WO2018235989A1

WO2018235989A1 - Stacked conductor joining apparatus

Info

Publication number: WO2018235989A1
Application number: PCT/KR2017/008914
Authority: WO
Inventors: 하홍수; 이상현; 오상수
Original assignee: 한국전기연구원
Priority date: 2017-06-22
Filing date: 2017-08-16
Publication date: 2018-12-27
Also published as: KR20190000165A

Abstract

The present invention principally relates to a stacked conductor joining apparatus comprising: a solder bath in which solder is stored so as to be soldered on the surface of conductors by means of moving the plurality of conductors; and a die assembly provided inside the solder bath such that the plurality of conductors are aligned before exiting the solder bath after being soldered. Therefore, since a die body is provided inside the solder bath, a separate heater for reheating the solder is not necessary, and the solder due to excessive soldering of the conductors is removed and input in the solder bath and thus can be recycled. And the plurality of conductors can be stacked in an accurate position, in terms of the cross-sectional structure thereof, without being damaged.

Description

Laminated conductor joining device

The present invention relates to a laminated conductor joining apparatus, in which a die body is disposed in a solder bath so that a separate heater for reheating the solder is not required, and the excess soldered solder is removed from the conductor and the solder is introduced into the solder bath, And a conductor splicing device.

In general, a superconducting thin film wire or a laminated conductor wire, such as a wire rod having a plate-like structure, is continuously laminated and joined in order to increase the current carrying capacity of the conductor. When the plate-shaped conductors are successively laminated and joined together, they pass through the joining apparatus 10 according to the prior art as shown in Fig. A method of laminating the conductor 1 through the bonding apparatus 10 is as follows. First, a plurality of conductors 1 are moved and immersed by a solder bath 11, and solder 3 is applied to the surface of the conductor 1 The solder 3 is re-heated through the heater 13 so that the solder 3 is maintained in a liquid state and the dies are arranged such that the cross-sectional shape of the conductor 1 is uniformly arranged. 15). The conductor 1 passing through the dies 15 in a stacked state is formed by cooling the conductor 1 with the cooling water 17 or the like so as to prevent the conductors 1, And finally winding.

Since the dice 15 is fixed to the outside of the solder bath 11 and the width and the thickness of the conductor 1 of the laminated conductor 1 passing through the die 15 are forcibly controlled by applying pressure, In the case of a composite material such as a superconducting thin film wire, the wire 1 is liable to be deformed and broken while passing through the die 15. The excess solder 3 of the solder 3 applied to the conductor 1 through the solder bath 11 is detached from the conductor 1 while passing through the dice 15, Because it is exposed to the outside, direct recycling is difficult on site due to oxidation and pollution. The disadvantage of the solder 3 itself is that it is difficult to recycle the solder 3 itself and thus the manufacturing cost is wasted. In addition, since the solder 3 needs to be subjected to a separate physical treatment or chemical treatment for the reuse of the solder 3, There are disadvantages. In addition, when the solder 3 is reheated, some of the components of the solder 3 may evaporate on the surface of the conductor, so that the component of the solder 3 may be formed differently from the desired component.

The solder 3 separated from the conductor 1 can be recycled without causing the conductor 1 to deform or break when the conductor 1 is passed through the dies 15 while stacking the conductor 1, A technique capable of stacking is necessary.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a laminated conductor joining apparatus in which a die body is disposed in a solder bath so that a separate heater for reheating the solder is not required and the solder is recycled into the solder bath while the excess soldered solder is removed from the conductor .

Another object of the present invention is to provide a multilayer conductor joining apparatus capable of laminating a plurality of conductors at accurate positions in a cross-sectional structure without damaging the conductors.

The present invention relates to a solder bath comprising: a solder bath for moving a plurality of conductors to store solder on the surface of the conductor; And a die assembly disposed within the solder bath to align the plurality of conductors before the conductor is soldered and then exits the solder bath.

