WO2019004774A1

WO2019004774A1 - Circuit board assembly and method for manufacturing same

Info

Publication number: WO2019004774A1
Application number: PCT/KR2018/007400
Authority: WO
Inventors: 오정학; 염진수
Original assignee: 주식회사 유라코퍼레이션
Priority date: 2017-06-29
Filing date: 2018-06-29
Publication date: 2019-01-03
Also published as: KR20190002100A

Abstract

Provided is a circuit board assembly comprising: a lower circuit board and an upper circuit board, each having a plurality of conducting holes formed therein; and a jumper circuit board interposed between the lower circuit board and the upper circuit board and having a plurality of shoulder portions which are formed by processing the outer shape of a printed circuit board and are insertedly coupled to the plurality of conducting holes respectively, so as to electrically connect the lower circuit board and the upper circuit board.

Description

Circuit board assembly and method of manufacturing the same

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a circuit board assembly and a method of manufacturing the same, and more particularly, to a circuit board assembly including a pair of circuit boards electrically connected to each other.

1 is a perspective view of a prior art circuit board assembly. Referring to FIG. 1, a circuit board assembly includes a pair of circuit boards 100 arranged in a multi-layered structure. Further, a plurality of jumper pin holes are formed on the circuit board 100 along the periphery thereof. The jumper pin hole is a portion to which the end of the jumper pin 110 is inserted. The jumper pin 110 is a conductor having a pin shape. At this time, both ends of the jumper pin 110 are respectively inserted into the jumper pin holes and soldered. As a result, the pair of circuit boards 100 are electrically connected through the jumper pins 110.

However, in the conventional electrical connection method using the jumper pin, 1) a plurality of jumper pins 110 must be inserted into the jumper pin hole, so that the operation is very cumbersome, the operation time is long, and the number of operations is considerable. Further, (2) the jumper pin 110 is a metal-made conductor, which is against the trend of lightening the product. 3) In the conventional connection method, when the jumper pins 110 are individually coupled to the jumper pins, the other circuit boards are connected to the other circuit boards before they are coupled to the other circuit boards. There is a problem in that it is inconvenient for a work for adjustment.

SUMMARY OF THE INVENTION An embodiment of the present invention has been devised to solve the above problems, and an object of the present invention is to provide an electrical connection means for replacing a jumper pin used in the related art. Specifically, the present invention aims to simplify the work which is cumbersome and takes a long time, and to improve the productivity.

In addition, the present invention seeks to reduce the weight of a circuit board assembly by using a lightweight material, while at the same time securing price competitiveness through cost reduction.

A circuit board assembly according to an embodiment of the present invention includes a lower circuit board and an upper circuit board each having a plurality of conductive holes formed therein, A plurality of shoulder portions formed between the lower circuit board and the upper circuit board and formed by contouring the printed circuit board to be inserted into the energizing holes to electrically connect the lower circuit board and the upper circuit board, And a substrate.

Wherein the jumper circuit board includes: a pin body portion having the shoulder portions at both ends thereof; And an insulating portion disposed between the pin body portions.

The shoulder portion may electrically connect the lower circuit board and the upper circuit board by a copper plating layer exposed on a part of the outer surface at both ends.

The shoulder may have a tapered shape with a gradual reduction in cross-sectional area.

The lower circuit board and the upper circuit board may be formed with a circuit pattern designed in advance, and electric parts may be provided. The power holes may be formed along the circumference of the lower circuit board and the upper circuit board.

The both ends of the shoulder portion may be electrically connected by a copper foil layer formed on at least one surface of the pin body portion.

The shoulder portion may further include a plating layer coated with a conductive metal, and the plating layer may be formed of a plurality of plating layers.

Both side surfaces of the insulating portion may be curved inward.

The insulating portion may be formed by etching to remove the copper foil layer in the printed circuit board.

A method of manufacturing a circuit board assembly according to an embodiment of the present invention includes the steps of: forming a plurality of current-carrying holes in a lower circuit board and a lower circuit board, respectively; A second step of forming a plurality of shoulders to be inserted into and coupled to the conductive holes, and coating the shoulders with a conductive metal; A third step of selectively etching the printed circuit board to insulate the neighboring shoulder portions; And a fourth step of electrically connecting the lower circuit board and the upper circuit board by soldering the parts to be coupled and inserting the shoulder parts into the electrification holes, respectively.

