WO2019062321A1 - Procédé de fabrication de logement, logement et dispositif électronique - Google Patents

Procédé de fabrication de logement, logement et dispositif électronique Download PDF

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Publication number
WO2019062321A1
WO2019062321A1 PCT/CN2018/098107 CN2018098107W WO2019062321A1 WO 2019062321 A1 WO2019062321 A1 WO 2019062321A1 CN 2018098107 W CN2018098107 W CN 2018098107W WO 2019062321 A1 WO2019062321 A1 WO 2019062321A1
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WO
WIPO (PCT)
Prior art keywords
paint layer
casing
housing
paint
layer
Prior art date
Application number
PCT/CN2018/098107
Other languages
English (en)
Chinese (zh)
Inventor
杨光明
孙文峰
袁于才
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019062321A1 publication Critical patent/WO2019062321A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/14—Producing integrally coloured layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/16—Pretreatment, e.g. desmutting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes

Definitions

  • the present application relates to the field of electronic device technologies, and in particular, to a housing manufacturing method, a housing, and an electronic device.
  • the raw materials for the preparation and processing of electronic devices are usually aluminum, and the commercially available aluminum materials cannot be directly used due to problems such as their own hardness.
  • the raw material aluminum material needs to be processed a plurality of times to form a desired shell structure.
  • the outer surface of the casing is easily adhered to the fingerprint.
  • the embodiment of the present application provides a method for manufacturing a casing, a casing, and an electronic device, which can reduce the fingerprint of the outer surface of the casing.
  • an embodiment of the present application provides a method for manufacturing a housing, where the housing is used in an electronic device, and the method for manufacturing the housing includes:
  • an embodiment of the present application further provides a housing that is applied to an electronic device, the housing includes opposite inner and outer surfaces, and the housing includes a concave-convex structure formed on the outer surface. And an oxide layer formed on the uneven structure, the paint layer being formed on the oxide layer.
  • an embodiment of the present application further provides an electronic device including a housing, the housing includes an opposite inner surface and an outer surface, and the housing includes a concave-convex structure formed on the outer surface, An oxide layer and a paint layer, the oxide layer being formed on the relief structure, the paint layer being formed on the oxide layer.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a back cover according to an embodiment of the present application.
  • Figure 4 is a cross-sectional view of Figure 3 in the A-A direction.
  • Figure 5 is another cross-sectional view of Figure 3 in the A-A direction.
  • Figure 6 is another cross-sectional view of Figure 3 in the A-A direction.
  • Figure 7 is another cross-sectional view of Figure 3 in the A-A direction.
  • Figure 8 is another cross-sectional view of Figure 3 in the A-A direction.
  • Figure 9 is another cross-sectional view of Figure 3 in the A-A direction.
  • FIG. 10 is another schematic structural diagram of a housing according to an embodiment of the present application.
  • FIG. 11 is another schematic structural diagram of a back cover according to an embodiment of the present application.
  • FIG. 12 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 13 is a schematic flow chart of a method for manufacturing a back cover according to an embodiment of the present application.
  • FIG. 14 is a schematic flow chart of a painting process provided by an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • connection In the description of the present application, it should be noted that the terms “installation”, “connected”, and “connected” are to be understood broadly, and may be fixed or detachable, for example, unless otherwise specifically defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • Connected, or integrally connected may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
  • the embodiment of the present application provides a housing manufacturing method, a housing, and an electronic device. The details will be described separately below.
  • the housing manufacturing method can form a housing, and the housing can be disposed in an electronic device, such as a mobile phone, a tablet computer, or a personal computer (Personal Digital Assistant, PDA) and so on.
  • PDA Personal Digital Assistant
  • An embodiment of the present application provides an electronic device, including a housing, the housing includes opposite inner and outer surfaces, and the housing includes a concave-convex structure and an oxide layer formed on the outer surface. And a paint layer, the oxide layer is formed on the uneven structure, and the paint layer is formed on the oxide layer.
  • the paint layer includes a first paint layer formed on the oxide layer and a second paint layer formed on the first paint layer .
  • the first paint layer and the second paint layer have at least one layer of transparent placement.
  • the thickness of the second paint layer is greater than the thickness of the first paint layer.
  • the paint layer is transparently disposed.
  • FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device 1 includes a housing 10, a display screen 20, a printed circuit board 30, and a battery 40.
  • FIG. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.
  • the housing 10 can include a cover plate 11, a middle frame 12 and a rear cover 13, and the cover plate 11, the middle frame 12 and the rear cover 13 are combined with each other to form the housing 10, and the housing 10 has a cover plate 11 and a middle portion thereof.
  • the sealed space formed by the frame 12 and the rear cover 13 accommodates the display 20, the printed circuit board 30, the battery 40, and the like.
  • the cover 11 is covered to the middle frame 12, the rear cover 13 is covered to the middle frame 12, and the cover 11 and the rear cover 13 are located on opposite sides of the middle frame 12, and the cover 11 and the rear cover 13 are provided.
  • the sealed space of the casing 10 is located between the cover 11 and the rear cover 13.
  • the cover 11 can be a transparent glass cover.
  • the cover 11 can be a cover glass made of a material such as sapphire.
  • the middle frame 12 may be a metal casing, such as an aluminum alloy middle frame 12. It should be noted that the material of the frame 12 in the embodiment of the present application is not limited thereto, and other methods may be used.
  • the middle frame 12 may be a ceramic middle frame or a glass middle frame.
  • the middle frame 12 can be a plastic middle frame.
  • the middle frame 12 can be a structure in which metal and plastic cooperate with each other, and the plastic part can be formed by injection molding onto a metal plate.
  • the back cover 13 can be a metal back cover, such as an aluminum alloy back cover.
  • FIG. 3 is a schematic structural diagram of a back cover according to an embodiment of the present application.
  • the rear cover 13 may include an opposite inner surface 131 and an outer surface 132.
  • the inner surface 131 of the rear cover 13 is adjacent to the middle frame 12 and the cover 11 to form an inner surface of the housing 10, and the outer surface 132 of the rear cover 13
  • the outer surface of the casing 10 is formed away from the middle frame 12 and the cover plate 11.
  • the rear cover 13 may also include a crater 133 that can mount a camera.
  • FIG. 4 is a cross-sectional view of FIG. 3 in the A-A direction.
  • the back cover 13a may include a back cover substrate 137, an oxide layer 134, and a paint layer 136.
  • the back cover substrate 137 may be made of an aluminum material such as an aluminum alloy.
  • the back cover substrate 137 includes an inner surface 131 and an outer surface 132.
  • the inner surface of the back cover substrate 137 can be understood as the inner surface of the back cover 13, and the outer surface of the back cover substrate 137 can be understood as the back cover is not oxidized and painted. Wait for the outer surface before.
  • the oxide layer 134 is formed on the outer surface 132 of the back cover substrate 137.
  • the oxide layer 134 can form an oxide layer 134 by one oxidation.
  • monochromatic oxidation forms the oxide layer 134, and specifically can be formed by coloring after an oxidation process. It should be noted that, in some embodiments, it is also possible to form a multilayer oxide layer by two oxidations or two or more oxidations.
  • FIG. 5 is another cross-sectional view of FIG. 3 in the A-A direction. 5 differs from FIG. 4 in that the oxide layer 134 of the back cover 13b includes two layers, a first oxide layer 1341 and a second oxide layer 1342.
  • the first oxide layer 1341 is formed on the outer surface 132 of the back cover substrate 137
  • the second oxide layer 1342 is formed on the first oxide layer 1341.
  • the second oxide layer may cover only the first oxide layer. Part of it.
  • the first oxide layer 1341 and the second oxide layer 1342 may increase the bonding force with the paint layer 136. Among them, the multilayer structure of the oxide layer will not be exemplified herein.
  • the first oxide layer may be a colored oxide layer and the second oxide layer may also be a colored oxide layer.
  • the color of the first oxide layer may be different from the color of the second oxide layer or may be the same.
  • the paint layer 136 is formed on the oxide layer 134, and the oxide layer 134 is located between the paint layer 136 and the back cover substrate 137.
  • the paint layer 136 can be formed by spraying a layer of paint over the oxide layer 134.
  • the paint layer 136 is located at the outermost layer of the outer surface of the back cover 13, and the surface thereof is smooth and flat, and it is not easy to adhere to the fingerprint, and the outer surface of the back cover can be kept clean and smooth.
