WO2018178314A1 - Constructions de cartes métalliques sans contact - Google Patents

Constructions de cartes métalliques sans contact Download PDF

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Publication number
WO2018178314A1
WO2018178314A1 PCT/EP2018/058248 EP2018058248W WO2018178314A1 WO 2018178314 A1 WO2018178314 A1 WO 2018178314A1 EP 2018058248 W EP2018058248 W EP 2018058248W WO 2018178314 A1 WO2018178314 A1 WO 2018178314A1
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WO
WIPO (PCT)
Prior art keywords
metal
module
slit
smartcard
transponder chip
Prior art date
Application number
PCT/EP2018/058248
Other languages
English (en)
Inventor
David Finn
Mustafa Lotya
Darren Molloy
Original Assignee
Féinics Amatech Teoranta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/818,785 external-priority patent/US20190156073A1/en
Application filed by Féinics Amatech Teoranta filed Critical Féinics Amatech Teoranta
Priority to CA3057941A priority Critical patent/CA3057941A1/fr
Priority to AU2018241289A priority patent/AU2018241289B2/en
Priority to EP18714769.9A priority patent/EP3602681A1/fr
Priority to KR1020197031136A priority patent/KR102544674B1/ko
Publication of WO2018178314A1 publication Critical patent/WO2018178314A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Definitions

  • the disclosure relates broadly to RFID devices including “smartcards", “affluent metal cards”, or “payment objects” (or “payment devices”) such as financial payment cards, RFID enabled SIM cards (or payment cards, electronic tickets, chip cards and the like) and wearable devices (activity tracking bands, watches, smart jewelry, rings, bangles, cuffs, bracelets, talisman charms, lockets and the like) having RFID (radio frequency identification) chips or chip modules (CM) capable of operating in a "contactless” mode (ISO 14443 or NFC/ISO 15693), including dual interface (DI) smartcards which can also operate in "contact” mode (ISO 7816-2) and, more particularly, to antenna modules (AM), transponder chip modules (TCMs), Coupling Frames (CFs), Coupling Frame Antennas (CFAs) or Transponder Chip Modules (TCMs), including transponder chip modules with integrated Coupling Frame (CF), suitable for implanting, embedding, insertion or
  • RFID devices including "nonsecure smartcards and tags" such as contactless cards in the form of keycards, hotel room keys in the form of a metal card, medic-alert tags, access control cards, loyalty cards, frequent traveler cards, security badges, key-fobs, wearable devices, mobile phones, tokens, small form factor tags, data carriers and the like operating in close proximity with a contactless reader.
  • nonsecure smartcards and tags such as contactless cards in the form of keycards, hotel room keys in the form of a metal card, medic-alert tags, access control cards, loyalty cards, frequent traveler cards, security badges, key-fobs, wearable devices, mobile phones, tokens, small form factor tags, data carriers and the like operating in close proximity with a contactless reader.
  • a smartcard is an example of an RFID device that has a transponder chip module (TCM) or an antenna module (AM) disposed in a card body (CB) or inlay substrate.
  • TCM transponder chip module
  • AM antenna module
  • a passive antenna module (AM) or transponder chip module (TCM) may be powered by RF from an external RFID reader, and may also communicate by RF with the external RFID reader.
  • a dual-interface antenna module (AM) or transponder chip module (TCM) may also have a contact pad array (CPA), typically comprising 6 or 8 contact pads (CP, or "ISO pads") disposed on a “face-up side” or “contact side” (or surface) of the module tape (MT), for interfacing with a contact reader in a contact mode (ISO 7816).
  • a connection bridge (CBR) may be disposed on the face-up side of the tape for effecting a connection between two components such as the module antenna and the RFID chip on the other face-down side of the module tape.
  • a conventional antenna module (AM) or transponder chip module (TCM) may be generally rectangular, having four sides, and measuring approximately 8.2mm x 10.8mm for a 6- contact module and 11.8mm x 13.0mm for an 8-contact module.
  • a generally rectangular transponder chip module (TCM) may have a larger or smaller form factor than a conventional transponder chip module (TCM).
  • the transponder chip module (TCM) may be round, elliptical, or other non-rectangular shape.
  • a module antenna (MA) may be disposed on the module tape (MT) for implementing a contactless interface, such as ISO 14443 and NFC/ISO 15693.
  • Contact pads (CP) may be disposed on the module tape (MT) for implementing a contact interface, such as ISO 7816.
  • the module antenna (MA) may be wire-wound, or etched, for example:
  • the module antenna (MA) may comprise several turns of wire, such as 50 ⁇ diameter insulated wire. Reference may be made to US 6378774 (2002, Toppan), for example FIGs. 12A, B thereof.
  • the module antenna (MA) may be a chemically-etched planar antenna (PA) structure.
  • PA planar antenna
  • the module antenna (MA) may comprise a laser-etched planar antenna (PA) structure (LES).
  • PA laser-etched planar antenna
  • a planar antenna (PA) structure or simply “planar antenna (PA)", whether chemically-etched (CES) or laser-etched (LES) is a type of antenna structure (AS) and may comprise a long conductive trace or track having two ends, in the form of a planar, rectangular spiral, disposed in an outer area of a module tape (MT), surrounding the RFID chip on the facedown side of the module tape.
