Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/50—Fixed connections
  • H01R12/51—Fixed connections for rigid printed circuits or like structures
  • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
  • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
  • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
  • H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10189—Non-printed connector
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3447—Lead-in-hole components

Definitions

• the invention relates to components with electrical connection elements for contacting a printed circuit board and at least one component support for support on the printed circuit board, an assembly aid for soldering a component and methods for soldering a component to the printed circuit board.
• the invention relates in particular to the assembly of components on printed circuit boards and their positioning prior to connection to the printed circuit board with a center of gravity that prevents a stable position after Bestü- ckung.
• the invention has for its object to overcome the above drawbacks and to propose ways that allow assembly of the circuit board with electronic / electromechanical components that must be kept in a stable position during assembly.
• the component has a balancing weight that stabilizes the component after mounting the device on a circuit board in its position and holds in its loading position.
• the component can be held in position after positioning on the circuit board for the subsequent connection process. It is, for example, regardless of whether it is a surface mounted device (SMT) or the through-hole mounting (THT) of the device.
• SMT surface mounted device
• THT through-hole mounting
• the balance weight loose or be fixedly arranged on the component.
• the balance weight can be arranged loosely as a laying-on part on the component and removed after the connection of the component to the circuit board again.
• a temporary fixation by means of magnetic force can take place.
• Another possibility is the fixed permanent attachment or integration on the device.
• the balancing weight via appropriate fastening means or integrated in the contour of the component as an additional assembly aid is releasably or not releasably attached to the component already in the production or is attached later.
• the placement aid can be pluggable or rupturable attached to the device to remove them after the process can, if the assembled printed circuit board must be placed in a housing that requires the space in which the placement aid and in particular the balance weight.
• the balance weight magnetically, so that the force for the positioning is additionally or exclusively applied by magnetic forces between the balance weight and magnetic elements on the circuit board.
• the balance weight can be dimensioned with a lower mass.
• the placement aid is supported on the printed circuit board in order to relieve the holding element with which the balance weight of the placement aid is fastened to the component. However, this is only possible if a corresponding space on the circuit board is present.
• the placement aid is mounted so that it is above the usual placement level of the flatter components and thus blocks any circuit board surface.
• the object is further achieved by an assembly aid for fastening, preferably for soldering, a component on a printed circuit board which has at least one balance weight and can be connected to the component.
• the assembly aid itself is thus an additional part, the direct provided with the component for assembly is formed. It can be attached directly to the component and be removed by breaking or be connected to the device by plugging in at least one corresponding plug-in opening.
• the placement aid may also include one or more surfaces for sucking or gripping the component by pick-and-place robots.
• the method for solder-mounting a device having an unfavorable center of gravity during assembly with one or more of the aforementioned features provides the following steps: providing a printed circuit board with electrical connections;
• the method takes into account the production of SMT components as well as THT components both in the wave soldering process and in the reflow process.
• the feature melting and solidifying also applies to the use of a conductive adhesive.
• the present invention makes it possible to position components with different shapes with linear movements on a printed circuit board and to keep them in the correct orientation for the soldering process.
• the assembly takes place without forces and thus favors the automation and the use of, for example, pick-and-place robots.
• the placement aid enables a secure stand during the soldering process, such as in the reflow and in the wave soldering process. It is also possible to work with conductive adhesive. After solidification of the solder joints, the placement aid can be easily removed due to the detachable connection, as well as for electronic operation non-functional parts of the components, such as the support element.
• existing device connectors up to individual contacts can be automatically equipped as angled variants in printed circuit boards and soldered, for example, in a reflow process.
• Figure 1 is a schematic representation of a THT device, a placement aid and a printed circuit board in the mounted state on the circuit board
• Figure 2 is a schematic representation of a THT device with an integrated balance weight in the mounted state on the circuit board
• FIG. 3 is a schematic representation of a THT device similar to FIG.
• the embodiment shown in the figures shows the schematic structure in a side view of the invention involved components, consisting of a printed circuit board 1, in this case THT component 4 (in contrast to an SMT component) in the form of a connector with a External thread 3 and contact pins 7, and a placement aid 14.
• the circuit board 1 has holes 2, which are aligned with each other so that they can accommodate all to be soldered connection elements 5 of the device 4 at the same time.
• at least one component support 12 is provided on the component 4 in the vicinity of the connection elements 5.
• the bores 2 serve to receive the connection elements 5 of the component 4.
• Figure 1 shows the device 4 with a placement aid 14, which has a balance weight 9, which is connected via a web 1 1, which is fixedly connected to the component 4 in the embodiment.
• the bridge 1 1 is stable enough formed to take the compensating forces. The figure is not significantly drawn. If the assembly aid 14 interferes with the assembly in a housing, not shown, the assembly aid can be removed after soldering, in which the web 1 1 is broken off on the component 4.
• the Weight In this exemplary embodiment, a court support 10 which additionally supports the balance weight 9 of the placement aid 14 on the printed circuit board 1 additionally has.
• the balance weight 9 is arranged in height to the circuit board 1 so that it is above a mounting plane for flat components, such as a resistor 8. Thus, the space available on the circuit board space can be exploited.
• FIG. 1 shows the device 4 with a placement aid 14, which has a balance weight 9, which is connected via a web 1 1, which is fixedly connected to the component 4 in the embodiment.
• the bridge 1 1 is stable enough formed to take the compensating
• FIG. 2 shows the component 4 without an assembly aid 14 as in FIG. 1.
• a balance weight 9 ' can be provided. be integrated into the component 4, so that a stable position can also be achieved here with appropriate dimensioning.
• FIG. 2 schematically shows a balancing weight 9 'which runs over the entire circumference of the connector 4 shown as component 4.
• the balance weight 9 ' is located laterally of the component support 12, which is offset in the component 4 according to Figure 2 with respect to the component support 12 in Figure 1.
• FIG. 3 substantially corresponds to the embodiment of FIG. 2, wherein identical elements have the same reference numerals.
• the initial weight 9 is designed as a loose Auflegeteil on the THT component 4. This can, for example, insert in a recess, lie directly on the component 4 or be held by a magnetic force.

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=61952496

Family Applications (1)

Country Status (5)

Citations (5)

Family Cites Families (2)

• 2017
  • 2017-03-08 DE DE102017104819.7A patent/DE102017104819A1/de active Pending
• 2018
  • 2018-03-07 JP JP2019600130U patent/JP3225989U/ja active Active
  • 2018-03-07 WO PCT/DE2018/100205 patent/WO2018162005A1/de active Application Filing
  • 2018-03-07 CN CN201890000586.3U patent/CN211457577U/zh active Active
  • 2018-03-08 TW TW107107818A patent/TW201836452A/zh unknown

Patent Citations (5)

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