  • FIG. 6 is another cross-sectional view of FIG. 3 in the A-A direction. 6 differs from FIG. 4 in that the paint layer 136 of the back cover 13c includes a first paint layer 1361 and a second paint layer 1362.
  • the first paint layer 1361 is formed on the oxide layer 134
  • the second paint layer 1362 is formed on the first paint layer 1361.
  • the thickness of the second paint layer 1362 is greater than the thickness of the first paint layer 1361.
  • the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, such as the second paint layer 1362.
  • the thickness of the first paint layer 1361 is 5 um. It should also be noted that the second paint layer 1362 and the first paint layer 1361 may have certain error values during the production process, such as an error value of 0.5 um. The thickness of the second paint layer and the first paint layer provides better protection to the outer surface of the back cover and allows for closer bonding between the two paint layers.
  • FIG. 7 is another cross-sectional view of FIG. 3 in the A-A direction. 7 differs from FIG. 4 in that the paint layer 136 of the back cover 13d includes a first paint layer 1361, a second paint layer 1362, and a third paint layer 1363.
  • the first paint layer 1361 is formed on an oxide layer 134 formed on the first paint layer 1361
  • the third paint layer 1363 is formed on the second paint layer 1362. Forming two or three layers of paint on the oxide layer 134 can increase the bonding force between the oxide layer and the paint layer, and the protection effect on the back cover is better.
  • the third paint layer 1363 has a greater thickness than the second paint layer 1362, and the second paint layer 1362 has a greater thickness than the first paint layer 1361. Further, the thickness of the third paint layer 1363 is twice the thickness of the second paint layer 1362, and the thickness of the second paint layer 1362 is twice the thickness of the first paint layer 1361, such as the thickness of the third paint layer 1363. 8um, the second paint layer 1362 has a thickness of 4um, and the first paint layer 1361 has a thickness of 2um.
  • the thicknesses of the third paint layer 1363, the second paint layer 1362, and the first paint layer 1361 are sequentially reduced in thickness, such as a thickness of 9 um for the third paint layer 1363 and a thickness of 6 um for the second paint layer 1362.
  • the first paint layer 1361 has a thickness of 3 um.
  • the third paint layer, the second paint layer, and the first paint layer thickness are provided to provide better protection to the outer surface of the back cover and to make the three layers of paint layer more closely bonded.
  • the paint layer can be disposed transparently. It should be noted that when the paint layer is at least two layers, at least one of the paint layers may be transparently disposed. Further, all paint layers are transparent.
  • the cover oxide layer is the color of the outer surface of the back cover.
  • FIG. 8 is another cross-sectional view of FIG. 4 in the A-A direction. 8 is different from FIG. 4 in that the back cover 13e may further include a bonding layer 135.
  • the bonding layer 135 is formed on the oxide layer 134, and the paint layer 136 is formed on the bonding layer 135.
  • the bonding layer 135 may be formed on the oxide layer 134 by means of PVD (Physical Vapor Deposition).
  • the bonding layer 135 is located between the oxide layer 134 and the paint layer 136 to increase the bonding force between the oxide layer 134 and the paint layer 136. It should be noted that, in other embodiments, the bonding layer may be formed on the oxide layer to increase the bonding force between the oxide layer and the paint layer.
  • FIG. 9 is another cross-sectional view of FIG. 4 in the AA direction, and FIG. 9 is different from FIG. 4 in that the rear cover 13f has an uneven structure 1371 formed on the outer surface of the back cover substrate 137.
  • the concave-convex structure 1371 can be formed by sandblasting by a sand blasting machine, so that the outer surface of the back cover substrate 137 is clean and rough, and the bonding force between the oxide layer 134 and the paint layer 136 formed on the uneven structure 1371 can be increased.
  • the structure of the back cover is not limited thereto.
  • the back cover may include two or more oxide layers, two or more layers of paint layers.
  • the back cover may include two or more oxide layers, two or more layers of paint, and a bonding layer.
  • the back cover may include two or more oxide layers, two or more layers of paint, and a bonding layer. It should be noted that the change of the number of layers between the oxide layer, the bonding layer and the paint layer is within the protection scope of the embodiments of the present application, and will not be exemplified herein.
