WO2021225285A1 - Display device - Google Patents

Display device Download PDF

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Publication number
WO2021225285A1
WO2021225285A1 PCT/KR2021/004126 KR2021004126W WO2021225285A1 WO 2021225285 A1 WO2021225285 A1 WO 2021225285A1 KR 2021004126 W KR2021004126 W KR 2021004126W WO 2021225285 A1 WO2021225285 A1 WO 2021225285A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
dissipation plate
light guide
guide plate
display panel
Prior art date
Application number
PCT/KR2021/004126
Other languages
French (fr)
Korean (ko)
Inventor
이상훈
강정일
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2021225285A1 publication Critical patent/WO2021225285A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133382Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133308Support structures for LCD panels, e.g. frames or bezels
    • G02F1/13332Front frames

Definitions

  • the present invention relates to a display device. More specifically, it relates to a display device having an improved grounding structure while easily dissipating heat inside the display device.
  • a display device is a device that displays an image on a screen, such as a television, a computer monitor, and a digital information display.
  • a display module using a liquid crystal display panel is widely used.
  • the display device may include a display panel and a backlight unit (BLU) for incident light on the display panel.
  • the display panel may be formed of a pair of substrates facing each other with a liquid crystal layer interposed therebetween.
  • the backlight unit may be provided with an LED module including a light source (a plurality of LEDs) for incident light to the display panel.
  • the LED module not only generates light but also emits heat, which can deteriorate the display panel.
  • the display apparatus may include a display panel and a plurality of printed board assemblies (PBAs) used to drive the backlight unit.
  • PBAs printed board assemblies
  • a thin-walled display device is mounted on a wall, even if the heat generated by the plurality of PBAs has a structure that emits heat to the rear, effective heat dissipation cannot be achieved due to the structural characteristics of being mounted close to the wall.
  • the display device may have a heat dissipation structure for preventing deterioration of the liquid crystal panel, and the heat dissipation structure may be implemented by a structure including a fan and an air filter.
  • the manufacturing process becomes complicated and the manufacturing cost increases. Since such a heat dissipation structure occupies a considerable volume, there is a limit to its application to a display device having a slim design. Specifically, in the case of a heat dissipation structure including a fan and an air filter, a high maintenance cost is required because the filter must be replaced periodically.
  • the plurality of PBAs of the LED module are provided as separate grounding structures, the number of wires added to implement the grounding structure increases, which increases the manufacturing cost and increases the risk of overcurrent flowing between the electronic components of the display device. this existed.
  • a display device capable of easily managing internal heat through an arrangement structure of a plurality of PBAs, a backlight unit, and a heat sink and effectively grounding a plurality of PBAs and a backlight unit through a simple structure.
  • a display apparatus includes a display panel; a light guide plate disposed behind the display panel; an LED module including a plurality of LEDs disposed along a side surface of the light guide plate to irradiate light to the light guide plate; a PBA (Printed Board Assembly) provided for controlling a display device and processing an image; and a heat dissipation plate on which the LED module is mounted on one side and the PBA is mounted on the other side, wherein the heat dissipation plate and the PBA are disposed so as not to overlap the front and rear of the display panel to form the heat dissipation plate It may be provided so that heat transmitted through and heat generated from the PBA are radiated to the outside of the front of the periphery of the display panel.
  • the heat dissipation plate includes a first heat dissipation plate including a first mounting surface on which the PBA is mounted and a second heat dissipation plate including a second mounting surface on which the LED module is mounted, wherein the first mounting surface is a display panel It is formed to face the front of the second mounting surface and the second heat dissipation plate may extend along a direction in which the plurality of LEDs are arranged.
  • the first mounting surface may be disposed outside the periphery of the display panel.
  • the first mounting surface is disposed under the display panel, the second heat dissipation plate protrudes from the lower end of the first heat dissipation plate toward the rear, and the second mounting surface is formed on the upper portion of the second heat dissipation plate.
  • the light guide plate extends to an upper end of the LED module mounted on the second mounting surface, and the heat dissipation plate includes a support formed on a surface opposite to the first mounting surface of the first heat dissipation plate, and the support portion is the The front surface of the lower portion of the light guide plate may be supported.
  • a rear reflection sheet covering the rear surface of the light guide plate and disposed in contact with the rear surface
  • the second heat dissipation plate may be disposed outside the circumference of the light guide plate.
  • the second heat dissipation plate is disposed under the light guide plate
  • the second heat dissipation plate may protrude forward from an upper end of the first heat dissipation plate, and the second mounting surface may be formed on an upper portion of the second heat dissipation plate.
  • the light guide plate extends to an upper end of the LED module mounted on the second mounting surface, and the heat dissipation plate includes a support formed on a surface opposite to the first mounting surface of the first heat dissipation plate, and the support portion is the light guide plate It may be supported by a rear chassis that supports the rear surface of the .
  • the rear chassis may include a spacer that protrudes from the rear chassis between the light guide plate and the plurality of LEDs and is provided to support a lower portion of the light guide plate to space the light guide plate and the plurality of LEDs apart.
  • a rear reflection sheet disposed behind the light guide plate to cover a rear surface of the light guide plate and to be in contact with the rear surface.
  • a first cover portion provided to cover the circumference of the display panel from the front of the display panel, and a second cover portion provided under the first cover portion and protruding toward the front of the display panel than the first cover portion It may further include a front cover (Front Cover).
  • the second cover portion of the front cover includes a plurality of holes for communicating the PBA accommodation portion and the outside, and through the plurality of holes, the heat of the PBA accommodation portion is provided to flow outwardly in front of the periphery of the display panel.
  • the display device may further include a speaker disposed in the PBA receiving unit corresponding to the position where the plurality of holes are formed.
  • the heat dissipation plate may be formed of a metal material.
  • a display device a display panel; a light guide plate disposed behind the display panel; an LED module including a plurality of LEDs mounted along a side surface of the light guide plate to irradiate a light source to the light guide plate; PBA (Printed Board Assembly) provided for image transmission of the display device; and a metal heat dissipation plate to which cathodes of the plurality of LEDs and a ground terminal of the PBA are connected.
  • PBA Print Board Assembly
  • the heat dissipation plate includes a first heat dissipation plate including a first mounting surface on which the PBA is mounted and a second heat dissipation plate including a second mounting surface on which the LED module is mounted, and the first mounting surface faces the front It is formed to face the second mounting surface and the second heat dissipation plate may extend along a direction in which the plurality of LEDs are mounted.
  • the heat dissipation plate may be disposed under the display panel.
  • a front cover including a first cover portion provided to cover the circumference of the display panel from the front of the display panel and a second cover portion provided under the first cover portion and protruding forward from the first cover portion Cover) is further included,
  • the second cover part may include a support flange that protrudes from the rear surface toward the rear and is formed of an insulator for supporting the heat dissipation plate.
  • the first heat dissipation plate and the second heat dissipation plate of the heat dissipation plate are integrally formed to provide an effective heat dissipation structure as well as a rigid reinforcement structure that more firmly supports the internal configuration of the display device together with the middle mold supporting the display panel and the light guide plate.
  • the heat dissipation plate is made of a metal material and the ground terminal of the cathode PBA of the LED is connected at the same time, and the structure sharing the same ground minimizes the risk of damage to the components inside the display device due to the surge voltage, and is used between each electronic component. It is also possible to achieve the effect of preventing an overcurrent from flowing due to the reference potential difference.
  • FIG. 1 is a perspective view illustrating a front exterior of a display device according to an embodiment of the present invention.
  • FIG. 2 is an exploded front perspective view illustrating the display device of FIG. 1 by disassembling it.
  • 3 and 4 are cross-sectional views viewed from the right side of a cross-section including a PBA of a display device according to an embodiment of the present invention.
  • FIG. 5 is an enlarged view of area A of FIG. 2 .
  • FIG. 6 is an exploded front perspective view illustrating an exploded display device according to another embodiment of the present invention.
  • FIG. 7 and 8 are cross-sectional views viewed from the right side of a cross-section including a PBA of a display device according to another embodiment of the present invention.
  • FIG. 9 is an enlarged view of area B of FIG. 5 .
  • FIG. 10 is a diagram schematically illustrating a ground structure of a PBA and an LED module of a display device according to an embodiment of the present invention together with a circuit.
  • first may be referred to as a second component
  • second component may also be referred to as a first component.
  • the term “and/or” includes a combination of a plurality of related listed items or any of a plurality of related listed items.
  • FIG. 1 shows the X-axis, Y-axis, and Z-axis directions perpendicular to each other, the X-axis direction means the left-right direction of the display device, the Y-axis direction means the vertical direction of the display device, and the Z-axis direction is It means the front-back direction of the display device.
  • a display device refers to a device that displays an image.
  • the display apparatus may include a television, a monitor, a mobile device, and the like.
  • a television will be mainly described as an example of the display device.
  • the television may include a flat television, a curved television, a bendable television, and the like.
  • a preferred embodiment according to the present invention will be described mainly with a flat television as an example of the television. It will be described in detail with reference to the accompanying drawings.
  • FIG. 1 is a perspective view illustrating a front exterior of a display device according to an embodiment of the present invention.
  • FIG. 2 is an exploded front perspective view illustrating the display device of FIG. 1 by disassembling it.
  • 3 and 4 are cross-sectional views viewed from the right side of a cross-section including a PBA of a display device according to an embodiment of the present invention.
  • FIG. 5 is an enlarged view of area A of FIG. 2 .
  • the display apparatus 10 may include a chassis assembly for accommodating and supporting the display panel 100 and the backlight unit.
  • the display panel 100 is composed of a liquid crystal panel formed by encapsulating liquid crystal between two glass substrates each having electrodes, and can display an image in the front.
  • the display panel 100 may display an image toward the first direction Z, which is the front.
  • the chassis assembly may include a front cover 800 , a middle mold 710 , a rear chassis 720 , and a rear cover 730 .
  • the front cover 800 may include an opening for exposing the display panel 100 .
  • the front cover 800 includes a bezel portion that covers the front outer side of the display panel 100 , and a top side portion that is bent from the end of the bezel portion to the rear side and covers the side surface of the middle mold 710 .
  • the front cover 800 may be coupled to the front side of the middle mold 710 to maintain the display panel 100 installed in the middle mold 710 .
  • the specific shape and structure of the front cover 800 of the display device 10 according to embodiments of the present invention will be described later.
  • the optical sheet 101, the display panel 100, and the front cover 800 are sequentially installed on the front side, and the light guide plate 200, the reflective sheet 620 and the rear chassis 720 are installed on the rear side. are installed in sequence to support each component, and may be provided to maintain the display panel 100 and the rear chassis 720 spaced apart from each other.
  • the rear chassis 720 may include a middle mold coupling part (not shown) coupled to the middle mold 710 at the upper end and a front cover coupling part (not shown) coupled to the front cover 800 at the bottom.
  • the rear chassis 720 may further include a support 512 supporting the light guide plate 200 on the rear surface of the light guide plate.
  • the rear chassis 720 is formed in a high-strength polygonal plate shape, and includes a metal material (for example, aluminum or aluminum alloy, etc.) that has little thermal deformation due to heat generated by the heat generated by the internal configuration of the display device 10 . can do.
  • a metal material for example, aluminum or aluminum alloy, etc.
  • the rear chassis 720 may be made of a material having high thermal conductivity. Accordingly, the heat generated by the light guide plate 200 or the reflective sheet 620 can be easily dissipated to improve the reliability of the display device 10 .
  • the rear chassis 720 may be formed of plastic (eg, polycarbonate (PC)) or by adding glass fiber to the plastic material.
  • plastic eg, polycarbonate (PC)
  • the display device 10 may further include a rear cover 730 that covers the rear of the rear chassis 720 surrounding the chassis assembly to protect and accommodate the chassis assembly.
  • the rear cover 730 may be provided to be finally coupled to the front cover 800 at the rear of the rear chassis 720 after the rear chassis 720 is fixed to the front cover 800 and the middle mold 710 .
  • the fastening of the front cover 800 and the rear cover 730 may be performed through a plurality of fastening members (not shown).
  • the display apparatus 10 may further include a back light unit (BLU) provided to supply light to the display panel 100 .
  • BLU back light unit
  • the backlight unit may include a light source module including a light source and a substrate on which the light source is mounted, a light guide plate 200 and various optical sheets 101 disposed on a movement path of light emitted from the light source module.
  • the light guide plate 200 may be disposed to face the rear surface of the display panel 100 from the rear of the display panel 100 .
  • the light guide plate 200 is formed in a rectangular plate shape with left and right widths longer than the vertical length to correspond to the display panel 100 , and is made of a transparent material to allow light to pass therethrough.
  • the light source module may include a light source that emits light.
  • the backlight unit is disposed so that the light source faces the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type)
  • the light source may be largely divided into a direct type in which the light source is disposed directly below the display panel 100 .
  • the display device 10 it will be described on the premise that it is provided as an edge type.
  • the light source module may be provided as an LED package in which an LED that emits light (Light Emitting Diode, LED) is accommodated.
  • the light source module of the display device 10 according to the embodiments of the present invention will be described on the premise that the LED module 300 is used.
  • the LED module 300 may be provided to supply light to the display panel 100 .
  • the LED module 300 may supply light to the display panel 100 from the rear of the display panel 100 .
  • the light source of the LED module 300 may be provided as a mini-LED formed of an LED chip having a size of 100 to 300 ⁇ m.
  • the LED module 300 may include a plurality of LEDs 310 and an LED substrate 320 on which the plurality of LEDs 310 are disposed.
  • the LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 .
  • the substrate may be provided in the shape of a bar extending in the X-direction, in other words, in the left-right direction. That is, the LED substrate 320 may have a length extending in the left-right direction or the X-direction.
  • the LED module 300 specifically, the plurality of LEDs 310 may be disposed on the LED substrate 320 along the side surface of the light guide plate 200 to irradiate light to the light guide plate 200 .
  • the LED substrate 320 may be formed of a glass material. However, the present invention is not limited thereto, and the LED substrate 320 may be formed of a material having different physical properties. A circuit pattern for transmitting driving power and signals to the plurality of LEDs 310 may be formed on the LED substrate 320 .
  • An optical sheet 101 may be disposed between the light guide plate 200 and the display panel 100 in order to improve the characteristics of the light emitted from the LED module 300 .
  • the optical sheet 101 may include a prism sheet (not shown) and a protective sheet (not shown).
  • the prism sheet includes a prism pattern having a triangular prism shape, and a plurality of these prism patterns are arranged adjacent to each other to form a plurality of bands. is formed
  • the light diffused from the LED module 300 is refracted while passing through the prism pattern, and accordingly, the light may be incident on the display panel in a vertical direction.
  • the protective sheet is a configuration that protects various components from external impact or the inflow of foreign substances.
  • the prism sheet is easily scratched, and the protective sheet can prevent the prism sheet from being scratched.
  • a power substrate 400a for supplying power to the display device 10
  • a signal processing substrate 400b for processing various image and sound signals
  • an image signal to the display panel 100 a timing control board (not shown) to transmit may be disposed.
  • timing control substrate (not shown) may be implemented in an integrated form with the signal processing substrate.
  • the various boards may be configured as a PBA (Printed Board Assembly) in which electrical and mechanical components are mounted on a printed circuit board (PCB) or connected to another printed circuit board to be electrically and mechanically finally processed.
  • PBA Print Board Assembly
  • various electrical substrates provided for image transmission of the display device 10, such as the power substrate 400a, the signal processing substrate 400b, and the timing control substrate (not shown), are collectively referred to as PBA.
  • the arrangement structure in the heat dissipation plate 500 applied to the embodiments of the present invention will be described as a configuration separate from the above-described PBA.
  • a separate heat dissipation structure is required to dissipate heat generated from the LED itself, which complicates the manufacturing process and leads to an increase in manufacturing cost.
  • a heat dissipation structure is provided at the rear of the display panel together with the PBA, there is a problem in that the thickness of the display device is increased in the front and rear directions.
  • the display device 10 has an LED module 300 mounted on one side, and a PBA on the other side in order to have an effective heat dissipation structure and a thickness in the front-rear direction of the portion on which the display panel of the display device is disposed becomes slim. It may include a heat dissipation plate 500 on which the 400 is mounted. In addition, the heat dissipation plate and the PBA are disposed so as not to overlap the front and rear of the display panel so that the heat transmitted through the heat dissipation plate and the heat generated from the PBA may be provided to radiate heat to the outside of the front of the periphery of the display panel. .
  • each LED module 300 and the LED module 300 may form an integrated heat transfer and heat dissipation structure without the need for a separate heat dissipation structure, respectively.
  • the heat dissipation plate 500 includes a first heat dissipation plate 510 including a first mounting surface 511 on which the PBA 400 is mounted and a second mounting surface 521 on which the LED module 300 is mounted.
  • Two heat dissipation plates 520 may be included. 2 to 5 , the first heat dissipation plate 510 and the second heat dissipation plate 520 may be integrally formed to constitute the heat dissipation plate 500 .
  • the meaning of being integrally formed means that the first heat dissipation plate 510 and the second heat dissipation plate 520 are physically integrally formed without a gap through a manufacturing method such as a mold in the process of manufacturing the heat dissipation plate 500 Alternatively, it may mean forming a single structure by contacting each other similarly to that shown in FIGS. 2 to 5 .
  • the first heat dissipation plate 510 including the first mounting surface 511 on which the PBA 400 is mounted may be formed in a plate shape to correspond to the width of the display panel 100 .
  • it is formed of a metal material so that heat transfer and heat dissipation can be performed effectively, but the present invention is not limited thereto and may be implemented with other materials having high thermal conductivity.
  • the first heat dissipation plate 510 may be disposed such that the first mounting surface 511 faces the front of the display panel. This is to design the heat dissipation plate 500 so that heat can be emitted to the front rather than the rear of the display device 10 together with the arrangement structure in the display device 10 as will be described later.
  • a speaker 900 in addition to the PBA may be disposed on the first mounting surface 511 of the first heat dissipation plate 510 .
  • the speaker 900 is shown to be mounted on the lower end of the PBA 400
  • the speaker 900 and the PBA 400 are a heat dissipation plate 500 , specifically a first heat dissipation plate 510 .
  • the arrangement structure may be different within the range of maintaining the technical characteristics of being mounted on the first mounting surface 511 of the .
  • the speaker 900 may be mounted on the upper end of the PBA 400 .
  • it may be mounted on both sides of the left and right sides of the PBA 400 .
  • the second heat dissipation plate 520 of the display apparatus 10 may protrude backward from the lower end of the first heat dissipation plate 510 .
  • the second mounting surface 521 and the second heat dissipation plate 520 on which the LED module 300 is mounted may extend along a direction in which the plurality of LEDs 310 are disposed.
  • the LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type) It is provided as described above.
  • Edge Type Edge Type
  • the light guide plate 200 is arranged to face the lower side of the four sides.
  • the second mounting surface 521 of the second heat dissipation plate 520 may correspond to the upper surface in the above-described protrusion structure. That is, the second mounting surface 521 may be formed on the second heat dissipation plate 520 .
  • the LED module 300 is disposed to face the side surface of the light guide plate 200 . That is, the plurality of LEDs 310 may be disposed along the side surface of the light guide plate 200 , and the LED substrate 320 on which the plurality of LEDs 310 are mounted may also be formed to extend along the side surface of the light guide plate 200 . That the LED module 300 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 means that the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 and can be used with the same meaning.
  • the first heat dissipation plate 510 and the second heat dissipation plate 520 are integrally formed, and the width in each X direction may be the same. Also, when viewed from the right side of the display device 10 , the cross section of the heat dissipation plate 500 may be provided in an L-shape.
  • the length in the Y direction of the first heat dissipation plate 510 on which the PBA 400 and the speaker 900 are mounted is the length of the second heat dissipation plate on which the LED module 300 is mounted. (520) It may be provided to be longer than the length in the Z direction. However, the length of the first heat dissipation plate 510 in the Y direction and the length of the second heat dissipation plate 520 in the Z direction are not limited thereto.
  • the heat dissipation plate 500 may be disposed outside the periphery of the display panel 100 .
  • the first heat dissipation plate 510 of the display device 10 may be disposed outside the periphery of the display panel 100 .
  • the first mounting surface 511 of the first heat dissipation plate 500 may face the front of the display panel 100 , that is, in the Z direction, and may be disposed outside the periphery of the display panel 100 .
  • the PBA 400 which was conventionally disposed on the rear of the display panel 100 , that is, on the rear of the display device 10 , is disposed so as not to overlap the front and rear of the display panel 100 together with the heat dissipation plate 500 .
  • the heat transferred through the heat dissipation plate 500 and the heat generated from the PBA 400 may be provided in a structure in which heat is radiated to the outside of the periphery of the display panel 100 .
  • the display device 10 Assuming that the light guide plate 200 disposed at the rear of the display panel 100 is provided in a rectangular plate shape, the display device 10 according to an embodiment of the present invention shown in FIGS.
  • the LED module 300 is disposed to face the lower side of the four sides of the light guide plate 200 as described above.
  • the second mounting surface 521 of the second heat dissipation plate 500 is disposed below the light guide plate 200 . .
  • the second heat dissipation plate 520 is also disposed on the outside of the periphery of the display panel 100 , so that heat is not emitted to the display panel 100 , and further heat is easily radiated to the front of the display device 10 . possible effects can be achieved.
