WO2018101423A1 - Member contacting chemical liquid for semiconductor product manufacture when chemical liquid is caused to flow - Google Patents

Abstract

The purpose of the present invention is to provide: a member which contacts liquid, gas, or powder insulating material when the insulating material is caused to flow and which is less susceptible to dielectric breakdown; a distribution mechanism, tank, and device using a sheet for lining the member or the interior of a pipe or a tank containing the member; a storage tank wherein a portion of the surface of a liquid-contact portion thereof comprises the member; a storage method for storing organic solvent, ultrapure water, and hydrogen peroxide water, particularly organic solvent, ultrapure water, and hydrogen peroxide water used in semiconductor product manufacture, using the storage tanks; and a method for manufacturing a semiconductor product using the organic solvent stored in the storage tank. A resin composition containing a matrix resin and an electro-conductive material dispersed in the matrix resin is used for the member which contacts liquid, gas, or powder insulating material when the insulating material is caused to flow.

Description

Components that come into contact with chemicals when flowing chemicals for manufacturing semiconductor products

The present invention relates to a flow mechanism, a tank, and a member using a member that contacts the insulating substance and a sheet for lining the member or the pipe or the tank including the member when the insulating substance flows. An apparatus, a storage tank in which a part of the surface of the wetted part is made of the above-mentioned member, an organic solvent or ultrapure water, hydrogen peroxide water, particularly an organic solvent or ultrapure water for semiconductor manufacturing, and a peroxide used in the storage tank. The present invention relates to a hydrogen water storage method and a semiconductor product manufacturing method using an organic solvent, ultrapure water, or hydrogen peroxide water stored in the storage tank.

Conventionally, an insulating fluid material typified by an organic solvent, ultrapure water, or hydrogen peroxide solution is stored in a storage tank, and then a chemical reaction is performed via piping using air, gas, a pump, or the like. It is supplied to various devices such as devices, cleaning devices and filling / packaging facilities.

In such a device, lining should be applied to the part in contact with the insulating fluid material in the device for the purpose of preventing the corrosion and wear of the device and preventing the elution and adhesion of impurities to the fluid material. There are many.

Especially in the manufacture of semiconductor devices, it is required to use chemicals with extremely high purity. For this reason, tanks and pipes for storing chemicals for manufacturing semiconductor devices are lined with resin materials that have excellent durability against chemicals, organic solvents, etc. in order to suppress the elution of impure parts such as metals. There are many cases.

As a tank for storing a chemical solution used for manufacturing a semiconductor device, for example, in Patent Document 1, a lining sheet material made of a fluororesin is provided on the liquid contact side on the inner surface of a metal can body, and on the back side of the lining sheet material. It has been proposed to construct a two-layer lining by providing a general-purpose resin lining material. Patent Document 1 also proposes the use of a carbon cloth thermally welded to a lining sheet made of a fluororesin.

Japanese Patent Laid-Open No. 8-80996

In the lining material described in Patent Document 1, a general-purpose resin lining material is provided so that a metal does not elute from a metal can body into a chemical solution even when a pinhole or a crack occurs in a lining sheet material made of a fluororesin. Yes.
However, in the tank lined as described in Patent Document 1, when pinholes or cracks occur in the lining sheet material made of fluororesin, it is possible to prevent elution of metal into the chemical solution in the short term. In the long term, there is a high possibility of inducing metal elution.
This is because the general-purpose resin generally has low resistance to chemicals. The chemical solution penetrates into the lining sheet material made of general-purpose resin from the location where the pinhole or crack occurs, and as a result, the lining sheet material made of general-purpose resin is invaded by the chemical solution.

For this reason, it is required for the lining sheet material to reduce fundamental pinholes and cracks.
Here, when the chemical solution is an insulating fluid material such as an organic solvent, ultrapure water, or hydrogen peroxide solution, the main causes of the occurrence of pinholes and cracks are the lining material and the fluidity that flows. Examples include electrostatic breakdown due to accumulation of static electricity caused by contact with a material.
The electrostatic breakdown of the lining material not only causes the elution of impurities into the chemical solution, but also has a problem in that it causes peeling of the lining material when the degree of the breakdown is severe.

Also, the lining material is required to be less likely to generate foreign matter with respect to the fluid material that the lining contacts.

The present invention has been made in view of the above problems, and is a member that comes into contact with an insulating substance when flowing the insulating substance that is a liquid, gas, or granular material, and causes dielectric breakdown. A flow mechanism, a tank, and a device using a member that is difficult to generate foreign matter with respect to an insulating substance, and a sheet for lining the member or a pipe or a tank including the member. A storage tank in which a part of the surface is made of the above-described member, and an organic solvent or ultrapure water and hydrogen peroxide solution using the storage tank, particularly an organic solvent or ultrapure water and hydrogen peroxide solution storage method for semiconductor production Another object of the present invention is to provide a semiconductor product manufacturing method using an organic solvent, ultrapure water, or hydrogen peroxide solution stored in the storage tank.

The inventors of the present invention provide a resin composition containing a matrix resin and a conductive material dispersed in the matrix resin, when an insulating substance that is a liquid, a gas, or a granular material is flowed. It has been found that the above-mentioned problems can be solved by using it as a member in contact with a substance, and the present invention has been completed. Specifically, the present invention provides the following.

(1) A member that comes into contact with an insulating substance when flowing the insulating substance that is a liquid, gas, or powder,
A member comprising a resin composition comprising a matrix resin and a conductive material dispersed in the matrix resin.

(2) The member according to (1), wherein the conductive material is a material that does not include a metal or a metal compound.

(3) The member according to (1) or (2), wherein the conductive material includes a nanocarbon material.

(4) The member according to (3), wherein the nanocarbon material is a carbon nanotube.

(5) The member according to any one of (1) to (4), wherein the tensile strength of the matrix resin is 12.5 MPa or more and the tensile elongation of the matrix resin is 200% or more.

(6) The member according to any one of (1) to (5), wherein the matrix resin is a fluororesin.

(7) The member according to (6), wherein the conductive material is a carbon nanotube.

(8) The member according to any one of (1) to (7), wherein the content of the conductive material in the resin composition is 20% by mass or less.

(9) A distribution mechanism for distributing an insulating substance that is a liquid, gas, or granular material, wherein at least a part of the surface that contacts the insulating substance is any one of (1) to (8) The distribution mechanism which consists of a member of description.

(10) A tank for storing or stirring an insulating substance that is a liquid, gas, or granular material, wherein at least a part of the surface in contact with the insulating substance is any one of (1) to (8) The tank which consists of a member as described in any one.

(11) A device comprising at least one of the distribution mechanism according to (9) and the tank according to (10).

(12) A sheet for lining the inside of a pipe or a tank including the member according to any one of (1) to (8).

(13) A pipe or tank lined with the sheet according to (12).

(14) A method of circulating, stirring, or storing an insulating substance that is a liquid, gas, or granular material using the pipe or tank according to (13).

(15) A storage tank for storing an insulating liquid comprising a tank body, a pit, and a drip pipe inserted into the tank body,
A pit is placed inside the tank body,
The dripping pipe is arranged so that one end of the dripping pipe is positioned close to the opening provided in the pit,
A storage tank in which at least one surface selected from a tank body, a pit, and a dripping pipe is in contact with an insulating liquid and is made of the member according to any one of (1) to (8).

(16) The storage tank according to (15), wherein the surface of the pit that comes into contact with the insulating liquid is composed of the member according to any one of (1) to (8).

(17) The storage tank according to (15) or (16), wherein the member is a member according to (7).

