CN112909475B - Antenna assembly and electronic equipment - Google Patents
Antenna assembly and electronic equipment Download PDFInfo
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- CN112909475B CN112909475B CN202110060493.8A CN202110060493A CN112909475B CN 112909475 B CN112909475 B CN 112909475B CN 202110060493 A CN202110060493 A CN 202110060493A CN 112909475 B CN112909475 B CN 112909475B
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 74
- 238000005452 bending Methods 0.000 claims abstract description 31
- 230000001681 protective effect Effects 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000004378 air conditioning Methods 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 30
- 238000004891 communication Methods 0.000 description 9
- 238000013461 design Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 108700041286 delta Proteins 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
Abstract
The application provides an antenna assembly and electronic equipment. The antenna assembly comprises an antenna and a heat dissipation piece. The antenna includes an antenna radiator. The heat dissipation piece is provided with a first surface and a second surface which is connected with the first surface in a bending way, the first surface is used for being connected with the functional component, and the second surface corresponds to the antenna radiator and is arranged at intervals with the antenna radiator. Firstly, a heat dissipation piece is additionally arranged, the first surface of the heat dissipation piece is used for connecting a functional component, and the second surface corresponds to an antenna radiator. Therefore, the heat dissipation piece not only can be used for dissipating heat for the functional component, but also can be used for dissipating heat for the antenna at the same time. And secondly, the second surface of the heat dissipation piece is arranged at intervals with the antenna radiator, so that the heat dissipation piece is coupled with the antenna radiator, and then the heat dissipation piece serves as an auxiliary radiator of the antenna, and the radiation efficiency and the receiving and transmitting performance of the antenna assembly are improved. And the antenna radiator is arranged on the second surface of the corresponding radiating piece, so that the radiating piece and the antenna radiator are horizontally arranged, and the overall thickness is reduced.
Description
Technical Field
The application belongs to the technical field of antennas, and particularly relates to an antenna assembly and electronic equipment.
Background
Antennas are one of important structural members for receiving and transmitting electromagnetic wave signals in electronic devices, and the number of antennas is increasing with the continuous development of communication technology. The increase of the number of the antennas can improve the frequency range of the electromagnetic wave signals transmitted and received by the antennas, but the load of the electronic equipment can be increased, the heat dissipation of the antennas during working is improved, and the service life of the electronic equipment is shortened.
Disclosure of Invention
In view of this, a first aspect of the present application provides an antenna assembly comprising:
an antenna comprising an antenna radiator;
the radiating piece is provided with a first surface and a second surface which is bent and connected with the first surface, the first surface is used for being connected with a functional component, and the second surface corresponds to the antenna radiator and is arranged at intervals with the antenna radiator, so that the radiating piece is coupled with the antenna radiator to serve as an auxiliary radiator of the antenna.
According to the antenna assembly provided by the first aspect of the application, firstly, the heat dissipation piece is additionally arranged, the first surface of the heat dissipation piece is used for connecting the functional assembly, and the second surface corresponds to the antenna radiator. Therefore, the heat dissipation piece not only can be used for dissipating heat of the functional component, but also can be used for dissipating heat of the antenna at the same time, heat generated during the working of the antenna is led away from the antenna radiator through the heat dissipation piece, and the heat dissipation performance and the service life of the antenna are improved.
Secondly, the second surface of the heat dissipation piece is arranged at intervals with the antenna radiator, so that the heat dissipation piece is coupled with the antenna radiator, and further the heat dissipation piece serves as an auxiliary radiator of the antenna. The heat dissipation piece provided by the application has the function of receiving and transmitting electromagnetic wave signals besides the heat dissipation function. Through making the radiating part coupling antenna radiator for when the antenna work, not only can utilize the antenna radiator to receive and dispatch the electromagnetic wave signal, but also can utilize auxiliary radiator to receive and dispatch the electromagnetic wave signal, thereby increase the scope of antenna receiving and dispatching electromagnetic wave signal, increase the frequency channel of antenna work, and then make antenna assembly have better communication effect, improved antenna assembly's radiating efficiency and transceiver performance. And, because the radiating piece can act as the auxiliary radiator of antenna for the operating band of antenna widens, consequently need not additionally increase the quantity of antenna and can reach the frequency channel coverage of same width, thereby the phase change has reduced the quantity of antenna, makes the design degree of difficulty that reduces the antenna in limited assembly space.
And when the first surface of the radiating piece is connected with the functional component, the antenna radiator can be arranged corresponding to the second surface of the radiating piece, so that the radiating piece and the antenna radiator can be horizontally arranged, the thickness of the whole radiating piece, the antenna radiator and the functional component is reduced, and the assembly space is fully utilized.
In summary, the antenna assembly provided in the first aspect of the present application can improve the heat dissipation performance and the radiation efficiency of the antenna through the heat dissipation member, and can reduce the overall thickness, thereby improving the service life of the antenna.
