WO2018106193A1 - Structures mems de capteur de gaz et leurs procédés de fabrication - Google Patents

Structures mems de capteur de gaz et leurs procédés de fabrication Download PDF

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Publication number
WO2018106193A1
WO2018106193A1 PCT/SG2017/050609 SG2017050609W WO2018106193A1 WO 2018106193 A1 WO2018106193 A1 WO 2018106193A1 SG 2017050609 W SG2017050609 W SG 2017050609W WO 2018106193 A1 WO2018106193 A1 WO 2018106193A1
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WIPO (PCT)
Prior art keywords
mems
support structure
metamaterial
die
providing
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PCT/SG2017/050609
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English (en)
Inventor
Enrico MACRELLI
Massimo Bruno Cristiano ALIOTO
Chengkuo Lee
Costas John SPANOS
You QIAN
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National University Of Singapore
The Regents Of The University Of California
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Application filed by National University Of Singapore, The Regents Of The University Of California filed Critical National University Of Singapore
Priority to US16/467,091 priority Critical patent/US11988600B2/en
Priority to CN201780083524.3A priority patent/CN110462377A/zh
Publication of WO2018106193A1 publication Critical patent/WO2018106193A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25—Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/31—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
    • G01N21/35—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
    • G01N21/3504—Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis

Definitions

  • the present Invention in one aspect, relates broadly to the field of gas sensors, and specifically relates to light-emission and -detection based gas sensors such as non-dispersive infrared (NDIR) gas sensors to determine the concentration of a particular gas present in a chamber by sensing the absorption of infrared radiation through the gas.
  • NDIR non-dispersive infrared
  • the present Invention in another aspect, relates broadly to the field of infrared sources and detectors such as microheater source and thermopile detector, in particular aiming to enhance the performance of the devices, as well as increase the fabrication yield of the devices.
  • Non-dispersive infrared (NDIR) gas sensors have long been considered as one of the best methods for gas measurement.
  • NDIR gas sensors exploit the fact that various gases show large absorption at specific wavelengths in the infrared radiation spectrum.
  • non-dispersive indicates the type of device incorporating the NDIR technique, usually with a narrow bandpass filter to select radiation in a particular wavelength band from a broadband infrared source.
  • NDIR gas sensors When compared to other gas detection methods such as electrochemical fuel cells, tin oxide (Sn02) sensors, metal oxide semiconductor (MOS) sensors, catalytic sensors, photo-ionization detector (PID), flame-ionization detector (FID), and thermal conductivity sensors, which are all referred to as interactive gas detectors, NDIR gas sensors are highly specific, sensitive, fast responding, relatively stable over time, reliable, and easy to maintain.
  • NDIR gas sensors typically comprise: an infrared radiation source with a motor- driven mechanical chopper to modulate the source, a pump to push gas through a sample chamber, a narrow bandpass filter, a sensitive infrared detector, and infrared optics and windows to focus the infrared energy from the source onto the detector.
  • an infrared radiation source with a motor- driven mechanical chopper to modulate the source
  • a pump to push gas through a sample chamber
  • a narrow bandpass filter to control gas through the sample chamber
  • a sensitive infrared detector a sensitive infrared detector
  • infrared optics and windows to focus the infrared energy from the source onto the detector.
  • the waveguide diffusion sample chamber uses an elongated hollow tube having an inner reflective surface that permits the tube to function as a light-pipe to transmit radiation from a source to a detector through the sample gas.
  • a plurality of apertures in the wall of the non-porous hollow tube let the sample gas to enter and exit freely under environmental pressure.
  • Particles of smoke and dust are kept out of the chamber by use of a semi-permeable membrane that extents the apertures, whereas condensation of the sample gas (or air) can be prevented by heating the sample chamber to a temperature above the dew point of the gas (or air).
  • This concept has been broadly adopted in the design of today's NDIR gas sensors, particularly in low-cost and high volume sorts.
  • the most widespread NDIR gas sensor is a dual beam device having a signal and a reference beam realized with a single infrared source and two separate infrared detectors, each with a different bandpass filter.
  • the signal filter contains a narrow spectral bandpass tuned to the absorption radiation of the gas.
  • the reference filter encloses a narrow spectral bandpass that is irrelevant to the gas in question and also to all the common gases present in the atmosphere.
  • the reference beam acts as a reference for the detection of the gas species over time.
  • the dual beam technique works well for many applications, especially for the detection of relatively low concentration of CO2 gas (400-2000 ppm) for heating, ventilation and air conditioning (HVAC) systems and indoor air quality (IAQ) applications.
  • HVAC heating, ventilation and air conditioning
  • IAQ indoor air quality
  • the cost reduction for the sensor is limited by the expensive detector package which contains two detectors each furnished with a different filter.
  • the dual beam NDIR gas sensor still has a number of limitations that require special actions in order to render the sensor reliable and stable for use over time.
  • NDIR gas sensors All of the NDIR gas sensors previously described perform well and have contributed effectively to the overall technical progress in the field of gas analysis during the past two decades. They have been widely accepted in both medical and industrial communities. However, regardless of their success over the years, there still remain several characteristics that need to be significantly improved in order to further extend the useful applications of these devices.
  • the first drawback of today's gas sensors, inclusive of NDIR gas sensors is the sensor output stability over time, i.e. drift over time, for instance due to the aging of the infrared source by heating up many times in a lifecycle to deliver the IR energy. This will result in a change of its spectral output intensities. This means that every gas sensor requires recalibration once every three months to a year in order to remain accurate over time.
  • both detection channels have the same narrow bandpass filter and they receive radiation from the same single infrared source has shown that they are all affected in the same way to first order when there are spectral changes caused by temperature variations in the sample chamber and/or by the short or long-term operational changes (e.g. aging) of the infrared source.
  • WSNs wireless sensor networks
  • These sensors can actually interact and work with one another in an efficient way with self-commissioning, self-tuning, self-diagnostic and correction, and even self-configuring features. By so doing the energy requirement for buildings can be reduced while the comfort level and safety for occupants in the buildings can also be greatly increased.
  • Other approaches include the use of feedback circuitry to control and keep constant the infrared source temperature by adjusting the voltage delivered to the source.
  • Other recent tactics comprise the use of post processing algorithms capable to compensate the environmental variations by measuring the sample chamber temperature, pressure, and eventually relative humidity (RH) through sensors.
