WO2019013068A1 - Imaging device - Google Patents

Imaging device Download PDF

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Publication number
WO2019013068A1
WO2019013068A1 PCT/JP2018/025339 JP2018025339W WO2019013068A1 WO 2019013068 A1 WO2019013068 A1 WO 2019013068A1 JP 2018025339 W JP2018025339 W JP 2018025339W WO 2019013068 A1 WO2019013068 A1 WO 2019013068A1
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WO
WIPO (PCT)
Prior art keywords
substrate
imaging device
shield plate
optical axis
imaging
Prior art date
Application number
PCT/JP2018/025339
Other languages
French (fr)
Japanese (ja)
Inventor
優太 中村
Original Assignee
日本電産コパル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産コパル株式会社 filed Critical 日本電産コパル株式会社
Priority to CN201880045616.7A priority Critical patent/CN110892703A/en
Priority to JP2019529081A priority patent/JP7161472B2/en
Publication of WO2019013068A1 publication Critical patent/WO2019013068A1/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • One embodiment of the present invention relates to an imaging device and the like.
  • Patent Document 1 discloses an imaging device having a configuration in which a circuit chip is mounted on the back surface of the surface on which the imaging element is mounted.
  • Patent Document 2 discloses an imaging device provided with a first substrate provided with an imaging element, and a second substrate and a third substrate on which electronic components and the like are mounted.
  • One means of the present invention is An imaging unit (511) for imaging a subject; A first substrate (51) on which the imaging unit is mounted; A second substrate (52) for mounting an electronic component electrically connected to the first substrate; A lens barrel (1) for holding a lens; The second substrate (52) is disposed at a predetermined angle with respect to the first substrate (51). It is an imaging device.
  • the imaging device having the above configuration, since the second substrate is disposed at a predetermined angle with respect to the first substrate, compared to the conventional configuration in which the first substrate and the second substrate are disposed in parallel, The length in the thickness direction (optical axis direction) can be shortened (reduced).
  • the first substrate 51 is disposed perpendicular to the optical axis
  • the second substrate (52) is disposed at an angle of 45 degrees or less with respect to the optical axis.
  • the overlapping area of the first substrate and the second substrate can be reduced to a certain extent, so that the first substrate and the external device are connected behind the first substrate in the optical axis direction.
  • the connector and other components can be arranged. That is, the design can be made to have a high degree of freedom in design.
  • the imaging apparatus preferably It further comprises a shield plate (6) formed of metal, which is disposed around the first substrate and the second substrate.
  • the imaging device of the above configuration it is possible to suppress emission of electromagnetic noise and the like from the first substrate and the second substrate to the outside by the shield plate.
  • the second substrate (52) has protrusions (521a, 521b),
  • the shield plate (6) has fitting portions (61a, 61b) fitted to the protrusions.
  • the position of the second substrate and the shield plate can be fixed by fitting the protrusion and the fitting portion.
  • it can be set as the structure which is easy to also perform the repair after assembling.
  • the shield plate has a first biasing portion (62 or 63) for biasing the second substrate in a predetermined direction.
  • the second substrate can be fixed while being biased in the predetermined direction by the first biasing unit, whereby the second substrate can be stably held. be able to.
  • the first biasing portion is a plate spring formed on the shield plate.
  • the second substrate can be stably held with a relatively simple configuration.
  • the shield plate has a second biasing portion (63 or 62) for biasing the second substrate in a direction orthogonal to the predetermined direction.
  • the second substrate can be fixed while being biased in two directions, and thereby the second substrate can be more stably held.
  • the second biasing portion is a plate spring (62, 63) formed on the shield plate.
  • the second substrate can be more stably held with a relatively simple configuration.
  • the first biasing portion (62 or 63) is electrically connected to the ground potential of the second substrate.
  • the shielding effect of the electromagnetic noise by the shield plate can be further enhanced.
  • the ground potentials of the first substrate and the second substrate can be strengthened to provide a circuit configuration that is more resistant to noise.
  • the first substrate has a connector (512) that protrudes rearward in the optical axis direction and is electrically connected to another configuration.
  • the second substrate is disposed so as not to overlap the connector in plan view in the optical axis direction.
  • the positions of the second substrate and the connector do not interfere with each other, and the length (thickness) of the imaging device in the optical axis direction can be easily reduced.
  • an imaging unit (511) for imaging a subject A first substrate (51) on which the imaging unit is mounted; A second substrate (52) for mounting an electronic component electrically connected to the first substrate; A lens barrel (1) for holding a lens;
  • the first substrate has a connector (512) that protrudes rearward in the optical axis direction and is electrically connected to another configuration.
  • the second substrate is disposed so as not to overlap the connector in plan view in the optical axis direction. It is an imaging device.
  • the positions of the second substrate and the connector do not interfere with each other, and the length (thickness) of the imaging device in the optical axis direction can be easily reduced.
  • An imaging unit (511) for imaging a subject A first substrate (51) on which the imaging unit is mounted; A second substrate (52) which is disposed at a predetermined angle with respect to the first substrate and on which an electronic component electrically connected to the first substrate is mounted; A lens barrel (1) holding a lens; A shield plate (6) formed of metal, disposed around the first substrate and the second substrate; And a case (3, 7) for housing the first substrate, the second substrate, the lens barrel, and the shield plate,
  • the second substrate has protrusions (521a, 521b),
  • the shield plate has a fitting portion (61a, 61b) to be fitted with the protrusion, When the protrusions (521a, 521b) engage with the fitting portions (61a, 61b), the length by which the protrusions protrude from the fitting portion is greater than the distance between the shield plate and the case long, It is an imaging device.
  • the imaging device of the above configuration even when the shield plate is expanded to the outside to the maximum and comes into contact with the case, the connection between the protrusion and the fitting portion can not be released. This can more reliably prevent the second substrate from falling off the shield plate.
  • the shield plate is capable of inserting the second substrate from the opening direction, and has at the end in the opening direction a bent portion (64a, 64b) bent outward.
  • the imaging device having the above configuration, by providing the bent portion, the second substrate can be easily inserted from the opening direction of the shield plate, and the assembly can be easily configured.
  • the bent portion since the bent portion is bent outward, the bent portion which is a part of the shield plate is configured to be close to the case, and the end in the opening direction of the shield plate is prevented from spreading outward more than necessary. It is possible to prevent the second substrate from falling off.
  • the case includes a front case and a rear case disposed rearward in the optical axis direction with respect to the front case.
  • the end in the opening direction of the shield plate overlaps the front case in a plane horizontal to the optical axis direction.
  • the imaging device of the above configuration when the end in the opening direction of the shield plate spreads outward, the end is likely to be in contact with the front case, so that the second substrate is prevented from falling off more reliably. be able to.
  • the protrusion protrudes at an obtuse angle with respect to the edge of the second substrate.
  • the protrusion protrudes at an angle of 95 degrees or more with respect to the edge of the second substrate.
  • a stress of a certain level or more can be easily generated between the second substrate and the shield plate, so that the second substrate can be further effectively removed from the shield plate. It can be suppressed. More preferably, the projection projects at an angle of 105 degrees or more with respect to the edge of the second substrate.
  • FIG. 1 is an external perspective view of the imaging device of Embodiment 1 as viewed from the front side.
  • FIG. 2 is an external perspective view of the imaging device of Embodiment 1 as viewed from the rear side.
  • FIG. 3 is an exploded perspective view of the imaging device of the first embodiment as viewed from the front side.
  • FIG. 4 is an exploded perspective view of the imaging device of the first embodiment as viewed from the rear side.
  • FIG. 5 is a cross-sectional view of the imaging device of Embodiment 1 at a position where the flexible substrate 53 can be seen.
  • FIG. 6 is a cross-sectional view of the imaging device of Embodiment 1 at a position where the plate spring portion 63 can be seen.
  • FIG. 1 is an external perspective view of the imaging device of Embodiment 1 as viewed from the front side.
  • FIG. 2 is an external perspective view of the imaging device of Embodiment 1 as viewed from the rear side.
  • FIG. 3 is an exploded perspective view of the imaging device of
  • FIG. 7 is an exploded perspective view of a state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected in the imaging device of Embodiment 1 as viewed from the rear side.
  • FIG. 8 is an exploded perspective view of the imaging device of Embodiment 2 as viewed from the front side.
  • FIG. 9 is an exploded perspective view of the imaging device of Embodiment 2 as viewed from the rear side.
  • FIG. 10 is an exploded perspective view of a state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected in the imaging device of Embodiment 2 as viewed from the rear side.
  • FIG. 11 is a plan view of the imaging device of Embodiment 2 as viewed from the front side.
  • FIG. 12 is a cross-sectional view at a position CC in FIG. 11 in the imaging device of the second embodiment.
  • FIG. 13 is a cross-sectional view at a position CC in FIG. 11 in the imaging device of the third embodiment.
  • the imaging device of the present invention is characterized in that the second substrate is not parallel to the first substrate but is disposed at a predetermined angle. Further, another feature of the present invention is that the second substrate is unlikely to come off from the shield plate disposed so as to surround the first substrate and the second substrate.
  • the center position of the lens and the center position of the light incident on the imaging device is referred to as an “optical axis”.
  • An imaging target located on the opposite side to the imaging element with respect to the lens is referred to as a "subject”.
  • the direction in which the subject is positioned with respect to the imaging device is referred to as “front side” or “forward in the optical axis direction”, and the direction in which the imaging device is positioned relative to the subject is referred to as “rear side” or “rear in the optical axis direction”.
  • Embodiments according to the present invention will be described according to the following configuration. However, the embodiments described below are merely examples of the present invention, and the technical scope of the present invention is not to be interpreted in a limited manner. In the drawings, the same components are denoted by the same reference numerals, and the description thereof may be omitted. 1. Embodiment 1 2. Embodiment 2 3. Embodiment 3 4. Supplementary items
  • 1 and 2 are external views of the imaging apparatus, and FIG. 1 is a front side, and FIG. 2 is a rear view.
  • 3 and 4 are exploded perspective views of the imaging apparatus, and FIG. 3 is a front side, and FIG. 4 is a rear view.
  • 5 and 6 are cross-sectional views of the imaging device, FIG. 5 is a cross-sectional view at a position where the flexible substrate 53 can be seen, and FIG. 6 is a cross-sectional view at a position where the plate spring portion 63 is visible.
  • FIG. 7 is an exploded perspective view of the state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected as viewed from the rear side.
  • the imaging device of the present embodiment includes the lens barrel 1, the waterproof seal 2, the front case 3, the waterproof seal 4, the first substrate 51, the second substrate 52, the shield plate 6, and the rear case 7. It comprises.
  • the front case 3 is a member that forms a case (case) of the imaging device together with the rear case 7 and is formed of resin, metal, or the like.
  • the front case 3 has an opening at the front in the optical axis direction centered on the optical axis, and the rear in the optical axis direction is openably connected to the rear case 7 and has a substantially rectangular shape so as to cover the optical axis. It has a circumferential surface.
  • the rear case 7 is connected to the front case 3 as described above to form a space for housing the lens barrel 1, the first substrate 51, the second substrate 52, the shield plate 6 and the like.
  • the rear case 7 has a shape along the shield plate 6, has a surface substantially perpendicular to the optical axis at the rear in the optical axis direction, and covers the optical axis in the optical axis direction from this surface. And has a substantially rectangular peripheral surface protruding from the In addition, the rear case 7 projects from the surface toward the rear in the optical axis direction along the shape of the shield plate 6.
  • the front of the rear case 7 in the optical axis direction has substantially the same shape as the rear of the front case 3 in the optical axis direction, and in the assembled state, they are connected by connection screws 85 and 86.
  • a prevention seal 4 is disposed between the rear case 7 and the front case 3.
  • the rear case 7 has a connector portion 74 at the rear in the optical axis direction for connecting the connector 512 of the first substrate 51 to an external device.
  • the rear case 7 has substrate guide portions 71 and 72 extending rearward in the optical axis direction, as shown in FIG. A groove slightly thicker than the thickness of the second substrate 52 is formed between the substrate guides 71 and 72.
  • the substrate guide portion 71 has a notch at a corner on the front side in the optical axis direction and into which the second substrate 52 is inserted, whereby the second substrate 52 is a portion of the substrate guide portions 71 and 72. It is easy to be inserted between.
  • the second substrate 52 is disposed between the substrate guides 71 and 72.
  • the rear case 7 also has a projecting portion 73 extending rearward in the optical axis direction. In the assembled state, the second substrate 52 is held by the projecting portion 73 and the plate spring portion 63 of the shield plate 6.
  • the lens barrel 1 is a cylindrical member that holds one or more optical members including the lens 1 a and extends in the optical axis direction.
