WO2019064588A1 - Method for producing wavelength conversion member, wavelength conversion member, backlight unit, image display device, resin composition for wavelength conversion member, and resin cured product - Google Patents

Abstract

Provided is a method for producing a wavelength conversion member, the method comprising: the step for preparing a resin composition that includes a quantum dot phosphor and a gellable dispersoid; the step for forming a resin composition layer using the resin composition; and the step for curing the resin composition layer to obtain a resin cured product, wherein the dispersoid including the quantum dot phosphor is dispersed in the resin composition, and the resin cured product includes a gelled substance formed by reaction of the dispersoid.

Description

Method for producing wavelength conversion member, wavelength conversion member, backlight unit, image display device, resin composition for wavelength conversion member, and resin cured product

The present disclosure relates to a method for manufacturing a wavelength conversion member, a wavelength conversion member, a backlight unit, an image display device, a resin composition for a wavelength conversion member, and a resin cured product.

In recent years, in the field of image display devices such as liquid crystal display devices, there is a need to improve the color reproducibility of displays, and wavelength conversion members containing quantum dot phosphors are attracting attention as a means to improve color reproducibility. (See, for example, Patent Documents 1 and 2).

The wavelength conversion member containing quantum dot fluorescent substance is arrange | positioned, for example in the backlight unit of an image display apparatus. In the case of using a wavelength conversion member containing a quantum dot phosphor emitting red light and a quantum dot phosphor emitting green light, when the wavelength conversion member is irradiated with blue light as excitation light, light is emitted from the quantum dot phosphor White light can be obtained from the red light and green light that have been transmitted and the blue light transmitted through the wavelength conversion member. With the development of wavelength conversion members containing quantum dot phosphors, the color reproducibility of the display has been expanded from 72% of the conventional National Television System Committee (NTSC) ratio to 100% of the NTSC ratio.

The wavelength conversion member containing a quantum dot fluorescent substance usually has a cured product obtained by curing a curable composition containing a quantum dot fluorescent substance. The curable composition includes a thermosetting type and a photocurable type, and from the viewpoint of productivity, a photocurable type curable composition is preferably used.

Japanese Patent Publication No. 2012-544018 International Publication No. 2016/052625

By the way, in the wavelength conversion member provided with the resin cured material containing quantum dot fluorescent substance, at least one part of resin cured material may be coat | covered with a coating material. For example, in the case of a film-like wavelength conversion member, a barrier film having a barrier property to at least one of oxygen and water may be provided on one side or both sides of the cured resin.

Even when the above-described barrier film is provided on one side or both sides of the cured resin, the quantum dot phosphor may be deteriorated by the influence of water vapor, oxygen, and the like. In particular, when the wavelength conversion member including the quantum dot phosphor is left in a high temperature and high humidity environment, the quantum dot phosphor is easily deteriorated, and there is a possibility that the Rec 2020 coverage, which is a standard of display color reproducibility, is reduced.

In one aspect of the present invention, a method of manufacturing a wavelength conversion member containing quantum dot phosphors and having excellent heat and humidity resistance, a wavelength conversion member thereof, a backlight unit and an image display using the wavelength conversion member, and a wavelength conversion member thereof It is an object of the present invention to provide a resin composition for wavelength conversion member and a resin cured product used for the production of

The specific means for achieving the said subject are as follows.
<1> A process of preparing a resin composition containing a quantum dot fluorescent substance and a gelable dispersoid, a process of forming a resin composition layer using the resin composition, and curing the resin composition layer And a step of obtaining a cured resin, wherein the dispersoid containing the quantum dot fluorescent material is dispersed in the resin composition, and the cured resin is a gel formed by the reaction of the dispersoid. Method of producing a wavelength conversion member, comprising
<2> The method for producing a wavelength conversion member according to <1>, wherein the gelable dispersoid contains a modified silicone.
<3> The method for producing a wavelength conversion member according to <2>, wherein the modified silicone contains an amino-modified silicone.
<4> The resin composition contains a difunctional or higher epoxy compound, and the ratio of the amine equivalent of the amino-modified silicone to the epoxy equivalent of the difunctional or higher epoxy compound (epoxy equivalent / amine equivalent) is 0.01 The manufacturing method of the wavelength conversion member as described in <3> which is -70.0.
<5> The method for producing a wavelength conversion member according to any one of <1> to <3>, wherein the resin composition contains an epoxy compound having two or more functional groups.
<6> The method for producing a wavelength conversion member according to <4> or <5>, wherein the bifunctional or higher epoxy compound has at least one of a bisphenol structure and a hydrogenated bisphenol structure.
<7> The wavelength conversion member according to any one of <1> to <6>, wherein the glass transition temperature of the cured resin product measured by dynamic viscoelasticity measurement at a frequency of 10 Hz is 40 ° C. or higher. Production method.
<8> The method for producing a wavelength conversion member according to any one of <1> to <7>, wherein the quantum dot phosphor contains a compound containing at least one of Cd and In.
<9> The method for producing a wavelength conversion member according to any one of <1> to <8>, wherein the resin composition comprises a polyfunctional thiol compound and a (meth) allyl compound.
The process of forming the <10> said resin composition layer is a process of providing the said resin composition on a 1st base material, and forming the said resin composition layer, and before the process of obtaining the said resin cured material And the wavelength described in any one of <1> to <9>, further comprising the step of providing a second base on the side opposite to the side on which the first base is provided in the resin composition layer. Method of manufacturing conversion member.

<11> A wavelength conversion member, comprising: a resin cured product having a sea-island structure including a sea part and an island part, wherein the island part is a gelled material including a quantum dot phosphor.
<12> The wavelength conversion member according to <11>, wherein the cured resin product has a structure derived from each of a multifunctional thiol compound, a (meth) allyl compound, a modified silicone, and a difunctional or more epoxy compound.
<13> The wavelength conversion member according to <12>, wherein the modified silicone comprises an amino-modified silicone.
<14> The wavelength conversion according to <13>, wherein the ratio of the amine equivalent of the amino-modified silicone to the epoxy equivalent of the difunctional or higher epoxy compound (epoxy equivalent / amine equivalent) is 0.01 to 70.0. Element.
<15> The wavelength conversion member according to any one of <12> to <14>, wherein the bifunctional or higher epoxy compound has at least one of a bisphenol structure and a hydrogenated bisphenol structure.
<16> The wavelength conversion member according to any one of <11> to <15>, wherein the glass transition temperature of the cured resin product measured by dynamic viscoelasticity measurement under the condition of frequency 10 Hz is 40 ° C. or higher.
<17> The wavelength conversion member according to any one of <11> to <16>, wherein the quantum dot phosphor includes a compound including at least one of Cd and In.
<18> The wavelength conversion member according to any one of <11> to <17>, including a covering material, wherein at least a part of the cured resin is covered with the covering material.
<19> The wavelength conversion member according to <18>, wherein the covering material has a barrier property to at least one of oxygen and water.

<20> A backlight unit comprising the wavelength conversion member according to any one of <11> to <19>, and a light source.

The image display apparatus provided with the backlight unit as described in <21> <20>.

<22> A resin composition for a wavelength conversion member, which comprises a quantum dot phosphor and a gelable dispersoid containing the quantum dot phosphor.
<23> The resin composition for a wavelength conversion member according to <22>, wherein the gelable dispersoid contains modified silicone.
<24> The resin composition for a wavelength conversion member according to <23>, wherein the modified silicone comprises an amino-modified silicone.
<25> A ratio of an amine equivalent of the amino-modified silicone to an epoxy equivalent of an epoxy compound having two or more functional groups (epoxy equivalent / amine equivalent) is 0.01 to 70.0 including an epoxy compound having two or more functional groups The resin composition for wavelength conversion members as described in <24>.
<26> The resin composition for a wavelength conversion member according to any one of <22> to <24>, which comprises an epoxy compound having two or more functional groups.
<27> The resin composition for a wavelength conversion member according to <25> or <26>, wherein the bifunctional or higher epoxy compound has at least one of a bisphenol structure and a hydrogenated bisphenol structure.
<28> The resin composition for a wavelength conversion member according to any one of <22> to <27>, wherein the quantum dot phosphor contains a compound containing at least one of Cd and In.
<29> The resin composition for a wavelength conversion member according to any one of <22> to <28>, which comprises a polyfunctional thiol compound and a (meth) allyl compound.

<30> A resin cured product comprising a gelled product obtained by curing the resin composition for a wavelength conversion member according to any one of <22> to <29> and reacting the dispersoid.
<31> The resin cured material as described in <30> whose glass transition temperature measured on conditions of frequency 10 Hz by dynamic-viscoelasticity measurement is 40 degreeC or more.

According to one aspect of the present invention, a method of manufacturing a wavelength conversion member including a quantum dot phosphor and having excellent heat and humidity resistance, a wavelength conversion member thereof, a backlight unit and an image display using the wavelength conversion member, and a wavelength thereof The resin composition for wavelength conversion members and resin cured material which are used for manufacture of a conversion member can be provided.

It is a schematic cross section which shows an example of schematic structure of the wavelength conversion member of this indication. It is a figure which shows an example of schematic structure of the backlight unit of this indication. It is a figure which shows an example of schematic structure of the liquid crystal display device of this indication.

