WO2018120951A1

WO2018120951A1 - Circuit board stack layer method and system

Info

Publication number: WO2018120951A1
Application number: PCT/CN2017/104182
Authority: WO
Inventors: 吴渝锋; 蒋俏俏; 卢贤文; 易利军
Original assignee: 广州兴森快捷电路科技有限公司; 深圳市兴森快捷电路科技股份有限公司; 宜兴硅谷电子科技有限公司
Priority date: 2016-12-30
Filing date: 2017-09-29
Publication date: 2018-07-05
Also published as: CN106604576A; CN106604576B

Abstract

Disclosed are a circuit board stack layer method and system, and the method comprises the following steps: storing thickness information corresponding to a copper foil layer model, thickness information corresponding to a board layer model and thickness information corresponding to a prepreg layer model (S101); acquiring circuit board layer number information and material model information of a circuit board file (S102); generating a stack layer frame according to the circuit board layer number information (S103); filtering and selecting from the material model information several first material model combinations satisfying a processing capability (S104); obtaining thickness information of the stack layer frame according to the thickness information corresponding to each material model in the first material model combinations (S105); and filtering and selecting from the first material model combinations second material model combinations having a thickness satisfying a default value and corresponding to the stack layer frame (S106). The method can be used to determine that each layer of material of a stack frame satisfies a processing capability requirement and increase the production efficiency and the product passing rate. In addition, the thickness of the stack frame can satisfy a customer thickness requirement for a circuit board product, thus ensuring the quality passing rate of the circuit board product.

Description

Circuit board stacking method and system

Technical field

The present invention relates to the field of circuit board manufacturing technology, and in particular, to a circuit board stacking method and system.

Background technique

The traditional circuit board stacking method is based on the thickness of the circuit board and the number of circuit boards, and is manually selected by manual experience and the material type required by the customer, and manually laminated. However, the circuit board stack which relies on the manual manual operation design may not meet the manufacturer's production process capability, and the personnel ability needs to be trained accordingly, which is easy to cause the production efficiency of the circuit board and the product qualification rate to be low.

Summary of the invention

Based on this, the present invention overcomes the deficiencies of the prior art and provides a method and system for laminating circuit boards, which can make the circuit board stack meet the production process capability, and the production efficiency and the product qualification rate are high.

The technical solution is as follows: a method for laminating a circuit board, comprising the steps of: storing thickness information corresponding to the model of the copper foil layer, thickness information corresponding to the model of the layer of the sheet layer, and thickness information corresponding to the type of the prepreg layer; acquiring the line in the circuit board file The number of layers and the material model information, wherein the material model comprises a copper foil layer model, a sheet layer model and a prepreg layer model; a laminated frame is generated according to the number of layers of the circuit board; and the material model information is selected a plurality of first material model combinations satisfying the process capability; obtaining thickness information of the laminated frame according to thickness information corresponding to each material model in the first material model combination, and filtering out the first material model combination A plurality of second material model combinations corresponding to the laminated frame having a thickness satisfying a preset value.

In the above method for stacking circuit boards, after obtaining the number of layers of the circuit board and the material model information in the circuit board file, the laminated frame can be established according to the number of layers of the circuit board. The laminate frame includes a sheet layer and a prepreg layer or a copper foil layer, a prepreg layer and a sheet layer to which thickness information is to be determined. Will be full The first material type combination of the foot process capability is selected, so that it can be determined that the materials of each layer of the laminated frame meet the process capability requirements, and the production efficiency and the product qualification rate can be improved. In addition, since the thickness information corresponding to the copper foil layer model, the thickness information corresponding to the plate layer model, and the thickness information corresponding to the prepreg layer model are stored, a plurality of second material model combinations may be selected from the first material model combination to make the second The thickness information of the laminated frame corresponding to the material type combination satisfies the preset value, so that the thickness of the laminated frame can satisfy the thickness requirement of the customer for the circuit board product, thereby ensuring the quality qualification rate of the circuit board product.

