WO2018144002A1 - Antennas for electronic devices - Google Patents
Antennas for electronic devices Download PDFInfo
- Publication number
- WO2018144002A1 WO2018144002A1 PCT/US2017/016365 US2017016365W WO2018144002A1 WO 2018144002 A1 WO2018144002 A1 WO 2018144002A1 US 2017016365 W US2017016365 W US 2017016365W WO 2018144002 A1 WO2018144002 A1 WO 2018144002A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna element
- electrically conductive
- technique
- conductive layer
- plastic film
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
Landscapes
- Details Of Aerials (AREA)
Abstract
Examples of fabrication of an antenna are described herein. In an example, a plastic film is obtained. Further, an electrically conductive layer is deposited on the plastic film to form an antenna element. The antenna element is thereafter affixed to an uneven substrate by an out-mold decoration (OMD) technique.
Description
ANTENNAS FOR ELECTRONIC DEVICES
BACKGROUND
[0001] Electronic devices, such as mobile devices, tablets, and computers, are provided with an antenna for wireless communication. With the advancement in technology, form factor of electronic devices has decreased. This has resulted in reduction in size of components, including antennas, used in the electronic devices.
BRIEF DESCRIPTION OF DRAWINGS
[0002] The following detailed description references the drawings, wherein:
[0003] FIG. 1 illustrates a schematic of an electronic device embedded with an antenna element, in accordance with an example of the present subject matter.
[0004] FIG. 2 illustrates a schematic of a body of an electronic device embedded with an antenna element, in accordance with an example of the present subject matter.
[0005] FIG. 3 illustrates a sectional view of a body of an electronic device embedded with the antenna element, in accordance with another example of the present subject matter.
[0006] FIG.4 illustrates a sectional view of a body of an electronic device embedded with the antenna element, in accordance with another example of the present subject matter.
[0007] FIG.5 illustrates a sectional view of a body of an electronic device embedded with the antenna element, in accordance with another example of the present subject matter.
[0008] FIG. 6 illustrates a method of fabricating an antenna, in accordance with an example of the present subject matter.
DETAILED DESCRIPTION
[0009] Antennas used in the electronic devices have evolved from being deployed at an outer surface of the electronic device to be included within the electronic device. Generally, to provide the antennas on an interior surface of the electronic device, the antennas are formed from patterned traces on printed circuits. However, such antennas are rigid in nature and do not provide the flexibility to be mounted at curved portions of the electronic device.
[0010] Existing techniques for fabricating antennas on an uneven substrate result in uneven deposition of a conductive layer. Most existing techniques that focus on fabrication of rigid antennas are unusable with uneven surface of a substrate. In addition, due to the irregular surface, the conductive layer of the antenna mounted on such an irregular surface remains exposed to and is prone to scratches or corrosion.
[0011] The present subject matter describes an antenna element, an electronic device, and methods for fabricating such an antenna element in accordance with aspects of the present subject matter. In an example, the antenna may be embedded on an uneven substrate or uneven surface by an out-mold decoration (OMD) technique. The antenna may also include a plastic film that protects the conductive layer from any damage.
[0012] According to an aspect, fabrication of the antenna may include obtaining a plastic film. Further, an electrically conductive layer may be deposited on an inner surface of the plastic film. The inner surface of the plastic film is to be on the inside and is going to be adhered to the uneven substrate. In an example, the uneven substrate may be a portion of the body of the electronic device. The electrically conductive layer deposited on the plastic film, collectively referred to as an antenna element, facilitates in transmitting or receiving electromagnetic energy.
[0013] in one example, the antenna eiement may inciude an electrically insulating layer to prevent flow of additional current to the electrically conductive layer. The electrically insulating layer may be coated on a free surface of the electrically conductive layer. The free surface being the surface which is disposed on the uneven surface, in the absence of the electrically insulating layer.
[0014] Thereafter, the antenna element may be affixed to the uneven substrate by an out-mold decoration (OMD) technique. The OMD technique may include affixing the antenna element on the uneven substrate using a high- pressure vacuum. The OMD technique provides a smooth finish to the plastic film. The plastic film, apart from providing aesthetic appeal to the antenna, protects the electrically conductive layer from damage. Further, the antenna so formed includes a flexible antenna element which may be applied to an irregular surface of the substrate with ease.