  • the problem caused by being disposed at the rear of the display panel 100 that is, at the rear of the display device 10 , is the same as described above.
  • the first mounting surface 511 of the first heat dissipation plate 500 is disposed on the outside of the periphery of the display panel 100 so that the PBA 400 is a display panel. Without dissipating heat to the 100 , it is possible to further achieve the effect of easily dissipating heat to the front of the display device 10 .
  • first heat dissipation plate 510 and the second heat dissipation plate 520 constitute one heat dissipation plate 500 , and the heat dissipation plate 500 is generally disposed outside the periphery of the display panel 100 . Due to this, it is possible to form an effective heat exchange and heat dissipation structure.
  • the first mounting surface 511 of the first heat dissipation plate 500 faces the front of the display panel 100 , that is, in the Z direction, and is disposed on the outside of the periphery of the display panel 100 .
  • the second heat dissipation plate 520 may protrude from the lower end of the first heat dissipation plate 510 toward the rear, and the second mounting surface 521 may be formed on the second heat dissipation plate 520 .
  • the light guide plate 200 may extend to the upper end of the LED module 300 mounted on the second mounting surface 521 .
  • the light guide plate 200 is formed in a rectangular plate shape to correspond to the display panel 100 , when the upper end of the light guide plate 200 is arranged to coincide with the upper end of the display panel 100 , the lower end of the light guide plate 200 is It may extend further downward than the lower end of the display panel 100 . As a result, the light guide plate 200 may be formed such that the length in the left and right directions corresponds to the display panel 100 , but the length in the vertical direction is longer than that of the display panel 100 .
  • the light guide plate 200 may extend downwardly by a distance D from the lower end of the display panel 100 . That is, the extension distance from the position corresponding to the lower end of the display panel 100 of the light guide plate 200 to the upper end of the LED module 300 mounted on the second mounting surface 521 may be formed as a distance D.
  • the LED module 300 may be provided in a structure that can sufficiently secure a separation distance from the display panel 100 . That is, as in the conventional structure, since the LED module 300 is disposed near the side surface of the display panel 100, it is possible to prevent a problem of causing deterioration in the side surface of the display panel.
  • the lower portion 200e (refer to FIGS. 3 and 4 ) of the light guide plate 200 corresponding to the distance D may be provided in a structure to be seated on the heat dissipation plate 500 .
  • the front surface of the lower portion 200e of the light guide plate 200 may be supported by the first heat dissipation plate 510 . Since the first mounting surface 511 of the first heat dissipation plate 510 is disposed to face forward, the supporting surface of the first heat dissipation plate 510 supporting the front surface of the lower portion 200e of the light guide plate 200 is the first mounting surface. It may be the opposite surface of the surface 511 .
  • a support surface of the first heat dissipation plate 510 supporting the front surface of the lower portion 200e of the light guide plate 200 may be defined as a support portion 512 .
  • the first heat dissipation plate 510 facing the rear of the display panel 100 is the The surface located on the other side.
  • the support part 512 is positioned opposite to the first mounting surface 511 and may be formed in a shape corresponding to the first mounting surface 511 . Since the first heat dissipation plate 510 is provided in a rectangular plate shape, the first mounting surface 511 and the support part 512 may also be formed in a rectangular shape.
  • the heat dissipation plate 500 may serve as a support structure for more firmly supporting the light guide plate 200 together with the middle mold 710 .
  • the lower side of the four sides of the light guide plate 200 faces the LED module 300 .
  • a lower side of the four sides of the light guide plate 200 may be provided to contact the LED module 300 .
  • the spacer 722 formed on the rear chassis 720 may be formed to secure a separation distance between the LED module 300 and the lower side of the four sides of the light guide plate 200 . .
  • the rear chassis 720 may include a spacer 722 that protrudes from the rear chassis 720 between the light guide plate 200 and the plurality of LEDs 320 and is provided to support a portion of the lower end of the light guide plate 200 .
  • the spacer 722 may protrude along a direction in which a lower portion of the four side surfaces of the light guide plate 200 extends. Accordingly, the upper and both sides of the light guide plate 200 may be supported by the middle mold 710 , and the lower side thereof may be supported by the spacer 722 .
  • the light irradiated from the LED module 300 to the light guide plate 200 is not incident directly toward the display panel 100, but passes through the lower portion of the light guide plate 200 corresponding to distance D and then enters the display panel 100. do.
  • reflective sheets may be additionally disposed in front and rear of the light guide plate 200 .
  • the reflective sheet covers the rear surface of the light guide plate 200 and is disposed in front of the rear reflection sheet 610 and the light guide plate 200 disposed to be in contact with the rear surface, and covers the front surface of the lower portion 200e of the light guide plate 200 and covers the lower portion ( 200e) may include a front reflective sheet 620 disposed in contact with the front surface.
  • the rear reflection sheet 610 may be provided in a shape corresponding to the rear surface of the light guide plate 200 . That is, it may be formed to correspond to the rectangular shape of the light guide plate 200 .
  • the front reflection sheet 620 is also formed in a rectangular shape, but may be formed to cover only the front of the lower portion of the light guide plate 200 corresponding to the D distance. This is good for the light passing through the light guide plate 200 to minimize the loss of light to the rear of the light guide plate 200, but the front reflection sheet 620 is the light incident on the surface of the light guide plate 200 facing the display panel 100. to prevent blocking.
  • the front reflective sheet 620 is provided only on the lower front surface of the light guide plate 200 corresponding to the distance D not facing the display panel 100 among the front surfaces of the light guide plate 200 to minimize light loss.
  • FIG. 6 is an exploded front perspective view illustrating an exploded display device according to another embodiment of the present invention.
  • 7 and 8 are cross-sectional views of a display device according to another embodiment of the present invention, including a PBA, as viewed from the right.
  • FIG. 9 is an enlarged view of area B of FIG. 6 .
  • the display device 10 may also include a heat dissipation plate 500 in which the LED module 300 is mounted on one side and the PBA 400 is mounted on the other side.
  • the heat dissipation plate 500 includes a first heat dissipation plate 510 including a first mounting surface 511 on which the PBA 400 is mounted and a second mounting surface 521 on which the LED module 300 is mounted.
  • Two heat dissipation plates 520 may be included. 6 to 9 , the first heat dissipation plate 510 and the second heat dissipation plate 520 may be integrally formed to constitute the heat dissipation plate 500 .
  • the meaning of being integrally formed is the same as described above.
  • the first heat dissipation plate 510 including the first mounting surface 511 on which the PBA 400 is mounted may be formed in a rectangular plate shape with left and right widths longer than the vertical length to correspond to the width of the display panel 100 . have. In addition, it is formed of a metal material so that heat transfer and heat dissipation can be performed effectively.
  • the first heat dissipation plate 510 may be disposed such that the first mounting surface 511 faces the front of the display panel 100 . This is to design the heat dissipation plate 500 so that heat can be emitted to the front rather than the rear of the display device 10 together with the arrangement structure in the display device 10 as will be described later.
  • a speaker 900 in addition to the PBA may be mounted on the first mounting surface 511 of the first heat dissipation plate 510 .
  • the speaker 900 is shown to be mounted at the lower end of the PBA 400
  • the speaker 900 and the PBA 400 are a heat dissipation plate 500 , specifically a first heat dissipation plate 510 .
  • the arrangement structure may be different within the range of maintaining the technical characteristics of being mounted on the first mounting surface 511 of the .
  • the speaker 900 may be mounted on the upper end of the PBA 400 .
  • it may be mounted on both sides of the left and right sides of the PBA 400 .
  • the second heat dissipation plate 520 of the display apparatus 10 may protrude forward from the top of the first heat dissipation plate 510 .
  • the second mounting surface 521 and the second heat dissipation plate 520 on which the LED module 300 is mounted may extend along a direction in which the plurality of LEDs 310 are disposed.
  • the LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type) It is provided as described above.
  • Edge Type Edge Type
  • the light guide plate 200 is arranged to face the lower side of the four sides.
  • the second mounting surface 521 of the second heat dissipation plate 520 may correspond to the upper surface in the above-described protrusion structure. That is, the second mounting surface 521 may be formed on the second heat dissipation plate 520 .
  • the LED module 300 is disposed to face the side surface of the light guide plate 200 . That is, the plurality of LEDs 310 may be disposed along the side surface of the light guide plate 200 , and the LED substrate 320 on which the plurality of LEDs 310 are mounted may also be formed to extend along the side surface of the light guide plate 200 .
  • That the LED module 300 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 is a structure in which the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 . and can be used in the same meaning as mounted.
  • the first heat dissipation plate 510 and the second heat dissipation plate 520 are integrally formed, and the width in each X direction may be the same.
  • the cross section of the heat dissipation plate 500 when viewed from the right side of the display device 10 may be provided in a L-shape.
  • the length in the Y direction of the first heat dissipation plate 510 on which the PBA 400 and the speaker 900 are mounted is the length of the second heat dissipation plate on which the LED module 300 is mounted. (520) It may be provided to be longer than the length in the Z direction. However, the length of the first heat dissipation plate 510 in the Y direction and the length of the second heat dissipation plate 520 in the Z direction are not limited thereto.
  • the heat dissipation plate 500 may be disposed outside the periphery of the display panel 100 .
  • the second heat dissipation plate 520 of the display device 10 may be disposed outside the periphery of the display panel 100 .
  • the PBA 400 which was conventionally disposed on the rear of the display panel 100 , that is, on the rear of the display device 10 , is disposed so as not to overlap the front and rear of the display panel 100 together with the heat dissipation plate 500 .
  • the heat transferred through the heat dissipation plate 500 and the heat generated from the PBA 400 may be provided in a structure in which heat is radiated to the outside of the periphery of the display panel 100 .
  • the display device 10 Assuming that the light guide plate 200 disposed at the rear of the display panel 100 is provided in a rectangular plate shape, the display device 10 according to an embodiment of the present invention shown in FIGS.
  • the LED module 300 is disposed to face the lower side of the four sides of the light guide plate 200 as described above.
  • a lower side of the four sides of the light guide plate 200 may be provided to contact the LED module 300 .
  • the spacer 722 formed on the rear chassis 720 may be formed to secure a separation distance between the LED module 300 and the lower side of the four sides of the light guide plate 200 . .
  • the rear chassis 720 may include a spacer 722 that protrudes from the rear chassis 720 between the light guide plate 200 and the plurality of LEDs 320 and is provided to support a portion of the lower end of the light guide plate 200 .
  • the spacer 722 may protrude along a direction in which a lower portion of the four side surfaces of the light guide plate 200 extends. Accordingly, the upper and both sides of the light guide plate 200 may be supported by the middle mold 710 , and the lower side thereof may be supported by the spacer 722 .
  • the first mounting surface 511 of the first heat dissipation plate 510 is disposed below the light guide plate 200 . .
  • the first heat dissipation plate 510 is also disposed on the outside of the periphery of the display panel 100 , so that heat is not emitted to the display panel 100 , and further heat is easily discharged to the front of the display device 10 . possible effects can be achieved.
  • the PBA 400 is disposed on the rear side of the display device 10 on the rear side of the display panel 100, and the problem caused is the same as described above.
  • the first mounting surface 511 of the first heat dissipation plate 500 is disposed on the outside of the periphery of the display panel 100 so that the PBA 400 is a display panel. Without dissipating heat to the 100 , it is possible to further achieve the effect of easily dissipating heat to the front of the display device 10 .
  • first heat dissipation plate 510 and the second heat dissipation plate 520 constitute one heat dissipation plate 500 , and the heat dissipation plate 500 is generally disposed outside the periphery of the display panel 100 . Due to this, it is possible to form an effective heat exchange and heat dissipation structure.
  • the second mounting surface 521 of the second heat dissipation plate 520 protrudes forward from the top of the first heat dissipation plate 510 and the second heat dissipation plate 2 mounting surfaces 521 are formed on the upper part of the
  • the light guide plate 200 may extend to the upper end of the LED module 300 mounted on the second mounting surface 521 .
  • the light guide plate 200 is formed in a rectangular plate shape to correspond to the display panel 100, and the length of the light guide plate 200 in the left and right directions and the length in the vertical direction are It may be formed to correspond to the display panel 100 . This means that the lower portion of the light guide plate 200 corresponding to the above-described distance D may be omitted.
  • the second heat dissipation plate 520 protruding forward from the top of the first heat dissipation plate 510 may be supported by the adjacent middle mold 710 .
  • the first heat dissipation plate 510 is disposed at the rear of the display device 10 according to an embodiment of the present invention and may be directly supported by the rear chassis 720 .
  • the first heat dissipation plate 510 facing the front of the display panel 100 is referred to as the first mounting surface 511
  • the first heat dissipation plate 510 facing the rear of the display panel 100 is the The surface located on the other side may be defined as the support part 512 .
  • the support part 512 is positioned opposite to the first mounting surface 511 and may be formed in a shape corresponding to the first mounting surface 511 . Since the first heat dissipation plate 510 is provided in a rectangular plate shape, the first mounting surface 511 and the support part 512 may also be formed in a rectangular shape.
  • the support part 512 of the first heat dissipation plate 510 may be provided as a surface directly supported by the above-described rear chassis 720 .
  • the rear reflection sheet 610 is disposed behind the light guide plate 200 and covers the rear surface of the light guide plate 200 and is provided to be in contact with the rear surface. may include.
  • the front reflection sheet 620 described above. may be omitted.
  • the front cover 800 is provided under the first cover part 810 and the first cover part 810 provided to cover the circumference of the display panel 100 in front of the display panel 100 , and the first cover part It may include a second cover part 820 that protrudes toward the front of the display panel 100 rather than the 810 .
  • the thickness of the cross-section of the display device 10 is greater than the thickness of the cross-section in the region where the display panel 100 is disposed.
  • the thickness of the cross section in the region may be provided to be thick.
  • the PBA 400 which was conventionally disposed on the rear of the display panel 100, that is, on the rear of the display device 10, is placed on the front of the display panel 100 together with the heat dissipation plate 500, It is arranged on the outside of the periphery of the display panel 100 so as not to overlap with the rear, but a relatively bulky PBA 400 structure can be accommodated.
  • the front cover 800 shown in FIGS. 2 to 9 is illustrated in a structure in which the lower portion of the display device 10 protrudes toward the front of the display panel 100 , but is not limited thereto, and the PBA 400 is heat-dissipated. If it can be disposed on the outside of the periphery of the display panel 100 so as not to overlap the front and rear of the display panel 100 together with the plate 500, a structure protruding from the top or both sides of the display device 10 can be formed. may be
  • the second cover portion 820 of the front cover 800 may include a plurality of holes 821 for communicating the PBA receiving portion 801 and the outside.
  • the plurality of holes 821 may be formed to correspond to positions where the above-described speakers 900 are disposed.
  • the area in which the plurality of holes 821 are formed corresponds to the front surface of the second cover part 820 . can be formed in
  • the speaker 900 is disposed in the PBA receiving part 801 , it is possible to achieve an effective sound radiation effect in front of the display device.
  • heat radiated from the heat dissipation plate 500 through the plurality of holes 821 may be effectively radiated to the front of the display device 10 .
  • FIG. 10 is a diagram schematically illustrating a ground structure of a PBA and a backlight unit of a display device according to an embodiment of the present invention together with circuits.
  • the performance of the device may be deteriorated.
  • An example of the surge voltage may be a voltage generated by electrostatic discharge (ESD).
  • ESD electrostatic discharge
  • static electricity means static electricity induced by a person or an object.
  • static electricity there is a risk that components inside the display apparatus 10 may be damaged.
  • a high voltage flows into a pixel region displaying an image, a desired image cannot be output to the screen.
  • the display device 10 may include a configuration that minimizes the possibility that such a surge voltage is introduced into the components inside the display device 10 to damage the components inside the display device 10 .
  • a ground terminal made of a conductive material may be connected to one surface of the PCB, and the LED cathode G2 may be connected to one surface of the LED substrate 320 .
  • PBA a plurality of PCBs on which electronic components such as a timing control unit and a power supply unit for generating a signal voltage necessary for image expression of the display device 10 are mounted will be collectively described as PBA. Also, in describing the grounding structure of FIG. 10 , among various electronic components, a power supply unit, an LED module, and a Driver_Integrated Circuit (D_IC) for driving the LED module will be mainly described.
  • D_IC Driver_Integrated Circuit
  • a circuit for driving the display device 10 includes a primary power supply 1000 that supplies AC or DC power supplied from the outside to the display device, and a primary power source 1000 receiving power from the primary power supply 1000 .
  • LED driving power circuit 1200, driving IC, TV image board and other display device 10 for driving the internal power circuit 1300, LED module 300 and LED module 300 to control the current flowing through It may include an LED driving IC (Driver_Integrated Circuit, D_IC, 1100) for A capacitor Vc for smoothing the ripple voltage supplied from the power supply unit 1300 to the supply voltage of the driving IC may be additionally connected to the driving IC.
  • the LED module 300 , the LED driving IC 1100 , the LED driving power supply circuit 1200 , and the power circuit 1300 for driving the electronic components inside the display device 10 are displayed due to the surge voltage generated from the outside, respectively.
  • a grounding structure may be provided that minimizes the risk of damage to components inside the device 10 .
  • the ground terminal of the power circuit 1300 for driving the electronic components inside the display device 10 is G1
  • the LED cathode (G2) for grounding the LED module 300 is G2
  • the ground structure of the LED driving power circuit 1200 is G3
  • the ground structure of the LED driving IC 1100 is referred to as G4.
  • the ground terminal G1 of the power circuit 1300 for driving the electronic component will be described as the ground terminal G1 of the PBA.
  • the display device 10 may include a metal heat dissipation plate 500 to which the cathode G2 of the LED and the ground terminal G1 of the PBA are connected.
  • a metal heat dissipation plate 500 to which the cathode G2 of the LED and the ground terminal G1 of the PBA are connected.
  • the heat dissipation plate 500 includes a first heat dissipation plate 510 including a first mounting surface 511 on which the PBA 400 is mounted and a second mounting surface 521 on which the LED module 300 is mounted.
  • Two heat dissipation plates 520 may be included. 2 to 5 , the first heat dissipation plate 510 and the second heat dissipation plate 520 may be integrally formed to constitute the heat dissipation plate 500 .
  • the meaning of being integrally formed means that the first heat dissipation plate 510 and the second heat dissipation plate 520 are physically integrally formed without a gap through a manufacturing method such as a mold in the process of manufacturing the heat dissipation plate 500 Alternatively, it may mean forming a single structure by contacting each other similarly to that shown in FIGS. 2 to 9 .
  • the first heat dissipation plate 510 including the first mounting surface 511 on which the PBA 400 is mounted may be formed in a rectangular plate shape with left and right widths longer than the vertical length to correspond to the width of the display panel 100 . have. In addition, it is formed of a metal material so that the ground can be effectively grounded at the same time as heat transfer and heat dissipation.
  • the first heat dissipation plate 510 may be disposed such that the first mounting surface 511 faces the front of the display panel.
  • the second heat dissipation plate 520 of the display apparatus 10 may protrude backward from the lower end of the first heat dissipation plate 510 .
  • the second mounting surface 521 and the second heat dissipation plate 520 on which the LED module 300 is mounted may extend along a direction in which the plurality of LEDs 310 are disposed.
  • the LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type) It is provided as described above.
  • Edge Type Edge Type
  • the light guide plate 200 is arranged to face the lower side of the four sides.
  • the second mounting surface 521 of the second heat dissipation plate 520 may correspond to the upper surface in the above-described protrusion structure. That is, the second mounting surface 521 may be formed on the second heat dissipation plate 520 .
  • the LED module 300 is disposed to face the side surface of the light guide plate 200 . That is, the plurality of LEDs 310 may be disposed along the side surface of the light guide plate 200 , and the LED substrate 320 on which the plurality of LEDs 310 are mounted may also be formed to extend along the side surface of the light guide plate 200 .
  • That the LED module 300 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 is a structure in which the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 . and can be used in the same meaning as mounted.
  • the first heat dissipation plate 510 and the second heat dissipation plate 520 are integrally formed, and the width in each X direction may be the same. Also, when viewed from the right side of the display device 10 , the cross section of the heat dissipation plate 500 may be provided in an L-shape.
  • the heat dissipation plate 500 may be disposed in the same manner as that of the heat dissipation plate 500 in the display device 10 described above with reference to FIGS. 2 to 9 .
  • the shape of the front cover may be equally applied to the contents described in relation to the heat dissipation plate 500 .
  • the front cover may further include a support flange 802 formed of an insulator for supporting the heat dissipation plate 500 .
  • the support flange 802 of the display device 10 supports the second cover of the front cover to support the lower surface of the second heat dissipation plate 520. It may protrude from the rear surface of the part 820 toward the rear.
  • the support flange 802 of the display device 10 according to another embodiment of the present invention shown in FIGS. 7 and 8 is a second cover part 820 of the front cover 800 to support the lower end of the first heat dissipation plate 510 . ) may protrude from the rear surface toward the rear.
  • the support flange 802 is made of an insulator to support the heat dissipation plate 500 , inconvenience in use such as static electricity that may occur when a user contacts the display device 10 from the outside can be prevented in advance.
  • the plurality of LEDs 310 may be mounted on one surface of the LED substrate 320 .
