WO2019002541A1 - Substrat pour circuits électriques et procédé de fabrication d'un tel substrat - Google Patents

Substrat pour circuits électriques et procédé de fabrication d'un tel substrat Download PDF

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Publication number
WO2019002541A1
WO2019002541A1 PCT/EP2018/067558 EP2018067558W WO2019002541A1 WO 2019002541 A1 WO2019002541 A1 WO 2019002541A1 EP 2018067558 W EP2018067558 W EP 2018067558W WO 2019002541 A1 WO2019002541 A1 WO 2019002541A1
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WO
WIPO (PCT)
Prior art keywords
paper
ceramic
layer
substrate
metallization
Prior art date
Application number
PCT/EP2018/067558
Other languages
German (de)
English (en)
Inventor
Karsten Schmidt
Shawn Williams
Nahum Travitzky
Peter Greil
Alexander BONET
Original Assignee
Rogers Germany Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of WO2019002541A1 publication Critical patent/WO2019002541A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492—Bases or plates or solder therefor
    • H01L23/4924—Bases or plates or solder therefor characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents

Definitions

  • the invention relates to a substrate for electrical circuits according to the preamble of claim 1 and a method for producing such a substrate according to the preamble of claim 14.
  • Such substrates are constructed in one or more layers and comprise at least one insulating layer.
  • the insulating layer is provided on the top and / or bottom with a metal layer or metallization, preferably on both sides.
  • the metal layer or metallization extends at least in sections flat along the top and / or bottom of the insulating layer and is connected to this either directly or possibly via further metal or insulating layers.
  • At least one of the outer metal layers may in this case be structured to form strip conductors and also contact and / or connection surfaces in a plurality of metallization surface sections.
  • the insulation layer is formed by at least one high insulation strength having ceramic layer.
  • the ceramic layer is for example made of an oxide, nitride or carbide ceramics such as aluminum oxide (Al 2 O 3) or Aluminum nitride (AIN) or silicon nitride (Si 3 N 4) or silicon carbide (SiC) or aluminum oxide with zirconium oxide (Al2O3 + ZrO2) were prepared.
  • metallization of a ceramic layer can also take place by means of the so-called "direct-plated-copper" connection technology
  • processes for the production of so-called highly filled papers are known from DE 10 2006 022 598 A1, US 200901 1208 A1 or US 8608906 B2
  • functional fillers such as a sinterable ceramic powder, highly adsorptive powder or powder with good heat storage capacity.
  • These ceramic fillers have the well-known electrical insulation properties as ceramic fillers or main fillers for the paper structure are, for example, in particular Al.sub.2O.sub.3, Si.sub.3N, AlN, ZrO.sub.2, MgO, SiC and BeO or else a combination such as ZTA, in particle sizes of ⁇ 5 .mu.m, preferably ⁇ 1 .mu.m.
  • Sintering aids of jewei main fillers namely Y2O3, CaO, MgO, S1O2, etc., were incorporated into the paper structure.
  • a so-called sintered paper or a paper ceramic is optionally produced after a further deformation process by thermal reaction, inter alia, carrying out a two-stage thermal conversion.
  • the organic components of the preceramic papers such as pulp, starch and latex oxidatively removed, resulting in a so-called "brownling.”
  • the "brownling” is sintered to form a ceramic material with the typical bending strength of a ceramic.
  • the microstructure of this sintered paper or of the paper-based ceramic shows, inter alia, the material properties typical for ceramics, for example also a high insulation strength.
  • the advantages of ceramic materials can be combined with the papering advantages, such as ease of deformation and light weight.
  • Such manufactured paper ceramics for example, have an open pore structure, which may be between 5 and 70% by volume of the total volume of the paper ceramics.
  • the porosity or pore structure of the paper-ceramic material in particular when used for electrical circuits, leads to a deterioration of the insulation resistance in comparison with a full-ceramic material.
  • Such paper ceramics tend with appropriate thermal stress to the formation of cracks in the paper ceramics, which may possibly even lead to breakage of the paper ceramics.
  • such paper ceramics have a low thermal conductivity and / or electrical conductivity.
  • a ceramic of preceramic paper or cardboard structures is known in which the preceramic papers or paperboards have a content of ceramic fillers between 30 and 95% by mass and the ceramic fillers have a particle size ⁇ 30 ⁇ m ,
  • so-called "spacers” or spacers are needed, via which a preferably expansion-adapted connection between the two substrates or components mounted thereon can be produced.
  • the invention has for its object to provide a substrate for electrical circuits and an associated method for its production, its thermal conductivity and / or electrical conductivity for the particular application and / or the particular application is adaptable.
  • the object is achieved by a substrate according to claim 1, an intermediate element according to claim 5, a method according to claim 6 and a module according to claim 11.
