view illustrating the reflector portion of the jig apparatus in detail according to an embodiment, and is a view taken on line A-A of FIG. 2
  • FIG. 7 is a cross-sectional view illustrating a guide fastening portion of the jig apparatus in detail according to an embodiment, and is a view taken on line B-B of FIG. 2.
  • the molding plate 200 has the plurality of reflector portions 220 formed thereon in a cup-like shape, and the top jig 110 is assembled to the upper portion of the molding plate 200, and the bottom jig 140 and the support jig 150 are assembled to the lower portion of the molding plate 200.
  • concave and convex structures corresponding to each other are formed between the top jig 110 and the molding plate 200 and between the molding plate 200 and the bottom jig 140, such that the molding plates can be easily assembled and stably fixed.
  • the upper surface of the molding plate on the periphery of the reflector portion 220 that is, the upper surface of the molding plate connected with the inclined surface 222, has a stepped structure formed in a stair shape.
  • the top jig 110 has an assembly recess 116 into which the stepped protrusion 212 is inserted, and an assembly protrusion 117 close in contact with the stepped recess 213 to correspond to the upper surface of the molding plate 200.
  • the stepped protrusion 212 is inserted into the assembly recess 116, such that the top jig 110 and the molding plate 200 having the above-described configuration can be stably assembled with each other.
  • the assembly protrusion 117 of the top jig 110 is in contact with the stepped recess 213 while pressing the stepped recess 213, and in particular, blocks the stepped recess 213 from being exposed to the deposition hole 111. Accordingly, the assembly protrusion 117 prevents a thin film from being formed on an unnecessary portion except for the inclined surface 222 of the reflector portion 220 in the thin film deposition process.
  • the reflector portion 220 of the molding plate 200 has a fixing recess 214 formed on a lower surface thereof to be coupled with the bottom jig 140, and the bottom jig 140 has a fixing protrusion 146 formed on an upper surface thereof to correspond to the fixing recess 214. Accordingly, the fixing protrusion 146 is inserted into the fixing recess 214, such that the assembly of the molding plate 200 and the bottom jig 140 is stably fixed.
  • the top jig 110 and the bottom jig 140 are assembled in the concave and convex structure with reference to the molding plate 200, and in this case, the concave portion and the convex portion may be formed on the molding plate to correspond to each other or may be selectively formed on the top jig or the bottom jig.
  • the concave portion and the convex portion may be formed on the molding plate 200 of the resin material by injection molding and may be formed on the top jig 110 and the bottom jig 140 of SUS by etching.
  • the guide fastening portion of the jig apparatus 100 assembles the respective jig plates and the molding plate by means of the guide pin. That is, the guide holes 115, 145, 155, and 205 are formed on the respective jig plates and the molding plate to have the same center with respect to the vertical direction, and the guide portion 162 of the guide pin 160 is inserted into the guide holes and guides the assembly of the respective jig plates and the molding plate when the support jig 150, the bottom jig 140, the middle jig 120, the molding plate 200, the cover jig 130, and the top jig 110 are stacked in sequence.
  • FIG. 8 is a cross-sectional view illustrating a thin film deposition process of the jig apparatus according to an embodiment
  • FIG. 9 is a cross-sectional view illustrating the reflector bar having the thin film deposited thereon according to the process of FIG. 8 in detail.
  • the molding plate 200 assembled inside the jig apparatus 100 is mounted in the chamber for thin film deposition, and the metal layer 250 of the thin film is formed on the inclined surface 222 of the reflector portion 220 through the deposition hole 111.
  • the mounting recess 221 of the reflector portion 220 is opened by the deposition hole 111 and is exposed to the outside as shown in FIG. 8, and the upper surface of the reflector portion 220 except for the inclined surface 222 is masked by the top jig 110.
  • the stepped recess 213 on the periphery of the reflector portion 220 is blocked by the assembly protrusion 117 of the top jig 110 from the deposition hole 111, and metal particles are prevented from being deposited onto the stepped recess 213.
  • the jig apparatus 100 After the jig apparatus 100 is mounted in the chamber, metal particles 310 reduced from a target plate 300 pass through the deposition hole 111 and moves to the inside of the mounting recess 220 and are deposited onto the inclined surface 222.
  • the reflector portion 220 has a lower side opened through the penetrating hole 220a, and the same penetrating holes 220a are formed in the bottom jig 140 and the support jig 150 to fluidly communicate with each other.
  • the metal particles 310 inside the mounting recess 221 are deposited onto the inclined surface 222, and simultaneously, some of the metal particles 310 are discharged to the outside of the mounting recess 221 through the penetrating hole 220a
  • the penetrating hole 220a allows surplus metal particles of the metal particles 310 flowing in the inner space of the mounting recess 221 to be discharged to the outside, and in the process, allows the metal particles 310 to be deposited onto a vertical surface of the penetrating hole 220a of the reflector portion 220.
  • a uniform metal layer may be formed on the inclined surface
  • the reflector portion 220 has the metal layer 250 of the thin film formed on the inclined surface 222 of the inside of the mounting recess 221, and the vertical surface 220a, and prevents metal particles from being deposited onto the other unnecessary portions, such that the metal layer 250 can be exactly and minutely formed, and can have a thin and uniform thickness all over.
  • FIG. 10 is an exploded perspective view illustrating a jig apparatus according to another exemplary embodiment
  • FIG. 11 is a perspective view illustrating a molding plate according to another exemplary embodiment
  • FIG. 12 is a perspective view illustrating a metal layer of a thin film formed on the molding plate of FIG. 11.