  • the LED cathode G2 connected to the LED substrate 320 is finally electrically connected to the heat dissipation plate 500 due to the structure in which the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 . It may be provided in a connected state.
  • the ground terminal G1 of the PBA made of a conductive material may be provided in a state in which the PBA 400 is electrically connected to the heat dissipation plate 500 by being mounted on the first mounting surface 511 of the first heat dissipation plate 510 . have.
  • the LED cathode G2 and the ground terminal G1 of the PBA may be provided to share the same ground.
  • the grounding structure of the LED driving power supply unit 1200 is disclosed as G3, and the grounding structure of the LED driving IC 1100 is also disclosed as G4.
  • it may be connected to the heat dissipation plate 500 to share the same ground with the LED cathode G2 and the ground terminal G1 of the PBA. Therefore, there is no need to provide a separate ground to discharge the surge voltage. That is, it is possible to omit various conductive wire structures required to construct a separate ground, thereby achieving the effect of simplification of the manufacturing process and reduction of manufacturing cost.
  • a middle mold ( Together with the 710 , it is possible to provide a rigid reinforcement structure that more firmly supports the internal configuration of the display device 10 .
  • the heat dissipation plate 500 is provided with a metal material, and the LED cathode (G2) and the ground terminal (G1) of the PBA are connected at the same time to share the same ground structure.
  • the effect of minimizing the risk of component damage it is possible to achieve the effect of preventing an overcurrent from flowing between each electronic component due to a difference in reference potential.

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Abstract

A display device according to an aspect of the present invention comprises: a display panel; a light guide plate arranged at the rear of the display panel; an LED module comprising a plurality of LEDs arranged along a side surface of the light guide plate, so as to emit light at the light guide plate; a printed board assembly (PBA) for display device control and image processing; and a heat-dissipating plate having the LED module mounted on one side thereof, and having the PBA mounted on the other side thereof, wherein the heat-dissipating plate and the PBA are arranged not to overlap on the front and rear of the display panel, so that heat transferred through the heat-dissipating plate and heat generated from the PBA are dissipated to the front and exterior of the circumference of the display panel.

Description

디스플레이장치display device
본 발명은 디스플레이장치에 관한 것이다. 구체적으로 디스플레이장치 내부의 열을 용이하게 방출하며 동시에 개선된 접지구조를 갖는 디스플레이장치에 관한 것이다.The present invention relates to a display device. More specifically, it relates to a display device having an improved grounding structure while easily dissipating heat inside the display device.
일반적으로 디스플레이장치는 텔레비전, 컴퓨터용 모니터, 디지털 정보 디스플레이 등과 같이 화면 상에 영상을 표시하는 장치이다.In general, a display device is a device that displays an image on a screen, such as a television, a computer monitor, and a digital information display.
디스플레이패널로는 액정표시패널을 사용하는 디스플레이 모듈이 널리 사용되고 있다.As a display panel, a display module using a liquid crystal display panel is widely used.
디스플레이장치는 디스플레이패널과, 디스플레이패널에 광을 입사시키는 백라이트 유닛(Back Light Unit, BLU)을 포함할 수 있다. 디스플레이패널은 액정층을 사이에 두고 서로 마주하는 한 쌍의 기판으로 형성될 수 있다. 백라이트 유닛에는 디스플레이패널로 광을 입사시키는 광원(복수의 LED)를 포함하는 LED 모듈이 마련될 수 있다. LED 모듈은 광을 발생시킬 뿐만 아니라 열도 함께 방출하여 디스플레이패널을 열화 시킬 수 있다.The display device may include a display panel and a backlight unit (BLU) for incident light on the display panel. The display panel may be formed of a pair of substrates facing each other with a liquid crystal layer interposed therebetween. The backlight unit may be provided with an LED module including a light source (a plurality of LEDs) for incident light to the display panel. The LED module not only generates light but also emits heat, which can deteriorate the display panel.
또한 디스플레이장치는 디스플레이패널과 상기 백라이트 유닛의 구동에 사용되는 복수의 PBA(Printed Board Assembly)를 포함할 수 있다. 종래에는 이러한 복수의 PBA를 디스플레이패널의 후방에 위치하였다. 따라서 복수의 PBA에서 발생되는 열이 전방에 위치한 디스플레이패널을 열화 시킬 수 있다. 또한 얇은 두께의 디스플레이장치가 벽에 장착되어 사용될 경우 복수의 PBA에서 발생되는 열이 후방으로 열을 방출하는 구조를 취하더라도 벽에 근접하여 장착되는 구조 특성상 효과적인 열 방출을 달성할 수 없었다. In addition, the display apparatus may include a display panel and a plurality of printed board assemblies (PBAs) used to drive the backlight unit. Conventionally, such a plurality of PBAs were positioned at the rear of the display panel. Therefore, the heat generated by the plurality of PBAs may deteriorate the display panel located in the front. In addition, when a thin-walled display device is mounted on a wall, even if the heat generated by the plurality of PBAs has a structure that emits heat to the rear, effective heat dissipation cannot be achieved due to the structural characteristics of being mounted close to the wall.
따라서, 디스플레이장치는 액정패널의 열화 현상을 방지하기 위한 방열구조를 구비할 수 있으며, 방열구조는 팬과 에어필터를 포함하는 구조에 의해 구현될 수 있다. 다만 이러한 경우 제조 공정이 복잡해지고 제조 단가가 상승하게 된다. 이러한 방열구조는 상당한 부피를 차지하므로, 슬림한 디자인을 가지는 디스플레이장치에 적용하는데 한계가 있다. 구체적으로, 팬과 에어필터를 포함하는 방열구조의 경우, 주기적으로 필터를 교환해야 하므로 높은 유지보수 비용을 요한다.Accordingly, the display device may have a heat dissipation structure for preventing deterioration of the liquid crystal panel, and the heat dissipation structure may be implemented by a structure including a fan and an air filter. However, in this case, the manufacturing process becomes complicated and the manufacturing cost increases. Since such a heat dissipation structure occupies a considerable volume, there is a limit to its application to a display device having a slim design. Specifically, in the case of a heat dissipation structure including a fan and an air filter, a high maintenance cost is required because the filter must be replaced periodically.
또한 LED 모듈 복수의 PBA가 각각 별도의 접지 구조로 마련됨으로 인하여 접지 구조를 구현하기 위하여 추가되는 배선수의 증가하고, 이로 인하여 제조비용의 증가되며 디스플레이장치의 전자 부품간의 과전류가 흐름 위험성 증가하는 문제점이 존재하였다.In addition, since the plurality of PBAs of the LED module are provided as separate grounding structures, the number of wires added to implement the grounding structure increases, which increases the manufacturing cost and increases the risk of overcurrent flowing between the electronic components of the display device. this existed.
복수의 PBA, 백라이트 유닛 및 방열판의 배치 구조를 통하여 내부의 열을 용이하게 관리하고 간단한 구조를 통하여 복수의 PBA 및 백라이트 유닛을 효과적으로 접지할 수 있는 디스플레이장치를 개시한다.Disclosed is a display device capable of easily managing internal heat through an arrangement structure of a plurality of PBAs, a backlight unit, and a heat sink and effectively grounding a plurality of PBAs and a backlight unit through a simple structure.
본 발명의 사상에 따른 디스플레이장치는 디스플레이패널; 상기 디스플레이패널의 후방에 배치된 도광판; 상기 도광판에 광을 조사하도록, 상기 도광판의 측면을 따라 배치되는 복수의 LED를 포함하는 LED 모듈; 디스플레이장치의 제어 및 영상처리 위하여 구비되는 PBA(Printed Board Assembly); 및 일측에 상기 LED 모듈이 장착되고, 타측에 상기 PBA가 장착되는방열플레이트;를 포함할 수 있고, 상기 방열플레이트와 상기 PBA는 상기 디스플레이패널의 전, 후방과 중첩되지 않도록 배치되어 상기 방열플레이트를 통해 전달되는 열과 상기 PBA로부터 발생된 열이 상기 디스플레이패널의 둘레의 전방 외측으로 방열되도록 마련될 수 있다. A display apparatus according to the spirit of the present invention includes a display panel; a light guide plate disposed behind the display panel; an LED module including a plurality of LEDs disposed along a side surface of the light guide plate to irradiate light to the light guide plate; a PBA (Printed Board Assembly) provided for controlling a display device and processing an image; and a heat dissipation plate on which the LED module is mounted on one side and the PBA is mounted on the other side, wherein the heat dissipation plate and the PBA are disposed so as not to overlap the front and rear of the display panel to form the heat dissipation plate It may be provided so that heat transmitted through and heat generated from the PBA are radiated to the outside of the front of the periphery of the display panel.
상기 방열플레이트는 상기 PBA가 장착되는 제1 장착면을 포함하는 제1 방열플레이트와 상기 LED 모듈이 장착되는 제2 장착면을 포함하는 제2 방열플레이트를 포함하고, 상기 제1 장착면은 디스플레이패널의 전방을 향하도록 형성되며 상기 제2 장착면과 상기 제2 방열플레이트는 상기 복수의 LED가 배치되는 방향을 따라 연장될 수 있다. The heat dissipation plate includes a first heat dissipation plate including a first mounting surface on which the PBA is mounted and a second heat dissipation plate including a second mounting surface on which the LED module is mounted, wherein the first mounting surface is a display panel It is formed to face the front of the second mounting surface and the second heat dissipation plate may extend along a direction in which the plurality of LEDs are arranged.
상기 제1 장착면은 상기 디스플레이패널의 둘레의 외측에 배치될 수 있다. The first mounting surface may be disposed outside the periphery of the display panel.
상기 제1 장착면은 상기 디스플레이패널의 하부에 배치되며,상기 제2 방열플레이트는 상기 제1 방열플레이트의 하단으로부터 후방을 향하여 돌출되며, 상기 제2 방열플레이트의 상부에 상기 제2 장착면이 형성될 수 있다. The first mounting surface is disposed under the display panel, the second heat dissipation plate protrudes from the lower end of the first heat dissipation plate toward the rear, and the second mounting surface is formed on the upper portion of the second heat dissipation plate. can be
상기 도광판은 상기 제2 장착면에 장착된 상기 LED 모듈의 상단까지 연장되며, 상기 방열플레이트는 상기 제1 방열플레이트의 상기 제1 장착면의 반대 면에 형성되는 지지부를 포함하고, 상기 지지부는 상기 도광판의 하부의 전면을 지지할 수 있다. The light guide plate extends to an upper end of the LED module mounted on the second mounting surface, and the heat dissipation plate includes a support formed on a surface opposite to the first mounting surface of the first heat dissipation plate, and the support portion is the The front surface of the lower portion of the light guide plate may be supported.
상기 도광판의 배면을 커버하며 상기 배면에 접하도록 배치되는 후방 반사시트 및 상시 도광판의 전방에 배치되며 상기 도광판의 상기 하부의 전면을 커버하며 상기 하부의 전면에 접하도록 배치되는 전방 반사시트를 포함할 수 있다. a rear reflection sheet covering the rear surface of the light guide plate and disposed in contact with the rear surface; can
상기 제2 방열플레이트는 상기 도광판의 둘레의 외측에 배치될 수 있다. The second heat dissipation plate may be disposed outside the circumference of the light guide plate.
상기 제2 방열플레이트는 상기 도광판의 하부에 배치되며, The second heat dissipation plate is disposed under the light guide plate,
상기 제2 방열플레이트는 상기 제1 방열플레이트의 상단으로부터 전방을 향하여 돌출되며, 상기 제2 방열플레이트의 상부에 상기 제2 장착면이 형성될 수 있다. The second heat dissipation plate may protrude forward from an upper end of the first heat dissipation plate, and the second mounting surface may be formed on an upper portion of the second heat dissipation plate.
상기 도광판은 상기 제2 장착면에 장착된 LED 모듈의 상단까지 연장되며, 상기 방열플레이트는 상기 제1 방열플레이트의 상기 제1 장착면의 반대 면에 형성되는 지지부를 포함하고, 상기 지지부는 상기 도광판의 배면을 지지하는 리어섀시(Rear Chassis)에 의해 지지될 수 있다. The light guide plate extends to an upper end of the LED module mounted on the second mounting surface, and the heat dissipation plate includes a support formed on a surface opposite to the first mounting surface of the first heat dissipation plate, and the support portion is the light guide plate It may be supported by a rear chassis that supports the rear surface of the .
상기 리어섀시는, 상기 리어섀시로부터 상기 도광판과 상기 복수의 LED 사이로 돌출되며 상기 도광판의 하단 일부를 지지하여 상기 도광판과 상기 복수의 LED를 이격시키도록 마련되는 스페이서를 포함할 수 있다. The rear chassis may include a spacer that protrudes from the rear chassis between the light guide plate and the plurality of LEDs and is provided to support a lower portion of the light guide plate to space the light guide plate and the plurality of LEDs apart.
상기 도광판의 후방에 배치되며 상기 도광판의 배면을 커버하며 상기 배면에 접하도록 마련되는 후방 반사시트를 포함할 수 있다. and a rear reflection sheet disposed behind the light guide plate to cover a rear surface of the light guide plate and to be in contact with the rear surface.
상기 디스플레이패널의 전방에서 상기 디스플레이패널의 둘레를 덮도록 마련되는 제1 커버부와 상기 제1 커버부의 하부에 마련되며 상기 제1 커버부보다 상기 디스플레이패널의 전방을 향하여 돌출되는 제2 커버부를 포함하는 프런트커버(Front Cover)를 더 포함할 수 있다. A first cover portion provided to cover the circumference of the display panel from the front of the display panel, and a second cover portion provided under the first cover portion and protruding toward the front of the display panel than the first cover portion It may further include a front cover (Front Cover).
상기 제2 커버부와 상기 제1 방열플레이트 사이에 형성되며 상기 PBA가 배치되는 PBA 수용부를 더 포함할 수 있다. It is formed between the second cover part and the first heat dissipation plate and may further include a PBA receiving part in which the PBA is disposed.
상기 프런트커버의 상기 제2 커버부는 상기 PBA 수용부와 외부를 연통시키는 복수의 홀을 포함하며, 상기 복수의 홀을 통하여 상기 PBA 수용부의 열이 상기 디스플레이패널의 둘레의 전방 외측으로 유동되도록 마련될 수 있다. The second cover portion of the front cover includes a plurality of holes for communicating the PBA accommodation portion and the outside, and through the plurality of holes, the heat of the PBA accommodation portion is provided to flow outwardly in front of the periphery of the display panel. can
상기 디스플레이장치는 상기 복수의 홀이 형성된 위치에 대응하여 상기 PBA 수용부에 배치되는 스피커를 더 포함할 수 있다. The display device may further include a speaker disposed in the PBA receiving unit corresponding to the position where the plurality of holes are formed.
상기 방열플레이트는 금속 재질로 형성될 수 있다. The heat dissipation plate may be formed of a metal material.
본 발명의 사상에 따른 디스플레이장치는, 디스플레이패널; 상기 디스플레이패널의 후방에 배치된 도광판; 상기 도광판에 광원을 조사하도록, 상기 도광판의 측면을 따라 실장되는 복수의 LED를 포함하는 LED 모듈; 디스플레이장치의 영상송출을 위하여 구비되는 PBA(Printed Board Assembly); 및 상기 복수의 LED의 음극(Cathode)과 상기 PBA의 접지단자가 연결되는 금속재질의 방열플레이트를 포함할 수 있다. A display device according to the spirit of the present invention, a display panel; a light guide plate disposed behind the display panel; an LED module including a plurality of LEDs mounted along a side surface of the light guide plate to irradiate a light source to the light guide plate; PBA (Printed Board Assembly) provided for image transmission of the display device; and a metal heat dissipation plate to which cathodes of the plurality of LEDs and a ground terminal of the PBA are connected.
상기 방열플레이트는 상기 PBA가 장착되는 제1 장착면을 포함하는 제1 방열플레이트와 상기 LED 모듈이 장착되는 제2 장착면을 포함하는 제2 방열플레이트를 포함하고, 상기 제1 장착면은 전방을 향하도록 형성되며 상기 제2 장착면과 상기 제2 방열플레이트는 상기 복수의 LED가 실장되는 방향을 따라 연장될 수 있다. The heat dissipation plate includes a first heat dissipation plate including a first mounting surface on which the PBA is mounted and a second heat dissipation plate including a second mounting surface on which the LED module is mounted, and the first mounting surface faces the front It is formed to face the second mounting surface and the second heat dissipation plate may extend along a direction in which the plurality of LEDs are mounted.
상기 방열플레이트는 상기 디스플레이패널의 하부에 배치될 수 있다. The heat dissipation plate may be disposed under the display panel.
상기 디스플레이패널의 전방에서 상기 디스플레이패널의 둘레를 덮도록 마련되는 제1 커버부와 상기 제1 커버부의 하부에 마련되며 상기 제1 커버부보다 전방으로 돌출되는 제2 커버부를 포함하는 프런트커버(Front Cover)를 더 포함하며, A front cover including a first cover portion provided to cover the circumference of the display panel from the front of the display panel and a second cover portion provided under the first cover portion and protruding forward from the first cover portion Cover) is further included,
상기 제2 커버부는 배면으로부터 후방을 향하여 돌출되며, 상기 방열플레이트를 지지하는 절연체로 형성된 지지플랜지를 포함할 수 있다. The second cover part may include a support flange that protrudes from the rear surface toward the rear and is formed of an insulator for supporting the heat dissipation plate.
방열플레이트의 제1 방열플레이트와 제2 방열플레이트가 일체구조로 형성됨으로써 효과적인 방열구조는 물론 디스플레이패널과 도광판을 지지하는 미들몰드와 함께 디스플레이장치의 내부 구성을 더욱 견고히 지지하는 강성 보강 구조를 제공할 수 있다.The first heat dissipation plate and the second heat dissipation plate of the heat dissipation plate are integrally formed to provide an effective heat dissipation structure as well as a rigid reinforcement structure that more firmly supports the internal configuration of the display device together with the middle mold supporting the display panel and the light guide plate. can
방열플레이트가 금속재질로 마련되며 LED의 음극 PBA의 접지단자가 동시에 연결되어, 동일한 그라운드를 공유하는 구조는 서지 전압으로 인한 디스플레이장치 내부의 부품이 손상될 염려를 최소화하는 효과와 더불어 각 전자부품간에 기준전위차이로 인한 과전류가 흐르는 상황을 방지하는 효과도 달성할 수 있다.The heat dissipation plate is made of a metal material and the ground terminal of the cathode PBA of the LED is connected at the same time, and the structure sharing the same ground minimizes the risk of damage to the components inside the display device due to the surge voltage, and is used between each electronic component. It is also possible to achieve the effect of preventing an overcurrent from flowing due to the reference potential difference.
도 1은 본 발명의 일 실시예에 따른 디스플레이장치의 전방 외관을 도시한 사시도이다. 1 is a perspective view illustrating a front exterior of a display device according to an embodiment of the present invention.
도 2는 도 1의 디스플레이장치를 분해하여 도시한 전방 분해사시도이다. FIG. 2 is an exploded front perspective view illustrating the display device of FIG. 1 by disassembling it.
도 3 및 도 4는 본 발명의 일 실시예에 따른 디스플레이장치의 PBA를 포함한 단면을 우측에서 바라본 단면도이다. 3 and 4 are cross-sectional views viewed from the right side of a cross-section including a PBA of a display device according to an embodiment of the present invention.
도 5는 도 2의 A영역을 확대한 도면이다. FIG. 5 is an enlarged view of area A of FIG. 2 .
도 6는 본 발명의 다른 실시예에 따른 디스플레이장치를 분해하여 도시한 전방 분해사시도이다. 6 is an exploded front perspective view illustrating an exploded display device according to another embodiment of the present invention.
도 7 및 도 8은 본 발명의 다른 실시예에 따른 디스플레이장치의 PBA를 포함한 단면을 우측에서 바라본 단면도이다.7 and 8 are cross-sectional views viewed from the right side of a cross-section including a PBA of a display device according to another embodiment of the present invention.
도 9은 도 5의 B영역을 확대한 도면이다. FIG. 9 is an enlarged view of area B of FIG. 5 .
도 10은 본 발명의 일 실시예에 따른 디스플레이장치의 PBA 및 LED 모듈의 접지 구조를 회로와 함께 모식적으로 나타낸 도면이다. 10 is a diagram schematically illustrating a ground structure of a PBA and an LED module of a display device according to an embodiment of the present invention together with a circuit.
본 명세서에 기재된 실시예와 도면에 도시된 구성은 개시된 발명의 바람직한 일 예에 불과할 뿐이며, 본 출원의 출원시점에 있어서 본 명세서의 실시예와 도면을 대체할 수 있는 다양한 변형 예들이 있을 수 있다.The configuration shown in the embodiments and drawings described in this specification is only a preferred example of the disclosed invention, and there may be various modifications that can replace the embodiments and drawings of the present specification at the time of filing of the present application.
또한, 본 명세서의 각 도면에서 제시된 동일한 참조번호 또는 부호는 실질적으로 동일한 기능을 수행하는 부품 또는 구성요소를 나타낸다.In addition, the same reference numbers or reference numerals in each drawing in the present specification indicate parts or components that perform substantially the same functions.