A second aspect of the present application provides an electronic device, comprising:
the middle frame comprises a body and side walls which are bent and connected from the periphery of the body;
the functional component is arranged on the body and is close to the side wall; a kind of electronic device with high-pressure air-conditioning system
The antenna assembly according to the first aspect of the present application, wherein the antenna radiator is connected to the side wall, or at least part of the side wall forms the antenna radiator.
In the electronic device according to the second aspect of the present application, the functional component is disposed on the body of the middle frame by using the antenna component according to the first aspect of the present application, and is disposed near the side wall. While the antenna radiator is connected to the side wall or is constituted by at least part of the side wall. Therefore, when the first surface of the heat dissipation piece is connected with the functional component and the second surface of the heat dissipation piece corresponds to the antenna radiator and is arranged at intervals with the antenna radiator, the functional component and the antenna can be dissipated at the same time, the radiation efficiency and the receiving and transmitting performance of the antenna can be improved, the design difficulty of the antenna can be reduced, and the thickness of the whole electronic equipment can be reduced.
Drawings
In order to more clearly explain the technical solutions in the embodiments of the present application, the drawings that are used in the embodiments of the present application will be described below.
Fig. 1 is a top view of an antenna assembly according to an embodiment of the application.
Fig. 2 is a schematic cross-sectional view taken along A-A in fig. 1.
Fig. 3 is a schematic cross-sectional view of an antenna assembly and a functional assembly according to another embodiment of the present application.
Fig. 4 is a top view of an antenna assembly according to another embodiment of the present application.
Fig. 5 is a top view of an antenna assembly according to yet another embodiment of the present application.
Fig. 6 is a top view of an antenna assembly according to yet another embodiment of the present application.
Fig. 7 is a top view of an antenna assembly according to yet another embodiment of the present application.
Fig. 8 is a top view of an electronic device according to an embodiment of the application.
Fig. 9 is a schematic cross-sectional view taken along the direction B-B in fig. 8.
Fig. 10 is a top view of an electronic device in accordance with yet another embodiment of the present application.
Fig. 11 is a top view of an electronic device according to yet another embodiment of the application.
Fig. 12 is a schematic cross-sectional view taken along the direction C-C in fig. 11.
Fig. 13 is a top view of an electronic device in yet another embodiment of the application.
Fig. 14 is a schematic cross-sectional view taken along the direction D-D in fig. 13.
Fig. 15 is a schematic cross-sectional view taken along the B-B direction in yet another embodiment of the present application.
Fig. 16 is a schematic cross-sectional view taken along the B-B direction in yet another embodiment of the present application.
Fig. 17 is a top view of an electronic device in yet another embodiment of the application.
Description of the reference numerals:
the antenna assembly comprises an antenna assembly body 1, electronic equipment 2, an antenna 10, an antenna radiator 11, a heat radiating piece 20, a first surface 21, a second surface 22, a third surface 23, a fourth surface 24, a bending surface 25, a functional assembly 30, a protective shell 31, a functional piece 32, a middle frame 40, a body 41, a side wall 42, a functional module 50, a battery 60, an adhesive piece 70, a convex column 80, a connecting column 90 and a positioning area N.
Detailed Description
The following are preferred embodiments of the present application, and it should be noted that modifications and variations can be made by those skilled in the art without departing from the principle of the present application, and these modifications and variations are also considered as the protection scope of the present application.
Before the technical scheme of the application is described, the technical problems in the prior art are described in detail.
An antenna is one of important components of electronic equipment, and plays a role in receiving and transmitting electromagnetic wave signals. With the rapid development of wireless communication technology and the mature use of 4G, fifth generation (5G) wireless communication systems will be fully commercialized in 2020. The 5G wireless communication system will use the following two different primary frequency bands: millimeter wave bands below 6GHz and above 6 GHz. Since the below 6GHz has the advantages of strong operability and mature technology, the below 6GHz 5G antenna system will be preferentially used. And in a fourth generation mobile communication (4G) system, a 2×2 Multiple Input Multiple Output (MIMO) antenna has been widely studied and used in a handheld mobile device. According to the research results of various countries, compared with the current 4G technology, the peak rate of the 5G technology is increased by tens of times, so that in order to meet the requirement of the 5G transmission rate, the number of antennas is increased: a 4 antenna system or more antennas will be used to achieve greater channel capacity and better communication quality. In addition, although the MIMO antenna structure with multiple antennas can well solve the multipath fading problem and improve the data throughput. This doubles the number of antennas: the number of the traditional mobile phone antennas is increased to about 10 from 3 to 6, but the design difficulty of the mobile phone antennas in a limited space is increased. It will also be appreciated that, due to the limited space available in hand-held devices such as cell phones, it is a challenge to design antennas that cover multiple frequency bands in small sizes.
