WO2019028678A1

WO2019028678A1 - Antenna assembly and terminal

Info

Publication number: WO2019028678A1
Application number: PCT/CN2017/096447
Authority: WO
Inventors: 王磊; 毛维华; 吕书文; 吕仁
Original assignee: 华为技术有限公司
Priority date: 2017-08-08
Filing date: 2017-08-08
Publication date: 2019-02-14
Also published as: CN110168807B; CN110168807A

Abstract

Embodiments of the present application relate to the technical field of antennas, and provide an antenna assembly and a terminal. The terminal comprises a non-metal back shell, a main board, a battery, and a coupling coil layer. The inner surface of the non-metal back shell is provided with a heat conductor layer; the heat conductor layer is slotted to form an NFC antenna coil; the main board is disposed opposite to the heat conductor layer, and a feeding point is provided on the main board; the battery and the main board are arranged in a direction parallel to the heat conductor layer; the coupling coil layer is disposed between the main board and the heat conductor layer, and is arranged along with the battery in a direction parallel to the heat conductor layer; the coupling coil layer is connected to the feeding point on the main board; and a space coupling can be formed between the coupling coil layer and the heat conductor layer, so that the heat conductor layer generates secondary radiation.

Description

Antenna assembly and terminal

Technical field

The present application relates to the field of antenna technologies, and in particular, to an antenna assembly and a terminal.

Background technique

With the popularity and development of mobile payment technologies, more and more terminals support NFC (Near Field Communication) functions. NFC is a contactless identification and interconnection technology that can be used in mobile devices and consumer electronics. Close-range wireless communication between products, PCs, and smart control tools. NFC provides a simple, touch-enabled solution that allows consumers to easily and intuitively exchange information and access content and services.

NFC consists of an NFC module and an NFC antenna. The NFC module is generally composed of a high-speed single-chip microcomputer, a radio frequency chip, and a matching circuit. The NFC module is disposed in the motherboard of the terminal, and the NFC antenna is connected to the feeding point of the motherboard. Among them, the NFC antenna is based on RFID (Radio Frequency Identification) technology, adopts transformer co-coupled matching to do the hardware processing scheme of communication, and completes the verification of data transmission process through the communication instruction of the processor, software and hardware environment. It is designed and manufactured successfully by RFID modulation processing and through matching circuit adjustment. The commonly used NFC antenna operates at 13.56 Mhz. Since the 13.56 Mhz wavelength is long and the read/write distance is very short, the size of the NFC antenna is critical to improving the user experience. The larger the area of the NFC antenna, the larger the identifiable range, and the better the user experience. However, a larger area of the NFC antenna needs to occupy a separate space, which may result in an increase in the thickness of the terminal, which is disadvantageous to the thinning of the terminal device.

Summary of the invention

Embodiments of the present application provide an antenna assembly and a terminal to reduce a thickness space occupied by an NFC antenna in a terminal.

To achieve the above objective, the embodiment of the present application adopts the following technical solutions:

In a first aspect, the present application provides a terminal, including a non-metal back shell, a main board, a battery, and a coupling coil layer, wherein an inner surface of the non-metal back shell is provided with a heat conductor layer, and the heat conductor layer is slotted to form an NFC antenna coil. The main board is opposite to the thermal conductor layer, and the feeding point is arranged on the main board; the battery and the main board are arranged in a direction parallel to the thermal conductor layer; the coupling coil layer is disposed between the main board and the thermal conductor layer, and is parallel to the heat conduction body of the battery The layers are arranged in the direction, the coupling coil layer is connected to the feeding point on the main board, and the coupling coupling layer and the heat conductor layer can form a space coupling, so that the thermal conductor layer generates secondary radiation.

In the terminal provided by the embodiment of the present application, the heat conductor layer is slotted to form an NFC antenna coil, and a space coupling can be formed between the coupling coil layer and the heat conductor layer, so that the NFC antenna coil formed by the heat conductor layer is excited. The induced current is generated, and the induced current generates secondary radiation. The embodiment of the present application utilizes a thermal conductor layer as the final radiating element of the NFC antenna, and the area of the thermal conductor layer can satisfy the requirement of the NFC antenna for the identification range, and the coupling coil layer is only used to couple the thermal conductor layer, so the area of the coupling coil layer is It can be made small so that the coupling coil layer is arranged corresponding to the position of the main board and aligned with the battery in a direction parallel to the heat conductor layer, so that the thickness space is not occupied, and the terminal product is made lighter and thinner.

In a possible implementation, the heat conductor layer is connected with a matching circuit module, and the NFC antenna coil is open The antenna coil, the matching circuit module and the NFC antenna coil are connected to form a closed annular current path. Thus, the operating frequency of the NFC antenna coil can be adjusted by adjusting the matching circuit module, for example, the operating frequency of the NFC antenna can be adjusted to a commonly used 13.56 Mhz. Since the thickness of the matching circuit module is slightly thicker than that of the thermal conductor layer, in order to prevent the thickness of the whole machine from increasing, the components with smaller thickness on the main board may be correspondingly matched with the matching circuit module to avoid the thickness of the matching circuit module, because the matching circuit module is The area is small, so avoidance is easy to achieve.

