WO2018133180A1 - Multilayer circuit board protection mechanism - Google Patents

Multilayer circuit board protection mechanism Download PDF

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Publication number
WO2018133180A1
WO2018133180A1 PCT/CN2017/075903 CN2017075903W WO2018133180A1 WO 2018133180 A1 WO2018133180 A1 WO 2018133180A1 CN 2017075903 W CN2017075903 W CN 2017075903W WO 2018133180 A1 WO2018133180 A1 WO 2018133180A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
limiting
cover
opening
disposed
Prior art date
Application number
PCT/CN2017/075903
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French (fr)
Chinese (zh)
Inventor
杜红伟
李科林
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201780009701.3A priority Critical patent/CN108702860A/en
Publication of WO2018133180A1 publication Critical patent/WO2018133180A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to the field of multi-layer circuit boards, and in particular, to a multi-layer circuit board protection mechanism.
  • MBB Mobile Broadband
  • the main and sub-board architecture that is, two-layer circuit board structure
  • the two-layer circuit board is connected by BTB (Board to Board board-to-board) connector
  • BTB Board to Board board-to-board
  • the layer circuit board is easily moved in a direction parallel to the circuit board due to the external action.
  • the BTB connector is easily damaged by the circuit board, thereby causing the product to be powered off or Damage problem.
  • How to limit the relative motion between the boards in the direction parallel to the board becomes a problem that designers need to solve.
  • the present invention provides a multi-layer circuit board protection mechanism capable of limiting relative motion occurring between circuit boards without affecting circuit board layout and radio frequency performance.
  • an embodiment of the present invention provides a multi-layer circuit board protection mechanism, including a first circuit board and a second circuit board, and a connection device disposed between the first circuit board and the second circuit board, the first circuit
  • the first circuit board is disposed adjacent to the second circuit board, and the first circuit board is provided with a first shielding cover, and the second circuit board is provided with a second shielding cover.
  • the first shielding cover and the second shielding cover are located at the first a first opening is formed between the circuit board and the second circuit board, a first opening is defined in the first shielding cover, and a second opening is defined in the second shielding cover, and the connecting device is disposed through the first opening and the second opening, first A limiting structure is disposed between the shielding cover and the second shielding cover, and the limiting structure limits the relative movement of the first shielding cover and the second shielding cover in a direction parallel to the first circuit board.
  • the limiting structure since the limiting structure is disposed between the first shielding cover and the second shielding cover, the limiting structure can limit the first shielding cover and the second shielding cover to be parallel to the first circuit.
  • the limiting structure is disposed between the first shielding cover and the second shielding cover, the first shielding cover and the second shielding cover can reduce the influence of the external environment on the RF performance of the first circuit board and the second circuit board, Therefore, the setting of the limiting structure has less influence on the radio frequency performance of the first circuit board and the second circuit board.
  • the multi-layer circuit board protection mechanism provided by the embodiment of the present invention can limit the relative motion between the shields without affecting the layout of the circuit board and the radio frequency performance, thereby limiting the relationship between the boards. Relative movement occurs, thereby avoiding damage to the connecting devices between the boards (such as the BTB connector) due to excessive movement between the boards.
  • the first shielding cover includes a first cover bottom and a first side plate formed on a peripheral edge of the first cover bottom, the first An opening is formed on the first cover bottom, the first side plate is fixedly connected to the first circuit board;
  • the second shielding cover includes a second cover bottom and a peripheral edge formed on the second cover bottom The second side plate is opened on the second cover bottom, and the second side plate is fixedly connected to the second circuit board.
  • the first shielding cover and the second shielding cover may also be configured as follows: the first shielding cover includes a first cover body, the first cover body is formed with a plurality of mesh holes, and the first cover body is formed with a first cover opening, a rim of the cover is fixedly connected to the first circuit board, the first opening is formed on the first cover; the second cover comprises a second cover, the second cover is formed with a plurality of meshes, and the second cover A second cover is formed on the second cover, and the second cover is fixedly connected to the second circuit board, and the second opening is formed on the second cover.
  • the first shield cover and the second shield cover of the former solution Compared with the structure of the first shield cover and the cover of the second shield cover having a plurality of mesh structures, the first shield cover and the second shield cover of the former solution have higher structural strength and are less prone to deformation, when the limit is When the structure is disposed on the first shield or the second shield, it can have sufficient strength to limit the relative motion between the two
  • the limiting structure in conjunction with the first possible implementation of the first aspect, in a second possible implementation manner of the first aspect, includes a flanged rib disposed on a first opening edge, and the flanged rib fits The utility model is disposed in the second opening.
  • the method of fitting the limit by the flange and the second opening is simple in structure, easy to disassemble and convenient to maintain, and does not need to add other parts, which is beneficial to reduce the cost.
  • the first cover bottom defines a slot
  • the second cover is provided
  • the limiting ribs are disposed in the limiting slot.
  • the limiting structure in conjunction with the first possible implementation of the first aspect, in a fourth possible implementation manner of the first aspect, includes a limiting protrusion disposed on the first cover and opening a limiting hole on the second cover bottom, wherein the limiting protrusion fits through the limiting hole.
  • the limiting hole can limit the movement of the limiting protrusion in a direction parallel to the first circuit board, thereby restricting the relative movement of the first shielding cover and the second shielding cover, thereby limiting the first circuit board and the second circuit. The relative movement of the plates, the connecting device will not be damaged by the relative movement of the first circuit board and the second circuit board.
  • the limiting protrusion is a plurality, and the plurality of the limiting protrusions surround the first The opening is disposed; the plurality of limiting holes are disposed around the second opening, and are in one-to-one correspondence with the plurality of limiting protrusions.
  • the plurality of limiting protrusions are matched with the plurality of limiting holes in one-to-one correspondence, when the first shielding cover and the second shielding cover are parallel
  • the plurality of limiting protrusions are disposed around the first opening, and the plurality of limiting holes are disposed around the second opening, so that the first shielding cover and the second shielding cover can be more accurately restricted, avoiding the first opening and the second opening
  • the inner wall of the opening contacts the connecting device when the first shield and the second shield move relative to each other in a direction parallel to the first circuit board, which is more advantageous for the protection of the connecting device.
  • the rib is formed by bending or stretching.
  • the ribs are made by a process of stretching or bending the material of the first shield itself, which is advantageous in reducing the manufacturing cost.
  • connection between the flange and the first cover is provided with a reinforcing rib.
  • the connection strength between the flange and the first cover bottom can be increased, and the rigidity of the flange can be increased, so that the flange can be greatly reduced in the direction in which the first shield and the second shield are parallel to the first circuit board. Deformation that occurs during exercise.
  • the limiting rib is formed by bending.
  • the limit rib is made by a process of bending the material of the second shield itself, which is advantageous for reducing the manufacturing cost.
  • FIG. 1 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib bending forming);
  • FIG 3 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib bending forming);
  • FIG. 4 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a rib forming process with a rib);
  • FIG. 5 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib forming, with ribs);
  • FIG. 6 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a rib stretch forming);
  • FIG. 7 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib stretch forming);
  • FIG. 8 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (folding ribs folded in half);
  • Figure 9 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism in accordance with an embodiment of the present invention (flap ribs folded in half);
  • FIG. 10 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a limiting protrusion and a limiting hole matching);
  • FIG. 11 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a limiting protrusion, a limiting hole matching);
  • FIG. 12 is a schematic structural view (inter-insertion structure) of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention
  • Figure 13 is a cross-sectional view (inter-insertion structure) of a multi-layer (two-layer) circuit board protection mechanism in accordance with an embodiment of the present invention.