In addition, another challenge faced in the current antenna technology is how to design a wideband or multi-frequency antenna system to cover a wider 4G, 5G, sub-6GHz band. For example, in order for an electronic device to realize 4G full network communication, the frequency band of the antenna needs to support and cover the frequency bands such as B1, B3, B5, B40, B41, and the like. In order for an electronic device to achieve 5G full network communication, the frequency bands of the antenna need to support and cover the frequency bands such as n41, n78, n79, etc. In order to achieve the above object, it is common practice to increase the number of antennas.
Therefore, in order to solve the above two problems, it is currently generally achieved by increasing the number of antennas. However, the increase of the number of the antennas can improve the frequency range and the radiation efficiency of the antennas for receiving and transmitting electromagnetic wave signals, but the load of the electronic equipment can be increased, the heat dissipation during the operation of the antennas is improved, and the service life of the electronic equipment is shortened. Therefore, a technical solution for simultaneously solving the radiation efficiency and the heat dissipation performance of the antenna is needed.
In view of this, in order to solve the above-described problems, the present embodiment provides an antenna assembly. Referring to fig. 1-3 together, fig. 1 is a top view of an antenna assembly according to an embodiment of the application. Fig. 2 is a schematic cross-sectional view taken along A-A in fig. 1. Fig. 3 is a schematic cross-sectional view of an antenna assembly and a functional assembly according to another embodiment of the present application. In the present embodiment, the antenna assembly 1 includes an antenna 10 and a heat sink 20. The antenna 10 comprises an antenna radiator 11. The heat sink 20 has a first surface 21 and a second surface 22 bent to connect the first surface 21. The first surface 21 is used for connecting with a functional component 30, and the second surface 22 corresponds to the antenna radiator 11 and is spaced from the antenna radiator 11, so that the heat sink 20 is coupled with the antenna radiator 11 and serves as an auxiliary radiator of the antenna 10.
The antenna assembly 1 provided in this embodiment includes an antenna radiator 11, and may further include a structural member such as an excitation source. Wherein the excitation source may be mounted to a circuit board and the antenna radiator 11 is mounted to various locations within the electronic device 2, such as the circuit board, the center 40, the rear cover, the battery 60, etc. Under the action of an externally-applied high-frequency excitation source, the antenna radiator 11 is excited to generate an alternating electric field and a magnetic field around the antenna radiator, and the alternating magnetic field and the electric field interact and are mutually converted repeatedly to form electromagnetic wave signals, and the electromagnetic wave signals are transmitted to a surrounding space at a certain speed; at the same time, it can also receive electromagnetic wave signals.
Alternatively, the antenna 10 may be a main set antenna 10 or a diversity antenna 10. The main antenna 10 may receive electromagnetic wave signals or may transmit electromagnetic wave signals. The diversity antenna 10 can only receive electromagnetic wave signals.
The antenna assembly 1 provided in this embodiment further includes a heat sink 20, and the heat sink 20 is literally Gu Mingsai provided with a heat dissipation function. The heat dissipation element 20 has a plurality of outer surfaces, for example, a first surface 21 and a second surface 22 connected with the first surface 21 in a bending manner. I.e. the first surface 21 and the second surface 22 are in a bent connection. In the present embodiment, as shown in fig. 2 and 3, the first surface 21 may be understood as a lower surface of the heat sink 20, and the second surface 22 may be understood as a side surface of the heat sink 20. The first surface 21 is used for connecting with the functional component 30 subsequently, so as to dissipate heat from the functional component 30 by using the heat dissipating member 20, and it is also understood that the heat dissipating member 20 is originally added to dissipate heat from the functional component 30. The present embodiment may also make the second surface 22 correspond to the antenna radiator 11. Therefore, the heat dissipation piece 20 not only can be used for dissipating heat of the functional component 30, but also can be used for dissipating heat of the antenna 10 at the same time, so that heat generated during the working of the antenna 10 is led away from the antenna radiator 11 through the heat dissipation piece 20, the heat dissipation performance of the antenna 10 is improved, and the service life of the antenna component 1 is prolonged.
Next, in this embodiment, the second surface 22 of the heat sink 20 is spaced from the antenna radiator 11, so that the heat sink 20 and the antenna radiator 11 can be coupled, and the heat sink 20 further functions as an auxiliary radiator of the antenna 10. The heat sink 20 provided by the present application has a function of transmitting and receiving electromagnetic wave signals in addition to a heat dissipation function. By coupling the heat dissipation element 20 to the antenna radiator 11, when the antenna 10 works, not only the antenna radiator 11 can be utilized to transmit and receive electromagnetic wave signals, but also the auxiliary radiator can be utilized to transmit and receive electromagnetic wave signals, so that the range of the antenna 10 for transmitting and receiving electromagnetic wave signals is increased, the working frequency band of the antenna 10 is increased, the antenna assembly 1 has better communication effect, and the radiation efficiency (i.e., OTA performance) and the transmitting and receiving performance of the antenna assembly 1 are improved. In addition, since the heat dissipation member 20 can serve as an auxiliary radiator of the antenna 10, the working frequency band of the antenna 10 is widened, and therefore, the frequency band coverage with the same width can be achieved without additionally increasing the number of the antennas 10, the number of the antennas 10 is reduced by phase inversion, and the design difficulty of the antenna 10 is reduced in a limited assembly space.