  • the jig apparatus 100 is configured to form a reflective layer by electroless plating. Accordingly, the molding plate 200 is not provided with the trace portion 211 (see FIG. 4) for connecting the respective reflector portions 220, or the contact portion 230 (see FIG. 4) for electric connection, and the deposition hole 111 of the top jig 110 does not require the trace hole 113 (see FIG. 3) and the contact hole 114 (see FIG. 3), and is formed of only the reflector hole 112.
  • the metal layers 250 are separately formed on the reflector portions 220 on the surface of the molding plate 200 in the unit of each reflector portion 220. Therefore, a plating layer may be formed on the metal layer by electroless plating.
  • the molding plate is not provided with the trace portion 211 or the contact portion 230 to form the metal layer 250 for electroless plating
  • the molding plate provided with the trace portion 211 or the contact portion 230 may be assembled with a jig apparatus for forming a metal layer for electroless plating and may form the metal layer for electroless plating. That is, the jig apparatus 100 of the present disclosure has an advantage that electro plating or electroless plating is easily changed and used simply by replacing the top jig 110 according to user's selection.
  • FI 13 is a process view illustrating a reflector manufacturing process according to an exemplary embodiment.
  • the molding plate 200 is separately manufactured by injection molding using a synthesis resin of an insulating material (S 11).
  • the reflector bar 210 including the plurality of reflector portions 220 is formed on the molding plate 200, and a trace portion and a contact portion for electroplating may further be formed on the molding plate 200 when necessary.
  • the molding plate 200 formed by injection molding is assembled with the jig apparatus 100 which is capable of performing electroplating or electroless plating, and portions of the molding plate 200 other than the deposition hole on which a metal layer should be formed are masked (S12).
  • the jig apparatus 100 with which the molding plate 200 is assembled is mounted in a chamber, and the metal layer 250 of the thin film is deposited onto the surface of the molding plate (S13), and then the molding plate 200 having the metal layer 250 deposited thereon is separated from the jig apparatus 100 (S14).
  • the plating layer 260 is formed on the metal layer 250 by electroplating or electroless plating by using the separated molding plate 200 (SI 5), and the molding plate 200 is diced in the unit of each reflector portion 220, and finally, an individual reflector is manufactured (SI 6).
  • a process of neatening a side portion of a line by laser may further be applied to enhance accuracy or a degree of completion of the metal layer or the plating layer.
  • the process of manufacturing the reflector by using the jig apparatus of the present disclosure does not apply a laser processing process and an etching process for patterning the metal layer or the plating layer, and thus can be simplified and can reduce a manufacturing cost.
  • the top jig for electroplating or the top jig for electroless plating is used according to user's selection, such that the molding plate 200 capable of electroplating or electroless plating can be manufactured.
  • FIGS. 14 and 15 are top views illustrating a dicing process of the molding plate according to an embodiment, and illustrate the molding plates on which the plating layer is formed by electroplating and electroless plating, respectively,
  • the plating layer 260 is formed on the metal layer 250 by electro plating or electroless plating, and then the reflector bar 210 is separated in the unit of the reflector portion 220, such that individual reflectors can be manufactured.
  • the individual reflectors may be separated by dicing, and the dicing is applied to the reflector bar 210 between the respective reflector portions 220. Accordingly, even when the plating layer 260 is formed on the trace portion 211 of the reflector bar 210 by electroplating as shown in FIG. 14, the plating layer of the trace portion has a relatively small width compared with the plating layer 260 of the reflector portion, and dicing is performed at a portion spaced apart from the plating layer 260 of the reflector portion. Therefore, the plating layer of the reflector portion is scarcely influenced by dicing.

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Abstract

The present disclosure relates to a reflective layer manufacturing apparatus which forms a reflective layer on a reflective surface of an insulation mold, and a reflector manufacturing method using the same. The present disclosure provides a jig apparatus which forms a metal layer on a surface of a molding plate having a plurality of reflector portions formed thereon to receive various sensors or light sources, the jig apparatus having an assembly having a plurality of plates stacked one on another and assembled with one another therein, the jig apparatus including: a middle jig which has a center opened to receive the molding plate; a top jig which has a deposition hole including a reflector hole formed therein, and is assembled to an upper surface of the middle jig and masks an upper surface of the molding plate; a bottom jig which is assembled to a lower surface of the middle jig and masks a lower surface of the molding plate; and an assembly member which fixes the assembly of the top jig, the middle jig, and the bottom jig, wherein the molding plate is assembled to the molding receiving portion, and a metal layer is formed on a surface of the molding plate.

Description

JIG APPARATUS OF REFLECTIVE LAYER COATING FOR REFLECTOR
AND MANUFACTURING METHOD OF REFLECTOR
RELATED APPLICATIONS
[0001] This application claims priority to Korean Application No. 10-2017-0126867, filed September 29, 2017, which is incorporated herein by reference in its entirety.
TECHNICAL FIELD
[0002] The present disclosure relates to a reflector used in an iris recognition sensor, a light emitting diode (LED), or etc., and more particularly, to a reflective layer manufacturing apparatus for forming a reflective layer on a reflective surface of an insulation mold, and a reflector manufacturing method using the same.
BACKGROUND ART
[0003] With the rapid development of information and communication technology in recent years, the market of products related to displays and portable electronic devices is rapidly growing, and accordingly, the demand for various sensors, LEDs, etc. essentially used in these industries, and research and development therefor are increasing. In particular, products such as iris recognition sensors and LED packages are increasingly mounted in portable electronic devices or various security-related products to recognize users, and the senor or the LED is mounted and used in a reflector to enhance accuracy and efficiency.
