WO2018209612A1

WO2018209612A1 - Contact plate, alignment system, and vapor deposition device

Info

Publication number: WO2018209612A1
Application number: PCT/CN2017/084766
Authority: WO
Inventors: 李欣
Original assignee: 深圳市柔宇科技有限公司
Priority date: 2017-05-17
Filing date: 2017-05-17
Publication date: 2018-11-22
Also published as: CN109563611A

Abstract

Disclosed in the present invention are a contact plate, an alignment system, and a vapor deposition device. The alignment system comprises a contact plate and a vapor deposition magnetic plate, for use in the alignment between a mask and a substrate. The contact plate comprises multiple spacer assemblies and sensing components disposed on a mounting plate and arranged in an array. The spacer assemblies are used for dispersing the strength generated when the vapor deposition magnetic plate presses downwards, so as to prevent deformation. The sensing components are used for detecting the force applied to each spacer assembly, and the force condition is used for analyzing the force applied to the substrate to control the vapor deposition magnetic plate to change the distribution of the magnetic field, so that the force applied to the substrate is uniform. The combination of the spacer assemblies and the sensing components enables the substrate and the mask to be accurately aligned, thereby effectively preventing the phenomenon of color mixing.

Description

Contact plate, alignment system and evaporation device

Technical field

The present invention relates to display manufacturing techniques, and more particularly to contact plates, alignment systems, and vapor deposition devices.

Background technique

In the manufacturing process of an existing organic light emitting diode (OLED) display, the organic light emitting material needs to be evaporated onto the substrate through a mask, and the mask forms an opening corresponding to the pixel array. Thus, the organic light emitting material can be The pixel array is attached to the substrate. Therefore, the alignment between the mask and the substrate is very important. If the alignment is not accurate, color mixing may occur, resulting in degradation of the display quality of the OLED display. The current vapor deposition apparatus includes an evaporation magnetic plate and a contact plate, the mask is made of a magnetic material, the contact plate and the substrate are sequentially disposed between the vapor deposition magnetic plate and the mask, and the vapor deposition magnetic plate is used for adsorbing the mask to The substrate is sandwiched between the contact plate and the mask to achieve alignment and attachment of the mask to the substrate. However, the existing contact plate design is difficult to ensure that the substrate and the mask are perfectly fitted, and the color mixing phenomenon cannot be effectively prevented.

Summary of the invention

The present invention provides a contact plate, a registration system, and an evaporation device according to the deficiencies of the prior art.

The contact plate provided by the invention is used for a aligning system of an evaporation device, and the aligning system is used for a aligning mask and a substrate and includes an evaporation magnetic plate, wherein the vapor deposition magnetic plate is used for adsorbing a mask to The mask is adsorbed on the contact plate and the substrate is sandwiched between the contact plate and the mask, the contact plate comprising:

Mounting plate

a plurality of spacer pillar assemblies disposed on the mounting plate and arranged in an array, each of the spacer pillar assemblies including a spacer pillar and an elastic member connecting the spacer pillar and the mounting panel, the spacer pillar including a connecting end of the elastic member and a pressing end surface away from the elastic member, the substrate is pressed against the pressing end surface;

a sensing component, configured to detect a force condition of each of the spacer components, wherein the force condition is used to analyze a force condition of the substrate to control the vapor deposition magnetic plate to change a magnetic field distribution to make the substrate Even by force.

In certain embodiments, the mounting plate is made of a hard plastic or a non-magnetic hard material.

In some embodiments, the mounting plate is shaped and sized to mate with the substrate.

In some embodiments, the mounting plate includes a mounting plane, the spacer post assembly being disposed on the mounting plane, the mounting plane being parallel to the abutting end surface.

In certain embodiments, the elastic member comprises a spring.

In some embodiments, the elastic member includes a first connecting end, and the mounting plate includes a second connecting end that cooperates with the first connecting end.

In some embodiments, the first connection end includes a threaded spigot, and the second connection end includes a threaded groove that mates with the arbor.

In certain embodiments, the spacer is cylindrical.

In some embodiments, the elastic member includes a third connecting end, and the spacer includes a fourth connecting end that cooperates with the third connecting end.

In certain embodiments, the third connection end includes a threaded insert shaft, and the fourth connection end includes a threaded groove that mates with the insert shaft.