[0015] The above aspects are further described in conjunction with the following figures and associated description below, it should be noted that the description and figures merely illustrate the principles of the present subject matter. Further, various arrangements may be devised that, although not explicitly described or shown herein, embody the principles of the present
subject matter and are included within its scope. The manner in which the systems depicting various implementation of an antenna are explained in detail with respect to FIGS. 1-6.
[0016] FIG. 1 illustrates a schematic of an electronic device 100 embedded with an antenna element 106, in accordance with an example of the present subject matter. In an example, the electronic device 100 may include a personal computer (PC), a laptop, a tablet PC, a notebook, a mobile phone, and the like. The electronic device 100 may include a body 102 having an uneven portion 104. The uneven portion 104 may extend throughout the body 102 of the electronic device 100 or may be at a specific region of the body 102. The uneven portion 104 of the body 102 may act as the uneven substrate for fabrication of the antenna. In an example, the electronic device 100 may include the antenna element 106 embedded on the uneven portion 104 of the body 102.
[0017] To fabricate the antenna, the antenna element 106 may be attached to the uneven portion 104 of the body 102 of the electronic device 100 by an out-mold decoration (OMD) technique. The OMD technique utilizes high- pressure vacuum to affix the antenna element 106 on the uneven portion 104. In said example, the uneven portion 104 may be similar to an irregular substrate for attaching the antenna element 106,
[0018] In an example, the antenna element 106 may include a plastic film 108. Further, the antenna element 106 may include an electrically conductive layer 110, deposited on the plastic film 108. The electrically conductive layer 110 facilitates in transmitting or receiving electromagnetic energy, in an example, the electrically conductive layer 110 may be deposited at an inner surface of the plastic film 108. Accordingly, the plastic film 108 acts as a protective layer to protect the electrically conductive layer 110 from
corrosion or scratches. Further, the plastic film 108 provides flexibility to the electrically conductive layer 110 to conform to any shape or contour of a substrate.
[0019] in an example implementation, the antenna element 106 may also include an electrically insulating layer 112. The electrically insulating layer 112 may be coated on the electrically conductive layer 110. The plastic film 108 provides flexibility to the antenna element 106, thereby enabling attachment of the antenna element 106 on an uneven substrate, such as an uneven portion 104 of the body 102. In an example, the antenna element 106 may be affixed to the uneven portion 104 of the body 102 by the OMO technique. For example, the antenna element 106 is attached to the uneven portion 104 by applying a layer of hot meit adhesive. Thereafter, the body 102 is passed through a high pressure vacuum machine to attach the antenna element 106 to the body 102 of the electronic device 100. The high pressure vacuum ensures that the antenna element 106 is tightly affixed to the body 102.
[0020] Accordingly, the OMD technique facilitates in evenly affixing the antenna element 106 on the uneven portion 104 of the body 102. The components, such as the body 102, of the electronic device 100 are explained in detail with reference to FIGS. 2 - 5.
[0021] FIG. 2 illustrates a schematic of the body 102 of an electronic device, such as the electronic device 100, embedded with the antenna element 106, in accordance with an example of the present subject matter. In an example, the body 102 may be made of a conductive materia). Examples of the conductive material may include, but are not limited to, a metallic material, a carbon fiber, and a conductive composite material. In another example implementation, the body 102 may be made of a non-conductive material.
Examples of the non-conductive material may include, but are not limited to, a plastic materia!, a ceramic material, and a non-conductive composite material.
[0022] In an example Implementation, the body 102 may include the uneven portion 104 and the antenna element 106 affixed to the uneven portion 104. In an example, the uneven portion 104 may be contoured as a concave surface, convex surface, or any other irregular surface. Further, the uneven portion 104 acts as a substrate for fabrication of an antenna. For example, the uneven portion 104 may be an inner surface of a housing of a mobile phone, a laptop, or another electronic device.
[0023] Further, the antenna element 106 may Include an electrically conductive layer 110 attached to the uneven portion 104. in an implementation, the antenna element 106 may include multiple electrically conductive layers. In case of multiple electrically conductive layers, the electrically conductive layers may have different electrical conductivity, in an example, the electrically conductive layer 110 may be of a material selected from a group consisting of a metal, graphene, a conductive ink, a conductive paste, a resin, a metallic powder, a Carbon Nano Tube (CNT), graphite, a copper foil, and a conductive polymer.
