WO2018137266A1 - 毛细相变冷却器及其安装方法 - Google Patents

毛细相变冷却器及其安装方法 Download PDF

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Publication number
WO2018137266A1
WO2018137266A1 PCT/CN2017/074715 CN2017074715W WO2018137266A1 WO 2018137266 A1 WO2018137266 A1 WO 2018137266A1 CN 2017074715 W CN2017074715 W CN 2017074715W WO 2018137266 A1 WO2018137266 A1 WO 2018137266A1
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heat dissipation
capillary
liquid
power device
phase change
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PCT/CN2017/074715
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English (en)
French (fr)
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王伟
吕松浩
李雪
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广东合一新材料研究院有限公司
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Publication of WO2018137266A1 publication Critical patent/WO2018137266A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Definitions

  • the invention relates to the technical field of cooling of power devices, and in particular to a capillary phase change cooler and a mounting method thereof.
  • the heat dissipation of the traditional high-power devices generally adopts the air-cooling heat dissipation mode. Since the specific heat capacity of the air is small, the heat taken away by the air is relatively small, and the components with less heat generation can satisfy the heat dissipation requirement, but the structure is increasingly compact. The high-power devices with increasing power, the traditional heat dissipation method can not meet the heat dissipation requirements.
  • the surface of the cooling plate directly attached to the liquid-cooled heat sink is directly cooled by water cooling, and there is still a gap between the heating surface of the high-power device and the liquid-cooled heat sink.
  • the contact thermal resistance is large, which affects the effect of liquid cooling.
  • a capillary phase change cooler for dissipating heat of a power device, including a cooler body and a capillary liquid absorbing layer;
  • the cooler body has a cooling cavity and a heat dissipation port communicating with the cooling cavity; a bottom of the cooling cavity is a liquid collecting portion for holding a cooling liquid; on the cooler body, at least a peripheral portion surrounding the heat dissipation opening for sealingly mating with a heat dissipation wall of the power device;
  • the capillary liquid absorbing layer is disposed at a position of the heat dissipation port and is in close contact with the heat dissipation wall, and one end of the capillary liquid absorption layer is configured to protrude into the liquid accumulation portion.
  • the heat dissipation opening is disposed on a sidewall of the cooler body and above the liquid accumulation portion.
  • one end of the capillary wicking layer is bent into the effusion portion.
  • the capillary liquid absorbing layer is a nonwoven fabric liquid absorbing layer, a copper mesh liquid absorbing layer or a sintered copper powder liquid absorbing layer.
  • the capillary wicking layer has a thickness of from 0.1 to 2 cm.
  • the capillary phase change cooler further includes an insulating sealant layer disposed at least around a peripheral portion of the heat sink; when the power device and the cooler body The chiller body is in sealing engagement with the power device through the insulating sealant layer.
  • the capillary phase change cooler further includes a heat dissipation structure, and a condensation passage of the heat dissipation structure is in communication with the cooling cavity for condensing and returning the evaporated coolant to the Cooling in the cavity.
  • the heat dissipation structure is disposed on the cooler body and located at a top end of the cooling cavity.
  • the heat dissipation structure is an air cooled heat sink, a water cooled heat exchanger or a finned natural convection heat sink.
  • the method for installing the above capillary phase change cooler comprises the following steps:
  • the capillary phase change cooler includes a cooler body and a capillary liquid absorbing layer; the cooler body has a cooling cavity and a heat dissipation port communicating with the cooling cavity; the bottom of the cooling cavity is for holding a liquid collecting portion of the cooling liquid; at least a peripheral portion of the heat dissipation opening is used for sealingly engaging with a heat dissipation wall of the power device; the capillary liquid absorption layer is disposed at the heat dissipation port position and is in close contact with The heat dissipation wall has one end of the capillary liquid absorbing layer for extending into the liquid accumulation portion.
  • the capillary phase change cooler directly sets the capillary liquid absorbing layer directly on the heat dissipation wall of the power device, and the capillary liquid absorbing layer causes the surface temperature of the heat dissipation wall of the power device to be the same by capillary absorption, compared with the conventional cooler.
  • the heat transfer wall significantly reduces the contact thermal resistance and improves the heat dissipation efficiency.