  • an embodiment of the present invention provides a multi-layer circuit board protection mechanism including a first circuit board 1 and a second circuit board 2 and disposed between the first circuit board 1 and the second circuit board 2.
  • the connecting device 3 the first circuit board 1 is adjacent to the second circuit board 2 and arranged in parallel, the first circuit board 1 is covered with a first shielding cover 4, and the second circuit board 2 is covered with a second shielding cover. 5, the first shield 4 and the second shield 5 are located between the first circuit board 1 and the second circuit board 2 and are oppositely disposed.
  • the first shield 4 is provided with a first opening 40, and the second shield 5 is A second opening 50 is defined, and the connecting device 3 is disposed through the first opening 40 and the second opening 50.
  • a limiting structure is disposed between the first shielding cover 4 and the second shielding cover 5.
  • the limiting structure can limit the first shielding cover. 4 and the second shield 5 are relatively moved in a direction parallel to the first circuit board 1.
  • the circuit board may be a PCB (Printed Circuit Board), and the number of layers of the circuit board may be 2, 3, or 4 layers, which is not limited herein.
  • the limiting structure can limit the first shielding cover 4 and the second shielding cover 5 to be parallel. Relatively moving in the direction of the first circuit board 1, so that no additional parts need to be added on the first circuit board 1 and the second circuit board 2 to restrict their relative movement in the direction parallel to the first circuit board 1, thereby reducing the first The influence of the layout of the components on the circuit board 1 and the second circuit board 2; since the limiting structure is disposed between the first shield 4 and the second shield 5, the first shield 4 and the second shield 5 can be reduced The small external influence on the radio frequency performance of the first circuit board 1 and the second circuit board 2, whereby the setting of the limit structure has less influence on the radio frequency performance of the first circuit board 1 and the second circuit board 2.
  • the multi-layer circuit board protection mechanism provided by the embodiment of the present invention can limit the relative motion between the shields without affecting the layout of the circuit board and the radio frequency performance, thereby limiting the relationship between the boards. Relative movement occurs, thereby preventing the connection device 3 (such as the BTB connector) between the boards from being damaged due to excessive movement between the boards.
  • the structure of the first shield 4 and the second shield 5 is not unique.
  • the first shield 4 and the second shield 5 may have the following structure: the first shield 4 includes a first cover, and the first cover a plurality of mesh holes are formed on the body, and a first cover is formed on the first cover, the edge of the first cover is fixedly connected to the first circuit board 1, and the first opening 40 is opened on the first cover;
  • the shielding cover 5 includes a second cover body.
  • the second cover body is formed with a plurality of mesh holes, and the second cover body is formed with a second cover opening.
  • the edge of the second cover opening is fixedly connected with the second circuit board 2, and the second The opening 50 is opened on the second cover.
  • the first shield 4 and the second shield 5 may also have the following structure: the first screen
  • the cover 4 includes a first cover bottom 41 and a first side plate 42 formed on the periphery of the first cover bottom 41.
  • the first opening 40 is formed on the first cover bottom 41, and the first side plate 42 and the first circuit board 1
  • the second shield cover 5 includes a second cover bottom 51 and a second side plate 52 formed on the periphery of the second cover bottom 51.
  • the second opening 50 is opened on the second cover bottom 51, and the second side plate 52 is The second circuit board 2 is fixedly connected.
  • FIG. 2 and FIG. 3 show a limiting structure.
  • the limiting structure includes a flange rib 43 disposed on the edge of the first opening 40, and the flange rib 43 is worn. It is disposed in the second opening 50.
  • the first circuit board 1 and the second circuit board 2 are relatively moved in the direction parallel to the first circuit board 1, and the second opening 50 acts on the movement of the flange ribs 43.
  • the effect of the limitation further limits the relative movement of the first circuit board 1 and the second circuit board 2 in a direction parallel to the first circuit board 1.
  • the connecting device 3 (such as the BTB connector) between the first circuit board 1 and the second circuit board 2 is not damaged by the relative movement of the first circuit board 1 and the second circuit board 2.
  • the method of fitting the limit by the flange rib 43 and the second opening 50 is simple in structure, easy to disassemble and convenient to maintain, and does not need to add other parts, which is beneficial to reduce the cost.
  • the flange rib 43 can be formed by bending, as shown in FIG. 2 and FIG. 3, by cutting the first opening 40, and then bending the edge of the first opening 40, thereby forming the flip shown in FIG. Side ribs 43.
  • the ribs 43 can be folded in half, and the ribs 43 can be strengthened by folding the ribs 43 to reduce the first shield 4 and the second shield. 5 deformation occurring when moving in a direction parallel to the direction of the first circuit board 1.
  • the flange rib 43 may be formed by stretch forming, applying a force to the edge of the first opening 40 using a mold and stretching in the direction of the first shield 4 to form a surrounding first opening. 40 rounded ribs 43 along the edge.
  • the ribs 43 are formed by a process of stretching or bending the material of the first shield 4 itself, which is advantageous in reducing the manufacturing cost.
  • the flanges 43 and the first A rib 44 is provided at the joint of the cover bottom 41.
  • the connection strength between the flanges 43 and the first cover bottom 41 can be increased, and the rigidity of the flanges 43 can be improved, thereby greatly reducing
  • the deformation of the small flange ribs 43 when the first shield 4 and the second shield 5 are relatively moved in the direction parallel to the first circuit board 1 provides better protection for the connecting device 3.
  • the first cover bottom 41 has a limit groove 411
  • the second cover bottom 51 has a limit.
  • the rib 511 and the limiting rib 511 are inserted into the limiting groove 411.
  • the second opening 50 of the first shielding cover 4 and the limiting rib 511 of the second shielding cover 5 are inserted into the limiting slot 411 of the first shielding cover 4 .
  • the limiting structure may further include a limited position slot 411 formed on the first cover bottom 41, and the second cover bottom 51 is disposed
  • the limiting rib 511, the limiting rib 511 is inserted into the limiting slot 411, and is inserted into the limiting slot 411 through the limiting rib 511. This can also limit the first shielding cover 4 and the second shielding cover 5 to be parallel to the first A board 1 is relatively moved in the direction.
  • the limiting rib 511 is formed by bending, that is, the notch is cut on the second cover bottom 51, and then the edge of the notch is biased to be bent into the limiting rib 511 shown in FIG.
  • the stopper 511 is made by a process of bending the material of the second shield 5 itself, which is advantageous in reducing the manufacturing cost.
  • FIG. 10 and FIG. 11 show another limiting structure.
  • the limiting structure includes a limiting protrusion 412 disposed on the first cover bottom 41 and a limiting hole 512 formed on the second cover bottom 51.
  • the limiting protrusion 412 is inserted into the limiting hole 512.
  • the limiting hole 512 can limit the movement of the limiting protrusion 412 in a direction parallel to the first circuit board 1 , thereby restricting the relative movement of the first shielding cover 4 and the second shielding cover 5 , thereby limiting the first circuit.
  • the relative movement of the board 1 and the second circuit board 2, the connecting device 3 is not damaged by the relative movement of the first circuit board 1 and the second circuit board 2.
  • the limiting protrusions 412 are easily deformed.
  • the limiting protrusions 412 are multiple, and multiple limit positions are provided.
  • the protrusions 412 are disposed around the first opening 40.
  • the plurality of limiting holes 512 are disposed around the second opening 50 and are in one-to-one correspondence with the plurality of limiting protrusions 412.
  • the plurality of limiting protrusions 412 are matched with the plurality of limiting holes 512 in one-to-one correspondence.
