WO2019006600A1 - Polishing agent, copper part and polishing process therefor - Google Patents
Polishing agent, copper part and polishing process therefor Download PDFInfo
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- WO2019006600A1 WO2019006600A1 PCT/CN2017/091534 CN2017091534W WO2019006600A1 WO 2019006600 A1 WO2019006600 A1 WO 2019006600A1 CN 2017091534 W CN2017091534 W CN 2017091534W WO 2019006600 A1 WO2019006600 A1 WO 2019006600A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Definitions
- Polishing agent copper piece and polishing treatment method thereof
- the present invention relates to the field of iron surface treatment technology, and in particular, to a polishing agent, a copper member, and a polishing treatment method thereof.
- the surface treatment technology of the workpiece is usually applied.
- the surface treatment processes of copper, aluminum, iron and their alloys are well-established in a wide range of industries.
- most workpieces require pre-treatment before surface treatment, for example, cleaning, decontamination and degreasing, and metal workpieces for certain applications need to be polished.
- polishing agent which is safe, environmentally friendly, and easy to operate at a normal temperature, and a copper member polishing method and a copper member obtained by polishing are provided.
- a polishing agent comprising, by weight of 200 parts by weight, of the following components: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of persulfuric acid Ammonium, 2-10 parts polyethylene glycol and the balance water.
- a copper member polishing treatment method comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to water in the polishing agent solution is 1: 1-2; The copper piece is immersed in the polishing agent solution, and after a predetermined daytime treatment, the copper piece is washed.
- Embodiments of the present invention provide a polishing agent for surface pretreatment of copper parts, comprising 200 parts by weight, including the following parts by weight: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance water.
- the abrasive has a weight fraction of 10-20 parts.
- the ethylenediaminetetraacetic acid is preferably 4-8 parts by weight
- the sulfuric acid is preferably 4-8 parts by weight
- the ammonium persulfate is preferably 4-8 parts by weight.
- the polyethylene glycol is preferably 4-8 parts by weight, and the polishing agent is used in a ratio of 1:1 to 2:1 -2.
- polishing agent In the above polishing agent, a better polishing effect is achieved by controlling the balance of the respective distribution ratios.
- Abrasives with a particle size of 20 - 150 nm reduce the surface roughness of the workpiece.
- Sulfuric acid and ammonium persulfate are the main reactive components of the polishing.
- Polyethylene glycol and ethylenediaminetetraacetic acid allow the workpiece to be uniformly polished.
- Embodiments of the present invention also provide a copper member polishing treatment method, comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, and polishing the polishing agent in the polishing agent solution
- the water preparation ratio is 1: 1-2; the copper piece is immersed in the polishing agent solution, and after a predetermined daytime treatment, the copper piece is washed and dried.
- the ratio of the polishing agent to the water in the polishing agent solution is 1 : 1, and the predetermined interval is 1-10 minutes. Further, after polishing, it is passivated, then washed with water and dried. After polishing, the temperature is controlled at 20 ° C - 25 ° C, that is, polishing at room temperature. Further, pretreatment such as degreasing and degreasing is performed before polishing.
- Embodiments of the present invention also provide a copper member which is subjected to a polishing treatment by a copper member polishing treatment method as described above to form a copper member to form a clean and bright surface.
- Embodiment 1 [0018] The ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 5 parts of abrasive, 2 parts of ethylenediaminetetraacetic acid, 2 parts of sulfuric acid, 2 parts of ammonium persulfate, 2 parts of polyethylene glycol and the balance water.
- Treatment method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 10 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
- the ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 10 parts of abrasive, 4 parts of ethylenediaminetetraacetic acid, 4 parts of sulfuric acid, 4 parts of ammonium persulfate, 5 parts of polyethylene glycol and the balance water.
- Treatment method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 5 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
- the ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 15 parts of abrasive, 7 parts of ethylenediaminetetraacetic acid, 7 parts of sulfuric acid, 8 parts of ammonium persulfate, 6 parts of polyethylene glycol and the balance water.
- Processing method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 5 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
- the ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 20 parts of abrasive, 10 parts of ethylenediamine Tetraacetic acid, 9 parts sulfuric acid, 9 parts ammonium persulfate, 10 parts polyethylene glycol and the balance water.