[0024] In an example implementation, the electrically conductive layer 110 may include the electrically insulating layer 112, deposited on the electrically conductive layer 110. The electrically insulating layer 112 may prevent flow of additional current to the electrically conductive layer 110. The electrically insulating layer 112 may be deposited on an interface of the electrically conductive layer 110 and the uneven portion 104 of the body 102. In an example, the electrically insulating layer 112 may form a contacting surface, i.e., the surface at which the antenna element 106 is disposed on the
substrate or the uneven portion 104 of the body 102, when the antenna element 106 may be affixed to the body 102.
[0025] In an example, the electrically Insulating layer 112 may be of a material selected from an Acrylonitrile-Butadiene-Styrene (ABS) material, an acetate material, an acrylic material, an epoxy/fiberglass polyethylene terephthalate material, a phenolics material, a polycarbonate material, a polyester material, a Poly-Vinyl-Chloride (PVC) material, a Poly-Ether-lmide (PEI) material, a poiyimide material, an electrical insulating material, a polystyrene foam, a polyester foam, a polyurethane foam, and a silicone foam.
[0026] In an example implementation, the electrically conductive layer 110 and the electrically insulating layer 112 may be deposited by a technique selected from a spin coating technique, a vapor deposition technique, a painting technique, a gravure printing, a screen printing, or a spray deposition technique.
[0027] Further, the antenna element 106 may include the plastic film 106 molded on the electrically conductive layer 110. As a result, the electrically conductive layer 110 may get sandwiched between the plastic film 108 and the electrically insulating layer 112. In an example, the plastic film 108 is of a material selected from one of a polyester material, a poiyacrylic material, a polycarbonate material, or a polycarbonate (PC}-Acrylonitrile-Butadiene- Styrene (ABS) material. Further, the plastic film 108 acts as a protective cover for the electrically conductive layer 110. The plastic film 106 may provide flexibility to the antenna element 106 thereby allowing attachment to any substrate irrespective of the shape of the substrate.
[0028] In an example implementation, the antenna element 106 may be affixed to the uneven portion 104 by the OMD technique. The OMD technique
employs a high pressure vacuum to affix the antenna element 106 to the uneven portion 104. For example, the body 102 may be placed on a support tray (not shown). Thereafter, the antenna element 106 may be mounted on the uneven portion 104 and put in the high pressure vacuum machine. The creation of the vacuum may facilitate in attaching the antenna element 106 with the body 102. Further, the plastic film 108 may soften under the high pressure, thereby providing flexibility to attach the antenna element 106.
[0029] in an example, the OMD technique may employ a variety of hot forming processes, gas pressure, hydraulics, and other ways to attach the antenna element 106 to the body 102. The OMD technique provides a smooth finish to the plastic film 108, thereby also providing an aesthetic appeal to the antenna element 106.
[0030] FIG. 3 illustrates a sectional view 300 of the body 102 of the electronic device 100 embedded with the antenna element 106, in accordance with an example of the present subject matter, in an example, the body 102 may be a housing of a mobile phone, a digital camera, a laptop, and the like. As mentioned previously, the body 102 may be made of a conductive material or a non-conductive material. Further, the body 102 may include the uneven portion 104 on which the antenna element 106 is attached. In an example, the uneven portion 104 may be any inner surface of irregular profile within the housing of a mobile phone or laptop.
[0031] In an example, the antenna element 106 may include the plastic film 108. The plastic film 108 may provide flexibility and aesthetic appeal to the antenna element 106. Further, the electrically conductive layer 110 may be deposited on an inner surface (not shown) of the plastic film 108. The electrically conductive layer 110, facilitates in transmitting or receiving
electromagnetic energy. The inner surface may be that surface which may get affixed to the uneven portion 104 of the body 102.
[0032] The electrically conductive layer 110 is deposited on the plastic film 108 to form the antenna element 106. The antenna element 106 may then be affixed to the uneven portion 104 of the body 102 by using a hot meit adhesive layer 302. In an example, the hot melt adhesive layer 302 is of a material selected from an ethylene-vinyl acetate {EVA) copolymer, a polyamide, a potyotefin, a styrene copolymer, a polyester, a polyurethane, and a rubber-based adhesive. The hot meit adhesive layer 302 may facilitate in attachment of the antenna element 106 to any kind of substrate, such as a conductive substrate or a non-conductive substrate.
