WO2019010596A1 - 新型光伏二极管 - Google Patents

新型光伏二极管 Download PDF

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Publication number
WO2019010596A1
WO2019010596A1 PCT/CN2017/000437 CN2017000437W WO2019010596A1 WO 2019010596 A1 WO2019010596 A1 WO 2019010596A1 CN 2017000437 W CN2017000437 W CN 2017000437W WO 2019010596 A1 WO2019010596 A1 WO 2019010596A1
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Prior art keywords
lead
copper
chip
tapered
photovoltaic diode
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PCT/CN2017/000437
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English (en)
French (fr)
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汪亚军
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汪亚军
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Application filed by 汪亚军 filed Critical 汪亚军
Priority to PCT/CN2017/000437 priority Critical patent/WO2019010596A1/zh
Publication of WO2019010596A1 publication Critical patent/WO2019010596A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the utility model relates to the field of photovoltaic diodes, in particular to a novel photovoltaic diode.
  • Photovoltaic diodes are important protection devices for photovoltaic power generation systems. They are widely used in conjunction with solar cell modules. They can also be used in low-voltage high-frequency switching devices, as well as in power systems for computers, household appliances, and program-controlled switches. It can also be used as a clamp. (This application has not been fully promoted for the time being.) With the rapid development of clean, non-polluting, renewable solar energy, communication automation technology and household appliances, the application market of photovoltaic diodes will continue to expand. With the rapid development of the photovoltaic industry, solar modules have become increasingly demanding for the heat dissipation capability and service life of photovoltaic diodes.
  • the photovoltaic diodes on the market are affected by their structure, and the heat dissipation capability is poor, which causes the temperature of the existing photovoltaic diode to rise rapidly, which may deform the junction box of the solar component, resulting in a short service life of the entire component; therefore, it is necessary to meet the current solar energy.
  • the components have the requirements of high heat dissipation capability and long service life of the photovoltaic diode, and the photovoltaic diode must be required to have a novel high heat dissipation capability and a long service life.
  • the utility model proposes a novel photovoltaic diode, the structure of the photovoltaic diode is ingenious, the product processing and production efficiency is high, the product heat dissipation is good, the temperature rise is low, and the service life is long.
  • a novel photovoltaic diode comprising a lead wire, a chip and a molding compound.
  • the lead wire is divided into two types, one is a planar lead wire and the other is a tapered lead wire, and the chip has a P surface and an N surface, and the chip P The surface of the chip is connected to the tapered lead by soldering, and the N side of the chip is connected to the planar lead by soldering, and the molding compound integrally encapsulates the lead and the chip.
  • the planar lead comprises a copper lead, an annular circular plate and a copper plane, the copper lead is connected in the middle of the back side of the copper plane, and the copper lead is designed with an annular circular plate at a position behind the copper plane, the copper lead and the circular circular plate. It is integrally formed with a copper plane.
  • the tapered lead comprises a copper lead, an annular circular plate and a copper cone surface, the copper lead is connected in the middle of the rear side of the copper tapered surface, and the copper lead is designed with an annular circular plate at a position close to the rear side of the copper tapered surface, the copper lead
  • the annular disc and the copper cone are integrally forged.
  • the molding compound is an epoxy molding compound.
  • the chip is a GPP model chip, the chip has a P surface and an N surface, the P surface has a tapered shape, and a P-face tapered surface has a silicon dioxide passivation protective layer, and the N surface is a flat surface.
  • the utility model has the advantages that the structure of the photovoltaic diode is ingenious, the product processing production efficiency is high, the product heat dissipation is good, the temperature rise is low, the service life is long, the epoxy resin is injected from the large nail head surface, and the backlash enters the chip surface to minimize the chip.
  • Rushing Strike effectively reduce the injection stress; product use process: due to the increased contact surface between the chip and the lead, the heat generated by the chip can be transmitted faster, thereby reducing the junction temperature of the chip, extending the service life of the product, and improving The rectification efficiency; the design of the annular circular plate on the lead of the photovoltaic diode plays a role of clamping during the processing, and increases the mechanical strength after the injection molding.
  • Figure 1 is a schematic view of the present invention.
  • FIG. 2 is a schematic view of the chip of the present invention.
  • a novel photovoltaic diode produced by a novel photovoltaic diode production process includes a lead, a chip 1 and a molding compound 2.
  • the leads are divided into two types, one is a planar lead 3 and the other is a cone.
