WO2018198604A1

WO2018198604A1 - Laminated balun

Info

Publication number: WO2018198604A1
Application number: PCT/JP2018/010977
Authority: WO
Inventors: 谷口　哲夫; 清弘樫内; 博志増田
Original assignee: 株式会社村田製作所
Priority date: 2017-04-26
Filing date: 2018-03-20
Publication date: 2018-11-01
Also published as: TW201843929A; TWI712261B

Abstract

A plurality of inductor electrodes formed between the layers of a laminate (1) includes: inductor electrodes (4d, 4j) electrically connected between an unbalanced terminal (UB) and a first ground terminal (G1); an inductor electrode (4g) electrically connected between a first terminal (Tx1) and a second terminal (Tx2) of a first balanced terminal (Tx); and an inductor electrode (4h) electrically connected between a first terminal (Rx1) and a second terminal (Rx2) of a second balanced terminal (Rx). When viewed from the lamination direction of dielectric layers (1a-1p), the region enclosed by the inductor electrodes (4d, 4j) overlaps the region enclosed by the inductor electrode (4g) and the region enclosed by the inductor electrode (4h). The inductor electrodes (4g, 4h) are formed between the same layers of the laminate (1).

Description

Laminated balun

The present invention relates to a laminated balun that performs signal conversion between an unbalanced signal and a balanced signal.

In the RF (Radio Frequency) circuit of communication equipment and its peripheral circuits, a balanced line may be used as a signal line in order to reduce the influence of external noise. For example, the Rx signal may be input from the antenna to the RF circuit and the Tx signal may be output from the RF circuit to the antenna through a balanced line.

Conventionally, in this case, when it is desired to share the transmission of the Tx signal and the reception of the Rx signal with one antenna, it is necessary to branch the unbalanced line from the antenna into two unbalanced lines by a divider. Then, a multilayer balance filter as disclosed in, for example, Japanese Patent Laid-Open No. 2013-138410 (Patent Document 1) is connected to each unbalanced line, and further, each multilayer balance filter is connected to an RF circuit via a balanced line. To do.

FIG. 6 is an equivalent circuit diagram of the laminated balance filter 200 disclosed in Japanese Patent Laid-Open No. 2013-138410. The laminated balance filter 200 has one unbalanced terminal UB and a balanced terminal B composed of a first terminal B1 and a second terminal B2. The laminated balance filter 200 outputs the unbalanced signal input to the unbalanced terminal UB as a balanced signal from the balanced terminal B (first terminal B1 and second terminal B2), and the balanced terminal B (first terminal B1 and second terminal). The balanced signal input to the terminal B2) is output as an unbalanced signal from the unbalanced terminal UB. The laminated balance filter 200 is manufactured by forming an inductor conductor pattern, a capacitor conductor pattern, a ground conductor pattern, a via conductor pattern, and the like inside a laminate in which a plurality of dielectric layers are laminated. Between the unbalanced terminal UB and the balanced terminal B, band-pass filters LC1 and LC2 configured by LC parallel resonators are inserted. A mutual inductance M10 is generated between the inductor L10 of the bandpass filter LC1 and the inductor L20 of the bandpass filter LC2, and a mutual inductance M20 is generated between the inductor L20 and the balanced inductor L30.

FIG. 7 is a diagram illustrating an example of a balanced / unbalanced conversion circuit configured by connecting one divider 300 and two stacked balanced filters 200.

The divider 300 includes a first terminal 101, a second terminal 102, and a third terminal 103. The divider 300 distributes a signal input to the first terminal 101 and outputs the signal from the second terminal 102 and the third terminal 103. 102, the signals input to the third terminal 103 are combined and output from the first terminal.

In this balanced / unbalanced conversion circuit, the antenna Ant and the first terminal 101 of the divider 300 are connected by an unbalanced line. The second terminal 102 of the divider 300 and the unbalanced terminal UB of one laminated balance filter 200 are connected by an unbalanced line, and the third terminal 103 of the divider 300 and the unbalanced terminal UB of the other laminated balance filter 200 are connected to each other. Are connected by an unbalanced line. Further, a balanced line on the Tx side is connected to the balanced terminal B (first terminal B1 and second terminal B2) of one multilayer balanced filter 200, and the balanced terminal B (first terminal B1 and first terminal B1) of the other multilayer balanced filter 200 is connected. A balanced line on the Rx side is connected to the two terminals B2).

JP 2013-138410 A

Like the balance-unbalance conversion circuit shown in FIG. 7, the output of the Tx signal from the RF circuit and the input of the Rx signal to the RF circuit are performed by a balanced line, and the transmission of the Tx signal and the reception of the Rx signal are performed. In the conventional method using one divider 300 and two laminated balance filters 200 in order to share one antenna Ant, there are the following problems.

First, since the signal line connected to the antenna Ant is branched by the divider 300, there is a problem that insertion loss occurs in the signal. For example, the Rx signal sent from the antenna Ant to the RF circuit has been attenuated by about 3 dB by passing through the divider. Furthermore, since each insertion balance filter 200 also has an insertion loss, there is a problem that the total insertion loss becomes large.

Furthermore, since one divider 300 and two laminated balance filters 200 must be used and the number of parts is large, there is a problem that a large mounting space is required in the communication device and the communication device becomes large. . Furthermore, since there are many parts, there existed a problem that manufacture became complicated.

The present disclosure has been made to solve the above-described problem, and an object thereof is to provide a small-sized laminated balun including an unbalanced terminal and two pairs of balanced terminals and having a small signal insertion loss. To do.

A multilayer balun according to an aspect of the present disclosure includes a multilayer body in which a plurality of dielectric layers are stacked, a plurality of inductor conductor patterns formed between layers of the multilayer body, and a plurality of layers formed on a surface of the multilayer body. Terminal. The plurality of terminals include an unbalanced terminal, a first balanced terminal, a second balanced terminal, and a ground terminal. Each of the first balanced terminal and the second balanced terminal has a first terminal and a second terminal. The plurality of inductor conductor patterns include at least one unbalanced inductor conductor pattern electrically connected between the unbalanced terminal and the ground terminal, the first terminal of the first balanced terminal, and the first terminal. A first balanced-side inductor conductor pattern electrically connected between the first balanced terminal and the second terminal; and the second balanced terminal first terminal and the second balanced terminal second terminal. And a second balanced inductor conductor pattern electrically connected therebetween. When viewed from the stacking direction of the plurality of dielectric layers, at least a part of a region surrounded by the first balanced-side inductor conductor pattern overlaps a region surrounded by the at least one unbalanced-side inductor conductive pattern, At least a part of the region surrounded by the second balanced inductor conductor pattern overlaps the region surrounded by the at least one unbalanced inductor conductor pattern. The first balanced inductor conductor pattern and the second balanced inductor conductor pattern are formed between the same layers of the multilayer body.

