WO2018100730A1 - Photosensitive element, method for forming resist pattern and method for producing printed wiring board - Google Patents
Photosensitive element, method for forming resist pattern and method for producing printed wiring board Download PDFInfo
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- WO2018100730A1 WO2018100730A1 PCT/JP2016/085893 JP2016085893W WO2018100730A1 WO 2018100730 A1 WO2018100730 A1 WO 2018100730A1 JP 2016085893 W JP2016085893 W JP 2016085893W WO 2018100730 A1 WO2018100730 A1 WO 2018100730A1
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- layer
- support film
- photosensitive
- photosensitive layer
- photosensitive element
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
Definitions
- the present invention relates to a photosensitive element, a resist pattern forming method using the same, and a printed wiring board manufacturing method.
- a support film As a resist material used for etching, plating, etc. in the field of printed wiring board manufacturing and precision metal processing, a support film, a layer made of a photosensitive resin composition (hereinafter referred to as “photosensitive layer”), and A photosensitive element composed of a protective film is widely used.
- photosensitive layer a layer made of a photosensitive resin composition
- the printed wiring board is manufactured as follows, for example. First, after peeling off the protective film of the photosensitive element from the photosensitive layer, the photosensitive layer is laminated on the conductive film of the substrate. Next, after pattern exposure is performed on the photosensitive layer, an unexposed portion is removed with a developing solution to form a resist pattern. And a printed wiring board is formed by patterning a conductive film based on this resist pattern.
- a support film having a defined haze value, a support film having a limited lubricant particle size, or the like may be used (for example, see Patent Documents 1 and 2 below).
- a high-resolution photosensitive resin composition or a high-resolution exposure machine (for example, a projection exposure machine and a direct drawing exposure machine) ) May significantly increase resist defects.
- the present invention has been made in view of the above circumstances, and an object thereof is to provide a photosensitive element capable of suppressing the occurrence of resist defects. It is another object of the present invention to provide a method for forming a resist pattern using the photosensitive element and a method for manufacturing a printed wiring board.
- resist defects in conventional photosensitive elements defects on the surface of the support film in contact with the photosensitive layer (for example, particles such as lubricants and irregularities resulting therefrom) are the main factors that cause resist defects. This has been found by the inventors' investigation. However, it is very difficult to reduce particles such as lubricants in order to reduce defects in the resist derived from the support film, and there is a limit to the existing improved methods for reducing the size and number of particles such as lubricants. .
- the present inventor has studied in detail the influence and cause of the defects of the support film on the resist.
- the influence of the surface in contact with the photosensitive layer on the support film on the occurrence of pattern defects was investigated using a support film coated with a lubricant on both sides.
- the present inventors have found the following findings. That is, it has been clarified that defects on the surface of the support film not in contact with the photosensitive layer (the surface opposite to the surface in contact with the photosensitive layer in the support film) have little influence on the resist defect.
- resist defects can be greatly improved by smoothing the support film by reducing the number of defects on the surface in contact with the photosensitive layer.
- the photosensitive element which concerns on this invention is a photosensitive element provided with a support film and the photosensitive layer arrange
- the photosensitive layer has a binder polymer and the light which has an ethylenically unsaturated bond. It contains a polymerizable compound and a photopolymerization initiator, and the number of defects having a diameter of 2 ⁇ m or more on the surface on the photosensitive layer side of the support film is 30 or less per 2 mm 2 .
- the number of defects on the surface of the support film on the photosensitive layer side is reduced. Thereby, since the smoothness of the surface of the support film on the photosensitive layer side is improved, the occurrence of resist defects can be suppressed. Further, according to the photosensitive element of the present invention, it is possible to suppress the occurrence of resist defects even when a high-resolution exposure machine is used, and good resist formability can be obtained.
- the support film has a polyester film, a resin layer, and a lubricant layer, the resin layer is disposed between the photosensitive layer and the polyester film, and the lubricant layer is polyester.
- positioned on the opposite side to the resin layer in a film may be sufficient.
- the thickness of the support film is preferably 1 to 200 ⁇ m.
- the haze value of the support film is preferably 0.01 to 1.0%.
- the method for forming a resist pattern according to the present invention includes a laminating step of laminating a photosensitive layer of the above-described photosensitive element on a substrate, and an exposure step of irradiating a predetermined portion of the photosensitive layer with actinic rays to form a photocured portion And a developing step for removing regions other than the photocured portion in the photosensitive layer.
- the method for producing a printed wiring board according to the present invention comprises a step of applying at least one selected from the group consisting of etching treatment and plating treatment to a substrate having a resist pattern formed by the above-described resist pattern forming method. Prepare.
- the present invention it is possible to provide a photosensitive element capable of suppressing the occurrence of resist defects. Moreover, according to this invention, the formation method of the resist pattern using the said photosensitive element, and the manufacturing method of a printed wiring board can be provided. According to the present invention, even when a high-resolution exposure apparatus is used, it is possible to suppress the occurrence of resist defects, and good resist formability can be obtained.
- (meth) acrylate means at least one of “acrylate” and “methacrylate” corresponding thereto. The same applies to other similar expressions such as “(meth) acryl”.
- FIG. 1 is a schematic cross-sectional view showing a photosensitive element according to this embodiment.
- the photosensitive element 1 shown in FIG. 1 includes a support film 10 and a photosensitive layer (photosensitive resin composition layer) 20.
- the photosensitive layer 20 is provided on the first main surface 12 of the support film 10 and is in contact with the first main surface 12.
- the support film 10 has a second main surface 14 on the side opposite to the first main surface 12.
- the first main surface 12 refers to the surface of the support film 10 on the photosensitive layer 20 side
- the second main surface 14 refers to the surface of the support film 10 opposite to the photosensitive layer 20. That means.
- the haze value is preferably 0.01 to 1.0% from the viewpoint of obtaining high transparency for the purpose of reducing resist defects.
- resist defects are likely to occur, and a high-resolution exposure machine is used. In this case, resist defects are particularly likely to occur.
- the number of defects having a diameter of 2 ⁇ m or more on the surface (first main surface 12) on the photosensitive layer 20 side of the support film 10 is 30 or less per 2 mm 2 .