  • FIG. 10 is another schematic structural diagram of the housing provided by the embodiment of the present application.
  • the housing 10a shown in FIG. 10 includes a cover plate 16 and a rear cover 17.
  • the cover plate 16 is directly attached to the rear cover 17, and the cover plate 16 and the rear cover 17 are combined with each other to form the housing 10a having a closed space formed by the cover plate 16 and the rear cover 17.
  • the housing 10a does not include a middle frame, or the middle frame 12 and the rear cover 13 of FIG.
  • FIG. 11 is another schematic structural diagram of a back cover according to an embodiment of the present application.
  • the back cover 17 includes an inner surface 171 and an outer surface 172 that are disposed opposite each other to form the entire surface of the back cover 17.
  • the structure of each layer of the back cover 17 can be referred to the back cover 13, and details are not described herein.
  • the printed circuit board 30 is mounted in the casing 10.
  • the printed circuit board 30 can be a main board of the electronic device 1.
  • the printed circuit board 30 can be integrated with an antenna, a motor, a microphone, a camera, a light sensor, and a receiver. And functional components such as processors.
  • the printed circuit board 30 is secured within the housing 10.
  • the printed circuit board 30 can be screwed to the middle frame 12 by screws, or can be snapped onto the middle frame 12 by means of a snap. It should be noted that the manner in which the printed circuit board 30 of the embodiment of the present application is specifically fixed to the middle frame 12 is not limited thereto, and may be otherwise fixed, for example, by a buckle and a screw.
  • the battery 40 is mounted in the housing 10, and the battery 40 is electrically connected to the printed circuit board 30 to supply power to the electronic device 1.
  • the housing 10 can function as a battery cover for the battery 40.
  • the casing 10 covers the battery 40 to protect the battery 40.
  • the back cover 13 covers the battery 40 to protect the battery 40, and the battery 40 is damaged due to collision, dropping, or the like of the electronic device 1.
  • the display screen 20 is mounted in the housing 10, and the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1.
  • the display screen 20 includes a display area 14 and a non-display area 15.
  • the display area 14 can be used to display a screen of the electronic device 1 or for a user to perform touch manipulation or the like.
  • the top area of the non-display area 15 is provided with an opening for sound and light transmission, and a functional component such as a fingerprint module and a touch button can be disposed on the bottom of the non-display area 15.
  • the cover 11 is mounted on the display screen 20 to cover the display screen 20 to form the same display area and non-display area as the display screen 20. For details, refer to the display area and the non-display area of the display screen 20.
  • the structure of the display screen 20 is not limited thereto.
  • the display screen may be a full screen or a heterogeneous screen.
  • FIG. 12 is another schematic structural diagram of an electronic device according to an embodiment of the present application.
  • the electronic device in FIG. 12 differs from the electronic device in FIG. 1 in that the non-display area 15a is formed directly on the display screen 20a, such as in a non-display area 15a of the display screen 20a, to be disposed in a transparent structure so that the optical signal passes through. Or directly open a hole or a gap for light conduction in the non-display area of the display screen 20a, the front camera, the photoelectric sensor, etc.
  • the display area 14a is spread over the entire surface of the electronic device 1a. It should be noted that the device 10, the printed circuit board 30, and the battery 40 in the electronic device 1a can be referred to the above content, and details are not described herein again.
  • the embodiment of the present invention provides a method of manufacturing a housing, the housing being applied to an electronic device, wherein the manufacturing method of the housing includes:
  • the step of performing at least one painting process on the outer surface of the monochrome-oxidized shell comprises:
  • the outer surface of the casing after the monochromatic oxidation treatment is subjected to a painting process, and a paint layer is formed on the outer surface of the casing.
  • the method of manufacturing the shell further comprises:
  • the outer surface of the shell after the primary painting process is subjected to a baking treatment to form a paint layer on the outer surface of the casing.
  • the step of performing at least one painting process on the outer surface of the monochrome-oxidized shell comprises:
  • the outer surface of the shell after the monochromatic oxidation treatment is subjected to two painting treatments, and two paint layers are formed on the outer surface of the casing.
  • the step of performing two painting processes on the outer surface of the monochrome oxidation treated casing comprises:
  • a second baking treatment is performed on the outer surface of the second painted paint, and a second paint layer is formed on the outer surface of the casing, and the second paint layer is formed on the first paint layer.
