WO2018135261A1

WO2018135261A1 - Solid-state imaging element, electronic device, and method for manufacturing solid-state imaging element

Info

Publication number: WO2018135261A1
Application number: PCT/JP2017/046872
Authority: WO
Inventors: 照美神戸
Original assignee: ソニーセミコンダクタソリューションズ株式会社
Priority date: 2017-01-18
Filing date: 2017-12-27
Publication date: 2018-07-26
Also published as: JP2018117027A

Abstract

The purpose of the present invention is to facilitate the capturing of image data having identical brightness in an element comprising two image sensors bonded together. This solid-state imaging element is provided with a first sensor chip and a second sensor chip. In the first sensor chip, wiring is formed on a first front surface, and a first photoelectric conversion element is formed on a first back surface opposing the first front surface. In the second sensor chip, wiring is formed on a second front surface bonded to the first front surface, and a second photoelectric conversion element is formed on a second back surface opposing the first front surface.

Description

Solid-state image sensor, electronic device, and method for manufacturing solid-state image sensor

The present technology relates to a solid-state image sensor, an electronic device, and a method for manufacturing the solid-state image sensor. More specifically, the present invention relates to a solid-state imaging device in which two sensors are joined, an electronic device, and a method for manufacturing the solid-state imaging device.

Conventionally, an image sensor is used to capture image data in an imaging device such as a camera or a smartphone. For example, an element in which a front side irradiation type image sensor and a back side irradiation type image sensor are joined by soldering has been proposed (for example, see Patent Document 1). Here, the back side illumination type image sensor is an image sensor in which a wired surface is a front surface and a photoelectric conversion element is formed on the back surface with respect to the front surface. On the other hand, the surface irradiation type image sensor is an image sensor in which wirings and photoelectric conversion elements are formed on the surface. Since it is not necessary to arrange the photoelectric conversion elements while avoiding the wiring, the back-illuminated image sensor is generally more sensitive than the front-illuminated image sensor.

US Patent Application Publication No. 2013/0285183

In the above-described conventional technology, it is possible to simultaneously capture two pieces of image data with different brightness by using a front side illumination type image sensor and a back side illumination type image sensor having different sensitivities. A composite image with an expanded dynamic range can be generated by combining these image data. Such a synthesis process is called high dynamic range synthesis. However, depending on the type of application, image processing other than high dynamic range composition may be performed on two pieces of captured image data. For example, a process for generating a depth map and a process for performing stereo matching are executed using two pieces of image data. In these image processes, it is desirable that the brightness of the two image data to be processed is the same. In the above-described prior art, since the sensitivity of each image sensor is different, in order to capture image data with the same brightness, each exposure amount must be controlled to a different value, and imaging is performed with limited imaging conditions. There is a problem that becomes difficult.

The present technology has been created in view of such a situation, and an object thereof is to facilitate the imaging of image data having the same brightness in an element obtained by joining two image sensors.

The present technology has been made to solve the above-described problems. The first side surface of the present technology has a wiring formed on the first surface, and the first photoelectric conversion element is formed on the first back surface with respect to the first surface. A first sensor chip formed, a second sensor chip in which wiring is formed on a second surface joined to the first surface, and a second photoelectric conversion element is formed on a second back surface with respect to the first surface, and a solid An imaging element and a manufacturing method thereof. Thereby, imaging is performed by the solid-state imaging device in which the first sensor chip having the first photoelectric conversion element formed on the first back surface and the second sensor chip having the second photoelectric conversion element formed on the second back surface are joined. This brings about the effect.

Further, in the first side surface, a protective layer for protecting the first microlens may be further formed on the first back surface, and a second microlens may be further formed on the second back surface. Thereby, the first microlens is protected.

In the first aspect, the first sensor chip includes a substrate on which the first photoelectric conversion element is formed and a first wiring layer, and the second sensor chip includes the second photoelectric conversion element. The formed substrate and the second wiring layer may be included. Thereby, the effect | action that a photoelectric conversion is performed by the 1st photoelectric conversion element and 2nd photoelectric conversion element which were formed in the board | substrate is brought about.

Further, in the first aspect, the second sensor chip may further include a predetermined support substrate. This brings about the effect that the bending strength is increased by the support substrate.

In the first aspect, one of the first wiring layer and the second wiring layer may include a predetermined logic circuit. This brings about the effect that signal processing is executed in the logic circuit.

In the first aspect, one of the first sensor chip and the second sensor chip further includes a logic substrate on which a predetermined logic circuit is formed. The logic substrate includes the first wiring layer and the first sensor layer. You may arrange | position between 2 wiring layers. As a result, the signal processing is performed on the logic board.

In addition, the first side surface may further include a through via formed in the logic substrate. As a result, the signal is transmitted in the logic board through the through via.

Further, in the first aspect, a through via penetrating from the logic substrate to the inside of the second wiring layer may be further provided. As a result, an image signal is transmitted between the logic board and the second wiring layer through the through via.

In the first side surface, another protective layer may be further formed on the second back surface. This brings about the effect that the second microlens is protected.

In the first aspect, the wiring may be a copper wiring, and the copper wiring on each of the first surface and the second surface may be joined by Cu—Cu connection. Thereby, the first surface and the second surface are brought into close contact with each other.

In the first aspect, the first surface and the second surface may contain silicon monoxide, and the first surface and the second surface may be joined by a SiO—SiO connection. Thereby, the first surface and the second surface are brought into close contact with each other.

Further, in the first side surface, the first surface and the second surface may be joined by an adhesive. Thereby, the first surface and the second surface are brought into close contact with each other.

In addition, according to a second aspect of the present technology, a first sensor chip in which a wiring is formed on a first surface and a first photoelectric conversion element is formed on a first back surface with respect to the first surface, and the first surface is bonded to the first sensor chip. A second sensor chip in which a wiring is formed on the second surface and a second photoelectric conversion element is formed on a second back surface with respect to the first surface; a first optical system that guides light to the first back surface; And an electronic device including a second optical system for guiding light to the second back surface. Accordingly, the first optical chip is obtained by joining the first sensor chip in which the first photoelectric conversion element is formed on the first back surface and the second sensor chip in which the second photoelectric conversion element is formed on the second back surface. The light from the system and the second optical system is photoelectrically converted.

In the second aspect, each of the first optical system and the second optical system may include an object side lens and a lens group that guides light from the object side lens. Thereby, the effect | action that the light from an object side lens and a lens group is photoelectrically converted is brought about.

Further, in the second aspect, each of the first optical system and the second optical system may include an object side lens and a mirror that bends light from the object side lens. Thereby, the effect | action that the light bent by the mirror is photoelectrically converted is brought about.

Further, in the second aspect, each of the first optical system and the second optical system may further include a lens group that guides the bent light. Thereby, the effect | action that the light from a lens group is photoelectrically converted is brought about.

Further, in the second aspect, an interposer in which wiring is formed may be further provided, and the first sensor chip and the second sensor chip may be mounted on the interposer. This brings about the effect that imaging is performed by the first sensor chip and the second sensor chip mounted on the interposer.

In the second aspect, the first sensor chip and the second sensor chip may be mounted on the interposer by wire bonding. This brings about the effect that imaging is performed by the first sensor chip and the second sensor chip mounted on the interposer by wire bonding.

In the second aspect, the first sensor chip and the second sensor chip may be mounted on the interposer by welding. This brings about the effect that imaging is performed by the first sensor chip and the second sensor chip mounted on the interposer by welding.

In this second aspect, the interposer may further include a logic circuit. Accordingly, there is an effect that imaging is performed by the first sensor chip and the second sensor chip mounted on the interposer in which the logic circuit is formed.

In the second aspect, the electronic device may further include a first optical system and a second optical system, and the electronic device may be an endoscope. This brings about the effect that imaging is performed by the first sensor chip and the second sensor chip mounted on the endoscope.

In the second aspect, the first optical system is provided on a side surface of the endoscope, and the second optical system includes a first lens whose optical axis is parallel to the axial direction of the endoscope. The first optical system may include a second lens and a mirror that bends light from the second lens. This brings about the effect that light is guided by the first optical system on the side surface and the second optical system that bends the light.

Further, in the second aspect, the first optical system and the second optical system may be provided on a side surface of the endoscope. This brings about the effect | action that light is guide | induced by the 1st optical system and 2nd optical system which are arrange | positioned at the side surface.

In the second aspect, each of the first optical system and the second optical system may include a lens and a mirror that bends light from the lens. This brings about the effect that the light is guided by the first optical system and the second optical system that bend the light.

In the second aspect, each of the first optical system and the second optical system may include a lens having an optical axis parallel to the axial direction of the endoscope. Accordingly, there is an effect that light is guided by the first optical system and the second optical system including a lens whose optical axis is parallel to the axial direction of the endoscope.

According to the present technology, it is possible to obtain an excellent effect that it is possible to easily capture image data with the same brightness in an element in which two image sensors are joined. Note that the effects described here are not necessarily limited, and may be any of the effects described in the present disclosure.

1 is an example of an external view of an electronic device according to a first embodiment of the present technology. 1 is an example of a cross-sectional view of an electronic device according to a first embodiment of the present technology. It is a figure for demonstrating the structure of the double-sided image sensor chip in 1st Embodiment of this technique. 1 is an example of a cross-sectional view of a double-sided image sensor chip according to a first embodiment of the present technology. FIG. 3 is an example of a cross-sectional view of a right-side backside illuminated sensor and a logic board before bonding in the first embodiment of the present technology. FIG. 3 is an example of a cross-sectional view of a right-side backside illuminated sensor and a logic substrate after bonding in the first embodiment of the present technology. It is an example of sectional drawing of the left back irradiation type sensor before joining in a 1st embodiment of this art, a logic board, and a right side back irradiation type sensor. FIG. 3 is an example of a cross-sectional view of a left back-side illuminated sensor, a logic substrate, and a right back-side illuminated sensor after bonding according to the first embodiment of the present technology. It is an example of sectional drawing of the double-sided image sensor chip in which the micro lens etc. in a 1st embodiment of this art were formed. 1 is an example of a cross-sectional view of a double-sided image sensor chip after formation of a high heat resistant material in a first embodiment of the present technology. It is an example of sectional drawing of the double-sided image sensor chip after glass formation in a 1st embodiment of this art. It is an example of sectional drawing of the double-sided image sensor in which the micro lens etc. in a 1st embodiment of this art were formed. It is an example of the top view and sectional view of the double-sided image sensor chip before soldering in the first embodiment of the present technology. 1 is an example of a plan view and a cross-sectional view of a double-sided image sensor chip and a flexible printed circuit board after soldering according to a first embodiment of the present technology. It is an example of the top view and sectional view of a double-sided image sensor chip and a flexible printed circuit board after cover glass attachment in a 1st embodiment of this art. 3 is a flowchart illustrating an example of a method for manufacturing a double-sided image sensor chip according to the first embodiment of the present technology. It is an example of sectional drawing of the double-sided image sensor chip in the modification of a 1st embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in a 2nd embodiment of this art. It is an example of sectional drawing of the left back irradiation type sensor and right side back irradiation type sensor before joining in a 2nd embodiment of this art. It is an example of sectional drawing of the left back irradiation type sensor and right side back irradiation type sensor after joining in a 2nd embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in which the micro lens etc. in a 2nd embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip after high heat-resistant material formation in a 2nd embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip after glass formation in a 2nd embodiment of this art. It is an example of sectional drawing of the double-sided image sensor in which the micro lens etc. in a 2nd embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip in the modification of the 2nd embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in a 3rd embodiment of this art. It is an example of sectional drawing of the left back irradiation type sensor after a joining in the 3rd embodiment of this art, a support substrate, and a right side back irradiation type sensor. It is an example of sectional drawing of the double-sided image sensor chip in which the micro lens etc. in a 3rd embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip after high heat-resistant material formation in a 3rd embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip after glass formation in a 3rd embodiment of this art. It is an example of sectional drawing of the double-sided image sensor in which the micro lens etc. in a 3rd embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip in the modification of the 3rd embodiment of this art. It is a figure for demonstrating the structure of the double-sided image sensor chip in 4th Embodiment of this technique. It is an example of the top view of the right side sensor chip in 4th Embodiment of this technique. It is an example of the top view of the left sensor chip in 4th Embodiment of this technique. It is an example of sectional drawing of the left sensor chip and right sensor chip before joining in a 4th embodiment of this art. It is an example of sectional drawing of the left sensor chip and right sensor chip after joining in a 4th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in which the micro lens etc. in a 4th embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip after high heat-resistant material formation in the 4th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip after glass formation in a 4th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in which the micro lens etc. in a 4th embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip after formation of a penetration via in a 4th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in the modification of the 4th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in a 5th embodiment of this art. It is an example of sectional drawing of a right back irradiation type sensor and a logic board before joining in a 5th embodiment of this art. It is an example of sectional drawing of the right back irradiation type sensor and logic board after joining in a 5th embodiment of this art. It is an example of sectional drawing of the left back irradiation type sensor before joining in a 5th embodiment of this art, a logic board, and a right side back irradiation type sensor. It is an example of sectional drawing of the left sensor chip and right sensor chip after joining in a 5th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor in which the micro lens etc. in a 5th embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip after high heat-resistant material formation in a 5th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip after glass formation in a 5th embodiment of this art. It is an example of sectional drawing of the double-sided image sensor chip in which the micro lens etc. in a 5th embodiment of this art were formed. It is an example of sectional drawing of the double-sided image sensor chip in the modification of the 5th embodiment of this art. It is an example of sectional drawing of the electronic device in a 6th embodiment of this art. It is an example of sectional drawing of the electronic device in the modification of 6th Embodiment of this technique. It is an example of sectional drawing of the electronic device in a 7th embodiment of this art. It is an example of sectional drawing of the electronic device which mounted the double-sided image sensor chip in an 8th embodiment of this art. It is an example of sectional drawing of the electronic device which mounted the double-sided image sensor chip in a 9th embodiment of this art. It is an example of sectional drawing of an electronic device which mounts the double-sided image sensor chip in a 10th embodiment of this art. It is an example of sectional drawing of the electronic device which mounted the double-sided image sensor chip in an 8th embodiment of this art. It is an example of sectional drawing of the electronic device which mounted the double-sided image sensor chip in a 9th embodiment of this art. It is an example of sectional drawing of an electronic device which mounts the double-sided image sensor chip in a 10th embodiment of this art. It is an example of the top view of the interposer which mounted the double-sided image sensor chip in 14th Embodiment of this technique. It is an example of sectional drawing of an interposer which mounted a double-sided image sensor chip in a 14th embodiment of this art. It is an example of the top view of the interposer which mounted the double-sided image sensor chip in 15th Embodiment of this technique. It is an example of a sectional view of an interposer on which a double-sided image sensor chip according to a fifteenth embodiment of the present technology is mounted. It is an example of the top view of the interposer which mounted the double-sided image sensor chip in a 16th embodiment of this art. It is an example of a sectional view of an interposer on which a double-sided image sensor chip according to a sixteenth embodiment of the present technology is mounted. FIG. 28 is an example of a plan view and a cross-sectional view of an interposer before mounting a double-sided image sensor chip in a sixteenth embodiment of the present technology. It is an example of the top view and sectional drawing of the interposer which mounted the double-sided image sensor chip in 16th Embodiment of this technique. It is an example of the top view and sectional view of the interposer which formed the welding alloy in the 16th embodiment of this art. It is an example of the top view and sectional drawing of the interposer which joined the logic circuit in 16th Embodiment of this technique. It is an example of the top view and sectional view of a double-sided image sensor chip and an interposer sealed with glass in the sixteenth embodiment of the present technology. It is a block diagram which shows the schematic structural example of a vehicle control system. It is explanatory drawing which shows an example of the installation position of an imaging part. It is a figure which shows an example of a schematic structure of an endoscopic surgery system. It is a block diagram which shows an example of a function structure of a camera head and CCU. It is a block diagram which shows an example of a schematic structure of an in-vivo information acquisition system.

