WO2018221400A1 - Pressure detection device and production method thereof - Google Patents

Pressure detection device and production method thereof Download PDF

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Publication number
WO2018221400A1
WO2018221400A1 PCT/JP2018/020137 JP2018020137W WO2018221400A1 WO 2018221400 A1 WO2018221400 A1 WO 2018221400A1 JP 2018020137 W JP2018020137 W JP 2018020137W WO 2018221400 A1 WO2018221400 A1 WO 2018221400A1
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WIPO (PCT)
Prior art keywords
substrate
cover member
pressure sensor
pressure detection
pressure
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PCT/JP2018/020137
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French (fr)
Japanese (ja)
Inventor
修治 佐藤
小出　茂樹
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日本精機株式会社
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Priority to JP2019522185A priority Critical patent/JPWO2018221400A1/en
Publication of WO2018221400A1 publication Critical patent/WO2018221400A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure

Definitions

  • the present invention relates to a pressure detection device including a ceramic substrate and a manufacturing method thereof.
  • the pressure detection device detects the pressure of gas or liquid with a pressure sensor and outputs an electric signal corresponding to the pressure.
  • a conventional technique of such a pressure detection device there is a technique disclosed in Patent Document 1.
  • Patent Document 1 discloses a first case half (attached body), a pressure sensor attached to the first case, and a second case half that covers the pressure sensor and covers the first case half. And are disclosed.
  • the first case half is provided with a first hole for introducing the first fluid.
  • the second case half is provided with a second hole for introducing the second fluid.
  • the pressure sensor measures the pressure of the first fluid introduced from the first hole and measures the pressure of the second fluid introduced from the second hole. Thereby, a differential pressure between the pressures of the second fluid is detected with reference to the pressure of the first fluid.
  • the pressure sensor is usually fixed to the substrate, and the substrate on which the pressure sensor is fixed is attached to the mounted body.
  • Some substrates are made of ceramic. Ceramics are generally hard and brittle. Furthermore, the shape and size of the mounted body are not uniform, and various mounted bodies exist. Therefore, when attaching the ceramic substrate to the mounted body, care must be taken so that no load is applied to the substrate.
  • the pressure detection device can be attached to the mounted body without applying a load to the substrate.
  • An object of the present invention is to provide a structure for mounting a pressure detection device to a body to be mounted that can suppress a load on a ceramic substrate.
  • a ceramic substrate a pressure sensor that is electrically connected to the substrate and detects the pressure of the fluid
  • a sealing cover that covers the pressure sensor and seals the pressure sensor
  • the surface of the substrate facing the attached body is covered with a first cover member,
  • the first cover member includes a first introduction portion that is vacant for introducing the fluid, and a first fixing portion that is fixed to the attached body.
  • the first introduction part is closed by the pressure sensor.
  • the pressure sensor is arranged on a top surface of the substrate and avoiding the top of the first introduction portion,
  • the substrate is formed by stacking a plurality of ceramic plates that are ceramic plates,
  • the second introduction part for flowing the fluid from the first introduction part to the pressure sensor is formed by a hole formed in the ceramic plate.
  • the side surface of the substrate is surrounded by a wall portion raised from the first cover member.
  • the pressure detection device further includes a second cover superimposed on the sealing cover,
  • the second cover includes a frame portion that overlaps a peripheral portion of the sealing cover, and a second fixing that extends from the frame portion toward the first fixing portion and overlaps the first fixing portion.
  • the sealing cover is joined to the substrate by seam welding, and the substrate is joined to the first cover member by seam welding.
  • the surface of the ceramic substrate facing the mounted body is covered with the first cover member.
  • This 1st cover member contains the 1st introducing
  • the first introduction portion is closed by the pressure sensor. That is, the pressure sensor is fixed to the first cover, not the substrate. Since the pressure sensor is not in contact with the substrate, even if the pressure of the fluid introduced from the first introduction unit is applied to the pressure sensor, no load is applied to the substrate.
  • the pressure sensor is disposed on the upper surface of the substrate and away from the upper side of the first introduction portion, and the substrate is formed by stacking a plurality of ceramic plates, which are ceramic plates.
  • the second introduction part for flowing fluid from the first introduction part to the pressure sensor is formed by a hole formed in the ceramic plate.
  • holes are formed in the plurality of ceramic plates, and when the plurality of ceramic plates are stacked, the holes are shifted from each other. By shifting the position where the hole is formed, the bent flow path can be easily formed.
  • the side surface of the substrate is surrounded by the wall portion raised from the first cover member.
  • the surface of the substrate that is opposed to the mounted body is covered by the first cover member, and the side surface is also surrounded. It can be said that the substrate is accommodated in a box-shaped portion of the first cover member.
  • a pressure detection apparatus further has the 2nd cover superimposed on the sealing cover, and this 2nd cover has the frame part which has overlapped with the peripheral part of the sealing cover, And a second fixing portion extending from the frame portion toward the first fixing portion and overlapping the first fixing portion. Therefore, when the second fixing portion is fixed to the first fixing portion, the frame portion is fixed so as to overlap the peripheral edge portion of the sealing cover. The peripheral part of the sealing cover is pressed by the frame part, and the sealing cover is hardly peeled off from the substrate.
  • the sealing cover is joined to the substrate by seam welding, and the substrate is joined to the first cover member by seam welding. Both the sealing cover and the first cover member are joined to the substrate by seam welding. Since the same joining method is employed, the joining process is not complicated.
  • FIG. 2 is a sectional view taken along line 2-2 of FIG. It is a figure explaining the modification of the pressure detection apparatus shown by FIG. It is a top view of the pressure detection apparatus by Example 2 of this invention.
  • FIG. 5 is a sectional view taken along line 5-5 of FIG.
  • FIG. 5 is a perspective view of a first cover member and a second cover member of the pressure detection device shown in FIG. 4. It is a figure explaining the modification of the pressure detection apparatus shown by FIG.
  • FIG. 1 shows a pressure detection device 10 according to Embodiment 1 of the present invention.
  • the pressure detection device 10 is attached to an attached body 11, for example, a vehicle transmission, a fuel injection device, or the like.
  • the pressure detection device 10 detects the pressure of the fluid flowing inside the mounted body 11 and outputs an electrical signal.
  • the pressure detection device 10 includes a ceramic substrate 20, a pressure sensor 30 that is electrically connected to the substrate 20 and detects the pressure of a fluid, a sealing cover 40 that covers and seals the pressure sensor 30, and a substrate And a first cover member 50 that covers a surface of the 20 attached body 11 that faces the attached body 11.
  • the substrate 20 is formed by stacking a first ceramic plate 21, a second ceramic plate 22, and a third ceramic plate 23 which are ceramic plates.
  • a first hole 24 is formed in the center of the first ceramic plate 21.
  • a second hole 25 is formed at the center of the second ceramic plate 22, and a third hole 26 is formed at the center of the third ceramic plate 23.
  • the first hole 24 and the third hole 26 have the same size.
  • the second hole 25 is smaller than the first hole 24.
  • a power lead terminal 27, a signal lead terminal 28, and a ground lead terminal 29 are connected to the land of the first ceramic plate 21.
  • the pressure sensor 30 includes a cylindrical glass pedestal 31 and a disk-shaped semiconductor chip 32 fixed to the pedestal 31.
  • the semiconductor chip 32 is a diaphragm formed by thinly forming a semiconductor such as silicon.
  • the pedestal 31 and the semiconductor chip 32 are fixed to each other by so-called anodic bonding for bonding silicon and glass.
  • the semiconductor chip 32 is connected to the substrate 20 by a wire.
  • the sealing cover 40 is made of metal such as Kovar and has a flat plate shape.
  • the first cover member 50 includes a rectangular flat plate portion 51 that covers the substrate 20 and four first fixing portions 52 that are provided at corners of the flat plate portion 51 and are fixed to the mounted body 11. In the center of the flat plate portion 51, a concave portion 53 opened upward is formed. The concave portion 53 is provided with a circular first introduction hole 54 (first introduction portion 54) that is vacated in order to introduce a fluid that flows inside the mounted body 11.