또한, 본 명세서에서 사용한 용어는 실시예를 설명하기 위해 사용된 것으로, 개시된 발명을 제한 및/또는 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "가지다"등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는다.In addition, the terms used herein are used to describe the embodiments, and are not intended to limit and/or limit the disclosed invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present specification, terms such as "comprise" or "have" are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It does not preclude the possibility of the presence or addition of figures, numbers, steps, operations, components, parts, or combinations thereof.
또한, 본 명세서에서 사용한 "제1", "제2" 등과 같이 서수를 포함하는 용어는 다양한 구성요소들을 설명하는데 사용될 수 있지만, 상기 구성요소들은 상기 용어들에 의해 한정되지는 않으며, 상기 용어들은 하나의 구성요소를 다른 구성요소로부터 구별하는 목적으로만 사용된다. 예를 들어, 본 발명의 권리 범위를 벗어나지 않으면서 제1 구성요소는 제2 구성요소로 명명될 수 있고, 유사하게 제2 구성요소도 제1 구성요소로 명명될 수 있다. "및/또는"이라는 용어는 복수의 관련된 기재된 항목들의 조합 또는 복수의 관련된 기재된 항목들 중의 어느 항목을 포함한다.In addition, terms including an ordinal number such as "first", "second", etc. used herein may be used to describe various elements, but the elements are not limited by the terms, and the terms are It is used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The term “and/or” includes a combination of a plurality of related listed items or any of a plurality of related listed items.
한편, 하기의 설명에서 사용된 용어 "상하 방향", "하측", 및 "전후 방향" 등은 도면을 기준으로 정의한 것이며, 이 용어에 의하여 각 구성요소의 형상 및 위치가 제한되는 것은 아니다.On the other hand, the terms "up and down direction", "lower side", "front-back direction", etc. used in the following description are defined based on the drawings, and the shape and position of each component is not limited by these terms.
“전방”, "후방", "상측", "하측", "좌측" 및 "우측"의 방향에 대하여는 첨부된 도면 도 1에 도시된 방향을 기준으로 명세서 전반에 걸쳐 통일적으로 지칭하기로 한다. 도 1에는 서로 수직한 X축, Y축, Z축 방향이 표시되어 있으며, X축 방향은 디스플레이장치의 좌우 방향을 의미하고, Y축 방향은 디스플레이장치의 상하 방향을 의미하며, Z축 방향은 디스플레이장치의 전후 방향을 의미한다.The directions of "front", "rear", "upper", "lower", "left" and "right" are uniformly referred to throughout the specification based on the direction shown in FIG. 1 of the accompanying drawings. 1 shows the X-axis, Y-axis, and Z-axis directions perpendicular to each other, the X-axis direction means the left-right direction of the display device, the Y-axis direction means the vertical direction of the display device, and the Z-axis direction is It means the front-back direction of the display device.
디스플레이장치는 영상을 표시하는 장치를 통칭한다. 디스플레이장치는 텔레비전, 모니터, 모바일 디바이스 등을 포함할 수 있다. 이하에서는, 디스플레이장치의 일 예로써 텔레비전을 중심으로 설명한다. 텔레비전은 평면 텔레비전(flat television), 곡면 텔레비전(curved television), 가변형 텔레비전(bendable television) 등을 포함할 수 있고, 이하에서는 텔레비전의 일 예로써, 평면 텔레비전을 중심으로 본 발명에 따른 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명한다.A display device refers to a device that displays an image. The display apparatus may include a television, a monitor, a mobile device, and the like. Hereinafter, a television will be mainly described as an example of the display device. The television may include a flat television, a curved television, a bendable television, and the like. Hereinafter, a preferred embodiment according to the present invention will be described mainly with a flat television as an example of the television. It will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일 실시예에 따른 디스플레이장치의 전방 외관을 도시한 사시도이다. 도 2는 도 1의 디스플레이장치를 분해하여 도시한 전방 분해사시도이다. 도 3 및 도 4는 본 발명의 일 실시예에 따른 디스플레이장치의 PBA를 포함한 단면을 우측에서 바라본 단면도이다. 도 5는 도 2의 A영역을 확대한 도면이다.1 is a perspective view illustrating a front exterior of a display device according to an embodiment of the present invention. FIG. 2 is an exploded front perspective view illustrating the display device of FIG. 1 by disassembling it. 3 and 4 are cross-sectional views viewed from the right side of a cross-section including a PBA of a display device according to an embodiment of the present invention. FIG. 5 is an enlarged view of area A of FIG. 2 .
도 1 내지 도 4에 도시된 바와 같이, 디스플레이장치(10)는 디스플레이패널(100) 및 백라이트 유닛을 수용하고 지지하는 섀시 어셈블리(Chassis Assembly)를 포함할 수 있다.1 to 4 , the display apparatus 10 may include a chassis assembly for accommodating and supporting the display panel 100 and the backlight unit.
디스플레이패널(100)은 각각 전극이 마련되어 있는 두 유리기판 사이에 액정이 봉입되어 형성되는 액정 패널로 이루어지고 전방으로 영상을 표시할 수 있다.The display panel 100 is composed of a liquid crystal panel formed by encapsulating liquid crystal between two glass substrates each having electrodes, and can display an image in the front.
디스플레이패널(100)은 전방인 제 1방향(Z)을 향해 영상을 표시할 수 있다.The display panel 100 may display an image toward the first direction Z, which is the front.
섀시 어셈블리는 프런트커버(800)와, 미들몰드(710)와, 리어 섀시(720)와, 리어커버(730)를 포함할 수 있다.The chassis assembly may include a front cover 800 , a middle mold 710 , a rear chassis 720 , and a rear cover 730 .
프런트커버(800)는 디스플레이패널(100)을 노출시키기 위한 개구를 포함할 수 있다. 프런트커버(800)는 디스플레이패널(100)의 전면 외곽측을 덮는 베젤부와, 베젤부의 단부에서 후방측으로 절곡되어 미들몰드(710)의 측면을 덮는 탑 측면부를 포함한다.The front cover 800 may include an opening for exposing the display panel 100 . The front cover 800 includes a bezel portion that covers the front outer side of the display panel 100 , and a top side portion that is bent from the end of the bezel portion to the rear side and covers the side surface of the middle mold 710 .
프런트커버(800)는 미들몰드(710)의 전방측에 결합되어 디스플레이패널(100)이 미들몰드(710)에 설치되어 있는 상태를 유지하도록 마련될 수 있다. 본 발명의 실시예들에 의한 디스플레이장치(10) 프런트커버(800)의 구체적인 형상 및 구조에 관하여는 후술하도록 한다. The front cover 800 may be coupled to the front side of the middle mold 710 to maintain the display panel 100 installed in the middle mold 710 . The specific shape and structure of the front cover 800 of the display device 10 according to embodiments of the present invention will be described later.
미들몰드(710)는 전방측에 광학시트(101), 디스플레이패널(100) 및 프런트커버(800)가 차례로 설치되며, 후방측에 도광판(200), 반사시트(620) 및 리어섀시(720)가 차례로 설치되어 각 구성들을 지지할 뿐만 아니라 디스플레이패널(100)과 리어섀시(720)가 서로 이격된 상태를 유지하도록 마련될 수 있다.In the middle mold 710, the optical sheet 101, the display panel 100, and the front cover 800 are sequentially installed on the front side, and the light guide plate 200, the reflective sheet 620 and the rear chassis 720 are installed on the rear side. are installed in sequence to support each component, and may be provided to maintain the display panel 100 and the rear chassis 720 spaced apart from each other.
리어섀시(720)는 상단에 미들몰드(710)와 결합하는 미들몰드 결합부(미도시) 및 하단에서 프런트커버(800)와 결합하는 프런트커버 결합부(미도시)를 포함할 수 있다. 리어섀시(720)는 도광판의 배면에서 도광판(200)을 지지하는 지지부(512)를 더 포함할 수 있다. The rear chassis 720 may include a middle mold coupling part (not shown) coupled to the middle mold 710 at the upper end and a front cover coupling part (not shown) coupled to the front cover 800 at the bottom. The rear chassis 720 may further include a support 512 supporting the light guide plate 200 on the rear surface of the light guide plate.
리어섀시(720)는 고강도의 다각 판 형상으로 형성되며, 디스플레이장치(10)의 내부 구성의 발열에 의해 발생되는 열에 의한 열변형이 적은 금속재질(예를 들어, 알루미늄 또는 알루미늄 합금등)을 포함할 수 있다.The rear chassis 720 is formed in a high-strength polygonal plate shape, and includes a metal material (for example, aluminum or aluminum alloy, etc.) that has little thermal deformation due to heat generated by the heat generated by the internal configuration of the display device 10 . can do.
리어섀시(720)는 열 전도율이 높은 재질로 마련될 수 있다. 이에 따라 도광판(200) 또는 반사시트(620)에서 발생된 열을 용이하게 방열하여 디스플레이장치(10)의 신뢰성을 향상시킬 수 있다.The rear chassis 720 may be made of a material having high thermal conductivity. Accordingly, the heat generated by the light guide plate 200 or the reflective sheet 620 can be easily dissipated to improve the reliability of the display device 10 .
리어섀시(720)는 플라스틱(예를들어, 폴리카보네이트(poly carbonate, PC)재질 또는 플라스틱 재질에 유리섬유(glass fiber)를 추가하여 성형될 수 있다.The rear chassis 720 may be formed of plastic (eg, polycarbonate (PC)) or by adding glass fiber to the plastic material.
디스플레이장치(10)는 이와 같은 섀시 어셈블리를 보호하고 수용하도록 섀시 어셈블리를 감싸는 리어섀시(720)의 후방을 커버하는 리어커버(730)를 더 포함할 수 있다. 리어커버(730)는 리어섀시(720)가 프런트커버(800) 및 미들몰드(710)에 고정된 후, 리어섀시(720)의 후방에서 프런트커버(800)와 최종 결합되도록 마련될 수 있다. 프런트커버(800)와 리어커버(730)의 체결은 복수의 체결부재(미도시)를 통하여 이루어 질 수 있다. The display device 10 may further include a rear cover 730 that covers the rear of the rear chassis 720 surrounding the chassis assembly to protect and accommodate the chassis assembly. The rear cover 730 may be provided to be finally coupled to the front cover 800 at the rear of the rear chassis 720 after the rear chassis 720 is fixed to the front cover 800 and the middle mold 710 . The fastening of the front cover 800 and the rear cover 730 may be performed through a plurality of fastening members (not shown).
디스플레이장치(10)는 디스플레이패널(100)에 광을 공급하도록 마련되는 백 라이트 유닛(Back Light Unit, BLU)을 더 포함할 수 있다.The display apparatus 10 may further include a back light unit (BLU) provided to supply light to the display panel 100 .
백 라이트 유닛은 광원과 광원이 실장되는 기판으로 구성되는 광원 모듈과, 광원 모듈에서 발산되는 광의 이동경로 상에 배치되는 도광판(200)과 각종 광학시트(101)를 포함할 수 있다.The backlight unit may include a light source module including a light source and a substrate on which the light source is mounted, a light guide plate 200 and various optical sheets 101 disposed on a movement path of light emitted from the light source module.
도광판(200)은 디스플레이패널(100)의 후방에서 디스플레이패널(100)의 배면과 마주하도록 배치될 수 있다. 도광판(200)은 디스플레이패널(100)과 대응하도록 좌우 폭이 상하 길이에 비해 긴 직사각형 판 형상으로 형성되며, 광이 통과할 수 있도록 투명 재질로 형성된다.The light guide plate 200 may be disposed to face the rear surface of the display panel 100 from the rear of the display panel 100 . The light guide plate 200 is formed in a rectangular plate shape with left and right widths longer than the vertical length to correspond to the display panel 100 , and is made of a transparent material to allow light to pass therethrough.
광원 모듈은 광을 발산하는 광원(light source)을 포함할 수 있다.The light source module may include a light source that emits light.
백 라이트 유닛은 광원이 디스플레이패널(100)의 후방에 배치되는 도광판(200)의 측면과 대향하도록 배치되며, 도광판(200)을 통하여 광을 디스플레이패널(100)에 공급하는 엣지형(Edge Type) 또는 광원이 디스플레이패널(100)의 직하방에 배치되는 직하형(Direct Type)으로 크게 나뉠 수 있다. 본 사상의 실시예들에 의한 디스플레이장치(10)의 경우, 엣지형(Edge Type)으로 마련되는 것을 전제로 서술하도록 한다.The backlight unit is disposed so that the light source faces the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type) Alternatively, the light source may be largely divided into a direct type in which the light source is disposed directly below the display panel 100 . In the case of the display device 10 according to embodiments of the present invention, it will be described on the premise that it is provided as an edge type.
광원 모듈은 광을 발산하는 엘이디(Light Emitting Diode, LED)가 수용되는 LED 패키지로 마련될 수 있다. 본 발명의 실시예들에 의한 디스플레이장치(10)의 광원 모듈은 LED 모듈(300)인 것을 전제로 서술하도록 한다. LED 모듈(300)은 디스플레이패널(100)에 광을 공급하도록 마련될 수 있다. LED 모듈(300)은 디스플레이패널(100)의 후방에서 디스플레이패널(100)에 광을 공급할 수 있다. LED 모듈(300)의 광원은 일반적인 LED와 달리 100~300μm 크기의 LED 칩으로 형성되는 mini-LED로 마련될 수 있다.The light source module may be provided as an LED package in which an LED that emits light (Light Emitting Diode, LED) is accommodated. The light source module of the display device 10 according to the embodiments of the present invention will be described on the premise that the LED module 300 is used. The LED module 300 may be provided to supply light to the display panel 100 . The LED module 300 may supply light to the display panel 100 from the rear of the display panel 100 . Unlike a general LED, the light source of the LED module 300 may be provided as a mini-LED formed of an LED chip having a size of 100 to 300 μm.
LED 모듈(300)은 복수의 LED(310)와 복수의 LED(310)가 배치되는 LED 기판(320)을 포함할 수 있다. The LED module 300 may include a plurality of LEDs 310 and an LED substrate 320 on which the plurality of LEDs 310 are disposed.
도 3을 참조하면, LED 모듈(300)은 디스플레이패널(100)의 후방에 배치되는 도광판(200)의 측면과 대향하도록 배치되며, 도광판(200)을 통하여 광을 디스플레이패널(100)에 공급하도록 마련될 수 있다. 즉 도 1을 참고할 때, 기판은 X방향으로, 다르게 설명하자면 좌우 방향으로 연장되는 바(Bar) 형상으로 마련될 수 있다. 즉, LED 기판(320)은 좌우 방향으로 또는 X방향으로 연장되는 길이부를 가질 수 있다. 도 3 내지 도 5를 참조하면, LED 모듈(300), 구체적으로 복수의 LED(310)는 도광판(200)에 광을 조사하도록, 도광판의 측면을 따라 LED 기판(320)에 배치될 수 있다. Referring to FIG. 3 , the LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 . can be provided. That is, referring to FIG. 1 , the substrate may be provided in the shape of a bar extending in the X-direction, in other words, in the left-right direction. That is, the LED substrate 320 may have a length extending in the left-right direction or the X-direction. 3 to 5 , the LED module 300 , specifically, the plurality of LEDs 310 may be disposed on the LED substrate 320 along the side surface of the light guide plate 200 to irradiate light to the light guide plate 200 .
LED 기판(320)은 글래스(Glass) 재질로 형성될 수 있다. 다만, 이에 한정되지 않고 LED 기판(320) 은 다른 물성을 가지는 재질로 형성될 수 있다. LED 기판(320)에는 복수의 LED(310)에 구동 전원 및 신호를 전달하기 위한 회로 패턴 등이 형성될 수 있다.The LED substrate 320 may be formed of a glass material. However, the present invention is not limited thereto, and the LED substrate 320 may be formed of a material having different physical properties. A circuit pattern for transmitting driving power and signals to the plurality of LEDs 310 may be formed on the LED substrate 320 .
LED 모듈(300)에서 출사되는 광 특성을 향상시키기 위해 도광판(200)과 디스플레이패널(100) 사이에는 광학시트(101)가 배치될 수 있다.An optical sheet 101 may be disposed between the light guide plate 200 and the display panel 100 in order to improve the characteristics of the light emitted from the LED module 300 .
광학시트(101)는 프리즘 시트(미도시) 및 보호 시트(미도시) 등을 포함할 수 있다.The optical sheet 101 may include a prism sheet (not shown) and a protective sheet (not shown).
프리즘 시트는 삼각 프리즘 형상의 프리즘 패턴을 포함하고, 이 프리즘 패턴은 복수 개가 인접 배열되어 복수 개의 띠 모양을 이루는데 프리즘 패턴은 산과 골이 반복되는 패턴으로 열을 지어 디스플레이패널(100)을 향하여 돌출되어 형성된다. LED 모듈(300)에서 확산된 광이 프리즘 패턴을 투과하면서 굴절되고 이에 따라 디스플레이패널로 광이 수직 방향으로 입사될 수 있다.The prism sheet includes a prism pattern having a triangular prism shape, and a plurality of these prism patterns are arranged adjacent to each other to form a plurality of bands. is formed The light diffused from the LED module 300 is refracted while passing through the prism pattern, and accordingly, the light may be incident on the display panel in a vertical direction.
보호 시트는 각종 구성 부품을 외부의 충격이나 이물질의 유입으로부터 보호하는 구성으로 특히, 프리즘 시트는 스크래치가 발생하기 쉬우며, 보호 시트는 프리즘 시트의 스크래치를 방지할 수 있다.The protective sheet is a configuration that protects various components from external impact or the inflow of foreign substances. In particular, the prism sheet is easily scratched, and the protective sheet can prevent the prism sheet from being scratched.
디스플레이장치(10)의 내측에는 디스플레이장치(10)에 전원을 공급하는 전원기판(400a)과 각종 화상 및 소리 신호를 처리하기 위한 신호처리기판(400b)과, 디스플레이패널(100)로 화상 신호를 전달하는 타이밍컨트롤기판(미도시)등이 배치될 수 있다. Inside the display device 10 , a power substrate 400a for supplying power to the display device 10 , a signal processing substrate 400b for processing various image and sound signals, and an image signal to the display panel 100 . A timing control board (not shown) to transmit may be disposed.
허나 이에 제한되지 않으며 상기 타이밍컨트롤기판(미도시)은 상기 신호처리 기판과 통합된 형태로 구현 될 수도 있다.However, the present invention is not limited thereto, and the timing control substrate (not shown) may be implemented in an integrated form with the signal processing substrate.
상기 각종 기판들은 PCB(Printed Circuit Board, 인쇄회로기판) 상에 전기적 기계적 부품이 실장되거나, 다른 인쇄회로기판과 연결되어 전기적 기계적으로 최종 가공 처리된 PBA(Printed Board Assembly)로 구성될 수 있다. 이하의 설명에서는 상기 전원기판(400a), 신호처리기판(400b), 타이밍컨트롤기판(미도시) 등 디스플레이장치(10)의 영상송출을 위하여 구비되는 각종 전기적 기판들을 통칭하여 PBA라고 지칭하도록 한다. 다만 상술한 LED 기판(320)의 경우 본 사상의 실시예들에 적용되는 방열플레이트(500)에서의 배치 구조상 상술한 PBA와는 별도의 구성으로서 설명하도록 한다. The various boards may be configured as a PBA (Printed Board Assembly) in which electrical and mechanical components are mounted on a printed circuit board (PCB) or connected to another printed circuit board to be electrically and mechanically finally processed. In the following description, various electrical substrates provided for image transmission of the display device 10, such as the power substrate 400a, the signal processing substrate 400b, and the timing control substrate (not shown), are collectively referred to as PBA. However, in the case of the above-described LED substrate 320, the arrangement structure in the heat dissipation plate 500 applied to the embodiments of the present invention will be described as a configuration separate from the above-described PBA.
종래에는 이러한 PBA를 디스플레이패널의 후방에 주로 위치하였다. 따라서 PBA에서 발생되는 열이 전방에 위치한 디스플레이패널을 열화 시킬 수 있다. 또한 얇은 두께의 디스플레이장치가 벽에 장착되어 사용될 경우 PBA에서 발생되는 열이 후방으로 열을 방출하는 구조를 취하더라도 벽에 근접하여 장착되는 구조 특성상 효과적인 열 방출을 달성할 수 없었다. Conventionally, such a PBA was mainly located at the rear of the display panel. Therefore, the heat generated by the PBA may deteriorate the display panel located in the front. In addition, when a thin-walled display device is mounted on a wall, effective heat dissipation could not be achieved due to the structural characteristics of being mounted close to the wall, even if the heat generated from the PBA has a structure to radiate heat to the rear.
또한 LED 모듈(300)에서도 LED 자체에서 발생하는 열을 방출하기 위하여 별도의 방열구조가 필요하며 이는 제조공정이 복잡해지며 제조비용 증가로 이어지게 되었다. 또한 상술한 것과 같이 디스플레이 패널의 후방에 PBA와 함께 방열구조가 마련될 경우, 디스플레이 장치의 전후방향의 두께가 두꺼워지는 문제점이 발생하였다. In addition, in the LED module 300, a separate heat dissipation structure is required to dissipate heat generated from the LED itself, which complicates the manufacturing process and leads to an increase in manufacturing cost. In addition, as described above, when a heat dissipation structure is provided at the rear of the display panel together with the PBA, there is a problem in that the thickness of the display device is increased in the front and rear directions.
