WO2019000892A1 - Procédé et appareil de prédiction de taux de mise au rebut pour une commande de carte de circuit imprimé - Google Patents

Procédé et appareil de prédiction de taux de mise au rebut pour une commande de carte de circuit imprimé Download PDF

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WO2019000892A1
WO2019000892A1 PCT/CN2017/120101 CN2017120101W WO2019000892A1 WO 2019000892 A1 WO2019000892 A1 WO 2019000892A1 CN 2017120101 W CN2017120101 W CN 2017120101W WO 2019000892 A1 WO2019000892 A1 WO 2019000892A1
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indicates
plate
circuit board
scrap rate
pcb order
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PCT/CN2017/120101
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English (en)
Chinese (zh)
Inventor
宫立军
邱醒亚
张可
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
宜兴硅谷电子科技有限公司
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Publication of WO2019000892A1 publication Critical patent/WO2019000892A1/fr

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"

Definitions

  • the present invention relates to the field of PCB technology, and in particular, to a PCB order rejection rate prediction method and apparatus.
  • PCB Printed Circuit Board, printed circuit board, also known as printed circuit board
  • PCB industry has many customers with PCB board source and random order, and PCB products have strong individuality, production parameters and process characteristics, and precision requirements. Higher characteristics. These characteristics lead to the easy occurrence of scrap in the PCB production process, so companies need to predict the scrap rate of PCB production.
  • the main influencing factors of PCB order scrap rate there will be certain scrapping conditions in the PCB processing process, and the reasons for the product's unqualified scrapping include subjective factors and objective factors.
  • the subjective factors mainly refer to the unreasonable design process of the man-made, the mistakes caused by the operation, etc., which can generally trace the responsible person directly.
  • the objective factors are mainly due to the fact that the product requires a large number of processing parameters, complex processing characteristics, high process requirements, equipment processing capacity limitations and environmental uncertainty, resulting in a certain proportion of product scrapping in the process of manufacturing. Obviously, the more complex the product, the higher the accuracy requirements of the feature, the higher the difficulty in manufacturing under the condition that the manufacturing equipment is not improved, and the higher the scrap rate caused by objective reasons.
  • the difficulty of fabrication is usually described by the extreme values (product parameters) of the manufacturing parameters of the PCB.
  • product parameters the higher the difficulty.
  • the transcendence boundary may cause the scrap rate to rise rapidly.
  • the parameter range of one or several features processed in one process directly affects the scrap rate of the process.
  • the PCB order scrap rate is mainly predicted by the production dispatcher to assess the difficulty of PCB manufacturing based on experience. This method has a large subjectivity, which may lead to inaccurate prediction and long time consumption.
  • an object of the present invention is to provide a PCB order rejection rate prediction method and apparatus, a computer readable storage medium, and a computer device, which can predict the PCB order scrap rate without manual intervention, and can improve The efficiency and accuracy of PCB order scrap rate prediction.
  • a method for predicting a PCB order scrap rate which includes:
  • the circuit board product information includes the number of layers, the number of plate plating times, the thickness of the finished board, the thickness of the minimum hole wall, the thickness ratio of the through holes, and the total number of holes , the total number of processes, the quantity of delivery, the historical yield, the area of the finished unit, whether it is plated with copper and nickel, whether it is plated with hard gold, whether there is gold finger, whether there is negative film plating, whether there is thinned copper, whether it is photoelectric plate, Whether it is a high-frequency board, whether it is required to meet the IPCIII standard, whether the line width spacing is less than a preset threshold value and a combination of all the parameter items or a plurality of parameter items.
  • the foregoing scrap rate calculation model is:
  • R scrapped k 1 *N layers +k 2 *T plate +k 3 *T F-plate +k 4 *S ct-hw +k 5 *R th-dm +k 6 *N holes +k 7 *N t -processes -k 8 *Q delivery -k 9 *Y his +k 10 *A F-unit +k 11 *W plate1 +*k 12 W plate2 +k 13 *W chefs +k 14 *W n-plate +k 15 *W t-copper +k 16 *W p-panel +k 17 *W h-fq-board +k 18 *W IPCIII +k 19 *W L-width +k 20 *N press
  • R scrapped indicates scrap rate
  • N layers indicates number of layers
  • T plate indicates plate plating times
  • T F-plate indicates finished plate thickness
  • S ct-hw indicates minimum hole wall thickness
  • R th-dm indicates through hole thickness Ratio
  • N holes indicates the total number of holes
  • N t-processes indicates the total number of flows
  • Q delivery indicates the delivery quantity
  • Y his indicates the historical yield
  • a F-unit indicates the finished unit area
  • W plate1 indicates whether the plate is plated with copper and nickel
  • W plate2 indicates whether to plate hard gold
  • W chefs indicates whether there is gold finger
  • W n-plate indicates whether there is negative plating
  • W t-copper indicates whether there is thinned copper
  • W p-panel indicates whether it is photoelectric plate
  • W h -fq-board indicates whether it is a high frequency board
  • W IPCIII indicates whether it is required to reach the IPCIII standard
  • W L-width indicates whether the line width spacing is less than the preset
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842.
  • k 16 is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • the determining, by the CMP software server, the parameter that is determined by using the PCB order file The PCB order file is parsed to obtain the parameters of the PCB order.
  • a PCB order rejection rate prediction apparatus including:
  • a file obtaining unit configured to obtain a PCB order file of a PCB order to be predicted by the scrap rate
  • An information analyzing unit configured to determine, according to the PCB order file, a parameter of the PCB order, where the parameter includes circuit board product information of a circuit board product corresponding to the PCB order;
  • the scrap rate prediction unit is configured to predict a scrap rate of the PCB order according to the circuit board product information and a preset scrap rate calculation model.