In the third step, the printed circuit board may be formed such that the copper foil layer is removed by the etching to expose the epoxy layer.

In the third step, the epoxy layer may be cut to be curved inward.

In the second step, the shoulder portion may be formed by coating a plurality of times with a conductive metal.

As described above, according to the present invention, various effects including the following can be expected. However, the present invention does not necessarily achieve the following effects.

The present invention makes it possible to simplify the electrical connection work through the integrally formed jumper circuit board, and at the same time to proceed rapidly, unlike the case where the conventional jumper pins are individually operated. As a result, the productivity of the circuit board assembly can be improved.

In addition, the present invention seeks to reduce the weight of a circuit board assembly using a lightweight material, and at the same time, it can secure price competitiveness through cost reduction.

1 is a perspective view of a prior art circuit board assembly;

2 is a perspective view of a circuit board assembly in accordance with an embodiment of the present invention;

3 is an exploded perspective view of Fig.

4 is a perspective view of a jumper circuit board according to one embodiment.

Fig. 5 is a front view of Fig. 4; Fig.

6 is a flow diagram of a method of fabricating a circuit board assembly in accordance with an embodiment of the present invention.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a perspective view of a circuit board assembly according to an embodiment of the present invention, FIG. 3 is an exploded perspective view of FIG. 2, FIG. 4 is a perspective view of a jumper circuit board according to an embodiment, Front view.

2 to 5, a circuit board assembly according to an embodiment includes a lower circuit board 10, an upper circuit board 20, a jumper circuit board 30, and the like. The circuit board assembly according to one embodiment may be used in a vehicle junction block. The junction block is located in a vehicle engine room or an interior panel, and serves as a distribution center for supplying power to individual electronic components in the vehicle.

Specifically, the circuit board assembly has a multi-layer structure in which a pair of the lower circuit boards 10 and the upper circuit boards 20 are electrically connected to each other by the jumper circuit board 30. That is, the jumper circuit board 30 energizes the lower circuit board 10 and the upper circuit board 20.

The lower circuit board 10 and the upper circuit board 20 are generally formed in a square plate shape, and circuit patterns (not shown) designed in advance are formed on the respective circuit boards. The lower circuit board 10 and the upper circuit board 20 may be provided with electrical components such as semiconductor devices.

On the other hand, the lower circuit board 10 and the upper circuit board 20 may include energizing holes 40 formed at the respective end positions of the above-described circuit pattern. The energizing hole 40 according to one embodiment is formed at a predetermined distance from each of the lower side circuit board 10 and the upper side circuit board 20 along each of the side edges or peripheries so that the lower circuit board 10 and the upper circuit Thereby securing a space for installing electric parts on the substrate 20, and facilitating the connection process of the jumper circuit board 30 later. For example, as shown in FIG. 3, the lower circuit board 10 and the upper circuit board 20, which are formed by square plates, are spaced apart from each other by a predetermined distance and are vertically penetrated.

On the other hand, the jumper circuit board 30 is formed by using a printed circuit board as a raw material and performing external contour processing and plating processing thereto. The jumper circuit board 30 interposed between the lower circuit board 10 and the upper circuit board 20 can greatly simplify the electrical connection process between the lower circuit board 10 and the upper circuit board 20 .

Specifically, the jumper circuit board 30 is a printed circuit board having a rectangular plate shape (having a predetermined length, width, length, and thickness). On the other hand, in the jumper circuit board 30, the pin body portion 32 and the insulating portion 36 are alternately arranged in the lateral direction. When the printed circuit board is cut by external contour machining, the printed circuit board may be provided with a shoulder portion 34 which can be inserted into the above-mentioned energizing hole 40.

On the other hand, the shoulder portions 34 are formed at both ends of the pin body portion 32, and a plurality of shoulders 34 are formed corresponding to the number of the energizing holes 40. The pin body portion 32 and the shoulder portions 34 formed at both ends of the pin body portion 32 are integrated in consideration that the raw material is a printed circuit board.