[0004] As shown in FIG. 1, a reflector 10 has a cup-like mounting recess 12 formed in a center of a molding portion 11 using an insulating resin. An LED package 22 mounted on a substrate 21 is mounted in the mounting recess 12. The mounting recess 12 may have a flat surface formed in a circular or polygonal shape and have an inner wall surface having an inclined surface 13, such that the mounting recess 12 becomes gradually wider toward the top. The reflector 10 has a reflective layer 14 formed on a surface of the insulating resin to reflect light distributed to the inner space of the mounting recess 12 to the front.
[0005] The reflector having the above-described reflective layer and the manufacturing method thereof are introduced in Korean Patent Registration No. 10-0963735, Japanese Patent Publication No. P2008-172125A, or etc. The related-art reflector introduced in the above-mentioned prior art documents is manufactured by forming an insulation mold having a plurality of mounting recesses, forming a reflective layer on a surface of the insulation mold by using Ag, etc., and then dicing into a unit reflector. In this case, forming the reflective layer includes a step of depositing a metal film, a step of patterning a circuit forming portion and a non-circuit forming portion by lasers, a step of forming a passivation on the circuit forming portion, a step of removing the non-circuit forming portion by etching, a step of separating the passivation, and a step of forming a plating layer on the circuit forming portion.
[0006] That is, the related-art process of forming the reflective layer requires laser processing, passivation processing, and etching. Accordingly, the related-art reflector should go through various steps to form a reflective layer, and thus has disadvantages that the manufacturing process is complicated, and much time is required.
[0007] In addition, the related-art process of forming the reflective layer for the reflector essentially requires laser processing and etching, and thus there is a disadvantage that manufacturing costs rise. In addition, the related-art process of forming the reflective layer for the reflector has difficulty in processing chemicals such as sulfuric acid, nitric acid, hydrochloric acid, etc., and waste of the chemicals used in etching may cause an environmental pollution problem.
[0008] In recent years, a reflector of an MID structure to which laser direct structuring (LDS) or microscopic integrated processing technology (Miptec) is applied is introduced, but even in this case, there is the disadvantage that laser processing should be essentially applied. In particular, the LDS technology is to apply laser processing to a molding surface to enhance adhesion of plating but is not suitable to a reflector since reflectivity is reduced due to roughness of the molding surface. In addition, the Miptec should go through the etching process for a plating layer, and thus in consideration of this, an initial plating layer should have a thick thickness. In addition, the Miptic has a limit to forming a plating layer only with an electroplating process, and also, there is a problem that the plating layer is damaged in a reflector dicing process.
[0009] Patent Document 1 : Korean Patent Registration No. 10-0963735
[0010] Patent Document2: Japanese Patent Publication No. P2008-172125A
SUMMARY
[0011] The present disclosure has been suggested to solve the above-mentioned problems, and an object of the present disclosure is to provide a jig apparatus for forming a reflective layer for a reflector, which can simplify a manufacturing process and reduce a manufacturing cost by applying patterning and plating to an insulation mold surface simultaneously.
[0012] In addition, another object of the present disclosure is to provide a jig apparatus which guarantees high reflectivity, while forming a thin plating layer.
[0013] In addition, still another object of the present disclosure is to provide a jig apparatus which can form a plating layer by selectively applying electroplating and electroless plating and can prevent a damage to the plating layer in a dicing process.
[0014] To achieve the above-described objects, the present disclosure provides a jig apparatus which forms a metal layer on a surface of a molding plate having a plurality of reflector portions formed thereon to receive various sensors or light sources, the jig apparatus having an assembly having a plurality of plates stacked one on another and assembled with one another therein, the jig apparatus including: a middle jig which has a center opened to receive the molding plate; a top jig which has a deposition hole including a reflector hole formed therein, and is assembled to an upper surface of the middle jig and masks an upper surface of the molding plate; a bottom jig which is assembled to a lower surface of the middle jig and masks a lower surface of the molding plate; and an assembly member which fixes the assembly of the top jig, the middle jig, and the bottom jig, wherein the molding plate is assembled to the molding receiving portion, and a metal layer is formed on a surface of the molding plate.
[0015] In addition, the jig apparatus may further include a support jig which is provided with a plurality of mounting portions protruding from a border of a plate to be mounted in a chamber and is assembled to a lower surface of the bottom jig.
[0016] In addition, the jig apparatus may further include a guide pin which includes a head portion and a guide portion protruding from one surface of the head portion, and the guide pin may guide the assembly of the top jig, the middle jig, and the bottom jig when the guide portion is inserted into guide holes formed on plates of the top jig, the middle jig, and the bottom jig.
[0017] The assembly member may be formed of a plurality of magnets having magnetism, and the assembly member may be inserted into an assembly hole formed in the middle jig and may press the top jig and the bottom jig which are made of SUS to the middle jig.
[0018] In addition, the jig apparatus may further include a cover jig which is assembled between the top jig and the middle jig and prevents the magnets from being released.
[0019] In addition, the trace hole may further include a connection portion for connecting the plurality of reflector portions, and a contact portion extending outward from the reflector portion on both side edges.
[0020] In addition, the top jig may have a concave and convex structure formed on a lower surface thereof and having an assembly recess and an assembly protrusion, and the assembly protrusion may be in close contact with an upper surface of the molding plate on the periphery of the mounting recess, and may prevent a metal layer from being deposited onto an upper surface of the molding plate other than the mounting recess.
[0021] In addition, the molding plate may have a stepped structure formed on an upper surface of the mounting recess and having a stepped recess and a stepped protrusion continuously formed, and the assembly protrusion may be in close contact with an upper surface of the stepped recess and may prevent a metal layer from being deposited onto the stepped recess.
[0022] In addition, the bottom jig may have a penetrating hole penetrating to allow metal particles flowing into the mounting recess to be discharged to a lower side.