  • Electrochemical gas sensors have long been considered to be small and low cost, but their performances are also known to suffer from output instability over time and relatively short operating lives when compared to other non- electrochemical gas sensors, particularly the NDIR types.
  • NDIR non- electrochemical gas sensors
  • Over a decade ago Wong disclosed in U.S. Pat. No. 5,444,249 (Aug. 22, 1995) a miniaturized single beam NDIR gas sensor manufactured using semiconductor micro-machining techniques from a semiconductor material. Since the NDIR sensor is fabricated out of a semiconductor material, the source driver and signal processing electronics can be added directly to the sensor using integrated circuit (IC) fabrication techniques.
  • IC integrated circuit
  • MEMS devices can comprise one or more mechanical elements such as sensors and actuators formed on a substrate, and silicon substrate, through micro-fabrication technology. Such MEMS devices in a state before packaging can also be referred to as a "MEMS die". MEMS dies are normally placed in a package to protect the MEMS dies and simplify electrical connection to larger electronic devices. Such MEMS packages are typically designed to be attached to a printed circuit board (PCB) or similar interface for larger devices.
  • PCB printed circuit board
  • a MEMS package can include a case defining a cavity to contain a MEMS die, bond pads for electrical connection to the MEMS die, leads for electrical connection to a larger device, and interconnects for electrical connection between the bond pads and the leads.
  • a MEMS die is attached to a mounting surface of the MEMS package, and can be electrically connected to the bond pads.
  • Other devices such as application specific integrated circuit (ASIC) dies can be similarly packaged for protection and to simplify electrical connection to larger electronic devices.
  • ASIC dies can be independently packaged or packaged together with MEMS devices. Vertical mounting of MEMS dies has been addressed by Xue et al. in U.S. Pat. No. 8,836,132 B2 (Sep. 2014) and U.S. Pat. No.
  • the MEMS die is parallel to the package mounting plane so that the device is in a horizontal orientation. In other applications, the MEMS die is perpendicular to the package mounting plane, so that the device is held in a vertical orientation.
  • a microheater In the field of MEMS, a microheater is a continuous line made of conductive material, which heats up in response to an input current due to Joule's heating.
  • the microheater are popularly used as either microplates for providing localized heating or as infrared source dictated by Planck's radiation law.
  • the heater line is housed on a membrane for mechanical stability and is secured to the substrate through supporting arms.
  • numerous tradeoffs are designed based on the application.
  • the heater lines are wound in meander shape to achieve improved footprint with high resistance.
  • the geometry of these structures are optimized with the desired mechanical strength needed to hold the heater in place.
  • the heater is packaged in vacuum to reduce the heat loss due to air convection.
  • thermopile is a device that converts thermal energy into electrical energy. It is composed of several thermocouples (one P-type beam and one N-type beam) connected together. The device has a hot junction (the absorber) and a cold junction (the substrate) at two ends of the thermocouples. Thermopiles do not respond to absolute temperature, but generate an output voltage proportional to a local temperature difference, thus, maintaining a high temperature difference would increase the output of the device.
  • the phenomena through which one material can convert thermal energy into electrical energy is called thermoelectric effect.
  • the Seebeck coefficient of a material is a measure of the magnitude of an induced thermoelectric voltage in response to a temperature difference across that material. There are generally two ways to increase the output device, using materials with high Seebeck coefficient and maintain a high temperature difference.
  • thermopile the absorber is used to absorb the incident signal (light), and create a temperature difference between two ends of the thermocouple.
  • the design principle of any thermopile can be summarized as 1), a high efficient absorber which converts all incident light to heat. 2), eliminate most or all heat loss between the absorber and Si substrate, which includes conduction, convention and radiation. Ideally, the only thermal path would be the thermocouples themselves.
  • Embodiments of the present invention seek to address at least one of the above problems.
  • a gas sensor comprising a first micro electro-mechanical system (MEMS) die comprising a light source; a second MEMS die comprising a light detector; a sample chamber disposes in an optical path between the light source and the light detector; and a holder substrate; wherein the first and second MEMS dies are disposed on the holder substrate in a vertical orientation relative to the holder substrate, and with the sample chamber disposed laterally there between.
  • MEMS micro electro-mechanical system
  • a method of manufacturing a gas sensor comprising the steps of providing a first micro electro-mechanical system (MEMS) die comprising a light source; providing a second MEMS die comprising a light detector; providing a sample chamber disposes in an optical path between the light source and the light detector; and providing a holder substrate; wherein the first and second MEMS dies are disposed on the holder substrate in a vertical orientation relative to the holder substrate, and with the sample chamber disposed laterally there between.
  • MEMS micro electro-mechanical system
  • a method for fabricating a micro electro-mechanical system (MEMS) die for a heater or thermopile comprising providing a support structure; providing one or more metamaterial elements on the support structure; providing the support structure with the one or more metamaterial elements suspended across a cavity; and providing a wafer level thin film encapsulation for vacuum packaging of the MEMS die.
  • MEMS micro electro-mechanical system
  • a micro electromechanical system (MEMS) die for a heater or thermopile, the MEMS die comprising a support structure; one or more metamaterial elements on the support structure; the support structure with the one or more metamaterial elements across a cavity; and a wafer level thin film encapsulation for vacuum packaging of the MEMS die.
  • MEMS micro electromechanical system
  • Figure 1 shows a lien drawing of a single-beam NDIR diffusion gas sensor according to an example embodiment.
  • Figure 2 shows a line drawing of the separated parts of the sensor of Figure 1.
  • Figure 3 shows a line drawing of the separated parts of the sensor of Figure 1 modified according to another example embodiment.
  • Figure 4 shows a line drawing of components of a micro -heater device according to an example embodiment.
  • Figure 5 shows a line drawing of the cross-section of a micro-heater device according to an example embodiment.
  • Figure 6a) to j) shows respective line drawings illustrating the process flow of fabricating the microheater device of Figure 5.
  • Figure 7 shows a line drawing of a thermopile device according to an example embodiment.
  • Figure 8 shows a line drawing of the cross-section of a thermopile device according to an example embodiment.
  • FIG. 9a) to j) show respective line drawings illustrating the process flow of fabricating the thermopile device of Figure 8.
  • Figure 10 shows a flow chart illustrating a method of manufacturing a gas sensor according to one embodiment.
  • FIG 11 shows a flow chart illustrating a method for fabricating a micro electro-mechanical system (MEMS) die for a heater or thermopile, according to one embodiment.
