WO2019001243A1 - 壳体、天线装置、移动终端及壳体加工方法 - Google Patents

壳体、天线装置、移动终端及壳体加工方法 Download PDF

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Publication number
WO2019001243A1
WO2019001243A1 PCT/CN2018/090473 CN2018090473W WO2019001243A1 WO 2019001243 A1 WO2019001243 A1 WO 2019001243A1 CN 2018090473 W CN2018090473 W CN 2018090473W WO 2019001243 A1 WO2019001243 A1 WO 2019001243A1
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WO
WIPO (PCT)
Prior art keywords
slits
housing
slit
micro
radio frequency
Prior art date
Application number
PCT/CN2018/090473
Other languages
English (en)
French (fr)
Inventor
汤星星
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710530728.9A external-priority patent/CN107394389B/zh
Priority claimed from CN201720789157.6U external-priority patent/CN206907918U/zh
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2019001243A1 publication Critical patent/WO2019001243A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present application relates to the field of communication device technologies, and in particular, to a housing, an antenna device, a mobile terminal, and a housing processing method.
  • metal is a signal shielding material. Although the all-metal housing is beautiful, it will block the RF signal of the antenna.
  • the traditional electronic products cut the gap on the metal casing by the numerical control machine tool to form the clearance area. Due to the limitation of the tool or the control mode of the numerical control machine tool, the area of the clearance area processed is often large, which easily leads to insufficient structural strength of the casing.
  • the technical problem to be solved by the present application is to provide a housing, an antenna device, a mobile terminal, and a housing processing method with high structural strength.
  • a housing having at least two conductive portions and at least one insulating portion that blocks the at least two conductive portions, the insulating portions having micro slit strips and respectively connected to the ends of the micro slit strips
  • the two slits have a plurality of micro slits, each of the micro slits is connected to the two slits, and the plurality of micro slits and the two slits are filled with an insulating material.
  • an antenna device including a radio frequency transceiver circuit, a matching circuit, and the above-mentioned housing, and the radio frequency transceiver circuit is electrically connected to the conductive portion through the matching circuit.
  • a mobile terminal comprising an antenna assembly and the housing, the antenna assembly being located inside the housing.
  • a method of processing a housing including:
  • microslit tape Forming a microslit tape on the shell substrate by laser cutting, wherein the microslit strip has a plurality of micro slits;
  • An insulating material is filled in the plurality of micro slits and the two slits to form a casing.
  • FIG. 1 is a schematic structural diagram of an implementation manner of a mobile terminal according to an embodiment of the present application.
  • FIG. 2 is a schematic structural view of an embodiment of a housing of the mobile terminal shown in FIG. 1.
  • FIG. 2 is a schematic structural view of an embodiment of a housing of the mobile terminal shown in FIG. 1.
  • Figure 3 is an enlarged view of the structure at A in Figure 2.
  • FIG. 4 is another schematic structural diagram of the mobile terminal shown in FIG. 1.
  • FIG. 5 is a schematic structural diagram of still another mobile terminal shown in FIG. 1.
  • FIG. 5 is a schematic structural diagram of still another mobile terminal shown in FIG. 1.
  • FIG. 6 is a schematic structural diagram of another embodiment of a mobile terminal according to an embodiment of the present application.
  • FIG. 7 is a schematic structural view of another embodiment of a housing of the mobile terminal shown in FIG. 1.
  • FIG. 7 is a schematic structural view of another embodiment of a housing of the mobile terminal shown in FIG. 1.
  • the fixed connection may also be detachably connected or integrally connected; it may be a mechanical connection; it may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood in the specific circumstances for those skilled in the art.
  • the embodiment of the present application provides a mobile terminal 100 , which includes a housing 1 and a terminal body located inside the housing 1 .
  • the terminal body includes a main board, a display, a battery, and the like.
  • the mobile terminal 100 can be an electronic device such as a mobile phone, a notebook computer, or a tablet computer.
  • the housing 1 has at least two conductive portions 11 and at least one insulating portion 12 that blocks the at least two conductive portions 11.
  • the at least one insulating portion 12 may be one insulating portion 12 or a plurality of insulating portions 12.
  • the conductive portion 11 is made of a conductive material such as metal.
  • the insulating portion 12 has a microslit strip 13 and two slits 14 respectively connected to both ends of the micro slit strip 13. That is, the microslit tape 13 is connected between the two slits 14.