Preferably, the plurality of dielectric layers include first to third dielectric layers that are successively stacked. The at least one unbalanced inductor conductor pattern includes an inductor conductor pattern formed between the first dielectric layer and the second dielectric layer. The first balanced-side inductor conductor pattern and the second balanced-side inductor conductor pattern are formed between the second dielectric layer and the third dielectric layer.

Preferably, the plurality of dielectric layers include a fourth dielectric layer stacked on the opposite side of the third dielectric layer from the second dielectric layer. The at least one unbalanced inductor conductor pattern includes a first unbalanced inductor conductor pattern and a second unbalanced inductor conductor pattern. The first unbalanced inductor conductor pattern is formed between the first dielectric layer and the second dielectric layer. The second unbalanced inductor conductor pattern is formed between the third dielectric layer and the fourth dielectric layer.

Preferably, at least one unbalanced inductor conductor pattern has a shape in which two open annular portions are connected. At least a part of a region surrounded by the first balanced-side inductor conductor pattern overlaps a region surrounded by one annular portion of at least one unbalanced-side inductor conductor pattern. At least a portion of the region surrounded by the second balanced-side inductor conductor pattern overlaps with the region surrounded by the other annular portion of the at least one unbalanced-side inductor conductor pattern.

Although the multilayer balun of the present disclosure includes an unbalanced terminal and two pairs of balanced terminals, since no divider is used, there is no signal insertion loss due to passing through the divider, and overall insertion loss is reduced. small.

Furthermore, the multilayer balun according to the present disclosure is configured such that the function conventionally performed by using one divider and two baluns is performed by one balun, and the size is reduced. Therefore, in a communication device in which the multilayer balun of the present disclosure is mounted, the space required for mounting can be reduced.

1 is an equivalent circuit diagram of a laminated balun according to an embodiment of the present invention. It is an external appearance perspective view of a laminated balun. It is a disassembled perspective view of a laminated balun. It is a disassembled perspective view which shows the modification of a laminated balun. It is a disassembled perspective view which shows a part of another modification of a lamination | stacking balun. 6 is an equivalent circuit diagram of a multilayer balance filter described in Patent Document 1. FIG. It is an equivalent circuit diagram showing an example of a balun circuit configured by connecting one divider and two laminated balance filters.

Embodiments of the present invention will be described in detail with reference to the drawings. Note that the same or corresponding parts in the drawings are denoted by the same reference numerals and description thereof will not be repeated. Each embodiment shows an embodiment of the present invention exemplarily, and the present invention is not limited to the content of the embodiment. Moreover, it is also possible to implement combining the content described in different embodiment, and the implementation content in that case is also included in this invention. Further, the drawings are for helping understanding of the embodiment, and may not be drawn strictly. For example, a drawn component or a dimensional ratio between the components may not match the dimensional ratio described in the specification. In addition, the constituent elements described in the specification may be omitted in the drawings or may be drawn with the number omitted.

1 to 3 show a laminated balun 100 according to an embodiment of the present invention. However, FIG. 1 is an equivalent circuit diagram of the laminated balun 100 according to the embodiment of the present invention. FIG. 2 is an external perspective view of the laminated balun 100. FIG. 3 is an exploded perspective view of the laminated balun 100.

First, an equivalent circuit of the laminated balun 100 will be described with reference to FIG. The laminated balun 100 includes one unbalanced terminal UB. The laminated balun 100 includes a first balanced terminal Tx having a first terminal Tx1 and a second terminal Tx2, and a second balanced terminal Rx having a first terminal Rx1 and a second terminal Rx2. In the present embodiment, two pairs of balanced terminals are shown as a first balanced terminal Tx and a second balanced terminal Rx for convenience, but the usage of each balanced terminal is arbitrary, and the first balanced terminal is designated as Tx. The terminal is not limited to using the second balanced terminal as the Rx terminal.

The laminated balun 100 includes a low-pass filter. The low-pass filter includes a first inductor L1, a first capacitor C1 inserted between one end of the first inductor L1 and the ground, and a second capacitor inserted between the other end of the first inductor L1 and the ground. And C2. One end of the first inductor L1 (one end of the first capacitor C1) is connected to the unbalanced terminal UB. With this low-pass filter, the laminated balun 100 can pass only signals in an arbitrarily selected frequency band.

In this embodiment, a π-type low-pass filter is employed as the low-pass filter, but the type of the low-pass filter is not limited to the π-type, and other types may be used.

The multilayer balun 100 includes a third capacitor C3 connected in parallel with the first inductor L1 of the low-pass filter. The third capacitor C3 is for forming a trap on the high frequency side outside the pass band of the low-pass filter, and for improving the function of the low-pass filter.

The multilayer balun 100 includes an unbalanced inductor L2. The unbalanced inductor L2 is connected in parallel with the second capacitor C2 of the low pass filter. The unbalanced inductor L2 and the second capacitor C2 connected in parallel constitute an LC parallel resonator.

The multilayer balun 100 includes a first balanced-side inductor in which a first inductor portion L31, a second inductor portion L32, and a third inductor portion L33 are connected in series. The first balanced-side inductor is connected between the first terminal Tx1 and the second terminal Tx2 of the first balanced terminal Tx. In the present embodiment, a DC feed terminal DCfeed is connected to an intermediate portion of the second inductor portion L32.

Furthermore, the multilayer balun 100 includes a second balanced-side inductor in which a first inductor portion L41, a second inductor portion L42, and a third inductor portion L43 are connected in series. The second balanced-side inductor is connected between the first terminal Rx1 and the second terminal Rx2 of the second balanced terminal Rx.

The unbalanced inductor L2 is electromagnetically coupled to the first balanced inductor. The unbalanced inductor L2 is electromagnetically coupled to the second inductor portion L32 of the first balanced inductor. That is, a mutual inductance M1 is generated between the unbalanced inductor L2 and the second inductor portion L32 of the first balanced inductor.

Furthermore, the unbalanced inductor L2 is electromagnetically coupled to the second balanced inductor. The unbalanced inductor L2 is electromagnetically coupled to the second inductor portion L42 of the second balanced inductor. That is, a mutual inductance M2 is generated between the unbalanced inductor L2 and the second inductor portion L42 of the second balanced inductor.

The multilayer balun 100 further includes a fourth capacitor C4 inserted between the first terminal Tx1 and the second terminal Tx2 of the first balanced terminal Tx.

The fourth capacitor C4 forms an LC parallel resonator with the first balanced inductors (L31, L32, L33), and the LC parallel resonator formed with the unbalanced inductor L2 and the second capacitor C2 described above. Together, they constitute a first band pass filter. The first band pass filter passes only a signal in an arbitrarily selected frequency band between the unbalanced terminal UB and the first balanced terminal Tx.