Hereinafter, modes for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps and the like) are not essential unless otherwise specified. The same applies to numerical values and ranges thereof, and does not limit the present invention.
In the present disclosure, numerical values described before and after “to” are included in the numerical range indicated using “to” as the minimum value and the maximum value, respectively.
The upper limit value or the lower limit value described in one numerical value range may be replaced with the upper limit value or the lower limit value of the other stepwise description numerical value range in the numerical value range described stepwise in the present disclosure. . In addition, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the example.
In the present disclosure, each component may contain a plurality of corresponding substances. When a plurality of substances corresponding to each component are present in the composition and in the wavelength conversion member, the content or content of each component is in the composition and in the wavelength conversion member unless otherwise specified. The total content or content of the substances of the species is meant.
In the present disclosure, the words “layer” or “film” mean that when the region in which the layer or film is present is observed, in addition to the case where the region is entirely formed, only a part of the region The case where it is formed is also included.
The term "laminate" in the present disclosure refers to stacking layers, two or more layers may be combined, and two or more layers may be removable.
In the present disclosure, “(meth) allyl” means allyl or methallyl, “(meth) acrylic” means acrylic or methacrylic, “(meth) acryloyl” means acryloyl or methacryloyl, “( "Meth) acrylate" means acrylate or methacrylate.
In the present disclosure, the (meth) allyl compound means a compound having a (meth) allyl group in the molecule, and the (meth) acrylic compound means a compound having a (meth) acryloyl group in the molecule. Compounds having both a (meth) allyl group and a (meth) acryloyl group in the molecule are classified as (meth) allyl compounds for the sake of convenience.
In addition, in the present disclosure, compounds containing both a thiol group and an alkyleneoxy group are classified as thiol compounds.
In the present disclosure, compounds containing both (meth) allyl and alkyleneoxy groups are classified as (meth) allyl compounds.
In the present disclosure, compounds containing both (meth) acrylic groups and alkyleneoxy groups are classified as alkyleneoxy group-containing compounds.
Further, in the present disclosure, oxygen in an ester group (oxygen bonded to a carbonyl group) and oxygen in a hydroxyl group are not classified as oxygen in an alkyleneoxy group.

[Method of manufacturing wavelength conversion member]
The method for producing a wavelength conversion member according to the present disclosure comprises the steps of preparing a resin composition containing a quantum dot fluorescent substance and a gelable dispersoid, and forming a resin composition layer using the resin composition; And curing the resin composition layer to obtain a cured resin product, wherein the dispersoid including the quantum dot fluorescent material is dispersed in the resin composition, and the cured resin product is obtained by curing the resin composition layer. It contains a gelled product resulting from the reaction of dispersoids.

As a method for improving the heat and moisture resistance of the wavelength conversion member, the resin composition which is an emulsion in which the quantum dot phosphor is contained in the modified silicone which is a dispersoid, the dispersoid is cured and the barrier property against water vapor, oxygen, etc. It is conceivable to improve the moisture and heat resistance of the wavelength conversion member by increasing the H.sub.2O.sub.2 and suppressing the deterioration of the quantum dot phosphor due to the influence of water vapor, oxygen and the like. However, if the dispersoid is completely cured, the dispersoid cured product is likely to be cracked, and as a result, the quantum dot phosphor in the cured product is degraded in a high temperature and high humidity environment, and the Rec 2020 coverage is May not be able to control

On the other hand, in the manufacturing method of the present disclosure, it is possible to manufacture a wavelength conversion member including a resin cured product containing a gelled product in which dispersoids are reacted, and in which the gelled product includes the quantum dot phosphor. Since the gelled product is less likely to crack, the deterioration of the quantum dot phosphor under high temperature and high humidity is suppressed, and as a result, the reduction of the Rec 2020 coverage rate under high temperature and high humidity is suppressed. Therefore, the wavelength conversion member manufactured by the manufacturing method of this indication is excellent in heat-and-moisture resistance.
Moreover, since the deterioration of the quantum dot fluorescent substance under high temperature and high humidity is suppressed, the wavelength conversion member manufactured by the manufacturing method of the present disclosure tends to be excellent in storage stability over a long period of time.

Furthermore, in the wavelength conversion member manufactured by the manufacturing method of the present disclosure, since the gelled substance contains the quantum dot phosphor, the fluidity of the quantum dot phosphor is compared to the case where the dispersoid is not gelled. There is a tendency for the aggregation of the quantum dot phosphors to be suppressed. As a result, for example, when two types of quantum dot phosphors having different emission center wavelengths are used, aggregation of the two types of quantum dot phosphors causes the light emission of the quantum dot phosphor having a shorter emission center wavelength to disappear. Problems that the brightness decreases, can be suppressed.

The manufacturing method of the wavelength conversion member of this indication includes the process of preparing the resin composition containing a quantum dot fluorescent substance and the gelable dispersoid. For example, the above-mentioned resin composition can be obtained by stirring the mixture of each component contained in a resin composition.
In addition, the obtained resin composition is an emulsion in which the dispersoid containing quantum dot fluorescent substance disperse | distributed in the resin composition.
Further, the resin composition of the present disclosure and the wavelength conversion member of the present disclosure are not limited to the configuration in which all the quantum dot phosphors exist in the dispersoid, and at least one quantum dot phosphor exists in the outside of the dispersoid. Some of the at least one quantum dot phosphor may be outside the dispersoid.

The manufacturing method of the wavelength conversion member of this indication includes the process of forming a resin composition layer using the above-mentioned resin composition. For example, the resin composition described above may be applied to a substrate to form a resin composition layer on the substrate.

The application method of the resin composition is not particularly limited, and examples thereof include a die coating method, a curtain coating method, an extrusion coating method, a rod coating method, and a roll coating method.

The manufacturing method of the wavelength conversion member of this indication includes the process of hardening the above-mentioned resin composition layer, and obtaining a resin cured material. In addition, the cured resin product obtained in this step contains a gelled product formed by the reaction of the dispersoid. The resin cured product can be obtained by subjecting the above-mentioned resin composition layer to a drying treatment, if necessary, and then irradiating an active energy ray such as ultraviolet rays.

<Resin composition>
The resin composition used in the method of manufacturing a wavelength conversion member according to the present disclosure includes a quantum dot phosphor and a gelable dispersoid, and the resin composition includes the dispersoid encapsulating the quantum dot phosphor dispersed therein. There is.
Further, the resin composition contains the resin component (excluding the dispersoid) together with the quantum dot fluorescent substance and the dispersoid, and specifically, an epoxy compound having two or more functions, a polyfunctional thiol compound, a (meth) allyl compound, A resin component such as a meta) acrylic compound, a monofunctional thiol compound, or an alkyleneoxy group-containing compound may be included.
In addition, the resin composition may contain a photopolymerization initiator, a liquid medium, other components, and the like.
Hereinafter, each component which may be contained in a resin composition is demonstrated.

(Quantum dot phosphor)
The resin composition of the present disclosure comprises a quantum dot phosphor. The quantum dot phosphor is not particularly limited, and includes particles containing at least one selected from the group consisting of II-VI compounds, III-V compounds, IV-VI compounds, and IV compounds. From the viewpoint of luminous efficiency, the quantum dot phosphor preferably contains a compound containing at least one of Cd and In.

Specific examples of II-VI compounds include CdSe, CdTe, CdS, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, CdSeS, CdSeTe, CdSTe, ZnSeTe, ZnSeTe, ZnSe, HgSeS, HgSeTe, HgSTe, CdZnS. CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgSe, CgHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSeTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeTe, HgZnETe,
Specific examples of III-V group compounds include GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InN, InAs, InS, InSb, GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb And AlPAs, AlPSb, InNP, InNAs, InNSb, InPAs, InPsb, GaAlNP, GaAlNAs, GaAlNsb, GaAlPAs, GaAlPSb, GaAlPSb, GaInNPs, GaInNAs, GaInNSb, GaInNSb, GaInPSb, InAlNSP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, and the like.
Specific examples of IV-VI compounds include SnS, SnSe, SnTe, PbS, PbSe, PbTe, SnSeS, SnSe, SnSTe, SnSe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, SnPbSSe, SnPbSeTe, SnPbSTe, etc. .
Specific examples of the group IV compound include Si, Ge, SiC, SiGe and the like.

As a quantum dot fluorescent substance, what has a core-shell structure is preferable. By making the band gap of the compound constituting the shell layer wider than the band gap of the compound constituting the core part, it is possible to further improve the quantum efficiency of the quantum dot phosphor. Examples of the combination of the core part and the shell layer (core part / shell layer) include CdSe / ZnS, InP / ZnS, PbSe / PbS, CdSe / CdS, CdTe / CdS, CdTe / ZnS and the like.

The quantum dot phosphor may have a so-called core multi-shell structure in which the shell layer has a multilayer structure. The quantum efficiency of the quantum dot phosphor is achieved by laminating one or two narrow shell layers with a narrow band gap in the wide band gap core part and further stacking a wide band gap shell layer on this shell layer. Further improvement is possible.

The resin composition of the present disclosure may contain one type of quantum dot phosphor alone, or may contain two or more types of quantum dot phosphor.
As an embodiment including two or more types of quantum dot phosphors, for example, an embodiment including two or more types of quantum dot phosphors having different components but having the same average particle size, quantum dot fluorescence having the same components having different average particle sizes. An embodiment including two or more types of bodies, and an embodiment including two or more types of quantum dot phosphors having different components and average particle sizes may be mentioned. The emission center wavelength of the quantum dot phosphor can be changed by changing at least one of the component of the quantum dot phosphor and the average particle diameter.

For example, the resin composition of the present disclosure includes a quantum dot phosphor G having an emission center wavelength in a green wavelength range of 520 nm to 560 nm, and a quantum dot phosphor R having an emission center wavelength in a red wavelength range of 600 nm to 680 nm. And may be included. When a resin composition containing quantum dot phosphor G and quantum dot phosphor R is irradiated with excitation light in the blue wavelength range of 430 nm to 480 nm, green light from quantum dot phosphor G and quantum dot phosphor R is emitted respectively. And red light is emitted. As a result, white light can be obtained from green light and red light emitted from the quantum dot phosphor G and the quantum dot phosphor R, and blue light transmitted through the resin composition.

The content of the quantum dot phosphor in the resin composition of the present disclosure is, for example, preferably 0.01% by mass to 1.0% by mass, and preferably 0.05% by mass, with respect to the total amount of the resin composition. It is more preferable that the amount is -0.5% by mass, and further preferably 0.1% by mass to 0.5% by mass. When the content of the quantum dot phosphor is 0.01% by mass or more, sufficient emission intensity tends to be obtained when the excitation light is irradiated, and the content of the quantum dot phosphor is 1.0% by mass or less In such a case, aggregation of the quantum dot phosphors tends to be suppressed.