(18) The storage tank according to any one of (15) to (17), wherein the insulating liquid is an organic solvent.

(19) The storage tank according to any one of (15) to (17), wherein the insulating liquid is an organic solvent for manufacturing a semiconductor product.

(20) An organic solvent storage method in which the organic solvent is stored in the storage tank described in (18).

(21) A method of storing an organic solvent for manufacturing a semiconductor product, wherein the organic solvent for manufacturing a semiconductor product is stored in the storage tank according to (19).

(22) A method for manufacturing a semiconductor product using the organic solvent stored by the method according to (21).

According to the present invention, when an insulating material that is a liquid, gas, or granular material is flowed, the member is in contact with the insulating material, hardly causes dielectric breakdown, and has a foreign object with respect to the insulating material. And a part of the surface of the wetted part is the above-mentioned member using a member that is difficult to generate, and a sheet for lining the member or the pipe or tank containing the member. A storage tank comprising: an organic solvent or ultrapure water that uses the storage tank; a hydrogen peroxide solution; in particular, an organic solvent or ultrapure water for manufacturing semiconductors; a hydrogen peroxide solution storage method; and an organic solution stored in the storage tank. It is possible to provide a semiconductor product manufacturing method using a solvent, ultrapure water, or hydrogen peroxide solution.

It is a figure which shows typically the cross section of the storage tank which stores an insulating liquid.

≪Members≫
The member described below is a member that comes into contact with the insulating substance when the insulating substance that is a liquid, gas, or granular material is flowed.
For such a member, static electricity is generated when it comes into contact with the flowing insulating material, and dielectric breakdown is likely to occur due to accumulation of the generated static electricity.
However, in a member including a predetermined component described later, the occurrence of dielectric breakdown due to contact with the flowing insulating material is suppressed.

The member is made of a resin composition containing a matrix resin and a conductive material dispersed in the matrix resin.

<Insulating material>
As described above, the member is a member that comes into contact with the insulating substance when flowing the insulating substance that is a liquid, gas, or powder.
Here, the insulating substance for the liquid or granular material is not particularly limited as long as it is a substance generally recognized as an insulating substance. Typically, the insulating liquid or granular material is preferably made of a material having a volume resistivity of 10 ⁷ Ω · cm or more, more preferably 10 ¹⁰ Ω · cm or more.
The gas is usually an insulator. This is because, with respect to gas, since molecules constituting the gas do not exist in close proximity, it is difficult to move free electrons or the like in the gas.

Note that the insulating substance may include two or more selected from liquid, gas, and powder. For example, the insulating liquid may include an insulating gas bubble, the insulating liquid may include an insulating powder, and the insulating gas may be an insulating liquid droplet. Or, it may contain an insulating fine powder.

Examples of the insulating liquid typically include ultrapure water, hydrogen peroxide solution, organic solvent, silicone oil, and the like.
Examples of the insulating gas include dry air, hydrogen, nitrogen, oxygen, carbon dioxide, helium, ethylene, acetylene, and various gases used as fuel.
Examples of insulating powders include organic chemical powders, resin pellets, glass fibers, glass powders, ceramic powders, grains such as grains and wheat flour, animal feeds, polysaccharides such as starch, sucrose, etc. And low molecular weight saccharides, wood flour and the like.
Note that the insulating material is not limited to the above specific example.

The insulating substance is particularly preferably a chemical solution for manufacturing semiconductor products. Such a chemical solution is typically ultrapure water, hydrogen peroxide solution, or an organic solvent. Specific examples of the organic solvent used for manufacturing the semiconductor product will be described later in detail.

<Conductive material>
The conductive material is not particularly limited as long as it is a material generally recognized as having conductivity. The conductive material may be an organic material or an inorganic material.
By dispersing the conductive material in the matrix resin, a resin composition giving a member having a low volume resistivity can be obtained.
The volume resistivity of a member made of a resin composition containing a matrix resin and a conductive material is typically preferably 10 ⁷ Ω · cm or less, more preferably 10 ⁶ Ω · cm or less, and more preferably 10 ⁴ Ω · cm. The following is more preferable, 10 ³ Ω · cm or less is even more preferable, and 10 ² Ω · cm or less is particularly preferable. Although the minimum of the volume resistivity of a member is not specifically limited, For example, it is more than 0 ohm * cm and may be more than 10 ohm * cm.

As the inorganic material, for example, metal powder or metal fiber can be used.
As the metal powder, for example, metal fine powder produced by an atomizing method and having an average particle diameter of 100 μm or less, preferably 50 μm or less is preferable.
As the metal fibers, metal nanofiber materials represented by silver nanowires and the like are preferable.
For example, the fiber diameter of the metal nanowire is preferably 200 nm or less, and more preferably 10 to 100 nm. The fiber length of the metal nanowire is preferably 5 to 100 μm, more preferably 10 to 50 μm.

However, depending on the type of insulating material that comes into contact with the member, it may be necessary to avoid elution or adhesion of metal to the insulating material. Typically, when the insulating material is an organic solvent for manufacturing semiconductor products, ultrapure water, or hydrogen peroxide, it is necessary to avoid elution of the metal into the organic solvent, ultrapure water, or hydrogen peroxide. is there.
For this reason, it is preferable that an insulating material is a material which does not contain a metal or a metal compound.

In addition, as the inorganic material, a conductive carbon material is also preferable. Some carbon materials contain a small amount of organic groups, but the carbon material that does not contain organic groups in the main skeleton is described in this specification. In the book, it is described as an inorganic material.
Examples of the carbon material include carbon black, carbon fiber, graphite, and carbon nanomaterial.

Among carbon materials, it is easy to lower the volume resistance value of a member to a desired level with a small amount of use, and since it contains almost no metal, it is difficult to elute and adhere metal to insulating materials. Material is preferred.
The nanocarbon material is preferably at least one selected from the group consisting of carbon nanotubes, carbon nanohorns, graphene, nanographites, fullerenes, and carbon nanocoils. Among these, carbon nanotubes are preferable because they are easily available and are not easily detached from the surface of the member. The carbon nanotube may be a multi-wall carbon nanotube or a single-wall carbon nanotube.
The short diameter (fiber diameter) of the carbon nanotube is not particularly limited, but is preferably 1 to 50 nm, more preferably 3 to 30 nm, and particularly preferably 5 to 20 nm. Examples of the major axis of the carbon nanotube include 5 nm to 10 μm, 7 nm to 5 μm, and 10 nm to 1 μm.
The carbon nanotube may be in the form of a fiber having a fiber length of, for example, about 100 to 1000 μm, preferably 150 to 600 μm, or 200 to 500 μm.

As the organic material, for example, a conductive polymer material can be used. When a polymer material is used as the conductive material, a resin composition having a sea-island structure in which the matrix resin is a sea component and the conductive polymer material is an island component is used as a member material.

The content of the conductive material in the resin composition used as a member is not particularly limited as long as the object of the present invention is not impaired.
The content of the conductive material in the resin composition is 20 mass% or less, 10 mass% or less, 5 mass% or less, 3 mass% or less, 2 mass% or less, 1 mass% or less, 0.7 mass% or less, And 0.5 mass% or less is preferable. From the viewpoint of suppressing the dropping of the conductive material into a fluid insulating substance such as a chemical for manufacturing a semiconductor product, the smaller the content of the conductive material is, the more preferable.
The lower limit of the content of the conductive material in the resin composition is not particularly limited as long as a member having the desired performance is obtained. The lower limit of the content is, for example, preferably 0.01% by mass, more preferably 0.03% by mass, and particularly preferably 0.05% by mass from the viewpoint that the volume resistivity of the member is sufficiently low.