  • MEMS micro electro-mechanical system
  • Embodiments of the present Invention described herein provide a low-cost and low-power integrated single-beam NDIR diffusion gas sensor for fast detection of a predetermined gas (e.g., C0 2 ).
  • the gas sensor is generally composed by: a single (or array) MEMS infrared heater source with metamaterial emitter to enable narrow bandpass emission, a single (or array) MEMS infrared thermopile detector with metamaterial absorber to enable narrow bandpass absorption, a silicon holder IC, a MEMS tube waveguide diffusion sample chamber with inner reflective surface and apertures, and a silicon ASIC designed on the same silicon holder IC, which contains circuitry to drive the infrared source with eventually feedback loop to calibrate its temperature, an analog interface to read-out the sensor output, and digital signal processing to determine the concentration of the gas and to compensate the environmental variations, i.e. sample chamber temperature, pressure, and eventually RH. All the components are realized through a CMOS compatible process.
  • metamaterial is an artificial material that does not exist in nature but can be engineered to manipulate electromagnetic (EM) wave propagation or achieve the unique features of EM wave which only can be realized on these periodic array of designed unit cell.
  • EM electromagnetic
  • metamaterial can be designed to allow a particular wavelength to propagate for selective reading while eliminating the need for bulk component, e.g., optical filter.
  • the radiation through the sample gas can be increased and the radiation detected by the thermopiles maximized.
  • the single components of the array can be connected both in parallel and in series depending on the design chosen.
  • the MEMS die are vertically assembled on the trenches of the holder IC which mechanically supports and electrically connects the die.
  • the ASIC in some example embodiments is designed on the same holder IC containing the driver, analog interface, and digital processing circuitry.
  • the MEMS metamaterial emitter and absorber preferably allow the MEMS infrared microheater source to emit radiation and the MEMS thermopile detector to receive radiation of a wavelength that is strongly absorbed by the gas whose concentration is to be determined.
  • the MEMS tube waveguide diffusion chamber is used to transmit the radiation from the infrared source to the thermopile through the sample gas via multiple reflections on the inner surface, while acting as the gas sample chamber.
  • the apertures can allow the gas to enter and exit spontaneously under environmental pressure.
  • the thermopile converts the changes of the gas absorption properties into a read-out voltage which is then sampled and processed by the electronics to determine the concentration of the gas and to compensate the environmental variations.
  • the vacuum level thin film encapsulations thermally isolate the source and detector from the sample gas, thus preventing the sample gas or the air from cooling these elements.
  • the thermal isolation preferably reduces the thermal response time of source and detector, thus allowing a very fast gas detection and hence low energy consumption per measurement, while increasing the yield.
  • the inner surface of the MEMS tube waveguide is reflective in some example embodiments, radiation is transmitted from the source to the detector through the sample gas without the need for expensive optics.
  • this gas sensor in some example embodiments uses a diffusion gas sample chamber, no pump is required to push or pull the sample gas into the sample chamber.
  • the novel low-cost and low-power integrated single-beam NDIR diffusion gas sensor 100 for fast detection of a predetermined gas is shown in Fig. 1.
  • the sensor 100 includes a MEMS die 102 comprising a single (or array, compare Fig. 3) MEMS source 103 with metamaterial emitter and vacuum level thin film encapsulation (not resolved), a MEMS die 104 comprising a single (or array, compare Fig.
  • MEMS detector 105 with metamaterial absorber and vacuum level thin film encapsulation (not resolved), a silicon holder IC 106, a MEMS die 108 comprising a MEMS tube waveguide diffusion sample chamber 110 with inner reflective surface and apertures in the form of the open ends of the chamber 110, and a silicon ASIC 112 designed on the same holder IC 106 which comprises a source driver, analog interface, and digital processing circuitry (not resolved).
  • the separated parts of the sensor 100 according to the example embodiment of Figure 1 are shown in Fig. 2, with the same reference numerals as in Figure 1 used for the same parts.
  • Fig. 2 The separated parts of the sensor 100 according to the example embodiment of Figure 1 are shown in Fig. 2, with the same reference numerals as in Figure 1 used for the same parts.
  • Fig. 2 The separated parts of the sensor 100 according to the example embodiment of Figure 1 are shown in Fig. 2, with the same reference numerals as in Figure 1 used for the same parts.
  • Fig. 2 The separated parts of the sensor 100 according
  • FIG. 3 shows the separated parts of a modified embodiment, with corresponding parts having the same numeral as in Figures 1 and 2 but with a "b" added, including micro heaters and thermopiles arrays 200, 202, respectively, providing a sensor including multiple source and detector MEMS components.
  • the holder IC 106 can be fabricated from a semiconductor material using existing techniques understood in the art, whereas the MEMS die 102, 104 and 108 can be vertically mounted on the holder IC 106 using a standard die-attaching process.
  • die-attaching process is the process of attaching the MEMS die either to a package or to some substrate.
  • Some examples of die-attaching process include eutectic bonding, epoxy bonding, and solder attach.
  • Specific advantages of the vertically mounted MEMS dies include miniaturization capability and Line-of-Sight (LoS) radiation between source and detector. Other advantages include easiness of integration and assembly.
  • CMOS complementary metal-oxide-semiconductor
  • SiP System-in- Package
  • Any semiconductor material may be used for the holder IC 106 including silicon (Si) and gallium arsenide (GaAs), however Si is presently considered the preferred semiconductor material.
  • Other semiconductor materials that may be used include binary, ternary, and quaternary II- VI and III-V semiconductor materials.
  • the vacuum encapsulations thermally isolate the source and the detector from the gas sample in some example embodiments so that the gas sample (or air) does not cool the detector or source, which would result in an incorrect reading.
  • the thickness of the encapsulation is selected to achieve thermal isolation while at the same time permitting to be optically transparent.
  • the source 103 produces broadband radiation of all wavelengths.
  • the sample chamber 110 contains the gas sample to be examined for the concentration of a particular gas. Radiation entering the sample chamber 110 passes through the gas sample until it is detected by the detector 105.
  • the source 103 can be realized in some embodiments by a thin film resistive heating element, i.e. a heater, placed on a cantilever so as to thermally isolate it from the substrate.
  • the resistive element can be made of polycrystalline silicon (Polysilicon) or other suitable metals such as platinum (Pt).
  • the heater materials are carefully selected to ensure high temperature performance.
  • thermal isolation of the heating element is preferred to keep small the thermal response time of the source 103, and so that the entire substrate is not heated.
