WO2019026791A1

WO2019026791A1 - Vibration-sensitive module

Info

Publication number: WO2019026791A1
Application number: PCT/JP2018/028253
Authority: WO
Inventors: 照元　幸次
Original assignee: ローム株式会社
Priority date: 2017-08-01
Filing date: 2018-07-27
Publication date: 2019-02-07

Abstract

The present disclosure provides a vibration-sensitive module. The vibration-sensitive module includes an acceleration sensor, a vibration power generation unit, and a module control unit. The acceleration sensor detects acceleration with respect to at least one detection axis. The vibration power generation unit converts vibration energy into electric power. The module control unit controls the acceleration sensor, and when the electric power is outputted from the vibration power generation unit, the module control unit starts vibration measuring mode for detecting acceleration using the acceleration sensor.

Description

Vibration sensing module

The present disclosure relates to a seismic sensing module.

The vibration sensing module is a module that detects vibrations such as earthquakes. The vibration sensing module uses a so-called pendulum type vibration sensing sensor. A pendulum-type seismic sensor has a portion that is mechanically oscillated by earthquake vibration. For this reason, at the time of non-vibration occurrence in which no earthquake occurs, power is hardly consumed.

Various seismic sensors having a so-called MEMS structure have been proposed. Such a seismic sensor is advantageous in achieving miniaturization and high precision. However, detection of vibration requires power. For this reason, even at the time of non-vibration occurrence, in order to determine whether or not significant vibration corresponding to an earthquake is generated, it is necessary to periodically detect the vibration. Therefore, in the case of earthquake monitoring over a long period of time, continuous power supply becomes a problem.

The present disclosure makes it a subject to provide a preferred seismic module.

According to the present disclosure, a seismic sensing module is provided. The seismic isolation module includes an acceleration sensor, a vibration power generation unit, and a module control unit. The acceleration sensor detects an acceleration about at least one detection axis. The vibration power generation unit converts vibration energy into electric power. The module control unit controls the acceleration sensor, and when power is output from the vibration power generation unit, starts the vibration measurement mode in which the acceleration sensor detects the acceleration.

Other features and advantages of the present disclosure will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is a perspective view showing a vibration sensing module based on a 1st embodiment of this indication. It is a principal part perspective view showing a vibration sensing module based on a 1st embodiment of this indication. It is a block block diagram showing a vibration sensing module based on a 1st embodiment of this indication. It is a block block diagram showing electronic equipment provided with a vibration sensing module based on a 1st embodiment of this indication. It is a flow chart which shows an operation example of a vibration sensing module based on a 1st embodiment of this indication. It is a flow chart which shows an operation example of a vibration sensing module based on a 1st embodiment of this indication. It is a flow chart which shows an operation example of a vibration sensing module based on a 1st embodiment of this indication. It is a graph which shows the operation example of the vibration sensing module based on 1st Embodiment of this indication. It is a graph which shows the operation example of the vibration sensing module based on 1st Embodiment of this indication. It is a graph which shows the operation example of the vibration sensing module based on 1st Embodiment of this indication. It is a graph which shows the operation example of the vibration sensing module based on 1st Embodiment of this indication. It is a flow chart which shows an operation example of a seismic system based on a 1st embodiment of this indication. It is a perspective view which shows the operation example of the seismic system based on 1st Embodiment of this indication. It is a perspective view showing a vibration sensing module based on a 2nd embodiment of this indication.

Hereinafter, preferred embodiments of the present disclosure will be specifically described with reference to the drawings.

FIGS. 1 to 4 show a vibration sensing module according to a first embodiment of the present disclosure and an electronic device provided with the vibration sensing module.

FIG. 1 is a perspective view of the vibration sensing module A1 as viewed from above. FIG. 2 is a perspective view of the below-described module substrate 110 of the vibration sensing module A1 as viewed from below. FIG. 3 is a block diagram showing the vibration sensing module A1. The vibration sensing module A1 according to the present embodiment includes a module substrate 110, an acceleration sensor 120, a module control unit 130, a module storage unit 140, and a vibration power generation unit 150. The vibration sensing module A1 is attached to, for example, the electronic device B1, and is used to detect a vibration received by the electronic device B1.

The module substrate 110 is a base of the vibration sensing module A1, and includes, for example, a base made of glass epoxy resin and a wiring portion formed on the base. The shape and size of the module substrate 110 are not particularly limited. In the present embodiment, the module substrate 110 has a rectangular shape in plan view of about 6 mm to 9 mm and a thickness of about 0.8 mm to 1.5 mm. The wiring portion has a plurality of mounting electrodes 111. The mounting electrode 111 is formed on one side of the module substrate 110, and is used to mount the module substrate 110 on the vibration power generation unit 150. The mounting electrode 111 is formed of a plating layer of, for example, Cu, Ni, Au or the like.

The acceleration sensor 120 detects acceleration on a plurality of detection axes, and outputs a signal corresponding to the detected acceleration. The specific configuration of the acceleration sensor 120 is not particularly limited as long as the acceleration can be detected for a plurality of detection axes. In the present embodiment, the acceleration sensor 120 is constituted by a so-called MEMS sensor, which is perpendicular to each other. The detection principle of the MEMS sensor constituting the acceleration sensor 120 capable of detecting the acceleration with respect to the x axis, the y axis and the z axis is not particularly limited. For example, the stationary side portion and the movable side portion mutually having a comb structure There is a detection principle that detects an acceleration using a capacitance that changes according to the relative position.