  • the limiting protrusions The force of the 412 can be greatly reduced, and the deformation occurring is also greatly reduced, thereby facilitating the improvement of the limit effect between the first circuit board 1 and the second circuit board 2; since the connecting device 3 passes through the first opening 40 and The second opening 50 is disposed, and the plurality of limiting protrusions 412 are disposed around the first opening 40, and the plurality of limiting holes 512 are disposed around the second opening 50, so that the first shielding cover 4 and the second shielding cover can be more accurately 5 performing a limit to prevent the inner walls of the first opening 40 and the second opening 50 from coming into contact with the connecting device 3 when the first shield 4 and the second shield 5 are relatively moved in a direction parallel to the first circuit board 1 , and more Conducive to the protection
  • the limiting protrusion 412 is a hollow structure, and the limiting protrusion 412 is formed by stretching, that is, applying a force to the first cover bottom 41 by a mold and stretching in the direction of the second shielding cover 5 , and then stretching into The limiting projection 412 is shown in FIG.
  • the limiting protrusion 412 may be a hollow cylinder or a hollow polygonal convex hull structure, which is not limited herein.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

A multilayer circuit board protection mechanism comprises a first circuit board (1), a second circuit board (2), and a connecting component (3). The first circuit board (1) and the second circuit board (2) are adjacent and are disposed in parallel to each other. A first shielding case (4) is disposed on the first circuit board (1), a second shielding case (5) is disposed on the second circuit board (2). The first shielding case (4) and the second shielding case (5) are located between the first circuit board (1) and the second circuit board (2) and are relatively disposed. An opening (40, 50) is formed in each of the first shielding case (4) and the second shielding case (5), The connecting component (3) is disposed in a manner of penetrating through the openings (40, 50). A limit structure is disposed between the first shielding case (4) and the second shielding case (5), and the limiting structure can limit relative movement of the first shielding case (4) and the second shielding case (5) along a direction parallel to the first circuit board (1).

Description

一种多层电路板保护机构Multilayer circuit board protection mechanism
本申请要求于2017年1月17日提交中国专利局、申请号为201710035790.0、发明名称为“一种电路板固定支架”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese Patent Application, filed on Jan. 17, 2017, filed Jan.
技术领域Technical field
本发明涉及多层电路板技术领域,尤其涉及一种多层电路板保护机构。The present invention relates to the field of multi-layer circuit boards, and in particular, to a multi-layer circuit board protection mechanism.
背景技术Background technique
MBB(Mobile Broadband移动宽带)部分产品采用主副板架构,即两层电路板结构,两层电路板之间通过BTB(Board to Board板对板)连接器连接,在机械可靠性测试时,两层电路板因受到外界的作用很容易在平行于电路板的方向上产生相对运动,当两者运动位移过大时,BTB连接器容易受到电路板的作用而发生损坏,从而造成产品断电或损坏问题。如何限制电路板间在平行于电路板的方向上的相对运动,成为设计者亟待解决的问题。MBB (Mobile Broadband) part of the product uses the main and sub-board architecture, that is, two-layer circuit board structure, the two-layer circuit board is connected by BTB (Board to Board board-to-board) connector, in the mechanical reliability test, two The layer circuit board is easily moved in a direction parallel to the circuit board due to the external action. When the motion displacement of the two layers is too large, the BTB connector is easily damaged by the circuit board, thereby causing the product to be powered off or Damage problem. How to limit the relative motion between the boards in the direction parallel to the board becomes a problem that designers need to solve.
现有的主副板架构中采用以下两种结构设计方案:(1)在两层电路板之间并且在BTB连接器两侧设计螺钉固定;(2)通过大面积胶粘形式把两层电路板可靠粘贴在一起。The following two structural design schemes are adopted in the existing main and sub-board architectures: (1) designing screws between two circuit boards and on both sides of the BTB connector; (2) two-layer circuit by large-area adhesive form The boards are reliably glued together.
虽然以上两种结构设计方案能够在在机械可靠性测试时限制两层电路板间的相对运动,但是,对于第一种结构设计方案,需要增加螺钉螺柱,不但成本较高,同时也会占用较多的电路板空间,这样对电路板的布局影响较大;对于第二种结构设计方案,该方案需要两层电路板之间有大面积的粘贴空间,这样对电路板的射频性能有一定影响,同时也增加了电路板的维护成本。Although the above two structural design schemes can limit the relative motion between the two layers of boards during the mechanical reliability test, for the first structural design, the screw studs need to be added, which is not only costly but also occupies More board space, which has a greater impact on the layout of the board; for the second structure design, the solution requires a large area of bonding space between the two boards, so that the RF performance of the board is certain The impact also increases the maintenance cost of the board.
发明内容Summary of the invention
本发明实施提供一种多层电路板保护机构,能够在不影响电路板布局和射频性能的前提下,限制电路板之间发生的相对运动。The present invention provides a multi-layer circuit board protection mechanism capable of limiting relative motion occurring between circuit boards without affecting circuit board layout and radio frequency performance.
为达到上述目的,本发明的实施例采用如下技术方案:In order to achieve the above object, embodiments of the present invention adopt the following technical solutions:
第一方面,本发明实施例提供了一种多层电路板保护机构,包括第一电路板和第二电路板以及设置于第一电路板和第二电路板之间的连接器件,第一电路板与第二电路板相邻且平行设置,第一电路板上罩设有第一屏蔽罩,第二电路板上罩设有第二屏蔽罩,第一屏蔽罩与第二屏蔽罩位于第一电路板与第二电路板之间且相对设置,第一屏蔽罩上开设有第一开口,第二屏蔽罩上开设有第二开口,连接器件穿过第一开口和第二开口设置,第一屏蔽罩与第二屏蔽罩之间设有限位结构,限位结构可限制第一屏蔽罩和第二屏蔽罩沿平行于第一电路板方向相对运动。In a first aspect, an embodiment of the present invention provides a multi-layer circuit board protection mechanism, including a first circuit board and a second circuit board, and a connection device disposed between the first circuit board and the second circuit board, the first circuit The first circuit board is disposed adjacent to the second circuit board, and the first circuit board is provided with a first shielding cover, and the second circuit board is provided with a second shielding cover. The first shielding cover and the second shielding cover are located at the first a first opening is formed between the circuit board and the second circuit board, a first opening is defined in the first shielding cover, and a second opening is defined in the second shielding cover, and the connecting device is disposed through the first opening and the second opening, first A limiting structure is disposed between the shielding cover and the second shielding cover, and the limiting structure limits the relative movement of the first shielding cover and the second shielding cover in a direction parallel to the first circuit board.