- the formation of a recess having a depth of 2 ⁇ m or more in the photosensitive layer 20 is suppressed, and the occurrence of resist defects can be suppressed.
- the support film 10 has, for example, a base material layer (polyester film or the like), a resin layer, and a lubricant layer (a layer containing a lubricant).
- the resin layer is disposed between the photosensitive layer 20 and the base material layer, and is located on the first main surface 12 side.
- the resin layer may contain particles (for example, fine particles) or may be a lubricant layer (a layer containing a lubricant).
- the first main surface 12 of the support film 10 is preferably smooth.
- the lubricant layer is disposed on the side opposite to the resin layer in the base material layer, and is located on the second main surface 14 side.
- the thickness of the resin layer is preferably 0.05 to 5.0 ⁇ m from the viewpoint of easily maintaining the mechanical strength.
- the resin layer (such as a lubricant layer) can be formed using a known method such as a roll coater, a flow coater, a spray coater, a curtain flow coater, a dip coater, or a slit die coater.
- the number of defects having a diameter of 2 ⁇ m or more on the first main surface 12 on the photosensitive layer 20 side of the support film 10 is 30 or less per 2 mm 2 from the viewpoint of suppressing the occurrence of resist defects.
- the number of defects is preferably 20 or less per 2 mm 2 and more preferably 10 or less from the viewpoint of further suppressing the occurrence of resist defects.
- the diameter of the defect is, for example, the maximum diameter of the defect.
- the measurement area with an area of 2 mm 2 is, for example, an area of 18 mm ⁇ 0.11 mm.
- the number of defects is, for example, an average value of a plurality of measured values.
- the average value may be obtained as an average value of five measurement values obtained by measuring the number of defects in any five regions on the surface (first main surface 12) of the support film 10 on the photosensitive layer 20 side. it can.
- the number of defects can be measured using a polarizing microscope or optical interferometry.
- the diameter of a defect (for example, particles of a lubricant or the like) included in the first main surface 12 of the support film 10 is preferably 2 ⁇ m or less. Even if many defects having a diameter of less than 2 ⁇ m are included in the support film 10, the influence on light scattering is not great. The reason for this is that when the photosensitive layer is irradiated with light in the exposure process, the photocuring reaction of the photosensitive layer is not limited to the light irradiation portion, but is slight, but in the lateral direction where light is not directly irradiated (for example, light It also proceeds in the direction perpendicular to the irradiation direction. Therefore, when the diameter is small, the photocuring reaction directly under the defect proceeds sufficiently, but as the diameter increases, the photocuring reaction directly under the defect does not proceed sufficiently, so that a fine defect of the resist occurs. Conceivable.
- the defect of the support film 10 is a defect derived from the components constituting the support film 10 or the like.
- Factors that form defects include, for example, polymer gels; monomers as raw materials; catalysts used during production; and inorganic or organic fine particles contained as necessary aggregate when the support film 10 is produced. Examples include swelling generated by applying a lubricant layer on the support film 10 and a lubricant and an adhesive; particles having a diameter of 2 ⁇ m or more (such as lubricant) contained in the support film 10. Examples of the particles having a diameter of 2 ⁇ m or more contained in the support film 10 include particles protruding from the first main surface 12 of the support film 10, particles existing inside the surface of the support film 10, and the like.
- the number of defects can be adjusted by selectively using particles having a small particle diameter or particles having excellent dispersibility.
- the average particle diameter of the particles can be obtained as the median diameter (d50) of the particle size distribution measured using a laser diffraction / scattering microtrack particle size distribution meter or the like.
- the support film (base material layer etc.) can be used without any particular limitation.
- the support film include polyethylene terephthalate (hereinafter referred to as “PET”), polyester such as polybutylene terephthalate (PBT), polyethylene-2,6-naphthalate (PEN), and polyolefin such as polypropylene and polyethylene. It is done.
- PET polyethylene terephthalate
- PBT polybutylene terephthalate
- PEN polyethylene-2,6-naphthalate
- polyolefin such as polypropylene and polyethylene. It is done.
- the support film may be a single layer or a multilayer.
- the haze value of the support film is preferably 0.01 to 1.0%, more preferably 0.01 to 0.85%, still more preferably 0.01 to 0.7%. 0.01 to 0.55% is particularly preferable.
- the haze value is 0.01% or more, the support film itself tends to be easily manufactured.
- the haze value is 1.0% or less, the sensitivity and resolution tend to be easily suppressed.
- the “haze value” means haze.
- a value measured using a commercially available haze meter (turbidimeter) in accordance with the method defined in JIS K 7105 can be used.
- the haze value can be measured with a commercially available turbidimeter such as NDH-5000 (trade name, manufactured by Nippon Denshoku Industries Co., Ltd.).
- the thickness of the support film is preferably 1 to 200 ⁇ m, more preferably 5 to 200 ⁇ m, still more preferably 11 to 100 ⁇ m, particularly preferably 12 to 50 ⁇ m, and 15 to 40 ⁇ m. Very preferably. When the thickness is 1 ⁇ m or more, the support film tends to be prevented from being broken when the support film is peeled from the photosensitive element. When the thickness is 200 ⁇ m or less, the price tends to be excellent.
- the support film may be a commercially available general industrial film that can be used as a support film for the photosensitive element, and may be appropriately processed and used.
- Examples of the support film include “QS-series” (produced by Toray Industries, Inc.), which is a PET film.
- the photosensitive layer 20 is a layer made of a photosensitive resin composition.
- the photosensitive resin composition constituting the photosensitive layer 20 contains, for example, (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator. .
- A a binder polymer
- B a photopolymerizable compound having an ethylenically unsaturated bond
- C a photopolymerization initiator.
- binder polymer As the binder polymer as the component (A), a binder polymer used in a conventional photosensitive resin composition can be used without particular limitation.
- the binder polymer include acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, and phenol resin. In these, an acrylic resin is preferable from a viewpoint which is excellent in alkali developability.
- a binder polymer can be used individually by 1 type or in combination of 2 or more types.
- the binder polymer can be produced by radical polymerization of a polymerizable monomer.