효과적인 방열구조 및 디스플레이 장치의 디스플레이패널이 배치된 부분의 전후방향 두께가 슬림해지기 위하여 본 발명의 일 실시예에 의한 디스플레이장치(10)는 일측에 LED 모듈(300)이 장착되고, 타측에 PBA(400)가 장착되는 방열플레이트(500)를 포함할 수 있다. 또한 방열플레이트와 상기 PBA는 상기 디스플레이패널의 전, 후방과 중첩되지 않도록 배치되어 상기 방열플레이트를 통해 전달되는 열과 상기 PBA로부터 발생된 열이 상기 디스플레이패널의 둘레의 전방 외측으로 방열되도록 마련될 수 있다. The display device 10 according to an embodiment of the present invention has an LED module 300 mounted on one side, and a PBA on the other side in order to have an effective heat dissipation structure and a thickness in the front-rear direction of the portion on which the display panel of the display device is disposed becomes slim. It may include a heat dissipation plate 500 on which the 400 is mounted. In addition, the heat dissipation plate and the PBA are disposed so as not to overlap the front and rear of the display panel so that the heat transmitted through the heat dissipation plate and the heat generated from the PBA may be provided to radiate heat to the outside of the front of the periphery of the display panel. .
다시 말하자면 후술하는 방열플레이트(500)의 구조적 형상 및 방열플레이트(500)의 디스플레이장치(10) 내부에서 배치되는 위치와 더불어 하나의 방열플레이트(500)의 복수의 측면에 각각 LED 모듈(300) 및 PBA(400)를 배치하여 효과적인 방열구조를 형성할 수 있다. 즉 PBA(400)와 LED 모듈(300)은 각각 별도의 방열구조를 구비할 필요가 없이 통합적인 열 전달 및 열 방출구조를 형성할 수 있다. In other words, in addition to the structural shape of the heat dissipation plate 500 to be described later and the position disposed inside the display device 10 of the heat dissipation plate 500, each LED module 300 and By disposing the PBA 400, an effective heat dissipation structure may be formed. That is, the PBA 400 and the LED module 300 may form an integrated heat transfer and heat dissipation structure without the need for a separate heat dissipation structure, respectively.
이하 본 발명의 일 실시예에 의한 디스플레이장치(10)의 방열플레이트(500)에 대하여 구체적으로 설명한다. Hereinafter, the heat dissipation plate 500 of the display device 10 according to an embodiment of the present invention will be described in detail.
방열플레이트(500)는 PBA(400)가 장착되는 제1 장착면(511)을 포함하는 제1 방열플레이트(510)와 LED 모듈(300)이 장착되는 제2 장착면(521)을 포함하는 제2 방열플레이트(520)를 포함할 수 있다. 도 2 내지 도 5를 참조하면, 제1 방열플레이트(510)와 제2 방열플레이트(520)는 일체로 형성되어 방열플레이트(500)를 구성할 수 있다. The heat dissipation plate 500 includes a first heat dissipation plate 510 including a first mounting surface 511 on which the PBA 400 is mounted and a second mounting surface 521 on which the LED module 300 is mounted. Two heat dissipation plates 520 may be included. 2 to 5 , the first heat dissipation plate 510 and the second heat dissipation plate 520 may be integrally formed to constitute the heat dissipation plate 500 .
일체로 형성된다는 것의 의미는 방열플레이트(500)를 제조하는 과정에서 몰드와 같은 제조방법을 통하여 제1 방열플레이트(510)와 제2 방열플레이트(520)가 틈새없이 물리적으로 일체로 형성되는 것을 의미할 수 도 있으나 이와 달리 도 2 내지 도 5에 도시된 것과 유사하게 서로 접하여 하나의 구조물을 형성하는 것을 의미할 수도 있다. The meaning of being integrally formed means that the first heat dissipation plate 510 and the second heat dissipation plate 520 are physically integrally formed without a gap through a manufacturing method such as a mold in the process of manufacturing the heat dissipation plate 500 Alternatively, it may mean forming a single structure by contacting each other similarly to that shown in FIGS. 2 to 5 .
PBA(400)가 장착되는 제1 장착면(511)을 포함하는 제1 방열플레이트(510)는 디스플레이패널(100)의 폭과 대응하도록 플레이트 형상으로 형성될 수 있다. 또한 열 전달 및 열 방출이 효과적으로 이루어 질 수 있도록 금속재질로 형성되나, 이에 제한 되지 않으며 열전도율이 높은 다른 물질로 구현 될 수도 있다.The first heat dissipation plate 510 including the first mounting surface 511 on which the PBA 400 is mounted may be formed in a plate shape to correspond to the width of the display panel 100 . In addition, it is formed of a metal material so that heat transfer and heat dissipation can be performed effectively, but the present invention is not limited thereto and may be implemented with other materials having high thermal conductivity.
제1 방열플레이트(510)는 제1 장착면(511)이 디스플레이패널의 전방을 향하도록 배치될 수 있다. 이는 후술하는 것과 같이 방열플레이트(500)의 디스플레이장치(10)내의 배치 구조와 더불어 디스플레이장치(10)의 후방이 아닌 전방으로 열이 방출될 수 있도록 설계하기 위함이다. The first heat dissipation plate 510 may be disposed such that the first mounting surface 511 faces the front of the display panel. This is to design the heat dissipation plate 500 so that heat can be emitted to the front rather than the rear of the display device 10 together with the arrangement structure in the display device 10 as will be described later.
제1 방열플레이트(510)의 제1 장착면(511)에는 PBA이외에도 스피커(900)가 배치될 수 있다. 도 2 내지 도 5를 참조하면 PBA(400)의 하단에 스피커(900)가 장착되도록 도시되어 있지만 스피커(900)와 PBA(400)는 방열플레이트(500), 구체적으로 제1 방열플레이트(510)의 제1 장착면(511)에 장착되는 기술적 특징을 유지하는 범위 내에서 그 배치 구조는 상이할 수 있다. 예를 들어 도 2 내지 도 5와는 달리 PBA(400)의 상단에 스피커(900)가 장착될 수도 있다. 또는 PBA(400)의 좌, 우측면 되는 양 측면에 장착 될 수도 있다. A speaker 900 in addition to the PBA may be disposed on the first mounting surface 511 of the first heat dissipation plate 510 . 2 to 5 , although the speaker 900 is shown to be mounted on the lower end of the PBA 400 , the speaker 900 and the PBA 400 are a heat dissipation plate 500 , specifically a first heat dissipation plate 510 . The arrangement structure may be different within the range of maintaining the technical characteristics of being mounted on the first mounting surface 511 of the . For example, unlike FIGS. 2 to 5 , the speaker 900 may be mounted on the upper end of the PBA 400 . Alternatively, it may be mounted on both sides of the left and right sides of the PBA 400 .
본 발명의 일 실시예에 의한 디스플레이장치(10)의 제2 방열플레이트(520)는 제1 방열플레이트(510)의 하단으로부터 후방을 향하여 돌출될 수 있다. LED 모듈(300)이 장착되는 제2 장착면(521)과 제2 방열플레이트(520)는 상기 복수의 LED(310)가 배치되는 방향을 따라 연장될 수 있다. The second heat dissipation plate 520 of the display apparatus 10 according to an embodiment of the present invention may protrude backward from the lower end of the first heat dissipation plate 510 . The second mounting surface 521 and the second heat dissipation plate 520 on which the LED module 300 is mounted may extend along a direction in which the plurality of LEDs 310 are disposed.
LED 모듈(300)은 디스플레이패널(100)의 후방에 배치되는 도광판(200)의 측면과 대향하도록 배치되며, 도광판(200)을 통하여 광을 디스플레이패널(100)에 공급하는 엣지형(Edge Type)으로 마련됨은 전술한 바와 같다. 다만 도 2 내지 도 5에 도시된 본 발명의 일 실시예에 의한 디스플레이장치(10)의 LED 모듈(300)은 도광판(200)이 직사각형의 판 형상으로 마련되는 것을 전제로 할 때, 도광판(200)의 네 개의 측면 중 하측 면에 대향하도록 배치되어 있다. The LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type) It is provided as described above. However, in the LED module 300 of the display device 10 according to an embodiment of the present invention shown in FIGS. 2 to 5 , on the premise that the light guide plate 200 is provided in a rectangular plate shape, the light guide plate 200 ) is arranged to face the lower side of the four sides.
따라서 제2 방열플레이트(520)의 제2 장착면(521)은 상술한 돌출구조에서 상면에 해당될 수 있다. 즉 제2 방열플레이트(520)의 상부에 제2 장착면(521)이 형성될 수 있다. LED 모듈(300)은 도광판(200)의 측면과 대향하도록 배치된다. 즉, 복수의 LED(310)는 도광판(200)의 측면을 따라 배치될 수 있으며 복수의 LED(310)가 실장되는 LED 기판(320)도 도광판(200)의 측면을 따라 연장 형성될 수 있다. LED 모듈(300)이 제2 방열플레이트(520)의 제2 장착면(521)에 장착된다는 것은 LED 기판(320)이 제2 방열플레이트(520)의 제2 장착면(521)에 장착되는 것과 동일한 의미로 사용될 수 있다. Therefore, the second mounting surface 521 of the second heat dissipation plate 520 may correspond to the upper surface in the above-described protrusion structure. That is, the second mounting surface 521 may be formed on the second heat dissipation plate 520 . The LED module 300 is disposed to face the side surface of the light guide plate 200 . That is, the plurality of LEDs 310 may be disposed along the side surface of the light guide plate 200 , and the LED substrate 320 on which the plurality of LEDs 310 are mounted may also be formed to extend along the side surface of the light guide plate 200 . That the LED module 300 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 means that the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 and can be used with the same meaning.
상술한 것과 같이 방열플레이트(500)는 제1 방열플레이트(510)와 제2 방열플레이트(520)가 일체로 형성되며 각각의 X방향으로의 폭은 동일하게 형성될 수 있다. 또한 디스플레이장치(10)의 우측면에서 보았을 때 방열플레이트(500)의 단면은 ㄴ자 형상으로 마련될 수 있다. As described above, in the heat dissipation plate 500 , the first heat dissipation plate 510 and the second heat dissipation plate 520 are integrally formed, and the width in each X direction may be the same. Also, when viewed from the right side of the display device 10 , the cross section of the heat dissipation plate 500 may be provided in an L-shape.
도 3 및 도 4에 도시된 것과 같이, PBA(400) 및 스피커(900)가 장착되는 제1 방열플레이트(510)의 Y방향으로의 길이는 LED 모듈(300)이 장착되는 제2 방열플레이트의(520) Z방향의 길이보다 길도록 마련될 수 있다. 다만 제1 방열플레이트(510)의 Y방향으로의 길이와 제2 방열플레이트의(520) Z방향의 길이가 이에 국한되는 것은 아니다. 3 and 4, the length in the Y direction of the first heat dissipation plate 510 on which the PBA 400 and the speaker 900 are mounted is the length of the second heat dissipation plate on which the LED module 300 is mounted. (520) It may be provided to be longer than the length in the Z direction. However, the length of the first heat dissipation plate 510 in the Y direction and the length of the second heat dissipation plate 520 in the Z direction are not limited thereto.
방열플레이트(500)는 디스플레이패널(100)의 둘레의 외측에 배치될 수 있다. 구체적으로 본 발명의 일 실시예에 의한 디스플레이장치(10)의 제1 방열플레이트(510)는 디스플레이패널(100)의 둘레의 외측에 배치될 수 있다. 또는 제 1 방열플레이트(500)의 제1 장착면(511)은 디스플레이패널(100)의 전방, 즉 Z방향을 향하되, 디스플레이패널(100)의 둘레의 외측에 배치될 수 있다. The heat dissipation plate 500 may be disposed outside the periphery of the display panel 100 . Specifically, the first heat dissipation plate 510 of the display device 10 according to an embodiment of the present invention may be disposed outside the periphery of the display panel 100 . Alternatively, the first mounting surface 511 of the first heat dissipation plate 500 may face the front of the display panel 100 , that is, in the Z direction, and may be disposed outside the periphery of the display panel 100 .
다시 말하자면, 종래에 디스플레이패널(100)의 후방 즉, 디스플레이장치(10)의 후면에 배치되던 PBA(400)를 방열플레이트(500)와 함께 디스플레이패널(100)의 전, 후방과 중첩되지 않도록 배치하여 방열플레이트(500)를 통해 전달되는 열과 PBA(400)로부터 발생된 열이 디스플레이패널(100)의 둘레의 외측으로 방열되는 구조로 마련될 수 있다.In other words, the PBA 400 , which was conventionally disposed on the rear of the display panel 100 , that is, on the rear of the display device 10 , is disposed so as not to overlap the front and rear of the display panel 100 together with the heat dissipation plate 500 . Thus, the heat transferred through the heat dissipation plate 500 and the heat generated from the PBA 400 may be provided in a structure in which heat is radiated to the outside of the periphery of the display panel 100 .
디스플레이패널(100)의 후방에 배치되는 도광판(200)이 직사각형의 판 형상으로 마련되는 것을 전제로 할 때, 도 2 내지 도 5에 도시된 본 발명의 일 실시예에 의한 디스플레이장치(10)의 LED 모듈(300)은 도광판(200)의 네 개의 측면 중 하측 면에 대향하도록 배치된 것은 상술한 것과 같다. Assuming that the light guide plate 200 disposed at the rear of the display panel 100 is provided in a rectangular plate shape, the display device 10 according to an embodiment of the present invention shown in FIGS. The LED module 300 is disposed to face the lower side of the four sides of the light guide plate 200 as described above.
상술한 제1 방열플레이트(510)와 제2 방열플레이트(520)의 일체 구조를 고려할 때, 따라서 제 2 방열플레이트(500)의 제2 장착면(521)은 도광판(200)의 하부에 배치된다. Considering the above-described integrated structure of the first heat dissipation plate 510 and the second heat dissipation plate 520 , the second mounting surface 521 of the second heat dissipation plate 500 is disposed below the light guide plate 200 . .
결과적으로 제2 방열플레이트(520) 역시 디스플레이패널(100)의 둘레의 외측에 배치되게 되어 디스플레이패널(100)에 열을 방출하지 않고, 더 나아가 디스플레이장치(10)의 전방으로 열을 쉽게 방출할 수 있는 효과를 달성할 수 있다.As a result, the second heat dissipation plate 520 is also disposed on the outside of the periphery of the display panel 100 , so that heat is not emitted to the display panel 100 , and further heat is easily radiated to the front of the display device 10 . possible effects can be achieved.
종래의 경우와 같이 PBA(400)가 디스플레이패널(100)의 후방 즉, 디스플레이장치(10)의 후면에 배치되어 생기는 문제는 상술한 것과 같다. 본 발명의 일 실시예에 의한 디스플레이장치(10)의 경우, 제 1 방열플레이트(500)의 제1 장착면(511) 디스플레이패널(100)의 둘레의 외측에 배치하여 PBA(400)가 디스플레이패널(100)에 열을 방출하지 않고, 더 나아가 디스플레이장치(10)의 전방으로 열을 쉽게 방출할 수 있는 효과를 달성할 수 있다. 또한 제1 방열플레이트(510)와 제2 방열플레이트(520)는 하나의 방열플레이트(500)를 구성하며 이러한 방열플레이트(500)가 전반적으로 디스플레이패널(100)의 둘레의 외측에 배치되는 기술적 특징으로 인하여 효과적인 열 교환 및 열 방출 구조를 형성할 수 있다. As in the conventional case, the problem caused by being disposed at the rear of the display panel 100 , that is, at the rear of the display device 10 , is the same as described above. In the case of the display device 10 according to an embodiment of the present invention, the first mounting surface 511 of the first heat dissipation plate 500 is disposed on the outside of the periphery of the display panel 100 so that the PBA 400 is a display panel. Without dissipating heat to the 100 , it is possible to further achieve the effect of easily dissipating heat to the front of the display device 10 . In addition, the first heat dissipation plate 510 and the second heat dissipation plate 520 constitute one heat dissipation plate 500 , and the heat dissipation plate 500 is generally disposed outside the periphery of the display panel 100 . Due to this, it is possible to form an effective heat exchange and heat dissipation structure.
도 3 및 도 4를 참조하면 제 1 방열플레이트(500)의 제1 장착면(511)은 디스플레이패널(100)의 전방, 즉 Z방향을 향하되, 디스플레이패널(100)의 둘레의 외측에 배치되며 제2 방열플레이트(520)는 제1 방열플레이트(510)의 하단으로부터 후방을 향하여 돌출되며, 제2 방열플레이트(520)의 상부에 상기 제2 장착면(521)이 형성될 수 있다. 이때, 도광판(200)은 제2 장착면(521)에 장착된 상기 LED 모듈(300)의 상단까지 연장될 수 있다. Referring to FIGS. 3 and 4 , the first mounting surface 511 of the first heat dissipation plate 500 faces the front of the display panel 100 , that is, in the Z direction, and is disposed on the outside of the periphery of the display panel 100 . The second heat dissipation plate 520 may protrude from the lower end of the first heat dissipation plate 510 toward the rear, and the second mounting surface 521 may be formed on the second heat dissipation plate 520 . In this case, the light guide plate 200 may extend to the upper end of the LED module 300 mounted on the second mounting surface 521 .
다시 말하자면 도광판(200)이 디스플레이패널(100)과 대응하도록 직사각형 판 형상으로 형성되지만, 도광판(200)의 상단이 디스플레이패널(100)의 상단과 일치되도록 배치되었을 때, 도광판(200)의 하단은 디스플레이패널(100)의 하단보다 더 하방을 향하여 연장될 수 있다. 결과적으로 도광판(200)은 좌우방향의 길이는 디스플레이패널(100)에 대응되도록 형성되지만, 상하방향의 길이는 디스플레이패널(100)보다 길도록 형성될 수 있다. In other words, although the light guide plate 200 is formed in a rectangular plate shape to correspond to the display panel 100 , when the upper end of the light guide plate 200 is arranged to coincide with the upper end of the display panel 100 , the lower end of the light guide plate 200 is It may extend further downward than the lower end of the display panel 100 . As a result, the light guide plate 200 may be formed such that the length in the left and right directions corresponds to the display panel 100 , but the length in the vertical direction is longer than that of the display panel 100 .
구체적으로 도 3 및 도 4에 도시된 것과 같이, 도광판(200)은 디스플레이패널(100)의 하단보다 더 하방을 향하여 D 거리만큼 연장될 수 있다. 즉 도광판(200)의 디스플레이패널(100)하단과 대응되는 위치로부터 제2 장착면(521)에 장착된 상기 LED 모듈(300)의 상단까지의 연장 거리는 D 거리로 형성될 수 있다. Specifically, as shown in FIGS. 3 and 4 , the light guide plate 200 may extend downwardly by a distance D from the lower end of the display panel 100 . That is, the extension distance from the position corresponding to the lower end of the display panel 100 of the light guide plate 200 to the upper end of the LED module 300 mounted on the second mounting surface 521 may be formed as a distance D.
이러한 구조로 인하여 LED 모듈(300)은 디스플레이패널(100)로부터 이격거리를 충분히 확보할 수 있는 구조로 마련된 수 있다. 즉 종래 구조와 같이 LED 모듈(300)이 디스플레이패널(100)의 측면 가까이에 배치됨으로써, 디스플레이패널의 측면에 열화현상을 발생시키는 문제점을 방지할 수 있다.Due to this structure, the LED module 300 may be provided in a structure that can sufficiently secure a separation distance from the display panel 100 . That is, as in the conventional structure, since the LED module 300 is disposed near the side surface of the display panel 100, it is possible to prevent a problem of causing deterioration in the side surface of the display panel.
D 거리에 해당되는 도광판(200)의 하부(200e, 도 3 및 도 4 참조)는 방열플레이트(500)에 안착되는 구조로 마련될 수 있다. The lower portion 200e (refer to FIGS. 3 and 4 ) of the light guide plate 200 corresponding to the distance D may be provided in a structure to be seated on the heat dissipation plate 500 .
구체적으로 도광판(200)의 하부(200e)의 전면은 제1 방열플레이트(510)에 의하여 지지될 수 있다. 제1 방열플레이트(510)의 제1 장착면(511)은 전방을 향하도록 배치되므로 도광판(200)의 하부(200e)의 전면을 지지하는 제1 방열플레이트(510)의 지지면은 제1 장착면(511)의 반대면일 수 있다. 도광판(200)의 하부(200e)의 전면을 지지하는 제1 방열플레이트(510)의 지지면을 지지부(512)라고 정의할 수 있다. Specifically, the front surface of the lower portion 200e of the light guide plate 200 may be supported by the first heat dissipation plate 510 . Since the first mounting surface 511 of the first heat dissipation plate 510 is disposed to face forward, the supporting surface of the first heat dissipation plate 510 supporting the front surface of the lower portion 200e of the light guide plate 200 is the first mounting surface. It may be the opposite surface of the surface 511 . A support surface of the first heat dissipation plate 510 supporting the front surface of the lower portion 200e of the light guide plate 200 may be defined as a support portion 512 .