  • the capillary phase change cooler adopts a specific heat capacity of the coolant greater than a specific heat capacity of the air, and the heat transfer performance can be greatly improved compared with the conventional air cooling method, and the coolant There is also a phase change endothermic process that also improves the heat dissipation efficiency of the power device.
  • FIG. 1 is a schematic view showing the structure of a capillary phase change cooler of a power device according to an embodiment.
  • a capillary phase change cooler 10 of an embodiment is used for heat dissipation of the power device 20, including a cooler body 100, a capillary liquid absorbing layer 200, and a heat dissipation structure 300.
  • the power device 20 refers to an electronic component having a relatively large output power, including a power semiconductor device when driven by a composite voltage, such as an IGBT, an IGCT, a thyristor, a rectifier bridge, or a relay.
  • a composite voltage such as an IGBT, an IGCT, a thyristor, a rectifier bridge, or a relay.
  • the cooler body 100 has a cooling cavity 110 and a heat dissipation port that communicates with the cooling cavity 110.
  • the bottom of the cooling chamber 110 is a liquid collecting portion for holding the cooling liquid 30.
  • On the cooler body 100 at least a peripheral portion surrounding the heat dissipation opening is used to seal the cooling cavity 110 in cooperation with the heat dissipation wall of the power device 20.
  • the insulating sealant layer 120 is disposed at least around the periphery of the heat dissipation port.
  • the chiller body 100 is sealingly coupled to the power device 20 by an insulating sealant layer 120. It can be understood that by the strong bonding action of the insulating sealant layer 120, the power device 20 can be insulated from the outer peripheral portion of the heat dissipation port of the cooler body 100, and the cooling cavity 110 can be sealed. This is a preferred embodiment.
  • the capillary liquid absorbing layer 200 is disposed at a position where the heat dissipation port is located and is in close contact with the heat dissipation wall of the power device 20, and one end of the capillary liquid absorption layer 200 is used for immersing the coolant in the liquid accumulation portion. 30 in.
  • the capillary wicking layer 200 can be fixedly spread or adsorbed on the heat dissipation wall of the power device 20 by a mesh or mesh structure.
  • the liquid absorbing layer 200 is used for immersing one end of the cooling liquid 30 to absorb the cooling liquid 30 by capillary action, and wets the entire capillary liquid absorbing layer 200, that is, the heat dissipation wall of the power device 20 is always in contact with the cooling liquid 30, and the heat dissipation wall The temperature is uniform and the heat dissipation efficiency is improved.
  • the size of the heat dissipation port should be maximized to meet the heat dissipation requirement of the power device 20, that is, the capillary liquid absorption layer 200 is maximized to cover the heat generating portion of the heat dissipation wall, so that the temperature of the entire heat dissipation wall of the power device 20 is uniform and significant. Improve heat transfer efficiency.
  • the cooling liquid 30 may be an insulating liquid working medium such as silicone oil, mineral oil or vegetable oil. It can be understood that in other embodiments, the cooling liquid 30 may also be selected from water as long as the heat dissipation requirement can be satisfied according to actual conditions.
  • the heat dissipation opening is disposed on a side wall of the cooler body 100 and above the liquid accumulation portion.
  • the heat dissipation opening may be located at one end of the central capillary liquid absorbing layer 200 of the side wall and bent into the liquid collecting portion, the end absorbs the cooling liquid 30 by capillary absorption, and wets the entire capillary liquid absorption layer. 200, and thus the heat dissipation wall is always in the heat exchange process.
  • the capillary absorbing layer 200 has a heat resistant temperature greater than 100 °C.
  • the capillary liquid absorbing layer 200 may be a non-woven fabric liquid absorbing layer, a copper mesh liquid absorbing layer or a sintered copper powder liquid absorbing layer, and is processed or formed into a shape satisfying heat dissipation requirements, and is adhered to or adsorbed on the heat dissipation wall.
  • the capillary wicking layer has a thickness of 0.1 to 2 cm to maximize the load of the cooling liquid 30 in the capillary liquid absorbing layer 200 and to improve heat exchange efficiency.