  • MT module tape
  • the track (or trace) width may be approximately ⁇ .
  • the planar antenna may be fabricated on other than the module tape, such as on a separate substrate, and joined to the module tape.
  • a module antenna (MA) connected to an RFID chip (CM), typically on a substrate or module tape (MT), may be referred to as a "transponder chip module”, or simply as a “transponder”, or as a “module”.
  • CM RFID chip
  • MT module tape
  • TCM transponder chip module
  • RFID device such as (but not limited to) a smart card.
  • a transponder chip module may generally comprise an RFID chip and a module antenna disposed on one (face-down) side of a module tape, and contact pads on an opposite (face-up) side of the module tape.
  • a contactless mode e.g., ISO 14443, 15693
  • the techniques disclosed herein may be applicable to dual-interface transponder chip modules capable of operating in both contactless and contact modes (e.g., ISO 7816).
  • RFID devices comprising (i) a transponder chip module (TCM) having an RFID chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having a slit (S) and opening (MO) to accept a TCM.
  • the coupling frame may be disposed closely adjacent the transponder chip module so that the slit and opening overlaps the module antenna.
  • the RFID device may be a payment object such as an ISO metal card body with a slit (S) to function as a coupling frame.
  • Coupling frames (CF) in combination with transponder chip modules (TCMs) may provide for inductive coupling with a contactless reader or point of sale terminal, or another RFID device. Coupling frames (CF) in combination with transponder chip modules (TCMs) may enhance (including enable) or boost contactless communication between the transponder chip module and a contactless terminal.
  • a "coupling frame” may comprise a metal layer, metal frame, metal plate or any electrically-conductive medium or surface with an electrical discontinuity such as in the form of a slit (S) or a non-conductive stripe extending from an outer edge of the layer to an inner position thereof, the coupling frame (CF) capable of being oriented so that the slit (S) overlaps (crosses-over) the module antenna (MA) of the transponder chip module (TCM), such as on at least one side thereof.
  • the slit (S) may be straight, and may have a width and a length. In some embodiments, the slit (S) may extend to an opening (MO) for accepting the transponder chip module.
  • Coupling frames of this type typically a layer of metal with an opening for receiving a transponder chip module, and a slit extending from a periphery of the layer to the opening, wherein the slit overlaps at least a portion of the module antenna, may be found in US 9812782, US 9390364, US 9634391, US 9798968, and US 9475086.
  • the overlap of the slit with the module antenna may be less than 100%.
  • the width and length of the slit can significantly affect the resonance frequency of the system and may be used as a tuning mechanism. As the width of slit changes, there is a resulting change in the overlap of the slit with the antenna.
  • the coupling frame may be disposed in close proximity to a transponder chip module, such as atop the module, so that the slit (or other discontinuity) overlaps at least a portion of the module antenna of the transponder chip module, so that the coupling frame enhances (including enables) coupling between the transponder chip module and another RFID device such as a contactless reader.
  • the slit is not overlapping the antenna, communication with the transponder chip module may be suppressed (or inhibited, including disabled).
  • the coupling frame may be incorporated into an RFID device such as a smart card, it may constitute substantially the entire body of a metal smart card, it may be incorporated into the transponder chip module, and it may comprise a component of a payment object.
  • the chip (IC) In order to satisfy communication requirements for a given smartcard application, in terms of maximum communication read/write range for example, the chip (IC) must have a minimum power level delivered to it.
  • the module antenna (MA) inductance, resistance and capacitance all affect the power level delivered to the chip (IC); at the maximum communication distance from the reader antenna, the module antenna (MA) is delivering the minimum chip (IC) power level.
  • This disclosure also relates to passive RFID devices operating on the principle of inductive coupling to effectuate data communication and harvest energy with and from a contactless reader and to drive active elements, in particular for integration into payment and identification objects.
  • the invention(s) described herein may relate to industrial and commercial industries, such RFID applications, payment smartcards, payment smartcards with dynamic displays, identity cards, loyalty cards, access control cards, payment objects, wearable devices, smart jewelry and the like.
  • a metal smartcard has a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another.
  • TCM transponder chip module
  • MA module antenna
  • CB card body
  • ML discontinuous metal layers
  • Each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another.
  • One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP).
  • the invention focuses on the arrangement of metal layers which are coupling frames, in a card body of a smartcard.
  • the transponder chip module is addedto the smartcard after the card body is already manufactured.
  • a metal smartcard may comprise at least two metal layers, each having a slit (S) and functioning as a coupling frame (CF).
  • the card body of the smartcard may comprise:
  • a first metal layer (ML, FCB) with a first slit (SI) extending from an outer edge thereof to a first module opening (MOl) for accepting a transponder chip module (TCM), the first metal layer functioning as a first coupling frame (CF1); and a second metal layer (ML,RCB) with a second slit (S2) extending from an outer edge thereof to a second module opening (M02) for accepting a transponder chip module (TCM), the second metal layer functioning as a second coupling frame (CF2);
  • the two coupling frames (CFl, CF2) mechanically support one another in particular around the two slits (SI, S2) and module openings (MO).
  • the slits (SI, S2) in the various metal layers (CFl, CF2) may each overlap a portion of a module antenna (MA) of the transponder chip module (TCM).