(Quality of dispersion)
The resin composition of the present disclosure comprises a gellable dispersoid.
The dispersoid is not particularly limited as long as it is dispersible in the resin composition and can be gelled, and modified silicone, dimethyl silicone, methylphenyl silicone, methyl hydrogen silicone, glycerin fatty acid ester, interface Active polyol etc. are mentioned. Among them, modified silicone is preferred.
As the dispersoid, one type may be used alone, or two or more types may be used in combination.

As the modified silicone, amino modified silicone, phenol modified silicone, fluorine modified silicone, epoxy modified silicone, carboxy modified silicone, carbinol modified silicone, mercapto modified silicone, heterofunctional modified silicone, polyether modified silicone, methylstyryl modified silicone, Examples thereof include hydrophilic special modified silicone, higher alkoxy modified silicone, higher fatty acid modified silicone and the like. Amino-modified silicones are preferred from the viewpoint of light diffusibility and dispersibility of the quantum dot phosphor.
As the modified silicone, one type may be used alone, or two or more types may be used in combination.

The modified silicone is preferably a modified silicone having a reactive group which reacts with another compound, specifically an epoxy compound having two or more functional groups described later, from the viewpoint of easily forming a gelled product. Examples of such modified silicones include amino-modified silicones, phenol-modified silicones, carboxy-modified silicones, carbinol-modified silicones, mercapto-modified silicones, different functional group-modified silicones and the like.

The content of the dispersoid in the resin composition is, for example, preferably 1% by mass to 10% by mass, and more preferably 3% by mass to 7% by mass, with respect to the total amount of the resin composition. More preferably, it is 3% by mass to 5% by mass. When the content of the dispersoid is 1% by mass or more, the emission intensity of the wavelength conversion member tends to improve, and when the content of the dispersoid is 10% by mass or less, the aggregation of the emulsion tends to be suppressed. .

In addition, the total content of the quantum dot phosphor and the dispersoid in the resin composition may be, for example, 1% by mass to 10% by mass, and 3% by mass to 7% with respect to the total amount of the resin composition. It may be mass%, or 3 to 5 mass%.

(Difunctional or higher epoxy compound)
The resin composition of the present disclosure preferably contains a difunctional or higher epoxy compound. Thus, when the resin composition is cured, it tends to react with the dispersoid to form a gelled product, and in particular to react with the modified silicone to form a gelled product.

The resin composition of the present disclosure preferably contains a modified silicone and a difunctional or higher epoxy compound, and more preferably contains an amino-modified silicone and a difunctional or higher epoxy compound. When the resin composition contains a modified silicone and a difunctional or more epoxy compound, when curing the resin composition, the modified silicone and the bifunctional or more epoxy compound tend to react to easily form a gelled product. is there.

When the dispersoid contains an amino-modified silicone, the ratio of the amine equivalent (molecular weight per amino group) of the amino-modified silicone to the epoxy equivalent (molecular weight per epoxy group) of the difunctional or higher epoxy compound (epoxy equivalent) / Amine equivalent weight) is preferably 0.01 to 70.0, more preferably 0.5 to 30, and still more preferably 1.0 to 10. When the epoxy equivalent / amine equivalent ratio is 0.01 or more, the amino-modified silicone tends to gel, and when it is 70.0 or less, aggregation of the emulsion tends to be suppressed.

The bifunctional or higher epoxy compound preferably has 2 to 4 epoxy groups, and more preferably 2 or 3 epoxy groups, from the viewpoint of improving the moist heat resistance of the wavelength conversion member. It is further preferred to have one or more epoxy groups.

The epoxy equivalent of the difunctional or higher epoxy compound is preferably 100 g / eq to 500 g / eq, more preferably 120 g / eq to 400 g / eq, and further preferably 200 g / eq to 400 g / eq. preferable.

The bifunctional or higher epoxy compound preferably has at least one of a bisphenol structure and a hydrogenated bisphenol structure from the viewpoint of improving the weather resistance, more preferably a bisphenol structure or a hydrogenated bisphenol structure, and a hydrogenated bisphenol structure It is particularly preferred to have

Specific examples of the difunctional or higher epoxy compound include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, neopentyl Examples thereof include glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin diglycidyl ether, trimethylolpropane triglycidyl ether, hydrogenated bisphenol A type diglycidyl ether, bisphenol A type PO adduct and the like. Among these, hydrogenated bisphenol A type diglycidyl ether and bisphenol A type PO adduct are preferable.
As a bifunctional or higher epoxy compound, one type may be used alone, or two or more types may be used in combination.

When the resin composition contains a difunctional or higher epoxy compound, the content of the difunctional or higher epoxy compound in the resin composition is, for example, 0.1% by mass to 4% by mass with respect to the total amount of the resin composition. Is preferably 0.1% by mass to 3% by mass, and more preferably 0.1% by mass to 2% by mass. When the content of the bifunctional or higher epoxy compound is 0.1% by mass or more, it tends to easily form a gelled product, and when the content of the bifunctional or higher epoxy compound is 4% by mass or less, the emulsion Tend not to inhibit the formation of

(Multifunctional thiol compound)
The resin composition of the present disclosure preferably comprises a multifunctional thiol compound. As a result, the adhesion of the cured resin to the base material described later, the heat resistance, and the heat and humidity resistance tend to be further improved.

The polyfunctional thiol compound is preferably a compound having 2 to 6 thiol groups in the molecule, and more preferably a compound having 3 or 4 thiol groups in the molecule.

Specific examples of polyfunctional thiol compounds include ethylene glycol bis (3-mercapto propionate), diethylene glycol bis (3-mercapto propionate), tetraethylene glycol bis (3-mercapto propionate), 1,2- Propylene glycol bis (3-mercaptopropionate), diethylene glycol bis (3-mercaptobutyrate), 1,4-butanediol bis (3-mercaptopropionate), 1,4-butanediol bis (3-mercaptobutylate) Rate), 1,8-octanediol bis (3-mercaptopropionate), 1,8-octanediol bis (3-mercaptobutyrate), hexanediol bisthioglycolate, trimethylolpropane tris (3-mercaptoprote) Peonate Trimethylolpropane tris (3-mercaptobutyrate), trimethylolpropane tris (3-mercaptoisobutyrate), trimethylolpropane tris (2-mercaptoisobutyrate), trimethylolpropane tristhioglycolate, tris- [ (3-Mercaptopropionyloxy) -ethyl] -isocyanurate, trimethylolethane tris (3-mercaptobutyrate), pentaerythritol tetrakis (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptobutyrate), penta Erythritol tetrakis (3-mercapto isobutyrate), pentaerythritol tetrakis (2-mercapto isobutyrate), dipentaerythritol hexakis (3-mercapto) (Pionate), dipentaerythritol hexakis (2-mercaptopropionate), dipentaerythritol hexakis (3-mercaptobutyrate), dipentaerythritol hexakis (3-mercaptoisobutyrate), dipentaerythritol hexakis ( 2-mercaptoisobutyrate), pentaerythritol tetrakisthioglycolate, dipentaerythritol hexakisthioglycolate and the like. Among them, pentaerythritol tetrakis (3-mercaptopropionate) and pentaerythritol tetrakis (3-mercaptobutyrate) are preferable, and pentaerythritol tetrakis (3-mercaptopropionate) is more preferable.
As polyfunctional thiol compounds, one type may be used alone, or two or more types may be used in combination.

Moreover, as a polyfunctional thiol compound, you may use the thioether oligomer which reacted with the polyfunctional (meth) acryl compound beforehand.

The thioether oligomer can be obtained, for example, by subjecting a polyfunctional thiol compound and a polyfunctional (meth) acrylic compound to an addition reaction in the presence of a polymerization initiator. The ratio of the number of equivalents of the thiol group of the polyfunctional thiol compound to the number of equivalents of the (meth) acryloyl group of the polyfunctional (meth) acrylic compound (number of equivalents of thiol group / number of equivalents of (meth) acryloyl group) is, for example, 3 It is preferably from 0 to 3.3, more preferably from 3.0 to 3.2, still more preferably from 3.05 to 3.15.

The weight average molecular weight of the thioether oligomer is, for example, preferably 3000 to 10000, more preferably 3000 to 8000, and still more preferably 4000 to 6000.
The weight average molecular weight of the thioether oligomer can be determined by converting it from the molecular weight distribution measured using gel permeation chromatography (GPC) using a standard polystyrene calibration curve, as shown in the examples described later. .

The thiol equivalent of the thioether oligomer is preferably, for example, 200 g / eq to 400 g / eq, more preferably 250 g / eq to 350 g / eq, and further preferably 250 g / eq to 270 g / eq. preferable.

The thiol equivalent of the thioether oligomer can be measured by the following iodine titration method.
0.2 g of the measurement sample is precisely weighed, and 20 mL of chloroform is added thereto to make a sample solution. Using 0.275 g of soluble starch dissolved in 30 g of pure water as a starch indicator, add 20 mL of pure water, 10 mL of isopropyl alcohol and 1 mL of starch indicator, and stir with a stirrer. An iodine solution is dropped, and the point at which the chloroform layer turned green is defined as the end point. At this time, the value given by the following formula is taken as the thiol equivalent of the measurement sample.
Thiol equivalent (g / eq) = mass of measurement sample (g) × 10000 / titration amount of iodine solution (mL) × factor of iodine solution

Among the thioether oligomers, pentaerythritol tetrakis (3-mercaptopropionate) and tris (2-hydroxyethyl) isocyanurate triacrylate are more preferred from the viewpoint of further improving the optical properties, heat resistance and moist heat resistance of the cured resin. Preferred are thioether oligomers obtained by addition reaction.

When the resin composition contains a polyfunctional thiol compound, the content of the polyfunctional thiol compound in the resin composition is preferably, for example, 40% by mass to 80% by mass with respect to the total amount of the resin composition, The content is more preferably 50% by mass to 80% by mass, and still more preferably 50% by mass to 70% by mass. When the content of the polyfunctional thiol compound is 40% by mass or more, the adhesion of the cured resin to the substrate tends to be further improved, and when the content of the polyfunctional thiol compound is 80% by mass or less, the resin The heat resistance and moist heat resistance of the cured product tend to be further improved.