- Processing method preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after being shaken for 3 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
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Abstract
A polishing agent, a copper part and a polishing process therefor. The polishing agent is used for surface pretreatment of a copper part and comprises the following components in parts by weight per 200 parts by weight of the polishing agent: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance of water. Processed with the above polishing agent, the surface of a copper part is clean and bright, and the polishing process is simple, safe and environmentally friendly, odorless, convenient to operate and low-cost.
Description
抛光剂、 铜件及其抛光处理方法 技术领域 Polishing agent, copper piece and polishing treatment method thereof
[0001] 本发明涉及铁表面处理技术领域， 具体涉及一种抛光剂、 铜件及其抛光处理方 法。 [0001] The present invention relates to the field of iron surface treatment technology, and in particular, to a polishing agent, a copper member, and a polishing treatment method thereof.
背景技术 Background technique
[0002] 为提高产品表面性能或者外观， 通常对工件表面处理技术。 例如， 铜、 铝、 铁 及其合金的表面处理工艺深入各行各业中。 而且， 大多数工件在进行表面处理 前还需要经过预处理， 例如， 进行清洗， 除污除油， 某些用途的金属工件还需 要进行抛光化处理。 [0002] In order to improve the surface properties or appearance of a product, the surface treatment technology of the workpiece is usually applied. For example, the surface treatment processes of copper, aluminum, iron and their alloys are well-established in a wide range of industries. Moreover, most workpieces require pre-treatment before surface treatment, for example, cleaning, decontamination and degreasing, and metal workpieces for certain applications need to be polished.
[0003] 一般在机械加工及电子电气行业， 常见的有铜及铜合金清洁光亮处理， 即抛光 处理。 传统的抛光剂一般采用机械抛光或三酸抛光， 其中机械抛光对于工件几 何形状复杂的抛光效果很差， 三酸抛光中的三酸即浓硫酸， 浓硝酸， 浓磷酸在 高温条件下剧烈反应， 气体挥发很大， 不安全也不环保， 能耗大危险也大。 技术问题 [0003] Generally in the mechanical processing and electrical and electronic industries, copper and copper alloys are commonly cleaned and polished, that is, polished. Conventional polishing agents generally use mechanical polishing or tri-acid polishing. Among them, mechanical polishing has a poor polishing effect on the complex geometry of the workpiece. The tri-acid in the tri-acid polishing is concentrated sulfuric acid, concentrated nitric acid, and concentrated phosphoric acid reacts violently under high temperature conditions. The gas volatilizes a lot, is unsafe and not environmentally friendly, and has a high risk of energy consumption. technical problem
[0004] 有鉴于此， 提供一种常温下使用， 安全环保、 操作简单的抛光剂， 以及铜件抛 光处理方法和经过抛光处理后制得的铜件。 [0004] In view of the above, a polishing agent which is safe, environmentally friendly, and easy to operate at a normal temperature, and a copper member polishing method and a copper member obtained by polishing are provided.
问题的解决方案 Problem solution
技术解决方案 Technical solution
[0005] 一种抛光剂， 以 200重量份计， 包括如下重量份数的成分： 5-20份磨料， 2-10份 乙二胺四乙酸， 2-10份硫酸， 2-10份过硫酸铵， 2-10份聚乙二醇和余量水。 [0005] A polishing agent comprising, by weight of 200 parts by weight, of the following components: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of persulfuric acid Ammonium, 2-10 parts polyethylene glycol and the balance water.
[0006] 一种铜件抛光处理方法， 其包括下列步骤： 配制如上所述的抛光剂； 将抛光剂 溶于水中配制成抛光剂溶液， 在抛光剂溶液中抛光剂与水配制比例为 1 : 1-2； 将 铜件浸入抛光剂溶液中， 经过预定吋间处理后， 水洗铜件。 [0006] A copper member polishing treatment method comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to water in the polishing agent solution is 1: 1-2; The copper piece is immersed in the polishing agent solution, and after a predetermined daytime treatment, the copper piece is washed.
[0007] 以及， 一种铜件， 其表面通过如上所述的铜件抛光处理方法进行抛光。 [0007] Also, a copper member whose surface is polished by a copper member polishing treatment method as described above.
