WO2018205172A1 - Radio frequency circuit switch chip, radio frequency circuit, antenna device, and electronic device - Google Patents

Radio frequency circuit switch chip, radio frequency circuit, antenna device, and electronic device Download PDF

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Publication number
WO2018205172A1
WO2018205172A1 PCT/CN2017/083839 CN2017083839W WO2018205172A1 WO 2018205172 A1 WO2018205172 A1 WO 2018205172A1 CN 2017083839 W CN2017083839 W CN 2017083839W WO 2018205172 A1 WO2018205172 A1 WO 2018205172A1
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Prior art keywords
switch
input
combiner
port
radio frequency
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PCT/CN2017/083839
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French (fr)
Chinese (zh)
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丛明
冯斌
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广东欧珀移动通信有限公司
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Priority to PCT/CN2017/083839 priority Critical patent/WO2018205172A1/en
Publication of WO2018205172A1 publication Critical patent/WO2018205172A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits

Abstract

A radio frequency circuit switch chip. By means of a first switch, a second switch, and a third switch having different states of connection to a first combiner and a second combiner, the present invention achieves carrier aggregation of high-frequency signals and medium-frequency signals, carrier aggregation of high-frequency signals and low-frequency signals, carrier aggregation of medium-frequency signals and low-frequency signals, or carrier aggregation of high-frequency signals, medium-frequency signals, and low-frequency signals. A radio frequency circuit, an antenna device, and an electronic device are also provided.

Description

射频电路开关芯片、射频电路、天线装置及电子设备 RF circuit switch chip, RF circuit, antenna device and electronic device 技术领域Technical field
本发明涉及通信技术领域,特别涉及一种射频电路开关芯片、射频电路、天线装置及电子设备。The present invention relates to the field of communications technologies, and in particular, to a radio frequency circuit switch chip, a radio frequency circuit, an antenna device, and an electronic device.
背景技术Background technique
随着通信技术的发展,移动终端能够支持的通信频段越来越多。例如,LTE(Long Term Evolution,长期演进)通信信号可以包括频率在700MHz至2700MHz之间的信号。With the development of communication technologies, more and more communication bands can be supported by mobile terminals. For example, LTE (Long Term The Evolution, Long Term Evolution communication signal may include signals having a frequency between 700 MHz and 2700 MHz.
移动终端能够支持的射频信号可以分为低频信号、中频信号和高频信号。其中,低频信号、中频信号以及高频信号各自又包括多个子频段信号。每个子频段信号都需要通过天线发射到外界。The radio frequency signals that the mobile terminal can support can be divided into a low frequency signal, an intermediate frequency signal, and a high frequency signal. The low frequency signal, the intermediate frequency signal, and the high frequency signal each include a plurality of sub-band signals. Each sub-band signal needs to be transmitted to the outside through the antenna.
由此,产生了载波聚合(Carrier Aggregation,简称CA)技术。通过载波聚合,可以将多个子频段信号聚合在一起,以提高网络上下行传输速率。Thus, carrier aggregation (carrier) Aggregation, referred to as CA) technology. Through carrier aggregation, multiple sub-band signals can be aggregated together to improve the uplink and downlink transmission rates of the network.
目前,全球各个通信市场的频率资源互不相同。不同区域的通信运营商拥有不同的通信频谱分配,因此也就存在不同的载波聚合的频段组合需求。然而,当前的载波聚合能够进行聚合的频段单一,缺乏多样性,无法满足上述需求。At present, the frequency resources of various communication markets around the world are different. Communication operators in different regions have different communication spectrum allocations, so there are different carrier aggregation band combinations. However, the current carrier aggregation is capable of a single frequency band of aggregation, lacking diversity, and cannot meet the above requirements.
技术问题technical problem
本发明实施例提供一种射频电路开关芯片、射频电路、天线装置及电子设备,可以提高电子设备对射频信号进行载波聚合的多样性。The embodiment of the invention provides a radio frequency circuit switch chip, a radio frequency circuit, an antenna device and an electronic device, which can improve the diversity of carrier aggregation of the radio frequency signal by the electronic device.
技术解决方案Technical solution
第一方面,本发明实施例提供一种射频电路开关芯片,包括第一开关、第二开关、第三开关、第一合路器以及第二合路器,第一开关、第二开关、第三开关可分别输出高频信号、中频信号、低频信号;其中In a first aspect, an embodiment of the present invention provides a radio frequency circuit switch chip, including a first switch, a second switch, a third switch, a first combiner, and a second combiner, a first switch, a second switch, and a first switch The three switches can respectively output a high frequency signal, an intermediate frequency signal, and a low frequency signal;
第一开关、第二开关可选择性接通第一合路器,以实现高频信号与中频信号载波聚合;The first switch and the second switch can selectively turn on the first combiner to implement carrier aggregation of the high frequency signal and the intermediate frequency signal;
第一开关、第三开关可选择性接通第二合路器,以实现高频信号与低频信号载波聚合;The first switch and the third switch can selectively turn on the second combiner to implement carrier aggregation of the high frequency signal and the low frequency signal;
第二开关、第三开关可选择性接通第二合路器,以实现中频信号与低频信号载波聚合;The second switch and the third switch can selectively turn on the second combiner to implement carrier aggregation of the intermediate frequency signal and the low frequency signal;
第一开关、第二开关可选择性接通第一合路器,并且第三开关、该第一合路器可选择性接通第二合路器,以实现高频信号、中频信号、低频信号载波聚合。The first switch and the second switch can selectively turn on the first combiner, and the third switch, the first combiner can selectively turn on the second combiner to implement a high frequency signal, an intermediate frequency signal, and a low frequency Signal carrier aggregation.
第二方面,本发明实施例提供一种射频电路,包括射频收发器、射频电路开关芯片以及天线,该射频收发器、射频电路开关芯片以及天线依次连接;In a second aspect, an embodiment of the present invention provides a radio frequency circuit, including a radio frequency transceiver, a radio frequency circuit switch chip, and an antenna, where the radio frequency transceiver, the radio frequency circuit switch chip, and the antenna are sequentially connected;
该射频电路开关芯片包括第一开关、第二开关、第三开关、第一合路器以及第二合路器,第一开关、第二开关、第三开关可分别输出高频信号、中频信号、低频信号;其中The RF circuit switch chip includes a first switch, a second switch, a third switch, a first combiner and a second combiner, and the first switch, the second switch, and the third switch respectively output a high frequency signal and an intermediate frequency signal Low frequency signal;
第一开关、第二开关可选择性接通第一合路器,以实现高频信号与中频信号载波聚合;The first switch and the second switch can selectively turn on the first combiner to implement carrier aggregation of the high frequency signal and the intermediate frequency signal;
第一开关、第三开关可选择性接通第二合路器,以实现高频信号与低频信号载波聚合;The first switch and the third switch can selectively turn on the second combiner to implement carrier aggregation of the high frequency signal and the low frequency signal;
第二开关、第三开关可选择性接通第二合路器,以实现中频信号与低频信号载波聚合;The second switch and the third switch can selectively turn on the second combiner to implement carrier aggregation of the intermediate frequency signal and the low frequency signal;
第一开关、第二开关可选择性接通第一合路器,并且第三开关、该第一合路器可选择性接通第二合路器,以实现高频信号、中频信号、低频信号载波聚合。The first switch and the second switch can selectively turn on the first combiner, and the third switch, the first combiner can selectively turn on the second combiner to implement a high frequency signal, an intermediate frequency signal, and a low frequency Signal carrier aggregation.
第三方面,本发明实施例提供一种天线装置,包括上述射频电路。In a third aspect, an embodiment of the present invention provides an antenna apparatus, including the foregoing radio frequency circuit.
第四方面,本发明实施例提供一种电子设备,包括壳体和电路板,该电路板安装在该壳体内部,该电路板上设置有射频电路,该射频电路为上述射频电路。In a fourth aspect, an embodiment of the present invention provides an electronic device including a housing and a circuit board. The circuit board is mounted inside the housing. The circuit board is provided with a radio frequency circuit, and the radio frequency circuit is the radio frequency circuit.
有益效果 Beneficial effect
本发明实施例提供一种射频电路开关芯片、射频电路、天线装置及电子设备,可以提高电子设备对射频信号进行载波聚合的多样性。The embodiment of the invention provides a radio frequency circuit switch chip, a radio frequency circuit, an antenna device and an electronic device, which can improve the diversity of carrier aggregation of the radio frequency signal by the electronic device.
附图说明DRAWINGS
图1是本发明实施例提供的电子设备的分解示意图。FIG. 1 is an exploded perspective view of an electronic device according to an embodiment of the present invention.
图2是本发明实施例提供的电子设备的结构示意图。FIG. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
图3是本发明实施例提供的射频电路的第一种结构示意图。FIG. 3 is a schematic diagram of a first structure of a radio frequency circuit according to an embodiment of the present invention.
图4是本发明实施例提供的射频电路的第二种结构示意图。FIG. 4 is a schematic diagram of a second structure of a radio frequency circuit according to an embodiment of the present invention.
图5是本发明实施例提供的射频电路的第三种结构示意图。FIG. 5 is a third schematic structural diagram of a radio frequency circuit according to an embodiment of the present invention.
图6是本发明实施例提供的射频电路的第四种结构示意图。FIG. 6 is a schematic diagram of a fourth structure of a radio frequency circuit according to an embodiment of the present invention.
图7是本发明实施例提供的射频电路开关芯片的第一种结构示意图。FIG. 7 is a first schematic structural diagram of a radio frequency circuit switch chip according to an embodiment of the present invention.
图8是本发明实施例提供的射频电路开关芯片的第二种结构示意图。FIG. 8 is a schematic diagram of a second structure of a radio frequency circuit switch chip according to an embodiment of the present invention.
图9是本发明实施例提供的射频电路开关芯片的第三种结构示意图。FIG. 9 is a third schematic structural diagram of a radio frequency circuit switch chip according to an embodiment of the present invention.