  • the surface lead 4, the chip 1 has a P side and an N side, the P side of the chip 1 is soldered to the tapered lead 4 by solder 5, and the N side of the chip 1 is soldered to the planar lead 3 by solder 5, and the molding material 2 leads It is molded integrally with the chip 1.
  • the planar lead 3 includes a copper lead 31, an annular circular plate 32 and a copper flat surface 33.
  • the copper lead 31 is connected in the middle of the rear side of the copper flat surface 33, and the annular lead plate 32 is designed on the rear side of the copper lead 31 near the copper flat surface 33.
  • the copper lead 31, the annular circular plate 32 and the copper flat surface 33 are integrally forged and formed.
  • the tapered lead 4 includes a copper lead 41, an annular circular plate 42 and a copper tapered surface 43.
  • the copper lead 41 is connected in the middle of the rear side of the copper tapered surface 43, and the copper lead 41 is designed to have a ring shape on the rear side of the copper tapered surface 43.
  • the circular plate 42, the copper lead 41, the annular circular plate 42 and the copper tapered surface 43 are integrally forged and formed.
  • the chip 1 is a GPP model chip, and the chip has a P surface 11 and an N surface 12, the P surface has a tapered shape, and a P-face tapered surface has a silicon dioxide passivation protective layer 13 and an N surface. It is a plane.
  • the P-plane of the chip is tapered, with a protective layer of silicon dioxide on both sides, and the N-side of the other side is a flat surface. Therefore, the lead wires at both ends of this patent are designed as a planar lead and a tapered lead.
  • the production process of the new photovoltaic diode which includes the process flow: lead discharge direction ⁇ mounting a soldering piece ⁇ split chip mounting chip ⁇ mounting secondary soldering piece ⁇ welding ⁇ injection molding ⁇ curing pin plating ⁇ printing test ⁇ packaging and shipping; The operation is as follows:
  • Lead discharge Open the main power supply, oscillation switch and air source switch to check the hygienic condition of the machine. It is required to have no dust, no residual lead and other debris on the machine floor and the area. Confirm that the equipment (including the fixture) should be intact and the test machine is normal. If the equipment checklist is not completed, please go to the working staff to clean it. If it has been taken, please clean it by yourself. The operator must wear gloves during operation. The sweat on the hands of the gloves will cause oxidation of the leads. It is strictly forbidden to wear gloves or cut off the ends of the gloves. Before each box of leads is put into operation, it is necessary to confirm whether the lead specifications are consistent with the production requirements.
  • each feeding does not exceed 1/3 box, moderately adjust the oscillation speed of the oscillating disc and the guide plate; the oscillating disc is kept clean, and the acetone is used before the start of the shift. The jersey is wiped and then wiped every 4 hours. If the oscillating disc is not wiped for a long time, the lead will be stained. Each time the amount of addition is ⁇ 1/3 of the box, the excessive amount of pouring will cause the lead bending ratio to rise during the oscillation process and the lead wire is easily stained, and the curved lead wire must be picked out before each feeding.
  • soldering piece is not sealed and stored in time, and the filling operation and welding quality are affected after moisture absorption. It should be sealed when it is not used for 15 minutes without chip or soldering. Excessive amount of soldering chips and chips increases the time during which the chips and solder pads collide with each other, and it is easy to form solder bumps or damaged chip edges, which affects soldering quality and product quality.
  • the split-board chip has the following steps:
  • a, chip stripping The process of stripping the chip from the blue film. Step: Before cleaning, clean the surface of the stripper and the roller And the knife edge; check whether the scale setting of the speed regulation I and II is consistent with the "process requirement of the stripper" posted on the spot; check whether there are residual chips on the rubber roller; the chip to be stripped is spread evenly in the hand; Keep the blue film flat; the chip with blue film is placed flat at the edge; the chip to be stripped is placed on the edge of the knife to make the chip 45 degrees to the edge, that is, the chip corner direction forward, and the blue film center line and the knife edge center Line alignment; at the end of the blue film chip stripping, the blue film blade and the chip maintain a distance of at least 1 cm, the distance is close to cause scratches and obvious damage on the surface of the chip; microscopic examination of the stripped chip has obvious chipping and missing corners Phenomenon; when the chip is found to have obvious chipping and missing corners, the brush is used to pick out;
  • Step cleaning the surface of the crystal picker with an air gun; placing the graphite boat with the primary soldering piece into the loading boat; the lower layer of the graphite boat is flat, the upper lead is tapered, and the P side of the chip is in contact with the tapered lead, the chip The N surface is in contact with the flat lead; the automatic solid crystal can be clicked with the mouse button; when there is leakage in the automatic round crystal process, the machine should be shut down immediately; check whether there is any leakage of the chip; the suction pen needs to add a nozzle. To alleviate the bad contact between the pen and the chip;
  • the secondary piece loading method is the same as the one piece.