  • a cantilever preferably prevents heat produced by heating element from draining to substrate too quickly.
  • the metamaterial emitter and absorber in some embodiments permit selective narrowband emission for the source 103 and selective narrowband absorption for the detector 105.
  • the metamaterial can be made of molybdenum (Mo) or other suitable metals. Preferably, the metamaterial materials are carefully selected to ensure high temperature performance.
  • the specific wavelength of the metamaterial depends on the absorption spectrum of the targeted gas, and it can be easily changed to other wavelength of interest by modifying the metamaterial pattern.
  • the specific wavelength of the metamaterial can be configured to detect the concentration and/or presence of various gases including, but not limited, to C0 2 , carbon monoxide (CO), oxygen (0 2 ), hydrogen sulfide (H 2 S), nitrogen dioxide (N0 2 ), sulfur dioxide (S0 2 ), etc.
  • a metamaterial with a center wavelength of 4.26 ⁇ and a full width at half maximum (FWHM) of about 0.1-0.2 ⁇ is appropriate for C0 2 detection. Since the source 103 and detector 105 employ a metamaterial layer, the sensor 100 advantageously does not require any additional stand-alone and expensive bandpass filter (filter- free design).
  • the detector 105 in example embodiments may be any device that creates variable electrical responses to corresponding variations in the strength of radiation reaching it from the source. Any detectors may be used when measuring infrared radiation: thermopile, thermocouple, pyroelectric, and bolometer. However, a thermopile detector may be favored for the detection of infrared radiation. A thermopile responds to temperature changes caused by the radiation incident upon it, and thus converts the radiation into electrical energy.
  • the sample chamber 110 is a diffusion type gas sample chamber in some embodiments. Hence, no pumps are required to push or pull the gas sample into the sample chamber 110.
  • the two ends of the waveguide forming the chamber 110 act as apertures which let the gas diffuse into and out of sample chamber 110.
  • the apertures can have a wide range of shapes and sizes. For instance, an aperture size of 20 ⁇ or more allows diffusion of gas through it rapidly enough so that a response to a change in composition of the surrounding air can be register within about 10 s after a composition change occurs. Moreover, it is desirable to prevent particles of dust and smoke from entering sample chamber 110.
  • apertures can be covered with a gas semi-permeable membrane in some embodiments, which preferably keeps out particles of a size greater than about 0.1 ⁇ .
  • the gas semi-permeable membrane may be a dielectric layer that can be deposited by evaporation or sputtering. Silicon oxide, silicon nitride, Teflon, and Kapton are dielectrics suitable for this purpose, preferably the dielectric layer is silicon oxide or silicon nitride.
  • the sample chamber 110 has a square or rectangular cross- section, however, other shapes can be used such as a circular or triangular waveguide in different embodiments.
  • the inner surface of the circular waveguide tube forming the chamber 110 is metallized in some embodiments in order to improve the efficiency of the sensor.
  • a variety of different metallization can be used to increase the reflectivity of the inner surface, including aluminum (Al), gold (Au), chromium (Cr), nickel (Ni), and Pt.
  • Al aluminum
  • Au gold
  • Cr chromium
  • Ni nickel
  • Pt Pt
  • the source driver of the ASIC 112 energizes the source 103 through a duty-cycled electric current in some embodiments.
  • the driver includes circuitry to drive the source 103 and preferably includes a feedback loop to calibrate the source's 103 temperature. After the radiation from source 103 reaches the detector 105, the latter produces an electrical signal that represents the intensity of the radiation falling on it. This signal is inversely proportional to the amount of gas being detected. For example, if C0 2 is being detected, the more C0 2 there is in the sample chamber 110 the weaker the infrared energy will be striking the detector 105.
  • the analog interface and digital processing electronics of the ASIC 112 elaborate the electrical signal produced by detector 105 thus providing the concentration of the targeted gas and compensating for environmental variations in some embodiments. Therefore, the signal output of the processing electronics may be applied to a meter or an alarm as is understood in the art.
  • the analog interface and digital processing electronics of the ASIC 112 can be coupled also with the source 103.
  • the source driver, analog interface, and digital processing electronics are realized within e.g. a silicon ASIC 112 on the same holder IC 106.
  • the signal produced by the detector 105 can be a time-varying response in reaction to a certain gas concentration (or gas mixture) which depends on several factors such as: type of sensor, nature and concentration of the gas, reaction of the gas with the sensor components, and environmental conditions.
  • the source 103 is normally not operated continuously, but it is rather pulsed at a specific frequency to reduce the usage of the sensor 100 and decrease the overall power consumption (i.e., prolonging its lifetime).
  • the response time dictated by the time required to reach 90% of the thermal steady state is typically in the order of seconds or even longer.
  • the measured gas concentration is available only after the response time, which implies greater energy consumption per measurement.
  • Transient analysis methods can reduce the latency between a gas concentration raise and its detection, compared to traditional slower methods based on steady- state analysis.
  • transient analysis can enable true real-time sensing, and hence quick reaction to time-varying (and potentially hazardous) environmental conditions, before excessive gas concentration occurs.
  • transient analysis enables low energy consumption per measurement and scalable energy-accuracy tradeoff by targeting a desired accuracy achieved by assigning an appropriate measurement time.
  • Several fast circuit and hardware solutions of the ASIC 112 have been proposed to reduce the response time, although at the price of higher sensor cost and/or larger size.
  • the analysis of the transient sensor response through signal processing algorithms of the ASIC 112 represents a better and cost-effective option to enable real-time sensing.
  • the signal processing unit of the ASIC 112 processes the transient sampled sensor response through real-time signal processing algorithms in order to derive the gas concentration.
  • a variety of features can be added to the signal processing unit of the ASIC 112 to improve the robustness of the algorithm against fluctuations in the environmental including ambient temperature, pressure, RH, radiation source temperature, and many others.
  • a wide variety of signal processing algorithms of the ASIC 112 can be used to predict the gas concentration from the transient sampled sensor response.
  • a few non- exhaustive examples include ordinary least-squares regression (OLS), multiple linear regression (MLR), principal component regression (PCR), partial least-squares regression (PLS), Ridge regression (RR), Lasso regression (Lasso), multivariate adaptive regression splines (MARS), stepwise regression (SR), nonlinear regression, and many others.