[0023] In addition, to achieve the above-described objects, the present disclosure provides a method for manufacturing a reflector having a reflective layer, the method including the steps of: (a) forming a molding plate having a plurality of mounting recesses formed thereon; (b) assembling a middle jig having a molding receiving portion to a bottom jig, assembling the molding plate to the molding receiving portion, and assembling a top jig having a trace hole formed thereon to correspond to the mounting recess to an upper surface of the middle jig, and masking the molding plate; (c) mounting the jig apparatus in a chamber and forming a metal layer on a surface of the molding plate exposed to the trace hole; (d) separating the molding plate from the jig apparatus; (e) forming a plating layer on the metal layer of the molding plate; and (f separating the molding plate in the unit of the mounting recess.
[0024] The plating layer at step (e) may be formed by electroplating or electroless plating.
[0025] As described above, the reflector manufacturing process using the jig apparatus of the present disclosure does not apply a laser patterning process for patterning a reflective layer, and an etching process for forming the reflective layer, and thus can be simplified and can reduce a manufacturing cost.
[0026] In addition, the jig apparatus of the present disclosure can manufacture a metal layer for electroplating or electroless plating on all molding plates according to user's selection.
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] FIG. 1 is a cross-sectional view illustrating a schematic structure of a related-art reflector;
[0028] FIG.2 is a perspective view illustrating a jig apparatus according to an exemplary embodiment of the present disclosure;
[0029] FIG 3 is an exploded perspective view illustrating the jig apparatus of FIG 2;
[0030] FIG. 4 is a perspective view illustrating a molding plate according to an exemplary embodiment of the present disclosure;
[0031] FIG 5 is a perspective view illustrating a metal layer of a thin film formed on the molding plate of FIG. 4;
[0032] FIG 6 is a cross-sectional view illustrating a reflector portion of the jig apparatus according to an exemplary embodiment of the present disclosure;
[0033] FIG. 7 is a cross-sectional view illustrating a guide fastening portion of the jig apparatus according to an exemplary embodiment of the present disclosure;
[0034] FIG 8 is a cross-sectional view illustrating a thin film deposition process of the jig apparatus according to an exemplary embodiment of the present disclosure;
[0035] FIG 9 is a cross-sectional view illustrating a reflector bar having a thin film deposited thereon by the process of FIG. 8 in detail;
[0036] FIG 10 is an exploded perspective view illustrating a jig apparatus according to another exemplary embodiment of the present disclosure; [0037] FIG. 11 is a perspective view illustrating a molding plate according to another exemplary embodiment of the present disclosure;
[0038] FIG. 12 is a perspective view illustrating a metal layer of a thin film formed on the molding plate of FIG. 11;
[0039] FIG. 13 is a process view illustrating a reflector manufacturing process according to an exemplary embodiment of the present disclosure;
[0040] FIG. 14 is a top view illustrating a dicing process of the molding plate according to an exemplary embodiment of the present disclosure; and
[0041] FIG IS is a top view illustrating a dicing process of the molding plate according to another exemplary embodiment of the present disclosure.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0042] The present disclosure and the technical objects achieved by embodiments of the present disclosure will be more apparent by preferred embodiments of the present disclosure which will be described below. Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
[0043] FIG.2 is a perspective view illustrating a jig apparatus according to an exemplary embodiment, and FIG. 3 is an exploded perspective view illustrating the jig apparatus of FIG. 2. The jig apparatus 100 according to the present disclosure has a plurality of plates stacked one on another and assembled and includes a molding plate 200 assembled therein to manufacture a reflector and masks some regions of the molding plate 200 and thereby forms a metal layer 250 of a thin film (see FIG. 5) on a surface of the molding plate 200 which is opened.
[0044] Specifically referring to the drawings, the jig apparatus 100 includes atop jig llO formasking an upper portion, a middle jig 120 receiving the molding plate 200, a cover jig 130 covering an upper surface of the middle jig, a bottom jig 140 for masking a lower portion, a support jig 150 for coupling the jig apparatus to a chamber, a guide pin 160 for guiding assembly of these jigs, and an assembly member 170 for assembling these jigs. The jigs are formed in a plate shape having a predetermined thickness, and the support jig 150, the bottom jig 140, the middle jig 120, the cover jig 130, and the top jig 110 are stacked in sequence, thereby forming an assembly, and the molding plate 200 is assembled into an inner space formed by the middle jig 120.
[0045] The top jig 110, which is the uppermost plate of the jig apparatus 100, performs a masking function of the jig apparatus 100, and may be formed of a rectangular plate of stainless steel (SUS). The top jig 110 has a deposition hole 111 formed on a center thereof and penetrating therethrough so as to form a metal layer according to a desired shape. The deposition hole 111 includes a plurality of reflector holes 112 corresponding to a shape of a reflector portion 220 (see FIG. 4) of the molding plate 200, and a trace hole 113 connecting the respective reflector holes 112. The trace hole 113 allows metals layers 250 of thin films, deposited on inclined surfaces 222 of the reflector portions 220 through the respective reflector holes 112, to be electrically connected with one another, such that plating layers 260 (see FIG. 14) can be uniformly formed on the respective metal layers 250 through electroplating, simultaneously. Accordingly, the top jig 110 having the trace hole 113 enables the molding plate having the metal layers 250 formed thereon to have the plating layers 260 formed thereon through electroplating.
[0046] In addition, a plurality of deposition holes 111 may be formed at predetermined intervals, and each of the deposition holes 111 may further include contact holes 114 formed at both ends thereof to electrically connect the metal layers 250.