  • the condensation passage of the heat dissipation structure 300 is in communication with the cooling chamber 110 for condensing and returning the evaporated coolant 30 to the cooling chamber 110.
  • the heat dissipation structure 300 is disposed on the cooler body 100 and located at the top end of the cooling cavity 110 and disposed opposite to the heat dissipation port, so that the condensed reflux liquid is poured on the capillary liquid absorption layer 200, which can further improve the cooling efficiency.
  • the heat dissipation structure 300 may be an air-cooled heat sink, a water-cooled heat exchanger or a finned convection heat sink. It can be understood that in other embodiments, the heat dissipation structure 300 may also be located at the upper middle portion of the cooling cavity 110, and may be condensed or cooled by the evaporated coolant 30.
  • the heat dissipation structure 300 may not be required if the power device 20 is replaced with a structure or device that does not dissipate heat but still needs to be maintained within a certain temperature range.
  • the capillary phase change cooler 10 of the present embodiment When the capillary phase change cooler 10 of the present embodiment is used for heat dissipation of the power device 20, it is installed as follows:
  • the cooling liquid 30 is placed in the cooling chamber 110 of the cooler body 100 and concentrated in the liquid accumulation portion.
  • the capillary liquid absorbing layer 200 is provided on the heat dissipation wall of the power device 20, and it is ensured that one end of the capillary liquid absorbing layer 200 can protrude into the cooling liquid 30 of the liquid accumulation portion.
  • the heat dissipation wall is fitted to at least the peripheral portion of the heat dissipation port on the cooler body 100 to seal the heat dissipation port.
  • the capillary liquid-absorbent layer 200 that protrudes into the liquid-collecting portion absorbs the cooling liquid 30 by capillary action, and the heat of the power device 20 is absorbed by the cooling liquid 30 carried in the capillary liquid-absorbent layer 200, and the cooling chamber
  • the coolant 30 in the body 110 performs flow heat transfer.
  • the coolant 30 reaches the volatilization temperature, the coolant 30 begins to volatilize and enters the condensation passage of the heat dissipation structure 300.
  • the steam condenses into a liquid when it is cooled, and flows back to the cooling chamber 110. in.
  • the coolant 30 can carry away the heat of the power device 20 by a repeated cycle of evaporation phase changes.
  • the capillary phase change cooler 10 in the present embodiment is provided with the capillary liquid absorbing layer 200, and fully utilizes the temperature rising liquid absorption and the evaporation phase change heat absorption of the cooling liquid 30, thereby effectively improving the heat dissipation efficiency of the power device 20 and effectively controlling the power device. 20 is within the junction temperature range of the chip, extending the useful life of the power device 20.
  • the embodiment provides a capillary phase change cooler for dissipating heat of a high-power device, comprising a cooler body, a thermal conductive silicone oil, a temperature-resistant non-woven fabric capillary absorbing layer, an insulating sealant layer, and a finned natural convection heat sink.
  • the cooler body has a cooling cavity and a heat dissipation port communicating with the cooling cavity, and the liquid collecting portion located at the bottom of the cooling cavity is filled with heat conductive silicone oil.
  • the temperature-resistant non-woven fabric capillary layer is closely attached to the heat dissipation wall of the high-power device, and one end is bent and then protrudes into the heat-conductive silicone oil of the liquid collecting portion, so that the capillary layer of the temperature-resistant non-woven fabric automatically passes through the capillary action. Loads thermal silicone oil to absorb heat from power devices.
  • the cooler body and the high power device seal the cooling cavity through an insulating sealant layer.
  • the finned natural convection radiator is disposed on the cooler body and located at a top end of the cooling cavity of the cooler body and disposed opposite to the heat dissipation port.
  • the heat generated by the high-power device is absorbed by the heat-dissipating silicone oil that is always carried by the capillary layer of the temperature-resistant non-woven fabric through the heat dissipation wall.
  • the heat dissipated by the high-power device causes the thermal conductive silicone oil to reach the volatilization temperature, the thermal conductive silicone oil evaporates into the cold condensing passage of the fin natural convection radiator, and the cooled thermal conductive silicone oil flows back into the cooling chamber. After repeated cycles of evaporation-condensation reflow of the thermally conductive silicone oil, the junction temperature of the chip of the high-power device can be effectively controlled, and the service life of the device is prolonged.