  • classification techniques can be used such as linear discriminant analysis (LDA), logistic regression (LR), classification and regression trees (CART), Gaussian mixture models (GMMs), k-nearest neighbors (k-NNs) classification, artificial neural networks (ANNs), support vector machines (SVMs), partial least-squares-discriminant analysis (PLS- DA), multilayer perceptron classifiers (MLPs), radial basis functions (RBFs), etc.
  • Other possible examples include feature extraction techniques such as genetic algorithms (GAs), feature subset selection (FSS), sequential forward selection (SFS), sequential backward selection (SBS), best-subset regression, etc.
  • a solution according to some embodiments is to add a thin film resistive type heater and resistance temperature detectors (RTDs) to the sidewalls of optical waveguide forming the chamber 110.
  • the heaters and RTDs can be connected to a temperature control circuit to keep the sample chamber 110 at an established temperature.
  • the temperature control circuit can be integrated within a silicon ASIC 112 on the same holder IC in some embodiments.
  • a temperature sensor can be realized through a MEMS resistive heater which is placed close to the main source heater in some embodiments. Since both temperature sensor and source are subjected to the same temperature, the temperature sensor can be used to detect the heater temperature, and then pass this feature to the feedback loop circuitry which will adjust the heater current accordingly to keep the heater temperature (and power) constant.
  • a micro-flow sensor may be added to detect the flow rate of the sample gas over the sample chamber in some embodiments. The output from these devices can be connected to the electronics within the silicon ASIC in some embodiments.
  • Some embodiments of the present Invention can also be used to determine simultaneously multiple gas concentration by using metamaterials with different emission and absorption wavelength, and by processing the detector output signal by classification and/or regression learning techniques. These methods can preferably recognize multiple gases even with a single-beam device with a single detector.
  • Embodiments of the present Invention can be linked to a WSN that connects to a plurality of others gas sensors.
  • a gas sensor comprises a first micro electro-mechanical system (MEMS) die comprising a light source; a second MEMS die comprising a light detector; a sample chamber disposes in an optical path between the light source and the light detector; and a holder substrate; wherein the first and second MEMS dies are disposed on the holder substrate in a vertical orientation relative to the holder substrate, and with the sample chamber disposed laterally there between.
  • MEMS micro electro-mechanical system
  • the light detector may comprise one or more conversion elements for converting a temperature change into an electrical signal and one or more first metamaterial elements thermally coupled to respective ones of the conversion elements, the first metamaterial elements configured for selective absorption at one or more wavelengths emitted by the light source and means for converting changes in the absorption at the one or more wavelengths into a variable electrical response.
  • the gas sensor may further comprise vacuum level thin film encapsulations for the first and second dies, respectively, for thermal isolation of the light source and the light detector from a gas sample.
  • the light source may comprise one or more heater elements and one or more second metamaterial elements thermally coupled to respective ones of the heater elements, the second metamaterial elements configured for emission at the one or more wavelengths.
  • the gas sensor may further comprise a processing circuit with, at least, a source driver for driving the light source and an analogue interface coupled to the light detector.
  • the processing circuit may be integrated on the holder substrate.
  • the sample chamber may comprise a waveguide diffusion chamber. Opposing open ends of the waveguide diffusion chamber function as diffusion apertures.
  • FIG. 10 shows a flow chart 1000 illustrating a method of manufacturing a gas sensor according to one embodiment.
  • a first micro electro-mechanical system (MEMS) die comprising a light source is provided.
  • a second MEMS die comprising a light detector is provided.
  • a sample chamber disposed in an optical path between the light source and the light detector is provided.
  • a holder substrate is provided, wherein the first and second MEMS dies are disposed on the holder substrate in a vertical orientation relative to the holder substrate, and with the sample chamber disposed laterally there between.
  • Providing the light detector may comprise providing one or more conversion elements for converting a temperature change into an electrical signal and thermally coupling one or more first metamaterial elements to respective ones of the conversion elements, the first metamaterial elements configured for selective absorption at one or more wavelengths emitted by the light source and means for converting changes in the absorption at the one or more wavelengths into a variable electrical response.
  • the method may further comprise providing vacuum level thin film encapsulations for the first and second dies, respectively, for thermal isolation of the light source and the light detector from a gas sample.
  • Providing the light source may comprise providing one or more heater elements and thermally coupling one or more second metamaterial elements to respective ones of the heater elements, the second metamaterial elements configured for emission at the one or more wavelengths.
  • the method may further comprise providing a processing circuit with, at least, a source driver for driving the light source and an analogue interface coupled to the light detector.
  • the method may comprise integrating the processing circuit on the holder substrate.
  • the sample chamber may comprise a waveguide diffusion chamber. Opposing open ends of the waveguide diffusion chamber function as diffusion apertures.
  • Integrated single-beam NDIR diffusion gas sensor with MEMS die that are vertically mounted and electrically connected on a silicon holder IC Reduces the fabrication cost and allow extreme miniaturization with lower unit cost within a CMOS compatible process.
  • Vacuum level thin film encapsulated MEMS parts fast thermal response thus quick detection, and hence low energy consumption per measurement, within a single chamber: Reduces the cost of MEMS parts, since no further packaging needed, while increasing the yield.
  • Metamaterial MEMS emitter and absorber Allow selective emission and absorption for specific wavelength (easy to change) without the need for an additional stand-alone bandpass filter (filter- free design).
  • the main commercial applications of embodiments of the present Invention can include: ⁇ Internet of Thing (IoT) applications
  • HVAC Heating, ventilation and air conditioning
  • the present invention can be applied to different type of light-emission and -detection based gas sensors such as optical gas sensors, spectroscopic gas sensors, mid infrared (IR) gas sensors, mid infrared (IR) light-emission diodes (LEDs) and photodiodes.
  • IR infrared
  • IR light-emission diodes
  • LEDs light-emission diodes
  • the architecture described for the embodiments with referenced to Figs. 1-3 can be used with different sources (e.g. resistive heater, thin-film heater) and detectors (e.g. thermopile, pyroelectric, bolometer) types.
  • a metamaterial layer or layers are advantageously included in a gas sensor architecture to provide selective (i.e. narrow bandpass) emission/absorption for specific wavelengths. This can provide a filter-free gas sensor design, which in turn can reduce complexity and/or costs according.
  • micro-heater device in another aspect, can provide a micro-heater device.
  • the micro-heater device generally includes four parts as shown in Fig. 4: the heater 400 (with supporting arms e.g. 401, PolySi heater wire 403, and metal interconnects e.g. 405), the emitter 402 (with metamaterial pattern 407), the cavity 404, and the encapsulation 406.