[0047] In addition, the top jig 110 is provided with a guide hole 115 penetrating through each corner or edge region thereof so as to be assembled with the middle jig 120, the bottom jig 140, or the like. The guide hole 115 has the guide pin 160 inserted thereinto, and guides assembly of the plates forming the respective jigs.
[0048] The middle jig 120, which is a rectangular plate for guiding assembly of the molding plate 200, has a center portion opened to include a molding receiving portion 121 to receive the molding plate 200. The middle jig 120 may have a predetermined thickness corresponding to the thickness of the molding plate 200 and may be formed of a rectangular plate of SUS. The inner surface of the middle jig 120 comes into contact with the outer surface of the molding plate 200 and guides the molding plate 200 to be in position inside the molding receiving portion 121.
[0049] In addition, the middle jig 120 receives an assembly member 170, and has an assembly hole 122 formed along a border of the plate to receive the assembly member 170. A plurality of assembly holes 122 are formed along the border of the rectangular plate.
[0050] In addition, the middle jig 120 has an avoidance recess 123 formed on an inner side of the plate forming the molding receiving portion 121 to allow the molding plate 200 to be easily assembled and disassembled. The avoidance recess 123 may be formed at a corer or on a side portion of the plate.
[0051] The cover jig 130 covers the upper surface of the middle jig 120 and prevents the assembly member 170 from being released from the middle jig 120 and may be formed of a rectangular plate of SUS. The cover jig 130 forms the molding receiving portion 121 and an avoidance recess 133 in the same shapes as those of the middle jig 120 but has no assembly hole formed thereon. Therefore, the cover jig 130 prevents the assembly member 170 from being released by covering the assembly hole 122 of the middle jig 120 when being assembled with the middle jig 120.
[0052] In addition, the cover jig 130 may complement the thickness of the middle jig 120. That is, when the molding plate 200 received in the middle jig 120 is thicker than the middle jig 120, the cover jig 130 compensates for the thickness of the middle jig 120, thereby having the same thickness as that of the molding plate 200. To achieve this, the cover jig 130 is formed of a plate having a thin thickness compared with the middle jig 120. [0053] The bottom jig 140 fixes the assembly while supporting the molding plate 200. The bottom jig 140 may be formed of a rectangular plate of SUS, and an upper surface of the bottom jig 140 has a structure corresponding to a shape of a lower surface of the molding plate 200. In addition, the bottom jig 140 covers a lower portion of the middle jig 120 and prevents metal particles from being deposited onto a rear surface of the molding plate 200 when the metal layer 250 of the thin film is formed. The bottom jig 140 may be provided with a guide hole 145 to allow the guide pin 160 to be inserted thereinto and to be assembled with each jig and may be provided with an assembly hole 142 formed along the border of the plate to receive the assembly member 170. In addition, the bottom jig 140 may have a deposition hole 143 to allow a metal layer for electric connection to be deposited onto a rear surface of the molding plate 200.
[0054] The support jig 150 is configured to support the plates forming the respective jigs, and to fix the jig apparatus 100 to a deposition chamber (not shown) in a thin film deposition process. The support jig 150 may be formed of a rectangular plate of SUS and has a relatively thick thickness compared with the top jig 110, the cover jig 130, and the bottom jig 140, so as to stably support the respective jig plates. In addition, the support jig 150 may have a plurality of mounting portions 151 protruding from side portions of the plate outwardly to be mounted in the chamber, and a chamber hole 152 may be formed on the mounting portion 151. In addition, the bottom jig 140 may have a guide hole 155 to allow the guide pin 160 to be inserted thereinto and to be assembled with each jig and may have a deposition hole 153 to allow the metal layer for electric connection to be deposited onto the rear surface of the molding plate 200.
[0055] As a configuration for supporting the jig apparatus 100 and mounting the same in the chamber, the support jig 150 is illustrated. However, the bottom jig 140 may be configured to support the jig apparatus 100 and to mount the same in the chamber. That is, the bottom jig 140 may be formed of a plate having predetermined rigidity, and may be provided with a separate mounting potion, and may be replaced for the support jig 150.
[0056] The guide pin 160 guides the plates forming the respective jigs to be assembled in position and includes a head portion 161 having a predetermined diameter, and a guide portion 162 protruding upwardly from a center ofthe head portion. A plurality of guide pins 160 may be provided, and for example, four guide pins 160 may be provided for the jigs of the rectangular plate shape and may be coupled to the respective corners. The guide pin 160 guides the assembly ofthe respective jigs with the guide portion 162 being inserted into the guide holes 115, 145, 155 formed at respective corners of the top jig 110, the bottom jig 140, and the support jig 150.
[0057] The assembly member 170 is to assemble the respective jigs and to fix the assembly of the jigs, and in the present disclosure, the assembly member 170 is formed of a magnet to assemble the respective jigs with magnetism. The magnet has a predetermined diameter and a predetermined thickness and is inserted into the assembly hole 122 formed on the middle jig 120. A plurality of magnets may be inserted along the border ofthe middle jig 120, and for example, two magnets on each side portion ofthe middle jig 120 of the rectangular plate shape, that is, eight magnets in total, may be provided. The assembly member 170 described above is inserted into the middle jig 120 and presses the top jig 110 and the cover jig 130 on the upper portion of the assembly member 170 and the bottom jig 140 and the support jig 150 on the lower portion of the assembly member 170 to the middle jig 120 with strong magnetism, and thereby assemblies the jigs.
[0058] The assembly member 170 may be formed of other means such as a screw or a clamp, in addition to the magnet, and the magnet has the merit of being able to strongly press the respective jigs without a separate fastening process. To achieve this, the respective jigs may be formed of the plate of SUS which reacts to magnetism. Although it is illustrated that the magnet is inserted into the middle jig 120 as the assembly member 170, the middle jig 120 may be formed of a magnetic plate having magnetism.