  • the first introduction hole 54 formed in the recess 53 is closed by the pressure sensor 30.
  • the pedestal 31 is bonded to the recess 53 by die bonding.
  • the lower surface of the first ceramic plate 21 is joined to the first cover member 50 by seam welding. More specifically, metallization is performed so as to surround the first hole 24 formed in the first ceramic plate 21, and the part subjected to the metallization and the first cover member 50 are seam welded.
  • the semiconductor chip 32 is connected to the land of the substrate 20 by wire bonding.
  • the sealing cover 40 is joined to the upper surface of the third ceramic plate 23 by seam welding. Specifically, a part of the upper surface of the third ceramic plate 23 is subjected to metallization, and the part subjected to the metallization and the sealing cover 40 are seam welded. Thereby, the pressure sensor 30 is covered. A region surrounded by the first cover member 50, the substrate 20, and the sealing cover 40 is a space in which a reference pressure is measured.
  • the pressure detection device 10 including the first cover member 50 is fixed to the mounted body 11 via the four first fixing portions 52 of the first cover member 50. Specifically, the bolts 56 are respectively inserted into the first fixing holes 55 formed in the first fixing portion 52, and the four first fixing portions 52 and the attached body 11 are fastened.
  • the lower surface of the ceramic substrate 20 (first ceramic plate 21) (the surface facing the mounted body 11) is covered with a first cover member 50.
  • the first cover member 50 includes a first introduction hole 54 and a first fixing portion 52. That is, the pressure detection device 10 is attached to the attached body 11 via the first fixing portion 52. Since the board
  • the first introduction hole 54 of the first cover member 50 is closed by the pressure sensor 30. That is, the pressure sensor 30 is fixed not to the substrate 20 but to the first cover member 50. Since the pressure sensor 30 is not in contact with the substrate 20, no load is applied to the substrate 20 even when the pressure of the fluid introduced from the first introduction hole 54 is applied to the pressure sensor 30.
  • FIG. 3 shows a liquid level detection device 12 which is a modification of the first embodiment.
  • a first cover member 80 is attached in place of the first cover member 50 (see FIG. 2).
  • the reference numerals are used and the description is omitted.
  • the first cover member 80 includes a rectangular flat plate portion 81 that covers the substrate 20, and four first fixing portions 82 (two first fixing portions 82 that are provided at corners of the flat plate portion 81 and are fixed to the mounted body 11. Only the fixed portions 82 and 82 are shown).
  • a concave portion 83 opened downward is formed at the center of the flat plate portion 81.
  • the recess 83 is provided with a circular first introduction hole 84 that is opened in order to introduce the fluid flowing inside the mounted body 11.
  • the pressure detection device 10A according to the second embodiment mainly differs in the shape of the first cover member 60A and the position where the pressure sensor 30A is disposed. Furthermore, the pressure detection device 10A includes a second cover member 70A that sandwiches the substrate 20A together with the first cover member 60A.
  • the substrate 20A is formed by stacking a first ceramic plate 21A, a second ceramic plate 22A, and a third ceramic plate 23A, which are ceramic plates.
  • a first hole 24A is formed in the center of the first ceramic plate 21A.
  • a second hole 25A is formed at the center of the second ceramic plate 22A, and a third hole 26A is formed at the center of the third ceramic plate 23A.
  • the second hole 25A has an oval shape.
  • the pressure sensor 30A includes a disk-shaped pedestal 31A and a disk-shaped semiconductor chip 32A having the same size as the pedestal 31A.
  • the semiconductor chip 32A is connected to the substrate 20A by a wire.
  • the sealing cover 40A has a main body portion 41A that has a substantially hat shape and has a box shape turned upside down, and a flange portion 42A that is formed annularly at the lower end of the main body portion 41A.
  • the first cover member 60A is provided at a rectangular bottom 61A that covers the lower surface of the first ceramic plate 21A, a wall 62A raised from the periphery of the bottom 61A, and an upper end of the wall 62A.
  • a first introduction hole 65A (first introduction portion 65A) is opened.
  • the second cover member 70A is formed at the overlapping portion 71A overlapping the sealing cover 40A, the second flange portion 72A provided at the lower end of the overlapping portion 71A, and the end portion of the second flange portion 72A. Second fixed portion 73A.
  • the overlapping portion 71A includes an annular portion 74A that overlaps the upper surface of the main body portion 41A of the sealing cover 40A, a cylindrical portion 75A that extends downward from the end of the annular portion 74A, and a sealing cover 40A provided at the lower end of the cylindrical portion 75A.
  • the frame portion 76A overlaps with the flange portion 42A (peripheral portion 42A).
  • the frame portion 76A and a part of the second flange portion 72A are notched for connecting the lead terminals 27-29.
  • a second introduction hole 66A (second introduction portion 66A) for flowing a fluid from the first introduction hole 65A to the pressure sensor 30A is formed by the first hole 24A and the second hole 25A.
  • the first hole 24A is twice or more larger than the second hole 25A.
  • the edge of the second hole 25A and the edge of the first hole 24A are continuous.
  • the third hole 26A is larger than the first hole 24A.
  • the pressure sensor 30A is disposed on the upper surface of the second ceramic plate 22A and away from the upper side of the first introduction hole 65A. That is, the second hole 25A is located at a portion that avoids the upper side of the first introduction hole 65A. Further, the second hole 25A is closed by the pressure sensor 30A.
  • the lower surface of the first ceramic plate 21A is joined to the first cover member 60A by seam welding. More specifically, metallization processing is performed so as to surround the first hole 24A of the first ceramic plate 21A, and the portion subjected to the metallization processing and the first cover member 60A are seam welded.
  • the side surface of the substrate 20A is surrounded by the wall portion 62A.
  • the sealing cover 40A is joined to the upper surface of the third ceramic plate 23A by seam welding. Specifically, a part of the upper surface of the third ceramic plate 23A is subjected to metallization, and the part subjected to the metallization is seam welded to the flange portion 42A of the sealing cover 40A.
  • the second fixing portion 73A overlaps the first fixing portion 64A.
  • the pressure detection device 10A is fixed to the mounted body 11 via the fixing portion of the first cover member 60A.
  • the bolt 56 is inserted into the first fixing hole 67A vacated in the first fixing portion 64A and the second fixing hole 77A vacated in the second fixing portion 73A, and the first fixing portion 64A and the 2nd fixing
  • the first fixing portion 64A and the second fixing portion 73A are fastened together.
  • the invention according to the second embodiment has the following effects in addition to the effect of attaching the first cover member 60A according to the first embodiment.
  • a second introduction hole 66A for flowing a fluid from the first introduction hole 65A to the pressure sensor 30A is formed by the first hole 24A and the second hole 25A.
  • the second hole 25A is half the size of the first hole 24A.
  • the edge of the second hole 25A and the edge of the first hole 24A are continuous.
  • the side surface of the substrate 20A is surrounded by a wall portion 62A raised from the first cover member 60A. That is, the lower surface of the substrate 20A is covered with the first cover member 60A, and the side surface is also surrounded. It can be said that the substrate 20A is accommodated in a box-shaped portion of the first cover member 60A.
  • the pressure detection device 10A further includes a second cover member 70A overlapped with the sealing cover 40A, and the second cover member 70A is a flange portion 42A (peripheral portion 42A) of the sealing cover 40A.
  • a second fixing portion 73A extending from the frame portion 76A toward the first fixing portion 64A and overlapping the first fixing portion 64A. Therefore, when the second fixing portion 73A is fixed to the first fixing portion 64A, the frame portion 76A is fixed so as to overlap the flange portion 42A (peripheral portion 42A) of the sealing cover 40A.