When the first surface 21 of the heat dissipation element 20 is connected with the functional component 30, the antenna radiator 11 can be arranged corresponding to the second surface 22 of the heat dissipation element 20, so that the heat dissipation element 20 and the antenna radiator 11 can be horizontally arranged, the thickness of the whole three parts is reduced, and the assembly space is fully utilized.
In summary, the antenna assembly 1 provided in the present embodiment can improve the heat dissipation performance and the radiation efficiency of the antenna 10 through the heat dissipation member 20, and can reduce the overall thickness, thereby well solving the above-mentioned technical problems of the present application.
Optionally, the material of the heat sink 20 includes, but is not limited to, graphite, metal, and alloys thereof.
Optionally, the functional components 30 include, but are not limited to, speakers, headphones, front cameras, rear cameras, and the like.
Alternatively, the first surface 21 is used to connect the functional module 50, it is understood that the first surface 21 may be directly connected to the functional module 50, or the first surface 21 may be indirectly connected to the functional module 50 through other structural members.
Referring to fig. 4 together, fig. 4 is a top view of an antenna assembly according to another embodiment of the application. In this embodiment, the vertical distance from the antenna radiator 11 to the second surface 22 is greater than or equal to 3.8mm.
From the above, the heat dissipation element 20 can be added to improve the heat dissipation performance and the radiation efficiency of the antenna 10. But the shape of the heat sink 20 or the distance between the heat sink 20 and the antenna radiator 11 affects the frequency range of the heat sink 20 as an auxiliary radiator. For example, in the present embodiment, the frequency band of the antenna 10 is 1710-2690MHz, and it is understood that the frequency band of the antenna 10 of the present embodiment, in which electromagnetic wave signals are transmitted and received during operation, is mainly concentrated at medium-high frequency (MHB). Therefore, in order to concentrate the frequency band of the electromagnetic wave signal transmitted and received by the heat sink 20 at 1710-2690MHz, the vertical distance (as shown by the L1 distance in fig. 4) from the antenna radiator 11 to the second surface 22 may be greater than or equal to 3.8mm, so as to adjust the impedance of the heat sink 20, reduce the inductance of the heat sink 20, thereby adjusting the coupling performance of the heat sink 20, and finally improve the radiation efficiency of the antenna 10.
Optionally, the vertical distance of the antenna radiator 11 to the second surface 22 is equal to 3.8mm.
In addition, in the related art, the heat sink 20 is mounted on the functional module 30, and the vertical distance from the antenna radiator 11 to the second surface 22 is 2.8mm. However, the heat dissipation element 20 is not only used as an auxiliary radiator, but also used to reduce the radiation efficiency, and the present application will be described in detail below with respect to specific test results. Therefore, the present embodiment can also be understood as having the second surface 22 of the heat sink 20 distant from the antenna radiator 111mm or more on the basis of the related art structure.
Referring to fig. 3 and fig. 5 together, fig. 5 is a top view of an antenna assembly according to another embodiment of the application. In this embodiment, the heat dissipation element 20 further has a third surface 23, the third surface 23 is disposed opposite to the second surface 22 and is connected to the first surface 21 in a bending manner, and a vertical distance from the antenna radiator 11 to the third surface 23 is less than or equal to 35.5mm.
In the present embodiment, the heat sink 20 has a third surface 23 in addition to the first surface 21 and the second surface 22. Wherein the third surface 23 is disposed opposite to the second surface 22, i.e. the third surface 23 and the second surface 22 are two different sides of the heat sink 20 disposed opposite to each other, and both sides are connected to the lower surface. In this embodiment, the frequency band of the antenna 10 is 1710-2690MHz, and it is also understood that the frequency band of the antenna 10 for transmitting and receiving electromagnetic wave signals during operation of this embodiment is mainly concentrated on middle-high frequency (MHB). Therefore, in order to concentrate the frequency band of the electromagnetic wave signal transmitted and received by the heat sink 20 at 1710-2690MHz, the vertical distance (as shown by the L2 distance in fig. 5) from the antenna radiator 11 to the third surface 23 may be less than or equal to 35.5mm, so as to adjust the impedance of the heat sink 20, reduce the inductance of the heat sink 20, thereby adjusting the coupling performance of the heat sink 20, and finally further improve the radiation efficiency of the antenna 10. In addition, the shape of the heat sink 20 may not be a regular geometric shape, but may be various irregular shapes, as shown in fig. 5.
Optionally, the vertical distance of the antenna radiator 11 to the third surface 23 is equal to 35.5mm.
