WO2018217006A3 - 반도체 발광소자 및 이의 제조 방법 - Google Patents
반도체 발광소자 및 이의 제조 방법 Download PDFInfo
- Publication number
- WO2018217006A3 WO2018217006A3 PCT/KR2018/005835 KR2018005835W WO2018217006A3 WO 2018217006 A3 WO2018217006 A3 WO 2018217006A3 KR 2018005835 W KR2018005835 W KR 2018005835W WO 2018217006 A3 WO2018217006 A3 WO 2018217006A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- emitting element
- semiconductor light
- manufacturing same
- body portion
- bottom portion
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Abstract
본 개시는 반도체 발광소자에 있어서, 중앙영역이 오목한 상면을 갖는 본체부; 반도체 발광소자 칩이 배치되며 중앙영역에 대응되는 부분이 본체부의 하면으로 돌출된 바닥부; 그리고 본체부의 하면에 위치하며 바닥부와 중첩되지 않는 복수의 지지부;를 포함하는 반도체 발광소자에 관한 것이다.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0063385 | 2017-05-23 | ||
KR1020170063385A KR101877237B1 (ko) | 2017-05-23 | 2017-05-23 | 반도체 발광소자 및 이의 제조 방법 |
KR10-2017-0083451 | 2017-06-30 | ||
KR1020170083451A KR101946241B1 (ko) | 2017-06-30 | 2017-06-30 | 반도체 발광소자 및 이의 제조 방법 |
KR1020170083453A KR101946242B1 (ko) | 2017-06-30 | 2017-06-30 | 반도체 발광소자 및 이의 제조 방법 |
KR10-2017-0083453 | 2017-06-30 | ||
KR10-2017-0083466 | 2017-06-30 | ||
KR1020170083466A KR20190003895A (ko) | 2017-06-30 | 2017-06-30 | 발광소자 검사장치 및 이의 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2018217006A2 WO2018217006A2 (ko) | 2018-11-29 |
WO2018217006A3 true WO2018217006A3 (ko) | 2019-01-17 |
Family
ID=64395764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2018/005835 WO2018217006A2 (ko) | 2017-05-23 | 2018-05-23 | 반도체 발광소자 및 이의 제조 방법 |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2018217006A2 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101970938B1 (ko) * | 2019-02-11 | 2019-04-19 | 진재언 | 지향각이 조절된 발광소자 패키지 및 이를 이용한 발광장치 |
CN109887906A (zh) * | 2019-02-22 | 2019-06-14 | 福建天电光电有限公司 | 一种高反射led封装支架 |
DE102021130288A1 (de) * | 2021-11-19 | 2023-05-25 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049857A (ja) * | 2004-06-29 | 2006-02-16 | Fuji Photo Film Co Ltd | 光源、および光源の作製方法、並びにカラー感熱プリンタ |
KR20060112071A (ko) * | 2005-04-26 | 2006-10-31 | 엘지전자 주식회사 | 측면 발광용 렌즈 및 그를 이용한 발광 패키지 |
JP2008153617A (ja) * | 2006-11-21 | 2008-07-03 | Nichia Chem Ind Ltd | 半導体発光装置 |
KR101652509B1 (ko) * | 2015-05-27 | 2016-08-30 | (주)애니캐스팅 | 백라이트 유닛용 엘이디 렌즈 |
KR20160115725A (ko) * | 2015-03-27 | 2016-10-06 | 서울바이오시스 주식회사 | 발광 다이오드 |
-
2018
- 2018-05-23 WO PCT/KR2018/005835 patent/WO2018217006A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049857A (ja) * | 2004-06-29 | 2006-02-16 | Fuji Photo Film Co Ltd | 光源、および光源の作製方法、並びにカラー感熱プリンタ |
KR20060112071A (ko) * | 2005-04-26 | 2006-10-31 | 엘지전자 주식회사 | 측면 발광용 렌즈 및 그를 이용한 발광 패키지 |
JP2008153617A (ja) * | 2006-11-21 | 2008-07-03 | Nichia Chem Ind Ltd | 半導体発光装置 |
KR20160115725A (ko) * | 2015-03-27 | 2016-10-06 | 서울바이오시스 주식회사 | 발광 다이오드 |
KR101652509B1 (ko) * | 2015-05-27 | 2016-08-30 | (주)애니캐스팅 | 백라이트 유닛용 엘이디 렌즈 |
Also Published As
Publication number | Publication date |
---|---|
WO2018217006A2 (ko) | 2018-11-29 |
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