TWI500377B - Elastic conductive structure and electronic device thereof - Google Patents

Description

Elastic conductive structure and electronic device thereof

The present invention relates to an electronic device, and more particularly to an elastic conductive structure of an electronic device.

In general, an electronic device is provided with a plurality of electronic modules or electromagnetic induction elements, and when the electronic device is operated, a certain degree of electromagnetic waves are generated. The shell is mostly made of plastic material, so the electromagnetic waves generated by the operation of the electronic device are easily leaked, thereby interfering with other devices, making it unable to operate normally, and even causing damage to the human body. Therefore, if there is no measure to prevent electromagnetic interference (EMI), it will not only affect the operation of other electronic devices, but also be susceptible to interference from other electronic devices.

At present, the method for preventing electromagnetic wave interference is to strengthen the electrical conduction inside the electronic device by means of metal iron sheet, sprayed conductive paint, electroplating and vacuum sputtering to ensure that the inside of the electronic device housing is a sealed metal body and prevent electromagnetic waves. vent. Wherein, the surface of the casing is treated by spraying conductive paint, electroplating and vacuum sputtering, and the adjacent metal plates are reinforced by a conductive structure, such as an electronic module and an external terminal of the electronic device. (I/O connector), in addition to ensuring the formation of a closed metal space, can form a complete conductive path (which can be conducted to the ground), that is, a circuit that shields electromagnetic waves.

1A and 1B are schematic views of a conductive structure of a conventional electronic device housing. As shown in FIG. 1A, the housing 1 of the electronic device is provided with a plurality of conductive junctions. The structure is made of conductive auxiliary material 11a (Fig. 1A) or metal iron piece 11b (Fig. 1B), and is overlapped with other electronic modules 2 to form a complete conductive path. As shown in FIG. 1A, the housing 1 includes a conductive auxiliary material 11a, a metal foil 12 (or a metal plating layer), and a rubber material 13, wherein the metal foil 12 is fixed to the bottom plate of the housing 1 by adhesive or heat fusion. 14. The conductive auxiliary material 11a is disposed on the metal foil 12 and overlaps the electronic module 2. In addition, as shown in FIG. 1B, the housing 1 includes a metal iron piece 11b, a metal foil 12 (or a metal plating layer), and a rubber 13 disposed in the same manner as the conductive auxiliary material 11a, and the metal iron piece 11b is also disposed on the metal. The sheet 12 is overlapped with the electronic module 2 to form a conductive path (ie, a circuit that shields electromagnetic waves).

As described above, in order to form a complete conductive path, the conventional electronic device must additionally add a conductive structure (such as the conductive auxiliary material 11a, the metal iron piece 11b) to the electronic module 2, and still have to add other materials, such as a metal foil. 12 and compound 13, these materials will increase the assembly time, which will increase the production cost. Therefore, how to design an electronic device can simultaneously have the structure and effect of the conductive structure to achieve electromagnetic waves and avoid electromagnetic waves. Discharge, and at the same time reduce the use of materials and assembly hours, is one of the important topics for designers of electronic devices and their manufacturers.

In view of the above problems, the present invention provides an elastic conductive structure and an electronic device thereof, which simultaneously have the structure and function of a conductive structure, so as to achieve electromagnetic wave conduction, thereby preventing electromagnetic wave leakage from affecting other electronic devices, or being subjected to other electronic modules. Electromagnetic wave effects compared to conventional conductive junctions The structure can reduce the use of the material and the working hours of the assembly.

To achieve the above objective, the present invention provides an elastic conductive structure suitable for use in an electronic device. The electronic device includes a conductive backplane and a plurality of spacers disposed on the conductive backplane. The elastic conductive structure includes a spring arm, a connecting portion and a contact portion. The connecting portion connects the elastic arm and the partition, and the contact portion connects the end of the elastic arm away from the connecting portion. The elastic arm, the connecting portion and the contact portion are integrally formed with a plurality of partition plates and a conductive bottom plate.

In an embodiment of the invention, the contact portion is in contact with an electronic module mounted in the electronic device.

In an embodiment of the invention, the contact portion has a chamfer and a curvature that is bent toward the conductive bottom plate.

In an embodiment of the invention, the connecting portion and the elastic arm have a curved portion designed in a curvature.

In an embodiment of the invention, the thickness of the curved portion is greater than the thickness of the contact portion.

In an embodiment of the invention, the elastic conductive structure further comprises a conductive layer disposed on the surface of the elastic arm and the connecting portion.