图10是本发明实施例提供的射频电路开关芯片的第四种结构示意图。FIG. 10 is a fourth structural diagram of a radio frequency circuit switch chip according to an embodiment of the present invention.
图11是本发明实施例提供的射频电路的第五种结构示意图。FIG. 11 is a fifth structural diagram of a radio frequency circuit according to an embodiment of the present invention.
图12是本发明实施例提供的电子设备的另一结构示意图。FIG. 12 is another schematic structural diagram of an electronic device according to an embodiment of the present invention.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings. It is apparent that the described embodiments are only a part of the embodiments of the invention, and not all of the embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
在本发明的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.
在本发明中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本发明。此外,本发明可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本发明提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.
本发明实施例提供一种电子设备。该电子设备可以是智能手机、平板电脑等设备。参考图1和图2,电子设备100包括盖板101、显示屏102、电路板103、电池104以及壳体105。Embodiments of the present invention provide an electronic device. The electronic device can be a device such as a smartphone or a tablet. Referring to FIGS. 1 and 2, the electronic device 100 includes a cover 101, a display screen 102, a circuit board 103, a battery 104, and a housing 105.
其中,盖板101安装到显示屏102上,以覆盖显示屏102。盖板101可以为透明玻璃盖板。在一些实施例中,盖板101可以是用诸如蓝宝石等材料制成的玻璃盖板。The cover plate 101 is mounted to the display screen 102 to cover the display screen 102. The cover plate 101 may be a transparent glass cover. In some embodiments, the cover plate 101 can be a glass cover plate made of a material such as sapphire.
显示屏102安装在壳体105上,以形成电子设备100的显示面。显示屏102可以包括显示区域102A和非显示区域102B。显示区域102A用于显示图像、文本等信息。非显示区域102B不显示信息。非显示区域102B的底部可以设置指纹模组、触控电路等功能组件。The display screen 102 is mounted on the housing 105 to form a display surface of the electronic device 100. The display screen 102 can include a display area 102A and a non-display area 102B. The display area 102A is for displaying information such as images, texts, and the like. The non-display area 102B does not display information. The bottom of the non-display area 102B may be provided with functional components such as a fingerprint module and a touch circuit.
电路板103安装在壳体105内部。电路板103可以为电子设备100的主板。电路板103上可以集成有摄像头、接近传感器以及处理器等功能组件。同时,显示屏102可以电连接至电路板103。The circuit board 103 is mounted inside the housing 105. The circuit board 103 can be a motherboard of the electronic device 100. Functional components such as a camera, a proximity sensor, and a processor can be integrated on the circuit board 103. At the same time, the display screen 102 can be electrically connected to the circuit board 103.
在一些实施例中,电路板103上设置有射频(RF,Radio Frequency)电路。射频电路可以通过无线网络与网络设备(例如,服务器、基站等)或其他电子设备(例如,智能手机等)通信,以完成与网络设备或其他电子设备之间的信息收发。In some embodiments, the radio frequency (RF, Radio) is provided on the circuit board 103. Frequency) circuit. The radio frequency circuit can communicate with a network device (eg, a server, a base station, etc.) or other electronic device (eg, a smart phone, etc.) through a wireless network to complete transceiving information with the network device or other electronic device.
在一些实施例中,如图3所示,射频电路200包括射频收发器21、功率放大单元22、滤波单元23、射频电路开关芯片24以及天线25。其中,功率放大单元22、滤波单元23、射频电路开关芯片24以及天线25依次连接。In some embodiments, as shown in FIG. 3, the radio frequency circuit 200 includes a radio frequency transceiver 21, a power amplifying unit 22, a filtering unit 23, a radio frequency circuit switching chip 24, and an antenna 25. The power amplifying unit 22, the filtering unit 23, the radio frequency circuit switching chip 24, and the antenna 25 are sequentially connected.
射频收发器21具有发射端口TX和接收端口RX。发射端口TX用于发射射频信号(上行信号),接收端口RX用于接收射频信号(下行信号)。射频收发器21的发射端口TX与功率放大单元22连接,接收端口RX与滤波单元23连接。The radio frequency transceiver 21 has a transmit port TX and a receive port RX. The transmitting port TX is used to transmit a radio frequency signal (uplink signal), and the receiving port RX is used to receive a radio frequency signal (downlink signal). The transmitting port TX of the radio frequency transceiver 21 is connected to the power amplifying unit 22, and the receiving port RX is connected to the filtering unit 23.
功率放大单元22用于对射频收发器21发射的上行信号进行放大,并将放大后的上行信号发送到滤波单元23。The power amplifying unit 22 is configured to amplify the uplink signal transmitted by the radio frequency transceiver 21 and send the amplified uplink signal to the filtering unit 23.
滤波单元23用于对射频收发器21发射的上行信号进行滤波,并将滤波后的上行信号发送到天线25。滤波单元23还用于对天线25接收的下行信号进行滤波,并将滤波后的下行信号发送到射频收发器21。The filtering unit 23 is configured to filter the uplink signal transmitted by the radio frequency transceiver 21 and send the filtered uplink signal to the antenna 25. The filtering unit 23 is further configured to filter the downlink signal received by the antenna 25, and send the filtered downlink signal to the radio frequency transceiver 21.
射频电路开关芯片24用于选择性接通射频收发器21与天线25之间的通信频段。射频电路开关芯片24的详细结构和功能将在下文进行描述。The RF circuit switch chip 24 is used to selectively turn on the communication band between the RF transceiver 21 and the antenna 25. The detailed structure and function of the RF circuit switch chip 24 will be described below.
天线25用于将射频收发器21发送的上行信号发射到外界,或者从外界接收射频信号,并将接收到的下行信号发送到射频收发器21。The antenna 25 is configured to transmit an uplink signal sent by the radio frequency transceiver 21 to the outside, or receive a radio frequency signal from the outside, and send the received downlink signal to the radio frequency transceiver 21.
在一些实施例中,如图4所示,射频电路200还包括控制电路26。其中,控制电路26与射频电路开关芯片24连接。控制电路26还可以与电子设备100中的处理器连接,以根据处理器的指令控制射频电路开关芯片24的状态。In some embodiments, as shown in FIG. 4, the radio frequency circuit 200 also includes a control circuit 26. The control circuit 26 is connected to the RF circuit switch chip 24. Control circuitry 26 may also be coupled to a processor in electronic device 100 to control the state of radio frequency circuit switch chip 24 in accordance with instructions from the processor.
在一些实施例中,如图5所示,射频收发器21包括高频端口21H、中频端口21M以及低频端口21L。其中,高频端口21H、中频端口21M、低频端口21L可以分别包括多个射频发射端口和多个射频接收端口。高频端口21H用于收发高频射频信号,中频端口21M用于收发中频射频信号,低频端口21L用于收发低频射频信号。In some embodiments, as shown in FIG. 5, the radio frequency transceiver 21 includes a high frequency port 21H, an intermediate frequency port 21M, and a low frequency port 21L. The high frequency port 21H, the intermediate frequency port 21M, and the low frequency port 21L may respectively include a plurality of radio frequency transmitting ports and a plurality of radio frequency receiving ports. The high frequency port 21H is used for transmitting and receiving high frequency radio frequency signals, the intermediate frequency port 21M is used for transmitting and receiving intermediate frequency radio frequency signals, and the low frequency port 21L is used for transmitting and receiving low frequency radio frequency signals.
需要说明的是,上述高频射频信号、中频射频信号、低频射频信号只是相对概念,并无绝对的频率范围区分。It should be noted that the above-mentioned high frequency radio frequency signal, intermediate frequency radio frequency signal, and low frequency radio frequency signal are only relative concepts, and there is no absolute frequency range distinction.
例如,射频收发器21包括9个射频发射端口a1、a2、a3、a4、a5、a6、a7、a8、a9,以及9个射频接收端口b1、b2、b3、b4、b5、b6、b7、b8、b9。For example, the radio frequency transceiver 21 includes nine radio frequency transmitting ports a1, a2, a3, a4, a5, a6, a7, a8, a9, and nine radio frequency receiving ports b1, b2, b3, b4, b5, b6, b7, B8, b9.
其中,a1、a2、a3为高频发射端口,用于发射高频射频信号(例如,band7、band40、band41等频段的射频信号)。b1、b2、b3为高频接收端口,用于接收高频射频信号。a4、a5、a6为中频发射端口,用于发射中频射频信号(例如,band1、band2、band3等频段的射频信号)。b4、b5、b6为中频接收端口,用于接收中频射频信号。a7、a8、a9为低频发射端口,用于发射低频射频信号(例如,band8、band12、band20等频段的射频信号)。b7、b8、b9为低频接收端口,用于接收低频射频信号。Among them, a1, a2, and a3 are high-frequency transmitting ports for transmitting high-frequency radio frequency signals (for example, radio frequency signals in bands such as band7, band40, and band41). B1, b2, and b3 are high frequency receiving ports for receiving high frequency RF signals. A4, a5, and a6 are intermediate frequency transmission ports for transmitting intermediate frequency radio frequency signals (for example, radio frequency signals in bands of band 1, band 2, and band 3). B4, b5, and b6 are intermediate frequency receiving ports for receiving intermediate frequency radio frequency signals. A7, a8, and a9 are low-frequency transmitting ports for transmitting low-frequency RF signals (for example, RF signals in bands such as band8, band12, and band20). B7, b8, and b9 are low frequency receiving ports for receiving low frequency RF signals.
需要说明的是,上述实施例仅以射频收发器21的高频端口21H、中频端口21M、低频端口21L分别包括3个射频发射端口和3个射频接收端口为例进行说明。在其他一些实施例中,高频端口21H、中频端口21M、低频端口21L还可以分别包括其他数量的射频发射端口和射频接收端口。只需满足高频端口21H、中频端口21M、低频端口21L各自所包括的射频发射端口和射频接收端口的数量相同并且大于1即可。It should be noted that the above embodiment only takes the high frequency port 21H, the intermediate frequency port 21M, and the low frequency port 21L of the radio frequency transceiver 21 as three radio frequency transmitting ports and three radio frequency receiving ports as an example for description. In some other embodiments, the high frequency port 21H, the intermediate frequency port 21M, and the low frequency port 21L may also include other numbers of radio frequency transmitting ports and radio frequency receiving ports, respectively. It suffices that the number of the radio frequency transmitting port and the radio frequency receiving port included in each of the high frequency port 21H, the intermediate frequency port 21M, and the low frequency port 21L is the same and greater than one.