The module control unit 130 uses the acceleration detected by the acceleration sensor 120 to perform seismic processing and the like to be described later. The specific configuration of the module control unit 130 is not particularly limited, and a general microprocessor (CPU) is employed.

The module storage unit 140 stores state information of the acceleration sensor. The module storage unit 140 is configured by a general semiconductor memory, and in the present embodiment, a semiconductor chip in which the module control unit 130 and the module storage unit 140 are integrated is adopted. The module control unit 130 may be a component separate from the module storage unit 140. In the present embodiment, the state information stored in the module storage unit 140 is information specifying the attitude of the acceleration sensor 120 with respect to the direction of gravity.

The vibration power generation unit 150 converts vibration energy into electric power. The specific configuration and power generation principle of the vibration power generation unit 150 are not particularly limited, and various configurations such as a configuration including a piezoelectric element (not shown) or a configuration using electromagnetic induction may be appropriately adopted.

In the present embodiment, the vibration power generation unit 150 has a rectangular outer shape larger than the module substrate 110 in the z-axis direction view, and the module substrate 110 is mounted on the upper surface of the vibration power generation unit 150 in the z-axis direction. There is. In the vibration power generation unit 150, a plurality of terminals 151 and a plurality of wirings 152 are formed. The plurality of terminals 151 are used, for example, to mount the vibration sensing module A1 on a circuit board or the like (not shown) of the electronic device B1. The plurality of terminals 151 are used for transmission and reception of control signals and power supply with the electronic device B1. In the present embodiment, the plurality of terminals 151 include an external power supply terminal 1511. The external power supply terminal 1511 is used to supply power from the external power supply (a battery 54 described later) of the vibration sensing module A1 to the vibration sensing module A1. The plurality of wirings 152 are respectively connected to the plurality of terminals 151. The plurality of mounting electrodes 111 of the module substrate 110 are connected to the end portions of the plurality of wires 152 by solder 129.

In FIG. 3, the power wiring is indicated by a solid line, and the control wiring is indicated by a dotted line. The power output line from the vibration power generation unit 150 is connected to the acceleration sensor 120 and the module control unit 130. The terminal 151 used to transmit and receive control signals is connected to the module control unit 130 by control wiring. The external power supply terminal 1511 is connected to the acceleration sensor 120 and the module control unit 130 via the switch 160.

FIG. 4 is a block diagram showing the electronic device B1 to which the vibration sensing module A1 is attached. The electronic device B1 includes a vibration sensing module A1, a device control unit 51, a display unit 52, an interface unit 53, and a battery 54. The application and function of the electronic device B1 are not particularly limited. For example, when an earthquake occurs, the electronic device B1 is a device that can vibrate to such an extent that the vibration detection module A1 can detect the vibration.

The device control unit 51 controls the entire electronic device B1. The device control unit 51 is constituted of, for example, a microprocessor, and appropriately includes a memory. The display unit 52 is for displaying the operation status of the electronic device B1 and the like, and is formed of, for example, a liquid crystal display panel. The interface unit 53 is a unit for performing communication transmission / reception with the outside of the electronic device B1 and power supply. The communication mode of the interface unit 53 may be either wired communication or wireless communication. The battery 54 is a rechargeable battery or a dry battery, and corresponds to an example of an external power supply of the vibration sensing module A1.

Next, the operation of the vibration sensing module A1 and the electronic device B1 will be described below.

FIG. 5 shows an operation example of the vibration sensing module A1. In step S0, the power supply of the vibration sensing module A1 is turned on. The acceleration sensor 120 performs the following processing according to a program stored in advance in the module control unit 130 or the like.

In step S1, an initial state storage mode M1 is started. The initial state memory mode M1 is performed in a steady state in which no vibration such as an earthquake occurs. In the present embodiment, the initial state storage mode M1 is executed by the power supplied from the battery 54 of the electronic device B1 to the vibration sensing module A1 via the external power supply terminal 1511. That is, the module control unit 130 causes the battery 54 to supply power to the acceleration sensor 120 and the module control unit 130 via the external power supply terminal 1511 by opening the switch 160.

For example, in step S2, acceleration data is acquired for the x axis, y axis, and z axis of the acceleration sensor 120. Then, in step S3, the gravity direction Ng is specified. In a steady state in which no vibration such as an earthquake occurs, the acceleration applied to the acceleration sensor 120 is considered to be only the gravitational acceleration. The accelerations in the x-axis, y-axis and z-axis are vector synthesized to specify the gravity direction Ng. The module control unit 130 stores the gravity direction Ng in the module storage unit 140 as the initial gravity direction Ngi. Next, in step S4, two axes perpendicular to the initial gravity direction Ngi are selected. These axes are perpendicular to one another and are defined as horizontal axes. The module control unit 130 stores these horizontal axes in the module storage unit 140. Next, in step S5, zero point correction is performed. Module control unit with the detected acceleration of x-axis, y-axis and z-axis in steady state with no gravitational vibration and load only gravity acceleration as the zero point of acceleration of each axis 130 is stored in the module storage unit 140.