  • the collar portion 42A of the sealing cover 40A is pressed by the frame portion 76A, and the sealing cover 40A is difficult to peel off from the substrate 20A.
  • sealing cover 40A is joined to the substrate 20A by seam welding, and the substrate 20A is joined to the first cover member 60A by seam welding. Both the sealing cover 40A and the first cover member 60A are joined to the substrate 20A by seam welding. Since the same joining method is employed, the joining process is not complicated.
  • FIG. 7 shows a pressure detection device 13 that is a modification of the first embodiment.
  • the pressure detection device 13 includes a sealing cover 40B instead of the sealing cover 40 (see FIG. 2).
  • the sealing cover 40B includes a top plate portion 41B that covers the upper surface of the substrate 20 and the sensor 30, and a side wall portion 42B that extends downward from the periphery of the top plate portion 41B and covers the side portion of the substrate 20.
  • the lower end of the front wall 43B is located near the center of the ceramic plate 21 in the thickness direction.
  • the lower end of the rear wall portion 44B is located near the center of the ceramic plate 22 in the thickness direction.
  • EMC electromagnetic noise countermeasure parts
  • the pressure detection device of the present invention is suitable for mounting on a vehicle.
  • Pedestal 32A Semiconductor chip 40A ... Sealing cover 41A ... Main body part 42A ... Bridge (peripheral part) 60A ... first cover member 61A ... bottom part 62A ... wall part 63A ... first flange part 64A ... first fixing part 65A ... first introduction hole (first introduction part) 66A ... second introduction hole 70A ... second cover member 71A ... overlapping part 72A ... second flange part 73A ... second fixing part 74A ... annular part 75A ... cylinder part 76A ... frame part

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

Provided is a pressure detection device capable of suppressing a load on a ceramic substrate. A pressure detection device (10) has: a ceramic substrate (20); and a pressure sensor (30) that is electrically connected to the substrate (20) and detects fluid pressure. A surface of the substrate (20) facing an attach-to body (11) is covered with a first cover member (50). The first cover member (50) includes a first introduction part (54) made for introducing a fluid; and a first fixing part (52) for fixing to the attach-to body (11).

Description

圧力検出装置及び同製造方法Pressure detecting device and manufacturing method thereof
　本発明は、セラミック製の基板を備えた圧力検出装置及び同製造方法に関する。 The present invention relates to a pressure detection device including a ceramic substrate and a manufacturing method thereof.
　圧力検出装置は、気体や液体の圧力を圧力センサで検知し、圧力に応じた電気信号を出力する。このような圧力検出装置の従来技術として特許文献１に開示される技術がある。 The pressure detection device detects the pressure of gas or liquid with a pressure sensor and outputs an electric signal corresponding to the pressure. As a conventional technique of such a pressure detection device, there is a technique disclosed in Patent Document 1.
　特許文献１には、第１のケース半体（被取付体）と、この第１のケースに取付けられる圧力センサと、第１のケース半体に被せられ圧力センサを覆う第２のケース半体と、が開示されている。第１のケース半体には、第１の流体を導入するための第１の穴が空けられている。同様に、第２のケース半体には、第２の流体を導入するための第２の穴が空けられている。 Patent Document 1 discloses a first case half (attached body), a pressure sensor attached to the first case, and a second case half that covers the pressure sensor and covers the first case half. And are disclosed. The first case half is provided with a first hole for introducing the first fluid. Similarly, the second case half is provided with a second hole for introducing the second fluid.
　圧力センサは、第１の穴から導入された第１の流体の圧力を計測すると共に、第２の穴から導入された第２の流体の圧力を計測する。これにより、第１の流体の圧力を基準として、第２の流体の圧力の差圧が検出される。 The pressure sensor measures the pressure of the first fluid introduced from the first hole and measures the pressure of the second fluid introduced from the second hole. Thereby, a differential pressure between the pressures of the second fluid is detected with reference to the pressure of the first fluid.
特開平１０－９００９９号公報JP-A-10-90099
　ところで、圧力センサは、通常、基板に固定されており、圧力センサが固定された基板が被取付体に取付けられる。基板には、セラミック製のものがある。セラミックは一般的に硬くて脆い。さらに、被取付体の形状や大きさは、一様でなく、様々な被取付体が存する。そのため、セラミック製の基板を被取付体に取り付ける際には、基板に負荷がかからないように注意を払う必要がある。 Incidentally, the pressure sensor is usually fixed to the substrate, and the substrate on which the pressure sensor is fixed is attached to the mounted body. Some substrates are made of ceramic. Ceramics are generally hard and brittle. Furthermore, the shape and size of the mounted body are not uniform, and various mounted bodies exist. Therefore, when attaching the ceramic substrate to the mounted body, care must be taken so that no load is applied to the substrate.
　基板に負荷をかけずに、圧力検出装置を被取付体へ取り付けることができれば望ましい。 It is desirable that the pressure detection device can be attached to the mounted body without applying a load to the substrate.
　本発明は、セラミック製の基板への負荷を抑制できる圧力検出装置の被取付体への取付構造の提供を課題とする。 An object of the present invention is to provide a structure for mounting a pressure detection device to a body to be mounted that can suppress a load on a ceramic substrate.
　請求項１による発明によれば、セラミック製の基板と、この基板に電気的に接続され流体の圧力を検知する圧力センサと、この圧力センサを覆い前記圧力センサを封止する封止カバーと、を有し、被取付体に取付けられる圧力検出装置において、
　前記基板の前記被取付体に対向する面は、第１のカバー部材で覆われており、
　この第１のカバー部材は、前記流体を導入するために空けられた第１の導入部と、前記被取付体に固定される第１の固定部と、を含むことを特徴とする圧力検出装置が提供される。 According to the invention of claim 1, a ceramic substrate, a pressure sensor that is electrically connected to the substrate and detects the pressure of the fluid, a sealing cover that covers the pressure sensor and seals the pressure sensor, In the pressure detection device attached to the mounted body,
The surface of the substrate facing the attached body is covered with a first cover member,
The first cover member includes a first introduction portion that is vacant for introducing the fluid, and a first fixing portion that is fixed to the attached body. Is provided.
　請求項２に記載のごとく、好ましくは、前記第１の導入部は、前記圧力センサにより塞がれている。 As described in claim 2, preferably, the first introduction part is closed by the pressure sensor.
　請求項３に記載のごとく、好ましくは、前記圧力センサは、前記基板の上面であって、前記第１の導入部の上方を避けた部位に配置され、
　前記基板は、セラミック製の板であるセラミック板が複数重ねられてなり、
　前記第１の導入部から前記圧力センサまで前記流体を流すための第２の導入部は、前記セラミック板に空けられた穴によって形成されている。 As described in claim 3, preferably, the pressure sensor is arranged on a top surface of the substrate and avoiding the top of the first introduction portion,
The substrate is formed by stacking a plurality of ceramic plates that are ceramic plates,
The second introduction part for flowing the fluid from the first introduction part to the pressure sensor is formed by a hole formed in the ceramic plate.
　請求項４に記載のごとく、好ましくは、前記基板は、前記第１のカバー部材から立ち上げられた壁部によって側面が囲われている。 As described in claim 4, preferably, the side surface of the substrate is surrounded by a wall portion raised from the first cover member.
　請求項５に記載のごとく、好ましくは、前記圧力検出装置は、前記封止カバーに重ねられた第２のカバーをさらに有し、
　この第２のカバーは、前記封止カバーの周縁部に重なっている枠部と、この枠部から前記第１の固定部に向かって延び前記第１の固定部に重なっている第２の固定部と、を含む。 As described in claim 5, preferably, the pressure detection device further includes a second cover superimposed on the sealing cover,
The second cover includes a frame portion that overlaps a peripheral portion of the sealing cover, and a second fixing that extends from the frame portion toward the first fixing portion and overlaps the first fixing portion. Part.