[0033] Thereafter, the antenna element 106 may be subjected to the OMD technique to tightly affix the antenna element 106 to the uneven portion 104 of the body 102. Although the antenna element 106 is depicted as affixed on the uneven portion 104, the antenna element 106 may extend over the body 102 of the electronic device 100.
[0034] FIG. 4 illustrates a sectional view 400 of the body 102 of the electronic device 100 embedded with the antenna element 106, in accordance with another example of the present subject matter. In the present example, the antenna element 106 may, in addition to the piastic film 108 and the electrically conductive layer 110, include the electrically insuiating layer 112. The electrically insulating layer 112 may be coated on the electrically conductive layer 110 to form the antenna element 106. in an example, the electrically conductive layer 110 may be deposited by a technique selected from a spin coating technique, a vapor deposition technique, a painting technique, a gravure printing, a screen printing, or a spray deposition
technique, in an example, the plastic film 108 acts as a protective cover to the electrically conductive layer 110.
[0035] In an example, the electrically insulating layer 112 may come in contact with the uneven portion 104 of the body 102 when the antenna element 106 is attached to the uneven portion 104. The plastic film 108 and the electrically conductive layer 110 may be arranged in the same manner as described with reference to FIG. 3. Further, the antenna element 106 may be affixed to the uneven portion 104 of the body 102 in the same manner as described with reference to FIG. 3.
[0036] FIG. 5 illustrates a sectional view 500 of the body 102 of the electronic device 100 embedded with the antenna element 106, in accordance with another example of the present subject matter. In the present example, the antenna element 106 may include multiple electrically conductive layers. For example, the antenna element 106 may include the electrically conductive layers 110, 502, and 504. The electrically conductive layers 502 and 504 may be deposited on the plastic film 108, in a manner similar to the deposition of the electrically conductive layer 110.
[0037] in an implementation, the electrically conductive layer 502 may be deposited on the inner surface of the plastic film 108. Further, the electrically conductive layer 504 may be deposited on an inner surface of the electrically conductive layer 502. Finally, the electrically conductive layer 110 may be deposited on an inner surface of the electrically conductive layer 504. The order in which the electrically conductive layers 110, 502, and 504 are arranged is not intended to be construed as a limitation, and the electrically conductive layers 110, 502, and 504 can be arranged in any appropriate order. In an example, the plastic film 108 and the electrically conductive layers 110, 502, and 504 may form the antenna element 106.
[0038] fn an example, the electrically conductive layers 502 and 110 may be made of graphene. At the same time, the electrically conductive layer 504 may be made of a copper foil. Further, the electrically conductive layers 502 and 110 possess higher electrical conductivity than that of the electrically conductive layer 504.
[0039] Further, the electrically insulating layer 112 may be coated on the electrically conductive layer 110, such that the electrically insulating iayer 112 is attached to the uneven portion 104 of the body 102. The antenna element 106 may be attached to the uneven portion 104 in the same manner as described with reference to FIG. 3. Furthermore, thickness of the plastic film 108, the electrically conductive layers 110, 502, 504, the electrically insulating layer 112, and the adhesive iayer 302 as shown in FIGS. 3*5 are merely exemplary and should not be construed as limiting the scope of the present subject matter.
[0040] FIG. 0 illustrates a method 600 for fabricating an antenna, in accordance with various examples of the present subject matter. The antenna so formed, includes a flexible antenna element 106 which may be affixed to an uneven substrate, such as an uneven portion 104 of a body 102 of the electronic device 100. In an example, the uneven substrate may be contoured as a concave surface, convex surface, or any other Irregular surface. The order in which the method 600 is described is not intended to be construed as a limitation, and any number of the described method blocks can be combined in any appropriate order to execute the method 600 or another similar method. Additionally, individual blocks may be deleted from the method 600 without departing from the spirit and scope of the subject matter described herein.
[0041] Referring to block 602, the plastic Him 108 is obtained. The plastic film 108 acts as a protective layer to protect the electrically conductive layer 110 from corrosion or scratches.
[0042] At block 604, the electrically conductive layer 110 is deposited on the plastic film 108. In an example, the electrically conductive layer 110 may be deposited on an inner surface of the plastic film 108. The inner surface may be the surface which is on the inside and is going to be adhered to the uneven portion 104 of the body 102.