[0059] FIG. 4 is a perspective view illustrating the molding plate according to an exemplary embodiment, and FIG. 5 is a perspective view illustrating the metal layer of the thin film formed on the molding plate of FIG. 4. According to an embodiment, the metal layer 250 of the thin film is formed on the inclined surface 222 of the reflector portion 220 with the molding plate 200 being assembled to the jig apparatus 100, and the molding plate 200 is separated from the jig apparatus 100 and a plating layer is formed on the metal layer 250, and then the molding plate 200 is divided into a plurality of individual reflectors.
[0060] To achieve this, the molding plate 200 is formed in the shape of a rectangular plate having a predetermined thickness as shown in FIG. 4, and has a width corresponding to the molding receiving portion 121 of the middle jig 120. In addition, the molding plate 200 may be formed by injection molding using an insulating resin and may have a guide hole 205 formed on an edge thereof to allow the guide pin 160 to be inserted thereinto and to be assembled with the jig apparatus 100.
[0061] In particular, the molding plate 200 is provided with the reflector portion 220 including a mounting recess 221 formed on the center thereof to mount a sensor or an LED, and the inclined surface 222 for forming a reflective layer. A plurality of reflector portions 220 may be formed along a reflector bar 210 at predetermined intervals, and a plurality of reflector bars 210 may be arranged at predetermined intervals.
[0062] In addition, the reflector portion 220 has a penetrating hole 220a penetrating through a bottom surface thereof. A trace portion 211 may be formed on an upper surface of the reflector bar 210 to connect the plurality of reflector portions 220.
[0063] In addition, the molding plate 200 may have contact portions 230 formed on both sides of the reflector bar 210 and penetrating through the rear surface of the molding plate 200 to electrically connect the metal layers 250 to be formed on the inclined surface 222 of each reflector portion 220 and the trace portion 211.
[0064] The molding plate 200 having the above-described configuration is received in the molding receiving portion 121 of the middle jig 120, and the top jig 110 and the bottom jig 140 are assembled to the front surface and the rear surface of the middle jig 120, respectively, such that the front surface and the rear surface of the molding plate 200 are masked. The jig apparatus 100 having the molding plate 200 mounted therein is mounted in the chamber for thin film deposition, and metal particles are made to be deposited, and as a result, the metal layer 250 of the thin film is formed along the reflector portion 220, the trace portion 211, and the contact portion 230 on the front surface of the molding plate 200 as shown in FIG. 5.
[0065] FIG. 6 is a cross-sectional view illustrating the reflector portion of the jig apparatus in detail according to an embodiment, and is a view taken on line A-A of FIG. 2, and FIG. 7 is a cross-sectional view illustrating a guide fastening portion of the jig apparatus in detail according to an embodiment, and is a view taken on line B-B of FIG. 2.
[0066] Referring to FIG. 6, first, the molding plate 200 has the plurality of reflector portions 220 formed thereon in a cup-like shape, and the top jig 110 is assembled to the upper portion of the molding plate 200, and the bottom jig 140 and the support jig 150 are assembled to the lower portion of the molding plate 200. In this case, concave and convex structures corresponding to each other are formed between the top jig 110 and the molding plate 200 and between the molding plate 200 and the bottom jig 140, such that the molding plates can be easily assembled and stably fixed.
[0067] Specifically, an upper surface of the molding plate 200 on the periphery of the reflector portion
220 has a stepped recess 213 indented inwardly and a stepped protrusion 212 protruding outwardly. That is, the upper surface of the molding plate on the periphery of the reflector portion 220, that is, the upper surface of the molding plate connected with the inclined surface 222, has a stepped structure formed in a stair shape.
[0068] In addition, the top jig 110 has an assembly recess 116 into which the stepped protrusion 212 is inserted, and an assembly protrusion 117 close in contact with the stepped recess 213 to correspond to the upper surface of the molding plate 200.
[0069] The stepped protrusion 212 is inserted into the assembly recess 116, such that the top jig 110 and the molding plate 200 having the above-described configuration can be stably assembled with each other. In addition, the assembly protrusion 117 of the top jig 110 is in contact with the stepped recess 213 while pressing the stepped recess 213, and in particular, blocks the stepped recess 213 from being exposed to the deposition hole 111. Accordingly, the assembly protrusion 117 prevents a thin film from being formed on an unnecessary portion except for the inclined surface 222 of the reflector portion 220 in the thin film deposition process.
[0070] In addition, the reflector portion 220 of the molding plate 200 has a fixing recess 214 formed on a lower surface thereof to be coupled with the bottom jig 140, and the bottom jig 140 has a fixing protrusion 146 formed on an upper surface thereof to correspond to the fixing recess 214. Accordingly, the fixing protrusion 146 is inserted into the fixing recess 214, such that the assembly of the molding plate 200 and the bottom jig 140 is stably fixed.
[0071] As described above, the top jig 110 and the bottom jig 140 are assembled in the concave and convex structure with reference to the molding plate 200, and in this case, the concave portion and the convex portion may be formed on the molding plate to correspond to each other or may be selectively formed on the top jig or the bottom jig. In addition, the concave portion and the convex portion may be formed on the molding plate 200 of the resin material by injection molding and may be formed on the top jig 110 and the bottom jig 140 of SUS by etching.