((Meth) allyl compounds)
The resin composition of the present disclosure preferably contains a (meth) allyl compound. The (meth) allyl compound may be a monofunctional (meth) allyl compound having one (meth) allyl group in one molecule, and a compound having two or more (meth) allyl groups in one molecule. It may be a functional (meth) allyl compound.
As the (meth) allyl compound, one type may be used alone, two or more types may be used in combination, and a monofunctional (meth) allyl compound and a polyfunctional (meth) allyl compound may be used in combination.
The (meth) allyl compound preferably contains a polyfunctional (meth) allyl compound from the viewpoint of further improving the adhesion of the cured resin to the substrate. The ratio of the polyfunctional (meth) allyl compound to the total amount of the (meth) allyl compound is, for example, preferably 80% by mass or more, more preferably 90% by mass or more, and further preferably 100% by mass. preferable.

Specific examples of monofunctional (meth) allyl compounds include (meth) allyl acetate, (meth) allyl n-propionate, (meth) allyl benzoate, (meth) allyl phenyl acetate, (meth) allyl phenoxy acetate, (meth) And allyl methyl ether, (meth) allyl glycidyl ether and the like.

The polyfunctional (meth) allyl compound is preferably a compound having 2 to 4 (meth) allyl groups in the molecule, from the viewpoint of the heat resistance and moisture and heat resistance of the cured resin, More preferably, it is a compound having three (meth) allyl groups.

Specific examples of the polyfunctional (meth) allyl compound include cyclohexanedicarboxylic acid di (meth) allyl, di (meth) allyl maleate, di (meth) allyl adipate, di (meth) allyl phthalate, di (meth) allyl iso Phthalate, di (meth) allyl terephthalate, glycerol di (meth) allyl ether, trimethylolpropane di (meth) allyl ether, pentaerythritol di (meth) allyl ether, 1,3-di (meth) allyl-5-glycidyl isocyanate Nurate, tri (meth) allyl cyanurate, tri (meth) allyl isocyanurate, tri (meth) allyl trimellitate, tetra (meth) allyl pyromelitate, 1,3,4,6-tetra (meth) allyl glycol Uril, 1,3,4,6-tetra (meth) allyl-3a-methi Glycoluril, 1,3,4,6-tetra (meth) allyl -3a, 6a- dimethyl glycoluril. Among them, tri (meth) allyl cyanurate, tri (meth) allyl isocyanurate, di (meth) allyl phthalate, di (meth) allyl isophthalate and di (meth) from the viewpoint of heat resistance and moisture and heat resistance of the cured resin. At least one selected from the group consisting of allyl terephthalate and cyclohexanedicarboxylate di (meth) allyl is preferred, and tri (meth) allyl isocyanurate is more preferred.

The content of the (meth) allyl compound in the resin composition is, for example, preferably 10% by mass to 50% by mass, and more preferably 15% by mass to 45% by mass, with respect to the total amount of the resin composition. More preferably, the content is 20% by mass to 40% by mass. When the content of the (meth) allyl compound is 10% by mass or more, the heat resistance and the moist heat resistance of the cured resin tend to be further improved, and the content of the (meth) allyl compound is 50% by mass or less The adhesion of the cured resin to the substrate tends to be further improved.

((Meth) acrylic compounds)
The resin composition of the present disclosure may contain a (meth) acrylic compound.

The (meth) acrylic compound may be a monofunctional (meth) acrylic compound having one (meth) acryloyl group in one molecule, and a multiple compound having two or more (meth) acryloyl groups in one molecule. It may be a functional (meth) acrylic compound.
As the (meth) acrylic compound, one type may be used alone, two or more types may be used in combination, and a monofunctional (meth) acrylic compound and a polyfunctional (meth) acrylic compound may be used in combination.

Specific examples of monofunctional (meth) acrylic compounds are: (meth) acrylic acid; methyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate ) Alkyl (meth) acrylates having 1 to 18 carbon atoms in the alkyl group such as acrylate, n-octyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate; benzyl (meth) acrylate, phenoxyethyl (Meth) acrylate compounds having an aromatic ring such as meta) acrylate; aminoalkyl (meth) acrylates such as N, N-dimethylaminoethyl (meth) acrylate; cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate , (Meth) acrylate compounds having an alicyclic ring such as isobornyl (meth) acrylate, methylene oxide addition cyclodecatriene (meth) acrylate, etc .; (meth) acrylate compounds having a heterocyclic ring such as (meth) acryloyl morpholine; heptadecafluorodecyl Fluorinated alkyl (meth) acrylates such as (meth) acrylates; (meth) acrylate compounds having a hydroxyl group such as 2-hydroxyethyl (meth) acrylates, 3-hydroxypropyl (meth) acrylates, 4-hydroxybutyl (meth) acrylates (Meth) acrylate compounds having an isocyanate group such as 2- (2- (meth) acryloyloxyethyloxy) ethyl isocyanate, 2- (meth) acryloyloxyethyl isocyanate, etc. (meth) acrylic , N, N-dimethyl (meth) acrylamide, N-isopropyl (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, 2-hydroxyethyl (meth) acrylamide And (meth) acrylamide compounds such as;

The polyfunctional (meth) acrylic compound is preferably a compound having 2 to 4 (meth) acryloyl groups in the molecule from the viewpoint of heat resistance and moisture and heat resistance of the cured resin, and it is preferable to use More preferably, it is a compound having three (meth) acryloyl groups.

Specific examples of the polyfunctional (meth) acrylic compound include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate and the like. Alkylene glycol di (meth) acrylate; tri (meth) acrylate compounds such as trimethylolpropane tri (meth) acrylate and tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate; trimethylolpropane tetra (meth) acrylate, penta And tetra (meth) acrylate compounds such as erythritol tetra (meth) acrylate.

The (meth) acrylic compound may contain a monofunctional (meth) acrylate compound having an alicyclic ring from the viewpoint of further improving the heat resistance and the moist heat resistance of the cured resin, and isobornyl (meth) acrylate dicyclo It may contain pentanyl (meth) acrylate or the like, and preferably may contain isobornyl (meth) acrylate.

The content of the (meth) acrylic compound in the resin composition may be, for example, 1% by mass to 30% by mass, or 5% by mass to 20% by mass, with respect to the total amount of the resin composition. It may be 10% by mass to 15% by mass. When the content of the (meth) acrylic compound is 1% by mass or more, the storage stability of the resin composition and the adhesion of the cured resin to the substrate tend to be further improved, and the content of the (meth) acrylic compound The heat resistance and the heat-and-moisture resistance of the resin cured product tend to be improved as the content of 30% by mass or less.

(Monofunctional thiol compound)
The resin composition of the present disclosure may contain a monofunctional thiol compound.
Specific examples of the monofunctional thiol compound include 1-hexanethiol, 1-heptanethiol, 1-octanethiol, 1-nonanethiol, 1-decanethiol, 3-mercaptopropionic acid, methyl 3-mercaptopropionate, 3- Examples thereof include 3-methoxybutyl mercaptopropionate, octyl 3-mercaptopropionate, tridecyl 3-mercaptopropionate, 2-ethylhexyl 3-mercaptopropionate, n-octyl 3-mercaptopropionate and the like.
As the monofunctional thiol compound, one type may be used alone, or two or more types may be used in combination.

(Alkylene oxy group-containing compound)
The resin composition of the present disclosure may contain an alkyleneoxy group-containing compound having an alkyleneoxy group and a polymerizable reactive group. This tends to facilitate the preparation of a resin composition having a high viscosity. By setting the viscosity of the resin composition to a relatively high value, when preparing the resin composition which is an emulsion by stirring the mixture of each component, coalescence of the dispersoid due to aggregation is suppressed, so High dispersion is maintained, and high brightness tends to be obtained for the wavelength conversion member.

The alkyleneoxy group-containing compound preferably has an ester group. Thereby, the dispersibility of the dispersoid such as modified silicone tends to be enhanced. The alkyleneoxy group-containing compound only needs to have one or more ester groups, and preferably has two or more ester groups.

The alkyleneoxy group-containing compound preferably has two or more polymerizable reactive groups, and more preferably two polymerizable reactive groups. By having two or more polymerizable reactive groups, the adhesion of the cured resin to the substrate, the heat resistance, and the moist heat resistance tend to be further improved.
As a polymerizable reaction group, the functional group which has an ethylenic double bond is mentioned, More specifically, a (meth) acryloyl group etc. are mentioned.

The alkyleneoxy group is preferably an alkyleneoxy group having a carbon number of 2 to 4, from the viewpoint of easily preparing a resin composition having a relatively high viscosity by increasing the viscosity of the alkyleneoxy group-containing compound. Is more preferably an alkyleneoxy group of 2 or 3, and still more preferably an alkyleneoxy group having 2 carbon atoms.
The alkyleneoxy group-containing compound may have one type of alkyleneoxy group, and may have two or more types of alkyleneoxy group.

The alkyleneoxy group-containing compound may be a polyalkyleneoxy group-containing compound having a polyalkyleneoxy group containing a plurality of alkyleneoxy groups.

The alkyleneoxy group-containing compound preferably has 2 to 30 alkyleneoxy groups, more preferably 2 to 20 alkyleneoxy groups, and 3 to 10 alkyleneoxy groups. Are more preferred, and it is particularly preferred to have 3 to 5 alkyleneoxy groups.

The alkyleneoxy group-containing compound preferably has a bisphenol structure. Thereby, the heat and humidity resistance tends to be excellent. As a bisphenol structure, a bisphenol A structure and a bisphenol F structure are mentioned, for example, Especially, a bisphenol A structure is preferable.