  • the embodiment provides a capillary phase change cooler for dissipating heat of a high power device, including a cooler body, mineral oil, Copper mesh capillary layer, insulating sealant layer and water-cooled heat exchanger.
  • the cooler body has a cooling cavity and a heat dissipation port communicating with the cooling cavity, and the liquid collecting portion located at the bottom of the cooling cavity is filled with mineral oil.
  • the capillary aspirating layer of the copper mesh is closely attached to the heat dissipation wall of the high-power device, and one end extends into the mineral oil of the effusion portion, so that the end of the capillary liquid absorbing layer of the copper mesh automatically carries the mineral oil by capillary action, and is used for Absorbs heat from the power device.
  • the cooler body and the high power device seal the cooling cavity through an insulating sealant layer.
  • the water-cooled heat exchanger is disposed on the cooler body and located at a top end of the cooling cavity of the cooler body and disposed opposite to the heat dissipation port.
  • the heat generated by the high-power device is absorbed by the thermal oil wall by the mineral oil that is always carried by the capillary liquid-absorbent layer of the copper mesh.
  • the heat emitted by the high-power device is that the mineral oil reaches the volatilization temperature, the mineral oil evaporates into the water-cooled radiator to be cooled, and the condensed mineral oil is returned to the cooling chamber. After repeated cycles of evaporation and condensation of mineral oil, the junction temperature of the high-power device can be effectively controlled and the service life of the device can be extended.

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Abstract

