WO2019059459A1

WO2019059459A1 - Curing apparatus

Info

Publication number: WO2019059459A1
Application number: PCT/KR2017/014892
Authority: WO
Inventors: 강용훈; 이도원; 구교욱
Original assignee: 유버 주식회사
Priority date: 2017-09-20
Filing date: 2017-12-15
Publication date: 2019-03-28
Also published as: KR102337233B1; KR20190032902A

Abstract

Disclosed is a curing apparatus comprising: a housing having an accommodation part corresponding to an internal space, and an opening part formed to have an opened end portion; at least one light-emitting diode arranged in the accommodation part of the housing and providing a light source; a lens part corresponding to the opening part of the housing and arranged such that light generated by the light-emitting diode is incident thereto; and an optical sensor unit arranged in the accommodation part of the housing, corresponding to the light-emitting diode, and being spaced apart from the light-emitting diode so as to sense the light generated by the light-emitting diode.

Description

Hardening device

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a curing apparatus, and more particularly, to a curing apparatus that improves curing characteristics and improves stability.

A curing process for a flexible material is used at the time of manufacturing various electronic products or assembling machine parts.

For example, in manufacturing a mobile phone or a display device, a process of applying an adhesive such as resin and irradiating light as a curing process for the adhesive may be performed.

The light used at this time may be light of various wavelength ranges, for example, UV, that is, ultraviolet light.

Curing apparatuses for irradiating such light have been developed, and various types of light sources and various numbers of light sources are used in such apparatuses.

Control of light generated in such a light source provided in the curing apparatus is an important factor in the curing process, and it is necessary to control and stabilize such a light source.

However, there is a limitation in realizing a curing apparatus provided with a light source while ensuring desired characteristics and stability.

The present invention can provide a curing apparatus having improved curing characteristics and improved stability.

In this embodiment, the optical sensor unit may be disposed on one side of the inner surface of the housing portion of the housing.

In this embodiment, the light sensor unit may further include a circuit board on which the light emitting diode is disposed, and the light sensor unit may be disposed on one side of the circuit board.

In the present embodiment, the optical sensor unit includes a first fastening member, and the circuit board includes a second fastening member formed to correspond to the first fastening member, and the first fastening member and the second fastening member The optical sensor unit can be fixed to the circuit board through the through hole.

In the present embodiment, the optical sensor unit may include a plurality of optical sensor modules spaced apart from each other and an optical sensor circuit board formed to arrange the plurality of optical sensor modules.

In this embodiment, the optical sensor unit may further include a terminal unit disposed on a surface of the optical sensor circuit board opposite to a surface on which the optical sensor module is disposed.

In the present embodiment, the housing may further include a connection portion formed to correspond to the terminal portion, and the terminal portion may be formed to be connected to a connector disposed outside the housing through the connection portion.

In this embodiment, the cooling unit may further include a cooling unit disposed on an inner wall of the housing so as to be spaced apart from the housing of the housing.

In the present embodiment, the cooling section includes a cooling passage in the form of a passage formed in the inner wall of the housing and a cooling member formed to pass through the cooling passage, and the cooling passage may be disposed to face the photosensor section.

In the present embodiment, when the plurality of light emitting diodes are provided and arranged along one direction, the cooling passage may be formed to have a shape elongated along one direction in which the light emitting diodes are arranged.

In this embodiment, the light emitting diode further includes a base portion configured to dispose the light emitting diode. One region of the base portion may be covered by the housing, and another region of the base portion may be exposed without being covered with the housing.

The curing apparatus according to the present invention can improve the curing characteristics and easily improve the stability.

1 is a schematic cross-sectional view showing a curing apparatus according to an embodiment of the present invention.

2 is a schematic perspective view showing a curing apparatus according to another embodiment of the present invention.

Fig. 3 is a schematic perspective view showing the curing apparatus of Fig. 2; Fig.

4 is a cross-sectional view taken along the line IV-IV in FIG.

FIGS. 5A to 5D are schematic views sequentially illustrating the assembling process of the curing apparatus of FIG. 2. FIG.