When the initial state storage mode M1 ends, the module control unit 130 enters a standby state. In the standby state, the module control unit 130 does not perform vibration detection or the like using the acceleration sensor 120. In the present embodiment, step S6 is performed after step S5. Step S6 is a step in which the vibration power generation unit 150 generates electric power due to the generation of vibration, and the vibration power generation unit 150 outputs electric power. That is, in a period in which the vibration generating unit 150 does not generate vibration to such an extent as to generate power, the vibration sensing module A1 is maintained in the standby state until step S6 is performed.

Step S6 is executed when the vibration generating unit 150 generates vibration to a degree that causes power generation. That is, the power from the vibration power generation unit 150 is supplied to the acceleration sensor 120 and the module control unit 130. Then, the module control unit 130 starts step S7 (vibration measurement mode M2) using this power. In addition, a part of the process after starting vibration measurement mode M2 may be performed only by the electric power from the vibration electric power generation part 150. FIG. In addition, processing after the start of vibration measurement mode M2 may be performed by power combining the power from vibration power generation unit 150 and the power from battery 54 (external power) via external power supply terminal 1511. , And may be performed only by the power from the battery 54 (external power). When processing is performed using the power from the battery 54, the module control unit 130 opens the switch 160.

Next, in step S7, vibration detection processing is performed. The vibration detection process is performed to detect whether significant vibration is generated, and is performed, for example, by the following procedure. First, in step S71, the x-axis, y-axis and z-axis accelerations of the acceleration sensor 120 or the gravity direction Ng and horizontal two-axis acceleration are obtained, and the difference from the initial acceleration stored as initial state information in step S5 is obtained. Calculate for each axis. And the difference value of the acceleration about all the axes is totaled, and a total is calculated. Next, in step S72, the sum of the accelerations obtained in step S71 is compared with the acceleration threshold value stored in advance in the module storage unit 140. In addition, even if a single acceleration of any axis, an acceleration of only two horizontal axes, or a total value of accelerations of a plurality of arbitrarily selected axes is compared with the corresponding acceleration threshold, Good. For example, if the sum of the accelerations is larger than the acceleration threshold, it is determined that the vibration is detected (step S72: Yes), and step S9 is executed. On the other hand, if the sum of the accelerations is equal to or less than the acceleration threshold (No at step S72), it is determined that no significant vibration is applied, and the module control unit 130 determines the necessity of self-diagnosis at step S8. For example, when a self-diagnosis is necessary according to an instruction from the device control unit 51 of the electronic device B1, the self-diagnosis of the acceleration sensor 120 is performed by a change in the state of the acceleration sensor 120 with respect to a predetermined condition change. In the present embodiment, for example, by applying a predetermined voltage to the acceleration sensor 120, a diagnosis is performed based on whether or not the comb-teeth-like movable part is operating normally. After self-diagnosis, it returns to step S1. On the other hand, when it is determined that the significant vibration is applied (step S72: Yes), the module control unit 130 performs seismic wave measurement in step S9. From the viewpoint of reduction of power consumption etc., in the processing up to execution of seismic wave measurement in step S9, the sampling rate of acceleration of acceleration sensor 120 is preferably a relatively low frequency, for example, set to about 100 Hz Be done. If it is determined that significant vibration is applied (Yes at step S72), the module control unit 130 may output a detection signal notifying that significant vibration has been detected. This detection signal may be maintained until the power of the vibration sensing module A1 is turned off, or may be maintained for a preset time. In addition, after the vibration sensing module A1 is turned on in step S0, the number of times the process proceeds to step S9 may be stored in the module storage unit 140.

As a modification of step S7, determination processing different from the above-described steps S71 and S72 may be performed. For example, the magnitude (acceleration, amplitude, etc.) of a single vibration of each axis may be calculated in step S71, and compared with a threshold for the magnitude of the single vibration of each axis set in advance in step S72. Alternatively, in step S71, a combined value of the magnitudes of vibrations of the three axes may be calculated, and in step S72, it may be compared with a threshold value for the combined value of the magnitudes of vibrations of the three axes set in advance. Alternatively, in step S71, a composite value of the magnitudes of vibrations of the two horizontal axes may be calculated, and in step S72, it may be compared with a threshold value for a composite value of magnitudes of vibrations of only the horizontal axis set in advance.

FIG. 6 shows an operation example of the vibration measurement mode M2. When the vibration measurement mode M2 is started in step S9, the module control unit 130 executes a first digitizing process S10. The first digitizing process S10 is a process of acquiring digitized acceleration data by sampling the acceleration output from the acceleration sensor 120 at a first sampling rate R1. The frequency of the first sampling rate R1 is not particularly limited, and is preferably a frequency that can represent the vibration given to the module control unit 130 with a sufficient resolution. In the present embodiment, the first sampling rate R1 is, for example, about 1600 Hz. In the vibration measurement mode M2, a total value of gravity direction Ng and acceleration data of two horizontal axes, single acceleration of any axis, acceleration of only two horizontal axes, or acceleration of a plurality of arbitrarily selected axes Acceleration data such as a total value can be selected as a processing target as appropriate.