  • the optical member held by the lens barrel 1 includes, in addition to the lens 1a, a lens, a spacer, an aperture plate, an optical filter, and the like.
  • the lens including the lens 1 a is formed of a transparent material such as glass or plastic, and transmits light from the front in the optical axis direction to the rear in the optical axis direction while refracting light from the front.
  • the spacer is a plate-like, annular member having an appropriate thickness in the optical axis direction, and adjusts the position of each lens in the optical axis direction.
  • the spacer has an opening at the center including the optical axis.
  • the aperture plate determines the outermost position of the passing light.
  • An optical filter suppresses or blocks light of a predetermined wavelength.
  • the optical filter includes, for example, an infrared cut filter that suppresses infrared light passing therethrough. The number of these optical members can be arbitrarily changed.
  • the waterproof seal 2 is an annular member formed of an elastic member such as rubber, and is disposed between the front case 3 and the lens barrel 1 so that the front case 3 and the lens barrel 1 can be separated. Acts to connect without gaps.
  • the waterproof seal 2 has an annular shape along the position of the outer edge of the opening of the front case 3.
  • the waterproof seal 4 is a rectangular member formed of an elastic member such as rubber, and is disposed between the front case 3 and the rear case 7 so that the front case 3 and the rear case 7 do not have a gap. Act to connect.
  • the waterproof seal 4 is formed in a rectangular shape along a rectangular open portion on the rear side in the optical axis direction of the front case 3 and a rectangular open portion on the front side in the optical axis direction of the rear case 7.
  • the shape of the open portion at the rear of the front case 3 in the optical axis direction, the open portion at the front of the rear case 7 in the optical axis direction, and the waterproof seal 4 is not limited to rectangular but may be circular. It may be polygonal or the like.
  • the first substrate 51 is a rigid substrate on which the imaging device 511 is mounted. Electronic components other than the image sensor 511 may be mounted on the first substrate 51.
  • a connector 512 is mounted on the rear surface of the first substrate 51 in the optical axis direction. Since the imaging device 511 is mounted on the front surface of the first substrate 51 in the optical axis direction, the first substrate 51 is along a plane perpendicular to the optical axis so that light is emitted to the imaging device 511 at the time of imaging. Be placed.
  • a flexible substrate 53 is connected to the first substrate 51, and the first substrate 51 is electrically connected to the second substrate 52 via the flexible substrate 53.
  • the electrical signal acquired by the imaging element 511 is subjected to predetermined electrical processing or signal processing by the electronic components mounted on the first substrate 51 and the second substrate 52, and then the connector portion 74 of the rear case 7 from the connector 512. Are output as image data to the outside of the imaging apparatus.
  • the first substrate 51 is connected to the front case 3 by the connection screws 81 and 82 and fixed in position.
  • the imaging element 511 is a photoelectric conversion element that converts the emitted light into an electric signal, and is, for example, a C-MOS sensor or a CCD, but is not limited thereto. Further, in the imaging device, an imaging unit requiring an imaging function other than the imaging element 511 may be adopted.
  • the imaging device is an example of the “imaging unit” in the present invention.
  • the second substrate 52 is a rigid substrate on which electronic components are mounted.
  • the second substrate 52 is disposed so as to extend in a direction perpendicular to the first substrate 51 and horizontal to the optical axis.
  • the second substrate 52 can be arranged so as not to interfere with the connector 512 and the connector portion 74.
  • the length (thickness) in the optical axis direction is shorter than in the configuration in which both the first substrate 51 and the second substrate 52 are disposed perpendicularly to the optical axis.
  • the second substrate 52 has protrusions 521 a and 521 b that project outward from the outer edge with respect to the optical axis.
  • the protrusions 521a and 521b are formed at positions facing the fitting portions 61a and 61b so as to be inserted into the fitting portions 61a and 61b formed in the shield plate 6 in the assembled state.
  • the second substrate 52 receives an urging force directed forward from the plate spring portion 62 of the shield plate 6 in the optical axis direction, and receives an urging force from the plate spring portion 63 in a direction perpendicular to the optical axis.
  • the protrusions 521 a and 521 b of the second substrate 52 are biased toward the edge in the optical axis direction of the fitting portions 61 a and 61 b of the shield plate 6 by the biasing force received from the plate spring portion 62. Further, the second substrate 52 is biased by the projecting portion 73 of the rear case 7 by the biasing force received from the plate spring portion 63. Thus, the second substrate 52 is stably held to the shield plate 6 and the rear case 7 by receiving the biasing force from the two directions.
  • the second substrate 52 is disposed to be inserted between the substrate guide portions 71 and 72 formed in the rear case 7.
  • the flexible substrate (FPC) 53 is a flexible substrate, and electrically connects the first substrate 51 and the second substrate 52 to enable exchange of signals with each other.
  • the shield plate 6 is formed of a plate-like member made of a conductive metal or the like, and is arranged to cover the first substrate 51 and the second substrate 52 in an assembled state. More specifically, the shield plate 6 has a first box-like portion surrounding the first substrate 51 and a second box-like portion surrounding the second substrate 52, which are respectively opened forward in the optical axis direction. At the time of assembly, the first substrate 51 and the second substrate 52 are inserted and assembled from the open portion in the optical axis direction front.
  • the shield plate 6 has fitting portions 61a and 61b, a plate spring portion 62, and a plate spring portion 63, as shown in FIGS.
  • the fitting portions 61 a and 61 b are through holes disposed at positions facing the protrusions 521 a and 521 b of the second substrate 52.
  • the protrusion 521a is inserted into the fitting portion 61a
  • the protrusion 521b is inserted into the fitting portion 61b
  • the protrusions 521a and 521b protrude outward.
  • the plate spring portion 62 is formed on the rear surface of the shield plate 6 in the optical axis direction, and as shown in FIGS. 5 and 6, the rear end of the second substrate 52 in the optical axis direction is directed forward. Turn on. On the other hand, since the protrusions 521a and 521b of the second substrate 52 are inserted into the fitting portions 61a and 61b of the shield plate 6, the protrusions 521a and 521b are the fitting portions 61a at the front end in the optical axis direction. And 61b are stably held by being pressed against the rear end in the optical axis direction.
  • the plate spring portion 63 is formed on a surface different from the plate spring portion 62 in the second box-like portion surrounding the second substrate 52 in the shield plate 6, and as shown in FIG.
  • the second substrate 52 is biased in a direction perpendicular to the biasing direction.
  • the plate spring portion 63 is in contact with the wiring pattern of the ground potential formed on the second substrate 52, whereby the entire shield plate 6 is at the ground potential.
  • the second substrate 52 is disposed substantially perpendicularly to the first substrate 51.
  • the length (thickness) in the optical axis direction of the imaging device can be shortened as compared with the configuration in which the first substrate 51 and the second substrate 52 are arranged horizontally to each other. It becomes.
  • the imaging device can be more effectively miniaturized.
  • the second substrate 52 does not necessarily have to be arranged vertically with respect to the first substrate 51, and certain effects can be obtained if the second substrate 52 is arranged at a predetermined angle.
  • the imaging device can be more effectively miniaturized by arranging the second substrate 52 slightly diagonally than perpendicular. It is possible to
  • the second substrate 52 is particularly preferable to arrange the second substrate 52 at an angle of 45 degrees or less with respect to the first substrate 51.
  • the area where the first substrate 51 and the second substrate 52 overlap can be reduced to a certain extent, so the connector 512 of the first substrate 51 and the optical axis direction rear of the first substrate 51 can be reduced.
  • the connector portion 74 and the like can be easily disposed. That is, the design can be made to have a high degree of freedom in design.
  • the shield plate 6 is disposed so as to surround the first substrate 51 and the second substrate 52, electromagnetic noise and the like are externally transmitted from the first substrate 51 and the second substrate 52. And the like can be suppressed.
  • the second substrate 52 has the protrusions 521a and 521b
  • the shield plate 6 has the fitting portions 61a and 61b, which are fitted to each other.
  • the second substrate 52 can be configured to be biased in a predetermined direction by the plate spring portions 62 and 63 of the shield plate 6, whereby the second substrate can be configured. 52 can be stably held. Even if only one of the plate spring portions 62 and 63 is used, a certain effect of stably holding the second substrate 52 can be obtained.
  • the plate spring portions 62 and 63 may be other biasing members instead of a plate spring formed integrally with the shield plate 6.
  • the second substrate 52 can be stably held with a relatively simple configuration. it can.
  • the plate spring portion 63 is electrically connected to the ground potential of the second substrate, the shield effect of the electromagnetic noise by the shield plate 6 can be further enhanced. . Further, the ground potentials of the first substrate 51 and the second substrate 52 can be strengthened to make a circuit configuration more resistant to noise.
  • the imaging device of the present embodiment is characterized in that the second substrate 52 is disposed vertically or at an angle to the first substrate 51, but the second substrate 52 is characterized in that it interferes with the connector 512 of the first substrate 51.
  • the second substrate 52 may be disposed. That is, the second substrate 52 is disposed so as not to overlap the connector 512 of the first substrate 51 in plan view in the optical axis direction. In this case, the second substrate 52 may be arranged horizontally to the first substrate 51.
  • the second substrate 52 and the connector 512 are disposed so as not to interfere with each other, so that the length (thickness) in the optical axis direction of the imaging device can be easily reduced.
  • Embodiment 2 a second embodiment of the present invention will be described with reference to FIGS. 8 to 12.
  • the imaging device of the present embodiment differs from the imaging device of the first embodiment in the shape of the shield plate 6.
  • the description of the same configuration as that of the first embodiment is omitted, and only the configuration different from the first embodiment will be described.
  • FIG. 8 and 9 are exploded perspective views of the imaging apparatus, and FIG. 8 is a front side, and FIG. 9 is a rear side.
  • FIG. 10 is an exploded perspective view of the state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected as viewed from the rear side.
  • FIG. 11 is a plan view of the imaging device as viewed from the front side.
  • FIG. 12 is a cross-sectional view of the imaging device at a position CC in FIG.
  • a bending portion 64a in which the end in the optical axis direction of the second box-like portion surrounding the second substrate 52 is bent outward And 64b. More specifically, the second substrate 52 can be inserted from the front in the optical axis direction, which is the opening direction of the shield plate 6, and in the shield plate 6, the end of the surface facing the side surface of the second substrate 52 is light It is bent so as to extend outward with respect to the axis, and the bent portions become bent portions 64a and 64b.
  • the shield plate 6 is configured to have the bending portions 64a and 64b as described above, whereby the second substrate 52 is inserted from the opening direction of the shield plate 6 (for example, the front in the optical axis direction). It can be made easy.
  • the bent portions 64a and 64b are bent outward, the bent portion is configured to be close to the front case 3, and the end in the opening direction of the shield plate 6 is prevented from spreading outward more than necessary. As a result, the second substrate 52 can be prevented from dropping off.
  • the protrusions 521 a and 521 b of the second substrate 52 are inserted into the fitting portions 61 a and 61 b of the shield plate 6.
  • the distance (P1-P2) between the surface P1 on the inner side (the side close to the optical axis) of the shield plate 6 and the surface P2 on the outer side (the side farther from the optical axis) of the protrusion 521a is the outer side of the bending portion 64a. It is configured to be longer than the distance (P3-P4) between the point P3 (the side far from the optical axis) and the surface P4 on the inner side (the side close to the optical axis) of the front case 3.
  • the protrusion part 521b and the fitting part 61b are also the same structure.
  • the imaging apparatus even if the bending portions 64a and 64b are expanded to the outside (direction away from the optical axis) to the maximum to be in contact with the front case 3 by the above configuration. Since only the distance of P3-P4 shorter than P1-P2 is moved, the connection between the protrusion 521a or 521b and the fitting parts 61a and 61b can not be released. This can prevent the second substrate 52 from falling off the shield plate 6.
  • the shield plate 6 need not necessarily have the bent portions 64a and 64b, and the distance between the outer point of the front end of the shield plate 6 in the optical axis direction and the inner surface P4 of the front case 3 is simply the shield plate. It may be configured to be shorter than the point P1 inside 6 and the point P3 outside the protrusion 521a. Even with such a configuration, as in the above, the effect of making the second substrate 52 less likely to come off the shield plate 6 can be obtained.
  • the shield plate 6 has a configuration in which the distance between the shield plate 6 and the front case 3 is shortened, for example, by providing a curved portion that curves outward and a protruding portion that protrudes outside in the vicinity of the front end in the optical axis direction. You may have it.
  • the range in which the end portion of the shield plate 6 spreads can be narrowed, and the second substrate 52 can be configured so as not to easily come off the shield plate 6.