Hereinafter, modes for carrying out the present technology (hereinafter referred to as embodiments) will be described. The description will be made in the following order.
1. First embodiment (example in which chips are brought into close contact with each other)
2. Second embodiment (example in which chips are brought into close contact with each other without using a logic substrate)
3. Third embodiment (example in which chips are brought into close contact with each other via a support substrate)
4). Fourth Embodiment (Example in which chips are brought into close contact with each other without stacking logic substrates)
5). Fifth embodiment (example in which the length of the through via is changed and the chips are bonded to each other)
6). Sixth embodiment (example in which rear lenses are arranged and chips are brought into close contact with each other)
7). Seventh embodiment (example in which chips are brought into close contact with each other in a twin-lens camera)
8). Eighth embodiment (an example in which a double-sided image sensor chip in which chips are bonded together and mounted on an endoscope)
9. Ninth Embodiment (An example in which a double-sided image sensor chip in which chips are brought into close contact with each other and two mirrors are mounted on an endoscope)
10. Tenth Embodiment (An example in which a double-sided image sensor chip in which chips are brought into close contact with each other and one mirror are mounted on an endoscope)
11. Eleventh Embodiment (Example in which a double-sided image sensor chip and a mirror in which chips are brought into close contact with each other and mounted on a capsule endoscope)
12 Twelfth embodiment (example in which a double-sided image sensor chip in which chips are brought into close contact with each other and mounted on a capsule endoscope)
13. Thirteenth Embodiment (Example in which a double-sided image sensor chip in which chips are brought into close contact with each other and mounted on a capsule endoscope by changing the arrangement of members)
14 Fourteenth embodiment (an example in which a double-sided image sensor chip in which chips are brought into close contact with each other and mounted on an interposer by wire bonding)
15. Fifteenth embodiment (example in which a double-sided image sensor chip in which chips are closely bonded to each other is mounted on an interposer with a bonding agent)
16. Sixteenth Embodiment (Example in which a double-sided image sensor chip and a logic circuit in which chips are closely bonded are mounted on an interposer)

<1. First Embodiment>
[Configuration example of electronic device]
FIG. 1 is an example of an external view of an electronic device 100 according to the first embodiment of the present technology. The shape of the electronic device 100 is, for example, a rectangular parallelepiped. Further,

front lenses

110 and 120 and a display unit 130 are formed on a surface of the electronic device 100. As the electronic device 100, for example, a smartphone is assumed. The electronic device 100 is not limited to a smartphone as long as it has an imaging function, and may be a digital camera or a personal computer, for example.

Hereinafter, the surface on which the display unit 130 is formed in the electronic device 100 is referred to as “front”, and the surface opposite to the front is referred to as “back”. Of the four planes perpendicular to the front, two of the larger areas are referred to as “side surfaces”. Of the two planes other than the front and side surfaces, the one closer to the

front lenses

110 and 120 is referred to as the “upper surface”, and the surface opposite to the upper surface is referred to as the “lower surface”.

The

front lenses

110 and 120 collect light and guide it into the electronic device 100. The display unit 130 displays various data such as image data. The

front lenses

110 and 120 are examples of the object-side lens described in the claims.

FIG. 2 is an example of a cross-sectional view of the electronic device 100 as viewed from above in the first embodiment of the present technology. Inside the electronic device 100, mirrors 141 and 151,

lens groups

142 and 152, a double-sided image sensor chip 200, a flexible printed circuit board 160, and a cover glass 170 are disposed. Of the two side surfaces, the side closer to 120 is the right side surface, and the mirror 151, lens group 152, cover glass 170, flexible printed circuit board 160, double-sided image sensor chip 200, lens group 142, and mirror 141 are arranged in this order from the right side. Is done.

The optical system including the front lens 110, the mirror 141, and the lens group 142 is an example of a first optical system described in the claims. The optical system including the front lens 120, the mirror 151, and the lens group 152 is an example of a second optical system described in the claims.

The mirror 141 bends the light from the front lens 110 toward the lens group 142. The lens group 142 collects the light from the mirror 141 and guides it to the double-sided image sensor chip 200.

The mirror 151 bends the light from the front lens 120 toward the lens group 152. The lens group 152 collects the light from the mirror 151 and guides it to the double-sided image sensor chip 200. By bending the light with the

mirrors

141 and 151, the distance from the front surface to the back surface of the electronic device 100 can be shortened as compared with the case where the light is not bent.

The double-sided image sensor chip 200 captures image data by photoelectrically converting light. One side of the double-sided image sensor chip 200 is irradiated with light from the lens group 142 and the other side is irradiated with light from the lens group 152. The double-sided image sensor chip 200 is an example of a solid-state imaging device described in the claims.

The flexible printed circuit board 160 is a flexible printed circuit board connected to the double-sided image sensor chip 200. The flexible printed circuit board 160 supplies image data captured by the double-sided image sensor chip 200 to the display unit 130, a memory (not shown), and the like. Further, the central portion (dotted line portion) of the flexible printed circuit board 160 is opened, and light from the opening portion is irradiated to the double-sided image sensor chip 200.

The cover glass 170 is a member that protects the double-sided image sensor chip 200. The cover glass 170 is adhered to the surface of the flexible printed circuit board 160 to which the double-sided image sensor chip 200 is not connected.

[Configuration example of double-sided image sensor chip]
FIG. 3 is a diagram for describing the configuration of the double-sided image sensor chip 200 according to the first embodiment of the present technology. The double-sided image sensor chip 200 includes a left sensor chip 201 and a right sensor chip 202 located on the right side of the left sensor chip 201.

The left sensor chip 201 includes a left backside illumination type sensor 240. The right sensor chip 202 includes a right backside illumination sensor 210 and a logic board 230. The left sensor chip 201 is an example of a first sensor chip described in the claims. The right sensor chip 202 is an example of a second sensor chip described in the claims.

The right side rear surface irradiation type sensor 210 is a sensor in which a surface on which a circuit is disposed is a front surface and a photodiode is disposed on the back surface with respect to the front surface. The right backside illumination sensor 210 captures image data and supplies it to the logic board 230. Further, the front surface of the right backside illumination sensor 210 is bonded to the right surface of the logic substrate 230.

The left side rear surface irradiation type sensor 240 is a sensor in which a surface on which a circuit is disposed is a front surface and a photodiode is disposed on the back surface with respect to the front surface. The left backside illumination sensor 240 captures image data and supplies it to the logic board 230. Further, the surface of the left backside illumination type sensor 240 is bonded to the left side surface of the logic board 230.

The logic board 230 is a board on which a predetermined logic circuit is formed. By this logic circuit, for example, various signal processing such as camera control processing such as AF (After-Focus) and AE (Auto-Exposure) and gamma processing is executed on the image data from the two sensors. Further, depth map generation, stereo matching processing, and the like are performed as necessary. When the logic board 230 processes image data from both the right backside illumination sensor 210 and the left backside illumination sensor 240, the timing of signal processing for the image data of those sensors can be easily matched. Note that a part of the above-described processing executed on the logic board 230 can be executed by a subsequent circuit instead of the logic board 230.

FIG. 4 is an example of a cross-sectional view of the double-sided image sensor chip 200 according to the first embodiment of the present technology. In the figure, the left side back-illuminated sensor 240 is shown on the lower side of the figure. For this reason, in the figure, the description will be given with the left backside illumination type sensor 240 as the lower side and the right backside illumination type sensor 210 as the upper side. A wiring layer 247 is provided on the upper surface of the left backside illumination sensor 240. A circuit is formed in the wiring layer 247 by Cu (copper) wiring 248. Further, the wiring layer 247 is in close contact with the logic substrate 230 and bonded by, for example, Cu—Cu bonding. Here, the Cu—Cu connection is a bonding method in which the Cu wirings of the substrates are directly connected to each other by applying pressure to each of the substrates while heating the two substrates to be bonded. The member to be directly connected is not limited to Cu, and may be silicon monoxide (SiO) or the like. When silicon monoxide is directly connected, it is called SiO—SiO connection. Further, the manufacturing apparatus can be bonded using a method other than Cu—Cu connection as long as the substrates can be bonded to each other.

A substrate 245 is provided below the wiring layer 247, and a photodiode 246 is formed in the substrate 245. The wiring layer 247 is an example of a first wiring layer described in the claims, and the photodiode 246 is an example of a first photoelectric conversion element described in the claims.

Further, a color filter 244 is formed on the lower surface of the substrate 245, and a microlens 243 is formed on the lower side thereof. The microlens 243 is an example of a first microlens described in the claims.

The high heat resistant material 242 is formed below the microlens 243, and the glass 241 is formed below the high heat resistant material 242. As the high heat-resistant material 242, a transparent member (polyethylene, polystyrene, acrylic resin, vinyl chloride, etc.) whose shape is reversibly changed by heat is used.

The microlens 243 is protected by the high heat resistant material 242 and the glass 241. Note that the layer made of the high heat-resistant material 242 and the glass 241 is an example of a protective layer described in the claims.

As described above, by arranging the photodiode 246 on the back surface with respect to the surface where the circuit is disposed (the surface on the logic board 230 side), the left back-side illuminated sensor 240 has the light irradiated on the back surface. Can be photoelectrically converted. In such a back-illuminated image sensor, since there is no wiring on the back surface that is the irradiation surface, the sensitivity can be improved as compared with the front-illuminated type.

An oxide film 234 such as silicon monoxide (SiO) is formed on the lower surface of the logic substrate 230. A substrate 233 is formed on the upper side of the oxide film 234. A wiring layer 231 is formed on the upper side of the substrate 233. A circuit is formed in the wiring layer 231 by the Cu wiring 232.

Further, a through via 235 that penetrates from the oxide film 234 to the wiring layer 231 is formed in the logic substrate 230. As a material of the through via 235, for example, an Al—Cu alloy is used. For example, a pixel signal is transmitted through the through via 235.

Here, if the through via 235 is lengthened until it penetrates the surface of the logic substrate 230, it is necessary to secure a space for the through via 235 on the surface. However, in the double-sided image sensor chip 200, since the through via 235 is formed inside the logic substrate 230, there is no need to provide a space for the through via 235 on the surface of the logic substrate 230, and the surface area is increased accordingly. Can be small.

In addition, the wiring layer 231 of the logic substrate 230 is in close contact with the front surface of the right side rear surface irradiation type sensor 210 and is bonded by, for example, Cu—Cu bonding. That is, the surface of the right backside illumination sensor 210 is bonded to the surface of the left backside illumination sensor 240 via the logic substrate 230.

A wiring layer 215 is formed on the lower surface of the right side rear surface irradiation type sensor 210. In the wiring layer 215, a circuit is formed by the Cu wiring 216 and the Al—Cu-based wiring 217. The wiring layer 215 is an example of a second wiring layer described in the claims.

Further, a substrate 214 is formed above the wiring layer 215, and a photodiode 213 is formed in the substrate 214. The photodiode 213 is an example of a second photoelectric conversion element described in the claims.

Further, the color filter 212 is formed on the upper surface of the substrate 214, and the microlens 211 is formed on the upper side. The microlens 211 is an example of a second microlens described in the claims.

Further, a through via 221 penetrating from the back surface to the wiring layer 215 is formed in the right back surface irradiation type sensor 210. For example, an Al—Cu alloy is used as the material of the through via 221.

As described above, by placing the photodiode 213 on the back surface with respect to the surface where the circuit is disposed (the surface on the logic board 230 side), the right-side backside illumination sensor 210 emits light irradiated on the back surface. Can be photoelectrically converted.

Also, since both sensors are back-illuminated, their sensitivity can be made the same value. Thereby, the double-sided image sensor chip 200 can simultaneously capture two pieces of image data having the same brightness. Although it is desirable that the characteristics such as sensitivity of both the sensors are the same, a configuration in which the characteristics of these sensors are different may be used.