<Matrix resin>
The matrix resin has a function of protecting the article including the member from contact with the flowing insulating substance in the member.

The matrix resin may be a thermoplastic resin or a curable resin. The curable resin is not particularly limited as long as it is a cured product of a curable compound. The method for curing the curable compound may be thermal curing or photocuring.
The matrix resin may be a mixture (polymer alloy) of two or more kinds of resins.

The tensile strength of the matrix resin is preferably 12.5 MPa or more and preferably 14.5 MPa or more from the viewpoint of the strength of the member. Further, the tensile elongation of the matrix resin is preferably 200% or more, and more preferably 250% or more. These values are values measured according to ASTM D638.

Thermoplastic resins include polyamide resin (nylon resin), polyester resin (polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene naphthalate resin, etc.), polycarbonate resin, polyphenylene ether resin, polyarylene sulfide resin, polyether ether ketone resin. , Liquid crystal polymer, fluororesin, polysulfone resin, polyether sulfone resin, polyarylate resin, polyamideimide resin, polyetherimide resin, and thermoplastic polyimide resin.

Examples of the curable resin include phenol resin, urea resin, melamine resin, unsaturated polyester, epoxy resin, diallyl phthalate resin, silicone resin, polyimide resin, and a cured product of acrylic monomer.

When the matrix resin is a cured product of a curable compound, the matrix resin is usually formed by heating or exposing a composition containing a curable compound and a curing agent or a photopolymerization initiator.
For this reason, when the matrix resin is a curable compound, an unreacted curing agent, a photopolymerization initiator, or the like may be eluted into the insulating substance.
Moreover, about curable resin, the hardened | cured material is often lacking in flexibility, and construction using a member containing a conductive substance and processing may be difficult.
From this point, the matrix resin is preferably a thermoplastic resin rather than a curable resin.

Of the matrix resins described above, fluororesins are preferred because they have various excellent properties such as chemical resistance, solvent resistance, mechanical properties such as tensile strength, and lubricity.
Examples of the fluororesin include PTFE (polytetrafluoroethylene resin), modified PTFE (polytetrafluoroethylene resin modified with 1-perfluoroalkoxy-1,2,2-trifluoroethylene), PFA (tetrafluoroethylene and 1). -Copolymer of perfluoroalkoxy-1,2,2-trifluoroethylene), FEP (copolymer of tetrafluoroethylene and hexafluoropropylene), ETFE (copolymer of tetrafluoroethylene and ethylene) , PCTFE (polychlorotrifluoroethylene resin), and PVdF (polyvinylidene fluoride resin).
Among these fluororesins, PTFE, modified PTFE, and PFA are preferable, and modified PTFE is more preferable in terms of heat resistance, chemical resistance, lubricity, electrical characteristics, and the like.

The member described above is a member that comes into contact with the chemical solution when flowing the chemical solution for manufacturing a semiconductor product,
A resin composition comprising a matrix resin and a conductive material dispersed in the matrix resin,
The matrix resin is a fluororesin,
The conductive material is a nanocarbon material,
The content of the conductive material in the resin composition is 1% by mass or less,
The volume resistivity of the member is less than 10 ⁶ Ω · cm;
When welding members by blowing hot air of 300 ° C or higher and melting a welding material made of a copolymer of tetrafluoroethylene and 1-perfluoroalkoxy-1,2,2-trifluoroethylene (PFA) Furthermore, a member that can be welded at a welding speed of 50 mm / min to 300 mm / min is preferable.
In the present specification, hereinafter, a member including the fluororesin and the nanocarbon material and exhibiting the above-described predetermined characteristics is referred to as a “conductive fluororesin member”.

When the matrix resin is a fluororesin, since the affinity between the fluororesin and the conductive material is poor, the conductive material tends to fall out of the matrix resin when the member is brought into contact with a chemical for manufacturing a semiconductor product.
However, when the nanocarbon material is used as the conductive material and the content of the conductive material in the resin composition is 1% by mass or less, while achieving the desired conductivity (low volume resistivity) for the member, It is possible to suppress the dropping of the conductive material from the matrix made of the fluororesin.

Moreover, when joining members about a member, it is calculated | required that joining by welding is applicable.
In this regard, when a conductive material is added to the matrix material, the heat conductivity of the member often becomes excessively high. In this case, since the heat applied to the material easily escapes, it is difficult to weld the members well.
On the other hand, the conductive fluororesin member can be welded at a welding speed of 50 mm / min or more and 300 mm / min or less when the member is welded by blowing hot air of 300 ° C. or higher and melting a welding material made of PFA. It is.
Here, “weldable” means that, when a place other than the joined part of the welded joined body is gripped, the joined body is not separated by peeling of the welded surface due to the weight of the welded member.
As a state after welding, it is preferable that no dislocation or float is observed between the welded surfaces.
In addition, the use of said member is not limited only to the use which needs welding.
Also, the use of PFA as a welding material has been described above. In the above description, when welding is performed by blowing hot air of 300 ° C. or higher, it is confirmed whether or not the member can be welded at the predetermined welding speed. For the sake of convenience, the use of PFA is only specified for convenience. For this reason, the material of the welding material used when welding said member is not limited to PFA.

When welding a conductive fluororesin member, for example, a plurality of surfaces of a single member may be welded or two or more members may be welded together. As a specific example in the case of welding between a plurality of surfaces of a single member, there is a case of welding a seam in a state where a single sheet-like member is rolled into a cylindrical shape.

The welding conditions for the conductive fluororesin member are not particularly limited as long as welding can be performed in a desired state.
The lower limit of the hot air temperature is 300 ° C. or higher, preferably 400 ° C. or higher, and more preferably 500 ° C. or higher because it is easy to perform strong welding while increasing the welding speed. The upper limit of the hot air temperature varies depending on the type and composition of the material included in the conductive fluororesin member, but is naturally determined within a range in which the conductive fluororesin member does not deform to an undesired degree during welding.
From the viewpoint of the safety of the welding operation and the reduction in the amount of energy consumed in the welding operation, the hot air temperature is preferably in the range of 300 ° C. or higher and 500 ° C. or lower or in the range of 300 ° C. or higher and 400 ° C. or lower.
If hot-air temperature is 300 degreeC or more, since a welding material is fully softened or fuse | melted normally, it can weld favorably.
The welding speed is preferably 50 mm / min or more and 400 mm / min or less, more preferably 100 mm / min or more and 300 mm / min or less, from the viewpoint that welding can be performed more firmly.
Moreover, from the point of the efficiency of welding work, 200 mm / min or more and 500 mm / min or less are preferable, and 300 mm / min or more and 500 mm / min or less are more preferable.

<Method for preparing resin composition>
The method for preparing the resin composition containing the matrix resin described above and the conductive material is not particularly limited as long as both methods can be mixed uniformly.
A preferred specific example of the method for preparing the resin composition will be described below.

When the matrix resin is a thermoplastic resin, the conductive resin is dispersed in the matrix resin by mixing the matrix resin and the conductive material by a general melt-kneading method using a single screw extruder or twin screw extruder. The obtained resin composition can be manufactured.
If the matrix resin exhibits thermoplasticity but melt processing is difficult due to problems such as melt viscosity, it is obtained after the matrix resin powder and the conductive material powder are uniformly mixed. The mixture may be compression molded, and then the compression molded product may be fired to obtain a resin composition.