  • the slits of the different metal layers may be oriented or positioned differently than one another so that they are not aligned with one another.
  • the first metal layer may be provided with a recess to accommodate (receive) the second metal layer.
  • the two metal layers may be separated by a layer of non-conductive material, such as an adhesive film.
  • the second metal layer may form the back of the smartcard, and may contain (support) any or all of a magnetic strips (MS); a signature panel (SP); and a hologram.
  • One or both of the coupling frames may be connected to a device circuit to power the circuit or improve the read/write performance of the smartcard in conjunction with a reader.
  • the second module opening (M02) in the second metal layer (CF2) may be replaced by an elongated, contoured or looped slit (S2) or multiple slits (S) to improve overall mechanical stability of the smartcard.
  • the smartcard and transponder chip module may be passive, harvesting power from an external reader.
  • the module antenna in the transponder chip module may comprise a planar antenna comprising a single long conductive track laid out in a spiral pattern.
  • the front card body may have a thickness of 760 ⁇ to 800 ⁇ .
  • the rear card body may have a a thickness of 300 ⁇ to 400 ⁇ .
  • the resulting smartcard may be operable in both contact and contactless modes. Contact mode would be facilitated by contact pads on the front surface of the smartcard. However, it is generally preferred that the smartcard be intended (and used) only in a contactless mode.
  • metal smartcard being described herein is “predominantly” metal, and may include other materials such as protective layers, signature panel, the transponder chip module itself, ink, etc.
  • the invention(s) described herein may relate to industrial and commercial industries, such RFID applications, payment smartcards, loyalty cards, gift cards, hotel keycards, identity cards, access control cards, wearable devices the like.
  • FIGs Some figures may be in the form of diagrams. Some elements in the figures may be exaggerated, others may be omitted, for illustrative clarity.
  • Some elements may be referred to with letters ("AM”, “BA”, “CB”, “CCM”, “CM”, “MA”, “MT”, “PA”, “TCM”, etc.) rather than or in addition to numerals.
  • Some similar (including substantially identical) elements in various embodiments may be similarly numbered, with a given numeral such as “310”, followed by different letters such as “A”, “B”, “C”, etc. (resulting in “310A”, “310B”, “3 IOC”), and variations thereof, and may be collectively (all of them at once) or individually (one at a time) referred to simply by the numeral ("310").
  • the figures presented herein may show different embodiments of RFID devices, such as smart cards, solid metal cards, plastic hybrid metal cards (also know as embedded metal cards) or payment objects such as wearable devices. Some of the drawings may omit components such as the transponder chip module or module antenna, for illustrative clarity. Some of the figures may show only components of an RFID device, such as coupling frames.
  • FIG. 1 is a diagram (cross-sectional view) of a dual-interface smart card (SC) and readers.
  • FIG. 2A is a diagram (cross-sectional view) illustrating a coupling frame in a card body of a smart card.
  • FIG. 2B is a diagram (partial perspective view) illustrating smart card having a metal card body modified to function as a coupling frame.
  • FIG. 3A is a diagrammatic view of a front surface of a smart card (SC) which may be a metal card or composite metal card having a slit (S) to function as a coupling frame (CF).
  • SC smart card
  • S slit
  • CF coupling frame
  • FIG. 4A is a diagram (perspective view) illustrating an assembly of a metal smart card
  • FIG. 4B is a diagram (rear view) illustrating the shape and features of the rear card body
  • RBC module opening
  • S slit
  • SP signature panel
  • FIG. 5A is a diagram (perspective view) illustrating an assembly of a metal smart card
  • FIG. 5B is a diagram (rear view) illustrating the shape and features of the rear card body
  • MS signature panel
  • SP signature panel
  • FIG. 6 A is a diagram (perspective view) illustrating an assembly of a metal smart card composed primarily of two coupling frames (CF) with parallel slits (S) which omits a module opening (MO) in the rear of the smart card.
  • CF coupling frames
  • S parallel slits
  • MO module opening
  • FIG. 6B is a diagram (rear view) of the rear of a metal smart card featuring a rear card body
  • RBC magnetic stripe
  • SP signature panel
  • FIG. 1 is a diagram (cross-sectional view) of a conventional dual-interface smart card (SC) and readers, as exemplary of an RFID device.
  • This RFID device is "dual interface" since it can interact either with external contact readers (e.g., ISO 7816) or with contactless readers (e.g., ISO 14443, 15693).
  • external contact readers e.g., ISO 7816
  • contactless readers e.g., ISO 14443, 15693
  • the diagram illustrates a smart card SC (100) in cross-section, along with a contact reader (e.g., ISO 7816) and a contactless reader (e.g., ISO 14443).
  • An antenna module (AM, or transponder chip module TCM) 102 may comprise a module tape (MT) 110, an RFID chip (CM or IC) 112 disposed on one side (face-down) of the module tape MT along with a module antenna (MA) 114 for interfacing with the contactless reader.
  • the antenna module (AM) may comprise contact pads (CP) 116 disposed on the other (face-up) side of the module tape (MT) for interfacing with the contact reader.
  • the card body (CB) 120 comprises a substrate which may have a recess (R) 122 extending into one side thereof for receiving the antenna module (AM).