Further, in the present embodiment, the first digitizing process S10 includes a first selection process S101. In the first selection processing S101, vibrations having a frequency equal to or less than a first frequency F1 are selectively left for vibration data configured by acceleration data sampled at a first sampling rate R1, and vibrations exceeding the first frequency F1 are excluded. It is a process. The first frequency F1 is a frequency significantly lower than the first sampling rate R1, and is set to about 20 Hz in the present embodiment. This is due to the fact that the frequency of general earthquakes is approximately 0.4 Hz to 10 Hz or so, and the range sufficiently including the frequency of general earthquakes is selected.

Next, the module control unit 130 executes step S11. In step S11, the module control unit 130 calculates the maximum acceleration of the vibration from the acceleration data (vibration data) obtained by the first digitizing process S10. The maximum acceleration contributes to roughly grasping the magnitude of the vibration, and is stored, for example, in the module storage unit 140.

Next, the module control unit 130 executes a second digitizing process S12. The second digitizing process S12 is a process of sampling the acceleration data (vibration data) obtained by the first digitizing process S10 at a second sampling rate R2. The frequency of the second sampling rate R2 is not particularly limited as long as it is lower than the first sampling rate R1, and a frequency suitable for the subsequent processing is preferable. In the present embodiment, the second sampling rate R2 is, for example, about 100 Hz, which is about 6.3% of the first sampling rate R1. The setting value of the second sampling rate R2 is intended to be adapted to the calculation condition of the SI value described later.

Further, in the present embodiment, the second digitizing process S12 includes a second selection process S121. The second selection processing S121 selectively allows the vibration having the second frequency F2 or less to remain for the vibration data configured by the acceleration data sampled at the second sampling rate R2, and excludes the vibration exceeding the second frequency F2. It is a process. The second frequency F2 is a frequency significantly lower than the second sampling rate R2, and is set to about 10 Hz in the present embodiment. This is because the frequency of a general earthquake is about 0.4 Hz to about 10 Hz.

Next, the module control unit 130 executes step S13. In step S13, the module control unit 130 calculates the SI value V using the acceleration data (vibration data) obtained by the second digitizing process S12. The SI value V quantifies how much damage a general building will be caused by an earthquake. More specifically, the SI value V is an average of the maximum velocity response value of each pendulum when the natural movement is from 0.1 to 2.5 seconds and the pendulum group with a damping constant of 20% is excited by the earthquake motion. It is In step S13, as in the vibration measurement mode M2, the total value of the gravity direction Ng and acceleration data of two horizontal axes, single acceleration of any axis, acceleration of only two horizontal axes, or any selected The SI value V can be calculated based on acceleration data appropriately selected from acceleration data such as a total value of accelerations of a plurality of axes.

Next, in step S14, earthquake level determination is performed. In this step S14, the magnitude (level) of the earthquake motion is determined based on the SI value V obtained in step S13. Further, in this determination, the maximum acceleration obtained in step S11 may be additionally used.

As a result of step S14, when it is determined that a seismic movement to be alerted has occurred, the module control unit 130 outputs the numerical value information of the SI value V or the determination result signal to the device control unit 51 of the electronic device B1. For example, in the electronic device B1 shown in FIG. 4, the device control unit 51 displays on the display unit 52 a message or an icon notifying that an earthquake has occurred. In addition, the device control unit 51 stops the operation of the electronic device B1 that should not be performed at the time of an earthquake. Alternatively, the device control unit 51 executes the operation of the electronic device B1 to be executed at the time of an earthquake. Further, the device control unit 51 may output, from the interface unit 53, a notification signal notifying that an earthquake has occurred to the outside. Note that the measurement and determination processing in steps S9 to S14 may be performed using the acceleration of a single body of any axis, the acceleration of only two horizontal axes, or the total value of the accelerations of a plurality of arbitrarily selected axes. Good.

In addition, the earthquake detection module A1 of the present embodiment may execute the earthquake detection signal output determination mode M3 illustrated in FIG. 7 as an additional process. When the earthquake detection signal output determination mode M3 is started in step S20, the module control unit 130 executes a first determination process S21. In the first determination process S21, the SI value V is compared with the SI value threshold value Vt set in advance. For example, when the SI value V does not exceed the SI value threshold value Vt, it is determined that the vibration is not earthquake motion (first determination process S21: No, step S25). On the other hand, when the SI value V exceeds the SI value threshold value Vt, it is determined that there is a possibility that the vibration is an earthquake motion (first determination process S21: Yes), and the process proceeds to the second determination process S22. The magnitude of the SI value threshold Vt is arbitrarily set, and is about 18 cm / sec in this embodiment, for example. As a unit of SI value, Kine is used with the same meaning as cm / sec.

In the second determination process S22, the number N of times the SI value V exceeds the SI value threshold Vt within a predetermined time is counted. Then, the number N is compared with a preset number threshold Nt. For example, when the number of times N does not exceed the number of times threshold Nt, it is determined that the vibration is not earthquake motion (second determination process S22: No, step S25). On the other hand, when the number of times N exceeds the number of times threshold Nt, the process proceeds to the third determination processing S23 as there is a possibility that the vibration is an earthquake motion (second determination processing S22: Yes). The magnitude of the number threshold Nt is arbitrarily set, and is 4 in the present embodiment, for example.

