WO2018196348A1

WO2018196348A1 - Backlight module and display device

Info

Publication number: WO2018196348A1
Application number: PCT/CN2017/111326
Authority: WO
Inventors: 邓天应; 潘俊; 陈细俊; 强科文
Original assignee: 深圳Tcl新技术有限公司
Priority date: 2017-04-28
Filing date: 2017-11-16
Publication date: 2018-11-01
Also published as: CN206805066U

Abstract

A backlight module (10) and a display device (100), the backlight module (10) comprising: a plurality of light-emitting assemblies (11), each light-emitting assembly (11) comprising a light-emitting chip (113) and a light-transmitting body portion (111) which covers the light-emitting chip (113); a plurality of optical film sheets (15), the optical film sheets (15) being stacked in parallel, and a surface of an optical film sheet (15) being provided with a quantum dot layer (17); light which is emitted by the light-emitting chip (113) passes through an optical film sheet (15) and the quantum dot layer (17) to generate white light, having good thermal reliability and being low cost.

Description

Backlight module and display device

Technical field

The present invention relates to the field of liquid crystal display technologies, and in particular, to a backlight module and a display device using the same.

Background technique

With the development of LCD TV technology, consumer demand for TV display quality has gradually increased. In the prior art, quantum dot technology can be used to achieve ultra-high color gamut image quality display, so the backlights in most of the existing backlight modules use quantum dots. However, since the conventional quantum dot material is exposed to the air and is easily oxidized, it is necessary to use a barrier material to wrap the quantum dot material. This technique is complicated and costly, and it cannot be widely used in liquid crystal display. At the same time, in the existing backlight structure, the quantum dots are directly close to the light source, resulting in poor thermal reliability; and the quantum dots are used in a large amount, resulting in further increase in cost.

Summary of the invention

An object of the present invention is to provide a backlight module, which aims to obtain a backlight module with good thermal reliability and low cost.

In order to achieve the above object, a backlight module provided by the present invention includes:

a plurality of light emitting components, each of the light emitting components comprising a light emitting chip and a light transmissive body portion covering the light emitting chip;

a plurality of optical films, the optical films are arranged in parallel, wherein a surface of an optical film is provided with a quantum dot layer.

Light emitted by the light emitting chip passes through the optical film and the quantum dot layer to generate white light.

Preferably, the light emitting chip comprises a blue LED chip and a green LED chip, and the quantum dot layer is a red quantum dot layer.

Preferably, the light emitting chip comprises a blue LED chip and a red LED chip, and the quantum dot layer is a green quantum dot layer.

Preferably, the surface of an optical film adjacent to the light-emitting component is provided with the quantum dot layer, and the quantum dot layer faces the light-emitting component.

Preferably, the quantum dot material of the quantum dot layer is a perovskite.

Preferably, the quantum dot layer has a thickness ranging from greater than 0 mm to less than or equal to 0.01 mm.

Preferably, the backlight module further includes a light guide plate adjacent to an end surface of the light guide plate, the optical film facing a surface of the light guide plate, the surface being adjacent to the light guide assembly and the light guide plate The end faces are connected, and the quantum dot layer is disposed on a surface of the optical film facing the light guide plate.

Preferably, the backlight module further includes a reflective sheet, the reflective sheet is attached to a surface of the light guide plate facing away from the optical film, and an end of the reflective sheet abuts the light emitting component.

Preferably, the blue LED chip emits light in a wavelength range of 440 nm to 450 nm.

Another object of the present invention is to provide a display device comprising the backlight module as described above.

In the technical solution of the present invention, the light source of the backlight module uses the light-emitting chip to excite the quantum dot layer on the optical film to generate white light, and the quantum dot layer is directly disposed on the surface of the optical film, and does not need to be packaged, thereby reducing preparation. Process can increase production efficiency and reduce costs. At the same time, the light emitted by the light-emitting chip transmits the quantum dot layer after passing through the optical film, and the heat generated by the excited quantum dot layer can be emitted in time without being blocked by the packaging material, thereby improving the thermal reliability of the quantum dot layer.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and those skilled in the art can obtain other drawings according to the structures shown in the drawings without any creative work.