디스플레이패널(100)의 전방을 향하는 제1 방열플레이트(510)의 일측에 위치하는 면을 제1 장착면(511)이라고 하면, 디스플레이패널(100)의 후방을 향하는 제1 방열플레이트(510)의 타측에 위치하는 면을 지지부(512)라고 정의할 수 있다. 지지부(512)는 제1 장착면(511)의 반대에서 위치하며 제1 장착면(511)과 대응하는 형상으로 형성될 수 있다. 제1 방열플레이트(510)가 직사각형의 판형으로 마련되므로 제1 장착면(511)과 지지부(512) 역시 직사각형의 형상으로 형성될 수 있다. 방열플레이트(500)는 미들몰드(710)와 함께 도광판(200)을 보다 견고하게 지지하는 지지구조의 역할을 수행할 수 있다. When the surface located on one side of the first heat dissipation plate 510 facing the front of the display panel 100 is referred to as the first mounting surface 511 , the first heat dissipation plate 510 facing the rear of the display panel 100 is the The surface located on the other side may be defined as the support part 512 . The support part 512 is positioned opposite to the first mounting surface 511 and may be formed in a shape corresponding to the first mounting surface 511 . Since the first heat dissipation plate 510 is provided in a rectangular plate shape, the first mounting surface 511 and the support part 512 may also be formed in a rectangular shape. The heat dissipation plate 500 may serve as a support structure for more firmly supporting the light guide plate 200 together with the middle mold 710 .
D 거리에 해당되는 도광판(200)의 하부의 전방이 제1 방열플레이트(510)의 지지부(512)와 마주한다면 도광판(200)의 네 측면 중 하부에 위치한 측면은 LED 모듈(300)을 마주하도록 배치될 수 있다. 도 3을 참조하면 도광판(200)의 네 측면 중 하부에 위치한 측면은 LED 모듈(300)과 접하도록 마련될 수 있다. 또는 이와 달리, 도 4를 참조하면 리어섀시(720)에 형성된 스페이서(722)에 의하여 도광판(200)의 네 측면 중 하부에 위치한 측면과 LED 모듈(300)간에 이격거리를 확보하도록 형성될 수도 있다.If the front of the lower portion of the light guide plate 200 corresponding to distance D faces the support part 512 of the first heat dissipation plate 510 , the lower side of the four sides of the light guide plate 200 faces the LED module 300 . can be placed. Referring to FIG. 3 , a lower side of the four sides of the light guide plate 200 may be provided to contact the LED module 300 . Alternatively, alternatively, referring to FIG. 4 , the spacer 722 formed on the rear chassis 720 may be formed to secure a separation distance between the LED module 300 and the lower side of the four sides of the light guide plate 200 . .
구체적으로 리어섀시(720)는, 리어섀시(720)로부터 도광판(200)과 복수의 LED(320) 사이로 돌출되며 도광판(200)의 하단 일부를 지지하도록 마련되는 스페이서(722)를 포함할 수 있다. 스페이서(722)는 도광판(200)의 네 측면 중 하부가 연장되는 방향을 따라서 돌출될 수 있다. 이로써 도광판(200)은 네 측면 중 상측과 양측은 미들몰드(710)에 의하여 지지되며, 하측은 스페이서(722)에 의하여 지지되도록 마련될 수 있다. Specifically, the rear chassis 720 may include a spacer 722 that protrudes from the rear chassis 720 between the light guide plate 200 and the plurality of LEDs 320 and is provided to support a portion of the lower end of the light guide plate 200 . . The spacer 722 may protrude along a direction in which a lower portion of the four side surfaces of the light guide plate 200 extends. Accordingly, the upper and both sides of the light guide plate 200 may be supported by the middle mold 710 , and the lower side thereof may be supported by the spacer 722 .
LED 모듈(300)에서 도광판(200)으로 조사된 광은 바로 디스플레이패널(100)을 향하여 입사되는 것이 아니라 D 거리에 해당되는 도광판(200)의 하부를 통과한 후 디스플레이패널(100)로 입사하게 된다. The light irradiated from the LED module 300 to the light guide plate 200 is not incident directly toward the display panel 100, but passes through the lower portion of the light guide plate 200 corresponding to distance D and then enters the display panel 100. do.
이때 D 거리에 해당되는 도광판(200)의 하부를 통과한 후 디스플레이패널(100)로 입사하는 광의 손실을 방지하기 위하여 도광판(200)의 전, 후방으로 반사시트가 추가적으로 배치될 수 있다. In this case, in order to prevent loss of light incident to the display panel 100 after passing through the lower portion of the light guide plate 200 corresponding to distance D, reflective sheets may be additionally disposed in front and rear of the light guide plate 200 .
반사시트는 도광판(200)의 배면을 커버하며 배면에 접하도록 배치되는 후방 반사시트(610) 및 도광판(200)의 전방에 배치되며 도광판(200)의 하부(200e)의 전면을 커버하며 하부(200e)의 전면에 접하도록 배치되는 전방 반사시트(620)를 포함 할 수 있다. The reflective sheet covers the rear surface of the light guide plate 200 and is disposed in front of the rear reflection sheet 610 and the light guide plate 200 disposed to be in contact with the rear surface, and covers the front surface of the lower portion 200e of the light guide plate 200 and covers the lower portion ( 200e) may include a front reflective sheet 620 disposed in contact with the front surface.
후방 반사시트(610)는 도광판(200)의 후면과 대응하는 형상으로 마련될 수 있다. 즉 도광판(200)의 직사각형 형상에 대응하여 형성될 수 있다. The rear reflection sheet 610 may be provided in a shape corresponding to the rear surface of the light guide plate 200 . That is, it may be formed to correspond to the rectangular shape of the light guide plate 200 .
전방 반사시트(620)도 직사각형 형상으로 형성되지만, D 거리에 해당되는 도광판(200)의 하부의 전방만을 커버하도록 형성될 수 있다. 이는 도광판(200)을 통과하는 광이 도광판(200)의 후방으로의 광 손실을 최소화는 것이 좋지만 도광판(200)이 디스플레이패널(100)과 마주한 면으로 입사하는 광을 전방 반사시트(620)가 차단하는 것을 방지하기 위함이다. The front reflection sheet 620 is also formed in a rectangular shape, but may be formed to cover only the front of the lower portion of the light guide plate 200 corresponding to the D distance. This is good for the light passing through the light guide plate 200 to minimize the loss of light to the rear of the light guide plate 200, but the front reflection sheet 620 is the light incident on the surface of the light guide plate 200 facing the display panel 100. to prevent blocking.
즉 도광판(200)의 전면 중 디스플레이패널(100)과 마주하지 않은 D 거리에 해당되는 도광판(200)의 하부 전방면에만 전방 반사시트(620)를 마련하여 광 손실을 최소화 하기 위함이다. That is, the front reflective sheet 620 is provided only on the lower front surface of the light guide plate 200 corresponding to the distance D not facing the display panel 100 among the front surfaces of the light guide plate 200 to minimize light loss.
전방 반사시트(620) 및 후방 반사시트(610)가 배치된 경우, 제1 방열플레이트(510)의 지지부(512)는 전방 반사시트(620)를 통하여 D 거리에 해당되는 도광판(200)의 하부를 지지할 수 있다. 또한 리어섀시(720)의 리어섀시(720)의 도광판 지지부(512)는 후방 반사시트(610)를 통하여 도광판(200)의 배면을 지지할 수 있다. 도 6는 본 발명의 다른 실시예에 따른 디스플레이장치를 분해하여 도시한 전방 분해사시도이다. 도 7은 및 도 8은 본 발명의 다른 실시예에 따른 디스플레이장치의 PBA를 포함한 단면을 우측에서 바라본 단면도이다. 도 9은 도 6의 B영역을 확대한 도면이다.When the front reflection sheet 620 and the rear reflection sheet 610 are disposed, the support part 512 of the first heat dissipation plate 510 passes through the front reflection sheet 620 to the lower portion of the light guide plate 200 corresponding to the distance D. can support In addition, the light guide plate support 512 of the rear chassis 720 of the rear chassis 720 may support the rear surface of the light guide plate 200 through the rear reflection sheet 610 . 6 is an exploded front perspective view illustrating an exploded display device according to another embodiment of the present invention. 7 and 8 are cross-sectional views of a display device according to another embodiment of the present invention, including a PBA, as viewed from the right. FIG. 9 is an enlarged view of area B of FIG. 6 .
효과적인 방열구조를 위하여 본 발명의 다른 실시예에 의한 디스플레이장치(10) 역시 일측에 LED 모듈(300)이 장착되고, 타측에 PBA(400)가 장착되는 방열플레이트(500)를 포함할 수 있다.For an effective heat dissipation structure, the display device 10 according to another embodiment of the present invention may also include a heat dissipation plate 500 in which the LED module 300 is mounted on one side and the PBA 400 is mounted on the other side.
이하 본 발명의 다른 실시예에 의한 디스플레이장치(10)의 방열플레이트(500)에 대하여 구체적으로 설명한다. Hereinafter, the heat dissipation plate 500 of the display device 10 according to another embodiment of the present invention will be described in detail.
방열플레이트(500)는 PBA(400)가 장착되는 제1 장착면(511)을 포함하는 제1 방열플레이트(510)와 LED 모듈(300)이 장착되는 제2 장착면(521)을 포함하는 제2 방열플레이트(520)를 포함할 수 있다. 도 6 내지 도 9를 참조하면, 제1 방열플레이트(510)와 제2 방열플레이트(520)는 일체로 형성되어 방열플레이트(500)를 구성할 수 있다. 일체로 형성된다는 것의 의미는 상술한 것과 같다. The heat dissipation plate 500 includes a first heat dissipation plate 510 including a first mounting surface 511 on which the PBA 400 is mounted and a second mounting surface 521 on which the LED module 300 is mounted. Two heat dissipation plates 520 may be included. 6 to 9 , the first heat dissipation plate 510 and the second heat dissipation plate 520 may be integrally formed to constitute the heat dissipation plate 500 . The meaning of being integrally formed is the same as described above.
PBA(400)가 장착되는 제1 장착면(511)을 포함하는 제1 방열플레이트(510)는 디스플레이패널(100)의 폭과 대응하도록 좌우 폭이 상하 길이에 비해 긴 직사각형 판 형상으로 형성될 수 있다. 또한 열 전달 및 열 방출이 효과적으로 이루어 질 수 있도록 금속재질로 형성된다.The first heat dissipation plate 510 including the first mounting surface 511 on which the PBA 400 is mounted may be formed in a rectangular plate shape with left and right widths longer than the vertical length to correspond to the width of the display panel 100 . have. In addition, it is formed of a metal material so that heat transfer and heat dissipation can be performed effectively.
제1 방열플레이트(510)는 제1 장착면(511)이 디스플레이패널(100)의 전방을 향하도록 배치될 수 있다. 이는 후술하는 것과 같이 방열플레이트(500)의 디스플레이장치(10)내의 배치 구조와 더불어 디스플레이장치(10)의 후방이 아닌 전방으로 열이 방출될 수 있도록 설계하기 위함이다.The first heat dissipation plate 510 may be disposed such that the first mounting surface 511 faces the front of the display panel 100 . This is to design the heat dissipation plate 500 so that heat can be emitted to the front rather than the rear of the display device 10 together with the arrangement structure in the display device 10 as will be described later.
제1 방열플레이트(510)의 제1 장착면(511)에는 PBA이외에도 스피커(900)가 장착될 수 있다. 도 6 내지 도 9를 참조하면 PBA(400)의 하단에 스피커(900)가 장착되도록 도시되어 있지만 스피커(900)와 PBA(400)는 방열플레이트(500), 구체적으로 제1 방열플레이트(510)의 제1 장착면(511)에 장착되는 기술적 특징을 유지하는 범위 내에서 그 배치 구조는 상이할 수 있다. 예를 들어 도 6 내지 도 9와는 달리 PBA(400)의 상단에 스피커(900)가 장착될 수도 있다. 또는 PBA(400)의 좌, 우측면 되는 양 측면에 장착 될 수도 있다.A speaker 900 in addition to the PBA may be mounted on the first mounting surface 511 of the first heat dissipation plate 510 . 6 to 9 , although the speaker 900 is shown to be mounted at the lower end of the PBA 400 , the speaker 900 and the PBA 400 are a heat dissipation plate 500 , specifically a first heat dissipation plate 510 . The arrangement structure may be different within the range of maintaining the technical characteristics of being mounted on the first mounting surface 511 of the . For example, unlike FIGS. 6 to 9 , the speaker 900 may be mounted on the upper end of the PBA 400 . Alternatively, it may be mounted on both sides of the left and right sides of the PBA 400 .
본 발명의 다른 실시예에 의한 디스플레이장치(10)의 제2 방열플레이트(520)는 제1 방열플레이트(510)의 상단으로부터 전방을 향하여 돌출될 수 있다. LED 모듈(300)이 장착되는 제2 장착면(521)과 제2 방열플레이트(520)는 상기 복수의 LED(310)가 배치되는 방향을 따라 연장될 수 있다.The second heat dissipation plate 520 of the display apparatus 10 according to another embodiment of the present invention may protrude forward from the top of the first heat dissipation plate 510 . The second mounting surface 521 and the second heat dissipation plate 520 on which the LED module 300 is mounted may extend along a direction in which the plurality of LEDs 310 are disposed.
LED 모듈(300)은 디스플레이패널(100)의 후방에 배치되는 도광판(200)의 측면과 대향하도록 배치되며, 도광판(200)을 통하여 광을 디스플레이패널(100)에 공급하는 엣지형(Edge Type)으로 마련됨은 전술한 바와 같다. 다만 도 6 내지 도 9에 도시된 본 발명의 다른 실시예에 의한 디스플레이장치(10)의 LED 모듈(300)은 도광판(200)이 직사각형의 판 형상으로 마련되는 것을 전제로 할 때, 도광판(200)의 네 개의 측면 중 하측 면에 대향하도록 배치되어 있다.The LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type) It is provided as described above. However, in the LED module 300 of the display device 10 according to another embodiment of the present invention shown in FIGS. 6 to 9 , on the premise that the light guide plate 200 is provided in a rectangular plate shape, the light guide plate 200 ) is arranged to face the lower side of the four sides.
따라서 제2 방열플레이트(520)의 제2 장착면(521)은 상술한 돌출구조에서 상면에 해당될 수 있다. 즉, 제2 방열플레이트(520)의 상부에 제2 장착면(521)이 형성될 수 있다. LED 모듈(300)은 도광판(200)의 측면과 대향하도록 배치된다. 즉 복수의 LED(310)는 도광판(200)의 측면을 따라 배치될 수 있으며 복수의 LED(310)가 실장되는 LED 기판(320)도 도광판(200)의 측면을 따라 연장 형성될 수 있다. LED 모듈(300)이 제2 방열플레이트(520)의 제2 장착면(521)에 장착된다는 것은 LED 기판(320)이 제2 방열플레이트(520)의 제2 장착면(521)에 장착되는 구조와 장착되는 것과 동일한 의미로 사용될 수 있다. Therefore, the second mounting surface 521 of the second heat dissipation plate 520 may correspond to the upper surface in the above-described protrusion structure. That is, the second mounting surface 521 may be formed on the second heat dissipation plate 520 . The LED module 300 is disposed to face the side surface of the light guide plate 200 . That is, the plurality of LEDs 310 may be disposed along the side surface of the light guide plate 200 , and the LED substrate 320 on which the plurality of LEDs 310 are mounted may also be formed to extend along the side surface of the light guide plate 200 . That the LED module 300 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 is a structure in which the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 . and can be used in the same meaning as mounted.
상술한 것과 같이 방열플레이트(500)는 제1 방열플레이트(510)와 제2 방열플레이트(520)가 일체로 형성되며 각각의 X방향으로의 폭은 동일하게 형성될 수 있다. 또한 디스플레이장치(10)의 우측면에서 보았을 때 방열플레이트(500)의 단면은 ㄱ자 형상으로 마련될 수 있다.As described above, in the heat dissipation plate 500 , the first heat dissipation plate 510 and the second heat dissipation plate 520 are integrally formed, and the width in each X direction may be the same. In addition, the cross section of the heat dissipation plate 500 when viewed from the right side of the display device 10 may be provided in a L-shape.
도 7 및 도 8에 도시된 것과 같이, PBA(400) 및 스피커(900)가 장착되는 제1 방열플레이트(510)의 Y방향으로의 길이는 LED 모듈(300)이 장착되는 제2 방열플레이트의(520) Z방향의 길이보다 길도록 마련될 수 있다. 다만 제1 방열플레이트(510)의 Y방향으로의 길이와 제2 방열플레이트의(520) Z방향의 길이가 이에 국한되는 것은 아니다.7 and 8, the length in the Y direction of the first heat dissipation plate 510 on which the PBA 400 and the speaker 900 are mounted is the length of the second heat dissipation plate on which the LED module 300 is mounted. (520) It may be provided to be longer than the length in the Z direction. However, the length of the first heat dissipation plate 510 in the Y direction and the length of the second heat dissipation plate 520 in the Z direction are not limited thereto.
방열플레이트(500)는 디스플레이패널(100)의 둘레의 외측에 배치될 수 있다. 구체적으로 본 발명의 다른 실시예에 의한 디스플레이장치(10)의 제2 방열플레이트(520)는 디스플레이패널(100)의 둘레의 외측에 배치될 수 있다. The heat dissipation plate 500 may be disposed outside the periphery of the display panel 100 . Specifically, the second heat dissipation plate 520 of the display device 10 according to another embodiment of the present invention may be disposed outside the periphery of the display panel 100 .
다시 말하자면, 종래에 디스플레이패널(100)의 후방 즉, 디스플레이장치(10)의 후면에 배치되던 PBA(400)를 방열플레이트(500)와 함께 디스플레이패널(100)의 전, 후방과 중첩되지 않도록 배치하여 방열플레이트(500)를 통해 전달되는 열과 PBA(400)로부터 발생된 열이 디스플레이패널(100)의 둘레의 외측으로 방열되는 구조로 마련될 수 있다. In other words, the PBA 400 , which was conventionally disposed on the rear of the display panel 100 , that is, on the rear of the display device 10 , is disposed so as not to overlap the front and rear of the display panel 100 together with the heat dissipation plate 500 . Thus, the heat transferred through the heat dissipation plate 500 and the heat generated from the PBA 400 may be provided in a structure in which heat is radiated to the outside of the periphery of the display panel 100 .
디스플레이패널(100)의 후방에 배치되는 도광판(200)이 직사각형의 판 형상으로 마련되는 것을 전제로 할 때, 도 6 내지 도 9에 도시된 본 발명의 일 실시예에 의한 디스플레이장치(10)의 LED 모듈(300)은 도광판(200)의 네 개의 측면 중 하측 면에 대향하도록 배치된 것은 상술한 것과 같다.Assuming that the light guide plate 200 disposed at the rear of the display panel 100 is provided in a rectangular plate shape, the display device 10 according to an embodiment of the present invention shown in FIGS. The LED module 300 is disposed to face the lower side of the four sides of the light guide plate 200 as described above.
도 7을 참조하면 도광판(200)의 네 측면 중 하부에 위치한 측면은 LED 모듈(300)과 접하도록 마련될 수 있다. 또는 이와 달리, 도 8를 참조하면 리어섀시(720)에 형성된 스페이서(722)에 의하여 도광판(200)의 네 측면 중 하부에 위치한 측면과 LED 모듈(300)간에 이격거리를 확보하도록 형성될 수도 있다.Referring to FIG. 7 , a lower side of the four sides of the light guide plate 200 may be provided to contact the LED module 300 . Alternatively, alternatively, referring to FIG. 8 , the spacer 722 formed on the rear chassis 720 may be formed to secure a separation distance between the LED module 300 and the lower side of the four sides of the light guide plate 200 . .
구체적으로 리어섀시(720)는, 리어섀시(720)로부터 도광판(200)과 복수의 LED(320) 사이로 돌출되며 도광판(200)의 하단 일부를 지지하도록 마련되는 스페이서(722)를 포함할 수 있다. 스페이서(722)는 도광판(200)의 네 측면 중 하부가 연장되는 방향을 따라서 돌출될 수 있다. 이로써 도광판(200)은 네 측면 중 상측과 양측은 미들몰드(710)에 의하여 지지되며, 하측은 스페이서(722)에 의하여 지지되도록 마련될 수 있다.Specifically, the rear chassis 720 may include a spacer 722 that protrudes from the rear chassis 720 between the light guide plate 200 and the plurality of LEDs 320 and is provided to support a portion of the lower end of the light guide plate 200 . . The spacer 722 may protrude along a direction in which a lower portion of the four side surfaces of the light guide plate 200 extends. Accordingly, the upper and both sides of the light guide plate 200 may be supported by the middle mold 710 , and the lower side thereof may be supported by the spacer 722 .
상술한 제1 방열플레이트(510)와 제2 방열플레이트(520)의 일체 구조를 고려할 때, 따라서 제1 방열플레이트(510)의 제1 장착면(511)은 도광판(200)의 하부에 배치된다.Considering the above-described integrated structure of the first heat dissipation plate 510 and the second heat dissipation plate 520 , the first mounting surface 511 of the first heat dissipation plate 510 is disposed below the light guide plate 200 . .