In some embodiments, the sensing component includes a sensor disposed between the elastic member and the mounting plate and arranged in an array, each of the sensors for detecting a corresponding elastic force of the elastic member .

In some embodiments, the mounting plane includes grooves arranged in an array, the sensor being disposed in the groove in an in-line manner.

In certain embodiments, the sensor array includes a pressure sensor.

The alignment system provided by the present invention is used for aligning a mask and a substrate in an evaporation device, including:

Evaporating magnetic plate;

The above contact plate; and

And a control unit configured to analyze the force condition and control the vapor deposition magnetic plate to change a magnetic field distribution to uniformly stress the substrate.

In some embodiments, the vapor-deposited magnetic plate includes magnetic elements arranged in an array for changing the magnetic field distribution by varying a magnetic pole distribution and/or a magnetic field size of the magnetic element.

In some embodiments, the alignment system includes a drive device;

The control unit is configured to control the driving device to drive the vapor deposition magnetic plate to be close to the contact plate.

The vapor deposition device provided by the present invention is used for vapor deposition of a substrate, comprising:

Mask; and

The above alignment system.

In certain embodiments, the substrate is a flexible substrate.

In some embodiments, the evaporation device is configured to vaporize the organic light-emitting material to the substrate through the mask.

The contact plate provided by the present invention utilizes the array of spacer pillar assemblies to disperse the force of the vapor deposition magnetic plate to act on the substrate, prevent secondary deformation of the substrate due to pressure, and detect the interval by using the sensing component. The force of the column assembly is then analyzed, and the force of the substrate is analyzed to determine whether the distribution of the vapor deposition magnetic field is appropriate. If the evaporation magnetic field distribution is found to be uneven, the control unit is used to manipulate the vapor deposition magnetic plate. The magnetic field distribution is changed to make the substrate uniformly stressed. The contact plate can make the substrate and the mask perfectly fit by using the mutual matching of the spacer column assembly and the sensing component, thereby effectively preventing the color mixing phenomenon from occurring.

The additional aspects and advantages of the embodiments of the present invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic plan view of a vapor deposition device according to an embodiment of the present invention;

2 is a partial plan view of a contact plate according to an embodiment of the present invention;

3 is a schematic diagram of operational steps of a registration system according to an embodiment of the present invention;

4 is a schematic diagram of a force model of a substrate before or after a magnetic plate of a vapor-deposited magnetic plate according to an embodiment of the present invention;

5 is a schematic diagram of a force-receiving model of a substrate after the magnetic plate of the vapor-deposited magnetic plate or after the magnetic plate is lowered according to an embodiment of the present invention;

6 is a schematic view showing a magnetic field distribution of an evaporated magnetic plate according to an embodiment of the present invention;

7 is a schematic view showing a magnetic pole distribution of a driving device that does not drive an evaporated magnetic plate according to an embodiment of the present invention;

8 is a schematic view showing a magnetic pole distribution after driving a vapor deposition magnetic plate according to an embodiment of the present invention;

The main component symbol description:

Contact plate 10, mounting plate 12, mounting plane 122, upper surface 124, second connecting end 126, spacer post assembly 14, elastic member 142, first connecting end 1422, third connecting end 1424, spacer post 144, pressing end face 1442, fourth connecting end 1444, sensing component 16, sensor 162, alignment system 100, vapor deposition magnetic plate 20, magnetic element 202, control unit 22, driving device 24, vapor deposition device 1000, mask 200, substrate 2000 .

detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present specification, reference is made to the terms "some embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific examples", or "some examples" The description means that specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " After, "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" is based on the orientation or positional relationship shown in the drawings, only for The invention is not limited by the scope of the invention, and is not intended to be a limitation of the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Referring to FIG. 1 , the contact plate 10 of the embodiment of the present invention can be applied to the alignment system 100 of the vapor deposition apparatus 1000 . The alignment system 100 is used for the alignment mask 200 and the substrate 2000. The alignment system 100 includes an evaporated magnetic plate 20. The vapor-deposited magnetic plate 20 is used to adsorb the mask 200 to sandwich the substrate 2000 between the contact plate 10 and the mask 200.

In this manner, the vapor deposition device 1000 can vapor-deposit the substrate 2000 through the mask 200, for example, vapor-depositing the organic light-emitting material to form display pixels.