In addition, the manufacturing apparatus makes the thickness of the solder ball smaller than that in the case where the logic substrate 230 and the surface of the left side rear surface irradiation type sensor 240 are bonded by Cu—Cu connection and bonded by soldering. can do.

Next, a method for manufacturing the double-sided image sensor chip 200 will be described.

FIG. 5 is an example of a cross-sectional view of the right-side backside illuminated sensor 210 and the logic substrate 230 before bonding in the first embodiment of the present technology. In the drawing, a is an example of a cross-sectional view of the right backside illumination sensor 210 before bonding, and b in the drawing is an example of a cross-sectional view of the logic substrate 230 before bonding.

When manufacturing the double-sided image sensor chip 200, the manufacturing apparatus first manufactures the right-side backside illuminated sensor 210 with the surface facing up, as illustrated in a in FIG. In addition, the manufacturing apparatus manufactures the logic substrate 230 with the wiring layer 231 facing upward as illustrated in FIG.

Then, the manufacturing apparatus inverts the right-side backside illumination type sensor 210 so that the surface is directed downward, and is bonded to the logic substrate 230 by Cu—Cu connection.

FIG. 6 is an example of a cross-sectional view of the right-side backside illuminated sensor 210 and the logic substrate 230 after bonding in the first embodiment of the present technology. In the figure, a is an example of a cross-sectional view of the right backside illumination sensor 210 and the logic substrate 230 before inversion, and b in the figure is a cross section of the right backside illumination sensor 210 and the logic substrate 230 after inversion. It is an example of a figure.

The manufacturing apparatus inverts the right side back-illuminated sensor 210 and the logic substrate 230 exemplified in a in FIG. 6 and polishes the substrate 233 according to the length of the through via 235. Thereby, the thickness of the board | substrate 233 is adjusted so that it may illustrate in b in the figure.

FIG. 7 is an example of a cross-sectional view of the left back-side illuminated sensor 240, the logic substrate 230, and the right back-side illuminated sensor 210 before bonding in the first embodiment of the present technology. In the figure, a is an example of a cross-sectional view of the left backside illumination sensor 240 before joining, and b in the figure is an example of a cross-sectional view of the logic board 230 and the right side backside illumination sensor 210 before joining. .

The manufacturing apparatus manufactures the left-side backside illuminated sensor 240 with the front side facing up, as illustrated in FIG. Further, the manufacturing apparatus forms an oxide film 234 on the substrate 233 as illustrated in FIG. Then, the manufacturing apparatus penetrates the through via 235 in the logic substrate 230 and contacts one end of the through via 235 to the Cu wiring 232 in the wiring layer 231. Subsequently, the manufacturing apparatus inverts the left back-side illuminated sensor 240 and joins it to the logic substrate 230 by Cu—Cu connection.

FIG. 8 is an example of a cross-sectional view of the left backside illumination sensor 240, the logic substrate 230, and the right backside illumination sensor 210 after bonding according to the first embodiment of the present technology. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus polishes the left backside illumination type sensor 240 and forms the color filter 244 and the microlens 243 thereon.

FIG. 9 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 243 and the like according to the first embodiment of the present technology are formed. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a high heat resistant material 242 on the microlens 243.

FIG. 10 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the high heat-resistant material 242 is formed in the first embodiment of the present technology. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a glass 241 for protecting the microlens 243 on the high heat resistant material 242.

Although the microlens 243 is protected by the high heat resistant material 242, it can be protected by a BGR seal instead of the high heat resistant material 242. In addition, it can be protected by a wafer support system using UV (Ultra Violet) curable liquid adhesive. At that time, the glass 241 can be peeled after the microlenses 211 are formed.

Further, the manufacturing apparatus can also make the glass 241 to have a thickness of about 50 micrometers (μm) by grinding or polishing using lapping or polishing.

FIG. 11 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the glass 241 is formed in the first embodiment of the present technology. The manufacturing apparatus inverts the double-sided image sensor chip 200 shown in the figure so that the glass 241 faces downward, and the color filter 212 and the microlens 211 are formed on the right-side backside illumination sensor 210.

FIG. 12 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 211 and the like according to the first embodiment of the present technology are formed. In the double-sided image sensor chip 200 of FIG. 6, the manufacturing apparatus passes the through via 221 through the right side back-illuminated sensor 210 and makes one end of the through via 221 contact the Al—Cu wiring 217 in the wiring layer 215. Thereby, the double-sided image sensor chip 200 illustrated in FIG. 4 is obtained.

As described above, the manufacturing apparatus joins the left sensor chip 201 and the right sensor chip 202 by Cu—Cu connection. Normally, in soldering, a gap is generated between the chips due to the solder balls. However, according to the Cu—Cu connection, the manufacturing apparatus can bond the chips together. For this reason, the thickness of the double-sided image sensor chip 200 can be reduced as compared with the case where soldering is performed.

However, since the chip needs to be heated and pressurized in the Cu-Cu connection, if the microlens is formed before bonding, the microlens may be deformed or damaged. Therefore, the manufacturing apparatus forms the microlens 243 on the left backside illumination sensor 240 after joining by Cu—Cu connection as illustrated in FIG. Thereby, it can suppress that the microlens 243 is damaged at the time of joining.

In addition, since the manufacturing apparatus forms the

color filters

212 and 244 after joining with heating, a heat-sensitive material (such as an organic material) can be used for the color filter.

Next, it is necessary for the manufacturing apparatus to invert the double-sided image sensor chip 200 and form the microlens 211 on the right side backside illumination type sensor 210. Here, if the microlens 243 is reversed with the microlens 243 exposed, the exposed microlens 243 may be on the lower side and the lens may be damaged. Therefore, as illustrated in FIGS. 10 and 11, the manufacturing apparatus reverses after protecting the microlens 243 with the high heat resistant material 242 and the glass 241. Thereby, since the glass 241 is on the lower side, damage to the microlens 243 can be suppressed.

FIG. 13 is an example of a plan view and a cross-sectional view of the double-sided image sensor chip 200 before soldering in the first embodiment of the present technology. A in the same figure is an example of the top view which looked at the double-sided image sensor chip 200 before soldering from the right side. B in the figure is an example of a cross-sectional view of the double-sided image sensor chip 200 before soldering as seen from above.

As illustrated in a in FIG. 13, in the double-sided image sensor chip 200, a plurality of rectangular pads for forming solder balls are formed around the rectangular light receiving surface 205. The size of one side of the double-sided image sensor chip 200 when viewed from the right side is, for example, 1 millimeter mail (mm).

The manufacturing apparatus forms solder balls 206 on the pad portions as illustrated in FIG. The diameter of the solder ball 206 is, for example, 30 micrometers. The depth of the pad is, for example, 6 micrometers (μm), and the length of one side of the pad is, for example, 50 micrometers (μm). Further, the thickness of the double-sided image sensor chip 200 is, for example, 320 micrometers (μm). Then, the manufacturing apparatus connects the double-sided image sensor chip 200 to the flexible printed circuit board 160 by soldering.

As described above, in the double-sided image sensor chip 200, since one end of the through via is arranged only on one side thereof, the flexible printed board 160 may be connected only to that side. Further, the pads need only be arranged on one side of the double-sided image sensor chip 200. Thereby, process cost can be reduced compared with the structure which arrange | positions a pad in the double-sided image sensor chip 200, and connects.

FIG. 14 is an example of a plan view and a cross-sectional view of the double-sided image sensor chip and the flexible printed circuit board 160 after soldering according to the first embodiment of the present technology. A in the same figure is an example of the top view which looked at the double-sided image sensor chip 200 after soldering and the flexible printed circuit board 160 from the side surface. B in the figure is an example of a cross-sectional view of the double-sided image sensor chip 200 and the flexible printed circuit board 160 as viewed from above after soldering.

As illustrated in a in FIG. 14, the flexible printed circuit board 160 has an opening 161 having substantially the same size as the light receiving surface 205. The manufacturing apparatus aligns the position of the light receiving surface 205 with the position of the opening 161 and solders the flexible printed circuit board 160 to form an element illustrated as b in FIG. Then, the manufacturing apparatus attaches the cover glass 170 to the right side of the flexible printed circuit board 160 with an adhesive or the like.

FIG. 15 is an example of a plan view and a cross-sectional view of the double-sided image sensor chip 200 and the flexible printed circuit board 160 after the cover glass 170 is attached in the first embodiment of the technology. A in the same figure is an example of the top view which looked at the double-sided image sensor chip 200 and the flexible printed circuit board 160 after attachment from the right side. B in the same figure is an example of a cross-sectional view of the double-sided image sensor chip 200 and the flexible printed circuit board 160 as viewed from above.

FIG. 16 is a flowchart illustrating an example of a method for manufacturing the double-sided image sensor chip 200 according to the first embodiment of the present technology. The operation of this flowchart is started, for example, when a substrate for manufacturing the double-sided image sensor chip 200 is placed on a manufacturing apparatus.

The manufacturing apparatus first manufactures the right backside illumination sensor 210 and the logic substrate 230 (step S901). The manufacturing apparatus inverts the right-side backside illumination type sensor 210 and bonds it to the logic board 230 (step S902). Then, the manufacturing apparatus polishes the logic substrate 230 (step S903), and forms the through via 235 in the logic substrate 230 (step S904). Subsequently, the manufacturing apparatus manufactures the left backside illumination type sensor 240 and joins the sensor to the logic substrate 230 by Cu—Cu connection (step S905).

The manufacturing apparatus polishes the left side back-illuminated sensor 240 to form the color filter 244 and the microlens 243 (step S906). Then, the manufacturing apparatus forms the high heat resistant material 242 and the glass 241 to protect the microlens 243 (step S907). The manufacturing apparatus inverts the double-sided image sensor chip 200 and forms the color filter 212 and the microlens 211 on the right backside illumination sensor 210 (step S908). Then, the manufacturing apparatus passes the through via 221 through the right-side backside illumination sensor 210 (step S909), and the manufacturing of the double-sided image sensor chip 200 is finished.

As described above, according to the first embodiment of the present technology, by joining the right backside illumination sensor 210 and the left backside illumination sensor 240, it is possible to easily capture two pieces of image data having the same brightness. can do. Further, by bonding the left sensor chip 201 and the right sensor chip 202 in close contact with each other by Cu—Cu connection, the element can be formed thinner than in the case of soldering.

[Modification]
In the first embodiment described above, the microlens 211 of the right-side backside illumination sensor 210 is exposed. However, in this configuration, dust or the like may adhere to the microlens 211. For this reason, it is desirable that the microlens 211 is also protected by a protective layer such as a high heat-resistant material, like the microlens 243. The double-sided image sensor chip 200 according to the modification of the first embodiment is different from the first embodiment in that the microlens 211 is also protected.

FIG. 17 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to a modification of the first embodiment of the present technology. The double-sided image sensor chip 200 according to the modification of the first embodiment is different from the first embodiment in that a high heat-resistant material 218 is formed on the upper side of the microlens 211.

As described above, according to the modification of the first embodiment of the present technology, the microlens 211 is protected by the high heat-resistant material 218, thereby preventing the adhesion of dust.

<2. Second Embodiment>
In the first embodiment described above, the size of the double-sided image sensor chip 200 as viewed from the light receiving surface (back surface) is reduced as compared with the case where the logic substrate 230 is stacked on the sensor and those are not stacked. . Instead, the thickness of the double-sided image sensor chip 200 is increased by the logic board 230. For this reason, when it is required to further reduce the thickness of the double-sided image sensor chip 200, it is difficult to meet the request. The double-sided image sensor chip 200 of the second embodiment is different from the first embodiment in that the double-sided image sensor chip 200 is formed thinner.

FIG. 18 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to the second embodiment of the present technology. The double-sided image sensor chip 200 of the second embodiment is different from the first embodiment in that the logic substrate 230 is not provided.

In the second embodiment, the right-side backside illumination sensor 210 and the left-side backside illumination sensor 240 are joined without going through the logic board 230. Further, the wiring layer 247 of the left backside illumination type sensor 240 is further provided with an Al—Cu-based wiring 249. A through via 222 is further provided.

The through via 222 passes through the right side backside illumination type sensor 210 and contacts the Al—Cu wiring 249 in the wiring layer 247.

The logic board 230 is provided outside the double-sided image sensor chip 200 and connected to the flexible printed board 160, for example. Alternatively, the logic board 230 is not provided in the electronic device 100, and the same circuit as that on the board is provided on the flexible printed board 160.

FIG. 19 is an example of a cross-sectional view of the left backside illumination sensor 240 and the right backside illumination sensor 210 before joining in the second embodiment of the present technology. In the figure, a is an example of a cross-sectional view of the left backside illumination sensor 240 before joining, and b in the figure is an example of a cross-sectional view of the right side backside illumination sensor 210 before joining.

The manufacturing apparatus first manufactures the left-side backside illuminated sensor 240 with the surface facing up, as illustrated in a in FIG. Moreover, the manufacturing apparatus manufactures the right-side backside illuminated sensor 210 with the front side facing up, as illustrated in FIG.

Then, the manufacturing apparatus inverts the left-side backside illumination sensor 240 so that the surface faces down, and joins the logic substrate 230 to the right-side backside illumination sensor 210 by Cu—Cu connection.

FIG. 20 is an example of a cross-sectional view of the left-side backside illumination sensor 240 and the right-side backside illumination sensor 210 after bonding according to the second embodiment of the present technology. In the double-sided image sensor chip 200 in the figure, the manufacturing apparatus forms a color filter 244 and a microlens 243 on the back surface of the left back-side illumination type sensor 240.

FIG. 21 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 243 and the like according to the second embodiment of the present technology are formed. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a high heat resistant material 242 on the microlens 243.

FIG. 22 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the high heat resistant material 242 is formed according to the second embodiment of the present technology. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a glass 241 for protecting the microlens 243 on the high heat resistant material 242.

FIG. 23 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the glass 241 is formed in the second embodiment of the present technology. The manufacturing apparatus inverts the double-sided image sensor chip 200 shown in the figure to form the color filter 212 and the microlens 211 on the right side backside illumination sensor 210.