  • the recess R may be stepped - such as wider at the surface of the card body (CB) - to accommodate the profile of the antenna module AM.
  • the booster antenna (BA) 130 may comprise turns (or traces) of wire (or other conductor) embedded in (or disposed on) the card body CB, and may comprise a number of components such as (i) a card antenna (CA) component 132 and (ii) a coupler coil (CC) component 134. It may be noted that, as a result of the recess R being stepped, a portion of the card body (CB) may extend under a portion of the antenna module (AM), more particularly under the module antenna (MA).
  • RFID devices having only a contactless interface may be described.
  • RFID devices having a coupling frame rather than a booster antenna may be described.
  • the booster antenna in an RFID device may be eliminated, or replaced by a "coupling frame" (CF).
  • CF coupled frame
  • the overall function of both a booster antenna and a coupling frame are to enhance (improve) coupling and communication between a transponder chip module (TCM) and an external contactless reader (or with another RFID device).
  • a coupling frame may generally comprise a conductive, planar surface or element (such as a conductive layer, or a conductive foil) having an outer edge, and discontinuity such as a slit (S) or a non-conductive stripe extending from the outer edge of the conductive surface to an interior position thereof.
  • the coupling frame may be a curved surface, rather than being planar.
  • Most of the coupling frames described herein may have a "continuous" surface, and may comprise a foil or sheet or layer of metal having a slit (an electrical discontinuity) for overlapping a module antenna and, in some cases having an appropriate opening (MO) for accommodating mounting the transponder chip module.
  • Coupling frames may be printed, and may be made up of a wire grid or array (such as wire embedding wire (copper or silver) and making a physical connection through overlapping wires to create a coupling frame.
  • the coupling frame could also be a metal mesh.
  • the slit (S) represents a mechanical and electrical discontinuity.
  • a “discontinuous” coupling frame could be made from a solid metal layer, or from embedding wire in a suitable pattern in a substrate, both of which would be arranged to exhibit a slit/discontinuity.
  • a coupling frame may be disposed closely adjacent to (in close proximity, or juxtaposed with) a transponder chip module (TCM) having a module antenna (MA) so that the slit (S) overlaps (traverses, over or under) at least a portion of the module antenna.
  • TCM transponder chip module
  • MA module antenna
  • the slit (S) may extend from a position external to the module antenna, crossing over (or overlapping) at least some of the traces of the module antenna, such as extending over all of the traces on one side of the module antenna and may further extend into the interior area (no-man's land) of the module antenna.
  • the coupling frame CF may be positioned so that the slit S overlaps or traverses at least some of the traces of the module antenna MA on at least one side thereof.
  • the slit S may extend at least partially, including completely across only one side of the module antenna, and may extend further across a central area ("no-mans land") of the module antenna (devoid of traces) to the opposite side of the module antenna.
  • the coupling frame and the module antenna may both be substantially planar, positioned very close together, parallel with one another, and separated by an air gap or dielectric layer which may be no greater than ⁇ , 50 ⁇ or 20 ⁇ .
  • the closer the coupling frame is to the module antenna (smaller separation) the better the communication (such as read/write performance) with the external contactless reader will be. With increasing separation distance, the read/write performance may degrade.
  • the coupling frame may enhance communication (signal, power) between an external contactless reader and the transponder chip module when the slit is positioned across (to traverse) the traces of the module antenna on at least one side thereof.
  • Transponder chip modules are conventionally incorporated into RFID devices which are smart cards (including plastic smartcard, metal smartcard, metal veneer smartcard, hybrid smartcard).
  • a coupling frame can be incorporated into the smart card. Refer to US 9,475,086.
  • a coupling frame may be incorporated into the transponder chip module itself. Refer to US 9,390,364.
  • transponder chip modules may be incorporated into other RFID devices, such as payment objects comprising wearable devices, smart jewelry and payment accessories.
  • a coupling frame may be incorporated in metal payment devices to enable contactless communication.
  • a coupling frame may be incorporated in any RFID device having multiple transponder chip modules to selectively enable communication with a given one of the transponder chip modules. Multiple coupling frames may be incorporated into a given RFID device.
  • a coupling frame may substitute (eliminate the need) for a booster antenna in an RFID device.
  • a transponder chip module (with or without its own coupling frame) can be incorporated into an RFID device such as a smartcard or a payment object.
  • the device may constitute a passive transponder.
  • a smartcard may comprise a metal layer which is modified (typically with a slit appropriately located vis-a-vis the module antenna) to function as a coupling frame.
  • An entire metal card body of a metal smart card may be provided with a slit (S, or other discontinuity) to function as a coupling frame.
  • An entire metal card body of a metal smart card may be provided with a slit (S, or other discontinuity) together with inserted or interlocking metal panels, each of which may be provided with a slit (S, or other discontinuity).
  • a metal layer of a hybrid smartcard (having dielectric layer and metal layer) may be provided with a slit (S, or other discontinuity) to function as a coupling frame.
  • a payment object may comprise a "wearable" device embodied in a jewelry item, bangle, bracelet or the like having a metal component modified (typically with a slit appropriately located vis-a-vis the module antenna) to function as a coupling frame
  • a card body can be made from aluminum and directly coloured by anodizing procedures.