In the third determination processing S23, an integrated SI value VI which is an integrated value of the SI value V is calculated within a predetermined time. Then, the integrated SI value VI is compared with a preset integrated SI value threshold value VIt. For example, when the integrated SI value VI does not exceed the integrated SI value threshold value VIt, it is determined that the vibration is not earthquake motion (third determination process S23: No, step S25). On the other hand, when the integrated SI value VI exceeds the integrated SI value threshold value VIt, the module control unit 130 outputs an earthquake detection signal in step S24 on the assumption that the vibration is earthquake motion (third determination process S23: Yes). Specifically, the earthquake detection signal is set to the Hi state. When the integration of the integrated SI value VI is based on the acceleration data sampled at the above-described second sampling rate R2, the integrated SI value VI is calculated by integrating the SI values V of five consecutive points. Further, the integrated SI value threshold value VIt in this case is, for example, about 108 cm.

When the earthquake detection signal is in the Hi state in step S24, the device control unit 210 performs the blocking process by the blocking unit 260 described above. On the other hand, if the determination is No in any of the first determination process S21, the second determination process S22, and the third determination process S23, the module control unit 130 maintains the earthquake detection signal in the Lo state in step S25. In this case, the blocking process by the blocking unit 260 described above is not performed. In addition, the output of the earthquake detection signal in step S24 and step S25 is not limited to switching the Hi state and the Lo state of a single signal, and information on whether or not an earthquake is detected is output from the module control unit 130 It may be any signal output mode to be output. Further, after step S25, control may be performed to return to step S7 of FIG. 5 after a predetermined time has elapsed.

FIGS. 8A to 11C show determination examples in the earthquake detection signal output determination mode M3. FIGS. 8A to 11C are applied with collision vibrations that are not earthquake motions. 8A-C show one collision, FIG. 9A-C shows two collisions, FIG. 10A-C shows three collisions, and FIGS. 11A-C show four collisions. is there.

FIG. 8A and FIG. 8B are acceleration graphs of horizontal two axes when the number of collisions is one. As shown, an acceleration peak corresponding to one collision appears. FIG. 8C shows the SI value V and the integrated SI value VI when the number of collisions is one. As shown in FIG. 8C, in the present example, there is an SI value V that exceeds the SI value threshold Vt, and the first determination processing S21 is a Yes determination. However, the number N is 2 and does not exceed the number threshold Nt (= 4). For this reason, the second determination process S22 is a No determination, and it is determined in step S25 that it is an erroneous detection that is not an earthquake motion.

FIG. 9A and FIG. 9B are acceleration graphs of horizontal two axes when the number of collisions is two. As shown, acceleration peaks corresponding to two collisions appear. FIG. 9C shows the SI value V and the integrated SI value VI when the number of collisions is two. As shown in FIG. 9C, in the present example, there is an SI value V that exceeds the SI value threshold Vt, and the first determination processing S21 is a Yes determination. However, the number N is 3 and does not exceed the number threshold Nt (= 4). For this reason, the second determination process S22 is a No determination, and it is determined in step S25 that it is an erroneous detection that is not an earthquake motion.

FIG. 10A and FIG. 10B are acceleration graphs of horizontal two axes when the number of collisions is three. As shown, acceleration peaks corresponding to three collisions appear. FIG. 10C shows the SI value V and the integrated SI value VI when the number of collisions is three. As shown in FIG. 10C, in the present example, there is an SI value V that exceeds the SI value threshold Vt, and the first determination processing S21 is a Yes determination. However, the number N is 3 and does not exceed the number threshold Nt (= 4). For this reason, the second determination process S22 is a No determination, and it is determined in step S25 that it is an erroneous detection that is not an earthquake motion. In the present example, when the integrated SI value VI exceeds the integrated SI value threshold value VIt and the third determination process S23 is performed, the process is determined as Yes.

FIG. 11A and FIG. 11B are acceleration graphs of horizontal two axes when the number of collisions is four. As shown, acceleration peaks corresponding to four collisions appear. FIG. 11C shows the SI value V and the integrated SI value VI when the number of collisions is four. As shown in FIG. 11C, in the present example, there is an SI value V that exceeds the SI value threshold Vt, and the first determination processing S21 is a Yes determination. Further, the number N is 5 and exceeds the number threshold Nt (= 4). Therefore, the second determination process S22 is a Yes determination. However, since the integrated SI value VI does not exceed the integrated SI value threshold value VIt, the third determination processing S23 is a No determination, and it is determined in step S25 that the erroneous detection is not earthquake motion.

FIG. 12 shows an operation example of the state information comparison mode M4 of the electronic device B1. As a situation in which the state information comparison mode M4 is executed, it is assumed that the electronic device B1 is installed in a building or the like and is normally used without being moved and left still. For example, when the device control unit 51 starts the state information comparison mode M4 in step S30, the seismic module A1 provided in the electronic device B1 in step S31 has already performed the initial state storage mode M1 and has already performed the initial gravity direction Ngi. It is determined whether it has been identified. When the initial gravity direction Ngi is not specified (step S31: No), the device control unit 51 causes the vibration sensing module A1 to execute the initial state storage mode M1.