To achieve the above objective, the present invention further provides an electronic device including a plurality of electronic modules, a conductive bottom plate, a plurality of partitions, and at least one elastic conductive structure. The separator is disposed on the conductive bottom plate. The elastic conductive structure includes a spring arm, a connecting portion and a contact portion. The connecting portion connects the elastic arm and the partition. The contact portion connects the end of the elastic arm away from the connecting portion to touch at least one of the electronic modules. Wherein, the plurality of separators and the conductive bottom plate are integrally formed with the elastic conductive structure.

As described above, the elastic conductive structure of the present invention and the electronic device thereof form a circuit path of the electromagnetic waveguide through the relative position of the elastic conductive structure and the spacer, and thereby conduct electromagnetic waves to the ground. The elastic conductive structure and the electronic module (or the carrying board with the electronic module) are mounted on the top surface, and the electromagnetic waves generated during the operation of the electronic module can be quickly transmitted to the ground through the circuit path to quickly discharge the electronic mold. The group generates electromagnetic waves to prevent electromagnetic waves from interfering with the effects of other electronic modules or electromagnetic sensing elements in the electronic device. In addition, since a plurality of separators and a conductive substrate are integrally formed with the elastic conductive structure, the use time of the material and assembly time can be reduced.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an elastic conductive structure and an electronic device thereof according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.

FIG. 2 is a schematic diagram of an elastic conductive structure applied to an electronic device according to a preferred embodiment of the present invention. Please refer to FIG. 2 . An elastic conductive structure 30 of the present invention is suitable for an electronic device 3, wherein the electronic device 3 includes a conductive bottom plate 31 and a plurality of partitions 32. The spacer 32 is disposed on the conductive bottom plate 31, and the elastic conductive structure 30 is disposed on one of the spacers 32. In addition, the electronic device 3 can accommodate a plurality of electronic modules 4 (not shown in FIG. 2).

FIG. 3 is an enlarged schematic view of the elastic conductive structure shown in FIG. 2, please refer to FIG. 2 and FIG. 3 at the same time. The elastic conductive structure 30 includes a spring arm 301, a connecting portion 302 and a contact portion 303, and the connecting portion 302 is connected to the elastic arm. 301 and the partition plate 32, the contact portion 303 is connected to one end of the elastic arm 301 away from the connecting portion 302 to touch at least one of the electronic modules 4 (please refer to FIG. 5A first). The plurality of separators 32 and the conductive bottom plate 31 are integrally formed with the elastic conductive structure 30. Preferably, the elastic conductive structure 30 can be disposed on the partition 32 according to the conductive path design of the electronic device 3, or the electronic conductive device 30 can be disposed in a plurality of components, and the elastic conductive structure 30 can also be disposed on the components. Where, effective electrical contact can be formed between different components. Since the elastic conductive structure 30 is integrally disposed on the partition 32, many materials and assembly man-hours can be saved compared with the conventional conductive structure.

In addition, the partition 32 provided with the elastic conductive structure 30 and the other partitions 32 are not closed. In other words, between the partition 32 having the elastic conductive structure 30 and the other partitions 32, there must be an opening 33 as a passage for the electromagnetic waveguide. .

4 is a side view of the elastic conductive structure shown in FIG. 2, please refer to FIG. 4 and FIG. 2 or FIG. 3 at the same time. The elastic conductive structure 30 has a conductive layer 304 disposed on the surface of the elastic arm 301 and the connecting portion 302. In practical applications, the electronic device 3 can use an integrated structure such as, but not limited to, spraying, plating, and vacuum sputtering, using, but not limited to, injection molding. The conductive substrate 31, the spacer 32 and the elastic conductive structure 30 are all electrically conductive, and the elastic arm 301 and the surface of the connecting portion 302 of the elastic conductive structure 30 have a conductive layer 304. Conduct electromagnetic waves, conduct electromagnetic waves to the ground, and form a complete conductive path to prevent electromagnetic wave interference.

FIG. 5A is a schematic diagram of the elastic conductive structure and the top contact arrangement of the electronic module shown in FIG. 2, which is shown in FIG. 5A. The electronic device 3 further has a plurality of electronic modules 4, and the contact portion 303 of the conductive structure 30 touches an electronic module 4 mounted in the electronic device. Preferably, the housing 3 further includes a carrier plate 34 for carrying the electronic module 4, and has a hollow portion 341 corresponding to the position of the electronic module 4, so that the contact portion 303 of the elastic conductive structure 30 can be directly touched. Set/lap to the electronic module 4. In addition, as shown in FIG. 5B , FIG. 5B is a schematic diagram of another embodiment of the elastic conductive structure and the top contact arrangement of the electronic module shown in FIG. 2 , and the elastic conductive structure 33 can be directly mounted/lapped on the top. Carrier plate 34a. The electronic module 4 is also disposed on the carrier plate 34a, but the elastic conductive structure 30 is overlapped with the carrier plate 34a instead of the electronic module 4. In this embodiment, the carrier plate 34a may be a metal member, or the surface thereof is plated with The conductive material, the invention is not limited thereto, and only needs to be in electrical contact with the elastic conductive structure 30.