In addition, also in the related art, a heat sink 20 is mounted on the functional module 30, and the vertical distance from the antenna radiator 11 to the third surface 23 is 37.5mm. However, in this case, the heat sink 20 is not used as an auxiliary radiator, but rather, the radiation efficiency is reduced. Therefore, the present embodiment can be also understood that, in addition to the related art structure, the third surface 23 of the heat sink 20 is brought closer to the antenna radiator 112mm or more.
Referring to fig. 6 together, fig. 6 is a top view of an antenna assembly according to another embodiment of the application. In this embodiment, the heat dissipation element 20 further has a third surface 23, a bending surface 25, and a fourth surface 24, wherein the third surface 23 is disposed opposite to the second surface 22 and is connected to the first surface 21 in a bending manner, the bending surface 25 connects the second surface 22 and the fourth surface 24, and the fourth surface 24 is further connected to the third surface 23; the vertical distance from the antenna radiator 11 to the bending surface 25 is greater than or equal to 4.8mm.
In the present embodiment, the heat sink 20 has a third surface 23, a fourth surface 24, and a bending surface 25 in addition to the first surface 21 and the second surface 22. The first surface 21 may still be understood as a lower surface of the heat dissipation element 20, the second surface 22 and the third surface 23 are two opposite sides, the fourth surface 24 is a sidewall 42 in another direction, and a bending surface 25 is further connected between the fourth surface 24 and the second surface 22. The curved surface 25 can also be understood as a transition surface between two adjacent sides. The frequency band of the antenna 10 of the present embodiment is 1710-2690MHz, and it is understood that the frequency band of the antenna 10 of the present embodiment for transmitting and receiving electromagnetic wave signals during operation is mainly concentrated on middle-high frequency (MHB). Therefore, in order to concentrate the frequency band of the electromagnetic wave signal transmitted and received by the heat sink 20 at 1710-2690MHz, the vertical distance (as shown by the L3 distance in fig. 6) from the antenna radiator 11 to the bending surface 25 may be greater than or equal to 4.8mm, so as to adjust the impedance of the heat sink 20, reduce the inductance of the heat sink 20, thereby adjusting the coupling performance of the heat sink 20, and finally further improve the radiation efficiency of the antenna 10.
Alternatively, the vertical distance of the antenna radiator 11 to the bending surface 25 is equal to 4.8mm.
In addition, also in the related art, a heat sink 20 is mounted on the functional module 30, and the vertical distance from the antenna radiator 11 to the bending surface 25 is 4.8mm. However, in this case, the heat sink 20 is not used as an auxiliary radiator, but rather, the radiation efficiency is reduced. Therefore, the present embodiment can be understood that, in addition to the related art structure, the bent surface 25 of the heat sink 20 is separated from the antenna radiator by 112mm or more.
In summary, as can be seen from the above embodiments, the frequency band of the heat sink 20 is also between 1710 MHz and 2690MHz, and the heat sink 20 and the antenna radiator 11 have a specific size and positional relationship, so that when one or more of the above sizes and positional relationships are satisfied, the electromagnetic wave receiving and transmitting performance of the heat sink 20 as an auxiliary radiator can be greatly improved, thereby improving the radiation efficiency of the antenna 10.
Referring to fig. 7 together, fig. 7 is a top view of an antenna assembly according to another embodiment of the application. In the present embodiment, the bending surface 25 protrudes in a direction away from the antenna radiator 11.
In the present embodiment, the bending surface 25 may be protruded in a direction away from the antenna radiator 11, thereby further increasing the vertical distance of the antenna radiator 11 to the bending surface 25, and further improving the radiation efficiency of the antenna 10. In addition, the bending surface 25 protrudes away from the antenna radiator 11, so that the bending surface 25 of the heat dissipation element 20 can avoid the screw post in the subsequent assembly process of the electronic device 2, thereby facilitating the installation and disassembly of the heat dissipation element 20, and the specific matching relationship between the bending surface 25 of the heat dissipation element 20 and other components will be described in detail later.
In addition, the application also performs performance tests on various antenna assemblies 1. The present application takes 3 different structures of antenna assemblies 1, the first is the most existing antenna assembly 1 without heat sink 20, i.e. with antenna 10. The second type of antenna assembly 1 with the addition of the heat sink 20 mentioned for the above embodiment, i.e. the vertical distance of the antenna radiator 11 to said second surface 22 is 2.8mm. The vertical distance of the antenna radiator 11 to the third surface 23 is 37.5mm. The vertical distance from the antenna radiator 11 to the bending surface 25 is 4.8mm. The third embodiment of the present application is the antenna assembly 1, wherein the vertical distance between the antenna radiator 11 and the second surface 22 is greater than or equal to 3.8mm. The vertical distance of the antenna radiator 11 to the third surface 23 is less than or equal to 35.5mm. The vertical distance from the antenna radiator 11 to the bending surface 25 is greater than or equal to 4.8mm. The three antenna assemblies 1 were taken for performance testing of radiation efficiency (tol.e) at respective frequency bands of 4G, and the test results are shown in table 1.