[0072] Referring to FIG. 7, the guide fastening portion of the jig apparatus 100 assembles the respective jig plates and the molding plate by means of the guide pin. That is, the guide holes 115, 145, 155, and 205 are formed on the respective jig plates and the molding plate to have the same center with respect to the vertical direction, and the guide portion 162 of the guide pin 160 is inserted into the guide holes and guides the assembly of the respective jig plates and the molding plate when the support jig 150, the bottom jig 140, the middle jig 120, the molding plate 200, the cover jig 130, and the top jig 110 are stacked in sequence.
[0073] FIG. 8 is a cross-sectional view illustrating a thin film deposition process of the jig apparatus according to an embodiment, and FIG. 9 is a cross-sectional view illustrating the reflector bar having the thin film deposited thereon according to the process of FIG. 8 in detail.
[0074] The molding plate 200 assembled inside the jig apparatus 100 is mounted in the chamber for thin film deposition, and the metal layer 250 of the thin film is formed on the inclined surface 222 of the reflector portion 220 through the deposition hole 111. In this case, the mounting recess 221 of the reflector portion 220 is opened by the deposition hole 111 and is exposed to the outside as shown in FIG. 8, and the upper surface of the reflector portion 220 except for the inclined surface 222 is masked by the top jig 110. In particular, the stepped recess 213 on the periphery of the reflector portion 220 is blocked by the assembly protrusion 117 of the top jig 110 from the deposition hole 111, and metal particles are prevented from being deposited onto the stepped recess 213.
[0075] After the jig apparatus 100 is mounted in the chamber, metal particles 310 reduced from a target plate 300 pass through the deposition hole 111 and moves to the inside of the mounting recess 220 and are deposited onto the inclined surface 222. In this case, the reflector portion 220 has a lower side opened through the penetrating hole 220a, and the same penetrating holes 220a are formed in the bottom jig 140 and the support jig 150 to fluidly communicate with each other. Accordingly, the metal particles 310 inside the mounting recess 221 are deposited onto the inclined surface 222, and simultaneously, some of the metal particles 310 are discharged to the outside of the mounting recess 221 through the penetrating hole 220a The penetrating hole 220a allows surplus metal particles of the metal particles 310 flowing in the inner space of the mounting recess 221 to be discharged to the outside, and in the process, allows the metal particles 310 to be deposited onto a vertical surface of the penetrating hole 220a of the reflector portion 220.
[0076] Accordingly, as shown in FIG.9, a uniform metal layer may be formed on the inclined surface
222 of the reflector portion 220 and the vertical surface of the penetrating hole 220a.
[0077] In addition, in the deposition process using the jig apparatus 100 as described above, the reflector portion 220 has the metal layer 250 of the thin film formed on the inclined surface 222 of the inside of the mounting recess 221, and the vertical surface 220a, and prevents metal particles from being deposited onto the other unnecessary portions, such that the metal layer 250 can be exactly and minutely formed, and can have a thin and uniform thickness all over. [0078] FIG. 10 is an exploded perspective view illustrating a jig apparatus according to another exemplary embodiment, FIG. 11 is a perspective view illustrating a molding plate according to another exemplary embodiment, and FIG. 12 is a perspective view illustrating a metal layer of a thin film formed on the molding plate of FIG. 11.
[0079] As shown in these drawings, the jig apparatus 100 according to another exemplary embodiment is configured to form a reflective layer by electroless plating. Accordingly, the molding plate 200 is not provided with the trace portion 211 (see FIG. 4) for connecting the respective reflector portions 220, or the contact portion 230 (see FIG. 4) for electric connection, and the deposition hole 111 of the top jig 110 does not require the trace hole 113 (see FIG. 3) and the contact hole 114 (see FIG. 3), and is formed of only the reflector hole 112.
[0080] In the jig apparatus 100 according to another exemplary embodiment, as shown in FIG. 12, the metal layers 250 are separately formed on the reflector portions 220 on the surface of the molding plate 200 in the unit of each reflector portion 220. Therefore, a plating layer may be formed on the metal layer by electroless plating.
[0081] Although it is illustrated that the molding plate is not provided with the trace portion 211 or the contact portion 230 to form the metal layer 250 for electroless plating, the molding plate provided with the trace portion 211 or the contact portion 230 may be assembled with a jig apparatus for forming a metal layer for electroless plating and may form the metal layer for electroless plating. That is, the jig apparatus 100 of the present disclosure has an advantage that electro plating or electroless plating is easily changed and used simply by replacing the top jig 110 according to user's selection.
[0082] FI 13 is a process view illustrating a reflector manufacturing process according to an exemplary embodiment.
[0083] Referring to the drawing, the molding plate 200 is separately manufactured by injection molding using a synthesis resin of an insulating material (S 11). The reflector bar 210 including the plurality of reflector portions 220 is formed on the molding plate 200, and a trace portion and a contact portion for electroplating may further be formed on the molding plate 200 when necessary.
[0084] In addition, the molding plate 200 formed by injection molding is assembled with the jig apparatus 100 which is capable of performing electroplating or electroless plating, and portions of the molding plate 200 other than the deposition hole on which a metal layer should be formed are masked (S12). The jig apparatus 100 with which the molding plate 200 is assembled is mounted in a chamber, and the metal layer 250 of the thin film is deposited onto the surface of the molding plate (S13), and then the molding plate 200 having the metal layer 250 deposited thereon is separated from the jig apparatus 100 (S14).
[0085] In addition, the plating layer 260 is formed on the metal layer 250 by electroplating or electroless plating by using the separated molding plate 200 (SI 5), and the molding plate 200 is diced in the unit of each reflector portion 220, and finally, an individual reflector is manufactured (SI 6).
[0086] In addition, after the metal layer is formed on the surface of the molding plate by deposition in the above-described process, or after the plating layer is formed on the metal layer, a process of neatening a side portion of a line by laser may further be applied to enhance accuracy or a degree of completion of the metal layer or the plating layer.
