WO2018203496A1 - Connection structure for conductive member and electric compressor equipped with same - Google Patents

Connection structure for conductive member and electric compressor equipped with same Download PDF

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Publication number
WO2018203496A1
WO2018203496A1 PCT/JP2018/016660 JP2018016660W WO2018203496A1 WO 2018203496 A1 WO2018203496 A1 WO 2018203496A1 JP 2018016660 W JP2018016660 W JP 2018016660W WO 2018203496 A1 WO2018203496 A1 WO 2018203496A1
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WO
WIPO (PCT)
Prior art keywords
substrate
hole
conductive member
connection structure
base substrate
Prior art date
Application number
PCT/JP2018/016660
Other languages
French (fr)
Japanese (ja)
Inventor
裕司 佐々木
優 石川
良宣 松沢
雅明 宍戸
Original Assignee
株式会社Ihi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社Ihi filed Critical 株式会社Ihi
Publication of WO2018203496A1 publication Critical patent/WO2018203496A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28Clamped connections, spring connections
    • H01R4/30Clamped connections, spring connections utilising a screw or nut clamping member
    • H01R4/34Conductive members located under head of screw
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/42Conversion of dc power input into ac power output without possibility of reversal
    • H02M7/44Conversion of dc power input into ac power output without possibility of reversal by static converters
    • H02M7/48Conversion of dc power input into ac power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/04Arrangements of circuit components or wiring on supporting structure on conductive chassis

Definitions

  • the present disclosure relates to a connection structure of conductive members and an electric compressor including the same.
  • connection structure in which a terminal is connected to a copper pattern on an aluminum substrate.
  • the terminals are fixed to the copper pattern by soldering.
  • An H-shaped electrode pattern is formed on the copper pattern.
  • a terminal is soldered to this electrode pattern.
  • a metal substrate such as aluminum is excellent in heat dissipation, it can be adopted as an inverter or converter for large current.
  • a circuit made of copper foil or the like is formed on the front surface side of the substrate, and a base substrate is provided on the back surface side of the substrate.
  • a conductive member for example, a terminal
  • the conductive member is soldered to the surface of the substrate as described in Patent Document 1 above.
  • soldering is a connection method with some limitations.
  • the present disclosure describes a connection structure of a conductive member in which the degree of freedom of connection of a conductive member to a metal substrate is increased, and an electric compressor including the same.
  • One aspect of the present disclosure is a connection structure of a conductive member in which a conductive member is electrically connected to a circuit provided on a first surface of a substrate, and the substrate is disposed on the first surface side to form a circuit.
  • a conductive plate, an insulating layer, and a through hole penetrating the base substrate in the thickness direction are formed, and a hole communicating with the through hole is formed in the conductive member, and the conductive member is fixed to the substrate
  • a fixing member which is inserted into the through hole and the hole, and is provided at the shaft end including the first end on the first surface side and the second end on the second surface side, and at the first end of the shaft portion The first end, which is larger than the hole, is engaged with the conductive member, and is provided at the second end of the shaft, is larger than the through
  • a base member including an isolation portion surrounding the through hole and a peripheral portion surrounding the isolation portion, the base substrate comprising: A resin portion surrounding the isolation portion and reaching the insulating layer in the thickness direction is provided, and the second end portion of the fixing member is within the range of the resin portion and the isolation portion.
  • the degree of freedom in connection of the conductive member to the metal substrate is enhanced.
  • FIG. 1 is a cross-sectional view showing a connection structure according to an embodiment of the present disclosure.
  • FIG. 2 is a bottom view showing the connection structure of FIG.
  • FIG. 3 is a schematic view showing an example in which the connection structure of FIG. 1 is applied to an electric compressor.
  • FIG. 4 is a cross-sectional view showing a connection structure according to a comparative example.
  • One aspect of the present disclosure is a connection structure of a conductive member in which a conductive member is electrically connected to a circuit provided on a first surface of a substrate, and the substrate is disposed on the first surface side to form a circuit.
  • a conductive plate, an insulating layer, and a through hole penetrating the base substrate in the thickness direction are formed, and a hole communicating with the through hole is formed in the conductive member, and the conductive member is fixed to the substrate
  • a fixing member which is inserted into the through hole and the hole, and is provided at the shaft end including the first end on the first surface side and the second end on the second surface side, and at the first end of the shaft portion The first end, which is larger than the hole, is engaged with the conductive member, and is provided at the second end of the shaft, is larger than the through
  • a base member including an isolation portion surrounding the through hole and a peripheral portion surrounding the isolation portion, the base substrate comprising: A resin portion surrounding the isolation portion and reaching the insulating layer in the thickness direction is provided, and the second end portion of the fixing member is within the range of the resin portion and the isolation portion.
  • the substrate is formed with the conductive plate, the insulating layer, and the through hole penetrating the base substrate in the thickness direction.
  • the shaft portion of the fixing member is inserted into the through hole and the hole portion of the conductive member.
  • the first end and the second end provided at both ends of the shaft are locked on the conductive member and on the base substrate (more specifically, on the separation portion), whereby the conductive member is fixed to the substrate It is fixed.
  • the second end of the fixing member is in contact with the isolation portion of the base substrate, but the isolation portion is insulated with respect to the peripheral portion by the resin portion reaching the insulating layer.
  • the second end of the fixing member is in the range of the resin portion and the separating portion, and does not contact the peripheral portion.
  • the peripheral portion is insulated from the conductive member, the conductive plate, the fixing member and the isolation portion, and a short circuit between the circuit of the conductive plate and the peripheral portion of the base substrate does not occur.
  • the conductive member is connected using the through hole and the fixing member including the shaft portion, the limitation associated with the above-described conventional technology (for example, the solder connection structure) is alleviated.
  • the degree of freedom in connection of the conductive member to the metal substrate is enhanced.
  • the fixing member comprises a bolt including the shank and one of the first end and the second end, and a nut that is the other of the first end and the second end.
  • the conductive member is fixed to the substrate by screwing the shaft of the bolt with respect to the nut. In this case, the conductive member can be easily fastened and fixed to the substrate by the bolt and the nut.
  • the isolation portion is provided on the edge of the substrate in the direction orthogonal to the thickness direction, and the resin portion reaches the edge of the substrate.
  • the edge of the substrate is, for example, a side or a corner of the substrate. Since the resin portion is provided to reach the edge of the substrate, the resin portion and the isolation portion surrounded by the resin portion can be easily formed.
  • the standoffs are rectangular in shape.
  • the rectangular shaped separator has a larger area than when the separator is circular. Thus, it is suitable for the seat surface of the second end. Since the resin portion also has a rectangular shape, it is easy to form the resin portion. If the second end is rectangular in shape, the standoff may conform to the shape of the second end, thus minimizing its area. As a result, for example, the cooling performance by the peripheral portion can be sufficiently secured.
  • An electric compressor has a substrate, and a motor in which the conductive member is electrically connected to the substrate by the connection structure of any of the conductive members described above; Equipped with In this case, the degree of freedom of connection of the conductive members can be enhanced even for the electric compressor that can flow a large current.
  • connection structure 100 of the present embodiment will be described with reference to FIGS. 1 and 2.
  • the connection structure 100 is a structure for electrically connecting a terminal (conductive member) 40 to the substrate 1 which is a metal substrate.
  • the substrate 1 is, for example, a power substrate through which a large current flows.
  • the terminal 40 connected to the substrate 1 is a terminal for flowing a large current.
  • Terminal 40 may be, for example, a bus bar or the like.
  • the terminal 40 includes a flat connection portion 41 connected to the substrate 1 and a lead-out portion 42 provided continuously to the connection portion 41.
  • the terminal 40 is, for example, an L-shaped component, but the shape of the terminal 40 is not limited to the L-shape.
  • the lead portion 42 of the terminal 40 is connected to, for example, a power supply.
  • a plurality of terminals 40 may be connected to the substrate 1.
  • One or more connection structures 100 are provided on the side 1 c (see FIG. 2) of the substrate 1.
  • the connection structure 100 may be provided at the corner of the substrate 1.
  • the substrate 1 having a rectangular shape as a whole has edge portions such as the side portions 1c and corner portions.
  • the connection structure 100 is provided at these end edges.
  • the edge means an edge in a direction orthogonal to the thickness direction of the substrate 1.
  • the connection structure 100 may be provided in a portion other than the edge portion of the substrate 1, for example, in the central portion.
  • the substrate 1 includes a first surface 1a, which is a surface to which the terminal 40 is connected, and a second surface 1b opposite to the first surface 1a.
  • the substrate 1 has a metal base substrate 3 on the second surface 1 b side.
  • the second surface 1 b of the substrate 1 may be connected to a cooling unit (not shown) in a region excluding the separation unit 21 described later.
  • the substrate 1 includes a conductive plate 2 disposed on the first surface 1 a side, a metal base substrate 3 disposed on the second surface 1 b side, and an insulation disposed between the conductive plate 2 and the base substrate 3. And a layer 4.
  • the base substrate 3, the insulating layer 4 and the conductive plate 2 are stacked in this order and bonded to each other.