Table 1 radiation efficiency of three antenna assemblies at respective frequency bands
Wherein Δ0 is the difference between the radiation efficiency of the second antenna element 1 and the radiation efficiency of the first antenna element 1.Δ1 is the difference between the radiation efficiencies of the third antenna element 1 and the second antenna element 1, and Δ2 is the difference between the radiation efficiencies of the third antenna element 1 and the first antenna element 1. As is clear from the above table, in the related art, the heat sink 20 is added, but the positional relationship between the heat sink 20 and the antenna radiator 11 is not optimal, so that the radiation efficiency of the antenna 10 is not improved, but the radiation efficiency of the antenna 10 is reduced, compared with the first antenna assembly 1 without the heat sink 20. In the third antenna assembly 1 provided by the application, after the heat dissipation element 20 is additionally arranged and the distance relation between the heat dissipation element 20 and the antenna radiator 11 is adjusted, the delta 1 is remarkably improved compared with the radiation efficiency of the second antenna assembly 1 which is additionally provided with the heat dissipation element 20 and has a non-optimal position relation. The radiation efficiency of the delta 2, i.e. compared to the first antenna component 1 without the addition of the heat sink 20, is also improved. Therefore, compared with the two antenna assembly 1 structures, the antenna assembly 1 provided by the application improves the radiation efficiency of the antenna 10 and the heat dissipation performance of the antenna 10, and the above embodiment brings unexpected technical effects.
In addition, the present embodiment provides not only the antenna assembly 1 but also the electronic device 2 obtained by using the antenna assembly 1 described above. Referring to fig. 8-9, fig. 8 is a top view of an electronic device according to an embodiment of the application. Fig. 9 is a schematic cross-sectional view taken along the direction B-B in fig. 8. The present embodiment provides an electronic device 2, which includes a middle frame 40, a functional component 30, and an antenna component 1 according to the above embodiment of the present application. The middle frame 40 includes a main body 41 and a side wall 42 bent from the periphery of the main body 41. The functional component 30 is mounted on the body 41, and the functional component 30 is disposed near the side wall 42. The antenna radiator 11 is connected to the side wall 42, or at least a portion of the side wall 42 forms the antenna radiator 11.
The electronic device 2 provided in this embodiment includes, but is not limited to, mobile terminals such as mobile phones, tablet computers, notebook computers, palm top computers, personal computers (Personal Computer, PC), personal digital assistants (Personal Digital Assistant, PDA), portable media players (Portable Media Player, PMP), navigation devices, wearable devices, smart bracelets, pedometers, and fixed terminals such as digital TVs, desktop computers, and the like. The application is schematically illustrated with an electronic device 2 as a mobile phone.
The electronic device 2 provided in this embodiment includes a middle frame 40, where the middle frame 40 is a part of a structural member that can fix and carry the electronic device 2. The functional component 30 is a generic term for structural members having various functions within the electronic device 2. For example, the functional components 30 include, but are not limited to, speakers, headphones, front cameras, rear cameras, and the like. In the present embodiment, the antenna radiator 11 may be connected to the side wall 42, or at least a part of the side wall 42 may form the antenna radiator 11. It is also understood that the antenna 10 is integrated on the side wall 42, thereby saving the assembly space of the electronic device 2. Alternatively, the connection of the antenna radiator 11 to the side wall 42 is understood as the antenna radiator 11 being provided on the side wall 42 or the antenna radiator 11 being embedded in the side wall 42. The present embodiment is illustrated with the antenna radiator 11 embedded in the side wall 42.
In addition, the present embodiment may also provide the functional component 30 adjacent to the sidewall 42. Thus, by using the antenna assembly 1 provided in the above embodiment of the present application, after the heat dissipation element 20 is added, the first surface 21 of the heat dissipation element 20 is connected with the functional assembly 30, and the second surface 22 corresponds to the antenna radiator 11 and is spaced from the antenna radiator 11, so that heat dissipation can be performed on the functional assembly 30 and the antenna 10 at the same time, the radiation efficiency and the transceiving performance of the antenna 10 can be improved, the design difficulty of the antenna 10 can be reduced, the overall thickness of the electronic device 2 can be reduced, and the service life and the service performance of the electronic device 2 can be improved.
Referring to fig. 10 together, fig. 10 is a top view of an electronic device according to another embodiment of the application. In this embodiment, the electronic device 2 further includes a functional module 50, the functional module 50 is disposed on the body 41, and the functional module 50 is close to the functional module 30; a gap is provided between the front projection of the heat sink 20 on the body 41 and the front projection of the functional module 50 on the body 41.
In this embodiment, the electronic device 2 may further include a function module 50 in addition to the function module 30. Where the functional module 50 is also a structural member of the electronic device 2 having various functions, the applicant has named it adaptively in order to distinguish it from the functional module 30. Optionally, the functional module 50 includes, but is not limited to, speakers, headphones, front cameras, rear cameras, and the like.