In the multilayer balun 100, the impedance on the first balanced terminal Tx (Tx1, Tx2) side is adjusted by selecting the constants of the first balanced inductors (L31, L32, L33) and the fourth capacitor C4. Can do.

The multilayer balun 100 further includes a fifth capacitor C5 inserted between the first terminal Rx1 and the second terminal Rx2 of the second balanced terminal Rx.

The fifth capacitor C5 forms an LC parallel resonator with the second balanced-side inductors (L41, L42, L43), and the LC parallel resonator configured with the unbalanced-side inductor L2 and the second capacitor C2 described above. Together, they constitute a second bandpass filter. The second band pass filter passes only a signal in an arbitrarily selected frequency band between the unbalanced terminal UB and the second balanced terminal Rx.

In the multilayer balun 100, the impedance of the second balanced terminal Rx (Rx1, Rx2) side is adjusted by selecting the constants of the second balanced inductors (L41, L42, L43) and the fifth capacitor C5. Can do.

The laminated balun 100 composed of the above equivalent circuits can output the balanced signal input to the first balanced terminal Tx as an unbalanced signal from the unbalanced terminal UB. Note that if DC power is supplied to the DC feed terminal DCfeed, the strength of the unbalanced signal output from the unbalanced terminal UB can be increased. Furthermore, the unbalanced signal input to the unbalanced terminal UB can be output as a balanced signal from the second balanced terminal Rx.

Note that balanced signals having substantially the same amplitude and different phases are input to the first terminal Tx1 and the second terminal Tx2 of the first balanced terminal Tx. Furthermore, balanced signals having substantially the same amplitude and different phases are output from the first terminal Rx1 and the second terminal Rx2 of the second balanced terminal Rx.

The laminated balun 100 composed of the above equivalent circuits can be constituted by, for example, the laminated body 1 shown in FIGS. The laminated balun 100 includes a laminated body 1 in which a plurality of dielectric layers are laminated, and a plurality of terminals formed on the surface of the laminated body 1. The plurality of terminals are formed on the side surfaces when the pair of main surfaces having the largest area of the rectangular parallelepiped laminated body 1 are the upper surface and the bottom surface.

The laminated body 1 is formed by laminating dielectric layers 1a to 1p made of ceramic, for example, in order from the bottom.

As shown in FIG. 2, on the surface of the laminated body 1, unbalanced terminals UB, first terminals Tx1 and second terminals Tx2 of the first balanced terminal Tx, first terminals Rx1 and second terminals of the second balanced terminal Rx are provided. Rx2, a first ground terminal G1, a second ground terminal G2, a DC feed terminal DCfeed, a first floating terminal F1, and a second floating terminal F2 are formed. Specifically, the first floating terminal F1, the second floating terminal F2, the first ground terminal G1, and the unbalanced terminal UB are sequentially arranged on the side surface on the near side of the stacked body 1 in FIG. It is formed. A second ground terminal G2 is formed on the left side surface of the multilayer body 1 in FIG. 2, the first terminal Tx1 of the first balanced terminal Tx, the second terminal Tx2, the first terminal Rx1 of the second balanced terminal Rx, the first terminal Rx1, the second balanced terminal Rx, and so on. Two terminals Rx2 are formed. A DC feed terminal DCfeed is formed on the right side surface of the laminate 1 in FIG. Note that both ends of each terminal are formed to extend on the lower main surface and the upper main surface of the laminate 1, respectively.

The first floating terminal F1 and the second floating terminal F2 are not connected to a circuit inside the stacked body 1, and are bonded to a land electrode such as a substrate when the stacked balun 100 is mounted, thereby increasing mounting strength. Used for.

Unbalanced terminal UB, first terminal Tx1 and second terminal Tx2 of first balanced terminal Tx, first terminal Rx1 and second terminal Rx2 of second balanced terminal Rx, first ground terminal G1, second ground terminal G2, DC The feed terminal DCfeed, the first floating terminal F1, and the second floating terminal F2 can be formed of, for example, a metal whose main component is Ag, Cu, or an alloy thereof. On the surface of these terminals, a plating layer containing Ni, Sn, Au or the like as a main component may be formed over one layer or a plurality of layers as necessary.

As shown in FIG. 3, the laminated balun 100 includes capacitor conductor patterns (hereinafter simply referred to as “capacitor electrodes”) 2a to 2q, connecting conductors formed between the dielectric layers 1a to 1p constituting the laminated body 1. A pattern (hereinafter simply referred to as “connection electrode”) 3a and an inductor conductor pattern (hereinafter simply referred to as “inductor electrode”) 4a to 4p are provided. Further, the laminated balun 100 includes via conductor patterns (hereinafter simply referred to as “via electrodes”) 5a to 5p formed in the laminated body 1 in the laminating direction of the dielectric layers 1a to 1p.

Specifically, a capacitor electrode 2a and a connection electrode 3a are formed on the upper main surface of the dielectric layer 1b. The capacitor electrode 2a is connected to the second ground terminal G2. The connection electrode 3a is connected to the DC feed terminal DCfeed.

A capacitor electrode 2b is formed on the upper main surface of the dielectric layer 1c. The capacitor electrode 2b is connected to the unbalanced terminal UB.

Four

capacitor electrodes

2c, 2d, 2e, 2f are formed on the upper main surface of the dielectric layer 1d. The capacitor electrode 2c is connected to the first terminal Tx1 of the first balanced terminal Tx, the capacitor electrode 2d is connected to the second terminal Tx2 of the first balanced terminal Tx, and the capacitor electrode 2e is connected to the first terminal Rx1 of the second balanced terminal Rx. The capacitor electrode 2f is connected to the second terminal Rx2 of the second balanced terminal Rx.

Two capacitor electrodes 2g and 2h are formed on the upper main surface of the dielectric layer 1e.
Four

capacitor electrodes

2i, 2j, 2k, 2l are formed on the upper main surface of the dielectric layer 1f. The capacitor electrode 2i is connected to the first terminal Tx1 of the first balanced terminal Tx, the capacitor electrode 2j is connected to the second terminal Tx2 of the first balanced terminal Tx, and the capacitor electrode 2k is connected to the first terminal Rx1 of the second balanced terminal Rx. 2l is connected to the second terminal Rx2 of the second balanced terminal Rx, respectively.

Three

capacitor electrodes

2m, 2n, 2o are formed on the upper main surface of the dielectric layer 1g. The capacitor electrode 2m is connected to the first ground terminal G1.

A capacitor electrode 2p is formed on the upper main surface of the dielectric layer 1h.
Capacitor electrode 2q is formed on the upper main surface of dielectric layer 1i. The capacitor electrode 2q is connected to the unbalanced terminal UB.