  • Conductive plate 2 includes a front surface 2 a corresponding to first surface 1 a and a back surface 2 b opposite to conductive plate 2.
  • Base substrate 3 includes a back surface 3 b corresponding to second surface 1 b and a front surface 3 a opposite to back surface 3 b.
  • Insulating layer 4 includes a front surface 4 a facing back surface 2 b of conductive plate 2 and a back surface 4 b opposite to front surface 3 a of base substrate 3 opposite to front surface 4 a.
  • the back surface 2 b of the conductive plate 2 and the surface 4 a of the insulating layer 4 are in contact with each other in a planar manner.
  • the front surface 3a of the base substrate 3 and the back surface 4b of the insulating layer 4 are in flat contact with each other.
  • Conductive plate 2 is, for example, a metal foil. Conductive plate 2 may be, for example, a copper foil or the like. The conductive plate 2 is formed with a circuit to which the terminal 40 is electrically connected.
  • Base substrate 3 is a substrate made of, for example, aluminum.
  • the base substrate 3 is attached to, for example, an apparatus to which the connection structure 100 is applied.
  • the base substrate 3 is a cooling unit that dissipates heat generated by an inverter, a converter, or the like.
  • the base substrate 3 may be connected to cooling means (not shown).
  • the base substrate 3 may be made of iron or copper.
  • Insulating layer 4 is made of, for example, a thermosetting resin. Insulating layer 4 may be made of, for example, an epoxy resin. The insulating layer 4 insulates the base substrate 3 from the conductive plate 2. As a material which constitutes insulating layer 4, other publicly known insulating materials may be used.
  • the connection structure 100 includes a fastening member (fixing member) 10 for fixing the terminal 40 to the substrate 1.
  • a fastening member fixing member
  • the bolt 13 and the nut (second end) 14 are used as the fastening member 10.
  • the fixing structure using the fastening member 10 will be described in detail.
  • a through hole 5 penetrating in the thickness direction is formed.
  • the through holes 5 are through holes penetrating the conductive plate 2, the insulating layer 4, and the base substrate 3 in the thickness direction. More specifically, in the conductive plate 2, for example, a cylindrical hole 2c is formed. In the insulating layer 4, for example, a cylindrical hole 4 c is formed. For example, a cylindrical hole 3 c is formed in the base substrate 3. The holes 2c, the holes 4c, and the holes 3c communicate with each other.
  • the through hole 5 of the substrate 1 is formed by combining the hole 2c, the hole 4c, and the hole 3c.
  • the axes of the hole 2c, the hole 4c, and the hole 3c may coincide with each other. That is, the hole 2c, the hole 4c, and the hole 3c may be formed concentrically with respect to one axis. The diameters of the hole 2c, the hole 4c, and the hole 3c may be equal.
  • connection portion 41 of the terminal 40 for example, a cylindrical hole portion 41c is formed.
  • the connection portion 41 is superimposed on the surface 2 a of the conductive plate 2 and is in contact with the circuit described above.
  • the hole 41 c is in communication with the through hole 5.
  • the shaft 12 of the bolt 13 of the fastening member 10 is inserted through the hole 41 c of the terminal 40 and the through hole 5 of the substrate 1.
  • the shaft portion 12 includes a first end disposed in the hole 41 c and a second end projecting from the second surface 1 b side of the through hole 5.
  • the bolt 13 includes a head (first end) 11 provided at a first end of the shaft 12.
  • the diameter of the head 11 (the width in the direction perpendicular to the axis of the shaft 12) is larger than the diameter of the hole 41c, for example, larger than the diameter of the through hole 5.
  • the head 11 is locked on the connection portion 41.
  • the head 11 may have a hexagonal shape that allows the rotary tool to be fitted. It is sufficient if a predetermined rotary tool can be fitted to the head 11.
  • the shape of the head 11 is not limited. For example, the shape of the head 11 may be dish-like.
  • the nut 14 is provided at the second end of the shaft 12.
  • the diameter of the nut 14 (the width in the direction perpendicular to the axis of the shaft 12) is larger than the diameter of the through hole 5, for example, larger than the diameter of the hole 41c.
  • the nut 14 is locked on the back surface 3 b of the base substrate 3.
  • connection portion 41 of the terminal 40 is fixed to the substrate 1 by screwing the bolt 13 into the nut 14.
  • the nut 14 disposed on the second surface 1 b side of the substrate 1 may be fixed to, for example, the back surface 3 b of the base substrate 3.
  • the nut 14 may be accommodated in a recess of a member separate from the substrate 1.
  • the nut 14 may be a floating nut.
  • the nut 14 is not limited to a hexagonal shape, and may be a square.
  • the head 11 of the bolt 13 is crimped (contacted) to the connecting portion 41 by the fastening force of the fastening member 10, and the nut 14 is crimped (contacted) to the base substrate 3.
  • the substrate 1 and the connection portion 41 are sandwiched and fixed by the head 11 and the nut 14.
  • the base substrate 3 includes an isolation portion 21 surrounding the through hole 5 and a peripheral portion 22 further enclosing the isolation portion 21.
  • the isolation portion 21 and the peripheral portion 22 are made of, for example, the same material and have the same thickness.
  • the isolation part 21 has, for example, a rectangular shape (see FIG. 2).
  • the peripheral portion 22 may be connected to cooling means (not shown).
  • a resin portion 30 is provided between the isolation portion 21 and the peripheral portion 22.
  • Resin portion 30 is made of, for example, a thermosetting resin.
  • Resin portion 30 may be filled, for example, without a gap between isolation portion 21 and peripheral portion 22.
  • Resin portion 30 may be made of, for example, an epoxy resin.
  • the material which comprises the resin part 30 is not restricted to an epoxy resin.
  • the resin portion 30 may be made of another thermosetting resin.
  • the resin portion 30 surrounds the isolation portion 21.
  • the two end faces 30c and 30c of the U-shaped (or C-shaped) resin portion 30 reach the side portion 1c.
  • the resin portion 30 reaches the insulating layer 4 in the thickness direction. That is, the resin portion 30 is in contact with the back surface 4 b of the insulating layer 4 over the entire length.
  • the resin portion 30 electrically insulates the isolation portion 21 from the peripheral portion 22.
  • the nut 14 of the fastening member 10 is within the range of the separating portion 21.
  • the nut 14 may be within the range of the resin portion 30 and the separating portion 21. That is, the size of the nut 14 and the sizes of the separating part 21 and the resin part 30 are set so that the nut 14 does not contact the peripheral part 22.
  • the circumscribed circle (the circle passing through each vertex) of the nut 14 may be within the range of the resin portion 30 and the separating portion 21. It is preferable that the circumscribed circle of the nut 14 does not extend beyond the resin portion 30.
  • the circumscribed circle of the nut 14 may be located inside the inner edge 30 b of the resin portion 30 or may intersect the inner edge 30 b but does not intersect the outer edge 30 a of the resin portion 30.
  • connection structure 100 a U-shaped (or C-shaped) hole (sag) is formed in the base substrate 3 (slit processing). Thereby, the area
  • the base substrate 3 is cut so as to cut both ends of the hole. Thus, a portion corresponding to the end face 30c is formed.
  • Insulating layer 4 is formed on surface 3 a of base substrate 3.
  • the resin portion 30 is formed in the hole. At this time, the resin portion 30 is formed to reach the insulating layer 4. Furthermore, a circuit is formed on the insulating layer 4. Then, in the central region surrounded by the resin portion 30, the through hole 5 penetrating in the thickness direction is formed.
  • the terminal 40 is placed on the substrate 1 by placing the connection portion 41 of the terminal 40 on the first surface 1 a of the substrate 1 and screwing the bolt 13 through the hole 41 c and the through hole 5 to the nut 14 disposed on the second surface 1 b side. It is fixed to 1.
  • connection structure 100 can be used for any electrical device.
  • the connection structure 100 may be applied to an electric compressor 50 in which a large current flows.
  • the electric compressor 50 compresses air and supplies the compressed air to an engine or the like.
  • the electric compressor 50 includes an inverter 54, a motor 52, and a compressor 51 connected to the motor 52 via a rotating shaft 53.
  • the inverter 54 converts direct current power supplied from the power supply 70 into alternating current power, and supplies the alternating current power to the motor 52.
  • the motor 52 is driven by being supplied with AC power from the inverter 54.
  • the compressor 51 attached to the rotating shaft 53 of the motor 52 is rotated by driving the motor 52.
  • the rotation of the compressor 51 compresses the air.
  • Connection structure 100 is provided, for example, in inverter 54.
  • the connection structure 100 may be provided between the power supply 70 and the inverter 54 and may be a structure for electrically connecting them (see virtual lines in FIG. 3).
  • the substrate 1 is formed with the through holes 5 penetrating the conductive plate 2, the insulating layer 4, and the base substrate 3 in the thickness direction.
  • the shaft 12 of the fastening member 10 is inserted into the through hole 5 and the hole 41 c of the terminal 40.