FIG. 24 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 211 and the like according to the second embodiment of the present technology are formed. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus penetrates through

vias

221 and 222. Thereby, the double-sided image sensor chip 200 illustrated in FIG. 18 is obtained.

As described above, in the second embodiment of the present technology, the double-sided image sensor chip 200 is formed thinner by bonding the sensors without stacking the logic substrates 230 than when the logic substrates 230 are stacked. can do.

[Modification]
In the second embodiment described above, the microlens 211 of the right-side backside illumination sensor 210 is exposed. However, in consideration of the influence of dust, it is desirable to protect the microlens 211 with a protective layer as in the case of the microlens 243. The double-sided image sensor chip 200 according to the modification of the second embodiment is different from the second embodiment in that the microlens 211 is also protected.

FIG. 25 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to a modification of the second embodiment of the present technology. The double-sided image sensor chip 200 according to the modification of the second embodiment is different from the second embodiment in that a high heat resistant material 218 is formed on the upper side of the microlens 211.

As described above, in the modification of the second embodiment of the present technology, the microlens 211 is protected by the high heat-resistant material 218, whereby adhesion of dust can be prevented.

<3. Third Embodiment>
In the second embodiment described above, the manufacturing apparatus is formed thin by bonding the left backside illumination sensor 240 and the right backside illumination sensor 210 without using the logic substrate 230. The bending strength may be insufficient. The double-sided image sensor chip 200 of the third embodiment is different from the second embodiment in that the bending strength is increased.

FIG. 26 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to the third embodiment of the present technology. The double-sided image sensor chip 200 according to the third embodiment is different from the second embodiment in that the right-side sensor chip 202 further includes a support substrate 260.

The support substrate 260 is a member having a certain strength such as glass. One of both surfaces of the support substrate 260 is in close contact with the right backside illumination sensor 210 and the other is in close contact with the left backside illumination sensor 240. That is, the surface of the right backside illumination sensor 210 is joined to the surface of the left backside illumination sensor 240 via the support substrate 260. Further, for example, SiO—SiO connection is used for connection between the support substrate 260 and each sensor. Note that the manufacturing apparatus can also bond the support substrate 260 with an adhesive instead of the SiO—SiO connection.

Next, a method for manufacturing the double-sided image sensor chip 200 will be described. The manufacturing apparatus manufactures the left backside illumination sensor 240 and the right backside illumination sensor 210 and joins them to the support substrate 260.

FIG. 27 is an example of a cross-sectional view of the left backside illumination sensor 240, the support substrate 260, and the right backside illumination sensor 210 after bonding in the third embodiment of the present technology. In the double-sided image sensor chip 200 in the figure, the manufacturing apparatus forms a color filter 244 and a microlens 243 on the back surface of the left back-side illumination type sensor 240.

FIG. 28 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 243 and the like according to the third embodiment of the present technology are formed. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a high heat resistant material 242 on the microlens 243.

FIG. 29 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the high heat resistant material 242 is formed in the third embodiment of the present technology. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a glass 241 for protecting the microlens 243 on the high heat resistant material 242.

FIG. 30 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the glass 241 is formed in the third embodiment of the present technology. The manufacturing apparatus inverts the double-sided image sensor chip 200 shown in the figure to form the color filter 212 and the microlens 211 on the right side backside illumination sensor 210.

FIG. 31 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 211 and the like according to the second embodiment of the present technology are formed. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus penetrates through

vias

221 and 222. Thereby, the double-sided image sensor chip 200 illustrated in FIG. 26 is obtained.

As described above, in the third embodiment of the present technology, since the support substrate 260 is provided between the left-side backside illumination sensor 240 and the right-side backside illumination sensor 210, compared to the case where the support substrate 260 is not provided. The bending strength can be increased.

[Modification]
In the third embodiment described above, the microlens 211 of the right side rear surface irradiation type sensor 210 is exposed. However, in consideration of the influence of dust, it is desirable to protect the microlens 211 with a protective layer as in the case of the microlens 243. The double-sided image sensor chip 200 according to the modification of the third embodiment is different from the third embodiment in that the microlens 211 is also protected.

FIG. 32 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to a modification of the third embodiment of the present technology. The double-sided image sensor chip 200 according to the modification of the third embodiment is different from the third embodiment in that a high heat-resistant material 218 is formed on the upper side of the microlens 211.

As described above, in the modification of the third embodiment of the present technology, the microlens 211 is protected by the high heat-resistant material 218, whereby adhesion of dust can be prevented.

<4. Fourth Embodiment>
In the first embodiment described above, the logic substrate 230 is stacked on the sensor to reduce the area of the double-sided image sensor chip 200 as viewed from the light receiving surface (back surface). The thickness of the sensor chip 200 increases. For this reason, when it is required to form the double-sided image sensor chip 200 thinner when the electronic device 100 is downsized, it is difficult to meet the demand. The double-sided image sensor chip 200 of the fourth embodiment is different from the first embodiment in that the double-sided image sensor chip 200 is formed thinner.

FIG. 33 is a diagram for describing a configuration of a double-sided image sensor chip 200 according to the fourth embodiment of the present technology. In the right sensor chip 202, a right backside illumination sensor 210 and a driver 270 are provided on the same substrate. In the left sensor chip 201, the left backside illumination sensor 240 and the logic circuit 280 are provided on the same substrate.

The driver 270 drives the right side rear surface irradiation type sensor 210 and the left side rear surface irradiation type sensor 240 in synchronization with a vertical synchronization signal or the like. As described above, when one driver 270 drives both the right backside illumination sensor 210 and the left backside illumination sensor 240, the drive timings of these sensors can be easily matched.

The logic circuit 280 is a circuit similar to the circuit mounted on the logic board 230 in the first embodiment. Thus, in the fourth embodiment, since the logic substrate 230 is not stacked and the circuits on the substrate are arranged on the same plane, the double-sided image sensor chip 200 is formed thinner than in the case of stacking. can do.

FIG. 34 is an example of a plan view of the right sensor chip 202 viewed from the right side in the fourth embodiment of the present technology. As illustrated in the figure, pads for forming solder balls are disposed around the right backside illumination sensor 210 and the driver 270, respectively.

FIG. 35 is an example of a plan view of the left sensor chip 201 viewed from the left side surface in the fourth embodiment of the present technology. As illustrated in the figure, pads for forming solder balls are arranged around the left back-side illuminated sensor 240 and the logic circuit 280, respectively.

FIG. 36 is an example of a cross-sectional view of the left sensor chip 201 and the right sensor chip 202 before joining in the fourth embodiment of the present technology. A in the same figure is an example of a cross-sectional view of the left sensor chip 201 before joining. B in the figure is an example of a cross-sectional view of the right sensor chip 202 before joining.

36, the manufacturing apparatus forms a wiring layer 247 on the substrate 245, and forms a pixel circuit or the like above the photodiode 246 in the wiring layer 247. Thereby, the left side back irradiation type sensor 240 is manufactured. In addition, the manufacturing apparatus forms the logic circuit 280 at a position different from the left side rear surface irradiation type sensor 240 in the wiring layer 247.

36, the manufacturing apparatus forms a wiring layer 215 on the substrate 214, and forms a pixel circuit or the like above the photodiode 213 in the wiring layer 215. Thereby, the right side backside illumination type sensor 210 is manufactured. Further, the manufacturing apparatus forms the driver 270 at a position different from the right-side backside illumination sensor 210 in the wiring layer 215. Then, the manufacturing apparatus reverses the left sensor chip 201 and joins it to the right sensor chip 202 by Cu—Cu connection.

FIG. 37 is an example of a cross-sectional view of the left sensor chip 201 and the right sensor chip 202 after bonding in the fourth embodiment of the present technology. In the double-sided image sensor chip 200 in the figure, the manufacturing apparatus forms a color filter 244 and a microlens 243 on the back surface of the left back-side illumination type sensor 240.

FIG. 38 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 243 and the like according to the fourth embodiment of the present technology are formed. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a high heat resistant material 242 on the microlens 243.

FIG. 39 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the high heat resistant material 242 is formed in the fourth embodiment of the present technology. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a glass 241 for protecting the microlens 243 on the high heat resistant material 242.

FIG. 40 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the glass 241 is formed in the fourth embodiment of the present technology. The manufacturing apparatus inverts the double-sided image sensor chip 200 shown in the figure to form the color filter 212 and the microlens 211 on the right side backside illumination sensor 210.

FIG. 41 is an example of a cross-sectional view of a double-sided image sensor chip 200 in which the microlenses 211 and the like according to the fourth embodiment of the present technology are formed. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus penetrates through

vias

221 and 222.

FIG. 42 is an example of a cross-sectional view of the double-sided image sensor chip after the through

vias

221 and 222 are formed in the fourth embodiment of the present technology. The through via 221 penetrates to the inside of the driver 270, and the through via 222 penetrates to the wiring layer 215 in the right side rear surface irradiation type sensor 210.

As described above, in the fourth embodiment of the present technology, the logic substrate 230 provided with the logic circuit is not stacked, and the logic circuit is arranged on the same substrate as compared with the case where the logic substrate 230 is stacked. Thus, the double-sided image sensor chip 200 can be formed thin.

[Modification]
In the fourth embodiment described above, the microlens 211 of the right-side backside illumination sensor 210 is exposed. However, considering the influence of dust, it is desirable to protect the microlens 211 with a protective layer in the same manner as the microlens 243. The double-sided image sensor chip 200 according to the modification of the fourth embodiment is different from the fourth embodiment in that the microlens 211 is also protected.

FIG. 43 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to a modification of the fourth embodiment of the present technology. The double-sided image sensor chip 200 according to the modification of the fourth embodiment is different from the fourth embodiment in that a high heat-resistant material 218 is formed on the upper side of the microlens 211.

As described above, in the modified example of the fourth embodiment of the present technology, the microlens 211 is protected by the high heat resistant material 218, whereby adhesion of dust can be prevented.

<5. Fifth embodiment>
In the first embodiment described above, the through via 235 is disposed in the logic substrate. However, the length of the through via is further increased so that the Al—Cu wiring 217 in the right-side backside illuminated sensor 210 is formed. Can also be contacted. The double-sided image sensor chip 200 of the fifth embodiment is different from the first embodiment in that the length of the through via is different.

FIG. 44 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to the fifth embodiment of the present technology. The double-sided image sensor chip 200 of the fifth embodiment is different from the first embodiment in that a through via 236 is provided instead of the through via 235.

The through via 236 is formed of an Al—Cu based alloy and penetrates from the oxide film 234 to the wiring layer 215 to contact the Al—Cu based wiring 217.

FIG. 45 is an example of a cross-sectional view of the right-side backside illuminated sensor 210 and the logic substrate 230 before bonding in the fifth embodiment of the present technology. In the drawing, a is an example of a cross-sectional view of the right backside illumination sensor 210 before bonding, and b in the drawing is an example of a cross-sectional view of the logic substrate 230 before bonding.

First, the manufacturing apparatus manufactures the right-side backside illuminated sensor 210 with the front side facing up, as illustrated in a in FIG. In addition, the manufacturing apparatus manufactures the logic substrate 230 with the wiring layer 231 facing upward as illustrated in FIG.

Then, the manufacturing apparatus inverts the right-side backside illumination type sensor 210 so that the front surface is directed downward, and is bonded to the logic substrate 230 by Cu—Cu connection.

FIG. 46 is an example of a cross-sectional view of the right back-side illuminated sensor 210 and the logic substrate 230 after bonding in the fifth embodiment of the present technology. In the figure, a is an example of a cross-sectional view of the right backside illumination sensor 210 and the logic substrate 230 before inversion, and b in the figure is a cross section of the right backside illumination sensor 210 and the logic substrate 230 after inversion. It is an example of a figure.

The manufacturing apparatus inverts the right sensor chip 202 illustrated in a in FIG. 46 and polishes the substrate 233 according to the length of the through via 236. Thereby, the thickness of the board | substrate 233 is adjusted so that it may illustrate in b in the figure.

FIG. 47 is an example of a cross-sectional view of the left back-side illuminated sensor 240, the logic substrate 230, and the right back-side illuminated sensor 210 before bonding in the first embodiment of the present technology. In the figure, a is an example of a cross-sectional view of the left backside illumination sensor 240 before joining, and b in the figure is an example of a cross-sectional view of the logic board 230 and the right side backside illumination sensor 210 before joining. .

The manufacturing apparatus manufactures the left-side backside illuminated sensor 240 with the surface facing up, as illustrated in a in FIG. Further, the manufacturing apparatus forms an oxide film 234 on the substrate 233 as illustrated in FIG. Then, the manufacturing apparatus penetrates the through via 236 in the logic substrate 230 and contacts one end of the through via 236 to the Al—Cu-based wiring 217 in the wiring layer 215. Subsequently, the manufacturing apparatus inverts the left back-side illuminated sensor 240 and joins it to the logic substrate 230 by Cu—Cu connection.

FIG. 48 is an example of a cross-sectional view of the left backside illumination sensor 240, the logic substrate 230, and the right backside illumination sensor 210 after bonding in the fifth embodiment of the present technology. In the left sensor chip 201 and the right sensor chip 202 in the figure, the manufacturing apparatus polishes the left back-side illuminated sensor 240 and forms the color filter 244 and the microlens 243 thereon.

FIG. 49 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlens 243 is formed according to the first embodiment of the present technology. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a high heat resistant material 242 on the microlens 243.

FIG. 50 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the high heat resistant material 242 is formed in the fifth embodiment of the present technology. In the double-sided image sensor chip 200 shown in the figure, the manufacturing apparatus forms a glass 241 for protecting the microlens 243 on the high heat resistant material 242.

FIG. 51 is an example of a cross-sectional view of the double-sided image sensor chip 200 after the glass 241 is formed in the fifth embodiment of the present technology. The manufacturing apparatus inverts the double-sided image sensor chip 200 shown in the figure so that the glass 241 faces downward, and the color filter 212 and the microlens 211 are formed on the right-side backside illumination sensor 210.

