WO2018129148A1 - Détachement et refixation d'un détecteur de rayons x à base de polyimide flexible - Google Patents

Détachement et refixation d'un détecteur de rayons x à base de polyimide flexible Download PDF

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Publication number
WO2018129148A1
WO2018129148A1 PCT/US2018/012332 US2018012332W WO2018129148A1 WO 2018129148 A1 WO2018129148 A1 WO 2018129148A1 US 2018012332 W US2018012332 W US 2018012332W WO 2018129148 A1 WO2018129148 A1 WO 2018129148A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
image sensor
adhesive
sensor array
flexible
Prior art date
Application number
PCT/US2018/012332
Other languages
English (en)
Inventor
Timothy J. Wojcik
Ravi K. MRUTHYUNJAYA
Bradley S. Jadrich
Original Assignee
Carestream Health, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carestream Health, Inc. filed Critical Carestream Health, Inc.
Priority to US16/468,441 priority Critical patent/US11195874B2/en
Priority to EP18701946.8A priority patent/EP3566248B1/fr
Priority to CN201880006057.9A priority patent/CN110121780B/zh
Publication of WO2018129148A1 publication Critical patent/WO2018129148A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
    • H01L27/14661—X-ray, gamma-ray or corpuscular radiation imagers of the hybrid type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
    • H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20184—Detector read-out circuitry, e.g. for clearing of traps, compensating for traps or compensating for direct hits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20188—Auxiliary details, e.g. casings or cooling
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20188—Auxiliary details, e.g. casings or cooling
    • G01T1/2019—Shielding against direct hits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469—Assemblies, i.e. hybrid integration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/36—Devices specially adapted for detecting X-ray radiation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Measurement Of Radiation (AREA)
  • Apparatus For Radiation Diagnosis (AREA)

Abstract

L'invention concerne un réseau de capteurs d'images formé sur un premier substrat flexible est supporté par un second substrat flexible fixé à celui-ci. Le second substrat a une surface supérieure avec un adhésif sur celle-ci pour fixer les substrats ensemble. L'adhésif se trouve sur une partie du second substrat directement sous le réseau de capteurs d'images pour permettre la formation sélective du second substrat.
PCT/US2018/012332 2017-01-06 2018-01-04 Détachement et refixation d'un détecteur de rayons x à base de polyimide flexible WO2018129148A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US16/468,441 US11195874B2 (en) 2017-01-06 2018-01-04 Detach and reattach of a flexible polyimide based X-ray detector
EP18701946.8A EP3566248B1 (fr) 2017-01-06 2018-01-04 Détachement et refixation d'un détecteur de rayons x à base de polyimide flexible
CN201880006057.9A CN110121780B (zh) 2017-01-06 2018-01-04 基于柔性聚酰亚胺的x射线检测器的分离和再附接

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762443023P 2017-01-06 2017-01-06
US62/443,023 2017-01-06

Publications (1)

Publication Number Publication Date
WO2018129148A1 true WO2018129148A1 (fr) 2018-07-12

Family

ID=61074529

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2018/012332 WO2018129148A1 (fr) 2017-01-06 2018-01-04 Détachement et refixation d'un détecteur de rayons x à base de polyimide flexible

Country Status (4)

Country Link
US (1) US11195874B2 (fr)
EP (1) EP3566248B1 (fr)
CN (1) CN110121780B (fr)
WO (1) WO2018129148A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109887941A (zh) * 2019-02-20 2019-06-14 上海奕瑞光电子科技股份有限公司 柔性x射线探测器
EP3968057A1 (fr) * 2020-09-11 2022-03-16 InnoCare Optoelectronics Corporation Dispositif à rayons x

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102466811B1 (ko) * 2017-12-12 2022-11-11 엘지디스플레이 주식회사 플렉서블 디지털 엑스레이 검출기용 패널 및 그 제조 방법
CN114902079A (zh) * 2019-12-27 2022-08-12 富士胶片株式会社 放射线图像摄影装置的制造方法
CN115176177A (zh) 2020-03-05 2022-10-11 富士胶片株式会社 放射线检测器、放射线图像摄影装置及放射线检测器的制造方法
CN112820748B (zh) * 2020-12-31 2024-03-15 上海奕瑞光电子科技股份有限公司 柔性x射线探测器的制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099652A1 (fr) * 2011-12-27 2013-07-04 富士フイルム株式会社 Grille pour radiographie, son procédé de fabrication et système de radiographie
US20150060676A1 (en) * 2013-08-29 2015-03-05 General Electric Company Organic x-ray detector assembly and method of manufacturing same
US20160204164A1 (en) * 2015-01-14 2016-07-14 General Electric Company Flexible x-ray detector and methods for fabricating the same
US20160260765A1 (en) * 2008-12-02 2016-09-08 Arizona Board of Regents, a body Corporate of the State of Arizona, Acting for and on Behalf of Ariz Dual active layer semiconductor device and method of manufacturing the same

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
TWI419091B (zh) * 2009-02-10 2013-12-11 Ind Tech Res Inst 可轉移的可撓式電子裝置結構及可撓式電子裝置的製造方法
US8808483B2 (en) * 2010-11-05 2014-08-19 Apple Inc. Method of making a curved touch panel
JP2013050364A (ja) * 2011-08-30 2013-03-14 Fujifilm Corp 放射線画像検出装置
KR101909803B1 (ko) * 2014-05-24 2018-10-18 가부시키가이샤 가네카 알콕시실란 변성 폴리아미드산 용액, 그것을 사용한 적층체 및 플렉시블 디바이스, 및 폴리이미드 필름 및 적층체의 제조 방법
US9773853B2 (en) * 2015-01-09 2017-09-26 Apple Inc. Organic light-emitting diode display with bent substrate
US9614168B2 (en) * 2015-01-12 2017-04-04 Apple Inc. Flexible display panel with bent substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160260765A1 (en) * 2008-12-02 2016-09-08 Arizona Board of Regents, a body Corporate of the State of Arizona, Acting for and on Behalf of Ariz Dual active layer semiconductor device and method of manufacturing the same
WO2013099652A1 (fr) * 2011-12-27 2013-07-04 富士フイルム株式会社 Grille pour radiographie, son procédé de fabrication et système de radiographie
US20150060676A1 (en) * 2013-08-29 2015-03-05 General Electric Company Organic x-ray detector assembly and method of manufacturing same
US20160204164A1 (en) * 2015-01-14 2016-07-14 General Electric Company Flexible x-ray detector and methods for fabricating the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109887941A (zh) * 2019-02-20 2019-06-14 上海奕瑞光电子科技股份有限公司 柔性x射线探测器
EP3968057A1 (fr) * 2020-09-11 2022-03-16 InnoCare Optoelectronics Corporation Dispositif à rayons x
US11675094B2 (en) 2020-09-11 2023-06-13 Innocare Optoelectronics Corporation X-ray device

Also Published As

Publication number Publication date
US11195874B2 (en) 2021-12-07
CN110121780B (zh) 2023-04-18
EP3566248A1 (fr) 2019-11-13
US20190333961A1 (en) 2019-10-31
CN110121780A (zh) 2019-08-13
EP3566248B1 (fr) 2021-09-22

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