  • the head 40 and the nut 14 provided at both ends of the shaft portion 12 are locked on the terminal 40 and the base substrate 3 (more specifically, on the separation portion 21), so that the terminal 40 is mounted on the substrate 1 It is fixed.
  • the nut 14 of the fastening member 10 is in contact with the isolation portion 21 of the base substrate 3, but the isolation portion 21 is insulated from the peripheral portion 22 by the resin portion 30 reaching the insulating layer 4.
  • the nut 14 of the fastening member 10 is within the range of the resin portion 30 and the separating portion 21 and does not contact the peripheral portion 22. Therefore, the peripheral portion 22 is insulated from the terminal 40, the conductive plate 2, the fastening member 10, and the separation portion 21, and a short circuit between the circuit of the conductive plate 2 and the peripheral portion 22 of the base substrate 3 does not occur.
  • the terminal 40 is connected using the through hole 5 and the fastening member 10 including the shaft portion 12, the limitation associated with the above-described prior art (for example, the soldering connection structure) is alleviated.
  • the degree of freedom in connection of the terminal 40 to the metal substrate is enhanced.
  • the space of the fastening member 10 since the space of the fastening member 10 only needs to be secured, space saving is realized as compared with the case where the solder portion 210 is provided. In addition, even when a semiconductor element such as a MOSFET is mounted near the conductive member, the situation that the semiconductor element is damaged or destroyed by the heat for soldering is avoided. Further, as in the connection structure 200 shown in FIG. 4, the second connection member 202 which is a terminal of the external circuit is separately fastened by the fastening member 203 to the first connection member 201 soldered in the solder portion 210 It takes time and effort to weld. In the above embodiment, the terminals 40 can be connected with a simple configuration.
  • the peripheral portion 22 enhances the heat dissipation of the substrate 1.
  • the heat dissipation of the substrate 1 is further enhanced by the peripheral portion 22 being connected to the external cooling means and being cooled.
  • the terminal 40 can be easily fastened and fixed to the substrate 1 by the bolt 13 and the nut 14 of the fastening member 10.
  • the terminal 40 can be directly fastened to the substrate 1 by the bolt 13 and the nut 14.
  • the resin portion 30 is provided to reach the side portion 1 c of the substrate 1, the resin portion 30 and the isolation portion 21 surrounded by the resin portion 30 can be easily formed.
  • the rectangular separating portion 21 has a large area as compared with the case where the separating portion 21 is circular. Thus, it is suitable for the bearing surface of the nut 14. Since the resin portion 30 also has a rectangular shape, the resin portion 30 can be easily formed. If the nut 14 is rectangular in shape, the standoff 21 conforms to the shape of the nut 14 so that its area can be minimized. As a result, for example, the cooling performance by the peripheral portion 22 can be sufficiently secured.
  • connection structure 100 When the connection structure 100 is applied to the motor-driven compressor 50, the degree of freedom in connection of the terminal 40 is enhanced even for the motor-driven compressor 50 in which a large current can flow.
  • the terminal 40 can be easily connected to a power substrate (metal substrate) that can be employed for the inverter 54 of the electric compressor 50.
  • the peripheral portion 22 enhances the heat dissipation of the substrate 1.
  • the heat dissipation of the substrate 1 is further enhanced by the peripheral portion 22 being connected to the external cooling means and being cooled.
  • the present disclosure is not limited to the above embodiment.
  • the shape of the isolation may be any other shape.
  • the separator may not be provided at the end of the substrate 1.
  • the configuration of the fixing member may be changed as appropriate.
  • the shaft portion and the second end may be integrated, a bolt may be inserted from the second surface 1 b side of the substrate 1, and a nut may be provided on the connection portion 41 side of the terminal 40.
  • a nut corresponding to the first end and a nut corresponding to the second end may be screwed into the stud bolt.
  • Other than the fastening member may be adopted.
  • a rivet structure or a socket structure may be employed.
  • a caulking structure may be employed.
  • connection structure 100 may be applied to a noncontact power feeding system or the like.
  • the freedom of connection of the conductive member to the metal substrate is enhanced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Inverter Devices (AREA)
  • Compressor (AREA)

Abstract

In the connection structure according to the present invention, a substrate has a through-hole formed therein that penetrates a conductor plate, an insulation layer, and a base substrate in the respective thickness directions thereof. The connection structure is provided with a fastening member which comprises: a shaft part inserted into a hole part and into the through-hole; a head part which is provided to a first end of the shaft part and which is locked on a connection part; and a nut which is provided to a second end of the shaft part and which is locked on the base substrate. The base substrate comprises: an isolation part surrounding the through-hole; and a peripheral part surrounding the isolation part. Provided between the isolation part and the peripheral part is a resin part that surrounds the isolation part and extends to reach the insulation layer in the thickness direction. The nut of the fastening member is configured to be within the ranges of the resin part and the isolation part.

Description

導電部材の接続構造およびそれを備える電動コンプレッサConnection structure of conductive members and electric compressor including the same
 本開示は、導電部材の接続構造およびそれを備える電動コンプレッサに関する。 The present disclosure relates to a connection structure of conductive members and an electric compressor including the same.
 特許文献1に記載されるように、アルミニウム基板上の銅パターンに端子が接続された接続構造が知られている。この接続構造では、端子は、銅パターンにはんだ付けで固定される。銅パターンには、H形状の電極パターンが形成される。この電極パターンに、端子がはんだ付けされる。 As described in Patent Document 1, there is known a connection structure in which a terminal is connected to a copper pattern on an aluminum substrate. In this connection structure, the terminals are fixed to the copper pattern by soldering. An H-shaped electrode pattern is formed on the copper pattern. A terminal is soldered to this electrode pattern.
実開平5-79974号公報Japanese Utility Model Application Publication No. 5-79974
 アルミニウム等の金属製基板は、放熱性に優れるため、大電流用のインバータやコンバータ等に採用され得る。たとえば基板の表面側に銅箔等からなる回路が形成され、基板の裏面側にベース基板が設けられる。その回路に外部回路を電気的に接続する場合、導電部材(たとえば端子)が用いられる。導電部材は、上記特許文献1に記載されるように、基板の表面にはんだ付けされる。 Since a metal substrate such as aluminum is excellent in heat dissipation, it can be adopted as an inverter or converter for large current. For example, a circuit made of copper foil or the like is formed on the front surface side of the substrate, and a base substrate is provided on the back surface side of the substrate. When an external circuit is electrically connected to the circuit, a conductive member (for example, a terminal) is used. The conductive member is soldered to the surface of the substrate as described in Patent Document 1 above.
 一般に、大電流が流れる導電部材のサイズは大きい。また放熱性の良いベース基板に対するはんだ付けには、大きな熱量が必要である。また、たとえば導電部材の近くにMOSFET(Metal-Oxide-semiconductor field-effect transistor)等の半導体素子が実装されている場合には、はんだ付けのための熱で半導体素子が損傷する虞もある。このように、はんだ付けは、いくつかの制限を伴う接続方法である。 Generally, the size of the conductive member through which a large current flows is large. In addition, a large amount of heat is required for soldering to a base substrate with good heat dissipation. Further, for example, when a semiconductor element such as a MOSFET (Metal-Oxide-semiconductor field-effect transistor) is mounted near a conductive member, the semiconductor element may be damaged by heat for soldering. Thus, soldering is a connection method with some limitations.
 本開示は、金属製基板に対する導電部材の接続の自由度が高められた導電部材の接続構造およびそれを備える電動コンプレッサを説明する。 The present disclosure describes a connection structure of a conductive member in which the degree of freedom of connection of a conductive member to a metal substrate is increased, and an electric compressor including the same.
 本開示の一態様は、基板の第1面に設けられた回路に導電部材が電気的に接続される導電部材の接続構造であって、基板は、第1面側に配置されて回路が形成された導電板と、第1面とは反対の第2面側に配置された金属製のベース基板と、導電板とベース基板との間に配置された絶縁層と、を有し、基板には、導電板、絶縁層、およびベース基板を厚み方向に貫通する貫通孔が形成されており、導電部材には貫通孔に連通する孔部が形成されており、基板に対して導電部材を固定する固定部材であって、貫通孔および孔部に挿通され、第1面側の第1端と第2面側の第2端とを含む軸部と、軸部の第1端に設けられ、孔部よりも大きく、導電部材上に係止された第1端部と、軸部の第2端に設けられ、貫通孔よりも大きく、ベース基板上に係止された第2端部と、を含む固定部材を備え、ベース基板は、貫通孔を取り囲む隔離部と、隔離部を取り囲む周辺部とを含み、隔離部と周辺部との間には、隔離部を取り囲むと共に厚み方向において絶縁層に達する樹脂部が設けられ、固定部材の第2端部は、樹脂部および隔離部の範囲内に収まっている。 One aspect of the present disclosure is a connection structure of a conductive member in which a conductive member is electrically connected to a circuit provided on a first surface of a substrate, and the substrate is disposed on the first surface side to form a circuit. A conductive base plate made of metal, a base substrate made of metal disposed on the second side opposite to the first side, and an insulating layer disposed between the conductive plate and the base base plate; A conductive plate, an insulating layer, and a through hole penetrating the base substrate in the thickness direction are formed, and a hole communicating with the through hole is formed in the conductive member, and the conductive member is fixed to the substrate A fixing member, which is inserted into the through hole and the hole, and is provided at the shaft end including the first end on the first surface side and the second end on the second surface side, and at the first end of the shaft portion The first end, which is larger than the hole, is engaged with the conductive member, and is provided at the second end of the shaft, is larger than the through hole, and is formed on the base substrate. And a base member including an isolation portion surrounding the through hole and a peripheral portion surrounding the isolation portion, the base substrate comprising: A resin portion surrounding the isolation portion and reaching the insulating layer in the thickness direction is provided, and the second end portion of the fixing member is within the range of the resin portion and the isolation portion.