1 is a cross-sectional view showing an embodiment of a display device of the present invention;

2 is a cross-sectional view of a light emitting assembly of a backlight module in the display device of FIG. 1.

Description of the reference numerals:

标号Label	名称name	标号Label	名称name
100100	显示装置Display device	1616	固定框Fixed frame
1010	背光模组Backlight module	16a16a	安装空间Installation space
1111	发光组件Illuminating component	161161	直段Straight section
111111	透光主体部Light transmissive body	163163	安装段Installation section
113113	发光芯片Light emitting chip	16311631	阶梯槽Step slot
1212	散热件Heat sink	1717	量子点层Quantum dot layer
1313	导光板Light guide	1818	反射片A reflective sheet
131131	黑色胶条Black strip	1919	电路板Circuit board
1414	背板Backplane	3030	显示面板Display panel
1515	光学膜片Optical diaphragm	5050	前框Front frame

The implementation, functional features, and advantages of the present invention will be further described in conjunction with the embodiments.

detailed description

The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back, ...) in the embodiments of the present invention are only used to explain between components in a certain posture (as shown in the drawing). Relative positional relationship, motion situation, etc., if the specific posture changes, the directional indication also changes accordingly.

In addition, the descriptions of "first", "second", and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include at least one of the features, either explicitly or implicitly.

In the present invention, the terms "connected", "fixed" and the like should be understood broadly, unless otherwise clearly defined and limited. For example, "fixed" may be a fixed connection, or may be a detachable connection, or may be integrated; It may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be an internal connection of two elements or an interaction relationship of two elements unless explicitly defined otherwise. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In addition, the technical solutions between the various embodiments of the present invention may be combined with each other, but must be based on the realization of those skilled in the art, and the combination of technical solutions should be considered when the combination of technical solutions is contradictory or impossible to implement. It does not exist and is not within the scope of protection required by the present invention.

The invention provides a backlight module 10.

Referring to FIG. 1 and FIG. 2, a backlight module 10 according to an embodiment of the invention includes:

a plurality of light-emitting components 11 each including a light-emitting chip 113 and a light-transmissive body portion 111 that is disposed on the light-emitting chip 113;

a plurality of optical films 15 and optical films 15 are arranged in parallel, wherein a surface of an optical film 15 is provided with a quantum dot layer 17,

Light emitted from the light-emitting chip 113 passes through the optical film 15 and the quantum dot layer 17, and white light is generated.

In this embodiment, the backlight of the backlight module 10 may be a side-in type or a direct type. The arrangement of the light-transmitting main body portion 111 can transmit light of the light-emitting chip 113 or protect the light-emitting chip 113. The optical film 15 in the backlight module 10 may include an upper diffusion sheet, a brightness enhancement sheet, a lower diffusion sheet, a prism film, and the like. The optical film 15 is used to modify the light emitted from the light-emitting assembly 11 so that the brightness of the finally emitted light is good and uniform.

In the technical solution of the present invention, the light source of the backlight module 10 is used to excite the quantum dot layer 17 on the optical film 15 to generate white light. The quantum dot layer 17 is directly disposed on the surface of the optical film 15, and does not need to be packaged. The treatment reduces the preparation process and can improve production efficiency and reduce costs. At the same time, the light emitted by the light-emitting chip 113 passes through the optical film 15 and excites the quantum dot layer 17. The heat generated by the excited quantum dot layer 17 can be dissipated in time without being blocked by the packaging material, thereby improving the quantum dot layer 17. Thermal reliability.

The light-emitting chip 113 of the present invention includes two color light chips of three primary colors. In one embodiment, the light-emitting chip 113 includes a blue LED chip and a green LED chip, and the quantum dot layer 17 is a red quantum dot layer.