  • the amount of graphite boat knots containing materials ⁇ 60 pieces of graphite boat stacking height ⁇ 5 layers. The graphite boat is not allowed to work in the operation, so it is not easy to find whether the hole is filled with intact materials, which will cause a large number of defective products.
  • Injection molding turn on the power supply, water, check the upper and lower mold temperature, transfer pressure, mold clamping pressure, turn-in time, curing time, etc. according to the standards set by the on-site engineering department. Each time the amount of plastic molding material is used, refer to the standards set by the engineering department. The remaining materials must be sealed and the date and time of the sealing should be written; the hand should not touch the white glue. Place the forming frame on the comb frame, place the aluminum strip with the material on the forming frame, and pull out the aluminum strip to position the material, place the aluminum strip with the material on the forming frame, and place the aluminum The strip is pulled out to position the material.
  • the mold thimble When the mold thimble ejects the strip from the injection tank, the mold is removed, the rack is removed from the mold, and the mold surface is blown off with high pressure gas. When cleaning the mold surface, it must be cleaned with copper needle, copper plate and copper rod; the time for molding the material to be molded shall not exceed 1.5 hours. If the molding equipment is repaired for a long time, the material to be molded must be placed in a special oven. Pick out the appearance defects such as crush, dead bend, stomata and misalignment, peel off the material from the strip and straighten it into the metal box.
  • the first self-check appearance condition mainly to check the lead deviation, body deviation, lead rubber, body surface cleanliness, body long wing, crush injury, etc.; after normal production, mass production, and record; production site only allowed to put The material of one card is not allowed to have two or more different specifications at the same time.
  • Curing pin plating a process of removing the oxide layer on the surface of the lead by chemical means and then plating a layer of pure tin;
  • Printing test open the test meter power switch at each test point, check the correctness of the set parameters; check whether the materials are consistent with the produced models, notify the online administrator or quality control if the discrepancies are not satisfied; random scattered equipment and ground No more than 10 tubes to prevent mixing. Check whether the site is clean. Straighten the over-bent material before loading and then put it into use. When setting, touch the screen and just tap it by hand. No other items are allowed to touch. When setting, the touch screen can only be tapped by hand, and it can't be touched by other items, otherwise it will damage the panel. Stick the font on the font wheel, visually inspect the appearance of the print, and check if the logo type of the stamp used is the same.
  • the packaged products are placed neatly and orderly into the tote, and the corresponding process cards have been filled in; if the boxed products are produced, it is necessary to check whether there are residual tubes in each box.
  • the printed tape was scattered on the ground and was not placed in the tote in time.
  • Packaging and shipping According to the customer's packaging specifications, product packaging and shipping.
