WO2018153246A1 - 耳机插座及移动终端 - Google Patents

耳机插座及移动终端 Download PDF

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Publication number
WO2018153246A1
WO2018153246A1 PCT/CN2018/075441 CN2018075441W WO2018153246A1 WO 2018153246 A1 WO2018153246 A1 WO 2018153246A1 CN 2018075441 W CN2018075441 W CN 2018075441W WO 2018153246 A1 WO2018153246 A1 WO 2018153246A1
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WIPO (PCT)
Prior art keywords
pin
ground pin
earphone
additional
earphone socket
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Ceased
Application number
PCT/CN2018/075441
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English (en)
French (fr)
Inventor
刘焕红
胡莎莎
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Publication of WO2018153246A1 publication Critical patent/WO2018153246A1/zh
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Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding   with earth pin, blade or socket
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Definitions

  • the present application relates to the field of mobile terminal technologies, and in particular, to a headset socket of a mobile terminal and the mobile terminal.
  • the metropolitan area has a gap on the metal casing.
  • the PCB corresponding to the gap on the metal casing is also formed on the PCB of the mobile terminal.
  • the board gap forms a slot antenna.
  • the mobile phone terminal such as the earphone socket E1 of the mobile phone
  • the earphone socket is hole-shaped and extends through the gap F1 of the PCB board P1.
  • the ground pin G1 of the headphone jack E1 usually needs to be connected to the audio module Y1 of the mobile terminal or the like via the ground line X1 on the PCB board P1 of the mobile terminal.
  • the grounding wire X1 on the PCB board generally needs to cross the gap F1 on the PCB board P1, and the grounding wire X1 crossing the gap F1 tends to easily interfere with the slot antenna, affecting the performance of the slot antenna.
  • the present application provides a headphone jack and a mobile terminal, which do not affect the normal use of the headphone function, and can avoid or reduce the influence on the slot antenna.
  • a mobile terminal including a PCB board, an audio module, and a headphone jack, wherein the PCB board is provided with a first opening having a half opening, the earphone socket includes a grounding pin, and the earphone socket is characterized in that the earphone socket A first additional ground pin and a second additional ground pin are further included, the first additional ground pin and the second additional ground pin are electrically connected to the ground pin, and the second additional ground pin is used to pass The first metal connection line is connected to the audio module, wherein the metal connection line is disposed on the PCB board and bypasses a gap of the PCB board.
  • a headphone jack disposed on a PCB board of a mobile terminal, the earphone jack includes a ground pin, the headphone jack further includes a first additional ground pin and a second additional ground pin, first An additional ground pin and a second additional ground pin are electrically coupled to the ground pin, the second additional ground pin for connecting to the audio module through a first metal connection that bypasses a gap in the PCB board.
  • the mobile terminal and the earphone socket of the present application by adding a first additional ground pin and a second additional ground pin electrically connected to the ground pin at the earphone socket, and passing the second additional ground pin through the PCB
  • the first metal connection line of the slot of the board is connected to the audio module, which can avoid the interference of the ground line through the slot to the slot antenna.
  • FIG. 1 is a schematic view of a prior art earphone jack.
  • FIG. 2 is a schematic overall diagram of a mobile terminal according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a part of a mobile terminal according to an embodiment of the present application.
  • FIG. 4 is a schematic view of a headphone jack according to an insertion direction in an embodiment of the present application.
  • FIG. 2 is an overall schematic diagram of the mobile terminal 100 .
  • the mobile terminal 100 includes a headphone jack 1 and a housing 200.
  • the housing 200 is provided with a slit 201 parallel to the top end or bottom end of the mobile terminal 100 near the top end and/or the bottom end.
  • the earphone socket 1 is disposed at a top end or a bottom end of the mobile terminal 100 and extends through the slot 201.
  • the mobile terminal 100 further includes a PCB (printed circuit board) board 2 and an audio module 3.
  • the PCB board 2 is provided with a semi-opening slit 21, and the position of the slit 21 on the PCB board 2 corresponds to the position of the slit 201 on the outer casing 200.
  • the slit 21 of the PCB board 2 and the slit 201 on the outer casing 200 constitute the main structure of the slot antenna.
  • the earphone socket 1 is disposed on the PCB board 2.
