WO2018165922A1

WO2018165922A1 - Secure ic protection structure and circuit board

Info

Publication number: WO2018165922A1
Application number: PCT/CN2017/076813
Authority: WO
Inventors: 邹志强
Original assignee: 深圳大趋智能科技有限公司
Priority date: 2017-03-15
Filing date: 2017-03-15
Publication date: 2018-09-20
Also published as: CN107980243A

Abstract

A secure IC protection structure, with a secure IC (1) being arranged on a main board (2). The protection structure comprises a protective wall (3) and a filler (4), wherein the protective wall (3) is fixedly connected to the main board (2) and is connected in a head-to-tail manner to form a protection space, and the secure IC (1) is arranged in the protection space. The filler (4) is filled in the protection space surrounded by the protective wall (3), so that the protection strength among various protection structures is improved, the physical protection for encrypted information is enhanced, and the information storage is more secure and comprehensive.

Description

Safety IC protection structure and circuit board

[0001] The present invention relates to the field of circuit component protection, and in particular to a security ic protection structure and circuit board.

[0002] IC (integrated circuit), that is, an integrated circuit is a microelectronic device or component. Using a certain process, interconnecting the components, such as transistors, resistors, capacitors, and inductors required in a circuit, on a small or small piece of semiconductor wafer or dielectric substrate, and then packaged in a single package. , to become a micro-structure with the required circuit function; all the components are structurally integrated, making electronic components a big step toward micro-miniature, low power consumption, intelligence and high reliability. It is indicated in the circuit by the letter "IC".

[0003] POS (Point Of Sale) is a sales terminal with non-cash settlement function, which is widely used in supermarkets, chain stores, hypermarkets, restaurants and other places. Because it involves the transaction of bank cards, it has high requirements on its security performance. It is necessary to ensure that important data such as keys in the P0S machine are not stolen. In order to standardize the security performance of the P0S machine, the Payment Card Industry Data Security Standards Committee has developed the PCI international certification standard. The PCI certification standard aims to strictly control the data security to ensure the payment security of payment card users online transactions; The Terminal Security Specification also specifies physical security requirements for point-of-sale (P0S) terminals.

[0004] Conventional safety IC physical protection is generally protected by a core area surrounded by FPCs, covers, zebra strips, carbon power, and plastic brackets. However, this kind of protection is generally safe. If someone else breaks these protections, the security IC is completely exposed to the attacker.

technical problem

[0005] A primary object of the present invention is to provide a security IC protection structure to solve the above problem of low degree of protection of the security IC.

Problem solution

Technical solution [0006] The present invention provides a security IC protection structure, the security IC is disposed on a motherboard, including a protection wall and a filler.

[0007] The protection wall is fixedly connected to the main board, and is connected end to end to form a protection space, and the safety IC is disposed in the protection space;

[0008] The filler is filled in a protective space surrounded by the protective wall.

[0009] Further, the safety IC protection structure further includes a trigger, and the trigger is disposed in the protection wall and electrically connected to the safety IC, and sends a trigger signal to control the safety IC.

[0010] Further, the safety IC protection structure further includes a first cover plate provided with an inductive line, the first cover plate is fixedly connected to the protection wall, and the sensing circuit is electrically connected to the trigger.

[0011] Further, the safety IC protection structure further includes an induction winding layer, and the induction winding layer is disposed in the protection wall and electrically connected to the trigger.

[0012] Further, the safety IC protection structure further includes a sensing wire mesh, wherein the sensing wire mesh is disposed in the filler and electrically connected to the trigger.

[0013] Further, the security IC protection structure further includes a signal protection layer, where the signal protection layer includes a first protection circuit layer, a second protection circuit layer, and an encryption signal layer.

[0014] The first protection circuit layer and the second protection circuit layer are oppositely disposed on the inner layer of the main board, wherein the protection line in the first protection circuit layer is electrically connected to the trigger through a blind hole on the main board. The protection circuit in the second protection circuit layer is electrically connected to the trigger through the buried hole in the motherboard;

[0015] The encrypted signal layer is disposed between the first signal protection layer and the second signal protection layer, and the encrypted line in the encrypted signal layer is electrically connected to the security IC through the buried via.