Next, the functional module 50 is close to the functional module 30, and there is a gap between the front projection of the heat sink 20 on the body 41 and the front projection of the functional module 50 on the body 41, that is, the heat sink 20 does not cover the functional module 50, so that the size of the heat sink 20 is shortened in the width direction, thereby further improving the radiation efficiency of the antenna 10 like various embodiments in the antenna module 1. In addition, the heat dissipation member 20 does not cover the functional module 50, so that the difficulty in mounting and dismounting the functional module 50 can be reduced.
Referring to fig. 11 together, fig. 11 is a top view of an electronic device according to another embodiment of the application. In this embodiment, the electronic device 2 further includes a battery 60, the battery 60 is disposed on the body 41, and an orthographic projection of a portion of the heat sink 20 on the body 41 is located in an orthographic projection of the battery 60 on the body 41.
In this embodiment, the electronic device 2 may further include a battery 60, and the battery 60 may store electric energy to supply energy to each of the functional modules 50 and the functional modules 30 of the electronic device 2. Wherein the battery 60 is disposed on the body 41, and the front projection of a part of the heat sink 20 on the body 41 is located in the front projection of the battery 60 on the body 41. It is also understood that a portion of the heat sink 20 is located on the battery 60, i.e., a portion of the heat sink 20 covers the battery 60, or the third surface 23 of the heat sink 20 is located above the battery 60. Thus, the heat dissipation member 20 can dissipate heat not only for the functional component 30 and the antenna 10, but also for the battery 60, thereby further improving the heat dissipation performance of the electronic device 2.
Referring to fig. 12, fig. 12 is a schematic cross-sectional view along the direction C-C in fig. 11. In this embodiment, the electronic device 2 further includes an adhesive member 70, where the adhesive member 70 adheres the heat sink 20 and the functional module 30, and the adhesive member 70 also adheres the heat sink 20 and the battery 60.
In the present embodiment, the adhesive 70 may be added, so that the heat sink 20 is indirectly connected to the functional module 30 by the adhesive 70, and the heat sink 20 is indirectly connected to the battery 60. It may also be understood that the opposite sides of the bonding member 70 bond the heat dissipation member 20 and the functional module 30, respectively, and the opposite sides of the bonding member 70 bond the heat dissipation member 20 and the battery 60, respectively, so as to further improve the bonding performance of the heat dissipation member 20 and the components in the electronic device 2.
Referring to fig. 13-14 together, fig. 13 is a top view of an electronic device according to another embodiment of the application. Fig. 14 is a schematic cross-sectional view taken along the direction D-D in fig. 13. In this embodiment, the middle frame 40 further includes a protrusion 80, the protrusion 80 is disposed on the body 41, and the heat dissipation element 20 is sleeved with the protrusion 80.
In this embodiment, the middle frame 40 may further include a protrusion 80 in addition to the body 41 and the sidewall 42, and the protrusion 80 is disposed on the body 41. Alternatively, the boss 80 and the body 41 may be integrally formed, which the applicant has manually split and named for clarity. Secondly, the heat dissipation member 20 can be sleeved with the protruding columns 80, so that the heat dissipation member 20 can be further fixed by using the protruding columns 80, and the heat dissipation member 20 can be positioned by using the protruding columns 80, and when the heat dissipation member 20 is detached and replaced, the accuracy of the distance between the replaced heat dissipation member 20 and the antenna radiator 11 can be improved. In addition, the boss 80 may also serve to fix and assemble the middle frame 40 and the rear cover of the electronic device 2.
Referring to fig. 15 together, fig. 15 is a schematic cross-sectional view along the B-B direction in a further embodiment of the present application. In this embodiment, a side surface of the functional component 30, which is close to the heat dissipation element 20, has a positioning area N, and an orthographic projection of the second surface 22 on the functional component 30 is located in the positioning area N.
In this embodiment, the functional component 30 may further have a positioning area N on a side surface thereof near the heat sink 20. Wherein the location area N is used to locate the orthographic projection of the second surface 22 on the functional component 30 within the location area N, thereby improving the accuracy of the position between the heat sink 20 and the functional component 30. Since the distance between the functional component 30 and the antenna radiator 11 on the body 41 is constant, it can also be understood that the accuracy of the position between the heat sink 20 and the antenna radiator 11 is improved. Thus, when the heat sink 20 is removed and replaced, the accuracy of the distance between the replaced heat sink 20 and the antenna radiator 11 can be improved by positioning the second surface 22 in the positioning area N.
Referring to fig. 16 together, fig. 16 is a schematic cross-sectional view along the direction B-B in a further embodiment of the present application. In this embodiment, the functional module 30 includes a protective case 31 and a functional element 32, the protective case 31 has a receiving space therein, the functional element 32 is disposed in the receiving space, and the heat sink 20 is connected to the protective case 31.