功率放大单元22包括9个放大器221、222、223、224、225、226、227、228、229。其中,放大器221、222、223、224、225、226、227、228、229分别与射频收发器21的射频发射端口a1、a2、a3、a4、a5、a6、a7、a8、a9连接。The power amplifying unit 22 includes nine amplifiers 221, 222, 223, 224, 225, 226, 227, 228, 229. The amplifiers 221, 222, 223, 224, 225, 226, 227, 228, 229 are respectively connected to the radio frequency transmitting ports a1, a2, a3, a4, a5, a6, a7, a8, a9 of the radio frequency transceiver 21.
滤波单元23包括9个双工器231、232、233、234、235、236、237、238、239。其中,双工器231、232、233、234、235、236、237、238、239分别与放大器221、222、223、224、225、226、227、228、229连接。并且,双工器231、232、233、234、235、236、237、238、239分别与射频收发器21的射频接收端口b1、b2、b3、b4、b5、b6、b7、b8、b9连接。The filtering unit 23 includes nine duplexers 231, 232, 233, 234, 235, 236, 237, 238, 239. Among them, the duplexers 231, 232, 233, 234, 235, 236, 237, 238, 239 are connected to the amplifiers 221, 222, 223, 224, 225, 226, 227, 228, 229, respectively. And, the duplexers 231, 232, 233, 234, 235, 236, 237, 238, 239 are respectively connected to the radio frequency receiving ports b1, b2, b3, b4, b5, b6, b7, b8, b9 of the radio frequency transceiver 21. .
射频电路开关芯片24的输入端包括9个子输入端口c1、c2、c3、c4、c5、c6、c7、c8、c9。其中,子输入端口c1、c2、c3、c4、c5、c6、c7、c8、c9分别与双工器231、232、233、234、235、236、237、238、239连接。The input of the RF circuit switch chip 24 includes nine sub-input ports c1, c2, c3, c4, c5, c6, c7, c8, c9. The sub-input ports c1, c2, c3, c4, c5, c6, c7, c8, and c9 are connected to the duplexers 231, 232, 233, 234, 235, 236, 237, 238, and 239, respectively.
在一些实施例中,如图6所示,滤波单元23包括滤波器231、滤波器232以及7个双工器233、234、235、236、237、238、239。其中,滤波器231、滤波器232以及7个双工器233、234、235、236、237、238、239分别与放大器221、222、223、224、225、226、227、228、229连接。并且,滤波器231、滤波器232以及7个双工器233、234、235、236、237、238、239分别与射频收发器21的射频接收端口b1、b2、b3、b4、b5、b6、b7、b8、b9连接。In some embodiments, as shown in FIG. 6, the filtering unit 23 includes a filter 231, a filter 232, and seven duplexers 233, 234, 235, 236, 237, 238, 239. The filter 231, the filter 232, and the seven duplexers 233, 234, 235, 236, 237, 238, and 239 are connected to the amplifiers 221, 222, 223, 224, 225, 226, 227, 228, and 229, respectively. Moreover, the filter 231, the filter 232, and the seven duplexers 233, 234, 235, 236, 237, 238, 239 and the radio frequency receiving ports b1, b2, b3, b4, b5, b6 of the radio frequency transceiver 21, respectively B7, b8, b9 are connected.
射频电路开关芯片24的输入端包括9个子输入端口c1、c2、c3、c4、c5、c6、c7、c8、c9。其中,子输入端口c1、c2、c3、c4、c5、c6、c7、c8、c9分别与滤波器231、滤波器232以及7个双工器233、234、235、236、237、238、239连接。The input of the RF circuit switch chip 24 includes nine sub-input ports c1, c2, c3, c4, c5, c6, c7, c8, c9. The sub-input ports c1, c2, c3, c4, c5, c6, c7, c8, and c9 are respectively connected to the filter 231, the filter 232, and the seven duplexers 233, 234, 235, 236, 237, 238, and 239. connection.
需要说明的是,上述实施例仅以滤波单元23包括2个滤波器以及7个双工器为例进行说明。在其他一些实施例中,滤波单元23还可以包括其他数量的滤波器和双工器。It should be noted that the above embodiment is described by taking only the filter unit 23 including two filters and seven duplexers as an example. In other embodiments, filtering unit 23 may also include other numbers of filters and duplexers.
在长期演进(Long Term Evolution,简称LTE)通讯网络中,根据双工方式的不同,LTE的通讯频段分为频分双工(Frequency Division Duplex,简称FDD)和时分双工(Time Division Duplex,简称TDD)两种类型。处在FDD模式下的通讯频段,上下行通讯链路使用不同的频率,此时射频电路中需要双工器对上下行通讯信号进行滤波处理。处在TDD模式下的通讯频段,上下行通讯链路使用相同的频率,在不同的时隙进行射频信号的传输,此时射频电路中需要滤波器对上下行通讯信号进行滤波处理。Long Term Evolution (Long Term Evolution, referred to as LTE) communication network, according to different duplex modes, LTE communication frequency band is divided into frequency division duplex (Frequency Division Duplex (FDD for short) and time division duplex (Time Division Duplex, referred to as TDD, is two types. In the communication frequency band in FDD mode, the uplink and downlink communication links use different frequencies. At this time, the duplexer needs to filter the uplink and downlink communication signals in the RF circuit. In the communication frequency band in TDD mode, the uplink and downlink communication links use the same frequency to transmit RF signals in different time slots. At this time, the RF circuit needs a filter to filter the uplink and downlink communication signals.
因此,实际应用中,滤波单元23中包括的滤波器数量和双工器数量取决于射频收发器21发射的各个频段的射频信号所处的双工模式。处于FDD模式的频段,射频发射端口和射频接收端口连接的是双工器;处于TDD模式的频段,射频发射端口和射频接收端口连接的是滤波器。例如,band1、band2频段工作在FDD模式,band1、band2射频信号的发射端口和接收端口连接的是双工器;而band40、band41频段工作在TDD模式,band40、band41射频信号的发射端口和接收端口连接的是滤波器。Therefore, in practical applications, the number of filters and the number of duplexers included in the filtering unit 23 depend on the duplex mode in which the radio frequency signals of the respective frequency bands transmitted by the radio frequency transceiver 21 are located. In the FDD mode, the RF transmit port and the RF receive port are connected to a duplexer; in the TDD mode, the RF transmit port and the RF receive port are connected to a filter. For example, the band1 and band2 bands work in the FDD mode, and the transmit port and the receive port of the band1 and band2 radio signals are connected to the duplexer; and the band40 and band41 bands operate in the TDD mode, and the transmit and receive ports of the band 40 and band41 radio frequency signals are transmitted. Connected to the filter.
参考图7,在一些实施例中,射频电路开关芯片24包括第一开关241、第二开关242、第三开关243以及合路器244。Referring to FIG. 7, in some embodiments, the radio frequency circuit switch chip 24 includes a first switch 241, a second switch 242, a third switch 243, and a combiner 244.
其中,第一开关241、第二开关242、第三开关243均为单刀多掷开关。例如,第一开关241包括3个子输入端口c1、c2、c3,第二开关242包括3个子输入端口c4、c5、c6,第三开关243包括3个子输入端口c7、c8、c9。第一开关241、第二开关242、第三开关243的输出端均连接到合路器244的输入端。The first switch 241, the second switch 242, and the third switch 243 are single-pole multi-throw switches. For example, the first switch 241 includes three sub-input ports c1, c2, c3, the second switch 242 includes three sub-input ports c4, c5, c6, and the third switch 243 includes three sub-input ports c7, c8, c9. The outputs of the first switch 241, the second switch 242, and the third switch 243 are all connected to the input of the combiner 244.
合路器244可以为三频合路器。合路器244的输出端连接到天线25。Combiner 244 can be a three-frequency combiner. The output of combiner 244 is coupled to antenna 25.
需要说明的是,上述连接关系仅表示元器件之间的直接连接,并不代表互相连接的元器件之间处于电性接通状态。It should be noted that the above connection relationship only indicates a direct connection between components, and does not mean that the components connected to each other are electrically connected.
在一些实施例中,子输入端口c1、c2、c3可以分别与射频收发器21中的高频端口连接,子输入端口c4、c5、c6可以分别与射频收发器21中的中频端口连接,子输入端口c7、c8、c9可以分别与射频收发器21中的低频端口连接。In some embodiments, the sub-input ports c1, c2, c3 may be respectively connected to the high frequency port in the radio frequency transceiver 21, and the sub input ports c4, c5, c6 may be respectively connected to the intermediate frequency port in the radio frequency transceiver 21, Input ports c7, c8, c9 can be respectively connected to the low frequency ports in the radio frequency transceiver 21.
当开关241接通c1、c2、c3中的任意一路,开关242接通c4、c5、c6中的任意一路,开关243断开时,合路器244可以实现高频信号与中频信号载波聚合。When the switch 241 turns on any one of c1, c2, and c3, the switch 242 turns on any one of c4, c5, and c6, and when the switch 243 is turned off, the combiner 244 can realize carrier aggregation of the high frequency signal and the intermediate frequency signal.
当开关241接通c1、c2、c3中的任意一路,开关242断开,开关243接通c7、c8、c9中的任意一路时,合路器244可以实现高频信号与低频信号载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch 242 is turned off, and the switch 243 turns on any one of c7, c8, c9, the combiner 244 can realize carrier aggregation of the high frequency signal and the low frequency signal.