 本開示の一態様によれば、金属製基板に対する導電部材の接続の自由度が高められる。 According to one aspect of the present disclosure, the degree of freedom in connection of the conductive member to the metal substrate is enhanced.
図1は、本開示の一実施形態に係る接続構造を示す断面図である。FIG. 1 is a cross-sectional view showing a connection structure according to an embodiment of the present disclosure. 図2は、図1の接続構造を示す底面図である。FIG. 2 is a bottom view showing the connection structure of FIG. 図3は、図1の接続構造が電動コンプレッサに適用された例を示す模式図である。FIG. 3 is a schematic view showing an example in which the connection structure of FIG. 1 is applied to an electric compressor. 図4は、比較例に係る接続構造を示す断面図である。FIG. 4 is a cross-sectional view showing a connection structure according to a comparative example.
 本開示の一態様は、基板の第1面に設けられた回路に導電部材が電気的に接続される導電部材の接続構造であって、基板は、第1面側に配置されて回路が形成された導電板と、第1面とは反対の第2面側に配置された金属製のベース基板と、導電板とベース基板との間に配置された絶縁層と、を有し、基板には、導電板、絶縁層、およびベース基板を厚み方向に貫通する貫通孔が形成されており、導電部材には貫通孔に連通する孔部が形成されており、基板に対して導電部材を固定する固定部材であって、貫通孔および孔部に挿通され、第1面側の第1端と第2面側の第2端とを含む軸部と、軸部の第1端に設けられ、孔部よりも大きく、導電部材上に係止された第1端部と、軸部の第2端に設けられ、貫通孔よりも大きく、ベース基板上に係止された第2端部と、を含む固定部材を備え、ベース基板は、貫通孔を取り囲む隔離部と、隔離部を取り囲む周辺部とを含み、隔離部と周辺部との間には、隔離部を取り囲むと共に厚み方向において絶縁層に達する樹脂部が設けられ、固定部材の第2端部は、樹脂部および隔離部の範囲内に収まっている。 One aspect of the present disclosure is a connection structure of a conductive member in which a conductive member is electrically connected to a circuit provided on a first surface of a substrate, and the substrate is disposed on the first surface side to form a circuit. A conductive base plate made of metal, a base substrate made of metal disposed on the second side opposite to the first side, and an insulating layer disposed between the conductive plate and the base base plate; A conductive plate, an insulating layer, and a through hole penetrating the base substrate in the thickness direction are formed, and a hole communicating with the through hole is formed in the conductive member, and the conductive member is fixed to the substrate A fixing member, which is inserted into the through hole and the hole, and is provided at the shaft end including the first end on the first surface side and the second end on the second surface side, and at the first end of the shaft portion The first end, which is larger than the hole, is engaged with the conductive member, and is provided at the second end of the shaft, is larger than the through hole, and is formed on the base substrate. And a base member including an isolation portion surrounding the through hole and a peripheral portion surrounding the isolation portion, the base substrate comprising: A resin portion surrounding the isolation portion and reaching the insulating layer in the thickness direction is provided, and the second end portion of the fixing member is within the range of the resin portion and the isolation portion.
 この導電部材の接続構造によれば、基板には、導電板、絶縁層、およびベース基板を厚み方向に貫通する貫通孔が形成されている。この貫通孔および導電部材の孔部に、固定部材の軸部が挿通される。軸部の両端に設けられた第1端部および第2端部が導電部材上およびベース基板上に(より詳細には隔離部上に)係止されることにより、導電部材が基板に対して固定される。固定部材の第2端部はベース基板の隔離部に接触するが、隔離部は、絶縁層に達する樹脂部によって、周辺部に対して絶縁されている。固定部材の第2端部は、樹脂部および隔離部の範囲内に収まっており、周辺部に接触することはない。したがって、周辺部は、導電部材、導電板、固定部材および隔離部から絶縁されており、導電板の回路とベース基板の周辺部との短絡は生じない。このように貫通孔と、軸部を含む固定部材とを用いて導電部材が接続されるため、上記した従来技術(たとえばはんだ付け接続構造)に伴う制限は軽減されている。よって、金属製基板に対する導電部材の接続の自由度が高められている。 According to the connection structure of the conductive members, the substrate is formed with the conductive plate, the insulating layer, and the through hole penetrating the base substrate in the thickness direction. The shaft portion of the fixing member is inserted into the through hole and the hole portion of the conductive member. The first end and the second end provided at both ends of the shaft are locked on the conductive member and on the base substrate (more specifically, on the separation portion), whereby the conductive member is fixed to the substrate It is fixed. The second end of the fixing member is in contact with the isolation portion of the base substrate, but the isolation portion is insulated with respect to the peripheral portion by the resin portion reaching the insulating layer. The second end of the fixing member is in the range of the resin portion and the separating portion, and does not contact the peripheral portion. Therefore, the peripheral portion is insulated from the conductive member, the conductive plate, the fixing member and the isolation portion, and a short circuit between the circuit of the conductive plate and the peripheral portion of the base substrate does not occur. As described above, since the conductive member is connected using the through hole and the fixing member including the shaft portion, the limitation associated with the above-described conventional technology (for example, the solder connection structure) is alleviated. Thus, the degree of freedom in connection of the conductive member to the metal substrate is enhanced.
 いくつかの態様において、固定部材は、軸部と第1端部および第2端部のいずれか一方とを含むボルトと、第1端部および第2端部のいずれか他方であるナットと、を有し、ナットに対してボルトの軸部がねじ込まれることにより基板に対して導電部材を固定する。この場合、ボルトおよびナットにより、基板に対して導電部材を容易に締結固定できる。 In some embodiments, the fixing member comprises a bolt including the shank and one of the first end and the second end, and a nut that is the other of the first end and the second end. The conductive member is fixed to the substrate by screwing the shaft of the bolt with respect to the nut. In this case, the conductive member can be easily fastened and fixed to the substrate by the bolt and the nut.
 いくつかの態様において、隔離部は、厚み方向に直交する方向における基板の端縁部に設けられ、樹脂部は基板の端縁部に達する。基板の端縁部とは、たとえば、基板の辺部や角部である。樹脂部は基板の端縁部に達するように設けられるので、樹脂部、および、樹脂部に取り囲まれた隔離部を容易に形成することができる。 In some embodiments, the isolation portion is provided on the edge of the substrate in the direction orthogonal to the thickness direction, and the resin portion reaches the edge of the substrate. The edge of the substrate is, for example, a side or a corner of the substrate. Since the resin portion is provided to reach the edge of the substrate, the resin portion and the isolation portion surrounded by the resin portion can be easily formed.
 いくつかの態様において、隔離部は矩形形状をなす。矩形形状の隔離部は、隔離部が円形である場合に比して、その面積が大きい。よって、第2端部の座面に適している。樹脂部も矩形形状となるので、樹脂部を形成しやすい。第2端部が矩形形状である場合は、隔離部は、第2端部の形状に適合するので、その面積を最小限とすることができる。その結果として、たとえば周辺部による冷却性能を十分に確保することができる。 In some embodiments, the standoffs are rectangular in shape. The rectangular shaped separator has a larger area than when the separator is circular. Thus, it is suitable for the seat surface of the second end. Since the resin portion also has a rectangular shape, it is easy to form the resin portion. If the second end is rectangular in shape, the standoff may conform to the shape of the second end, thus minimizing its area. As a result, for example, the cooling performance by the peripheral portion can be sufficiently secured.
 本開示の別の態様に係る電動コンプレッサは、基板を有し、上記のいずれかの導電部材の接続構造によって基板に導電部材が電気的に接続されたモータと、モータに連結されたコンプレッサと、を備える。この場合、大電流が流され得る電動コンプレッサに対しても、導電部材の接続の自由度が高められる。 An electric compressor according to another aspect of the present disclosure has a substrate, and a motor in which the conductive member is electrically connected to the substrate by the connection structure of any of the conductive members described above; Equipped with In this case, the degree of freedom of connection of the conductive members can be enhanced even for the electric compressor that can flow a large current.
 以下、本開示の実施形態について、図面を参照しながら説明する。なお、図面の説明において同一要素には同一符号を付し、重複する説明は省略する。 Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the description of the drawings, the same elements will be denoted by the same reference symbols and redundant description will be omitted.