  • Jewelry items may be manufactured to have a rustic appearance that wears (or acquires a patina) during use such that the appearance of the product improves over time.
  • a metal layer in a metal hybrid smartcard may comprise a metal core having two metal layers with slits located in different (including opposite) directions, or otherwise offset from each other (including in the same direction), and said metal layers electrically insulated by a dielectric such as a screen printed adhesive film or a pre-assembled adhesive/plastic laminate.
  • the metal may layer may have recesses milled or etched one side over the area of the slit to accommodate a re-enforcing structure to prevent bending of the finished card around the area of the slit (S).
  • Metal jewelry items having transponders incorporated therein may operate as payment objects.
  • the metal would normally operate like a faraday cage with all electromagnetic transmission, and reception would be impaired.
  • a transponder device (with or without its own coupling frame integrated therein) may be located, embedded or inserted into the metal charm and can couple with the metal charm which in turn couples with the external contactless reader generating the electromagnetic field.
  • the slit (S) in a coupling frame may be linear (straight) or curved, and may have a width of approximately 20 microns, 50 microns, 100 microns, 500 microns, l-2mm and a length of approximately 8- 13mm, but may have other dimensions and form factors.
  • the slit (S) may be arranged to overlap (traverse) the traces of the module antenna at 90° thereto, or at another angle.
  • the slit (S) may be other than straight.
  • the slit (S) may be disguised as part of the card artwork or its presence may invisible (hidden, rendered inconspicuous) by the application of lacquers and inks.
  • the slit (S) may be widened to enable display of artwork or form a visible decorative feature, the area of the slit may be filled with a decorative panel that may be of different material, texture or colour from other elements of the card.
  • the coupling frame may be on a different plane than the module antenna.
  • the slit of the coupling frame may overlap or traverse at least some outer turns (or traces) of the module antenna on one side thereof, including overlapping all of the turns of the module antenna on the one side thereof and extending into (above) the inner area (no- mans land) of the module antenna.
  • the slit may be long enough to overlap one or more turns of the module antenna on an opposite side of the module antenna.
  • the slit may be wide enough to overlap one or more inner turns of the module antenna on one or both adjacent side(s) of the module antenna.
  • a transponder chip module (with or without its own coupling frame) can be incorporated into an RFID device which may be a smartcard or other payment object.
  • a coupling frame may be movable so as to selectively enable (enhance) or disable (suppress) communication with a transponder chip module incorporated into the RFID device.
  • a coupling frame may be associated with two or more transponder chip modules in a single RFID device, and may be movable to selectively enable one or the other of, or neither one of the transponder chip modules.
  • FIG. 2A shows an example of a smart card 200 with a coupling frame (CF) 220 incorporated into its card body (CB) 202 which has a stepped recess (R).
  • a transponder chip module (TCM) 210 has a planar antenna (PA) which may be a laser-etched antenna structure (LES) 212.
  • the coupling frame (CF) has an opening (MO) 208 for receiving the transponder chip module (TCM).
  • the coupling frame (CF) may have a slit (not visible) extending from the opening (MO) to an outer edge of the coupling frame (CF).
  • the dashed line indicates, schematically, that the coupling frame may comprise a metal layer in a stackup of a card body.
  • An inner edge of the coupling frame (CF) may overlap (or underlie) at least some outer turns of the module antenna (MA), which may be a planar antenna (PA) which is laser- etched antenna structure (LES) in the transponder chip module (TCM). Viewed from another perspective, an outer portion of the module antenna (MA may overhang an inner portion of the coupling frame (CF).
  • the coupling frame (CF) may enhance communication between the transponder chip module and another RFID device such as a contactless reader.
  • the transponder chip module may be dual-interface, supporting both contactless and contact communication with external readers.
  • FIG. 2B illustrates a transponder chip module (TCM) 210 disposed in the card body (CB) 202 of a metal smartcard (SC) 200, or metal card (MC), wherein substantially the entire card body (e.g., 760 ⁇ thick) comprises metal, and may be referred to as a metal card body (MCB).
  • the transponder chip module (TCM) may reside in an opening (MO) 208 extending completely through the card body, the opening may be stepped, having a larger area portion and smaller area portion, as shown. This may result in a void 203 behind the transponder chip module (TCM), and the void may be filled with non-conductive filler 204.
  • the void behind the transponder chip module may allow electromagnetic radiation from an external reader to interact with the transponder chip module.
  • a slit (S) 230 extends from an outer edge of the metal card body (MCB) to the opening (MO) and may overlap (underneath, as viewed) an outer portion of the module antenna (MA) 212 which may be a laser-etched antenna structure (LES). Similarly, a slit may be provided through a metal layer of a hybrid smart card. The slit (S) modifies the metal card body (MCB) or layer, allowing it to operate as a coupling frame 220 to enhance contactless communication with the transponder chip module.
  • FIG. 2B is illustrative of a coupling frame 220 substantially surrounding a transponder chip module and having an opening to accommodate the transponder chip module.
  • transponder chip module may be shown in the illustrations of this and some other embodiments, it should be understood that many of the techniques described herein may be applicable to coupling frames having a slit, without a module opening. Such coupling frames may not be strictly coplanar with the transponder chip module, but they may be disposed closely adjacent and parallel thereto.