  • the essential aspect of the inventive substrate for electrical circuits is the fact that the pore-shaped cavities of the pore structure at least in the region of the top and / or bottom of the paper ceramic layer using an infiltration process are filled with a metal or a metal alloy that on Top and / or bottom at least one metallization layer with a layer thickness between 0.1 to 10 ⁇ forms.
  • the infiltration of the metal or the metal alloy takes place here in the liquid state. Due to the degree of infiltration of the paper ceramic and / or the choice of the metal or metal alloy used, the thermal conductivity and / or electrical conductivity of the substrate can be adapted to the respective field of use in an especially advantageous manner.
  • the provision of the metallization layer (s) provides a bonding surface which can be connected to other substrates and / or molded parts via the known and frequently used bonding technologies such as, for example, soldering and bonding.
  • the substrate according to the invention is thus not only inexpensive to produce, but also with regard to its electrical and mechanical properties individually adaptable to the particular application and beyond even with the existing bonding technologies with other components connectable.
  • a paper-ceramic layer according to the invention is understood as meaning a paper structure enriched in papermaking with a sinterable ceramic filler, preferably alumina powder, from which a preceramic paper structure is produced.
  • the preceramic paper structure is subjected to a two-stage thermal conversion process and firstly a "Braunling" is produced from the preceramic paper structure ("green body"), in which the organic components of the preceramic paper structure, for example cellulose, starch and latex, are oxidatively removed.
  • the "Braunling" is fed to a sintering process, whereby a ceramic material, namely the paper ceramics, is produced.
  • the paper ceramics layer exhibits the typical material properties of a ceramic material, namely a high bending and insulation resistance
  • the different ceramic-ceramic layer is lighter in comparison to a conventional ceramic layer and can be individually deformed prior to the implementation of the thermal conversion process the starting material of the paper-ceramic layer is stored as roll goods due to the deformability and further processed.
  • the paper-ceramic layer is produced particularly advantageously from a paper structure enriched with a sinterable ceramic filler by means of thermal conversion, in which the proportion of sinterable ceramic fillers of the enriched paper structure is greater than 80% by weight, preferably between 80 and 90% by weight.
  • ceramic fillers of the paper structure Al 2 O 3, Si 3 N 4 , AlN, ZrO 2, MgO, SiC, BeO or a combination thereof and associated typical sintering aids such as Y 2 O 3, CaO, MgO, S1O 2 are provided.
  • the volume fraction of the pore structure in the total volume of the paper ceramic is adjustable.
  • the paper-ceramic layer has a layer thickness between 0.5 and 2 mm.
  • the paper-ceramic layer can be produced either by a "single" paper-ceramic layer or as a paper-ceramic composite layer which is produced by corresponding cohesive connection of a plurality of paper-ceramic layers of lesser layer thickness.
  • the at least one metallization layer forms a connection layer for producing a thermally conductive and / or electrically conductive, integral connection with a further metallization layer and / or a further paper ceramic layer and / or a further substrate. Due to the metallization layer with the layer thickness according to the invention, there are universal application possibilities for the infiltrated paper-ceramic layer.
  • the thermal conductivity and / or the electrical sheet resistance and / or the electrical conductivity and / or the mechanical expansion coefficient of the infiltrated paper-ceramic layer can be adjusted particularly advantageously via the degree of infiltration of the pore structure.
  • the mechanical expansion coefficient is for example between 4 - 12 ppm / K, preferably between 6 - 8 ppm / K and the thermal conductivity, for example between 50 - 300 W / mK, preferably between 120 - 200 W / mK.
  • the heat conductivity and / or the electrical sheet resistance and / or the electrical conductivity and / or the mechanical expansion coefficient is dependent on the volume fraction of the pore structure on the total volume of the paper-ceramic layer is advantageous.
  • the volume fraction of the pore structure in the manufacture of the paper ceramics is preferably between 5 and 70% by volume and can be set individually within the stated range.
  • the metal used is copper, aluminum, gold, silver, tin, zinc, molybdenum, tungsten, chromium and, as the metal alloy, an alloy of said metals for infiltrating the paper-ceramic layer.
  • the pore structure of the infiltrated paper-ceramic layer is particularly advantageous or only partially infiltrated with metal or metal alloy, whereby in particular the electrical sheet resistance and / or the electrical conductivity are individually adjustable.
  • the infiltrated paper-ceramic layer with the at least one metallization layer or the substrate according to the invention forms a spacer for connecting two further substrates. The spacer is particularly advantageous for expansion, at least to a substrate.
  • the upper side of the infiltrated paper-ceramic layer has a first metallization layer and the underside of the infiltrated paper-ceramic layer has a second metallization layer.