6 is a schematic perspective view showing a curing apparatus according to another embodiment of the present invention.

FIGS. 7A and 7B are schematic views sequentially illustrating the assembling process of the curing apparatus of FIG.

8 is a schematic cross-sectional view showing a curing apparatus according to another embodiment of the present invention.

Fig. 9 is a perspective view schematically showing the curing apparatus of Fig. 8; Fig.

10 is a schematic view for explaining control of a curing apparatus according to an embodiment of the present invention.

11 is a view schematically showing a modification of the controller of Fig.

[Reference Numerals]

100, 200, 300, 400: Curing device

110, 210, 310, 410: housing

120, 220, 320, 420: light emitting diodes

140, 240, 340, 440: Light sensor

160, 260, 360, and 460:

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present invention and methods of achieving them will be apparent with reference to the embodiments described in detail below with reference to the drawings. However, the present invention is not limited to the embodiments described below, but may be implemented in various forms.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, wherein like reference numerals refer to like or corresponding components throughout the drawings, and a duplicate description thereof will be omitted .

In the following embodiments, the terms first, second, and the like are used for the purpose of distinguishing one element from another element, not the limitative meaning.

In the following examples, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise.

In the following embodiments, terms such as inclusive or possessive are intended to mean that a feature, or element, described in the specification is present, and does not preclude the possibility that one or more other features or elements may be added.

In the drawings, components may be exaggerated or reduced in size for convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to those shown in the drawings.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

If certain embodiments are otherwise feasible, the particular process sequence may be performed differently from the sequence described. For example, two processes that are described in succession may be performed substantially concurrently, and may be performed in the reverse order of the order described.

Referring to FIG. 1, the curing apparatus 100 of the present embodiment may include a housing 110, a light emitting diode 120, a circuit board 130, a photosensor unit 140, and a lens unit 160.

The housing 110 may include a receiving portion 115. The inside of the housing 110 may be partially removed so that the light emitting diode 120 and the optical sensor unit 140 are accommodated in the housing part 115. [

The housing 110 includes an opening 116 and the lens unit 160 may be disposed so as to correspond to the opening 116. [

The opening 116 is formed to be connected to a space in which the lens unit 160 is disposed, and may be linearly formed. The opening 116 and the receiving portion 115 may be formed to be connected to each other.

The light emitting diodes 120 may be disposed as one or more light sources for generating light, and may be arranged as a plurality of alternative embodiments. As a specific example, a plurality of them may be provided apart from each other along one direction.

The light emitting diode 120 may be in various forms and may emit ultraviolet light.

The circuit board 130 is arranged to correspond to the light emitting diodes 120. The light emitting diodes 120 may be disposed on the circuit board 130. In a case where a plurality of light emitting diodes 120 are provided as an alternative embodiment And may be disposed on one side of the circuit board 130 so as to be arranged along one direction on the circuit board 130.

As a specific example, the light emitting diode 120 may be disposed in the receiving portion 115 of the housing 110 while being disposed on the circuit board 130.

The optical sensor unit 140 may be disposed in the receiving portion 115 of the housing 110 to sense the light emitted from the LED 120.

When a plurality of light emitting diodes 120 are provided as an alternative embodiment, a plurality of optical sensor units 140 may be provided.

The light sensor unit 140 may be disposed adjacent to the light emitting diode 120 to be spaced apart from the light emitting diode 120 to sense the light emitted from the light emitting diode 120.

The optical sensor unit 140 may not be positioned between the light emitting diode 120 and the lens unit 160 so that the light generated by the light emitting diode 120 is effectively transmitted to the lens unit 160, It is possible to reduce or prevent the restriction of the transmission of light from the lens unit 160 from the light source 120. [

The lens unit 160 is disposed in the housing 110 so that light is incident on the light emitting diode 120 and the light emitted from the light emitting diode 120 is transmitted through the lens unit 160 to the housing 110 The openings 116 of the openings may correspond to the openings 116 of FIG.

The lens unit 160 improves efficiency of light in the light emitting diode 120, for example, can condense light.