In a possible implementation, the matching circuit module can be disposed on the main board. In this case, a connection line is required between the main board and the thermal conductor layer to connect the matching circuit module to the thermal conductor layer. Specifically, one end of the connecting line can be connected to the matching circuit module on the main board, and the other end of the connecting line is crimped with the heat conductor layer through the crimping structure to facilitate opening of the non-metallic back shell.

In another possible implementation manner, the matching circuit module can also be disposed on the inner surface of the non-metal back shell. In this case, the heat conductor layer and the matching circuit module can be connected to the non-metal back shell to form a loop. It does not need to be connected to the motherboard. This connection structure is easy to implement and does not affect the opening of the non-metallic back shell.

In a possible implementation manner, since the heat dissipation layer is usually provided with a escaping hole for escaping the camera, the escaping hole can be used as a part of the NFC antenna coil. Specifically, the heat conductor layer is provided with a long groove and a long groove. One end penetrates through the first edge of the heat conductor layer, and the other end penetrates through the avoidance hole. The two sides of the long slot are respectively provided with a connection point, and the two connection points are respectively connected to the two interfaces of the matching circuit module. This simplifies the grooving process. The magnetic flux near the camera can be made larger, and the camera can be used as a center position when swiping, which is convenient for reference and improves recognition speed and accuracy.

In a possible implementation, the NFC antenna coil is a closed antenna coil, and the enclosed antenna coil forms a closed annular current path inside the thermal conductor layer. This structure needs to adjust the operating frequency of the NFC antenna coil by adjusting the structure of the closed antenna coil, without connecting the matching circuit module, the manufacturing process can be simplified, and there is no connection between the thermal conductor layer and the main board, and the non-metallic back shell is not affected. turn on.

In a possible implementation manner, the heat conductor layer is provided with a escaping hole for escaping the camera, and the first heat sink layer is provided with a first long slot and a second long slot perpendicular to each other, and the first long slot is adjacent to the first layer of the heat conductor layer. The edge is disposed parallel to the first edge of the heat conductor layer, and one end of the second long groove penetrates the first long groove, and the other end penetrates with the escape hole. This structure can only change the length and width of the first long slot to adjust the operating frequency of the NFC antenna coil, and achieve the purpose of adjusting the operating frequency by minimizing structural changes, thereby preventing excessive waste.

In a possible implementation, the surface of the coupling coil layer adjacent to the thermal conductor layer is flush with the surface of the battery adjacent to the thermal conductor layer. Thereby, the coupling coil layer can be kept away from the main board as far as possible without exceeding the thickness range of the battery, thereby avoiding the influence on the heat dissipation of the main board.

In a possible implementation, the coupling coil layer includes an FPC (Flexible Printed Circuit) and a coupling coil disposed inside the FPC. The FPC is thinner in thickness, small in space and low in cost.

In a possible implementation manner, the projection of the region of the heat conductor layer slotted on the main board is offset from the component on the main board that needs to dissipate heat, and the projection of the coupling coil layer on the main board and the main board The components that need to dissipate heat are staggered. Thereby, it is possible to prevent the groove of the heat conductor layer and the coupling coil layer from affecting the heat dissipation of the element having high heat on the main board.

In a possible implementation, the gap between the heat conductor layer and the coupling coil layer is 0.2 to 0.3 mm. This gap range allows for a better coupling between the thermal conductor layer and the coupling coil layer.

In a possible implementation, the coupling coil layer is provided with a ferrite layer on the surface of the main board. Ferrite layer The eddy current generated on the surface of the conductor inside the main board is prevented from weakening the magnetic field of the coupling coil layer, thereby increasing the magnetic flux and improving the coupling effect between the thermal conductor layer and the coupling coil layer.

In a second aspect, the present application provides another terminal, including a non-metal back shell and a main board. The inner surface of the non-metal back shell is provided with a heat conductor layer, and the heat conductor layer is slotted to form an NFC antenna coil; the main board is opposite to the heat conductor layer. There is a feeding point on the main board, and the NFC antenna coil is connected with the feeding point on the main board.

The terminal provided by the embodiment of the present invention directly connects the thermal conductor layer to the feeding point on the main board, and uses the thermal conductor layer as the radiating unit of the NFC antenna. The area of the thermal conductor layer can meet the requirement of the NFC antenna for the recognition range, and there is no Adding other devices, the thickness of the whole machine is not changed, thus avoiding the NFC antenna occupying the thickness space of the whole machine.

In a possible implementation of the second aspect, the thermal conductor layer is provided with a ferrite layer on the surface of the main board. The ferrite layer prevents eddy currents generated on the conductor surface of the main board from weakening the magnetic field of the thermal conductor layer, thereby improving the performance of the NFC antenna.

