WO2018111306A1 - Procédé de protection d'un dispositif électronique par dépôt sélectif de revêtements polymères - Google Patents

Procédé de protection d'un dispositif électronique par dépôt sélectif de revêtements polymères Download PDF

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Publication number
WO2018111306A1
WO2018111306A1 PCT/US2016/067257 US2016067257W WO2018111306A1 WO 2018111306 A1 WO2018111306 A1 WO 2018111306A1 US 2016067257 W US2016067257 W US 2016067257W WO 2018111306 A1 WO2018111306 A1 WO 2018111306A1
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WO
WIPO (PCT)
Prior art keywords
isoprene rubber
isobutylene isoprene
connector
charge
polymer
Prior art date
Application number
PCT/US2016/067257
Other languages
English (en)
Inventor
Syed Taymur Ahmad
Bruce ACTON
Original Assignee
Syed Taymur Ahmad
Acton Bruce
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Syed Taymur Ahmad, Acton Bruce filed Critical Syed Taymur Ahmad
Priority to PCT/US2016/067257 priority Critical patent/WO2018111306A1/fr
Publication of WO2018111306A1 publication Critical patent/WO2018111306A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Definitions

  • the present disclosure generally relates to methods of protecting electronic devices, such as a cell phone or computer, by applying an electrically insulating polymer to certain device components, and a polymer capable of conducting a charge to different device components.
  • the present disclosure also relates to methods of rendering an electronic device hydrophobic by applying these different materials to different components on the printed circuit board of the device.
  • the present disclosure further relates to devices protected by such polymeric coatings, including any device containing a printed circuit board.
  • Electronic devices are comprised of electrically conductive and insulating components, which can be adversely affected by a variety of
  • the disclosed method generally comprises treating, in any order, the backside and front side of the printed circuit board.
  • treating the backside of the circuit board comprises: applying an electrically insulating material to the surface of at least one component located on the backside of the circuit board.
  • the components that can be treated with the insulating polymer include at least one component and/or connector chosen from a printed circuit board, such as a flexible printed circuit connector, an LCD, a battery connector, a speaker connector, a camera connector, a light connector, and combinations thereof.
  • the method next comprises curing the insulating material, followed by applying a polymer capable of conducting a charge to at least one different component than the component containing the insulating polymer.
  • a polymer capable of conducting a charge includes at least one component and/or connector chosen from a power switch, a volume switch, RAM Chips, ROM Chips, USB charging port, MEMS, Microphone, SIM card housings, headphone jack, and combinations thereof.
  • the method of treating the front side of the printed circuit board comprises: applying an insulating polymer to the surface of at least component located on the front side of the circuit board.
  • the previously mentioned components that are covered with the insulating polymer on the back side of the PCB are the same as on the front side, e.g., at least one component and/or connector chosen from an FPC connector, an LCD, a battery connector, a speaker connector, a camera connector, a light connector, and combinations thereof.
  • the method also comprises curing the insulating polymer, and applying a polymer capable of conducting a charge to at least one different component than the component containing the insulating polymer.
  • a polymer capable of conducting a charge on the back side of the PCB are the same as on the front side, e.g., at least one component and/or connector chosen from a power switch, a volume switch, RAM Chips, ROM Chips, USB charging port, MEMS, Microphone, SIM card housings, headphone jack, and combinations thereof.
  • the above methods next comprise assembling the electronic device by installing the printed circuit board and battery in a housing; connecting the male connectors of the device to base female connectors mounted on the back side of the printed circuit board; and applying the insulating polymer to the side of the connector in an amount sufficient to achieve wicking coverage around perimeter.
  • the insulating polymer described herein may comprise an acrylic-based polymer, or a rubber, such as isobutylene isoprene rubber.
  • the polymers used herein can be fully cured when exposed to ambient conditions.
  • the polymer capable of conducting a charge comprises a silicone-based polymer.
  • Such a polymer can be cured when exposed to ambient conditions for up to 30 minutes.
  • the insulating polymer can be cured when exposed to ambient conditions for up to 24 hours, such as 12 to 18 hours.
  • a printed circuit board having a front side and a back side, the backside comprising: at least one female connector having an insulating polymer located around the perimeter; at least one internal component having the insulating polymer located thereon; and at least one different internal component having a polymer capable of conducting a charge located thereon.