Two

inductor electrodes

4a and 4b are formed on the upper main surface of the dielectric layer 1j. One end of the inductor electrode 4a is connected to the first terminal Tx1 of the first balanced terminal Tx, and one end of the inductor electrode 4b is connected to the second terminal Rx2 of the second balanced terminal Rx.

Three

inductor electrodes

4c, 4d, and 4e are formed on the upper main surface of the dielectric layer 1k. The inductor electrode 4d has an open ring shape. One end of the inductor electrode 4d is connected to the first ground terminal G1.

Two

inductor electrodes

4f, 4g, and 4h are formed on the upper main surface of the dielectric layer 1l. The

inductor electrodes

4g and 4h have an open ring shape. When viewed from the stacking direction of the dielectric layers 1a to 1p, each of the regions surrounded by the

annular inductor electrodes

4g and 4h overlaps at least a part of the region surrounded by the annular inductor electrode 4d.

Four

inductor electrodes

4i, 4j, 4k, 4l are formed on the upper main surface of the dielectric layer 1m. The inductor electrode 4j has an open annular shape. When viewed from the stacking direction of the dielectric layers 1a to 1p, at least a part of the region surrounded by the annular inductor electrode 4j overlaps with the region surrounded by the annular inductor electrode 4g. Furthermore, at least a part of the region surrounded by the annular inductor electrode 4j overlaps with the region surrounded by the annular inductor electrode 4h.

Three

inductor electrodes

4m, 4n, 4o are formed on the upper main surface of the dielectric layer 1n. One end of the inductor electrode 4n is connected to the second terminal Tx2 of the first balanced terminal Tx, and one end of the inductor electrode 4o is connected to the first terminal Rx1 of the second balanced terminal Rx.

An inductor electrode 4p is formed on the upper main surface of the dielectric layer 1o. One end of the inductor electrode 4p is connected to the unbalanced terminal UB.

In the laminated body 1, the via electrode 5a penetrates the dielectric layers 1i to 1k and connects the capacitor electrode 2p and one end of the inductor electrode 4c. The via electrode 5a is formed integrally with a via electrode 5h, which will be described later, but for convenience of explaining the connection relationship, the lower portion of the via electrode is denoted by reference numeral 5a and the upper portion is denoted by reference numeral 5h. It shows by.

The via electrode 5b penetrates the dielectric layer 1k and connects the other end of the inductor electrode 4b and one end of the inductor electrode 4e.

The via electrode 5c penetrates the dielectric layer 11 and connects the other end of the inductor electrode 4c and one end of the inductor electrode 4f.

The via electrode 5d passes through the dielectric layers 1c to 1l and connects the connection electrode 3a and the intermediate portion of the inductor electrode 4g.

The via electrode 5e passes through the dielectric layers 1k and 1l and connects the other end of the inductor electrode 4a and one end of the inductor electrode 4g.

The via electrode 5f penetrates the dielectric layer 11 and connects the other end of the inductor electrode 4e and one end of the inductor electrode 4h.

The via electrode 5g penetrates the dielectric layer 1m and connects the other end of the inductor electrode 4f and one end of the inductor electrode 4i.

The via electrode 5h penetrates the

dielectric layers

11 and 1m and connects one end of the inductor electrode 4c and one end of the inductor electrode 4j.

The via electrode 5i passes through the

dielectric layers

11 and 1m and connects the other end of the inductor electrode 4d and the other end of the inductor electrode 4j.

The via electrode 5j penetrates the dielectric layer 1m and connects the other end of the inductor electrode 4g and one end of the inductor electrode 4k.

The via electrode 5k penetrates the dielectric layer 1m and connects the other end of the inductor electrode 4h and one end of the inductor electrode 4l.

The via electrode 5l penetrates the dielectric layer 1n and connects the other end of the inductor electrode 4i and one end of the inductor electrode 4m.

The via electrode 5m penetrates the dielectric layer 1n and connects the other end of the inductor electrode 4k and the other end of the inductor electrode 4n.

The via electrode 5n penetrates the dielectric layer 1n and connects the other end of the inductor electrode 4l and the other end of the inductor electrode 4o.

The via electrode 5o passes through the dielectric layer 1o and connects the other end of the inductor electrode 4m and the other end of the inductor electrode 4p.

The capacitor electrodes 2a to 2q, the connection electrodes 3a, the inductor electrodes 4a to 4p, and the via electrodes 5a to 5o described above can be formed of, for example, Ag, Cu, or a metal mainly composed of these alloys.

The laminated balun 100 of the present embodiment constituted by the laminated body in which the dielectric layers are laminated having the above-described configuration is manufactured by a general manufacturing method conventionally used for manufacturing a laminated balun. can do.

Next, the relationship between the equivalent circuit of the laminated balun 100 and the configuration in the laminated body 1 will be described by comparing FIG. 1 and FIG.

The low-pass filter is composed of a first inductor L1, a first capacitor C1, and a second capacitor C2. The first inductor L1 of which starts from the unbalanced terminal UB, and starts from the inductor electrode 4p and the via electrode 5o. The inductor electrode 4m, the via electrode 5l, the inductor electrode 4i, the via electrode 5g, the inductor electrode 4f, the via electrode 5c, and the inductor electrode 4c are formed by a line having one end of the inductor electrode 4c as an end point.

The first capacitor C1 of the low-pass filter is formed by a capacitance formed between the capacitor electrode 2b connected to the unbalanced terminal UB and the capacitor electrode 2a connected to the second ground terminal G2.

The second capacitor C2 of the low-pass filter is between the capacitor electrode 2p connected to one end of the inductor electrode 4c that is the end point of the first inductor L1 by the via electrode 5a and the capacitor electrode 2m connected to the first ground terminal G1. It is formed by the capacity | capacitance formed in this.

The third capacitor C3 connected in parallel with the first inductor L1 of the low-pass filter has a capacitor electrode 2q connected to the unbalanced terminal UB, and one end of the inductor electrode 4c that is the end point of the first inductor L1 by the via electrode 5a. It is formed by a capacitor formed between the connected capacitor electrode 2p.

The unbalanced inductor L2 starts from one end of the inductor electrode 4c, which is the end point of the first inductor L1, and passes through the via electrode 5h, the inductor electrode 4j, the via electrode 5i, and the inductor electrode 4d to connect the first ground terminal G1. It is formed by a track that is the end point. The other end of the inductor electrode 4c is electrically connected to the unbalanced terminal UB via each electrode constituting the first inductor L1. Therefore, each of the inductor electrodes 4j and 4d constituting the unbalanced inductor L2 is electrically connected between the unbalanced terminal UB and the first ground terminal G1. Here, the “electrically connected” state means a state connected by a conductive path or a state connected through a capacitor, and is not limited to a directly connected state, but another element is interposed therebetween. It also includes a state of being indirectly connected.