  • Metal payment objects such as metal smart cards may feature a cavity to accommodate the transponder chip module TCM.
  • the cavity may not completely penetrate the payment object, or it may be covered from one face by a continuous metal.
  • the transponder chip module may be shielded from the continuous metal layer by magnetic shielding material. This allows the cavity to be concealed.
  • the slit may be concealed by jewels or crystals.
  • FIGs. 2C and 2D of US 9,475,086 there is typically a sizeable opening (module opening MO, central opening CO) in the body of the coupling frame to accommodate the transponder chip module, and the slit S in the coupling frame extends from the opening to an outer edge of the coupling frame.
  • module opening MO central opening CO
  • slit S in the coupling frame extends from the opening to an outer edge of the coupling frame.
  • the coupling frame was typically substantially coplanar with the module antenna, and typically surrounded it.
  • a coupling frame CF may be a planar (or non-planar, 3D) conductive element having an outer periphery (edge) and having a slit S extending from its outer edge to an inner location on the conductive element.
  • the coupling frame may be disposed (arranged) to overlap the transponder chip module, and may be oriented (arranged) so that the slit S overlaps (traverses over, or under) the turns (traces) of the module antenna on one side thereof.
  • the inner end of the slit S need not terminate in a distinct opening sized to accommodate the transponder chip module TCM. Essentially, it is the slit rather than the opening that dictates the electrical characteristics of the coupling frame.
  • Some of the coupling frames disclosed herein may be non-planar, including curved or tubular.
  • coupling frames and transponder chip modules may be integrated into payment objects, which may also be referred to as "payment devices”, or simply “devices”.
  • FIG. 3A illustrates the front side of a smartcard (SC) 300 which may be a metal card having a metal layer (ML), which may constitute substantially the entire thickness of the card body (CB) 302.
  • the card body (CB) may have a module opening (MO) 308 wherein a transponder chip module (TCM) 310 may be disposed, and a slit (S) 330 extending from the module opening (MO) to the outer perimeter of the metal layer (ML) so that the metal card body (MCB) 302 may function as a coupling frame (CF) 320.
  • SC smartcard
  • MCM transponder chip module
  • S slit
  • the metal layer (ML) (or card body CB, or metal card body MCB) may comprise stainless steel, titanium, or any other metal or metal alloy and is provided with a slit, slot or gap in the metal to create an open loop coupling frame (CF) closely adjacent to and substantially fully surrounding the transponder chip module (TCM).
  • ML metal layer
  • CF open loop coupling frame
  • the slit (S) may overlap at least a portion of the module antenna (MA, not shown) of the transponder chip module.
  • This concept of modifying a metal element to have a slit (S) to function as a coupling frame (CF) may be applied to other products which may have an antenna module (AM) or transponder chip module (TCM) integrated therewith, such as watches, wearable devices, and the like.
  • AM antenna module
  • TCM transponder chip module
  • the slit (S) may extend completely (fully) through the metal layer (ML) forming the coupling frame (CF).
  • the slit (S) may extend only partially through the metal layer, and remaining material of the metal layer below the slit (S) may have a thickness below a transparency threshold or skin depth for the metal layer.
  • the slit (S) may have a width which is smaller than the opening.
  • the slit (S) may be at least partially filled with an electrically nonconducting material selected from the group consisting of polymer and epoxy resin, reinforced epoxy resin.
  • a reinforcing structure (RS) may be disposed at a location of the slit (S) to reinforce the metal layer (ML).
  • An activation distance for a transponder chip module (TCM) disposed in (or under, or above) the opening (MO) of the coupling frame may be at least 20 mm; at least 25 mm; at least 30 mm; at least 35 mm; up to 40 mm; and more than 40 mm.
  • a component element may be connected across the slit such as a capacitor to enhance performance.
  • the transponder chip module may also house a capacitor to improve coupling.
  • FIG. 4A illustrates an exploded view of a solid metal smartcard comprising two metal layers (ML) attached together (joined with one another ) by an adhesive film (AF) 405.
  • the front card body (FCB) 402 composed of a metal layer (ML) contains a first module opening (MOl) 403 that accepts a specially designed transponder chip module (TCM) 401.
  • the front card body (FCB) 402 may have thickness 760 ⁇ to 800 ⁇ .
  • the rear card body (RCB) 408 fits into a pocket milled, etched, stamped or otherwise formed in the rear side of the front card body (FCB) 402.
  • the front card body (FCB) 402 comprises a first slit (SI) 404 that allows the front card body (FCB) 402 to perform as a coupling frame (CF).
  • the module antenna on the transponder chip module (TCM) 401 may have suitable overlap with the front card body (FCB) 402 to allow optimum performance of the device when operating in contactless communication with an external reader.
  • An insert 406 made of plastic or other suitable non-conductive material may be disposed behind the first module opening (MOl) 403 in the front card body (FCB) 402 and may be milled or otherwise shaped to accommodate the volume occupied by the chip IC and encapsulation from the transponder chip module (TCM) 401.
  • An insert adhesive 407 in film or liquid form may be provided to bond the insert 406 to the card.