When the matrix resin is soluble in a solvent, a resin composition in which a conductive material is dispersed in the matrix resin can be produced by the following method.
First, a dispersion liquid in which a conductive material is dispersed in an organic solvent solution of a matrix resin is prepared. A resin in which a conductive material is dispersed in a matrix resin by molding the obtained dispersion into a desired shape by a method such as coating or casting, and then removing the organic solvent by a method such as heating or decompression. A composition is obtained.

If the polymerization reaction is not hindered by the conductive material, the polymerization reaction may be performed in the presence of a predetermined amount of the conductive material to produce a resin composition in which the conductive material is dispersed in the matrix resin. Good.

When the matrix resin is a curable resin, a precursor composition obtained by mixing a curable compound, a conductive material, and, if necessary, a curing agent or a photopolymerization initiator and then preparing the precursor composition is obtained. A resin composition in which a conductive material is dispersed in a matrix resin can be produced by molding the composition into a desired shape and then curing the precursor composition by a method such as heating or exposure.

By applying the member made of the resin composition described above to a portion in contact with the fluid insulating material in various articles, accumulation of static electricity is suppressed, and dielectric breakdown of the member on the surface of the article is suppressed. The

≪Molded product≫
The member described above is preferably used in the form of a molded product composed only of the member. Such a molded article is preferably used in an application in which a chemical solution for manufacturing a semiconductor product is flowed when it is in contact with the chemical solution.
As the member, the above-mentioned conductive fluororesin member is preferable.
Specific examples of such molded products include connecting pipes, pipe end adapters, and gaskets.

A connecting pipe is used to connect between two pipes, between a pipe and a device, between two devices, etc., or used in the same way as a pipe by connecting two or more connecting pipes. To do.
The connecting pipe may be a straight pipe or a pipe bent into an arc shape, a substantially right angle shape, an S shape, or the like. Further, the connecting pipe may be a pipe having a branch such as a Y shape or a cross shape.
The cross-sectional shape of the connecting pipe is not particularly limited. The cross-sectional shape of the connecting pipe is usually circular, but may be a quadrangle such as a square or a rectangle, or a polygon such as a regular hexagon or a regular octagon.

A projection for fitting may be formed integrally with the pipe body at at least one end of the connecting pipe. The fitting convex portion is provided with a hole (cavity) communicating with the space inside the pipe body so that fluid can freely flow from one end of the connecting pipe to the other end.
Specific embodiments of the connecting pipe include a connecting pipe having a fitting convex portion at both ends, a connecting pipe having a fitting convex portion only at one end portion, and a fitting convex portion at both ends. There are no connecting pipes.

The projection for fitting is fitted into the opening of the end of the other connecting pipe where the projection for fitting is not formed. By doing so, two connection pipes are connected. In this case, it is preferable that the fitting convex portion is configured to be slightly larger than the opening at the end of the connecting pipe into which the convex portion is fitted. In this case, the connecting pipes are firmly coupled to each other by pushing the fitting convex portion provided in the connecting pipe into the opening at the end of the other connecting pipe by an external force.

In addition, a thread may be provided on the fitting convex portion, and a thread having a shape corresponding to the shape of the thread of the fitting convex portion may be provided in the opening of the end of the connecting pipe into which the convex portion is fitted. preferable.
By doing so, the convex part for fitting which has a thread can be screwed into opening of the edge part which has the thread of another connection pipe.

The pipe end adapter is a part that is attached to the end having a pipe opening. When a fluid insulating material is discharged from a pipe, static electricity is particularly likely to occur near the opening at the end of the pipe. However, if a pipe end adapter is attached to the end of the pipe, static electricity generated at the end of the pipe can be satisfactorily removed.

The shape of the pipe end adapter is not particularly limited, and is appropriately designed according to the shape of the end of the pipe to which the pipe end adapter is attached. For example, if the pipe is cylindrical, typically the shape of the pipe end adapter is slightly larger than the outer diameter of the pipe, and is equal to or slightly smaller than the inner diameter of the pipe. A ring shape having an inner diameter.

The pipe end adapter may be attached to the end of the pipe by being physically fitted by an external force. In this case, an annular groove having a width slightly narrower than the thickness of the end of the pipe is provided on the surface of the pipe end adapter that is in contact with the end of the pipe. By pushing the end of the pipe into the groove, the pipe end adapter is fixed to the end of the pipe.
Moreover, after providing a screw thread in a pipe end adapter and the edge part of piping, a pipe terminal adapter may be screwed in the edge part of piping.
Furthermore, the pipe end adapter may be fixed to the end of the pipe with an adhesive. When piping is a resin material, the edge part of piping and a pipe terminal adapter may be welded by methods, such as welding.

The gasket is typically a ring-shaped sheet that is used by being sandwiched between flanges provided in a pipe or a tank. The gasket is often referred to as “packing”, “packing sheet” or the like by those skilled in the art.
The shape, size, and the like of the gasket are not particularly limited, and are appropriately set according to the shape and size of the joint surface such as a pipe where the gasket is disposed. For example, the shape of the flange at the end of the pipe is determined by a standard such as JIS.

≪Composite molded product≫
As a molded article including the above-mentioned member, a composite molded article including a conductive portion made of the above-described member and a welded portion made of a thermoplastic resin or a thermoplastic resin composition not containing a conductive material is also preferably used. Can do.
The aforementioned member containing a conductive material is welded more than a thermoplastic resin or a thermoplastic resin composition that does not contain a conductive material, even though it can be welded due to the inclusion of the conductive material. The ease and the strength of the joint after welding may be slightly inferior.
However, since the composite molded article includes a welded portion made of a thermoplastic resin or a thermoplastic resin composition that does not contain a conductive material, the welded portion can be easily and firmly welded by welding the welded portion. They can be joined together.
Here, as a member, the above-mentioned electroconductive fluororesin member is preferable.

As a specific example of the composite molded article, at least at one end portion, a pipe in which the end portion and a portion in the vicinity of the end portion are welded portions and a portion other than the welded portion is a conductive portion can be mentioned. In the pipe which is a composite molded product, it is preferable that the end portion and a portion in the vicinity of the end portion are welded portions at all ends.
Such a tube may be a straight tube (straight tube), or may be a tube bent into an arc shape, a substantially right angle shape, an S shape, or the like. Further, such a tube may be a tube having a branch such as a Y shape or a cross shape.
The cross-sectional shape of such a tube is not particularly limited. The cross-sectional shape of the tube is usually circular, but may be a quadrangle such as a square or a rectangle, or a polygon such as a regular hexagon or a regular octagon.

A preferable specific example of such a tube is a linear tube having two open ends, and at the two ends, the end portion and a portion in the vicinity of the end portion are welded portions. A pipe having a conductive portion between the welded portions is exemplified. Such a linear tube is preferably a straight tube (straight tube) or a tube bent at a substantially right angle (so-called elbow pipe).
The pipe | tube demonstrated above is typically used by joining with other pipe | tubes by welding welding parts.

Another preferred example of the composite molded article is a nozzle liner that is used by being fitted into a tubular nozzle that protrudes toward the outside of the tank.
The shape of the nozzle liner is generally a shape in which a ring-shaped sheet is integrated with one end of a straight pipe having openings at both ends. The ring-shaped sheet is integrated with the straight pipe in a state where the opening of the ring-shaped sheet is aligned with the opening at the end of the straight pipe. Here, the inner diameter of the straight pipe and the opening diameter of the ring-shaped sheet are substantially equal.
In such a nozzle liner, typically, a welded portion is provided at an end portion of the straight pipe that is not in contact with the ring-shaped sheet, the vicinity of the end portion, and an outer edge portion of the ring-shaped sheet. A conductive portion is provided in the portion.
The manufacturing method of such a nozzle liner is not particularly limited. For example, the nozzle liner can be manufactured by expanding and deforming one end of a straight pipe having a welded portion at both ends and a conductive portion between the welded portions at both ends under heating.