Specific examples of the alkyleneoxy group-containing compound include alkoxyalkyl (meth) acrylates such as butoxyethyl (meth) acrylate; diethylene glycol monoethyl ether (meth) acrylate, triethylene glycol monobutyl ether (meth) acrylate, tetraethylene glycol monomethyl ether (Meth) acrylate, hexaethylene glycol monomethyl ether (meth) acrylate, octaethylene glycol monomethyl ether (meth) acrylate, nona ethylene glycol monomethyl ether (meth) acrylate, dipropylene glycol monomethyl ether (meth) acrylate, hepta propylene glycol monomethyl ether (Meth) acrylate, tetraethylene glycol monoethyl ester Polyalkylene glycol monoalkyl ether (meth) acrylates such as hydroxyl (meth) acrylate; polyalkylene glycol monoaryl ether (meth) acrylates such as hexaethylene glycol monophenyl ether (meth) acrylate; tetrahydrofurfuryl (meth) acrylate and the like Heterocyclic (meth) acrylate compounds; having hydroxyl groups such as triethylene glycol mono (meth) acrylate, tetraethylene glycol mono (meth) acrylate, hexaethylene glycol mono (meth) acrylate, octapropylene glycol mono (meth) acrylate, etc. (Meth) acrylate compounds; (meth) acrylate compounds having a glycidyl group such as glycidyl (meth) acrylate; polyethylene glycol di Polyalkylene glycol di (meth) acrylates such as meta) acrylate and polypropylene glycol di (meth) acrylate; tri (meth) acrylate compounds such as ethylene oxide-added trimethylolpropane tri (meth) acrylate; ethylene oxide-added pentaerythritol tetra (meth) acrylate Etc .; bisphenol type di (meth) acrylates such as ethoxylated bisphenol A type di (meth) acrylate, propoxylated bisphenol A type di (meth) acrylate, propoxylated ethoxylated bisphenol A type di (meth) acrylate ) Acrylate compounds; and the like.
Among the alkyleneoxy group-containing compounds, ethoxylated bisphenol A di (meth) acrylate, propoxylated bisphenol A di (meth) acrylate and propoxylated ethoxylated bisphenol A di (meth) acrylate are preferable, among which ethoxylated bisphenol A-type di (meth) acrylate is more preferred.
As the alkyleneoxy group-containing compound, one type may be used alone, or two or more types may be used in combination.

When the resin composition contains an alkyleneoxy group-containing compound, the content of the alkyleneoxy group-containing compound in the resin composition is, for example, 0.5% by mass to 10% by mass with respect to the total amount of the resin composition. Is preferable, 1 to 8% by mass is more preferable, and 1.5 to 5% by mass is more preferable. When the content of the alkyleneoxy group-containing compound is 0.5% by mass or more, the viscosity of the resin composition tends to be easily increased, and when the content of the alkyleneoxy group-containing compound is 10% by mass or less The viscosity of the composition does not become too high, and the application of the resin composition to a substrate or the like and the production efficiency of the wavelength conversion member tend to be excellent.

(Photopolymerization initiator)
The resin composition of the present disclosure preferably contains a photopolymerization initiator. It does not restrict | limit especially as a photoinitiator, For example, the compound which generate | occur | produces a radical by irradiation of active energy rays, such as an ultraviolet-ray, is mentioned.

Specific examples of the photopolymerization initiator include benzophenone, N, N'-tetraalkyl-4,4'-diaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-Methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1,4,4'-bis (dimethylamino) benzophenone (also referred to as "Michler's ketone"), 4,4'-bis (Diethylamino) benzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 1-hydroxycyclohexyl phenyl ketone, 1- (4-isopropylphenyl) 2-hydroxy-2-methylpropan-1-one, 1- (4- (4- 2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propan-1-one, 2 Aromatic ketone compounds such as hydroxy-2-methyl-1-phenylpropan-1-one; quinone compounds such as alkyl anthraquinone and phenanthrene quinone; benzoin compounds such as benzoin and alkyl benzoin; benzoin such as benzoin alkyl ether and benzoin phenyl ether Ether compounds; benzyl derivatives such as benzyl dimethyl ketal; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole , 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxy Phenyl) -5-phenylimidazole Dimer, 2,4,5-triarylimidazole dimer such as 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer; 9-phenylacridine, 1,7- (9, Acridine derivatives such as 9'-acridinyl) heptane; 1,2-octanedione 1- [4- (phenylthio) -2- (O-benzoyloxime)], ethanone 1- [9-ethyl-6- (2-methyl) Oxime ester compounds such as benzoyl) -9H-carbazol-3-yl] -1- (O-acetyloxime); coumarin compounds such as 7-diethylamino-4-methylcoumarin; thioxanthone compounds such as 2,4-diethylthioxanthone; 2,4,6-Trimethylbenzoyl-diphenyl-phosphine oxide, 2,4,6-trimethylbenzoyl-phenyl- And acyl phosphine oxide compounds such as ethoxy-phosphine oxide;
As the photopolymerization initiator, one type may be used alone, or two or more types may be used in combination.

The photopolymerization initiator is preferably at least one selected from the group consisting of an acyl phosphine oxide compound, an aromatic ketone compound, and an oxime ester compound from the viewpoint of curability, and from an acyl phosphine oxide compound and an aromatic ketone compound And more preferably at least one selected from the group consisting of: acyl phosphine oxide compounds.

The content of the photopolymerization initiator in the resin composition is, for example, preferably 0.1% by mass to 5% by mass, and more preferably 0.1% by mass to 3% by mass, with respect to the total amount of the resin composition. The content is more preferably 0.5% by mass to 1.5% by mass. When the content of the photopolymerization initiator is 0.1% by mass or more, the sensitivity of the resin composition tends to be sufficient, and when the content of the photopolymerization initiator is 5% by mass or less, the resin The influence of the composition on the hue and the decrease in storage stability tend to be suppressed.

(Liquid medium)
The resin composition of the present disclosure may contain a liquid medium. The liquid medium refers to a medium in a liquid state at room temperature (25 ° C.).

Specific examples of the liquid medium include acetone, methyl ethyl ketone, methyl n-propyl ketone, methyl isopropyl ketone, methyl n-butyl ketone, methyl isobutyl ketone, methyl n-pentyl ketone, methyl n-hexyl ketone, diethyl ketone, Ketone solvents such as dipropyl ketone, diisobutyl ketone, trimethylnonanone, cyclohexanone, cyclopentanone, methylcyclohexanone, 2,4-pentanedione, acetonylacetone, etc .; diethyl ether, methyl ethyl ether, methyl-n-propyl ether, diisopropyl Ether, tetrahydrofuran, methyltetrahydrofuran, dioxane, dimethyldioxane, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol Di-n-propyl ether, ethylene glycol di-n-butyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol methyl n-propyl ether, diethylene glycol methyl n-butyl ether, diethylene glycol di-n-propyl ether, Diethylene glycol di-n-butyl ether, diethylene glycol methyl-n-hexyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol methyl ethyl ether, triethylene glycol methyl n-butyl ether, triethylene glycol di-n-butyl ether , Triethylene glycol Methyl n-hexyl ether, tetraethylene glycol dimethyl ether, tetraethylene glycol diethyl ether, tetraethylene glycol methyl ethyl ether, tetraethylene glycol methyl n-butyl ether, tetraethylene glycol di-n-butyl ether, tetraethylene glycol methyl n- Hexyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol di-n-propyl ether, propylene glycol di-n-butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol methyl ethyl ether, dipropylene glycol Methyl-n-butyl ether, dipropi Polyethylene glycol di-n-propyl ether, dipropylene glycol di-n-butyl ether, dipropylene glycol methyl n-hexyl ether, tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol methyl ethyl ether, tripropylene glycol methyl ether -N-butyl ether, tripropylene glycol di-n-butyl ether, tripropylene glycol methyl-n-hexyl ether, tetrapropylene glycol dimethyl ether, tetrapropylene glycol diethyl ether, tetrapropylene glycol methyl ethyl ether, tetrapropylene glycol methyl n-butyl ether , Tetrapropylene glycol di-n-butyl ether, teto Ether solvents such as propylene glycol methyl-n-hexyl ether; carbonate solvents such as propylene carbonate, ethylene carbonate, diethyl carbonate; methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, sec acetic acid -Butyl, n-pentyl acetate, sec-pentyl acetate, 3-methoxybutyl acetate, methylpentyl acetate, 2-ethylbutyl acetate, 2-ethylhexyl acetate, 2- (2-butoxyethoxy) ethyl acetate, benzyl acetate, cyclohexyl acetate, Methyl cyclohexyl cyclohexyl, nonyl acetate, methyl acetoacetate, ethyl acetoacetate, diethylene glycol methyl ether acetate, diethylene glycol monoethyl ether acetate, dipropylene glycol methyl acetate , Dipropylene glycol ethyl ether acetate, glycol diacetate, methoxytriethylene glycol acetate, ethyl propionate, n-butyl propionate, isoamyl propionate, diethyl oxalate, di-n-butyl oxalate, methyl lactate, ethyl lactate , N-butyl lactate, n-amyl lactate, ethylene glycol methyl ether propionate, ethylene glycol ethyl ether propionate, ethylene glycol methyl ether acetate, ethylene glycol ethyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate Ester solvents such as propylene glycol propyl ether acetate, γ-butyrolactone and γ-valerolactone; acetonitrile, N- Aprotic polar polarity such as chill pyrrolidinone, N-ethyl pyrrolidinone, N-propyl pyrrolidinone, N-butyl pyrrolidinone, N-hexyl pyrrolidinone, N-cyclohexyl pyrrolidinone, N, N-dimethylformamide, N, N-dimethyl acetamide, dimethyl sulfoxide and the like Solvents: methanol, ethanol, n-propanol, isopropanol, n-butanol, isobutanol, sec-butanol, t-butanol, n-pentanol, isopentanol, 2-methylbutanol, sec-pentanol, t-pentanol 3-methoxybutanol, n-hexanol, 2-methylpentanol, sec-hexanol, 2-ethylbutanol, sec-heptanol, n-octanol, 2-ethylhexanol, sec-o Cranol, n-nonyl alcohol, n-decanol, sec-undecyl alcohol, trimethyl nonyl alcohol, sec-tetradecyl alcohol, sec-heptadecyl alcohol, cyclohexanol, methylcyclohexanol, benzyl alcohol, ethylene glycol, 1,2- Alcohol solvents such as propylene glycol, 1,3-butylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol and tripropylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol Monoethyl ether, diethylene glycol mono-n-butyl ester Diethylene glycol mono-n-hexyl ether, triethylene glycol monoethyl ether, tetraethylene glycol mono-n-butyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, tripropylene glycol monomethyl ether, etc. Solvents for glycol monoethers; Terpinene, Terpineol, Myrcene, Alloocimene, Limonene, Dipentene, Pinene, Carboxyl, Osimene, Ferandrene etc. Terpene solvents; Butanoic acid, Pentanic acid, Hexanoic acid, Heptanoic acid, Octanoic acid, Nonanoic acid, Decane Acid, undecanoic acid, dodecanoic acid, tridecanoic acid, tetradecanoic acid, pentadecanoic acid, hexadecanoic acid, heptadecanoic acid, octa Saturated aliphatic monocarboxylic acid having 4 or more carbon atoms such as kanamic acid, nonadecanoic acid, icosanic acid, eicosenic acid, etc .; unsaturated aliphatic monocarboxylic acid having 8 or more carbon atoms such as oleic acid, elaidic acid, linoleic acid, palmitoleic acid And the like. The resin composition of the present disclosure may contain one type of liquid medium alone, or may contain two or more types of liquid media.