In general, the circuit path of the electromagnetic waveguide can be designed by the position of the elastic conductive structure 30, the spacer 32 and the opening 33, thereby conducting electromagnetic waves to the ground. When the elastic conductive structure 30 is overlapped with the electronic module 4 or the carrier boards 34 and 34a, the electromagnetic waves generated during the operation of the electronic module 4 can be quickly transmitted to the ground through the circuit path, and the electronic module can be quickly discharged. 4 electromagnetic waves generated to prevent electromagnetic waves from interfering with the effectiveness of other electronic modules or electromagnetic sensing elements in the electronic device. In addition, if the electronic device 3 is assembled by a plurality of components, the elastic conductive structure 30 can also be applied to the joint between the components to form a complete metal space inside the casing 3 to prevent electromagnetic waves from leaking and avoid electromagnetic waves. Other electronic devices or electronics Damage to the user of the device.

Referring to FIG. 4, the connecting portion 302 of the elastic conductive structure 30 and the elastic arm 301 have a bent portion 305, thereby forming a spring arm 301 extending horizontally (relative to the conductive bottom plate) and extending upward, and away from the connection. One end of the portion 302 is a contact portion 303, the contact portion 303 has a chamfer 306, and the chamfer 306 has a curvature that is bent downward (ie, toward the conductive bottom plate), and the curvature is designed to increase the chamfer compared to the horizontal shape. The strength of 306. Preferably, the thickness W2 of the curved portion 305 is greater than the thickness W1 of the contact portion 303, wherein the thickness W1 of the contact portion 303 is thinner to ensure the elasticity of the elastic conductive structure 30, and the thickness W2 of the curved portion 305 is thicker, and The overall strength of the elastic conductive structure 30 is reinforced.

Moreover, since the curved portion 305 of the elastic conductive structure 30 and the chamfer 306 of the contact portion 303 are designed in an arc shape, the overall shape of the elastic conductive structure 30 is a smooth streamline shape without an acute angle structure, so that when the electromagnetic wave is conducted, the elastic conductive The structure 30 can produce less electric resistance than the conventional metal iron piece having an acute angle, and has high conductivity and enhances the effect of preventing electromagnetic interference.

In addition, the curvature is designed such that the chamfer 306 is in linear contact with the electronic module 4 or the carrier plate 34, and has a linear contact surface A (as shown in FIG. 4B) instead of being contacted in a planar manner. It can improve the continuity of electromagnetic waves. The conventional metal iron piece is in contact with the electronic module in a planar manner, but microscopically, the contact surface of the two is not a flat plane, but a plane of cracking, and the design of the plane is more likely to be due to the angle design. The circumstance of the chamfer 306 of the present invention is not only a horizontal angle, but can not be solved. Effective electrical contact problems.

In addition, it should be particularly noted that the length L of the elastic arm 301 is not limited by the present invention, and only needs to be overlapped with the electronic module 4 or the carrier plates 34, 34a (as shown in FIGS. 5A and 5B). Of course, the length L is more The elasticity of the elastic arm 301 is also good, so that the elastic conductive structure 30 is easier to assemble with the electronic module 4 or the carrier plates 34, 34a, so that it can be adjusted according to the needs of the design and manufacture of the electronic device 3. However, in order to secure the elasticity of the elastic arm 301, its length L is preferably equal to or greater than 6 mm.

The invention further provides an electronic device comprising a plurality of electronic modules, a conductive bottom plate, a plurality of partitions and at least one elastic conductive structure. The separator is disposed on the conductive bottom plate. The elastic conductive structure includes a spring arm, a connecting portion and a contact portion. The connecting portion connects the elastic arm and the partition. The contact portion is formed to extend from one end of the elastic arm away from the connecting portion to touch at least one of the electronic modules. The electronic device disclosed in the present invention may be corresponding to the housing of the electronic device of the foregoing embodiment, and specific component structures and features may be referred to the foregoing, and details are not described herein.