In this embodiment, white light can be formed by mixing blue light, green light and red light. Therefore, the blue LED chip and the green light LED chip emit blue light and green light to jointly excite the red quantum dot layer, and uniform white light can be obtained. At the same time, because of the use of the red quantum dot layer, the advantages of quantum dots can be utilized, for example, the size of the example is controllable and uniform. The excitation conversion efficiency is high and the light efficiency is high, so that the color gamut of the backlight module 10 can be effectively improved, the demand for high color gamut liquid crystal display is satisfied, and the image quality display effect is remarkably improved. In addition, changing the color light of the quantum dot layer 17 from the former two to the current light-emitting chip 113 and the quantum dot layer 17 of one color light can greatly reduce the amount of quantum dots used, because the raw material price of the quantum dots is relatively high, so The backlight module 10 of the present structure can significantly reduce the cost.

In another embodiment, the light emitting chip 113 includes a blue LED chip and a red LED chip, and the quantum dot layer 17 is a green quantum dot layer.

In this embodiment, the blue LED chip and the red LED chip emit blue light and red light to jointly excite the green quantum dot layer, thereby forming uniform white light. This embodiment also reduces the use of quantum dots while ensuring high color gamut liquid crystal display, thereby also reducing the cost of the backlight module 10.

Since the blue light has the highest luminous intensity in the three primary colors, in the above two embodiments, the blue LED chip is used for excitation to ensure the light intensity of the final emitted light. The wavelength of blue light ranges from 400 nm to 480 nm. In the above two embodiments, the wavelength of light emitted by the blue LED chip ranges from 440 nm to 450 nm. The blue light in this wavelength range can also reduce the damage to the human eye while ensuring the intensity of the laser.

Preferably, the material of the quantum dot layer 17 is a perovskite.

In this embodiment, the quantum dot material in the quantum dot layer 17 is different from the conventional quantum dot material, and the perovskite quantum dot not only has excellent luminescence properties such as full-spectrum luminescence and high quantum efficiency, but also has high oxidation resistance. The performance, so that the quantum dot layer 17 can be directly applied to the optical film 15, without using a barrier sheet for protection of water and oxygen barrier, simplifies the process, thereby saving cost. Of course, it is also possible to use the previous quantum dot material, which is directly wrapped with a barrier film of a polymer material during preparation, and has a water-proof and oxygen barrier effect, so that it can be mixed with the glue and coated on the optical film 15.

Referring to FIG. 1, a surface of an optical film 15 adjacent to the light-emitting assembly 11 is provided with a quantum dot layer 17 facing the light-emitting assembly 11.

In the present embodiment, the quantum dot layer 17 is provided on the optical film 15, and may be applied by glue or may be formed by forming a film. Specifically, the quantum dots are applied to the optical film 15 by mixing with the UV glue, and the quantum dots in the quantum dot layer 17 are uniformly dispersed in the UV glue. Selecting the optical film 15 closest to the light-emitting component 11 to coat the quantum dot layer 17 allows the light-emitting chip 113 to directly excite the quantum dot layer 17, so that the excitation efficiency can be improved, and the amount of quantum dots can be reduced, thereby saving cost.

In order to make the intensity distribution of the finally emitted white light uniform, the thickness of the quantum dot layer 17 applied to the optical film 15 is set to be uniform. In this embodiment, the quantum dot layer 17 has a thickness in the range of more than 0 mm and less than or equal to 0.01 mm. The quantum dot layer 17 in the range can ensure the uniformity of the finally emitted white light and save the quantum dot.

Referring to FIG. 1 again, the backlight module 10 further includes a light guide plate 13 adjacent to an end surface of the light guide plate 13 . The optical film 15 faces a surface of the light guide plate 13 . The surface is adjacent to the light guide plate 13 . The end faces are connected, and the quantum dot layer 17 is provided on the surface of the optical film 15 facing the light guide plate 13.