一种用于功率器件（20）散热的毛细相变冷却器（10），包括冷却器本体（100）和毛细吸液层（200）。冷却器本体（100）具有冷却腔体（110）和散热口。冷却腔体（110）的底部为用于盛放冷却液（30）的积液部。散热口与功率器件（20）的散热壁相配合密封冷却腔体（110）。毛细吸液层（200）设置在散热口位置并紧贴在功率器件（20）的散热壁上。毛细吸液层（200）的一端伸入积液部。毛细相变冷却器（10）通过将毛细吸液层（200）直接设于功率器件（20）的散热壁上，使功率器件（20）的散热壁的表面温度相同，提高散热效率。

Description

毛细相变冷却器及其安装方法 技术领域
本发明涉及功率器件的冷却技术领域，特别是涉及一种毛细相变冷却器及其安装方法。
背景技术
随着电子电力技术的飞跃发展，各种交流电机、变频器、开光电源及照明装置等整机装置逐渐向大功率、紧凑化、轻量化及数控化方向发展。在这些整机装置中，大功率的半导体器件例如IGBT、可控硅，整流桥等，是构成电控回路的重要元件。在实际工作中，高度集成的大功率器件产生的热量会使芯片温度升高，如果散热缓慢，就有可能使芯片温度升高到超过所允许的最高结温，器件的性能将显著下降，并且不能稳定工作，甚至可能会直接烧坏。因此，控制大功率器件的升温速度，使芯片内部温度始终维持在允许的结温之内，保证机器稳定运行，成为大功率器件技术领域研究的重点和难题。
传统的大功率器件的散热普遍采用风冷散热模式，由于空气的比热容较小，通过空气带走的热量相对较小，对于发热量较小的元器件可以满足散热需求，但是面对结构日益紧凑、功率日益增大的大功率器件，传统的散热方式已经无法满足散热需求。
针对大功率器件的散热问题，目前普遍采用将大功率器件直接贴附在液冷散热器的冷却板的表面通过水冷散热，由于大功率器件的发热面与液冷散热器之间仍然存在间隙，接触热阻较大，影响液体冷却的效果。
发明内容
基于此，有必要提供一种提高冷却效果的毛细相变冷却器及其安装方法。
一种毛细相变冷却器，用于功率器件的散热，包括冷却器本体和毛细吸液层；
所述冷却器本体具有冷却腔体和与所述冷却腔体相连通的散热口；所述冷却腔体的底部为用于盛放冷却液的积液部；在所述冷却器本体上，至少围绕所述散热口的周边部分用于与所述功率器件的散热壁密封配合；
所述毛细吸液层用于设置在所述散热口位置并紧贴到所述散热壁上，且所述毛细吸液层的一端用于伸入所述积液部中。
在其中一个实施例中，所述散热口设于所述冷却器本体的一侧壁上，且位于所述积液部的上方。
在其中一个实施例中，所述毛细吸液层的一端通过弯折后伸入所述积液部中。
在其中一个实施例中，所述毛细吸液层为无纺布吸液层、铜网吸液层或烧结铜粉吸液层。
在其中一个实施例中，所述毛细吸液层的厚度为0.1-2cm。
在其中一个实施例中，所述毛细相变冷却器还包括绝缘密封胶层，所述绝缘密封胶层至少设置在围绕所述散热口的周边部分；当所述功率器件与所述冷却器本体的散热口配合时，所述冷却器本体与所述功率器件通过所述绝缘密封胶层密封连接。
在其中一个实施例中，所述毛细相变冷却器还包括散热结构，所述散热结构的冷凝通道与所述冷却腔体相连通，用于供挥发后的所述冷却液冷凝回流至所述冷却腔体中。
在其中一个实施例中，所述散热结构设于所述冷却器本体上，且位于所述冷却腔体的顶端。
在其中一个实施例中，所述散热结构为风冷散热器、水冷换热器或翅片式自然对流散热器。
上述毛细相变冷却器的安装方法，包括如下步骤：
(1)将冷却液置于冷却器本体的冷却腔体内，并集中在积液部；
(2)将毛细吸液层设于功率器件的散热壁上，并使所述毛细吸液层的一端能够伸入所述积液部并接触所述冷却液；
(3)将所述冷却器本体的散热口的周边部分和所述散热壁配合密封所述散热口。
上述毛细相变冷却器包括冷却器本体和毛细吸液层；所述冷却器本体具有冷却腔体和和与所述冷却腔体相连通的散热口；所述冷却腔体的底部为用于盛放冷却液的积液部，；至少围绕所述散热口的周边部分用于与所述功率器件的散热壁密封配合；所述毛细吸液层用于设置在所述散热口位置并紧贴到所述散热壁上，且所述毛细吸液层的一端用于伸入所述积液部中。上述毛细相变冷却器，通过直接将毛细吸液层直接设于功率器件的散热壁上，毛细吸液层通过毛细吸液作用使功率器件的散热壁的表面温度相同，相对于传统冷却器的传热壁，明显减少接触热阻，提高散热效率。另外，上述毛细相变冷却器采用冷却液的比热容大于空气的比热容，相对于传统空气冷却方式，能够大幅度提高传热性能，且冷却液 还存在相变吸热过程，也能提高功率器件的散热效率。
附图说明