Referring to FIG. 2, the contact plate 10 includes a mounting plate 12, a plurality of spacer post assemblies 14 and a sensor component 16. The spacer assemblies 14 are disposed on the mounting plate 12 and are arranged in an array, each spacer assembly 14 including spacer posts 144 and connection spacing The post 144 and the resilient member 142 of the mounting plate 12. The spacer post 144 includes a connecting end 1444 that is coupled to the resilient member 142 and a resisting end face 1442 that is remote from the resilient member 142. The substrate 2000 is pressed against the pressing end surface 1442 so that the contact plate 10 is in contact with the substrate 2000. The sensing component 16 is configured to detect the force of each spacer component 14. The force condition is used to analyze the force of the substrate 2000 to control the vapor deposition magnetic plate 20 to change the magnetic field distribution to make the substrate 2000 uniform.

It will be appreciated that the alignment system 100 of other embodiments of the present invention may include a contact plate 10 and an evaporated magnetic plate 20.

It is to be understood that the evaporation apparatus 1000 of other embodiments of the present invention may include the alignment system 100 and the mask 200, and is used to vapor-deposit the substrate 100 to manufacture a display device such as an OLED display.

It can be understood that the contact plate 10, the alignment system 100 and the evaporation device 1000 of the embodiments of the present invention can be used to manufacture an OLED flexible display. Therefore, the substrate 2000 is generally made of a flexible material such as a PET film. Therefore, when the substrate 2000 is aligned with the mask 200, it is difficult to spread flat on the conventional contact plate, or there is a difference in the shape and position of each opening due to uneven force, which will result in the substrate 2000 and the mask. The film 200 is difficult to accurately align, so that multiple vapor deposition occurs (the red, green, and blue color pixel array substrates 2000 are required to be three times aligned with the mask 200 and three times vapor-deposited), and steaming is different. The plating material may interfere (for example, interference occurs in different color pixels), resulting in color mixing.

However, the contact plate 10, the alignment system 100, and the vapor deposition device 1000 of the embodiment of the present invention can detect the force of each spacer column assembly 14 by using the sensing member 16, and the force condition is used to analyze the force of the substrate 2000. The control of the vapor deposition magnetic plate 20 changes the magnetic field distribution to make the substrate 2000 uniform, thereby improving the flatness of the substrate 2000, thereby ensuring the accuracy of the alignment of the substrate 2000 and the mask 200, and avoiding the occurrence of color mixing.

In some embodiments, the mounting plate 12 can be made of a hard plastic or a non-magnetic hard material.

As such, the mounting plate 12 has a relatively high stiffness that provides sufficient support strength to the spacer assembly 14.

In some embodiments, the mounting plate 12 can be shaped and sized to mate with the substrate 2000.

It can be understood that the shape of the substrate 2000 is generally rectangular, and the shape and size of the mounting board 12 can be in one-to-one correspondence with the substrate 2000.

This can improve space utilization.

In certain embodiments, the mounting plate 12 can include a mounting plane 122. The mounting plane 122 is parallel to the abutting end face 1442. The spacer assembly 14 is disposed on the mounting plane 122.

Since the mounting plane 122 already has a high degree of flatness mounted on the mounting plane 122, the end of the spacer assembly 14 away from the mounting board 12 can also form a flatter flat surface, thereby improving the flatness of the substrate 2000.

In certain embodiments, the resilient member 142 includes a spring.

It can be understood that the spring acts as a buffer during the evaporation process. The spiral springs are small in size and suitable for arrays.

It can be understood that the material of the elastic member 142 may not be limited to the above embodiment, but in other embodiments may be The use of suitable elastic materials.

In some embodiments, the resilient member 142 includes a first connecting end 1422, and the mounting plate 12 includes a second connecting end 126 that mates with the first connecting end 1422.

It can be understood that the cooperation of the first connecting end 1422 and the second connecting end 126 realizes the connection of the elastic member 142 and the mounting plate 12.

In certain embodiments, the first connection end 1422 includes a threaded spigot and the second connection end 126 includes a threaded slot that mates with the plunging shaft.

It can be understood that the elastic member 142 and the mounting plate 12 can be better fixed by rotating the insertion shaft of the elastic member 142 into the thread groove of the mounting plate in the thread direction.