In this embodiment, the backlight is disposed in a side-entry manner, the light-emitting component 11 is located at an end surface of the light guide plate 13, and the optical film 15 is disposed above the light guide plate 13. In addition, the backlight module 10 is further provided with a back plate 14 and a fixing frame 16 . The fixing frame 16 is fixed to the periphery of the back plate 14 , and the back plate 14 can be a sheet metal member. The fixing frame 16 can be selected from plastic or metal materials. The diaphragm 15 is mounted and fixed to the fixing frame 16. Specifically, the fixing frame 16 includes a straight section 161 perpendicular to the backboard 14 and a mounting section 163 extending along the straight section 161. The straight section 161 forms a mounting space 16a with the mounting section 163 and the backboard 14 , and the light emitting component 11 and the light guide plate 13 are mounted on the installation space 16a, and the structure is stable. A heat dissipating member 12 is disposed between the light-emitting assembly 11 and the fixing frame 16, the light guide plate 13 and the back plate 14. The heat dissipating member 12 is made of aluminum material, has good thermal conductivity, is easy to process, and can heat the light-emitting component 11 in time. It is emitted to ensure the service life and working performance of the light-emitting component 11. A side of the mounting section 163 facing away from the backing plate 14 is provided with two stepped grooves 1631. The plurality of optical films 15 are stacked in parallel and mounted on a stepped groove 1631 adjacent to the light guiding plate 13, and are disposed opposite to the light guiding plate 13, and the quantum dots are disposed. The layer 17 is disposed on one side of the optical film 15 on the light guide plate 13, facilitating excitation and improving excitation efficiency. A black rubber strip 131 is disposed between the surface of the light guide plate 13 and the upper surface of the light guide plate 13 for pressing the light guide plate 13 to firmly fix the light guide plate 13, and also prevents light leakage. .

The backlight module 10 further includes a reflective sheet 18 attached to a surface of the light guide plate 13 facing away from the optical film 15. The end of the reflective sheet 18 abuts the light-emitting assembly 11.

In this embodiment, the base material of the reflective sheet 18 is generally polyethylene terephthalate (PET), and a reflective sheet 18 is disposed on the lower surface of the light guide plate 13, so that the unscattered light can be reflected again into the light. The conductive region enters the light guide plate 13 and is emitted from the light guide plate 13 toward the surface of the optical film 15. The reflection of the reflective sheet 18 is specular reflection to improve the utilization of the light-emitting assembly 11. At the same time, the end of the reflection sheet 18 abuts against the light-emitting assembly 11, and the light diverged by the light-emitting assembly 11 can be reflected, thereby further improving the utilization of light.

In addition, the backlight module 10 further includes a circuit board 19, and the plurality of light emitting components 11 are uniformly distributed on the circuit board 19.

In this embodiment, the circuit board 19 is arranged to increase the power support of the light-emitting component 11, and other components for control can be disposed on the circuit board 19. The circuit board 19 is parallel to the side of the backlight module 10, and the plurality of light-emitting components 11 are uniformly disposed on the circuit board 19, so that the provided backlight is uniformly stabilized, so that the final light intensity is evenly distributed in each part.

Another object of the present invention is to provide a display device 100 including a backlight module 10 and a display panel 30. The backlight module 10 is the backlight module 10, and the display panel 30 is disposed on the optical film. 15 faces away from the side of the light guide plate 13. Since the backlight module 10 of the display device 100 adopts all the technical solutions of all the above embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are not repeatedly described herein.

In this embodiment, the display panel 30 is a liquid crystal display panel 30, and the substrate is made of glass. The display panel 30 is disposed on the mounting section 163 of the fixing frame 16, specifically, in the stepped groove 1631 away from the light guide plate 13, and the optical film. The sheets 15 are arranged in parallel and completely cover the optical film 15, so that the light emitted by the backlight module 10 is entirely emitted by the display panel 30, thereby improving the picture quality. In order to fix the backlight module 10 and the display panel 30, the display device 100 is further provided with a front frame 50 which is made of a metal material to ensure the stability of the structure of the display device 100.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structural transformation, or direct/indirect use, of the present invention and the contents of the drawings are used in the inventive concept of the present invention. It is included in the scope of the patent protection of the present invention in other related technical fields.

Claims

A backlight module, comprising:

a plurality of light emitting components, each of the light emitting components comprising a light emitting chip and a light transmissive body portion covering the light emitting chip;

a plurality of optical films, the optical films are arranged in parallel, wherein a surface of an optical film is provided with a quantum dot layer.