Here, the die assembly for aligning a plurality of stacked conductors includes: a pair of die main bodies; A plurality of conductors are stacked along a length direction on a surface of a pair of the die main bodies so as to face each other, and are recessed in each of the die main bodies so that width and height are aligned and arranged. A depression formed; Each of the first projections being formed in each of the depressions and projecting in a semicylinder shape along each first axis parallel to the width direction of the conductor, And the die main body is arranged to be shifted along the longitudinal direction of the conductor.

The pair of depressed portions are provided with a pair of protrusions which are parallel to the height direction of the conductor and protrude in a semicylindrical shape along a second axis perpendicular to the first axis on both sides of the respective first protrusions Each of the second axes is disposed on a different axis from each other, and the die body is disposed to be shifted along the width direction of the conductor.

It is preferable that each of the depressions is recessed by a width of 1.1 to 1.5 times with respect to the width of the stacked conductor and that the pair of die bodies are arranged to be shifted by 0.1 to 0.3 times the width of the conductor Each of the depressions is recessed by a height of 1.1 to 1.5 times the height of the stacked conductors and the pair of die bodies are arranged to be shifted by a length of 1 to 10 cm along the longitudinal direction of the conductor .

At this time, the conductor is preferably a superconducting thin film wire, and tension is preferably controlled when the conductor is loaded into the solder bath.

According to the above-described structure of the present invention, the die body is disposed in the solder bath, so that a separate heater for reheating the solder is not required, and the solder can be recycled by entering the solder bath while the solder excessively soldered to the conductor is removed.

In addition, it is possible to obtain an effect that a plurality of conductors can be stacked at precise positions in a cross-sectional structure without damaging the conductors.

1 is a cross-sectional view of a bonding apparatus according to the prior art,

2 is a cross-sectional view of a laminated conductor bonding apparatus according to an embodiment of the present invention,

3 and 4 are a perspective view and a front view of a biaxial dice assembly according to an embodiment of the present invention,

5 and 6 are a perspective view and a front view showing an arrangement of a biaxial dice assembly according to an embodiment of the present invention,

7 is an optical microscope photograph of a laminated conductor,

8 is a photograph of the laminated conductor manufactured through the embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a laminated conductor bonding apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.

2, a laminated conductor splicing apparatus 10 for aligning a plurality of stacked conductors 1 according to the present invention includes a plurality of conductors 1 that are moved to move the solder 1 to be soldered to the surface of the conductor 1, A solder bath 11 in which the solder bath 3 is stored and a die assembly 11 disposed in the solder bath 11 for aligning the plurality of conductors 1 before the conductor 1 is soldered and then out of the solder bath 11, (100).

The die assembly 100 is disposed inside the solder bath 11 and passes through the die assembly 100 before the conductor 1 is soldered and then exits the solder bath 11. The conductors pass through the joining apparatus 10 to perform the soldering on the surface of the conductor 1 as in the conventional case. A method of laminating a conductor 1 through a bonding apparatus 10 according to the present invention is as follows. First, a plurality of conductors 1 are moved and immersed in a solder bath 11, After passing through the die assembly 100 existing in the solder bath 11 such that the cross-sectional shape is uniformly arranged in a state where the solder 3 is excessively present on the surface of the conductor 1 after soldering to the surface do. Since the die assembly 100 is inside the solder bath 11, the conductor 1 passes through the die assembly 100 before the solder 3 is hardened. As a result, the solder 3 is hardened There is an advantage that the heater 13 for reheating is not used separately. This has the advantage of saving energy since reheating is not necessary in the process of stacking and aligning conductor 1. The excess solder 3 is detached from the conductor 1 while passing through the die assembly 100. Since the falling solder 3 enters the solder bath 11 again and can be recycled, Few. The conductor 1 passing through the die assembly 100 in a laminated state is cooled by the cooling water 17 or the like so as to prevent the conductors 1 which have been stacked thereafter from being separated from each other , And finally winds.