本发明实施例提供的多层电路板保护机构,由于第一屏蔽罩与第二屏蔽罩之间设有限位结构,限位结构可限制第一屏蔽罩和第二屏蔽罩沿平行于第一电路板方向的相对运动,这样在第一电路板和第二电路板上无需增设其它零件来限制它们沿平行于第一电路板方向的相对运动,从而减小了对第一电路板和第二电路板上元器件布局的影 响;由于限位结构是设在第一屏蔽罩与第二屏蔽罩之间,第一屏蔽罩与第二屏蔽罩能够减小外界对第一电路板和第二电路板的射频性能影响,由此,限位结构的设置对第一电路板和第二电路板的射频性能影响较小。因此,相比现有技术,本发明实施例提供的多层电路板保护机构,在不影响电路板布局和射频性能的前提下,能够限制屏蔽罩之间发生相对运动,进而限制电路板之间发生相对运动,从而避免了电路板之间的连接器件(比如BTB连接器)因电路板之间运动幅度过大而受到损坏。According to the multi-layer circuit board protection mechanism provided by the embodiment of the present invention, since the limiting structure is disposed between the first shielding cover and the second shielding cover, the limiting structure can limit the first shielding cover and the second shielding cover to be parallel to the first circuit. The relative movement of the plates in the direction such that no additional parts are required on the first circuit board and the second circuit board to limit their relative movement in a direction parallel to the first circuit board, thereby reducing the first circuit board and the second circuit Shadow of component layout on the board Because the limiting structure is disposed between the first shielding cover and the second shielding cover, the first shielding cover and the second shielding cover can reduce the influence of the external environment on the RF performance of the first circuit board and the second circuit board, Therefore, the setting of the limiting structure has less influence on the radio frequency performance of the first circuit board and the second circuit board. Therefore, compared with the prior art, the multi-layer circuit board protection mechanism provided by the embodiment of the present invention can limit the relative motion between the shields without affecting the layout of the circuit board and the radio frequency performance, thereby limiting the relationship between the boards. Relative movement occurs, thereby avoiding damage to the connecting devices between the boards (such as the BTB connector) due to excessive movement between the boards.
结合第一方面,在第一方面的第一种可能的实现方式中,所述第一屏蔽罩包括第一罩底以及形成于所述第一罩底四周边沿的第一侧板,所述第一开口开设于所述第一罩底上,所述第一侧板与所述第一电路板固定连接;所述第二屏蔽罩包括第二罩底以及形成于所述第二罩底四周边沿的第二侧板,所述第二开口开设于所述第二罩底上,所述第二侧板与所述第二电路板固定连接。In conjunction with the first aspect, in a first possible implementation manner of the first aspect, the first shielding cover includes a first cover bottom and a first side plate formed on a peripheral edge of the first cover bottom, the first An opening is formed on the first cover bottom, the first side plate is fixedly connected to the first circuit board; the second shielding cover includes a second cover bottom and a peripheral edge formed on the second cover bottom The second side plate is opened on the second cover bottom, and the second side plate is fixedly connected to the second circuit board.
第一屏蔽罩和第二屏蔽罩也可以为以下结构:第一屏蔽罩包括第一罩体,第一罩体上形成有多个网孔,第一罩体上形成有第一罩口,第一罩口的边沿与第一电路板固定连接,第一开口开设于第一罩体上;第二屏蔽罩包括第二罩体,第二罩体上形成有多个网孔,第二罩体上形成有第二罩口,第二罩口的边沿与第二电路板固定连接,第二开口开设于第二罩体上。相比第一屏蔽罩和第二屏蔽罩的罩体上具有多个网孔结构的结构,前者方案中第一屏蔽罩和第二屏蔽罩的结构强度更高,不容易发生变形,当限位结构设在第一屏蔽罩或第二屏蔽罩上时,能够具有足够的强度来限制两者之间发生相对运动The first shielding cover and the second shielding cover may also be configured as follows: the first shielding cover includes a first cover body, the first cover body is formed with a plurality of mesh holes, and the first cover body is formed with a first cover opening, a rim of the cover is fixedly connected to the first circuit board, the first opening is formed on the first cover; the second cover comprises a second cover, the second cover is formed with a plurality of meshes, and the second cover A second cover is formed on the second cover, and the second cover is fixedly connected to the second circuit board, and the second opening is formed on the second cover. Compared with the structure of the first shield cover and the cover of the second shield cover having a plurality of mesh structures, the first shield cover and the second shield cover of the former solution have higher structural strength and are less prone to deformation, when the limit is When the structure is disposed on the first shield or the second shield, it can have sufficient strength to limit the relative motion between the two
结合第一方面的第一种可能的实现方式,在第一方面的第二种可能的实现方式中,所述限位结构包括设置于第一开口边沿的翻边筋,所述翻边筋配合穿设于所述第二开口内。通过翻边筋与第二开口配合限位的方法,这样结构简单,容易拆卸方便维护,而且不需要增加其它零件,有利于降低成本。In conjunction with the first possible implementation of the first aspect, in a second possible implementation manner of the first aspect, the limiting structure includes a flanged rib disposed on a first opening edge, and the flanged rib fits The utility model is disposed in the second opening. The method of fitting the limit by the flange and the second opening is simple in structure, easy to disassemble and convenient to maintain, and does not need to add other parts, which is beneficial to reduce the cost.
结合第一方面的第一或第二种可能的实现方式,在第一方面的第三种可能的实现方式中,所述第一罩底上开设有限位槽,所述第二罩底上设有限位筋,所述限位筋配合穿设于所述限位槽内。这样第一屏蔽罩上的翻边筋插入到第二屏蔽罩上的第二开口、第二屏蔽罩上的限位筋插入到第一屏蔽罩上的限位槽中,从而形成互插结构,能够进一步限制第一屏蔽罩与第二屏蔽罩沿平行于第一电路板方向相对运动,进而提高第一电路板与第二电路板之间的限位效果。In conjunction with the first or second possible implementation of the first aspect, in a third possible implementation manner of the first aspect, the first cover bottom defines a slot, and the second cover is provided The limiting ribs are disposed in the limiting slot. Thus, the flange on the first shield is inserted into the second opening of the second shield, and the limiting rib on the second shield is inserted into the limiting slot on the first shield to form an inter-insertion structure. The first shield and the second shield can be further restricted to move in a direction parallel to the first circuit board, thereby improving the limiting effect between the first circuit board and the second circuit board.
结合第一方面的第一种可能的实现方式,在第一方面的第四种可能的实现方式中,所述限位结构包括设置于所述第一罩底上的限位凸起和开设于所述第二罩底上的限位孔,所述限位凸起配合穿设于所述限位孔内。这样限位孔可对限位凸起沿平行于第一电路板方向的运动起到限制作用,从而限制第一屏蔽罩与第二屏蔽罩相对运动,进而限制了第一电路板与第二电路板的相对运动,连接器件就不会因第一电路板与第二电路板的相对运动而受到损坏。In conjunction with the first possible implementation of the first aspect, in a fourth possible implementation manner of the first aspect, the limiting structure includes a limiting protrusion disposed on the first cover and opening a limiting hole on the second cover bottom, wherein the limiting protrusion fits through the limiting hole. The limiting hole can limit the movement of the limiting protrusion in a direction parallel to the first circuit board, thereby restricting the relative movement of the first shielding cover and the second shielding cover, thereby limiting the first circuit board and the second circuit. The relative movement of the plates, the connecting device will not be damaged by the relative movement of the first circuit board and the second circuit board.
结合第一方面的第四种可能的实现方式,在第一方面的第五种可能的实现方式中,所述限位凸起为多个,多个所述限位凸起围绕所述第一开口设置;所述限位孔为多个,多个所述限位孔围绕所述第二开口设置,并与多个所述限位凸起一一对应。通过多个限位凸起与多个限位孔一一对应配合,当第一屏蔽罩和第二屏蔽罩沿平行 于第一电路板方向相对运动时,限位凸起的受力可大大减小,发生的变形也大大减小,从而有利于提高第一电路板与第二电路板之间的限位效果;将多个限位凸起围绕第一开口设置,多个限位孔围绕第二开口设置,这样能够更加准确地对第一屏蔽罩和第二屏蔽罩进行限位,避免第一开口和第二开口的内壁在第一屏蔽罩和第二屏蔽罩沿平行于第一电路板方向相对运动时与连接器件发生接触,更加有利于对连接器件的保护。In conjunction with the fourth possible implementation of the first aspect, in a fifth possible implementation manner of the first aspect, the limiting protrusion is a plurality, and the plurality of the limiting protrusions surround the first The opening is disposed; the plurality of limiting holes are disposed around the second opening, and are in one-to-one correspondence with the plurality of limiting protrusions. The plurality of limiting protrusions are matched with the plurality of limiting holes in one-to-one correspondence, when the first shielding cover and the second shielding cover are parallel When the first circuit board is relatively moved in the direction of the first circuit board, the force of the limiting protrusion can be greatly reduced, and the deformation occurring is also greatly reduced, thereby facilitating the improvement of the limiting effect between the first circuit board and the second circuit board; The plurality of limiting protrusions are disposed around the first opening, and the plurality of limiting holes are disposed around the second opening, so that the first shielding cover and the second shielding cover can be more accurately restricted, avoiding the first opening and the second opening The inner wall of the opening contacts the connecting device when the first shield and the second shield move relative to each other in a direction parallel to the first circuit board, which is more advantageous for the protection of the connecting device.