In a third aspect, the present application provides a mobile phone including a non-metallic back shell, a heat conductor layer is disposed on an inner surface of the non-metal back shell, and a heat sink layer is formed to form an NFC antenna coil; the main board, the main board and the heat conductor layer are along the mobile phone. The thickness direction is arranged, the feeding point is arranged on the main board; the battery, the battery and the main board are arranged along the length direction of the mobile phone; the FPC and the FPC are formed with an antenna coil, the FPC is disposed between the main board and the thermal conductor layer, and the FPC and the battery are along the mobile phone. Arranged in the length direction, the antenna coil in the FPC is connected to the feeding point on the main board, and the space coupling between the antenna coil and the heat conductor layer in the FPC can be formed to generate secondary radiation of the NFC antenna coil of the thermal conductor layer; the matching circuit The module, the matching circuit module is disposed on the inner surface of the non-metallic back shell, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected with the NFC antenna coil to form a closed annular current path.

In the mobile phone provided by the embodiment of the present application, the heat conductor layer is slotted to form an NFC antenna coil, and a space coupling can be formed between the antenna coil and the heat conductor layer in the FPC to generate secondary radiation, thereby utilizing The thermal conductor layer acts as the final radiating element of the NFC antenna. The area of the thermal conductor layer can meet the requirements of the NFC antenna for the identification range. The antenna coil in the FPC is only used to couple the thermal conductor layer, so the area of the FPC can be made small, so that the FPC Corresponding to the position setting of the main board and the length direction of the battery phone, so as not occupying the thickness space of the mobile phone, the mobile phone is more light and thin.

In a fourth aspect, the present application provides an antenna assembly including a non-metallic back shell, the inner surface of the non-metal back shell is provided with a heat conductor layer, the heat conductor layer is slotted to form an NFC antenna coil, the coupling coil layer, the coupling coil layer and the heat conduction The body layers are parallel and spaced apart, and a spatial coupling can be formed between the coupling coil layer and the heat conductor layer to cause secondary radiation of the heat conductor layer.

In the antenna assembly provided by the embodiment of the present application, the heat conductor layer is slotted to form an NFC antenna coil, and a space coupling can be formed between the coupling coil layer and the heat conductor layer to generate secondary radiation, thereby utilizing heat conduction. As the final radiating element of the NFC antenna, the body layer can meet the requirement of the NFC antenna for the recognition range, and the coupling coil layer is only used to couple the heat conductor layer, so the area of the coupling coil layer can be made small, so that the coupling coil The layer does not occupy the thickness space.

In a possible implementation manner of the fourth aspect, the heat conductor layer is connected with the matching circuit module, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected with the NFC antenna coil to form a closed annular current path. Thus, the operating frequency of the NFC antenna coil can be adjusted by adjusting the matching circuit module, for example, the operating frequency of the NFC antenna can be adjusted to a commonly used 13.56 Mhz. Specifically, the matching circuit module can be a fixed value inductor, and Change the operating frequency of the NFC antenna coil by changing the fixed inductance of different models.

In a possible implementation manner of the fourth aspect, the matching circuit module can be disposed on the inner surface of the non-metal back shell. In this case, only the heat conductor layer and the matching circuit module are connected to the non-metal back shell to form a loop. Yes, this connection structure is easy to implement and does not affect the opening of the non-metallic back shell.

In a possible implementation manner of the fourth aspect, since the heat dissipation layer is generally provided with an escape hole for escaping the camera, the avoidance hole may be used as a part of the NFC antenna coil, and specifically, the heat conductor layer is provided with a long length. The slot has a first end of the slot extending through the first edge of the heat conductor layer, and the other end is connected to the avoidance hole. The two sides of the slot are respectively provided with a connection point, and the two connection points are respectively connected to the two interfaces of the matching circuit module. This simplifies the grooving process. The magnetic flux near the camera can be made larger, and the camera can be used as a center position when swiping, which is convenient for reference and improves recognition speed and accuracy.

In a possible implementation of the fourth aspect, the NFC antenna coil is a closed antenna coil, and the enclosed antenna coil forms a closed annular current path inside the thermal conductor layer. This structure needs to adjust the operating frequency of the NFC antenna coil by adjusting the structure of the closed antenna coil. It is not necessary to connect the matching circuit module, which simplifies the manufacturing process and does not affect the opening of the non-metallic back shell.

In a possible implementation manner of the fourth aspect, the heat conductor layer is provided with a escaping hole for escaping the camera, and the heat conductor layer is provided with a first long slot and a second long slot perpendicular to each other, and the first long slot is adjacent to the heat conductor. The first edge of the layer is disposed parallel to the first edge of the heat conductor layer, and one end of the second long groove penetrates the first long groove, and the other end penetrates with the escape hole. This structure can only change the length and width of the first long slot to adjust the operating frequency of the NFC antenna coil, and achieve the purpose of adjusting the operating frequency by minimizing structural changes, thereby preventing excessive waste.

In a possible implementation of the fourth aspect, the coupling coil layer comprises an FPC and a coupling coil disposed inside the FPC. The FPC is thinner in thickness, small in space and low in cost.