When the conductor 1 is loaded into the solder bath 11, it is possible to control the tension as necessary. Conventionally, a die having a size suitable for the width and the thickness of the conductor has to be used. As a result, the die can not be disposed inside the solder bath. However, in the present invention, it is possible to obtain the conductor 1 smoothly joined without changing the die by controlling the charging tension of the conductor 1. [ For example, when the width of the conductor 1 is wide or the thickness thereof is large, the tension is reduced so that the conductor 1 can pass smoothly through the die assembly 100, and when the width of the conductor 1 is narrow If it is thin, the tension is increased so that it can pass tightly through the die assembly 100.

Also, in the conventional case, the solder bath is composed of a double bath, and the solder existing in the other bath is continuously supplied through the pumping with the solder bath. In this case, since it is difficult to dispose the die assembly in the drainage, there is no such structure as the present invention. However, in the present invention, since the single solder bath 11 is used, the die assembly 100 can be disposed therein.

A pressing roller that presses the conductor 1 from the upper side to the lower side and positions the conductor 1 so that the conductor 1 passes through the die assembly 100 when the conductor 1 passes the die assembly 100 . The pressure roller may be disposed inside the solder bath 11 so as to be immersed in the solder 1.

As shown in Figs. 3 and 4, the die assembly 100 of the present invention used in such a joining apparatus 10 includes a pair of die main bodies 110, a recess formed in each of the die main bodies 110, And a first protrusion 150 formed on each of the depressions 130. The first protrusion 150 is formed in the recess 130,

The depressed portion 130 is formed on the surface of the pair of die main bodies 110 so as to face each other. The conductor 1 wound on the outside of the solder bath 11 is moved along the longitudinal direction into the solder bath 11. At this time, the depressed portion 130 is formed such that a plurality of moving conductors 1 move in the length length and height of the plurality of conductors 1 laminated while being stacked and aligned.

The first protrusions L1 included in the respective depressions 130 are formed along the first axis L1 which is parallel to the width direction of the laminated conductor 1 passing through the depression 130, and a first protrusion 150 protruding in a semicylinder shape. The first axis L1 is a line arbitrarily formed in the dice main body 110 so as to be parallel to the width direction of the conductor 1 and each first axis L1 is arranged in a different axis from each other, The dice main body 110 is arranged to be shifted along the longitudinal direction of the conductor 1.

In the case of the prior art, the dies 15 arranged on the upper and lower sides are formed of depressions having a rectangular shape in conformity with the width and height of the conductor 1. In order for the conductor 1 laminated in the rectangular depression to pass through correctly, the conductor 1 needs to be aligned. In order to align the conductor 1 through the depression, pressure is applied to the conductor 1. If the pressure is applied to the laminated conductor 1, the conductor 1 is damaged. Even if the conductor 1 is aligned, a part of the conductor passing through the depression comes into contact with the depression, As shown in FIG.

2 and 5, the respective dice bodies 110 are arranged to be shifted along the longitudinal direction of the conductor 1, so that the respective depressions 130 are spaced apart from each other Respectively. The conductor 1 having the solder 3 adhering to the solder bath 11 is placed inside the solder bath 11 before the solder bath 11 is taken out of the solder bath 11, And then passes through the depressions 130 formed in each of the recesses. At this time, since each of the depressions 130 is slightly shifted with respect to the advancing direction of the conductor 1, the conductor 1 is slightly bent in the height and width directions. This allows the conductors 1 to be aligned within the depressions 130 by longitudinal tension so as to achieve laminated alignment of the conductors 1 with a weak force. This method is advantageous in that the conductor 1 is less damaged than the conventional method of forcefully applying force to the conductor 1.