  • the earphone socket 1 includes a ground pin GND, a first additional ground pin GND1, and a second additional ground pin GND2. As shown in FIG. 1, the ground pin GND, the first additional ground pin GND1, and the second additional ground pin GND2 are all electrically connected. The first additional ground pin GND1 and the ground pin GND are located on the same side of the earphone socket 1, and the second additional ground pin GND2 and the ground pin GND are respectively located on opposite sides of the earphone socket 1.
  • the second additional ground pin GND2 is used to connect to the audio module 3 through a metal connection line 22, wherein the metal connection line 22 is disposed on the PCB board 2 and bypasses the PCB board. 2 gaps 21. As shown in FIG. 3, the second additional ground pin GND2 is close to the closed end position of the slot 21 of the PCB board 2, so that the bypass can be conveniently connected through the second additional ground pin GND2.
  • the metal connection line 22 of the slit 21 of the PCB board 2 is connected to the audio module 3. Specifically, the metal connecting wire 22 bypasses the slit 21 of the PCB board 2 and is disposed at a non-slit position on the PCB board 2.
  • the ground pin GND is connected to the first additional ground pin GND1 and the second additional ground pin GND2, and then the second additional ground pin GND2 is passed through the gap 21
  • the metal connection line 22 of the connection 201 is connected to the audio module 3, and is connected to the audio module 3 without connecting a gap 21 passing through the PCB board 2 and a metal connection line of the slot 201 on the outer casing 200. Therefore, the ground pin GND of the existing earphone jack 1 is prevented from being connected to the audio module 3 by the grounding line across the slot 21 of the PCB board 2 and the slot 201 on the outer casing 200. interference. At the same time, the normal operation of the earphone jack 1 and the audio module 3 is ensured.
  • first additional ground pin GND1 and the second additional ground pin GND2 are connected by a metal connection line J1, and the first additional ground pin GND1 and the ground pin GND also pass through the metal connection line J2. Connected, and the metal connection line J1 between the first additional ground pin GND1 and the second additional ground pin GND is located at a position corresponding to the slot 21 of the PCB board 2 and the slot 201 on the outer casing 200. outer.
  • FIG. 4 is a schematic view of the earphone socket 1 in the insertion direction.
  • the earphone jack 1 is a circular jack for accessing the earphone plug.
  • the first additional ground pin GND1 is electrically connected to the second additional ground pin GND2 through a metal connection line J1 disposed around the cylindrical surface of the earphone socket 1.
  • the first additional ground pin GND1 and the second additional ground pin GND2 may be pins formed at both ends of the metal connection line J1 on the cylindrical surface of the earphone socket 1.
  • the metal connection line J1, the first additional ground pin GND1, and the second additional ground pin GND2 are not exposed on the inner wall of the earphone socket 1.
  • the earphone socket 1 further includes a detection pin DET, a left channel pin L1, a right channel pin R1, and a microphone pin M1.
  • the detection pin DET is configured to detect whether there is a headphone insertion, and the left channel pin L1 and the right channel pin R1 are used for performing left channel signals and right with the earphone when the earphone is inserted.
  • Channel signal transmission, the microphone pin M1 is used to receive the sound electrical signal of the microphone input of the earphone.
  • the ground pin GND, the detection pin DET, the left channel pin L1, the right channel pin R1, and the microphone pin M1 are extended.
  • the electrical contacts on the inner wall of the earphone socket 1 can be connected to a normal earphone as with the conventional five-pin earphone socket 1.
  • the first additional ground pin GND1 and the second additional ground pin GND2 are pins that do not expose the inner wall of the earphone socket 1, that is, do not make direct electrical contact with the earphone, only inside the earphone socket 1 and the The ground pin GND is electrically connected.
  • the earphone socket 1 further includes a capacitor C1, and the metal connection line J2 between the first additional ground pin GND1 and the ground pin GND also passes through the capacitor.
  • C1 is grounded.
  • the capacitance of the capacitor C1 is 33 pf (pigma).
  • the capacitor C1 is disconnected for high frequency signals and acts as a path for low frequency audio signals.
  • the ground pin GND is grounded.
  • the metal connection line J1 between the first additional ground pin GND1 and the second additional ground pin GND2 is a suspended metal, which is equivalent to an open circuit, further reducing the influence on the slot antenna.
  • the metal connecting wires J1 and L2 and the metal connecting wires 22 may be made of a conductive metal such as copper, iron or silver.
  • the mobile terminal 100 can be a device such as a mobile phone, a tablet computer, or a music player.
  • the audio module 3 can be an audio processing module such as an audio codec chip.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Telephone Set Structure (AREA)