  • the end of the shield plate 6 may be configured to overlap with the rear case 7. Even in this case, similarly to the above, the configuration can be made in which the second substrate 52 is prevented from dropping out of the shield plate 6.
  • the rear end of the bent portions 64a and 64b which are the end portions in the opening direction of the shield plate 6, is positioned so as to overlap the front case 3 in a plane perpendicular to the optical axis direction. It has a shape projecting from the side toward the front side. As a result, when the bent portions 64a and 64b extend outward, the end portion is easily in contact with the front case 3, so that the second substrate 52 can be reliably prevented from falling off.
  • Embodiment 3 a third embodiment of the present invention will be described with reference to FIG.
  • the imaging device of the present embodiment differs from the imaging device of the second embodiment in the shapes of the protrusions 521 a and 521 b of the second substrate 52.
  • the description of the same configuration as in the first embodiment and the second embodiment will be omitted, and only the characteristic parts different from the first embodiment and the second embodiment will be described.
  • FIG. 13 is a cross-sectional view of the imaging device at a position CC in FIG.
  • the protrusions 521 a and 521 b of the second substrate 52 of the present embodiment protrude at an obtuse angle with respect to the edge of the second substrate 52.
  • the end portions of the protrusions 521 a and 521 b on the front side in the optical axis direction and in contact with the fitting portions 61 a and 61 b have an inclination. That is, the notch-shaped portion formed by the edge of the second substrate 52 and the protrusions 521a and 521b has an acute angle.
  • the protrusions 521 a and 521 b of the second substrate 52 preferably protrude with an angle of 95 degrees or more with respect to the edge of the second substrate 52.
  • the protrusions 521a and 521b are preferably formed to have an angle of 5 degrees or more with respect to a plane perpendicular to the optical axis.
  • the protrusions 521 a and 521 b of the second substrate 52 are configured to protrude at an angle of 105 degrees or more with respect to the edge of the second substrate 52. According to this configuration, a certain amount of stress or more can be more easily generated between the shield plate 6 and the second substrate 52, so that the second substrate 52 can be further removed from the shield plate 6. It can be effectively suppressed.
  • the plate spring portions 62 and 63 in the above embodiments are configured to apply biasing forces in directions perpendicular to each other with respect to the second substrate 52, the configurations are not necessarily configured to apply biasing forces in directions perpendicular to each other. It is also possible to obtain a certain effect even when the biasing force is applied from different directions.
  • the configuration including the two rigid substrates of the first substrate 51 and the second substrate 52 has been described, but a configuration including an additional rigid substrate may be adopted.
  • the imaging device can be further miniaturized by arranging the additional substrate at a predetermined angle (for example, perpendicular) with respect to the first substrate 51 similarly to the second substrate 52. Even if the additional substrate is arranged horizontally to the first substrate 51, a certain effect can be obtained.
  • the present invention is suitably used as an on-vehicle imaging device or the like.

Abstract

This imaging device is provided with: an imaging unit which images a subject; a first substrate having the imaging unit mounted thereto; a second substrate having, mounted thereto, an electronic component which is electrically connected to the first substrate; and a lens barrel which holds a lens. The imaging device has a configuration in which the second substrate is disposed at a prescribed angle with respect to the first substrate. Accordingly, a relatively small imaging device can be configured which has a shortened length in the optical axis direction in comparison to a configuration in which the first substrate and the second substrate are disposed horizontally along the optical axis.

Description

撮像装置Imaging device
　本発明の一態様は、撮像装置等に関する。 One embodiment of the present invention relates to an imaging device and the like.
　従来から、レンズを保持するレンズ鏡筒と、撮像素子が搭載された基板とがケースに収容された撮像装置が広く採用されているが、近年、装置の小型化に対する要求が高くなっている。このような撮像装置では、小型化に伴って光軸に垂直な方向の面積が小さくなったことなどから、撮像素子を搭載する基板上の電子部品の集積率を高めたり、撮像素子と搭載する基板と電子部品を搭載する基板を別の基板にしたりする構成が採用されることがある。例えば、特許文献１には、撮像素子を搭載した面の裏面に回路チップを実装した構成の撮像装置が開示されている。特許文献２には、撮像素子が設けられた第１基板と、電子部品等が実装された第２基板及び第３基板とを備える撮像装置が開示されている。 Conventionally, an imaging apparatus in which a lens barrel for holding a lens and a substrate on which an imaging element is mounted has been widely adopted in a case, but in recent years, the demand for downsizing of the apparatus has increased. In such an imaging device, since the area in the direction perpendicular to the optical axis becomes smaller along with the miniaturization, the integration ratio of electronic components on the substrate on which the imaging device is mounted is increased, or the imaging device is mounted with the imaging device. A configuration may be adopted in which a substrate on which a substrate and an electronic component are mounted is used as another substrate. For example, Patent Document 1 discloses an imaging device having a configuration in which a circuit chip is mounted on the back surface of the surface on which the imaging element is mounted. Patent Document 2 discloses an imaging device provided with a first substrate provided with an imaging element, and a second substrate and a third substrate on which electronic components and the like are mounted.
特開２０１１－２５９１０１号公報JP 2011-259101 A 特開２０１１－１６４４６１号公報JP, 2011-144461, A
　しかしながら、近年普及しつつある車載カメラでは搭載される空間が限定されるため、従来よりもさらに小型化に対する要求が高くなっている。また、車載カメラ以外の撮像装置においても同様に、小型化に対する要求がある。これらの小型化に対する要求に対し、上記特許文献に記載されたような構成では十分に対応できない場合があった。また、小型の撮像装置では、小さな部品の組立が容易ではなく、組立容易な構成が求められている。 However, in-vehicle cameras, which are becoming widespread in recent years, are limited in space to be mounted, and therefore, the demand for further downsizing has become higher than ever. In addition, in imaging devices other than in-vehicle cameras, there is also a demand for downsizing. There has been a case where the configuration as described in the above-mentioned patent documents can not sufficiently cope with these demands for miniaturization. In addition, in a small-sized imaging apparatus, assembly of small parts is not easy, and a configuration easy to assemble is required.
　本発明は、上記の課題などを解決するために次のような手段を採る。なお、以下の説明において、発明の理解を容易にするために図面中の符号等を括弧書きで付記するが、本発明の各構成要素はこれらの付記したものに限定されるものではなく、当業者が技術的に理解しうる範囲にまで広く解釈されるべきものである。 The present invention adopts the following means in order to solve the above-mentioned problems and the like. In the following description, in order to facilitate understanding of the invention, reference numerals and the like in the drawings are appended in parentheses, but each component of the present invention is not limited to the appended ones. It should be interpreted broadly to the extent that the vendor can understand technically.
　本発明の一の手段は、
　被写体を撮像する撮像部（５１１）と、
　前記撮像部を搭載する第１基板（５１）と、
　前記第１基板と電気的に接続された電子部品を搭載する第２基板（５２）と、
　レンズを保持するレンズ鏡筒（１）と、を備え、
　前記第２基板（５２）は、前記第１基板（５１）に対して所定の角度を持って配置されている、
　撮像装置である。 One means of the present invention is
An imaging unit (511) for imaging a subject;
A first substrate (51) on which the imaging unit is mounted;
A second substrate (52) for mounting an electronic component electrically connected to the first substrate;
A lens barrel (1) for holding a lens;
The second substrate (52) is disposed at a predetermined angle with respect to the first substrate (51).
It is an imaging device.
　上記構成の撮像装置では、第１基板に対して第２基板が所定の角度を持って配置されているため、第１基板と第２基板とを平行に配置する従来の構成と比較して、厚さ方向（光軸方向）の長さを短く（小さく）することができる。 In the imaging device having the above configuration, since the second substrate is disposed at a predetermined angle with respect to the first substrate, compared to the conventional configuration in which the first substrate and the second substrate are disposed in parallel, The length in the thickness direction (optical axis direction) can be shortened (reduced).
　上記撮像装置において、好ましくは、
　前記第１基板（５１）は、光軸に垂直に配置され、
　前記第２基板（５２）は、光軸に対して４５度以下の角度をもって配置されている。 In the above imaging apparatus, preferably
The first substrate 51 is disposed perpendicular to the optical axis,
The second substrate (52) is disposed at an angle of 45 degrees or less with respect to the optical axis.
　上記構成の撮像装置によれば、例えば、第１基板と第２基板とが重なる領域をある程度小さくすることができるため、第１基板の光軸方向後方に、第１基板と外部機器とを連結するコネクタなどの構成を配置することができる。すなわち、設計自由度を高めた構成とすることができる。 According to the imaging device having the above configuration, for example, the overlapping area of the first substrate and the second substrate can be reduced to a certain extent, so that the first substrate and the external device are connected behind the first substrate in the optical axis direction. The connector and other components can be arranged. That is, the design can be made to have a high degree of freedom in design.
　上記撮像装置において、好ましくは、
　前記第１基板及び前記第２基板を囲んで配置された、金属で形成されたシールド板（６）をさらに備える。 In the above imaging apparatus, preferably
It further comprises a shield plate (6) formed of metal, which is disposed around the first substrate and the second substrate.
　上記構成の撮像装置によれば、シールド板によって第１基板及び第２基板から電磁ノイズ等が外部に放出されることを抑制することなどが可能となる。 According to the imaging device of the above configuration, it is possible to suppress emission of electromagnetic noise and the like from the first substrate and the second substrate to the outside by the shield plate.
　上記撮像装置において、好ましくは、
　前記第２基板（５２）は、突起部（５２１ａ、５２１ｂ）を有しており、
　前記シールド板（６）は、前記突起部に嵌合する嵌合部（６１ａ、６１ｂ）を有する。 In the above imaging apparatus, preferably
The second substrate (52) has protrusions (521a, 521b),
The shield plate (6) has fitting portions (61a, 61b) fitted to the protrusions.
　上記構成の撮像装置によれば、突起部と嵌合部とが嵌合することで第２基板とシールド板との位置を固定する構成とすることができる。これにより、従来のように接着剤を用いる構成と比較して、組み立てやすく、組み立てた後のリペアも行いやすい構成とすることができる。 According to the imaging device of the above configuration, the position of the second substrate and the shield plate can be fixed by fitting the protrusion and the fitting portion. Thereby, compared with the structure which uses an adhesive agent conventionally, it can be set as the structure which is easy to also perform the repair after assembling.
　上記撮像装置において、好ましくは、
　前記シールド板は、前記第２基板を所定の方向に付勢する第１付勢部（６２または６３）を有している。 In the above imaging apparatus, preferably
The shield plate has a first biasing portion (62 or 63) for biasing the second substrate in a predetermined direction.
　上記構成の撮像装置によれば、第１付勢部によって第２基板が所定方向に付勢されながら固定された構成にすることができ、これによって第２基板を安定的に保持する構成とすることができる。 According to the imaging apparatus having the above configuration, the second substrate can be fixed while being biased in the predetermined direction by the first biasing unit, whereby the second substrate can be stably held. be able to.
　上記撮像装置において、好ましくは、
　前記第１付勢部は、前記シールド板に形成された板ばねである。 In the above imaging apparatus, preferably
The first biasing portion is a plate spring formed on the shield plate.
　上記構成の撮像装置によれば、比較的簡易な構成で、第２基板を安定的に保持する構成とすることができる。 According to the imaging device of the above configuration, the second substrate can be stably held with a relatively simple configuration.
　上記撮像装置において、好ましくは、
　前記シールド板は、前記第２基板を前記所定の方向と直交する方向へ付勢する第２付勢部（６３または６２）を有している。 In the above imaging apparatus, preferably
The shield plate has a second biasing portion (63 or 62) for biasing the second substrate in a direction orthogonal to the predetermined direction.
　上記構成の撮像装置によれば、第２基板が２方向に付勢されながら固定された構成にすることができ、これによって第２基板をさらに安定的に保持する構成とすることができる。 According to the imaging device of the above configuration, the second substrate can be fixed while being biased in two directions, and thereby the second substrate can be more stably held.
　上記撮像装置において、好ましくは、
　前記第２付勢部は、前記シールド板に形成された板ばね（６２、６３）である。 In the above imaging apparatus, preferably
The second biasing portion is a plate spring (62, 63) formed on the shield plate.
　上記構成の撮像装置によれば、比較的簡易な構成で、第２基板をさらに安定的に保持する構成とすることができる。 According to the imaging device of the above configuration, the second substrate can be more stably held with a relatively simple configuration.
　上記撮像装置において、好ましくは、
　前記第１付勢部（６２または６３）は、前記第２基板の接地電位に電気的に接続されている。 In the above imaging apparatus, preferably
The first biasing portion (62 or 63) is electrically connected to the ground potential of the second substrate.