  • the diode junction temperature can be calculated by the following formula:
  • Tj T case +R THjc ⁇ U D ⁇ I D
  • test sample is continuously placed in a temperature chamber of (75 ⁇ 5) ° C, the test current is increased to 1.25 times the rated current of the junction box, and the current is maintained for 1 h;
  • junction temperature of the diode based on the above shall not exceed the maximum junction temperature stated by the manufacturer;

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

一种光伏二极管。它包括引线、芯片（1）和塑封料（2），所述的引线分为两种，一种是平面引线（3），另一种是锥面引线（4），所述的芯片（1）有P面和N面，芯片（1）的P面通过焊料（5）焊接连接锥面引线（4），芯片（1）的N面通过焊料（5）焊接连接平面引线（3），塑封料（2）把引线和芯片（1）塑封成一体。该光伏二极管的结构巧妙，产品加工生产效率高，产品散热好，温升低，使用寿命长。

Description

新型光伏二极管 技术领域
本实用新型涉及光伏二极管领域，具体涉及一种新型光伏二极管。
背景技术
光伏二极管是光伏发电系统的重要保护器件，广泛与太阳能电池组件配套使用，同时也可应用于低压高频开关装置中，以及计算机、家用电器、程控交换机等的电源系统中，既可作整流用，也可作箝位用。(此应用方面暂未能全面推广)随着清洁、无污染、可再生的太阳能开发利用，通讯自动化技术和家用电器的飞速发展，光伏二极管的应用市场将不断扩大。随着光伏产业的快速发展，太阳能组件对光伏二极管散热能力和使用寿命的要求也越来越高。目前市场上光伏二极管受其结构的影响，散热能力较差，导致现有光伏二极管温度升高较快，可能会使太阳能组件的接线盒变形，导致整个组件使用寿命短；因此，要满足现在太阳能组件对光伏二极管散热能力较强和使用寿命长等要求，就必须要求光伏二极管具有新型性高散热能力且使用寿命长的特点。
实用新型内容
为了解决上述问题，本实用新型提出了一种新型光伏二极管，光伏二极管的结构巧妙，产品加工生产效率高，产品散热好，温升低，使用寿命长。
为了达到上述实用新型目的，本实用新型提出了以下技术方案：
新型光伏二极管，它包括引线、芯片和塑封料，所述的引线分为两种，一种是平面引线，另一种是锥面引线，所述的芯片有P面和N面，芯片的P面通过焊料焊接连接锥面引线，芯片的N面通过焊料焊接连接平面引线，塑封料把引线和芯片塑封成一体。
所述的平面引线包括铜引线、环形圆板和铜平面，铜引线连接在铜平面后侧中间，铜引线靠近铜平面后侧位置上设计有环形圆板，所述的铜引线、环形圆板和铜平面一体锻压成型。
所述的锥面引线包括铜引线、环形圆板和铜锥面，铜引线连接在铜锥面后侧中间，铜引线靠近铜锥面后侧位置上设计有环形圆板，所述的铜引线、环形圆板和铜锥面一体锻压成型。
所述的塑封料是环氧塑封料。
所述的芯片是GPP型号芯片，芯片有P面和N面，P面呈锥形状，P面的锥形状面上有一层二氧化硅钝化保护层，N面是平面。
本实用新型的优点是光伏二极管的结构巧妙，产品加工生产效率高，产品散热好，温升低，使用寿命长，环氧树脂从大钉头面注入，反冲进入芯片表面，最大限度降低对芯片的冲 击，有效降低注塑应力；产品使用过程：因芯片与引线之间的接触面增大，因而，芯片所产生的热量能够较快地传递出去，从而降低芯片结温，延长产品使用寿命，且提升了整流效率；光伏二极管的引线上的环形圆板的设计在加工过程中起到锁模作用，成型注塑后增加机械强度。
附图说明
图1是本实用新型的示意图。
图2是本实用新型的芯片示意图。
具体实施方式
为了对本实用新型进一步说明，下面结合说明书附图来介绍：