[0043] In an example implementation, the electrically insulating layer 112 may be coated on the electrically conductive layer 110 to form an antenna element, such as the antenna element 106. In an example, the electrically insulating layer 112 may be coated on an interface of the electrically conductive layer 110 and an uneven substrate, such as the uneven portion 104.
[0044] At block 606, the antenna element 106 may be affixed to the uneven substrate. In an example, the antenna element 106 may be affixed to the uneven portion 104 by an out-mold decoration (OMD) technique. The OMD technique may include using a high pressure vacuum to affix the antenna element 106. In an example implementation, the affixing may include applying a hot melt adhesive layer on the uneven substrate, such as the uneven portion 104. For example, the antenna element 106 is attached to the uneven portion 104 by applying the hot melt adhesive layer. Thereafter, the body 102 is subjected to the a high pressure vacuum machine to attach the antenna element 106 to the body 102 of the electronic device 100.
[0045] In an example, the OMD technique may employ a variety of hot forming processes, gas pressure, hydraulics, and other ways to affix the antenna element 106. The OMD technique softens the plastic film 108, as a
result the plastic film 108 provides flexibility to the antenna element 106. Further, the OMD technique ensure that the antenna element 106 may get attached to the uneven portion 104 with ease.
[0046] Although implementations of the body 102 and the electronic device 100 embedded with an antenna element and the method 600 for fabricating an antenna, have been described in language specific to structural features and/or methods, it is to be understood that the present subject matter is not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed and explained in the context of a few example implementations for the body 102 and the electronic device 100 embedded with an antenna element and the method 600 for fabricating an antenna.
Claims
1. A method for fabricating an antenna, the method comprising:
obtaining a plastic film;
depositing an electrically conductive layer on the plastic film to form an antenna element; and
affixing the antenna element to an uneven substrate by an out- mold decoration (OMD) technique, wherein the OMD technique comprises affixing the antenna element to the uneven substrate using a high-pressure vacuum.
2. The method as claimed in ciaim 1, wherein the depositing comprises coating an electrically insulating layer on an interface of the electrically conductive layer and the uneven substrate.
3. The method as claimed in claim 1, wherein the affixing comprises applying a hot melt adhesive layer on the uneven substrate.
4. A body of an electronic device comprising:
an uneven portion; and
an antenna element affixed to the uneven portion, the antenna element comprising:
an electrically conductive layer attached to the uneven portion, wherein the electrically conductive layer comprises an electrically insulating layer deposited thereon; and a plastic film molded on the electrically conductive layer, wherein the antenna element is affixed to the uneven portion by an out-mold decoration (OMD) technique.
5. The body as claimed in claim 4, wherein the uneven portion is made of one of a conductive material and a non-conductive material.
6. The body as claimed in claim 5, wherein the conductive material is one of a metallic material, a carbon fiber, and a conductive composite material.
7. The body as claimed in claim 5, wherein the non-conductive material is one of a plastic material, a ceramic material and a non-conductive composite material.
8. The body as claimed in claim 4, wherein the electrically conductive layer is of a material selected from a group consisting of a metal, graphene, a conductive ink, a conductive paste, a resin, a metallic powder, a Carbon Nano Tube (CNT), graphite, a copper foil, and a conductive polymer.
9. The body as claimed in claim 4, wherein the electrically insulating layer is one of an Acrylonitrile-Butadiene-Styrene (ABS) material, an acetate material, an acrylic material, an epoxy/fiberglass polyethylene terephthalate material, a phenoiics material, a polycarbonate material, a polyester material, a Poly-Vinyl-Chloride (PVC) material, a Poly-Ether-lmide (PEI) material, a polyimide material, an electrical insulating material, a polystyrene foam, a polyester foam, a polyurethane foam, and a silicone foam.
10, The body as claimed in claim 4, wherein plastic film is of a material selected from one of a polyester material, a poiyacrylic material, a polycarbonate material, and a polycarbonate-Acrylonitrile-Butadiene-Styrene (ABS) material.
11. The body as claimed in claim 4, wherein the electrically insulating layer is deposited on the electrically conductive layer by a technique selected from a spin coating technique, a vapour deposition technique, a painting technique, a gravure printing, a screen printing, and a spray deposition technique.