  • Another object of the present invention is an intermediate element for arrangement between metal-ceramic substrates, wherein the intermediate element comprises at least one paper ceramic layer having a top and bottom, which has a pore structure consisting of a plurality of poreformigen cavities, wherein the poreformigen cavities of the pore structure at least in the area of the upper and / or lower side of the paper-ceramic layer, using an infiltration method, are filled with a metal or a metal alloy in such a way that at least one metallization layer with a layer thickness between 0.1 and 10 is formed on the upper and / or lower side ⁇ trains.
  • thermomechanical compensation between the metal-ceramic substrates can be realized in a simple manner by means of an intermediate element designed as a paper-ceramic and its controllably adjustable thermal conductivity or thermal properties.
  • the intermediate element is arranged in the installed state between two stacked in the stacking direction metal-ceramic substrates.
  • the intermediate element lies with his Top on the one metal-ceramic substrate and with its underside on the other metal-ceramic substrate, in particular on an electrical component such as a semiconductor of the other metal-ceramic substrate.
  • the intermediate element between two provided with electrical components metal-ceramic substrates is arranged.
  • the intermediate element is arranged between the metal-ceramic substrate and the electrical component, for example a semiconductor element, of a metal-ceramic substrate or of the other metal-ceramic substrate.
  • a thickness of the intermediate element measured in the stacking direction is 0.5 times to 15 times, preferably 1.5 times to 10 times and particularly preferably 2.5 times to 6 times as thick as one in the stacking direction measured thickness of the metal-ceramic substrate and / or an accumulated thickness of the opposing metal-ceramic substrates.
  • the intermediate element acts as a spacer between the two opposing metal-ceramic substrates.
  • the metal-ceramic substrates are designed to serve as carriers for electronic components.
  • the intermediate element acts electrically insulating between the opposing metal-ceramic substrates.
  • the intermediate element has a plated-through hole over which the opposing metal-ceramic substrates are in electrical contact with each other.
  • the intermediate element acts along one direction, in particular the stacking direction, at least partially or completely electrically insulating. Ie. Despite the infiltration of the paper ceramics with the metal, the intermediate element can serve for electrical insulation of the opposing metal-ceramic substrates.
  • the invention likewise provides a process for the production of a substrate for electrical circuits comprising at least one paper-ceramic layer having a top and bottom side which has a pore structure consisting of a plurality of pore-shaped cavities.
  • the pore-shaped cavities of the pore structure are particularly advantageous at least in the region of Top and / or bottom of the paper ceramic layer using an infiltration process so filled with a liquid metal or a liquid metal alloy that forms at least one metallization layer with a layer thickness between 0.1 to 10 ⁇ on the top and / or bottom.
  • the described method allows an individual adjustment of the thermal conductivity and / or the electrical sheet resistance and / or the electrical conductivity and / or the mechanical expansion coefficient of the infiltrated paper-ceramic layer on the degree of infiltration of the pore structure.
  • the paper-ceramic layer is produced from a paper structure enriched with a sinterable ceramic filler by means of thermal conversion, the proportion of sinterable ceramic fillers of the enriched paper structure being greater than 80% by weight, preferably between 80 and 90% by weight.
  • the volume fraction of the pore structure in the total volume of the paper-ceramic layer is set to be between 5 and 70% by volume.
  • the thermal conductivity and / or the electrical sheet resistance and / or the electrical conductivity and / or the mechanical expansion coefficient of the infiltrated paper-ceramic layer via the degree of infiltration of the pore structure.
  • said material properties can also be adjusted via the volume fraction of the pore structure on the total volume of the paper-ceramic layer.
  • the pore structure of the paper-ceramic layer is completely or only partially infiltrated with the metal or the metal alloy, for example by means of pressureless infiltration, pressure infiltration or vacuum infiltration.
  • the paper-ceramic layer is further advantageously infiltrated in a temperature range which is in the range of the melting point of the metal to be infiltrated or the is to be infiltrated metal alloy.
  • a temperature range which is in the range of the melting point of the metal to be infiltrated or the is to be infiltrated metal alloy.
  • conventional heaters can be used for the infiltration of copper o- a copper alloy and aluminum or an aluminum alloy.
  • the invention likewise relates to a module comprising a substrate according to the invention, in which the at least one metallization layer is connected to at least one further paper ceramic layer or a paper-ceramic composite layer or at least one further substrate.
  • the module comprises an intermediate element and at least two metal-ceramic substrates, wherein the intermediate element between the at least two metal-ceramic substrates are arranged.
  • the at least one further paper ceramic layer is connected, for example, via an adhesive layer to at least one metallization layer of the paper ceramic layer, wherein in one embodiment, the pore-shaped cavities of the further paper ceramic layer are at least partially, preferably completely filled with the adhesive used.
  • the further substrates are preferably designed as metal-ceramic substrates, and at least one metallization layer of the paper-ceramic layer is connected to at least one metallization of the metal-ceramic substrates.