  • the micro-heater devices are light sources that emit broadband radiation.
  • the wavelengths can extend from visible to the far infrared.
  • the broadband nature of the radiation makes these micro-heater devices/sources useful in spectrophotometry and infrared-signal generation, e.g. for use in the embodiments of the sensor described above with reference to Figs. 1 to 3.
  • the electrical current going through the conductive wire heats the emitter, by joule heating.
  • the emitter converts the heat to light.
  • the design principle of the micro- heater device can be summarized as 1) A high efficient emitter which converts heat to light. 2) Eliminate most or all heat loss between the emitter and Si substrate, which includes conduction, convention and radiation.
  • the only thermal path would preferably be the supporting arms. 3)
  • the supporting arms should preferably have a low thermal conductivity.
  • the heater 400 Polycrystalline silicon (Polysilicon) can be used for the heater 400. Silicon has a few advantages including much lower thermal conductivity compares to metal. Silicon reduces the energy loss through the supporting arms. In traditional fabrication process, a dielectric layer is right beneath the Polysilicon layer to provide the insulation. The dielectric layer is an additional heat loss path other than the Polysilicon layer. It also induces residual stress to the devices but do not have any other benefit other than electrical insulation. In the process flow according to some embodiments described below, this dielectric layer is preferably eliminated while still maintaining a good insulation for the device. Polysilicon also has a higher resistivity than metal, which preferably makes sure most of the joule heating happens on the heating wire other than the metal interconnection outside of the device in some embodiments.
  • the emitter 402 A metamaterial pattern 407 is designed for the emitter 402 in some embodiments.
  • the metamaterial pattern 407 can be engineered to emit light with specific wavelength only, and have a 100% emission rate in the peak wavelength. In this way, the emitter 402 can preferably only emit the interested wavelength, which is a great advantage for gas sensing applications.
  • the cavity 404 During the fabrication of the microheater device 500 in some embodiments, the emitter 402 and the heater 400 need to be released. By suspending the emitter 402 and supporting arms e.g. 401 of the heater 400, the dominated heat loss mechanism (thermal conduction through solid) is preferably removed. Using a conventional process understood in the art, the release step can be done by an isotropic etch controlled by time. After the etching, the emitter 402 and the supporting arms e.g. 401 of the heater 400 are fully released, but the side effect is the supporting arms e.g. 401 may be over released. In full wafer fabrication, increase the release time could preferably ensure all devices on the wafer are released.
  • the micro-heater device 500 can be packed with higher density since over release would not have influence to the micro-heater device 500 according to some embodiments, since the physical connection between the supporting arms e.g. 401 (and thus the heater 400) and the substrate outside the cavity is formed by separate connection structures, as will be described in more detail below with reference to Figure 7.
  • the physical connection between the supporting arms e.g. 401 (and thus the heater 400) and the substrate outside the cavity is formed by separate connection structures, as will be described in more detail below with reference to Figure 7.
  • the sacrificial material inside the cavity is removable in the conventional isotropic etching.
  • increasing the release time could ensure all devices on the cavity are fully suspended while these devices advantageously will not be detached from wafer after releasing, according to some example embodiments.
  • the encapsulation 406 Because of the heat on the emitter 402 lost via the conduction and convention of air, the performance of the devices could enhance by packaging the devices into vacuum environment.
  • the conventional vacuum packaging method understood in the art uses wafer to wafer bonding. It is an expensive method and the yield is not ideal.
  • a wafer level thin film encapsulation method preferably replaces the wafer to wafer bonding method. By encapsulating each device individually with a CMOS compatible process in some embodiments, the cost of the device can be reduced.
  • a metamaterial emitter can have the exact same architecture as metamaterial absorber that consists of bottom metal, middle dielectric and top metal layer.
  • the bottom metal layer blocks light from transmission.
  • the top metamaterial and middle dielectric layers can be engineered to achieve specific values of permittivity and permeability to achieve impedance matching with the free space to obtain the absorption resonance.
  • the middle dielectric layer is also used to contain and confine the resonance and reduce energy loss.
  • the structures are designed for perfect absorption, i.e., perfect emission at a specific wavelength, preferably enabling high signal to noise ratio of the system at low power consumption.
  • the process flow of fabricating the microheater device 500 is described below with reference to Fig. 6.
  • the process begins with a Si wafer 502.
  • a cavity 504 is first etched on the silicon (Si) wafer 502 for 2 ⁇ .
  • a silicon dioxide (S1O2) layer 506 of thickness more than 2 ⁇ is deposited on the whole wafer 502 and then the Si0 2 layer 506 is planarized by chemical mechanical polishing (CMP), as shown in Fig. 6a).
  • CMP chemical mechanical polishing
  • a Polysilicon layer 508 is deposited and then doped as N-type or P-type Polysilicon, as show in Fig. 6b).
  • the Polysilicon layer 508 is etched with Si0 2 hard mask to form the supporting arms and heater wire, together indicated with numeral 510.
  • the Polysilicon arms are only located within the Si0 2 cavity 504 without any physical connection with the Si substrate 502, as shown in Fig. 6c).
  • Aluminum oxide (A1 2 0 3 ) 512 is deposited, this layer 512 serves as the insulation layer for the metal interconnection later.
  • the A1 2 0 3 layer 512 is also the physical connection between the supporting arms 510 and Si substrate 502, as well as the arms 510 and metamaterial emitter.
  • Vias 514 are opened on the A1 2 0 3 layer 512 to allow electrical interconnection to form with the Polysilicon 508, as shown in Fig. 6d).
  • Molybdenum Metal (Mo) 516 is deposited and etched.
  • This metal layer 516 works as the interconnection between Polysilicon arms 510 and also is the bottom layer of the metamaterial structure, see Fig. 6e).
  • Another layer of dielectric 518 and another layer of metal 520 is deposited and the metal layer 520 is etched to form the metamaterial pattern for the top layer of the metamaterial emitter structure, with a portion of the dielectric layer 518 forming the middle dielectric of the metamaterial absorber, as shown in Fig. 6f).
  • the A1 2 0 3 is selectively removed above the Polysilicon arms 510, and also forms the shape of the emitter 521, as shown in Fig. 6g).
  • a thick layer of Si0 2 522 is deposited and planarized.
  • the Si0 2 522 is etched and the Si0 2 522 is left above the device, as shown in Fig. 6h).
  • Aluminum nitride (A1N) 524 is deposited to seal the device, as shown in Fig. 6i).