When the initial gravity direction Ngi of the vibration sensing module A1 has been identified (step S31: Yes), the device control unit 51 executes step S32. In step S32, the device control unit 51 causes the seismic sensor module A1 to acquire acceleration data for the x-axis, y-axis, and z-axis of the acceleration sensor 120 at that time. Then, the gravity direction Ng at that time is specified.

Next, in step S33, the direction of the initial gravity direction Ngi stored in advance is compared with the direction of gravity Ng specified in step S32. For example, the electronic device B1 indicated by an imaginary line (two-dot chain line) in FIG. 13 indicates an initial state when the initial gravity direction Ngi is specified. Thereafter, a solid line indicates a state in which the attitude of the electronic device B1 with respect to the gravity direction Ng changes due to secular change and the like. When the electronic device B1 is inclined with respect to the gravity direction Ng, the initial gravity direction Ngi specified by the vibration sensing module A1 of the electronic device B1 is a vector pointing in a direction different from the gravity direction Ng at that time. In step S33, the difference between the gravity direction Ng and the initial gravity direction Ngi is calculated, for example, as an angle amount, and stored in the memory in the device control unit 51. Then, the device control unit 51 executes step S34.

In step S34, how much the electronic device B1 is inclined with respect to the gravity direction Ng is specified from an angle amount corresponding to the difference between the gravity direction Ng calculated for the electronic device B1 and the initial gravity direction Ngi. As a result, it is possible to recognize deformation or the like associated with the secular change of the portion where the electronic device B1 is installed.

According to the present embodiment, when the vibration generating unit 150 generates vibrations to such an extent that power generation occurs, the vibration measurement mode M2 is started using the power from the vibration generating unit 150. Thereby, when a vibration such as an earthquake occurs, it is possible to reliably start the detection processing for the vibration without delay. On the other hand, the vibration sensing module A1 does not perform processing such as vibration detection until the vibration generating unit 150 generates vibration to such an extent that power generation occurs. For this reason, at the time of non-vibration generation | occurrence | production, it can be set as the state which does not consume electric power in vibration-sensing module A1. Therefore, according to the vibration sensing module A1, it is possible to dispense with the power supply at the time of non-vibration occurrence.

The vibration sensing module A1 includes an external power supply terminal 1511, and can receive power supply from external power such as the battery 54 or the like. Thereby, for example, after the vibration measurement mode M2 is started by the power from the vibration power generation unit 150, each process for performing vibration detection or seismic wave measurement can be performed using external power. This is an advantage that when the module control unit 130 or the module storage unit 140 adopts a specification capable of executing high-performance processing, the function of the module control unit 130 can be sufficiently exhibited. is there. Alternatively, when vibration occurs to such an extent that power generation occurs in the vibration power generation unit 150, the acceleration sensor 120 and the module control unit 130 continue processing necessary for vibration detection and seismic wave measurement for a predetermined time thereafter. It can be performed at once or intermittently.

In the present embodiment, the module substrate 110 on which the acceleration sensor 120, the module control unit 130 and the module storage unit 140 are mounted is mounted on the vibration power generation unit 150. Thereby, the miniaturization of the vibration sensing module A1 can be achieved.

The vibration sensing module A1 has a module control unit 130 and a module storage unit 140. The module control unit 130 can perform processing based on acceleration data from the acceleration sensor 120, and the processing result can be stored in the module storage unit 140. Therefore, the function of the vibration sensing module A1 can be enhanced.

The vibration control module A1 stores the state information of the acceleration sensor 120 in the initial state such as the initial stage of installation in the module storage unit 140 as the initial state information by executing the initial state storage mode M1 shown in FIG. be able to. By storing the initial gravity direction Ngi as the initial state information, it is possible to realize the high functionality of the electronic device B1 described with reference to FIGS. 12 and 13. By performing the vibration detection process of step S7 to step S72, it is possible to quantitatively and quickly detect the state of high possibility of the change of the acceleration due to the earthquake motion. In addition, by performing the self-diagnosis process of step S8, it is possible to recognize that the acceleration sensor 120 is in an unintended non-operating state by long-term use. For example, as a result of performing step S8, when it is diagnosed that the acceleration sensor 120 is not operating normally, the module control unit 130 can be configured to output a sensor error signal to the outside.

As shown in FIG. 6, in the vibration measurement mode M2, a two-step process of a first digitizing process S10 and a second digitizing process S12 is performed. By performing the first digitizing process S10 using the relatively high frequency first frequency F1, it is possible to sample an actually generated vibration with a sufficient resolution. By sampling with sufficient resolution, for example, in the first selection process S101, it is possible to reliably eliminate the vibration component different from the earthquake motion. Performing the second digitizing process S12 after completing the first digitizing process S10 is, for example, noise different from earthquake motion when the second digitizing process S12 is executed without executing the first digitizing process S10. It can prevent that the high frequency vibration as is accidentally matched with the 2nd frequency F2 of the 2nd digitization processing S12, and being recognized as a vibration of a frequency near earthquake movement. Further, by sampling at the second frequency F2 of lower frequency in the second digitizing process S12, it is possible to appropriately reduce the amount of data used for calculating the SI value V in step S13.