The distance between the lens unit 160 and the housing 110 may be minimized or closely contacted so that the light generated from the LED 120 may be scattered or outflowed to the outside and concentrated to the lens unit 160.

As an alternative embodiment, the lens portion 160 may have a curved surface, and may have, for example, a circular cross-section.

The lens unit 160 may extend in a linearly elongated shape and may include a plurality of light emitting diodes 120. The lens unit 160 may include a light emitting diode 120, May be provided in a plurality of lengths extending along the direction in which they are arranged.

Also, as an alternative embodiment, the lens unit 160 and the LED 120 may be eccentrically disposed at one side with respect to the center line of the overall width of the curing apparatus 100. [

The curing apparatus 100 according to the present embodiment includes a light emitting diode 120 disposed in a receiving portion 115 of the housing 110 and a light generated in the light emitting diode 120 is condensed through the lens portion 160, It can be easily entered into a workpiece desired to be cured. Through this, concentrated and efficient irradiation of light can proceed and the efficiency of the UV curing process can be improved.

The light sensor unit 140 may be disposed in the receiving part 115 to sense light generated in the light emitting diode 120 during UV curing to facilitate control of light generated in the light emitting diode 120. At this time, it is not necessary to dispose the substrate or the module for installing the optical sensor unit 140 on the outside of the housing 110 with the optical sensor unit 140 in the housing part 115 of the housing 110 Damage or breakage of the optical sensor unit 140 can be detected, and the process of installing the optical sensor unit 140 can be facilitated.

FIG. 2 is a schematic perspective view showing a curing apparatus according to another embodiment of the present invention, FIG. 3 is a schematic perspective view showing a curing apparatus of FIG. 2, and FIG. 4 is a cross-sectional view taken along the line IV- It is a cross section cut.

2 to 4, the curing apparatus 200 of the present embodiment includes a housing 210, a light emitting diode 220, a circuit board 230, an optical sensor unit 240, a lens unit 260, 270).

The housing 210 may include a receiving portion 215. The inside of the housing 210 may be partially removed so that the light emitting diode 220 and the optical sensor unit 240 are received in the receiving part 215.

The housing 210 includes the opening 216 and the lens portion 260 may be disposed so as to correspond to the opening 216.

The opening 216 is formed to be connected to the space where the lens unit 260 is disposed, and may be linearly formed. The opening 216 and the receiving portion 215 may be formed to be connected to each other.

The light emitting diodes 220 may be disposed as one or more light sources for generating light, and may be provided in a plurality of spaced apart from each other along one direction as shown in FIG.

The circuit board 230 is disposed to correspond to the light emitting diode 220. The light emitting diode 220 may be disposed on the circuit board 230 and the plurality of light emitting diodes 220 may be arranged along one direction. And may be disposed on one side of the substrate 230.

As a specific example, the light emitting diode 220 may be disposed in the receiving portion 215 of the housing 210 while being disposed on the circuit board 230.

The optical sensor unit 240 may be disposed in the receiving portion 215 of the housing 210 to sense the light emitted from the light emitting diode 220.

Specifically, the optical sensor unit 240 may include a plurality of optical sensor modules 241 and an optical sensor circuit board 242.

The optical sensor unit 240 may be disposed adjacent to the light emitting diode 220 and spaced apart from the light emitting diode 220 to sense the light emitted from the light emitting diode 220.

The optical sensor unit 240 may not be positioned between the light emitting diode 220 and the lens unit 260 so that the light generated by the light emitting diode 220 is effectively transmitted to the lens unit 260, It is possible to reduce or prevent the restriction of the light transmission from the lens unit 260 to the lens unit 260.

The optical sensor circuit board 242 of the optical sensor unit 240 is separated from the light emitting diode 220 on one surface of the circuit board 230 on which the light emitting diode 220 is disposed, As shown in FIG. The plurality of light emitting diodes 220 may be spaced apart from the light emitting diodes 220 and disposed to face the light emitting diodes 220 on the optical sensor circuit board 242.