It can be understood that the connection of the elastic member 142 and the mounting plate 12 may not be limited to the above embodiment, but in other embodiments, a suitable fixing manner such as an adhesive connection may be adopted according to requirements. That is, the elastic member 142 may include a first joint surface parallel to the pressing end surface, and the mounting plate 12 includes a mounting surface that cooperates with the first joint surface. The first connecting surface and the mounting surface are glued together to achieve the connection of the elastic member 142 and the mounting plate 12.

In certain embodiments, the spacer posts 144 are cylindrical.

It will be appreciated that the spacer posts 144 are formed in a cylindrical shape to reduce the volume.

It can be understood that the shape of the spacer 144 is not limited to a cylindrical shape, and in other embodiments, the prism shape can be made according to production needs.

In some embodiments, the spacer posts 144 can be made of plastic.

As such, the spacer posts 144 have sufficient mechanical strength to support the substrate 2000.

In some embodiments, the resilient member 142 includes a third connecting end 1424 that includes a fourth connecting end 1444 that mates with the third connecting end 1424.

It can be understood that the interaction of the third connecting end 1424 and the fourth connecting end 1444 realizes the connection of the elastic member 142 and the spacer post 144.

In certain embodiments, the third connection end 1424 includes a threaded spigot, and the fourth connection end 1444 includes a threaded slot that mates with the plunging shaft.

It can be understood that the insertion of the shaft of the elastic member 142 into the thread groove of the spacer post 144 in the thread direction can better fix the elastic member 142 and the spacer post 144.

It can be understood that the connection of the elastic member 142 and the spacer post 144 may not be limited to the above embodiment, but in other embodiments, a suitable fixing manner such as an adhesive connection may be adopted according to requirements. That is, the elastic member 142 may include a third connecting face parallel to the pressing end face, and the spacer post 144 includes a fourth connecting face that cooperates with the third connecting face. The third connecting surface and the fourth connecting surface are bonded by glue to realize the connection of the elastic member 142 and the spacer post 144.

It can be understood that, in the process of producing the contact plate 10, the elastic member 142 can be first connected with the spacer post 144 to form The spacer assemblies 14 are then mounted in an array on the mounting plate 12.

It can be understood that, in the process of producing the contact plate 10, the mounting order of the elastic member 142, the spacer post 144, and the mounting plate 12 may not be limited to the above embodiment, and the mounting sequence may be changed according to production needs.

In some embodiments, the sensing component 16 includes sensors 162 disposed in an array disposed between the resilient member 142 and the mounting plate 12, each sensor 162 for detecting the spring force of the corresponding resilient member 142.

It can be understood that the sensors 142 correspond to the spacer assemblies 14 one by one, that is, each sensor 162 and one spacer assembly 14 are in contact with each other. When the elastic member 142 is deformed, the corresponding sensor 162 can detect the corresponding elastic member 142. Elasticity.

Thus, when the elastic member 142 is deformed, the sensor 162 measures the elastic force of the corresponding elastic member 142, thereby obtaining the force of the array of the spacer members 14.

In some embodiments, the mounting plane 122 includes grooves arranged in an array with the sensor 162 disposed within the recess in an in-line manner.

It can be understood that the mounting plate 12 can include an upper surface 124 away from the abutting end surface 1442 and a mounting plane 122 adjacent to the pressing end surface 1442. The grooves are arranged in an array on the mounting plane 122, and the sensor 162 is embedded in the recess. The fixing of the sensor 162 is achieved.

It can be understood that the groove may communicate with the upper surface 124 and the mounting plane 122, or may not communicate with the upper surface 124 and the mounting plane 122.

It will be appreciated that by locating the sensor 162 inside the mounting plate 12, the thickness of the contact plate 10 can be reduced.

It can be understood that the manner in which the sensor 162 is disposed on the mounting board 12 is not limited to the above embodiment.

In certain embodiments, sensor 162 includes a pressure sensor.

It can be understood that the pressure sensor converts the elastic force of the elastic member 142 into an electrical signal and transmits it to the external control unit 22.

Referring to FIG. 1 , in some embodiments, the alignment system 100 provided by the present invention can include an evaporation magnetic plate 20 , a contact plate 10 , and a control unit 22 .

In the vapor deposition device 1000, the alignment system 100 is used for the alignment mask 200 and the substrate 2000.