  • the microslit strip 13 has a plurality of slits 131, each of which is connected to the two slits 14.
  • the plurality of slits 131 and the two slits 14 are filled with an insulating material. At this time, the insulating portion 12 can smoothly block the electrical connection between the at least two conductive portions 11.
  • the insulating portion 12 adopts a mixed structure of the slit 14 - the micro slit tape 13 - the slit 14 , which enhances the structural strength of the housing 1 compared to the pure slit structure in the prior art.
  • the structural strength of the housing 1 is high. Since the width h of each of the micro slits 13 in the microslit tape 13 is small, it is not easy to attract the attention of the consumer in appearance, and thus it is advantageous to ensure the appearance of the casing 1 and the mobile terminal 100.
  • the integrity of the housing 1 and the mobile terminal 100 can be made more ornamental by designing the shape of the slot 14.
  • the micro slit tape 13 and the two micro slits 14 of the micro slit tape 13 are both Can become an antenna clearance area for RF signals to pass. Since the shape (and the area) are different, the micro slit tape 13 and the two slits 14 can also become antenna clearance areas of different antennas, so that the function of the mobile terminal 100 to which the housing 1 is applied is more diverse.
  • the terminal body of the mobile terminal 100 further includes an antenna component.
  • the antenna assembly includes a first antenna 3, a second antenna 4, and a third antenna 5.
  • the first antenna 3 includes a first radio frequency transceiver circuit 31, a first radiator 32, and a first matching circuit 33 connected between the first radio frequency transceiver circuit 31 and the first radiator 32.
  • the first radiator 32 of the first antenna 3 is disposed opposite to the micro slit tape 13.
  • the first radio frequency transceiver circuit 31 is configured to transmit and receive radio frequency signals, which are also called radio frequency chips.
  • the first matching circuit 33 is used to adjust the impedance matching of the first radiator 32 so that the first radiator 32 can better transmit and receive radio frequency signals.
  • the second antenna 4 includes a second radio frequency transceiver circuit 41, a second radiator 42 and a second matching circuit 43 connected between the second radio frequency transceiver circuit 41 and the second radiator 42.
  • the second radiator 42 of the second antenna 4 is disposed opposite one of the slits 14.
  • the third antenna 5 includes a third radio frequency transceiver circuit 51, a third radiator 52, and a third matching circuit 53 connected between the third radio frequency transceiver circuit 51 and the third radiator 52.
  • the third radiator 52 is disposed adjacent to the other of the slits 14.
  • the first radio frequency transceiver circuit 31 can be used to process radio frequency signals such as GPS signals, Bluetooth signals, WiFi signals, or mobile communication signals (such as mobile communication signals in different communication bands under network standards such as GSM, CDMA, LTE, and LTE-A).
  • the second radio frequency transceiver circuit 41 can be used to process radio frequency signals such as GPS signals, Bluetooth signals, WiFi signals, or mobile communication signals (such as mobile communication signals of different communication bands under network standards such as GSM, CDMA, LTE, and LTE-A).
  • the third radio frequency transceiver circuit 51 can be used to process radio frequency signals such as GPS signals, Bluetooth signals, WiFi signals, or mobile communication signals (such as mobile communication signals of different communication bands under network standards such as GSM, CDMA, LTE, and LTE-A). .
  • radio frequency signals such as GPS signals, Bluetooth signals, WiFi signals, or mobile communication signals (such as mobile communication signals of different communication bands under network standards such as GSM, CDMA, LTE, and LTE-A).
  • the first radio frequency transceiver circuit 31 of the first antenna 3 and the second radio frequency transceiver circuit 41 of the second antenna 4 are used to process different radio frequency signals, such as radio frequency signals of the same signal type, different signal bands, or signals. Different types of RF signals.
  • the radio frequency signal processed by the third radio frequency transceiver circuit 51 is different from the first radio frequency transceiver circuit 31, and the radio frequency signal processed by the third radio frequency transceiver circuit 51 can be processed by the second radio frequency transceiver circuit 41.
  • the RF signals are the same or different.
  • the mobile terminal 100 includes an antenna device 200.
  • the antenna device 200 includes a radio frequency transceiver circuit 7, a matching circuit 8, and the housing 1.
  • the radio frequency transceiver circuit 7 is electrically connected to the conductive portion 11 through the matching circuit 8.
  • the conductive portion 11 forms a radiator of the antenna device 200.