参照附图1，使用新型光伏二极管的生产工艺生产的新型光伏二极管，它包括引线、芯片1和塑封料2，所述的引线分为两种，一种是平面引线3，另一种是锥面引线4，所述的芯片1有P面和N面，芯片1的P面通过焊料5焊接连接锥面引线4，芯片1的N面通过焊料5焊接连接平面引线3，塑封料2把引线和芯片1塑封成一体。
所述的平面引线3包括铜引线31、环形圆板32和铜平面33，铜引线31连接在铜平面33后侧中间，铜引线31靠近铜平面33后侧位置上设计有环形圆板32，所述的铜引线31、环形圆板32和铜平面33一体锻压成型。
所述的锥面引线4包括铜引线41、环形圆板42和铜锥面43，铜引线41连接在铜锥面43后侧中间，铜引线41靠近铜锥面43后侧位置上设计有环形圆板42，所述的铜引线41、环形圆板42和铜锥面43一体锻压成型。
参照图2，所述的芯片1是GPP型号芯片，芯片有P面11和N面12，P面呈锥形状，P面的锥形状面上有一层二氧化硅钝化保护层13，N面是平面。芯片的P面是锥形状，两侧具有二氧化硅的保护层，另一侧N面是平面，所以本专利两端引线设计成一个平面引线一个锥面引线。
新型光伏二极管的生产工艺，它包括工艺流程：引线排向→装一次焊片→分向板装芯片→装二次焊片→焊接→注塑→固化引脚电镀→印字测试→包装出货；具体操作如下：
1)引线排向：打开排向机总电源、振荡开关、气源开关，检查机台卫生状况，要求机台及区域地面无积尘、无残留引线及其他杂物；接班时与上班人员共同确认，设备(含夹具)应完整无损，试机正常，完成设备点检表未接班请上班人员打扫合格，已接班请自行打扫合格。操作时作业员必须戴好手套，不戴手套手上的汗渍会导致引线氧化，严禁不戴手套或将手套手指端部剪除等不良现象。每盒引线投入前需确认引线规格是否与生产要求一致，引线 有无明显氧化、弯曲等不良如有异常及时反馈班长处理，每次加料不超过1/3盒，适中调整振荡盘及导料板振荡速度；振荡盘保持清洁，开班前用沾有丙酮的汗布进行擦拭，然后每4小时擦拭一次，长时间不擦拭振荡盘会产生引线沾污。每次的加量≤1/3盒，倒入量过多在振荡过程中会产生引线弯曲比例上升且易产生引线沾污，每次加料前必须将弯引线挑出。将焊接盘置于排向固定架上固定好，取相应规格的石墨舟，将压克力盒对准焊接盘，待蓄料轨上材料约八分满时开始按下料START键，自动上料；石墨舟脚出现松动应予以拧紧，无法拧紧或石墨舟破损的应给予挑出。禁止用尖锐的夹具敲击直振板。待石墨舟排满后，取下压克力导引块，小心取出装满材料的石墨舟。将压克力导引块对准焊接盘，套好并置于排向固定架上固定好后按“自动键”时两手须迅速离开固定架及压克力盒防止轧手！如遇弯料需及时挑出，严禁用镊子按入石墨舟孔内！检查石墨舟每孔是否都落入引线，有无引线无法自然落入孔中之现象将石墨舟空孔补齐材料，未自然落孔的材料挑出更换挑出弯料，将不满的孔用同规格的引线补满。如中途遇卡料揭开挡板用镊子将弯引线挑出，卡料排除后将挡板放下，按“复归”键继续上料1不同规格的材料不可混放，且需做到与标识相符，摆放整齐、高度一致且≤8层；装有材料的石墨舟结存量≤180片。将完工材料放于规定的工作台上，放上相应规格的标识卡，不同型号产品放置于不同区域且做好标识，以防混料；如遇中途休息超出4小时，生产现场不许有已排向的结存料，余料全部倒入引线盒中用塑料袋密封好，引线长时间暴露在空气里易造成引线吸潮，长时间易氧化及影响排向下料。落地引线不允许超过10根。
2)装一次焊片：将焊片吸盘、晶片吸盘与真空气源以皮管连接，将真空度调至适中；装填中，一次性暴露在空气中的焊片数量：≤100K；装填时一次性暴露在空气中的芯片蓝膜数量小于5片；当环境温度大于70％时，上述数量减至一半；晶片品种型号不同者不可互混，操作台上不可出现两种不同型号的芯片，相同型号的芯片也不可相混，更换型号及批号时，必须有品保、生产班长现场确认。倒入适量的焊片于焊片吸盘内，打开真空，摇动吸盘，确使吸盘中的每一孔中均有焊片；轻敲吸盘，将多余的焊片倒入不锈钢盘中；未用芯片、焊片不及时密封保存，吸潮后影响装填操作及焊接质量。未用芯片、焊片或停止15分钟不生产时需将其密封。焊片、芯片倒入量过多增加芯片、焊片互相撞击的时间，易形成焊片卷曲或芯片边角受损，影响焊接质量及产品质量。
3)所述的分向板装芯片有以下步骤完成：
所述的分向板装芯片有以下步骤完成：