  • the electronic device such as a smart phone, described herein comprises: a printed circuit board having a front side and a back side, the backside comprising: at least one internal connector having an electrically insulating polymer located around the perimeter; at least one internal component having the insulating polymer located thereon; and at least one different internal component having a polymer capable of conducting a charge located thereon.
  • the front side of the printed circuit board comprises: at least one internal connector having the insulating polymer located around the perimeter; at least one camera having the insulating polymer located around the perimeter; at least one internal component having the insulating polymer located thereon; and at least one different internal component having a polymer capable of conducting a charge located thereon.
  • Figure 1 is a flow chart showing the general method used to treat a printed circuit board according to an embodiment
  • Figure 2 is a flow chart showing a more specific method used to treat a printed circuit board with isobutylene isoprene rubber and a silicone based polymer according to an embodiment.
  • Figure 3 is a flow chart showing a method used to treat a printed circuit board in a production process according to an embodiment.
  • Figure 4 is a flow chart showing a method used to treat a printed circuit board on a disassembled cell phone according to an embodiment.
  • Figure 5 is a photograph showing the back side of a printed circuit board showing where the insulating polymer and the polymer capable of carrying a charge are deposited.
  • Figure 6 is a photograph showing the front side of a printed circuit board showing where the insulating polymer and the polymer capable of carrying a charge are deposited.
  • Figure 7 is a photograph showing the back side of the printed circuit board of FIG.5, with additional description of where the insulating polymer and the polymer capable of carrying a charge are deposited.
  • Figure 8 is a photograph showing the back side of the printed circuit board of FIG.6, with additional description of where the insulating polymer and the polymer capable of carrying a charge are deposited.
  • ambient conditions refers to 72 °F and 45% humidity.
  • inert to conductivity means that the material does not conduct or resist electrical charge.
  • insulating polymer means the polymer does not conduct electricity.
  • insulating polymer may be used interchangeably with the "first polymer” or “Polymer ⁇ , as used in the attached Figures.
  • conducting polymer may be used interchangeably with the “second polymer” or “Polymer 2", as used in the attached Figures.
  • the "water contact angle" is measured using droplets of water that are placed onto a 304 stainless steel surface that has been treated with any of the described polymer(s).
  • a first polymer having a water contact angle greater than 90 degrees after curing means that a 304 stainless steel surface has been coated with the first polymer, which is then cured prior to a droplet of water being dropped thereon. The same is true for the water contact angle for a second polymer.
  • hydrophobic properties of the described coatings placed on different substrates were measured on treated glass slides and treated aluminum substrates. The methods used to measure these contact angles are similar to those described for the treated 304 stainless steel surface.
  • FIG. 1 depicts a flow chart of an embodiment of the present disclosure, specifically the general method of protecting an electronic device that comprises a printed circuit board 100.
  • the method comprises applying a first polymer to one or more female connectors 110 and components 120 located on the backside of a printed circuit board 100.
  • the method then comprises curing the first polymer 130, before applying a second polymer to a different set of one or more components 140 on the backside of the PCB.
  • Both the first polymer and the second polymer exhibit hydrophobic properties, as determined by a water contact angle greater than 90° such at least 110°, such as 115° or greater, or any contact angle ranging from 100° to 120°.
  • Treating the front side of the circuit board 150 comprises applying the first polymer around the perimeter of at least one female connector 160, around the perimeter of one or more connected cameras 170, to the surface of at least one internal component 180, or combinations thereof. Next, the first polymer is cured 190, prior to applying the second polymer to a different set of one or more internal components 192.
  • the method next comprises assembling the electronic device 195.
  • Assembling the electronic device includes installing the printed circuit board and a battery in an appropriate housing and connecting the male connectors of the device to base female connectors mounted on the back side of the printed circuit board.
  • the first polymer is applied to the side of the housing, such as in an amount sufficient to achieve wicking coverage around perimeter 198.
  • the first polymer in electrically insulating and has a higher hardness than the second polymer.
  • the first polymer may comprise an acrylic-based polymer, such as a fluoroacrylate.
  • an acrylic-based polymer such as a fluoroacrylate.
  • a coating comprising the acrylic-based polymer provides a hard barrier that exhibits excellent electrically insulating and anti-corrosion properties.
  • Curing of the fluorinated, acrylic-based polymer typically comprises exposing the polymer to ambient conditions for at least 24 hours. This may be done under thermal conditions, for times less than 24 hours. When curing is done at a temperature above ambient temperature, it is done for a time sufficient to cure the polymer material.
  • first polymer is applied to the connector(s) and/or components in a single layer or in multiple discrete layers.