  • the rear card body (RCB) 408 is composed of a metal layer (ML), featuring a second module opening (M02) 412 and a second slit (S2) 409; it behaves as a coupling frame (CF).
  • the rear card body (RCB) 402 may have thickness 300 ⁇ to 400 ⁇ .
  • the insert 406 may be composed of multiple parts and may contain a tuning circuit with antenna windings and/or capacitors to influence the resonant characteristics of the smartcard.
  • FIG. 4B shows the outer face of the rear card body (RCB) 408 panel.
  • the second slit (S2) 409 is shown in this example as commencing from an internal edge of the panel with respect to the overall perimeter of the assembled card. It is noted that a small gap is provided between the internal edges of the rear card body (RCB) 408 and the front card body (FCB) 402 in order to prevent electrical short circuiting of the second slit (S2) 409, this gap may be of the order of 10 ⁇ to 50 ⁇ .
  • the rear card body (RCB) 408 also features two recesses that may be formed by any appropriate technique including laser ablation, chemical etching or milling. One recess may be used to accommodate a magnetic stripe, i.e.
  • MSR magnetic stripe recess
  • SPR signature panel recess
  • Either one or both of the front card body (FCB) 402 and the rear card body (408) may be coated in a dielectric material.
  • the coating may be a hard wearing decorative black diamond-like-carbon (DLC) with characteristics of very high electrical resistivity. This may be achieved by control of the ratio of conductive carbon (e.g. graphitic sp 2 hybridised and amorphous carbon) to insulating carbon (e.g. diamond type sp 3 hybridised carbon).
  • Alternative coatings may be considered and may be transparent or other colour, this also includes the use of paints and lacquers or layers of coatings to achieve a desired finish.
  • the coating(s) may be applied to any or all of the surfaces or edges of either of the front card body (FCB) 402 or rear card body (RCB) 408 in order to provide the necessary electrical isolation between the two panels and enable each to perform as a coupling frame (CF).
  • FCB front card body
  • RBC rear card body
  • S2 slit
  • M02 second module opening
  • Either one or both of the front card body (FCB) 402 and the rear card body (RCB) 408 may be electrically connected, across their respective slits (SI, S2) or other locations to a device or circuit assembly in order to power a circuit or to improve the read/write performance of the smartcard with respect to a reader antenna.
  • the additional circuit or device may be housed in a layer independent of the FCB and RCB and may, for example, reside between them, interacting with the induced eddy currents in each of the coupling frames (CF1, CF2).
  • the slits (SI, 404; S2, 409) may be made discrete and less visible by cutting them to a narrow width (e.g. 10 ⁇ , 20 ⁇ , 50 ⁇ to 150 ⁇ ), this may be achieved by laser cutting for example.
  • the apparent width of the slits (SI , 404; S2, 409) may be reduced by the thickness of coating applied to front or rear card bodies (FCB 402, RCB 408).
  • FCB 402, RCB 408 front or rear card bodies
  • each edge of the slits (SI, 404; S2, 409) may have a coating thickness of 5 microns thereby reducing the apparent slit width by 10 microns.
  • Alternative coating types or use of multiple coating layers may have allow a greater reduction in apparent slit width.
  • FIG. 5A illustrates an exploded view of a similar construction to that shown in FIG. 4A and FIG. 4B with similar layout of transponder chip module (TCM) 501, front card body (FCB) 502, first slit (SI) 504, module opening (MO) 503 and adhesive film (AF) 505.
  • TCM transponder chip module
  • FCB front card body
  • SI first slit
  • MO module opening
  • AF adhesive film
  • the design does not necessarily feature an insert at the module position.
  • the rear card body (RCB) 506 may comprise a second slit (S2) 507 and accommodates the magnetic stripe (MS) 508 and signature panel (SP) 509.
  • FIG. 5B shows the outer face of the rear card body (RCB) 506.
  • the panel shown features a magnetic strip recess (MSR) 510 and a signature panel recess (SPR) 511.
  • the rear card body does (RCB) 506 not feature a module opening (MO) as described previously. Instead, the design features an extended slit (S2) 507 which runs inwards from an edge of the rear card body (RCB) 506 panel that is internal to the metal smart card and describes a loop around an area overlapping the module antenna (MA) of the transponder chip module (TCM) 501.
  • S2 extended slit
  • the second slit (S2) 507 is formed, such as as-shown, to leaves an area of solid metal behind the transponder chip module (TCM) 501 instead of a module opening (MO).
  • the second slit (S2) 507 in this manner may enable the rear card body (RCB) 506 to function as a coupling frame (CF) by directing induced eddy currents around the module antenna (MA) and permitting inductive coupling.
  • the design of the second slit (S2) 507 in this manner eliminates the need for an insert or other fill material to cover a module opening (MO) and prevents the occurrence of a potential weak spot in the card body behind the transponder chip module (TCM) 501.
  • the slit (S2) 507 may describe any shape, including spiral, in order to optimise the overlap of the coupling frame with a given module antenna (MA).
  • the slit (S2) 507 may have varying width along its length, e.g. it may begin at the edge of the panel at a width of 100 ⁇ and widen when in proximity to the module antenna (MA) to 300 ⁇ in order to increase the radio frequency communication performance of the device.