图1为一实施方式的功率器件的毛细相变冷却器的结构示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。
请结合图1，一实施方式的毛细相变冷却器10，用于功率器件20的散热，包括冷却器本体100、毛细吸液层200和散热结构300。
功率器件20是指输出功率比较大的电子元件，包括用复合型电压驱动时的功率半导体器件，例如IGBT、IGCT、可控硅、整流桥或继电器等。
在本实施方式中，冷却器本体100具有冷却腔体110和与冷却腔体110相连通的散热口。冷却腔体110的底部为用于盛放冷却液30的积液部。在冷却器本体100上，至少围绕散热口的周边部分用于与功率器件20的散热壁相配合密封冷却腔体110。
在本实施方式中，绝缘密封胶层120至少围绕散热口的周边设置。当功率器件20与冷却器本体100的散热口配合时，冷却器本体100与功率器件20通过绝缘密封胶层120密封连接。可以理解，通过绝缘密封胶层120的牢固粘接作用，可以使功率器件20与冷却器本体100的散热口的外周部分绝缘密封，进而使冷却腔体110处于密封，属于优选的实施方式。
在本实施方式中，毛细吸液层200用于设置在散热口所在位置并紧贴到功率器件20的散热壁上，并且毛细吸液层200的一端用于浸泡在位于积液部的冷却液30中。毛细吸液层200可以通过网孔状或网线状结构固定铺展或吸附在功率器件20的散热壁上。毛细 吸液层200用于浸泡在冷却液30中的一端通过毛细作用吸收冷却液30，并润湿整个毛细吸液层200，也就是使功率器件20的散热壁始终与冷却液30接触，散热壁的温度均匀，提高散热效率。
可以理解，散热口的大小应尽量最大化满足功率器件20散热需求，也就是使毛细吸液层200尽可能最大化覆盖散热壁的发热部分，使功率器件20的整个散热壁的温度均匀，显著提高换热效率。
具体地，冷却液30可以为硅油、矿物油及植物油等绝缘液体工质。可以理解，在其他实施方式中，冷却液30也可以选用水，只要能够根据实际情况满足散热需求即可。
具体地，散热口设于冷却器本体100的一侧壁上且位于积液部的上方。优选地，散热口可以位于该侧壁的中部毛细吸液层200的一端通过弯折伸入至积液部中，该端通过毛细吸液作用吸收冷却液30，并润湿整个毛细吸液层200，进而使散热壁始终处于换热过程中。
优选地，毛细吸液层200的耐热温度大于100℃。例如，毛细吸液层200可以为无纺布吸液层、铜网吸液层或烧结铜粉吸液层，通过加工成满足散热要求的形状，紧贴或吸附在散热壁上。毛细吸液层的厚度为0.1～2cm，以尽量提高毛细吸液层200中冷却液30的承载量，提高热交换效率。在本实施例方式中，散热结构300的冷凝通道与冷却腔体110相连通，用于供挥发后的冷却液30冷凝回流至冷却腔体110内。
优选地，散热结构300设于冷却器本体100上，且位于冷却腔体110的顶端，且与散热口相对设置，使冷凝回流的液体浇灌在毛细吸液层200上，可以进一步提高冷却效率。其中，散热结构300可以为风冷散热器、水冷换热器或翅片式对流散热器。可以理解，在其他实施方式中，散热结构300也可以位于冷却腔体110的中上部，通过挥发后的冷却液30的冷凝或冷却即可。
可以理解，在其他实施方式中，如果功率器件20置换为散热量不大、但依然需要维持在一定温度范围内的结构或器件时，可以不需要设置散热结构300。
使用本实施方式的毛细相变冷却器10，用于功率器件20的散热时，按如下方法安装：
(1)将冷却液30置于冷却器本体100的冷却腔体110内，并集中在积液部。
(2)将毛细吸液层200设在功率器件20的散热壁上，并保证毛细吸液层200的一端能够伸入积液部的冷却液30中。
(3)将散热壁至少和冷却器本体100上的散热口的周边部分配合密封散热口。
当功率器件20工作时，毛细吸液层200的伸入积液部的一端通过毛细作用吸收冷却液30，功率器件20的热量被毛细吸液层200中承载的冷却液30吸收，与冷却腔体110内的冷却液30进行流动传热，当冷却液30达到挥发温度时，冷却液30开始挥发，进入散热结构300的冷凝通道中，蒸汽遇冷又凝结成液体，回流到冷却腔体110中。冷却液30通过蒸发相变的反复循环过程，可以将功率器件20的热量带走。本实施方式中的毛细相变冷却器10过设置毛细吸液层200，并充分利用冷却液30的升温吸液和蒸发相变吸热，能够有效提高功率器件20的散热效率，有效控制功率器件20处于芯片的结温范围内，延长功率器件20的使用寿命。
下面结合具体实施例，对本发明做进一步说明。