 図1および図2を参照して、本実施形態の接続構造100について説明する。接続構造100は、金属製基板である基板1に端子(導電部材)40を電気的に接続するための構造である。基板1は、たとえば、大電流が流されるパワー基板である。基板1に接続される端子40は、大電流を流すための端子である。端子40は、たとえばバスバ等であってもよい。 The connection structure 100 of the present embodiment will be described with reference to FIGS. 1 and 2. The connection structure 100 is a structure for electrically connecting a terminal (conductive member) 40 to the substrate 1 which is a metal substrate. The substrate 1 is, for example, a power substrate through which a large current flows. The terminal 40 connected to the substrate 1 is a terminal for flowing a large current. Terminal 40 may be, for example, a bus bar or the like.
 端子40は、基板1に接続される平板状の接続部41と、接続部41に連続して設けられた引出部42とを有する。端子40は、たとえばL字状の部品であるが、端子40の形状はL字状に限られない。端子40の引出部42は、たとえば電源に接続される。 The terminal 40 includes a flat connection portion 41 connected to the substrate 1 and a lead-out portion 42 provided continuously to the connection portion 41. The terminal 40 is, for example, an L-shaped component, but the shape of the terminal 40 is not limited to the L-shape. The lead portion 42 of the terminal 40 is connected to, for example, a power supply.
 基板1には、複数の端子40が接続されてもよい。1つまたは複数の接続構造100は、基板1の辺部1c(図2参照)に設けられる。接続構造100は、基板1の角部に設けられてもよい。全体として矩形形状の基板1は、辺部1cや角部等の端縁部を有する。接続構造100は、これらの端縁部に設けられる。端縁部とは、基板1の厚み方向に直交する方向における端縁部を意味する。なお、接続構造100が、基板1の端縁部以外の部分、たとえば中央部に設けられてもよい。 A plurality of terminals 40 may be connected to the substrate 1. One or more connection structures 100 are provided on the side 1 c (see FIG. 2) of the substrate 1. The connection structure 100 may be provided at the corner of the substrate 1. The substrate 1 having a rectangular shape as a whole has edge portions such as the side portions 1c and corner portions. The connection structure 100 is provided at these end edges. The edge means an edge in a direction orthogonal to the thickness direction of the substrate 1. The connection structure 100 may be provided in a portion other than the edge portion of the substrate 1, for example, in the central portion.
 基板1は、端子40が接続される面である第1面1aと、第1面1aとは反対の第2面1bとを含む。基板1は、第2面1b側に金属製のベース基板3を有する。これにより、基板1の放熱性が高められている。基板1の第2面1bは、後述の隔離部21を除く領域において、図示しない冷却手段に接続されてもよい。 The substrate 1 includes a first surface 1a, which is a surface to which the terminal 40 is connected, and a second surface 1b opposite to the first surface 1a. The substrate 1 has a metal base substrate 3 on the second surface 1 b side. Thus, the heat dissipation of the substrate 1 is enhanced. The second surface 1 b of the substrate 1 may be connected to a cooling unit (not shown) in a region excluding the separation unit 21 described later.
 基板1は、第1面1a側に配置された導電板2と、第2面1b側に配置された金属製のベース基板3と、導電板2とベース基板3との間に配置された絶縁層4とを有する。ベース基板3、絶縁層4および導電板2は、この順に積層され、互いに接合されている。導電板2は、第1面1aに相当する表面2aと、導電板2とは反対の裏面2bとを含む。ベース基板3は、第2面1bに相当する裏面3bと、裏面3bとは反対の表面3aとを含む。絶縁層4は、導電板2の裏面2bに対面する表面4aと、表面4aとは反対でベース基板3の表面3aに対面する裏面4bとを含む。導電板2の裏面2bと絶縁層4の表面4aとは平面状に接触している。ベース基板3の表面3aと絶縁層4の裏面4bとは平面状に接触している。 The substrate 1 includes a conductive plate 2 disposed on the first surface 1 a side, a metal base substrate 3 disposed on the second surface 1 b side, and an insulation disposed between the conductive plate 2 and the base substrate 3. And a layer 4. The base substrate 3, the insulating layer 4 and the conductive plate 2 are stacked in this order and bonded to each other. Conductive plate 2 includes a front surface 2 a corresponding to first surface 1 a and a back surface 2 b opposite to conductive plate 2. Base substrate 3 includes a back surface 3 b corresponding to second surface 1 b and a front surface 3 a opposite to back surface 3 b. Insulating layer 4 includes a front surface 4 a facing back surface 2 b of conductive plate 2 and a back surface 4 b opposite to front surface 3 a of base substrate 3 opposite to front surface 4 a. The back surface 2 b of the conductive plate 2 and the surface 4 a of the insulating layer 4 are in contact with each other in a planar manner. The front surface 3a of the base substrate 3 and the back surface 4b of the insulating layer 4 are in flat contact with each other.
 導電板2は、たとえば金属箔である。導電板2は、たとえば銅箔等であってもよい。導電板2には、端子40が電気的に接続される回路が形成されている。 Conductive plate 2 is, for example, a metal foil. Conductive plate 2 may be, for example, a copper foil or the like. The conductive plate 2 is formed with a circuit to which the terminal 40 is electrically connected.
 ベース基板3は、たとえばアルミニウム製の基板である。ベース基板3は、たとえば、接続構造100が適用される機器に取り付けられる。ベース基板3は、インバータやコンバータ等で発生する熱を放散させる冷却部である。ベース基板3は、図示しない冷却手段に接続されてもよい。ベース基板3は、鉄または銅などからなってもよい。 Base substrate 3 is a substrate made of, for example, aluminum. The base substrate 3 is attached to, for example, an apparatus to which the connection structure 100 is applied. The base substrate 3 is a cooling unit that dissipates heat generated by an inverter, a converter, or the like. The base substrate 3 may be connected to cooling means (not shown). The base substrate 3 may be made of iron or copper.
 絶縁層4は、たとえば熱硬化性樹脂からなる。絶縁層4は、たとえばエポキシ樹脂からなってもよい。絶縁層4は、導電板2に対してベース基板3を絶縁する。絶縁層4を構成する材料としては、他の公知の絶縁材料が用いられてもよい。 Insulating layer 4 is made of, for example, a thermosetting resin. Insulating layer 4 may be made of, for example, an epoxy resin. The insulating layer 4 insulates the base substrate 3 from the conductive plate 2. As a material which constitutes insulating layer 4, other publicly known insulating materials may be used.
 接続構造100は、基板1に対して端子40を固定するための締結部材(固定部材)10を備える。本実施形態では、締結部材10として、ボルト13およびナット(第2端部)14が用いられる。以下、締結部材10を用いた固定構造について詳細に説明する。 The connection structure 100 includes a fastening member (fixing member) 10 for fixing the terminal 40 to the substrate 1. In the present embodiment, the bolt 13 and the nut (second end) 14 are used as the fastening member 10. Hereinafter, the fixing structure using the fastening member 10 will be described in detail.
 図1に示されるように、基板1には、その厚み方向に貫通する貫通孔5が形成されている。貫通孔5は、導電板2、絶縁層4、およびベース基板3を厚み方向に貫通するスルーホールである。より詳細には、導電板2には、たとえば円筒状の孔部2cが形成されている。絶縁層4には、たとえば円筒状の孔部4cが形成されている。ベース基板3には、たとえば円筒状の孔部3cが形成されている。これらの孔部2c、孔部4c、および孔部3cは、互いに連通している。孔部2c、孔部4c、および孔部3cが合わさって、基板1の貫通孔5が形成されている。 As shown in FIG. 1, in the substrate 1, a through hole 5 penetrating in the thickness direction is formed. The through holes 5 are through holes penetrating the conductive plate 2, the insulating layer 4, and the base substrate 3 in the thickness direction. More specifically, in the conductive plate 2, for example, a cylindrical hole 2c is formed. In the insulating layer 4, for example, a cylindrical hole 4 c is formed. For example, a cylindrical hole 3 c is formed in the base substrate 3. The holes 2c, the holes 4c, and the holes 3c communicate with each other. The through hole 5 of the substrate 1 is formed by combining the hole 2c, the hole 4c, and the hole 3c.
 これらの孔部2c、孔部4c、および孔部3cの各軸線は一致してもよい。すなわち、孔部2c、孔部4c、および孔部3cが1本の軸線に対して同心状に形成されてもよい。孔部2c、孔部4c、および孔部3cの各直径は等しくてもよい。 The axes of the hole 2c, the hole 4c, and the hole 3c may coincide with each other. That is, the hole 2c, the hole 4c, and the hole 3c may be formed concentrically with respect to one axis. The diameters of the hole 2c, the hole 4c, and the hole 3c may be equal.
 一方、端子40の接続部41には、たとえば円筒状の孔部41cが形成されている。接続部41は導電板2の表面2aに重ねられており、上記した回路に接触している。孔部41cは貫通孔5に連通している。 On the other hand, in the connection portion 41 of the terminal 40, for example, a cylindrical hole portion 41c is formed. The connection portion 41 is superimposed on the surface 2 a of the conductive plate 2 and is in contact with the circuit described above. The hole 41 c is in communication with the through hole 5.