  • a first metal-ceramic substrate with a first ceramic layer and a first and second metallization and a second metal-ceramic substrate with a second ceramic layer and a first and second metallization is provided.
  • the first metallization of at least the second metal-ceramic substrate is structured to form connection and contact surfaces in a plurality of metallization sections, wherein an electronic component having a metallization section is structured.
  • section of the second metal-ceramic substrate is connected via the spacer forming substrate to the second metallization of the first metal-ceramic substrate.
  • FIG. 1 is a simplified schematic sectional view through a substrate according to the invention comprising a paper-ceramic layer with provided on the top and bottom metallization layers,
  • FIG 1 is a simplified schematic representation of an infiltration process for producing a substrate according to the invention shown in FIG 1,
  • FIG. 3 shows a simplified schematic section through a power module comprising a spacer forming substrate according to the invention and two metal-ceramic substrates 4 shows a simplified schematic sectional illustration through an alternative embodiment of a substrate according to the invention comprising additional paper ceramic layers
  • FIG. 5 shows a simplified schematic sectional illustration through a further alternative embodiment variant of a substrate according to the invention comprising further composite layers of paper ceramics.
  • Figure 1 shows in a simplified schematic representation a section through an inventively designed substrate 1 for electrical circuits, which has a plate-like structure, i. is formed in the form of a printed circuit board.
  • the substrate 1 according to the invention is particularly suitable for use in electronic circuits in the power range, also called power modules.
  • the substrate 1 according to the invention can also be part of such a power module, in particular a "sandwich” power module or a so-called “multilayer” power module.
  • the substrate 1 according to the invention forms in particular an expansion-adapted component, specifically the thermal expansion coefficient (TCE) of the substrate 1 according to the invention is adapted to the coefficients of expansion of the components of the power module connected to it, in order to achieve a high thermal shock resistance of the power module. to ensure.
  • TCE thermal expansion coefficient
  • the inventive substrate 1 for electrical circuits comprises in one embodiment at least one paper ceramic layer 2 with a top and bottom 2a, 2b, which has a pore structure consisting of a plurality of pore-shaped cavities.
  • the paper-ceramic layer 2 is made of a paper-made ceramic material. Such paper ceramics are also referred to as pre-ceramics.
  • the inventive paper-ceramic layer 2 has, for example, a first layer thickness d1 of between 0.5 and 2 mm.
  • the paper-ceramic layer 2 is furthermore preferably plate-like, with the length and / or width of the plate-shaped paper-ceramic layer 2 being dependent on the application.
  • a paper ceramics in the sense of the invention is understood as meaning a paper structure enriched in the papermaking with sinterable ceramic, preferably pulverulent fillers, from which a preceramic paper structure is produced in an intermediate step.
  • the proportion of the sinterable ceramic filler of the preceramic paper structure is greater than 80 wt .-%, preferably between 80 and 90 wt .-%.
  • the ceramic fillers or main fillers of the paper structure are, above all, Al 2 O 3, Si 3 N 4 , AlN, ZrO 2, MgO, SiC and BeO or else combinations such as ZTA, in particle sizes of ⁇ 5 ⁇ m preferably ⁇
  • the respective typical sintering aids of the main fillers for example Y 2 O 3, CaO, MgO, SiO 2, etc., are included in the paper structure
  • a "Braunling" is produced from the preceramic paper structure ("green body"), in which the organic components of the preceramic paper structure, for example cellulose, starch and latex, are oxidatively removed.
  • a ceramic he material namely the paper ceramics with the typical material properties of a ceramic material is produced, such as a high bending and insulation strength.
  • the paper ceramics are lighter in comparison to a conventional ceramic and individually deformable prior to the implementation of the thermal conversion process.
  • the starting material of the paper-ceramic layer 2, specifically the preceramic paper structure can be stored and processed as a roll product due to the deformability becomes.
  • AI2O3 paper ceramics are preferred.
  • a pore structure comprising a multiplicity of pore-shaped cavities is formed as part of the described production method of the paper ceramics, the pore structure being open at least in the area of the top and / or bottom side 2a, 2b of the paper-ceramic layer 2 is trained.
  • the pore-shaped cavities often have the shape of the cellulose fibers removed by oxidation and are distributed approximately uniformly over the entire paper-ceramic layer 2. Based on the total volume of the paper-ceramic layer 2, the proportion of the open pore structure is between 5 and 70% by volume. This can be adjusted by appropriate choice of the composition of the components of the preceramic paper structure.
  • elongate pores are formed which extend along the plane of the page or the x-y plane of a plate-shaped paper ceramics. These are thus distributed spatially approximately homogeneously. Due to the aforementioned pore structure, the paper ceramics exhibit similar material properties along the x-y plane, whereas in the z direction the paper ceramics can develop different material properties. This creates a certain anisotropic effect.