When the resin composition contains a liquid medium, the content of the liquid medium in the resin composition is, for example, preferably 1% by mass to 10% by mass, and more preferably 4% by mass to the total amount of the resin composition. It is more preferably 10% by mass, and still more preferably 4% by mass to 7% by mass.

(Other ingredients)
The resin composition of the present disclosure may contain other components such as a polymerization inhibitor, a silane coupling agent, a surfactant, an adhesion promoter, an antioxidant, and the like. The resin composition of the present disclosure may contain one type alone or two or more types for each of the other components.

A resin composition layer formed using a resin composition, for example, a resin composition layer formed on a substrate by applying the resin composition to a substrate, was subjected to drying treatment as necessary. After that, an active energy ray such as ultraviolet rays is irradiated. Thereby, a resin composition layer hardens | cures and resin cured | curing material is obtained. The wavelength and irradiation amount of the active energy ray can be appropriately set according to the composition of the resin composition. In some aspect, it is irradiated with ultraviolet rays having a wavelength of 280 nm ~ 400 nm at an irradiation amount of ^{100mJ / cm 2 ~ 5000mJ / cm} 2. Examples of the ultraviolet light source include low pressure mercury lamps, medium pressure mercury lamps, high pressure mercury lamps, ultra high pressure mercury lamps, carbon arc lamps, metal halide lamps, xenon lamps, chemical lamps, black light lamps, microwave excited mercury lamps and the like.

The cured resin product obtained by curing the resin composition layer contains a gelled product formed by the reaction of the above-mentioned dispersoids, and preferably is formed by the reaction of the above-mentioned modified silicone and a difunctional or higher epoxy compound. Contains gelation.
Furthermore, the resin cured product may be a gelled product that includes the sea area and the island area, and the island area includes the quantum dot phosphor.

The shapes of the cured resin and the wavelength conversion member are not particularly limited, and examples thereof include films and lenses. When applied to a backlight unit described later, the cured resin and the wavelength conversion member are preferably in the form of a film.

When the cured resin product is in the form of a film, the average thickness of the cured resin product is, for example, preferably 50 μm to 200 μm, more preferably 50 μm to 150 μm, and still more preferably 80 μm to 120 μm. When the average thickness is 50 μm or more, the wavelength conversion efficiency tends to be further improved, and when the average thickness is 200 μm or less, when applied to a backlight unit described later, the backlight unit tends to be thinner. is there.
The average thickness of the film-like cured resin is determined, for example, as an arithmetic average value of the thicknesses of three arbitrary points measured using a micrometer.

The resin cured product may be a single layer, or two or more layers may be laminated. When two or more layers of the resin cured product are laminated, the curing conditions of the resin composition and the resin composition used to form each layer may be the same or different. .

The resin cured product preferably has a structure derived from an ene-thiol reaction, and the sea part of the resin cured product more preferably has a structure derived from an ene-thiol reaction.
The ene-thiol reaction is a bond forming reaction between a thiol compound and a compound having an ethylenically unsaturated group. The ene-thiol reaction is preferably a bond-forming reaction between a thiol compound and a (meth) allyl compound, from the viewpoint of excellent adhesion of the cured resin to a substrate. For example, when a resin composition containing a thiol compound, a (meth) allyl compound and a photopolymerization initiator is irradiated with an active energy ray such as ultraviolet light, the thiol compound and the (meth) allyl are generated by radicals generated from the polymerization initiator. The reaction with the compound proceeds to obtain a cured resin having a structure derived from the ene-thiol reaction.

The cured resin having a structure derived from an ene-thiol reaction may be a cured product derived from the reaction of a thiol compound, a (meth) allyl compound and a (meth) acrylic compound. The cured resin having a structure derived from an ene-thiol reaction may be, for example, a cured product obtained by further reacting an oligomer obtained by reacting a thiol compound and a (meth) acrylic compound with a (meth) allyl compound. .

The cured resin has a loss tangent (tan δ) of 0.4 to 1.5 measured by dynamic viscoelasticity measurement at a frequency of 10 Hz and a temperature of 25 ° C. in order to further improve the adhesion to the substrate. Is preferable, 0.4 to 1.2 is more preferable, and 0.4 to 0.6 is more preferable. The loss tangent (tan δ) of the resin cured product can be measured using a dynamic viscoelasticity measurement device (eg, Rheometric Scientific, Inc., Solid Analyzer RSA-III).

The cured resin preferably has a glass transition temperature (Tg) of 40 ° C. or higher, more preferably 45 ° C. or higher, and more preferably 50 ° C. or higher, from the viewpoint of further improving heat resistance and moist heat resistance. Is more preferred.
The cured resin is preferably 90 ° C. or less, more preferably 80 ° C. or less, and still more preferably 75 ° C. or less, from the viewpoint of adhesion to the substrate.
The glass transition temperature (Tg) of the resin cured product can be measured using a dynamic viscoelasticity measurement device (for example, Rheometric Scientific, Solid Analyzer RSA-III).

In addition, the cured resin has a storage elastic modulus of 1 × 10 ⁷ Pa to 1 × 10 5 measured at a frequency of 10 Hz and a temperature of 25 ° C. from the viewpoint of further improving the adhesion to the substrate, the heat resistance and the moisture and heat resistance. ^The pressure is preferably ⁹ Pa, more preferably 5 × 10 ⁷ Pa to 1 × 10 ⁹ Pa, and still more preferably 5 × 10 ⁷ Pa to 5 × 10 ⁸ Pa. The storage elastic modulus of the resin cured product can be measured using a dynamic viscoelasticity measuring device (for example, Rheometric Scientific, Inc., Solid Analyzer RSA-III).

The wavelength conversion member manufactured by the method for manufacturing a wavelength conversion member of the present disclosure has a first base and a second base provided on both sides of a cured resin, and the first base, the cured resin, and The second base material may be a wavelength conversion member arranged in this order. In such a wavelength conversion member, for example, in the step of forming a resin composition layer, the step of applying the resin composition to the first substrate to form a resin composition layer, and obtaining a cured resin product. Before this, it can manufacture by performing the process of providing a 2nd base material on the opposite side to the side in which the 1st base material in a resin composition layer was provided.

As a 1st base material and a 2nd base material, the coating material which coat | covers at least one part of resin cured material is mentioned. When the cured resin is in the form of a film, the wavelength conversion member of the present disclosure may be one in which one surface or both surfaces of the cured resin in the form of a film is covered with a film-shaped covering material.

The coating material preferably has a barrier property to at least one of oxygen and water, and more preferably has a barrier property to both oxygen and water, from the viewpoint of suppressing a decrease in the luminous efficiency of the quantum dot phosphor. It does not restrict | limit especially as a coating material which has a barrier property with respect to at least one of oxygen and water, Well-known coating materials, such as a barrier film which has an inorganic layer, can be used.

When the covering material is in the form of a film, the average thickness of the covering material is, for example, preferably 100 μm to 150 μm, more preferably 100 μm to 140 μm, and still more preferably 100 μm to 135 μm. When the average thickness is 100 μm or more, the function such as barrier property tends to be sufficient, and when the average thickness is 150 μm or less, the decrease in light transmittance tends to be suppressed.
The average thickness of the film-like covering material is determined in the same manner as the film-like cured resin.

The oxygen permeability of the covering material is, for example, preferably 0.5 mL / (m ² · 24 h · atm) or less, more preferably 0.3 mL / (m ² · 24 h · atm) or less, 0 More preferably, it is not more than 1 mL / (m ² · 24 h · atm). The oxygen permeability of the covering material can be measured under conditions of a temperature of 23 ° C. and a relative humidity of 65% using an oxygen permeability measuring device (for example, OX-TRAN, manufactured by MOCON).
Further, the water vapor transmission rate of the covering material is, for example, preferably 5 × 10 ⁻² g / (m ² · 24 h · Pa) or less, and 1 × 10 ⁻² g / (m ² · 24 h · Pa) or less Is more preferably 5 × 10 ⁻³ g / (m ² · 24 h · Pa) or less. The water vapor transmission rate of the covering material can be measured under the conditions of a temperature of 40 ° C. and a relative humidity of 90% using a water vapor transmission rate measuring device (for example, AQUATRAN manufactured by MOCON).

[Wavelength conversion member]
The wavelength conversion member which concerns on one form of this invention is a gelatinization thing provided with the resin cured material which has a sea island structure containing a sea part and an island part, and the said island part includes quantum dot fluorescent substance.
The wavelength conversion member which concerns on one form of this invention can be manufactured by the manufacturing method of the wavelength conversion member of above-mentioned this indication, for example.
Moreover, since each structure in the wavelength conversion member which concerns on one form of this invention is the same as each structure in the wavelength conversion member manufactured by the manufacturing method of the wavelength conversion member of above-mentioned this indication, the description is abbreviate | omitted.

In the wavelength conversion member according to the present embodiment, the island portion is a gelled material in which the quantum dot phosphor is contained. Thereby, the quantum dot fluorescent substance in gelatinization does not deteriorate easily under high temperature and high humidity environment, and a wavelength conversion member is excellent in heat-and-moisture resistance.