As an alternative embodiment, the terminal portion 243 may be disposed on the back surface of the optical sensor circuit board 230, that is, the surface opposite to the surface on which the optical sensor module 241 is disposed. An electrical signal can be applied or communicated to the optical sensor module 241 through the terminal portion 243. [

The terminal portion 243 may be connected to a connection portion 263 formed in the housing 210 and connected to an external member or a connector 280 to be described later.

The lens unit 260 is disposed in the housing 210 so that the light is incident on the light emitting diode 220 and the light emitted from the light emitting diode 220 is transmitted through the lens unit 260 to the housing 210 As shown in FIG.

The lens unit 260 improves the efficiency of light in the light emitting diode 220, for example, can condense light.

The distance between the lens unit 260 and the housing 210 may be minimized or closely contacted so that the light emitted from the light emitting diode 220 may be scattered or outflowed to the outside and focused on the lens unit 260.

As an alternative embodiment, the lens portion 260 may have a curved surface and may have, for example, a circular cross-section.

The lens unit 260 may extend in a linear shape and may include a plurality of light emitting diodes 220 arranged in one direction. The lens unit 260 may also include a light emitting diode 220, May be provided in a plurality of lengths extending along the direction in which they are arranged.

Further, as an alternative embodiment, the lens unit 260 and the light emitting diode 220 may be eccentrically disposed at one side with respect to the center line of the overall width of the curing apparatus 200.

The base portion 270 may be formed to dispose the light emitting diode 220 and the circuit board 230.

Specifically, the base portion 270 may include a body region 271 and a placement region 272 connected to the body region 271.

The above-described circuit board 230 may be disposed on the placement area 272. [ The housing 210 described above may also be disposed on the base portion 270 and, as an optional embodiment, may correspond to the placement region 272 and be disposed to cover the placement region 272. [ For example, the accommodation area 272 may correspond to the accommodation part 215 of the housing 210. [

As an alternative embodiment, body region 271 may be external to receptacle 215. For example, the body region 271 may be formed to be larger than the placement region 272 and include a side projected to the side of the placement region 272, and the end of the housing 210 may be in contact with the body region 271 have.

And may further include a mounting portion 290 as an alternative embodiment.

The mounting portion 290 is formed to place the curing device 200 in the work space and may include, for example, a supporting portion 291 and a coupling portion 292. The coupling portion 292 is connected to the support portion 291 and may have a bent shape from the support portion 291 and may be coupled to the base portion 270.

First, referring to FIG. 5A, a light emitting diode 220 is prepared. A circuit board 230 is disposed on one side of the base unit 270 and a plurality of light emitting diodes 220 are disposed on the circuit board 230.

Referring to FIG. 5B, a photosensor unit 240 is prepared. The optical sensor unit 240 includes a plurality of optical sensor modules 241 disposed along one direction on one surface of the optical sensor circuit board 242 and another surface of another optical sensor circuit board 242, And a terminal portion 243 disposed on the opposite side of one surface on which the sensor module 241 is disposed.

Referring to FIG. 5C, the optical sensor circuit board 242 is disposed on the circuit board 230. The optical sensor circuit board 242 can be fixed to the circuit board 230 by using various fastening members as an alternative embodiment.

Referring to FIG. 5D, a housing 210 and a lens unit 260 may be provided.

The connector 280 can be connected to the connection portion 263 formed on one side of the housing 210 as described above. One or more cables 285 are connected to the connector 280 so that a power or an electrical signal can be applied to the terminal portion 243 of the optical sensor unit 240.

The curing apparatus 200 according to the present embodiment includes a light emitting diode 220 disposed in a receiving portion 215 of the housing 210 and light generated in the light emitting diode 220 is condensed through the lens portion 260, It can be easily entered into a workpiece desired to be cured. Through this, concentrated and efficient irradiation of light can proceed and the efficiency of the UV curing process can be improved.