  • the pore-shaped cavities of the pore structure of the paper-ceramic layer 2 are at least in the area of the top and / or bottom 2a, 2b filled or infiltrated using an infiltration process with a metal or a metal alloy that on the top and / or Bottom 2a, 2b at least one metallization layer 3, 4 with a layer thickness d2, d3 between 0.1 to 10 ⁇ forms.
  • a first metallization layer 3 with a second layer thickness d2 is on the upper side 2a and a second metallization layer 4 with a third on the lower side 2b Layer thickness d3 provided.
  • the second and third layer thickness d2, d3 at least approximately coincide.
  • FIGS. 1 to 5 a Cartesian coordinate system is shown to explain the subject matter of the invention, which comprises an x-axis, y-axis and a z-axis.
  • the substrate 1 extends in a plane extending parallel to the x-y plane, in such a way that the first metallization layer 3, the paper-ceramic layer 2 and the second metallization layer 4 adjoin one another along the z-axis.
  • the upper and / or lower side 2 a, 2 b of the paper-ceramic layer 2 are exposed to a liquid metal or a liquid metal alloy in a preferably non-oxidizing atmosphere and thereby at least the porous and / or underside 2 a, 2 b located in the area of the upper and / or lower side 2 a, 2 b.
  • the pore structure is infiltrated to a predetermined degree with liquid metal or a liquid metal alloy, in such a way that at least at the infiltrated top and / or bottom 2a, 2b, the metallization layer 3, 4 with a layer thickness d2, d3 between 0.1 to 10 ⁇ forms.
  • the infiltration process is carried out in a temperature range T which permits processing of the respective metal or of the respective metal alloy, ie at least in the region of the melting point of the metal or metal alloy used in each case.
  • a temperature range T which permits processing of the respective metal or of the respective metal alloy, ie at least in the region of the melting point of the metal or metal alloy used in each case.
  • non-pressure infiltration or spontaneous infiltration or pressure infiltration or vacuum infiltration can be used as infiltration methods.
  • FIG. 2 shows in a schematic representation, for example, the infiltration process in an atmosphere indicated by a dashed line with a temperature range T.
  • the infiltration takes place here in the region of the upper side 2a in the z direction and in the region of the lower side 2b opposite to the z direction.
  • all metals or metal alloys are suitable for infiltration, and copper or copper alloys or aluminum or aluminum alloys are particularly preferably used for applications in the field of power electronics.
  • the latter metals or alloys advantageously have a low melting point, so that low-cost furnaces with a heating temperature of up to 1300 ° C. can be used to carry out the infiltration process or provide the required temperature range T.
  • the thermal and / or electrical properties of the substrate 1 can be adjusted individually and thus to the respective Purpose of the substrate 1 can be adjusted.
  • the thermal and / or electrical properties of the substrate 1 and their mechanical properties are adjustable, i. adaptable to the particular application or intended use of the substrate 1.
  • the paper-ceramic layer 2 can be infiltrated with special solder materials or solder alloys, in order subsequently to ensure optimum bonding of the substrate 1 via the metallization layers 3, 4 produced by means of bonding and / or bonding technologies adapted to the infiltrated solder materials or solder alloys.
  • solder materials or solder alloys in order subsequently to ensure optimum bonding of the substrate 1 via the metallization layers 3, 4 produced by means of bonding and / or bonding technologies adapted to the infiltrated solder materials or solder alloys.
  • the use of pressure-free infiltration or spontaneous infiltration due to the low wettability of the top and / or bottom 2.1, 2.2 of the paper-ceramic layer 2 requires the addition of Oxygen required, for example, in a desired infiltration with copper in the form of copper oxide or a copper oxide alloy.
  • the thermal and / or electrical properties of the substrate 1 can additionally be adjusted via the amount of added oxygen.
  • the first and second metallization layers 3, 4 extend over the upper and lower sides 2a, 2b of the paper-ceramic layer 2 in a planar fashion.
  • the paper-ceramic layer 2 is made of Al 2 O 3.
  • both the first and second metallization layers 3, 4 were produced, and at least one third of the pore structure was filled, for example, with a copper oxide alloy, specifically the region of the pore structure adjoining the top and / or bottom 2a, 2b.
  • the substrate 1 according to the invention also has two or more interconnected paper-ceramic layers 2, which form a paper-ceramic composite layer with a greater width or extension along the z-axis.
  • this paper-ceramic composite layer comprising a plurality of paper ceramic layers 2 is infiltrated at its top and / or bottom using a suitable method with a metal or a metal alloy.
  • the connection of the individual paper-ceramic layers 2 to a paper-ceramic composite layer can be effected, for example, by means of suitable adhesive methods or sintering methods.