결과적으로 제1 방열플레이트(510) 역시 디스플레이패널(100)의 둘레의 외측에 배치되게 되어 디스플레이패널(100)에 열을 방출하지 않고, 더 나아가 디스플레이장치(10)의 전방으로 열을 쉽게 방출할 수 있는 효과를 달성할 수 있다.As a result, the first heat dissipation plate 510 is also disposed on the outside of the periphery of the display panel 100 , so that heat is not emitted to the display panel 100 , and further heat is easily discharged to the front of the display device 10 . possible effects can be achieved.
종래의 경우와 같이 PBA(400)가 디스플레이패널(100)의 후방 측 디스플레이장치(10)의 후면에 배치되어 생기는 문제는 상술한 것과 같다. 본 발명의 다른 실시예에 의한 디스플레이장치(10)의 경우, 제 1 방열플레이트(500)의 제1 장착면(511) 디스플레이패널(100)의 둘레의 외측에 배치하여 PBA(400)가 디스플레이패널(100)에 열을 방출하지 않고, 더 나아가 디스플레이장치(10)의 전방으로 열을 쉽게 방출할 수 있는 효과를 달성할 수 있다. 또한 제1 방열플레이트(510)와 제2 방열플레이트(520)는 하나의 방열플레이트(500)를 구성하며 이러한 방열플레이트(500)가 전반적으로 디스플레이패널(100)의 둘레의 외측에 배치되는 기술적 특징으로 인하여 효과적인 열 교환 및 열 방출 구조를 형성할 수 있다.As in the conventional case, the PBA 400 is disposed on the rear side of the display device 10 on the rear side of the display panel 100, and the problem caused is the same as described above. In the case of the display device 10 according to another embodiment of the present invention, the first mounting surface 511 of the first heat dissipation plate 500 is disposed on the outside of the periphery of the display panel 100 so that the PBA 400 is a display panel. Without dissipating heat to the 100 , it is possible to further achieve the effect of easily dissipating heat to the front of the display device 10 . In addition, the first heat dissipation plate 510 and the second heat dissipation plate 520 constitute one heat dissipation plate 500 , and the heat dissipation plate 500 is generally disposed outside the periphery of the display panel 100 . Due to this, it is possible to form an effective heat exchange and heat dissipation structure.
본 발명의 다른 실시예에 의한 디스플레이장치(10)의 경우 제2 방열플레이트(520)의 제2 장착면(521)이 제1 방열플레이트(510)의 상단으로부터 전방을 향하여 돌출되며 제2 방열플레이트의 상부에 2 장착면(521)이 형성된다. 도광판(200)은 제2 장착면(521)에 장착된 LED 모듈(300)의 상단까지 연장될 수 있다. In the case of the display device 10 according to another embodiment of the present invention, the second mounting surface 521 of the second heat dissipation plate 520 protrudes forward from the top of the first heat dissipation plate 510 and the second heat dissipation plate 2 mounting surfaces 521 are formed on the upper part of the The light guide plate 200 may extend to the upper end of the LED module 300 mounted on the second mounting surface 521 .
따라서 본 발명의 일 실시예에 의한 디스플레이장치(10)와는 달리 도광판(200)이 디스플레이패널(100)과 대응하도록 직사각형 판 형상으로 형성되며 도광판(200)은 좌우방향의 길이와 상하방향의 길이는 디스플레이패널(100)에 대응되도록 형성될 수 있다. 이는 상술한 D 거리에 해당되는 도광판(200)의 하부가 생략될 수 있음을 의미한다. Therefore, unlike the display device 10 according to an embodiment of the present invention, the light guide plate 200 is formed in a rectangular plate shape to correspond to the display panel 100, and the length of the light guide plate 200 in the left and right directions and the length in the vertical direction are It may be formed to correspond to the display panel 100 . This means that the lower portion of the light guide plate 200 corresponding to the above-described distance D may be omitted.
제1 방열플레이트(510)의 상단으로부터 전방을 향하여 돌출된 제2 방열플레이트(520)는 인접한 미들몰드(710)에 의하여 지지 될 수 있다. The second heat dissipation plate 520 protruding forward from the top of the first heat dissipation plate 510 may be supported by the adjacent middle mold 710 .
제1 방열플레이트(510)는 본 발명의 일 실시예에 의한 디스플레이장치(10)의 경우보다 후방에 배치되며 리어섀시(720)에 의하여 직접 지지될 수 있다. The first heat dissipation plate 510 is disposed at the rear of the display device 10 according to an embodiment of the present invention and may be directly supported by the rear chassis 720 .
디스플레이패널(100)의 전방을 향하는 제1 방열플레이트(510)의 일측에 위치하는 면을 제1 장착면(511)이라고 하면, 디스플레이패널(100)의 후방을 향하는 제1 방열플레이트(510)의 타측에 위치하는 면을 지지부(512)라고 정의할 수 있다. When the surface located on one side of the first heat dissipation plate 510 facing the front of the display panel 100 is referred to as the first mounting surface 511 , the first heat dissipation plate 510 facing the rear of the display panel 100 is the The surface located on the other side may be defined as the support part 512 .
지지부(512)는 제1 장착면(511)의 반대에서 위치하며 제1 장착면(511)과 대응하는 형상으로 형성될 수 있다. 제1 방열플레이트(510)가 직사각형의 판형으로 마련되므로 제1 장착면(511)과 지지부(512) 역시 직사각형의 형상으로 형성될 수 있다.The support part 512 is positioned opposite to the first mounting surface 511 and may be formed in a shape corresponding to the first mounting surface 511 . Since the first heat dissipation plate 510 is provided in a rectangular plate shape, the first mounting surface 511 and the support part 512 may also be formed in a rectangular shape.
제1 방열플레이트(510)의 지지부(512)가 상술한 리어섀시(720)에 의하여 직접 지지되는 면으로 마련될 수 있다. The support part 512 of the first heat dissipation plate 510 may be provided as a surface directly supported by the above-described rear chassis 720 .
제2 방열플레이트(520)가 제1 방열플레이트(510)의 하단으로부터 후방을 향하여 돌출된 경우 보다, 제2 방열플레이트(520)가 제1 방열플레이트(510)의 상단으로부터 전방을 향하여 돌출되었을 때 보다 견고한 방열 구조를 형성할 수 있다. When the second heat dissipation plate 520 protrudes from the top of the first heat dissipation plate 510 toward the front rather than when the second heat dissipation plate 520 protrudes from the lower end of the first heat dissipation plate 510 toward the rear. A more robust heat dissipation structure can be formed.
본 발명의 다른 실시예에 의한 디스플레이장치(10)의 경우도 상술한 것과 같이 도광판(200)의 후방에 배치되며 도광판(200)의 배면을 커버하며 배면에 접하도록 마련되는 후방 반사시트(610)를 포함할 수 있다. 다만 도 3과 도 7에서 확인할 수 있듯이 D 거리에 해당되는 도광판(200)의 하부가 본 발명의 다른 실시예에 의한 디스플레이장치(10)의 경우에는 존재하지 않으므로, 상술한 전방 반사시트(620)는 생략될 수 있다. In the case of the display device 10 according to another embodiment of the present invention, as described above, the rear reflection sheet 610 is disposed behind the light guide plate 200 and covers the rear surface of the light guide plate 200 and is provided to be in contact with the rear surface. may include. However, as can be seen in FIGS. 3 and 7 , since the lower portion of the light guide plate 200 corresponding to distance D does not exist in the case of the display device 10 according to another embodiment of the present invention, the front reflection sheet 620 described above. may be omitted.
이하에서는 도 2 내지 도 9의 실시예들에 공통적으로 적용될 수 있는 프런트커버(Front Cover, 800)에 대하여 구체적으로 설명하도록 한다. Hereinafter, a front cover 800 that can be commonly applied to the embodiments of FIGS. 2 to 9 will be described in detail.
프런트커버(800)는 디스플레이패널(100)의 전방에서 디스플레이패널(100)의 둘레를 덮도록 마련되는 제1 커버부(810)와 제1 커버부(810)의 하부에 마련되며 제1 커버부(810)보다 디스플레이패널(100)의 전방을 향하여 돌출되는 제2 커버부(820)를 포함할 수 있다. The front cover 800 is provided under the first cover part 810 and the first cover part 810 provided to cover the circumference of the display panel 100 in front of the display panel 100 , and the first cover part It may include a second cover part 820 that protrudes toward the front of the display panel 100 rather than the 810 .
즉, 도 3 및 도 4, 도 7 및 도 8을 참조하면, 디스플레이장치(10)의 단면의 두께는 디스플레이패널(100)이 배치된 영역에서의 단면의 두께보다 방열플레이트(500)가 배치된 영역에서의 단면의 두께가 두껍도록 마련될 수 있다. That is, referring to FIGS. 3 and 4 , 7 and 8 , the thickness of the cross-section of the display device 10 is greater than the thickness of the cross-section in the region where the display panel 100 is disposed. The thickness of the cross section in the region may be provided to be thick.
제1 커버부(810)의 하부에 마련되는 제2 커버부(820)가 제1 커버부(810)보다 디스플레이패널(100)의 전방을 향하여 돌출되는 것은 제2 커버부(820)와 제1 방열플레이트(510) 사이에 형성되며 PBA(400)가 배치되는 PBA 수용부(801)를 형성하기 위함이다. The second cover portion 820 provided under the first cover portion 810 protrudes toward the front of the display panel 100 rather than the first cover portion 810 is the second cover portion 820 and the first It is formed between the heat dissipation plates 510 to form the PBA receiving portion 801 in which the PBA 400 is disposed.
PBA 수용부(801)를 형성하여 종래에 디스플레이패널(100)의 후방 즉, 디스플레이장치(10)의 후면에 배치되던 PBA(400)를 방열플레이트(500)와 함께 디스플레이패널(100)의 전, 후방과 중첩되지 않도록 디스플레이패널(100)의 둘레의 외측에 배치하되 비교적 부피가 큰 PBA(400) 구조를 수용할 수 있다. Forming the PBA accommodating part 801, the PBA 400, which was conventionally disposed on the rear of the display panel 100, that is, on the rear of the display device 10, is placed on the front of the display panel 100 together with the heat dissipation plate 500, It is arranged on the outside of the periphery of the display panel 100 so as not to overlap with the rear, but a relatively bulky PBA 400 structure can be accommodated.
도 2 내지 도 9에 도시된 프런트커버(800)는 디스플레이장치(10)의 하부가 디스플레이패널(100)의 전방을 향하여 돌출되는 구조로 도시되어 있지만 이에 국한되는 것은 아니며, PBA(400)를 방열플레이트(500)와 함께 디스플레이패널(100)의 전, 후방과 중첩되지 않도록 디스플레이패널(100)의 둘레의 외측에 배치될 수 있다면 디스플레이장치(10)의 상부 또는 양 측부에 돌출되는 구조를 형성할 수도 있다. The front cover 800 shown in FIGS. 2 to 9 is illustrated in a structure in which the lower portion of the display device 10 protrudes toward the front of the display panel 100 , but is not limited thereto, and the PBA 400 is heat-dissipated. If it can be disposed on the outside of the periphery of the display panel 100 so as not to overlap the front and rear of the display panel 100 together with the plate 500, a structure protruding from the top or both sides of the display device 10 can be formed. may be
프런트커버(800)의 제2 커버부(820)는 PBA 수용부(801)와 외부를 연통시키는 복수의 홀(821)을 포함할 수 있다. 복수의 홀(821)은 상술한 스피커(900)가 배치된 위치에 대응하여 형성될 수 있다. 또는 도 1, 도 2 및 도 6에 도시된 것과 같이, 스피커(900)가 Bar형태의 스피커로 마련된 경우, 복수의 홀(821)이 형성된 영역은 이에 대응하여 제2 커버부(820)의 전면에 형성될 수 있다. The second cover portion 820 of the front cover 800 may include a plurality of holes 821 for communicating the PBA receiving portion 801 and the outside. The plurality of holes 821 may be formed to correspond to positions where the above-described speakers 900 are disposed. Alternatively, as shown in FIGS. 1, 2 and 6 , when the speaker 900 is provided as a bar-shaped speaker, the area in which the plurality of holes 821 are formed corresponds to the front surface of the second cover part 820 . can be formed in
복수의 홀(821)이 형성된 위치에 대응하여, 스피커(900)가 PBA 수용부(801)에 배치되므로 디스플레이장치 전방으로 효과적인 음 방사효과를 달성할 수 있다. 또한 음향 기능의 향상뿐만 아니라, 복수의 홀(821)을 통하여 방열플레이트(500)로부터 방사되는 열을 디스플레이장치(10)의 전방으로 효과적으로 방출할 수 있다. Corresponding to the position where the plurality of holes 821 are formed, since the speaker 900 is disposed in the PBA receiving part 801 , it is possible to achieve an effective sound radiation effect in front of the display device. In addition, in addition to improving the acoustic function, heat radiated from the heat dissipation plate 500 through the plurality of holes 821 may be effectively radiated to the front of the display device 10 .
도 10은 본 발명의 일 실시예에 따른 디스플레이장치의 PBA 및 백라이트 유닛의 접지 구조를 회로와 함께 모식적으로 나타낸 도면이다. 10 is a diagram schematically illustrating a ground structure of a PBA and a backlight unit of a display device according to an embodiment of the present invention together with circuits.
이하에서는 도 2 내지 도 9의 실시예들에 공통적으로 적용될 수 있는 접지구조에 대하여 구체적으로 설명하도록 한다. Hereinafter, a grounding structure that can be commonly applied to the embodiments of FIGS. 2 to 9 will be described in detail.
예를들어, 외부로부터 발생된 서지 전압(Surge Voltage)이 디스플레이장치(10)로 인가될 경우, 장치의 성능저하를 초래할 수 있다. 서지 전압의 일 예로, 정전기(Electro Static Discharge; ESD)에 의해 발생된 전압을 들 수 있다. 이러한 정전기는 사람 또는 물체에 유기된 정지된 전기를 의미하는데, 정전기에 의해 디스플레이장치로 고전압이 인가되면 디스플레이장치(10) 내부의 부품이 손상될 염려가 있다. 특히, 이러한 고전압이 영상을 표시하는 화소 영역으로 유입되면, 원하는 영상을 화면에 출력할 수 없게 된다.For example, when a surge voltage generated from the outside is applied to the display device 10 , the performance of the device may be deteriorated. An example of the surge voltage may be a voltage generated by electrostatic discharge (ESD). Such static electricity means static electricity induced by a person or an object. When a high voltage is applied to the display apparatus by static electricity, there is a risk that components inside the display apparatus 10 may be damaged. In particular, when such a high voltage flows into a pixel region displaying an image, a desired image cannot be output to the screen.
따라서, 디스플레이장치(10)는 이와 같은 서지 전압이 디스플레이장치(10) 내부의 부품으로 유입되어 디스플레이장치(10) 내부의 부품이 손상될 염려를 최소화하는 구성이 포함될 수 있다.Accordingly, the display device 10 may include a configuration that minimizes the possibility that such a surge voltage is introduced into the components inside the display device 10 to damage the components inside the display device 10 .
이를 위하여 디스플레이장치(10)는 도전성 물질로 구성된 접지 단자는 PCB의 일면에, LED 음극(G2)은 LED 기판(320)의 일면에 연결될 수 있다.To this end, in the display device 10 , a ground terminal made of a conductive material may be connected to one surface of the PCB, and the LED cathode G2 may be connected to one surface of the LED substrate 320 .
이하에서는 디스플레이장치(10)의 영상표현에 필요한 신호전압을 생성하는 타이밍컨트롤, 전원부 등의 전자 부품이 실장된 복수의 PCB를 통칭하여 PBA라고 서술하도록 한다. 또한 도 10의 접지구조를 설명함에 있어서, 다양한 전자 부품 중 전원부, LED 모듈 및 LED 모듈을 구동하기 위한 구동IC(Driver_Integrated Circuit, D_IC)에 관하여 중점적으로 서술하도록 한다. Hereinafter, a plurality of PCBs on which electronic components such as a timing control unit and a power supply unit for generating a signal voltage necessary for image expression of the display device 10 are mounted will be collectively described as PBA. Also, in describing the grounding structure of FIG. 10 , among various electronic components, a power supply unit, an LED module, and a Driver_Integrated Circuit (D_IC) for driving the LED module will be mainly described.
도 10을 참조하면, 디스플레이장치(10)의 구동을 위한 회로는, 외부로부터 공급되는 교류 또는 직류 전원을 디스플레이장치에 공급하는 1차 전원(1000), 1차 전원(1000)으로부터 전원을 분배받는 LED 구동 전원 회로(1200), 구동IC와 TV 영상보드 기타 디스플레이장치(10) 내부의 전자 부품을 구동하기 위한 전원 회로(1300), LED 모듈(300) 및 LED 모듈(300)에 흐르는 전류를 제어하기 위한 LED 구동IC(Driver_Integrated Circuit, D_IC, 1100)를 포함할 수 있다. 구동IC에는 전원부(1300)로부터 공급되는 리플이 있는 전압을 구동 IC의 공급 전압으로 평활 하는 커패시터(Vc)가 추가적으로 연결될 수 있다.Referring to FIG. 10 , a circuit for driving the display device 10 includes a primary power supply 1000 that supplies AC or DC power supplied from the outside to the display device, and a primary power source 1000 receiving power from the primary power supply 1000 . LED driving power circuit 1200, driving IC, TV image board and other display device 10 for driving the internal power circuit 1300, LED module 300 and LED module 300 to control the current flowing through It may include an LED driving IC (Driver_Integrated Circuit, D_IC, 1100) for A capacitor Vc for smoothing the ripple voltage supplied from the power supply unit 1300 to the supply voltage of the driving IC may be additionally connected to the driving IC.
LED 모듈(300), LED 구동IC(1100), LED 구동 전원 회로(1200), 디스플레이장치(10) 내부의 전자 부품을 구동하기 위한 전원 회로(1300)는 각각 외부로부터 발생된 서지 전압으로 인하여 디스플레이장치(10) 내부의 부품이 손상될 염려를 최소화하는 접지구조가 마련될 수 있다. The LED module 300 , the LED driving IC 1100 , the LED driving power supply circuit 1200 , and the power circuit 1300 for driving the electronic components inside the display device 10 are displayed due to the surge voltage generated from the outside, respectively. A grounding structure may be provided that minimizes the risk of damage to components inside the device 10 .
디스플레이장치(10) 내부의 전자 부품을 구동하기 위한 전원 회로 (1300)의 접지 단자를 G1, LED 모듈(300) 접지를 위한 LED 음극(G2)을 G2, LED 구동 전원 회로(1200)의 접지 구조를 G3, LED 구동IC(1100)의 접지 구조를 G4라고 지칭하도록 한다. 이하 에서는 서술의 편의상 전자 부품을 구동하기 위한 전원 회로(1300)의 접지 단자를 G1을 PBA의 접지 단자 G1으로 서술하도록 한다. The ground terminal of the power circuit 1300 for driving the electronic components inside the display device 10 is G1, the LED cathode (G2) for grounding the LED module 300 is G2, the ground structure of the LED driving power circuit 1200 is G3, and the ground structure of the LED driving IC 1100 is referred to as G4. Hereinafter, for convenience of description, the ground terminal G1 of the power circuit 1300 for driving the electronic component will be described as the ground terminal G1 of the PBA.
본 발명의 일 실시예에 의한 디스플레이장치(10)는 LED의 음극(G2)과 상기 PBA의 접지단자(G1)가 연결되는 금속재질의 방열플레이트(500)를 포함할 수 있다. 이하의 설명에서는 도 2 내지 도 5의 도면을 기준으로 설명하도록 한다. 다만 LED의 음극(Cathode, G2)과 상기 PBA의 접지단자(G1)가 하나의 방열플레이트(500)에 연결된다는 기술적 사상은 도 6 내지 도 9에도 동일하게 적용될 수 있음은 자명하다. The display device 10 according to an embodiment of the present invention may include a metal heat dissipation plate 500 to which the cathode G2 of the LED and the ground terminal G1 of the PBA are connected. In the following description, it will be described with reference to the drawings of FIGS. 2 to 5 . However, it is obvious that the technical idea that the cathode (Cathode, G2) of the LED and the ground terminal (G1) of the PBA are connected to one heat dissipation plate 500 can be equally applied to FIGS. 6 to 9 .
방열플레이트(500)는 PBA(400)가 장착되는 제1 장착면(511)을 포함하는 제1 방열플레이트(510)와 LED 모듈(300)이 장착되는 제2 장착면(521)을 포함하는 제2 방열플레이트(520)를 포함할 수 있다. 도 2 내지 도 5를 참조하면, 제1 방열플레이트(510)와 제2 방열플레이트(520)는 일체로 형성되어 방열플레이트(500)를 구성할 수 있다. The heat dissipation plate 500 includes a first heat dissipation plate 510 including a first mounting surface 511 on which the PBA 400 is mounted and a second mounting surface 521 on which the LED module 300 is mounted. Two heat dissipation plates 520 may be included. 2 to 5 , the first heat dissipation plate 510 and the second heat dissipation plate 520 may be integrally formed to constitute the heat dissipation plate 500 .