By executing the earthquake detection signal output determination mode M3 shown in FIG. 7, as a result of the execution of the first digitizing process S10 and the second digitizing process S12, it is determined that the collision vibration is earthquake movement. Even such false detection can be eliminated. In the determination of this false detection, the comparison between the SI value V and the SI value threshold value Vt in the first determination processing S21 is to determine whether or not there is earthquake motion from the instantaneous vibration scale, which is rational. Further, the comparison between the number N and the number threshold Nt in the second determination processing S22 is to determine whether or not the earthquake motion is based on the temporal continuity of the vibration, which is preferable for improving the accuracy of the determination. Further, the comparison between the integrated SI value VI and the integrated SI value threshold value VIt in the third determination processing S23 is based on the determination condition that the energy of vibration continues temporally. Such a determination is based on the fact that the earthquake motion has a continuous energy distribution, whereas the collision vibration has a discrete energy distribution, and this determination is suitable for high accuracy determination. Then, by executing all of the first determination processing S21, the second determination processing S22, and the third determination processing S23, false detection can be significantly reduced.

In steps S13 and S14 and steps S20 to S25 shown in FIGS. 6 and 7, a PGA (peak ground acceleration) value may be used. That is, similar to the threshold value and the number of times serving as the determination reference for the SI value set in steps S13 and S14 and steps S20 to S25, the threshold and the number of times serving as the determination reference are set for the PGA value The same judgment processing as in the case of the case may be performed. In addition, about adoption of a PGA value, it may replace with a SI value and may use a PGA value, and may use together a SI value and a PGA value.

FIG. 14 shows another embodiment of the present disclosure. In these figures, elements that are the same as or similar to the above embodiment are given the same reference numerals as the above embodiment.

FIG. 14 shows a seismic sensing module according to a second embodiment of the present disclosure. The seismic sensing module A2 of the present embodiment does not include the module substrate 110 in the seismic sensing module A1, and the module control unit 130 and the module storage unit 140 are incorporated in the acceleration sensor 120.

The module control unit 130 and the module storage unit 140 incorporated in the acceleration sensor 120 preferably have a smaller and thinner configuration than the module control unit 130 and the module storage unit 140 mounted on the module substrate 110 in the vibration sensing module A1. In the present embodiment, an application specific integrated circuit (ASIC) that can perform the functions of the module control unit 130 and the module storage unit 140 described above is used. The ASIC is an integrated circuit element whose function is narrowed down specifically for a specific application such as an earthquake detection application in the present embodiment. Therefore, the ASIC is suitable for downsizing and thinning, and can be incorporated in the acceleration sensor 120 as a component that performs the functions of the module control unit 130 and the module storage unit 140.

When an ASIC as the module control unit 130 and the module storage unit 140 is incorporated, for example, as illustrated, the ASIC is disposed adjacent to the x-axis detection unit 120x, the y-axis detection unit 120y, and the z-axis detection unit 120z. Ru. The x-axis detection unit 120x, the y-axis detection unit 120y, and the z-axis detection unit 120z correspond to MEMS sensors that can detect the acceleration of each axis. The measurement principle and specific structure of the x-axis detection unit 120x, the y-axis detection unit 120y, and the z-axis detection unit 120z are not particularly limited.

Further, in the present embodiment, the acceleration sensor 120 including the module control unit 130 and the module storage unit 140 is mounted on the vibration power generation unit 150. A mounting terminal (not shown) of the acceleration sensor 120 is connected to the plurality of wires 152 of the vibration power generation unit 150.

The processing described with reference to FIGS. 5 to 7 may be adopted as appropriate for the detection processing by the vibration sensing module A2. When the storage capacity of the ASIC is limited, for example, the storage capacity may be reduced by reducing the number of history storages of the earthquake detection process.

Also according to the present embodiment, it is possible to eliminate the need for power supply at the time of non-vibration occurrence. Further, since the acceleration sensor 120 includes the module control unit 130 and the module storage unit 140, the vibration sensing module A2 is suitable for further downsizing as compared to the vibration sensing module A1.

The vibration sensing module according to the present disclosure is not limited to the embodiment described above. The specific configuration of each part of the vibration sensing module according to the present disclosure can be varied in design in many ways.