　請求項６に記載のごとく、好ましくは、前記封止カバーは、シーム溶接により前記基板に接合されており、かつ、前記基板は、シーム溶接により前記第１のカバー部材に接合されている。 As described in claim 6, preferably, the sealing cover is joined to the substrate by seam welding, and the substrate is joined to the first cover member by seam welding.
　請求項１に係る発明では、セラミック製の基板の被取付体に対向する面は、第１のカバー部材で覆われている。この第１のカバー部材は、流体を導入するために空けられた第１の導入部と、被取付体に固定される第１の固定部と、を含む。即ち、圧力検出装置は、第１のカバー部材のなかの第１の固定部を介して、被取付体に取付けられる。基板が被取付体に直接に固定されないため、被取付体に圧力検出装置を取り付ける際に、基板に負荷がかかることを抑制できる。 In the invention according to claim 1, the surface of the ceramic substrate facing the mounted body is covered with the first cover member. This 1st cover member contains the 1st introducing | transducing part vacated in order to introduce | transduce a fluid, and the 1st fixing | fixed part fixed to a to-be-attached body. That is, the pressure detection device is attached to the attached body through the first fixing portion in the first cover member. Since the substrate is not directly fixed to the attached body, it is possible to suppress a load from being applied to the substrate when the pressure detection device is attached to the attached body.
　請求項２に係る発明では、第１の導入部は、圧力センサにより塞がれている。即ち、圧力センサは、基板でなく、第１のカバーに固定されている。圧力センサは、基板に接触していないため、第１の導入部から導入された流体の圧力が圧力センサに加わっても、基板に負荷は加わらない。 In the invention according to claim 2, the first introduction portion is closed by the pressure sensor. That is, the pressure sensor is fixed to the first cover, not the substrate. Since the pressure sensor is not in contact with the substrate, even if the pressure of the fluid introduced from the first introduction unit is applied to the pressure sensor, no load is applied to the substrate.
　請求項３に係る発明では、圧力センサは、基板の上面であって、第１の導入部の上方を避けた部位に配置され、基板は、セラミック製の板であるセラミック板が複数重ねられてなり、第１の導入部から圧力センサまで流体を流すための第２の導入部は、セラミック板に空けられた穴によって形成されている。即ち、複数のセラミック板には、穴が形成されており、複数のセラミック板が重ねられると、これらの穴は、互いにずれて位置する。穴の形成する位置をずらすことにより、折れ曲がる流路を簡易に形成することができる。 In the invention according to claim 3, the pressure sensor is disposed on the upper surface of the substrate and away from the upper side of the first introduction portion, and the substrate is formed by stacking a plurality of ceramic plates, which are ceramic plates. Thus, the second introduction part for flowing fluid from the first introduction part to the pressure sensor is formed by a hole formed in the ceramic plate. In other words, holes are formed in the plurality of ceramic plates, and when the plurality of ceramic plates are stacked, the holes are shifted from each other. By shifting the position where the hole is formed, the bent flow path can be easily formed.
　請求項４に係る発明では、基板は、第１のカバー部材から立ち上げられた壁部によって側面が囲われている。即ち、基板は、第１のカバー部材により、被取付体に対向する面が覆われており、かつ、側面も囲まれている。基板は、第１のカバー部材のなかの箱状の部位に収容されているともいえる。基板を被取付体に取付ける際に、基板が他の部品に当たり、基板に負荷が加わることを抑制できる。 In the invention according to claim 4, the side surface of the substrate is surrounded by the wall portion raised from the first cover member. In other words, the surface of the substrate that is opposed to the mounted body is covered by the first cover member, and the side surface is also surrounded. It can be said that the substrate is accommodated in a box-shaped portion of the first cover member. When attaching a board | substrate to a to-be-attached body, it can suppress that a board | substrate hits another component and a load is added to a board | substrate.
　請求項５に係る発明では、圧力検出装置は、封止カバーに重ねられた第２のカバーをさらに有し、この第２のカバーは、封止カバーの周縁部に重なっている枠部と、この枠部から第１の固定部に向かって延び第１の固定部に重なっている第２の固定部と、を含む。そのため、第２の固定部が、第１の固定部に固定されると、枠部は、封止カバーの周縁部に重なって固定される。封止カバーの周縁部は、枠部により押さえつけられ、封止カバーは、基板から剥がれにくくなる。 In the invention which concerns on Claim 5, a pressure detection apparatus further has the 2nd cover superimposed on the sealing cover, and this 2nd cover has the frame part which has overlapped with the peripheral part of the sealing cover, And a second fixing portion extending from the frame portion toward the first fixing portion and overlapping the first fixing portion. Therefore, when the second fixing portion is fixed to the first fixing portion, the frame portion is fixed so as to overlap the peripheral edge portion of the sealing cover. The peripheral part of the sealing cover is pressed by the frame part, and the sealing cover is hardly peeled off from the substrate.
　請求項６に係る発明では、封止カバーは、シーム溶接により基板に接合されており、かつ、基板は、シーム溶接により第１のカバー部材に接合されている。封止カバー及び第１のカバー部材は、共に、シーム溶接により基板と接合している。同一の接合方法が採用されるため、接合の工程が複雑とならない。 In the invention according to claim 6, the sealing cover is joined to the substrate by seam welding, and the substrate is joined to the first cover member by seam welding. Both the sealing cover and the first cover member are joined to the substrate by seam welding. Since the same joining method is employed, the joining process is not complicated.
本発明の実施例１による圧力検出装置の斜視図である。It is a perspective view of the pressure detection apparatus by Example 1 of this invention. 図１の２－２線断面図である。FIG. 2 is a sectional view taken along line 2-2 of FIG. 図１に示された圧力検出装置の変形例について説明する図である。It is a figure explaining the modification of the pressure detection apparatus shown by FIG. 本発明の実施例２による圧力検出装置の平面図である。It is a top view of the pressure detection apparatus by Example 2 of this invention. 図４の５－５線断面図である。FIG. 5 is a sectional view taken along line 5-5 of FIG. 図４に示された圧力検出装置の第１のカバー部材、及び、第２のカバー部材の斜視図である。FIG. 5 is a perspective view of a first cover member and a second cover member of the pressure detection device shown in FIG. 4. 図１に示された圧力検出装置の変形例について説明する図である。It is a figure explaining the modification of the pressure detection apparatus shown by FIG.
　本発明の実施の形態を添付図に基づいて以下に説明する。なお、図中Ｆｒは前、Ｒｒは後、Ｌは左、Ｒは右、Ｕｐは上、Ｄｎは下を示している。
＜実施例１＞ Embodiments of the present invention will be described below with reference to the accompanying drawings. In the figure, Fr indicates front, Rr indicates rear, L indicates left, R indicates right, Up indicates top, and Dn indicates bottom.
<Example 1>
　図１を参照する。図１には、本発明の実施例１による圧力検出装置１０が示されている。この圧力検出装置１０は、被取付体１１、例えば、車両のトランスミッションや燃料噴射装置等に取付けられる。圧力検出装置１０は、被取付体１１の内部を流れる流体の圧力を検出して、電気信号を出力する。 Refer to FIG. FIG. 1 shows a pressure detection device 10 according to Embodiment 1 of the present invention. The pressure detection device 10 is attached to an attached body 11, for example, a vehicle transmission, a fuel injection device, or the like. The pressure detection device 10 detects the pressure of the fluid flowing inside the mounted body 11 and outputs an electrical signal.
　図１，図２を参照する。圧力検出装置１０は、セラミック製の基板２０と、この基板２０に電気的に接続され流体の圧力を検知する圧力センサ３０と、この圧力センサ３０を覆うと共に封止する封止カバー４０と、基板２０の被取付体１１に対向する面を覆う第１のカバー部材５０と、を有する。 Refer to FIG. 1 and FIG. The pressure detection device 10 includes a ceramic substrate 20, a pressure sensor 30 that is electrically connected to the substrate 20 and detects the pressure of a fluid, a sealing cover 40 that covers and seals the pressure sensor 30, and a substrate And a first cover member 50 that covers a surface of the 20 attached body 11 that faces the attached body 11.
