WO2019008535A1

WO2019008535A1 - Apparatus for the removal of protective films

Info

Publication number: WO2019008535A1
Application number: PCT/IB2018/054973
Authority: WO
Inventors: Fabio RUINI
Original assignee: Simac Tech S.R.L.
Priority date: 2017-07-06
Filing date: 2018-07-05
Publication date: 2019-01-10
Also published as: IT201700076014A1

Abstract

The present invention concerns an apparatus 1 for the removal of protective films 10 wrapped around a load C comprising a movement member 3 and a cutting head 4, the movement member 3 being intended to move the cutting head 4 towards the load C. The apparatus comprises advantageously at least one laser emitter 5a, 5b, 5c, 5d mounted on the cutting head 4 and intended to emit a light beam which is collimated towards a cutting focal point F for cutting the protective film 10.

Description

APPARATUS FOR THE REMOVAL OF PROTECTIVE FILMS

Technical Field

The present invention relates to an apparatus for the removal of protective films, in particular, an apparatus for the removal of the protective film that surrounds multilayer products which are mounted on a pallet.

Background Art

In the remainder of the present description and in the following claims, protective film means the coating film, made of heat-shrinkable or stretchable material, preferably plastic, intended to completely cover multilayer products when these are stacked on a pallet.

Generally speaking, on a pallet is stored a succession of layers of superimposed levels of products (e.g. packs) which may have substantially identical shapes and sizes (hereinafter "single products") or different shapes and sizes (hereinafter "mixed products"). Once mounted on the pallet the products are wrapped together by a protective film which surrounds them to keep them tied together and to be transported as a single load.

Before using the products, the load must be stripped of the protective covering film; then the pallet is unloaded using appropriate handling equipment.

The use is known of cutting systems equipped with a knife to remove the protective film, interfering with the latter at a cutting line. Usually, the cut is made horizontally between two layers of adjacent products, around the load so as to create a plurality of annular strips of protective film. Finally, an operator manually removes the annular layers to release the products.

The Applicant has noticed that known cutting systems have a number of drawbacks. First of all, the knife tends to deteriorate which results in uneven cutting and tearing of the protective film. Moreover, if it is not well positioned between the layers, the knife can also cut the underlying products with consequent breakage or damage to the products themselves.

Description of the Invention

The Applicant has discovered that an apparatus for the removal of protective films wrapped around a load comprising one movement member to move a laser cutting head intended to emit a light beam which is collimated towards a cutting focal point would make possible cutting the protective film only and not the underlying products, the latter being in an out-of-focus position.

The present invention therefore relates to an apparatus for the removal of protective films having structural and functional characteristics such as to satisfy the above requirements and at the same time to remedy the drawbacks mentioned with reference to the background art.

This object is achieved by an apparatus for the removal of protective films according to claim 1.

Brief Description of the Drawings

Further characteristics and advantages of the apparatus for the removal of protective films according to the present invention will become clear from the following description of a preferred embodiment thereof, given by way of a non-limiting example, with reference to the attached illustrations, in which:

Figure 1 is a perspective view of an apparatus for the removal of protective films according to the present invention,

Figures 2 to 4 are perspective views of possible supporting plates which can be mounted on the apparatus of Figure 1.

Embodiments of the Invention

With reference to the attached illustrations, reference numeral 1 globally indicates an apparatus for the removal of protective films 10 comprising a supporting element 2 fastened to the ground, a movement member 3 and a cutting head 4.

The movement member 3 is mounted on the supporting element 2 and comprises an anthropomorphic arm 3 a that can be moved on three axes x,y,z towards a plurality of mixed products P packed together with a protective film 10 to form a single load C of products. The anthropomorphic arm 3a comprises a first terminal extremity 3b and a second terminal extremity 3c; the first extremity 3b is connected revolving to the supporting element and the second extremity 3c is adapted to support the cutting head 4.

The cutting head 4 comprises a supporting plate 4' on which is mounted at least one laser emitter 5a on the surface 4b opposite the surface 4a to which is connected the second extremity 3c of the anthropomorphic arm 3a. The laser emitter 5a is intended to emit a collimated light beam (having a predetermined cutting power) along a direction X-X orthogonal to the surface 4b of the supporting plate 4' towards a focal point F. In the following of the present description and in the following claims, by focal point F, or otherwise cutting focal point F, means the point where the protective film 10 is cut.

According to a preferred embodiment shown in the example in figure 4, the cutting head 4 comprises at least two laser emitters 5a, 5b mounted on the supporting plate 4' with a preferably rectangular shape and preferably arranged at the opposite vertices of the supporting plate 4'. Advantageously, by appropriately directing the light beams of the two laser emitters 5a, 5b towards the focal point F, a total light beam is concentrated on the latter with a predetermined cutting power obtained from the sum of the two beams of each of the laser emitters 5a, 5b.

As illustrated in the examples of Figures 2 to 4, the supporting plate may have a rectangular or triangular shape and may comprise, preferably, three or four laser emitters 5a, 5b, 5c, 5d arranged at the opposite vertices of the supporting plate 4' . The total light beam is generated by summing the beams of each of the laser emitters towards the focal point F.

With reference to Figure 1, the apparatus 1 comprises sensor means 6 for measuring the distance d between the supporting plate 4' and the load C. The sensor means 6 are also intended to determine the overall dimensions/volume of the load C when mounted on the central platform 9a and can comprise, e.g., one or more feelers, laser gauges or proximity sensors preferably mounted on the supporting plate 4'. Furthermore, the sensor means 6 are adapted to determine the geometric profile of the load C.