当开关241断开,开关242接通c4、c5、c6中的任意一路,开关243接通c7、c8、c9中的任意一路时,合路器244可以实现中频信号与低频信号载波聚合。When the switch 241 is turned off, the switch 242 is turned on by any one of c4, c5, and c6, and when the switch 243 is turned on by any one of c7, c8, and c9, the combiner 244 can realize carrier aggregation of the intermediate frequency signal and the low frequency signal.
当开关241接通c1、c2、c3中的任意一路,开关242接通c4、c5、c6中的任意一路,开关243接通c7、c8、c9中的任意一路时,合路器244可以实现高频信号、中频信号与低频信号载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch 242 turns on any one of c4, c5, c6, and when the switch 243 turns on any one of c7, c8, c9, the combiner 244 can realize High frequency signal, intermediate frequency signal and low frequency signal carrier aggregation.
参考图8,在一些实施例中,射频电路开关芯片24包括第一开关241、第二开关242、第三开关243、开关组件246以及第一合路器244、第二合路器245。Referring to FIG. 8, in some embodiments, the radio frequency circuit switch chip 24 includes a first switch 241, a second switch 242, a third switch 243, a switch assembly 246, and a first combiner 244, a second combiner 245.
其中,第一开关241、第二开关242、第三开关243均为单刀多掷开关。例如,第一开关241包括3个子输入端口c1、c2、c3,第二开关242包括3个子输入端口c4、c5、c6,第三开关243包括3个子输入端口c7、c8、c9。第一开关241、第二开关242的输出端连接到开关组件246。第三开关243的输出端连接到第二合路器245的第一输入端。开关组件246具有3个输入端P1、P2、P3以及3个输出端Q1、Q2、Q3。其中,输入端P1与开关241的输出端连接。输入端P2与开关242的输出端连接。输入端P3与第一合路器244的输出端连接。输出端Q1与合路器244的第一输入端连接。输出端Q2与合路器244的第二输入端连接。输出端Q3与第二合路器245的第二输入端连接。The first switch 241, the second switch 242, and the third switch 243 are single-pole multi-throw switches. For example, the first switch 241 includes three sub-input ports c1, c2, c3, the second switch 242 includes three sub-input ports c4, c5, c6, and the third switch 243 includes three sub-input ports c7, c8, c9. The outputs of the first switch 241 and the second switch 242 are connected to the switch assembly 246. The output of the third switch 243 is coupled to the first input of the second combiner 245. The switch assembly 246 has three input terminals P1, P2, P3 and three output terminals Q1, Q2, Q3. The input terminal P1 is connected to the output end of the switch 241. Input P2 is coupled to the output of switch 242. The input terminal P3 is connected to the output of the first combiner 244. The output Q1 is connected to the first input of the combiner 244. The output terminal Q2 is coupled to the second input of the combiner 244. The output terminal Q3 is connected to the second input terminal of the second combiner 245.
其中,第一合路器244、第二合路器245都为双频合路器。第二合路器245的输出端连接到天线25。The first combiner 244 and the second combiner 245 are both dual frequency combiners. The output of the second combiner 245 is connected to the antenna 25.
在一些实施例中,开关组件246包括开关K1、K2、K3。其中,开关K1、K2为单刀双掷开关,K3为单刀单掷开关。In some embodiments, the switch assembly 246 includes switches K1, K2, K3. Among them, the switches K1 and K2 are single-pole double-throw switches, and K3 is a single-pole single-throw switch.
开关K1的固定端连接至开关组件246的输入端P1。开关K1的选通端分别连接至开关组件246的输出端Q1、Q3。开关K1可以选择性接通输入端P1与输出端Q1或Q3。The fixed end of switch K1 is coupled to input P1 of switch assembly 246. The gates of switch K1 are coupled to the outputs Q1, Q3 of switch assembly 246, respectively. The switch K1 can selectively turn on the input terminal P1 and the output terminal Q1 or Q3.
开关K2的固定端连接至开关组件246的输入端P2。开关K2的选通端分别连接至开关组件246的输出端Q2、Q3。开关K2可以选择性接通输入端P2与输出端Q2或Q3。The fixed end of switch K2 is coupled to input P2 of switch assembly 246. The gates of switch K2 are coupled to outputs Q2, Q3 of switch assembly 246, respectively. The switch K2 can selectively turn on the input terminal P2 and the output terminal Q2 or Q3.
开关K3的输入端和输出端分别连接至开关组件246的输入端P3和输出端Q3。开关K3可以接通或断开输入端P3和输出端Q3。The input and output of switch K3 are coupled to input P3 and output Q3 of switch assembly 246, respectively. The switch K3 can turn on or off the input terminal P3 and the output terminal Q3.
在一些实施例中,子输入端口c1、c2、c3可以分别与射频收发器21中的高频端口连接,子输入端口c4、c5、c6可以分别与射频收发器21中的中频端口连接,子输入端口c7、c8、c9可以分别与射频收发器21中的低频端口连接。In some embodiments, the sub-input ports c1, c2, c3 may be respectively connected to the high frequency port in the radio frequency transceiver 21, and the sub input ports c4, c5, c6 may be respectively connected to the intermediate frequency port in the radio frequency transceiver 21, Input ports c7, c8, c9 can be respectively connected to the low frequency ports in the radio frequency transceiver 21.
当开关241接通c1、c2、c3中的任意一路,开关K1接通P1与Q1,开关242接通c4、c5、c6中的任意一路,开关K2接通P2与Q2时,合路器244可以实现高频信号与中频信号载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch K1 turns on P1 and Q1, the switch 242 turns on any one of c4, c5, c6, and when the switch K2 turns on P2 and Q2, the combiner 244 High frequency signal and intermediate frequency signal carrier aggregation can be realized.
进一步地,当开关K3接通P3与Q3,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现高频信号、中频信号、低频信号的载波聚合。Further, when the switch K3 turns on P3 and Q3, and the switch 243 turns on any one of c7, c8, and c9, the combiner 245 can realize carrier aggregation of the high frequency signal, the intermediate frequency signal, and the low frequency signal.
当开关241接通c1、c2、c3中的任意一路,开关K1接通P1与Q3,开关242断开,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现高频信号与低频信号的载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch K1 turns on P1 and Q3, the switch 242 is turned off, and the switch 243 turns on any one of c7, c8, c9, the combiner 245 can achieve high Carrier aggregation of frequency signals and low frequency signals.
当开关241断开,开关242接通c4、c5、c6中的任意一路,开关K2接通P2与Q3,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现中频信号与低频信号的载波聚合。When the switch 241 is turned off, the switch 242 turns on any one of c4, c5, c6, the switch K2 turns on P2 and Q3, and the switch 243 turns on any one of c7, c8, c9, the combiner 245 can realize the intermediate frequency Carrier aggregation of signals and low frequency signals.
例如,子输入端口c1可以与射频收发器21中的高频频段band40发射端口连接,子输入端口c4可以与射频收发器21中的中频频段band3发射端口连接,子输入端口c7可以与射频收发器21中的低频频段band12发射端口连接。For example, the sub-input port c1 can be connected to the HF band 40 transmit port in the RF transceiver 21, the sub-input port c4 can be connected to the IF band 3 transmit port in the RF transceiver 21, and the sub-input port c7 can be transceived with the RF The low frequency band band 12 in the 21 is connected to the transmit port.
当开关241接通c1,开关K1接通P1与Q1,开关242接通c4,开关K2接通P2与Q2时,合路器244可以实现band40与band3的载波聚合。When switch 241 is turned on c1, switch K1 turns on P1 and Q1, switch 242 turns on c4, and switch K2 turns on P2 and Q2, combiner 244 can implement carrier aggregation of band 40 and band 3.
进一步地,当开关K3接通P3与Q3,开关243接通c7时,合路器245可以实现band40、band3、band12的载波聚合。Further, when the switch K3 turns on P3 and Q3, and the switch 243 turns on c7, the combiner 245 can implement carrier aggregation of band 40, band 3, and band 12.
当开关241接通c1,开关K1接通P1与Q3,开关242断开,开关243接通c7时,合路器245可以实现band40与band12的载波聚合。When switch 241 is turned on c1, switch K1 is turned on P1 and Q3, switch 242 is turned off, and switch 243 is turned on c7, combiner 245 can implement carrier aggregation of band 40 and band 12.
当开关241断开,开关242接通c4,开关K2接通P2与Q3,开关243接通c7,合路器245可以实现band3与band12的载波聚合。When the switch 241 is turned off, the switch 242 is turned on c4, the switch K2 is turned on P2 and Q3, the switch 243 is turned on c7, and the combiner 245 can realize carrier aggregation of band3 and band12.
参考图9,在一些实施例中,射频电路开关芯片24包括第一开关241、第二开关242、第三开关243、开关组件246以及第一合路器244、第二合路器245。Referring to FIG. 9 , in some embodiments, the RF circuit switch chip 24 includes a first switch 241 , a second switch 242 , a third switch 243 , a switch assembly 246 , and a first combiner 244 , a second combiner 245 .
其中,第一开关241、第二开关242、第三开关243均为单刀多掷开关。例如,第一开关241包括3个子输入端口c1、c2、c3,第二开关242包括3个子输入端口c4、c5、c6,第三开关243包括3个子输入端口c7、c8、c9。第一开关241、第二开关242的输出端连接到开关组件246。第三开关243的输出端连接到第二合路器245的第一输入端。The first switch 241, the second switch 242, and the third switch 243 are single-pole multi-throw switches. For example, the first switch 241 includes three sub-input ports c1, c2, c3, the second switch 242 includes three sub-input ports c4, c5, c6, and the third switch 243 includes three sub-input ports c7, c8, c9. The outputs of the first switch 241 and the second switch 242 are connected to the switch assembly 246. The output of the third switch 243 is coupled to the first input of the second combiner 245.
在一些实施例中,第一开关241、第二开关242以及第三开关243可以封装形成第一芯片247。In some embodiments, the first switch 241, the second switch 242, and the third switch 243 may be packaged to form the first chip 247.
