WO2018104170A3 - Bauteil mit einem strahlungsemittierenden optoelektronischen bauelement - Google Patents

Bauteil mit einem strahlungsemittierenden optoelektronischen bauelement Download PDF

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Publication number
WO2018104170A3
WO2018104170A3 PCT/EP2017/081182 EP2017081182W WO2018104170A3 WO 2018104170 A3 WO2018104170 A3 WO 2018104170A3 EP 2017081182 W EP2017081182 W EP 2017081182W WO 2018104170 A3 WO2018104170 A3 WO 2018104170A3
Authority
WO
WIPO (PCT)
Prior art keywords
radiation
support
optoelectronic component
emitting optoelectronic
component
Prior art date
Application number
PCT/EP2017/081182
Other languages
English (en)
French (fr)
Other versions
WO2018104170A2 (de
Inventor
Alexander Linkov
Frank Singer
Matthias Bruckschloegl
Siegfried Herrmann
Thomas Schwarz
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of WO2018104170A2 publication Critical patent/WO2018104170A2/de
Publication of WO2018104170A3 publication Critical patent/WO2018104170A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Die Erfindung betrifft ein Bauteil (1) mit einem strahlungsemittierenden optoelektronischen Bauelement (2), wobei das Bauelement (2) mit einer Unterseite auf einer Oberseite (30) eines ersten Trägers (3) angeordnet ist, wobei der erste Träger (3) transparent für die Strahlung des Bauelementes (2) ist, wobei der erste Träger (3) mit einer Unterseite (31) auf einer Oberseite (13) eines zweiten Trägers (4) angeordnet ist, wobei der zweite Träger (4) zweite elektrische Kontakte (10, 11) aufweist, wobei die zweiten elektrischen Kontakte (10, 11) über elektrische Leitungen (16, 17) mit elektrischen Kontakten (14, 15) des Bauelementes (2) verbunden sind.
PCT/EP2017/081182 2016-12-06 2017-12-01 Bauteil mit einem strahlungsemittierenden optoelektronischen bauelement WO2018104170A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016123535.0 2016-12-06
DE102016123535.0A DE102016123535A1 (de) 2016-12-06 2016-12-06 Bauteil mit einem strahlungsemittierenden optoelektronischen Bauelement

Publications (2)

Publication Number Publication Date
WO2018104170A2 WO2018104170A2 (de) 2018-06-14
WO2018104170A3 true WO2018104170A3 (de) 2018-08-23

Family

ID=60813808

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/081182 WO2018104170A2 (de) 2016-12-06 2017-12-01 Bauteil mit einem strahlungsemittierenden optoelektronischen bauelement

Country Status (2)

Country Link
DE (1) DE102016123535A1 (de)
WO (1) WO2018104170A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018124121A1 (de) * 2018-09-28 2020-04-02 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung und Verbindungselement

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005025933A2 (en) * 2003-09-08 2005-03-24 Schefenacker Vision Systems Usa Inc. Led light source
JP2007059781A (ja) * 2005-08-26 2007-03-08 Toyoda Gosei Co Ltd サブマウント付発光素子および発光装置
WO2010075599A1 (de) * 2008-12-16 2010-07-08 D. Swarovski & Co. Transparenter körper mit unsichtbarer led-lichtquelle
US20110248304A1 (en) * 2010-04-07 2011-10-13 Nichia Corporation Light emitting device
EP2730684A1 (de) * 2011-07-04 2014-05-14 Fujifilm Corporation Reflektierendes isolationssubstrat und herstellungsverfahren dafür
US20140353676A1 (en) * 2013-05-31 2014-12-04 Disco Corporation Light emitting chip
EP2858132A1 (de) * 2012-05-31 2015-04-08 Panasonic Intellectual Property Management Co., Ltd. Led-modul
US20160099391A1 (en) * 2014-10-02 2016-04-07 Samsung Electronics Co., Ltd. Light emitting device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013116623A1 (en) * 2012-02-02 2013-08-08 The Procter & Gamble Company Bidirectional light sheet
US9166116B2 (en) * 2012-05-29 2015-10-20 Formosa Epitaxy Incorporation Light emitting device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005025933A2 (en) * 2003-09-08 2005-03-24 Schefenacker Vision Systems Usa Inc. Led light source
JP2007059781A (ja) * 2005-08-26 2007-03-08 Toyoda Gosei Co Ltd サブマウント付発光素子および発光装置
WO2010075599A1 (de) * 2008-12-16 2010-07-08 D. Swarovski & Co. Transparenter körper mit unsichtbarer led-lichtquelle
US20110248304A1 (en) * 2010-04-07 2011-10-13 Nichia Corporation Light emitting device
EP2730684A1 (de) * 2011-07-04 2014-05-14 Fujifilm Corporation Reflektierendes isolationssubstrat und herstellungsverfahren dafür
EP2858132A1 (de) * 2012-05-31 2015-04-08 Panasonic Intellectual Property Management Co., Ltd. Led-modul
US20140353676A1 (en) * 2013-05-31 2014-12-04 Disco Corporation Light emitting chip
US20160099391A1 (en) * 2014-10-02 2016-04-07 Samsung Electronics Co., Ltd. Light emitting device

Also Published As

Publication number Publication date
DE102016123535A1 (de) 2018-06-07
WO2018104170A2 (de) 2018-06-14

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