Each of the depressions 130 is recessed by a height of 1.1 to 1.5 times the height of the laminated conductor 1 and the pair of dice bodies 110 are arranged along the longitudinal direction of the conductor 1, It is preferable that they are arranged to be shifted by a length. When the recessed height of the depressed portion 130 is less than 1.1 times the height of the stacked conductor 1, there may be a conductor 1 partially protruding to the outside without passing through the depression 130. The conductor 1 It is difficult to remove the entire amount of the excess solder 3 adhered to a part of the solder. If the recessed height of the depressed portion 130 exceeds 1.5 times the stacked conductor 1, the residual solder 3 is much buried in the depressed portion 130, so that it is not easy to clean the depressed portion 130 . In addition, when the length of the pair of die bodies 110 is less than 1 cm, the laminated conductor 1 can not be sufficiently bent so that the conductor 1 stacked in the recessed portion 130 can not be perfectly aligned, If the thickness exceeds 10 cm, the time taken to reach the other depression 130 through one depression 130 becomes long, and the solder 3 may harden during that time.

The first protrusion 150 protrudes in a semicylinder shape with respect to the first axis L1. When the first protrusions 150 are not formed in a semicylindrical shape but have a plate shape with corners, the conductor 1 is bent at the corners while the height of the laminated conductor 1 passing through the depressions 130 is aligned It can be scratched and damaged.

The conductor 1 is brought into contact with the first protrusion 150 while the conductor 1 is moved by the tension when the conductor 1 passes through the depression 130 so that the solder 3 which is excessively soldered detaches from the conductor 1 do. When the solder 3 is separated from the conductor 1, only the necessary amount of the solder 3 is applied to the conductor 1, and since the solder 3 applied has a constant thickness, The laminated wires are made to have the same thickness along the longitudinal direction. In order to prevent the conductor 1 from being damaged in this process, it is preferable that the first protrusions 150 have a semi-cylindrical shape without edges. Particularly, the conductor 1 passes through the depressed portion 130 which is slightly offset from the depressed portion 130. In order to smoothly pass through the depressed portion 130, the first protruded portion 150 preferably has a semicylindrical shape .

In some cases, a second protrusion 170 may be additionally formed in the depression 130. The second protrusion 170 is parallel to the height direction of the conductor 1 and is formed on both sides of each first protrusion 150 along a second axis L2 perpendicular to the first axis L1, On both sides of the first projection 150. The second axis L2 is a line arbitrarily formed in the dice main body 110 so as to be parallel to the height direction of the conductor 1 as in the case of the first axis L1. The second axis L2 is arranged in a different axis from each other. Accordingly, as shown in FIG. 6, the die main body 110 is arranged to be shifted along the width direction of the conductor 1.

The conductors 1 which are not aligned with each other in the width direction are aligned in the width direction while passing through the depressions 130. At this time, the second protrusions 170 are not present, There is a possibility that the conductor 1 is damaged by the edge while passing through the depression. In addition, since the conductor 1 is composed of corners, both sides of the conductor 1 are damaged and it is difficult to be aligned even if the laminated conductor 1 that has not been aligned passes. Thus, the second protrusion 170 is formed so that the width of the laminated conductor 1 is smoothly aligned as it passes the second protrusion 170.

Here, it is preferable that each depression 130 is recessed by a width of 1.1 to 1.5 times the width of the conductor 1. This is because when the laminated conductor 1 passes through the depressed portion 130, the conductor 1 whose width is not aligned is passed through the depressed portion 130. When the width of the depressed portion 130 is larger than the width of the conductor 1 If less than 1.1 times the width, the side of some conductors 1 that are not properly aligned can be damaged by friction. If it is more than 1.5 times, even if the conductor 1 passes through the depression 130, the interval is too wide and it is difficult to align the width of the laminated conductor 1 properly.

It is also preferable that the pair of die bodies 110 are arranged to be shifted by 0.1 to 0.3 times the width of the conductor 1. When the dice body 110 does not deviate and the dimple 130 forms a rectangular space, the conductor 1, which is laminated in the space, must pass through. However, since the laminated conductor 1 is not aligned in width, it is very difficult to pass through the depressed portion 130 without being damaged. Therefore, it is preferable that the die main body 110 is arranged to be shifted by 0.1 to 0.3 times the width of the conductor 1. If it is less than 0.1 times, the conductor (1) must pass through the fully aligned state. If it exceeds 0.3 times, the concave portion (130) may be obstructed to evenly align the laminated conductors (1).