- a polymerizable monomer (meth) acrylic acid, styrene, alkyl (meth) acrylate (such as methyl (meth) acrylate), benzyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, (meth ) Glycidyl acrylate, maleic acid and the like.
- the binder polymer preferably has a carboxyl group in the molecule from the viewpoint of excellent alkali developability.
- the binder polymer having a carboxyl group can be produced by radical polymerization of a polymerizable monomer having a carboxyl group, and a polymerizable monomer having a carboxyl group and other polymerizable monomers , May be radically polymerized.
- As the polymerizable monomer having a carboxyl group (meth) acrylic acid is preferred.
- the binder polymer a binder polymer having a structural unit derived from (meth) acrylic acid and a structural unit derived from (meth) acrylic acid alkyl ester is preferable.
- the acid value of the binder polymer may be 80 to 250 mgKOH / g, 90 to 240 mgKOH / g, 100 to 230 mgKOH / g, or 100 to 200 mgKOH / g from the viewpoint of easy improvement in adhesion and resolution.
- the acid value of the binder polymer can be adjusted by the content of structural units constituting the binder polymer (for example, structural units derived from (meth) acrylic acid).
- the weight average molecular weight (Mw) of the binder polymer may be 10,000 to 100,000, 20,000 to 80,000, or 25,000 to 60,000 from the viewpoint of easily improving the mechanical strength and resolution of the film.
- the weight average molecular weight can be measured, for example, by gel permeation chromatography (GPC) using a standard polystyrene calibration curve. More specifically, it can be measured under the conditions described in the examples.
- the content of the binder polymer is preferably 40 to 90 parts by mass, and more preferably 50 to 80 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B).
- the content is 40 parts by mass or more, the photocured product tends to be suppressed from becoming brittle.
- the content is 90 parts by mass or less, sufficient resolution and light sensitivity tend to be obtained.
- the component (B) (photopolymerizable compound having an ethylenically unsaturated bond) preferably contains a compound having 4 to 40 carbon atoms of an oxyalkylene unit (alkylene glycol unit) having 2 to 6 carbon atoms.
- (B) component contains such a compound, compatibility with (A) component can be improved.
- Examples of the oxyalkylene unit having 2 to 6 carbon atoms include an oxyethylene unit, an oxypropylene unit, an oxyisopropylene unit, an oxybutylene unit, an oxypentylene unit, and an oxyhexylene unit.
- the alkylene unit is preferably at least one selected from the group consisting of an oxyethylene unit and an oxyisopropylene unit from the viewpoint of improving resolution and plating resistance.
- the photopolymerizable compounds from the viewpoint that the effects of the present invention can be obtained more reliably, from the group consisting of bisphenol A-based (meth) acrylate compounds and polyalkylene glycol di (meth) acrylates. At least one selected can be used particularly preferably.
- the bisphenol A (meth) acrylate compound is preferably a compound represented by the following general formula (I).
- R 1 and R 2 each independently represent a hydrogen atom or a methyl group, and preferably a methyl group.
- X 1 and X 2 each independently represents an alkylene group having 2 to 6 carbon atoms.
- the value of p + q is preferably 2 to 40, more preferably 4 to 40, still more preferably 5 to 30, particularly preferably 8 to 20, and preferably 8 to 16. Is very preferable, and 8 to 12 is very preferable.
- p and q indicate the number of structural units. Therefore, an integer value is shown in a single molecule, and a rational number that is an average value is shown as an aggregate of a plurality of types of molecules. Hereinafter, the same applies to the number of structural units.
- the value of p + q is 1 or more, the compatibility with the component (A) is suppressed from decreasing, and it tends to be easily prevented from peeling off when the photosensitive element is laminated on the circuit forming substrate.
- the value of p + q is 40 or less, the increase in hydrophilicity is suppressed, the resist image is hardly peeled off during development, and the plating resistance against solder plating or the like is lowered but tends to be suppressed. In either case, a reduction in the resolution of the photosensitive element tends to be suppressed.
- alkylene group having 2 to 6 carbon atoms examples include ethylene group, propylene group, isopropylene group, butylene group, pentylene group and hexylene group.
- at least one selected from the group consisting of an ethylene group and an isopropylene group is preferable from the viewpoint of improving resolution and plating resistance.
- Examples of the compound represented by the general formula (I) include 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypoly). Propoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypolybutoxy) phenyl) propane, 2,2-bis (4-((meth) acryloxypolyethoxypolypropoxy) phenyl) propane, etc. And bisphenol A-based (meth) acrylate compounds.
- 2,2-bis (4-((meth) acryloxypolyethoxy) phenyl) propane 2,2-bis (4-((meth) acryloxydiethoxy) phenyl) propane, 2,2-bis ( 4-((meth) acryloxypentaethoxy) phenyl) propane, 2,2-bis (4- (methacryloxypentadecaethoxy) phenyl) propane, and the like.
- 2,2-bis (4- (methacryloxypentaethoxy) phenyl) propane is commercially available as FA-321M (trade name, manufactured by Hitachi Chemical Co., Ltd.).
- BPE-1300 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.
- BPE-200 (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
- polyalkylene glycol di (meth) acrylate examples include a compound represented by the following general formula (II), a compound represented by the following general formula (III), and a compound represented by the following general formula (IV) Is mentioned. These can be used alone or in combination of two or more.
- R 3 and R 4 each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms
- EO represents an oxyethylene unit
- PO represents an oxypropylene unit
- R 5 and R 6 each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms
- EO represents an oxyethylene unit
- PO represents an oxypropylene unit
- R 7 and R 8 each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms
- EO represents an oxyethylene unit
- PO represents an oxypropylene unit
- Examples of the alkyl group having 1 to 3 carbon atoms in the general formulas (II), (III) and (IV) include a methyl group, an ethyl group, an n-propyl group and an isopropyl group, and a methyl group is preferable.
- the total number of structural units (m 1 + m 2 , m 3 and m 4 ) of the oxyethylene group in the general formulas (II), (III) and (IV) is preferably 1 to 30 each independently. More preferably, it is 10, more preferably 4 to 9, and particularly preferably 5 to 8. If the total number of structural units is 30 or less, sufficient tent reliability and resist shape tend to be easily obtained.