  • the paper-ceramic composite layer can also be formed as a composite layer, ie comprise a plurality of different paper ceramic layers or paper ceramic layers with different properties.
  • the individual paper ceramic layers could have a different pore structure and / or be made of different ceramic materials.
  • the layer thickness d 2, d 3 of the metallization layers 3, 4 produced can be further increased by the use of further metallization processes, such as, for example, galvanic deposition or sputtering.
  • the metallization layer 3, 4 produced according to the invention have approximately a surface roughness corresponding to the surface roughness of the upper and / or lower side of the 2a, 2b of the paper-ceramic layer 2.
  • the surface is correspondingly increased in a particularly advantageous manner, which leads to an increase in the adhesion or bonding strength when using bonding technologies with a bonding layer that clearly exceeds the surface roughness.
  • the surface roughness and thus also the flatness as well as the total layer thickness of the substrate 1 can be set in an application-specific manner.
  • the substrate 1 shown in FIG. 1 is used as a so-called "spacer” or spacer 5 between two further substrates 6, 7, wherein at least one of the further substrates 6, 7 is equipped with an electronic component 8.
  • the electronic component 8 can be formed, for example, by a semiconductor component for power electronics, such as a transistor amplifier, a bipolar transistor or a bipolar transistor with an insulated gate electrode, and an electrically conductive connection between the two substrates 6, 7 can also be produced via the substrate 1 according to the invention.
  • FIG. 3 shows by way of example a power module comprising a substrate 1 according to the invention which forms a spacer 5 between a first and a second substrate 6, 7, in particular in the present exemplary embodiment, between the electronic component 8 and the first substrate 6.
  • the first and second substrate 6, 7 are formed in the present embodiment by a metal-ceramic substrate, which are arranged, for example, each along a plane parallel to the x-y plane extending.
  • the first substrate 6 has a first ceramic layer 9 and a first metallization 10 provided on its upper side 9a and a second metallization 11 provided on its lower side 9b.
  • the second substrate 7 comprises a second ceramic layer 12 and a first metallization 13 provided on its upper side 12a and a second metallization 14 provided on the lower side 12b thereof.
  • the first metallization 13 of the second substrate 7 is structured into a plurality of metallization sections 13a, 13b and / or form contact surfaces.
  • the electronic component 8 is mounted with the underside on one of the metallization surfaces 13b of the second substrate 7 and the upper side of the electronic component 8 is connected to the second metallization layer 4 of the substrate 1 according to the invention via a solder connection 15, for example. Furthermore, the first metallization layer 3 is connected via a further solder connection 16 to the second metallization 1 1 of the first substrate 6.
  • the substrate 1 according to the invention here forms an expansion-adapted spacer between the two substrates 6, 7. It is understood that, instead of the solder connections 16, 17, alternative bonding technologies are also used which ensure a heat-conducting connection between the electrical component 8 and the spacer 5.
  • the first and second substrates 6, 7 may be formed, for example, by a direct copper bonding substrate, an active metal bonding substrate, a direct aluminum bonding substrate, a direct-plated copper substrate, and / or or one or more, possibly formed of different metals and / or metal alloys metal layers comprising substrate may be formed.
  • At least two substrates 1 according to the invention according to FIG. 1 are connected to form a module, directly or indirectly via their respective metallization layers 3, 4.
  • the metallization layers 3, 4 can be connected to one another by soldering or gluing.
  • the substrates 1 connected to one another in a module have a different degree of infiltration, ie. the substrates 1 have different thermal and / or electrical properties.
  • the substrate 1 according to the invention has at least one further paper ceramic layer 2.1, 2.2 connected to a metallization layer 3, 4, which preferably is not infiltrated with metal or a metal alloy and thus untreated.
  • FIG. 4 shows, for example, a substrate arrangement comprising a substrate 1 according to the invention and a first and second paper ceramic layer 2.1, 2.2.
  • the first paper ceramic layer 2.1 is directly connected, for example via a first adhesive layer 17 to the first metallization layer 3 and the second paper dielectric layer 2.2, for example via a second adhesive layer 18 to the second metallization layer 4.
  • the at least one adhesive layer 17, 18 is produced by applying at least one adhesive to the respective metallization layer 3, 4 and / or on the top or bottom 2.1 a, 2.2 a of the respective paper ceramic layer 2.1, 2.2 such that by means of the applied adhesive the pore-shaped cavities of the pore structure of the paper-ceramic layers 2.1, 2.2 at least whose surface, ie in the region of the top or bottom 2.1 a, 2.2 a of the paper-ceramic layer 3, 4 are at least partially filled.
  • at least the surface-side open pore-shaped cavities of the paper-ceramic layers 3, 4 are closed in the connection region by means of the adhesive.