　基板２０は、セラミック製の板である第１のセラミック板２１，第２のセラミック板２２，第３のセラミック板２３が重ねられてなる。第１のセラミック板２１の中央には、第１の穴２４が形成されている。同様に、第２のセラミック板２２の中央には、第２の穴２５が形成され、第３のセラミック板２３の中央には、第３の穴２６が形成されている。第１の穴２４と第３の穴２６は、同じ大きさである。第２の穴２５は、第１の穴２４よりも小さい。 The substrate 20 is formed by stacking a first ceramic plate 21, a second ceramic plate 22, and a third ceramic plate 23 which are ceramic plates. A first hole 24 is formed in the center of the first ceramic plate 21. Similarly, a second hole 25 is formed at the center of the second ceramic plate 22, and a third hole 26 is formed at the center of the third ceramic plate 23. The first hole 24 and the third hole 26 have the same size. The second hole 25 is smaller than the first hole 24.
　第１のセラミック板２１のランドには、電源用リード端子２７、信号用リード端子２８、グランド用リード端子２９が接続されている。 A power lead terminal 27, a signal lead terminal 28, and a ground lead terminal 29 are connected to the land of the first ceramic plate 21.
　圧力センサ３０は、筒状のガラス製の台座３１と、この台座３１に固定される円板状の半導体チップ３２とからなる。半導体チップ３２は、シリコン等の半導体を薄肉に形成してなるダイアフラムである。台座３１と半導体チップ３２は、シリコンとガラスを接合するいわゆる陽極接合により互いに固定されている。半導体チップ３２は、ワイヤによって基板２０と接続されている。 The pressure sensor 30 includes a cylindrical glass pedestal 31 and a disk-shaped semiconductor chip 32 fixed to the pedestal 31. The semiconductor chip 32 is a diaphragm formed by thinly forming a semiconductor such as silicon. The pedestal 31 and the semiconductor chip 32 are fixed to each other by so-called anodic bonding for bonding silicon and glass. The semiconductor chip 32 is connected to the substrate 20 by a wire.
　封止カバー４０は、コバール等の金属製で、平板状を呈する。 The sealing cover 40 is made of metal such as Kovar and has a flat plate shape.
　第１のカバー部材５０は、基板２０を覆う矩形状の平板部５１と、この平板部５１の角に設けられ被取付体１１に固定される４つの第１の固定部５２と、からなる。平板部５１の中央には、上方に開いた凹部５３が形成されている。凹部５３には、被取付体１１の内部を流れる流体を導入するために空けられた円形状の第１の導入穴５４（第１の導入部５４）が空けられている。 The first cover member 50 includes a rectangular flat plate portion 51 that covers the substrate 20 and four first fixing portions 52 that are provided at corners of the flat plate portion 51 and are fixed to the mounted body 11. In the center of the flat plate portion 51, a concave portion 53 opened upward is formed. The concave portion 53 is provided with a circular first introduction hole 54 (first introduction portion 54) that is vacated in order to introduce a fluid that flows inside the mounted body 11.
　次に、上記部品による圧力検出装置１０の構成について説明する。凹部５３に空けられた第１の導入穴５４は、圧力センサ３０により塞がれている。台座３１は、ダイボンディングにより凹部５３に接着されている。 Next, the configuration of the pressure detection device 10 using the above components will be described. The first introduction hole 54 formed in the recess 53 is closed by the pressure sensor 30. The pedestal 31 is bonded to the recess 53 by die bonding.
　第１のセラミック板２１の下面は、シーム溶接により第１のカバー部材５０に接合されている。詳細には、第１のセラミック板２１に空けられた第１の穴２４を囲むようにメタライズ加工を施し、メタライズ加工が施された部位と第１のカバー部材５０とがシーム溶接される。半導体チップ３２は、ワイヤボンディングにより基板２０のランドと接続している。 The lower surface of the first ceramic plate 21 is joined to the first cover member 50 by seam welding. More specifically, metallization is performed so as to surround the first hole 24 formed in the first ceramic plate 21, and the part subjected to the metallization and the first cover member 50 are seam welded. The semiconductor chip 32 is connected to the land of the substrate 20 by wire bonding.
　封止カバー４０は、シーム溶接により第３のセラミック板２３の上面に接合されている。詳細には、第３のセラミック板２３の上面の一部にメタライズ加工を施し、メタライズ加工が施された部位と封止カバー４０とがシーム溶接される。これにより、圧力センサ３０が覆われる。第１のカバー部材５０、基板２０、及び、封止カバー４０に囲われる領域は、基準となる圧力が測定される空間となる。 The sealing cover 40 is joined to the upper surface of the third ceramic plate 23 by seam welding. Specifically, a part of the upper surface of the third ceramic plate 23 is subjected to metallization, and the part subjected to the metallization and the sealing cover 40 are seam welded. Thereby, the pressure sensor 30 is covered. A region surrounded by the first cover member 50, the substrate 20, and the sealing cover 40 is a space in which a reference pressure is measured.
　第１のカバー部材５０を備えた圧力検出装置１０は、第１のカバー部材５０の４つの第１の固定部５２を介して、被取付体１１に固定される。詳細には、第１の固定部５２に空けられた第１の固定穴５５に、ボルト５６がそれぞれ差し込まれ、４つの第１の固定部５２と被取付体１１とが締結される。 The pressure detection device 10 including the first cover member 50 is fixed to the mounted body 11 via the four first fixing portions 52 of the first cover member 50. Specifically, the bolts 56 are respectively inserted into the first fixing holes 55 formed in the first fixing portion 52, and the four first fixing portions 52 and the attached body 11 are fastened.
　次に、本発明の効果について説明する。 Next, the effect of the present invention will be described.
　図２を参照する。セラミック製の基板２０（第１のセラミック板２１）の下側の面（被取付体１１に対向する面）は、第１のカバー部材５０で覆われている。この第１のカバー部材５０は、第１の導入穴５４と、第１の固定部５２と、を含む。即ち、圧力検出装置１０は、第１の固定部５２を介して、被取付体１１に取付けられる。基板２０が被取付体１１に直接に固定されないため、被取付体１１に圧力検出装置１０を取り付ける際に、基板２０に負荷がかかることを抑制できる。 Refer to FIG. The lower surface of the ceramic substrate 20 (first ceramic plate 21) (the surface facing the mounted body 11) is covered with a first cover member 50. The first cover member 50 includes a first introduction hole 54 and a first fixing portion 52. That is, the pressure detection device 10 is attached to the attached body 11 via the first fixing portion 52. Since the board | substrate 20 is not fixed directly to the to-be-attached body 11, when attaching the pressure detection apparatus 10 to the to-be-attached body 11, it can suppress that a load is applied to the board | substrate 20. FIG.
　加えて、第１のカバー部材５０の第１の導入穴５４は、圧力センサ３０により塞がれている。即ち、圧力センサ３０は、基板２０でなく、第１のカバー部材５０に固定されている。圧力センサ３０は、基板２０に接触していないため、第１の導入穴５４から導入された流体の圧力が圧力センサ３０に加わっても、基板２０に負荷は加わらない。 In addition, the first introduction hole 54 of the first cover member 50 is closed by the pressure sensor 30. That is, the pressure sensor 30 is fixed not to the substrate 20 but to the first cover member 50. Since the pressure sensor 30 is not in contact with the substrate 20, no load is applied to the substrate 20 even when the pressure of the fluid introduced from the first introduction hole 54 is applied to the pressure sensor 30.
　図３を参照する。図３には、実施例１の変更例である液面検出装置１２が示されている。液面検出装置は１２には、第１のカバー部材５０（図２参照）に代えて、第１のカバー部材８０が取付けられている。その他の構成についての説明は、符号を流用するとともに説明を省略する。 Refer to FIG. FIG. 3 shows a liquid level detection device 12 which is a modification of the first embodiment. In the liquid level detection device 12, a first cover member 80 is attached in place of the first cover member 50 (see FIG. 2). In the description of other configurations, the reference numerals are used and the description is omitted.