The alignment principle of the alignment system 100 is that the sensing component 16 detects the magnetic force of the vapor deposition magnetic plate 20 or the force of the spacer column assembly 14 before and after the evaporation of the magnetic plate 20, and the control unit 22 receives the force of the spacer assembly 14. The situation is analyzed and the force of the substrate 2000 is analyzed, and the vapor-deposited magnetic plate 20 is controlled to change the magnetic field distribution so that the substrate 2000 is evenly stressed, so that the mask 200 and the substrate 2000 are aligned accurately.

It can be understood that during the operation, it involves the establishment of a force model of the substrate 2000. Control unit 22 includes a computer, or other processing device. The control unit 22 can receive the force of the spacer component 14 detected by the sensing component 16, and analyze the force of the substrate 2000 to establish a mathematical model through the data processing software. Data software can include Matlab, Origion, Maple.

In addition, the control unit 22 can also convert the force model of the substrate 2000 into a corresponding magnetic field distribution. The magnetic field distribution referred to herein is represented by a magnetic field value which is measured in accordance with the average force value of the substrate 2000. That is to say, the value of the magnetic field corresponding to the substrate 2000 having a large average force value is large, and the value of the magnetic field corresponding to the substrate 2000 having a small average force value is small.

Specifically, please refer to FIG. 3 , which is an operational procedure of the alignment system 100 .

First, step S101 is performed, the vapor-deposited magnetic plate 20 is not energized, the substrate 2000 is in contact with the contact plate 10, the sensing component 16 detects the force of the array of spacer posts 14, and the control unit 22 receives the force of the spacer assembly 14. The force of the substrate 2000 is analyzed, and then a force model diagram of the substrate 2000 when the vapor-deposited magnetic plate 20 is not energized is established.

Then, steps S103 and S104 are performed to energize the vapor-deposited magnetic plate 20, the vapor-deposited magnetic plate 20 is magnetically connected, the mask 200 is adsorbed, the substrate 2000 is sandwiched between the contact plate 10 and the mask 200, and the sensor member detects the spacer again. When the force of the array 12 of the assembly 14 is received, the control unit 22 receives the force of the spacer assembly 14 again and analyzes the force of the substrate 2000, thereby establishing a force model diagram of the substrate 2000 after the vapor deposition magnetic plate 20 is energized.

Proceeding to step S105, the control unit 22 converts the force model of the substrate 2000 into a corresponding magnetic field value. The force model of the plurality of substrates 2000 is collected, and the magnetic field distribution of the vapor-deposited magnetic plates 20 corresponding to the plurality of substrates 2000 is obtained.

Finally, steps S106 and S107 are performed, and the control unit 22 compares the magnetic field distribution to find the optimal magnetic field distribution, and controls the driving device 24 to drive the vapor-deposited magnetic plate 20, thereby changing the magnetic field distribution and making the substrate 2000 evenly stressed.

Referring to FIG. 4 and FIG. 5 , the force diagram of the substrate 2000 according to the embodiment of the present invention is a three-dimensional diagram, and the plane where the X-axis and the Y-axis are located is parallel to the plane where the substrate 2000 is located, and is used to indicate the position of the substrate 2000, the Z-axis. Indicates the magnitude of the force applied to the substrate 2000, and the force value increases in the direction indicated by the arrow.

Referring to FIG. 4, when the vapor deposition magnetic plate 20 is not energized, the substrate 2000 hangs down at the center due to its own gravity, so that the entire substrate 2000 is unevenly stressed. It can be seen that the force value at the center is relatively small, and the value of the edge force is large.

Referring to FIG. 5, after the vapor deposition magnetic plate 20 is energized, the substrate 2000 is forced to change. It can be seen that the force value at the center becomes smaller, the edge force value becomes larger, and the force distribution of the whole substrate 2000 is more uniform with respect to the force distribution of the substrate 2000 when the vapor deposition magnetic plate 20 is not energized, because the contact plate 10 The force of the vapor-deposited magnetic plate 20 acting on the substrate 2000 is uniformly dispersed.

In some embodiments, the evaporated magnetic plate 20 includes magnetic elements 202 arranged in an array. The control unit 22 changes the magnetic field distribution of the vapor-deposited magnetic plate 20 by changing the magnetic pole distribution and/or the magnetic field size of the magnetic element 202.

It will be appreciated that the magnetic element 202 can be made of an electromagnet. The magnetic pole distribution and/or the magnitude of the magnetic field of the electromagnet are related to the current passing through the inside of the electromagnet, and the control unit 22 can change the magnitude of the current passing through the electromagnet by changing the magnitude of the voltage applied across the electromagnet, thereby changing the magnetic pole distribution and/or The size of the magnetic field.