开关组件246具有3个输入端P1、P2、P3以及3个输出端Q1、Q2、Q3。其中,输入端P1与开关241的输出端连接。输入端P2与开关242的输出端连接。输入端P3与第一合路器244的输出端连接。输出端Q1与合路器244的第一输入端连接。输出端Q2与合路器244的第二输入端连接。输出端Q3与第二合路器245的第二输入端连接。The switch assembly 246 has three input terminals P1, P2, P3 and three output terminals Q1, Q2, Q3. The input terminal P1 is connected to the output end of the switch 241. Input P2 is coupled to the output of switch 242. The input terminal P3 is connected to the output of the first combiner 244. The output Q1 is connected to the first input of the combiner 244. The output terminal Q2 is coupled to the second input of the combiner 244. The output terminal Q3 is connected to the second input terminal of the second combiner 245.
其中,第一合路器244、第二合路器245都为双频合路器。第二合路器245的输出端连接到天线25。The first combiner 244 and the second combiner 245 are both dual frequency combiners. The output of the second combiner 245 is connected to the antenna 25.
在一些实施例中,开关组件246包括开关K1、K2、K3。其中,开关K1、K2为单刀单掷开关,K3为单刀三掷开关。In some embodiments, the switch assembly 246 includes switches K1, K2, K3. Among them, the switches K1 and K2 are single-pole single-throw switches, and K3 is a single-pole three-throw switch.
开关K1的输入端和输出端分别连接至开关组件246的输入端P1和输出端Q1。开关K1可以接通或断开输入端P1和输出端Q1。The input and output of switch K1 are coupled to input P1 and output Q1 of switch assembly 246, respectively. The switch K1 can turn on or off the input terminal P1 and the output terminal Q1.
开关K2的输入端和输出端分别连接至开关组件246的输入端P2和输出端Q2。开关K2可以接通或断开输入端P2和输出端Q2。The input and output of switch K2 are coupled to input P2 and output Q2 of switch assembly 246, respectively. The switch K2 can turn on or off the input terminal P2 and the output terminal Q2.
开关K3的固定端连接至开关组件246的输出端Q3。开关K3的三个选通端分别连接至开关组件246的输入端P1、输入端P2、输入端P3。开关K3可以选择性接通输入端P1、输入端P2或输入端P3与输出端Q3。The fixed end of switch K3 is coupled to output Q3 of switch assembly 246. The three strobe terminals of the switch K3 are respectively connected to the input terminal P1, the input terminal P2, and the input terminal P3 of the switch assembly 246. The switch K3 can selectively turn on the input terminal P1, the input terminal P2 or the input terminal P3 and the output terminal Q3.
在一些实施例中,子输入端口c1、c2、c3可以分别与射频收发器21中的高频端口连接,子输入端口c4、c5、c6可以分别与射频收发器21中的中频端口连接,子输入端口c7、c8、c9可以分别与射频收发器21中的低频端口连接。In some embodiments, the sub-input ports c1, c2, c3 may be respectively connected to the high frequency port in the radio frequency transceiver 21, and the sub input ports c4, c5, c6 may be respectively connected to the intermediate frequency port in the radio frequency transceiver 21, Input ports c7, c8, c9 can be respectively connected to the low frequency ports in the radio frequency transceiver 21.
当开关241接通c1、c2、c3中的任意一路,开关K1接通P1与Q1,开关242接通c4、c5、c6中的任意一路,开关K2接通P2与Q2时,合路器244可以实现高频信号与中频信号载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch K1 turns on P1 and Q1, the switch 242 turns on any one of c4, c5, c6, and when the switch K2 turns on P2 and Q2, the combiner 244 High frequency signal and intermediate frequency signal carrier aggregation can be realized.
进一步地,当开关K3接通P3与Q3,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现高频信号、中频信号、低频信号的载波聚合。Further, when the switch K3 turns on P3 and Q3, and the switch 243 turns on any one of c7, c8, and c9, the combiner 245 can realize carrier aggregation of the high frequency signal, the intermediate frequency signal, and the low frequency signal.
当开关241接通c1、c2、c3中的任意一路,开关K3接通P1与Q3,开关242断开,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现高频信号与低频信号的载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch K3 turns on P1 and Q3, the switch 242 is turned off, and the switch 243 turns on any one of c7, c8, c9, the combiner 245 can achieve high Carrier aggregation of frequency signals and low frequency signals.
当开关241断开,开关242接通c4、c5、c6中的任意一路,开关K3接通P2与Q3,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现中频信号与低频信号的载波聚合。When the switch 241 is turned off, the switch 242 turns on any one of c4, c5, c6, the switch K3 turns on P2 and Q3, and the switch 243 turns on any one of c7, c8, c9, the combiner 245 can realize the intermediate frequency Carrier aggregation of signals and low frequency signals.
参考图10,在一些实施例中,射频电路开关芯片24包括第一开关241、第二开关242、第三开关243、开关组件246以及第一合路器244、第二合路器245。Referring to FIG. 10, in some embodiments, the RF circuit switch chip 24 includes a first switch 241, a second switch 242, a third switch 243, a switch assembly 246, and a first combiner 244, a second combiner 245.
其中,第一开关241、第二开关242、第三开关243均为单刀多掷开关。例如,第一开关241包括3个子输入端口c1、c2、c3,第二开关242包括3个子输入端口c4、c5、c6,第三开关243包括3个子输入端口c7、c8、c9。第一开关241、第二开关242的输出端连接到开关组件246。第三开关243的输出端连接到第二合路器245的第一输入端。The first switch 241, the second switch 242, and the third switch 243 are single-pole multi-throw switches. For example, the first switch 241 includes three sub-input ports c1, c2, c3, the second switch 242 includes three sub-input ports c4, c5, c6, and the third switch 243 includes three sub-input ports c7, c8, c9. The outputs of the first switch 241 and the second switch 242 are connected to the switch assembly 246. The output of the third switch 243 is coupled to the first input of the second combiner 245.
开关组件246具有3个输入端P1、P2、P3以及3个输出端Q1、Q2、Q3。其中,输入端P1与开关241的输出端连接。输入端P2与开关242的输出端连接。输入端P3与第一合路器244的输出端连接。输出端Q1与合路器244的第一输入端连接。输出端Q2与合路器244的第二输入端连接。输出端Q3与第二合路器245的第二输入端连接。The switch assembly 246 has three input terminals P1, P2, P3 and three output terminals Q1, Q2, Q3. The input terminal P1 is connected to the output end of the switch 241. Input P2 is coupled to the output of switch 242. The input terminal P3 is connected to the output of the first combiner 244. The output Q1 is connected to the first input of the combiner 244. The output terminal Q2 is coupled to the second input of the combiner 244. The output terminal Q3 is connected to the second input terminal of the second combiner 245.
其中,第一合路器244、第二合路器245都为双频合路器。第二合路器245的输出端连接到天线25。The first combiner 244 and the second combiner 245 are both dual frequency combiners. The output of the second combiner 245 is connected to the antenna 25.
在一些实施例中,第一开关241、第二开关242、第三开关243以及开关组件246可以封装形成第二芯片248。In some embodiments, the first switch 241, the second switch 242, the third switch 243, and the switch assembly 246 can be packaged to form the second chip 248.
在一些实施例中,开关组件246包括开关K1、K2、K3、K4、K5。其中,开关K1、K2、K3、K4、K5均为单刀单掷开关。In some embodiments, the switch assembly 246 includes switches K1, K2, K3, K4, K5. Among them, the switches K1, K2, K3, K4, and K5 are single-pole single-throw switches.
开关K1的输入端和输出端分别连接至开关组件246的输入端P1和输出端Q1。开关K1可以接通或断开输入端P1和输出端Q1。The input and output of switch K1 are coupled to input P1 and output Q1 of switch assembly 246, respectively. The switch K1 can turn on or off the input terminal P1 and the output terminal Q1.
开关K2的输入端和输出端分别连接至开关组件246的输入端P2和输出端Q2。开关K2可以接通或断开输入端P2和输出端Q2。The input and output of switch K2 are coupled to input P2 and output Q2 of switch assembly 246, respectively. The switch K2 can turn on or off the input terminal P2 and the output terminal Q2.
开关K3的输入端和输出端分别连接至开关组件246的输入端P2和输出端Q3。开关K3可以接通或断开输入端P2和输出端Q3。The input and output of switch K3 are coupled to input P2 and output Q3 of switch assembly 246, respectively. The switch K3 can turn on or off the input terminal P2 and the output terminal Q3.
开关K4的输入端和输出端分别连接至开关组件246的输入端P1和输出端Q3。开关K4可以接通或断开输入端P1和输出端Q3。The input and output of switch K4 are coupled to input P1 and output Q3 of switch assembly 246, respectively. The switch K4 can turn on or off the input terminal P1 and the output terminal Q3.
开关K5的输入端和输出端分别连接至开关组件246的输入端P3和输出端Q3。开关K5可以接通或断开输入端P3和输出端Q3。The input and output of switch K5 are coupled to input P3 and output Q3 of switch assembly 246, respectively. The switch K5 can turn on or off the input terminal P3 and the output terminal Q3.
在一些实施例中,子输入端口c1、c2、c3可以分别与射频收发器21中的高频端口连接,子输入端口c4、c5、c6可以分别与射频收发器21中的中频端口连接,子输入端口c7、c8、c9可以分别与射频收发器21中的低频端口连接。In some embodiments, the sub-input ports c1, c2, c3 may be respectively connected to the high frequency port in the radio frequency transceiver 21, and the sub input ports c4, c5, c6 may be respectively connected to the intermediate frequency port in the radio frequency transceiver 21, Input ports c7, c8, c9 can be respectively connected to the low frequency ports in the radio frequency transceiver 21.