In a possible implementation of the fourth aspect, the gap between the heat conductor layer and the coupling coil layer is 0.2 to 0.3 mm. This gap range allows for a better coupling between the thermal conductor layer and the coupling coil layer.

In a possible implementation of the fourth aspect, the coupling coil layer is provided with a ferrite layer on the surface of the main board. When the antenna assembly is used in the terminal, the ferrite layer prevents the eddy current generated on the conductor surface in the main board of the terminal from weakening the magnetic field of the coupling coil layer, thereby increasing the magnetic flux and improving the coupling between the thermal conductor layer and the coupling coil layer. effect.

DRAWINGS

1 is a schematic cross-sectional structural view of a mobile phone;

2 is a front view of a mobile phone according to an embodiment of the present application;

3 is a schematic cross-sectional structural view of a mobile phone according to Embodiment 1 of the present application;

4 is a schematic exploded view showing a main board, a coupling coil layer, and a heat conductor layer in the mobile phone according to Embodiment 1 of the present application;

5 is a schematic exploded view showing a matching circuit module of a mobile phone according to Embodiment 1 of the present application when it is disposed in a non-metal back shell;

6 is a schematic exploded view showing the NFC antenna coil in a closed type when the mobile phone is in the first embodiment of the present application;

7 is a schematic exploded view showing a main board, a coupling coil layer, and a heat conductor layer in the mobile phone according to Embodiment 2 of the present application;

FIG. 8 is a schematic structural diagram of an antenna assembly according to Embodiment 4 of the present application.

Detailed ways

The embodiment of the present application relates to a terminal, which may be a mobile terminal, and the mobile terminal may include a mobile phone. Tablet PC, PDA (Personal Digital Assistant), POS (Point of Sales), on-board computer, etc. The specific form of the terminal is not specifically limited in the embodiment of the present invention.

The mobile terminal may include a main board, a rear case, a thermal conductor layer, and an NFC antenna. The above components will be briefly described below.

Motherboard: The motherboard is also called the main control board, motherboard, system board, logic board, motherboard, backplane, etc. It can include NFC modules and feed points. Among them, the NFC module is generally composed of a high-speed single-chip microcomputer, a radio frequency chip and a matching circuit, and the matching circuit is used to adjust the operating frequency of the NFC antenna.

Rear case: A cover that is attached to the back of the phone to protect the internal components of the phone.

Thermal conductor layer: a layer of a heat conductor material formed on the inner surface of the back cover of the mobile phone, and specifically may be a good conductor such as double-layer graphite, graphite plus copper foil or graphene. It is used to evenly dissipate the heat of the back cover of the mobile phone to prevent local overheating of the back cover of the mobile phone

NFC antenna: Based on RFID technology, it adopts transformer co-coupled matching to do the hardware processing scheme of communication, and completes the verification of data transmission process through the communication instruction of the processor. The hardware and software environment is processed by RFID modulation and adjusted by matching circuit. The design was successful. NFC antennas typically consist of a circuit coil made by a winding/printing/etching process and a ferrite material that is resistant to interference.

In addition, the mobile terminal may further include: RF (Radio Frequency) circuit, memory, other input devices, display screen, sensor, I/O subsystem, processor, power management chip, camera, Bluetooth module, virtual button, entity Buttons and other components will not be described here.

It will be understood by those skilled in the art that the structure of the above mobile terminal does not constitute a limitation of the terminal, and may include more or less components than those illustrated, or combine some components, or split some components, or different components. Arrangement. Those skilled in the art will appreciate that the display screen belongs to a User Interface (UI) and that the handset may include fewer user interfaces than illustrated or less.

In the following embodiments, the terminal may use a mobile phone as an example. Of course, the electronic device in the embodiment of the present application is not limited to a mobile phone. With the increasing integration of electronic components, mobile phones are increasingly moving toward thinner and lighter, and the architecture and performance requirements for NFC antennas are also increasing.

1 is a partial structural view of a cross section of a mobile phone. Referring to FIG. 1, the mobile phone includes a main board 01 and a battery 02 arranged along the X direction shown in FIG. 1, and an NFC antenna 03 is disposed above the battery 02 and the main board 01. The thickness of the battery 02 is greater than the thickness of the main board 01, and the NFC antenna 03 and the main board There is a bracket 04 between them, which can increase the strength of the whole machine and provide buffer protection to the main board 01. Applicants have found that the size of the NFC antenna 03 in this solution is large, so it can only be stacked in the thickness direction of the battery 02, thereby causing an increase in the thickness of the whole machine, which is disadvantageous to the thinning of the mobile phone.