  • the thickness of each acrylic-based polymer layer ranges from 20 to 1000 nm, such as 100 to 800 nm, such as from 200 to 700 nm, or even 300 to 500 nm.
  • the first polymer which is electrically insulating, is a soft barrier coating, and not the hard barrier layer described above.
  • the first polymer has a hardness value less than the previously described acrylic-based polymer.
  • the first polymer may comprise a rubber, preferably a butyl rubber.
  • Butyl rubbers which are also called isobutylene- isoprene rubber, are synthetic rubbers produced by copolymerizing isobutylene with small amounts of isoprene.
  • Isobutylene Isoprene rubber is known for its excellent resistance to water, steam, alkalis, and oxygenated solvents. It also very low gas permeation properties making it attractive for a barrier layer. In addition, to these excellent impermeability properties, the long polyisobutylene segments of the polymer chains of isobutylene isoprene rubber give it good flex properties.
  • the polymer repeating units have the following properties:
  • first polymer is applied to the connector(s) and/or components in a single layer or in multiple discrete layers.
  • the thickness of each isobutylene isoprene rubber layer ranges from 20 to 1000 nm, such as 100 to 800 nm, such as from 200 to 7Q0 nm, or even 300 to 500 nm.
  • the second polymer is capable of carrying a charge, such as a silicone-based polymer.
  • a silicone-based polymer that can be used herein is aliphatic siloxane, as shown in (II) below:
  • a coating comprising the silicon-based polymer Upon curing, a coating comprising the silicon-based polymer provides improved surface properties, including improved hydrophobicity, improved oleophobicity and reduced friction. The coated surface also exhibits anti-corrosion properties.
  • Curing of the silicone-based polymer typically comprises exposing the polymer to ambient conditions for at least 30 minutes. Alternatively, curing may be done under thermal conditions, such as heating above 80 °C, such as from 90-110 °C for a time sufficient to cure the polymer. Such times ranges are typically up to 5 minutes, but may range from 2 to 10 minutes depending on the polymer composition and layer thickness. In one embodiment, the thickness of the silicone-based polymer layer ranges from 50 to 500 nm, such as 100 to 400 nm, 150 to 350 nm, or even 200 to 300nm.
  • the silicone-based polymer may further comprise at least one hydrophobic agent, such as an organometallic compound.
  • the organometallic halogen material comprises at least one alkyl group and at least one halogen atom linked to a metal atom.
  • the metal atom include titanium, zirconium, tantalum, germanium, boron, strontium, iron,
  • the first and second polymers are applied by at least one automated or manual deposition technique independently chosen from dipping, spraying, vacuum deposition, syringe dispensing, and wipe coating.
  • the technique employed is selected to achieve the previously described thicknesses of each polymer deposited, e.g., an isobutylene isoprene rubber layer ranging from 20 to 1000 nm, and a silicone-based polymer layer ranging from 50 to 500 nm, including the nested ranges described above for each polymer.
  • One particularly useful automated coating system that can be used to deposit the first and/or second polymer is The Nordson ASYMTEKTM Select Coat* SL-940 Series confomnal coating system.
  • DISPENSING SYSTEM sold by Precision Valve & Automation, Inc. (PVA) is another robotic conformal coating/dispensing system that can be used to deposit such polymers.
  • PVA Precision Valve & Automation, Inc.
  • ST100S,TM also sold by PVA, can be used.
  • Additional steps may be carried out before or after applying the first and/or second polymers.
  • the method may further comprise cleaning the electronic component prior to applying either polymer material to remove dust, grime or other surface dirt.
  • Non-limiting examples of the electronic component that may be coated using the disclosed method include a power switch, a volume switch, a light, a liquid crystal display, a touch-screen, a touch panel, a camera, an antenna, an internal connector, such as a printed circuit board, and combinations thereof.
  • the method comprises applying the polymers to both the male end and the female end of the internal connector prior to connecting the male end to the female end.
  • an electronic device that is protected from contaminants, such as water, because it comprises a hydrophobic polymer on at least one internal connector and/or one internal component.
  • Non-limiting examples of at least one or more devices that can be protected using the disclosed method include a cellular phone, a personal digital assistant (PDA), a tablet, a notebook, a laptop, a desktop computer, a music player, a camera, a video recorder, a battery, an electronic reader, a radio device, a gaming device, a server, headphones, terminal blocks, and control panels.