当开关241接通c1、c2、c3中的任意一路,开关K1接通P1与Q1,开关242接通c4、c5、c6中的任意一路,开关K2接通P2与Q2时,合路器244可以实现高频信号与中频信号载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch K1 turns on P1 and Q1, the switch 242 turns on any one of c4, c5, c6, and when the switch K2 turns on P2 and Q2, the combiner 244 High frequency signal and intermediate frequency signal carrier aggregation can be realized.
进一步地,当开关K5接通P3与Q3,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现高频信号、中频信号、低频信号的载波聚合。Further, when the switch K5 turns on P3 and Q3, and the switch 243 turns on any one of c7, c8, and c9, the combiner 245 can realize carrier aggregation of the high frequency signal, the intermediate frequency signal, and the low frequency signal.
当开关241接通c1、c2、c3中的任意一路,开关K4接通P1与Q3,开关242断开,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现高频信号与低频信号的载波聚合。When the switch 241 turns on any one of c1, c2, c3, the switch K4 turns on P1 and Q3, the switch 242 is turned off, and the switch 243 turns on any one of c7, c8, c9, the combiner 245 can achieve high Carrier aggregation of frequency signals and low frequency signals.
当开关241断开,开关242接通c4、c5、c6中的任意一路,开关K3接通P2与Q3,开关243接通c7、c8、c9中的任意一路时,合路器245可以实现中频信号与低频信号的载波聚合。When the switch 241 is turned off, the switch 242 turns on any one of c4, c5, c6, the switch K3 turns on P2 and Q3, and the switch 243 turns on any one of c7, c8, c9, the combiner 245 can realize the intermediate frequency Carrier aggregation of signals and low frequency signals.
参考图11,图11为射频电路200的结构示意图。其中,射频收发器21包括9个射频发射端口a1、a2、a3、a4、a5、a6、a7、a8、a9,以及9个射频接收端口b1、b2、b3、b4、b5、b6、b7、b8、b9。Referring to FIG. 11, FIG. 11 is a schematic structural diagram of a radio frequency circuit 200. The radio frequency transceiver 21 includes nine radio frequency transmitting ports a1, a2, a3, a4, a5, a6, a7, a8, a9, and nine radio frequency receiving ports b1, b2, b3, b4, b5, b6, b7, B8, b9.
其中,a1、a2、a3为高频发射端口,用于发射高频射频信号(例如,band7、band40、band41等频段的射频信号)。b1、b2、b3为高频接收端口,用于接收高频射频信号。a4、a5、a6为中频发射端口,用于发射中频射频信号(例如,band1、band2、band3等频段的射频信号)。b4、b5、b6为中频接收端口,用于接收中频射频信号。a7、a8、a9为低频发射端口,用于发射低频射频信号(例如,band8、band12、band20等频段的射频信号)。b7、b8、b9为低频接收端口,用于接收低频射频信号。Among them, a1, a2, and a3 are high-frequency transmitting ports for transmitting high-frequency radio frequency signals (for example, radio frequency signals in bands such as band7, band40, and band41). B1, b2, and b3 are high frequency receiving ports for receiving high frequency RF signals. A4, a5, and a6 are intermediate frequency transmission ports for transmitting intermediate frequency radio frequency signals (for example, radio frequency signals in bands of band 1, band 2, and band 3). B4, b5, and b6 are intermediate frequency receiving ports for receiving intermediate frequency radio frequency signals. A7, a8, and a9 are low-frequency transmitting ports for transmitting low-frequency RF signals (for example, RF signals in bands such as band8, band12, and band20). B7, b8, and b9 are low frequency receiving ports for receiving low frequency RF signals.
需要说明的是,上述实施例仅以射频收发器21的高频端口、中频端口、低频端口分别包括3个射频发射端口和3个射频接收端口为例进行说明。在其他一些实施例中,高频端口、中频端口、低频端口还可以分别包括其他数量的射频发射端口和射频接收端口。只需满足高频端口、中频端口、低频端口各自所包括的射频发射端口和射频接收端口的数量相同并且大于1即可。It should be noted that the foregoing embodiment only takes the high frequency port, the intermediate frequency port, and the low frequency port of the radio frequency transceiver 21 as three radio frequency transmitting ports and three radio frequency receiving ports as an example for description. In some other embodiments, the high frequency port, the intermediate frequency port, and the low frequency port may also include other numbers of radio frequency transmitting ports and radio frequency receiving ports, respectively. It only needs to satisfy the same number of radio frequency transmitting ports and radio frequency receiving ports included in the high frequency port, the intermediate frequency port, and the low frequency port, and is greater than one.
功率放大单元22包括9个放大器221、222、223、224、225、226、227、228、229。其中,放大器221、222、223、224、225、226、227、228、229分别与射频收发器21的射频发射端口a1、a2、a3、a4、a5、a6、a7、a8、a9连接。The power amplifying unit 22 includes nine amplifiers 221, 222, 223, 224, 225, 226, 227, 228, 229. The amplifiers 221, 222, 223, 224, 225, 226, 227, 228, 229 are respectively connected to the radio frequency transmitting ports a1, a2, a3, a4, a5, a6, a7, a8, a9 of the radio frequency transceiver 21.
滤波单元23包括9个双工器231、232、233、234、235、236、237、238、239。其中,双工器231、232、233、234、235、236、237、238、239分别与放大器221、222、223、224、225、226、227、228、229连接。并且,双工器231、232、233、234、235、236、237、238、239分别与射频收发器21的射频接收端口b1、b2、b3、b4、b5、b6、b7、b8、b9连接。The filtering unit 23 includes nine duplexers 231, 232, 233, 234, 235, 236, 237, 238, 239. Among them, the duplexers 231, 232, 233, 234, 235, 236, 237, 238, 239 are connected to the amplifiers 221, 222, 223, 224, 225, 226, 227, 228, 229, respectively. And, the duplexers 231, 232, 233, 234, 235, 236, 237, 238, 239 are respectively connected to the radio frequency receiving ports b1, b2, b3, b4, b5, b6, b7, b8, b9 of the radio frequency transceiver 21. .
射频电路开关芯片24包括第一开关241、第二开关242、第三开关243、开关组件246以及第一合路器244、第二合路器245。The RF circuit switch chip 24 includes a first switch 241, a second switch 242, a third switch 243, a switch assembly 246, and a first combiner 244 and a second combiner 245.
其中,第一开关241、第二开关242的输出端连接到开关组件246。第三开关243的输出端连接到第二合路器245的第一输入端。The output ends of the first switch 241 and the second switch 242 are connected to the switch assembly 246. The output of the third switch 243 is coupled to the first input of the second combiner 245.
第一开关241、第二开关242、第三开关243均为单刀多掷开关。例如,第一开关241包括3个子输入端口c1、c2、c3,第二开关242包括3个子输入端口c4、c5、c6,第三开关243包括3个子输入端口c7、c8、c9。其中,子输入端口c1、c2、c3、c4、c5、c6、c7、c8、c9分别与双工器231、232、233、234、235、236、237、238、239连接。The first switch 241, the second switch 242, and the third switch 243 are single-pole multi-throw switches. For example, the first switch 241 includes three sub-input ports c1, c2, c3, the second switch 242 includes three sub-input ports c4, c5, c6, and the third switch 243 includes three sub-input ports c7, c8, c9. The sub-input ports c1, c2, c3, c4, c5, c6, c7, c8, and c9 are connected to the duplexers 231, 232, 233, 234, 235, 236, 237, 238, and 239, respectively.
开关组件246具有3个输入端P1、P2、P3以及3个输出端Q1、Q2、Q3。其中,输入端P1与开关241的输出端连接。输入端P2与开关242的输出端连接。输入端P3与第一合路器244的输出端连接。输出端Q1与合路器244的第一输入端连接。输出端Q2与合路器244的第二输入端连接。输出端Q3与第二合路器245的第二输入端连接。The switch assembly 246 has three input terminals P1, P2, P3 and three output terminals Q1, Q2, Q3. The input terminal P1 is connected to the output end of the switch 241. Input P2 is coupled to the output of switch 242. The input terminal P3 is connected to the output of the first combiner 244. The output Q1 is connected to the first input of the combiner 244. The output terminal Q2 is coupled to the second input of the combiner 244. The output terminal Q3 is connected to the second input terminal of the second combiner 245.
其中,第一合路器244、第二合路器245都为双频合路器。第二合路器245的输出端连接到天线25。The first combiner 244 and the second combiner 245 are both dual frequency combiners. The output of the second combiner 245 is connected to the antenna 25.
本发明实施例中,射频电路开关芯片24可以控制射频收发器21的高频端口与中频端口接通第一合路器244,以实现高频信号与中频信号载波聚合;可以控制射频收发器21的高频端口、中频端口接通第一合路器244,同时第一合路器244、射频收发器21的低频端口接通第二合路器245,以实现高频信号、中频信号、低频信号的载波聚合;还可以控制射频收发器21的高频端口与低频端口接通第二合路器245,以实现高频信号与低频信号载波聚合;可以控制射频收发器21的中频端口与低频端口接通第二合路器245,以实现中频信号与低频信号载波聚合。射频电路开关芯片24能够控制不同频段的射频信号进行载波聚合,从而可以提高电子设备100对射频信号进行载波聚合的多样性。In the embodiment of the present invention, the radio frequency circuit switch chip 24 can control the high frequency port and the intermediate frequency port of the radio frequency transceiver 21 to be connected to the first combiner 244 to implement high frequency signal and intermediate frequency signal carrier aggregation; and the radio frequency transceiver 21 can be controlled. The high frequency port and the intermediate frequency port are connected to the first combiner 244, and the first combiner 244 and the low frequency port of the radio frequency transceiver 21 are connected to the second combiner 245 to implement a high frequency signal, an intermediate frequency signal, and a low frequency. The carrier aggregation of the signal; the high frequency port and the low frequency port of the radio frequency transceiver 21 can be controlled to be connected to the second combiner 245 to implement high frequency signal and low frequency signal carrier aggregation; and the intermediate frequency port and low frequency of the radio frequency transceiver 21 can be controlled. The port is connected to the second combiner 245 to implement carrier aggregation of the intermediate frequency signal and the low frequency signal. The radio frequency circuit switch chip 24 can control the radio frequency signals of different frequency bands for carrier aggregation, thereby improving the diversity of carrier aggregation of the radio frequency signals by the electronic device 100.