It will be appreciated that the magnetic element 202 can also be made from a common magnet having a high magnetic force. The control unit 22 can perform a corresponding alignment adjustment action by the control command to change the magnetic pole distribution and magnetic force of the magnetic component 202 made of the common magnet. Field size.

Referring to FIG. 6, the magnetic elements 202 are arranged in an array, and are arranged in a one-to-one correspondence with the substrate 2000. Assuming that a vapor-deposited magnetic plate 20 can evaporate 25 substrates 2000, it can be seen that the value of the magnetic field on the right side is significantly larger than the value of the magnetic field on the left side, indicating that the substrate 2000 on the right side is too strong, and the corresponding substrate on the right side needs to be reduced. Magnetic field strength. At this time, the control unit 22 calculates the average magnetic field value of the entire vapor-deposited magnetic plate 20, and calculates the magnitude of the current required to generate the average magnetic field value or the number and orientation of the magnet, by changing the magnitude of the voltage applied to the electromagnet or performing The alignment adjustment action is performed to change the magnetic pole distribution and/or the magnetic field size of the magnetic element 202 so that the magnetic field distribution on both the left and right sides is uniform.

In some embodiments, the alignment system 100 includes an evaporated magnetic plate 20, a contact plate 10, and a control unit 22, and also drives the device 24. The control unit 22 drives the vapor-deposited magnetic plate 20 by controlling the driving device 24 to move the adsorption mask 200 up.

It will be appreciated that the drive unit 24 includes an interface that is electrically coupled to the control unit 22 and the vapor-deposited magnetic plate 20, respectively. The control unit 22 transmits an instruction to be executed to the drive unit 24 via the interface, and the drive unit 24 executes an instruction to drive the vapor deposition magnetic plate 20 to change the magnetic pole distribution and/or the magnetic field size.

It will be appreciated that the instructions executed by the drive unit 24 include varying the amount of voltage applied to the vapor-deposited magnetic plate 20.

Specifically, referring to FIG. 7, the magnetic pole distribution of the vapor deposition magnetic plate 20 is divided into four regions, namely, an A1 electromagnetic region, an A2 electromagnetic region, an A3 electromagnetic region, an A4 electromagnetic region, and an A5 electromagnetic region. When the driving device 24 does not drive the vapor-deposited magnetic plate 20 to change the magnetic field distribution, it can be seen that the magnetic pole distribution of the vapor-deposited magnetic plate 20 is as shown in FIG. After the driving device 24 drives the vapor-deposited magnetic plate 20 to change the magnetic field distribution, it can be seen that the magnetic pole distribution of the vapor-deposited magnetic plate 20 is changed from FIG. 7 to FIG. 8, that is, the magnetic pole of the A5 electromagnetic region is changed.

In this way, the magnetic field distribution of the entire vapor-deposited magnetic plate 20 is uniform, so that the substrate 2000 on the right side is less stressed and the deformation is reduced, so that it is more closely fitted to the mask 200.

Referring to FIG. 1 , the vapor deposition apparatus 1000 provided by the present invention includes a mask 200 and a alignment system 100 for vapor deposition of the substrate 2000 .

In the vapor deposition apparatus 1000, the mask 200 is disposed in parallel with the substrate 2000, and the mask 200 is formed with openings corresponding to the color pixel array so that the organic light-emitting material is vapor-deposited through the mask 200 onto the substrate 2000. In addition, the alignment system 100 is disposed in parallel with the substrate 2000 to ensure that the mask 200 and the substrate 2000 are aligned accurately. Since the vapor deposition device 1000 provided by the present invention includes the alignment system 100 of the above embodiment, the vapor deposition device 1000 provided by the present invention provides at least all the advantageous effects of the above embodiments.

In some embodiments, the substrate 2000 can be a flexible substrate.

The material of the flexible substrate includes a PET film and a metal foil. OLEDs are thin and vapor-deposited onto flexible substrates to make OLED displays more durable and lighter.

It can be understood that the substrate 2000 can be not limited to a flexible substrate, but in other embodiments, it can also be a rigid substrate, such as a glass substrate.