Embodiment 1,

To solve the above problem, the embodiment of the present application provides a structural design scheme of a mobile phone, as shown in FIGS. 2 to 3. The mobile phone 100 of the embodiment of the present invention includes a non-metal back shell 1, a main board 2, a battery 3, and a coupling coil layer 4, wherein the inner surface of the non-metal back shell 1 is provided with a heat conductor layer 5, and the heat conductor layer 5 is grooved. NFC antenna coil, the main board 2 is opposite to the thermal conductor layer 5, and the main board 2 is provided with a feeding point (not shown); the battery 3 and the main board 2 are arranged in a direction parallel to the thermal conductor layer 5; the coupling coil layer 4 Between the main board 2 and the thermal conductor layer 5, and the battery 3 is arranged in a direction parallel to the thermal conductor layer 5, the coupling coil layer 4 is connected to the feeding point on the main board 2, and the coupling coil layer 4 and the thermal conductor layer 5 are connected. A spatial coupling can be formed between them to cause secondary radiation of the thermal conductor layer 5.

In the mobile phone provided by the embodiment of the present application, the heat conductor layer 5 is slotted to form an NFC antenna coil, and the coupling coil layer 4 and the heat conductor layer 5 can form a space coupling. Therefore, the heat conductor layer 5 is formed in the NFC antenna coil. It will be excited by the induced current, and the induced current will emit secondary radiation. Thus, the thermal conductor layer 5 is utilized as the final radiating element of the NFC antenna, the grooving process does not increase the thickness of the thermal conductor layer 5, and the area of the thermal conductor layer 5 can satisfy the requirement of the NFC antenna for the identification range, and the coupling coil layer 4 is only used to couple the thermal conductor layer 5, so the area of the coupling coil layer 4 can be made small, so that the coupling coil layer 4 is disposed corresponding to the position of the main board 2 and aligned with the battery 3 in a direction parallel to the thermal conductor layer 5, thereby not occupying The thickness space makes the terminal products lighter and thinner.

As shown in FIG. 4, the main board 2 is provided with an NFC chip 21 and a matching circuit 22. The feeding point on the main board 2 is connected to the matching circuit 22, and the connection mode of the coupling coil layer 4 and the feeding point can be a differential feeding mode. It can also be a non-differential single-ended feed mode, which is not limited herein.

It should be noted that the heat conductor layer 5 is slotted to form an NFC antenna coil, wherein the slot can be completed by an etching process, that is, a part of the material of the heat conductor layer 5 can be removed by a chemical reaction or a physical impact method to finally form an NFC antenna coil structure. . The specific process used is not limited. The shape of the slot of the heat conductor layer 5 may also be a plurality of shapes, such as a circle, an ellipse, a square, a triangle, etc., and is not limited herein. The antenna coil formed after the slotting may be a closed structure or an open type. structure.

4 shows an embodiment of an open antenna coil. The NFC antenna coil shown in FIG. 4 is an open antenna coil, and the matching circuit module 6 is connected to the NFC antenna coil to form a closed annular current path. The arrow in Fig. 4 shows a possible flow path of the induced current. Thus, the operating frequency of the NFC antenna coil can be adjusted by adjusting the matching circuit module 6, for example, the operating frequency of the NFC antenna coil can be adjusted to the commonly used 13.56. Mhz. Specifically, the matching circuit module 6 can be a constant value inductor, and the operating frequency of the NFC antenna coil is adjusted by replacing different types of fixed value inductors. Since the thickness of the matching circuit module 6 is slightly thicker than that of the thermal conductor layer 5, in order to prevent the thickness of the whole machine from increasing, the components having a smaller thickness on the main board 2 may be disposed corresponding to the matching circuit module 6 to avoid the thickness of the matching circuit module 6. Since the area of the matching circuit module 6 is small (usually less than 1 mm x 2 mm), avoidance is easy to implement.

It should be noted that the current working frequency of the NFC antenna is 13.56 Mhz, but the 13.56 Mhz is not limited to the operating frequency of the NFC antenna of the present application. The operating frequency of the NFC antenna may also be 13.56 MHz ± 7 kHz, or 13.56 MHz ± 678 Hz, etc. Any operating frequency that can be applied to an NFC antenna is within the scope of this application.

As shown in FIG. 4, the matching circuit module 6 can be disposed on the main board 2. At this time, it is necessary to provide a connection line between the main board 2 and the heat conductor layer 5, and connect the matching circuit module 6 to the heat conductor layer 5. Specifically, one end of the connecting line can be fixedly connected with the matching circuit module 6 on the main board 2, and the other end of the connecting line can be detachably connected to the thermal conductor layer 5 (for example, crimped by a crimping structure) to facilitate the non-metallic back shell. 1 open.

In another possible implementation manner, as shown in FIG. 5, the matching circuit module 6 can also be disposed on the inner surface of the non-metal back shell 1. At this time, only the heat conductor layer 5 and the matching circuit module 6 need to be The non-metallic back shell 1 is connected in a loop, and does not need to be connected to the main board 2. This connection structure is convenient to implement and does not affect the opening of the non-metal back shell 1.