12. An electronic device comprising:
a body having an uneven portion; and
an antenna element affixed on the uneven portion, the antenna element comprising:
a plastic film;
an electrically conductive layer deposited on plastic film; and
an electrically insulating layer coated on the electrically conductive layer,
wherein the antenna element is affixed to the uneven portion by an out-mold decoration (OMD) technique.
13. The electronic device as claimed in claim 12, wherein the plastic film is of a material selected from one of a polyester material, a polyacrylic material, a polycarbonate material, and a polycarbonate-Acrylonitrile-Butadiene-Styrene (ABS) material.
14. The electronic device as claimed in claim 12, wherein the body is one of a conductive material and a non-conductive material.
15. The electronic device as claimed in claim 12, wherein the electrically conductive layer is deposited on the electrically conductive layer by a technique selected from a spin coating technique, a vapour deposition technique, a painting technique, a gravure printing, a screen printing, and a spray deposition technique.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2017/016365 WO2018144002A1 (en) | 2017-02-03 | 2017-02-03 | Antennas for electronic devices |
| CN201780074751.XA CN110199433A (en) | 2017-02-03 | 2017-02-03 | Antenna for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2017/016365 WO2018144002A1 (en) | 2017-02-03 | 2017-02-03 | Antennas for electronic devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2018144002A1 true WO2018144002A1 (en) | 2018-08-09 |
Family
ID=63039985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US2017/016365 WO2018144002A1 (en) | 2017-02-03 | 2017-02-03 | Antennas for electronic devices |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110199433A (en) |
| WO (1) | WO2018144002A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151955A (en) * | 2020-09-18 | 2020-12-29 | 中国科学院重庆绿色智能技术研究院 | Flexible frequency reconfigurable antenna and preparation method and application thereof |
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|---|---|---|---|---|
| EP1988601A1 (en) * | 2006-02-19 | 2008-11-05 | Nissha Printing Co., Ltd. | Feeding structure of housing with antenna |
| WO2011093167A1 (en) * | 2010-01-26 | 2011-08-04 | 日本写真印刷株式会社 | Injection-molded and simultaneously decorated article with antenna and production method thereof, and power feeding structure of housing with antenna |
| CN102623794A (en) * | 2011-01-31 | 2012-08-01 | 纽西兰商青岛长弓电子公司 | Method for cladding and molding mobile internet device antenna by employing out-mold decoration |
| US20140085150A1 (en) * | 2012-09-26 | 2014-03-27 | Huawei Device Co., Ltd | Antenna connection structure and its companion electronic product |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010123733A1 (en) * | 2009-04-21 | 2010-10-28 | Molex Incorporated | Three dimensional antenna |
| CN103507307A (en) * | 2013-09-09 | 2014-01-15 | 苏州达方电子有限公司 | Decorative film, composite material object decorated by using decorative film, and manufacturing method of composite material object |
| TW201527070A (en) * | 2014-01-06 | 2015-07-16 | Prior Company Ltd | Decoration film and manufacturing method thereof and manufacturing method of decorated molding article |
-
2017
- 2017-02-03 WO PCT/US2017/016365 patent/WO2018144002A1/en active Application Filing
- 2017-02-03 CN CN201780074751.XA patent/CN110199433A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1988601A1 (en) * | 2006-02-19 | 2008-11-05 | Nissha Printing Co., Ltd. | Feeding structure of housing with antenna |
| WO2011093167A1 (en) * | 2010-01-26 | 2011-08-04 | 日本写真印刷株式会社 | Injection-molded and simultaneously decorated article with antenna and production method thereof, and power feeding structure of housing with antenna |
| CN102623794A (en) * | 2011-01-31 | 2012-08-01 | 纽西兰商青岛长弓电子公司 | Method for cladding and molding mobile internet device antenna by employing out-mold decoration |
| US20140085150A1 (en) * | 2012-09-26 | 2014-03-27 | Huawei Device Co., Ltd | Antenna connection structure and its companion electronic product |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112151955A (en) * | 2020-09-18 | 2020-12-29 | 中国科学院重庆绿色智能技术研究院 | Flexible frequency reconfigurable antenna and preparation method and application thereof |
| CN112151955B (en) * | 2020-09-18 | 2022-05-17 | 中国科学院重庆绿色智能技术研究院 | Flexible frequency reconfigurable antenna and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110199433A (en) | 2019-09-03 |
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