In these embodiments, the contact plate 10, the alignment system 100, and the vapor deposition device 1000 can also force the substrate 2000 to be uniform, thereby reducing the stress on the substrate 2000.

In some embodiments, the evaporation device is configured to vaporize the organic light-emitting material to the substrate 2000 through the mask 200.

It can be understood that the mask 200 is formed with an opening corresponding to the color pixel array. That is to say, at the opening, the organic light-emitting material may be evaporated onto the substrate 2000, and at the unopened, no organic light-emitting material is evaporated onto the substrate 2000.

It can be understood that the vapor deposition device 1000 is not limited to vapor deposition of the organic light-emitting material, and in other embodiments, the substrate 2000 may be vapor-deposited with other materials.

That is to say, the vapor deposition device 1000 is not limited to use in manufacturing an OLED display.

Although the embodiments of the present invention have been shown and described, it is understood that the above-described embodiments are illustrative and are not to be construed as limiting the scope of the invention. The scope of the invention is defined by the claims and their equivalents.

Claims

A contact plate for an alignment system of an evaporation device, the alignment system being used for a alignment mask and a substrate and comprising an evaporation magnetic plate, the vapor deposition magnetic plate being used for adsorbing a mask to The substrate is sandwiched between the contact plate and the mask, wherein the contact plate comprises:

Mounting plate

a plurality of spacer pillar assemblies disposed on the mounting plate and arranged in an array, each of the spacer pillar assemblies including a spacer pillar and an elastic member connecting the spacer pillar and the mounting panel, the spacer pillar including a connecting end of the elastic member connecting and an abutting end surface away from the elastic member, wherein the substrate is pressed against the pressing end surface; and

a sensing component, configured to detect a force condition of each of the spacer components, wherein the force condition is used to analyze a force condition of the substrate to control the vapor deposition magnetic plate to change a magnetic field distribution to make the substrate Even by force.
The contact plate according to claim 1, wherein the mounting plate is made of a hard plastic or a non-magnetic hard material.
The contact plate of claim 1 wherein said mounting plate is shaped and sized to mate with said substrate.
The contact plate of claim 1 wherein said mounting plate includes a mounting plane, said spacer assembly being disposed on said mounting plane, said mounting plane being parallel to said abutting end surface.
The contact plate of claim 1 wherein said resilient member comprises a spring.
The contact plate according to claim 1, wherein said elastic member comprises a first connecting end, and said mounting plate includes a second connecting end that cooperates with said first connecting end.
The contact plate of claim 6 wherein said first attachment end includes a threaded insert shaft and said second attachment end includes a threaded groove that mates with said insert shaft.
The contact plate of claim 1 wherein said spacer is cylindrical.
The contact plate according to claim 1, wherein said elastic member comprises a third connecting end, said spacing The post includes a fourth connection end that mates with the third connection end.
The contact plate of claim 9 wherein said third attachment end includes a threaded insert shaft and said fourth attachment end includes a threaded groove that mates with said insert shaft.
The contact plate according to claim 1, wherein said sensing member comprises a sensor disposed between said elastic member and said mounting plate and arranged in an array, each of said sensors for detecting a corresponding The elastic force of the elastic member.
The sensing component of claim 11 wherein said mounting plane includes grooves arranged in an array, said sensor being disposed in said recess in an inlaid manner.
The sensing component of claim 11 wherein said sensor comprises a pressure sensor.
A aligning system for aligning a mask and a substrate in an evaporation device, wherein the alignment system comprises:

Evaporating magnetic plate;

a contact plate according to any of claims 1-13; and

And a control unit configured to analyze the force condition and control the vapor deposition magnetic plate to change a magnetic field distribution to uniformly stress the substrate.
The alignment system according to claim 14, wherein said vapor-deposited magnetic plate comprises magnetic elements arranged in an array, said control unit for changing a magnetic pole distribution and/or a magnetic field size of said magnetic element To change the magnetic field distribution.
The alignment system of claim 14 wherein said alignment system comprises a drive device;

The control unit is configured to control the driving device to drive the vapor deposition magnetic plate to adsorb the mask up.
An evaporation device for vapor depositing a substrate, wherein the vapor deposition device comprises:

Mask; and

The alignment system of claim 14.
The alignment system of claim 17 wherein said substrate is a flexible substrate.
The alignment system according to claim 17, wherein said vapor deposition means is for vapor-depositing said organic light-emitting material to said substrate through said mask.