  • the slits (SI, 504; S2, 507) may be filled with resin or other material to prevent ingress of liquid or debris during use of the card.
  • the slit (S2) 507 may also be concealed by placement of a security hologram, logo or other feature.
  • FIG. 6A shows an exploded view of a variation of a solid metal dual interface card.
  • the first slit (SI) 604 of the front card body (FCB) 602 runs parallel to the second slit (S2) 607 of the rear card body (RCB) 606 but is off-set in position such that the slits do not overlap, thereby increasing the mechanical stability of the card near the position of the transponder chip module (TCM) 601.
  • TCM transponder chip module
  • the configuration shown may apply equally to a rear card body (RCB) 606 panel that includes a module opening (MO) and second slit (S2).
  • FIG. 6B shows a rear view of the assembled solid metal dual interface card, excluding the magnetic stripe (MS) 608 and signature panel (SP) 609.
  • the offsetting of the positions of the slits (SI) 604 and (S2) 607 is shown, such that the slits do not overlap.
  • the rear card body (RCB) 606 fits into a pocket milled, etched, stamped or otherwise formed in the rear side of the front card body (FCB) 602.
  • the pocket may allow the rear card body (RCB) 606 to be wrapped around its perimeter by a frame from the front card body (FCB) 602. This frame may serve a role in stabilising the front card body (FCB) 602 during production of the pocket.
  • the pocket is formed by a milling tool stress on the metal layer (ML) comprising the front card body (FCB) 602 may cause permanent warping.
  • the presence of the frame as shown in FIG. 6B may add rigidity and stability to the front card body (FCB) 602 and to the overall card assembly.
  • an easily machined metal or metal alloy may be chosen for some or all of the card construction. This could include various alloys of stainless steel or aluminium alloys such as duralumin.
  • An additional benefit to using a metal alloy relates to the reading and writing of data to the high coercivity magnetic stripe (MS) 608.
  • MS high coercivity magnetic stripe
  • Placing the magnetic stripe on top of a nonmagnetic metal or metal alloy e.g. 300 series stainless steel, aluminium, aluminium alloys, titanium results in reduced data corruption and problems reading data using conventional magnetic stripe readers.
  • FCB front card body
  • RBCB rear card body
  • the assembly process may include any of the following but not limited to: buffing, cleaning, lamination, printing, lacquering, laser engraving, surface coating, sandblasting and insertion of filler materials into voids and slits (S).
  • S surface coating
  • S sandblasting

Landscapes

  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne une carte à puce métallique (SC) comprenant un module de puce répondeur (TCM) présentant une antenne de module (MA), et un corps de carte (CB) comprenant deux couches métalliques discontinues (ML), chaque couche ayant une fente (S) chevauchant l'antenne de module, et les fentes étant orientées différemment l'une de l'autre. Une couche métallique peut être un corps de carte avant (FCB, CF1), et l'autre couche peut être un corps de carte arrière (RCB, CF2) ayant une bande magnétique (MS) et une bande de signature (SP).
PCT/EP2018/058248 2017-03-29 2018-03-29 Constructions de cartes métalliques sans contact WO2018178314A1 (fr)

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CA3057941A CA3057941A1 (fr) 2017-03-29 2018-03-29 Constructions de cartes metalliques sans contact
AU2018241289A AU2018241289B2 (en) 2017-03-29 2018-03-29 Contactless metal card constructions
EP18714769.9A EP3602681A1 (fr) 2017-03-29 2018-03-29 Constructions de cartes métalliques sans contact
KR1020197031136A KR102544674B1 (ko) 2017-03-29 2018-03-29 비접촉 금속 카드 구조

Applications Claiming Priority (4)

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US201762478208P 2017-03-29 2017-03-29
US62/478,208 2017-03-29
US15/818,785 US20190156073A1 (en) 2017-11-21 2017-11-21 Smartcard constuctions
US15/818,785 2017-11-21

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EP3671561A1 (fr) * 2018-12-21 2020-06-24 Thales Dis France SA Procede de fabrication d'une carte a puce radiofrequence metallique a permittivite electromagnetique amelioree
KR20210076954A (ko) * 2016-07-27 2021-06-24 컴포시큐어 엘엘씨 트랜잭션 카드들을 위한 오버몰딩된 전자 컴포넌트들 및 그 제조 방법들
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US12086669B2 (en) 2017-10-18 2024-09-10 Composecure, Llc Metal, ceramic, or ceramic-coated transaction card with window or window pattern and optional backlighting
US12093772B2 (en) 2018-01-30 2024-09-17 Composecure, Llc DI capacitive embedded metal card

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KR20230074913A (ko) * 2021-11-22 2023-05-31 코나엠 주식회사 안테나 특성이 향상된 금속 ic 카드 및 금속 ic 카드의 제조 방법

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US12093772B2 (en) 2018-01-30 2024-09-17 Composecure, Llc DI capacitive embedded metal card
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CA3057941A1 (fr) 2018-10-04
KR20190137824A (ko) 2019-12-11
KR102544674B1 (ko) 2023-06-19
AU2018241289A1 (en) 2019-10-24
EP3602681A1 (fr) 2020-02-05
AU2018241289B2 (en) 2022-12-08

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