FIG. 52 is an example of a cross-sectional view of the double-sided image sensor chip 200 in which the microlenses 211 and the like according to the fifth embodiment of the present technology are formed. In the double-sided image sensor chip 200 of FIG. 6, the manufacturing apparatus passes the through via 221 through the right side back-illuminated sensor 210 and makes one end of the through via 221 contact the Al—Cu wiring 217 in the wiring layer 215. Thereby, the double-sided image sensor chip 200 illustrated in FIG. 44 is obtained.

As described above, according to the fifth embodiment of the present technology, the through via 236 is lengthened, and the logic substrate 230 is connected to the right-side backside illuminated sensor 210 through the through via 236, whereby the through via 236 is interposed. Thus, signals can be transmitted between the sensors and the substrate.

[Modification]
In the fifth embodiment described above, the microlens 211 of the right side rear surface irradiation type sensor 210 is exposed. However, considering the influence of dust, it is desirable to protect the microlens 211 with a protective layer as in the case of the microlens 243. The double-sided image sensor chip 200 according to the modification of the fifth embodiment is different from the fifth embodiment in that the microlens 211 is also protected.

FIG. 53 is an example of a cross-sectional view of a double-sided image sensor chip 200 according to a modification of the fifth embodiment of the present technology. The double-sided image sensor chip 200 according to the modification of the fifth embodiment is different from the fourth embodiment in that a high heat-resistant material 218 is formed on the upper side of the microlens 211.

As described above, in the modification of the fifth embodiment of the present technology, the microlens 211 is protected by the high heat-resistant material 218, whereby adhesion of dust can be prevented.

<6. Sixth Embodiment>
In the first embodiment described above, the two lenses (front lenses 110 and 120) are both arranged in the front. However, in the configuration in which the lenses are arranged only in the front, a 360-degree panoramic image is captured. Is difficult. In order to capture such a panoramic image, for example, lenses may be arranged on both the front and the back. The electronic device 100 according to the sixth embodiment is different from the first embodiment in that lenses are arranged on the front surface and the back surface.

FIG. 54 is an example of a cross-sectional view of the electronic device 100 according to the sixth embodiment of the present technology as viewed from above. The electronic device 100 according to the sixth embodiment includes a rear lens 121 instead of the front lens 120. The rear lens 121 is disposed on the back surface. The mirror 151 bends the light from the rear lens 121 toward the lens group 152. For example, the double-sided image sensor chip 200 captures a front image and a back image at the same time, combines the image data, and generates a 360-degree panoramic image.

Thus, in the sixth embodiment of the present technology, the front lens 110 is disposed on the front surface and the rear lens 121 is disposed on the rear surface, whereby a front image and a rear image can be simultaneously captured.

[Modification]
In the sixth embodiment described above, the light is bent by the

mirrors

141 and 152, but the lower the reflectance of these mirrors, the smaller the amount of light and the darker the image. The electronic device 100 according to the modification of the sixth embodiment is different from the sixth embodiment in that no mirror is provided.

FIG. 55 is an example of a cross-sectional view of the electronic device 100 according to a modification of the sixth embodiment of the present technology. In the electronic device 100 according to the modified example of the sixth embodiment, light from the front lens 110 is guided to the lens group 142 without passing through a mirror. Further, the light from the rear lens 121 is also guided to the lens group 152 without passing through a mirror.

As described above, in the modified example of the sixth embodiment of the present technology, the light from the front lens 110 and the rear lens 121 is reflected by the mirror by being guided to the

lens groups

142 and 152 without being reflected by the mirror. In comparison, the amount of light can be increased.

<7. Seventh Embodiment>
In the above-described first embodiment, the double-sided image sensor chip 200 is arranged on the smartphone. However, the double-sided image sensor chip 200 can be provided on a device other than the smartphone, for example, a twin-lens camera. The double-sided image sensor chip 200 according to the seventh embodiment is different from the first embodiment in that it is disposed in a twin-lens camera.

FIG. 56 is an example of a cross-sectional view of the twin-lens camera 101 according to the seventh embodiment of the present technology. In the binocular camera 101, mirrors 141 and 151 and a double-sided image sensor chip 200 are arranged. The

front lenses

110 and 120 are arranged in front. Of the two side surfaces, the side closer to the front lens 120 is the right side surface, and the mirror 151, the double-sided image sensor chip 200, and the mirror 141 are arranged in this order from the right side.

The mirror 141 bends the light from the front lens 110 toward the double-sided image sensor chip 200. The mirror 151 bends the light from the front lens 120 toward the double-sided image sensor chip 200. One side of the double-sided image sensor chip 200 is irradiated with light from the mirror 141, and the other side is irradiated with light from the mirror 151.

As described above, in the seventh embodiment of the present technology, the binocular camera 101 can be easily downsized by disposing the thin double-sided image sensor chip 200 in the binocular camera 101.

<8. Eighth Embodiment>
In the above-described first embodiment, the double-sided image sensor chip 200 is mounted on the electronic device 100 such as a smartphone. However, it can be mounted on an endoscope. The eighth embodiment is different from the first embodiment in that the double-sided image sensor chip 200 is mounted on an endoscope.

FIG. 57 is an example of a cross-sectional view of the electronic device 102 on which the double-sided image sensor chip 200 according to the eighth embodiment of the present technology is mounted. The electronic device 102 is a rigid endoscope and includes

lenses

310 and 311 and a double-sided image sensor chip 200.

Here, the electronic device 102 (rigid endoscope) has a cylindrical shape, and a direction perpendicular to the upper surface (in other words, an axial direction) is defined as a Z direction, and a predetermined direction perpendicular to the Z direction is defined as an X direction. A direction perpendicular to the X direction and the Z direction is taken as a Y direction. 57a is a cross-sectional view as viewed from the Y direction, and b in FIG. 57 is a cross-sectional view as viewed from the Z direction.

The

lenses

310 and 311 are arranged on the side surface of the electronic device 102 so that their optical axis directions coincide. The double-sided image sensor chip 200 is disposed between the

lenses

310 and 311 so that the axes perpendicular to both sides coincide with the optical axes of the

lenses

310 and 311. The lens 310 guides light to one of both surfaces of the double-sided image sensor chip 200, and the lens 311 guides light to the other of the both surfaces.

As illustrated in FIG. 57b, the electronic device 102 includes a chemical solution discharge unit 312 for discharging a chemical solution, a candy outlet 313 for inserting a candy, and a light source such as a light emitting diode (LED). 314 are provided.

As described above, according to the eighth embodiment of the present technology, since the double-sided image sensor chip 200 is mounted on the electronic device 102 (rigid endoscope), two image data can be easily captured by the rigid endoscope. can do.

<9. Ninth Embodiment>
In the first embodiment described above, the double-sided image sensor chip 200 is arranged in the electronic device 102 (rigid endoscope) without bending light, but in this structure, the diameter of the rigid endoscope is reduced. Difficult to do. The electronic device 102 according to the ninth embodiment is different from the eighth embodiment in that light is bent.

FIG. 58 is an example of a cross-sectional view of the electronic device 102 on which the double-sided image sensor chip 200 according to the ninth embodiment of the present technology is mounted. This electronic device 102 is different from the eighth embodiment in that mirrors 315 and 316 are further provided.

In the ninth embodiment, the optical axis of the lens 310 and the optical axis of the lens 311 are parallel to the X direction, but are not on the same axis. Further, both surfaces of the double-sided image sensor chip 200 are parallel to the upper surface and the lower surface of the electronic device 102.

The mirror 315 bends the light from the lens 310 and guides it to one of both surfaces of the double-sided image sensor chip 200, and the mirror 316 bends the light from the lens 311 and guides it to the other of the both surfaces.

As described above, according to the ninth embodiment of the present technology, since the

mirrors

315 and 316 for bending light are further arranged, the diameter of the endoscope can be reduced as compared with the case where the light is not bent. .

<10. Tenth Embodiment>
In the ninth embodiment described above, the two

mirrors

315 and 316 are arranged, but the number of mirrors may be one. The electronic device 102 according to the tenth embodiment is different from the ninth embodiment in that one mirror is disposed.

FIG. 59 is an example of a cross-sectional view of the electronic device 102 on which the double-sided image sensor chip 200 according to the tenth embodiment of the present technology is mounted. The electronic device 102 of the tenth embodiment is different from the ninth embodiment in that the mirror 316 is not provided.

In the tenth embodiment, the lens 310 is disposed on the side surface, and the lens 311 is disposed on the lower surface. The optical axis of the lens 310 is parallel to the X direction, and the optical axis of the lens 311 is parallel to the Z direction (axial direction).

The mirror 315 bends the light from the lens 310 and guides it to one of both surfaces of the double-sided image sensor chip 200, and the lens 311 guides the light to the other of the both surfaces.

As described above, according to the tenth embodiment of the present technology, since the

lenses

310 and 311 are arranged on the side surface and the bottom surface, the diameter of the endoscope is further increased as compared with the case where these lenses are arranged on the side surface. Can be reduced.

<11. Eleventh embodiment>
In the tenth embodiment described above, the double-sided image sensor chip 200 is mounted on a rigid endoscope, but it can also be mounted on a capsule endoscope. The eleventh embodiment differs from the tenth embodiment in that the double-sided image sensor chip 200 is mounted on a capsule endoscope.

FIG. 60 is an example of a cross-sectional view of the electronic device 103 on which the double-sided image sensor chip 200 according to the eleventh embodiment of the present technology is mounted. The electronic device 103 is a capsule endoscope, and includes an antenna 361, a receiving unit 362, a transmitting unit 363, a storage unit 364, and a sample space 365. The electronic device 103 includes a mirror 366,

lenses

367 and 370, a double-sided image sensor chip 200, and

light sources

368 and 369 such as LEDs.

The receiving unit 362 receives a control signal and the like via the antenna 361. The transmission unit 363 transmits image data captured by the double-sided image sensor chip 200 to the outside via the antenna 361. The accumulation unit 364 accumulates captured image data.

Here, the electronic device 103 (capsule endoscope) is an oval rotating body such as a rounded rectangle or an ellipse, and the major axis direction of the oval is a Z direction, and a predetermined direction perpendicular to the Z direction (in other words, The minor axis direction) is taken as the X direction. A direction perpendicular to the X direction and the Z direction is taken as a Y direction. 60 is a cross-sectional view seen from the Y direction, and b in the same figure is a cross-sectional view seen from the Z direction.

The lens 367 is disposed on the side surface of the electronic device 103 (capsule endoscope), and the lens 370 is disposed at a position where the optical axis is parallel to the Z direction (long axis direction). Further, the Z direction is perpendicular to both surfaces of the double-sided image sensor chip 200. The mirror 366 bends the light from the lens 367 and guides it to one of both surfaces of the double-sided image sensor chip 200, and the lens 370 guides the light to the other of the both surfaces. The light source 368 can move along a direction perpendicular to the Z direction, and the light source 369 can move along the Z direction.

Thus, according to the eleventh embodiment of the present technology, since the double-sided image sensor chip 200 is mounted on the electronic device 103 (capsule endoscope), two pieces of image data can be easily obtained in the capsule endoscope. Can be imaged.

<12. Twelfth Embodiment>
In the eleventh embodiment described above, the light is bent, but it may be configured not to be bent. The electronic device 103 according to the twelfth embodiment differs from the eleventh embodiment in that light is not bent.

FIG. 61 is an example of a cross-sectional view of the electronic device 103 on which the double-sided image sensor chip 200 according to the twelfth embodiment of the present technology is mounted. The electronic device 103 according to the twelfth embodiment is different from the eleventh embodiment in that the mirror 366 is not provided.

In the twelfth embodiment, the

lenses

367 and 370 are arranged on the side surface of the electronic device 103 so that the optical axis directions thereof coincide with each other. The double-sided image sensor chip 200 is disposed between the

lenses

367 and 370 so that the axes perpendicular to both sides thereof coincide with the optical axes of the

lenses

367 and 370. The lens 367 guides light to one of both surfaces of the double-sided image sensor chip 200, and the lens 370 guides light to the other of the both surfaces. In addition, the

light sources

368 and 369 can move along a direction perpendicular to the Z direction.

As described above, according to the twelfth embodiment of the present technology, the

lenses

367 and 370 guide the light to the double-sided image sensor chip 200 without bending, so that no mirror is required, and the length of the capsule endoscope is long. The axial dimension can be reduced.

<13. Thirteenth Embodiment>
In the twelfth embodiment described above, the

lenses

367 and 370 are disposed on the side surfaces, but they can also be disposed at positions where their optical axes are parallel to the Z direction. The electronic apparatus 103 according to the thirteenth embodiment differs from the twelfth embodiment in that the optical axes of the

lenses

367 and 370 are parallel to the Z direction.

FIG. 62 is an example of a cross-sectional view of the electronic device 103 on which the double-sided image sensor chip 200 according to the thirteenth embodiment of the present technology is mounted. In the twelfth embodiment, the optical axes of the

lenses

367 and 370 and the axis perpendicular to both surfaces of the double-sided image sensor chip 200 are parallel to the Z direction. In addition, the

light sources

368 and 369 can move along the Z direction. The antenna 361, the reception unit 362, the transmission unit 363, the storage unit 364, and the sample space 365 are arranged on the side surface of the electronic device 103.

As described above, according to the thirteenth embodiment of the present technology, the

lenses

367 and 370 are arranged at positions where the optical axes thereof are parallel to the Z direction. The dimension of the long axis direction of the endoscope can be reduced.

<14. Fourteenth Embodiment>
In the first embodiment described above, the double-sided image sensor chip 200 is mounted on the flexible printed circuit board 160, but it can also be mounted on an interposer. Here, the interposer is a substrate that includes wiring and terminals and on which a chip such as the double-sided image sensor chip 200 is mounted. The electronic device 100 according to the fourteenth embodiment is different from the first embodiment in that the double-sided image sensor chip 200 is mounted on the interposer by wire bonding.