The shoulder portion 34 may have, for example, a rectangular bar shape. On the other hand, the shoulder portion 34 has a tapered shape that is inclined at a predetermined angle so that its cross sectional area gradually decreases. This smoothly guides the insertion of the shoulder portion 34 when the shoulder portion 34 is inserted into the energizing hole 40. [ Further, the distal end of the shoulder portion 34 may be roundly rounded. Preferably, the shoulder portion 34 is formed to have a length that allows the end portion of the shoulder portion 34 to protrude through the energizing hole 40 when the shoulder portion 34 is inserted into the energizing hole 40.

On the other hand, at least one copper plating layer is formed on the printed circuit board perpendicularly to the thickness direction. That is, a copper plating layer is laminated on the printed circuit board in the thickness direction. Therefore, in the process of forming the shoulder portion 34, a part of the surface of the shoulder portion 34 can be exposed so that the copper plating layer is exposed to the outside. On the other hand, the shoulder portion 34 may be coated with a conductive metal to widen the electrical contact area with respect to the energizing hole 40. [ The conductive metal is preferably, for example, copper or the like. The coating may be repeated two or more times, and as a result, the plating layer may be formed in plural.

This is because the shoulder portions 34 are respectively inserted into the energizing hole 40 and then soldered. Both ends of the shoulder portion 34 are electrically connected by a copper foil layer formed on at least one surface of the pin body portion 32. [ As a result, the current can flow from one end of the shoulder portion 34 to the other end.

The insulating portion 36 isolates the pin body portions 32 from each other. That is, the insulating portion 36 is disposed between the pin body portions to block the electrical flow between the neighboring pin body portions 32. As a result, the electrical connection is established between the lower circuit board 10 and the upper circuit board 20 via the shoulder portions 34 formed at both ends of the respective pin body portions 32, centering the respective pin body portions 32 Independent of each other. Specifically, the insulating portion 36 is formed by etching so as to remove the copper foil layer in the printed circuit board. At this time, the etching is preferably performed until the epoxy layer having an insulating material is exposed. That is, the etching is done selectively, so that the thickness of the insulation 36 becomes thinner than other portions of the printed circuit board.

Further, both side surfaces of the insulating portion 36 can be curved inward. Considering the distance between the pin body portions 32, the thickness of the insulating portion 36 and the fact that the jumper circuit board 30 fixes the lower circuit board 10 and the

upper circuit board

20, 36 may be damaged by stress concentration due to external vibration or impact. This lowers the reliability of the jumper circuit board 30. [ Therefore, if the recess 36 curved inward is formed in the insulating portion 36, stress concentrated at a certain point can be dispersed.

The circuit board assembly according to one embodiment significantly simplifies the electrical connection work through the integrally formed jumper circuit board 30, and can proceed quickly, unlike the conventional jumper pins. As a result, the productivity of the circuit board assembly can be improved. Further, the present invention seeks to reduce the weight of the circuit board assembly through the use of a lightweight material, and at the same time, it can secure cost competitiveness through cost reduction.

6 is a flowchart of a method of manufacturing a circuit board assembly according to an embodiment of the present invention. Referring to FIG. 6, a method of manufacturing a circuit board assembly according to an embodiment of the present invention includes a first step (s10) to a fourth step (s40). Here, the circuit board assembly has a multi-layer structure in which a pair of circuit boards are arranged in a vertically spaced manner. The first step is a step of forming a plurality of energizing holes 40 in each of the lower circuit board 10 and the upper circuit board 20. (s10) At this time, the energizing hole 40 formed in each circuit board, It is preferable that they are formed at opposed positions.

In the second step, a plurality of shoulder portions 34 to be inserted into and coupled to the energizing hole 40 are formed by outer contouring the printed circuit board, and the shoulder portion 34 is coated with a conductive metal. (S20) Considering the shape of the hole 40 and the like, it is preferable that the shoulder portion 34 to be inserted and coupled thereto be formed into a bar shape. At this time, the shoulder portions 34 are disposed opposite to each other on both sides of the rectangular plate-shaped printed circuit board, and are formed repeatedly along the lateral direction of the printed circuit board.