　第１のカバー部材８０は、基板２０を覆う矩形状の平板部８１と、この平板部８１の角に設けられ被取付体１１に固定される４つの第１の固定部８２（２つの第１の固定部８２，８２のみが示されている）と、からなる。平板部８１の中央には、下方に開いた凹部８３が形成されている。凹部８３には、被取付体１１の内部を流れる流体を導入するために空けられた円形状の第１の導入穴８４が空けられている。
＜実施例２＞ The first cover member 80 includes a rectangular flat plate portion 81 that covers the substrate 20, and four first fixing portions 82 (two first fixing portions 82 that are provided at corners of the flat plate portion 81 and are fixed to the mounted body 11. Only the fixed portions 82 and 82 are shown). A concave portion 83 opened downward is formed at the center of the flat plate portion 81. The recess 83 is provided with a circular first introduction hole 84 that is opened in order to introduce the fluid flowing inside the mounted body 11.
<Example 2>
　図４，図５を参照する。次に、本発明の実施例２について説明する。実施例２による圧力検出装置１０Ａは、主に、第１のカバー部材６０Ａの形状、及び、圧力センサ３０Ａの配置される位置が異なる。さらに、圧力検出装置１０Ａは、第１のカバー部材６０Ａと共に、基板２０Ａを挟み込む第２のカバー部材７０Ａを有する。 Refer to FIG. 4 and FIG. Next, a second embodiment of the present invention will be described. The pressure detection device 10A according to the second embodiment mainly differs in the shape of the first cover member 60A and the position where the pressure sensor 30A is disposed. Furthermore, the pressure detection device 10A includes a second cover member 70A that sandwiches the substrate 20A together with the first cover member 60A.
　基板２０Ａは、セラミック製の板である第１のセラミック板２１Ａ，第２のセラミック板２２Ａ，第３のセラミック板２３Ａが重ねられてなる。第１のセラミック板２１Ａの中央には、第１の穴２４Ａが形成されている。同様に、第２のセラミック板２２Ａの中央には、第２の穴２５Ａが形成され、第３のセラミック板２３Ａの中央には、第３の穴２６Ａが形成されている。第２の穴２５Ａは、長円形状を呈する。 The substrate 20A is formed by stacking a first ceramic plate 21A, a second ceramic plate 22A, and a third ceramic plate 23A, which are ceramic plates. A first hole 24A is formed in the center of the first ceramic plate 21A. Similarly, a second hole 25A is formed at the center of the second ceramic plate 22A, and a third hole 26A is formed at the center of the third ceramic plate 23A. The second hole 25A has an oval shape.
　圧力センサ３０Ａは、円板状の台座３１Ａと、この台座３１Ａと略同じ大きさの円板状の半導体チップ３２Ａとからなる。半導体チップ３２Ａは、ワイヤによって基板２０Ａと接続されている。 The pressure sensor 30A includes a disk-shaped pedestal 31A and a disk-shaped semiconductor chip 32A having the same size as the pedestal 31A. The semiconductor chip 32A is connected to the substrate 20A by a wire.
　封止カバー４０Ａは、略ハット形状を呈し、箱体を逆さまにした形状を呈する本体部４１Ａと、この本体部４１Ａの下端に環状に形成された鍔部４２Ａと、からなる。 The sealing cover 40A has a main body portion 41A that has a substantially hat shape and has a box shape turned upside down, and a flange portion 42A that is formed annularly at the lower end of the main body portion 41A.
　図５，図６を参照する。第１のカバー部材６０Ａは、第１のセラミック板２１Ａの下面を覆う矩形状の底部６１Ａと、この底部６１Ａの周縁から立ち上げられた壁部６２Ａと、この壁部６２Ａの上端に設けられた第１のフランジ部６３Ａと、この第１のフランジ部６３Ａの端部に形成された第１の固定部６４Ａと、からなる。底部６１Ａの中央には、第１の導入穴６５Ａ（第１の導入部６５Ａ）が空けられている。 Refer to FIG. 5 and FIG. The first cover member 60A is provided at a rectangular bottom 61A that covers the lower surface of the first ceramic plate 21A, a wall 62A raised from the periphery of the bottom 61A, and an upper end of the wall 62A. The first flange portion 63A and a first fixing portion 64A formed at the end of the first flange portion 63A. In the center of the bottom portion 61A, a first introduction hole 65A (first introduction portion 65A) is opened.
　第２のカバー部材７０Ａ部材は、封止カバー４０Ａに重なる重合部７１Ａと、この重合部７１Ａの下端に設けられた第２のフランジ部７２Ａと、この第２のフランジ部７２Ａの端部に形成された第２の固定部７３Ａと、からなる。 The second cover member 70A is formed at the overlapping portion 71A overlapping the sealing cover 40A, the second flange portion 72A provided at the lower end of the overlapping portion 71A, and the end portion of the second flange portion 72A. Second fixed portion 73A.
　重合部７１Ａは、封止カバー４０Ａの本体部４１Ａの上面に重なる環状部７４Ａと、環状部７４Ａの端部から下方に延びる筒部７５Ａと、この筒部７５Ａの下端に設けられ封止カバー４０Ａの鍔部４２Ａ（周縁部４２Ａ）に重なる枠部７６Ａと、からなる。枠部７６Ａと、第２のフランジ部７２Ａの一部は、リード端子２７～２９の接続のために切り欠かれている。 The overlapping portion 71A includes an annular portion 74A that overlaps the upper surface of the main body portion 41A of the sealing cover 40A, a cylindrical portion 75A that extends downward from the end of the annular portion 74A, and a sealing cover 40A provided at the lower end of the cylindrical portion 75A. The frame portion 76A overlaps with the flange portion 42A (peripheral portion 42A). The frame portion 76A and a part of the second flange portion 72A are notched for connecting the lead terminals 27-29.
　次に、上記部品による圧力検出装置１０Ａの構成について説明する。第１の導入穴６５Ａから圧力センサ３０Ａまで流体を流すための第２の導入穴６６Ａ（第２の導入部６６Ａ）は、第１の穴２４Ａと第２の穴２５Ａにより形成されている。第１の穴２４Ａは、第２の穴２５Ａよりも２倍以上大きい。第２の穴２５Ａの縁と第１の穴２４Ａの縁は、連続している。第３の穴２６Ａは、第１の穴２４Ａよりも大きい。 Next, the configuration of the pressure detection apparatus 10A using the above parts will be described. A second introduction hole 66A (second introduction portion 66A) for flowing a fluid from the first introduction hole 65A to the pressure sensor 30A is formed by the first hole 24A and the second hole 25A. The first hole 24A is twice or more larger than the second hole 25A. The edge of the second hole 25A and the edge of the first hole 24A are continuous. The third hole 26A is larger than the first hole 24A.
　圧力センサ３０Ａは、第２のセラミック板２２Ａの上面であって、第１の導入穴６５Ａの上方を避けた部位に配置されている。即ち、第２の穴２５Ａは、第１の導入穴６５Ａの上方を避けた部位に位置している。さらに、第２の穴２５Ａは、圧力センサ３０Ａにより塞がれている。 The pressure sensor 30A is disposed on the upper surface of the second ceramic plate 22A and away from the upper side of the first introduction hole 65A. That is, the second hole 25A is located at a portion that avoids the upper side of the first introduction hole 65A. Further, the second hole 25A is closed by the pressure sensor 30A.
　第１のセラミック板２１Ａの下面は、シーム溶接により第１のカバー部材６０Ａに接合されている。詳細には、第１のセラミック板２１Ａの第１の穴２４Ａを囲むようにメタライズ加工を施し、メタライズ加工が施された部位と第１のカバー部材６０Ａがシーム溶接される。 The lower surface of the first ceramic plate 21A is joined to the first cover member 60A by seam welding. More specifically, metallization processing is performed so as to surround the first hole 24A of the first ceramic plate 21A, and the portion subjected to the metallization processing and the first cover member 60A are seam welded.