It is most preferable that the conductor 1 laminated in the present invention is a superconducting thin film wire, but it is also a technique applicable to manufacture of a wire including the conductor 1 in addition to the above. 7, it is possible to obtain the effect of stacking a plurality of conductors 1 at precise positions in a cross-sectional structure without damaging the conductor 1 through the technique of the present invention, Is not disposed in the solder bath 11 and a separate heater 13 for reheating the solder 3 is not required and the solder 3 excessively soldered to the conductor 1 is removed, The solder 3 can be recycled.

Hereinafter, embodiments of the present invention will be described in more detail.

An embodiment of the present invention in which a plurality of conductors are laminated and soldered using a biaxial dice assembly is shown in Fig. Sn-3.0Ag-0.5Cu was prepared with a copper conductor (SCN04-161104-01, SuNAM) and solder, and the solder bath temperature was set at 240 ° C. The copper conductors are then laminated and then charged into the solder bath where molten solder is present to solder the solder to the surface of the copper conductor. At this time, the charging speed of the copper conductor corresponds to 60 cm / min, and the tension moves to ~ 2 kgf. The surface-soldered copper conductor passes through the biaxial dice assembly located inside the solder bath, where the biaxial dice assembly is 4.3w.?0.7mmh. Size. The biaxial dice assembly is spaced about 5 to 10 mm along the longitudinal direction of the copper conductor and spaced apart by about 0.5 to 1 mm in the width direction. Therefore, the laminated copper conductor formed through the biaxial dice assembly after soldering is excellent in that the copper conductor is not damaged in the width and height direction of the copper conductor as shown in FIG. 8, and is not delaminated even if bent.

Claims

In the laminated conductor bonding apparatus,

A solder bath in which a plurality of conductors are moved to solder the solder on the surface of the conductor;

And a die assembly disposed within the solder bath to align the plurality of conductors before the conductor is soldered and then exits the solder bath.
The method according to claim 1,

The die assembly for aligning a plurality of stacked conductors comprises:

A pair of die bodies;

A plurality of conductors are stacked along a length direction on a surface of a pair of the die main bodies so as to face each other, and are recessed in each of the die main bodies so that width and height are aligned and arranged. A depression formed;

And a first protrusion formed on each of the depressions and protruding in a semicylinder shape along respective first axes parallel to the width direction of the conductor.
3. The method of claim 2,

Wherein each of the first axes is disposed on a different axis from one another, and the die body is disposed to be shifted along a longitudinal direction of the conductor.
3. The method of claim 2,

In the pair of depressed portions,

And a pair of second protrusions parallel to a height direction of the conductor and protruding in a semicylindrical shape along a second axis perpendicular to the first axis on both sides of each of the first protrusions. Laminated conductor bonding apparatus.
5. The method of claim 4,

Wherein each of the second axes is disposed in a different axis from each other, and the die body is disposed to be shifted along the width direction of the conductor.
5. The method of claim 4,

Wherein each of said depressions is recessed by a width of 1.1 to 1.5 times the width of said stacked conductors,

Wherein the pair of die bodies are arranged to be shifted by a width of 0.1 to 0.3 times the width of the conductor.
3. The method of claim 2,

Each of said depressions being recessed by a height of 1.1 to 1.5 times the height of said stacked conductors,

Wherein the pair of die bodies are arranged to be shifted by a length of 1 to 10 cm along the longitudinal direction of the conductor.
3. The method of claim 2,

Wherein the conductor is a superconducting thin film wire.
The method according to claim 1,

Wherein a tension is controlled when the conductor is loaded into the solder bath.