FIG. 63 is an example of a plan view of an interposer on which the double-sided image sensor chip 200 according to the fourteenth embodiment of the present technology is mounted. The double-sided image sensor chip 200 is mounted on the interposer 400. The interposer 400 is provided with a plurality of terminals 410, and a terminal 290 is provided for each terminal 410 on the double-sided image sensor chip 200 side. Terminal 410 and terminal 290 corresponding to terminal 410 are connected by wire bonding.

FIG. 64 is an example of a cross-sectional view of the interposer 400 on which the double-sided image sensor chip 200 according to the fourteenth embodiment of the present technology is mounted. This figure is a cross-sectional view taken along the line AA ′ of FIG. A wiring 420 is formed in the interposer 400, and one end of the wiring 420 is connected to the terminal 410. A ball 510 is formed on the terminal 410 on the interposer 400 side, and a ball 520 is formed on the terminal 290 on the double-sided image sensor chip 200 side. These balls are electrically connected via a wire 500. Such wire bonding is known to be relatively low cost and highly reliable.

Also, the upper part of the interposer 400 is sealed with glass 180 with the light receiving surface side as the upper side. The diameter of the ball 520 is, for example, 30 micrometers. The height of the step formed with the terminal 290 is, for example, 6 micrometers (μm), and the length of one side of the terminal 290, for example, 50 micrometers (μm).

As described above, according to the fourteenth embodiment of the present technology, since the double-sided image sensor chip 200 is mounted on the interposer 400 by wire bonding, it is possible to realize cost reduction and reliability improvement.

<15. Fifteenth embodiment>
In the fourteenth embodiment described above, the double-sided image sensor chip 200 is mounted on the interposer 400 by wire bonding, but can also be mounted by welding without using a wire. The electronic device 100 of the ninth embodiment differs from the fourteenth embodiment in that the double-sided image sensor chip 200 is mounted on the interposer 400 by welding.

FIG. 65 is an example of a plan view of the interposer 400 on which the double-sided image sensor chip 200 according to the fifteenth embodiment of the present technology is mounted. The interposer 400 according to the ninth embodiment is different from the eighth embodiment in that wiring is connected by welding instead of wire bonding.

FIG. 66 is an example of a cross-sectional view of the interposer 400 on which the double-sided image sensor chip 200 according to the fifteenth embodiment of the present technology is mounted. This figure is a cross-sectional view taken along the line AA ′ of FIG. The wiring 420 of the interposer 400 is electrically connected by welding using a welding alloy 530. As the welding alloy 530, solder, gold (Au), NiAu, or the like is used.

Thus, according to the fifteenth embodiment of the present technology, since the double-sided image sensor chip 200 is connected to the interposer 400 by welding, the double-sided image sensor chip 200 can be mounted without using a wire.

<16. Sixteenth Embodiment>
In the fifteenth embodiment described above, only the wiring 420 is formed in the interposer 400, but a logic circuit such as a driver or a memory can be further provided. The electronic device 100 according to the sixteenth embodiment differs from the first embodiment in that a logic circuit is further provided in the interposer 400.

FIG. 67 is an example of a plan view of the interposer 400 on which the double-sided image sensor chip 200 according to the sixteenth embodiment of the present technology is mounted. The interposer 400 of the sixteenth embodiment differs from the fifteenth embodiment in that a logic circuit 430 is further mounted. As the logic circuit 430, a driver or a memory is assumed.

FIG. 68 is an example of a cross-sectional view of the interposer 400 on which the double-sided image sensor chip 200 according to the sixteenth embodiment of the present technology is mounted. This figure is a cross-sectional view taken along the line AA ′ in FIG. In the interposer 400 in the sixteenth embodiment, a logic circuit 430 is further mounted, and a glass 180 is provided thereon.

FIG. 69 is an example of a plan view and a cross-sectional view of the interposer 400 before mounting the double-sided image sensor chip 200 in the tenth embodiment of the present technology. In the figure, a is an example of a plan view of the interposer 400 before the double-sided image sensor chip 200 is mounted, and b in the figure is an example of a cross-sectional view thereof. As illustrated in the figure, the interposer 400 is formed with a recess for mounting the double-sided image sensor chip 200.

FIG. 70 is an example of a plan view and a cross-sectional view of an interposer 400 on which the double-sided image sensor chip 200 according to the sixteenth embodiment of the present technology is placed. A in the same figure is an example of the top view of the interposer 400 which mounted the double-sided image sensor chip 200, and b in the same figure is an example of the sectional view. As illustrated in the figure, the double-sided image sensor chip 200 is placed in the recess of the interposer 400.

71 is an example of a plan view and a cross-sectional view of an interposer 400 on which a welding alloy 530 according to a sixteenth embodiment of the present technology is formed. A in the same figure is an example of the top view of the interposer 400 which formed the welding alloy 530, and b in the same figure is an example of the sectional drawing. As illustrated in the figure, a welding alloy 530 such as solder is formed at the joint.

72 is an example of a plan view and a cross-sectional view of the interposer 400 joined with the logic circuit 430 according to the sixteenth embodiment of the present technology. A in the figure is an example of a plan view of the interposer 400 to which the logic circuit 430 is joined, and b in the figure is an example of a sectional view thereof. As illustrated in the figure, a logic circuit 430 such as a driver or a memory is further mounted.

FIG. 73 is an example of a plan view and a cross-sectional view of the double-sided image sensor chip 200 and the interposer 400 sealed with the glass 180 in the sixteenth embodiment of the present technology. In the figure, a is an example of a plan view of the double-sided image sensor chip 200 and the interposer 400 sealed with glass 180, and b in the figure is an example of a sectional view thereof. As illustrated in the figure, the glass 180 is sealed, and mounting on the interposer 400 is completed.

Although the logic circuit 430 is provided in the interposer 400 mounted by welding, the logic circuit 430 may be provided in the interposer 400 mounted by wire bonding as in the eighth embodiment.

Thus, according to the sixteenth embodiment of the present technology, since the logic circuit 430 is further mounted on the interposer 400, the cost is reduced as compared with the case where the logic circuit 430 is separately mounted outside the interposer 400. can do.

<Application examples to mobile objects>
The technology according to the present disclosure (present technology) can be applied to various products. For example, the technology according to the present disclosure is realized as a device that is mounted on any type of mobile body such as an automobile, an electric vehicle, a hybrid electric vehicle, a motorcycle, a bicycle, personal mobility, an airplane, a drone, a ship, and a robot. May be.

FIG. 74 is a block diagram illustrating a schematic configuration example of a vehicle control system that is an example of a mobile control system to which the technology according to the present disclosure can be applied.

The vehicle control system 12000 includes a plurality of electronic control units connected via a communication network 12001. In the example shown in FIG. 74, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside information detection unit 12030, an in-vehicle information detection unit 12040, and an integrated control unit 12050. As a functional configuration of the integrated control unit 12050, a microcomputer 12051, an audio image output unit 12052, and an in-vehicle network I / F (interface) 12053 are illustrated.

The drive system control unit 12010 controls the operation of the device related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 includes a driving force generator for generating a driving force of a vehicle such as an internal combustion engine or a driving motor, a driving force transmission mechanism for transmitting the driving force to wheels, and a steering angle of the vehicle. It functions as a control device such as a steering mechanism that adjusts and a braking device that generates a braking force of the vehicle.

The body system control unit 12020 controls the operation of various devices mounted on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a keyless entry system, a smart key system, a power window device, or a control device for various lamps such as a headlamp, a back lamp, a brake lamp, a blinker, or a fog lamp. In this case, the body control unit 12020 can be input with radio waves transmitted from a portable device that substitutes for a key or signals from various switches. The body system control unit 12020 receives input of these radio waves or signals, and controls a door lock device, a power window device, a lamp, and the like of the vehicle.

The vehicle outside information detection unit 12030 detects information outside the vehicle on which the vehicle control system 12000 is mounted. For example, the imaging unit 12031 is connected to the vehicle exterior information detection unit 12030. The vehicle exterior information detection unit 12030 causes the imaging unit 12031 to capture an image outside the vehicle and receives the captured image. The vehicle outside information detection unit 12030 may perform an object detection process or a distance detection process such as a person, a car, an obstacle, a sign, or a character on a road surface based on the received image.

The imaging unit 12031 is an optical sensor that receives light and outputs an electrical signal corresponding to the amount of received light. The imaging unit 12031 can output an electrical signal as an image, or can output it as distance measurement information. Further, the light received by the imaging unit 12031 may be visible light or invisible light such as infrared rays.

The vehicle interior information detection unit 12040 detects vehicle interior information. For example, a driver state detection unit 12041 that detects a driver's state is connected to the in-vehicle information detection unit 12040. The driver state detection unit 12041 includes, for example, a camera that images the driver, and the vehicle interior information detection unit 12040 determines the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 12041. It may be calculated or it may be determined whether the driver is asleep.

The microcomputer 12051 calculates a control target value of the driving force generator, the steering mechanism, or the braking device based on the information inside / outside the vehicle acquired by the vehicle outside information detection unit 12030 or the vehicle interior information detection unit 12040, and the drive system control unit A control command can be output to 12010. For example, the microcomputer 12051 realizes ADAS (Advanced Driver Assistance System) functions including vehicle collision avoidance or impact mitigation, follow-up traveling based on inter-vehicle distance, vehicle speed maintenance traveling, vehicle collision warning, or vehicle lane departure warning. It is possible to perform cooperative control for the purpose.

Further, the microcomputer 12051 controls the driving force generator, the steering mechanism, the braking device, and the like based on the information around the vehicle acquired by the vehicle exterior information detection unit 12030 or the vehicle interior information detection unit 12040. It is possible to perform cooperative control for the purpose of automatic driving that autonomously travels without depending on the operation.

Further, the microcomputer 12051 can output a control command to the body system control unit 12020 based on information outside the vehicle acquired by the vehicle outside information detection unit 12030. For example, the microcomputer 12051 controls the headlamp according to the position of the preceding vehicle or the oncoming vehicle detected by the outside information detection unit 12030, and performs cooperative control for the purpose of anti-glare, such as switching from a high beam to a low beam. It can be carried out.

The sound image output unit 12052 transmits an output signal of at least one of sound and image to an output device capable of visually or audibly notifying information to a vehicle occupant or the outside of the vehicle. In the example of FIG. 74, an audio speaker 12061, a display unit 12062, and an instrument panel 12063 are illustrated as output devices. The display unit 12062 may include at least one of an on-board display and a head-up display, for example.

FIG. 74 is a diagram illustrating an example of the installation position of the imaging unit 12031. In FIG. 75, the imaging unit 12031 includes

imaging units

12101, 12102, 12103, 12104, and 12105.

The

imaging units

12101, 12102, 12103, 12104, and 12105 are provided, for example, at positions such as a front nose, a side mirror, a rear bumper, a back door, and an upper part of a windshield in the vehicle interior of the vehicle 12100. The imaging unit 12101 provided in the front nose and the imaging unit 12105 provided in the upper part of the windshield in the vehicle interior mainly acquire an image in front of the vehicle 12100. The

imaging units

12102 and 12103 provided in the side mirror mainly acquire an image of the side of the vehicle 12100. The imaging unit 12104 provided in the rear bumper or the back door mainly acquires an image behind the vehicle 12100. The imaging unit 12105 provided on the upper part of the windshield in the passenger compartment is mainly used for detecting a preceding vehicle or a pedestrian, an obstacle, a traffic light, a traffic sign, a lane, or the like.

FIG. 75 shows an example of the shooting range of the imaging units 12101 to 12104. The imaging range 12111 indicates the imaging range of the imaging unit 12101 provided in the front nose, the imaging ranges 12112 and 12113 indicate the imaging ranges of the

imaging units

12102 and 12103 provided in the side mirrors, respectively, and the imaging range 12114 The imaging range of the imaging part 12104 provided in the rear bumper or the back door is shown. For example, by superimposing the image data captured by the imaging units 12101 to 12104, an overhead image when the vehicle 12100 is viewed from above is obtained.

At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera including a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

For example, the microcomputer 12051, based on the distance information obtained from the imaging units 12101 to 12104, the distance to each three-dimensional object in the imaging ranges 12111 to 12114 and the temporal change in this distance (relative speed with respect to the vehicle 12100). In particular, it is possible to extract, as a preceding vehicle, a three-dimensional object that travels at a predetermined speed (for example, 0 km / h or more) in the same direction as the vehicle 12100, particularly the closest three-dimensional object on the traveling path of the vehicle 12100. it can. Further, the microcomputer 12051 can set an inter-vehicle distance to be secured in advance before the preceding vehicle, and can perform automatic brake control (including follow-up stop control), automatic acceleration control (including follow-up start control), and the like. Thus, cooperative control for the purpose of autonomous driving or the like autonomously traveling without depending on the operation of the driver can be performed.

For example, the microcomputer 12051 converts the three-dimensional object data related to the three-dimensional object to other three-dimensional objects such as two-wheeled vehicles, ordinary vehicles, large vehicles, pedestrians, and power poles based on the distance information obtained from the imaging units 12101 to 12104. It can be classified and extracted and used for automatic avoidance of obstacles. For example, the microcomputer 12051 identifies obstacles around the vehicle 12100 as obstacles that are visible to the driver of the vehicle 12100 and obstacles that are difficult to see. The microcomputer 12051 determines the collision risk indicating the risk of collision with each obstacle, and when the collision risk is equal to or higher than the set value and there is a possibility of collision, the microcomputer 12051 is connected via the audio speaker 12061 or the display unit 12062. By outputting an alarm to the driver and performing forced deceleration or avoidance steering via the drive system control unit 12010, driving assistance for collision avoidance can be performed.