Abstract

本申请提供一种移动终端，包括PCB板、音频模块及耳机插座，所述PCB板上开设有半开口的第一缝隙，耳机插座包括接地引脚。所述耳机插座还包括第一及第二附加接地引脚，第一附加接地引脚以及第二附加接地引脚均与所述接地引脚电连接，所述第二附加接地引脚用于通过第一金属连接线与所述音频模块连接，其中，所述金属连接线布设于所述PCB板上，且绕过所述PCB板的缝隙。本申请还提供一种耳机插座。本申请的移动终端及耳机插座，能够避免耳机插座中的接地引脚与音频模块之间连接线对缝隙天线的影响且不妨碍耳机插座的正常使用。

Description

耳机插座及移动终端 技术领域
本申请涉及移动终端技术领域，尤其涉及一种移动终端的耳机插座及所述移动终端。
背景技术
目前，手机、平板电脑等移动终端已经广泛地被人们使用，极大地方便了人们的生活。目前，为了提高移动终端的握持感以及整体质感，采用金属壳体的移动终端越来越多。相应的，由于采用了金属壳体，为了保证移动终端天线的使用，大都会在金属壳体上开缝隙，相对应的，移动终端的PCB板上也会开设与金属壳体上缝隙对应的PCB板缝隙，从而形成缝隙天线。如图1所示，目前移动终端，例如手机的耳机插座E1都是五脚插座，且耳机插座都是孔状并延伸经过PCB板P1的缝隙F1。耳机插座E1的接地引脚G1通常需要在移动终端的PCB板P1上经过接地线X1与移动终端的音频模块Y1等连接。然而，所述在PCB板上的接地线X1通常需要跨过PCB板P1上的缝隙F1，所述跨过缝隙F1的接地线X1往往容易与缝隙天线发生干扰，影响缝隙天线性能。
发明内容
本申请提供一种耳机插座及移动终端，不影响耳机功能的正常使用，并且可避免或减弱对缝隙天线的影响。
一方面，提供一种移动终端，包括PCB板、音频模块及耳机插座，所述PCB板上开设有半开口的第一缝隙，所述耳机插座包括接地引脚，其特征在于，所述耳机插座还包括第一附加接地引脚以及第二附加接地引脚，第一附加接地引脚以及第二附加接地引脚均与所述接地引脚电连接，所述第二附加接地引脚用于通过第一金属连接线与所述音频模块连接，其中，所述金属连接线布设于所述PCB板上，且绕过所述PCB板的缝隙。
另一方面，提供一种耳机插座，布设于移动终端的PCB板上，所述耳机插座包括接地引脚，所述耳机插座还包括第一附加接地引脚以及第二附加接地引脚，第一附加接地引脚以及第二附加接地引脚均与所述接地引脚电连接，所述第二附加接地引脚用于通过一绕过PCB板的缝隙的第一金属连接线与音频模块连接。
本申请中的移动终端及耳机插座，通过在耳机插座增加与接地引脚电连接的第一附加接地引脚以及第二附加接地引脚，并将所述第二附加接地引脚通过绕过PCB板的缝隙的第一金属连接线与音频模块连接，能够避免接地线经过缝隙对缝隙天线的干扰。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为现有技术中的耳机插座的示意图。
图2为本申请一实施例中的移动终端的整体示意图。
图3为本申请一实施例中的移动终端的部分结构示意图。
图4为本申请一实施例中的耳机插座沿插入方向视角的示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
请参阅图2，为移动终端100的整体示意图。如图2所示，所述移动终端100包括耳机插座1及外壳200。所述外壳200靠近顶端和/或底端处开设有平行于移动终端100的顶端或底端边的半开口的缝隙201。所述耳机插座1设置于移动终端100的顶端或底端，且延伸经过所述缝隙201。
请一并参阅图3，为移动终端100的部分结构示意图。所述移动终端100还包括PCB(printed circuit board，印刷电路板)板2及音频模块3。所述PCB板2上开设有半开口的缝隙21，所述PCB板2上的缝隙21的位置与所述外壳200上的缝隙201的位置对应。所述PCB板2的缝隙21及所述外壳200上的缝隙201构成了缝隙天线的主要结构。所述耳机插座1布设于所述PCB板2上。