实施例1
本实施例提供一种用于大功率器件散热的毛细相变冷却器，包括冷却器本体、导热硅油、耐温无纺布毛细吸液层、绝缘密封胶层和翅片式自然对流散热器。
冷却器本体具有冷却腔体和与该冷却腔体相连通的散热口，位于冷却腔体内底部的积液部填充有导热硅油。
耐温无纺布毛细吸液层紧贴于大功率器件的散热壁上，一端通过弯折后伸入至积液部的导热硅油中，使耐温无纺布毛细吸液层自动通过毛细作用承载导热硅油，用于吸收功率器件发出的热量。
冷却器本体与大功率器件通过绝缘密封胶层密封冷却腔体。
翅片式自然对流散热器设于冷却器本体上，且位于冷却器本体的冷却腔体的顶端，并与散热口相对设置。
当该大功率器件工作时，大功率器件发出的热量通过散热壁被耐温无纺布毛细吸液层总承载的导热硅油吸收。当大功率器件散发的热量使导热硅油达到挥发温度时，导热硅油蒸发进入翅片自然对流散热器的冷冷凝通道中冷却，冷却后的导热硅油回流至冷却腔体内。经过导热硅油的蒸发-冷凝回流的反复循环过程，能够有效控制大功率器件的芯片结温，延长器件的使用寿命。
实施例2
本实施例提供一种用于大功率器件散热的毛细相变冷却器，包括冷却器本体、矿物油、 铜网毛细吸液层、绝缘密封胶层和水冷换热器。
冷却器本体具有冷却腔体和与该冷却腔体相连通的散热口，位于冷却腔体内底部的积液部填充有矿物油。
铜网毛细吸液层紧贴于大功率器件的散热壁上，且一端伸入至积液部的矿物油中，使铜网毛细吸液层的该端自动通过毛细作用承载矿物油，用于吸收功率器件发出的热量。
冷却器本体与大功率器件通过绝缘密封胶层密封冷却腔体。
水冷换热器设于冷却器本体上，且位于冷却器本体的冷却腔体的顶端，并与散热口相对设置。
当该大功率器件工作时，大功率器件发出的热量通过散热壁被铜网毛细吸液层总承载的矿物油吸收。当大功率器件散发的热量是矿物油达到挥发温度时，矿物油蒸发进入水冷散热器中冷却，冷凝后的矿物油回流至冷却腔体内。经过矿物油的蒸发-冷凝回流的反复循环过程，能够有效控制大功率器件的芯片结温，延长器件的使用寿命。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种毛细相变冷却器，用于功率器件的散热，其特征在于，包括冷却器本体和毛细吸液层；
    所述冷却器本体具有冷却腔体和与所述冷却腔体相连通的散热口；所述冷却腔体的底部为用于盛放冷却液的积液部；在所述冷却器本体上，至少围绕所述散热口的周边部分用于与所述功率器件的散热壁密封配合；
    所述毛细吸液层用于设置在所述散热口位置并紧贴到所述散热壁上，且所述毛细吸液层的一端用于伸入所述积液部中。
  2. 根据权利要求1所述的毛细相变冷却器，其特征在于，所述散热口设于所述冷却器本体的一侧壁上，且位于所述积液部的上方。
  3. 根据权利要求2所述的毛细相变冷却器，其特征在于，所述毛细吸液层的一端通过弯折后伸入所述积液部中。
  4. 根据权利要求1所述的毛细相变冷却器，其特征在于，所述毛细吸液层为无纺布吸液层、铜网吸液层或烧结铜粉吸液层。
  5. 根据权利要求4所述的毛细相变冷却器，其特征在于，所述毛细吸液层的厚度为0.1-2cm。
  6. 根据权利要求1所述的毛细相变冷却器，其特征在于，还包括绝缘密封胶层，所述绝缘密封胶层至少设置在围绕所述散热口的周边部分；当所述功率器件与所述冷却器本体的散热口配合时，所述冷却器本体与所述功率器件通过所述绝缘密封胶层密封连接。
  7. 根据权利要求1至6中任一项所述的毛细相变冷却器，其特征在于，还包括散热结构，所述散热结构的冷凝通道与所述冷却腔体相连通，用于供挥发后的所述冷却液冷凝回流至所述冷却腔体中。
  8. 根据权利要求7所述的毛细相变冷却器，其特征在于，所述散热结构设于所述冷却器本体上，且位于所述冷却腔体的顶端。
  9. 根据权利要求7所述的毛细相变冷却器，其特征在于，所述散热结构为风冷散热器、水冷换热器或翅片式自然对流散热器。
  10. 权利要求1至9中任一项所述的毛细相变冷却器的安装方法，其特征在于，包括如下步骤：
    (1)将冷却液置于冷却器本体的冷却腔体内，并集中在积液部；
    (2)将毛细吸液层设于功率器件的散热壁上，并使所述毛细吸液层的一端能够伸入所述积液部并接触所述冷却液；
    (3)将所述冷却器本体的散热口的周边部分和所述散热壁配合密封所述散热口。
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