- the total number (n 1 , n 2 + n 3 , and n 4 ) of the structural units of the oxypropylene group in the general formulas (II), (III), and (IV) is preferably independently 1 to 30, It is more preferably 5 to 20, more preferably 8 to 16, and particularly preferably 10 to 14. When the total number of the structural units is 30 or less, sufficient resolution is easily obtained, and the generation of sludge tends to be suppressed.
- a compound (trade name: FA-023M, manufactured by Hitachi Chemical Co., Ltd.).
- a (meth) acrylate compound having a skeleton derived from dipentaerythritol can be used.
- the (meth) acrylate compound having a skeleton derived from dipentaerythritol means an esterified product of dipentaerythritol and (meth) acrylic acid, and the esterified product is a compound modified with an alkyleneoxy group. Is also defined as containing. Further, the number of ester bonds in one molecule is 6, but a compound having 1 to 5 ester bonds may be mixed. This compound is commercially available as DPH-12E (trade name, manufactured by Shin-Nakamura Chemical Co., Ltd.).
- a component can be used individually by 1 type or in combination of 2 or more types.
- the content of the component (B) is preferably 10 to 60 parts by mass, and more preferably 20 to 50 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B).
- the content is 10 parts by mass or more, sufficient resolution and photosensitivity tend to be obtained.
- the content is 60 parts by mass or less, the photocured product tends to be suppressed from becoming brittle.
- Examples of the component (C) (photopolymerization initiator) include N, N, N ′ such as benzophenone; N, N, N ′, N′-tetramethyl-4,4′-diaminobenzophenone (also known as Michler's ketone).
- N′-tetraalkyl-4,4′-diaminobenzophenone 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, 2-methyl-1- [4- (methylthio) phenyl
- An aromatic ketone such as 2-morpholino-1-propanone; a quinone compound such as alkyl anthraquinone; a benzoin ether compound such as benzoin alkyl ether; a benzoin compound such as benzoin and alkyl benzoin; a benzyl derivative such as benzyldimethyl ketal; (O-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chloro Enyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-meth
- a component can be used individually by 1 type or in combination of 2 or more types.
- the content of the component (C) is preferably 0.1 to 20 parts by weight, and preferably 0.2 to 10 parts by weight with respect to 100 parts by weight as the total of the components (A) and (B). Is more preferably 0.5 to 5 parts by mass.
- the content is 0.1 part by mass or more, sufficient photosensitivity tends to be obtained.
- the content is 20 parts by mass or less, an increase in light absorption on the surface of the photosensitive resin composition at the time of exposure is suppressed, and an insufficient internal photocuring tends to be suppressed. is there.
- the photosensitive resin composition comprises a photopolymerizable compound (such as an oxetane compound) having at least one cationically polymerizable cyclic ether group in the molecule, a cationic polymerization initiator, a dye (such as malachite green), light, and the like.
- a photopolymerizable compound such as an oxetane compound
- a cationic polymerization initiator such as sodium oxetane compound
- a dye such as malachite green
- Coloring agents tribromophenyl sulfone, leuco crystal violet, etc.
- thermal coloring inhibitors plasticizers (p-toluenesulfonamide, etc.)
- pigments fillers, antifoaming agents, flame retardants, stabilizers, adhesion-imparting agents
- You may contain additives, such as a leveling agent, peeling promoter, antioxidant, a fragrance
- the photosensitive resin composition is dissolved in a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, and propylene glycol monomethyl ether, or a mixed solvent thereof, as necessary.
- a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, and propylene glycol monomethyl ether, or a mixed solvent thereof, as necessary.
- a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, and propylene glycol monomethyl ether, or a mixed solvent thereof, as
- the photosensitive layer 20 in the photosensitive element 1 can be formed by removing the solvent after applying the above-described photosensitive resin composition on the support film 10.
- a coating method for example, a known method such as roll coating, comma coating, gravure coating, air knife coating, die coating, or bar coating can be employed.
- the removal of the solvent can be performed, for example, by treating at 70 to 150 ° C. for about 5 to 30 minutes.
- the amount of the remaining organic solvent in the photosensitive layer 20 is preferably 2% by mass or less from the viewpoint of preventing the organic solvent from diffusing in the subsequent step.
- the photosensitive element 1 may include a protective film (not shown) on the opposite side of the photosensitive layer 20 from the support film 10.
- a protective film it is preferable to use a film in which the adhesive force between the photosensitive layer 20 and the protective film is smaller than the adhesive force between the photosensitive layer 20 and the support film 10.
- a low fish eye film is preferably used.
- the protective film include inert polyolefin films (polyethylene, polypropylene, etc.).
- a polyethylene film is preferable from the viewpoint of excellent peelability from the photosensitive layer 20.
- the thickness of the protective film varies depending on the use, but is preferably about 1 to 100 ⁇ m.
- the photosensitive element 1 may further include an intermediate layer or a protective layer such as a cushion layer, an adhesive layer, a light absorption layer, and a gas barrier layer in addition to the support film 10, the photosensitive layer 20, and the protective film.
- a protective layer such as a cushion layer, an adhesive layer, a light absorption layer, and a gas barrier layer in addition to the support film 10, the photosensitive layer 20, and the protective film.
- the photosensitive element 1 may be stored as it is, for example, or may be stored in a state where a protective film is laminated on the photosensitive layer 20 and wound around a cylindrical core. At this time, the support film 10 is preferably wound into a roll shape so as to be the outermost layer.
- the resist pattern forming method includes a laminating step of laminating the photosensitive layer 20 of the photosensitive element 1 on a substrate, and exposure for irradiating a predetermined portion of the photosensitive layer 20 with actinic rays to form a photocured portion. And a developing step for removing regions other than the photocured portion in the photosensitive layer 20.
- the photosensitive layer of the photosensitive element and the support film are laminated on the substrate in this order.
- the laminating step as a method of laminating the photosensitive layer 20 on the substrate, for example, when a protective film is present on the photosensitive layer 20, the protective layer is removed, and then the photosensitive layer 20 is heated to 70 to 130 ° C.