[0087] As described above, the process of manufacturing the reflector by using the jig apparatus of the present disclosure does not apply a laser processing process and an etching process for patterning the metal layer or the plating layer, and thus can be simplified and can reduce a manufacturing cost. In addition, the top jig for electroplating or the top jig for electroless plating is used according to user's selection, such that the molding plate 200 capable of electroplating or electroless plating can be manufactured.
[0088] FIGS. 14 and 15 are top views illustrating a dicing process of the molding plate according to an embodiment, and illustrate the molding plates on which the plating layer is formed by electroplating and electroless plating, respectively,
[0089] Referring to these drawings, the plating layer 260 is formed on the metal layer 250 by electro plating or electroless plating, and then the reflector bar 210 is separated in the unit of the reflector portion 220, such that individual reflectors can be manufactured. The individual reflectors may be separated by dicing, and the dicing is applied to the reflector bar 210 between the respective reflector portions 220. Accordingly, even when the plating layer 260 is formed on the trace portion 211 of the reflector bar 210 by electroplating as shown in FIG. 14, the plating layer of the trace portion has a relatively small width compared with the plating layer 260 of the reflector portion, and dicing is performed at a portion spaced apart from the plating layer 260 of the reflector portion. Therefore, the plating layer of the reflector portion is scarcely influenced by dicing.
[0090] In addition, when the plating layer is not formed between the reflector portions by electroless plating as shown in FIG. 15, there is an advantage that the plating layer is never influenced by dicing.
[0091] Although the present disclosure has been described with reference to embodiments illustrated in the drawings, it will be understood by an ordinary person skilled in the related art that various changes can be made therefrom, and other equivalent embodiments are possible.

Claims

CLAIMS What is claimed is:
1. Ajig apparatus for forming a reflective layer for a reflector, which forms a metal layer on a surface of a molding plate having a plurality of reflector portions formed thereon to receive various sensors or light sources, the jig apparatus having an assembly having a plurality of plates stacked one on another and assembled with one another therein, the jig apparatus comprising:
a middle jig which has a center opened to receive the molding plate;
a top jig which has a deposition hole comprising a reflector hole formed therein, and is assembled to an upper surface of the middle jig and masks an upper surface of the molding plate;
a bottom jig which is assembled to a lower surface of the middle jig and masks a lower surface of the molding plate; and
an assembly member which fixes the assembly of the top jig, the middle jig, and the bottom jig,
wherein the molding plate is assembled to the molding receiving portion, and a metal layer is formed on a surface of the molding plate.
2. The jig apparatus of claim 1, further comprising: a support jig which is provided with a plurality of mounting portions protruding from a border of a plate to be mounted in a chamber and is assembled to a lower surface of the bottom jig.
3. The jig apparatus of claim 1, further comprising: a guide pin which comprises a head portion and a guide portion protruding from one surface of the head portion, wherein the guide pin guides the assembly of the top jig, the middle jig, and the bottom jig when the guide portion is inserted into guide holes formed on plates of the top jig and the bottom jig.
4. The jig apparatus of claim 1, wherein the assembly member is formed of a plurality of magnets having magnetism, and wherein the assembly member is inserted into an assembly hole formed in the middle jig and presses the top jig and the bottom jig which are made of SUS to the middle jig.
5. The jig apparatus of claim 4, further comprising: a cover jig which is assembled between the top jig and the middle jig and prevents the magnets from being released.
6. The jig apparatus of claim 1, wherein the trace hole further comprises a connection portion for connecting the plurality of reflector portions, and a contact portion extending outward from the reflector portion on both side edges.
7. The jig apparatus of claim 1, wherein the top jig has a concave and convex structure formed on a lower surface thereof and having an assembly recess and an assembly protrusion, and wherein the assembly protrusion is in close contact with an upper surface of the molding plate on the periphery of the mounting recess and prevents a metal layer from being deposited onto an upper surface of the molding plate other than the mounting recess.
8. The jig apparatus of claim 7, wherein the molding plate has a stepped structure formed on an upper surface of the mounting recess, and having a stepped recess and a stepped protrusion continuously formed, and wherein the assembly protrusion is in close contact with an upper surface of the stepped recess and prevents a metal layer from being deposited onto the stepped recess.
9. The jig apparatus of claim 1, wherein the bottom jig has a penetrating hole penetrating to allow metal particles flowing into the mounting recess to be discharged to a lower side.
10. A method for manufacturing a reflector having a reflective layer, the method comprising the steps of:
forming a molding plate having a plurality of mounting recesses formed thereon; assembling a middle jig having a molding receiving portion to a bottom jig, assembling the molding plate to the molding receiving portion, and assembling a top jig having a trace hole formed thereon to correspond to the mounting recess to an upper surface of the middle jig, and masking the molding plate;
mounting the jig apparatus in a chamber and forming a metal layer on a surface of the molding plate exposed to the trace hole;
separating the molding plate from the jig apparatus;
forming a plating layer on the metal layer of the molding plate; and
separating the molding plate in the unit of the mounting recess.
11. The method of claim 10, wherein the plating layer at step (e) is formed by electroplating or electroless plating.
PCT/US2018/053315 2017-09-29 2018-09-28 Jig apparatus of reflective layer coating for reflector and manufacturing method of reflector WO2019067841A1 (en)

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KR102257692B1 (en) * 2019-12-09 2021-05-31 주식회사 큐브테크 Method for manufacturing vapor chamber using jig
KR102593415B1 (en) * 2023-01-13 2023-10-25 (주)수 Multi-tap fire extinguishing liquid application jig

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