　基板２０Ａは、壁部６２Ａによって側面が囲われている。 The side surface of the substrate 20A is surrounded by the wall portion 62A.
　封止カバー４０Ａは、シーム溶接により第３のセラミック板２３Ａの上面に接合されている。詳細には、第３のセラミック板２３Ａの上面の一部にメタライズ加工を施し、メタライズ加工が施された部位と封止カバー４０Ａの鍔部４２Ａとがシーム溶接される。 The sealing cover 40A is joined to the upper surface of the third ceramic plate 23A by seam welding. Specifically, a part of the upper surface of the third ceramic plate 23A is subjected to metallization, and the part subjected to the metallization is seam welded to the flange portion 42A of the sealing cover 40A.
　第２の固定部７３Ａは、第１の固定部６４Ａに重なる。この圧力検出装置１０Ａは、第１のカバー部材６０Ａの固定部を介して、被取付体１１に固定される。詳細には、第１の固定部６４Ａに空けられた第１の固定穴６７Ａと、第２の固定部７３Ａに空けられた第２の固定穴７７Ａにボルト５６が差し込まれ、第１の固定部６４Ａと第２の固定部７３Ａ被取付体１１とが締結される。第１の固定部６４Ａ及び第２の固定部７３Ａは、共締めされている。 The second fixing portion 73A overlaps the first fixing portion 64A. The pressure detection device 10A is fixed to the mounted body 11 via the fixing portion of the first cover member 60A. Specifically, the bolt 56 is inserted into the first fixing hole 67A vacated in the first fixing portion 64A and the second fixing hole 77A vacated in the second fixing portion 73A, and the first fixing portion 64A and the 2nd fixing | fixed part 73A to-be-attached body 11 are fastened. The first fixing portion 64A and the second fixing portion 73A are fastened together.
　次に、実施例２による発明の効果について説明する。実施例２による発明は、実施例１による第１のカバー部材６０Ａを取り付けた効果に加えて、以下の効果を有する。 Next, the effect of the invention according to Example 2 will be described. The invention according to the second embodiment has the following effects in addition to the effect of attaching the first cover member 60A according to the first embodiment.
　図５を参照する。第１の導入穴６５Ａから圧力センサ３０Ａまで流体を流すための第２の導入穴６６Ａは、第１の穴２４Ａと第２の穴２５Ａにより形成されている。第２の穴２５Ａは、第１の穴２４Ａの大きさの半分である。第２の穴２５Ａの縁と第１の穴２４Ａの縁は、連続している。第１の穴２４Ａと第２の穴２５Ａの配置の組み合わせにより、折れ曲がる流路を簡易に形成することができる。 Refer to FIG. A second introduction hole 66A for flowing a fluid from the first introduction hole 65A to the pressure sensor 30A is formed by the first hole 24A and the second hole 25A. The second hole 25A is half the size of the first hole 24A. The edge of the second hole 25A and the edge of the first hole 24A are continuous. By the combination of the arrangement of the first hole 24A and the second hole 25A, a bent flow path can be easily formed.
　加えて、基板２０Ａは、第１のカバー部材６０Ａから立ち上げられた壁部６２Ａによって側面が囲われている。即ち、基板２０Ａは、第１のカバー部材６０Ａにより、下面が覆われており、かつ、側面も囲まれている。基板２０Ａは、第１のカバー部材６０Ａのなかの箱状の部位に収容されているともいえる。基板２０Ａを被取付体１１に取付ける際に、基板２０Ａが他の部品に当たり、基板２０Ａに負荷が加わることを抑制できる。 In addition, the side surface of the substrate 20A is surrounded by a wall portion 62A raised from the first cover member 60A. That is, the lower surface of the substrate 20A is covered with the first cover member 60A, and the side surface is also surrounded. It can be said that the substrate 20A is accommodated in a box-shaped portion of the first cover member 60A. When the board 20A is attached to the body 11 to be attached, it is possible to prevent the board 20A from hitting other components and applying a load to the board 20A.
　加えて、圧力検出装置１０Ａは、封止カバー４０Ａに重ねられた第２のカバー部材７０Ａをさらに有し、この第２のカバー部材７０Ａは、封止カバー４０Ａの鍔部４２Ａ（周縁部４２Ａ）に重なっている枠部７６Ａと、この枠部７６Ａから第１の固定部６４Ａに向かって延び第１の固定部６４Ａに重なっている第２の固定部７３Ａと、を含む。そのため、第２の固定部７３Ａが、第１の固定部６４Ａに固定されると、枠部７６Ａは、封止カバー４０Ａの鍔部４２Ａ（周縁部４２Ａ）に重なって固定される。封止カバー４０Ａの鍔部４２Ａは、枠部７６Ａにより押さえつけられ、封止カバー４０Ａは、基板２０Ａから剥がれにくくなる。 In addition, the pressure detection device 10A further includes a second cover member 70A overlapped with the sealing cover 40A, and the second cover member 70A is a flange portion 42A (peripheral portion 42A) of the sealing cover 40A. And a second fixing portion 73A extending from the frame portion 76A toward the first fixing portion 64A and overlapping the first fixing portion 64A. Therefore, when the second fixing portion 73A is fixed to the first fixing portion 64A, the frame portion 76A is fixed so as to overlap the flange portion 42A (peripheral portion 42A) of the sealing cover 40A. The collar portion 42A of the sealing cover 40A is pressed by the frame portion 76A, and the sealing cover 40A is difficult to peel off from the substrate 20A.
　加えて、封止カバー４０Ａは、シーム溶接により基板２０Ａに接合されており、かつ、基板２０Ａは、シーム溶接により第１のカバー部材６０Ａに接合されている。封止カバー４０Ａ及び第１のカバー部材６０Ａは、共に、シーム溶接により基板２０Ａと接合している。同一の接合方法が採用されるため、接合の工程が複雑とならない。 In addition, the sealing cover 40A is joined to the substrate 20A by seam welding, and the substrate 20A is joined to the first cover member 60A by seam welding. Both the sealing cover 40A and the first cover member 60A are joined to the substrate 20A by seam welding. Since the same joining method is employed, the joining process is not complicated.
　図７を参照する。図７には、実施例１の変形例である圧力検出装置１３が示されている。圧力検出装置１３は、封止カバー４０（図２参照）に代え、封止カバー４０Ｂを有する。封止カバー４０Ｂは、基板２０の上面及びセンサ３０を覆う天板部４１Ｂと、この天板部４１Ｂの周縁から下方に延び基板２０の側部を覆う側壁部４２Ｂと、からなる。 Refer to FIG. FIG. 7 shows a pressure detection device 13 that is a modification of the first embodiment. The pressure detection device 13 includes a sealing cover 40B instead of the sealing cover 40 (see FIG. 2). The sealing cover 40B includes a top plate portion 41B that covers the upper surface of the substrate 20 and the sensor 30, and a side wall portion 42B that extends downward from the periphery of the top plate portion 41B and covers the side portion of the substrate 20.
　前壁部４３Ｂの下端は、セラミック板２１の厚み方向の中央付近に位置している。後壁部４４Ｂの下端は、セラミック板２２の厚み方向の中央付近に位置している。 The lower end of the front wall 43B is located near the center of the ceramic plate 21 in the thickness direction. The lower end of the rear wall portion 44B is located near the center of the ceramic plate 22 in the thickness direction.
　なお、ＥＭＣ（電磁ノイズ）対策部品を基板２０，２０Ａに設けることができる。本発明の作用及び効果を奏する限りにおいて、本発明は、上記の実施例及び変形例に限定されるものではない。 In addition, EMC (electromagnetic noise) countermeasure parts can be provided on the boards 20 and 20A. As long as the effects and effects of the present invention are exhibited, the present invention is not limited to the above embodiments and modifications.