Light emitted by the light emitting chip passes through the optical film and the quantum dot layer to generate white light.
The backlight module of claim 1 , wherein the light emitting chip comprises a blue LED chip and a green LED chip, and the quantum dot layer is a red quantum dot layer.
The backlight module of claim 1 , wherein the light emitting chip comprises a blue LED chip and a red LED chip, and the quantum dot layer is a green quantum dot layer.
The backlight module of claim 1 , wherein a surface of an optical film adjacent to the light-emitting component is provided with the quantum dot layer, and the quantum dot layer faces the light-emitting component.
The backlight module of claim 1 , wherein the quantum dot material of the quantum dot layer is a perovskite.
The backlight module of claim 1 , wherein the quantum dot layer has a thickness ranging from greater than 0 mm to less than or equal to 0.01 mm.
The backlight module of claim 2, wherein the quantum dot layer has a thickness ranging from greater than 0 mm to less than or equal to 0.01 mm.
The backlight module according to claim 3, wherein the quantum dot layer has a thickness in a range of more than 0 mm and less than or equal to 0.01 mm.
The backlight module according to claim 4, wherein the quantum dot layer has a thickness in a range of more than 0 mm and less than or equal to 0.01 mm.
The backlight module according to claim 5, wherein the quantum dot layer has a thickness in a range of more than 0 mm and less than or equal to 0.01 mm.
The backlight module of claim 6 , further comprising a light guide plate, the light emitting component is adjacent to an end surface of the light guide plate, and the optical film faces a surface of the light guide plate The surface is connected to an end surface of the light-emitting component adjacent to the light guide plate, and the quantum dot layer is disposed on a surface of the optical film facing the light guide plate.
The backlight module of claim 7 , further comprising a light guide plate, the light emitting component is adjacent to an end surface of the light guide plate, and the optical film faces a surface of the light guide plate The surface is connected to an end surface of the light-emitting component adjacent to the light guide plate, and the quantum dot layer is disposed on a surface of the optical film facing the light guide plate.
The backlight module of claim 8 , further comprising a light guide plate, the light emitting component is adjacent to an end surface of the light guide plate, and the optical film faces a surface of the light guide plate The surface is connected to an end surface of the light-emitting component adjacent to the light guide plate, and the quantum dot layer is disposed on a surface of the optical film facing the light guide plate.
The backlight module of claim 9 , further comprising a light guide plate, the light emitting component is adjacent to an end surface of the light guide plate, and the optical film faces a surface of the light guide plate The surface is connected to an end surface of the light-emitting component adjacent to the light guide plate, and the quantum dot layer is disposed on a surface of the optical film facing the light guide plate.
The backlight module of claim 10, further comprising a light guide plate, the light emitting component is adjacent to an end surface of the light guide plate, and the optical film faces a surface of the light guide plate The surface is connected to an end surface of the light-emitting component adjacent to the light guide plate, and the quantum dot layer is disposed on a surface of the optical film facing the light guide plate.
The backlight module of claim 11 , further comprising a reflective sheet, the reflective sheet being attached to a surface of the light guide plate facing away from the optical film, the reflective sheet The end abuts the light emitting component.
The backlight module of claim 12, further comprising a reflective sheet, the reflective sheet being attached to a surface of the light guide plate facing away from the optical film, the reflective sheet The end abuts the light emitting component.
The backlight module of claim 2, wherein the blue LED chip emits light in a wavelength range of 440 nm to 450 nm.
The backlight module of claim 3, wherein the blue LED chip emits light in a wavelength range of 440 nm to 450 nm.
A display device, comprising the backlight module of claim 1, the backlight module comprising:

a plurality of light emitting components, each of the light emitting components comprising a light emitting chip and a light transmissive body portion covering the light emitting chip;

a plurality of optical films, the optical films are arranged in parallel, wherein a surface of an optical film is provided with a quantum dot layer.

Light emitted by the light emitting chip passes through the optical film and the quantum dot layer to generate white light.