In summary, the elastic conductive structure and the electronic device thereof of the present invention form a circuit path of the electromagnetic waveguide through the relative position of the elastic conductive structure and the spacer, and thereby conduct electromagnetic waves to the ground. The elastic conductive structure and the electronic module (or the carrying board with the electronic module) are mounted on the top surface, and the electromagnetic waves generated during the operation of the electronic module can be quickly transmitted to the ground through the circuit path to quickly discharge the electronic mold. The group generates electromagnetic waves to prevent electromagnetic waves from interfering with the effects of other electronic modules or electromagnetic sensing elements in the electronic device. In addition, due to a plurality of separators and a conductive substrate and an elastic conductive structure Body molding, which can reduce the use of materials and assembly time.

Compared with the conventional use of metal iron sheets or conductive auxiliary materials, the curved portion and the contact portion of the elastic conductive structure of the present invention may have a chamfered arc design, so that the overall shape of the elastic conductive structure is smooth and streamlined without acute angles. The structure makes the elastic conductive structure capable of generating less electric resistance, high conductivity, and enhancing the effect of preventing electromagnetic interference when the electromagnetic wave is transmitted compared with the conventional metal iron piece or the conductive auxiliary material having an acute angle. In addition, the arc design allows the chamfer to be in linear contact with the electronic module, rather than in a planar manner, which also improves the continuity of electromagnetic waves.

The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.

1‧‧‧shell

11a‧‧‧Electrical accessories

11b‧‧‧metal iron

12‧‧‧Sheet

13‧‧‧Material

14‧‧‧floor

2, 4‧‧‧ electronic module

3‧‧‧Electronic devices

30‧‧‧Elastic conductive structure

301‧‧‧Bounce arm

302‧‧‧Connecting Department

303‧‧‧Contacts

304‧‧‧ Conductive layer

305‧‧‧Bend

306‧‧‧Chamfering

31‧‧‧ Conductive bottom plate

32‧‧‧Baffle

33‧‧‧ openings

34, 34a‧‧‧ carrying board

341‧‧‧ Hollow

A‧‧‧ contact surface

L‧‧‧ length

W1, W2‧‧‧ thickness

1A and 1B are schematic views showing a conductive structure of a conventional electronic device housing; FIG. 2 is a schematic view showing an elastic conductive structure applied to an electronic device according to a preferred embodiment of the present invention; and FIG. 3 is an elastic conductive device shown in FIG. FIG. 4 is a side view of the elastic conductive structure shown in FIG. 2; FIG. 5A is a schematic view of the elastic conductive structure shown in FIG. 2 and the top contact arrangement of the electronic module; and FIG. 5B is a schematic view of FIG. A schematic diagram of another embodiment of the elastic conductive structure and the top mounting of the electronic module.

3‧‧‧Electronic devices

30‧‧‧Elastic conductive structure

301‧‧‧Bounce arm

302‧‧‧Connecting Department

31‧‧‧ Conductive bottom plate

32‧‧‧Baffle

33‧‧‧ openings

Claims (10)

An elastic conductive structure, which is suitable for an electronic device, the electronic device includes a plurality of electronic modules, a conductive bottom plate and a plurality of partitions disposed on the conductive bottom plate, the elastic conductive structure comprising: a spring arm; a connecting portion, Connecting the elastic arm and the partition; and a contact portion connecting the end of the elastic arm away from the connecting portion to touch at least one of the electronic modules, wherein the elastic arm, the connecting portion, the contact portion Forming integrally with the plurality of separators and the conductive substrate. The elastic conductive structure of claim 1, wherein the contact portion has a chamfer and a curvature that is bent toward the conductive bottom plate. The elastic conductive structure of claim 2, wherein the connecting portion and the elastic arm have a curved portion designed in a curvature. The elastic conductive structure of claim 3, wherein the thickness of the bent portion is greater than the thickness of the contact portion. The elastic conductive structure according to claim 1, further comprising a conductive layer disposed on the surface of the elastic arm and the connecting portion. An electronic device comprising: a plurality of electronic modules; a conductive substrate; a plurality of spacers disposed on the conductive substrate; and at least one elastic conductive structure, the elastic conductive structure comprising: a spring arm; a connecting portion connecting the elastic arm and the partition; and a contact portion connecting the end of the elastic arm away from the connecting portion to touch at least one of the electronic modules, wherein the plurality of electronic modules The separator and the conductive substrate are integrally formed with the elastic conductive structure. The electronic device of claim 6, wherein the contact portion has a chamfer and a curvature that is bent toward the conductive substrate. The electronic device of claim 7, wherein the connecting portion and the elastic arm have a curved portion designed in a curved shape. The electronic device of claim 8, wherein the thickness of the curved portion is greater than the thickness of the contact portion. The electronic device of claim 6, wherein the elastic conductive structure further comprises a conductive layer disposed on a surface of the elastic arm and the connecting portion.