发明的有益效果 Advantageous effects of the invention
有益效果
[0008] 经过上述抛光剂处理后， 铜件表面清洁光亮， 而且整个抛光处理方法工艺简单 、 安全环保， 无气味， 操作方便， 使用成本低。 Beneficial effect [0008] After the above polishing agent treatment, the surface of the copper piece is clean and bright, and the whole polishing treatment method is simple, safe and environmentally friendly, odorless, convenient to operate, and low in use cost.
本发明的实施方式 Embodiments of the invention
[0009] 以下将结合具体实施例对本发明进行详细说明。 The present invention will be described in detail below with reference to specific embodiments.
[0010] 本发明实施例提供一种抛光剂， 用于铜件表面预处理， 以 200重量份计， 包括 如下重量份数的成分： 5-20份磨料， 2-10份乙二胺四乙酸， 2-10份硫酸， 2-10份 过硫酸铵， 2-10份聚乙二醇和余量水。 [0010] Embodiments of the present invention provide a polishing agent for surface pretreatment of copper parts, comprising 200 parts by weight, including the following parts by weight: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance water.
[0011] 具体地， 所述磨料的重量份数为 10-20份。 所述乙二胺四乙酸的重量份数优选 为 4-8份， 所述硫酸的重量份数优选为 4-8份， 所述过硫酸铵的重量份数优选为 4- 8份。 所述聚乙二醇的重量份数优选为 4-8份， 抛光剂使用吋与水配制比例为 1 : 1 -2。 [0011] Specifically, the abrasive has a weight fraction of 10-20 parts. The ethylenediaminetetraacetic acid is preferably 4-8 parts by weight, the sulfuric acid is preferably 4-8 parts by weight, and the ammonium persulfate is preferably 4-8 parts by weight. The polyethylene glycol is preferably 4-8 parts by weight, and the polishing agent is used in a ratio of 1:1 to 2:1 -2.
[0012] 在上述抛光剂中， 通过控制各成分配比平衡， 以达到较佳抛光效果。 粒径为 20 -150nm的磨料减低工件表面粗糙度， 硫酸、 过硫酸铵为抛光主要反应成分， 聚 乙二醇和乙二胺四乙酸使工件能够均匀的被抛光。 [0012] In the above polishing agent, a better polishing effect is achieved by controlling the balance of the respective distribution ratios. Abrasives with a particle size of 20 - 150 nm reduce the surface roughness of the workpiece. Sulfuric acid and ammonium persulfate are the main reactive components of the polishing. Polyethylene glycol and ethylenediaminetetraacetic acid allow the workpiece to be uniformly polished.
[0013] 本发明实施例还提供一种铜件抛光处理方法， 其包括下列步骤： 配制如上所述 的抛光剂； 将抛光剂溶于水中配制成抛光剂溶液， 在抛光剂溶液中抛光剂与水 配制比例为 1 : 1-2； 将铜件浸入抛光剂溶液中， 经过预定吋间处理后， 水洗铜件 ， 干燥。 [0013] Embodiments of the present invention also provide a copper member polishing treatment method, comprising the steps of: formulating a polishing agent as described above; dissolving the polishing agent in water to prepare a polishing agent solution, and polishing the polishing agent in the polishing agent solution The water preparation ratio is 1: 1-2; the copper piece is immersed in the polishing agent solution, and after a predetermined daytime treatment, the copper piece is washed and dried.
[0014] 具体地， 在抛光剂溶液中抛光剂与水配制比例为 1 : 1， 所述预定吋间为 1-10分 钟。 进一步地， 在经过抛光后， 再钝化， 然后水洗， 干燥。 抛光处理吋， 温度 控制在 20°C-25°C， 即常温下进行抛光处理。 更进一步地， 在抛光前， 先进行除 油脱脂等预处理。 [0014] Specifically, the ratio of the polishing agent to the water in the polishing agent solution is 1 : 1, and the predetermined interval is 1-10 minutes. Further, after polishing, it is passivated, then washed with water and dried. After polishing, the temperature is controlled at 20 ° C - 25 ° C, that is, polishing at room temperature. Further, pretreatment such as degreasing and degreasing is performed before polishing.