　上記構成の撮像装置によれば、シールド板による電磁ノイズの遮蔽効果をさらに高めた構成とすることができる。また、第１基板及び第２基板の接地電位を強化し、よりノイズに強い回路構成にすることができる。 According to the imaging device having the above configuration, the shielding effect of the electromagnetic noise by the shield plate can be further enhanced. In addition, the ground potentials of the first substrate and the second substrate can be strengthened to provide a circuit configuration that is more resistant to noise.
　上記撮像装置において、好ましくは、
　前記第１基板は、光軸方向後方に突出し、他の構成と電気的に接続されるコネクタ（５１２）を有しており、
　前記第２基板は、光軸方向の平面視において、前記コネクタと重ならないよう配置されている。 In the above imaging apparatus, preferably
The first substrate has a connector (512) that protrudes rearward in the optical axis direction and is electrically connected to another configuration.
The second substrate is disposed so as not to overlap the connector in plan view in the optical axis direction.
　上記構成の撮像装置によれば、第２基板とコネクタとの位置が互いに干渉しない位置となり、撮像装置の光軸方向の長さ（厚み）をさらに小さくしやすい構成にすることができる。 According to the imaging device of the above configuration, the positions of the second substrate and the connector do not interfere with each other, and the length (thickness) of the imaging device in the optical axis direction can be easily reduced.
　また、本発明の他の手段は、
　被写体を撮像する撮像部（５１１）と、
　前記撮像部を搭載する第１基板（５１）と、
　前記第１基板と電気的に接続された電子部品を搭載する第２基板（５２）と、
　レンズを保持するレンズ鏡筒（１）と、を備え、
　前記第１基板は、光軸方向後方に突出し、他の構成と電気的に接続されるコネクタ（５１２）を有しており、
　前記第２基板は、光軸方向の平面視において、前記コネクタと重ならないよう配置されている、
　撮像装置である。 Also, another means of the present invention is
An imaging unit (511) for imaging a subject;
A first substrate (51) on which the imaging unit is mounted;
A second substrate (52) for mounting an electronic component electrically connected to the first substrate;
A lens barrel (1) for holding a lens;
The first substrate has a connector (512) that protrudes rearward in the optical axis direction and is electrically connected to another configuration.
The second substrate is disposed so as not to overlap the connector in plan view in the optical axis direction.
It is an imaging device.
　上記構成の撮像装置によれば、第２基板とコネクタとの位置が互いに干渉しない位置となり、撮像装置の光軸方向の長さ（厚み）を小さくしやすい構成にすることができる。 According to the imaging device of the above configuration, the positions of the second substrate and the connector do not interfere with each other, and the length (thickness) of the imaging device in the optical axis direction can be easily reduced.
　本発明の他の手段は、
　被写体を撮像する撮像部（５１１）と、
　前記撮像部を搭載する第１基板（５１）と、
　前記第１基板に対して所定の角度を有して配置され、前記第１基板と電気的に接続された電子部品を搭載する第２基板（５２）と、
　レンズを保持するレンズ鏡筒（１）と、
　前記第１基板及び前記第２基板を囲んで配置された、金属で形成されたシールド板（６）と、
　前記第１基板、前記第２基板、前記レンズ鏡筒、及び前記シールド板を収容するケース（３、７）と、を備え、
　前記第２基板は突起部（５２１ａ、５２１ｂ）を有しており、
　前記シールド板は、前記突起部と嵌合する嵌合部（６１ａ、６１ｂ）を有しており、
　前記突起部（５２１ａ、５２１ｂ）が前記嵌合部（６１ａ、６１ｂ）と嵌合した際に前記突起部が前記嵌合部から突出する長さは、前記シールド板と前記ケースとの距離よりも長い、
　撮像装置である。 Another means of the invention is
An imaging unit (511) for imaging a subject;
A first substrate (51) on which the imaging unit is mounted;
A second substrate (52) which is disposed at a predetermined angle with respect to the first substrate and on which an electronic component electrically connected to the first substrate is mounted;
A lens barrel (1) holding a lens;
A shield plate (6) formed of metal, disposed around the first substrate and the second substrate;
And a case (3, 7) for housing the first substrate, the second substrate, the lens barrel, and the shield plate,
The second substrate has protrusions (521a, 521b),
The shield plate has a fitting portion (61a, 61b) to be fitted with the protrusion,
When the protrusions (521a, 521b) engage with the fitting portions (61a, 61b), the length by which the protrusions protrude from the fitting portion is greater than the distance between the shield plate and the case long,
It is an imaging device.
　上記構成の撮像装置によれば、シールド板が外側に最大限に広がってケースに接触する状態になったとしても、突起部と嵌合部との連結状態が解除されない構成にすることができる。これによって、第２基板がシールド板から脱落してしまうことをより確実に防止することができる。 According to the imaging device of the above configuration, even when the shield plate is expanded to the outside to the maximum and comes into contact with the case, the connection between the protrusion and the fitting portion can not be released. This can more reliably prevent the second substrate from falling off the shield plate.
　上記撮像装置において、好ましくは、
　前記シールド板は、前記第２基板を開口方向から挿入可能であり、前記開口方向の端部には外側に向かって屈曲した屈曲部（６４ａ、６４ｂ）を有している。 In the above imaging apparatus, preferably
The shield plate is capable of inserting the second substrate from the opening direction, and has at the end in the opening direction a bent portion (64a, 64b) bent outward.
　上記構成の撮像装置によれば、屈曲部を有する構成としたことにより、シールド板の開放方向から第２基板を挿入しやすい構成にすることができ、組立容易な構成とすることができる。また、屈曲部が外側に屈曲しているため、シールド板の一部である屈曲部がケースに近接した構成となり、シールド板の開放方向の端部が必要以上に外側に広がることを抑制することができ、第２基板が脱落してしまうことを抑制することができる。 According to the imaging device having the above configuration, by providing the bent portion, the second substrate can be easily inserted from the opening direction of the shield plate, and the assembly can be easily configured. In addition, since the bent portion is bent outward, the bent portion which is a part of the shield plate is configured to be close to the case, and the end in the opening direction of the shield plate is prevented from spreading outward more than necessary. It is possible to prevent the second substrate from falling off.
　上記撮像装置において、好ましくは、
　前記ケースは、フロントケースと、前記フロントケースよりも光軸方向後方に配置されたリアケースとを含み、
　前記シールド板の開口方向の端部は、光軸方向に水平な面において前記フロントケースと重なる。 In the above imaging apparatus, preferably
The case includes a front case and a rear case disposed rearward in the optical axis direction with respect to the front case.
The end in the opening direction of the shield plate overlaps the front case in a plane horizontal to the optical axis direction.
　上記構成の撮像装置によれば、シールド板の開口方向の端部が外側に広がったときに、当該端部がフロントケースに接しやすい状態となるため、さらに確実に第２基板の脱落を防止することができる。 According to the imaging device of the above configuration, when the end in the opening direction of the shield plate spreads outward, the end is likely to be in contact with the front case, so that the second substrate is prevented from falling off more reliably. be able to.
　上記撮像装置において、好ましくは、
　前記突起部は、前記第２基板の縁部に対して鈍角を有して突出している。 In the above imaging apparatus, preferably
The protrusion protrudes at an obtuse angle with respect to the edge of the second substrate.
　上記構成の撮像装置によれば、第２基板に対して、シールド板の内側に向かう応力が発生する構成とすることができるため、シールド板から第２基板が脱落することをより効果的に抑制することができる。 According to the imaging device of the above configuration, since stress directed to the inside of the shield plate can be generated with respect to the second substrate, it is possible to more effectively suppress the second substrate from falling off the shield plate. can do.
　上記撮像装置において、好ましくは、
　前記突起部は、前記第２基板の縁部に対して９５度以上の角度を有して突出している。 In the above imaging apparatus, preferably
The protrusion protrudes at an angle of 95 degrees or more with respect to the edge of the second substrate.
　上記構成の撮像装置によれば、第２基板とシールド板との間に一定以上の応力が発生しやすい構成とすることができるため、シールド板から第２基板が脱落することをさらに効果的に抑制することができる。より好ましくは、前記突起部が、前記第２基板の縁部に対して１０５度以上の角度を有して突出した構成とする。 According to the imaging device of the above configuration, a stress of a certain level or more can be easily generated between the second substrate and the shield plate, so that the second substrate can be further effectively removed from the shield plate. It can be suppressed. More preferably, the projection projects at an angle of 105 degrees or more with respect to the edge of the second substrate.
図１は、実施形態１の撮像装置をフロント側から見た外観斜視図である。FIG. 1 is an external perspective view of the imaging device of Embodiment 1 as viewed from the front side. 図２は、実施形態１の撮像装置をリア側から見た外観斜視図である。FIG. 2 is an external perspective view of the imaging device of Embodiment 1 as viewed from the rear side. 図３は、実施形態１の撮像装置をフロント側から見た分解斜視図である。FIG. 3 is an exploded perspective view of the imaging device of the first embodiment as viewed from the front side. 図４は、実施形態１の撮像装置をリア側から見た分解斜視図である。FIG. 4 is an exploded perspective view of the imaging device of the first embodiment as viewed from the rear side. 図５は、フレキシブル基板５３が見える位置での実施形態１の撮像装置の断面図である。FIG. 5 is a cross-sectional view of the imaging device of Embodiment 1 at a position where the flexible substrate 53 can be seen. 図６は、板ばね部６３が見える位置での実施形態１の撮像装置の断面図である。FIG. 6 is a cross-sectional view of the imaging device of Embodiment 1 at a position where the plate spring portion 63 can be seen. 図７は、実施形態１の撮像装置においてリアケース７、シールド板６、及び第２基板５２を連結させた状態をリア側から見た分解斜視図である。FIG. 7 is an exploded perspective view of a state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected in the imaging device of Embodiment 1 as viewed from the rear side. 図８は、実施形態２の撮像装置をフロント側から見た分解斜視図である。FIG. 8 is an exploded perspective view of the imaging device of Embodiment 2 as viewed from the front side. 図９は、実施形態２の撮像装置をリア側から見た分解斜視図である。FIG. 9 is an exploded perspective view of the imaging device of Embodiment 2 as viewed from the rear side. 図１０は、実施形態２の撮像装置においてリアケース７、シールド板６、及び第２基板５２を連結させた状態をリア側から見た分解斜視図である。FIG. 10 is an exploded perspective view of a state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected in the imaging device of Embodiment 2 as viewed from the rear side. 図１１は、実施形態２の撮像装置をフロント側から見た平面図である。FIG. 11 is a plan view of the imaging device of Embodiment 2 as viewed from the front side. 図１２は、実施形態２の撮像装置において、図１１のＣ－Ｃの位置における断面図である。FIG. 12 is a cross-sectional view at a position CC in FIG. 11 in the imaging device of the second embodiment. 図１３は、実施形態３の撮像装置において、図１１のＣ－Ｃの位置における断面図である。FIG. 13 is a cross-sectional view at a position CC in FIG. 11 in the imaging device of the third embodiment.
　本発明の撮像装置は、第１基板に対して第２基板が平行ではなく、所定の角度を持って配置されている点を特徴のひとつとしている。また、本発明の別の特徴は、第１基板及び第２基板を囲んで配置されたシールド板から第２基板が脱落しづらい構成としている点である。 The imaging device of the present invention is characterized in that the second substrate is not parallel to the first substrate but is disposed at a predetermined angle. Further, another feature of the present invention is that the second substrate is unlikely to come off from the shield plate disposed so as to surround the first substrate and the second substrate.
　なお、本明細書では、レンズの中心位置であって、撮像素子に入射する光の中心位置を「光軸」と称する。レンズに対して撮像素子とは反対側に位置する撮像対象を「被写体」と称する。撮像素子に対して被写体が位置する方向を「フロント側」または「光軸方向前方」と称し、被写体に対して撮像素子が位置する方向を「リア側」または「光軸方向後方」と称する。 In the present specification, the center position of the lens and the center position of the light incident on the imaging device is referred to as an “optical axis”. An imaging target located on the opposite side to the imaging element with respect to the lens is referred to as a "subject". The direction in which the subject is positioned with respect to the imaging device is referred to as “front side” or “forward in the optical axis direction”, and the direction in which the imaging device is positioned relative to the subject is referred to as “rear side” or “rear in the optical axis direction”.