 締結部材10のボルト13の軸部12は、端子40の孔部41cおよび基板1の貫通孔5に挿通されている。軸部12は、孔部41cに配置される第1端と、貫通孔5の第2面1b側から突出する第2端とを含む。ボルト13は、軸部12の第1端に設けられた頭部(第1端部)11を含む。頭部11の直径(軸部12の軸線に垂直な方向の幅)は、孔部41cの直径よりも大きく、たとえば貫通孔5の直径よりも大きい。頭部11は、接続部41上に係止されている。頭部11は、回転工具が嵌合可能な六角形状をなしてもよい。頭部11に所定の回転工具が嵌合可能であればよい。頭部11の形状は限定されない。たとえば頭部11の形状は皿状であってもよい。 The shaft 12 of the bolt 13 of the fastening member 10 is inserted through the hole 41 c of the terminal 40 and the through hole 5 of the substrate 1. The shaft portion 12 includes a first end disposed in the hole 41 c and a second end projecting from the second surface 1 b side of the through hole 5. The bolt 13 includes a head (first end) 11 provided at a first end of the shaft 12. The diameter of the head 11 (the width in the direction perpendicular to the axis of the shaft 12) is larger than the diameter of the hole 41c, for example, larger than the diameter of the through hole 5. The head 11 is locked on the connection portion 41. The head 11 may have a hexagonal shape that allows the rotary tool to be fitted. It is sufficient if a predetermined rotary tool can be fitted to the head 11. The shape of the head 11 is not limited. For example, the shape of the head 11 may be dish-like.
 ナット14は、軸部12の第2端に設けられている。ナット14の直径(軸部12の軸線に垂直な方向の幅)は、貫通孔5の直径よりも大きく、たとえば孔部41cの直径よりも大きい。ナット14は、ベース基板3の裏面3b上に係止されている。 The nut 14 is provided at the second end of the shaft 12. The diameter of the nut 14 (the width in the direction perpendicular to the axis of the shaft 12) is larger than the diameter of the through hole 5, for example, larger than the diameter of the hole 41c. The nut 14 is locked on the back surface 3 b of the base substrate 3.
 接続構造100では、ナット14に対してボルト13がねじ込まれることにより、基板1に対して端子40の接続部41が固定されている。基板1の第2面1b側に配置されるナット14は、たとえばベース基板3の裏面3bに固定されていてもよい。ナット14は、基板1とは別体の部材の凹部に収容されていてもよい。この場合、ナット14はフローティングナットであってもよい。ナット14は六角形状に限られず、四角形であってもよい。ナット14を工具等で把持する必要のない構成を採用すれば、たとえば基板1の第2面1b側のスペースが限られている場合でも、締付けの作業性は確保される。 In the connection structure 100, the connection portion 41 of the terminal 40 is fixed to the substrate 1 by screwing the bolt 13 into the nut 14. The nut 14 disposed on the second surface 1 b side of the substrate 1 may be fixed to, for example, the back surface 3 b of the base substrate 3. The nut 14 may be accommodated in a recess of a member separate from the substrate 1. In this case, the nut 14 may be a floating nut. The nut 14 is not limited to a hexagonal shape, and may be a square. By adopting a configuration in which the nut 14 does not need to be gripped by a tool or the like, for example, even when the space on the second surface 1 b side of the substrate 1 is limited, the workability of tightening can be ensured.
 締結部材10の締結力により、ボルト13の頭部11は接続部41に圧着(接触)しており、ナット14はベース基板3に圧着(接触)している。基板1および接続部41は、頭部11およびナット14によって挟まれ、固定されている。 The head 11 of the bolt 13 is crimped (contacted) to the connecting portion 41 by the fastening force of the fastening member 10, and the nut 14 is crimped (contacted) to the base substrate 3. The substrate 1 and the connection portion 41 are sandwiched and fixed by the head 11 and the nut 14.
 ここで、図1および図2に示されるように、ベース基板3は、貫通孔5を取り囲む隔離部21と、隔離部21を更に取り囲む周辺部22とを含む。隔離部21および周辺部22は、たとえば、同じ材料からなり、同じ厚みを有する。隔離部21は、たとえば、矩形形状をなす(図2参照)。周辺部22は、図示しない冷却手段に接続されてもよい。 Here, as shown in FIG. 1 and FIG. 2, the base substrate 3 includes an isolation portion 21 surrounding the through hole 5 and a peripheral portion 22 further enclosing the isolation portion 21. The isolation portion 21 and the peripheral portion 22 are made of, for example, the same material and have the same thickness. The isolation part 21 has, for example, a rectangular shape (see FIG. 2). The peripheral portion 22 may be connected to cooling means (not shown).
 隔離部21と周辺部22との間には、樹脂部30が設けられている。樹脂部30は、たとえば熱硬化性樹脂からなる。樹脂部30は、隔離部21と周辺部22との間に、たとえば隙間なく充填されてもよい。樹脂部30は、たとえばエポキシ樹脂からなってもよい。なお、樹脂部30を構成する材料はエポキシ樹脂に限られない。樹脂部30は、他の熱硬化性樹脂からなってもよい。 A resin portion 30 is provided between the isolation portion 21 and the peripheral portion 22. Resin portion 30 is made of, for example, a thermosetting resin. Resin portion 30 may be filled, for example, without a gap between isolation portion 21 and peripheral portion 22. Resin portion 30 may be made of, for example, an epoxy resin. In addition, the material which comprises the resin part 30 is not restricted to an epoxy resin. The resin portion 30 may be made of another thermosetting resin.
 図2に示されるように、樹脂部30は、隔離部21を取り囲んでいる。基板1の辺部1cに設けられた接続構造100において、U字状(またはC字状)をなす樹脂部30の2つの端面30c,30cは、辺部1cに達している。また、図1に示されるように、樹脂部30は、厚み方向において絶縁層4に達している。すなわち、樹脂部30は、その全長にわたって、絶縁層4の裏面4bに接触している。樹脂部30は、周辺部22に対して隔離部21を電気的に絶縁する。 As shown in FIG. 2, the resin portion 30 surrounds the isolation portion 21. In the connection structure 100 provided on the side portion 1c of the substrate 1, the two end faces 30c and 30c of the U-shaped (or C-shaped) resin portion 30 reach the side portion 1c. Further, as shown in FIG. 1, the resin portion 30 reaches the insulating layer 4 in the thickness direction. That is, the resin portion 30 is in contact with the back surface 4 b of the insulating layer 4 over the entire length. The resin portion 30 electrically insulates the isolation portion 21 from the peripheral portion 22.
 締結部材10のナット14は、隔離部21の範囲内に収まっている。ナット14は、樹脂部30および隔離部21の範囲内に収まっていればよい。すなわち、ナット14は、周辺部22に接触しないように、ナット14の大きさと隔離部21および樹脂部30の大きさとが設定されている。言い換えれば、ナット14の外接円(各頂点を通る円)が樹脂部30および隔離部21の範囲内に収まっていればよい。ナット14の外接円が樹脂部30よりはみ出なければよい。ナット14の外接円は、樹脂部30の内縁部30bより内側に位置するか、または内縁部30bに交差してもよいが、樹脂部30の外縁部30aには交差しない。 The nut 14 of the fastening member 10 is within the range of the separating portion 21. The nut 14 may be within the range of the resin portion 30 and the separating portion 21. That is, the size of the nut 14 and the sizes of the separating part 21 and the resin part 30 are set so that the nut 14 does not contact the peripheral part 22. In other words, the circumscribed circle (the circle passing through each vertex) of the nut 14 may be within the range of the resin portion 30 and the separating portion 21. It is preferable that the circumscribed circle of the nut 14 does not extend beyond the resin portion 30. The circumscribed circle of the nut 14 may be located inside the inner edge 30 b of the resin portion 30 or may intersect the inner edge 30 b but does not intersect the outer edge 30 a of the resin portion 30.
 続いて、接続構造100の製造方法について説明する。まず、ベース基板3にU字状(またはC字状)の孔部(ざぐり)が形成される(スリット加工)。これにより、樹脂部30に相当する領域が形成される。この孔部の両端部を切断するように、ベース基板3が切断される。これにより、端面30cに相当する部分が形成される。ベース基板3の表面3a上に、絶縁層4が形成される。続いて、孔部に樹脂部30が形成される。このとき、樹脂部30は、絶縁層4に達するように形成される。さらに絶縁層4上に回路が形成される。そして、樹脂部30に囲まれた中央の領域に、厚み方向に貫通する貫通孔5が形成される。基板1の第1面1aに端子40の接続部41をあてがい、孔部41cおよび貫通孔5にボルト13を通して、第2面1b側に配置したナット14に対してねじ込むことにより、端子40が基板1に固定される。 Subsequently, a method of manufacturing the connection structure 100 will be described. First, a U-shaped (or C-shaped) hole (sag) is formed in the base substrate 3 (slit processing). Thereby, the area | region corresponded to the resin part 30 is formed. The base substrate 3 is cut so as to cut both ends of the hole. Thus, a portion corresponding to the end face 30c is formed. Insulating layer 4 is formed on surface 3 a of base substrate 3. Subsequently, the resin portion 30 is formed in the hole. At this time, the resin portion 30 is formed to reach the insulating layer 4. Furthermore, a circuit is formed on the insulating layer 4. Then, in the central region surrounded by the resin portion 30, the through hole 5 penetrating in the thickness direction is formed. The terminal 40 is placed on the substrate 1 by placing the connection portion 41 of the terminal 40 on the first surface 1 a of the substrate 1 and screwing the bolt 13 through the hole 41 c and the through hole 5 to the nut 14 disposed on the second surface 1 b side. It is fixed to 1.