[0015] 经过上述抛光剂处理后， 铜件表面清洁光亮， 而且整个抛光处理方法工艺简单 [0015] After the above polishing agent treatment, the surface of the copper piece is clean and bright, and the entire polishing process is simple
、 安全环保， 无气味， 操作方便， 使用成本低。 , safe and environmentally friendly, odorless, easy to operate, low cost of use.
[0016] 本发明实施例还提供一种铜件， 其通过如上所述的铜件抛光处理方法进行抛光 处理， 使铜件形成清洁光亮的表面。 [0016] Embodiments of the present invention also provide a copper member which is subjected to a polishing treatment by a copper member polishing treatment method as described above to form a copper member to form a clean and bright surface.
[0017] 实施例 1
[0018] 按照下列重量份数混合各成分 （总量为 200重量份） ： 5份磨料， 2份乙二胺四 乙酸， 2份硫酸， 2份过硫酸铵， 2份聚乙二醇和余量水。 [0017] Embodiment 1 [0018] The ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 5 parts of abrasive, 2 parts of ethylenediaminetetraacetic acid, 2 parts of sulfuric acid, 2 parts of ammonium persulfate, 2 parts of polyethylene glycol and the balance water.
[0019] 处理方法： 配制好抛光剂； 将抛光剂溶于水中配制成抛光剂溶液， 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1 ; 铜件应先除油和除氧化皮， 然后水洗， 再将 处理好的铜件浸入抛光剂溶液中， 经震机震动 10分钟后， 水洗铜件， 再钝化， 水洗， 干燥。 [0019] Treatment method: preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 10 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
[0020] 经过上述抛光剂溶液处理后， 观察工件表面， 整个表面清洁光亮， 颜色一致， 亮度比抛光之前提高 20%以上。 [0020] After the above polishing agent solution is treated, the surface of the workpiece is observed, the entire surface is clean and bright, the color is uniform, and the brightness is increased by more than 20% than before polishing.
[0021] 实施例 2 Embodiment 2
[0022] 按照下列重量份数混合各成分 （总量为 200重量份） ： 10份磨料， 4份乙二胺四 乙酸， 4份硫酸， 4份过硫酸铵， 5份聚乙二醇和余量水。 [0022] The ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 10 parts of abrasive, 4 parts of ethylenediaminetetraacetic acid, 4 parts of sulfuric acid, 4 parts of ammonium persulfate, 5 parts of polyethylene glycol and the balance water.
[0023] 处理方法： 配制好抛光剂； 将抛光剂溶于水中配制成抛光剂溶液， 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1 ; 铜件应先除油和除氧化皮， 然后水洗， 再将 处理好的铜件浸入抛光剂溶液中， 经震机震动 5分钟后， 水洗铜件， 再钝化， 水 洗， 干燥。 [0023] Treatment method: preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 5 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
[0024] 经过上述抛光剂溶液处理后， 观察工件表面， 整个表面清洁光亮， 颜色一致， 亮度比抛光之前提高 40%以上。 [0024] After the above polishing agent solution is treated, the surface of the workpiece is observed, the entire surface is clean and bright, the color is uniform, and the brightness is increased by more than 40% before polishing.
[0025] 实施例 3 Embodiment 3
[0026] 按照下列重量份数混合各成分 （总量为 200重量份） ： 15份磨料， 7份乙二胺四 乙酸， 7份硫酸， 8份过硫酸铵， 6份聚乙二醇和余量水。 [0026] The ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 15 parts of abrasive, 7 parts of ethylenediaminetetraacetic acid, 7 parts of sulfuric acid, 8 parts of ammonium persulfate, 6 parts of polyethylene glycol and the balance water.
[0027] 处理方法： 配制好抛光剂； 将抛光剂溶于水中配制成抛光剂溶液， 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1 ; 铜件应先除油和除氧化皮， 然后水洗， 再将 处理好的铜件浸入抛光剂溶液中， 经震机震动 5分钟后， 水洗铜件， 再钝化， 水 洗， 干燥。 [0027] Processing method: preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after shaking for 5 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
[0028] 经过上述抛光剂溶液处理后， 观察工件表面， 整个表面清洁光亮， 颜色一致， 亮度比抛光之前提高 60%以上。 [0028] After the above polishing agent solution treatment, the surface of the workpiece is observed, the entire surface is clean and bright, the color is uniform, and the brightness is increased by more than 60% than before polishing.