Then, the shoulder portion 34 is coated with a conductive metal. That is, the shoulder portion 34 is plated to enlarge the electrical contact area. When the plating process is completed by limiting to the shoulder portion 34, the printed circuit board can be divided into the shoulder portion 34 and the portion excluding the shoulder portion 34.

The third step is to selectively etch the printed circuit board to isolate the neighboring shoulders 34. (s30) The etching is performed in particular by removing the copper foil layer that is laminated to the printed circuit board and etching the neighboring shoulders 34 34 to block the electrical flow. When the etching process is completed, an insulating portion 36 is formed on the printed circuit board to expose the epoxy layer. The printed circuit board is subjected to the second step and the third step to become the jumper circuit board 30.

On the other hand, when the insulating portion 36 is formed, both side surfaces of the insulating portion 36 can be bent inward by cutting or the like. This can prevent the insulating portion 36 from being damaged due to stress concentration due to external vibration, shock, or the like. That is, when the recessed portion curved inward is formed in the insulating portion 36, the stress concentrated at a certain point can be dispersed to improve the product reliability.

In the fourth step, the jumper circuit board 30 is interposed between the lower circuit board 10 and the upper circuit board 20 to electrically connect the lower circuit board 10 and the upper circuit board 20, (S40). This is a step of inserting the shoulder portions 34 into the electrifying holes 40 so as to make one-to-one correspondence. Then, each part to be joined is soldered. The shoulder portion 34 and the energizing hole 40 are electrically connected to each other through soldering. For soldering, for example, a method using laser or paste may be used.

The manufacturing method of the circuit board assembly according to the first to fourth steps has the advantage that the productivity is greatly improved as compared with the manufacturing method using the conventional jumper pin.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention.

Claims

A lower circuit board and an upper circuit board each having a plurality of energizing holes;

A plurality of shoulder portions formed between the lower circuit board and the upper circuit board and formed by contouring the printed circuit board to be inserted into the energizing holes to electrically connect the lower circuit board and the upper circuit board, A circuit board assembly comprising: a substrate;
The method according to claim 1,

The jumper circuit board

A pin body portion having the shoulder portions at both ends thereof; And

And an insulating portion disposed between the pin body portions.
3. The method of claim 2,

The shoulder

Wherein the lower circuit board and the upper circuit board are electrically connected to each other by a copper plating layer exposed on a part of outer surfaces of both ends.
3. The method of claim 2,

The shoulder

A circuit board assembly having a tapered shape with a gradual reduction in cross-sectional area.
The method according to claim 1,

The lower circuit board and the upper circuit board

A pre-designed circuit pattern is formed, an electric component is installed,

The current-

Wherein the lower circuit board and the upper circuit board are spaced apart from each other around the circuit board assembly.
3. The method of claim 2,

Wherein the shoulder portion is electrically connected at its both ends by a copper foil layer formed on at least one surface of the pin body portion.
The method according to claim 1,

Wherein the shoulder portion further comprises a plated layer coated with a conductive metal.
8. The method of claim 7,

Wherein the plating layer is formed in a plurality of layers.
3. The method of claim 2,

Wherein both side surfaces of the insulation portion are curved inward.
3. The method of claim 2,

Wherein the insulating portion is formed by etching so as to remove the copper foil layer in the printed circuit board.
A first step of forming a plurality of current-carrying holes in each of the lower circuit board and the upper circuit board;

A second step of forming a plurality of shoulders to be inserted into and coupled to the conductive holes, and coating the shoulders with a conductive metal;

A third step of selectively etching the printed circuit board to insulate the neighboring shoulder portions; And

And a fourth step of electrically connecting the lower circuit board and the upper circuit board by soldering the parts to be coupled and inserting the shoulder parts into the electrification holes, respectively, and electrically connecting the lower circuit board and the upper circuit board.
12. The method of claim 11,

In the third step

Wherein the copper foil layer is removed by the etching to expose the epoxy layer on the printed circuit board.
13. The method of claim 12,

In the third step

Wherein the epoxy layer is cut so as to be curved inward.
12. The method of claim 11,

In the second step

And the shoulder portion is coated with conductive metal a plurality of times.