In the unbalanced inductor L2, the inductor electrode 4d corresponds to the lower inductor electrode, and the inductor electrode 4j corresponds to the upper inductor electrode. The inductor electrode 4d as the lower inductor electrode and the inductor electrode 4k as the upper inductor electrode are connected by the via electrode 5i.

The first balanced-side inductor starts from the first terminal Tx1 of the first balanced terminal Tx and passes through the inductor electrode 4a, the via electrode 5e, the inductor electrode 4g, the via electrode 5j, the inductor electrode 4k, the via electrode 5m, and the inductor electrode 4n. The first balanced terminal Tx is formed by a line having the second terminal Tx2 as an end point. That is, each of the

inductor electrodes

4a, 4g, 4k, and 4n is electrically connected between the first terminal Tx1 and the second terminal Tx2 of the first balanced terminal Tx. Among these, the inductor electrode 4g formed so as to surround a region overlapping with a part of the region surrounded by any of the annular inductor electrodes 4j and 4d when viewed from the stacking direction is the first balanced-side inductor. 2 inductor part L32 is constituted. The region surrounded by the inductor electrode 4g and the region surrounded by any one of the

inductor electrodes

4i and 4d are overlapped, so that the unbalanced structure configured by the second inductor portion L32 configured by the inductor electrode 4g and the

inductor electrodes

4i and 4d is formed. The side inductor L2 is electromagnetically coupled.

The inductor electrode 4a and the via electrode 5e electrically connected between the first terminal Tx1 of the first balanced terminal Tx and the inductor electrode 4g constitute a first inductor portion L31 of the first balanced side inductor. The via electrode 5j, the inductor electrode 4k, the via electrode 5m, and the inductor electrode 4n that are electrically connected between the inductor electrode 4g and the second terminal Tx2 of the first balanced terminal Tx are the third balanced inductors. The inductor portion L33 is configured.

Note that the intermediate portion of the inductor electrode 4g constituting the second inductor portion L32 of the first balanced inductor is connected to the DC feed terminal DCfeed via the via electrode 5d and the connection electrode 3a.

The second balanced-side inductor starts from the first terminal Rx1 of the second balanced terminal Rx, and starts from the inductor electrode 4o, via electrode 5n, inductor electrode 41, via electrode 5k, inductor electrode 4h, via electrode 5f, inductor electrode 4e, via It is formed by a line having the second terminal Rx2 of the second balanced terminal Rx as an end point via the electrode 5b and the inductor electrode 4b. That is, each of the

inductor electrodes

4o, 4l, 4h, 4e, and 4b is electrically connected between the first terminal Rx1 and the second terminal Rx2 of the second balanced terminal Rx. Among these, when viewed from the stacking direction, the inductor electrode 4h formed so as to surround a region overlapping with a part of the region surrounded by either of the annular inductor electrodes 4j and 4d is the second balanced-side inductor. 2 inductor part L42 is comprised. The region surrounded by the inductor electrode 4h and the region surrounded by any one of the

inductor electrodes

4i and 4d are overlapped, so that an unbalance formed by the second inductor portion L42 formed by the inductor electrode 4h and the

inductor electrodes

4i and 4d is formed. The side inductor L2 is electromagnetically coupled.

The inductor electrode 4o, the via electrode 5n, the inductor electrode 4l and the via electrode 5k, which are electrically connected between the first terminal Rx1 of the second balanced terminal Rx and the inductor electrode 4h, are the first balanced-side inductor first. The inductor portion L41 is configured. The via electrode 5f, the inductor electrode 4e, the via electrode 5b, and the inductor electrode 4b, which are electrically connected between the inductor electrode 4h and the second terminal Rx2 of the second balanced terminal Rx, are the third balanced-side inductor third. The inductor portion L43 is configured.

The fourth capacitor C4 mainly includes

capacitor electrodes

2c and 2i connected to the first terminal Tx1 of the first balanced terminal Tx via the capacitor electrodes 2g and 2n which are not connected to the terminals and become floating electrodes, The capacitor is formed by a capacitor formed between the

capacitor electrodes

2d and 2j connected to the second terminal Tx2 of the first balanced terminal Tx.

The fifth capacitor C5 mainly includes

capacitor electrodes

2e and 2k connected to the first terminal Rx1 of the second balanced terminal Rx via the capacitor electrodes 2h and 2o which are not connected to the terminals and are floating electrodes, The capacitor is formed by a capacitor formed between the capacitor electrodes 2f and 2l connected to the second terminal Rx2 of the second balanced terminal Rx.

In the multilayer balun 100 of the present embodiment having the above equivalent circuit and configuration, the inductor electrode 4g constituting the second inductor portion L32 of the first balanced-side inductor and the second inductor portion L42 of the second balanced-side inductor are configured. The inductor electrode 4h to be formed is formed on the upper main surface of the same dielectric layer 1l. That is, the inductor electrode 4g and the inductor electrode 4h are formed between the same layers between the dielectric layer 11 and the dielectric layer 1m. Thereby, the laminated body 1 which comprises the laminated balun 100 can be made low-profile.

In the laminating direction of the dielectric layers 1a to 1p, a first inductor is provided between the inductor electrode 4d constituting the lower inductor electrode of the unbalanced inductor L2 divided into two and the inductor electrode 4j constituting the upper inductor electrode. An inductor electrode 4g constituting the second inductor portion L32 of the balanced-side inductor and an inductor electrode 4h constituting the second inductor portion L42 of the second balanced-side inductor are sandwiched and arranged.

As a result, when the multilayer balun 100 is used, the unbalanced inductor L2 and the second inductor portion L32 of the first balanced inductor are electromagnetically coupled. Further, the unbalanced inductor L2 and the second inductor section L42 of the second balanced inductor are electromagnetically coupled.

A via electrode 5i that connects the inductor electrode 4d that forms the lower inductor electrode of the unbalanced inductor L2 divided into two and the inductor electrode 4j that forms the upper inductor electrode, together with the via electrode 5h, It arrange | positions so that the inner side of an annular part may be penetrated.

As a result, in the multilayer balun 100, the magnetic flux formed by the via electrode 5i that connects the inductor electrode 4d that forms the lower inductor electrode of the unbalanced inductor L2 and the inductor electrode 4j that forms the upper inductor electrode, and the first The magnetic flux formed by the inductor electrode 4g of the second inductor portion L32 of the balanced inductor is orthogonal to each other, and interference between the two is suppressed. Therefore, a decrease in Q is suppressed in both the unbalanced inductor L2 and the first balanced inductor (second inductor portion L32).

As described above, the laminated balun 100 of the present embodiment includes the laminated body 1 in which the plurality of dielectric layers 1a to 1p are laminated, the plurality of inductor electrodes formed between the layers of the laminated body 1, and the laminated body 1 And a plurality of terminals formed on the surface.