The light sensor unit 240 may be disposed in the receiving unit 215 to sense light generated in the light emitting diode 220 during UV curing to facilitate control of light generated in the light emitting diode 220. It is not necessary to dispose the substrate or module for installing the optical sensor unit 240 on the outside of the housing 210 with the optical sensor unit 240 in the housing 215 of the housing 210 Damage or breakage of the optical sensor unit 240 can be detected, and the process of installing the optical sensor unit 240 can be easily performed.

The circuit board 230 is disposed in one region of the base portion 270 such as the arrangement region 272 so that the accommodating portion 215 of the housing 210 corresponds to the circuit board 230 So that the light emitting diodes 220 and the optical sensor unit 240 can be stably arranged.

The body region 271 can facilitate handling of the curing apparatus 200 through the body region 271 by preventing the housing 210 from covering the body region 271. In addition, Can easily proceed.

6 is a schematic perspective view showing a curing apparatus according to another embodiment of the present invention. FIGS. 7A and 7B are schematic views sequentially illustrating the assembling process of the curing apparatus of FIG. Specifically, Fig. 6 is a schematic perspective view showing a curing apparatus.

6, 7A and 7B, the curing apparatus 300 of the present embodiment includes a housing 310, a light emitting diode 320, a circuit board 330, a photosensor unit 340, a lens unit 360, And may include a base portion 370.

For the sake of convenience of description, the description will be focused on the differences from the embodiments shown in Figs. 2 to 5B.

The housing 310 may include a receiving portion 315. The inside of the housing 310 may be partially removed so that the light emitting diode 320 and the optical sensor unit 340 are accommodated in the receiving portion 315. [ The housing 310 includes an opening 316 and the lens portion 360 may be disposed so as to correspond to the opening 316.

The light emitting diodes 320 may be provided as a plurality of light sources for generating light, which are spaced apart from each other.

The circuit board 330 is arranged to correspond to the light emitting diode 320 and may be disposed in the receiving portion 315 of the housing 310.

The optical sensor unit 340 may be disposed in the receiving portion 315 of the housing 310 to sense light emitted from the light emitting diode 320.

Specifically, the optical sensor unit 340 may include a plurality of optical sensor modules 341 and an optical sensor circuit board 342. And may include terminal portions (not shown) although not shown.

The lens unit 360 is disposed in the housing 310 so that light is incident on the light emitting diode 320 and the light emitted from the light emitting diode 320 is transmitted through the lens unit 360 to the housing 310 The openings 316 of the first and second openings 316a and 316b.

The base portion 370 may be formed to dispose the light emitting diode 320 and the circuit board 330.

Specifically, the base portion 370 may include a body region 371 and a placement region 372 connected to the body region 371.

The above-described circuit board 330 may be disposed on the placement area 372. [ The housing 310 described above may also be disposed in the base portion 370 and, as an alternative, may correspond to the placement region 372 and be disposed to cover the placement region 372. [ For example, the accommodation area 372 may correspond to the accommodation part 315 of the housing 310.

Although not shown, it may further include a mounting portion (not shown) as an alternative embodiment.

The mounting portion (not shown) is the same as that described in the above embodiment.

7A, the optical sensor unit 340 includes a plurality of optical sensor modules 341 arranged along one direction on one surface of the optical sensor circuit board 342 and another surface of the other optical sensor circuit board 342, for example, And a terminal portion 343 disposed on the opposite side of one surface on which the plurality of optical sensor modules 341 are disposed.

The optical sensor unit 340 is disposed on the circuit board 330, and can be disposed using a fastening member. For example, the optical sensor unit 340 may be a first fastening member 344, for example, an arm fastening member having a spatial region.

The circuit board 330 may be a second fastening member 334 corresponding to the first fastening member 344, for example, a protruding type of water-tightening member.

The second fastening member 334 is inserted into the first fastening member 344 so that the photosensor unit 340 can be easily fastened to the circuit board 330. [

That is, referring to FIG. 7B, the optical sensor unit 340 may be fastened to the circuit board 330 by applying a force to the circuit board 330 with respect to the height direction of the optical sensor circuit board 342.