  • the adhesive is also at least partially in the top or bottom 2.1 a, 2.2 a of the paper ceramic layer 2.1, 2.2 adjoining or arranged in the area porenformigen cavities and possibly also existing cracks in the paper ceramic layer 2.1, 2.2 in the frame - Men of the production of the adhesive bond between the metallization layer 3, 4 and the paper ceramic layer 2.1, 2.2 introduced, ie
  • the adhesive penetrates into the pore-shaped cavities and closes them completely in the section of the paper-ceramic layer 2.1, 2.2 adjoining the top or bottom 2.1a, 2.2a of the paper-ceramic layer 2.1, 2.2.
  • this reduces the existing porosity or pore structure of the paper-ceramic layer 2.1, 2.2 to less than 10% and thus significantly improves its insulation resistance.
  • more than one third of the pore-shaped cavities in the paper-ceramic layers 2.1, 2.2 can at least partially be filled with the adhesive.
  • the first and second Textilke- ceramic layer 2.1, 2.2 in this case, for example, have a fourth and fifth layer thickness between 0.2 and 0.8 mm.
  • a plurality of paper ceramic layers 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6 are connected to form a paper-ceramic composite layer 20, 20 ', which respectively adjoin the metallization layer 3, 4 of the substrate 1 and preferably with the latter First and second adhesive layer 17, 18 are attached thereto.
  • connection of the paper-ceramic layers 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6 to form the paper-ceramic composite layer 19, 20 takes place, for example, by means of gluing or sintering.
  • spacers with a greater width that is, their extent along the z-axis, can thereby be produced particularly advantageously be increased significantly.
  • an individual adaptation to the internal content of a power module required spacing ratios is possible.
  • the adhesive application can be carried out using known methods, wherein in particular a pre-hardening of the applied adhesive, in particular a temperature treatment can be carried out to optionally in the adhesive containing volatile components such as solvents or reaction products to remove.
  • the further paper ceramic layers 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6 or the paper-ceramic composite layer 19, 20 produced therefrom are mechanically processed before being bonded to one another and / or before being bonded to the substrate 1 according to the invention to set the respectively required flatness and / or predetermined thickness tolerances.
  • the paper-ceramic layers 2, 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6 provided with the respective adhesive application are, for example, joined using a lamination process, specifically at a predetermined pressure and / or temperature.
  • the pressure is in this case dimensioned such that an areal homogeneous and bubble-free connection of the paper-ceramic layers 2, 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6 is ensured.
  • the deflection of the substrate 1 is reduced to a minimum.
  • roll and / or flat laminators can be used in the lamination process.
  • adhesives for the production of the adhesive layer different adhesives can be used, which have a temperature stability of at least 100 ° C after curing.
  • adhesives are applied and harden under temperature increase and / or pressure increase.
  • the corresponding cured between the paper ceramic layers 2, 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6 then preferably have a temperature stability of 100 ° C to 350 ° C.
  • finely dispersed particles which are electrically non-conductive but have good thermal conductivity for example Si 3 N 4 , ALN or AL 2 O 3, may be added to the particular adhesive used.
  • adhesives or adhesives of low viscosity are preferably used, preferably less than 30 Pas, in order to fill the porous upper and lower side of the paper ceramic layers 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6 and thus increase their insulation resistance.
  • different adhesives can be used, which have, for example, a different viscosity.
  • the adhesives provided for filling the pore-shaped cavities and producing the adhesive bond which are applied directly to the top and / or bottom of the paper-ceramic layers 2.1, 2.3, 2.4 or 2.2, 2.5, 2.6, should have a low viscosity to ensure easy penetration into the pore-shaped cavities.
  • a wide variety of metals and metal alloys can be used, for example, copper, aluminum, gold, silver, tin, zinc, molybdenum, tungsten, chromium, titanium or their alloys, for example an oxygen-enriched copper alloy.
  • the use of powder metallurgical mixtures of different metals is possible.
  • the infiltration of a paper-ceramic composite layer comprising several paper-ceramic layers 2 can take place simultaneously with the formation thereof in one process step, and by applying powder-metallurgical mixtures of different metals on the top and / or bottom of the paper-ceramic layers 2 to be joined together.
  • additional metal layers can be used, which are made of the aforementioned metals or metal alloys. These can also be produced, for example, per se known resistance alloy materials, which are marketed under the product names manganin, ceranin or Isaohm.
  • the substrates 1 according to the invention can also serve as printed circuit boards for electrical or electronic circuits or circuit modules, in particular for electronic power circuits.
  • additional metal layers can be provided which are structured in a manner known per se by means of masking and etching technologies into a plurality of metallization sections and thus form, for example, printed conductors, contact surfaces and / or terminal surfaces.
  • the structuring of such metal layers preferably takes place after the production of the substrate 1 according to the invention.