　本発明の圧力検出装置は、車両に搭載するのに好適である。 The pressure detection device of the present invention is suitable for mounting on a vehicle.
１０…圧力検出装置
１１…被取付体
２０…基板
２１…第１のセラミック板
２２…第２のセラミック板
２３…第３のセラミック板
２４…第１の穴
２５…第２の穴
２６…第３の穴
３０…圧力センサ
３１…台座
３２…半導体チップ
４０…封止カバー
５０…第１のカバー部材
５１…平板部
５２…第１の固定部
５３…凹部
５４…第１の導入穴（第１の導入部）
１０Ａ…圧力検出装置
２０Ａ…基板
２１Ａ…第１のセラミック板
２２Ａ…第２のセラミック板
２３Ａ…第３のセラミック板
２４Ａ…第１の穴
２５Ａ…第２の穴
２６Ａ…第３の穴
３０Ａ…圧力センサ
３１Ａ…台座
３２Ａ…半導体チップ
４０Ａ…封止カバー
４１Ａ…本体部
４２Ａ…鍔部（周縁部）
６０Ａ…第１のカバー部材
６１Ａ…底部
６２Ａ…壁部
６３Ａ…第１のフランジ部
６４Ａ…第１の固定部
６５Ａ…第１の導入穴（第１の導入部）
６６Ａ…第２の導入穴
７０Ａ…第２のカバー部材
７１Ａ…重合部
７２Ａ…第２のフランジ部
７３Ａ…第２の固定部
７４Ａ…環状部
７５Ａ…筒部
７６Ａ…枠部 DESCRIPTION OF SYMBOLS 10 ... Pressure detection apparatus 11 ... Mounted object 20 ... Board | substrate 21 ... 1st ceramic board 22 ... 2nd ceramic board 23 ... 3rd ceramic board 24 ... 1st hole 25 ... 2nd hole 26 ... 3rd Hole 30 ... pressure sensor 31 ... pedestal 32 ... semiconductor chip 40 ... sealing cover 50 ... first cover member 51 ... flat plate part 52 ... first fixing part 53 ... concave part 54 ... first introduction hole (first Introduction)
10A ... Pressure detector 20A ... Substrate 21A ... First ceramic plate 22A ... Second ceramic plate 23A ... Third ceramic plate 24A ... First hole 25A ... Second hole 26A ... Third hole 30A ... Pressure Sensor 31A ... Pedestal 32A ... Semiconductor chip 40A ... Sealing cover 41A ... Main body part 42A ... Bridge (peripheral part)
60A ... first cover member 61A ... bottom part 62A ... wall part 63A ... first flange part 64A ... first fixing part 65A ... first introduction hole (first introduction part)
66A ... second introduction hole 70A ... second cover member 71A ... overlapping part 72A ... second flange part 73A ... second fixing part 74A ... annular part 75A ... cylinder part 76A ... frame part

Claims (6)

  1. 　セラミック製の基板と、この基板に電気的に接続され流体の圧力を検知する圧力センサと、この圧力センサを覆い前記圧力センサを封止する封止カバーと、を有し、被取付体に取付けられる圧力検出装置において、
    　前記基板の前記被取付体に対向する面は、第１のカバー部材で覆われており、
    　この第１のカバー部材は、前記流体を導入するために空けられた第１の導入部と、前記被取付体に固定される第１の固定部と、を含むことを特徴とする圧力検出装置。     A ceramic substrate, a pressure sensor that is electrically connected to the substrate and detects the pressure of the fluid, and a sealing cover that covers the pressure sensor and seals the pressure sensor, and is attached to the mounted body In the pressure detecting device,
    The surface of the substrate facing the attached body is covered with a first cover member,
    The first cover member includes a first introduction portion that is vacant for introducing the fluid, and a first fixing portion that is fixed to the attached body. .
  2. 　前記第１の導入部は、前記圧力センサにより塞がれていることを特徴とする請求項１に記載の圧力検出装置。 The pressure detection device according to claim 1, wherein the first introduction part is closed by the pressure sensor.
  3. 　前記圧力センサは、前記基板の上面であって、前記第１の導入部の上方を避けた部位に配置され、
    　前記基板は、セラミック製の板であるセラミック板が複数重ねられてなり、
    　前記第１の導入部から前記圧力センサまで前記流体を流すための第２の導入部は、前記セラミック板に空けられた穴によって形成されていることを特徴とする請求項１に記載の圧力検出装置。     The pressure sensor is disposed on a top surface of the substrate and avoiding the top of the first introduction part,
    The substrate is formed by stacking a plurality of ceramic plates that are ceramic plates,
    2. The pressure detection according to claim 1, wherein a second introduction portion for flowing the fluid from the first introduction portion to the pressure sensor is formed by a hole formed in the ceramic plate. apparatus.
  4. 　前記基板は、前記第１のカバー部材から立ち上げられた壁部によって側面が囲われていることを特徴とする請求項１～請求項３のいずれか１項に記載の圧力検出装置。 The pressure detection device according to any one of claims 1 to 3, wherein a side surface of the substrate is surrounded by a wall portion raised from the first cover member.
  5. 　前記圧力検出装置は、前記封止カバーに重ねられた第２のカバーをさらに有し、
    　この第２のカバーは、前記封止カバーの周縁部に重なっている枠部と、この枠部から前記第１の固定部に向かって延び前記第１の固定部に重なっている第２の固定部と、を含むことを特徴とする請求項１～請求項４のいずれか１項に記載の圧力検出装置。     The pressure detection device further includes a second cover superimposed on the sealing cover,
    The second cover includes a frame portion that overlaps a peripheral portion of the sealing cover, and a second fixing that extends from the frame portion toward the first fixing portion and overlaps the first fixing portion. The pressure detection device according to any one of claims 1 to 4, further comprising: a portion.
  6. 　前記封止カバーは、シーム溶接により前記基板に接合されており、かつ、前記基板は、シーム溶接により前記第１のカバー部材に接合されていることを特徴とする請求項１～請求項５のいずれか１項に記載の圧力検出装置の製造方法。 6. The sealing cover according to claim 1, wherein the sealing cover is joined to the substrate by seam welding, and the substrate is joined to the first cover member by seam welding. The manufacturing method of the pressure detection apparatus of any one.
PCT/JP2018/020137 2017-05-30 2018-05-25 Pressure detection device and production method thereof WO2018221400A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007139517A (en) * 2005-11-16 2007-06-07 Epson Toyocom Corp Method for manufacturing pressure sensor, pressure sensor, and method for mounting pressure sensor
JP2010217170A (en) * 2009-02-17 2010-09-30 Seiko Epson Corp Composite sensor and electronic device
JP2012073233A (en) * 2010-08-31 2012-04-12 Mitsumi Electric Co Ltd Sensor device and mounting method of semiconductor sensor element
US20160313201A1 (en) * 2015-04-23 2016-10-27 Samsung Electro-Mechanics Co., Ltd. Pressure sensor package

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009007837A1 (en) * 2009-02-06 2010-08-19 Epcos Ag Sensor module and method for producing sensor modules
JP5972850B2 (en) * 2013-11-15 2016-08-17 長野計器株式会社 Physical quantity measurement sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007139517A (en) * 2005-11-16 2007-06-07 Epson Toyocom Corp Method for manufacturing pressure sensor, pressure sensor, and method for mounting pressure sensor
JP2010217170A (en) * 2009-02-17 2010-09-30 Seiko Epson Corp Composite sensor and electronic device
JP2012073233A (en) * 2010-08-31 2012-04-12 Mitsumi Electric Co Ltd Sensor device and mounting method of semiconductor sensor element
US20160313201A1 (en) * 2015-04-23 2016-10-27 Samsung Electro-Mechanics Co., Ltd. Pressure sensor package

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