[0029] 实施例 4 Embodiment 4
[0030] 按照下列重量份数混合各成分 （总量为 200重量份） ： 20份磨料， 10份乙二胺
四乙酸， 9份硫酸， 9份过硫酸铵， 10份聚乙二醇和余量水。 [0030] The ingredients were mixed in the following parts by weight (total amount of 200 parts by weight): 20 parts of abrasive, 10 parts of ethylenediamine Tetraacetic acid, 9 parts sulfuric acid, 9 parts ammonium persulfate, 10 parts polyethylene glycol and the balance water.
[0031] 处理方法： 配制好抛光剂； 将抛光剂溶于水中配制成抛光剂溶液， 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1 ; 铜件应先除油和除氧化皮， 然后水洗， 再将 处理好的铜件浸入抛光剂溶液中， 经震机震动 3分钟后， 水洗铜件， 再钝化， 水 洗， 干燥。 [0031] Processing method: preparing a polishing agent; dissolving the polishing agent in water to prepare a polishing agent solution, wherein the ratio of the polishing agent to the water in the polishing agent solution is 1:1; the copper piece should be degreased and descaled first. Then, it was washed with water, and then the treated copper piece was immersed in the polishing agent solution, and after being shaken for 3 minutes by the vibration machine, the copper piece was washed, then passivated, washed with water, and dried.
[0032] 经过上述抛光剂溶液处理后， 观察工件表面， 整个表面清洁光亮， 颜色一致， 亮度比抛光之前提高 60%以上。 [0032] After the above polishing agent solution treatment, the surface of the workpiece is observed, the entire surface is clean and bright, the color is uniform, and the brightness is increased by more than 60% than before polishing.
[0033] 需要说明的是， 本发明并不局限于上述实施方式， 根据本发明的创造精神， 本 领域技术人员还可以做出其他变化， 这些依据本发明的创造精神所做的变化， 都应包含在本发明所要求保护的范围之内。
[0033] It should be noted that the present invention is not limited to the above embodiments, and other changes may be made by those skilled in the art according to the inventive spirit of the present invention, and the changes according to the inventive spirit of the present invention should be It is intended to be included within the scope of the invention as claimed.
Claims
[权利要求 1] 一种抛光剂， 其特征在于， 以 200重量份计， 包括如下重量份数的成 分： 5-20份磨料， 2-10份乙二胺四乙酸， 2-10份硫酸， 2-10份过硫酸 铵， 2-10份聚乙二醇和余量水。 [Claim 1] A polishing agent comprising, by weight of 200 parts by weight, of the following components: 5-20 parts of abrasive, 2-10 parts of ethylenediaminetetraacetic acid, 2-10 parts of sulfuric acid, 2-10 parts of ammonium persulfate, 2-10 parts of polyethylene glycol and the balance water.
[权利要求 2] 如权利要求 1所述的抛光剂， 其特征在于， 所述磨料为粒径为 20-150n m的水溶性二氧化硅， 的重量份数为 10-20份。 [Claim 2] The polishing agent according to claim 1, wherein the abrasive is water-soluble silica having a particle diameter of 20 to 150 nm, and the weight fraction is 10 to 20 parts.
[权利要求 3] 如权利要求 1所述的抛光剂， 其特征在于， 所述乙二胺四乙酸的重量 份数为 4-8份。 [Claim 3] The polishing agent according to claim 1, wherein the ethylenediaminetetraacetic acid is 4-8 parts by weight.
[权利要求 4] 如权利要求 1所述的抛光剂， 其特征在于， 所述硫酸的重量份数为 4-8 份。 [Claim 4] The polishing agent according to claim 1, wherein the sulfuric acid is in a range of 4 to 8 parts by weight.
[权利要求 5] 如权利要求 1所述的抛光剂， 其特征在于， 所述过硫酸铵的重量份数 为 4-8份。 [Claim 5] The polishing agent according to claim 1, wherein the ammonium persulfate is 4-8 parts by weight.