At least one of the imaging units 12101 to 12104 may be an infrared camera that detects infrared rays. For example, the microcomputer 12051 can recognize a pedestrian by determining whether a pedestrian is present in the captured images of the imaging units 12101 to 12104. Such pedestrian recognition is, for example, whether or not the user is a pedestrian by performing a pattern matching process on a sequence of feature points indicating the outline of an object and a procedure for extracting feature points in captured images of the imaging units 12101 to 12104 as infrared cameras. It is carried out by the procedure for determining. When the microcomputer 12051 determines that there is a pedestrian in the captured images of the imaging units 12101 to 12104 and recognizes the pedestrian, the audio image output unit 12052 has a rectangular contour line for emphasizing the recognized pedestrian. The display unit 12062 is controlled so as to be superimposed and displayed. Moreover, the audio | voice image output part 12052 may control the display part 12062 so that the icon etc. which show a pedestrian may be displayed on a desired position.

Heretofore, an example of a vehicle control system to which the technology according to the present disclosure can be applied has been described. The technology according to the present disclosure can be applied to the imaging unit 12031 among the configurations described above. Specifically, the double-sided image sensor chip 200 in FIG. 1 can be applied to the imaging unit 12031. By applying the technology according to the present disclosure to the imaging unit 12031, the size of the imaging unit 12031 can be reduced.

<4. Application example to endoscopic surgery system>
The technology according to the present disclosure (present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

FIG. 76 is a diagram illustrating an example of a schematic configuration of an endoscopic surgery system to which the technology (present technology) according to the present disclosure can be applied.

FIG. 76 shows a state where an operator (doctor) 11131 is performing surgery on a patient 11132 on a patient bed 11133 using an endoscopic surgery system 11000. As shown in the figure, an endoscopic surgery system 11000 includes an endoscope 11100, other surgical instruments 11110 such as an insufflation tube 11111 and an energy treatment instrument 11112, and a support arm device 11120 that supports the endoscope 11100. And a cart 11200 on which various devices for endoscopic surgery are mounted.

The endoscope 11100 includes a lens barrel 11101 in which a region having a predetermined length from the distal end is inserted into the body cavity of the patient 11132, and a camera head 11102 connected to the proximal end of the lens barrel 11101. In the illustrated example, an endoscope 11100 configured as a so-called rigid mirror having a rigid lens barrel 11101 is illustrated, but the endoscope 11100 may be configured as a so-called flexible mirror having a flexible lens barrel. Good.

An opening into which the objective lens is fitted is provided at the tip of the lens barrel 11101. A light source device 11203 is connected to the endoscope 11100, and light generated by the light source device 11203 is guided to the tip of the lens barrel by a light guide extending inside the lens barrel 11101. Irradiation is performed toward the observation target in the body cavity of the patient 11132 through the lens. Note that the endoscope 11100 may be a direct endoscope, a perspective mirror, or a side endoscope.

An optical system and an image sensor are provided inside the camera head 11102, and reflected light (observation light) from the observation target is condensed on the image sensor by the optical system. Observation light is photoelectrically converted by the imaging element, and an electrical signal corresponding to the observation light, that is, an image signal corresponding to the observation image is generated. The image signal is transmitted to a camera control unit (CCU: Camera Control Unit) 11201 as RAW data.

The CCU 11201 is configured by a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), and the like, and comprehensively controls operations of the endoscope 11100 and the display device 11202. Further, the CCU 11201 receives an image signal from the camera head 11102 and performs various kinds of image processing for displaying an image based on the image signal, such as development processing (demosaic processing), for example.

The display device 11202 displays an image based on an image signal subjected to image processing by the CCU 11201 under the control of the CCU 11201.

The light source device 11203 is composed of a light source such as an LED (Light Emitting Diode), for example, and supplies irradiation light to the endoscope 11100 when photographing a surgical site or the like.

The input device 11204 is an input interface for the endoscopic surgery system 11000. A user can input various information and instructions to the endoscopic surgery system 11000 via the input device 11204. For example, the user inputs an instruction to change the imaging conditions (type of irradiation light, magnification, focal length, etc.) by the endoscope 11100.

The treatment instrument control device 11205 controls the drive of the energy treatment instrument 11112 for tissue ablation, incision, blood vessel sealing, or the like. In order to inflate the body cavity of the patient 11132 for the purpose of securing the field of view by the endoscope 11100 and securing the operator's work space, the pneumoperitoneum device 11206 passes gas into the body cavity via the pneumoperitoneum tube 11111. Send in. The recorder 11207 is an apparatus capable of recording various types of information related to surgery. The printer 11208 is a device that can print various types of information related to surgery in various formats such as text, images, or graphs.

In addition, the light source device 11203 that supplies the irradiation light when the surgical site is imaged to the endoscope 11100 can be configured by, for example, a white light source configured by an LED, a laser light source, or a combination thereof. When a white light source is configured by a combination of RGB laser light sources, the output intensity and output timing of each color (each wavelength) can be controlled with high accuracy. Therefore, the light source device 11203 adjusts the white balance of the captured image. It can be carried out. In this case, laser light from each of the RGB laser light sources is irradiated on the observation target in a time-sharing manner, and the drive of the image sensor of the camera head 11102 is controlled in synchronization with the irradiation timing, thereby corresponding to each RGB. It is also possible to take the images that have been taken in time division. According to this method, a color image can be obtained without providing a color filter in the image sensor.

Further, the driving of the light source device 11203 may be controlled so as to change the intensity of the output light every predetermined time. Synchronously with the timing of changing the intensity of the light, the drive of the image sensor of the camera head 11102 is controlled to acquire an image in a time-sharing manner, and the image is synthesized, so that high dynamic without so-called blackout and overexposure A range image can be generated.

Further, the light source device 11203 may be configured to be able to supply light of a predetermined wavelength band corresponding to special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in body tissue, the surface of the mucous membrane is irradiated by irradiating light in a narrow band compared to irradiation light (ie, white light) during normal observation. A so-called narrow band imaging is performed in which a predetermined tissue such as a blood vessel is imaged with high contrast. Alternatively, in special light observation, fluorescence observation may be performed in which an image is obtained by fluorescence generated by irradiating excitation light. In fluorescence observation, the body tissue is irradiated with excitation light to observe fluorescence from the body tissue (autofluorescence observation), or a reagent such as indocyanine green (ICG) is locally administered to the body tissue and applied to the body tissue. It is possible to obtain a fluorescence image by irradiating excitation light corresponding to the fluorescence wavelength of the reagent. The light source device 11203 can be configured to be able to supply narrowband light and / or excitation light corresponding to such special light observation.

FIG. 77 is a block diagram showing an example of the functional configuration of the camera head 11102 and CCU 11201 shown in FIG.

The camera head 11102 includes a lens unit 11401, an imaging unit 11402, a drive unit 11403, a communication unit 11404, and a camera head control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera head 11102 and the CCU 11201 are connected to each other by a transmission cable 11400 so that they can communicate with each other.

The lens unit 11401 is an optical system provided at a connection portion with the lens barrel 11101. Observation light taken from the tip of the lens barrel 11101 is guided to the camera head 11102 and enters the lens unit 11401. The lens unit 11401 is configured by combining a plurality of lenses including a zoom lens and a focus lens.

The imaging unit 11402 includes an imaging element. One (so-called single plate type) image sensor may be included in the imaging unit 11402, or a plurality (so-called multi-plate type) may be used. In the case where the imaging unit 11402 is configured as a multi-plate type, for example, image signals corresponding to RGB may be generated by each imaging element, and a color image may be obtained by combining them. Alternatively, the imaging unit 11402 may be configured to include a pair of imaging elements for acquiring right-eye and left-eye image signals corresponding to 3D (Dimensional) display. By performing the 3D display, the operator 11131 can more accurately grasp the depth of the living tissue in the surgical site. Note that in the case where the imaging unit 11402 is configured as a multi-plate type, a plurality of lens units 11401 can be provided corresponding to each imaging element.

Further, the imaging unit 11402 is not necessarily provided in the camera head 11102. For example, the imaging unit 11402 may be provided inside the lens barrel 11101 immediately after the objective lens.

The driving unit 11403 is configured by an actuator, and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera head control unit 11405. Thereby, the magnification and the focus of the image captured by the imaging unit 11402 can be adjusted as appropriate.

The communication unit 11404 is configured by a communication device for transmitting and receiving various types of information to and from the CCU 11201. The communication unit 11404 transmits the image signal obtained from the imaging unit 11402 as RAW data to the CCU 11201 via the transmission cable 11400.

Further, the communication unit 11404 receives a control signal for controlling driving of the camera head 11102 from the CCU 11201 and supplies the control signal to the camera head control unit 11405. The control signal includes, for example, information for designating the frame rate of the captured image, information for designating the exposure value at the time of imaging, and / or information for designating the magnification and focus of the captured image. Contains information about the condition.

Note that the imaging conditions such as the frame rate, exposure value, magnification, and focus may be appropriately specified by the user, or may be automatically set by the control unit 11413 of the CCU 11201 based on the acquired image signal. Good. In the latter case, a so-called AE (Auto Exposure) function, AF (Auto Focus) function, and AWB (Auto White Balance) function are mounted on the endoscope 11100.

The camera head control unit 11405 controls driving of the camera head 11102 based on a control signal from the CCU 11201 received via the communication unit 11404.

The communication unit 11411 is configured by a communication device for transmitting and receiving various types of information to and from the camera head 11102. The communication unit 11411 receives an image signal transmitted from the camera head 11102 via the transmission cable 11400.

Further, the communication unit 11411 transmits a control signal for controlling driving of the camera head 11102 to the camera head 11102. The image signal and the control signal can be transmitted by electrical communication, optical communication, or the like.

The image processing unit 11412 performs various types of image processing on the image signal that is RAW data transmitted from the camera head 11102.

The control unit 11413 performs various types of control related to imaging of the surgical site by the endoscope 11100 and display of a captured image obtained by imaging of the surgical site. For example, the control unit 11413 generates a control signal for controlling driving of the camera head 11102.

Further, the control unit 11413 causes the display device 11202 to display a picked-up image showing the surgical part or the like based on the image signal subjected to the image processing by the image processing unit 11412. At this time, the control unit 11413 may recognize various objects in the captured image using various image recognition techniques. For example, the control unit 11413 detects surgical tools such as forceps, specific biological parts, bleeding, mist when using the energy treatment tool 11112, and the like by detecting the shape and color of the edge of the object included in the captured image. Can be recognized. When displaying the captured image on the display device 11202, the control unit 11413 may display various types of surgery support information superimposed on the image of the surgical unit using the recognition result. Surgery support information is displayed in a superimposed manner and presented to the operator 11131, thereby reducing the burden on the operator 11131 and allowing the operator 11131 to proceed with surgery reliably.

The transmission cable 11400 for connecting the camera head 11102 and the CCU 11201 is an electric signal cable corresponding to electric signal communication, an optical fiber corresponding to optical communication, or a composite cable thereof.

Here, in the illustrated example, communication is performed by wire using the transmission cable 11400. However, communication between the camera head 11102 and the CCU 11201 may be performed wirelessly.

In the foregoing, an example of an endoscopic surgery system to which the technology according to the present disclosure can be applied has been described. The technology according to the present disclosure can be applied to the endoscope 11100 and the imaging unit 11402 among the configurations described above. Specifically, the double-sided image sensor chip 200 can be applied to the imaging unit 11402, and the electronic device 102 can be applied to the endoscope 11100. By applying the technology according to the present disclosure, the size of the endoscope 11100 and the imaging unit 11402 can be reduced.

<4. Application example for in-vivo information acquisition system>
The technology according to the present disclosure (present technology) can be applied to various products. For example, the technology according to the present disclosure may be applied to an endoscopic surgery system.

FIG. 78 is a block diagram illustrating an example of a schematic configuration of a patient in-vivo information acquisition system using a capsule endoscope to which the technology (present technology) according to the present disclosure can be applied.

The in-vivo information acquisition system 10001 includes a capsule endoscope 10100 and an external control device 10200.

The capsule endoscope 10100 is swallowed by the patient at the time of examination. The capsule endoscope 10100 has an imaging function and a wireless communication function, and moves inside the organ such as the stomach and the intestine by peristaltic motion or the like until it is spontaneously discharged from the patient. Images (hereinafter also referred to as in-vivo images) are sequentially captured at predetermined intervals, and information about the in-vivo images is sequentially wirelessly transmitted to the external control device 10200 outside the body.

The external control device 10200 comprehensively controls the operation of the in-vivo information acquisition system 10001. Further, the external control device 10200 receives information about the in-vivo image transmitted from the capsule endoscope 10100 and, based on the received information about the in-vivo image, displays the in-vivo image on the display device (not shown). The image data for displaying is generated.

In the in-vivo information acquisition system 10001, an in-vivo image obtained by imaging the inside of the patient's body can be obtained at any time in this manner until the capsule endoscope 10100 is swallowed and discharged.

The configurations and functions of the capsule endoscope 10100 and the external control device 10200 will be described in more detail.

The capsule endoscope 10100 includes a capsule-type casing 10101. In the casing 10101, a light source unit 10111, an imaging unit 10112, an image processing unit 10113, a wireless communication unit 10114, a power supply unit 10115, and a power supply unit 10116 and the control unit 10117 are stored.

The light source unit 10111 is composed of a light source such as an LED (Light Emitting Diode), for example, and irradiates the imaging field of the imaging unit 10112 with light.

The image capturing unit 10112 includes an image sensor and an optical system including a plurality of lenses provided in front of the image sensor. Reflected light (hereinafter referred to as observation light) of light irradiated on the body tissue to be observed is collected by the optical system and enters the image sensor. In the imaging unit 10112, in the imaging element, the observation light incident thereon is photoelectrically converted, and an image signal corresponding to the observation light is generated. The image signal generated by the imaging unit 10112 is provided to the image processing unit 10113.

The image processing unit 10113 is configured by a processor such as a CPU (Central Processing Unit) or a GPU (Graphics Processing Unit), and performs various signal processing on the image signal generated by the imaging unit 10112. The image processing unit 10113 provides the radio communication unit 10114 with the image signal subjected to signal processing as RAW data.