Such a nozzle liner is provided with a welded portion provided on the outer edge portion of the ring-shaped sheet in the tank while being inserted from the inside of the tank into a tubular nozzle protruding toward the outside of the tank. Used in welded condition with lining material.
By attaching such a nozzle liner to the tank, static electricity generated on the inner surface of the nozzle liner can be satisfactorily removed when a fluid insulating material is discharged from the nozzle.

Still another preferable example of the composite molded article includes a sheet having a conductive portion and a welded portion. Such a sheet has a charge removal performance by including a conductive portion. Such a sheet is typically preferably used as a lining sheet described later.

For such a sheet, since joining by welding is easy, it is preferable that at least a part of the outer edge portion of the sheet is formed of a welded portion and a portion other than the welded portion is formed of a conductive portion. Moreover, as for the sheet | seat as a composite molded product, it is preferable that the whole outer edge part of a sheet | seat consists of a welding part, and parts other than a welding part consist of a electroconductive part. The conductive portion may be divided into two or more parts on the main surface of the sheet.

≪Sheet for lining≫
The member demonstrated above is used suitably as a material of the sheet | seat for lining the insides, such as piping and a tank.
About the sheet | seat, the whole may consist of the above-mentioned member (preferably above-mentioned electroconductive fluororesin member), and a part may consist of the above-mentioned member. As the member used for the sheet, the above-mentioned conductive fluororesin member is preferable.
When a part of the sheet is made of the above-described member, the sheet is the same as the sheet including the conductive portion and the weld portion described for the composite molded product.

When lining the inside of pipes and tanks using a lining sheet, fluid insulating materials (especially chemicals for manufacturing semiconductor products) in the pipes and tanks using CAE analysis and other methods. ) Where turbulent flow is likely to occur or where the flow rate of the flowable material is high, and only these points in the lining material are composed of the aforementioned members, preferably the aforementioned conductive fluororesin members. Is also preferable.
This is because static electricity is likely to occur at locations where turbulent flow is likely to occur or where the flow velocity is high. In this way, the cost of the lining can be reduced by configuring only the portion where static electricity is likely to be generated with the member including the conductive material.

The shape of the sheet may be a flat surface or a curved surface that matches the shape of the pipe or layer. Such a sheet is attached to the inner surface of the pipe or inside the tank, and is used as a lining material for elution of impurities from the pipe or the tank or protecting the pipe or the tank itself.

It should be noted that there may be a seam between a plurality of sheets during lining construction. In this case, a rod made of an easily meltable resin or a strip-shaped sheet is applied to the joint, and then the rod or the sheet is melted by heating to fill the joint. The rods and sheets used for filling the seam may also contain the above-described conductive material.

Since joining between the sheets is easy by welding, the lining includes a conductive portion made of the above-described member (preferably, the above-mentioned conductive fluororesin member) and a thermoplastic resin containing no conductive material, or heat. It is preferable to use a lining sheet that includes a welded portion made of a plastic resin composition, and at least a part of the outer edge portion is a welded portion.
When such a sheet is used, the welded portions of the sheet can be easily and firmly joined, and as a result, the lining operation is easy.

The thickness of the sheet is not particularly limited as long as it does not impair the object of the present invention. The thickness of the sheet is typically preferably 0.5 to 50 mm, more preferably 1.0 to 6.0 mm. More preferably, it is 0 to 3.0 mm.

Moreover, the laminated body which contains at least the layer which consists of said member can also be used suitably as a sheet | seat for lining.
Examples of suitable laminates include a laminated sheet comprising a layer made of the above-mentioned member as a lower layer and a resin layer not containing a conductive material as an upper layer, and a layer made of the above-mentioned member as an intermediate layer, and having conductivity. A laminated sheet provided with a resin layer containing no material as an upper layer and a lower layer may be mentioned.
As a preferable material of the resin layer not including the conductive material, the same material as that of the matrix resin described above can be used.

If the surface in contact with the insulating substance is a resin layer that does not contain a conductive material, it is possible to prevent the conductive material from being mixed into the insulating material due to the dropping of the conductive material. On the other hand, if there is a layer made of the above-mentioned member in the lower layer or intermediate layer, even if a dielectric breakdown occurs on the surface of the laminated sheet that contacts the insulating material, a dielectric breakdown occurs in the layer made of the above-mentioned member. Since it is difficult, it is hard to produce the defect which penetrates a lamination sheet.

When a pipe or tank lined with a sheet as described above is used to circulate, agitate, or store an insulating substance that is a liquid, gas, or granular material, dielectric breakdown in the inner lining of the pipe or tank Can be remarkably suppressed.

≪Distribution mechanism≫
The distribution mechanism is a distribution mechanism that distributes an insulating substance that is a liquid, gas, or granular material. In such a distribution mechanism, at least a part of the surface in contact with the insulating substance is made of the above-described member. In particular, it is preferable that the insulating substance is a distribution mechanism for distributing a chemical for manufacturing a semiconductor product, and the above-described member is a conductive fluororesin member.

The distribution mechanism is not particularly limited as long as the fluid insulating substance can be moved.
A typical example of the flow mechanism is typically a fluid material transport device including a pipe and a pump, blower, or suction device. Other specific examples include screw conveyors and bucket conveyors.
The distribution mechanism also includes piping, chutes and the like for dropping the fluid material from a high place to a low place.
When the insulating substance is a chemical solution for manufacturing a semiconductor product, the distribution mechanism typically includes a pipe and a pump.

As a specific example of the distribution mechanism,
A supply system for supplying a semiconductor substrate, a semiconductor substrate being processed, or a semiconductor product, etc. for the purpose of processing and cleaning, etc.
Refrigerant and heat medium circulation system in chemical reaction device, refrigeration device, refrigeration device, air conditioner, etc.
A heating or cooling system for a flowable material using a heat exchanger, a supply system for supplying the flowable material as a reaction reagent or solvent to a chemical reaction apparatus,
A supply system for supplying the flowable material from the flowable material storage tank to the dispensing device in order to divide and pack the flowable material;
A supply system for supplying the flowable material stored in the storage tank into the storage tank;
A supply system for supplying an organic solvent to a semiconductor manufacturing apparatus for the purpose of supplying oil from a storage tank of oil such as gasoline and light oil to a fuel tank of an automobile, a gasoline station, and cleaning;
Etc.

In the above distribution mechanism, at least a part of the inside of the piping, preferably the entire surface, is preferably composed of the above-described members. More preferably, the entire inside of the pipe is lined with a sheet made of the aforementioned member.

Also, it is preferable that the surface of the portion of the pump that comes into contact with the fluid material is also composed of the aforementioned members. The kind of pump is not specifically limited, A piston pump, a plunger pump, a diaphragm pump, a gear pump, a vane pump, a screw pump, etc. are mentioned.

In the various pumps described above, it is preferable that at least a surface of the casing that contacts the fluid material is constituted by the above-described member.
In the pump, the parts to which the above-described members are applied are not particularly limited, and are appropriately selected according to the type of the pump. For example, the surfaces of the piston in the piston pump, the plunger in the plunger pump, the diaphragm in the diaphragm pump, the gear in the gear pump, the blade in the vane pump, the screw in the screw pump, etc. are constituted by the aforementioned members. preferable.
When surfaces such as bolts, nuts, and screws that fasten components constituting the pump come into contact with the insulating material, these surfaces may be formed using the above-described members.
Further, these pump components may be entirely constituted by the above-described members as long as they are not damaged during the transfer of the flowable material.