结合第一方面的第二种可能的实现方式,在第一方面的第六种可能的实现方式中,所述翻边筋通过折弯或拉伸成型。翻边筋通过利用第一屏蔽罩本身的材料拉伸或折弯的工艺制成,有利于降低制作成本。In conjunction with the second possible implementation of the first aspect, in a sixth possible implementation of the first aspect, the rib is formed by bending or stretching. The ribs are made by a process of stretching or bending the material of the first shield itself, which is advantageous in reducing the manufacturing cost.
结合第一方面的第二种可能的实现方式,在第一方面的第七种可能的实现方式中,所述翻边筋与所述第一罩底的连接处设有加强筋。这样可以增加翻边筋与第一罩底的连接强度,能够提高翻边筋的刚度,从而可大大减小翻边筋在第一屏蔽罩与第二屏蔽罩沿平行于第一电路板方向相对运动时发生的变形。In conjunction with the second possible implementation of the first aspect, in a seventh possible implementation of the first aspect, the connection between the flange and the first cover is provided with a reinforcing rib. In this way, the connection strength between the flange and the first cover bottom can be increased, and the rigidity of the flange can be increased, so that the flange can be greatly reduced in the direction in which the first shield and the second shield are parallel to the first circuit board. Deformation that occurs during exercise.
结合第一方面的第三种可能的实现方式,在第一方面的第八种可能的实现方式中,所述限位筋通过折弯成型。限位筋通过利用第二屏蔽罩本身的材料折弯的工艺制成,有利于降低制作成本。In conjunction with the third possible implementation of the first aspect, in an eighth possible implementation of the first aspect, the limiting rib is formed by bending. The limit rib is made by a process of bending the material of the second shield itself, which is advantageous for reducing the manufacturing cost.
附图说明DRAWINGS
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below. Obviously, the drawings in the following description are only It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any creative work.
图1为本发明实施例中的多层(两层)电路板保护机构的结构示意图;1 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention;
图2为本发明实施例中的多层(两层)电路板保护机构的结构示意图(翻边筋折弯成型);2 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib bending forming);
图3为本发明实施例中的多层(两层)电路板保护机构的剖面视图(翻边筋折弯成型);3 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib bending forming);
图4为本发明实施例中的多层(两层)电路板保护机构的结构示意图(翻边筋折弯成型、带加强筋);4 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a rib forming process with a rib);
图5为本发明实施例中的多层(两层)电路板保护机构的剖面视图(翻边筋折弯成型、带加强筋);5 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib forming, with ribs);
图6为本发明实施例中的多层(两层)电路板保护机构的结构示意图(翻边筋拉伸成型);6 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a rib stretch forming);
图7为本发明实施例中的多层(两层)电路板保护机构的剖面视图(翻边筋拉伸成型);7 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (flange rib stretch forming);
图8为本发明实施例中的多层(两层)电路板保护机构的结构示意图(翻边筋对折);8 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (folding ribs folded in half);
图9为本发明实施例中的多层(两层)电路板保护机构的剖面视图(翻边筋对折); Figure 9 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism in accordance with an embodiment of the present invention (flap ribs folded in half);
图10为本发明实施例中的多层(两层)电路板保护机构的结构示意图(限位凸起、限位孔配合);10 is a schematic structural view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a limiting protrusion and a limiting hole matching);
图11为本发明实施例中的多层(两层)电路板保护机构的剖面视图(限位凸起、限位孔配合);11 is a cross-sectional view of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention (a limiting protrusion, a limiting hole matching);
图12为本发明实施例中的多层(两层)电路板保护机构的结构示意图(互插结构);12 is a schematic structural view (inter-insertion structure) of a multi-layer (two-layer) circuit board protection mechanism according to an embodiment of the present invention;
图13为本发明实施例中的多层(两层)电路板保护机构的剖面视图(互插结构)。Figure 13 is a cross-sectional view (inter-insertion structure) of a multi-layer (two-layer) circuit board protection mechanism in accordance with an embodiment of the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述。The technical solutions in the embodiments of the present invention will be clearly and completely described in the following with reference to the accompanying drawings.
参见图1和图2,本发明实施例提供了一种多层电路板保护机构,包括第一电路板1和第二电路板2以及设置于第一电路板1和第二电路板2之间的连接器件3,第一电路板1与第二电路板2相邻且平行设置,第一电路板1上罩设有第一屏蔽罩4,第二电路板2上罩设有第二屏蔽罩5,第一屏蔽罩4与第二屏蔽罩5位于第一电路板1与第二电路板2之间且相对设置,第一屏蔽罩4上开设有第一开口40,第二屏蔽罩5上开设有第二开口50,连接器件3穿过第一开口40和第二开口50设置,第一屏蔽罩4与第二屏蔽罩5之间设有限位结构,限位结构可限制第一屏蔽罩4和第二屏蔽罩5沿平行于第一电路板1方向相对运动。其中,电路板可以是PCB(Printed Circuit Board印刷电路板),电路板的层数可以是2层、3层、4层等,在此不作限定。Referring to FIG. 1 and FIG. 2, an embodiment of the present invention provides a multi-layer circuit board protection mechanism including a first circuit board 1 and a second circuit board 2 and disposed between the first circuit board 1 and the second circuit board 2. The connecting device 3, the first circuit board 1 is adjacent to the second circuit board 2 and arranged in parallel, the first circuit board 1 is covered with a first shielding cover 4, and the second circuit board 2 is covered with a second shielding cover. 5, the first shield 4 and the second shield 5 are located between the first circuit board 1 and the second circuit board 2 and are oppositely disposed. The first shield 4 is provided with a first opening 40, and the second shield 5 is A second opening 50 is defined, and the connecting device 3 is disposed through the first opening 40 and the second opening 50. A limiting structure is disposed between the first shielding cover 4 and the second shielding cover 5. The limiting structure can limit the first shielding cover. 4 and the second shield 5 are relatively moved in a direction parallel to the first circuit board 1. The circuit board may be a PCB (Printed Circuit Board), and the number of layers of the circuit board may be 2, 3, or 4 layers, which is not limited herein.