  • the radio frequency transceiver circuit 7 and the matching circuit 8 are located inside the casing 1.
  • the antenna device 200 may include a plurality of the radio frequency transceiver circuits 7 and a plurality of the matching circuits 8 corresponding to the plurality of radio frequency transceiver circuits 7.
  • the conductive portions 11 are multiplexed into different radiators (which can be realized by grounding at a required position or forming a loop by capacitive coupling).
  • the number of the radio frequency transceiver circuits 7 in the antenna device 200 is plural, and the number of the matching circuits 8 corresponds to the number of the radio frequency transceiver circuits 7, and is also plural.
  • a plurality of the radio frequency transceiver circuits 7 are connected to the same one of the conductive portions 11 via a plurality of the matching circuits 8 in a one-to-one correspondence to multiplex the conductive portions 11.
  • the width h of the micro slit 131 is 0.05 mm to 0.15 mm.
  • the width h of the micro slit 131 is 0.06 mm, which is hardly visible to the naked eye, thereby ensuring the mobile terminal 100.
  • the antenna RF signal can pass while also improving the overall appearance of the housing 1.
  • the width H of the slit 14 is greater than the width h of the micro slit 131. Since the width H of the slit 14 is large, the slit 14 can be formed by mechanical cutting. Since the width h of the micro slit 131 is small, the micro slit 131 can be formed by laser cutting. For example, the microslit tape 13 may be formed first by laser cutting, and then the material at both ends of the microslit tape 13 may be removed by mechanical cutting to form the two slits 14.
  • the material which is deformed by the stress impact in the laser cutting step near the both ends of the microslit tape 13 can be removed, thereby improving the processing accuracy of the insulating portion 12, so that the The product yield of the housing 1 is high.
  • the width H of the single slit 14 is greater than the sum of the widths h of all the slits 131. At this time, the width H' of the entire microslit tape 13 is close to the width H of the single slit 14, so that the insulating portion 12 is more integral.
  • the width H of a single slit 14 is equal to the width H' of the microslit strip 13.
  • the insulating portion 12 has a uniform width in a direction perpendicular to the extending direction thereof, so that the integrity of the appearance of the casing 1 can be improved, so that the user's experience is better.
  • the microslit tape 13 includes at least one dividing strip 132 for separating the plurality of micro slits 131.
  • the material of the dividing strip 132 is
  • the conductive portions 11 are made of the same material.
  • the partitioning strip 132 and the conductive portion 11 have a relatively uniform appearance, which is advantageous for improving the integrity of the appearance of the casing 1.
  • the plurality of micro slits 131 are spaced apart from each other, for example, spaced apart from each other and parallel, and the present application is described by way of example. In another embodiment, the plurality of slits 131 may also be in the presence of intersecting regions.
  • the width h' of the dividing strip 132 is greater than or equal to the width h of the micro slit 131.
  • the ratio of the area of the slit 14 of the microslit tape 13 is made less than 50%, which further ensures the overall appearance of the casing 1 with better appearance under naked eye.
  • the housing 1 includes two long sides 15 which are oppositely disposed and two short sides which are oppositely connected between the two long sides 15. Side 16.
  • the housing 1 is substantially rectangular.
  • the two slits 14 extend to the two long sides 15 respectively.
  • the insulating portion 12 extends from one of the long sides 15 to the other long side 15.
  • the extending direction of the microslit strip 13 coincides with the extending direction of the short side 16 of the casing 1.
  • the microslit strip 13 is spaced apart from the short side 16, and the camera assembly 6 of the mobile terminal 100 is located at the micro slit strip 13 and the short side 16 between.
  • the microslit strip 13 is disposed near the short side 16, and the camera assembly 6 of the mobile terminal 100 is located away from the micro slit strip 13.
  • One side of the short side 16 is described.
  • the microslit strip 13 is disposed adjacent to the short side 16 such that the microslit strip 13 is visually very close to the edge of the housing 1 such that the overall appearance of the housing 1 is better.
  • the extending direction of the plurality of slits 131 coincides with the extending direction of the short side 16 of the casing 1.
  • each of the slits 14 includes an arc segment 141 and a straight segment 142.
  • the arc segment 141 is connected to the straight segment 142 and the micro slit tape. Between 13 At this time, the straight line segment 142 may extend to the two long sides 15 of the casing 1 such that the straight line segment 142 is easier to machine and also reduces the processing difficulty of the slit 14.