As an alternative embodiment, the optical sensor circuit board 342 may be attached to the housing 310. For example, the optical sensor circuit board 342 can be attached to one surface of the housing portion 315 of the housing 310. Through the process of disposing the housing 310 on the base unit 370, the optical sensor unit 340 can be easily disposed at the same time without a separate assembly process.

The light emitting diode 320 is disposed in the receiving portion 315 of the housing 310 and the light emitted from the light emitting diode 320 is condensed through the lens portion 360. Thereafter, It can be easily entered into a workpiece desired to be cured. Through this, concentrated and efficient irradiation of light can proceed and the efficiency of the UV curing process can be improved.

The light sensor unit 340 may be disposed in the receiving part 315 to sense the light generated by the light emitting diode 320 during UV curing to facilitate control of the light generated by the light emitting diode 320. At this time, it is not necessary to dispose the substrate or module for installing the optical sensor unit 340 on the outside of the housing 310 by allowing the optical sensor unit 340 to be in the accommodating unit 315 of the housing 310 The damage and breakage of the optical sensor unit 340 can be detected and the process of installing the optical sensor unit 340 can be facilitated.

The circuit board 330 is arranged in one region of the base portion 370 such as the arrangement region 372 so that the accommodating portion 315 of the housing 310 corresponds to the circuit board 330 So that the light emitting diodes 320 and the optical sensor unit 340 can be stably arranged.

The body region 371 can facilitate handling of the curing apparatus 300 through the body region 371 by preventing the housing 310 from covering the body region 371. In addition, Can easily proceed.

The optical sensor unit 340 is connected to the circuit board 330 through the first fastening member 344 of the optical sensor unit 340 and the second fastening member 334 of the circuit board 330, So that it can be easily fastened to the substrate 330. A force is applied to the photosensor circuit board 342 by the circuit board 330 with reference to the height direction of the photosensor circuit board 342 by using the female fastening member having the space region and the male fastening member having the protruding region, So that the optical sensor unit 340 can be fastened to the circuit board 330.

The optical sensor unit 340 may be mounted on the base 310 by a process of disposing the optical sensor circuit board 342 on the base 310. In this case, Can be easily arranged at the same time.

FIG. 8 is a schematic cross-sectional view illustrating a curing apparatus according to another embodiment of the present invention, and FIG. 9 is a perspective view schematically showing the curing apparatus of FIG.

8 and 9, the curing apparatus 400 of the present embodiment includes a housing 410, a light emitting diode 420, a circuit board 430, a photosensor unit 440, a lens unit 460, and a cooling unit 450).

The housing 410 may include a receiving portion 415. The inside of the housing 410 may be partially removed so that the light emitting diode 420 and the optical sensor unit 440 are accommodated in the receiving part 415. [

The housing 410 includes the opening 416 and the lens portion 460 may be disposed so as to correspond to the opening 416. [

The opening 416 is formed to be connected to the space where the lens portion 460 is disposed, and may be linearly formed. The opening 416 and the receiving portion 415 may be formed to be connected to each other.

The light emitting diodes 420 may be disposed as one or more light sources for generating light, and may be provided in a plurality of spaced apart from each other along one direction.

The circuit board 430 is disposed to correspond to the light emitting diode 420. The light emitting diode 420 may be disposed on the circuit board 430 and the plurality of light emitting diodes 420 may be arranged along one direction. And may be disposed on one side of the substrate 430.

As a specific example, the light emitting diode 420 may be disposed in the receiving portion 415 of the housing 410 while being disposed on the circuit board 430.

The optical sensor unit 440 may be disposed in the receiving portion 415 of the housing 410 to sense the light emitted from the light emitting diode 420.

Although not shown, as an alternative embodiment, the optical sensor unit 440 may be configured such that a plurality of optical sensor modules arranged in one direction are disposed on the optical sensor circuit board.

In addition, as another alternative embodiment, the structure of the optical sensor unit of any one of the above-described embodiments is applicable, and for example, it may include a first fastening member (not shown).

The photosensor unit 440 may be disposed adjacent to the light emitting diode 420 and spaced apart from the light emitting diode 420 to sense the light emitted from the light emitting diode 420.