  • the circuit board product information includes the number of layers, the number of plate plating times, the thickness of the finished board, the thickness of the minimum hole wall, the thickness ratio of the through holes, and the total Number of holes, total flow, delivery quantity, historical yield, finished unit area, whether copper or nickel plating, whether hard gold plating, whether there is gold finger, whether there is negative plating, whether there is thinned copper, whether it is photoelectric Whether the board, whether it is a high-frequency board, whether it is required to meet the IPCIII standard, whether the line width spacing is less than a preset threshold value and the number of presses, or a combination of a plurality of parameter items;
  • the foregoing retirement rate calculation model is:
  • R scrapped k 1 *N layers +k 2 *T plate +k 3 *T F-plate +k 4 *S ct-hw +k 5 *R th-dm +k 6 *N holes +k 7 *N t -processes -k 8 *Q delivery -k 9 *Y his +k 10 *A F-unit +k 11 *W plate1 +*k 12 W plate2 +k 13 *W chefs +k 14 *W n-plate +k 15 *W t-copper +k 16 *W p-panel +k 17 *W h-fq-board +k 18 *W IPCIII +k 19 *W L-width +k 20 *N press
  • R scrapped indicates scrap rate
  • N layers indicates number of layers
  • T plate indicates plate plating times
  • T F-plate indicates finished plate thickness
  • S ct-hw indicates minimum hole wall thickness
  • R th-dm indicates through hole thickness Ratio
  • N holes indicates the total number of holes
  • N t-processes indicates the total number of flows
  • Q delivery indicates the delivery quantity
  • Y his indicates the historical yield
  • a F-unit indicates the finished unit area
  • W plate1 indicates whether the plate is plated with copper and nickel
  • W plate2 indicates whether to plate hard gold
  • W chefs indicates whether there is gold finger
  • W n-plate indicates whether there is negative plating
  • W t-copper indicates whether there is thinned copper
  • W p-panel indicates whether it is photoelectric plate
  • W h -fq-board indicates whether it is a high frequency board
  • W IPCIII indicates whether it is required to reach the IPCIII standard
  • W L-width indicates whether the line width spacing is less than the preset
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842.
  • k 16 is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • a computer readable storage medium having stored thereon a computer program for performing the steps of the PCB order scrap rate prediction method as described above when the program is executed by the processor.
  • a fourth aspect provides a computer device including a memory, a processor, and a computer program stored on the memory and operable on the processor, wherein the processor executes the program to implement a PCB order scrap rate prediction method as described above A step of.
  • the PCB order file of the PCB order for which the scrap rate prediction is to be performed is determined, and the parameter of the PCB order is determined according to the PCB order file, and the parameter includes the line of the circuit board product corresponding to the PCB order.
  • the board product information predicts the scrap rate of the PCB order according to the board product information and a preset scrap rate calculation model.
  • FIG. 1 is a schematic flowchart of an implementation process of a PCB order scrap rate prediction method according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a PCB order scrap rate prediction apparatus according to an embodiment of the present invention.
  • a PCB order rejection rate prediction method is provided. As shown in FIG. 1, the PCB order scrap rate prediction method in this embodiment includes the following steps:
  • Step S101 Obtain a PCB order file of a PCB order to be predicted by the scrap rate
  • the PCB order file is a line graphic file that can be used to make a circuit board product.
  • Step S102 determining parameters of the PCB order according to the PCB order file, where the parameters include circuit board product information of the circuit board product corresponding to the PCB order;
  • the circuit board product information includes parameter values corresponding to the respective parameter items of the circuit board product, and specifically includes which parameter item parameter values can be determined according to actual needs.
  • Step S103 predicting the scrap rate of the PCB order according to the circuit board product information and a preset scrap rate calculation model.
  • the prediction of the PCB order scrap rate can be realized without manual intervention, which can save labor cost and improve the efficiency and accuracy of the forecast.
  • the above-mentioned circuit board product information includes the number of layers, the number of plate plating times, the thickness of the finished plate, the thickness of the minimum hole wall, the thickness ratio of the through holes, the total number of holes, the total number of processes, the quantity of delivery, and the history. Yield, finished unit area, whether it is plated with copper and nickel, whether it is plated with hard gold, whether there is gold finger, whether there is negative plating, whether there is thin copper, whether it is photovoltaic board, whether it is high frequency board, whether it is required to reach IPCIII Standard, whether the line width spacing is less than all the parameter items in the preset threshold value and the number of pressing times or a combination of multiple parameter items.
  • the parameter items included in the board product information may be determined based on actual needs.
  • the product information of the circuit board includes the number of layers, the number of plate plating times, the thickness of the finished plate, the thickness of the minimum hole wall, the thickness ratio of the through holes, the total number of holes, the total number of processes, and the quantity of delivery. , historical yield, finished unit area, whether it is plated with copper and nickel gold, whether it is plated with hard gold, whether there is gold finger, whether there is negative film plating, whether there is thin copper, whether it is photoelectric plate, whether it is high frequency plate, whether it is required Meet the IPCIII standard, whether the line width spacing is less than the preset threshold and the number of presses.
  • the parameter items included in the circuit board product information in this embodiment are comprehensive, and the prediction accuracy can be improved. Table 1 shows the parameters of a PCB order.
  • Serial number Parameter item Parameter value 1 Number of layers 2 2 Plate plating times 1 3 Finished board thickness 1.6 4 Minimum hole wall copper thickness 20 5 Through hole thickness to diameter ratio 6 6 Total number of holes 21568 7 Total number of processes twenty three 8 quantity of delivery 150 9 Historical yield 94.17% 10 Finished unit area 0.005 11 Whether the picture is plated with copper, nickel and gold 1 12 Whether to plate hard gold 1 13 Is there a golden finger? 0 14 Is there a negative plating? 0 15 Is there a thinned copper? 0 16 Whether photovoltaic panels 0 17 Whether high frequency board 0 18 Whether the IPCIII standard 0 19 Whether the line width spacing is less than 3.5 0 20 Number of presses 0