a、芯片剥片。即将芯片从蓝膜上剥离的过程。步骤：作业前，清洁剥片机表面、滚轮 及刀口；检查调速I、II对应刻度设定是否与现场张贴的《剥片机使用工艺要求》相符；检查橡胶滚轮上是否有残留芯片；将要待剥片的芯片平摊在手中；剥片过程中必须保持蓝膜平整；带有蓝膜的芯片平放于刀口处；待剥的芯片放置于刀口边使芯片呈45度对准刀口，即芯片边角方向向前，且蓝膜中心线与刀口中心线对齐；蓝膜芯片剥片结束时，划蓝膜刀片与芯片保持至少1厘米的距离，距离近易造成芯片表面划痕及明显破损；显微镜检查已剥的芯片有无明显的崩边、缺角现象；发现芯片明显崩边缺角时应用毛笔挑出；
b、拾晶：即将已剥离的芯片通过拾晶机装放至石墨舟的过程。步骤：将拾晶机表面用气枪清理；将装有一次焊片的石墨舟放入载舟盘中；石墨舟下层引线为平头，上层引线为锥形，芯片P面与锥形引线接触，芯片N面与平头引线接触；用鼠标键单击自动固晶即可；在自动圆晶过程中发现有漏吸时，应立即停机调试；检查有无漏吸的芯片；吸笔需添加吸嘴，以缓解吸笔与芯片接触而产生不良；
4)装二次焊片：打开真空，反转吸盘，对准已装好引线的石墨舟导孔，关掉真空，用镊子轻敲吸盘，使焊片能全部掉入石墨舟的每一孔中，将吸盘移开；筛芯片时，须在不锈钢盘中置一托架；在操作中不戴好手套，手指触及芯片、焊片，手上的汗脂粒如占上，焊接时会形成气孔或焊接断裂。检查石墨舟中的每一孔，位置不正确的要用镊子调整，有漏装的要补满(二次焊片装填方法与一次焊片相同)。装有材料的石墨舟结存量：≤60片操作时石墨舟堆放高度≤5层。操作中不允许石墨舟叠起来工作，这样不易发现空孔是否装有完好的材料，会造成大量的不良品。
5)焊接：通过电加热惰性气体，通过对流、传导、辐射三种热传递方式使焊料受热熔化，从而将引线、芯片、引线焊连在一起；
6)注塑：打开电源、水、检查上下模温，转进压力、合模压力、转进时间、固化时间等设定根据现场工程部制定的标准。每次领用塑封料的量参见工程部制定标准，余料必须密好，并写上密封的日期及时间；手不能触摸白胶。将成型架放于梳料架上，将装有材料的铝条放于成型架上，并将铝条拔出，使材料下落定位将装有材料的铝条放于成型架上，并将铝条拔出，使材料下落定位。一次只许预热一模所需量的塑封料，必须在15秒内使用完；每次加入容器中的CRC量应不超过海绵的1/3高度，遇弯料搓直，遇空位补满，但手和任何器物不可触及白胶。环氧树脂从平面注入，反冲进入芯片表面洗模时按工程规定的工艺要求洗模；盖上成型架固好的材料检查料架中的材料是否有空位和弯曲，是否已无残留物，料架是否已定位准确且引线是否全部落槽。用毛刷在材料进料口位置均匀涂上适量的CRC。CRC涂 到白胶上面，会影响电性；检查料架是否已定位准确且引线是否全部落槽，将预热好的塑封料放入料筒中双手按下合模键，使设备合模，双手按下转进键，设备开始按设定条件自动注塑并固化成型，禁止手动开模。洗模时按工程规定的工艺要求洗模。排料前及时写上补料的型号并检查卡物，材料规格应与所要封装规格相符合，每生产完一批产品后，随即填写好相应的流程卡放入箱中。当模具顶针将胶条顶出注胶槽后开始起模，将料架从模具上取下，并用高压气吹净模具表面。遇漏胶清理模面时必须使用铜针、铜板及铜棒进行清理；待模压材料放置时间不得大于1.5小时，如遇模压设备长时间修理，待模压材料必须放于专用烘箱中。挑出压伤、死弯、气孔及错位等外观不良，将材料从胶条上剥离并理顺放入铁皮箱。首件自查外观状况，主要检验引线偏位、本体偏位、引线胶皮、本体表面清洁度、本体长翅、压伤等情况；正常后再批量生产，并做好记录；生产现场只允许放一张卡的材料，不允许同时有两周种以上不同规格的产品。
7)固化引脚电镀：通过化学方式，去除引脚表面氧化层，再电镀一层纯锡的过程；