  • release holes 526 are etched. Vapor Hydrofluoric acid release is conducted to suspend the emitter 521 and arms 510.
  • the device is again sealed with another layer of Si0 2 528 as shown in Fig. 6j). Electrical contact pads (not shown) are opened and formed outside the encapsulation.
  • thermopile device In another aspect, embodiments of the present Invention can provide a thermopile device.
  • the thermopile device generally includes four parts as shown in Fig. 7: The thermocouples 700 (with P-type PolySi e.g. 701 and N-type PolySi e.g. 703, and metal interconnects e.g. 705, absorber 702 (with metamaterial pattern 707), cavity 704, and the encapsulation 706.
  • the thermocouples 700 Polysilicon is used for the thermoelectric material in some embodiments as it has a few advantages such as: high Seebeck coefficient, CMOS compatible process, easy to form N-type and P-type material, low residual stress. In traditional fabrication process understood in the art, a dielectric layer is right beneath the Polysilicon layer to provide the insulation.
  • the dielectric layer is an additional heat loss path other than the Polysilicon layer, decreases the temperature difference of the hot junction and cold junction, and induces residual stress to the devices but do not have any other benefit other than insulation. In the process flow according to some embodiments described below, this dielectric layer is preferably eliminated while still maintaining a good insulation for the device.
  • the absorber 702 A metamaterial absorber is designed for the absorber 702 in some embodiments.
  • the metamaterial can be engineered to absorb light with specific wavelength only, and have a 100% absorption rate in the peak wavelength. In this way, the absorber 702 can preferably only respond to the interested wavelength.
  • the cavity 704 During the fabrication of the thermopile device in some embodiments, the absorber 702 and the thermocouples 700 need to be released. By suspending the absorber 702 and thermocouples 700, the dominated heat loss mechanism (thermal conduction through solid) is preferably removed. Using a conventional process understood in the art, the release step can be done by an isotropic etch controlled by time. After the etching, the absorber 702 and the thermocouples 700 are fully released, but the side effect is the cold junction of the thermocouples 700 might over release and not closely connected to the substrate. The temperature gradient then is not fully dropped on the thermocouples 700 and the output voltage would decrease. Adding the cavity 704 preferably ensures the cold junction connected to the substrate as design and increases the tolerance of the release time. In full wafer fabrication, increasing the release time could preferably ensure all devices on the wafer are released.
  • the encapsulation 706 Because of the heat on the absorber 702 lost via the conduction and convention of air, the performance of the devices could enhance by packaging the devices into vacuum environment.
  • the conventional vacuum packaging method understood in the art uses wafer to wafer bonding. It is an expensive method and the yield is not ideal.
  • a wafer level thin film encapsulation method preferably replaces the wafer to wafer bonding method. By encapsulating each device individually with a CMOS compatible process in some embodiments, the cost of the device can be reduced.
  • thermopile device 800 The cross-section of thermopile device 800 according to an example embodiment is shown in Fig. 8.
  • the bottom metal layer blocks light from transmission.
  • the top metamaterial and middle dielectric layers can be engineered to achieve specific values of permittivity and permeability to achieve impedance matching with the free space to obtain the absorption resonance.
  • the middle dielectric layer is also used to contain and confine the resonance and reduce energy loss.
  • the structures are designed for perfect absorption, i.e., perfect emission at a specific wavelength, preferably enabling high signal to noise ratio of the system at low power consumption.
  • thermopile device 800 The process flow of fabricating the thermopile device 800 is described below in Fig 9.
  • the process begins with a Si wafer 802.
  • a cavity 804 is first etched on the Si wafer 802 for 2 ⁇ .
  • a S1O2 layer 806 (more than 2 ⁇ ) is deposited on the whole wafer 802 and then the S1O2 806 is planarized by chemical mechanical polishing (CMP), as shown in Fig. 9a).
  • CMP chemical mechanical polishing
  • a Polysilicon layer 808 is deposited and then doped as N-type and P-type Polysilicon 809, 811, the area designed for electrical contact are further heavily doped to achieve a low contact resistance with metal, as shown in Fig. 9b).
  • the Polysilicon layer 808 is etched with S1O2 hard mask 813 to form the N-type and P-type arms 810, 815.
  • the Polysilicon arms 810, 815 are only located within the perimeter of the Si0 2 cavity 804 without any physical connection with the Si substrate 802, as shown in Fig 9c).
  • AI2O3 812 is deposited, this layer 812 serves as the insulation layer for the metal interconnection later.
  • the AI2O3 layer 812 is also the physical connection between the arms 810, 815 of thermocouples and Si substrate 802, as well as the arms 810, 815 and metamaterial absorber, forming a carrier 817 for the metamaterial absorber structure.
  • Vias 814 are opened on the AI2O3 layer 812 to allow electrical interconnection to form with the heavily doped Polysilicon 810, 815, as shown in Fig. 9d).
  • Metal (Mo) 816 is deposited and etched. This metal layer 816 works as the interconnection between Polysilicon arms 810, 815 and also is the bottom layer of the metamaterial absorber structure, see Fig. 9e).
  • Another layer of dielectric 818 and another layer of metal 820 is deposited and the metal layer 820 is etched to form the metamaterial pattern for the top layer of the metamaterial absorber structure, with a portion of the dielectric layer 818 forming the middle dielectric of the metamaterial absorber, as shown in Fig. 9f).
  • the AI2O3 818 is selectively removed above the Polysilicon arms 810, 815, and also forms the shape of the absorber 821, as shown in Fig. 9g).
  • a thick layer of S1O2 822 is deposited and planarized. The S1O2 822 is etched and the S1O2 822 is left above the device, as shown in Fig. 9h).
  • A1N 824 is deposited to seal the device, as shown in Fig. 9i). On the A1N layer 824, release holes 826 are etched. Vapor Hydrofluoric acid release is conducted to suspend the absorber 821 and arms 810, 815. The devices are again sealed with another layer of S1O2 828, as shown in Fig. 9j). Electrical contact pads (not shown) are opened and formed outside the encapsulation
  • a metamaterial layer is advantageously included to provide selective (i.e. narrow bandpass) emission/absorption for specific wavelengths.
  • the metamaterial layer comprising a combination made of Mo-AIN-Mo used in the embodiments described above is additionally advantageous, promising low thermal stress and fast thermal response.