继续参考图1和图2。其中,电池104安装在壳体105内部。电池104用于为电子设备100提供电能。Continue to refer to Figures 1 and 2. Among them, the battery 104 is mounted inside the casing 105. Battery 104 is used to provide electrical energy to electronic device 100.
壳体105用于形成电子设备100的外部轮廓。壳体105的材质可以为塑料或金属。壳体105可以一体成型。The housing 105 is used to form an outer contour of the electronic device 100. The material of the casing 105 may be plastic or metal. The housing 105 can be integrally formed.
参考图12,图12为本发明实施例提供的电子设备100的另一结构示意图。电子设备100包括天线装置10、存储器20、显示单元30、电源40以及处理器50。本领域技术人员可以理解,图12中示出的电子设备100的结构并不构成对电子设备100的限定。电子设备100可以包括比图示更多或更少的部件,或者组合某些部件,或者不同的部件布置。Referring to FIG. 12, FIG. 12 is another schematic structural diagram of an electronic device 100 according to an embodiment of the present invention. The electronic device 100 includes an antenna device 10, a memory 20, a display unit 30, a power source 40, and a processor 50. Those skilled in the art can appreciate that the structure of the electronic device 100 shown in FIG. 12 does not constitute a limitation on the electronic device 100. Electronic device 100 may include more or fewer components than illustrated, or some components in combination, or different component arrangements.
其中,天线装置10包括上述任一实施例中所描述的射频电路200。天线装置10可以通过无线网络与网络设备(例如,服务器)或其他电子设备(例如,智能手机)通信,完成与网络设备或其他电子设备之间的信息收发。The antenna device 10 includes the radio frequency circuit 200 described in any of the above embodiments. The antenna device 10 can communicate with a network device (eg, a server) or other electronic device (eg, a smart phone) over a wireless network to perform transceiving of information with a network device or other electronic device.
存储器20可用于存储应用程序和数据。存储器20存储的应用程序中包含有可执行程序代码。应用程序可以组成各种功能模块。处理器50通过运行存储在存储器20的应用程序,从而执行各种功能应用以及数据处理。Memory 20 can be used to store applications and data. The application stored in the memory 20 contains executable program code. Applications can form various functional modules. The processor 50 executes various functional applications and data processing by running an application stored in the memory 20.
显示单元30可用于显示由用户输入到电子设备100的信息或提供给用户的信息以及电子设备100的各种图形用户接口。这些图形用户接口可以由图形、文本、图标、视频和其任意组合来构成。显示单元30可包括显示面板。The display unit 30 can be used to display information input by the user to the electronic device 100 or information provided to the user and various graphical user interfaces of the electronic device 100. These graphical user interfaces can be composed of graphics, text, icons, video, and any combination thereof. The display unit 30 may include a display panel.
电源40用于给电子设备100的各个部件供电。在一些实施例中,电源40可以通过电源管理系统与处理器50逻辑相连,从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。The power source 40 is used to power various components of the electronic device 100. In some embodiments, the power source 40 can be logically coupled to the processor 50 through a power management system to enable functions such as managing charging, discharging, and power management through the power management system.
处理器50是电子设备100的控制中心。处理器50利用各种接口和线路连接整个电子设备100的各个部分,通过运行或执行存储在存储器20内的应用程序,以及调用存储在存储器20内的数据,执行电子设备100的各种功能和处理数据,从而对电子设备100进行整体监控。The processor 50 is a control center of the electronic device 100. The processor 50 connects various parts of the entire electronic device 100 using various interfaces and lines, performs various functions of the electronic device 100 by running or executing an application stored in the memory 20, and calling data stored in the memory 20. The data is processed to perform overall monitoring of the electronic device 100.
此外,电子设备100还可以包括摄像头模块、蓝牙模块等,在此不再赘述。In addition, the electronic device 100 may further include a camera module, a Bluetooth module, and the like, and details are not described herein again.
以上对本发明实施例提供的射频电路开关芯片、射频电路、天线装置及电子设备进行了详细介绍,本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明。同时,对于本领域的技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本发明的限制。The radio frequency circuit switch chip, the radio frequency circuit, the antenna device and the electronic device provided by the embodiments of the present invention are described in detail. The principles and implementation manners of the present invention are described in the specific examples. The description of the above embodiments is only used. To help understand the invention. In the meantime, the present invention is not limited by the scope of the present invention.

Claims (20)

  1. 一种射频电路开关芯片,其中,所述射频电路开关芯片包括第一开关、第二开关、第三开关、第一合路器以及第二合路器,所述第一开关、第二开关、第三开关可分别输出高频信号、中频信号、低频信号;A radio frequency circuit switch chip, wherein the radio frequency circuit switch chip comprises a first switch, a second switch, a third switch, a first combiner and a second combiner, the first switch, the second switch, The third switch can respectively output a high frequency signal, an intermediate frequency signal, and a low frequency signal;
    所述第一开关、第二开关可选择性接通所述第一合路器,以实现高频信号与中频信号载波聚合;The first switch and the second switch may selectively turn on the first combiner to implement carrier aggregation of a high frequency signal and an intermediate frequency signal;
    所述第一开关、第三开关可选择性接通所述第二合路器,以实现高频信号与低频信号载波聚合;The first switch and the third switch may selectively turn on the second combiner to implement carrier aggregation of a high frequency signal and a low frequency signal;
    所述第二开关、第三开关可选择性接通所述第二合路器,以实现中频信号与低频信号载波聚合;The second switch and the third switch can selectively turn on the second combiner to implement carrier aggregation of the intermediate frequency signal and the low frequency signal;
    所述第一开关、第二开关可选择性接通所述第一合路器,并且所述第三开关、所述第一合路器可选择性接通所述第二合路器,以实现高频信号、中频信号、低频信号载波聚合。The first switch and the second switch may selectively turn on the first combiner, and the third switch and the first combiner may selectively turn on the second combiner to Realize high frequency signal, intermediate frequency signal, low frequency signal carrier aggregation.
  2. 根据权利要求1所述的射频电路开关芯片,其中:The RF circuit switch chip of claim 1 wherein:
    所述第一开关与所述第一合路器的输入端、所述第二合路器的输入端连接;The first switch is connected to an input end of the first combiner and an input end of the second combiner;
    所述第二开关与所述第一合路器的输入端、所述第二合路器的输入端连接;The second switch is connected to an input end of the first combiner and an input end of the second combiner;
    所述第三开关与所述第二合路器的输入端连接;以及The third switch is coupled to an input of the second combiner;
    所述第一合路器的输出端与所述第二合路器的输入端连接。An output of the first combiner is coupled to an input of the second combiner.
  3. 根据权利要求2所述的射频电路开关芯片,其中,所述第一开关、第二开关、第三开关封装形成第一芯片。The radio frequency circuit switch chip of claim 2, wherein the first switch, the second switch, and the third switch package form a first chip.
  4. 根据权利要求2所述的射频电路开关芯片,其中,还包括开关组件,所述开关组件分别与所述第一开关、第二开关以及所述第一合路器的输入端和输出端、所述第二合路器的输入端连接。The radio frequency circuit switch chip of claim 2, further comprising a switch component, the switch component and the first switch, the second switch, and the input and output ends of the first combiner, respectively The input of the second combiner is connected.
  5. 根据权利要求4所述的射频电路开关芯片,其中,所述开关组件的第一输入端口、第二输入端口、第三输入端口分别与所述第一开关、第二开关、第一合路器的输出端连接,所述开关组件的第一输出端口、第二输出端口、第三输出端口分别与所述第一合路器的第一输入端口、所述第一合路器的第二输入端口、所述第二合路器的输入端连接。The radio frequency circuit switch chip according to claim 4, wherein the first input port, the second input port, and the third input port of the switch component are respectively connected to the first switch, the second switch, and the first combiner The output terminal is connected, the first output port, the second output port, and the third output port of the switch component are respectively connected to the first input port of the first combiner and the second input of the first combiner The port and the input end of the second combiner are connected.
  6. 根据权利要求5所述的射频电路开关芯片,其中:The RF circuit switch chip of claim 5 wherein:
    所述开关组件的第一输入端口可选择性接通所述开关组件的第一输出端口或第三输出端口;The first input port of the switch component can selectively turn on the first output port or the third output port of the switch component;
    所述开关组件的第二输入端口可选择性接通所述开关组件的第二输出端口或第三输出端口;The second input port of the switch component can selectively turn on the second output port or the third output port of the switch component;
    所述开关组件的第三输入端口可选择性接通所述开关组件的第三输出端口。A third input port of the switch assembly selectively turns on a third output port of the switch assembly.
  7. 根据权利要求6所述的射频电路开关芯片,其中,所述开关组件包括第一单刀双掷开关、第二单刀双掷开关以及单刀单掷开关;The radio frequency circuit switch chip according to claim 6, wherein the switch assembly comprises a first single pole double throw switch, a second single pole double throw switch, and a single pole single throw switch;
    所述第一单刀双掷开关的固定端与所述开关组件的第一输入端口连接,所述第一单刀双掷开关的选通端分别与所述开关组件的第一输出端口和第三输出端口连接;a fixed end of the first single pole double throw switch is connected to a first input port of the switch assembly, a gate end of the first single pole double throw switch and a first output port and a third output of the switch assembly respectively Port connection
    所述第二单刀双掷开关的固定端与所述开关组件的第二输入端口连接,所述第二单刀双掷开关的选通端分别与所述开关组件的第二输出端口和第三输出端口连接;a fixed end of the second single pole double throw switch is connected to a second input port of the switch assembly, and a gate end of the second single pole double throw switch is respectively connected to a second output port and a third output of the switch assembly Port connection
    所述单刀单掷开关的输入端和输出端分别与所述开关组件的第三输入端口和第三输出端口连接。An input end and an output end of the single-pole single-throw switch are respectively connected to a third input port and a third output port of the switch assembly.