Since the NFC antenna is coupled by the magnetic field radiated by the coil, and the distribution of the magnetic field has a density change, the magnetic field density in the central region of the coil is usually large, and when the NFC function is used for short-range wireless communication, since the back cover has no coil center The indication mark of the area cannot be referred to, so the user cannot know where the magnetic field is dense. If the degree is large, the most powerful part of the magnetic field cannot be accurately used. In order to solve the above problem, as shown in FIG. 4, since the heat dissipation layer 5 is usually provided with a relief hole 51 for avoiding the camera, the relief hole 51 can be used as a part of the heat conduction layer 5, specifically, heat conduction. The body layer 5 is further provided with a long groove 52. One end of the long groove 52 penetrates the first edge of the heat conductor layer 5, and the other end penetrates through the avoidance hole 51. One side of the long groove 52 is respectively provided with a connection point, and two connections are respectively The points are respectively connected to the two interfaces of the matching circuit module 6. Thereby, the escape hole 51 can be used as a part of the NFC antenna coil, and the magnetic flux in the vicinity of the camera can be made large. When the NFC function is used, the camera can be used as a center position when the card is swiped, which facilitates reference and improves recognition speed and accuracy.

As shown in FIG. 6, the NFC antenna coil formed after the thermal conductor layer 5 is slotted may also be a closed antenna coil, and the closed antenna coil forms a closed annular current path inside the thermal conductor layer 5. The arrow in Fig. 6 shows a possible flow path of the induced current. This structure needs to adjust the operating frequency of the NFC antenna coil by adjusting the structure of the closed antenna coil. It is not necessary to connect the matching circuit module 6, which simplifies the manufacturing process. And there is no connection between the thermal conductor layer 5 and the main board 2, and the non-metallic rear case 1 is not affected.

In the above embodiment, the avoidance hole 51 can also be used as a part of the NFC antenna coil. Specifically, as shown in FIG. 6, the heat conductor layer 5 is provided with a relief hole 51 for avoiding the camera, and the heat conductor layer 5 is opened. a first long groove 53 and a second long groove 54 which are perpendicular to each other. The first long groove 53 is disposed adjacent to the first edge 55 of the heat conductor layer 5 and is parallel to the first edge 55 of the heat conductor layer 5, and the second long groove 54 is at one end. The first long groove 53 is penetrated, and the other end penetrates the escape hole 51. Thereby, the escape hole 51 can be used as a part of the NFC antenna coil, and the magnetic flux in the vicinity of the camera can be made large. When the NFC function is used, the camera can be used as a center position when the card is swiped, which facilitates reference and improves recognition speed and accuracy. In addition, the structure can adjust the operating frequency of the NFC antenna coil by changing the length and width of the first long groove 53, and achieve the purpose of adjusting the operating frequency by minimizing structural changes, thereby preventing excessive waste.

In order not to increase the thickness of the whole machine, the coupling coil layer 4 may be disposed below the upper surface of the battery 3 or flush with the upper surface of the battery 3 when the coupling coil layer 4 is close to the surface of the thermal conductor layer 5 and close to the battery 3. When the surface of the thermal conductor layer 5 is flush, the coupling coil layer 4 can be kept away from the main board 2 as far as possible without exceeding the thickness range of the battery 3, thereby avoiding the influence on the heat dissipation of the main board 2.

The coupling coil layer 4 can be implemented in various manners. For example, in the solution shown in FIG. 4, the flexible circuit board 41 can be disposed on the bracket 7 on the main board 2, and the coupling coil 42 can be formed inside the flexible circuit board 41. The coupling coil is directly formed on the plastic portion of the bracket 7 by an LDS (Laser Direct Structuring) process or a spraying process, and the solution of the flexible circuit board is low in cost and easy to implement.

In order to ensure good heat dissipation of the heat-generating component on the main board 2, the projection of the region of the heat-conducting layer 5 on the main board 2 is staggered from the components on the main board 2 that require heat dissipation, that is, in the open When the slot is used, the components on the main board 2 that need to dissipate heat can be avoided as much as possible, thereby ensuring that the rear shell region corresponding to the component requiring heat dissipation has heat conduction of the heat conductor, thereby preventing local heat in the region from being excessively high. Similarly, in order to prevent the coupling coil layer 4 from affecting the heat dissipation of the components on the main board 2 that require heat dissipation, the projection range of the coupling coil layer 4 on the main board 2 can be shifted from the components on the main board 2 that require heat dissipation to have sufficient heat dissipation space. Thereby, it is ensured that the components on the main board 2 that require heat dissipation are well cooled. The component that needs to dissipate heat on the main board 2 may be a component with higher heat on the main board 2 or a component with heat dissipation requirements, such as a CPU.

The gap between the heat conductor layer 5 and the coupling coil layer 4 is an important parameter affecting the coupling effect when the gap between the heat conductor layer 5 and the coupling coil layer 4 is 0.2 mm to 0.3 mm. The heat conductor layer 5 and the coupling coil layer can be made The coupling between 4 is better.

In order to prevent the influence of the eddy current on the surface of the main board 2 on the antenna magnetic field, a ferrite layer may be provided on the surface of the coupling coil layer 4 facing the main board 2. The ferrite layer prevents eddy currents generated on the conductor surface of the main board 2 from weakening the magnetic field of the coupling coil layer 4, thereby increasing the magnetic flux and enhancing the coupling effect between the thermal conductor layer 5 and the coupling coil layer 4.