The plurality of terminals include an unbalanced terminal UB, a first balanced terminal Tx, a second balanced terminal Rx, and a first ground terminal G1. The first balanced terminal Tx has a first terminal Tx1 and a second terminal Tx2. The second balanced terminal Rx has a first terminal Rx1 and a second terminal Rx2.

The plurality of inductor electrodes include inductor electrodes (unbalanced-side inductor conductor patterns) 4d and 4j electrically connected between the unbalanced terminal UB and the first ground terminal G1, and a first terminal of the first balanced terminal Tx. Between the inductor electrode (first balanced-side inductor conductor pattern) 4g electrically connected between Tx1 and the second terminal Tx2, and between the first terminal Rx1 and the second terminal Rx2 of the second balanced terminal Rx Connected inductor electrode (second balanced-side inductor conductor pattern) 4h.

When viewed from the stacking direction of the plurality of dielectric layers 1a to 1p, at least a part of the region surrounded by the inductor electrode 4g overlaps the region surrounded by the inductor electrodes 4d and 4j. Furthermore, at least a part of the region surrounded by the inductor electrode 4h overlaps the region surrounded by the inductor electrodes 4d and 4j. The

inductor electrodes

4g and 4h are formed between the same layers of the multilayer body 1 (here, between the dielectric layer 1l and the dielectric layer 1m).

With such an arrangement, the unbalanced inductor L2 constituted by the inductor electrodes 4d and 4j can be electromagnetically coupled to the second inductor portion L32 of the first balanced inductor constituted by the inductor electrode 4g, and the inductor electrode 4h. The second inductor portion L42 of the second balanced-side inductor constituted by the electromagnetic field coupling can also be performed. Further, since the

inductor electrodes

4g and 4h are formed between the same layers, the stacked body 1 can be reduced in height. Furthermore, since there is no need to use a divider, insertion loss due to passing through the divider can be suppressed, and the number of parts can be reduced. As a result, it is possible to realize a small-sized laminated balun including an unbalanced terminal and two pairs of balanced terminals and having a small signal insertion loss.

The plurality of dielectric layers include a dielectric layer (first dielectric layer) 1k, a dielectric layer (second dielectric layer) 1l, and a dielectric layer (third dielectric layer) 1m that are sequentially stacked. Including. The inductor electrode constituting the unbalanced inductor L2 includes an inductor electrode (first unbalanced inductor conductor pattern) 4d formed between the dielectric layers 1k and 1l. The

inductor electrodes

4g and 4h are formed between the dielectric layers 1l and 1m. As a result, only one dielectric layer 11 is interposed between the inductor electrode 4d and the inductor electrode 4g, and the second inductor portion L32 of the first balanced-side inductor constituted by the unbalanced inductor L2 and the inductor electrode 4g, The electromagnetic field coupling can be strengthened. Similarly, electromagnetic field coupling between the unbalanced inductor L2 and the second inductor portion L42 of the second balanced inductor constituted by the inductor electrode 4h can be strengthened.

Furthermore, the plurality of dielectric layers include a dielectric layer (fourth dielectric layer) 1n laminated on the opposite side of the dielectric layer 1m from the dielectric layer 1l. The inductor electrode constituting the unbalanced inductor L2 includes an inductor electrode (second unbalanced inductor conductor pattern) 4j formed between the

dielectric layers

1m and 1n in addition to the inductor electrode 4d. Thereby, the electromagnetic field coupling between the unbalanced inductor L2 and the second inductor portion L32 of the first balanced inductor constituted by the inductor electrode 4g can be further strengthened. Similarly, electromagnetic field coupling between the unbalanced inductor L2 and the second inductor portion L42 of the second balanced inductor configured by the inductor electrode 4h can be further strengthened.

FIG. 4 is an exploded perspective view showing a modified example of the laminated balun according to the present embodiment. FIG. 4 shows only a part of the dielectric layers constituting the laminated balun. Compared with the laminated balun 100 shown in FIG. 3, the laminated balun according to the modified example includes a dielectric layer 1q instead of the dielectric layer 1k, and includes

dielectric layers

1r and 1s instead of the dielectric layers 1m to 1o. It differs only in the point provided.

Inductor electrodes

4c, 4e, and 4q are formed on the upper main surface of the dielectric layer 1q. The dielectric layer 1q differs from the dielectric layer 1k shown in FIG. 3 only in that an inductor electrode 4q is formed instead of the inductor electrode 4d. One end of the inductor electrode 4q is connected to the first ground terminal G1, and the other end of the inductor electrode 4q is connected to one end of the inductor electrode 4c. A via electrode 5a is connected to a connection point between the inductor electrode 4c and the inductor electrode 4q. The inductor electrode 4q is an open ring. When viewed from the stacking direction of the dielectric layer, a part of the region surrounded by the inductor electrode 4q overlaps the region surrounded by the inductor electrode 4g formed on the upper main surface of the dielectric layer 1l. Similarly, a part of the region surrounded by the inductor electrode 4q overlaps the region surrounded by the inductor electrode 4h formed on the upper main surface of the dielectric layer 11.

Inductor electrodes

4i, 4k, 4l are formed on the upper main surface of the dielectric layer 1r. The dielectric layer 1r differs from the dielectric layer 1m shown in FIG. 3 only in that the inductor electrode 4j is not formed.

Inductor electrodes

4n, 4o, 4r are formed on the upper main surface of the dielectric layer 1s. The dielectric layer 1s differs from the dielectric layer 1n shown in FIG. 3 only in that an inductor electrode 4r is formed instead of the inductor electrode 4m. One end of the inductor electrode 4r is connected to the unbalanced terminal UB. The other end of the inductor electrode 4r is connected to the other end of the inductor electrode 4i by a via electrode 5p that penetrates the dielectric layer 1s.

The

inductor electrodes

4q and 4r can be formed of, for example, Ag, Cu, or a metal mainly composed of these alloys.

According to this modification, the unbalanced inductor L2 is a line that starts from one end of the inductor electrode 4c that is the end point of the first inductor L1, passes through the inductor electrode 4q, and ends at the first ground terminal G1. It is formed. The inductor electrode 4q constituting the unbalanced inductor L2 is formed between the dielectric layer (first dielectric layer) 1q and the dielectric layer 1l. In the present modification, a dielectric layer (third dielectric layer) 1r laminated on the

inductor electrodes

4g and 4i and a dielectric layer laminated on the opposite side of the dielectric layer 1l of the dielectric layer 1r ( The inductor electrode constituting the unbalanced inductor L2 is not formed between the fourth dielectric layer) 1s. As a result, the number of inductor electrodes constituting the unbalanced inductor L2 can be reduced, and the laminated balun can be reduced in height.