 接続構造100は、あらゆる電気機器に用いられ得る。たとえば、図3に示されるように、接続構造100は、大電流が流される電動コンプレッサ50に適用されてもよい。電動コンプレッサ50は、空気を圧縮し、圧縮した空気をエンジン等に供給する。電動コンプレッサ50は、インバータ54と、モータ52と、回転軸53を介してモータ52に連結されたコンプレッサ51と、を含む。インバータ54は、電源70から供給された直流の電力を交流電力に変換し、交流電力をモータ52に供給する。モータ52は、インバータ54から交流電力を供給されることにより駆動する。モータ52の回転軸53に取り付けられたコンプレッサ51は、モータ52が駆動することで回転する。コンプレッサ51の回転により、空気が圧縮される。接続構造100は、たとえばインバータ54に設けられる。なお、接続構造100は、電源70とインバータ54との間に設けられて、これらを電気的に接続するための構造であってもよい(図3中の仮想線参照)。 The connection structure 100 can be used for any electrical device. For example, as shown in FIG. 3, the connection structure 100 may be applied to an electric compressor 50 in which a large current flows. The electric compressor 50 compresses air and supplies the compressed air to an engine or the like. The electric compressor 50 includes an inverter 54, a motor 52, and a compressor 51 connected to the motor 52 via a rotating shaft 53. The inverter 54 converts direct current power supplied from the power supply 70 into alternating current power, and supplies the alternating current power to the motor 52. The motor 52 is driven by being supplied with AC power from the inverter 54. The compressor 51 attached to the rotating shaft 53 of the motor 52 is rotated by driving the motor 52. The rotation of the compressor 51 compresses the air. Connection structure 100 is provided, for example, in inverter 54. The connection structure 100 may be provided between the power supply 70 and the inverter 54 and may be a structure for electrically connecting them (see virtual lines in FIG. 3).
 端子40の接続構造100によれば、基板1には、導電板2、絶縁層4、およびベース基板3を厚み方向に貫通する貫通孔5が形成されている。この貫通孔5および端子40の孔部41cに、締結部材10の軸部12が挿通される。軸部12の両端に設けられた頭部11およびナット14が端子40上およびベース基板3上に(より詳細には隔離部21上に)係止されることにより、端子40が基板1に対して固定される。締結部材10のナット14はベース基板3の隔離部21に接触するが、隔離部21は、絶縁層4に達する樹脂部30によって、周辺部22に対して絶縁されている。締結部材10のナット14は、樹脂部30および隔離部21の範囲内に収まっており、周辺部22に接触することはない。したがって、周辺部22は、端子40、導電板2、締結部材10および隔離部21から絶縁されており、導電板2の回路とベース基板3の周辺部22との短絡は生じない。このように貫通孔5と、軸部12を含む締結部材10とを用いて端子40が接続されるため、上記した従来技術(たとえばはんだ付け接続構造)に伴う制限は軽減されている。よって、金属製基板に対する端子40の接続の自由度が高められている。 According to the connection structure 100 of the terminal 40, the substrate 1 is formed with the through holes 5 penetrating the conductive plate 2, the insulating layer 4, and the base substrate 3 in the thickness direction. The shaft 12 of the fastening member 10 is inserted into the through hole 5 and the hole 41 c of the terminal 40. The head 40 and the nut 14 provided at both ends of the shaft portion 12 are locked on the terminal 40 and the base substrate 3 (more specifically, on the separation portion 21), so that the terminal 40 is mounted on the substrate 1 It is fixed. The nut 14 of the fastening member 10 is in contact with the isolation portion 21 of the base substrate 3, but the isolation portion 21 is insulated from the peripheral portion 22 by the resin portion 30 reaching the insulating layer 4. The nut 14 of the fastening member 10 is within the range of the resin portion 30 and the separating portion 21 and does not contact the peripheral portion 22. Therefore, the peripheral portion 22 is insulated from the terminal 40, the conductive plate 2, the fastening member 10, and the separation portion 21, and a short circuit between the circuit of the conductive plate 2 and the peripheral portion 22 of the base substrate 3 does not occur. As described above, since the terminal 40 is connected using the through hole 5 and the fastening member 10 including the shaft portion 12, the limitation associated with the above-described prior art (for example, the soldering connection structure) is alleviated. Thus, the degree of freedom in connection of the terminal 40 to the metal substrate is enhanced.
 たとえば、締結部材10のスペースが確保されればよいので、はんだ部210が設けられる場合に比して、省スペースが実現される。また、導電部材の近くにMOSFET等の半導体素子が実装されている場合でも、はんだ付けのための熱で半導体素子が損傷する又は破壊されるといった事態が回避される。また、図4に示される接続構造200のように、はんだ部210においてはんだ付けされた第1接続部材201に対して、外部回路の端子である第2接続部材202を別途締結部材203によって締結あるいは溶接する手間が必要である。上記実施形態では、簡易な構成で端子40を接続することができる。端子40をはんだ付けする必要がなくなり、基板1の実装工程で過度な熱量が不要となり、他の実装部品への熱ストレスが軽減される。基板1へのバスバ等の端子40の接続が容易になり、基板1および端子40の形状設計自由度が広がる。さらに、周辺部22は基板1の放熱性を高める。周辺部22が外部の冷却手段に接続され、冷却されることで、基板1の放熱性は更に高められる。 For example, since the space of the fastening member 10 only needs to be secured, space saving is realized as compared with the case where the solder portion 210 is provided. In addition, even when a semiconductor element such as a MOSFET is mounted near the conductive member, the situation that the semiconductor element is damaged or destroyed by the heat for soldering is avoided. Further, as in the connection structure 200 shown in FIG. 4, the second connection member 202 which is a terminal of the external circuit is separately fastened by the fastening member 203 to the first connection member 201 soldered in the solder portion 210 It takes time and effort to weld. In the above embodiment, the terminals 40 can be connected with a simple configuration. There is no need to solder the terminals 40, and an excessive amount of heat is not required in the mounting process of the substrate 1, and the thermal stress on other mounted components is reduced. The connection of the terminal 40 such as a bus bar to the substrate 1 is facilitated, and the freedom in shape design of the substrate 1 and the terminal 40 is expanded. Furthermore, the peripheral portion 22 enhances the heat dissipation of the substrate 1. The heat dissipation of the substrate 1 is further enhanced by the peripheral portion 22 being connected to the external cooling means and being cooled.
 締結部材10のボルト13およびナット14により、基板1に対して端子40を容易に締結固定できる。ボルト13およびナット14によって端子40を基板1に直接締結できる。 The terminal 40 can be easily fastened and fixed to the substrate 1 by the bolt 13 and the nut 14 of the fastening member 10. The terminal 40 can be directly fastened to the substrate 1 by the bolt 13 and the nut 14.
 樹脂部30は基板1の辺部1cに達するように設けられるので、樹脂部30、および、樹脂部30に取り囲まれた隔離部21を容易に形成することができる。 Since the resin portion 30 is provided to reach the side portion 1 c of the substrate 1, the resin portion 30 and the isolation portion 21 surrounded by the resin portion 30 can be easily formed.
 矩形形状の隔離部21は、隔離部21が円形である場合に比して、その面積が大きい。よって、ナット14の座面に適している。樹脂部30も矩形形状となるので、樹脂部30を形成しやすい。ナット14が矩形形状である場合は、隔離部21は、ナット14の形状に適合するので、その面積を最小限とすることができる。その結果として、たとえば周辺部22による冷却性能を十分に確保することができる。 The rectangular separating portion 21 has a large area as compared with the case where the separating portion 21 is circular. Thus, it is suitable for the bearing surface of the nut 14. Since the resin portion 30 also has a rectangular shape, the resin portion 30 can be easily formed. If the nut 14 is rectangular in shape, the standoff 21 conforms to the shape of the nut 14 so that its area can be minimized. As a result, for example, the cooling performance by the peripheral portion 22 can be sufficiently secured.