Advantageously, the apparatus 1 comprises processing means (not shown) in signal communication with the sensor means 6 and adapted to act on the movement of the movement member 3 so that the distance between the supporting plate 4' and the focal point F during the cutting of the film 10 corresponds to the distance d measured by the sensor means 6 between the supporting plate 4' and the protective film 10 wrapped around the load C. For this purpose, the movement member 3 comprises one or more motors 7 to move the anthropomorphic arm 3a on the three axes x,y,z.

Furthermore, the processing means act on the movement of the movement member 3 to ensure the focal point F follows the profile of the load C. In particular, the movement member 3 is moved so that the focal point F follows the profile of the load C even when the latter is made up of products/packs of different shape and size. By means of appropriate software known to the expert in the sector, data and information about the geometric profile of load C and of packs P are managed by the processing means to move the movement member 3 for cutting.

It should be noted that the laser cutting power at the focal point F is predetermined and/or calculated beforehand so that it is sufficient to cut only the protective film 10 and not the underlying products, the latter being in an out- of-focus position.

With reference to the example shown in Figure 1, before the cutting operations, the load C is positioned on a central platform 9a placed between two load sorting platforms 9b, 9c. Preferably, the load platforms 9a,9b,9c are of the motorized-roller type.

Once the load C is on the central load platform 9a, a first cutting phase involves moving the cutting head 4 from a home position, wherein the focal point F does not cross the load C, to a cut start position, wherein the focal point F lies, preferably, at a midpoint of the upper corner of the load C, when the side of the latter is facing the supporting plate 4' .

Subsequently, a second phase envisages cutting the protective film 10 by switching on the laser emitters and moving the cutting head 4 from the upper corner downwards by a pre-determined length, substantially corresponding to the height of the first layer of products P.

In a subsequent third phase, the horizontal cutting of the protective film 10 takes place by rotating the load C around a rotation axis Y-Y vertical and orthogonal to the ground by means of appropriate motors (not shown) mounted on the central platform 9a and controlled by the processing means. Preferably, the rotation axis Y-Y is substantially placed along the axis of vertical symmetry of the load C. The load C is made to rotate, e.g., clockwise, while the cutting head 4 is moved away from and nearer to the load C, thus maintaining the focal point F at a constant distance d from the load C.

Once the load C has been fully rotated, the cutting of the protective film 10 can continue at the underlying layers of levels, repeating the phases described above until the protective film 10 is completely removed.

In a version not shown, the protective film can be cut by rotating the apparatus 1 around the load C. For this purpose, for example, the supporting element 2 can comprise castor wheels so that an operator can manually turn the apparatus 1 manually around the load C. In a further version, it is possible to make use of circular ring rails around the load C and supporting a sliding carriage to which the supporting element 2 can be attached.

Advantageously, the apparatus 1 comprises picking means 8 to grip the protective film 10 once cut. In particular, the picking means 8 are mounted on the cutting head 4 in the proximity of the supporting plate 4' downstream of the latter with respect to the cutting direction. Preferably, the picking means 8 comprise a vertically rotating suction roller for the purpose of attracting the protective film 10 towards the roller just after cutting and rolling it up for subsequent disposal.

Claims

1) Apparatus (1) for the removal of protective films (10) wrapped around a load (C) comprising:

a movement member (3) and a cutting head (4), the movement member (3) being intended to move said cutting head (4) towards said load (C),

characterized in that it comprises:

at least one laser emitter (5a, 5b, 5c, 5d) mounted on said cutting head (4) and intended to emit a light beam which is collimated towards a cutting focal point (F) for cutting said protective film (10).

2) Apparatus (1) according to claim 1, comprising sensor means (6) for measuring the distance (d) comprised between said cutting head (4) and the protective film (10) wrapping said load (C), and

processing means acting on said movement member (3) for moving said cutting head (4) in order to maintain said cutting focal point (F) at a distance substantially corresponding to said distance (d) between said cutting head (4) and said protective film (10).

3) Apparatus (1) according to claim 1 or 2, comprising a supporting plate (4') mounted on said cutting head (4), the latter supporting said at least one laser emitter (5a, 5b, 5c, 5d).

4) Apparatus (1) according to claim 3, wherein said supporting plate (4') has a triangular shape and comprises three laser emitters (5a, 5b, 5c) arranged each at the vertices of said supporting plate (4').

5) Apparatus (1) according to claim 3, wherein said supporting plate (4') has a rectangular shape and comprises four laser emitters (5a, 5b, 5c, 5d) arranged each at the vertices of said supporting plate (4').

6) Apparatus (1) according to claim 4 or 5, wherein each laser emitter (5a, 5b, 5c, 5d) is intended to emit a light beam which is collimated towards said cutting focal point (F), on the latter being concentrated a total light beam having a cutting power obtained from the sum of the beams of each of said laser emitters (5a, 5b, 5c, 5d).

7) Apparatus (1) according to any one of claims 1 to 6, comprising optics associated with said at least one laser emitter (5a, 5b, 5c, 5d) for collimating said light beam towards said cutting focal point (F).

8) Apparatus (1) according to any one of claims 2 to 7, wherein said sensor means (6) comprise one or more feelers, laser gauges or proximity sensors preferably mounted on the supporting plate (4') to determine the geometric profile of said load (C).

9) Apparatus (1) according to any one of claims 1 to 8, comprising a central platform (9a) for receiving and rotating said load (C) around an axis of rotation orthogonal to the ground, said movement member (3) being adapted to move said cutting head (4) between a home position, wherein the cutting focal point (F) does not cross the load (C), and a cut start position, wherein the focal point (F) lies at said protective film (10).

10) Apparatus (1) according to any one of claims 1 to 9, comprising picking means (8) to grip said protective film (10) after it has been cut.