The shape of the inductor electrode constituting each of the unbalanced-side inductor L2, the second inductor portion L32 of the first balanced-side inductor, and the second inductor portion L42 of the second balanced-side inductor is particularly limited. is not. FIG. 5 is an exploded perspective view showing a part of another modified example of the laminated balun. In FIG. 5, other than the dielectric layer on which the inductor electrode constituting the unbalanced inductor L2, the second inductor portion L32 of the first balanced inductor, and the second inductor portion L42 of the second balanced inductor is formed. The dielectric layer is omitted.

As shown in FIG. 5, the stacked body constituting the stacked balun includes adjacent

dielectric layers

1t and 1u. The inductor electrode 4s formed on the upper main surface of the dielectric layer 1t constitutes an unbalanced inductor L2. The inductor electrode 4s has a shape in which two open annular portions 4s1 and 4s2 are connected. The inductor electrode 4t formed on the upper main surface of the dielectric layer 1u constitutes the second inductor portion L32 of the first balanced-side inductor and has an open annular shape. The inductor electrode 4u formed on the upper main surface of the same dielectric layer 1u constitutes the second inductor portion L42 of the second balanced-side inductor and has an open annular shape. The inductor electrodes 4s to 4u can be made of, for example, Ag, Cu, or a metal mainly composed of these alloys. When viewed from the stacking direction of the

dielectric layers

1t and 1u, at least a part of the region surrounded by the inductor electrode 4t overlaps the region surrounded by the one annular portion 4s1 in the inductor electrode 4s. Further, when viewed from the stacking direction of the

dielectric layers

1t and 1u, at least a part of the region surrounded by the inductor electrode 4u overlaps the region surrounded by the other annular portion 4s2 in the inductor electrode 4s. As a result, the unbalanced inductor L2 can be electromagnetically coupled to each of the second inductor portion L32 of the first balanced side inductor and the second inductor portion L42 of the second balanced side inductor. In addition, it is easy to adjust the impedance of each of the unbalanced inductor L2, the second inductor portion L32 of the first balanced side inductor, and the second inductor portion L42 of the second balanced side inductor.

In the above description, the unbalanced inductor L2 is connected in parallel with the second capacitor C2, but may be connected in series with the capacitor. For example, the unbalanced inductor L2 and the capacitor may be connected in series in this order between the other end of the first inductor L1 and the ground.

The laminated balun 100 according to the above embodiment can also be expressed as follows.
The laminated balun 100 includes one unbalanced terminal UB, a first balanced terminal Tx having a first terminal Tx1 and a second terminal Tx2, and a second balanced terminal having a first terminal Rx1 and a second terminal Rx2. Rx. An unbalanced inductor L2 is inserted between the unbalanced terminal UB and the ground, a first balanced inductor is inserted between the first terminal Tx1 and the second terminal Tx2 of the first balanced terminal Tx, A second balanced-side inductor is inserted between the first terminal Rx1 and the second terminal Rx2 of the two balanced terminals Rx. The unbalanced inductor L2 is electromagnetically coupled to both the first balanced inductor and the second balanced inductor.

It is preferable that a low-pass filter is inserted between the unbalanced terminal UB and the unbalanced inductor L2. The low-pass filter includes a first inductor L1, a first capacitor C1 inserted between one end of the first inductor L1 and the ground, and a second capacitor inserted between the other end of the first inductor L1 and the ground. C2. The unbalanced inductor L2 is preferably connected in parallel with the second capacitor C2. In this case, the frequency band of the signal passing between the unbalanced terminal UB and the first balanced terminal Tx and the signal passing between the unbalanced terminal UB and the second balanced terminal Rx by the low-pass filter. The frequency band can be adjusted.

In this case, it is preferable that the third capacitor C3 is connected in parallel with the first inductor L1 of the low-pass filter. In this case, a trap can be formed on the high frequency side outside the pass band of the low-pass filter, and the function of the low-pass filter can be improved.

A fourth capacitor C4 is further inserted between the first terminal Tx1 and the second terminal Tx2 of the first balanced terminal Tx, and between the first terminal Rx1 and the second terminal Rx2 of the second balanced terminal Rx, Furthermore, it is preferable that the fifth capacitor C5 is inserted. In this case, the first parallel-side inductor and the fourth capacitor C4 constitute an LC parallel resonator. Further, the second balanced-side inductor and the fifth capacitor C5 constitute an LC parallel resonator. The LC parallel resonator composed of the first balanced-side inductor and the fourth capacitor C4 is the LC parallel resonator formed by the unbalanced-side inductor L2 and the second capacitor C2 described above. When the second capacitor C2 is omitted and the LC parallel resonator is not configured in cooperation with the parallel resonator, the first band pass filter is configured independently. The first band-pass filter passes only a signal in an arbitrarily selected frequency band between the unbalanced terminal UB and the first balanced terminal Tx. Further, the LC parallel resonator constituted by the second balanced-side inductor and the fifth capacitor C5 is an LC parallel resonator when the above-described unbalanced-side inductor L2 and the second capacitor C2 constitute an LC parallel resonator. When the second capacitor C2 is omitted and the LC parallel resonator is not configured in cooperation with the parallel resonator, a second band pass filter is configured independently. The second band pass filter passes only a signal in an arbitrarily selected frequency band between the unbalanced terminal UB and the second balanced terminal Rx. Even when the fourth capacitor C4 and the fifth capacitor C5 are not inserted, the LC parallel resonator constituted by the unbalanced inductor L2 and the second capacitor C2 described above can be used as a bandpass filter or Functions as part of a bandpass filter.

The first balanced inductor includes a first inductor portion L31, a second inductor portion L32, and a third inductor portion L33 connected in series in order. The unbalanced inductor L2 is mainly electromagnetically coupled to the second inductor portion L32 of the first balanced inductor. The second balanced-side inductor includes a first inductor portion L41, a second inductor portion L42, and a third inductor portion L43 that are connected in series in order. It is preferable that the unbalanced inductor L2 is mainly electromagnetically coupled to the second inductor portion L42 of the second balanced inductor. In this case, it is easy to adjust the strength of electromagnetic coupling between the unbalanced inductor L2 and the first balanced inductor, and strong electromagnetic coupling between the unbalanced inductor L2 and the second balanced inductor. Adjustment of the thickness becomes easy. That is, in each of the first balanced-side inductor and the second balanced-side inductor, the second inductor portion is mainly used for adjusting the electromagnetic field coupling with the unbalanced-side inductor. On the other hand, in the first balanced-side inductor and the second balanced-side inductor, the first inductor portion and the third inductor portion are mainly used for adjusting the impedance of the first balanced terminal or the second balanced terminal, respectively.

It is preferable that a DC feed terminal DCfeed is connected to an intermediate portion of the first balanced inductor. In this case, for example, the strength of the Tx signal transmitted from the antenna can be increased by supplying DC power to the DC feed terminal DCfeed.

