WO2018206596A1 - Élément structural pourvu d'une protection cem et destiné à une platine électronique - Google Patents

Élément structural pourvu d'une protection cem et destiné à une platine électronique Download PDF

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Publication number
WO2018206596A1
WO2018206596A1 PCT/EP2018/061906 EP2018061906W WO2018206596A1 WO 2018206596 A1 WO2018206596 A1 WO 2018206596A1 EP 2018061906 W EP2018061906 W EP 2018061906W WO 2018206596 A1 WO2018206596 A1 WO 2018206596A1
Authority
WO
WIPO (PCT)
Prior art keywords
plastic layer
board
components
grid
module
Prior art date
Application number
PCT/EP2018/061906
Other languages
German (de)
English (en)
Inventor
Daniel Schleicher
Christoph Sigmund
Christian Achathaler
Martin RESCHER
Dennis Christian Knospe
Original Assignee
Magna Powertrain Bad Homburg GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magna Powertrain Bad Homburg GmbH filed Critical Magna Powertrain Bad Homburg GmbH
Publication of WO2018206596A1 publication Critical patent/WO2018206596A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the invention relates to a component at least consisting of electronic and / or electrical components which are mounted on or connected to one or more circuit boards, wherein the components are encapsulated with the circuit board having a first and a second plastic layer, and wherein at least one shield against electromagnetic Radiation is present.
  • the invention relates to a method for producing such a component.
  • US20090091907A1 shows metallic layers which surround a unit or even groups of components. These layers are made by coating or printing on a first plastic layer. However, the coating of plastic with metal is not without problems.
  • DE 10 2016 208 782 A1 and DE 10 2016 208 783 A1 disclose a method for the production of electrical units by encapsulation with two different plastic materials, wherein a shielding plate is encapsulated as a stamped material with the electrical components.
  • WO 2010/013 841 A1 shows a plug in which electrical components are protected by a shield and installed in a plastic housing.
  • the object is achieved with a component at least consisting of electronic and / or electrical components, which are mounted on one or more boards or connected thereto, wherein the components are molded with the board having a first and a second plastic layer, and wherein at least a shield against electromagnetic radiation is present, wherein the shield is at least one stamped grid, which is embedded between the first plastic layer and the second plastic layer.
  • the stamped grid has at least one device for mechanical fixation and stabilization of the components.
  • the punched grid not only serves the electromagnetic shielding, but also to stabilize the components on the board.
  • the stamped grid has at least one contact strip to the board, so as to establish the connection to the ground of the board.
  • the stamped grid can also be constructed in several parts.
  • the stamped grid has at least one area for thermal contacting of components.
  • waste heat is dissipated from the board, without the first plastic layer must have special thermal properties.
  • a wider range of plastics for the production of the first plastic layer can be used.
  • the stamped grid covers at least the largest part of the surface of the board. It does not have to cover the entire surface of the board, but only the surface that covers the particular shielded components.
  • the method according to the invention comprises the following steps:
  • FIGS. 1 and 2 show a schematic representation of a first exemplary embodiment.
  • FIG. 2 shows a longitudinal section
  • FIG. 2a shows a plan view
  • FIG. 2b shows a cross section
  • Fig. 1 and 2 show an embodiment of a component in which the electronics used 4, that is, all the electrical and electronic components, is overmolded on the board 3 with two plastic layers. About a connector 1, the board is electrically connected.
  • the ground connection of the board can be created anywhere.
  • the grounding connection 2 can be a through-contacting by means of pressfit.
  • the punched grid can also be clamped or soldered. Important is sufficient electrical contact and mechanical fixation.
  • the first plastic layer 1 1 protects the components and the board 3 and should provide the best possible thermal connection, so as to be able to derive the resulting waste heat supportive.
  • the second plastic layer 12 consists for example of a cheaper plastic, which offers a defined strength and media tightness and can already be used as a housing of the entire component.
  • the second plastic layer is made of the same material as the first plastic layer.
  • Figures 1 and 2 show an embodiment in which the shield is brought about by a metallic material in the form of a punched grid.
  • a punching Grid is a predominantly flat structure made of a sheet metal produced by punching.
  • the lead frame 8 is connected via a ground 2 with the board 3 simply or repeatedly.
  • the punched grid 8 has a shape that is optimized for the respective board. To protect the board can also be mounted several punched grid, for example, above and below the board.
  • the lead frame 8 has an electrical connection to the board in the form of a contact 23 which is stamped free of the material of the stamped grid and bent in the direction of the board.
  • a contact strip 23 may be soldered.
  • the punched grid 8 has areas 9 for the thermal contacting of components 4 with high dissipative waste heat in order to achieve a distribution of the waste heat via the thermal conductivity of the metal.
  • the regions 9 can be produced by stamping and / or bending and / or deep drawing of the stamped grid. There are all shaping methods possible, which are familiar to the expert.
  • the stamped grid has devices 10 for mechanical fixation and stabilization of components, so that the first encapsulation process can take place more securely. Especially capacitors and chokes should be stably supported during encapsulation.
  • the stamped grid also has contact areas 22 in which punches of an injection mold can engage to hold the stamped grid during the first Umspritzungsvorgangs with the first plastic layer.
  • the encapsulation of the board 3 with the punched grid 8 as a module 24 is carried out with little pressure with a thin material as possible, which can optimally flow through and fill the different cavities between the board and punched grid.
  • the first plastic layer thus produced is overmolded with the second plastic layer, so that the stamped grid is securely integrated between the layers.
  • the design of the stamped grid arise areas 5, in which the first plastic layer is directly connected to the second plastic layer. In these areas there is no punched grid between the two plastic layers.
  • the punched grid can be perforated more or less. Small holes affect the EMC protection behavior only slightly
  • the production process according to the invention takes place in several steps.
  • the first step involves mounting the board with all components 4 on and with the stamped grid.
  • the devices 10 for the mechanical fixation of components are connected to the components 4 to form a module 24.
  • This module is inserted into a first injection-molded tool where it is held by dies, and in a second production step, the circuit board 3 is over-molded with the electronics 4 and the punched grid 8 with a first plastic material.
  • the punches are slowly withdrawn in the injection mold and the cavities are filled by the inflowing plastic material.
  • the board could be kept at the plug 1 and the lead frames 8. The use of stamps would not be necessary, which is a cheaper solution.
  • the stamp of the plastic injection tool prevents the prefabricated module from shifting.
  • the punches are in abutment areas 22 of the module so both on the board and on the lead frame.
  • the injection-molded inputs must be placed so that the plastic material quickly reaches and fills the cavities and forms no trapped air bubbles.
  • the shielding 13, the stamped grid 8 is encapsulated by a second plastic layer.
  • stamped grid is designed to minimize the obstruction process, i.
  • the deep-drawn areas 9 in which the circuit board or a component is contacted offer only a small end face in the injection direction, which affects the injection behavior only slightly.
  • the board can be held in the tool via the punched grid. This has the advantage that the board is molded around cleanly. Without punched grid, the board must be held in the tool by means of holding pins, which are pulled out during the overmolding process, which makes the tool more expensive and more expensive. If the outer side of the stamped grid remains free during the first injection, this is no problem.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un élément structural comprenant des composants électroniques et/ou électriques, qui sont montés sur une ou plusieurs platines ou sont reliés à elle(s), les composants et la platine étant enrobés par injection d'une première et d'une deuxième couche plastique, et au moins un blindage contre le rayonnement électromagnétique étant présent, le blindage étant constitué d'une grille estampée qui est ingérée entre la première couche de plastique et la deuxième couche de plastique.
PCT/EP2018/061906 2017-05-12 2018-05-08 Élément structural pourvu d'une protection cem et destiné à une platine électronique WO2018206596A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017208076.0 2017-05-12
DE102017208076.0A DE102017208076A1 (de) 2017-05-12 2017-05-12 Bauteil mit EMV Schutz für elektronische Platine