In one embodiment, before the step of acquiring the circuit board layer information and the material model information in the circuit board file, the method further comprises the steps of: storing cost information corresponding to the copper foil layer model, cost information corresponding to the plate layer model, and prepreg Cost information corresponding to the layer model; after the step of combining the second material model combination corresponding to the laminated frame whose thickness meets the preset value, the step of including the cost corresponding to the material model in the second material model combination The information calculates cost information of the second material combination, and selects a combination of the lowest cost material type in the second material model combination; and the lowest cost material in combination of the laminated frame and the second material model Model combinations are formed in the file. Since the cost information corresponding to the copper foil layer model, the cost information corresponding to the plate layer model, and the cost information corresponding to the prepreg layer model are stored, the cost of the laminated frame corresponding to the second material model combination can be calculated, and the cost can be calculated. The lowest material type combination is screened out, so that the selected material type combination can be used as the production material of the circuit board, and the production cost can be greatly reduced.

In one embodiment, after the step of acquiring the board layer number information and the material type information in the board file, the step of: generating an order number corresponding to the board file; and the second material type The lowest cost material type combination screening step in the combination includes the step of combining the order number, the lowest cost material model combination of the laminate frame and the second material model combination in a file. Staff can directly use the file of the laminated frame with order number, thickness information and material combination information.

In one embodiment, after the step of acquiring the board layer number information and the material type information in the board file, the step of: generating an order number corresponding to the board file; and the second material type The combination of the lowest cost material type combination in the combination Step: storing the lowest cost material model combination among the laminated frame and the second material model combination and the order number. Different line board files can be distinguished by order number and are convenient for staff to find.

In one embodiment, the circuit board stacking method further comprises the steps of: obtaining drilling structure information in the circuit board file, whether the material layer is high frequency board information, and whether laser drilling information is used; The structural information, whether the sheet layer is high frequency board information, and whether laser drilling information is used to determine the first material type combination constituting the laminated frame.

In one embodiment, if the drilling structure is a continuous adjacent copper foil layer, a through hole is provided, the plate layer is a high frequency plate, and the through hole is obtained by non-laser drilling, and the first material is The model combination is a sheet layer and a prepreg; otherwise, the first material model is combined into a sheet layer, a prepreg and a copper foil layer.

A circuit board lamination system includes: a storage module, wherein the storage module is configured to store thickness information corresponding to a copper foil layer model, thickness information corresponding to a plate layer model, and thickness information corresponding to a prepreg layer model; The obtaining module is configured to obtain the circuit board layer information and the material model information in the circuit board file; the laminated frame generating module, wherein the laminated frame generating module is configured to generate the laminated frame according to the circuit board layer number information; a screening module, wherein the first screening module is configured to filter, from the material model, a plurality of first material model combinations satisfying process capability; a laminated frame thickness calculation module, wherein the laminated frame thickness calculation module is configured to The thickness information corresponding to each material model in the first material model combination obtains the thickness information of the laminated frame; the second screening module, the second screening module is configured to filter the thickness from the first material model combination to meet the preset value. The laminated frame corresponds to a plurality of second material model combinations.

In the above-mentioned circuit board lamination system, after the acquisition module acquires the circuit board layer information and the material model information in the circuit board file, the lamination frame generation module can establish the lamination frame according to the circuit board layer number information. The laminate frame includes a sheet layer and a prepreg layer or a copper foil layer, a prepreg layer and a sheet layer to which thickness information is to be determined. The first screening module selects the first material model combination that satisfies the process capability, so that the material of each layer of the laminated frame can be determined to meet the process capability requirements, and the production efficiency and the product qualification rate can be improved. In addition, since the storage module stores the thickness information corresponding to the copper foil layer model, the thickness information corresponding to the plate layer model, and the thickness information corresponding to the prepreg layer model, the second screening mode The block selects a plurality of second material model combinations from the first material model combination, so that the thickness information of the laminated frame corresponding to the second material model combination satisfies a preset value, so that the thickness of the laminated frame can satisfy the customer to the circuit board product. The thickness requirements ensure the quality of the board product.