  • the thickness of the second paint layer is greater than the thickness of the first paint layer.
  • the step of performing the first painting process on the outer surface of the monochrome oxidation treated casing comprises:
  • a transparent paint is sprayed on the outer surface of the shell after the monochromatic oxidation treatment.
  • the step of performing a second painting process on the outer surface of the shell after the first baking process comprises:
  • a transparent paint is sprayed on the outer surface of the shell after the first baking treatment.
  • the method of manufacturing the housing before the step of performing a polishing process on the outer surface of the housing, the method of manufacturing the housing further includes:
  • the step of performing a polishing process on the outer surface of the casing specifically includes:
  • the step of performing a monochromatic oxidation treatment on the outer surface of the blasted shell comprises:
  • the outer surface of the shell after the oxidation treatment is colored.
  • the method for manufacturing the casing may specifically include a method for manufacturing the back cover and a method for manufacturing the middle frame.
  • the following is a description of the method for manufacturing the cover of the present invention. It is to be understood that the method for manufacturing the cover of the embodiment of the present application is not limited to the back cover.
  • FIG. 13 is a schematic flowchart diagram of a method for manufacturing a back cover according to an embodiment of the present application.
  • the method for manufacturing the back cover includes the following steps:
  • a back cover is provided.
  • the back cover may be a metal material such as aluminum, and further, such as an aluminum alloy. It should be noted that the back cover can be directly purchased or processed for the sheet material, for example, forging and aging treatment of the aluminum alloy sheet.
  • the back cover may include opposite inner and outer surfaces.
  • the rear cover and its inner and outer surfaces may be referred to above, and details are not described herein.
  • step 102 the outer surface of the back cover is polished.
  • the outer surface of the back cover is made flat.
  • the outer surface of the back cover may be polished by mechanical, chemical, electrochemical or ultrasonic means.
  • the chemical polishing method is to regularly dissolve the outer surface of the back cover to achieve smooth and flat.
  • the electrochemical polishing method uses the outer surface of the back cover as an anode and the insoluble metal as a cathode, and the two electrodes are simultaneously immersed in the electrolytic cell to generate a selective anode solution by direct current, thereby increasing the brightness of the outer surface of the back cover.
  • the mechanical polishing method is to cut the outer surface of the back cover, so that the outer surface of the back cover is plastically deformed to remove the polished convex portion to obtain a smooth surface.
  • the ultrasonic polishing method is to place the back cover into the abrasive suspension and place it together in the ultrasonic field, and the abrasive is ground and polished on the surface of the workpiece by the vibration of the ultrasonic wave.
  • the outer surface of the back cover before the outer surface of the back cover is polished, the outer surface of the back cover may be polished, and then the outer surface of the back cover after polishing is polished to make the polishing effect better. , making the outer surface of the back cover more flat.
  • the sanding process can be understood as roughing before the polishing process. That is, the outer surface of the back cover may be first rough-polished, and then fine-polished to complete the polishing process.
  • step 103 the outer surface of the back cover after the buffing is sandblasted.
  • the outer surface of the back cover after the buffing is sandblasted to form a concave-convex structure on the outer surface of the back cover, which can increase the bonding force between the oxide layer and the paint layer.
  • the concave and convex structure can be referred to the above content, and details are not described herein again.
  • step 104 the outer surface of the back cover after the blasting is subjected to a monochromatic oxidation treatment.
  • the step 104 specifically includes: oxidizing the outer surface of the back cover after the sandblasting to form an oxide layer; and coloring the outer surface of the back cover after the oxidation treatment to form a back cover on the oxide layer The color of the outer surface.
  • the outer surface of the blasted back cover may be subjected to a monochromatic oxidation treatment to form an oxide layer, or an oxide film, and subjected to a coloring treatment after oxidation to form a desired appearance color.
  • a monochromatic oxidation treatment to form an oxide layer, or an oxide film
  • a coloring treatment after oxidation to form a desired appearance color.
  • the outer surface of the back cover after the blasting may be subjected to two or more oxidation treatments to form at least two oxide layers, which may be performed in one oxidation process.
  • the coloring treatment can also be carried out by oxidation treatment in each oxidation process to form a desired appearance color.