  • PDA personal digital assistant
  • other devices that can be protected using the disclosed method include a wearable device, a medical device, a radio controlled device, an industrial device, and an appliance device.
  • both the first polymer and the second polymer exhibit hydrophobic properties, as determined by a water contact angle greater than 90 0 such that the first layer and second layer form a multilayer, hydrophobic coating on top of the internal component.
  • the first and second polymers have a water contact angle of at least 110°, such as 115° or greater, or any contact angle ranging from 90° to 120°, such as 100° to 120°.
  • water resistance of the device can increase at least 10 times, such as more than 25 times, or even more than 50 times when compared to an
  • the multilayer, hydrophobic coating described herein is inert to conductivity, it does not interfere with the function of the resulting electronic device, while adding the improved water resistance.
  • Low surface tension of the coating solution as disclosed herein provides increased surface wetting, especially under low profile components.
  • the polymers described herein also provide excellent repeilency, anti-wetting and anti- sticking properties against fluids, including but not limited to water, hydrocarbons, silicones and photoresists. As a result, the dried film has low surface energy allowing water-based liquids to bead and drain freely.
  • polymers described herein when applied as coatings, are insoluble in solvents such heptane, toluene and water.
  • solvents such as heptane, toluene and water.
  • the following examples provide a step-by-step process of protecting a smart phone from contaminants by applying two different polymers to different components of the smart phone prior to final assembly of the device.
  • PCB printed circuit board
  • FPC flexible printed circuit
  • the isobutylene isoprene rubber was cured by exposing it to ambient conditions for 24 hours 225. After it was completely cured, an aliphatic siloxane was applied on various internal components 230 located on the backside of the PCB 200.
  • the front side of the circuit board 240 was treated.
  • This method comprised applying the isobutylene isoprene rubber around the perimeter of a flexible printed circuit (FPC) based female connector of the front side of the PCB 250.
  • FPC flexible printed circuit
  • the isobutylene isoprene rubber was then applied around the perimeter of a connected camera 260 and various internal components 270 located on the front side of the circuit board 240.
  • the isobutylene isoprene rubber was cured by exposing it to ambient conditions for 24 hours 280. After it was completely cured, the aliphatic siloxane was applied on various internal components 285 located on the front side of the PCB 240.
  • the isobutylene isoprene rubber was applied to perimeter of female connector and to other internal components, followed by curing the rubber.
  • aliphatic siloxane was applied to different internal components, which was followed by curing of this polymer.
  • isobutylene isoprene rubber was applied to internal components of the PCB via the Precision Spray Machine.
  • the isobutylene isoprene rubber was applied to the perimeter of female connectors, which was followed by curing the butyl rubber.
  • the aliphatic siloxane polymer was applied to different internal components, which is followed by curing of this polymer.
  • FIG. 3 further exemplifies a Hand Assembly Process that can be applied to the backside of the PCB.
  • a connection being made with the FPC connection.
  • the isobutylene isoprene rubber is applied to the perimeter of FPC Connector.
  • hand assembly is used to incorporate the PCB completely into the device, with the polymer being hand dispensed.
  • This Figure shows various connections being made including the FPC connections, and battery connection, with the isobutylene isoprene rubber being added to the connections, followed by the curing of this rubber. After the phone assembly is complete, it is set aside for 24 Hours before testing.
  • both polymers are hand dispensed.
  • isobutylene isoprene rubber is dispensed to the perimeter of FPC Connector, and other internal components, which is followed by curing the isobutylene isoprene rubber.
  • Polymer 2 is applied to different internal component, which is followed by curing Polymer 2.
  • Isobutylene isoprene rubber is applied to internal components, including to the perimeter of female connectors. Isobutylene isoprene rubber is then cured. Aliphatic siloxane is then applied to different internal component.
  • FIG. 5 there is shown the component locations for the different insulating 501 and conducting 502 coatings on the backside of a PCB. It is shown in this Figure the coatings specific to the power and volume switches, as well as LCD and FPC connector areas. Other areas described in this figure include battery connection, backlight areas, and speaker connections.
  • the locations of the insulating and conducting layers shown in FIG. 5 are for representative purposes only, and are not limiting.
  • FIG. 6 is the front side PCB shown in FIG. 5, there is shown the component locations for the different insulating 601 and conducting 602 coatings according to the present disclosure. It is shown in this Figure the coatings specific to the camera, FPC connectors, as well as Dual SIM card housings, USB charging port, RAM, ROM Chips MEMS, Microphone, and the headphone jack.