  8. 根据权利要求6所述的射频电路开关芯片,其中,所述开关组件包括第一单刀单掷开关、第二单刀单掷开关以及单刀三掷开关;The RF circuit switch chip of claim 6 wherein said switch assembly comprises a first single pole single throw switch, a second single pole single throw switch, and a single pole triple throw switch;
    所述第一单刀单掷开关的输入端和输出端分别与所述开关组件的第一输入端口和第一输出端口连接;The input end and the output end of the first single-pole single-throw switch are respectively connected to the first input port and the first output port of the switch assembly;
    所述第二单刀单掷开关的输入端和输出端分别与所述开关组件的第二输入端口和第二输出端口连接;The input end and the output end of the second single-pole single-throw switch are respectively connected to the second input port and the second output port of the switch assembly;
    所述单刀三掷开关的固定端与所述开关组件的第三输出端口连接,所述单刀三掷开关的选通端分别与所述开关组件的第一输入端口、第二输入端口、第三输入端口连接。a fixed end of the single-pole three-throw switch is connected to a third output port of the switch assembly, and a gate end of the single-pole three-throw switch is respectively connected with a first input port, a second input port, and a third of the switch assembly Input port connection.
  9. 根据权利要求6所述的射频电路开关芯片,其中,所述开关组件包括五个单刀单掷开关,其中:The radio frequency circuit switch chip of claim 6 wherein said switch assembly comprises five single pole single throw switches, wherein:
    第一单刀单掷开关的输入端和输出端分别与所述开关组件的第一输入端口和第一输出端口连接;An input end and an output end of the first single-pole single-throw switch are respectively connected to the first input port and the first output port of the switch assembly;
    第二单刀单掷开关的输入端和输出端分别与所述开关组件的第二输入端口和第二输出端口连接;An input end and an output end of the second single-pole single-throw switch are respectively connected to the second input port and the second output port of the switch assembly;
    第三单刀单掷开关的输入端和输出端分别与所述开关组件的第二输入端口和第三输出端口连接;The input end and the output end of the third single-pole single-throw switch are respectively connected to the second input port and the third output port of the switch assembly;
    第四单刀单掷开关的输入端和输出端分别与所述开关组件的第一输入端口和第三输出端口连接;An input end and an output end of the fourth single-pole single-throw switch are respectively connected to the first input port and the third output port of the switch assembly;
    第五单刀单掷开关的输入端和输出端分别与所述开关组件的第三输入端口和第三输出端口连接。An input end and an output end of the fifth single-pole single-throw switch are respectively connected to the third input port and the third output port of the switch assembly.
  10. 根据权利要求4所述的射频电路开关芯片,其中,所述第一开关、第二开关、第三开关、开关组件封装形成第二芯片。The radio frequency circuit switch chip of claim 4, wherein the first switch, the second switch, the third switch, and the switch component package form a second chip.
  11. 根据权利要求1所述的射频电路开关芯片,其中,所述第一合路器、第二合路器均为双频合路器。The radio frequency circuit switch chip according to claim 1, wherein the first combiner and the second combiner are both dual frequency combiners.
  12. 一种射频电路,其中,所述射频电路包括射频收发器、射频电路开关芯片以及天线,所述射频收发器、射频电路开关芯片以及天线依次连接;A radio frequency circuit, wherein the radio frequency circuit comprises a radio frequency transceiver, a radio frequency circuit switch chip and an antenna, wherein the radio frequency transceiver, the radio frequency circuit switch chip and the antenna are connected in sequence;
    所述射频电路开关芯片包括第一开关、第二开关、第三开关、第一合路器以及第二合路器,所述第一开关、第二开关、第三开关可分别输出高频信号、中频信号、低频信号;The radio frequency circuit switch chip includes a first switch, a second switch, a third switch, a first combiner and a second combiner, wherein the first switch, the second switch, and the third switch respectively output high frequency signals , intermediate frequency signal, low frequency signal;
    所述第一开关、第二开关可选择性接通所述第一合路器,以实现高频信号与中频信号载波聚合;The first switch and the second switch may selectively turn on the first combiner to implement carrier aggregation of a high frequency signal and an intermediate frequency signal;
    所述第一开关、第三开关可选择性接通所述第二合路器,以实现高频信号与低频信号载波聚合;The first switch and the third switch may selectively turn on the second combiner to implement carrier aggregation of a high frequency signal and a low frequency signal;
    所述第二开关、第三开关可选择性接通所述第二合路器,以实现中频信号与低频信号载波聚合;The second switch and the third switch can selectively turn on the second combiner to implement carrier aggregation of the intermediate frequency signal and the low frequency signal;
    所述第一开关、第二开关可选择性接通所述第一合路器,并且所述第三开关、所述第一合路器可选择性接通所述第二合路器,以实现高频信号、中频信号、低频信号载波聚合。The first switch and the second switch may selectively turn on the first combiner, and the third switch and the first combiner may selectively turn on the second combiner to Realize high frequency signal, intermediate frequency signal, low frequency signal carrier aggregation.
  13. 根据权利要求12所述的射频电路,其中:The radio frequency circuit of claim 12 wherein:
    所述第一开关与所述第一合路器的输入端、所述第二合路器的输入端连接;The first switch is connected to an input end of the first combiner and an input end of the second combiner;
    所述第二开关与所述第一合路器的输入端、所述第二合路器的输入端连接;The second switch is connected to an input end of the first combiner and an input end of the second combiner;
    所述第三开关与所述第二合路器的输入端连接;以及The third switch is coupled to an input of the second combiner;
    所述第一合路器的输出端与所述第二合路器的输入端连接。An output of the first combiner is coupled to an input of the second combiner.
  14. 根据权利要求13所述的射频电路,其中,所述射频收发器包括高频端口、中频端口以及低频端口,所述高频端口与所述第一开关的输入端连接,所述中频端口与所述第二开关的输入端连接,所述低频端口与所述第三开关的输入端连接。The radio frequency circuit according to claim 13, wherein said radio frequency transceiver comprises a high frequency port, an intermediate frequency port and a low frequency port, said high frequency port being connected to an input end of said first switch, said intermediate frequency port and said The input end of the second switch is connected, and the low frequency port is connected to the input end of the third switch.
  15. 根据权利要求14所述的射频电路,其中:The radio frequency circuit of claim 14 wherein:
    所述高频端口包括N1个不同频段的子发射端口以及N1个不同频段的子接收端口,所述第一开关的输入端包括N1个子输入端口,所述N1个子发射端口与所述N1个子输入端口一一连接,所述N1个子接收端口与所述N1个子输入端口一一连接;The high frequency port includes a sub-transmitting port of N1 different frequency bands and a sub-receiving port of N1 different frequency bands, and the input end of the first switch includes N1 sub-input ports, the N1 sub-transmitting ports and the N1 sub-inputs The ports are connected one by one, and the N1 sub-receiving ports are connected to the N1 sub-input ports one by one;
    所述中频端口包括N2个不同频段的子发射端口以及N2个不同频段的子接收端口,所述第二开关的输入端包括N2个子输入端口,所述N2个子发射端口与所述N2个子输入端口一一连接,所述N2个子接收端口与所述N2个子输入端口一一连接;The intermediate frequency port includes a sub-transmitting port of N2 different frequency bands and a sub-receiving port of N2 different frequency bands, and the input end of the second switch includes N2 sub-input ports, the N2 sub-transmitting ports and the N2 sub-input ports One-to-one connection, the N2 sub-receiving ports are connected to the N2 sub-input ports one by one;
    所述低频端口包括N3个不同频段的子发射端口以及N3个不同频段的子接收端口,所述第三开关的输入端包括N3个子输入端口,所述N3个子发射端口与所述N3个子输入端口一一连接,所述N3个子接收端口与所述N3个子输入端口一一连接;The low frequency port includes a sub-transmission port of N3 different frequency bands and a sub-reception port of N3 different frequency bands, and the input end of the third switch includes N3 sub-input ports, the N3 sub-transmission ports and the N3 sub-input ports One-to-one connection, the N3 sub-receiving ports are connected to the N3 sub-input ports one by one;
    其中,N1、N2、N3均为大于1的自然数。Among them, N1, N2, and N3 are all natural numbers greater than 1.
  16. 根据权利要求15所述的射频电路,其中,每一个所述子发射端口与每一个对应的所述子输入端口之间还连接有功率放大器。The radio frequency circuit according to claim 15, wherein a power amplifier is further connected between each of said sub-transmission ports and each of said corresponding sub-input ports.
  17. 根据权利要求15所述的射频电路,其中,每一个所述子发射端口与每一个对应的所述子输入端口之间还连接有双工器或滤波器。The radio frequency circuit according to claim 15, wherein a duplexer or a filter is further connected between each of said sub-transmission ports and each of said corresponding sub-input ports.
  18. 根据权利要求12所述的射频电路,其中,所述第二合路器的输出端与所述天线连接。The radio frequency circuit of claim 12 wherein the output of said second combiner is coupled to said antenna.
  19. 一种天线装置,其中,所述天线装置包括权利要求12所述的射频电路。An antenna device, wherein the antenna device comprises the radio frequency circuit of claim 12.
  20. 一种电子设备,其中,所述电子设备包括壳体和电路板,所述电路板安装在所述壳体内部,所述电路板上设置有射频电路,所述射频电路为权利要求12所述的射频电路。An electronic device, wherein the electronic device includes a housing and a circuit board, the circuit board is mounted inside the housing, the circuit board is provided with a radio frequency circuit, and the radio frequency circuit is according to claim 12. RF circuit.
PCT/CN2017/083839 2017-05-10 2017-05-10 Radio frequency circuit switch chip, radio frequency circuit, antenna device, and electronic device WO2018205172A1 (en)

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CN204761429U (en) * 2015-06-24 2015-11-11 陈林 Terminal device
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