- the stacking step it is also possible to stack under reduced pressure.
- the surface of the substrate on which the photosensitive layer 20 is laminated is usually a metal surface, but is not particularly limited. In addition, in order to further improve the stackability, the substrate may be preheated.
- a photomask having a negative or positive mask pattern is aligned and adhered to the second main surface 14 of the support film 10 with respect to the photosensitive layer 20 that has been laminated in the laminating step.
- a predetermined portion of the photosensitive layer 20 is irradiated through the support film 10 to form a photocured portion on the photosensitive layer 20.
- the photosensitive layer 20 is irradiated with an actinic ray in an image form through the support film 10 to form a photocured portion on the photosensitive layer 20.
- an actinic light source a known light source (for example, a light source that effectively emits ultraviolet light, visible light, etc., such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, or a xenon lamp) is used.
- a laser direct drawing exposure method can also be used.
- the photomask is peeled off from the support film 10.
- the support film 10 is peeled off from the photosensitive layer 20.
- the region other than the photocured portion in the photosensitive layer is removed.
- the unexposed portion (unphotocured portion) of the photosensitive layer 20 is removed and developed by wet development or dry development with a developer such as an alkaline aqueous solution, an aqueous developer, or an organic solvent, and a resist pattern is developed. Can be manufactured.
- Examples of the alkaline aqueous solution include 0.1 to 5% by mass sodium carbonate solution, 0.1 to 5% by mass potassium carbonate solution, and 0.1 to 5% by mass sodium hydroxide solution.
- the pH of the alkaline aqueous solution is preferably in the range of 9-11.
- the temperature of the alkaline aqueous solution is adjusted according to the developability of the photosensitive layer 20.
- the alkaline aqueous solution may contain a surface active agent, an antifoaming agent, an organic solvent, and the like.
- Examples of the developing method include a dip method, a spray method, brushing, and slapping.
- the resist pattern may be further cured by performing heating at about 60 to 250 ° C. or exposure at about 0.2 to 10 J / cm 2 as necessary.
- a resist pattern can be formed on the conductor layer on which the wiring pattern is formed.
- the resist pattern can be used as a solder resist for preventing solder from adhering to unnecessary portions on the conductor layer when mounting components are joined.
- the resist pattern obtained by the above-described forming method is used for forming a cured resin on a rigid substrate that has excellent physical properties (tensile strength, elongation, etc.) and satisfies the electric corrosion resistance. It may be used as a permanent mask (solder resist) formed on a rigid substrate. Specifically, the resist pattern is useful when used as a solder resist for a printed wiring board having a rigid substrate or a solder resist for a semiconductor package substrate having a rigid substrate.
- the method for manufacturing a printed wiring board according to the present embodiment includes a step of applying at least one selected from the group consisting of an etching process and a plating process to a substrate having a resist pattern formed by the resist pattern forming method.
- the etching or plating of the substrate can be performed by etching or plating the surface of the substrate by a known method using the developed resist pattern as a mask.
- a cupric chloride solution for example, a cupric chloride solution, a ferric chloride solution, and an alkaline etching solution can be used.
- the plating include copper plating, solder plating, nickel plating, and gold plating.
- the resist pattern can be peeled off with a stronger alkaline aqueous solution than the alkaline aqueous solution used for development, for example.
- a stronger alkaline aqueous solution for example, a 1 to 10% by mass aqueous sodium hydroxide solution and a 1 to 10% by mass aqueous potassium hydroxide solution are used.
- the peeling method include an immersion method and a spray method.
- the printed wiring board on which the resist pattern is formed may be a multilayer printed wiring board or may have a small diameter through hole.
- the photosensitive element which concerns on this embodiment can also be used for a semiconductor package board
- the photocured portion of the photosensitive layer may be used as the insulating film.
- the photocured portion of the photosensitive layer is used as, for example, a solder resist for a semiconductor package, after the development in the resist pattern forming method, ultraviolet irradiation with a high-pressure mercury lamp is performed for the purpose of improving solder heat resistance, chemical resistance, etc. Or it is preferable to heat. In the case of irradiating with ultraviolet rays, the irradiation amount can be adjusted as necessary.
- irradiation can be performed at an irradiation amount of about 0.2 to 10 J / cm 2 .
- the heating is performed in the range of about 100 to 170 ° C. for about 15 to 90 minutes.
- ultraviolet irradiation and heating it is also possible to perform ultraviolet irradiation and heating at the same time, and after performing one of them, the other can be performed.
- heating to 60 to 150 ° C. is more preferable from the viewpoint of effectively imparting solder heat resistance, chemical resistance, and the like.
- This solder resist is effective as a permanent mask for semiconductor packages because it also serves as a protective film for wiring after soldering to the substrate, and has excellent physical properties (tensile strength, elongation, etc.) and thermal shock resistance. is there.
- the semiconductor package substrate having such a resist pattern is mounted on an electronic device such as a personal computer after mounting of a semiconductor element or the like (for example, wire bonding and solder connection).
- the photosensitive element the resist pattern forming method, the printed wiring board, and the semiconductor package substrate manufacturing method according to the present embodiment
- the surface on the photosensitive layer side of the support film the first layer Since the number of defects in the main surface 12) is reduced, resist defects can be sufficiently reduced.
- the resist defects can be reduced.
- the depth of focus (focal range) of the exposure apparatus for forming a fine circuit is, for example, ⁇ 40 ⁇ m when a resolution of 4 ⁇ m is obtained, and ⁇ 10 ⁇ m when a resolution of 2 ⁇ m or less is obtained.
- the depth of focus becomes narrow.
- a lubricant layer for example, the lubricant layer disposed on the second main surface 14 side in FIG. 1 is disposed at a position outside the range of the focal depth, defects are likely to be reduced.
- the surface for example, the 1st main surface 12 of FIG. 1) which contact
- solution 4a was added dropwise to 4) over 4 hours.