　本発明に係る実施形態について、以下の構成に従って説明する。ただし、以下で説明する実施形態はあくまで本発明の一例にすぎず、本発明の技術的範囲を限定的に解釈させるものではない。なお、各図面において、同一の構成要素には同一の符号を付しており、その説明を省略する場合がある。
　１．実施形態１
　２．実施形態２
　３．実施形態３
　４．補足事項 Embodiments according to the present invention will be described according to the following configuration. However, the embodiments described below are merely examples of the present invention, and the technical scope of the present invention is not to be interpreted in a limited manner. In the drawings, the same components are denoted by the same reference numerals, and the description thereof may be omitted.
1. Embodiment 1
2. Embodiment 2
3. Embodiment 3
4. Supplementary items
　＜１．実施形態１＞
　本発明の実施形態１について、図１～図７を参照しながら説明する。図１及び図２は撮像装置の外観図であって、図１はフロント側、図２はリア側から見た図である。図３及び図４は撮像装置の分解斜視図であって、図３はフロント側、図４はリア側から見た図である。図５及び図６は撮像装置の断面図であって、図５はフレキシブル基板５３が見える位置における断面図、図６は板ばね部６３が見える位置での断面図である。図７は、リアケース７、シールド板６、及び第２基板５２を連結させた状態をリア側から見た分解斜視図である。 <1. Embodiment 1>
Embodiment 1 of the present invention will be described with reference to FIGS. 1 to 7. 1 and 2 are external views of the imaging apparatus, and FIG. 1 is a front side, and FIG. 2 is a rear view. 3 and 4 are exploded perspective views of the imaging apparatus, and FIG. 3 is a front side, and FIG. 4 is a rear view. 5 and 6 are cross-sectional views of the imaging device, FIG. 5 is a cross-sectional view at a position where the flexible substrate 53 can be seen, and FIG. 6 is a cross-sectional view at a position where the plate spring portion 63 is visible. FIG. 7 is an exploded perspective view of the state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected as viewed from the rear side.
　図示されるように、本実施形態の撮像装置は、レンズ鏡筒１、防水シール２、フロントケース３、防水シール４、第１基板５１、第２基板５２、シールド板６、及びリアケース７を含んで構成される。 As illustrated, the imaging device of the present embodiment includes the lens barrel 1, the waterproof seal 2, the front case 3, the waterproof seal 4, the first substrate 51, the second substrate 52, the shield plate 6, and the rear case 7. It comprises.
　　＜フロントケース３＞
　フロントケース３は、リアケース７と共に撮像装置の筐体（ケース）を形成する部材であって、樹脂または金属などで形成される。フロントケース３は、光軸方向前方に、光軸を中心とする開口部を有し、光軸方向後方はリアケース７と連結可能に開放されており、光軸を覆うように略矩形状の周面を有している。フロントケース３とリアケース７とが連結されることで、レンズ鏡筒１、第１基板５１、第２基板５２、及びシールド板６などを収容する内部空間が形成される。図１に示されるように、フロントケース３の光軸方向前方の開口部には、レンズ鏡筒１により保持されたレンズ１ａが位置する。 <Front case 3>
The front case 3 is a member that forms a case (case) of the imaging device together with the rear case 7 and is formed of resin, metal, or the like. The front case 3 has an opening at the front in the optical axis direction centered on the optical axis, and the rear in the optical axis direction is openably connected to the rear case 7 and has a substantially rectangular shape so as to cover the optical axis. It has a circumferential surface. By connecting the front case 3 and the rear case 7, an internal space for housing the lens barrel 1, the first substrate 51, the second substrate 52, the shield plate 6 and the like is formed. As shown in FIG. 1, the lens 1 a held by the lens barrel 1 is positioned at an opening on the front side of the front case 3 in the optical axis direction.
　　＜リアケース７＞
　リアケース７は、上記のように、フロントケース３と連結されることで、レンズ鏡筒１、第１基板５１、第２基板５２、及びシールド板６などを収容する空間を形成する。リアケース７は、シールド板６に沿った形状をしており、光軸方向後方に光軸に対して略垂直な面を有し、この面から光軸方向前方に向かって光軸を覆うように突出した略矩形状の周面を有している。また、リアケース７は、この面から光軸方向後方に向かってシールド板６の形状に沿って突出している。リアケース７の光軸方向前方は、フロントケース３の光軸方向後方と略同形状であり、組立状態では、連結ねじ８５及び８６によって連結される。リアケース７とフロントケース３との間には、防止シール４が配置される。リアケース７は、光軸方向後方に、第１基板５１のコネクタ５１２を外部機器と連結するためのコネクタ部７４を有する。 <Rear case 7>
The rear case 7 is connected to the front case 3 as described above to form a space for housing the lens barrel 1, the first substrate 51, the second substrate 52, the shield plate 6 and the like. The rear case 7 has a shape along the shield plate 6, has a surface substantially perpendicular to the optical axis at the rear in the optical axis direction, and covers the optical axis in the optical axis direction from this surface. And has a substantially rectangular peripheral surface protruding from the In addition, the rear case 7 projects from the surface toward the rear in the optical axis direction along the shape of the shield plate 6. The front of the rear case 7 in the optical axis direction has substantially the same shape as the rear of the front case 3 in the optical axis direction, and in the assembled state, they are connected by connection screws 85 and 86. A prevention seal 4 is disposed between the rear case 7 and the front case 3. The rear case 7 has a connector portion 74 at the rear in the optical axis direction for connecting the connector 512 of the first substrate 51 to an external device.
　リアケース７は、図７に示されるように、光軸方向後方に延びる基板ガイド部７１及び７２を有する。基板ガイド部７１及び７２の間には、第２基板５２の厚さよりやや厚みを持った溝が形成されている。基板ガイド部７１は、光軸方向前方であって、第２基板５２が挿入される側の角部に切欠を有しており、これによって第２基板５２が、基板ガイド部７１と７２との間に挿入されやすくなっている。組立状態では、この基板ガイド部７１及び７２の間に第２基板５２が配置される。また、リアケース７は、光軸方向後方に延びる突出部７３を有している。組立状態では、突出部７３と、シールド板６の板ばね部６３とによって、第２基板５２が保持される。 The rear case 7 has substrate guide portions 71 and 72 extending rearward in the optical axis direction, as shown in FIG. A groove slightly thicker than the thickness of the second substrate 52 is formed between the substrate guides 71 and 72. The substrate guide portion 71 has a notch at a corner on the front side in the optical axis direction and into which the second substrate 52 is inserted, whereby the second substrate 52 is a portion of the substrate guide portions 71 and 72. It is easy to be inserted between. In the assembled state, the second substrate 52 is disposed between the substrate guides 71 and 72. The rear case 7 also has a projecting portion 73 extending rearward in the optical axis direction. In the assembled state, the second substrate 52 is held by the projecting portion 73 and the plate spring portion 63 of the shield plate 6.
　　＜レンズ鏡筒１＞
　レンズ鏡筒１は、レンズ１ａを含む１以上の光学部材を保持し、光軸方向に伸びる円筒状の部材である。レンズ鏡筒１に保持される光学部材には、レンズ１ａの他に、レンズ、スペーサ、口径板、及び光学フィルタなどが含まれる。レンズ１ａを含むレンズは、ガラスまたはプラスチック等の透過性を有する素材で形成され、光軸方向前方からの光を屈折させながら光軸方向後方に透過させる。スペーサは、光軸方向に適度な厚みを有する板状で円環状の部材であり、各レンズの光軸方向の位置を調整する。スペーサは、光軸を含む中心部に開口部を有する。口径板は、通過する光の最外位置を決める。光学フィルタは、所定の波長の光を抑制または遮蔽する。光学フィルタは、例えば、通過する赤外線を抑制する赤外線カットフィルタなどが含まれる。これらの光学部材の数は、任意に変更可能である。 <Lens barrel 1>
The lens barrel 1 is a cylindrical member that holds one or more optical members including the lens 1 a and extends in the optical axis direction. The optical member held by the lens barrel 1 includes, in addition to the lens 1a, a lens, a spacer, an aperture plate, an optical filter, and the like. The lens including the lens 1 a is formed of a transparent material such as glass or plastic, and transmits light from the front in the optical axis direction to the rear in the optical axis direction while refracting light from the front. The spacer is a plate-like, annular member having an appropriate thickness in the optical axis direction, and adjusts the position of each lens in the optical axis direction. The spacer has an opening at the center including the optical axis. The aperture plate determines the outermost position of the passing light. An optical filter suppresses or blocks light of a predetermined wavelength. The optical filter includes, for example, an infrared cut filter that suppresses infrared light passing therethrough. The number of these optical members can be arbitrarily changed.
　　＜防水シール２＞
　防水シール２は、ゴムなどの弾性部材により形成された円環状の部材であって、フロントケース３とレンズ鏡筒１との間に配置されることで、フロントケース３とレンズ鏡筒１とを隙間無く連結させるよう作用する。防水シール２は、フロントケース３の開口部の外縁の位置に沿った円環状となっている。 <Waterproof seal 2>
The waterproof seal 2 is an annular member formed of an elastic member such as rubber, and is disposed between the front case 3 and the lens barrel 1 so that the front case 3 and the lens barrel 1 can be separated. Acts to connect without gaps. The waterproof seal 2 has an annular shape along the position of the outer edge of the opening of the front case 3.
　　＜防水シール４＞
　防水シール４は、ゴムなどの弾性部材により形成された矩形状の部材であって、フロントケース３とリアケース７との間に配置されることで、フロントケース３とリアケース７とを隙間無く連結させるよう作用する。防水シール４は、フロントケース３の光軸方向後方の矩形状の開放部分、及びリアケース７の光軸方向前方の矩形状の開放部分に沿った矩形状に形成される。 <Waterproof seal 4>
The waterproof seal 4 is a rectangular member formed of an elastic member such as rubber, and is disposed between the front case 3 and the rear case 7 so that the front case 3 and the rear case 7 do not have a gap. Act to connect. The waterproof seal 4 is formed in a rectangular shape along a rectangular open portion on the rear side in the optical axis direction of the front case 3 and a rectangular open portion on the front side in the optical axis direction of the rear case 7.
　なお、フロントケース３の光軸方向後方の開放部分、リアケース７の光軸方向前方の開放部分、及び防水シール４の形状は矩形状に限定されるものではなく、円状であっても良いし多角形状などであっても良い。 The shape of the open portion at the rear of the front case 3 in the optical axis direction, the open portion at the front of the rear case 7 in the optical axis direction, and the waterproof seal 4 is not limited to rectangular but may be circular. It may be polygonal or the like.
　　＜第１基板５１＞
　第１基板５１は、撮像素子５１１が搭載されたリジッド基板である。第１基板５１には、撮像素子５１１以外の電子部品が搭載されても良い。第１基板５１の光軸方向後方の面には、コネクタ５１２が搭載される。第１基板５１の光軸方向前方の面には撮像素子５１１が搭載されているため、撮像時に撮像素子５１１に光が照射されるよう、第１基板５１は光軸に垂直な平面に沿って配置される。図５に示されるように、第１基板５１にはフレキシブル基板５３が接続されており、このフレキシブル基板５３を介して第１基板５１が第２基板５２と電気的に接続される。撮像素子５１１により取得された電気信号は、第１基板５１及び第２基板５２に搭載された電子部品により所定の電気処理または信号処理が施された後、コネクタ５１２からリアケース７のコネクタ部７４を介して、撮像装置の外部に画像データとして出力される。第１基板５１は、連結ねじ８１及び８２によって、フロントケース３と連結されて位置固定される。 <First substrate 51>
The first substrate 51 is a rigid substrate on which the imaging device 511 is mounted. Electronic components other than the image sensor 511 may be mounted on the first substrate 51. A connector 512 is mounted on the rear surface of the first substrate 51 in the optical axis direction. Since the imaging device 511 is mounted on the front surface of the first substrate 51 in the optical axis direction, the first substrate 51 is along a plane perpendicular to the optical axis so that light is emitted to the imaging device 511 at the time of imaging. Be placed. As shown in FIG. 5, a flexible substrate 53 is connected to the first substrate 51, and the first substrate 51 is electrically connected to the second substrate 52 via the flexible substrate 53. The electrical signal acquired by the imaging element 511 is subjected to predetermined electrical processing or signal processing by the electronic components mounted on the first substrate 51 and the second substrate 52, and then the connector portion 74 of the rear case 7 from the connector 512. Are output as image data to the outside of the imaging apparatus. The first substrate 51 is connected to the front case 3 by the connection screws 81 and 82 and fixed in position.
　撮像素子５１１は、照射された光を電気信号に変換する光電変換素子であり、例えばＣ－ＭＯＳセンサやＣＣＤなどであるが、これらに限定されるものではない。また、撮像装置においては、撮像素子５１１以外の撮像機能を要する撮像部を採用してもよい。撮像素子は、本発明の「撮像部」の一例である。 The imaging element 511 is a photoelectric conversion element that converts the emitted light into an electric signal, and is, for example, a C-MOS sensor or a CCD, but is not limited thereto. Further, in the imaging device, an imaging unit requiring an imaging function other than the imaging element 511 may be adopted. The imaging device is an example of the “imaging unit” in the present invention.