[权利要求 6] 如权利要求 1所述的抛光剂， 其特征在于， 所述聚乙二醇的重量份数 为 4-8份。 [Claim 6] The polishing agent according to claim 1, wherein the polyethylene glycol is 4-8 parts by weight.
[权利要求 7] 如权利要求 1所述的抛光剂， 其特征在于， 所述抛光剂使用吋与水配 制比例为 1 : 1-2。 [Claim 7] The polishing agent according to claim 1, wherein the polishing agent is used in a ratio of hydrazine to water of 1 : 1-2.
[权利要求 8] —种铜件抛光处理方法， 其包括下列步骤： 配制如权利要求 1-6任一 项所述的抛光剂； 将抛光剂溶于水中配制成抛光剂溶液， 在抛光剂溶 液中抛光剂与水配制比例为 1 : 1-2； 将铜件浸入抛光剂溶液中， 使用 震机不断的震动， 经过预定吋间处理后， 水洗铜件， 进入下一道工序 [Claim 8] A method for polishing a copper member, comprising the steps of: formulating the polishing agent according to any one of claims 1 to 6; dissolving the polishing agent in water to prepare a polishing agent solution, in the polishing agent solution The ratio of the polishing agent to the water is 1: 1-2; the copper piece is immersed in the polishing agent solution, and the vibration is continuously vibrated. After the predetermined daytime treatment, the copper piece is washed and the next process is performed.
[权利要求 9] 如权利要求 7所述的铜件抛光处理方法， 其特征在于， 在经过抛光后 ， 再钝化， 然后水洗干燥， 在抛光剂溶液中抛光剂与水配制比例为 1 ： 1-2， 所述预定吋间为 1-10分钟。 [Claim 9] The method for polishing a copper member according to claim 7, wherein after polishing, passivation, and then washing and drying, the ratio of the polishing agent to water in the polishing solution is 1:1. -2, the predetermined time is 1-10 minutes.
[权利要求 10] 一种铜件， 其特征在于， 所述铜件表面通过如权利要求 8所述的铜件 抛光处理方法进行抛光。
[Claim 10] A copper member, characterized in that the surface of the copper member is polished by the copper member polishing treatment method according to claim 8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/091534 WO2019006600A1 (en) | 2017-07-03 | 2017-07-03 | Polishing agent, copper part and polishing process therefor |
| CN201780092855.3A CN110809615A (en) | 2017-07-03 | 2017-07-03 | Polishing agent, copper part and polishing treatment method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/091534 WO2019006600A1 (en) | 2017-07-03 | 2017-07-03 | Polishing agent, copper part and polishing process therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019006600A1 true WO2019006600A1 (en) | 2019-01-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2017/091534 WO2019006600A1 (en) | 2017-07-03 | 2017-07-03 | Polishing agent, copper part and polishing process therefor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110809615A (en) |
| WO (1) | WO2019006600A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11932713B2 (en) * | 2017-12-31 | 2024-03-19 | Rohm And Haas Electronic Materials Llc | Monomers, polymers and lithographic compositions comprising same |
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- 2017-07-03 WO PCT/CN2017/091534 patent/WO2019006600A1/en active Application Filing
- 2017-07-03 CN CN201780092855.3A patent/CN110809615A/en not_active Withdrawn
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| US20080108539A1 (en) * | 2004-03-23 | 2008-05-08 | Johnsondiversey, Inc. | Cleaning and Corrosion Inhibition System and Composition for Surfaces of Aluminum or Colored Metals and Alloys Thereof Under Alkaline Conditions |
| CN101671527A (en) * | 2009-09-27 | 2010-03-17 | 大连三达奥克化学股份有限公司 | Copper chemical mechanical polishing solution with high removing rate and low damage, and preparation method thereof |
| CN101974297A (en) * | 2010-11-12 | 2011-02-16 | 大连三达奥克化学股份有限公司 | Core/shell type composite nano-abrasive copper chemical-mechanical polishing liquid |
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| US11932713B2 (en) * | 2017-12-31 | 2024-03-19 | Rohm And Haas Electronic Materials Llc | Monomers, polymers and lithographic compositions comprising same |
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| CN110809615A (en) | 2020-02-18 |
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