如图3所示，所述耳机插座1包括接地引脚GND、第一附加接地引脚GND1以及第二附加接地引脚GND2。如图1所示，所述接地引脚GND、第一附加接地引脚GND1以及第二附加接地引脚GND2均电连接。所述第一附加接地引脚GND1与所述接地引脚GND位于耳机插座1的同侧，所述第二附加接地引脚GND2与所述接地引脚GND分别位于耳机插座1的相对两侧。
其中，所述第二附加接地引脚GND2用于通过金属连接线22与所述音频模块3连接，其中，所述金属连接线22布设于所述PCB板2上，且绕过所述PCB板2的缝隙21。如图3所示，所述第二附加接地引脚GND2靠近于所述PCB板2的缝隙21的封闭端位置，从而，通过所述第二附加接地引脚GND2可方便的连接所述绕过所述PCB板2的缝隙21的金属连接线22与所述音频模块3连接。具体的，所述金属连接线22绕过所述PCB板2的缝隙21，布设于所述PCB板2上的非缝隙的位置。
从而，相比现有技术，所述接地引脚GND为通过与第一附加接地引脚GND1以及第二附加接地引脚GND2连接后，再将第二附加接地引脚GND2通过一绕过缝隙21及201的金属连接线22与音频模块3连接，无需连接一经过PCB板2的缝隙21及所述外壳200上缝隙201的金属连接线与所述音频模块3连接。从而，避免了现有的耳机插座1的接地引脚GND通过跨过所述PCB板2的缝隙21及所述外壳200上的缝隙201的接地线与音频模块3连接时，对缝隙天线造成的干扰。同时，保证了耳机插座1及音频模块3的正常工作。
在一些实施例中，所述第一附加接地引脚GND1与第二附加接地引脚GND2通过金属连接线J1连接，所述第一附加接地引脚GND1与接地引脚GND也通过金属连接线J2连接，且所述第一附加接地引脚GND1与第二附加接地引脚GND之间的金属连接线J1为位于所述PCB板2的缝隙21及所述外 壳200上的缝隙201对应的位置之外。
请参阅图4，为耳机插座1沿插入方向视角的示意图。在一些实施例中，所述耳机插座1为圆形插孔，用于供接入耳机插头。所述第一附加接地引脚GND1通过布设于耳机插座1的环绕圆柱面的金属连接线J1与第二附加接地引脚GND2电连接。在一些实施例中，所述第一附加接地引脚GND1及第二附加接地引脚GND2可为所述耳机插座1的圆柱面上的金属连接线J1的两端形成的引脚。其中，所述金属连接线J1、所述第一附加接地引脚GND1及第二附加接地引脚GND2均不露出于耳机插座1的内壁。
请返回参考图3，如图3所示，所述耳机插座1还包括侦测引脚DET、左声道引脚L1、右声道引脚R1以及麦克风引脚M1。其中，所述侦测引脚DET用于侦测是否有耳机插入，所述左声道引脚L1、右声道引脚R1用于在有耳机插入时，与耳机进行左声道信号及右声道信号传输，所述麦克风引脚M1用于接收耳机的麦克风输入的声音电信号。
其中，当所述耳机插座1为圆形插孔时，所述接地引脚GND、侦测引脚DET、左声道引脚L1、右声道引脚R1以及麦克风引脚M1为伸出所述耳机插座1内壁的电触点，与通常的五引脚耳机插座1一样，可与普通的耳机进行连接。所述第一附加接地引脚GND1、第二附加接地引脚GND2为不露出所述耳机插座1内壁的引脚，即不会与耳机进行直接电接触，仅仅在耳机插座1的内部与所述接地引脚GND电连接。
如图3所示，在一些实施例中，所述耳机插座1还包括电容C1，所述第一附加接地引脚GND1与所述接地引脚GND之间的金属连接线J2还通过所述电容C1接地。在一些实施例中，所述电容C1的电容值为33pf(皮法)。所述电容C1对于高频信号是断开作用，对于低频率的音频信号是通路作用。从而，这样对音频信号来说，接地引脚GND就是接地处理。对于天线高频信号来说，增加的第一附加接地引脚GND1、第二附加接地引脚GND2之间的金属连接线J1就是悬浮的金属，相当于断路，进一步减少了对缝隙天线的影响。
其中，所述金属连接线J1、L2及金属连接线22可为铜、铁、银等导电金属材质。
所述移动终端100可为手机、平板电脑、音乐播放器等装置。所述音频模 块3可为音频编解码芯片等音频处理模块。
以上所揭露的仅为本申请较佳实施例而已，当然不能以此来限定本申请之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本申请权利要求所作的等同变化，仍属于申请所涵盖的范围。