　　＜第２基板５２＞
　第２基板５２は、電子部品を搭載したリジッド基板である。第２基板５２は、光軸に水平であって、第１基板５１に対して垂直な方向に延びて配置される。第２基板５２がこのように配置されることで、第２基板５２がコネクタ５１２及びコネクタ部７４と干渉しない配置にすることができる。また、第１基板５１と第２基板５２との双方を光軸に垂直に配置する構成と比較して、光軸方向の長さ（厚さ）を短くした構成となっている。 <Second substrate 52>
The second substrate 52 is a rigid substrate on which electronic components are mounted. The second substrate 52 is disposed so as to extend in a direction perpendicular to the first substrate 51 and horizontal to the optical axis. By arranging the second substrate 52 in this manner, the second substrate 52 can be arranged so as not to interfere with the connector 512 and the connector portion 74. Further, the length (thickness) in the optical axis direction is shorter than in the configuration in which both the first substrate 51 and the second substrate 52 are disposed perpendicularly to the optical axis.
　第２基板５２は、光軸に対して外側に向かって外縁部から突出した突起部５２１ａ及び５２１ｂを有している。これらの突起部５２１ａ及び５２１ｂは、組立状態において、それぞれシールド板６に形成された嵌合部６１ａ及び６１ｂに挿入されるよう、嵌合部６１ａ及び６１ｂに対向する位置に形成される。また、第２基板５２は、シールド板６の板ばね部６２から光軸方向前方に向かう付勢力を受け、板ばね部６３から光軸に垂直な方向の付勢力を受ける。第２基板５２の突起部５２１ａ及び５２１ｂは、板ばね部６２から受ける付勢力によって、シールド板６の嵌合部６１ａ及び６１ｂの光軸方向後方の縁部に付勢される。また、第２基板５２は、板ばね部６３から受ける付勢力によって、リアケース７の突出部７３に付勢される。このように第２基板５２は、２方向からの付勢力を受けることで、シールド板６及びリアケース７対して安定的に保持されている。 The second substrate 52 has protrusions 521 a and 521 b that project outward from the outer edge with respect to the optical axis. The protrusions 521a and 521b are formed at positions facing the fitting portions 61a and 61b so as to be inserted into the fitting portions 61a and 61b formed in the shield plate 6 in the assembled state. Further, the second substrate 52 receives an urging force directed forward from the plate spring portion 62 of the shield plate 6 in the optical axis direction, and receives an urging force from the plate spring portion 63 in a direction perpendicular to the optical axis. The protrusions 521 a and 521 b of the second substrate 52 are biased toward the edge in the optical axis direction of the fitting portions 61 a and 61 b of the shield plate 6 by the biasing force received from the plate spring portion 62. Further, the second substrate 52 is biased by the projecting portion 73 of the rear case 7 by the biasing force received from the plate spring portion 63. Thus, the second substrate 52 is stably held to the shield plate 6 and the rear case 7 by receiving the biasing force from the two directions.
　図７に示されるように、第２基板５２は、リアケース７に形成された基板ガイド部７１及び７２の間に挿入されるよう配置される。 As shown in FIG. 7, the second substrate 52 is disposed to be inserted between the substrate guide portions 71 and 72 formed in the rear case 7.
　　＜フレキシブル基板５３＞
　フレキシブル基板（ＦＰＣ）５３は可撓性を有する基板であって、第１基板５１と第２基板５２とを電気的に接続し、互いに信号のやり取りを可能にする。 <Flexible substrate 53>
The flexible substrate (FPC) 53 is a flexible substrate, and electrically connects the first substrate 51 and the second substrate 52 to enable exchange of signals with each other.
　　＜シールド板６＞
　シールド板６は、導電性を有する金属などの板状の部材により形成され、組み立てられた状態で、第１基板５１及び第２基板５２を覆うように配置される。より具体的には、シールド板６は、それぞれ光軸方向前方に開放された、第１基板５１を囲む第１箱状部分と、第２基板５２を囲む第２箱状部分とを有する。組み立ての際には、第１基板５１及び第２基板５２は、光軸方向前方の開放部分から挿入されて組み立てられる。 <Shield plate 6>
The shield plate 6 is formed of a plate-like member made of a conductive metal or the like, and is arranged to cover the first substrate 51 and the second substrate 52 in an assembled state. More specifically, the shield plate 6 has a first box-like portion surrounding the first substrate 51 and a second box-like portion surrounding the second substrate 52, which are respectively opened forward in the optical axis direction. At the time of assembly, the first substrate 51 and the second substrate 52 are inserted and assembled from the open portion in the optical axis direction front.
　シールド板６は、図３～図６に示されるように、嵌合部６１ａ、６１ｂ、板ばね部６２、及び板ばね部６３を有する。嵌合部６１ａ及び６１ｂは、第２基板５２の突起部５２１ａ及び５２１ｂに対向する位置に配置された貫通孔である。組立状態では、嵌合部６１ａには突起部５２１ａが挿入され、嵌合部６１ｂには突起部５２１ｂが挿入され、突起部５２１ａ及び５２１ｂが外側に向かって突出する。 The shield plate 6 has fitting portions 61a and 61b, a plate spring portion 62, and a plate spring portion 63, as shown in FIGS. The fitting portions 61 a and 61 b are through holes disposed at positions facing the protrusions 521 a and 521 b of the second substrate 52. In the assembled state, the protrusion 521a is inserted into the fitting portion 61a, the protrusion 521b is inserted into the fitting portion 61b, and the protrusions 521a and 521b protrude outward.
　板ばね部６２は、シールド板６の光軸方向後方の面に形成され、図５及び図６に示されるように、第２基板５２の光軸方向後方の端部を光軸方向前方に向かって付勢する。一方で、シールド板６の嵌合部６１ａ及び６１ｂには第２基板５２の突起部５２１ａ及び５２１ｂが挿入されているため、突起部５２１ａ及び５２１ｂは光軸方向前方の端部で嵌合部６１ａ及び６１ｂの光軸方向後方の端部に押しつけられることで安定的に保持されている。 The plate spring portion 62 is formed on the rear surface of the shield plate 6 in the optical axis direction, and as shown in FIGS. 5 and 6, the rear end of the second substrate 52 in the optical axis direction is directed forward. Turn on. On the other hand, since the protrusions 521a and 521b of the second substrate 52 are inserted into the fitting portions 61a and 61b of the shield plate 6, the protrusions 521a and 521b are the fitting portions 61a at the front end in the optical axis direction. And 61b are stably held by being pressed against the rear end in the optical axis direction.
　板ばね部６３は、シールド板６において第２基板５２を囲む第２箱状部分において、板ばね部６２とは異なる面に形成されており、図６に示すように、板ばね部６２による付勢方向とは垂直な方向に、第２基板５２を付勢する。板ばね部６３は、第２基板５２に形成された接地電位の配線パターンに接触しており、これによってシールド板６の全体が接地電位となっている。 The plate spring portion 63 is formed on a surface different from the plate spring portion 62 in the second box-like portion surrounding the second substrate 52 in the shield plate 6, and as shown in FIG. The second substrate 52 is biased in a direction perpendicular to the biasing direction. The plate spring portion 63 is in contact with the wiring pattern of the ground potential formed on the second substrate 52, whereby the entire shield plate 6 is at the ground potential.
　本実施形態の撮像装置では、このように第１基板５１及び第２基板５２を有する構成において、第１基板５１に対して第２基板５２が略垂直に配置されている。このような構成にすることで、第１基板５１と第２基板５２とを互いに水平に配置する構成と比較して、撮像装置の光軸方向の長さ（厚さ）を短くすることが可能となる。特に、コネクタ部７４と第２基板５２とを互いに干渉しないよう配置することで、より効果的に撮像装置の小型化が可能となる。 In the configuration having the first substrate 51 and the second substrate 52 as described above, in the imaging device of the present embodiment, the second substrate 52 is disposed substantially perpendicularly to the first substrate 51. With such a configuration, the length (thickness) in the optical axis direction of the imaging device can be shortened as compared with the configuration in which the first substrate 51 and the second substrate 52 are arranged horizontally to each other. It becomes. In particular, by arranging the connector 74 and the second substrate 52 so as not to interfere with each other, the imaging device can be more effectively miniaturized.
　上記構成において、第１基板５１に対して第２基板５２は必ずしも垂直に配置される必要はなく、所定の角度を有して配置されれば一定の効果が得られる。例えば、コネクタ部７４の長さが第２基板５２の一辺の長さよりも短い構成であれば、第２基板５２を垂直よりもやや斜めに配置することで、撮像装置をより効果的に小型化することが可能となる。 In the above configuration, the second substrate 52 does not necessarily have to be arranged vertically with respect to the first substrate 51, and certain effects can be obtained if the second substrate 52 is arranged at a predetermined angle. For example, if the length of the connector portion 74 is shorter than the length of one side of the second substrate 52, the imaging device can be more effectively miniaturized by arranging the second substrate 52 slightly diagonally than perpendicular. It is possible to
　第２基板５２は、第１基板５１に対して４５度以下の角度を持って配置することが特に好ましい。このような構成とすることで、第１基板５１と第２基板５２とが重なる領域をある程度小さくすることができるため、第１基板５１の光軸方向後方に、第１基板５１のコネクタ５１２及びコネクタ部７４などを配置しやすくすることができる。すなわち、設計自由度を高めた構成とすることができる。 It is particularly preferable to arrange the second substrate 52 at an angle of 45 degrees or less with respect to the first substrate 51. With such a configuration, the area where the first substrate 51 and the second substrate 52 overlap can be reduced to a certain extent, so the connector 512 of the first substrate 51 and the optical axis direction rear of the first substrate 51 can be reduced. The connector portion 74 and the like can be easily disposed. That is, the design can be made to have a high degree of freedom in design.
　また、本実施形態の撮像装置では、第１基板５１及び第２基板５２を囲んで配置されたシールド板６を有する構成としているため、第１基板５１及び第２基板５２から電磁ノイズ等が外部に放出されることを抑制することなどが可能となる。 Further, in the imaging device according to the present embodiment, since the shield plate 6 is disposed so as to surround the first substrate 51 and the second substrate 52, electromagnetic noise and the like are externally transmitted from the first substrate 51 and the second substrate 52. And the like can be suppressed.
　また、本実施形態の撮像装置では、第２基板５２が突起部５２１ａ及び５２１ｂを有し、シールド板６が嵌合部６１ａ及び６１ｂを有し、これらが互いに嵌合する構成としている。この構成により、第２基板５２とシールド板６との位置を固定する構成とすることができる。これにより、従来のように接着剤を用いる構成と比較して、組み立てやすく、組み立てた後に再度解体して組み立て直すリペア処理も行いやすい構成とすることができる。 Further, in the imaging device of the present embodiment, the second substrate 52 has the protrusions 521a and 521b, and the shield plate 6 has the fitting portions 61a and 61b, which are fitted to each other. With this configuration, the positions of the second substrate 52 and the shield plate 6 can be fixed. As a result, compared to the configuration using an adhesive as in the prior art, it is easy to assemble, and it is possible to easily perform a repair process of reassembling and reassembling after assembling.
　また、本実施形態の撮像装置では、シールド板６の板ばね部６２及び６３によって、第２基板５２が所定方向に付勢されながら構成された構成にすることができ、これによって、第２基板５２を安定的に保持する構成とすることができる。なお、板ばね部６２及び６３は、いずれか一方のみであっても、第２基板５２を安定的に保持する一定の効果が得られる。 Further, in the imaging device of the present embodiment, the second substrate 52 can be configured to be biased in a predetermined direction by the plate spring portions 62 and 63 of the shield plate 6, whereby the second substrate can be configured. 52 can be stably held. Even if only one of the plate spring portions 62 and 63 is used, a certain effect of stably holding the second substrate 52 can be obtained.
　なお、板ばね部６２及び６３は、シールド板６と一体的に形成された板ばねに代えた他の付勢部材であっても良い。ただし、シールド板６と一体的に形成された上記の板ばね部６２及び６３を有する構成とすることで、比較的簡易な構成で、第２基板５２を安定的に保持する構成とすることができる。 The plate spring portions 62 and 63 may be other biasing members instead of a plate spring formed integrally with the shield plate 6. However, by having the above-described plate spring portions 62 and 63 integrally formed with the shield plate 6, the second substrate 52 can be stably held with a relatively simple configuration. it can.
