WO2018182945A1 - Adhesive-less carriers for chemical mechanical polishing - Google Patents
Adhesive-less carriers for chemical mechanical polishing Download PDFInfo
- Publication number
- WO2018182945A1 WO2018182945A1 PCT/US2018/021561 US2018021561W WO2018182945A1 WO 2018182945 A1 WO2018182945 A1 WO 2018182945A1 US 2018021561 W US2018021561 W US 2018021561W WO 2018182945 A1 WO2018182945 A1 WO 2018182945A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plate
- polishing
- substrate
- carrier
- vacuum
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019553815A JP2020515424A (en) | 2017-03-30 | 2018-03-08 | Adhesive-free carrier for chemical mechanical polishing |
KR1020197032117A KR20190126190A (en) | 2017-03-30 | 2018-03-08 | Adhesive-free carriers for chemical mechanical polishing |
CN201880014288.4A CN110382165A (en) | 2017-03-30 | 2018-03-08 | Adhesive-free carrier for chemically mechanical polishing |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/474,736 US20180281151A1 (en) | 2017-03-30 | 2017-03-30 | Adhesive-less carriers for chemical mechanical polishing |
US15/474,736 | 2017-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2018182945A1 true WO2018182945A1 (en) | 2018-10-04 |
Family
ID=63672796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2018/021561 WO2018182945A1 (en) | 2017-03-30 | 2018-03-08 | Adhesive-less carriers for chemical mechanical polishing |
Country Status (6)
Country | Link |
---|---|
US (1) | US20180281151A1 (en) |
JP (1) | JP2020515424A (en) |
KR (1) | KR20190126190A (en) |
CN (1) | CN110382165A (en) |
TW (1) | TW201838018A (en) |
WO (1) | WO2018182945A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10510563B2 (en) * | 2016-04-15 | 2019-12-17 | Taiwan Semiconductor Manufacturing Company Ltd. | Wafer carrier assembly |
JP7012454B2 (en) * | 2017-04-27 | 2022-01-28 | 株式会社岡本工作機械製作所 | Manufacturing method of electrostatic suction chuck and manufacturing method of semiconductor device |
JP7045861B2 (en) * | 2018-01-17 | 2022-04-01 | 株式会社ディスコ | Support base |
CN111244015B (en) * | 2020-01-20 | 2023-07-21 | 杭州立昂东芯微电子有限公司 | Wafer bonding-releasing auxiliary carrier disc, bonding-releasing machine and bonding-releasing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07290355A (en) * | 1994-04-25 | 1995-11-07 | Nippon Steel Corp | Polishing device |
US5938512A (en) * | 1996-12-27 | 1999-08-17 | Shin-Etsu Handotai Co., Ltd. | Wafer holding jig |
US6030488A (en) * | 1997-02-06 | 2000-02-29 | Speedfam Co., Ltd. | Chemical and mechanical polishing apparatus |
EP1125686A1 (en) * | 1999-02-12 | 2001-08-22 | Shin-Etsu Handotai Co., Ltd | Work holding disc for polishing, work polishing apparatus, and work polishing method |
US20060245138A1 (en) * | 2003-07-14 | 2006-11-02 | Koh Meng F | Perforated plate for water chuck |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63210148A (en) * | 1987-02-26 | 1988-08-31 | Nikko Rika Kk | Plastic sinter for vacuum chuck |
US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
JP2000167762A (en) * | 1998-12-04 | 2000-06-20 | Speedfam-Ipec Co Ltd | Carrier and cmp device |
US6462928B1 (en) * | 1999-05-07 | 2002-10-08 | Applied Materials, Inc. | Electrostatic chuck having improved electrical connector and method |
US6752703B2 (en) * | 2001-12-21 | 2004-06-22 | Lam Research Corporation | Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film |
JP4180068B2 (en) * | 2005-06-03 | 2008-11-12 | 株式会社荏原製作所 | Polishing apparatus and method |
JP2007158190A (en) * | 2005-12-07 | 2007-06-21 | Nikon Corp | Suction device, polishing device, semiconductor device manufacturing method, and semiconductor device manufactured by the method |
JP2007258240A (en) * | 2006-03-20 | 2007-10-04 | Tokyo Electron Ltd | Surface processing method |
WO2009013941A1 (en) * | 2007-07-23 | 2009-01-29 | Creative Technology Corporation | Substrate suction apparatus and method for manufacturing the same |
JP2009113149A (en) * | 2007-11-06 | 2009-05-28 | Disco Abrasive Syst Ltd | Grinder |
TWI439351B (en) * | 2008-09-29 | 2014-06-01 | Nitto Denko Corp | Adsorption tablets |
CN202053163U (en) * | 2011-03-03 | 2011-11-30 | 中芯国际集成电路制造(上海)有限公司 | Grinding head |
-
2017
- 2017-03-30 US US15/474,736 patent/US20180281151A1/en not_active Abandoned
-
2018
- 2018-03-08 WO PCT/US2018/021561 patent/WO2018182945A1/en active Application Filing
- 2018-03-08 KR KR1020197032117A patent/KR20190126190A/en unknown
- 2018-03-08 JP JP2019553815A patent/JP2020515424A/en active Pending
- 2018-03-08 CN CN201880014288.4A patent/CN110382165A/en active Pending
- 2018-03-28 TW TW107110645A patent/TW201838018A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07290355A (en) * | 1994-04-25 | 1995-11-07 | Nippon Steel Corp | Polishing device |
US5938512A (en) * | 1996-12-27 | 1999-08-17 | Shin-Etsu Handotai Co., Ltd. | Wafer holding jig |
US6030488A (en) * | 1997-02-06 | 2000-02-29 | Speedfam Co., Ltd. | Chemical and mechanical polishing apparatus |
EP1125686A1 (en) * | 1999-02-12 | 2001-08-22 | Shin-Etsu Handotai Co., Ltd | Work holding disc for polishing, work polishing apparatus, and work polishing method |
US20060245138A1 (en) * | 2003-07-14 | 2006-11-02 | Koh Meng F | Perforated plate for water chuck |
Also Published As
Publication number | Publication date |
---|---|
US20180281151A1 (en) | 2018-10-04 |
JP2020515424A (en) | 2020-05-28 |
CN110382165A (en) | 2019-10-25 |
TW201838018A (en) | 2018-10-16 |
KR20190126190A (en) | 2019-11-08 |
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