  • the arc segment 141 can smoothly transition the straight line segment 142 and the micro slit tape 13 to reduce the processing difficulty of the insulating portion 12.
  • the adjacent short side 16 of the casing 1 and the long side 15 are transitioned by a circular arc 17, and the shape of the curved section 141 is the same as or similar to the shape of the circular arc 17.
  • the extending direction of the straight line segment 142 is consistent with the extending direction of the short side 16 of the housing 1 .
  • the extending direction of the straight section 142 coincides with the extending direction of the microslit strip 13.
  • the insulating portion 12 may also extend from one of the long sides 15 to one of the short sides 16.
  • the micro slit tape 13 may have a substantially inline shape.
  • One of the slits 14 may be perpendicular to the other of the slits 14.
  • the insulating portion 12 may also extend from one of the short sides 16 to the other of the short sides 16.
  • the embodiment of the present application further provides a housing processing method, which can be used to form the housing 1 of the foregoing embodiment.
  • the housing processing method includes:
  • the housing substrate is made of a conductive material such as a metal.
  • S02 forming a microslit strip 13 on the shell substrate by laser cutting, wherein the micro slit strip 13 has a plurality of slits 131.
  • the laser-cut area is in the predetermined area of the insulating portion 12, but may extend beyond the area of the micro-slit strip 13, for example, from a predetermined area of a slit 14 until it extends into another
  • the predetermined area of the slit 14 is favorable for improving the cutting quality of the plurality of slits 131.
  • the laser cutting trajectory during laser cutting extends from a predetermined area of one of the slits 14 to a predetermined area of the other of the slits 14.
  • Auxiliary cooling treatment can be performed during the laser cutting process to reduce the temperature during the laser cutting process to form the desired micro slits 131. It can be understood that the auxiliary cooling treatment is a high pressure nitrogen assisted cooling treatment.