Embodiment 2,

The embodiment of the present application provides a structural design scheme of another mobile phone, as shown in FIG. 7. The mobile phone 100 of the embodiment of the present application includes a non-metal back shell 1 (not shown) and a main board 2, and the inner surface of the non-metal back shell 1 is provided with a heat conductor layer 5, and the heat conductor layer 5 is slotted to form an NFC antenna coil. The main board 2 is opposite to the thermal conductor layer 5, and the main board 2 is provided with a feeding point, and the NFC antenna coil is connected with the feeding point on the main board 2.

In the mobile phone provided by the embodiment of the present application, the thermal conductor layer 5 is directly connected to the feeding point on the main board 2, and the thermal conductor layer 5 is used as the radiating unit of the NFC antenna. The area of the thermal conductor layer 5 can satisfy the NFC antenna for the recognition range. Demand, and no other devices are added, the thickness of the whole machine is not changed, thus avoiding the thickness space occupied by the NFC antenna.

In order to prevent the influence of the eddy current on the surface of the main board 2 on the antenna magnetic field, a ferrite layer may be provided on the surface of the thermal conductor layer 5 facing the main board 2. The ferrite layer prevents the eddy current generated on the conductor surface of the main board 2 from weakening the magnetic field of the thermal conductor layer 5, thereby increasing the magnetic flux and improving the performance of the NFC antenna.

Embodiment 3,

As shown in FIG. 2, FIG. 3 and FIG. 5, the embodiment of the present application further provides a mobile phone 100, including a non-metal back shell 1, a motherboard 2, a battery 3, an FPC, and a matching circuit module 6, and a non-metal back shell 1 The inner surface is provided with a heat conductor layer 5, and the heat conductor layer 5 is slotted to form an NFC antenna coil; the main board 2 and the heat conductor layer 5 are arranged along the thickness direction of the mobile phone, and the main board 2 is provided with a feeding point; the battery 3 and the main board 2 are along the mobile phone Arranged in the length direction; an antenna coil is formed in the FPC, the FPC is disposed between the main board 2 and the heat conductor layer 5, and the FPC and the battery 3 are arranged along the length direction of the mobile phone, and the antenna coil in the FPC and the feeding point on the main board 2 Connecting, the antenna coil in the FPC and the heat conductor layer 5 can form a space coupling, so that the NFC antenna coil of the heat conductor layer 5 generates secondary radiation; the matching circuit module 6 is disposed on the inner surface of the non-metal back shell 1, NFC The antenna coil is an open antenna coil, and the matching circuit module 6 is connected to the NFC antenna coil to form a closed annular current path.

In the mobile phone provided by the embodiment of the present application, the heat conductor layer 5 is slotted to form an NFC antenna coil, and the antenna coil in the FPC and the heat conductor layer 5 can form a space coupling, so that the heat conductor layer 5 generates secondary radiation. The heat conductor layer 5 is used as the final radiating element of the NFC antenna, and the area of the heat conductor layer 5 can satisfy the requirement of the NFC antenna for the recognition range, and the antenna coil in the FPC is only used to couple the heat conductor layer 5, so the area of the FPC It can be made small, so that the FPC is arranged corresponding to the position of the main board 2 and aligned with the length direction of the battery 3, so that the thickness of the mobile phone is not occupied, and the mobile phone is made lighter and thinner.

Embodiment 4,

As shown in FIG. 8 , an embodiment of the present application further provides an antenna assembly including a non-metal back shell 1 (not shown) and a coupling coil layer 4 . The inner surface of the non-metal back shell 1 is provided with a heat conductor layer 5 . The heat conductor layer 5 is slotted to form an NFC antenna coil, and the coupling coil layer 4 is parallel and spaced apart from the heat conductor layer 5, and a space coupling can be formed between the coupling coil layer 4 and the heat conductor layer 5, so that the heat conductor layer 5 is generated twice. radiation.

In the antenna assembly provided by the embodiment of the present application, the heat conductor layer 5 is slotted to form an NFC antenna coil, and the coupling coil layer 4 and the heat conductor layer 5 can form a space coupling, so that the heat conductor layer 5 generates secondary radiation. , The heat conductor layer 5 is utilized as the final radiating element of the NFC antenna, and the area of the heat conductor layer 5 can satisfy the requirement of the NFC antenna for the identification range, and the coupling coil layer 4 is only used to couple the heat conductor layer 5, thus coupling the coil layer 4 The area can be made small so that the coupling coil layer 4 does not occupy the thickness space.

In the description of the specification, specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It should be covered by the scope of the present invention. Therefore, the scope of the invention should be determined by the scope of the appended claims.