　また、本実施形態の撮像装置では、板ばね部６３が第２基板の接地電位に電気的に接続されているため、シールド板６による電磁ノイズの遮蔽効果をさらに高めた構成とすることができる。また、第１基板５１及び第２基板５２の接地電位を強化し、よりノイズに強い回路構成にすることができる。 Further, in the imaging device of the present embodiment, since the plate spring portion 63 is electrically connected to the ground potential of the second substrate, the shield effect of the electromagnetic noise by the shield plate 6 can be further enhanced. . Further, the ground potentials of the first substrate 51 and the second substrate 52 can be strengthened to make a circuit configuration more resistant to noise.
　＜変形例＞
　本実施形態の撮像装置では、第１基板５１に対して第２基板５２が垂直に、または角度を有して配置されていることを特徴としていたが、第１基板５１が有するコネクタ５１２に干渉しないよう、第２基板５２を配置しても良い。つまり、第２基板５２は、光軸方向の平面視において、第１基板５１のコネクタ５１２と重ならないよう配置される。この場合、第１基板５１に対して第２基板５２は水平に配置されても良い。 <Modification>
The imaging device of the present embodiment is characterized in that the second substrate 52 is disposed vertically or at an angle to the first substrate 51, but the second substrate 52 is characterized in that it interferes with the connector 512 of the first substrate 51. Alternatively, the second substrate 52 may be disposed. That is, the second substrate 52 is disposed so as not to overlap the connector 512 of the first substrate 51 in plan view in the optical axis direction. In this case, the second substrate 52 may be arranged horizontally to the first substrate 51.
　上記構成の撮像装置では、第２基板５２とコネクタ５１２とが互いに干渉しない配置にしているため、撮像装置の光軸方向の長さ（厚み）を小さくしやすい構成にすることができる。 In the imaging device of the above configuration, the second substrate 52 and the connector 512 are disposed so as not to interfere with each other, so that the length (thickness) in the optical axis direction of the imaging device can be easily reduced.
　＜２．実施形態２＞
　次に、本発明の実施形態２について、図８～図１２を参照しながら説明する。本実施形態の撮像装置は、実施形態１の撮像装置と比較して、シールド板６の形状が異なっている。以下の説明では、実施形態１と同様の構成についてはその説明を省略し、実施形態１と異なる構成についてのみ説明する。 <2. Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. 8 to 12. The imaging device of the present embodiment differs from the imaging device of the first embodiment in the shape of the shield plate 6. In the following description, the description of the same configuration as that of the first embodiment is omitted, and only the configuration different from the first embodiment will be described.
　図８及び図９は撮像装置の分解斜視図であって、図８はフロント側、図９はリア側から見た図である。図１０は、リアケース７、シールド板６、及び第２基板５２を連結させた状態をリア側から見た分解斜視図である。図１１は、撮像装置をフロント側から見た平面図である。図１２は、図１１のＣ－Ｃの位置における撮像装置の断面図である。 8 and 9 are exploded perspective views of the imaging apparatus, and FIG. 8 is a front side, and FIG. 9 is a rear side. FIG. 10 is an exploded perspective view of the state in which the rear case 7, the shield plate 6, and the second substrate 52 are connected as viewed from the rear side. FIG. 11 is a plan view of the imaging device as viewed from the front side. FIG. 12 is a cross-sectional view of the imaging device at a position CC in FIG.
　図８～図１０に示されるように、本実施形態のシールド板６は、第２基板５２を囲む第２箱状部分の光軸方向前方の端部が、外側に向かって屈曲した屈曲部６４ａ及び６４ｂを有する。より具体的には、第２基板５２はシールド板６の開放方向である光軸方向前方から挿入可能であり、シールド板６において、第２基板５２の側面と対向する面の端部が、光軸に対して外側に向かって広がるよう屈曲しており、当該屈曲した部分が屈曲部６４ａ及び６４ｂとなっている。 As shown in FIGS. 8 to 10, in the shield plate 6 of the present embodiment, a bending portion 64a in which the end in the optical axis direction of the second box-like portion surrounding the second substrate 52 is bent outward And 64b. More specifically, the second substrate 52 can be inserted from the front in the optical axis direction, which is the opening direction of the shield plate 6, and in the shield plate 6, the end of the surface facing the side surface of the second substrate 52 is light It is bent so as to extend outward with respect to the axis, and the bent portions become bent portions 64a and 64b.
　本実施形態の撮像装置では、上記のようにシールド板６が屈曲部６４ａ及び６４ｂを有する構成としていることで、シールド板６の開放方向（例えば光軸方向前方）から第２基板５２を挿入しやすい構成にすることができる。また、屈曲部６４ａ及び６４ｂが外側に屈曲しているため、屈曲部がフロントケース３に近接した構成となり、シールド板６の開放方向の端部が必要以上に外側に広がることを抑制することができ、第２基板５２が脱落してしまうことを抑制することができる。 In the imaging device of the present embodiment, the shield plate 6 is configured to have the bending portions 64a and 64b as described above, whereby the second substrate 52 is inserted from the opening direction of the shield plate 6 (for example, the front in the optical axis direction). It can be made easy. In addition, since the bent portions 64a and 64b are bent outward, the bent portion is configured to be close to the front case 3, and the end in the opening direction of the shield plate 6 is prevented from spreading outward more than necessary. As a result, the second substrate 52 can be prevented from dropping off.
　図１２に示されるように、組立状態において、第２基板５２の突起部５２１ａ及び５２１ｂは、シールド板６の嵌合部６１ａ及び６１ｂに挿入される。このとき、シールド板６の内側（光軸に近い側）の面Ｐ１と、突起部５２１ａの外側（光軸から遠い側）の面Ｐ２との距離（Ｐ１－Ｐ２）は、屈曲部６４ａの外側（光軸から遠い側）の点Ｐ３と、フロントケース３の内側（光軸に近い側）の面Ｐ４との距離（Ｐ３－Ｐ４）よりも長くなるよう構成されている。また、突起部５２１ｂ及び嵌合部６１ｂも同様の構成である。 As shown in FIG. 12, in the assembled state, the protrusions 521 a and 521 b of the second substrate 52 are inserted into the fitting portions 61 a and 61 b of the shield plate 6. At this time, the distance (P1-P2) between the surface P1 on the inner side (the side close to the optical axis) of the shield plate 6 and the surface P2 on the outer side (the side farther from the optical axis) of the protrusion 521a is the outer side of the bending portion 64a. It is configured to be longer than the distance (P3-P4) between the point P3 (the side far from the optical axis) and the surface P4 on the inner side (the side close to the optical axis) of the front case 3. Moreover, the protrusion part 521b and the fitting part 61b are also the same structure.
　本実施形態の撮像装置では、上記のような構成にすることで、屈曲部６４ａ及び６４ｂが外側（光軸から遠ざかる方向）に最大限に広がってフロントケース３に接触する状態になったとしても、Ｐ１－Ｐ２よりも短いＰ３－Ｐ４の距離だけしか移動しないため、突起部５２１ａまたは５２１ｂと嵌合部６１ａ及び６１ｂとの連結状態が解除されない構成にすることができる。これによって、第２基板５２がシールド板６から脱落してしまうことを防止する構成にすることができる。 In the imaging apparatus according to the present embodiment, even if the bending portions 64a and 64b are expanded to the outside (direction away from the optical axis) to the maximum to be in contact with the front case 3 by the above configuration. Since only the distance of P3-P4 shorter than P1-P2 is moved, the connection between the protrusion 521a or 521b and the fitting parts 61a and 61b can not be released. This can prevent the second substrate 52 from falling off the shield plate 6.
　なお、シールド板６は必ずしも屈曲部６４ａ及び６４ｂを有する必要はなく、単にシールド板６の光軸方向前方の端部の外側の点とフロントケース３の内側の面Ｐ４との距離が、シールド板６の内側の点Ｐ１と突起部５２１ａの外側の点Ｐ３よりも短くなるような構成としても良い。このような構成であっても、上記同様、第２基板５２がシールド板６から脱落しづらくなる効果が得られる。 The shield plate 6 need not necessarily have the bent portions 64a and 64b, and the distance between the outer point of the front end of the shield plate 6 in the optical axis direction and the inner surface P4 of the front case 3 is simply the shield plate. It may be configured to be shorter than the point P1 inside 6 and the point P3 outside the protrusion 521a. Even with such a configuration, as in the above, the effect of making the second substrate 52 less likely to come off the shield plate 6 can be obtained.
　また、シールド板６は、光軸方向前方の端部近傍に、外側に湾曲する湾曲部や、外部に突出する突出部を設けるなど、シールド板６とフロントケース３との距離を短くする構成を備えていても良い。このような構成を採用すると、シールド板６の端部が広がる範囲を狭めることができ、第２基板５２がシールド板６から脱落しづらい構成にすることができる。 In addition, the shield plate 6 has a configuration in which the distance between the shield plate 6 and the front case 3 is shortened, for example, by providing a curved portion that curves outward and a protruding portion that protrudes outside in the vicinity of the front end in the optical axis direction. You may have it. When such a configuration is adopted, the range in which the end portion of the shield plate 6 spreads can be narrowed, and the second substrate 52 can be configured so as not to easily come off the shield plate 6.
　また、光軸に対して水平な面において、シールド板６の端部がフロントケース３と重なる構成とすることは必須ではなく、シールド板６の端部がリアケース７と重なる構成としても良い。この場合であっても、上記同様に、シールド板６から第２基板５２が脱落することを抑制した構成にすることができる。 Further, it is not essential for the end of the shield plate 6 to overlap with the front case 3 in a plane horizontal to the optical axis, and the end of the shield plate 6 may be configured to overlap with the rear case 7. Even in this case, similarly to the above, the configuration can be made in which the second substrate 52 is prevented from dropping out of the shield plate 6.
　また、本実施形態の撮像装置では、シールド板６の開口方向の端部となる屈曲部６４ａ及び６４ｂの端部が、光軸方向に垂直な面においてフロントケース３と重なる位置になるよう、リア側からフロント側に向かって突出した形状となっている。これによって、屈曲部６４ａ及び６４ｂが外側に広がったときに、端部がフロントケース３に接しやすい状態となるため、確実に第２基板５２の脱落を防止することができる。 Further, in the imaging device of the present embodiment, the rear end of the bent portions 64a and 64b, which are the end portions in the opening direction of the shield plate 6, is positioned so as to overlap the front case 3 in a plane perpendicular to the optical axis direction. It has a shape projecting from the side toward the front side. As a result, when the bent portions 64a and 64b extend outward, the end portion is easily in contact with the front case 3, so that the second substrate 52 can be reliably prevented from falling off.
　＜３．実施形態３＞
　次に、本発明の実施形態３について、図１３を参照しながら説明する。本実施形態の撮像装置は、実施形態２の撮像装置と比較して、第２基板５２の突起部５２１ａ及び５２１ｂの形状が異なっている。以下の説明では、実施形態１及び実施形態２と同様の構成についてはその説明を省略し、実施形態１及び実施形態２と異なる特徴部分についてのみ説明する。 <3. Embodiment 3>
Next, a third embodiment of the present invention will be described with reference to FIG. The imaging device of the present embodiment differs from the imaging device of the second embodiment in the shapes of the protrusions 521 a and 521 b of the second substrate 52. In the following description, the description of the same configuration as in the first embodiment and the second embodiment will be omitted, and only the characteristic parts different from the first embodiment and the second embodiment will be described.
　図１３は、図１１のＣ－Ｃの位置における撮像装置の断面図である。図１３に示されるように、本実施形態の第２基板５２の突起部５２１ａ及び５２１ｂは、第２基板５２の縁部に対して鈍角を有して突出している。言い換えれば、突起部５２１ａ及び５２１ｂの光軸方向前方の端部であって、嵌合部６１ａ及び６１ｂと接する部分が傾斜を有している。つまり、第２基板５２の縁部と突起部５２１ａ及び５２１ｂによって形成される切欠形状部分が鋭角形状となっている。 FIG. 13 is a cross-sectional view of the imaging device at a position CC in FIG. As shown in FIG. 13, the protrusions 521 a and 521 b of the second substrate 52 of the present embodiment protrude at an obtuse angle with respect to the edge of the second substrate 52. In other words, the end portions of the protrusions 521 a and 521 b on the front side in the optical axis direction and in contact with the fitting portions 61 a and 61 b have an inclination. That is, the notch-shaped portion formed by the edge of the second substrate 52 and the protrusions 521a and 521b has an acute angle.