In the present embodiment, the functional module 30 specifically includes an outer protective case 31 and an inner functional element 32, and the protective case 31 has a housing space therein, and the functional element 32 is disposed in the housing space, so that the functional element 32 is effectively protected by the protective case 31. The above mentions that the heat sink 20 is connected to the functional module 30, and in particular that the heat sink 20 may be connected to the protective case 31 so as not to affect the usability of the functional module 30.
Referring to fig. 17 together, fig. 17 is a top view of an electronic device according to another embodiment of the application. In this embodiment, the middle frame 40 further includes a connection post 90, the connection post 90 is disposed on the body 41, and the connection post 41 is located between the heat dissipation element 20 and the side wall 42; the bending surface 25 of the heat sink 20 is spaced from the connecting post 90.
In this embodiment, the body 41 of the middle frame 40 is also often provided with a connecting post 90. The connecting post 90 is understood to be a screw post for a mating connection with the rear cover during assembly, so that a fastening is achieved. In other words, the connecting post 90 and the boss 80 are both understood as screw posts, except that applicant has given different designations in order to distinguish between the two structural members in different embodiments.
From the above, it is clear that the bending surface 25 of the heat sink 20 is far from the antenna radiator 112mm or more, that is, the vertical distance from the antenna radiator 11 to the bending surface 25 is equal to 4.8mm. When assembled on the middle frame 40, the connecting posts 41 are located between the heat sink 20 and the side walls 42. At this time, the bending surface 25 of the heat dissipation element 20 and the connecting post 90 are arranged at intervals, so that the radiation efficiency of the heat dissipation element 20 serving as an auxiliary radiator can be further improved, the heat dissipation element 20 and the connecting post 90 can be prevented from being collided during installation and disassembly, and the assembly difficulty of the electronic equipment 2 is reduced.
The foregoing has outlined rather broadly the more detailed description of embodiments of the application in order that the principles and embodiments of the application may be better understood, and in order that the present application may be better understood; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.
Claims (8)
1. An antenna assembly, comprising:
the antenna comprises an antenna radiator, and the frequency range of the antenna is 1710-2690MHz;
the radiating piece is provided with a first surface and a second surface which is bent and connected with the first surface, the first surface is used for connecting a functional component, and the second surface corresponds to the antenna radiator and is arranged at intervals with the antenna radiator, so that the radiating piece is coupled with the antenna radiator, serves as an auxiliary radiator of the antenna, and radiates heat to the antenna radiator;
the vertical distance from the antenna radiator to the second surface is greater than or equal to 3.8mm;
the radiating piece is also provided with a third surface, the third surface is arranged opposite to the second surface and is connected with the first surface in a bending way, and the vertical distance between the antenna radiator and the third surface is less than or equal to 35.5mm;
the heat dissipation piece is also provided with a bending surface and a fourth surface, the bending surface is connected with the second surface and the fourth surface, and the fourth surface is also connected with the third surface; the vertical distance from the antenna radiator to the bending surface is greater than or equal to 4.8mm; the bending surface protrudes towards the direction away from the antenna radiator and is used for enabling the bending surface to avoid the screw column.
2. An electronic device, comprising:
the middle frame comprises a body and side walls which are bent and connected from the periphery of the body;
the functional component is arranged on the body and is close to the side wall; a kind of electronic device with high-pressure air-conditioning system
The antenna assembly of claim 1, the antenna radiator being connected to the side wall, or at least a portion of the side wall forming the antenna radiator.
3. The electronic device of claim 2, further comprising a functional module disposed on the body, the functional module being proximate to the functional component; the clearance is arranged between the orthographic projection of the heat dissipation part on the body and the orthographic projection of the functional module on the body.
4. The electronic device of claim 2, further comprising a battery disposed on the body, and wherein an orthographic projection of a portion of the heat sink onto the body is located within the orthographic projection of the battery onto the body.
5. The electronic device of claim 4, further comprising an adhesive that adheres the heat sink to the functional component, the adhesive further adhering the heat sink to the battery.
6. The electronic device of claim 2, wherein the middle frame further comprises a boss, the boss is disposed on the body, and the heat sink is sleeved on the boss.
7. The electronic device of claim 2, wherein a side surface of the functional component adjacent to the heat sink has a location area, and an orthographic projection of the second surface on the functional component is located in the location area.
8. The electronic device of claim 2, wherein the functional component comprises a protective shell and a functional member, wherein an accommodating space is formed in the protective shell, the functional member is arranged in the accommodating space, and the heat dissipation member is connected with the protective shell.
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| CN202110060493.8A CN112909475B (en) | 2021-01-15 | 2021-01-15 | Antenna assembly and electronic equipment |
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| CN202110060493.8A CN112909475B (en) | 2021-01-15 | 2021-01-15 | Antenna assembly and electronic equipment |
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