  • the above-mentioned scrapping rate calculation model may be the number of layers, the number of plate plating times, the thickness of the finished plate, the minimum hole wall copper thickness, the through hole thickness to diameter ratio, the total number of holes, the total number of processes, and the number of deliveries. , historical yield, finished unit area, whether it is plated with copper and nickel gold, whether it is plated with hard gold, whether there is gold finger, whether there is negative film plating, whether there is thin copper, whether it is photoelectric plate, whether it is high frequency plate, whether it is required
  • a combination of all parameter items or a plurality of parameter items in the IPCIII standard, whether the line width spacing is less than the preset threshold value and the number of presses is weighted and summed. Wherein, the weight coefficient of the two parameter items of the delivery quantity and the historical yield is a negative number, and the weight coefficient of the remaining parameter items is a positive number.
  • the above-mentioned scrap rate calculation model is the following formula (1):
  • R scrapped indicates scrap rate
  • N layers indicates number of layers
  • T plate indicates plate plating times
  • T F-plate indicates finished plate thickness
  • S ct-hw indicates minimum hole wall thickness
  • R th-dm indicates through hole thickness Ratio
  • N holes indicates the total number of holes
  • N t-processes indicates the total number of flows
  • Q delivery indicates the delivery quantity
  • Y his indicates the historical yield
  • a F-unit indicates the finished unit area
  • W plate1 indicates whether the plate is plated with copper and nickel
  • W plate2 indicates whether to plate hard gold
  • W chefs indicates whether there is gold finger
  • W n-plate indicates whether there is negative plating
  • W t-copper indicates whether there is thinned copper
  • W p-panel indicates whether it is photoelectric plate
  • W h -fq-board indicates whether it is a high frequency board
  • W IPCIII indicates whether it is required to reach the IPCIII standard
  • W L-width indicates whether the line width spacing is less than the preset
  • the preset threshold can be set according to actual needs.
  • the predetermined threshold is 3.5 mils and 1 mil is equal to 25.4 microns.
  • the scrap rate calculation model in this embodiment considers various major influencing factors of the PCB scrap rate, and the prediction of the PCB order scrap rate based on the scheme of the embodiment can significantly improve the accuracy of the scrap rate prediction.
  • the scrap rate calculation model is not limited to the formula (1).
  • the scrap rate calculation model may have different forms.
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842
  • k 16 is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • the accuracy of the prediction can be further improved.
  • the units of the above-mentioned finished sheet thickness, minimum hole wall copper thickness, and finished unit area are respectively mm, micrometer, and square millimeter.
  • the step of determining the parameter of the PCB order according to the PCB order file may include: parsing the PCB order file by a CAM (computer Aided Manufacturing) software server, Obtain the parameters of the PCB order.
  • CAM computer Aided Manufacturing
  • the PCB order file may be sent to the CAM software server, and the parameters of the PCB order returned by the CAM software server after parsing the PCB order file are received.
  • the prediction efficiency can be further improved by adopting the scheme of the embodiment.
  • FIG. 2 is a schematic diagram showing the structure of a PCB order scrap rate prediction apparatus according to an embodiment of the present invention.
  • the PCB order scrap rate prediction apparatus of the present invention includes a file acquisition unit 201, an information analysis unit 202, and a scrap rate prediction unit 203, wherein:
  • a file obtaining unit 201 configured to acquire a PCB order file of a PCB order to be predicted by the scrap rate
  • the information analyzing unit 202 is configured to determine, according to the PCB order file, a parameter of the PCB order, where the parameter includes circuit board product information of the circuit board product corresponding to the PCB order;
  • the scrap rate prediction unit 203 is configured to predict a scrap rate of the PCB order according to the circuit board product information and a preset scrap rate calculation model.
  • the circuit board product information includes the number of layers, the number of plate plating times, the thickness of the finished plate, the thickness of the minimum hole wall, the thickness ratio of the through holes, the total number of holes, the total number of processes, the quantity of delivery, and the history. Yield, finished unit area, whether it is plated with copper and nickel, whether it is plated with hard gold, whether there is gold finger, whether there is negative plating, whether there is thin copper, whether it is photovoltaic board, whether it is high frequency board, whether it is required to reach IPCIII Standard, whether the line width spacing is less than all parameter items in the preset threshold value and the number of pressing times or a combination of multiple parameter items;
  • the rejection rate calculation model is the formula (1) as above.
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842
  • k 16 is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • the information analysis unit 202 may parse the PCB order file through the CAM software server to obtain parameters of the PCB order.
  • the description of the PCB order scrap rate prediction device provided by the embodiment of the present invention is similar to the description of the PCB order scrap rate prediction method described above, and has the beneficial effects of the above PCB order scrap rate prediction method, so as to save space, no further description is provided; Therefore, for the technical details not disclosed in the PCB order rejection rate prediction apparatus provided by the embodiment of the present invention, please refer to the description of the PCB order rejection rate prediction method provided above.
  • an embodiment further provides a computer readable storage medium having stored thereon a computer program that, when executed by the processor, implements the PCB order as described in any one of the above embodiments The steps of the scrap rate prediction method.
  • an embodiment further provides a computer device including a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor executing the The steps of the PCB order scrap rate prediction method described in any of the above embodiments are implemented at the time of the program.
  • the computer device may be any terminal device including a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), a POS (Point of Sales), an in-vehicle computer, a wearable device, and the like.
  • the program can be stored in a non-volatile computer readable storage.
  • the program may be stored in a storage medium of the computer system and executed by at least one processor in the computer system to implement a flow comprising an embodiment of the methods as described above.
  • the storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