When the distribution mechanism is a screw conveyor or a bucket conveyor, the surface of the screw and the surface of the bucket are constituted by the above-described members. In addition, as long as the damage by the transfer of material does not arise, you may comprise the whole screw and the whole bucket with the above-mentioned material.

≪Tank≫
A tank is a tank which stores or stirs the insulating substance which is a liquid, gas, or a granular material. In such a layer, at least a part of the surface in contact with the insulating substance is made of the aforementioned member.
The tank is typically a storage tank or a stirring tank. A typical example of the stirring tank is a reaction tank (reactor).
The storage tank for storing the insulating liquid will be described later in more detail.

(Storage tank)
Examples of storage tanks for storing insulating materials include tanks and cylinders for storing organic solvents, ultrapure water, hydrogen peroxide water, and gas. Moreover, as a storage tank which stores a granular material, the silo etc. which store a feed are mentioned, for example.
These storage tanks may be provided with a valve for extracting the stored insulating material at any location of the storage tank.

In the above-mentioned storage tank, preferably at least a part, preferably the entire surface, of the inner surface of the storage tank body is composed of the aforementioned members. More preferably, the entire inner surface of the storage tank is lined with a sheet made of the aforementioned member.
Further, it is preferable that the insulating substance is a distribution mechanism for distributing a chemical for manufacturing a semiconductor product, and the sheet member used for the lining is a conductive fluororesin member.

Further, it is also preferable that the inside of the above-described valve and the inside of the pipe between the storage tank and the valve are composed of the above-described members.

The type of valve is not particularly limited. Specific examples of the valve include a gate valve, a globe valve, a ball valve, a needle valve, a butterfly valve, and a piston valve.
Regarding these valves, it is preferable to form the surfaces of the flow path in the valve, packing, disc (disk (valve element)), stem (valve rod), piston and the like using the aforementioned members.

When the surfaces of bolts, nuts, screws, etc. that fasten parts constituting the valve come into contact with the insulating material, these surfaces may be formed using the aforementioned members.

For example, the packing, disk, piston, bolt, nut, screw, etc. may be entirely formed using the aforementioned members.
Further, when the valve size is small, or when excessive pressure is not applied to the valve, the entire valve body (body) may be formed using the above-described members.

(Stirring tank)
As a tank which stirs an insulating substance, if it is a stirring tank provided with a stirring function, it will not specifically limit. Typical examples of the stirring tank include a so-called reaction tank (reactor) and a powder mixing apparatus. Stirring is usually performed using a stirring blade or a screw.
In addition, the insulating material extracted from at least one location in the tank is circulated back into the tank from at least one location in the tank, thereby stirring the insulating material without using a stirring device such as a stirring blade. It may be a tank.

The surface that comes into contact with the insulating material includes the inner surface of the tank body, the surface of the baffle plate provided inside the tank body, the surface of the stirring blade, the surface of the shaft that supports the stirring blade, and the coil for circulating the heat medium and refrigerant. The inner surface or outer surface of the tube, the surface of a sealed tube for holding a temperature sensor such as a thermocouple, the inner surface of the dropping tube for supplying gas or liquid into the tank, or the outer surface.
In addition, the tank does not necessarily need to be equipped with said stirring blade, a shaft, a coil, a sealed tube, a dropping tube, etc.

Moreover, the stirring tank may be provided with a valve for extracting the insulating substance stirred in the tank from the tank. Such a valve is usually provided at or near the bottom of the tank. About the kind of valve | bulb etc., it is as having mentioned above about the storage tank.

When the size of the tank is small, a coil for circulating a heat medium or a refrigerant, a sealed tube for holding a temperature sensor such as a thermocouple, and a drip tube are formed entirely using the above-described members. May be.

≪Apparatus equipped with at least one of distribution mechanism and tank≫
An apparatus including at least one of the above-described distribution mechanism and tank is suitably used for various purposes because it is lined with a member having excellent durability that hardly causes dielectric breakdown.
Moreover, when at least one part of lining consists of the above-mentioned electroconductive fluororesin member, favorable suppression of the dielectric breakdown by low resistance and suppression of the detachment | leave from the member of nanocarbon material can be made compatible.

Such devices include, for example, chemical plants for manufacturing various chemical products, packaging plants for packaging and packaging fluid insulating materials, air conditioners, refrigeration devices and freezing devices, including refrigerant circulation devices, flow Manufacturing equipment for various electrical and electronic parts, semiconductor devices, etc., equipped with heat exchangers that heat or cool by circulating a conductive material inside, and devices that supply organic solvents, ultrapure water or hydrogen peroxide water for the purpose of cleaning, etc. Is mentioned.

≪Storage tank for storing insulating liquid≫
Hereinafter, the preferable aspect of the storage tank which stores an insulating liquid is demonstrated, referring FIG. FIG. 1 is a diagram schematically showing a cross section of a storage tank.
The storage tank 10 includes a tank body 1, a pit 2, and a dropping pipe 3 inserted into the tank body.
The pit 2 is disposed inside the tank body 1.
The dripping pipe 3 is arranged so that one end of the dripping pipe 3 is located in the vicinity of the opening provided in the pit 2. For this reason, the pit 2 is normally provided on the bottom side of the tank body 1.
That is, the storage tank 10 of the aspect shown by FIG. 1 is normally installed so that the pit 2 may be located in the side near the ground surface.
The pit 2 rectifies the insulating liquid sucked or discharged from the end of the dripping pipe 3.

And at least one part of the surface which contacts the at least 1 insulating liquid selected from the tank main body 1, the pit 2, and the dripping pipe | tube 3 is comprised by the above-mentioned member. Here, the insulating liquid is preferably a chemical for manufacturing a semiconductor product.
When the insulating liquid is sucked or discharged at the end of the dripping pipe 3, the flow of the insulating liquid is so strong that static electricity is likely to be generated and accumulated. It is preferable to be comprised with a member. The pit 2 may be a composite molded product having a bottom portion made of a conductive portion and another portion made of a welded portion. The bottom portion of the pit 2 is always in contact with the insulating liquid, but if the bottom portion of the pit 2 is a conductive portion, static electricity generated by the contact between the pit 2 and the insulating liquid can be satisfactorily removed.

At least one member selected from the tank body 1, the pit 2, and the dripping pipe 3 that constitutes a surface in contact with the insulating liquid has excellent durability against the insulating liquid and particularly suppresses dielectric breakdown. Since it is easy, the member which consists of a resin composition containing a fluororesin and a carbon nanotube is preferable.

The hose 4 and piping (not shown) are connected to the dripping pipe 3. A coupler 5 is provided at the end of the hose 3. By connecting the coupler 5 to an insulating liquid transport vehicle (not shown) such as an organic solvent, a pump (not shown), or the like, Liquid supply and liquid supply to the storage tank 10 are performed. The liquid contact surfaces of the hose 4 and the coupler 5 are also preferably composed of the aforementioned members.

As the insulating liquid stored in the storage tank 10, an organic solvent, ultrapure water or hydrogen peroxide water is preferable. Moreover, as an organic solvent, since elution of impurities, such as a metal by the dielectric breakdown of the lining in the storage tank 10, is prevented, the organic solvent for manufacture of a semiconductor product is preferable.

The organic solvent, ultrapure water, and hydrogen peroxide solution stored in the storage tank 10 described above have a very low risk of elution of impurities such as metals. For this reason, when the organic solvent, ultrapure water, or hydrogen peroxide solution stored in the storage tank 10 is used, it is possible to manufacture a semiconductor product with good quality while suppressing generation of defective products due to impurities.