In one embodiment, the circuit board stacking system further includes: a laminated frame cost calculation module, wherein the laminated frame cost calculation module is configured to use cost information corresponding to a material type in the second material type combination Calculating the cost information of the second material combination, wherein the storage module is further configured to store cost information corresponding to the model of the copper foil layer, cost information corresponding to the model of the sheet layer layer, and cost information corresponding to the type of the prepreg layer; a module, the third screening module is configured to filter out a combination of the lowest cost material types in the second material model combination; a file generation module, wherein the file generation module is configured to record the laminated frame and the second The lowest cost combination of material types in the material model combination.

In one embodiment, the circuit board stacking system further includes an order number generating module, the order number generating module is configured to generate an order number corresponding to the circuit board file; the storage module is further used to The lowest cost material model combination of the laminated frame, the second material model combination, and the order number are stored.

In one embodiment, the circuit board stacking system further includes an order number generating module, the order number generating module is configured to generate an order number corresponding to the circuit board file; and the file generating module is further configured to record The order number, the laminated frame and the second material type combination are the lowest cost material types combined.

DRAWINGS

1 is a flow chart of a method for laminating a circuit board according to an embodiment;

2 is a flow chart of a method for laminating a circuit board according to another embodiment;

Figure 3 is a structural view of a circuit board lamination system of an embodiment;

Fig. 4 is a structural diagram of a circuit board lamination system of another embodiment.

Description of the reference signs:

10, storage module, 20, acquisition module, 30, laminated frame generation module, 40, first screening module, 50, laminated frame thickness calculation module, 60, second screening module, 70, laminated frame cost Calculation module, 80, third screening module, 90, file generation module, 100, order number generation module.

detailed description

The embodiments of the present invention are described in detail below:

As shown in FIG. 1 , FIG. 1 is a flowchart of a method for laminating a circuit board according to an embodiment of the present invention; the method for laminating a circuit board according to an embodiment of the present invention includes the following steps:

Step S101: storing thickness information corresponding to the model of the copper foil layer, thickness information corresponding to the model of the sheet layer layer, and thickness information corresponding to the type of the prepreg layer; in step S101, different types of copper foil layers of different manufacturers are different, and different types of copper foil layers are used. Different thicknesses; different manufacturers' plate layers have different models, different types of plate layers have different thicknesses; different manufacturers have different types of prepreg layers, and different types of prepreg layers have different thicknesses.

Step S102: Obtain information on the number of layers of the circuit board and the material model information in the circuit board file, wherein the material model includes a copper foil layer model, a plate layer model, and a prepreg layer model;

Step S103, generating a laminated frame according to the number of layers of the circuit board; if the number of circuit board layers obtained in step S102 is four, the generated laminated frame corresponds to four copper foil layers and three prepreg layers.

Step S104, selecting a plurality of first material model combinations satisfying the process capability from the material model information; and in step S104, mainly from different types of copper foil layers, different types of prepreg layers and different layer types of plates A copper foil layer, a prepreg layer and a sheet layer are respectively selected and combined in the layer, so that a plurality of material model combinations are formed, and then the first material satisfying the manufacturer's process capability is combined among the plurality of material types. The model combination is screened out.

Step S105, obtaining thickness information of the laminated frame according to thickness information corresponding to each material type in the first material type combination; when the material type of the laminated layer in the laminated frame is determined, the stacking may be performed according to the material model The laminate thickness of the layer frame is calculated.

Step S106: Select, from the first material model combination, a plurality of second material model combinations corresponding to the laminated frame whose thickness meets a preset value. The laminated frame thickness information is screened by step S106 such that the thickness of the laminated frame satisfies the customer's demand for the thickness value of the circuit board product.