Claims (20)

  1. 一种耳机插座，布设于移动终端的PCB板上，所述耳机插座包括接地引脚，其特征在于，所述耳机插座还包括第一附加接地引脚以及第二附加接地引脚，第一附加接地引脚以及第二附加接地引脚均与所述接地引脚电连接，所述第二附加接地引脚用于通过一绕过PCB板的缝隙的第一金属连接线与音频模块连接。
  2. 如权利要求1所述的耳机插座，所述PCB板的缝隙为半开口的缝隙。
  3. 如权利要求2所述的耳机插座，所述第二附加接地引脚靠近于所述PCB板的缝隙的封闭端位置。
  4. 如权利要求1所述的耳机插座，所述第一附加接地引脚与所述接地引脚位于耳机插座的同侧，所述第二附加接地引脚与所述接地引脚分别位于耳机插座的相对两侧。
  5. 如权利要求1所述的耳机插座，其特征在于，所述第一附加接地引脚与第二附加接地引脚通过第二金属连接线连接，所述第一附加接地引脚与接地引脚通过第三金属连接线连接，且所述第二金属连接线及第三金属连接线为位于所述PCB板的缝隙对应的位置之外。
  6. 如权利要求5所述的耳机插座，其特征在于，所述耳机插座还包括侦测引脚、左声道引脚、右声道引脚以及麦克风引脚，所述侦测引脚用于侦测是否有耳机插入，所述左声道引脚、右声道引脚用于在有耳机插入时，与耳机进行左声道信号及右声道信号传输，所述麦克风引脚用于接收耳机的麦克风输入的声音电信号。
  7. 如权利要求6所述的耳机插座，其特征在于，所述耳机插座为圆形插孔，所述接地引脚、侦测引脚、左声道引脚、右声道引脚以及麦克风引脚为伸出所述耳机插座内壁的电触点，所述第一附加接地引脚、第二附加接地引脚为不露出于所述耳机插座内壁的引脚。
  8. 如权利要求5-7任一项所述的耳机插座，其特征在于，所述耳机插座还包括电容，所述第一附加接地引脚与所述接地引脚之间的第三金属连接线还通过所述电容接地。
  9. 如权利要求8所述的耳机插座，其特征在于，所述电容的电容值为33pf。
  10. 一种移动终端，包括PCB板、音频模块及耳机插座，所述PCB板上开设有半开口的第一缝隙，所述耳机插座包括接地引脚，其特征在于，所述耳机插座还包括第一附加接地引脚以及第二附加接地引脚，第一附加接地引脚以及第二附加接地引脚均与所述接地引脚电连接，所述第二附加接地引脚用于通过第一金属连接线与所述音频模块连接，其中，所述金属连接线布设于所述PCB板上，且绕过所述PCB板的缝隙。
  11. 如权利要求10所述的移动终端，其特征在于，所述PCB板的缝隙为半开口的缝隙。
  12. 如权利要求11所述的移动终端，其特征在于，所述第二附加接地引脚靠近于所述PCB板的缝隙的封闭端位置。
  13. 如权利要求10所述的移动终端，其特征在于，所述第一附加接地引脚与所述接地引脚位于耳机插座的同侧，所述第二附加接地引脚与所述接地引脚分别位于耳机插座的相对两侧。
  14. 如权利要求13所述的移动终端，其特征在于，所述第二附加接地引脚靠近于所述PCB板的第一缝隙的封闭端位置。
  15. 如权利要求14所述的移动终端，其特征在于，所述第一附加接地引脚与第二附加接地引脚通过第二金属连接线连接，所述第一附加接地引脚与接地引脚通过第三金属连接线连接，且所述第二金属连接线及第三金属连接线为位于所述PCB板的缝隙对应的位置之外。
  16. 如权利要求15所述的移动终端，其特征在于，所述耳机插座还包括侦测引脚、左声道引脚、右声道引脚以及麦克风引脚，所述侦测引脚用于侦测是否有耳机插入，所述左声道引脚、右声道引脚用于在有耳机插入时，与耳机进行左声道信号及右声道信号传输，所述麦克风引脚用于接收耳机的麦克风输入的声音电信号。
  17. 如权利要求16所述的移动终端，其特征在于，所述耳机插座为圆形插孔，所述接地引脚、侦测引脚、左声道引脚、右声道引脚以及麦克风引脚为伸出所述耳机插座内壁的电触点，所述第一附加接地引脚、第二附加接地引脚为不露出于所述耳机插座内壁的引脚。
  18. 如权利要求15-17任一项所述的移动终端，其特征在于，所述耳机插 座还包括电容，所述第一附加接地引脚与所述接地引脚之间的第三金属连接线还通过所述电容接地。
  19. 如权利要求18所述的移动终端，其特征在于，所述电容的电容值为33pf。
  20. 如权利要求12所述的移动终端，其特征在于，所述移动终端还包括外壳，所述外壳上开设有与所述PCB板上的第一缝隙的位置对应的第二缝隙。
PCT/CN2018/075441 2017-02-22 2018-02-06 耳机插座及移动终端 Ceased WO2018153246A1 (zh)

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