  • the locations of the insulating and conducting layers shown in FIG. 6 are for representative purposes only, and is not limiting.
  • FIG. 7 there is shown the component locations for the different insulating 701 and conducting 702 coatings on the backside of a PCB according to the present disclosure. It is shown in this Figure the coatings specific to the insulating coating around FPC connector area (for LCD), as well as for insulating coating on/around ZIF Flip-Lock connector for flexible PCB button power, volume switches. It is also shown in this Figure, insulating coatings around the FPC battery clip, as well as insulating coatings around the power supply area connectors for backlight and speaker. The locations of the insulating and conducting layers shown in FIG. 7 are for representative purposes only, and Is not limiting.
  • FIG. 8 which is the front side PCB shown in FIG. 7, there is shown the component locations for the different insulating 801 and conducting 802 coatings according to the present disclosure. It is shown in this Figure the coatings specific to the insulating coating around PC connectors for cameras, as well as insulating coatings for components in these areas. This Figure also shows polymer coatings for dual SIM card housings, MEMS Mic, USB charging ports, and headphone jacks, as well as polymer coating for Ram and Rom chips. The locations of the insulating and conducting layers shown in FIG. 8 are for representative purposes only, and is not limiting.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La présente invention concerne des procédés de protection d'un dispositif électronique contre des contaminants par application de différents matériaux polymères et isolants sur différents composants vitaux d'un dispositif. Dans un mode de réalisation, le procédé comprend les étapes consistant à : appliquer un premier électriquement isolant, tel qu'un caoutchouc d'isoprène-isobutylène, sur un ou plusieurs connecteurs et composants situés sur la carte de circuits imprimés du dispositif. Le procédé comprend en outre l'application d'un polymère capable de supporter une charge, tel qu'un polymère à base de silicone, sur différents connecteurs et composants sur la carte de circuits imprimés. Le procédé permet d'obtenir différents composants revêtus de différents matériaux. L'invention concerne également des dispositifs électroniques qui sont protégés par de tels revêtements, tels que des téléphones intelligents, des ordinateurs, des casques téléphoniques et des dispositifs de jeu, qui présentent tous une protection améliorée vis-à-vis de contaminants, en particulier de contaminants liquides.
PCT/US2016/067257 2016-12-16 2016-12-16 Procédé de protection d'un dispositif électronique par dépôt sélectif de revêtements polymères WO2018111306A1 (fr)

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US5350594A (en) * 1993-01-25 1994-09-27 Tech Spray, Inc. Conformally coated faraday cage
US20060038630A1 (en) * 2004-02-24 2006-02-23 Toshiyuki Kawaguchi Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same
GB2500138A (en) * 2012-03-06 2013-09-11 Semblant Ltd Coated electrical assembly and method
US20140098505A1 (en) * 2012-10-05 2014-04-10 Apple Inc. Heterogeneous encapsulation
US20140190930A1 (en) * 2013-01-04 2014-07-10 Apple Inc. Methods for transparent encapsulation and selective encapsulation
US20140268526A1 (en) * 2013-03-15 2014-09-18 Hzo, Inc. Combining different types of moisture-resistant materials
EP2876138A1 (fr) * 2013-11-20 2015-05-27 Samsung SDI Co., Ltd. Matériau silicone pour protéger des appareils électroniques, module de circuit l'utilisant et procédé de fabrication de module de circuit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5350594A (en) * 1993-01-25 1994-09-27 Tech Spray, Inc. Conformally coated faraday cage
US20060038630A1 (en) * 2004-02-24 2006-02-23 Toshiyuki Kawaguchi Electromagnetic noise suppressor, structure with electromagnetic noise suppressing function, and method of manufacturing the same
GB2500138A (en) * 2012-03-06 2013-09-11 Semblant Ltd Coated electrical assembly and method
US20140098505A1 (en) * 2012-10-05 2014-04-10 Apple Inc. Heterogeneous encapsulation
US20140190930A1 (en) * 2013-01-04 2014-07-10 Apple Inc. Methods for transparent encapsulation and selective encapsulation
US20140268526A1 (en) * 2013-03-15 2014-09-18 Hzo, Inc. Combining different types of moisture-resistant materials
EP2876138A1 (fr) * 2013-11-20 2015-05-27 Samsung SDI Co., Ltd. Matériau silicone pour protéger des appareils électroniques, module de circuit l'utilisant et procédé de fabrication de module de circuit

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