  • the protective effect of the outer surface of the back cover is better not only by two or more oxidation treatments, but also the bonding force of at least two layers formed after two or more of this oxidation is better with the paint layer.
  • step 105 at least one painting process is performed on the outer surface of the back cover after the monochromatic oxidation treatment, and at least one paint layer is formed on the outer surface of the back cover.
  • the at least one layer of paint is formed on the oxide layer.
  • the at least one layer of paint is located at the outermost layer of the outer surface of the back cover, and the surface thereof is smooth and flat, and the fingerprint is not easy to adhere, and the outer surface of the back cover can be kept clean and smooth.
  • a painting process may be performed on the oxide layer to form a layer of paint, or two or more paint processes may be performed on the oxide layer to form two or more layers of paint. It should be noted that when there is only one layer of the oxide layer, a painting process may be directly performed on the oxide layer to form a layer of paint, or two or more painting processes may be performed on the oxide layer to form two layers or Two or more layers of paint.
  • the outer surface of the back cover after the monochromatic oxidation treatment is subjected to at least one painting process may be baked at least once, and may be baked at a high temperature to be sprayed on the outer surface of the back cover.
  • the paint dries to form a layer of paint.
  • the baking temperature is 80 degrees
  • the baking time is 1 hour to bake the outer surface of the back cover.
  • one baking treatment can be performed after each painting process. The following is a description of the two painting processes as an example. Please refer to FIG. 14 , which is a schematic flowchart of the painting process provided by the embodiment of the present application.
  • the painting process includes:
  • step 1051 the outer surface of the back cover after the monochromatic oxidation treatment is subjected to a first painting process.
  • the first surface of the back cover after the oxidation treatment is sprayed for the first time, and the transparent paint is sprayed.
  • step 1052 the outer surface of the back cover after the first painting process is subjected to a first baking treatment to form a first paint layer on the outer surface of the back cover.
  • the first painting treatment and baking treatment can increase the bonding force between the oxide layer and the first spray paint.
  • step 1053 a second painting process is performed on the outer surface of the back cover after the first baking process.
  • a second painting treatment is performed on the outer surface of the back cover after the first baking treatment, and the transparent paint is sprayed.
  • step 1054 the outer surface of the back cover after the second painting process is subjected to a second baking treatment, the outer surface of the back cover forms a second paint layer, and the second paint layer is formed on the first paint layer.
  • the first paint layer and the second paint layer are both formed of a clear paint. It should be noted that it is also possible that one of the first paint layer and the second paint layer is a transparent paint layer.
  • the physical vapor deposition treatment may be performed on the outer surface of the back cover after the oxidation treatment to form a bonding layer, or a bonding film, on the outer surface of the back cover, specifically on the oxide layer.
  • the bonding layer can increase the bonding force between the oxide layer and the paint layer.
  • the method for manufacturing the back cover may sequentially form an uneven structure, at least one oxide layer, one layer or two or more layers of paint on the outer surface of the back cover, and the concave and convex structure and the oxide layer may be increased.
  • the combination of the paint layer and the paint layer is formed on the outermost surface of the outer surface of the back cover, and the surface thereof is bright and transparent, so that the surface thereof is smooth and flat, and the fingerprint is not easy to adhere, and the outer surface of the back cover can be kept clean.
  • the electronic device 1 does not constitute a limitation on the electronic device 1.
  • the electronic device 1 may include more or less components than those illustrated, or some components may be combined, or different component arrangements.
  • the electronic device 1 may further include a memory, a Bluetooth module, and the like, and details are not described herein again.

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  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Selon un mode de réalisation, la présente invention concerne un procédé de fabrication de logement, un logement et un dispositif électronique, le procédé de fabrication de logement consistant : à réaliser un logement, à polir une surface extérieure du logement, et à sabler la surface extérieure polie du logement ; à procéder à une oxydation monochromatique de la surface extérieure sablée du logement, à pulvériser de la peinture sur la surface extérieure à oxydation monochromatique du logement au moins une fois, et à former au moins une couche de peinture sur la surface extérieure du logement.
PCT/CN2018/098107 2017-09-29 2018-08-01 Procédé de fabrication de logement, logement et dispositif électronique WO2019062321A1 (fr)

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