The above method for stacking circuit boards, when obtaining the number of layers of the circuit board in the circuit board file and the material After the model information is obtained, the laminated frame can be created based on the number of layers of the board. The laminate frame includes a sheet layer and a prepreg layer or a copper foil layer, a prepreg layer and a sheet layer to which thickness information is to be determined. The first material type combination that satisfies the process capability is selected, so that the material of each layer of the laminated frame can be determined to meet the process capability requirements, and the production efficiency and the product qualification rate can be improved. In addition, since the thickness information corresponding to the copper foil layer model, the thickness information corresponding to the plate layer model, and the thickness information corresponding to the prepreg layer model are stored, a plurality of second material model combinations may be selected from the first material model combination to make the second The thickness information of the laminated frame corresponding to the material type combination satisfies the preset value, so that the thickness of the laminated frame can satisfy the thickness requirement of the customer for the circuit board product, thereby ensuring the quality qualification rate of the circuit board product.

As shown in FIG. 2, FIG. 2 is a flowchart of a method for laminating a circuit board according to another embodiment, and the method for laminating the circuit board includes the following steps:

Step S201, storing thickness information corresponding to the model of the copper foil layer, thickness information corresponding to the model of the sheet layer layer, and thickness information corresponding to the type of the prepreg layer;

Step S202: storing cost information corresponding to the model of the copper foil layer, cost information corresponding to the model of the sheet layer layer, and cost information corresponding to the type of the prepreg layer; in step S202, the cost of different types of copper foil layers is different; the cost of different types of sheet layers Different; the cost of different types of prepreg layers is different.

In this embodiment, the order of step S201 and step S202 can be interchanged.

Step S203, obtaining information about the number of layers of the circuit board and the material model information in the circuit board file, wherein the material model includes a copper foil layer model, a plate layer model, and a prepreg layer model;

Step S204, obtaining drilling structure information in the circuit board file, whether the material layer is high frequency board information, and whether laser drilling information is used;

In this embodiment, the order of step S203 and step S204 may be interchanged.

Step S205, generating a laminated frame according to the number of layers of the circuit board;

Step S206, determining, according to the drilling structure information, whether the sheet layer is high frequency board information, and whether laser drilling information is used to determine a first material type combination constituting the laminated frame;

In this embodiment, the order of step S205 and step S206 can be interchanged.

Wherein, if the drilling structure is a continuous adjacent copper foil layer, a through hole is provided, the plate layer is a high frequency plate, and the through hole is obtained by non-laser drilling, and the first material type is combined into a plate layer. And half The sheet is cured; otherwise, the first material model is combined into a sheet layer, a prepreg layer and a copper foil layer.

Step S207, selecting a plurality of first material model combinations satisfying the process capability from the material model information;

Step S208, obtaining thickness information of the laminated frame according to thickness information corresponding to each material model in the first material model combination;

Step S209: Screening, from the first material model combination, a plurality of second material model combinations corresponding to the laminated frame whose thickness meets a preset value.

Step S210: Calculate cost information of the second material combination according to cost information corresponding to a material model in the second material model combination;

Step S211, selecting a combination of the lowest cost material types in the second material model combination;

Step S212, combining the lowest cost material model combination of the laminated frame and the second material model combination in a file. Since the cost information corresponding to the copper foil layer model, the cost information corresponding to the plate layer model, and the cost information corresponding to the prepreg layer model are stored, the cost of the laminated frame corresponding to the second material model combination can be calculated, and the cost can be calculated. The lowest material type combination is screened out, so that the selected material type combination can be used as the production material of the circuit board, and the production cost can be greatly reduced.

In one embodiment, after the step of acquiring the board layer number information and the material type information in the board file, the step of: generating an order number corresponding to the board file; and the second material type The lowest cost material type combination screening step in the combination includes the steps of: forming the combination of the order number, the laminated frame and the second material type combination with the lowest cost material type in the file, the file may be a format such as document, Excel or text; storing the lowest cost material model combination of the laminated frame, the second material model combination, and the order number. Different board documents are distinguished by order number and are convenient for staff to find. And the staff can directly use the file of the laminated frame with the order number and the information of the thickness information and material combination.

Referring to FIG. 3, FIG. 3 is a structural diagram of a circuit board lamination system according to an embodiment. The circuit board lamination system includes: a storage module 10, an acquisition module 20, a lamination frame generation module 30, and a first The screening module 40, the laminated frame thickness calculating module 50 and the second screening module 60.