8)印字测试：打开每一测试点测试仪表电源开关，检查设定参数的正确性；检查用料与所生产型号是否一致，不符的要通知在线管理员或品管；设备和地面的随机散落管不超过10个，以防混料。检查现场是否清洁，上料前要对过度弯曲的材料进行拉直后再投入使用；设定时，触摸屏幕只许用手轻轻点击，其它任何物品不许触及。设定时，触摸屏幕只许用手轻轻点击，不可用其它物品触及，否则易损伤面板。在字模轮上粘上字模，对印字外观进行目检，检查一下所用图章商标型号是否一致。中途擦拭印字轮时，必须按点动按钮，要十分小心，当心扎手，且丙酮要远离火种。仪表面板严禁用丙酮等强腐蚀性溶剂擦拭(易损伤面板)使用前检查U.V灯得排风是否通畅良好，设备不生产时请关闭U.V灯；使用过程中不允许打开灯罩，以防紫外线泄漏伤人。不可用手取轮下弯管，当心扎手。检查包装测试点测试仪表是否完好，并对仪表参数设定进行检查校正；U.V灯管、灯罩每月用95％浓度的酒精擦拭一次，每3000小时更换一次。不可打开风机，要使管子得到充分降温冷却。包装好的产品整齐有序放入周转箱内，并放上已填写好的相应流程卡；若是生产盒装产品时，要检查每一盒内是否有残留管。已打印好的编带散落在地面，没有及时放进周转箱。
9)包装出货：根据客户的包装规格要求，进行产品包装，出货。
实施例
1、样品描述
样品一共11个，分为三组，本专利产品5个，编号为A1-A5(LOGO为HB)，其他两款品牌编号为B1-B3，C1-C3。
2、Tj试验
试验条件
A)对二级管施加正向电流；
B)使用生产商推荐的最小横截面积导线；
C)将试验样品加热至(75±5)℃；提供与接线盒额定电流(±2％)相同的电流；1h后，侧量每一个二极管的温度。
依据二极管生产商提供的说明，依据测得的壳体温度及二极管本体功率损耗值，通过以下公式可以计算二极管结温：
Tj＝Tcase+RTHjc×UD×ID
其中，
Tj     二极管结温
Tcase  测得的二极管壳体温度
RTHjc  二极管热阻系数
UD     二极管电压
ID     通过二极管的电流
若二极管生产商提供RTH代替RTHjc，则在上面的公式中也做相应的调换，使用RTH代替RTHjc，同时，若温度探测器也应装在相应的指定位置；
D)试验样品继续放置在(75±5)℃的温度箱中，测试电流提高到接线盒额定电流的1.25倍，保持该电流1h；
E)应再次检验，二极管是否仍然具备工作能力。
试验分析依据：
GJB548B-2006微电子器件试验方法和程序方法5003；
GB/T 9535-2006地面用晶体硅光伏组件---设计鉴定和定型。
判定标准：
-依据上述得出的二极管结温不应超过生产商声明的结温最高值；
-没有明显损坏；
-实验结束后二极管仍正常工作。
试验数据：
Figure PCTCN2017000437-appb-000001
150℃条件下，漏电流数据：
Figure PCTCN2017000437-appb-000002
Figure PCTCN2017000437-appb-000003
对比试验分心结论：
1)75℃额定电流条件下，本专利产品LOGO(HB)5颗材料Tj低于另两个非本专利LOGO产品。
2)150℃下反向漏电流，本专利产品LOGO(HB)5颗材料高温反向漏电流低于另两个非本专利LOGO产品。
说明书附图

Claims (5)

  1. 新型光伏二极管，其特征是它包括引线、芯片和塑封料，所述的引线分为两种，一种是平面引线，另一种是锥面引线，所述的芯片有P面和N面，芯片的P面通过焊料焊接连接锥面引线，芯片的N面通过焊料焊接连接平面引线，塑封料把引线和芯片塑封成一体。
  2. 根据权利要求1所述的新型光伏二极管，其特征是所述的平面引线包括铜引线、环形圆板和铜平面，铜引线连接在铜平面后侧中间，铜引线靠近铜平面后侧位置上设计有环形圆板，所述的铜引线、环形圆板和铜平面一体锻压成型。
  3. 根据权利要求1所述的新型光伏二极管，其特征是所述的锥面引线包括铜引线、环形圆板和铜锥面，铜引线连接在铜锥面后侧中间，铜引线靠近铜锥面后侧位置上设计有环形圆板，所述的铜引线、环形圆板和铜锥面一体锻压成型。
  4. 根据权利要求1所述的新型光伏二极管，其特征是所述的塑封料是环氧塑封料。
  5. 根据权利要求1所述的新型光伏二极管，其特征是所述的芯片是GPP型号芯片，芯片有P面和N面，P面呈锥形状，P面的锥形状面上有一层二氧化硅钝化保护层，N面是平面。
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CN202513164U (zh) * 2012-02-22 2012-10-31 扬州虹扬科技发展有限公司 一种新型光伏二极管
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