 電動コンプレッサ50に接続構造100が適用された場合、大電流が流され得る電動コンプレッサ50に対しても、端子40の接続の自由度が高められる。たとえば、電動コンプレッサ50のインバータ54に採用され得るパワー基板(金属製基板)に対しても端子40を容易に接続できる。周辺部22は基板1の放熱性を高める。周辺部22が外部の冷却手段に接続され、冷却されることで、基板1の放熱性は更に高められる。 When the connection structure 100 is applied to the motor-driven compressor 50, the degree of freedom in connection of the terminal 40 is enhanced even for the motor-driven compressor 50 in which a large current can flow. For example, the terminal 40 can be easily connected to a power substrate (metal substrate) that can be employed for the inverter 54 of the electric compressor 50. The peripheral portion 22 enhances the heat dissipation of the substrate 1. The heat dissipation of the substrate 1 is further enhanced by the peripheral portion 22 being connected to the external cooling means and being cooled.
 本開示の実施形態について説明したが、本開示は上記実施形態に限られない。たとえば、隔離部の形状は他のいかなる形状であってもよい。隔離部は、基板1の端部に設けられなくてもよい。 Although the embodiment of the present disclosure has been described, the present disclosure is not limited to the above embodiment. For example, the shape of the isolation may be any other shape. The separator may not be provided at the end of the substrate 1.
 固定部材の構成は適宜、変更され得る。たとえば、軸部と第2端部が一体になっており、ボルトが基板1の第2面1b側から挿入され、端子40の接続部41側にナットが設けられてもよい。スタッドボルトに対して、第1端部に相当するナットと、第2端部に相当するナットとがねじ込まれてもよい。締結部材以外が採用されてもよい。たとえば、リベット構造やソケット構造が採用されてもよい。かしめ構造が採用されてもよい。 The configuration of the fixing member may be changed as appropriate. For example, the shaft portion and the second end may be integrated, a bolt may be inserted from the second surface 1 b side of the substrate 1, and a nut may be provided on the connection portion 41 side of the terminal 40. A nut corresponding to the first end and a nut corresponding to the second end may be screwed into the stud bolt. Other than the fastening member may be adopted. For example, a rivet structure or a socket structure may be employed. A caulking structure may be employed.
 接続構造100は、非接触給電システム等に適用されてもよい。 The connection structure 100 may be applied to a noncontact power feeding system or the like.
 本開示のいくつかの態様によれば、金属製基板に対する導電部材の接続の自由度が高められる。 According to some aspects of the present disclosure, the freedom of connection of the conductive member to the metal substrate is enhanced.
1 基板
1a 第1面
1b 第2面
1c 辺部(端縁部)
2 導電板
3 ベース基板
4 絶縁層
5 貫通孔
10 締結部材(固定部材)
11 頭部(第1端部)
12 軸部
13 ボルト
14 ナット(第2端部)
21 隔離部
22 周辺部
30 樹脂部
40 端子(導電部材)
41c 孔部
50 電動コンプレッサ
51 コンプレッサ
52 モータ
100 接続構造
1 substrate 1a first surface 1b second surface 1c side portion (edge portion)
2 conductive plate 3 base substrate 4 insulating layer 5 through hole 10 fastening member (fixing member)
11 head (first end)
12 shaft portion 13 bolt 14 nut (second end)
21 separation portion 22 peripheral portion 30 resin portion 40 terminal (conductive member)
41c hole 50 electric compressor 51 compressor 52 motor 100 connection structure

Claims (5)

  1.  基板の第1面に設けられた回路に導電部材が電気的に接続される導電部材の接続構造であって、
     前記基板は、
     前記第1面側に配置されて前記回路が形成された導電板と、
     前記第1面とは反対の第2面側に配置された金属製のベース基板と、
     前記導電板と前記ベース基板との間に配置された絶縁層と、を有し、
     前記基板には、前記導電板、前記絶縁層、および前記ベース基板を厚み方向に貫通する貫通孔が形成されており、前記導電部材には前記貫通孔に連通する孔部が形成されており、
     前記基板に対して前記導電部材を固定する固定部材であって、前記貫通孔および前記孔部に挿通され、前記第1面側の第1端と前記第2面側の第2端とを含む軸部と、前記軸部の前記第1端に設けられ、前記孔部よりも大きく、前記導電部材上に係止された第1端部と、前記軸部の前記第2端に設けられ、前記貫通孔よりも大きく、前記ベース基板上に係止された第2端部と、を含む前記固定部材を備え、
     前記ベース基板は、前記貫通孔を取り囲む隔離部と、前記隔離部を取り囲む周辺部とを含み、
     前記隔離部と前記周辺部との間には、前記隔離部を取り囲むと共に前記厚み方向において前記絶縁層に達する樹脂部が設けられ、
     前記固定部材の前記第2端部は、前記樹脂部および前記隔離部の範囲内に収まっている、導電部材の接続構造。
    A connection structure of a conductive member in which the conductive member is electrically connected to a circuit provided on the first surface of the substrate,
    The substrate is
    A conductive plate disposed on the first surface side and having the circuit formed thereon;
    A metal base substrate disposed on a second surface opposite to the first surface;
    An insulating layer disposed between the conductive plate and the base substrate;
    In the substrate, a through hole penetrating the conductive plate, the insulating layer, and the base substrate in a thickness direction is formed, and in the conductive member, a hole communicating with the through hole is formed.
    A fixing member for fixing the conductive member to the substrate, which is inserted into the through hole and the hole and includes a first end on the first surface side and a second end on the second surface side. A shaft portion, the first end portion of the shaft portion provided at the first end, the first end portion being larger than the hole and engaged on the conductive member, and provided at the second end of the shaft portion; And a second end portion larger than the through hole and locked on the base substrate.
    The base substrate includes an isolation portion surrounding the through hole and a peripheral portion surrounding the isolation portion.
    Between the isolation portion and the peripheral portion, a resin portion which surrounds the isolation portion and reaches the insulating layer in the thickness direction is provided.
    The connection structure of a conductive member, wherein the second end of the fixing member is within the range of the resin portion and the separating portion.
  2.  前記固定部材は、
     前記軸部と前記第1端部および前記第2端部のいずれか一方とを含むボルトと、
     前記第1端部および前記第2端部のいずれか他方であるナットと、を有し、
     前記ナットに対して前記ボルトの前記軸部がねじ込まれることにより前記基板に対して前記導電部材を固定する、請求項1に記載の導電部材の接続構造。
    The fixing member is
    A bolt including the shaft and any one of the first end and the second end;
    And a nut that is the other of the first end and the second end,
    The connection structure of a conductive member according to claim 1, wherein the conductive member is fixed to the substrate by screwing the shaft portion of the bolt with respect to the nut.
  3.  前記隔離部は、前記厚み方向に直交する方向における前記基板の端縁部に設けられ、前記樹脂部は前記基板の前記端縁部に達する、請求項1または2に記載の導電部材の接続構造。 The connection structure for a conductive member according to claim 1 or 2, wherein the isolation portion is provided at an edge of the substrate in a direction orthogonal to the thickness direction, and the resin portion reaches the edge of the substrate. .
  4.  前記隔離部は矩形形状をなす、請求項1~3のいずれか一項に記載の導電部材の接続構造。 The connection structure of a conductive member according to any one of claims 1 to 3, wherein the separation part has a rectangular shape.
  5.  前記基板を有し、請求項1~4のいずれか一項に記載の導電部材の接続構造によって前記基板に前記導電部材が電気的に接続されたモータと、
     前記モータに連結されたコンプレッサと、を備える電動コンプレッサ。
    A motor comprising the substrate and the conductive member electrically connected to the substrate by the conductive member connection structure according to any one of claims 1 to 4.
    And a compressor coupled to the motor.
PCT/JP2018/016660 2017-05-01 2018-04-24 Connection structure for conductive member and electric compressor equipped with same WO2018203496A1 (en)

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CN111952737A (en) * 2020-06-30 2020-11-17 安徽佰尧电子科技有限公司 Electric automobile motor terminal connection structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237507A (en) * 2005-02-28 2006-09-07 Mitsubishi Heavy Ind Ltd Structure using soldering
JP2015048811A (en) * 2013-09-03 2015-03-16 株式会社Ihi Electric centrifugal compressor device and compressor motor control method
JP2016012721A (en) * 2014-06-03 2016-01-21 住友ベークライト株式会社 Metal-based mounting board and method of manufacturing metal-based mounting board
JP2016154091A (en) * 2015-02-20 2016-08-25 株式会社オートネットワーク技術研究所 Ground structure
JP2016197520A (en) * 2015-04-02 2016-11-24 株式会社豊田自動織機 Power storage device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006237507A (en) * 2005-02-28 2006-09-07 Mitsubishi Heavy Ind Ltd Structure using soldering
JP2015048811A (en) * 2013-09-03 2015-03-16 株式会社Ihi Electric centrifugal compressor device and compressor motor control method
JP2016012721A (en) * 2014-06-03 2016-01-21 住友ベークライト株式会社 Metal-based mounting board and method of manufacturing metal-based mounting board
JP2016154091A (en) * 2015-02-20 2016-08-25 株式会社オートネットワーク技術研究所 Ground structure
JP2016197520A (en) * 2015-04-02 2016-11-24 株式会社豊田自動織機 Power storage device

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