The storage module 10 is configured to store thickness information corresponding to the model of the copper foil layer, thickness information corresponding to the model of the sheet layer layer, and thickness information corresponding to the type of the prepreg layer. The obtaining module 20 is configured to obtain information about the number of layers of the circuit board and the material model information in the circuit board file. The laminated frame generating module 30 is configured to generate a laminated frame according to the number of layers of the circuit board. The first screening module 40 is configured to screen a plurality of first material model combinations that meet the process capability from the material model. The laminated frame thickness calculating module 50 is configured to obtain thickness information of the laminated frame according to thickness information corresponding to each material type in the first material type combination. The second screening module 60 is configured to filter, from the first material model combination, a plurality of second material model combinations corresponding to the laminated frame whose thickness meets a preset value.

In the above-mentioned circuit board lamination system, after the acquisition module 20 acquires the circuit board layer number information and the material model information in the circuit board file, the lamination frame generation module 30 can establish the lamination frame according to the circuit board layer number information. The laminate frame includes a sheet layer and a prepreg layer or a copper foil layer, a prepreg layer and a sheet layer to which thickness information is to be determined. The first screening module 40 selects the first material model combination that satisfies the process capability, so that the material of each layer of the laminated frame can be determined to meet the process capability requirements, and the production efficiency and the product qualification rate can be improved. In addition, since the storage module 10 stores the thickness information corresponding to the copper foil layer model, the thickness information corresponding to the plate layer model, and the thickness information corresponding to the prepreg layer model, the second screening module 60 selects a plurality of seconds from the first material model combination. The material type combination makes the thickness information of the laminated frame corresponding to the second material type combination meet the preset value, so that the thickness of the laminated frame can satisfy the thickness requirement of the customer for the circuit board product, thereby ensuring the quality qualification rate of the circuit board product. .

Referring to FIG. 4, FIG. 4 is a structural diagram of a circuit board lamination system according to another embodiment. The circuit board lamination system further includes a lamination frame cost calculation module 70, a third screening module 80, and file generation. Module 90. The stacked frame cost calculation module 70 is configured to calculate cost information of the second material combination according to cost information corresponding to a material model in the second material model combination. The storage module 10 is further configured to store cost information corresponding to the model of the copper foil layer, cost information corresponding to the model of the sheet layer layer, and cost information corresponding to the model of the prepreg layer. The third screening module 80 is configured to filter the combination of the lowest cost material types in the second material model combination. The file generating module 90 is configured to record the lowest cost material model group in the combination of the laminated frame and the second material model Hehe.

The circuit board stacking system further includes an order number generation module 100. The order number generation module 100 is configured to generate an order number corresponding to the circuit board file. The storage module 10 is further configured to store the lowest cost material model combination of the laminated frame and the second material model combination and the order number. The file generating module 90 is further configured to record the order number, the lowest cost material model combination among the laminated frame and the second material model combination.

The technical features of the above-described embodiments may be arbitrarily combined. For the sake of brevity of description, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be considered as the scope of this manual.

The above-described embodiments are merely illustrative of several embodiments of the present invention, and the description thereof is more specific and detailed, but is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

A circuit board stacking method, comprising the steps of:

The thickness information corresponding to the model of the copper foil layer, the thickness information corresponding to the model of the sheet layer layer, and the thickness information corresponding to the type of the prepreg layer;

Obtaining information on the number of layers of the circuit board and the material model information in the circuit board file, wherein the material model includes a copper foil layer model, a sheet layer model, and a prepreg layer model;

Generating a laminated frame according to the number of layers of the circuit board;

Extracting a plurality of first material model combinations satisfying the process capability from the material model information;