  • S03 forming two slits 14 on the shell substrate by mechanical cutting, wherein the two slits 14 are connected at two ends of the micro slit strip 13, and each of the slits 131 is connected to The two slits 14.
  • the mechanically cut region corresponds to a predetermined area of the two slits 14.
  • the insulating material may be plastic
  • the insulating portion 12 is obtained by performing nano (NMT) injection molding filling on each of the micro slits 131 and the two slits 14.
  • NMT nano

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  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请公开了一种壳体，具有至少两个导电部以及隔断至少两个导电部的至少一绝缘部，绝缘部具有微缝带及分别连接在微缝带两端的两条缝隙，微缝带具有多条微缝，每条微缝均连通至两条缝隙，多条微缝和两条缝隙内均填充有绝缘材料。上述壳体结构强度较高。本申请还公开了一种天线装置、移动终端以及壳体加工方法。

Description

壳体、天线装置、移动终端及壳体加工方法 技术领域
本申请涉及通讯设备技术领域，尤其涉及一种壳体、一种天线装置、一种移动终端以及一种壳体加工方法。
背景技术
随着科技的发展及使用者对电子产品的信号及外观质量要求越来越高，目前市面上的手机等具有天线的电子产品很多选用金属作为外观壳体(包括侧面、背盖等)，以满足质感的外观。众所周知，金属为信号屏蔽材料，全金属壳体虽然美观，但会对天线的射频信号产生一定的阻挡。
传统电子产品通过数控机床在金属壳体上切割缝隙以形成净空区域，由于数控机床的刀具或者控制方式的限制，加工出的净空区域面积往往较大，容易导致壳体的结构强度不足。
发明内容
本申请所要解决的技术问题在于提供一种结构强度较高的壳体、天线装置、移动终端及壳体加工方法。
为了实现上述目的，本申请实施方式采用如下技术方案：
第一方面，提供一种壳体，具有至少两个导电部以及隔断所述至少两个导电部的至少一绝缘部，所述绝缘部具有微缝带及分别连接在所述微缝带两端的两条缝隙，所述微缝带具有多条微缝，每条所述微缝均连通至所述两条缝隙，所述多条微缝和所述两条缝隙内均填充有绝缘材料。
第二方面，还提供一种天线装置，包括射频收发电路、匹配电路及上述壳体，所述射频收发电路通过所述匹配电路与所述导电部电连接。
第三方面，还提供一种移动终端，包括天线组件和上述壳体，所述天线组件位于所述壳体内部。
第四方面，还提供一种壳体加工方法，包括：
通过激光切割方式在壳体基材上形成微缝带，其中，所述微缝带具有多条微缝；
通过机械切割方式在所述壳体基材上形成两条缝隙，其中，所述两条缝隙连接在所述微缝带的两端，每条所述微缝均连通至所述两条缝隙；以及
在所述多条微缝和所述两条缝隙内填充绝缘材料，以形成壳体。
附图说明
为了更清楚地说明本申请的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是本申请实施例提供的移动终端的一种实施方式的结构示意图。
图2是图1所示移动终端的壳体的一种实施方式的结构示意图。
图3是图2中A处结构的放大图。
图4是图1所示移动终端的另一结构示意图。
图5是图1所示移动终端的再一结构示意图。
图6是本申请实施例提供的移动终端的另一种实施方式的结构示意图。
图7是图1所示移动终端的壳体的另一种实施方式的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
此外，以下各实施例的说明是参考附加的图示，用以例示本申请可用以实施的特定实施例。本申请中所提到的方向用语，例如，“上”、“下”、“前”、“后”、“左”、“右”、“内”、“外”、“侧面”等，仅是参考附加图式的方向，因此，使用的方向用语是为了更好、更清楚地说明及理解本申请，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“设置在……上”应做广义理解，例如，可以是 固定连接，也可以是可拆卸地连接，或者一体地连接；可以是机械连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