Publications (1)

Publication Number Publication Date
WO2018206596A1 true WO2018206596A1 (fr) 2018-11-15

Family

ID=62148373

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2018/061906 WO2018206596A1 (fr) 2017-05-12 2018-05-08 Élément structural pourvu d'une protection cem et destiné à une platine électronique

Country Status (2)

Country Link
DE (1) DE102017208076A1 (fr)
WO (1) WO2018206596A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
DE69202405T2 (de) * 1991-09-19 1996-01-18 Nokia Mobile Phones Ltd Eine Leiterplattenanordnung.
US20080158825A1 (en) * 2006-12-29 2008-07-03 Nokia Corporation Electronic device and method of assembling an electronic device
US20090091907A1 (en) 2007-10-09 2009-04-09 Huang Chung-Er Shielding structure for electronic components
WO2010013841A1 (fr) 2008-07-30 2010-02-04 Yazaki Corporation Connecteur optique et procédé de fabrication correspondant
US20170075396A1 (en) * 2015-09-16 2017-03-16 Nvidia Corporation Thermal shield can for improved thermal performance of mobile devices
DE102016208783A1 (de) 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
DE102016208782A1 (de) 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166772A (en) * 1991-02-22 1992-11-24 Motorola, Inc. Transfer molded semiconductor device package with integral shield
DE69202405T2 (de) * 1991-09-19 1996-01-18 Nokia Mobile Phones Ltd Eine Leiterplattenanordnung.
US20080158825A1 (en) * 2006-12-29 2008-07-03 Nokia Corporation Electronic device and method of assembling an electronic device
US20090091907A1 (en) 2007-10-09 2009-04-09 Huang Chung-Er Shielding structure for electronic components
WO2010013841A1 (fr) 2008-07-30 2010-02-04 Yazaki Corporation Connecteur optique et procédé de fabrication correspondant
US20170075396A1 (en) * 2015-09-16 2017-03-16 Nvidia Corporation Thermal shield can for improved thermal performance of mobile devices
DE102016208783A1 (de) 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
DE102016208782A1 (de) 2016-05-20 2017-11-23 Continental Teves Ag & Co. Ohg Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement

Also Published As

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DE102017208076A1 (de) 2018-11-15

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