- the dropping funnel was washed with 40 g of a mixture of toluene and methyl cellosolve having a mass ratio of 6: 4 and added to the flask. Next, the mixture was kept at 80 ° C. with stirring for 2 hours. Furthermore, a solution in which 1.0 g of azobisisobutyronitrile was dissolved in 40 g of a mixture of methyl cellosolve and toluene having a mass ratio of 6: 4 was dropped into the flask over 30 minutes. The dropping funnel was washed with 120 g of a mixture of toluene and methyl cellosolve having a mass ratio of 6: 4 and added to the solution a. The solution after dropping was kept at 80 ° C.
- binder polymer solution as component (A).
- Toluene was added to the binder polymer solution to adjust the nonvolatile component concentration (solid content concentration) to 40% by mass.
- the weight average molecular weight of the binder polymer was measured.
- the weight average molecular weight was measured by a gel permeation chromatography (GPC) method and calculated by using a standard polystyrene calibration curve. The GPC conditions are shown below.
- the acid value was measured according to the following measurement procedure. Table 1 shows the measurement results of the weight average molecular weight and acid value.
- QS series A biaxially oriented film having a three-layer structure having a PET film and a lubricant layer (resin layer containing particles) disposed on both sides of the PET film.
- the number of lubricants contained in one lubricant layer is extremely small compared to the other lubricant layer; FB-40 manufactured by Toray Industries, Inc .: PET film and a lubricant layer (resin containing particles) disposed on both sides of the PET film
- A-1517 PET film and a first film disposed on one side of the PET film A lubricant layer (resin layer containing particles) and a second lubricant layer (resin layer containing particles; average particle diameter of contained particles: 2 ⁇ m or more) disposed on the other surface of the PET film.
- a biaxially oriented film having a two-layer structure A-4100 manufactured by Toyobo Co., Ltd., a PET film, a first lubricant layer (resin layer containing particles) arranged on one surface of the PET film, and the PET film
- Table 3 shows the results of measuring the thickness of the support film, the number of defects having a diameter of 2 ⁇ m or more on the surface of the support film, the transmittance, and the haze value.
- the number of defects was determined by using light interference to measure the number of defects (aggregate particles, etc.) having a diameter of 2 ⁇ m or more present in an area of 2 mm 2 (18 mm ⁇ 0.11 mm).
- a trade name “Hybrid Confocal Microscope” manufactured by Lasertec Corporation was used as a measuring machine.
- the number of measurements (n number) at that time was set to 5, and the average value was calculated.
- the surface on which the photosensitive layer is formed (first main surface 12 in FIG.
- the solvent was removed by drying with a hot air convection dryer at 100 ° C. for 2 minutes.
- a photosensitive layer was formed on the second lubricant layer (resin layer containing particles; average particle diameter of contained particles: 2 ⁇ m or more).
- the photosensitive layer was covered with a protective film made of polyethylene (manufactured by Tamapoly Co., Ltd., trade name “NF-15A”, thickness: 28 ⁇ m) to obtain a photosensitive element.
- the photosensitive layer after drying had a thickness of 10 ⁇ m.
- the support film was peeled off, and a 1% by mass sodium carbonate aqueous solution at 30 ° C. was spray-developed in a time twice as long as the minimum development time, and the unexposed portion was removed for development. And it confirmed that the number of steps of the step tablet of the photocured film formed on the copper clad laminate was 9, and the irradiation energy amount (exposure amount, mJ / cm 2 ) in the exposure was obtained.
- Table 3 shows the measurement results. It shows that photosensitivity is so high that the value of irradiation energy amount is small.
- a photo tool having a 41-step tablet and a glass chrome type having a wiring pattern with a line width / space width of 2/6 to 20/90 (unit: ⁇ m) as a negative for adhesion evaluation A glass chrome type photo tool having a wiring pattern with a line width / space width of 2/2 to 20/20 (unit: ⁇ m) as a negative for resolution evaluation, and a projection exposure machine (UX) having a high-pressure mercury lamp -7 series (manufactured by Ushio Electric Co., Ltd.) was used to expose the photosensitive layer of the laminate with an irradiation energy amount such that the number of remaining steps after development of the 41-step tablet was 9 steps.
- UX projection exposure machine
- the support film was peeled off, and a 1% by mass aqueous sodium carbonate solution was spray-developed at 30 ° C. in a time twice as long as the minimum development time, and the unexposed portion was removed for development.
- the adhesion and resolution were evaluated by the smallest value (unit: ⁇ m) of the space width between the line widths in which the unexposed portion could be removed cleanly by the development process.
- evaluation of adhesiveness and resolution is so favorable that a numerical value is small. The results are shown in Table 3.
- the particle size of the lubricant of the supporting film used in Comparative Example 1 is smaller than the particle size of the lubricant contained in Comparative Examples 2 to 4, but at the interface between the photosensitive layer and the supporting film (the surface on the photosensitive layer side of the supporting film). Since there are a large number of defects derived from a lubricant or the like, it is considered that the defects block the exposure light beam and cause resist defects. In Comparative Examples 2 and 3, since the number of lubricants present at the interface between the photosensitive layer and the support film (the surface on the photosensitive layer side of the support film) is large, the aggregate blocks the exposure light beam and causes a resist defect. Conceivable.
- the present invention it is possible to provide a photosensitive element capable of suppressing the occurrence of resist defects. Moreover, according to this invention, the formation method of the resist pattern using the said photosensitive element, and the manufacturing method of a printed wiring board can be provided.
- SYMBOLS 1 Photosensitive element, 10 ... Support film, 12 ... 1st main surface (surface on the photosensitive layer side of a support film), 14 ... 2nd main surface (surface on the opposite side to the photosensitive layer of a support film), 20: Photosensitive layer (photosensitive resin composition layer).