此外，在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。若本说明书中出现“工序”的用语，其不仅是指独立的工序，在与其它工序无法明确区别时，只要能实现该工序所预期的作用则也包括在本用语中。另外，本说明书中用“～”表示的数值范围是指将“～”前后记载的数值分别作为最小值及最大值包括在内的范围。在附图中，结构相似或相同的单元用相同的标号表示。
请一并参阅图1至图5，本申请实施例提供一种移动终端100，所述移动终端100包括壳体1和位于所述壳体1内部的终端本体。所述终端本体包括主板、显示器及电池等。所述移动终端100可以是手机、笔记本电脑、平板电脑等电子设备。
所述壳体1具有至少两个导电部11以及隔断所述至少两个导电部11的至少一绝缘部12。至少一个绝缘部12可以为一个绝缘部12或多个绝缘部12。所述导电部11采用导电材质制成，例如金属。所述绝缘部12具有微缝带13及分别连接在所述微缝带13两端的两条缝隙14。也即，所述微缝带13连接在所述两条缝隙14之间。所述微缝带13具有多条微缝131，每条所述微缝131均连通至所述两条缝隙14。所述多条微缝131和所述两条缝隙14内均填充有绝缘材料。此时，所述绝缘部12能够顺利隔断所述至少两个导电部11之间的电连接。
在本实施例中，所述绝缘部12采用缝隙14-微缝带13-缝隙14的混合结构，相较于现有技术中的纯缝隙结构，增强了所述壳体1的结构强度，使得所述壳体1的结构强度较高。由于所述微缝带13中的每条所述微缝131的宽度h都很小，在外观上不易引起消费者的注意，因此有利于保证所述壳体1和所述移动终端100的外观的整体性，同时也可通过对所述缝隙14的形状的设计使得所述壳体1和所述移动终端100的外观更具观赏性。
可以理解的是，由于所述微缝带13的所述多条微缝131和所述两条缝隙14内均填充有绝缘材料，因此所述微缝带13和所述两条微缝131均能够成为天线净空区域，以供射频信号通过。由于形状(和面积)不同，因此所述微缝带13 和所述两条缝隙14还能够成为不同天线的天线净空区域，使得应用所述壳体1的移动终端100的功能更为多样化。
具体而言：如图4所示，所述移动终端100的所述终端本体还包括天线组件。所述天线组件包括第一天线3、第二天线4以及第三天线5。
所述第一天线3包括第一射频收发电路31、第一辐射体32以及连接在所述第一射频收发电路31与所述第一辐射体32之间的第一匹配电路33。所述第一天线3的所述第一辐射体32正对所述微缝带13设置。所述第一射频收发电路31用于收发射频信号，也称射频芯片。所述第一匹配电路33用于调节第一辐射体32的阻抗匹配，使得第一辐射体32能够更好地发射和接收射频信号。
所述第二天线4包括第二射频收发电路41、第二辐射体42以及连接在所述第二射频收发电路41与所述第二辐射体42之间的第二匹配电路43。所述第二天线4的所述第二辐射体42正对其中一条所述缝隙14设置。
所述第三天线5包括第三射频收发电路51、第三辐射体52以及连接在所述第三射频收发电路51与所述第三辐射体52之间的第三匹配电路53。所述第三辐射体52正对另外一条所述缝隙14设置。
所述第一射频收发电路31可以用于处理GPS信号、蓝牙信号、WiFi信号或移动通信信号(例如GSM、CDMA、LTE、LTE-A等网络制式下不同通信频段的移动通信信号)等射频信号。所述第二射频收发电路41可以用于处理GPS信号、蓝牙信号、WiFi信号或移动通信信号(例如GSM、CDMA、LTE、LTE-A等网络制式下不同通信频段的移动通信信号)等射频信号。所述第三射频收发电路51可以用于处理GPS信号、蓝牙信号、WiFi信号或移动通信信号(例如GSM、CDMA、LTE、LTE-A等网络制式下不同通信频段的移动通信信号)等射频信号。
所述第一天线3的第一射频收发电路31和所述第二天线4的第二射频收发电路41用于处理不同的射频信号，例如信号类型相同、信号频段不同的射频信号，或者是信号类型不同的射频信号。所述第三射频收发电路51所处理的射频信号不同于所述第一射频收发电路31，所述第三射频收发电路51所处理的射频信号可与所述第二射频收发电路41所处理的射频信号相同或不同。
在其他实施方式中，如图5所示，所述移动终端100包括天线装置200。所述天线装置200包括射频收发电路7、匹配电路8及所述壳体1。所述射频收发电路7通过所述匹配电路8与所述导电部11电连接。所述导电部11形成所述天线装 置200的辐射体。所述射频收发电路7和所述匹配电路8位于所述壳体1内部。
在本实施方式中，所述天线装置200可以包括多个所述射频收发电路7和对应于多个所述射频收发电路7的多个所述匹配电路8。多个所述匹配电路8均连接至所述导电部11时，所述导电部11复用成不同的辐射体(可通过在需要的位置接地或通过电容耦合形成回路来实现)。换言之，所述天线装置200中的所述射频收发电路7的数量为多个，所述匹配电路8的数量与所述射频收发电路7的数量相对应，也为多个。多个所述射频收发电路7一一对应地经多个所述匹配电路8连接至同一个所述导电部11，以复用所述导电部11。
可以理解的，通过共用所述导电部11来分别形成对应于不同的所述射频收发电路7的不同辐射体，可以有效节省所述移动终端100的内部空间，并可降低所述移动终端100的金属壳体对天线辐射性能的影响，从而提升所述天线装置200的信号收发性能。