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Abstract

La présente invention concerne un procédé et un appareil permettant de prédire le taux de mise au rebut pour une commande de carte de circuit imprimé (PCB). Le procédé comprend : l'acquisition d'un fichier de commande de PCB d'une commande de PCB pour laquelle une prédiction du taux de mise au rebut doit être réalisée (S101) ; selon le fichier de commande de PCB, la détermination de paramètres pour la commande de PCB, les paramètres comprenant des informations de produit de carte de circuit imprimé d'un produit de carte de circuit imprimé correspondant à la commande de PCB (S102) ; selon les informations de produit de carte de circuit imprimé et un modèle prédéfini de calcul de taux de mise au rebut, la prédiction du taux de mise au rebut pour la commande de PCB (S103). À l'aide du procédé et de l'appareil, la prédiction de taux de mise au rebut pour une commande de PCB peut être accomplie sans intervention manuelle, et l'efficacité et la précision de la prédiction du taux de mise au rebut pour une commande de PCB peuvent également être améliorées.
PCT/CN2017/120101 2017-06-29 2017-12-29 Procédé et appareil de prédiction de taux de mise au rebut pour une commande de carte de circuit imprimé WO2019000892A1 (fr)

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CN201710530953.2A CN107506514B (zh) 2017-06-29 2017-06-29 Pcb订单报废率预测方法和装置
CN201710530953.2 2017-06-29

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CN107506514B (zh) * 2017-06-29 2020-07-28 广州兴森快捷电路科技有限公司 Pcb订单报废率预测方法和装置
CN108416470B (zh) * 2018-02-11 2020-11-17 广州兴森快捷电路科技有限公司 线路板的良品率预测方法
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