It is preferable that the impedance of the first balanced terminal Tx is different from the impedance of the second balanced terminal Rx. In this case, for example, even when the impedance on the Rx side and the impedance on the Tx side of the RF circuit to be connected are different, the laminated balun 100 can be connected as it is. Furthermore, the impedance of the first balanced terminal Tx and the impedance of the second balanced terminal Rx can be designed independently of each other.

The frequency of the pass band formed between the unbalanced terminal UB and the first balanced terminal Tx is different from the frequency of the pass band formed between the unbalanced terminal UB and the second balanced terminal Rx. Also good.

Alternatively, the frequency of the pass band formed between the unbalanced terminal UB and the first balanced terminal Tx is the same as the frequency of the pass band formed between the unbalanced terminal UB and the second balanced terminal Rx. It may be. In this case, for example, the laminated balun 100 can be used for TDD (Time Division Duplex) communication.

The laminated balun 100 includes a laminated body 1 in which a plurality of dielectric layers are laminated, a plurality of inductor electrodes laminated between the dielectric layers, and a plurality of via electrodes formed through the dielectric layers. Prepare. It is preferable that the unbalanced-side inductor L2, the first balanced-side inductor, and the second balanced-side inductor are respectively formed by the inductor electrode or by the inductor electrode and the via electrode.

The multilayer balun 100 further includes a plurality of capacitor electrodes stacked between the dielectric layers, and the first capacitor C1, the second capacitor C2, the third capacitor C3, It is preferable that at least one of the fourth capacitor C4 and the fifth capacitor C5 is formed.

In the multilayer body 1, an inductor electrode forming the unbalanced inductor L2 is divided into at least an inductor electrode (lower inductor electrode) 4d and an inductor electrode (upper inductor electrode) 4j, and the inductor electrode 4d. The inductor electrode 4j is preferably connected to the via electrode 5i. In this case, further, in the stacking direction of the dielectric layers, an inductor electrode 4g that forms the second inductor portion L32 of the first balanced-side inductor and an inductor electrode 4h that forms the second inductor portion L42 of the second balanced-side inductor. Is sandwiched between the inductor electrode 4d and the inductor electrode 4j of the unbalanced inductor L2. As a result, the unbalanced inductor L2 and the first balanced inductor can be electromagnetically coupled, and at the same time, the unbalanced inductor L2 and the second balanced inductor can be electromagnetically coupled. By further adding an inductor electrode constituting the unbalanced inductor L2 below the inductor electrode 4d and / or above the inductor electrode 4j, the strength of these electromagnetic field couplings can be increased.

In the above configuration, the inductor electrode 4g constituting the first balanced-side inductor and the inductor electrode 4h constituting the second balanced-side inductor are each formed in an annular shape. The via electrode 5i that connects the inductor electrode 4d and the inductor electrode 4j of the unbalanced inductor L2 is disposed so as to penetrate the inside of the annular portion of the inductor electrode 4g of the second inductor portion L32 of the first balanced inductor. It is preferable that In this case, the magnetic flux formed by the via electrode 5i connecting the inductor electrode 4d of the unbalanced inductor and the inductor electrode 4j, and the magnetic flux formed by the inductor electrode 4g of the second inductor portion L32 of the first balanced inductor. However, since they are orthogonal to each other and their interference is suppressed, it is possible to suppress a decrease in Q in both the unbalanced inductor L2 and the first balanced inductor.

The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 laminated body, 1a to 1u dielectric layer, 2a to 2q capacitor electrode, 3a connection electrode, 4a to 4u inductor electrode, 4s1, 4s2 annular part, 5a to 5p via electrode, 100 laminated balun, Rx1, Tx1, first terminal, Rx2, Tx2 second terminal, C1 first capacitor, C2 second capacitor, C3 third capacitor, C4 fourth capacitor, C5 fifth capacitor, DCfeed DC feed terminal, F1 first floating terminal, F2 second floating terminal, G1 1st ground terminal, G2 2nd ground terminal, L1 1st inductor, L2 unbalanced inductor, L31, L41 1st inductor part, L32, L42 2nd inductor part, L33, L43 3rd inductor part, Rx 2nd balanced Terminal, Tx first balanced terminal, UB unbalanced terminal.

Claims

A laminate in which a plurality of dielectric layers are laminated;
A plurality of inductor conductor patterns formed between the layers of the laminate;
A laminated balun comprising a plurality of terminals formed on the surface of the laminated body,
The plurality of terminals include an unbalanced terminal, a first balanced terminal, a second balanced terminal, and a ground terminal,
Each of the first balanced terminal and the second balanced terminal has a first terminal and a second terminal;
The plurality of inductor conductor patterns are:
At least one unbalanced inductor conductor pattern electrically connected between the unbalanced terminal and the ground terminal;
A first balanced-side inductor conductor pattern electrically connected between the first terminal of the first balanced terminal and the second terminal of the first balanced terminal;
A second balanced-side inductor conductor pattern electrically connected between the first terminal of the second balanced terminal and the second terminal of the second balanced terminal;
When viewed from the stacking direction of the plurality of dielectric layers, at least a part of the region surrounded by the first balanced inductor conductor pattern overlaps the region surrounded by the at least one unbalanced inductor conductor pattern, And at least a part of a region surrounded by the second balanced-side inductor conductor pattern overlaps with a region surrounded by the at least one unbalanced-side inductor conductive pattern;
The first balanced-side inductor conductor pattern and the second balanced-side inductor conductor pattern are multilayer baluns formed between the same layers of the multilayer body.
The plurality of dielectric layers include first to third dielectric layers stacked sequentially in sequence,
The at least one unbalanced inductor conductor pattern includes a first unbalanced inductor conductor pattern formed between the first dielectric layer and the second dielectric layer;
The multilayer balun according to claim 1, wherein the first balanced-side inductor conductor pattern and the second balanced-side inductor conductor pattern are formed between the second dielectric layer and the third dielectric layer.
The plurality of dielectric layers include a fourth dielectric layer stacked on the opposite side of the third dielectric layer from the second dielectric layer,
The at least one unbalanced inductor conductor pattern further includes a second unbalanced inductor conductor pattern formed between the third dielectric layer and the fourth dielectric layer. Laminated balun.
The at least one unbalanced inductor conductor pattern has a shape formed by connecting two open annular portions;
At least a part of a region surrounded by the first balanced inductor conductor pattern overlaps a region surrounded by one annular portion of the at least one unbalanced inductor conductor pattern, and the second balanced inductor conductor pattern 4. The multilayer balun according to claim 1, wherein at least a part of a region surrounded by the second region overlaps a region surrounded by the other annular portion of the at least one unbalanced inductor conductor pattern.