Specific examples of suitable organic solvents used for the production of semiconductor products include alkanols such as methanol, ethanol, isopropanol, n-propanol, n-butanol, isobutanol, n-pentanol, n-hexanol; ethylene glycol, Glycols such as propylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol; ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol-n-propyl ether, ethylene glycol mono- n-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol Mono-n-propyl ether, diethylene glycol mono-n-butyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-propyl ether, propylene glycol mono -N-butyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol mono-n-propyl ether, dipropylene glycol mono-n-butyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, etc. (Poly) alkylene glycol monoalkyl ethers; (Poly) alkylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate; Other ethers such as dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, tetrahydrofuran; ketones such as acetone, methyl ethyl ketone, cyclohexanone, 2-heptanone, 3-heptanone; methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate Lactic acid alkyl esters such as ethyl 2-hydroxy-2-methylpropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl ethoxyacetate Hydroxyethyl acetate, 2-hydroxy-3-methyl methyl carbonate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutylpropionate, ethyl acetate, n-propyl acetate, isopropyl acetate, acetic acid n-butyl, isobutyl acetate, n-pentyl formate, isopentyl acetate, n-butyl propionate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-lactate -Butyl, methyl pyruvate, pyrubi Ethyl, pyruvate n- propyl, methyl acetoacetate, ethyl acetoacetate, other esters such as ethyl 2-oxobutanoate;
And aromatic hydrocarbons such as toluene and xylene; amides such as N-methylpyrrolidone, N, N-dimethylformamide and N, N-dimethylacetamide. These organic solvents can be used alone or in combination of two or more.

Hereinafter, the present invention will be described more specifically with reference to examples. However, the scope of the present invention is not limited to these examples.

[Example 1]
-Resistivity measurement test piece preparation method and measurement method PTFE (polytetrafluoroethylene) mixed with 0.05% by mass of carbon nanotubes (CNT) powder 500g uniformly filled in a mold with a lid of 150mm in diameter And the top lid was closed.
The mold was placed in a press molding machine, and the upper lid was pressed at a normal temperature at a pressure of 19.6 MPa to perform compression molding. The compression molded product was taken out from the mold and baked in a hot air circulation type baking furnace at 380 ° C. for 5 hours. The obtained fired molded product was cut to produce a disc-shaped molded product having a thickness of 2.4 mm.
Using an electric resistance measuring device, the surface resistivity and volume resistivity of the obtained test piece were measured by a method based on JIS K 6911, and data shown in Table 1 were obtained.

[Comparative Example 1]
PTFE (polytetrafluoroethylene) powder (500 g) was uniformly filled into a mold having a lower lid with a diameter of 150 mm and the upper lid was covered.
The mold was placed in a press molding machine, and the upper lid was pressed at a normal temperature at a pressure of 19.6 MPa to perform compression molding. The compression molded product was taken out from the mold and baked in a hot air circulation type baking furnace at 380 ° C. for 5 hours. The obtained fired molded product was cut to produce a disc-shaped molded product having a thickness of 2.4 mm.
Using an electric resistance measuring device, the surface resistivity and volume resistivity of the obtained test piece were measured by a method based on JIS K 6911, and data shown in Table 1 were obtained.

According to the comparison between Example 1 and Comparative Example 1, it can be seen that the surface resistivity and volume resistivity of the member of Example 1 are significantly lower than the volume resistivity of the member of Comparative Example 1.
According to this result, it can be seen that static electricity is unlikely to accumulate in the member of Example 1, and dielectric breakdown is unlikely to occur.

[Dissolution test]
In accordance with the following method, a metal elution test was performed on the member of Example 1 and the member of Comparative Example 1.

Example 1
A test piece obtained by processing the molded article prepared in Example 1 into a length of 30 mm, a width of 10 mm, and a thickness of 2.4 mm was washed with 0.1 N nitric acid (EL grade) in a clean bench, then washed with ultrapure water and air-dried. .
The test piece and 250 g of EL grade IPA (isopropyl alcohol) were placed in a PFA clean bottle, sealed, and immersed for 7 days at room temperature.
After evaporating IPA after immersion on a platinum dish washed with 0.1N nitric acid (EL grade) and ultrapure water, it was extracted with 0.1N nitric acid (EL grade) and a measurement sample was collected in a dedicated measurement container. .
All work up to sample collection was done in a clean bench to prevent contamination from the environment. The main trace metal mass was measured by ICP-MS (inductively coupled plasma mass spectrometer) for the measurement sample, converted into the concentration in the immersion liquid, and the data shown in Table 2 were obtained.

(Comparative Example 1)
Similarly to Example 1, a test piece obtained by processing the molded article prepared in Comparative Example 1 into a length of 30 mm, a width of 10 mm, and a thickness of 2.4 mm was washed with 0.1 N nitric acid (EL grade) in a clean bench, and then ultrapure water And air dried.
The test piece and 250 g of IPA (EL grade) were placed in a PFA clean bottle, sealed, and immersed for 7 days at room temperature.
After evaporating IPA after immersion on a platinum dish washed with 0.1N nitric acid (EL grade) and ultrapure water, it was extracted with 0.1N nitric acid (EL grade) and a measurement sample was collected in a dedicated measurement container. .
All work up to sample collection was done in a clean bench to prevent contamination from the environment. The main trace metal mass was measured by ICP-MS (inductively coupled plasma mass spectrometer) for the measurement sample, converted into the concentration in the immersion liquid, and the data shown in Table 2 were obtained.

(blank)
In a clean bench, 250 g of IPA (EL grade) was evaporated on a platinum dish washed with 0.1 N nitric acid (EL grade) and ultrapure water, extracted with 0.1 N nitric acid (EL grade), and ICP-MS (inductive coupling) The main trace metal mass was measured with a plasma mass spectrometer and converted into the concentration in the liquid to obtain the data in the table.

According to Table 2, it can be seen that even when a conductive material (CNT) is added to the matrix resin (PTFE), there is almost no elution of the metal into the organic solvent.

[Comparative Example 2]
A molded product was produced in the same manner as in Example 1 except that the content of the conductive material (CNT) in the resin composition was changed to 15% by mass. A test piece was prepared by processing the obtained molded product into a length of 30 mm, a width of 10 mm, and a thickness of 2.4 mm.

[Comparative Example 3]
A molded product is produced in the same manner as in Example 1 except that carbon black (CB) is used as the conductive material and the content of the conductive material (CNT) in the resin composition is changed to 15% by mass. did. A test piece was prepared by processing the obtained molded product into a length of 30 mm, a width of 10 mm, and a thickness of 2.4 mm.

[Dropping test]
Using the molded product obtained in Example 1, a test piece having the same shape (length 30 mm, width 10 mm, thickness 2.4 mm) as the test piece used in the dissolution test was prepared.
A drop test was performed using the test piece made of the member of Example 1, the test piece made of the member of Comparative Example 2, and the test piece made of the member of Comparative Example 3.
The test piece and the rotor were put into a clean glass container having a capacity of 500 mL, and 500 mL of ultrapure water was poured. The test piece was arranged so as to lean against the side wall of the glass container.
Next, in order to promote the dropping of the conductive material, the ultrapure water in the container was stirred with a magnetic stirrer at room temperature for two weeks.
The amount of carbon contained in the ultrapure water after stirring for 2 weeks was measured with a total organic carbon meter, and was used as an index of dropping of the conductive material (carbon nanotube or carbon black). The measurement results (TOC) of carbon content are shown in the table below.