　第２基板５２の突起部５２１ａ及び５２１ｂを上記のように形成することで、シールド板６の端部近傍は内側（光軸に近づく方向）に向かう応力が発生することとなる。これによって、シールド板６の嵌合部６１ａ及び６１ｂと、第２基板５２の突起部５２１ａ及び５２１ｂとの嵌合が解除され、第２基板５２が脱落することを、効果的に抑制することができる。 By forming the protrusions 521a and 521b of the second substrate 52 as described above, stress in the vicinity of the end of the shield plate 6 is generated inward (in a direction approaching the optical axis). As a result, the fitting between the fitting portions 61a and 61b of the shield plate 6 and the protrusions 521a and 521b of the second substrate 52 is released, and the drop of the second substrate 52 can be effectively suppressed. it can.
　なお、第２基板５２の突起部５２１ａ及び５２１ｂは、第２基板５２の縁部に対して９５度以上の角度を有して突出した構成とすることが好ましい。言い換えれば、突起部５２１ａ及び５２１ｂは、光軸に垂直な平面に対して５度以上の角度を有するよう形成することが好ましい。このような構成とすることで、シールド板６と第２基板５２との間に一定以上の応力が発生しやすい構成とすることができるため、シールド板６から第２基板５２が脱落することをさらに効果的に抑制することができる。 The protrusions 521 a and 521 b of the second substrate 52 preferably protrude with an angle of 95 degrees or more with respect to the edge of the second substrate 52. In other words, the protrusions 521a and 521b are preferably formed to have an angle of 5 degrees or more with respect to a plane perpendicular to the optical axis. With such a configuration, it is possible to easily generate a certain amount of stress or more between the shield plate 6 and the second substrate 52, so that the second substrate 52 may come off from the shield plate 6. It can be further effectively suppressed.
　より好ましくは、第２基板５２の突起部５２１ａ及び５２１ｂは、第２基板５２の縁部に対して１０５度以上の角度を有して突出した構成とする。この構成によれば、シールド板６と第２基板５２との間に、一定以上の応力がより発生しやすい構成とすることができるため、シールド板６から第２基板５２が脱落することをさらに効果的に抑制することができる。 More preferably, the protrusions 521 a and 521 b of the second substrate 52 are configured to protrude at an angle of 105 degrees or more with respect to the edge of the second substrate 52. According to this configuration, a certain amount of stress or more can be more easily generated between the shield plate 6 and the second substrate 52, so that the second substrate 52 can be further removed from the shield plate 6. It can be effectively suppressed.
　＜４．補足事項＞
　以上、本発明の実施形態についての具体的な説明を行った。上記説明では、あくまで一実施形態としての説明であって、本発明の範囲はこの一実施形態に留まらず、当業者が把握可能な範囲にまで広く解釈されるものである。 <4. Additional Notes>
The specific description of the embodiment of the present invention has been described above. In the above description, the description is merely an embodiment, and the scope of the present invention is not limited to the one embodiment, and can be broadly interpreted to a range that can be grasped by those skilled in the art.
　例えば、上記各実施形態の板ばね部６２及び６３は、第２基板５２に対して互いに垂直な方向に付勢力を与える構成としていたが、必ずしも互いに垂直な方向に付勢力を与える構成でなくても良く、異なる方向から付勢力を与える構成としても一定の効果が得られる。 For example, although the plate spring portions 62 and 63 in the above embodiments are configured to apply biasing forces in directions perpendicular to each other with respect to the second substrate 52, the configurations are not necessarily configured to apply biasing forces in directions perpendicular to each other. It is also possible to obtain a certain effect even when the biasing force is applied from different directions.
　また、実施形態では第１基板５１及び第２基板５２の２枚のリジッド基板を有する構成について説明したが、さらに追加のリジッド基板を有する構成を採用してもよい。この場合、追加の基板についても第２基板５２同様に第１基板５１に対して所定の角度（例えば垂直）を有して配置することで、撮像装置をより小型化することができる。なお、追加の基板は第１基板５１に対して水平に配置しても、一定の効果が得られる。 In the embodiment, the configuration including the two rigid substrates of the first substrate 51 and the second substrate 52 has been described, but a configuration including an additional rigid substrate may be adopted. In this case, the imaging device can be further miniaturized by arranging the additional substrate at a predetermined angle (for example, perpendicular) with respect to the first substrate 51 similarly to the second substrate 52. Even if the additional substrate is arranged horizontally to the first substrate 51, a certain effect can be obtained.
　本発明は、車載用の撮像装置などとして好適に利用される。 The present invention is suitably used as an on-vehicle imaging device or the like.
１…レンズ鏡筒
　１ａ…レンズ
２…防水シール
３…フロントケース
４…防水シール
５１…第１基板
　５１１…撮像素子
　５１２…コネクタ
５２…第２基板
　５２１ａ、５２１ｂ…突起部
５３…フレキシブル基板
６…シールド板
７…リアケース
６１ａ、６１ｂ…嵌合部
６２、６３…板ばね部
６４ａ、６４ｂ…屈曲部
７１、７２…基板ガイド部
７３…突出部
７４…コネクタ部
８１～８６…連結ねじ DESCRIPTION OF SYMBOLS 1 ... Lens-barrel 1a ... Lens 2 ... Waterproof seal 3 ... Front case 4 ... Waterproof seal 51 ... 1st board | substrate 511 ... Image sensor 512 ... Connector 52 ... 2nd board | substrate 521a, 521b ... Projection part 53 ... Flexible board | substrate 6 ... Shield Plate 7: Rear case 61a, 61b: Fitting portion 62, 63: Plate spring portion 64a, 64b: Flexure portion 71, 72: Substrate guide portion 73: Projection portion 74: Connector portion 81 to 86: Connection screw

Claims (16)

  1. 　被写体を撮像する撮像部と、
    　前記撮像部を搭載する第１基板と、
    　前記第１基板と電気的に接続された電子部品を搭載する第２基板と、
    　レンズを保持するレンズ鏡筒と、を備え、
    　前記第２基板は、前記第１基板に対して所定の角度を持って配置されている、
    　撮像装置。     An imaging unit for imaging a subject;
    A first substrate on which the imaging unit is mounted;
    A second substrate on which an electronic component electrically connected to the first substrate is mounted;
    A lens barrel for holding a lens;
    The second substrate is disposed at a predetermined angle with respect to the first substrate.
    Imaging device.
  2. 　前記第１基板は、光軸に垂直に配置され、
    　前記第２基板は、光軸に対して４５度以下の角度をもって配置されている、
    　請求項１に記載の撮像装置。     The first substrate is disposed perpendicular to the optical axis,
    The second substrate is disposed at an angle of 45 degrees or less with respect to the optical axis,
    The imaging device according to claim 1.
  3. 　前記第１基板及び前記第２基板を囲んで配置された、金属で形成されたシールド板をさらに備える、
    　請求項１または請求項２に記載の撮像装置。     And a metal shield plate disposed around the first substrate and the second substrate.
    The imaging device according to claim 1 or 2.
  4. 　前記第２基板は、突起部を有しており、
    　前記シールド板は、前記突起部に嵌合する嵌合部を有する、
    　請求項１から請求項３のいずれか１項に記載の撮像装置。     The second substrate has a protrusion,
    The shield plate has a fitting portion to be fitted to the protrusion.
    The imaging device according to any one of claims 1 to 3.
  5. 　前記シールド板は、前記第２基板を所定の方向に付勢する第１付勢部を有している、
    　請求項４に記載の撮像装置。     The shield plate has a first biasing portion that biases the second substrate in a predetermined direction.
    The imaging device according to claim 4.
  6. 　前記第１付勢部は、前記シールド板に形成された板ばねである、
    　請求項４に記載の撮像装置。     The first biasing portion is a plate spring formed on the shield plate.
    The imaging device according to claim 4.
  7. 　前記シールド板は、前記第２基板を前記所定の方向と直交する方向へ付勢する第２付勢部を有している、
    　請求項５または請求項６に記載の撮像装置。     The shield plate has a second biasing portion that biases the second substrate in a direction orthogonal to the predetermined direction.
    The imaging device according to claim 5 or 6.
  8. 　前記第２付勢部は、前記シールド板に形成された板ばねである、
    　請求項７に記載の撮像装置。     The second biasing portion is a plate spring formed on the shield plate.
    The imaging device according to claim 7.
  9. 　前記第１付勢部は、前記第２基板の接地電位に電気的に接続されている、
    　請求項５から請求項８のいずれか１項に記載の撮像装置。     The first biasing unit is electrically connected to the ground potential of the second substrate.
    The imaging device according to any one of claims 5 to 8.
  10. 　前記第１基板は、光軸方向後方に突出し、他の構成と電気的に接続されるコネクタを有しており、
    　前記第２基板は、光軸方向の平面視において、前記コネクタと重ならないよう配置されている、
    　請求項１から請求項９のいずれか１項に記載の撮像装置。     The first substrate has a connector that protrudes rearward in the optical axis direction and is electrically connected to another configuration,
    The second substrate is disposed so as not to overlap the connector in plan view in the optical axis direction.
    The imaging device according to any one of claims 1 to 9.
  11. 　被写体を撮像する撮像部と、
    　前記撮像部を搭載する第１基板と、
    　前記第１基板と電気的に接続された電子部品を搭載する第２基板と、
    　レンズを保持するレンズ鏡筒と、を備え、
    　前記第１基板は、光軸方向後方に突出し、他の構成と電気的に接続されるコネクタを有しており、
    　前記第２基板は、光軸方向の平面視において、前記コネクタと重ならないよう配置されている、
    　撮像装置。     An imaging unit for imaging a subject;
    A first substrate on which the imaging unit is mounted;
    A second substrate on which an electronic component electrically connected to the first substrate is mounted;
    A lens barrel for holding a lens;
    The first substrate has a connector that protrudes rearward in the optical axis direction and is electrically connected to another configuration,
    The second substrate is disposed so as not to overlap the connector in plan view in the optical axis direction.
    Imaging device.
  12. 　被写体を撮像する撮像部と、
    　前記撮像部を搭載する第１基板と、
    　前記第１基板に対して所定の角度を有して配置され、前記第１基板と電気的に接続された電子部品を搭載する第２基板と、
    　レンズを保持するレンズ鏡筒と、
    　前記第１基板及び前記第２基板を囲んで配置された、金属で形成されたシールド板と、
    　前記第１基板、前記第２基板、前記レンズ鏡筒、及び前記シールド板を収容するケースと、を備え、
    　前記第２基板は突起部を有しており、
    　前記シールド板は、前記突起部と嵌合する嵌合部を有しており、
    　前記突起部が前記嵌合部と嵌合した際に前記突起部が前記嵌合部から突出する長さは、前記シールド板と前記ケースとの距離よりも長い、
    　撮像装置。     An imaging unit for imaging a subject;
    A first substrate on which the imaging unit is mounted;
    A second substrate which is disposed at a predetermined angle with respect to the first substrate and carries an electronic component electrically connected to the first substrate;
    A lens barrel that holds a lens,
    A shield plate formed of metal disposed around the first substrate and the second substrate;
    And a case for containing the first substrate, the second substrate, the lens barrel, and the shield plate.
    The second substrate has a protrusion,
    The shield plate has a fitting portion to be fitted to the protrusion,
    When the projection engages with the fitting portion, the length by which the projection protrudes from the fitting portion is longer than the distance between the shield plate and the case.
    Imaging device.
  13. 　前記シールド板は、前記第２基板を開口方向から挿入可能であり、前記開口方向の端部には外側に向かって屈曲した屈曲部を有している、
    　請求項１２に記載の撮像装置。     The shield plate is capable of inserting the second substrate from the opening direction, and has an outwardly bent portion at an end in the opening direction.
    The imaging device according to claim 12.
  14. 　前記ケースは、フロントケースと、前記フロントケースよりも光軸方向後方に配置されたリアケースとを含み、
    　前記シールド板の開口方向の端部は、光軸方向に垂直な面において前記フロントケースと重なる、
    　請求項１２または請求項１３に記載の撮像装置。     The case includes a front case and a rear case disposed rearward in the optical axis direction with respect to the front case.
    The open end of the shield plate overlaps the front case in a plane perpendicular to the optical axis direction.
    The imaging device according to claim 12 or 13.
  15. 　前記突起部は、前記第２基板の縁部に対して鈍角を有して突出している、
    　請求項１２から請求項１４のいずれか１項に記載の撮像装置。     The projection protrudes at an obtuse angle with respect to the edge of the second substrate,
    The imaging device according to any one of claims 12 to 14.
  16. 　前記突起部は、前記第２基板の縁部に対して９５度以上の角度を有して突出している、
    　請求項１５に記載の撮像装置。     The projection protrudes at an angle of 95 degrees or more with respect to the edge of the second substrate.
    The imaging device according to claim 15.
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