可选的，所述微缝131的宽度h为0.05mm～0.15mm，本实施例中，所述微缝131的宽度h为0.06mm，肉眼几乎不可视，从而在保证所述移动终端100的天线射频信号能够通过的同时亦提高所述壳体1的外观的整体性。
请一并参阅图1至图5，作为一种可选实施例，所述缝隙14的宽度H大于所述微缝131的宽度h。由于所述缝隙14的宽度H较大，因此可采用机械切割方式形成所述缝隙14。由于所述微缝131的宽度h较小，因此可采用激光切割方式形成所述微缝131。例如，可通过激光切割方式先形成所述微缝带13，然后通过机械切割方式去除所述微缝带13两端的材料，以形成所述两条缝隙14。此时，在机械切割工序中，能够将靠近所述微缝带13两端的因激光切割工序中受应力冲击而发生形变的材料去除，从而提高了所述绝缘部12的加工精度，使得所述壳体1的产品良率较高。
可选的，单条所述缝隙14的宽度H大于所有的所述微缝131的宽度h的和。此时，所述微缝带13整体的宽度H’与单条所述缝隙14的宽度H相近，从而使得所述绝缘部12整体性更佳。
可选的，单条所述缝隙14的宽度H等于所述微缝带13的宽度H’。此时，所述绝缘部12在垂直于其延伸方向的方向上，具有均一的宽度，从而能够提高所述壳体1的外观的整体性，使得用户的体验感更好。
请一并参阅图1至图5，作为一种可选实施例，所述微缝带13包括用于分隔 所述多条微缝131的至少一条分隔条132，所述分隔条132的材料与所述导电部11的材料相同。此时，所述分隔条132与所述导电部11具有较为一致的外观，有利于提高所述壳体1的外观的整体性。
在一种实施方式中，所述多条微缝131是彼此间隔设置的，例如彼此间隔且平行，本申请以此为例进行说明。在另一种实施方式中，所述多条微缝131也可以是存在交叉区域的。
可选的，所述分隔条132的宽度h’大于等于所述微缝131的宽度h。使得所述微缝带13的缝隙14面积的比例小于50％，进一步保障所述壳体1在肉眼视觉下具有更佳的外观的整体性。
请一并参阅图1至图7，作为一种可选实施例，所述壳体1包括相对设置的两条长边15和相对地连接在所述两条长边15之间的两条短边16。所述壳体1大致呈矩形。
一种实施方式中，请一并参阅图1至图6，所述两条缝隙14分别延伸至所述两条长边15。换言之，所述绝缘部12自其中一条所述长边15延伸至另一条所述长边15。所述微缝带13的延伸方向与所述壳体1的短边16的延伸方向一致。
在一种实施方式中，如图6所示，所述微缝带13与所述短边16间隔设置，所述移动终端100的摄像组件6位于所述微缝带13与所述短边16之间。在另一种实施方式中，如图1至图5所示，所述微缝带13靠近所述短边16设置，所述移动终端100的摄像组件6位于所述微缝带13的远离所述短边16的一侧。所述微缝带13靠近所述短边16设置，使得所述微缝带13在外观视觉上非常靠近于所述壳体1的边缘，使得所述壳体1的外观的整体性更好。
所述微缝带13的所述多条微缝131彼此间隔且平行时，所述多条微缝131的延伸方向与所述壳体1的短边16的延伸方向一致。
请一并参阅图1至图5，可选的，每条所述缝隙14均包括弧线段141和直线段142，所述弧线段141连接在所述直线段142与所述微缝带13之间。此时，所述直线段142可延伸至所述壳体1的所述两条长边15，使得所述直线段142更容易加工，也降低所述缝隙14的加工难度。所述弧线段141能够顺利过渡所述直线段142与所述微缝带13，降低所述绝缘部12的加工难度。所述壳体1的相邻的所述短边16与所述长边15之间通过圆弧17过渡，所述弧线段141的形状与所述圆弧17的形状相同或相似。
可选的，所述直线段142的延伸方向与所述壳体1的短边16的延伸方向一致。所述直线段142的延伸方向与所述微缝带13的延伸方向一致。
在另一种实施方式中，如图7所示，所述绝缘部12也可自其中一条所述长边15延伸至其中一条所述短边16。此时，所述微缝带13可大致呈一字形。其中一条所述缝隙14可垂直于另一条所述缝隙14。
在再一种实施方式中，所述绝缘部12也可自其中一条所述短边16延伸至另一条所述短边16。
请一并参阅图1至图7，本申请实施例还提供一种壳体加工方法，可用于形成前述实施例所述壳体1。所述壳体加工方法包括：
S01：提供壳体基材。所述壳体基材采用导电材料，例如金属。
S02：通过激光切割方式在所述壳体基材上形成微缝带13，其中，所述微缝带13具有多条微缝131。可以理解的是，激光切割的区域在所述绝缘部12的预设区域内，但可以超出所述微缝带13的区域，例如自一条缝隙14的预设区域开始切割，直至伸入另一条所述缝隙14的预设区域内，有利于提高所述多条微缝131的切割质量。激光切割过程中的激光切割轨迹自一条所述缝隙14的预设区域延伸至另一条所述缝隙14的预设区域内。可在激光切割过程中进行辅助降温处理，以降低激光切割过程中的温度，形成所需的微缝131。可以理解的，所述辅助降温处理为高压氮气辅助降温处理。
S03：通过机械切割方式在所述壳体基材上形成两条缝隙14，其中，所述两条缝隙14连接在所述微缝带13的两端，每条所述微缝131均连通至所述两条缝隙14。机械切割的区域对应于所述两条缝隙14的预设区域，去除所述两条缝隙14的预设区域的材料时，能够将靠近所述微缝带13两端的因激光切割工序中受应力冲击而发生形变的材料去除，从而提高了所述绝缘部12的加工精度，使得所述壳体1的产品良率较高。