Claims

A terminal, comprising:

a non-metallic back shell, the inner surface of the non-metallic back shell is provided with a heat conductor layer, the heat conductor layer is slotted to form an NFC antenna coil;

a main board, the main board is opposite to the heat conductor layer, and the main board is provided with a feeding point;

a battery, the battery and the main board being arranged in a direction parallel to the heat conductor layer;

Coupling a coil layer, the coupling coil layer is disposed between the main board and the heat conductor layer, and is arranged in a direction parallel to the heat conductor layer with the battery, the coupling coil layer and the main board The feed point is connected, and the coupling coil layer and the heat conductor layer can form a space coupling, so that the heat conductor layer generates secondary radiation.
The terminal according to claim 1, wherein the heat conductor layer is connected with a matching circuit module, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected to the NFC antenna coil to form a closed circuit. Ring current path.
The terminal according to claim 2, wherein the matching circuit module is disposed on the main board.
The terminal according to claim 2, wherein said matching circuit module is disposed on an inner surface of said non-metallic rear case.
The terminal according to any one of claims 2 to 4, wherein the heat conductor layer is provided with a escaping hole for escaping the camera, and the heat conductor layer is provided with a long groove, the long groove One end penetrates through the first edge of the heat conductor layer, and the other end penetrates through the avoidance hole, and two sides of the long groove are respectively provided with a connection point, and the two connection points are respectively associated with the matching circuit module Interface connection.
The terminal of claim 1 wherein said NFC antenna coil is a closed antenna coil, said enclosed antenna coil forming a closed annular current path within said thermal conductor layer.
The terminal according to claim 6, wherein the heat conductor layer is provided with a escaping hole for escaping the camera, and the heat conductor layer is provided with a first long groove and a second long groove perpendicular to each other. The first long slot is disposed adjacent to the first edge of the heat conductor layer and is parallel to the first edge of the heat conductor layer, and one end of the second slot is penetrated with the first slot, and the other end is Avoid the hole through.
The terminal according to any one of claims 1 to 7, wherein a surface of the coupling coil layer close to the heat conductor layer is flush with a surface of the battery adjacent to the heat conductor layer.
The terminal according to any one of claims 1 to 8, wherein the coupling coil layer includes an FPC and a coupling coil formed inside the FPC.
The terminal according to any one of claims 1 to 9, wherein a projection of a region of the heat conductor layer slotted on the main board is offset from a component on the main board that requires heat dissipation, the coupling coil The projection of the layer on the motherboard is offset from the components on the motherboard that require heat dissipation.
The terminal according to any one of claims 1 to 10, wherein an area of the heat conductor layer is adapted to an area of an inner surface of the non-metallic back shell.
The terminal according to any one of claims 1 to 11, wherein a gap between the heat conductor layer and the coupling coil layer is 0.2 mm to 0.3 mm.
The terminal according to any one of claims 1 to 12, wherein the coupling coil layer is oriented A ferrite layer is disposed on a surface of the main board.
A terminal, comprising:

a non-metallic back shell, the inner surface of the non-metallic back shell is provided with a heat conductor layer, the heat conductor layer is slotted to form an NFC antenna coil;

The main board is opposite to the heat conductor layer. The main board is provided with a feeding point, and the NFC antenna coil is connected to a feeding point on the main board.
The terminal according to claim 14, wherein the heat conductor layer is provided with a ferrite layer on a surface of the main board.
A mobile phone characterized by comprising:

a non-metallic back shell, the inner surface of the non-metallic back shell is provided with a heat conductor layer, the heat conductor layer is slotted to form an NFC antenna coil;

a main board, the main board and the heat conductor layer are arranged along a thickness direction of the mobile phone, and the main board is provided with a feeding point;

a battery, the battery and the main board are arranged along a length direction of the mobile phone;

An FPC, an antenna coil is formed in the FPC, the FPC is disposed between the main board and the heat conductor layer, and the FPC and the battery are arranged along a length direction of the mobile phone, and an antenna coil in the FPC Connecting with a feeding point on the main board, a space coupling can be formed between the antenna coil in the FPC and the heat conductor layer, so that the NFC antenna coil of the thermal conductor layer generates secondary radiation;

a matching circuit module, the matching circuit module is disposed on an inner surface of the non-metallic back shell, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected to the NFC antenna coil to form a closed loop current path.
An antenna assembly, comprising:

a non-metallic back shell, the inner surface of the non-metallic back shell is provided with a heat conductor layer, the heat conductor layer is slotted to form an NFC antenna coil;

The coupling coil layer is disposed in parallel with and spaced apart from the heat conductor layer, and a space coupling can be formed between the coupling coil layer and the heat conductor layer to generate secondary radiation.
The antenna assembly according to claim 17, wherein the heat conductor layer is connected with a matching circuit module, the NFC antenna coil is an open antenna coil, and the matching circuit module is connected to the NFC antenna coil to form a closed Ring current path.
The antenna assembly according to claim 18, wherein said matching circuit module is disposed on an inner surface of said non-metallic rear case.
The antenna assembly of claim 17 wherein said NFC antenna coil is a closed antenna coil, said enclosed antenna coil forming a closed annular current path within said thermal conductor layer.