本发明实施例提供的多层电路板保护机构,由于第一屏蔽罩4与第二屏蔽罩5之间设有限位结构,限位结构可限制第一屏蔽罩4和第二屏蔽罩5沿平行于第一电路板1方向相对运动,这样在第一电路板1和第二电路板2上无需增设其它零件来限制它们沿平行于第一电路板1方向相对运动,从而减小了对第一电路板1和第二电路板2上元器件布局的影响;由于限位结构是设在第一屏蔽罩4与第二屏蔽罩5之间,第一屏蔽罩4与第二屏蔽罩5能够减小外界对第一电路板1和第二电路板2的射频性能影响,由此,限位结构的设置对第一电路板1和第二电路板2的射频性能影响较小。因此,相比现有技术,本发明实施例提供的多层电路板保护机构,在不影响电路板布局和射频性能的前提下,能够限制屏蔽罩之间发生相对运动,进而限制电路板之间发生相对运动,从而避免了电路板之间的连接器件3(比如BTB连接器)因电路板之间运动幅度过大而受到损坏。In the multi-layer circuit board protection mechanism provided by the embodiment of the present invention, since the limiting structure is disposed between the first shielding cover 4 and the second shielding cover 5, the limiting structure can limit the first shielding cover 4 and the second shielding cover 5 to be parallel. Relatively moving in the direction of the first circuit board 1, so that no additional parts need to be added on the first circuit board 1 and the second circuit board 2 to restrict their relative movement in the direction parallel to the first circuit board 1, thereby reducing the first The influence of the layout of the components on the circuit board 1 and the second circuit board 2; since the limiting structure is disposed between the first shield 4 and the second shield 5, the first shield 4 and the second shield 5 can be reduced The small external influence on the radio frequency performance of the first circuit board 1 and the second circuit board 2, whereby the setting of the limit structure has less influence on the radio frequency performance of the first circuit board 1 and the second circuit board 2. Therefore, compared with the prior art, the multi-layer circuit board protection mechanism provided by the embodiment of the present invention can limit the relative motion between the shields without affecting the layout of the circuit board and the radio frequency performance, thereby limiting the relationship between the boards. Relative movement occurs, thereby preventing the connection device 3 (such as the BTB connector) between the boards from being damaged due to excessive movement between the boards.
其中,第一屏蔽罩4和第二屏蔽罩5的结构并不唯一,比如第一屏蔽罩4和第二屏蔽罩5可以为以下结构:第一屏蔽罩4包括第一罩体,第一罩体上形成有多个网孔,第一罩体上形成有第一罩口,第一罩口的边沿与第一电路板1固定连接,第一开口40开设于第一罩体上;第二屏蔽罩5包括第二罩体,第二罩体上形成有多个网孔,第二罩体上形成有第二罩口,第二罩口的边沿与第二电路板2固定连接,第二开口50开设于第二罩体上。The structure of the first shield 4 and the second shield 5 is not unique. For example, the first shield 4 and the second shield 5 may have the following structure: the first shield 4 includes a first cover, and the first cover a plurality of mesh holes are formed on the body, and a first cover is formed on the first cover, the edge of the first cover is fixedly connected to the first circuit board 1, and the first opening 40 is opened on the first cover; The shielding cover 5 includes a second cover body. The second cover body is formed with a plurality of mesh holes, and the second cover body is formed with a second cover opening. The edge of the second cover opening is fixedly connected with the second circuit board 2, and the second The opening 50 is opened on the second cover.
另外,如图2所示,第一屏蔽罩4和第二屏蔽罩5也可以为以下结构:第一屏 蔽罩4包括第一罩底41以及形成于第一罩底41四周边沿的第一侧板42,第一开口40开设于第一罩底41上,第一侧板42与第一电路板1固定连接;第二屏蔽罩5包括第二罩底51以及形成于第二罩底51四周边沿的第二侧板52,第二开口50开设于第二罩底51上,第二侧板52与第二电路板2固定连接。相比第一屏蔽罩4和第二屏蔽罩5的罩体上具有多个网孔结构的结构,图2所示结构,第一屏蔽罩4和第二屏蔽罩5的结构强度更高,不容易发生变形,当限位结构设在第一屏蔽罩4或第二屏蔽罩5上时,能够具有足够的强度来限制两者之间发生相对运动(即沿平行于第一电路板1方向的相对运动)。In addition, as shown in FIG. 2, the first shield 4 and the second shield 5 may also have the following structure: the first screen The cover 4 includes a first cover bottom 41 and a first side plate 42 formed on the periphery of the first cover bottom 41. The first opening 40 is formed on the first cover bottom 41, and the first side plate 42 and the first circuit board 1 The second shield cover 5 includes a second cover bottom 51 and a second side plate 52 formed on the periphery of the second cover bottom 51. The second opening 50 is opened on the second cover bottom 51, and the second side plate 52 is The second circuit board 2 is fixedly connected. Compared with the structure of the first shield cover 4 and the second shield cover 5 having a plurality of mesh structures, the structure shown in FIG. 2 has higher structural strength of the first shield cover 4 and the second shield cover 5, It is easy to be deformed, and when the limiting structure is disposed on the first shield 4 or the second shield 5, it can have sufficient strength to limit the relative movement between the two (ie, in a direction parallel to the first circuit board 1) Relative movement).
进一步地,限位结构并不唯一,图2和图3所示为一种限位结构,具体地,限位结构包括设置于第一开口40边沿的翻边筋43,翻边筋43配合穿设于第二开口50内。当多层电路板在做机械可靠性测试,第一电路板1与第二电路板2沿平行于第一电路板1方向相对运动时,第二开口50会对翻边筋43的运动起到限制的作用,进而限制了第一电路板1与第二电路板2沿平行于第一电路板1方向相对运动。这样第一电路板1与第二电路板2之间的连接器件3(比如BTB连接器)就不会因第一电路板1与第二电路板2的相对运动而受到损坏。通过翻边筋43与第二开口50配合限位的方法,这样结构简单,容易拆卸方便维护,而且不需要增加其它零件,有利于降低成本。Further, the limiting structure is not unique. FIG. 2 and FIG. 3 show a limiting structure. Specifically, the limiting structure includes a flange rib 43 disposed on the edge of the first opening 40, and the flange rib 43 is worn. It is disposed in the second opening 50. When the multilayer circuit board is subjected to the mechanical reliability test, the first circuit board 1 and the second circuit board 2 are relatively moved in the direction parallel to the first circuit board 1, and the second opening 50 acts on the movement of the flange ribs 43. The effect of the limitation further limits the relative movement of the first circuit board 1 and the second circuit board 2 in a direction parallel to the first circuit board 1. Thus, the connecting device 3 (such as the BTB connector) between the first circuit board 1 and the second circuit board 2 is not damaged by the relative movement of the first circuit board 1 and the second circuit board 2. The method of fitting the limit by the flange rib 43 and the second opening 50 is simple in structure, easy to disassemble and convenient to maintain, and does not need to add other parts, which is beneficial to reduce the cost.
其中,翻边筋43可以通过折弯成型,如图2和图3所示,通过对第一开口40进行剪裁,然后对第一开口40的边沿进行折弯,从而形成图2所示的翻边筋43。为了进一步的增强翻边筋43的强度,如图8和图9所示,翻边筋43可以对折,翻边筋43通过对折可以加强强度,能够减小第一屏蔽罩4与第二屏蔽罩5沿平行于第一电路板1方向相对运动时发生的变形。Wherein, the flange rib 43 can be formed by bending, as shown in FIG. 2 and FIG. 3, by cutting the first opening 40, and then bending the edge of the first opening 40, thereby forming the flip shown in FIG. Side ribs 43. In order to further enhance the strength of the ribs 43, as shown in FIG. 8 and FIG. 9, the ribs 43 can be folded in half, and the ribs 43 can be strengthened by folding the ribs 43 to reduce the first shield 4 and the second shield. 5 deformation occurring when moving in a direction parallel to the direction of the first circuit board 1.