According to Table 3, about the resin composition which consists of a fluororesin and an electroconductive material, when a content of the electroconductive material (CNT) in a resin composition is 1 mass% or less, it contacts a test piece. It can be seen that the loss of the conductive material to the fluid is suppressed to a very low level.
On the other hand, from Comparative Example 2 and Comparative Example 3, the amount of the conductive material in the resin composition is a large amount such as 15% by mass, and the dropout of the conductive material to the fluid in contact with the test piece is remarkable. It turns out that it is.

[Example 2]
Hereinafter, in Example 2, a sheet-like composite molded product and welding of the composite molded product will be described.
First, a mold is provided with a region filled with PTFE (polytetrafluoroethylene) powder and a region filled with CNT-containing powder obtained by mixing 0.025% by mass of CNT with PTFE powder. The powder inside was compression molded. The compression molded product was taken out from the mold and baked at 380 ° C. for 5 hours in a hot air circulation type baking furnace. The obtained fired molded article was cut to obtain a square sheet having a size of 50 mm × 50 mm × thickness 2.4 mm. The same operation was repeated to produce two sheets.

The sheet contained a 20 mm-wide welded portion made only of PTFE and a 30 mm-wide conductive portion made of PTFE and CNT. The end surface on the welded part side of the sheet was an inclined surface.

The obtained two sheets were arranged so that the end faces of the welded portions face each other and are in contact with each other, and a groove having a V-shaped cross section is formed by the two end faces (inclined surfaces).
Welding made of PFA (copolymer of tetrafluoroethylene and 1-perfluoroalkoxy-1,2,2-trifluoroethylene) while blowing hot air at 480 ° C. into the groove formed between the end faces of the weld The rod was pressed into the groove with a pressure of 0.3 to 0.5 MPa, and PFA was filled in the groove.

Next, while pressing hot air of 580 ° C. on a PFA welded coating material (covering sheet) of width 14 mm × thickness 2.4 mm, it is pressed at a pressure of 0.3 to 0.5 MPa and on the seam of the two sheets Was adhered by welding so that the center line of the covering sheet passed.

It was made to adhere | attach by carrying out welding running so that the centerline of a welding coating | cover material may pass on the joint line of two sheets.
The welding speed at this time was 160 to 200 mm / min.

A test piece having a short side width of 10 mm and a long side width of 50 mm was cut out from the welded joint so that the positions of the two short sides were each 25 mm from the joint between the two sheets. As a result of measuring the tensile strength in the direction perpendicular to the joint between the two sheets of the cut specimen, the tensile strength was 30 kN / m.
Moreover, the weld coating material adhered well to the two sheets in a state where there was no lifting or peeling.

Example 3
The whole square sheet of 50 mm × 50 mm × 2.4 mm thickness was formed in the same manner as in Example 2 except that a CNT-containing powder in which 0.025% by mass of CNT was mixed with PTFE powder was used. A welded joint was created.
The welding speed in Example 3 was 100 to 150 mm / min.
As a result of measuring the tensile strength of the test piece cut out from the joined body in the same manner as in Example 2, the tensile strength was 29 kN / m.
However, when the vicinity of the side parallel to the seam of the two sheets of the weld coating material was observed, it was found that there was slight lifting or peeling between the weld coating material and the sheet.

[Comparative Example 3]
Welding was carried out in the same manner as in Example 2 except that the entire square sheet of 50 mm × 50 mm × 2.4 mm thickness was formed using CNT-containing powder in which 15% by mass of CNT was mixed with PTFE powder. A joined body was prepared.
However, the produced joined body is easily decomposed from the joined surface when the joined body is lifted.

10 Storage tank 1 Tank body 2 Pit 3 Drip pipe 4 Hose 5 Coupler

Claims (22)

1. When flowing a chemical for manufacturing a semiconductor product, the member is in contact with the chemical,
   A resin composition comprising a matrix resin and a conductive material dispersed in the matrix resin,
   The matrix resin is a fluororesin;
   The conductive material is a nanocarbon material;
   The content of the conductive material in the resin composition is 1% by mass or less,
   The volume resistivity of the member is 10 ⁶ Ω · cm or less,
   Welding is performed when members are welded by blowing hot air of 300 ° C or higher and melting a welding material composed of a copolymer of tetrafluoroethylene and 1-perfluoroalkoxy-1,2,2-trifluoroethylene. A member that can be welded at a speed of 50 mm / min to 300 mm / min.
2. The member according to claim 1, wherein the conductive material is a material that does not contain a metal or a metal compound.
3. The member according to claim 1 or 2, wherein the nanocarbon material is a carbon nanotube.
4. The member according to any one of claims 1 to 3, wherein the matrix resin has a tensile strength of 12.5 MPa or more and the matrix resin has a tensile elongation of 200% or more.
5. The member according to claim 3, wherein the carbon nanotube has a fiber length of 100 to 1000 µm.
6. A molded article comprising the member according to any one of claims 1 to 5 and being any one of a connecting pipe, a pipe end adapter, and a gasket.
7. A composite molded article comprising: a conductive portion made of the member according to any one of claims 1 to 5; and a welded portion made of a thermoplastic resin or a thermoplastic resin composition not containing the conductive material.
8. The method for joining composite molded articles according to claim 7, comprising welding the welds.
9. A distribution mechanism for distributing a chemical for manufacturing a semiconductor product, wherein at least a part of a surface in contact with the chemical is made of the member according to any one of claims 1 to 5.
10. A tank for storing or stirring a chemical for manufacturing a semiconductor product, wherein at least a part of a surface in contact with the chemical is made of the member according to any one of claims 1 to 5.
11. An apparatus comprising at least one of the distribution mechanism according to claim 9 and the tank according to claim 10.
12. A sheet for lining the inside of a pipe or a tank including the member according to any one of claims 1 to 5.
13. A conductive portion made of the member according to any one of claims 1 to 5, and a welded portion made of a thermoplastic resin not containing the conductive material, or a thermoplastic resin composition,
    The sheet according to claim 12, wherein at least a part of an outer edge portion of the sheet is the welded portion.
14. A pipe or tank lined with the sheet according to claim 12 or 13.
15. Lined with the sheet of claim 13,
    The piping or tank of Claim 14 provided with the lining layer by which the said some sheet | seat is joined by welding the said welding parts.
16. A method for circulating, stirring, or storing a chemical solution for manufacturing a semiconductor product using the pipe or the tank according to claim 14 or 15.
17. A storage tank for storing an insulating liquid comprising a tank body, a pit, and a drip pipe inserted into the tank body,
    The pit is disposed inside the tank body,
    The insertion tube is arranged so that one end of the dropping tube is positioned close to the opening provided in the pit,
    At least one part selected from the tank main body, the pit, and the dripping pipe, at least a part of the surface in contact with the insulating liquid is formed of the member according to any one of claims 1 to 5. Storage tank.
18. The storage tank according to claim 17, wherein at least a part of a surface of the pit that comes into contact with the chemical solution is made of the member according to any one of claims 1 to 5.
19. The storage tank according to claim 17 or 18, wherein the member is the member according to claim 3.
20. The storage tank according to any one of claims 17 to 19, wherein the chemical solution is an organic solvent.
21. 21. A method of storing an organic solvent for manufacturing a semiconductor product, wherein the organic solvent for manufacturing a semiconductor product is stored in the storage tank according to claim 20.
22. A method for manufacturing a semiconductor product, wherein the organic solvent stored by the method according to claim 21 is used.

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