S04：在所述多条微缝131和所述两条缝隙14内填充绝缘材料，以形成壳体1。其中，所述绝缘材料可以为塑料，通过对每条所述微缝131和所述两条缝隙14进行纳米(NMT)注塑填充以获得所述绝缘部12。此时，所述壳体基材的被所述绝缘部12隔断的区域形成所述导电部11。
以上对本申请实施例进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的方 法及其核心思想；同时，对于本领域的一般技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种壳体，其特征在于，具有至少两个导电部以及隔断所述至少两个导电部的至少一绝缘部，所述绝缘部具有微缝带及分别连接在所述微缝带两端的两条缝隙，所述微缝带具有多条微缝，每条所述微缝均连通至所述两条缝隙，所述多条微缝和所述两条缝隙内均填充有绝缘材料。
  2. 如权利要求1所述的壳体，其特征在于，所述缝隙的宽度大于所述微缝的宽度。
  3. 如权利要求1或2所述的壳体，其特征在于，单条所述缝隙的宽度大于所有的所述微缝的宽度的和。
  4. 如权利要求1至3中任意一项所述的壳体，其特征在于，单条所述缝隙的宽度等于所述微缝带的宽度。
  5. 如权利要求1至4中任意一项所述的壳体，其特征在于，所述微缝带包括用于分隔所述多条微缝的至少一条分隔条，所述分隔条的材料与所述导电部的材料相同。
  6. 如权利要求5所述的壳体，其特征在于，所述分隔条的宽度大于等于所述微缝的宽度。
  7. 如权利要求1至6中任意一项所述的壳体，其特征在于，所述壳体包括相对设置的两条长边和相对地连接在所述两条长边之间的两条短边，所述两条缝隙分别延伸至所述两条长边。
  8. 如权利要求7所述的壳体，其特征在于，所述微缝带的延伸方向与所述壳体的短边的延伸方向一致。
  9. 如权利要求7或8所述的壳体，其特征在于，每条所述缝隙均包括弧线段和直线段，所述弧线段连接在所述直线段与所述微缝带之间。
  10. 如权利要求9所述的壳体，其特征在于，所述直线段的延伸方向与所述壳体的短边的延伸方向一致。
  11. 如权利要求1至6中任意一项所述的壳体，其特征在于，所述壳体包括相对设置的两条长边和相对地连接在所述两条长边之间的两条短边，所述绝缘部自其中一条所述长边延伸至其中一条所述短边。
  12. 如权利要求11所述的壳体，其特征在于，所述两条缝隙中的其中一 条所述缝隙垂直于另一条所述缝隙。
  13. 一种天线装置，其特征在于，包括射频收发电路、匹配电路及如权利要求1至12中任意一项所述的壳体，所述射频收发电路通过所述匹配电路与所述导电部电连接。
  14. 如权利要求13所述的天线装置，其特征在于，所述射频收发电路的数量为多个，所述匹配电路的数量为多个，多个所述射频收发电路一一对应地经多个所述匹配电路连接至同一个所述导电部。
  15. 一种移动终端，其特征在于，包括天线组件和如权利要求1至12中任意一项所述的壳体，所述天线组件位于所述壳体内部。
  16. 如权利要求15所述的移动终端，其特征在于，所述天线组件包括第一天线和第二天线，所述第一天线的第一辐射体正对所述微缝带设置，所述第二天线的第二辐射体正对其中一条所述缝隙设置。
  17. 如权利要求16所述的移动终端，其特征在于，所述第一天线的第一射频收发电路和所述第二天线的第二射频收发电路用于处理不同的射频信号。
  18. 如权利要求17所述的移动终端，其特征在于，所述第一射频收发电路用于处理GPS信号、蓝牙信号、WiFi信号或移动通信信号。
  19. 一种壳体加工方法，其特征在于，包括：
    通过激光切割方式在壳体基材上形成微缝带，其中，所述微缝带具有多条微缝；
    通过机械切割方式在所述壳体基材上形成两条缝隙，其中，所述两条缝隙连接在所述微缝带的两端，每条所述微缝均连通至所述两条缝隙；以及
    在所述多条微缝和所述两条缝隙内填充绝缘材料，以形成壳体。
  20. 如权利要求19所述的壳体加工方法，其特征在于，激光切割过程中的激光切割轨迹自一条所述缝隙的预设区域延伸至另一条所述缝隙的预设区域内。
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CN105896085A (zh) * 2016-05-30 2016-08-24 广东欧珀移动通信有限公司 天线装置及移动终端
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CN206907918U (zh) * 2017-06-29 2018-01-19 广东欧珀移动通信有限公司 壳体、天线装置及移动终端
CN206907917U (zh) * 2017-06-29 2018-01-19 广东欧珀移动通信有限公司 壳体、天线装置及移动终端

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