另外,如图6和图7所示,翻边筋43可以通过拉伸成型,使用模具向第一开口40的边沿施加作用力并向第一屏蔽罩4方向拉伸,从而形成围绕第一开口40边沿一周的翻边筋43。翻边筋43通过利用第一屏蔽罩4本身的材料拉伸或折弯的工艺制成,有利于降低制作成本。In addition, as shown in FIG. 6 and FIG. 7, the flange rib 43 may be formed by stretch forming, applying a force to the edge of the first opening 40 using a mold and stretching in the direction of the first shield 4 to form a surrounding first opening. 40 rounded ribs 43 along the edge. The ribs 43 are formed by a process of stretching or bending the material of the first shield 4 itself, which is advantageous in reducing the manufacturing cost.
为了减少翻边筋43在第一屏蔽罩4与第二屏蔽罩5沿平行于第一电路板1方向相对运动时发生的变形,如图4和图5所示,翻边筋43与第一罩底41的连接处设有加强筋44。通过在翻边筋43与第一罩底41的连接处设有加强筋44,可以增加翻边筋43与第一罩底41的连接强度,能够提高翻边筋43的刚度,从而可大大减小翻边筋43在第一屏蔽罩4与第二屏蔽罩5沿平行于第一电路板1方向相对运动时发生的变形,对连接器件3起到更好的保护作用。In order to reduce the deformation of the flange ribs 43 when the first shield 4 and the second shield 5 are relatively moved in a direction parallel to the first circuit board 1, as shown in FIGS. 4 and 5, the flanges 43 and the first A rib 44 is provided at the joint of the cover bottom 41. By providing the reinforcing ribs 44 at the joint of the flanges 43 and the first cover bottom 41, the connection strength between the flanges 43 and the first cover bottom 41 can be increased, and the rigidity of the flanges 43 can be improved, thereby greatly reducing The deformation of the small flange ribs 43 when the first shield 4 and the second shield 5 are relatively moved in the direction parallel to the first circuit board 1 provides better protection for the connecting device 3.
为了提高第一电路板1与第二电路板2之间的限位效果,如图12和图13所示,第一罩底41上开设有限位槽411,第二罩底51上设有限位筋511,限位筋511配合穿设于限位槽411内。这样第一屏蔽罩4上的翻边筋43插入到第二屏蔽罩5上的第二开口50、第二屏蔽罩5上的限位筋511插入到第一屏蔽罩4上的限位槽411中,从而形成互插结构,能够进一步限制第一屏蔽罩4与第二屏蔽罩5沿平行于第一电路板1方向相对运动,进而提高第一电路板1与第二电路板2之间的限位效果。另外,限位结构也可以包括第一罩底41上开设有限位槽411,第二罩底51上设有 限位筋511,限位筋511配合穿设于限位槽411内,通过限位筋511插入限位槽411中,这样也能够限制第一屏蔽罩4与第二屏蔽罩5沿平行于第一电路板1方向相对运动。In order to improve the limit effect between the first circuit board 1 and the second circuit board 2, as shown in FIG. 12 and FIG. 13, the first cover bottom 41 has a limit groove 411, and the second cover bottom 51 has a limit. The rib 511 and the limiting rib 511 are inserted into the limiting groove 411. Thus, the second opening 50 of the first shielding cover 4 and the limiting rib 511 of the second shielding cover 5 are inserted into the limiting slot 411 of the first shielding cover 4 . Forming an inter-insertion structure to further restrict the relative movement of the first shield 4 and the second shield 5 in a direction parallel to the first circuit board 1 to improve the relationship between the first circuit board 1 and the second circuit board 2 Limit effect. In addition, the limiting structure may further include a limited position slot 411 formed on the first cover bottom 41, and the second cover bottom 51 is disposed The limiting rib 511, the limiting rib 511 is inserted into the limiting slot 411, and is inserted into the limiting slot 411 through the limiting rib 511. This can also limit the first shielding cover 4 and the second shielding cover 5 to be parallel to the first A board 1 is relatively moved in the direction.
其中,限位筋511通过折弯成型,即在第二罩底51上剪裁处缺口,然后对缺口的边沿施力弯折成图12中所示的限位筋511。限位筋511通过利用第二屏蔽罩5本身的材料折弯的工艺制成,这样有利于降低制作成本。Wherein, the limiting rib 511 is formed by bending, that is, the notch is cut on the second cover bottom 51, and then the edge of the notch is biased to be bent into the limiting rib 511 shown in FIG. The stopper 511 is made by a process of bending the material of the second shield 5 itself, which is advantageous in reducing the manufacturing cost.
图10和图11所示为另一种限位结构,具体地,限位结构包括设置于第一罩底41上的限位凸起412和开设于第二罩底51上的限位孔512,限位凸起412配合穿设于限位孔512内。这样限位孔512可对限位凸起412沿平行于第一电路板1方向的运动起到限制作用,从而限制第一屏蔽罩4与第二屏蔽罩5相对运动,进而限制了第一电路板1与第二电路板2的相对运动,连接器件3就不会因第一电路板1与第二电路板2的相对运动而受到损坏。FIG. 10 and FIG. 11 show another limiting structure. Specifically, the limiting structure includes a limiting protrusion 412 disposed on the first cover bottom 41 and a limiting hole 512 formed on the second cover bottom 51. The limiting protrusion 412 is inserted into the limiting hole 512. Thus, the limiting hole 512 can limit the movement of the limiting protrusion 412 in a direction parallel to the first circuit board 1 , thereby restricting the relative movement of the first shielding cover 4 and the second shielding cover 5 , thereby limiting the first circuit. The relative movement of the board 1 and the second circuit board 2, the connecting device 3 is not damaged by the relative movement of the first circuit board 1 and the second circuit board 2.
在第一屏蔽罩4和第二屏蔽罩5之间,如果限位凸起412、限位孔512为一个,那么当第一屏蔽罩4和第二屏蔽罩5沿平行于第一电路板1方向相对运动时,限位凸起412容易发生变形。为了减小限位凸起412的变形,从而提高第一电路板1与第二电路板2之间的限位效果,如图10所示,限位凸起412为多个,多个限位凸起412围绕第一开口40设置;限位孔512为多个,多个限位孔512围绕第二开口50设置,并与多个限位凸起412一一对应。这样通过多个限位凸起412与多个限位孔512一一对应配合,当第一屏蔽罩4和第二屏蔽罩5沿平行于第一电路板1方向相对运动时,限位凸起412的受力可大大减小,发生的变形也大大减小,从而有利于提高第一电路板1与第二电路板2之间的限位效果;由于连接器件3穿过第一开口40和第二开口50设置,将多个限位凸起412围绕第一开口40设置,多个限位孔512围绕第二开口50设置,这样能够更加准确地对第一屏蔽罩4和第二屏蔽罩5进行限位,避免第一开口40和第二开口50的内壁在第一屏蔽罩4和第二屏蔽罩5沿平行于第一电路板1方向相对运动时与连接器件3发生接触,更加有利于对连接器件3的保护。其中,限位孔512可以是封闭的孔,即限位孔512与第二开口50不相连,另外,限位孔512也可以与第二开口50相连形成开放的孔。Between the first shield 4 and the second shield 5, if the limiting protrusion 412 and the limiting hole 512 are one, when the first shield 4 and the second shield 5 are parallel to the first circuit board 1 When the directions are relatively moved, the limit protrusions 412 are easily deformed. In order to reduce the deformation of the limiting protrusion 412, thereby improving the limiting effect between the first circuit board 1 and the second circuit board 2, as shown in FIG. 10, the limiting protrusions 412 are multiple, and multiple limit positions are provided. The protrusions 412 are disposed around the first opening 40. The plurality of limiting holes 512 are disposed around the second opening 50 and are in one-to-one correspondence with the plurality of limiting protrusions 412. Thus, the plurality of limiting protrusions 412 are matched with the plurality of limiting holes 512 in one-to-one correspondence. When the first shielding cover 4 and the second shielding cover 5 are relatively moved in the direction parallel to the first circuit board 1, the limiting protrusions The force of the 412 can be greatly reduced, and the deformation occurring is also greatly reduced, thereby facilitating the improvement of the limit effect between the first circuit board 1 and the second circuit board 2; since the connecting device 3 passes through the first opening 40 and The second opening 50 is disposed, and the plurality of limiting protrusions 412 are disposed around the first opening 40, and the plurality of limiting holes 512 are disposed around the second opening 50, so that the first shielding cover 4 and the second shielding cover can be more accurately 5 performing a limit to prevent the inner walls of the first opening 40 and the second opening 50 from coming into contact with the connecting device 3 when the first shield 4 and the second shield 5 are relatively moved in a direction parallel to the first circuit board 1 , and more Conducive to the protection of the connecting device 3. The limiting hole 512 can be a closed hole, that is, the limiting hole 512 is not connected to the second opening 50. Alternatively, the limiting hole 512 can also be connected to the second opening 50 to form an open hole.