In the wavelength conversion member according to the present embodiment, the standard deviation of the diameter of the island is preferably 1.5 μm or less, more preferably 1.2 μm or less, and still more preferably 1.0 μm or less. It is particularly preferable that the diameter is not more than 8 μm. When the standard deviation of the diameter of the island portion is 1.5 μm or less, the emission intensity of the wavelength conversion member tends to be more excellent.

The lower limit of the standard deviation of the diameter of the island is not particularly limited, but is preferably 0.1 μm or more, more preferably 0.2 μm or more, and more preferably 0.3 μm or more from the viewpoint of the production efficiency of the wavelength conversion member. It is further preferred that

In the wavelength conversion member according to the present embodiment, the diameter of the island portion is preferably 5.0 μm or less, more preferably 4.0 μm or less, still more preferably 3.0 μm or less, and 2.5 μm or less Is particularly preferred. When the diameter of the island portion is 5.0 μm or less, the emission intensity of the wavelength conversion member tends to be more excellent.

The lower limit of the diameter of the island portion is not particularly limited, but may be 0.3 μm or more, 0.5 μm or more, or 1.0 μm or more.

For example, the standard deviation of the diameter of the island and the diameter of the island can be controlled by adjusting the viscosity of the resin composition used for producing the wavelength conversion member. In addition, when preparing the resin composition, the standard deviation of the diameter of the island and the diameter of the island are controlled by changing the stirring conditions such as the number of rotations and the stirring time when mixing each component. May be

In the present disclosure, the diameter of the island portion is an arithmetic mean value of the diameters of 100 island portions selected indiscriminately when the wavelength conversion member is observed with an optical microscope.
Further, in the present disclosure, the standard deviation of the diameter of the island is a standard deviation obtained from the STDEV function using the diameter of the selected 100 islands.

An example of schematic structure of a wavelength conversion member is shown in FIG. However, the wavelength conversion member of the present disclosure is not limited to the configuration of FIG. 1. Further, the sizes of the resin cured product and the covering material in FIG. 1 are conceptual, and the relative relationship of the sizes is not limited thereto.

The wavelength conversion member 10 shown in FIG. 1 has a cured resin 11 in the form of a film and film- like covering materials 12A and 12B provided on both sides of the cured resin 11. The types and average thicknesses of the covering material 12A and the covering material 12B may be the same or different.

The wavelength conversion member having the configuration shown in FIG. 1 can be manufactured, for example, by the following method.

First, the above-mentioned resin composition is applied to the surface of the film-like covering material 12A (first base material) which is continuously conveyed, and a coating film (resin composition layer) is formed.

Subsequently, the film-like covering material 12B (second base material) which is continuously conveyed is pasted onto the coating film.

Next, the coating is cured by irradiating the coating material 12A and the coating material 12B with active energy radiation from the side of the coating material capable of transmitting active energy radiation, thereby forming a cured resin containing a gelled product. Thereafter, the wavelength conversion member having the configuration shown in FIG. 1 can be obtained by cutting out to a prescribed size.

In addition, when neither coating | covering material 12A nor coating | covering material 12B can permeate | transmit an active energy ray, before bonding together the coating | covering material 12B, an active energy ray may be irradiated to a coating film and resin cured material may be formed. .

[Backlight unit]
The backlight unit of the present disclosure includes the above-described wavelength conversion member of the present disclosure and a light source.

The backlight unit is preferably a multi-wavelength light source from the viewpoint of improving color reproducibility. In a preferred embodiment, it has an emission center wavelength in a wavelength range of 430 nm to 480 nm and blue light having an emission intensity peak having a half width of 100 nm or less and an emission center wavelength in a wavelength range of 520 nm to 560 nm. A back that emits green light having an emission intensity peak whose half width is 100 nm or less and red light having an emission center wavelength in the wavelength range of 600 nm to 680 nm and an emission intensity peak whose half width is 100 nm or less A light unit can be mentioned. The full width at half maximum of the emission intensity peak means a peak width at a half height of the peak height.

From the viewpoint of further improving color reproducibility, the emission center wavelength of blue light emitted by the backlight unit is preferably in the range of 440 nm to 475 nm. From the same point of view, the emission center wavelength of the green light emitted by the backlight unit is preferably in the range of 520 nm to 545 nm. From the same point of view, the emission center wavelength of red light emitted by the backlight unit is preferably in the range of 610 nm to 640 nm.

In addition, in order to further improve color reproducibility, the half-width of each of the light emission intensity peaks of blue light, green light and red light emitted by the backlight unit is preferably 80 nm or less, and 50 nm or less Some are more preferable, 40 nm or less is further preferable, 30 nm or less is particularly preferable, and 25 nm or less is very preferable.

As a light source of the backlight unit, for example, a light source which emits blue light having an emission center wavelength in a wavelength range of 430 nm to 480 nm can be used. Examples of the light source include an LED (Light Emitting Diode) and a laser. When a light source emitting blue light is used, the wavelength conversion member preferably includes at least a quantum dot phosphor R emitting red light and a quantum dot phosphor G emitting green light. Thereby, white light can be obtained from the red light and green light emitted from the wavelength conversion member and the blue light transmitted through the wavelength conversion member.

Further, as a light source of the backlight unit, for example, a light source which emits ultraviolet light having an emission center wavelength in a wavelength range of 300 nm to 430 nm can be used. The light source includes, for example, an LED and a laser. When a light source emitting ultraviolet light is used, the wavelength conversion member preferably includes the quantum dot phosphor R and the quantum dot phosphor G together with the quantum dot phosphor B which is excited by the excitation light and emits blue light. Thereby, white light can be obtained by the red light, the green light, and the blue light emitted from the wavelength conversion member.

The backlight unit of the present disclosure may be an edge light system or a direct system.

An example of a schematic configuration of the edge light type backlight unit is shown in FIG. However, the backlight unit of the present disclosure is not limited to the configuration of FIG. Further, the sizes of the members in FIG. 2 are conceptual, and the relative relationship between the sizes of the members is not limited thereto.

The backlight unit 20 shown in FIG. 2 includes a light source 21 for emitting the blue light L _B, a light guide plate 22 to be emitted guiding the blue light L _B emitted from the light source 21, the light guide plate 22 and disposed to face A retroreflective member 23 disposed opposite to the light guide plate 22 via the wavelength conversion member 10, and a reflector 24 disposed opposite to the wavelength conversion member 10 via the light guide plate 22. . The wavelength conversion member 10 emits red light L _R and green light L _G using a part of the blue light L _B as excitation light, and emits red light L _R and green light L _G and blue light L that has not become excitation light. Emit _B and. White light _LW is emitted from the retroreflective member 23 by the red light L _R , the green light L _G , and the blue light L _B.

[Image display device]
An image display device of the present disclosure includes the backlight unit of the present disclosure described above. It does not restrict | limit especially as an image display apparatus, For example, a liquid crystal display device is mentioned.

An example of a schematic configuration of the liquid crystal display device is shown in FIG. However, the liquid crystal display device of the present disclosure is not limited to the configuration of FIG. 3. Also, the sizes of the members in FIG. 3 are conceptual, and the relative relationship between the sizes of the members is not limited thereto.

The liquid crystal display device 30 shown in FIG. 3 includes a backlight unit 20 and a liquid crystal cell unit 31 disposed to face the backlight unit 20. The liquid crystal cell unit 31 is configured such that the liquid crystal cell 32 is disposed between the polarizing plate 33A and the polarizing plate 33B.

The driving method of the liquid crystal cell 32 is not particularly limited, and TN (Twisted Nematic) method, STN (Super Twisted Nematic) method, VA (Virtical Alignment) method, IPS (In-Place-Switching) method, OCB (Optically Compensated Birefringence) System etc.

[Resin composition for wavelength conversion member]
The resin composition for a wavelength conversion member of the present disclosure includes a quantum dot phosphor and a gelable dispersoid that contains the quantum dot phosphor. The resin composition for wavelength conversion members of this embodiment is used for manufacture of a wavelength conversion member.

In addition to the above-mentioned components, the resin composition for wavelength conversion members of this embodiment is an epoxy compound having two or more functions, a polyfunctional thiol compound, a (meth) allyl compound, a (meth) acrylic compound, a monofunctional thiol compound And a resin component such as an alkyleneoxy group-containing compound may be contained, and a photopolymerization initiator, a liquid medium, other components and the like may be contained.
The components that can be contained in the resin composition for wavelength conversion members of the present embodiment and the content thereof are the respective components that can be contained in the resin composition used in the method for producing a wavelength conversion member of the present disclosure described above, and the content thereof Since it is the same, the description is omitted.

[Cured resin]
The resin cured product of the present disclosure includes a gelled product obtained by curing the above-described resin composition for a wavelength conversion member and reacting the dispersoid. The conditions for curing the above-described resin composition for a wavelength conversion member, the preferable physical property values of the cured resin product, and the like are as described in the item of the method for producing a wavelength conversion member of the present disclosure described above.

EXAMPLES Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to these examples.

Synthesis Example 1
174.0 g of pentaerythritol tetrakis (3-mercaptopropionate) (Evans Chemetex, PEMP) is weighed into a reaction vessel equipped with a thermometer, a stirrer, a nitrogen inlet tube, and a vacuum pipe, and the rotation speed is 200 times The reaction vessel was depressurized using a vacuum pump while stirring at a rate of 1 minute and held for 30 minutes. Thereafter, 26.0 g of tris (2-acryloyloxyethyl) isocyanurate (Hitachi Chemical Co., Ltd., Funcryl FA-731A) dissolved in advance by heating at 55 ° C. to 65 ° C. was blended and stirred for 30 minutes. Subsequently, 0.25 g of triethylamine was added as a catalyst and allowed to react for 2 hours. The reaction was terminated by confirming that the absorption peak of acryloyl group disappeared by infrared spectrophotometric measurement to obtain a thioether oligomer (weight average molecular weight: 4600).