Further, in the above-described security IC protection structure, the encrypted signal layer is composed of a combination of two or more circuit layers.

[0017] Further, the safety IC protection structure further includes a bracket and a second cover, wherein the bracket is disposed on the main board and surrounds the protection wall; the second cover is disposed on the bracket, and Cover the area around the bracket.

[0018] Further, in the safety IC protection structure described above, the filler is an epoxy resin.

[0019] The present invention provides a circuit board comprising the security IC protection structure of any of the above.

Advantageous effects of the invention Beneficial effect

[0020] The security IC protection structure of the present invention improves the security IC by adding a protective wall and a filler, and improves the protection circuit by adding sensing lines and triggers to the inner wall of the protection wall, the filler and the main board. The protection between the protection structures enhances the physical protection of the encrypted information, making the information storage safer and more comprehensive.

Brief description of the drawing

DRAWINGS

1 is a cross-sectional structural diagram of a safety IC protection structure according to an embodiment of the present invention;

2 is a cross-sectional structural diagram of a safety IC protection structure according to an embodiment of the present invention;

3 is a schematic cross-sectional structural view of a region A of a safety IC protection structure according to an embodiment of the present invention;

[0024] 1, the security IC; 2, the motherboard; 3, the protection wall; 4, the filler; 5, the trigger; 6, the first cover; 7, the induction winding layer; 8, the induction network; Signal protection layer; 10, bracket; 11, second cover; 91, first protection circuit layer; 92, second protection circuit layer; 93, encrypted signal layer.

[0025]

The implementation, functional features and advantages of the objects of the present invention will be further described with reference to the accompanying drawings.

BEST MODE FOR CARRYING OUT THE INVENTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of them Example. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.

[0028] It should be noted that all the directional indications (such as up, down, left, right, front, back, ...) in the embodiment of the present invention are only used to explain the components in a certain posture (as shown in the drawing). The relative positional relationship, the motion situation, and the like, if the specific posture changes, the directional indication also changes accordingly, and the connection may be a direct connection or an indirect connection.

In addition, the descriptions of "first", "second" and the like in the present invention are used for descriptive purposes only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. . Thus, features defining "first" and "second" may include at least one of the features, either explicitly or implicitly. In addition, each The technical solutions between the embodiments may be combined with each other, but must be based on the realization of those skilled in the art, and when the combination of the technical solutions is contradictory or impossible to implement, it should be considered that the combination of the technical solutions does not exist, It is not within the scope of protection required by the present invention.

1 , in an embodiment of the present invention, a security IC protection structure is provided. The security IC 1 is disposed on the main board 2, and includes a protection wall 3 and a filler 4. The protection wall 3 and the motherboard are 2, the fixed connection, and the first end connection to form a protection space, the safety IC1 is disposed in the protection space; the filler 4 is filled in the protection space enclosed by the protection wall 3.

[0031] The security IC1 is preferably a Z32 HUA (D512) security chip developed by National Technology Co., Ltd. in the embodiment of the present invention;

[0032] The protective wall 3 is generally used to protect the exposed pins of the above-mentioned safety IC1 and the above-mentioned main board 2, wherein the protective wall 3 is closely connected, and the space formed is generally rectangular, circular, and rhombic. In the embodiment of the present invention, it is preferably a square shape, which is most suitable for the structural shape of the above-mentioned safety IC1, and can maximize the area of the above-mentioned main board 2, and is convenient for the above-mentioned main board 2 Arrangement of various circuit components;

[0033] The filler 4 is generally used to protect the lead and the chip core exposed in the area surrounded by the safety IC 1 and the protective wall 3, wherein the filler 4 is generally a flexible solid body with good insulation and heat dissipation performance. Preferred in the embodiment of the invention is an epoxy resin;

[0034] wherein the protective wall 3 and the filler 4 are generally provided with a touch-type sensing circuit that varies according to the pressure received by the protective wall 3, and the touch-type sensing circuit is electrically connected to the safety IC1. When the pressure applied to the protective wall 3 causes the induced voltage to deviate from the set range, the above-mentioned safety IC 1 automatically destroys the internally stored encrypted information to prevent information leakage.