参见图11,限位凸起412为空心结构,限位凸起412通过拉伸成型,即通过模具对第一罩底41施加作用力并向第二屏蔽罩5方向拉伸,然后拉伸成图11中所示的限位凸起412。其中,限位凸起412可以为空心圆柱,也可以为空心多边形凸包结构,在此不作限定。Referring to FIG. 11 , the limiting protrusion 412 is a hollow structure, and the limiting protrusion 412 is formed by stretching, that is, applying a force to the first cover bottom 41 by a mold and stretching in the direction of the second shielding cover 5 , and then stretching into The limiting projection 412 is shown in FIG. The limiting protrusion 412 may be a hollow cylinder or a hollow polygonal convex hull structure, which is not limited herein.
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本发明的保护范围之内。因此,本发明的保护范围应所述以权利要求的保护范围为准。 The above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention. It should be covered by the scope of the present invention. Therefore, the scope of the invention should be determined by the scope of the claims.

Claims (10)

  1. 一种多层电路板保护机构,包括第一电路板和第二电路板以及设置于所述第一电路板和第二电路板之间的连接器件,所述第一电路板与第二电路板相邻且平行设置,所述第一电路板上罩设有第一屏蔽罩,所述第二电路板上罩设有第二屏蔽罩,所述第一屏蔽罩与第二屏蔽罩位于所述第一电路板与第二电路板之间且相对设置,所述第一屏蔽罩上开设有第一开口,所述第二屏蔽罩上开设有第二开口,所述连接器件穿过所述第一开口和第二开口设置,其特征在于,所述第一屏蔽罩与第二屏蔽罩之间设有限位结构,所述限位结构可限制所述第一屏蔽罩和第二屏蔽罩沿平行于所述第一电路板方向相对运动。A multi-layer circuit board protection mechanism includes a first circuit board and a second circuit board, and a connecting device disposed between the first circuit board and the second circuit board, the first circuit board and the second circuit board Adjacent and parallel, the first circuit board is provided with a first shielding cover, and the second circuit board is provided with a second shielding cover, and the first shielding cover and the second shielding cover are located at the a first opening is formed between the first circuit board and the second circuit board, a first opening is defined in the first shielding cover, and a second opening is defined in the second shielding cover, and the connecting device passes through the first An opening and a second opening are disposed, wherein a limiting structure is disposed between the first shielding cover and the second shielding cover, and the limiting structure limits the first shielding cover and the second shielding cover to be parallel Relatively moving in the direction of the first circuit board.
  2. 根据权利要求1所述的多层电路板保护机构,其特征在于,所述第一屏蔽罩包括第一罩底以及形成于所述第一罩底四周边沿的第一侧板,所述第一开口开设于所述第一罩底上,所述第一侧板与所述第一电路板固定连接;所述第二屏蔽罩包括第二罩底以及形成于所述第二罩底四周边沿的第二侧板,所述第二开口开设于所述第二罩底上,所述第二侧板与所述第二电路板固定连接。The multi-layer circuit board protection mechanism according to claim 1, wherein the first shield cover comprises a first cover bottom and a first side plate formed on a peripheral edge of the first cover bottom, the first Openings are formed on the first cover bottom, the first side plate is fixedly connected to the first circuit board; the second shielding cover includes a second cover bottom and a peripheral edge formed on the fourth cover bottom The second side plate is opened on the second cover bottom, and the second side plate is fixedly connected to the second circuit board.
  3. 根据权利要求2所述的多层电路板保护机构,其特征在于,所述限位结构包括设置于第一开口边沿的翻边筋,所述翻边筋配合穿设于所述第二开口内。The multi-layer circuit board protection mechanism according to claim 2, wherein the limiting structure comprises a flange rib disposed on the edge of the first opening, and the flange is fitted into the second opening .
  4. 根据权利要求2或3所述的多层电路板保护机构,其特征在于,所述第一罩底上开设有限位槽,所述第二罩底上设有限位筋,所述限位筋配合穿设于所述限位槽内。The multi-layer circuit board protection mechanism according to claim 2 or 3, wherein a finite slot is formed on the first cover bottom, and a limiting rib is disposed on the second cover bottom, and the limiting rib is matched The utility model is disposed in the limiting slot.
  5. 根据权利要求2所述的多层电路板保护机构,其特征在于,所述限位结构包括设置于所述第一罩底上的限位凸起和开设于所述第二罩底上的限位孔,所述限位凸起配合穿设于所述限位孔内。The multi-layer circuit board protection mechanism according to claim 2, wherein the limiting structure comprises a limiting protrusion disposed on the first cover bottom and a limit formed on the second cover bottom And a limiting hole, the limiting protrusion is inserted into the limiting hole.
  6. 根据权利要求5所述的多层电路板保护机构,其特征在于,所述限位凸起为多个,多个所述限位凸起围绕所述第一开口设置;所述限位孔为多个,多个所述限位孔围绕所述第二开口设置,并与多个所述限位凸起一一对应。The multi-layer circuit board protection mechanism according to claim 5, wherein the plurality of limiting protrusions are disposed, and the plurality of limiting protrusions are disposed around the first opening; And a plurality of the limiting holes are disposed around the second opening and are in one-to-one correspondence with the plurality of the limiting protrusions.
  7. 根据权利要求3所述的多层电路板保护机构,其特征在于,所述翻边筋通过折弯或拉伸成型。The multilayer circuit board protection mechanism according to claim 3, wherein the flange is formed by bending or stretching.
  8. 根据权利要求3所述的多层电路板保护机构,其特征在于,所述翻边筋与所述第一罩底的连接处设有加强筋。The multi-layer circuit board protection mechanism according to claim 3, wherein a reinforcing rib is provided at a joint of the flange and the first cover.
  9. 根据权利要求4所述的多层电路板保护机构,其特征在于,所述限位筋通过折弯成型。The multi-layer circuit board protection mechanism according to claim 4, wherein the limiting rib is formed by bending.
  10. 根据权利要求5所述的多层电路板保护机构,其特征在于,所述限位凸起为空心结构,所述限位凸起通过拉伸成型。 The multi-layer circuit board protection mechanism according to claim 5, wherein the limiting protrusion is a hollow structure, and the limiting protrusion is formed by stretching.
PCT/CN2017/075903 2017-01-17 2017-03-07 Multilayer circuit board protection mechanism WO2018133180A1 (en)

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