Abstract
Description
図1は、本実施形態に係る感光性エレメントを示す模式断面図である。図1に示した感光性エレメント1は、支持フィルム10と、感光層(感光性樹脂組成物の層)20と、を備える。感光層20は、支持フィルム10の第1の主面12上に設けられており、第1の主面12に接している。支持フィルム10は、第1の主面12とは反対側に第2の主面14を有している。ここで、第1の主面12とは、支持フィルム10の感光層20側の表面のことをいい、第2の主面14とは、支持フィルム10の感光層20とは反対側の表面のことをいう。 <Photosensitive element>
FIG. 1 is a schematic cross-sectional view showing a photosensitive element according to this embodiment. The
支持フィルム10は、例えば、基材層(ポリエステルフィルム等)と、樹脂層と、滑剤層(滑剤を含有する層)と、を有している。樹脂層は、感光層20と基材層との間に配置されており、第1の主面12側に位置している。樹脂層は、粒子(例えば微粒子)を含んでいてもよく、滑剤層(滑剤を含有する層)であってもよい。支持フィルム10の第1の主面12は、平滑であることが好ましい。滑剤層は、基材層における樹脂層とは反対側に配置されており、第2の主面14側に位置している。 (Support film)
The
感光層20は、感光性樹脂組成物からなる層である。感光層20を構成する感光性樹脂組成物は、例えば、(A)バインダーポリマーと、(B)エチレン性不飽和結合を有する光重合性化合物と、(C)光重合開始剤と、を含有する。以下、各成分について詳細に説明する。 (Photosensitive layer)
The
(A)成分であるバインダーポリマーとしては、従来の感光性樹脂組成物に用いられているバインダーポリマーを特に制限なく使用できる。バインダーポリマーとしては、アクリル樹脂、スチレン樹脂、エポキシ樹脂、アミド樹脂、アミドエポキシ樹脂、アルキド樹脂、フェノール樹脂等が挙げられる。これらの中では、アルカリ現像性に優れる観点から、アクリル樹脂が好ましい。バインダーポリマーは、1種を単独で又は2種以上を組み合わせて用いることができる。 [(A) Binder polymer]
As the binder polymer as the component (A), a binder polymer used in a conventional photosensitive resin composition can be used without particular limitation. Examples of the binder polymer include acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, and phenol resin. In these, an acrylic resin is preferable from a viewpoint which is excellent in alkali developability. A binder polymer can be used individually by 1 type or in combination of 2 or more types.
(B)成分(エチレン性不飽和結合を有する光重合性化合物)は、炭素数2~6のオキシアルキレン単位(アルキレングリコールユニット)を分子内に4~40有する化合物を含むことが好ましい。(B)成分がこのような化合物を含むことによって、(A)成分との相溶性を向上させることができる。 [(B) Photopolymerizable compound having an ethylenically unsaturated bond]
The component (B) (photopolymerizable compound having an ethylenically unsaturated bond) preferably contains a compound having 4 to 40 carbon atoms of an oxyalkylene unit (alkylene glycol unit) having 2 to 6 carbon atoms. When (B) component contains such a compound, compatibility with (A) component can be improved.
(C)成分(光重合開始剤)としては、例えば、ベンゾフェノン;N,N,N’,N’-テトラメチル-4,4’-ジアミノベンゾフェノン(別名:ミヒラーケトン)等のN,N,N’,N’-テトラアルキル-4,4’-ジアミノベンゾフェノン;2-ベンジル-2-ジメチルアミノ-1-(4-モルホリノフェニル)-1-ブタノン、2-メチル-1-[4-(メチルチオ)フェニル]-2-モルホリノ-1-プロパノン等の芳香族ケトン;アルキルアントラキノン等のキノン化合物;ベンゾインアルキルエーテル等のベンゾインエーテル化合物;ベンゾイン、アルキルベンゾイン等のベンゾイン化合物;ベンジルジメチルケタール等のベンジル誘導体;2-(o-クロロフェニル)-4,5-ジフェニルイミダゾール二量体、2-(o-クロロフェニル)-4,5-ジ(メトキシフェニル)イミダゾール二量体、2-(o-フルオロフェニル)-4,5-ジフェニルイミダゾール二量体、2-(o-メトキシフェニル)-4,5-ジフェニルイミダゾール二量体、2-(p-メトキシフェニル)-4,5-ジフェニルイミダゾール二量体等の2,4,5-トリアリールイミダゾール二量体;9-フェニルアクリジン、1,7-ビス(9,9’-アクリジニル)ヘプタン等のアクリジン誘導体;N-フェニルグリシン;N-フェニルグリシン誘導体;クマリン系化合物;1-フェニル-3-(4-メトキシスチリル)-5-(4-メトキシフェニル)ピラゾリン等のピラゾリン化合物;4-t-ブチルカテコール等のカテコール化合物が挙げられる。これらの中では、密着性及び感度を向上させる観点から、2,4,5-トリアリールイミダゾール二量体が好ましい。(C)成分は、1種を単独で又は2種以上を組み合わせて用いることができる。 [(C) Photopolymerization initiator]
Examples of the component (C) (photopolymerization initiator) include N, N, N ′ such as benzophenone; N, N, N ′, N′-tetramethyl-4,4′-diaminobenzophenone (also known as Michler's ketone). , N′-tetraalkyl-4,4′-diaminobenzophenone; 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -1-butanone, 2-methyl-1- [4- (methylthio) phenyl An aromatic ketone such as 2-morpholino-1-propanone; a quinone compound such as alkyl anthraquinone; a benzoin ether compound such as benzoin alkyl ether; a benzoin compound such as benzoin and alkyl benzoin; a benzyl derivative such as benzyldimethyl ketal; (O-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chloro Enyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenyl 2,4,5-triarylimidazole dimers such as imidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer; 9-phenylacridine, 1,7-bis (9 , 9′-acridinyl) heptane derivatives; N-phenylglycine; N-phenylglycine derivatives; coumarin compounds; 1-phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) pyrazoline etc. And catechol compounds such as 4-t-butylcatechol. Among these, 2,4,5-triarylimidazole dimer is preferable from the viewpoint of improving adhesion and sensitivity. (C) A component can be used individually by 1 type or in combination of 2 or more types.