  • This type of structuring is one of the subtractive methods in which a part of the metallization is removed or weakened in a wet-chemical process.
  • Substrates 1 also additive processes such as a galvanic deposition are used to locally or over the entire surface to increase the layer thickness of an additional metal layer. This can e.g. also be carried out by soldering of moldings at defined locations of the structured substrate.
  • the substrates 1 according to the invention in the form of multiple substrates, which are separated after the production to the desired substrates 1. Singulation takes place in the case of the substrates 1 according to the invention, for example by means of mechanical processing operations such as, for example, sawing, cutting or punching or using a laser unit or a water-jet cutting edge. Accordingly, unlike the prior art, the unstructured metal layer 7 preferably also extends as far as the edge of the cut edge of the respective substrate 1.
  • the respective adhesive layer 17, 18 has at least two different adhesives, which are preferably applied in layers one behind the other.
  • adhesives of different viscosities can be used, the one adhesive having a lower viscosity being used to fill the pore-shaped cavities in the paper-ceramic layer 2.1, 2.2 and the further adhesive having a high viscosity being used to produce the adhesive bond of the layer composite.
  • pretreatments can be carried out, and this can still be done in the paper state and / or on the already produced ceramic.
  • pressing downstream of the paper production process for example by means of calendering or coating the paper, can contribute to a reduction in the pore-shaped cavities.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Ceramic Products (AREA)

Abstract

L'invention concerne un substrat (1) pour circuits électriques comprenant au moins une couche de céramique à papier (2) comprenant des faces supérieure et inférieure (2a, 2b), qui présentent une structure de pores composée d'une pluralité de cavités en forme de pores, caractérisé en ce que les cavités en forme de pores de la structure de pores sont, au moins dans la zone des faces supérieure et/ou inférieure (2a, 2b) de la couche de céramique à papier (2), remplies d'un métal ou d'un alliage métallique par utilisation d'un procédé d'infiltration, de telle façon qu'au moins une couche de métallisation (3, 4) avec une épaisseur de couche (d2, d3) entre 0,1 et 10 μm se forme sur les faces supérieure et/ou inférieure. L'invention concerne en outre un procédé pour la fabrication d'un tel substrat ainsi que de modules fabriqués avec celui-ci, en particulier des modules de puissance.
PCT/EP2018/067558 2017-06-29 2018-06-29 Substrat pour circuits électriques et procédé de fabrication d'un tel substrat WO2019002541A1 (fr)

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DE102017114442.0A DE102017114442B4 (de) 2017-06-29 2017-06-29 Modul mit Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Moduls

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Citations (5)

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Publication number Priority date Publication date Assignee Title
US5043535A (en) * 1989-03-10 1991-08-27 Olin Corporation Hermetic cerglass and cermet electronic packages
DE102006022598A1 (de) 2005-10-12 2007-04-19 Papiertechnische Stiftung München Keramik aus präkeramischen Papier- oder Pappstrukturen, Verfahren zu ihrer Herstellung und ihre Verwendung
EP1840264A1 (fr) * 2006-03-31 2007-10-03 PTS (Papiertechnische Stiftung) München Papier enrichis de carbone
US8608906B2 (en) 2010-10-01 2013-12-17 Fpinnovations Cellulose-reinforced high mineral content products and methods of making the same
DE102015111667A1 (de) * 2015-07-17 2017-01-19 Rogers Germany Gmbh Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates

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US5043535A (en) * 1989-03-10 1991-08-27 Olin Corporation Hermetic cerglass and cermet electronic packages
DE102006022598A1 (de) 2005-10-12 2007-04-19 Papiertechnische Stiftung München Keramik aus präkeramischen Papier- oder Pappstrukturen, Verfahren zu ihrer Herstellung und ihre Verwendung
US20090011208A1 (en) 2005-10-12 2009-01-08 Andreas Hofenauer Ceramics Made of Preceramic Paper or Board Structures, Method of Producing the Same and Use Thereof
EP1840264A1 (fr) * 2006-03-31 2007-10-03 PTS (Papiertechnische Stiftung) München Papier enrichis de carbone
US8608906B2 (en) 2010-10-01 2013-12-17 Fpinnovations Cellulose-reinforced high mineral content products and methods of making the same
DE102015111667A1 (de) * 2015-07-17 2017-01-19 Rogers Germany Gmbh Substrat für elektrische Schaltkreise und Verfahren zur Herstellung eines derartigen Substrates

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N.A. TARVITZKY: "Microstructure and mechanical properties of alumina/copper composites fabricated by different infiltration techniques", MATERIALS LETTERS, vol. 36, 1998, pages 114 - 117, XP004336897, DOI: doi:10.1016/S0167-577X(98)00012-3

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