The wireless communication unit 10114 performs predetermined processing such as modulation processing on the image signal that has been subjected to signal processing by the image processing unit 10113, and transmits the image signal to the external control apparatus 10200 via the antenna 10114A. In addition, the wireless communication unit 10114 receives a control signal related to drive control of the capsule endoscope 10100 from the external control device 10200 via the antenna 10114A. The wireless communication unit 10114 provides a control signal received from the external control device 10200 to the control unit 10117.

The power feeding unit 10115 includes a power receiving antenna coil, a power regeneration circuit that regenerates power from a current generated in the antenna coil, a booster circuit, and the like. In the power feeding unit 10115, electric power is generated using a so-called non-contact charging principle.

The power supply unit 10116 is composed of a secondary battery, and stores the electric power generated by the power supply unit 10115. In FIG. 1001, illustration of an arrow indicating a power supply destination from the power supply unit 10116 is omitted to avoid the drawing from being complicated, but the power stored in the power supply unit 10116 is not stored in the light source unit 10111. The imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the control unit 10117 can be used for driving them.

The control unit 10117 includes a processor such as a CPU, and a control signal transmitted from the external control device 10200 to drive the light source unit 10111, the imaging unit 10112, the image processing unit 10113, the wireless communication unit 10114, and the power feeding unit 10115. Control accordingly.

The external control device 10200 is configured by a processor such as a CPU or GPU, or a microcomputer or a control board in which a processor and a storage element such as a memory are mounted. The external control device 10200 controls the operation of the capsule endoscope 10100 by transmitting a control signal to the control unit 10117 of the capsule endoscope 10100 via the antenna 10200A. In the capsule endoscope 10100, for example, the light irradiation condition for the observation target in the light source unit 10111 can be changed by a control signal from the external control device 10200. In addition, an imaging condition (for example, a frame rate or an exposure value in the imaging unit 10112) can be changed by a control signal from the external control device 10200. Further, the contents of processing in the image processing unit 10113 and the conditions (for example, the transmission interval, the number of transmission images, etc.) by which the wireless communication unit 10114 transmits an image signal may be changed by a control signal from the external control device 10200. .

Further, the external control device 10200 performs various image processing on the image signal transmitted from the capsule endoscope 10100, and generates image data for displaying the captured in-vivo image on the display device. As the image processing, for example, development processing (demosaic processing), high image quality processing (band enhancement processing, super-resolution processing, NR (Noise reduction) processing and / or camera shake correction processing, etc.), and / or enlargement processing ( Various signal processing such as electronic zoom processing can be performed. The external control device 10200 controls driving of the display device to display an in-vivo image captured based on the generated image data. Alternatively, the external control device 10200 may cause the generated image data to be recorded on a recording device (not shown) or may be printed out on a printing device (not shown).

Heretofore, an example of the in-vivo information acquisition system to which the technology according to the present disclosure can be applied has been described. The technology according to the present disclosure can be applied to the capsule endoscope 10100 among the configurations described above. Specifically, the electronic apparatus 103 can be applied to a capsule endoscope 10100. By applying the technique according to the present disclosure to the capsule endoscope 10100, the size can be reduced.

The above-described embodiment shows an example for embodying the present technology, and the matters in the embodiment and the invention-specific matters in the claims have a corresponding relationship. Similarly, the invention specific matter in the claims and the matter in the embodiment of the present technology having the same name as this have a corresponding relationship. However, the present technology is not limited to the embodiment, and can be embodied by making various modifications to the embodiment without departing from the gist thereof.

Further, the processing procedure described in the above embodiment may be regarded as a method having a series of these procedures, and a program for causing a computer to execute these series of procedures or a recording medium storing the program. You may catch it. As this recording medium, for example, a CD (Compact Disc), an MD (MiniDisc), a DVD (Digital Versatile Disc), a memory card, a Blu-ray disc (Blu-ray (registered trademark) Disc), or the like can be used.

It should be noted that the effects described in this specification are merely examples, and are not limited, and other effects may be obtained.

In addition, this technique can also take the following structures.
(1) a first sensor chip in which wiring is formed on a first surface and a first photoelectric conversion element is formed on a first back surface with respect to the first surface;
A solid-state imaging device comprising: a second sensor chip in which wiring is formed on a second surface bonded to the first surface, and a second photoelectric conversion element is formed on a second back surface with respect to the first surface.
(2) a protective layer for protecting the first microlens is further formed on the first back surface;
The solid-state imaging device according to claim 1, wherein a second microlens is further formed on the second back surface.
(3) The first sensor chip includes a substrate on which the first photoelectric conversion element is formed and a first wiring layer,
The solid-state imaging device according to (1) or (2), wherein the second sensor chip includes a substrate on which the second photoelectric conversion element is formed and a second wiring layer.
(4) The solid-state imaging device according to (3), wherein the second sensor chip further includes a predetermined support substrate.
(5) The solid-state imaging device according to (3), wherein one of the first wiring layer and the second wiring layer includes a predetermined logic circuit.
(6) One of the first sensor chip and the second sensor chip further includes a logic substrate on which a predetermined logic circuit is formed,
The solid-state imaging device according to (3), wherein the logic substrate is disposed between the first wiring layer and the second wiring layer.
(7) The solid-state imaging device according to (6), further including a through via formed in the logic substrate.
(8) The solid-state imaging device according to (6), further including a through via penetrating from the logic substrate to the inside of the second wiring layer.
(9) The solid-state imaging device according to any one of (1) to (8), wherein another protective layer is further formed on the second back surface.
(10) The wiring is a copper wiring,
The solid-state imaging device according to (1), wherein the copper wirings on the first surface and the second surface are joined by Cu—Cu connection.
(11) The first surface and the second surface include silicon monoxide,
The solid-state imaging device according to (1), wherein the first surface and the second surface are joined by SiO—SiO connection.
(12) The solid-state imaging device according to (1), wherein the first surface and the second surface are bonded with an adhesive.
(13) a first sensor chip in which wiring is formed on a first surface and a first photoelectric conversion element is formed on a first back surface with respect to the first surface;
A second sensor chip in which a wiring is formed on a second surface bonded to the first surface, and a second photoelectric conversion element is formed on a second back surface with respect to the first surface;
A first optical system for guiding light to the first back surface;
An electronic apparatus comprising: a second optical system that guides light to the second back surface.
(14) Each of the first optical system and the second optical system includes:
An object side lens;
The electronic device according to (13), further comprising a lens group that guides light from the object side lens.
(15) Each of the first optical system and the second optical system includes:
An object side lens;
The electronic device according to (13), further including a mirror that bends light from the object side lens.
(16) The electronic device according to (15), wherein each of the first optical system and the second optical system further includes a lens group that guides the bent light.
(17) further comprising an interposer in which wiring is formed;
The electronic device according to (13), wherein the first sensor chip and the second sensor chip are mounted on the interposer.
(18) The electronic device according to (17), wherein the first sensor chip and the second sensor chip are mounted on the interposer by wire bonding.
(19) The electronic device according to (17), wherein the first sensor chip and the second sensor chip are mounted on the interposer by welding.
(20) The electronic device according to (17) or (18), wherein a logic circuit is further formed in the interposer.
(21) further comprising a first optical system and a second optical system;
The electronic device according to (13), wherein the electronic device is an endoscope.
(22) The first optical system is provided on a side surface of the endoscope,
The second optical system includes a first lens whose optical axis is parallel to the axial direction of the endoscope,
The first optical system includes:
A second lens;
The electronic device according to (21), further comprising a mirror that bends light from the second lens.
(23) The electronic device according to (21), wherein the first optical system and the second optical system are provided on a side surface of the endoscope.
(24) Each of the first optical system and the second optical system includes:
A lens,
The electronic device according to (23), further comprising a mirror that bends light from the lens.
(25) The electronic device according to (23), wherein each of the first optical system and the second optical system includes a lens having an optical axis parallel to an axial direction of the endoscope.
(26) A second sensor in which a second photoelectric conversion element is formed on the first back surface of the first sensor chip on which the first photoelectric conversion element is formed on the first back surface with respect to the first surface and on the second back surface with respect to the second surface. A bonding procedure for bonding the second surface of the chip in close contact with each other;
A first microlens formation procedure for forming a first microlens on the first back surface;
A protective layer forming procedure for forming a protective layer on the first back surface on which the first microlens is formed;
A method for manufacturing a solid-state imaging device, comprising: a second microlens formation procedure for forming a second microlens on the second back surface with the protective layer facing down.

100, 102, 103 Electronic device 101

Binocular camera

110, 120 Front lens 121 Rear lens 130

Display unit

141, 151

Mirror

142, 152 Lens group 160 Flexible printed circuit board 170 Cover glass 180 Glass 200 Double-sided image sensor chip 201 Left sensor chip 202 Right Sensor chip 210 Right side back-illuminated

sensor

211, 243

Micro lens

212, 244

Color filter

213, 246

Photodiode

214, 233, 245

Substrate

215, 231, 247

Wiring layer

216, 232, 248 Cu wiring 217, 249 Al-

Cu system Wiring

218, 242 High heat

resistant material

221, 222, 235, 236 Through-via 230 Logic substrate 234 Oxide film 240 Left-side backside illuminated sensor 241 Ga 260 Support substrate 270

Driver

280, 430

Ethics circuit

290, 410

Terminals

310, 311, 367, 370 Lens 312 Chemical solution outlet 313

Outlet

314, 368, 369

Light source

315, 316, 366 Mirror 361 Antenna 362 Receiver 363 Transmitter 364 Storage unit 365 Sample space 400 Interposer 420 Wiring 500

Wire

510, 520 Ball 530 Welding alloy 10100 Capsule endoscope 11100

Endoscope

11402, 12031 Imaging unit

Claims

A first sensor chip in which wiring is formed on a first surface and a first photoelectric conversion element is formed on a first back surface with respect to the first surface;
A solid-state imaging device comprising: a second sensor chip in which wiring is formed on a second surface bonded to the first surface, and a second photoelectric conversion element is formed on a second back surface with respect to the first surface.
A protective layer for protecting the first microlens is further formed on the first back surface;
The solid-state imaging device according to claim 1, wherein a second microlens is further formed on the second back surface.
The first sensor chip includes a substrate on which the first photoelectric conversion element is formed and a first wiring layer,
The solid-state imaging device according to claim 1, wherein the second sensor chip includes a substrate on which the second photoelectric conversion element is formed and a second wiring layer.
The solid-state imaging device according to claim 3, wherein the second sensor chip further includes a predetermined support substrate.
The solid-state imaging device according to claim 3, wherein one of the first wiring layer and the second wiring layer includes a predetermined logic circuit.
One of the first sensor chip and the second sensor chip further includes a logic substrate on which a predetermined logic circuit is formed,
The solid-state imaging device according to claim 3, wherein the logic substrate is disposed between the first wiring layer and the second wiring layer.
The solid-state imaging device according to claim 6, further comprising a through via formed in the logic substrate.
The solid-state imaging device according to claim 6, further comprising a through via penetrating from the logic substrate to the inside of the second wiring layer.
The solid-state imaging device according to claim 1, wherein another protective layer is further formed on the second back surface.
The wiring is a copper wiring;
The solid-state imaging device according to claim 1, wherein the copper wirings on the first surface and the second surface are joined by Cu—Cu connection.
The first surface and the second surface comprise silicon monoxide;
2. The solid-state imaging device according to claim 1, wherein the first surface and the second surface are joined by SiO—SiO connection.
The solid-state imaging device according to claim 1, wherein the first surface and the second surface are bonded with an adhesive.
A first sensor chip in which wiring is formed on a first surface and a first photoelectric conversion element is formed on a first back surface with respect to the first surface;
A second sensor chip in which a wiring is formed on a second surface bonded to the first surface, and a second photoelectric conversion element is formed on a second back surface with respect to the first surface;
A first optical system for guiding light to the first back surface;
An electronic apparatus comprising: a second optical system that guides light to the second back surface.
Each of the first optical system and the second optical system is
An object side lens;
The electronic device according to claim 13, further comprising a lens group that guides light from the object side lens.
Each of the first optical system and the second optical system is
An object side lens;
The electronic device of Claim 13 provided with the mirror which bends the light from the said object side lens.
16. The electronic device according to claim 15, wherein each of the first optical system and the second optical system further includes a lens group that guides the bent light.
It further comprises an interposer in which wiring is formed,
The electronic device according to claim 13, wherein the first sensor chip and the second sensor chip are mounted on the interposer.
The electronic device according to claim 17, wherein the first sensor chip and the second sensor chip are mounted on the interposer by wire bonding.
The electronic device according to claim 17, wherein the first sensor chip and the second sensor chip are mounted on the interposer by welding.
The electronic device of claim 17, further comprising a logic circuit formed in the interposer.
A first optical system and a second optical system;
The electronic device according to claim 13, wherein the electronic device is an endoscope.
The first optical system is provided on a side surface of the endoscope,
The second optical system includes a first lens whose optical axis is parallel to the axial direction of the endoscope,
The first optical system includes:
A second lens;
The electronic device according to claim 21, further comprising a mirror that bends light from the second lens.
The electronic device according to claim 21, wherein the first optical system and the second optical system are provided on a side surface of the endoscope.
Each of the first optical system and the second optical system includes:
A lens,
The electronic device according to claim 23, further comprising a mirror that bends light from the lens.
The electronic device according to claim 23, wherein each of the first optical system and the second optical system includes a lens having an optical axis parallel to an axial direction of the endoscope.
The first sensor chip having the first photoelectric conversion element formed on the first back surface with respect to the first surface and the second sensor chip having the second photoelectric conversion element formed on the second back surface with respect to the second surface. A joining procedure for bringing the second surface into close contact with each other;
A first microlens formation procedure for forming a first microlens on the first back surface;
A protective layer forming procedure for forming a protective layer on the first back surface on which the first microlens is formed;
A method for manufacturing a solid-state imaging device, comprising: a second microlens formation procedure for forming a second microlens on the second back surface with the protective layer facing down.