The weight average molecular weight is a value determined by conversion using gel permeation chromatography, using a calibration curve of standard polystyrene according to the following apparatus and measurement conditions. In preparation of a standard curve, five sample sets (PStQuick MP-H, PStQuick B (Tosoh Corp., trade name)) were used as standard polystyrene.
Device: High-speed GPC device HLC-8320GPC (Detector: Differential Refractometer) (Tosoh Corporation, trade name)
Solvent used: tetrahydrofuran (THF)
Column: Column TSKSEL SuperMultipore HZ-H (Tosoh Corporation, trade name)
Column size: Column length 15 cm, column inner diameter 4.6 mm
Measurement temperature: 40 ° C
Flow rate: 0.35 mL / min Sample concentration: 10 mg / THF 5 mL
Injection volume: 20 μL

Examples 1 to 4 and Comparative Examples 1 to 3
(Preparation of resin composition for wavelength conversion member)
The resin compositions for wavelength conversion members of Examples 1 to 4 and Comparative Examples 1 to 3 were prepared by mixing the components shown in Table 1 in the blending amounts (unit: part by mass) shown in the same table. "-" In Table 1 means unblended.
In addition, as a (meth) allyl compound, triallyl isocyanurate (Nippon Kasei Co., Ltd., Taik) was used. Also, as the epoxy compound, hydrogenated bisphenol A type diglycidyl ether (Epolite 4000 manufactured by Kyoeisha Chemical Co., Ltd.), bisphenol A type PO 2 mol adduct diglycidyl ether (Kyoeisha Chemical Co., Ltd. Epolite 3002 (N)) and C12, 13 mixed Higher alcohol glycidyl ether epolite (Kyoeisha Chemical Co., Ltd. M-1230) was used. Further, as a photopolymerization initiator, 2,4,6-trimethyl benzoyl diphenyl phosphine oxide (Sort, SB-PI 718) was used. As a quantum dot fluorescent substance, CdSe / ZnS (core / shell) dispersion (manufactured by Nanosys, Gen2 QD Concentrate, dispersoid: amino-modified silicone) was used.

More specifically, a composition containing a thioether oligomer and a CdSe / ZnS (core / shell) dispersion, a (meth) allyl compound, an epoxy compound, and a composition containing a photopolymerization initiator are mixed. Thus, a resin composition for wavelength conversion member is prepared. Therefore, when curing the resin composition for wavelength conversion members as will be described later, it is presumed that a part of the mixed epoxy compound reacts with the amino-modified silicone in the dispersion liquid to form a gelled product.

(Manufacturing of wavelength conversion member)
Each curable composition obtained above was each apply | coated on the 120-micrometer-thick barrier film (Dainippon Printing Co., Ltd., FF1 CM) which is a coating material, and the coating film was formed. A 120 μm thick barrier film (Dainippon Printing Co., Ltd., FF1 CM), which is a covering material, is pasted onto this coating film, and the coating film is irradiated with ultraviolet light (irradiation amount: By performing 1000 mJ / cm < ² >, the wavelength conversion member by which the coating material was arrange | positioned on both surfaces of the resin cured material was obtained, respectively.

(Confirmation of gelation)
After the wavelength conversion member obtained in Examples 1 to 4 is thinly cut out with a microtome, when observed with a transmission electron microscope, the reactant does not flow out from the cross section, and the reactant in the wavelength conversion member is not It was confirmed that the reaction product of the dispersoid was a gelled product because the shape was deformed when touching the area including the area with tweezers.
On the other hand, after the wavelength conversion members obtained in Comparative Examples 1 to 3 were thinly cut out with a microtome, when observed with a transmission electron microscope, those flowing out of the cross section were observed.

<Evaluation>
About each wavelength conversion member obtained above, measurement and evaluation of each item shown below were carried out.
The results are shown in Table 2.

(Moisture resistant)
After cutting each wavelength conversion member obtained above into a dimension of width 100 mm and length 100 mm, it is put into a constant temperature and humidity chamber at 65 ° C. and 95% RH (relative humidity) and allowed to stand for 500 hours. According to the equation, the Rec2020 coverage retention ratio of the wavelength conversion member was calculated.
Rec2020 Cover ratio retention rate: (RLa-RLb)
RLa: Initial Rec2020 cover rate (%)
RLb: Rec 2020 coverage (%) after 65 ° C 95% RH x 500 hours
And according to the following evaluation criteria, the heat-and-moisture resistance of each wavelength conversion member was evaluated.
-Evaluation criteria-
A: Rec2020 coverage retention rate: less than 1% B: Rec2020 coverage retention rate: 1% or more and less than 5% C: Rec2020 coverage retention rate: 5% or more

As can be seen from Table 2, the wavelength conversion members in Examples 1 to 4 were superior in moisture and heat resistance as compared with the wavelength conversion members of Comparative Examples 1 to 3.

All documents, patent applications, and technical standards described herein are as specific and distinct as when individual documents, patent applications, and technical standards are incorporated by reference. Incorporated herein by reference.

Claims (31)

1. Providing a resin composition comprising a quantum dot phosphor and a gelable dispersoid;
   Forming a resin composition layer using the resin composition;
   Curing the resin composition layer to obtain a cured resin product,
   The manufacturing method of the wavelength conversion member which the said dispersoid which includes the said quantum dot fluorescent substance in the said resin composition is disperse | distributed, and the said resin cured material contains the gelatinization which the said dispersoid reacts.
2. The method for producing a wavelength conversion member according to claim 1, wherein the gelable dispersoid comprises a modified silicone.
3. The method for producing a wavelength conversion member according to claim 2, wherein the modified silicone comprises an amino-modified silicone.
4. The resin composition comprises a difunctional or higher epoxy compound,
   The wavelength conversion member according to claim 3, wherein a ratio (epoxy equivalent / amine equivalent) of an amine equivalent of the amino-modified silicone and an epoxy equivalent of the difunctional or higher epoxy compound is 0.01 to 70.0. Production method.
5. The method for producing a wavelength conversion member according to any one of claims 1 to 3, wherein the resin composition contains an epoxy compound having two or more functional groups.
6. The method for producing a wavelength conversion member according to claim 4, wherein the difunctional or higher epoxy compound has at least one of a bisphenol structure and a hydrogenated bisphenol structure.
7. The method for producing a wavelength conversion member according to any one of claims 1 to 6, wherein the glass transition temperature of the cured resin product measured by dynamic viscoelasticity measurement under conditions of a frequency of 10 Hz is 40 属 C or higher.
8. The method for producing a wavelength conversion member according to any one of claims 1 to 7, wherein the quantum dot phosphor contains a compound containing at least one of Cd and In.
9. The method for producing a wavelength conversion member according to any one of claims 1 to 8, wherein the resin composition contains a polyfunctional thiol compound and a (meth) allyl compound.
10. The step of forming the resin composition layer is a step of applying the resin composition on a first substrate to form the resin composition layer,
    10. The method according to claim 1, further comprising the step of providing a second base on the side opposite to the side on which the first base is provided in the resin composition layer before the step of obtaining the cured resin product. The manufacturing method of the wavelength conversion member of any one of these.
11. It has a cured resin that has a sea-island structure including the sea area and the island area,
    The wavelength conversion member, wherein the island portion is a gelled material including a quantum dot phosphor.
12. The wavelength conversion member according to claim 11, wherein the resin cured product has a structure derived from each of a polyfunctional thiol compound, a (meth) allyl compound, a modified silicone, and a difunctional or more epoxy compound.
13. The wavelength conversion member according to claim 12, wherein the modified silicone comprises an amino-modified silicone.
14. The wavelength conversion member according to claim 13, wherein the ratio of the amine equivalent of the amino-modified silicone to the epoxy equivalent of the difunctional or higher epoxy compound (epoxy equivalent / amine equivalent) is 0.01 to 70.0.
15. The wavelength conversion member according to any one of claims 12 to 14, wherein the difunctional or higher epoxy compound has at least one of a bisphenol structure and a hydrogenated bisphenol structure.
16. The wavelength conversion member according to any one of claims 11 to 15, wherein the glass transition temperature of the cured resin product measured by dynamic viscoelasticity measurement under the condition of frequency 10 Hz is 40 属 C or higher.
17. The wavelength conversion member according to any one of claims 11 to 16, wherein the quantum dot phosphor contains a compound containing at least one of Cd and In.
18. Equipped with a covering
    The wavelength conversion member according to any one of claims 11 to 17, wherein at least a part of the cured resin is covered by the covering material.
19. The wavelength conversion member according to claim 18, wherein the covering material has a barrier property to at least one of oxygen and water.
20. A backlight unit comprising the wavelength conversion member according to any one of claims 11 to 19 and a light source.
21. An image display apparatus comprising the backlight unit according to claim 20.
22. A resin composition for a wavelength conversion member, which comprises a quantum dot phosphor and a gelable dispersoid containing the quantum dot phosphor.
23. The resin composition for a wavelength conversion member according to claim 22, wherein the gelable dispersoid comprises a modified silicone.
24. The resin composition for wavelength conversion members according to claim 23, wherein the modified silicone comprises an amino-modified silicone.
25. Containing a bifunctional or higher epoxy compound,
    The resin for a wavelength conversion member according to claim 24, wherein the ratio of the amine equivalent of the amino-modified silicone to the epoxy equivalent of the difunctional or higher epoxy compound (epoxy equivalent / amine equivalent) is 0.01 to 70.0. Composition.
26. The resin composition for a wavelength conversion member according to any one of claims 22 to 24, comprising a difunctional or higher epoxy compound.
27. The resin composition for wavelength conversion members according to claim 25 or 26, wherein the difunctional or higher epoxy compound has at least one of a bisphenol structure and a hydrogenated bisphenol structure.
28. The resin composition for a wavelength conversion member according to any one of claims 22 to 27, wherein the quantum dot phosphor contains a compound containing at least one of Cd and In.
29. The resin composition for a wavelength conversion member according to any one of claims 22 to 28, comprising a polyfunctional thiol compound and a (meth) allyl compound.
30. A resin cured product comprising a gelled product obtained by curing the resin composition for a wavelength conversion member according to any one of claims 22 to 29 and reacting the dispersoid.
31. The resin cured material of Claim 30 whose glass transition temperature measured on the conditions of frequency 10 Hz by dynamic-viscoelasticity measurement is 40 degreeC or more.

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