Obtaining thickness information of the laminated frame according to thickness information corresponding to each material type in the first material type combination, and screening, according to the first material type combination, a corresponding thickness of the laminated frame that meets a preset value Several second material model combinations.
The circuit board stacking method according to claim 1, further comprising the step of: storing the cost information corresponding to the copper foil layer model before the step of acquiring the circuit board layer number information and the material type information in the circuit board file The cost information corresponding to the model of the sheet layer and the cost information corresponding to the type of the prepreg layer;

After the step of combining the corresponding second material model combination of the laminated frame whose thickness meets the preset value, the method includes the step of: calculating the second according to the cost information corresponding to the material model in the second material model combination The cost information of the material combination is selected by combining the lowest cost material type in the second material model combination;

Combining the laminated frame with the lowest cost material type of the second material model combination is formed in a document.
The circuit board stacking method according to claim 2, wherein the step of acquiring the circuit board layer number information and the material type information in the circuit board file comprises the steps of:

Generating an order number corresponding to the circuit board file;

After the step of screening the combination of the lowest cost material type in the second material model combination, the steps are included:

The lowest cost of combining the order number, the laminated frame and the second material model Material type combinations are formed in the document.
The method of laminating a wiring board according to claim 2, wherein

After the step of obtaining the circuit board layer information and the material model information in the circuit board file, the step of: generating an order number corresponding to the circuit board file;

After the step of screening the combination of the lowest cost material type in the second material model combination, the steps are included:

The lowest cost material model combination of the laminated frame, the second material model combination, and the order number are stored.
The method of laminating a circuit board according to claim 1, further comprising the steps of:

Obtain drilling structure information in the circuit board file, whether the material layer is high frequency board information, and whether laser drilling information is used;

A first material type combination constituting the laminated frame is determined based on the drilling structure information, whether the sheet layer is high frequency board information, and whether laser drilling information is used.
The method of laminating a circuit board according to claim 5, wherein if the drilling structure is a continuous adjacent copper foil layer, a through hole is provided, and the plate layer is a high frequency plate, and the through hole is used. If the non-laser drilling is obtained, the first material type is combined into a sheet layer and a prepreg layer; otherwise, the first material type is combined into a sheet layer, a prepreg layer and a copper foil layer.
A circuit board stacking system, comprising:

a storage module, wherein the storage module is configured to store thickness information corresponding to the copper foil layer model, thickness information corresponding to the plate layer model, and thickness information corresponding to the prepreg layer model;

Obtaining a module, where the obtaining module is configured to obtain information about the number of layers of the circuit board and the material model information in the circuit board file;

a laminated frame generating module, wherein the laminated frame generating module is configured to generate a laminated frame according to the number of layers of the circuit board;

a first screening module, wherein the first screening module is configured to filter, from the material model, a plurality of first material model combinations that meet process capability;

a laminated frame thickness calculating module, wherein the laminated frame thickness calculating module is configured to obtain thickness information of the laminated frame according to thickness information corresponding to each material type in the first material type combination;

And a second screening module, wherein the second screening module is configured to filter, from the first material model combination, a plurality of second material model combinations corresponding to the laminated frame whose thickness meets a preset value.
The circuit board stacking system according to claim 7, further comprising:

a laminated frame cost calculation module, configured to calculate cost information of the second material combination according to cost information corresponding to a material model in the second material type combination, wherein the storage The module is further configured to store cost information corresponding to the model of the copper foil layer, cost information corresponding to the model of the sheet layer layer, and cost information corresponding to the model of the prepreg layer;

a third screening module, wherein the third screening module is configured to filter out a combination of the lowest cost materials in the second material model combination;

a file generating module, wherein the file generating module is configured to record a combination of the lowest cost material type in the combination of the laminated frame and the second material model.
The circuit board stacking system according to claim 8, further comprising an order number generating module, wherein the order number generating module is configured to generate an order number corresponding to the circuit board file; The lowest cost material model combination and the order number are stored in the laminated frame and the second material model combination.
A circuit board stacking system according to claim 8, further comprising an order number generating module, wherein said order number generating module is configured to generate an order number corresponding to said circuit board file; said file generating module further It is used to record the combination of the order number, the lowest cost material type combination of the laminated frame and the second material model combination.