[0035] Referring to FIG. 2, in the embodiment, the safety IC protection structure further includes a trigger 5, and the trigger 5 is disposed in the protection wall 3 and electrically connected to the safety IC1 to send a trigger signal. Control the above safety IC1.

[0036] The trigger 5 is generally used to prevent the protection wall 3 or the filler 4 from being damaged, which causes the safety I C1 to be attacked, and the voltage signal fed back by the sensing circuit in the protection wall 3 or the filler 4 After the value deviates from the set range, the trigger 5 sends a destruction signal to the security IC1. After receiving the destruction signal, the security IC1 destroys the internally stored encrypted information, wherein the trigger 5 is generally connected to the built-in power supply. Connect, provide working energy for the above trigger.

[0037] In the embodiment, the safety IC protection structure further includes a first cover plate 6 provided with an inductive line, the first cover plate 6 is fixedly connected to the protection wall 3, the sensing circuit and the above The trigger 5 is electrically connected.

[0038] The first cover plate 6 is generally used to protect the trigger 5 in the protective wall 3 to prevent the trigger ring 5 from being attacked and causing the protection circuit to fail. The first cover 6 is provided with an induction. The circuit is connected to the trigger 5, and when the first cover 6 is smashed or broken, causing the voltage value on the sensing line to deviate from the set range, the trigger 5 sends a destruction signal to the safety IC1. After receiving the destruction signal, the security IC 1 destroys the internally stored encrypted information, wherein the sensing circuit is generally a mesh metal structure or a mesh conductive material, and the mesh structure is generally disposed on the inner wall of the first cover 6 In the present invention, the sensing circuit preferably includes two layers, and the two layers of sensing lines are parallel to the sidewall of the first cover 6 in the embodiment of the present invention. If one or two layers of voltage values deviate from the set range, the trigger 5 will send a destroy signal to the above-mentioned safety IC1, and the above-mentioned safety IC1 destroys the signal after receiving the destruction signal. The encrypted information stored in the portion, wherein the shape of the first cover plate 6 is generally the same as the planar shape of the outer side wall of the protective wall 3, and the area is the same, or the shape of the first cover plate 6 and the above protection The inner and outer side walls of the wall form the same planar shape.

In the embodiment, the safety IC protection structure further includes an inductive winding layer 7, and the inductive winding layer 7 is disposed in the protective wall 3 and electrically connected to the trigger 5.

[0040] The inductive winding layer 7 is generally connected to the trigger 5, and when the protective wall 3 is attacked, causing the voltage value on the inductive winding layer 7 to deviate from the set range, the flip-flop 5 will Sending the destruction signal to the security IC1, the security IC1 destroys the internally stored encryption information after receiving the destruction signal, wherein the sensing wire network 8 can also enhance the physical protection effect of the protection wall 3, so that the filler structure It is more stable and strengthens to prevent the above-mentioned protective wall 3 from being exposed to the lead of the above-mentioned safety IC1. The above-mentioned induction winding layer 7 is generally a mesh metal structure or a mesh conductive material, and the mesh structure is generally The inductive winding layer 7 preferably comprises two layers, and the two layers of the inductive winding layer 7 are parallel to the sidewall of the protective wall 3, in the embodiment of the present invention. If one or two layers of voltage values deviate from the set range, the trigger 5 will send a destruction signal to the above-mentioned safety IC1, and the above-mentioned safety IC1 destroys the internal storage after receiving the destruction signal. Confidential information. In the embodiment, the safety IC protection structure further includes a sensing wire net 8 disposed in the filler 4 and electrically connected to the trigger 5 .