일체로 형성된다는 것의 의미는 방열플레이트(500)를 제조하는 과정에서 몰드와 같은 제조방법을 통하여 제1 방열플레이트(510)와 제2 방열플레이트(520)가 틈새없이 물리적으로 일체로 형성되는 것을 의미할 수 도 있으나 이와 달리 도 2 내지 도 9에 도시된 것과 유사하게 서로 접하여 하나의 구조물을 형성하는 것을 의미할 수도 있다.The meaning of being integrally formed means that the first heat dissipation plate 510 and the second heat dissipation plate 520 are physically integrally formed without a gap through a manufacturing method such as a mold in the process of manufacturing the heat dissipation plate 500 Alternatively, it may mean forming a single structure by contacting each other similarly to that shown in FIGS. 2 to 9 .
PBA(400)가 장착되는 제1 장착면(511)을 포함하는 제1 방열플레이트(510)는 디스플레이패널(100)의 폭과 대응하도록 좌우 폭이 상하 길이에 비해 긴 직사각형 판 형상으로 형성될 수 있다. 또한 열 전달 및 열 방출과 동시에 접지가 효과적으로 이루어 질 수 있도록 금속재질로 형성된다. The first heat dissipation plate 510 including the first mounting surface 511 on which the PBA 400 is mounted may be formed in a rectangular plate shape with left and right widths longer than the vertical length to correspond to the width of the display panel 100 . have. In addition, it is formed of a metal material so that the ground can be effectively grounded at the same time as heat transfer and heat dissipation.
제1 방열플레이트(510)는 제1 장착면(511)이 디스플레이패널의 전방을 향하도록 배치될 수 있다. 본 발명의 일 실시예에 의한 디스플레이장치(10)의 제2 방열플레이트(520)는 제1 방열플레이트(510)의 하단으로부터 후방을 향하여 돌출될 수 있다. LED 모듈(300)이 장착되는 제2 장착면(521)과 제2 방열플레이트(520)는 상기 복수의 LED(310)가 배치되는 방향을 따라 연장될 수 있다. The first heat dissipation plate 510 may be disposed such that the first mounting surface 511 faces the front of the display panel. The second heat dissipation plate 520 of the display apparatus 10 according to an embodiment of the present invention may protrude backward from the lower end of the first heat dissipation plate 510 . The second mounting surface 521 and the second heat dissipation plate 520 on which the LED module 300 is mounted may extend along a direction in which the plurality of LEDs 310 are disposed.
LED 모듈(300)은 디스플레이패널(100)의 후방에 배치되는 도광판(200)의 측면과 대향하도록 배치되며, 도광판(200)을 통하여 광을 디스플레이패널(100)에 공급하는 엣지형(Edge Type)으로 마련됨은 전술한 바와 같다. 다만 도 2 내지 도 5에 도시된 본 발명의 일 실시예에 의한 디스플레이장치(10)의 LED 모듈(300)은 도광판(200)이 직사각형의 판 형상으로 마련되는 것을 전제로 할 때, 도광판(200)의 네 개의 측면 중 하측 면에 대향하도록 배치되어 있다. The LED module 300 is disposed to face the side surface of the light guide plate 200 disposed at the rear of the display panel 100 , and supplies light to the display panel 100 through the light guide plate 200 Edge type (Edge Type) It is provided as described above. However, in the LED module 300 of the display device 10 according to an embodiment of the present invention shown in FIGS. 2 to 5 , on the premise that the light guide plate 200 is provided in a rectangular plate shape, the light guide plate 200 ) is arranged to face the lower side of the four sides.
따라서 제2 방열플레이트(520)의 제2 장착면(521)은 상술한 돌출구조에서 상면에 해당될 수 있다. 즉 제2 방열플레이트(520)의 상부에 제2 장착면(521)이 형성될 수 있다. LED 모듈(300)은 도광판(200)의 측면과 대향하도록 배치된다. 즉, 복수의 LED(310)는 도광판(200)의 측면을 따라 배치될 수 있으며 복수의 LED(310)가 실장되는 LED 기판(320)도 도광판(200)의 측면을 따라 연장 형성될 수 있다. LED 모듈(300)이 제2 방열플레이트(520)의 제2 장착면(521)에 장착된다는 것은 LED 기판(320)이 제2 방열플레이트(520)의 제2 장착면(521)에 장착되는 구조와 장착되는 것과 동일한 의미로 사용될 수 있다.Therefore, the second mounting surface 521 of the second heat dissipation plate 520 may correspond to the upper surface in the above-described protrusion structure. That is, the second mounting surface 521 may be formed on the second heat dissipation plate 520 . The LED module 300 is disposed to face the side surface of the light guide plate 200 . That is, the plurality of LEDs 310 may be disposed along the side surface of the light guide plate 200 , and the LED substrate 320 on which the plurality of LEDs 310 are mounted may also be formed to extend along the side surface of the light guide plate 200 . That the LED module 300 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 is a structure in which the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 . and can be used in the same meaning as mounted.
상술한 것과 같이 방열플레이트(500)는 제1 방열플레이트(510)와 제2 방열플레이트(520)가 일체로 형성되며 각각의 X방향으로의 폭은 동일하게 형성될 수 있다. 또한 디스플레이장치(10)의 우측면에서 보았을 때 방열플레이트(500)의 단면은 ㄴ자 형상으로 마련될 수 있다.As described above, in the heat dissipation plate 500 , the first heat dissipation plate 510 and the second heat dissipation plate 520 are integrally formed, and the width in each X direction may be the same. Also, when viewed from the right side of the display device 10 , the cross section of the heat dissipation plate 500 may be provided in an L-shape.
방열플레이트(500)배치는 도 2 내지 도 9과 관련하여 상술한 방열플레이트(500)의 디스플레이장치(10) 내에서의 배치와 동일하게 마련될 수 있다. The heat dissipation plate 500 may be disposed in the same manner as that of the heat dissipation plate 500 in the display device 10 described above with reference to FIGS. 2 to 9 .
마찬가지로 프런트커버(Front Cover)의 형상도 방열플레이트(500)와 관련하여 서술한 내용이 동일하게 적용될 수 있다. Similarly, the shape of the front cover may be equally applied to the contents described in relation to the heat dissipation plate 500 .
다만 추가적으로 프런트커버(Front Cover)는 방열플레이트(500)를 지지하는 절연체로 형성된 지지플랜지(802)를 더 포함할 수 있다. 도 3 및 도 4의 경우, 본 발명의 일 실시예에 의한 디스플레이장치(10)의 지지플랜지(802)는 제2 방열플레이트(520)의 하면을 지지하도록 프런트커버(Front Cover)의 제2 커버부(820)의 배면으로부터 후방을 향하여 돌출될 수 있다. 도 7 및 도 8의 본 발명의 다른 실시예에 의한 디스플레이장치(10)의 지지플랜지(802)는 제1 방열플레이트(510)의 하단을 지지하도록 프런트커버(800)의 제2 커버부(820)의 배면으로부터 후방을 향하여 돌출될 수 있다. However, additionally, the front cover may further include a support flange 802 formed of an insulator for supporting the heat dissipation plate 500 . 3 and 4, the support flange 802 of the display device 10 according to an embodiment of the present invention supports the second cover of the front cover to support the lower surface of the second heat dissipation plate 520. It may protrude from the rear surface of the part 820 toward the rear. The support flange 802 of the display device 10 according to another embodiment of the present invention shown in FIGS. 7 and 8 is a second cover part 820 of the front cover 800 to support the lower end of the first heat dissipation plate 510 . ) may protrude from the rear surface toward the rear.
지지플랜지(802)가 절연체로 구성되어 방열플레이트(500)를 지지하므로 사용자가 디스플레이장치(10)를 외부에서 접촉하였을 때 발생할 수 있는 정전기와 같은 사용상의 불편함을 사전에 방지할 수 있다. Since the support flange 802 is made of an insulator to support the heat dissipation plate 500 , inconvenience in use such as static electricity that may occur when a user contacts the display device 10 from the outside can be prevented in advance.
복수의 LED(310)는 LED 기판(320)의 일면에 실장될 수 있다. LED 기판(320)에 연결된 LED 음극(G2)은 LED 기판(320)이 제2 방열플레이트(520)의 제2 장착면(521)에 장착되는 구조로 인하여 최종적으로 방열플레이트(500)와 전기적으로 연결된 상태로 마련될 수 있다. The plurality of LEDs 310 may be mounted on one surface of the LED substrate 320 . The LED cathode G2 connected to the LED substrate 320 is finally electrically connected to the heat dissipation plate 500 due to the structure in which the LED substrate 320 is mounted on the second mounting surface 521 of the second heat dissipation plate 520 . It may be provided in a connected state.
도전성 물질로 구성된 PBA의 접지단자(G1)는, PBA(400)가 제1 방열플레이트(510)의 제1 장착면(511)에 장착됨으로써 방열플레이트(500)와 전기적으로 연결된 상태로 마련될 수 있다. 결과적으로 LED 음극(G2)과 PBA의 접지단자(G1)는 동일한 그라운드를 공유하는 구조로 마련될 수 있다. The ground terminal G1 of the PBA made of a conductive material may be provided in a state in which the PBA 400 is electrically connected to the heat dissipation plate 500 by being mounted on the first mounting surface 511 of the first heat dissipation plate 510 . have. As a result, the LED cathode G2 and the ground terminal G1 of the PBA may be provided to share the same ground.
도 10을 참조하면 LED 구동 전원부(1200)의 접지 구조를 G3, LED 구동IC(1100)의 접지 구조를 G4 역시 개시되어 있으며, 설계사양에 따라 LED 음극(G2)과 PBA의 접지단자(G1)와 마찬가지로 방열플레이트(500)에 연결되어 LED 음극(G2)과 PBA의 접지단자(G1)와 더불어 동일한 그라운드를 공유하는 구조로 마련될 수 있다. 따라서 서지 전압을 방전시키기 위해 별도의 그라운드를 마련할 필요가 없게 된다. 즉, 별도의 그라운드를 구성하기 위하여 필요하게 되는 각종 도선 구조를 생략할 수 있어 제조공정상의 단순화 및 제조비용 절감의 효과를 이룰 수 있다. Referring to FIG. 10 , the grounding structure of the LED driving power supply unit 1200 is disclosed as G3, and the grounding structure of the LED driving IC 1100 is also disclosed as G4. Similarly, it may be connected to the heat dissipation plate 500 to share the same ground with the LED cathode G2 and the ground terminal G1 of the PBA. Therefore, there is no need to provide a separate ground to discharge the surge voltage. That is, it is possible to omit various conductive wire structures required to construct a separate ground, thereby achieving the effect of simplification of the manufacturing process and reduction of manufacturing cost.
방열플레이트(500)의 제1 방열플레이트(510)와 제2 방열플레이트(520) 가 상술한 일체구조로 형성됨으로써 효과적인 방열구조는 물론 디스플레이패널(100)과 도광판(200)을 지지하는 미들몰드(710)와 함께 디스플레이장치(10)의 내부 구성을 더욱 견고히 지지하는 강성 보강 구조를 제공할 수 있다. 또한 방열플레이트(500)가 금속재질로 마련되며 LED 음극(G2) 및 PBA의 접지단자(G1)가 동시에 연결되어, 동일한 그라운드를 공유하는 구조는 상술한 서지 전압으로 인한 디스플레이장치(10) 내부의 부품이 손상될 염려를 최소화하는 효과와 더불어 각 전자부품간에 기준전위차이로 인한 과전류가 흐르는 상황을 방지하는 효과도 달성할 수 있다. A middle mold ( Together with the 710 , it is possible to provide a rigid reinforcement structure that more firmly supports the internal configuration of the display device 10 . In addition, the heat dissipation plate 500 is provided with a metal material, and the LED cathode (G2) and the ground terminal (G1) of the PBA are connected at the same time to share the same ground structure. In addition to the effect of minimizing the risk of component damage, it is possible to achieve the effect of preventing an overcurrent from flowing between each electronic component due to a difference in reference potential.
이상에서는 특정의 실시예에 대하여 도시하고 설명하였다. 그러나, 상기한 실시예에만 한정되지 않으며, 발명이 속하는 기술분야에서 통상의 지식을 가진 자라면 이하의 청구범위에 기재된 발명의 기술적 사상의 요지를 벗어남이 없이 얼마든지 다양하게 변경 실시할 수 있을 것이다.In the above, specific embodiments have been shown and described. However, it is not limited only to the above-described embodiments, and those of ordinary skill in the art to which the invention pertains can make various changes without departing from the spirit of the invention described in the claims below. .

Claims (15)

  1. 디스플레이패널;display panel;
    상기 디스플레이패널의 후방에 배치된 도광판;a light guide plate disposed behind the display panel;
    상기 도광판에 광을 조사하도록, 상기 도광판의 측면을 따라 배치되는 복수의 LED를 포함하는 LED 모듈;an LED module including a plurality of LEDs disposed along a side surface of the light guide plate to irradiate light to the light guide plate;
    디스플레이장치의 제어 및 영상처리 위하여 구비되는 PBA(Printed Board Assembly); 및a PBA (Printed Board Assembly) provided for controlling a display device and processing an image; and
    일측에 상기 LED 모듈이 장착되고, 타측에 상기 PBA가 장착되는방열플레이트;를 포함하고, Including; a heat dissipation plate on which the LED module is mounted on one side and the PBA is mounted on the other side;
    상기 방열플레이트와 상기 PBA는 상기 디스플레이패널의 전, 후방과 중첩되지 않도록 배치되어 상기 방열플레이트를 통해 전달되는 열과 상기 PBA로부터 발생된 열이 상기 디스플레이패널의 둘레의 전방 외측으로 방열되도록 마련되는 디스플레이장치.The heat dissipation plate and the PBA are disposed so as not to overlap the front and rear sides of the display panel so that the heat transmitted through the heat dissipation plate and the heat generated from the PBA are provided to be radiated to the front and outside of the periphery of the display panel. .
  2. 제1항에 있어서,According to claim 1,
    상기 방열플레이트는 상기 PBA가 장착되는 제1 장착면을 포함하는 제1 방열플레이트와 상기 LED 모듈이 장착되는 제2 장착면을 포함하는 제2 방열플레이트를 포함하고, 상기 제1 장착면은 디스플레이패널의 전방을 향하도록 형성되며 상기 제2 장착면과 상기 제2 방열플레이트는 상기 복수의 LED가 배치되는 방향을 따라 연장되는 디스플레이장치.The heat dissipation plate includes a first heat dissipation plate including a first mounting surface on which the PBA is mounted and a second heat dissipation plate including a second mounting surface on which the LED module is mounted, wherein the first mounting surface is a display panel is formed to face the front of the display device and the second mounting surface and the second heat dissipation plate extend along a direction in which the plurality of LEDs are arranged.
  3. 제2항에 있어서,3. The method of claim 2,
    상기 제1 장착면은 상기 디스플레이패널의 둘레의 외측에 배치되는 디스플레이장치.The first mounting surface is a display device disposed outside the periphery of the display panel.
  4. 제3항에 있어서,4. The method of claim 3,
    상기 제1 장착면은 상기 디스플레이패널의 하부에 배치되며,The first mounting surface is disposed under the display panel,
    상기 제2 방열플레이트는 상기 제1 방열플레이트의 하단으로부터 후방을 향하여 돌출되며, 상기 제2 방열플레이트의 상부에 상기 제2 장착면이 형성되는 디스플레이장치.The second heat dissipation plate protrudes backward from a lower end of the first heat dissipation plate, and the second mounting surface is formed on the second heat dissipation plate.
  5. 제4항에 있어서,5. The method of claim 4,
    상기 도광판은 상기 제2 장착면에 장착된 상기 LED 모듈의 상단까지 연장되며, 상기 방열플레이트는 상기 제1 방열플레이트의 상기 제1 장착면의 반대 면에 형성되는 지지부를 포함하고, 상기 지지부는 상기 도광판의 하부의 전면을 지지하는 디스플레이장치.The light guide plate extends to an upper end of the LED module mounted on the second mounting surface, and the heat dissipation plate includes a support formed on a surface opposite to the first mounting surface of the first heat dissipation plate, and the support portion is the A display device supporting the front surface of the lower portion of the light guide plate.
  6. 제5항에 있어서,6. The method of claim 5,
    상기 도광판의 배면을 커버하며 상기 배면에 접하도록 배치되는 후방 반사시트 및 상시 도광판의 전방에 배치되며 상기 도광판의 상기 하부의 전면을 커버하며 상기 하부의 전면에 접하도록 배치되는 전방 반사시트를 포함하는 디스플레이장치.A rear reflection sheet covering the rear surface of the light guide plate and disposed in contact with the rear surface, and a front reflection sheet disposed always in front of the light guide plate, covering the front surface of the lower portion of the light guide plate, and disposed in contact with the front surface of the lower portion display device.
  7. 제2항에 있어서,3. The method of claim 2,
    상기 제2 방열플레이트는 상기 도광판의 둘레의 외측에 배치되는 디스플레이장치.The second heat dissipation plate is disposed outside the circumference of the light guide plate.
  8. 제7항에 있어서,8. The method of claim 7,
    상기 제2 방열플레이트는 상기 도광판의 하부에 배치되며, The second heat dissipation plate is disposed under the light guide plate,
    상기 제2 방열플레이트는 상기 제1 방열플레이트의 상단으로부터 전방을 향하여 돌출되며, 상기 제2 방열플레이트의 상부에 상기 제2 장착면이 형성되는 디스플레이장치.The second heat dissipation plate protrudes forward from an upper end of the first heat dissipation plate, and the second mounting surface is formed on the second heat dissipation plate.
  9. 제8항에 있어서,9. The method of claim 8,
    상기 도광판은 상기 제2 장착면에 장착된 LED 모듈의 상단까지 연장되며, 상기 방열플레이트는 상기 제1 방열플레이트의 상기 제1 장착면의 반대 면에 형성되는 지지부를 포함하고, 상기 지지부는 상기 도광판의 배면을 지지하는 리어섀시(Rear Chassis)에 의해 지지되는 디스플레이장치. The light guide plate extends to an upper end of the LED module mounted on the second mounting surface, and the heat dissipation plate includes a support formed on a surface opposite to the first mounting surface of the first heat dissipation plate, and the support portion is the light guide plate A display device supported by a rear chassis supporting the rear surface of the display device.
  10. 제9항에 있어서,10. The method of claim 9,
    상기 리어섀시는, 상기 리어섀시로부터 상기 도광판과 상기 복수의 LED 사이로 돌출되며 상기 도광판의 하단 일부를 지지하여 상기 도광판과 상기 복수의 LED를 이격시키도록 마련되는 스페이서를 포함하는 디스플레이장치.The rear chassis includes a spacer that protrudes between the light guide plate and the plurality of LEDs from the rear chassis and is provided to support a lower portion of the light guide plate to space the light guide plate and the plurality of LEDs apart.
  11. 제10항에 있어서,11. The method of claim 10,
    상기 도광판의 후방에 배치되며 상기 도광판의 배면을 커버하며 상기 배면에 접하도록 마련되는 후방 반사시트를 포함하는 디스플레이장치. and a rear reflection sheet disposed at a rear side of the light guide plate to cover a rear surface of the light guide plate and to be in contact with the rear surface.
  12. 제4항 또는 제8항 중 어느 하나의 항에 있어서,9. The method of any one of claims 4 or 8,
    상기 디스플레이패널의 전방에서 상기 디스플레이패널의 둘레를 덮도록 마련되는 제1 커버부와 상기 제1 커버부의 하부에 마련되며 상기 제1 커버부보다 상기 디스플레이패널의 전방을 향하여 돌출되는 제2 커버부를 포함하는 프런트커버(Front Cover)를 더 포함하는 디스플레이장치.A first cover portion provided to cover the circumference of the display panel from the front of the display panel, and a second cover portion provided under the first cover portion and protruding toward the front of the display panel than the first cover portion The display device further comprising a front cover (Front Cover).
  13. 제12항에 있어서,13. The method of claim 12,
    상기 제2 커버부와 상기 제1 방열플레이트 사이에 형성되며 상기 PBA가 배치되는 PBA 수용부를 더 포함하는 디스플레이장치.The display apparatus further comprising a PBA accommodating part formed between the second cover part and the first heat dissipation plate and in which the PBA is disposed.
  14. 제13항에 있어서,14. The method of claim 13,
    상기 프런트커버의 상기 제2 커버부는 상기 PBA 수용부와 외부를 연통시키는 복수의 홀을 포함하며, 상기 복수의 홀을 통하여 상기 PBA 수용부의 열이 상기 디스플레이패널의 둘레의 전방 외측으로 유동되도록 마련되는 디스플레이장치.The second cover part of the front cover includes a plurality of holes for communicating the PBA accommodating part and the outside, and through the plurality of holes, the rows of the PBA accommodating part are provided to flow outwardly in front of the periphery of the display panel. display device.
  15. 제14항에 있어서, 15. The method of claim 14,
    상기 디스플레이장치는 상기 복수의 홀이 형성된 위치에 대응하여 상기 PBA 수용부에 배치되는 스피커를 더 포함하는 디스플레이장치.The display device further comprises a speaker disposed in the PBA receiving portion corresponding to the position where the plurality of holes are formed.
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JP2019036779A (en) * 2017-08-10 2019-03-07 シャープ株式会社 Display device and television receiver
JP2019198017A (en) * 2018-05-10 2019-11-14 シャープ株式会社 Display device and television receiver

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