The present disclosure includes embodiments according to the following appendices.
[Supplementary Note 1]
An acceleration sensor for detecting an acceleration about at least one detection axis;
A vibration power generation unit that converts vibration energy into electric power;
A module control unit for controlling the acceleration sensor, wherein the module control unit starts a vibration measurement mode for detecting an acceleration by the acceleration sensor when power is output from the vibration power generation unit; module.
[Supplementary Note 2]
The seismic sensing module according to appendix 1, further comprising a module substrate on which the acceleration sensor and the module control unit are mounted.
[Supplementary Note 3]
The seismic sensor module according to Appendix 2, wherein the module substrate is mounted on the vibration power generation unit.
[Supplementary Note 4]
The vibration control module according to appendix 1, wherein the module control unit is built in the acceleration sensor.
[Supplementary Note 5]
The seismic sensor module according to appendix 4, wherein the acceleration sensor is mounted on the vibration power generation unit.
[Supplementary Note 6]
The seismic sensor module according to any one of appendices 1 to 5, further comprising an external power supply terminal for receiving a power supply.
[Supplementary Note 7]
The vibration module according to claim 6, wherein the vibration measurement mode by the module control unit is performed using power supplied from the external power supply terminal.
[Supplementary Note 8]
The at least one detection axis includes a plurality of detection axes,
The acceleration sensor detects an acceleration on a plurality of the detection axes,
The seismic sensor module according to Appendix 7, further comprising a module storage unit that stores state information of the acceleration sensor.
[Supplementary Note 9]
The earthquake sensing module according to appendix 8, wherein the state information is an acceleration about the plurality of detection axes when no vibration occurs.
[Supplementary Note 10]
The module control unit calculates the direction of gravity based on the accelerations of the plurality of detection axes when no vibration occurs.
The earthquake sensing module according to appendix 9, wherein the state information includes the gravity direction at the time of non-vibration occurrence.
[Supplementary Note 11]
The vibration module according to claim 10, wherein the module control unit has an initial state storage mode for storing the state information of the acceleration sensor in the module storage unit as initial state information.
[Supplementary Note 12]
The seismic isolation module according to Appendix 11, wherein the initial state storage mode by the module control unit is performed using the power supplied from the external power supply terminal.
[Supplementary Note 13]
The module control unit sums the differences between the accelerations of the plurality of detection axes and the acceleration stored as initial state information in the vibration measurement mode, and compares the sum of the totals with a predetermined acceleration threshold value. An earthquake detection module according to appendix 12, wherein signal detection processing is performed to determine presence or absence of vibration.
[Supplementary Note 14]
The seismic sensor module according to appendix 13, wherein the module control unit calculates an SI value based on accelerations of the plurality of detection axes.
[Supplementary Note 15]
The vibration module according to claim 14, wherein the vibration measurement mode includes a first digitizing process in which the module control unit samples an acceleration of the acceleration sensor at a first sampling rate.
[Supplementary Note 16]
The vibration measurement mode includes a second digitizing process in which the module control unit samples acceleration data obtained by the first digitizing process at a second sampling rate lower than the first sampling rate. ,
15. The earthquake detection module according to appendix 15, wherein the module control unit calculates an SI value based on acceleration data obtained by the second digitizing process.
[Supplementary Note 17]
The module control unit according to any one of appendages 14 to 16, which has an earthquake detection signal output determination mode that determines whether or not to output an earthquake detection signal based on the SI value calculated in the vibration measurement mode. Vibration-sensing module.

Claims

An acceleration sensor for detecting an acceleration about at least one detection axis;
A vibration power generation unit that converts vibration energy into electric power;
A module control unit for controlling the acceleration sensor, wherein the module control unit starts a vibration measurement mode for detecting an acceleration by the acceleration sensor when power is output from the vibration power generation unit; module.
The seismic isolation module according to claim 1, further comprising a module substrate on which the acceleration sensor and the module control unit are mounted.
The vibration module according to claim 2, wherein the module substrate is mounted on the vibration power generation unit.
The vibration control module according to claim 1, wherein the module control unit is built in the acceleration sensor.
The seismic sensor module according to claim 4, wherein the acceleration sensor is mounted on the vibration power generation unit.
The seismic isolation module according to any one of claims 1 to 5, further comprising an external power supply terminal for receiving a power supply.
The vibration module according to claim 6, wherein the vibration measurement mode by the module control unit is performed using power supplied from the external power supply terminal.
The at least one detection axis includes a plurality of detection axes,
The acceleration sensor detects an acceleration on a plurality of the detection axes,
The seismic sensor module according to claim 7, further comprising a module storage unit that stores state information of the acceleration sensor.
The seismic isolation module according to claim 8, wherein the state information is an acceleration on the plurality of detection axes at the time of non-vibration occurrence.
The module control unit calculates the direction of gravity based on the accelerations of the plurality of detection axes when no vibration occurs.
The seismic isolation module according to claim 9, wherein the state information includes the gravity direction at the time of non-vibration occurrence.
The vibration control module according to claim 10, wherein the module control unit has an initial state storage mode for storing the state information of the acceleration sensor in the module storage unit as initial state information.
The seismic module according to claim 11, wherein the initial state storage mode by the module control unit is performed using power supplied from the external power supply terminal.
The module control unit sums the differences between the accelerations of the plurality of detection axes and the acceleration stored as initial state information in the vibration measurement mode, and compares the sum of the totals with a predetermined acceleration threshold value. The vibration detection module according to claim 12, wherein the signal detection processing is performed to determine presence or absence of vibration.
The vibration control module according to claim 13, wherein the module control unit calculates an SI value based on accelerations of the plurality of detection axes.
The vibration module according to claim 14, wherein the vibration measurement mode includes a first digitizing process in which the module control unit samples an acceleration of the acceleration sensor at a first sampling rate.
The vibration measurement mode includes a second digitizing process in which the module control unit samples acceleration data obtained by the first digitizing process at a second sampling rate lower than the first sampling rate. ,
The vibration control module according to claim 15, wherein the module control unit calculates an SI value based on acceleration data obtained by the second digitizing process.
The module control unit according to any one of claims 14 to 16, wherein the module control unit has an earthquake detection signal output determination mode that determines whether or not to output an earthquake detection signal based on the SI value calculated in the vibration measurement mode. Vibration sensor module described.