[0042] The sensing wire net 8 is generally connected to the trigger 5, and when the filler 4 is attacked, causing the voltage value on the sensing wire 8 to deviate from the set range, the trigger 5 will send a destruction signal. To the above-mentioned security IC1, the security IC1 destroys the internally stored encrypted information after receiving the destruction signal, wherein the sensing wire mesh 8 can also enhance the physical protection effect of the filler 4, so that the filler structure is more stable and strengthened. Preventing the above-mentioned filler 4 from being exposed to the lead or chip core of the above-mentioned safety IC1, wherein the sensing wire mesh 8 is generally a mesh metal structure or a mesh conductive material, and the mesh structure is generally disposed on the above In the filler 4, in the present invention, the sensing wire mesh 8 preferably comprises two layers, and the two layers of the sensing wire mesh 8 are parallel to the main board 2, and when one or two layers of voltage values deviate from the set range 吋The trigger 5 above sends a destruction signal to the security IC1, and the security IC1 destroys the internally stored encryption after receiving the destruction signal. Information.

In the embodiment, the security IC protection structure further includes a signal protection layer 9, and the signal protection layer 9 includes a first protection circuit layer 91, a second protection circuit layer 92, and an encryption signal layer 93. A protection circuit layer 91 and a second protection circuit layer 92 are oppositely disposed on the inner layer of the main board 2, wherein the line in the first protection circuit layer 91 is electrically connected to the flip-flop 5 through a blind hole on the main board 2, The circuit in the second protection circuit layer 92 is electrically connected to the flip-flop 5 through a buried hole in the main board 2; the encrypted signal layer 93 is respectively disposed between the first signal line layer 91 and the second signal line layer 92. The line in the encrypted signal layer 93 is electrically connected to the safety IC 1 through the buried via.

[0044] The first protection circuit layer 91 is generally used to protect the motherboard 2, and the connection between the security IC1 and the motherboard 2 is prevented, and the line buried in the inner layer of the motherboard 2 and the security IC1 is attacked. , thereby leaking encrypted information;

[0045] The second protection circuit layer 92 is generally used to protect the motherboard 2, and prevents the back surface of the connection surface between the security IC1 and the motherboard 2 from being attacked, thereby causing a line buried in the inner layer of the motherboard 2 to be connected to the security IC1. Being attacked, thereby revealing encrypted information;

[0046] The first protection circuit layer 91 and the second protection circuit layer 92 are generally one or more protection lines. The protection circuit is preferably an inductive circuit in the embodiment of the present invention, and is triggered by the above. The device 5 is electrically connected, when the motherboard 2 is attacked, causing the voltage value on the sensing circuit to deviate from the set range, The trigger 5 will send a destruction signal to the above-mentioned security IC1, and the security IC1 destroys the internally stored encrypted information after receiving the destruction signal;

[0047] The above-mentioned encryption signal layer 93 is generally used for signal transmission between the above-mentioned security IC1 and each circuit element. Preferably, in the embodiment of the present invention, the signal communication traces between the circuit elements are disposed on the main board 2 The first protection circuit layer 91 and the second protection circuit layer 92 of the inner layer are prevented from attacking the communication line of other circuit components, thereby extending the attack to the above-mentioned security IC 1.

In the above embodiment, the security IC protection structure, the encryption signal layer 93 is composed of two or more layers of winding layers, wherein the encryption signal layer 93 is preferably in the embodiment of the present invention. It consists of a combination of two layers of winding layers.

[0049] In the embodiment, the security IC protection structure further includes a bracket 10 and a second cover 11 disposed on the main board 2 and surrounding the protection wall 3; the second cover The plate 11 is disposed on the bracket 10 and covers the area surrounded by the bracket 10.

[0050] The bracket 10 and the second cover 11 are generally used to protect two important electrical components of the motherboard, so as to prevent internal components from being damaged due to external attacks or oscillations;

[0051] wherein the bracket 10 is fixedly connected to the main board and encloses a peripheral protection space, and the safety IC1 and the circuit thereof are disposed in the peripheral protection space to prevent the circuit from being attacked; the second cover shape 1 1 The bracket 10 is similar in shape and planarly connected to the bracket 10; the second cover and the bracket are generally made of a material that is resistant to high temperature, toughness, and flame retardant.