The lens unit 460 is disposed in the housing 410 so that light is incident on the light emitting diode 420 and the light emitted from the light emitting diode 420 is transmitted through the lens unit 460 to the housing 410 The openings 416 of the first and second openings may correspond to each other.

The lens unit 460 improves the efficiency of light in the light emitting diode 420, for example, can condense light.

Although not shown, it may include a base portion (not shown) described in the above embodiment as an alternative embodiment.

Further, as an alternative embodiment, it may further include a mounting portion (not shown) described in the above embodiment.

The cooling section 450 may include a cooling passage 451 and a cooling member 452.

The cooling passage 451 may extend in a passage-shaped space formed in the inner wall of the housing 410, for example, in one direction, and may be formed to be adjacent to the photosensor portion 440 as an alternative embodiment.

The cooling member 452 may be formed to pass through the cooling passage 451 to reduce or prevent the overheating of the photosensor unit 440, and may be, for example, a cooling fluid, a cooling water, or a cooling gas.

The cooling member 452 can move through the elongated cooling passage 451 to construct a cooling line as shown in Fig.

When the optical sensor unit 440 includes a plurality of optical sensor modules arranged in one direction, the cooling unit 450 may form a linear cooling line extended in one direction to correspond to the optical sensor unit.

The cooling passage 451 may be formed in the inner space of the side surface of the housing 410 and may be adjacent to the photosensor unit 440 without being exposed.

The curing apparatus 400 of the present embodiment is characterized in that the light emitting diode 420 is disposed in the receiving portion 415 of the housing 410 and the light emitted from the light emitting diode 420 is condensed through the lens portion 460, It can be easily entered into a workpiece desired to be cured. Through this, concentrated and efficient irradiation of light can proceed and the efficiency of the UV curing process can be improved.

In addition, the light sensor unit 440 may be disposed in the receiving part 415 to sense the light generated by the light emitting diode 420 during UV curing, thereby facilitating control of light generated in the light emitting diode 420. At this time, it is not necessary to dispose the substrate or module for installing the photosensor unit 440 on the outside of the housing 410 with the photosensor unit 440 in the accommodating unit 415 of the housing 410 Damage or breakage of the optical sensor unit 440 can be detected, and the process of installing the optical sensor unit 440 can be facilitated.

The cooling unit 450 may be formed in one area of the housing 410 and may be adjacent to the optical sensor unit 440 to reduce or prevent overheating of the optical sensor unit 440. Accordingly, it is possible to reduce or prevent the decrease in the sensing characteristics of the optical sensor unit 440, thereby ensuring accurate optical sensing characteristics.

FIG. 10 is a schematic view for explaining control of the curing apparatus according to an embodiment of the present invention, and FIG. 11 is a view schematically showing a variation of the controller of FIG.

Referring to FIG. 10, a control unit 600 and a controller 500 connected to a curing apparatus 200 through wire or wireless are disclosed for controlling the curing apparatus 200 of the present embodiment.

10, the curing apparatus 200 of the present embodiment includes a housing 210, a light emitting diode 220, a circuit board 230, an optical sensor unit 240, a lens unit 260, and a base 270 .

The curing apparatus 200 shown in Fig. 10 may be the same as the curing apparatus 200 in the embodiment shown in Fig.

Therefore, detailed description of the housing 210, the light emitting diode 220, the circuit board 230, the optical sensor unit 240, the lens unit 260, and the base unit 270 will be omitted.

In addition, as an alternative embodiment, any one of the above-described embodiments may be used instead of the curing apparatus 200 shown in Fig. For example, as in the embodiments of Figs. 8 and 9 described above.

The controller 600 may be a PC or a PLC, and may include a processor such as a CPU, a memory, an input / output interface, and the like.

The controller 500 may be formed to connect the control unit 600 and the curing unit 200. The controller 500 may be configured to perform real-time monitoring during operation of the light emitting diodes 220 provided in the curing apparatus 200.

Referring to FIG. 11, as a modification of the controller 500, the controller 500 'of FIG. 11 includes an interface module 510' and a dip switch 520 '.