  • FIG 11 shows a flow chart 1100 illustrating a method for fabricating a micro electromechanical system (MEMS) die for a heater or thermopile, according to one embodiment.
  • MEMS micro electromechanical system
  • a support structure is provided.
  • one or more metamaterial elements are provided the support structure.
  • the support structure with the one or more metamaterial elements is suspended across a cavity.
  • a wafer level thin film encapsulation is provided for vacuum packaging of the MEMS die.
  • The may comprise forming the cavity by removal of a sacrificial material from a recess formed in a substrate made of a material different from the sacrificial material.
  • the support structure may be formed within the perimeter of the cavity and the method further comprises forming a physical connection between the substrate and the support structure across a peripheral gap between the support structure and the substrate.
  • the physical interconnection may comprise a metal interconnection to the support structure and an insulation layer for the metal interconnection.
  • Providing the wafer level thin film encapsulation may comprise using a complementary metal-oxide-semiconductor (CMOS) compatible process.
  • CMOS complementary metal-oxide-semiconductor
  • the MEMS die may be for the heater, and the one or more metamaterial elements may function as an emitter for one or more wavelengths.
  • Providing the supporting structure may comprise forming heating wire and support arm portions of the support structure, wherein the metamaterial elements may be formed on the heating wire portion.
  • the MEMS structure may be for the thermopile, and the one or more metamaterial elements may function as an absorber for one or more wavelengths.
  • Providing the supporting structure may comprise forming thermocouple and carrier portions of the support structure, wherein the metamaterial elements may be formed on the carrier portion.
  • the thermocouple portion may surround the carrier portion.
  • a micro electro-mechanical system (MEMS) die for a heater or thermopile comprising a support structure; one or more metamaterial elements on the support structure; the support structure with the one or more metamaterial elements across a cavity; and a wafer level thin film encapsulation for vacuum packaging of the MEMS die.
  • MEMS micro electro-mechanical system
  • the cavity may be formed by removal of a sacrificial material from a recess formed in a substrate made of a material different from the sacrificial material.
  • the support structure may be formed within the perimeter of the cavity and the MEMS die may further comprise forming a physical connection between the substrate and the support structure across a peripheral gap between the support structure and the substrate.
  • the physical interconnection may comprise a metal interconnection to the support structure and an insulation layer for the metal interconnection.
  • the wafer level thin film encapsulation may be formed using a complementary metal-oxide- semiconductor (CMOS) compatible process.
  • CMOS complementary metal-oxide- semiconductor
  • the MEMS die may be for the heater, and the one or more metamaterial elements may function as an emitter for one or more wavelengths.
  • the supporting structure may comprise heating wire and support arm portions, wherein the metamaterial elements may be formed on the heating wire portion.
  • the MEMS structure may be for the thermopile, and the one or more metamaterial elements function as an absorber for one or more wavelengths.
  • the supporting structure may comprise thermocouple and carrier portions, wherein the metamaterial elements may be formed on the carrier portion.
  • the thermocouple portion may surround the carrier portion.
  • Embodiments of the microheater device can have one or more of the following features and associated advantages: Dielectric-less supporting arms to reduce power consumption, eliminate the residual stress induced by the dielectric layer
  • Dielectric-less thermocouple which will increase output voltage and eliminate the residual stress induced by the dielectric layer in the released structure.
  • Metamaterial absorber to provide selective absorption for specific wavelength
  • Vacuum level encapsulation to enhance device performance and largely reduce the fabrication cost.
  • HVAC Heating, ventilation and air conditioning
  • DCV Demand-controlled ventilation
  • IAQ Indoor air quality
  • Computer-readable media in which such formatted data and/or instructions may be embodied include, but are not limited to, non-volatile storage media in various forms (e.g., optical, magnetic or semiconductor storage media) and carrier waves that may be used to transfer such formatted data and/or instructions through wireless, optical, or wired signaling media or any combination thereof.
  • Examples of transfers of such formatted data and/or instructions by carrier waves include, but are not limited to, transfers (uploads, downloads, e-mail, etc.) over the internet and/or other computer networks via one or more data transfer protocols (e.g., HTTP, FTP, SMTP, etc.).
  • data transfer protocols e.g., HTTP, FTP, SMTP, etc.
  • a processing entity e.g., one or more processors
  • PLDs programmable logic devices
  • FPGAs field programmable gate arrays
  • PAL programmable array logic
  • ASICs application specific integrated circuits
  • microcontrollers with memory such as electronically erasable programmable read only memory (EEPROM)
  • EEPROM electronically erasable programmable read only memory
  • embedded microprocessors firmware, software, etc.
  • aspects of the system may be embodied in microprocessors having software -based circuit emulation, discrete logic (sequential and combinatorial), custom devices, fuzzy (neural) logic, quantum devices, and hybrids of any of the above device types.
  • the underlying device technologies may be provided in a variety of component types, e.g., metal-oxide semiconductor field-effect transistor (MOSFET) technologies like complementary metal-oxide semiconductor (CMOS), bipolar technologies like emitter-coupled logic (ECL), polymer technologies (e.g., silicon-conjugated polymer and metal-conjugated polymer-metal structures), mixed analog and digital, etc.
  • MOSFET metal-oxide semiconductor field-effect transistor
  • CMOS complementary metal-oxide semiconductor
  • bipolar technologies like emitter-coupled logic (ECL)
  • polymer technologies e.g., silicon-conjugated polymer and metal-conjugated polymer-metal structures
  • mixed analog and digital etc.

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Abstract

L'invention concerne un capteur de gaz, un procédé de fabrication d'un capteur de gaz, un procédé de fabrication d'une puce de système micro-électromécanique (MEMS) d'un dispositif de chauffage ou d'une thermopile, et une puce de système micro-électromécanique (MEMS) d'un dispositif de chauffage ou d'une thermopile. Le capteur de gaz comprend une première puce de système micro-électromécanique (MEMS) comprenant une source de lumière ; une seconde puce MEMS comprenant un détecteur de lumière ; une chambre d'échantillon disposée dans un trajet optique entre la source de lumière et le détecteur de lumière ; un substrat de support, les première et seconde puces MEMS étant disposées sur le substrat de support dans une orientation verticale par rapport au support.
PCT/SG2017/050609 2016-12-09 2017-12-08 Structures mems de capteur de gaz et leurs procédés de fabrication WO2018106193A1 (fr)

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CN201780083524.3A CN110462377A (zh) 2016-12-09 2017-12-08 气体传感器mems结构及其制造方法

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