[0052] In the embodiment, in the above-mentioned safety IC protection structure, the filler 4 is an epoxy resin, and the epoxy resin generally refers to an organic compound having two or more epoxy groups in a molecule, and a relative molecule. The quality is not high. The molecular structure of the epoxy resin is characterized by the presence of an active epoxy group in the molecular chain, and the epoxy group may be located at the end, in the middle or in a ring structure of the molecular chain. Since the molecular structure contains an active epoxy group, they can be cross-linked with various types of curing agents to form an insoluble polymer having a three-dimensional network structure. A polymer compound containing an epoxy group in a molecular structure is collectively referred to as an epoxy resin. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small deformation shrinkage, good dimensional stability, high hardness and flexibility. Good in properties, stable to alkali and most solvents, so it is widely used in various sectors of national defense and national economy for casting, dipping, laminating, bonding, coating, etc. The grease is generally classified into mechanical epoxy resin adhesive, construction epoxy resin adhesive, electronic epoxy resin adhesive, repair epoxy resin adhesive, transportation adhesive, marine adhesive, etc. In the embodiment of the invention, the epoxy resin type is an electronic epoxy resin adhesive.

The present invention provides a circuit board including the security IC protection structure described in any of the above embodiments.

[0054] The above circuit board is generally used for a sensitive information storage circuit, an internal transaction circuit of a pos machine, and an encrypted communication circuit.

[0055]

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and the equivalent structure or equivalent process transformations made by the description of the present invention and the drawings are used directly or indirectly. Other related technical fields are equally included in the scope of patent protection of the present invention.

Claims

Claim

A security IC protection structure, the security IC is disposed on a main board, and is characterized in that: a protection wall and a filler are included,

The protection wall is fixedly connected to the main board, and is connected end to end to form a protection space, and the safety IC is disposed in the protection space;

The filler is filled in a protective space enclosed by the protective wall.

The safety IC protection structure according to claim 1, further comprising a trigger, the trigger being disposed in the protection wall and electrically connected to the safety IC, and transmitting a trigger signal to control the safety IC.

The safety IC protection structure according to claim 2, further comprising a first cover plate provided with an inductive line, the first cover plate being fixedly connected to the protection wall, the sensing line and the The trigger is electrically connected.

The safety IC protection structure according to claim 2, further comprising an inductive winding layer, wherein the inductive winding layer is disposed in the protection wall and electrically connected to the trigger

[Claim 5] The safety IC protection structure according to claim 2, further comprising a sensing wire mesh, wherein the sensing wire mesh is disposed in the filler and electrically connected to the trigger.

[Claim 6] The security IC protection structure according to claim 2, further comprising a signal protection layer, wherein the signal protection layer comprises a first protection circuit layer, a second protection circuit layer, and an encryption signal layer,

The first protection circuit layer and the second protection circuit layer are oppositely disposed on the inner layer of the main board, wherein the protection line in the first protection circuit layer passes through the blind hole on the main board and the trigger Connecting, the protection circuit in the second protection circuit layer is electrically connected to the trigger through a buried hole in the main board;

The encrypted signal layer is disposed between the first signal protection layer and the second signal protection layer, and the encrypted circuit in the encrypted signal layer is electrically connected to the security IC through the buried hole.

[Claim 7] The security IC protection structure according to claim 6, wherein the encryption signal layer is composed of a combination of two or more circuit layers. [Claim 8] The security IC protection structure according to claim 1, further comprising a bracket and a second cover, the bracket being disposed on the main board and surrounding the protection wall; The second cover plate is disposed on the bracket and covers the area surrounded by the bracket.

[Claim 9] The security IC protection structure according to any one of claims 1 to 3, wherein the filler is an epoxy resin.

[Claim 10] A circuit board comprising the security IC according to any one of claims 1-9

Protection structure.