Although the interface module 510 'and the dip switch 520' are shown as being separated from each other in FIG. 11, the controller 500 'is provided with the interface module 510' and the dip switch 520 ' And may have an integrated form.

11, the interface module 510 'includes a plurality of resistors, for example, six resistors R1, R2, R3, R4, R5, and R6 arranged in parallel, S3, S4, S5, S6). The first resistor S1 of the interface module 510 'can be selectively activated by activating the switch if necessary, that is, by operating the switch S1 through the dip switch 520'.

Accordingly, various resistances can be implemented by one interface module 510 ', so that even if the types of light emitting diodes 220 provided in the curing device 200 are changed, they can be easily controlled.

As a result, the control and monitoring of the curing apparatus 200 can be facilitated, and the curing efficiency and stability can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art . Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

The specific implementations described in the embodiments are, by way of example, not intended to limit the scope of the embodiments in any way. Also, unless explicitly mentioned, such as " essential ", " importantly ", etc., it may not be a necessary component for application of the present invention.

The use of the terms " above " and similar indication words in the description of the embodiments (in particular in the claims) may refer to both singular and plural. In addition, in the embodiment, when a range is described, it includes the invention to which the individual values belonging to the above range are applied (if there is no description to the contrary), the individual values constituting the above range are described in the detailed description . Finally, the steps may be performed in an appropriate order, unless explicitly stated or contrary to the description of the steps constituting the method according to the embodiment. The embodiments are not necessarily limited to the description order of the steps. The use of all examples or exemplary terms (e.g., etc.) in the examples is for the purpose of describing the embodiments in detail and is not intended to be limited by the scope of the claims, It is not. It will also be appreciated by those skilled in the art that various modifications, combinations, and alterations may be made depending on design criteria and factors within the scope of the appended claims or equivalents thereof.

Claims

A housing having a receiving portion corresponding to the inner space and an opening formed to open the end portion;

At least one light emitting diode disposed in the receiving portion of the housing and providing a light source;

A lens unit corresponding to an opening of the housing and arranged to allow light generated from the light emitting diode to enter;

And a photosensor disposed in the receiving portion of the housing and corresponding to the light emitting diode and spaced apart from the light emitting diode to detect light emitted from the light emitting diode.
The method according to claim 1,

Wherein the optical sensor unit is disposed on one side of the inner surface of the housing portion of the housing.
The method according to claim 1,

Further comprising a circuit board on which the light emitting diode is arranged,

Wherein the optical sensor unit is disposed on one surface of the circuit board.
The method of claim 3,

Wherein the optical sensor unit includes a first fastening member,

Wherein the circuit board includes a second fastening member formed to correspond to the first fastening member,

And the optical sensor unit is fixed to the circuit board through engagement of the first fastening member and the second fastening member.
The method according to claim 1,

Wherein the optical sensor unit comprises a plurality of spaced-apart optical sensor modules and an optical sensor circuit board formed to arrange the plurality of optical sensor modules.
6. The method of claim 5,

Wherein the optical sensor unit further includes a terminal portion disposed on an opposite surface of a surface of the optical sensor circuit board on which the optical sensor module is disposed.
The method according to claim 6,

The housing further includes a connection portion formed to correspond to the terminal portion,

And the terminal portion is connected to a connector disposed outside the housing through the connection portion.
The method according to claim 1,

And a cooling portion disposed on an inner wall of the housing so as to be spaced apart from the housing portion of the housing.
9. The method of claim 8,

Wherein the cooling portion includes a cooling passage in the form of a passage formed in an inner wall of the housing and a cooling member formed to pass through the cooling passage,

And the cooling passage is disposed to face the photosensor section.
10. The method of claim 9,

When the plurality of light emitting diodes are provided and arranged along one direction,

Wherein the cooling passage has a shape elongated along one direction in which the light emitting diodes are arranged.
The method according to claim 1,

Further comprising a base portion configured to dispose the light emitting diode,

Wherein one portion of the base portion is covered by the housing and another portion of the base portion is exposed without being covered by the housing.