感光性樹脂組成物は、必要に応じて、分子内に少なくとも1つのカチオン重合可能な環状エーテル基を有する光重合性化合物(オキセタン化合物等)、カチオン重合開始剤、染料(マラカイトグリーン等)、光発色剤(トリブロモフェニルスルホン、ロイコクリスタルバイオレット等)、熱発色防止剤、可塑剤(p-トルエンスルホンアミド等)、顔料、充填剤、消泡剤、難燃剤、安定剤、密着性付与剤、レベリング剤、剥離促進剤、酸化防止剤、香料、イメージング剤、熱架橋剤などの添加剤を含有してもよい。これらは、1種を単独で又は2種以上を組み合わせて用いることができる。これらの添加剤の含有量は、(A)成分及び(B)成分の総量100質量部に対して各々0.01~20質量部であってもよい。 [Other ingredients]
If necessary, the photosensitive resin composition comprises a photopolymerizable compound (such as an oxetane compound) having at least one cationically polymerizable cyclic ether group in the molecule, a cationic polymerization initiator, a dye (such as malachite green), light, and the like. Coloring agents (tribromophenyl sulfone, leuco crystal violet, etc.), thermal coloring inhibitors, plasticizers (p-toluenesulfonamide, etc.), pigments, fillers, antifoaming agents, flame retardants, stabilizers, adhesion-imparting agents, You may contain additives, such as a leveling agent, peeling promoter, antioxidant, a fragrance | flavor, an imaging agent, and a thermal crosslinking agent. These can be used alone or in combination of two or more. The content of these additives may be 0.01 to 20 parts by mass with respect to 100 parts by mass of the total amount of component (A) and component (B).
本実施形態に係るレジストパターンの形成方法は、感光性エレメント1の感光層20を基板上に積層する積層工程と、活性光線を感光層20の所定部分に照射して光硬化部を形成する露光工程と、感光層20における光硬化部以外の領域を除去する現像工程と、を備える。 <Method for forming resist pattern>
The resist pattern forming method according to the present embodiment includes a laminating step of laminating the
本実施形態に係るプリント配線板の製造方法は、前記レジストパターンの形成方法により形成されたレジストパターンを有する基板に対して、エッチング処理及びめっき処理からなる群より選ばれる少なくとも1種を施す工程を備える。ここで、基板のエッチング又はめっきは、現像されたレジストパターンをマスクとして用いて、基板の表面を公知の方法によりエッチング又はめっきすることによって行うことができる。 <Method for manufacturing printed wiring board>
The method for manufacturing a printed wiring board according to the present embodiment includes a step of applying at least one selected from the group consisting of an etching process and a plating process to a substrate having a resist pattern formed by the resist pattern forming method. Prepare. Here, the etching or plating of the substrate can be performed by etching or plating the surface of the substrate by a known method using the developed resist pattern as a mask.
本実施形態に係る感光性エレメントは、リジット基板と、当該リジット基板上に配置された絶縁膜とを備える半導体パッケージ基板に用いることもできる。この場合、感光層の光硬化部を絶縁膜として用いればよい。感光層の光硬化部を、例えば半導体パッケージ用のソルダーレジストとして用いる場合、上述のレジストパターンの形成方法における現像終了後、はんだ耐熱性、耐薬品性等を向上させる目的で、高圧水銀灯による紫外線照射又は加熱を行うことが好ましい。紫外線を照射させる場合は、必要に応じて、その照射量を調整することが可能であり、例えば0.2~10J/cm2程度の照射量で照射を行うこともできる。また、レジストパターンを加熱する場合は、100~170℃程度の範囲で15~90分程度加熱が行われることが好ましい。さらに、紫外線照射と加熱とを同時に行うことも可能であり、いずれか一方を実施した後、他方を実施することもできる。紫外線の照射と加熱とを同時に行う場合、はんだ耐熱性、耐薬品性等を効果的に付与する観点から、60~150℃に加熱することがより好ましい。 <Semiconductor package substrate manufacturing method>
The photosensitive element which concerns on this embodiment can also be used for a semiconductor package board | substrate provided with a rigid board | substrate and the insulating film arrange | positioned on the said rigid board | substrate. In this case, the photocured portion of the photosensitive layer may be used as the insulating film. When the photocured portion of the photosensitive layer is used as, for example, a solder resist for a semiconductor package, after the development in the resist pattern forming method, ultraviolet irradiation with a high-pressure mercury lamp is performed for the purpose of improving solder heat resistance, chemical resistance, etc. Or it is preferable to heat. In the case of irradiating with ultraviolet rays, the irradiation amount can be adjusted as necessary. For example, irradiation can be performed at an irradiation amount of about 0.2 to 10 J / cm 2 . When the resist pattern is heated, it is preferable that the heating is performed in the range of about 100 to 170 ° C. for about 15 to 90 minutes. Furthermore, it is also possible to perform ultraviolet irradiation and heating at the same time, and after performing one of them, the other can be performed. When ultraviolet irradiation and heating are performed simultaneously, heating to 60 to 150 ° C. is more preferable from the viewpoint of effectively imparting solder heat resistance, chemical resistance, and the like.
表1に示した組成のバインダーポリマーを下記の合成例に従って合成した。 <Synthesis of binder polymer>
The binder polymer having the composition shown in Table 1 was synthesized according to the following synthesis example.
ポンプ:日立 L-6000型[株式会社日立製作所製]
カラム:Gelpack GL-R420+Gelpack GL-R430+Gelpack GL-R440(計3本)[以上、日立化成株式会社製、商品名]
溶離液:テトラヒドロフラン
測定温度:40℃
流量:2.05mL/分
検出器:日立 L-3300型RI[株式会社日立製作所製、商品名] [GPC conditions]
Pump: Hitachi L-6000 type [manufactured by Hitachi, Ltd.]
Column: Gelpack GL-R420 + Gelpack GL-R430 + Gelpack GL-R440 (3 in total) [above, manufactured by Hitachi Chemical Co., Ltd., trade name]
Eluent: Tetrahydrofuran Measurement temperature: 40 ° C
Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI [manufactured by Hitachi, Ltd., trade name]
合成したバインダーポリマー溶液を三角フラスコに秤量した後、混合溶剤(質量比:トルエン/メタノール=70/30)を加えてバインダーポリマーを溶解させた。次に、指示薬としてフェノールフタレイン溶液を添加した後、0.1N水酸化カリウムアルコール溶液で滴定し、酸価を測定した。 [Measurement method of acid value]
After the synthesized binder polymer solution was weighed in an Erlenmeyer flask, a mixed solvent (mass ratio: toluene / methanol = 70/30) was added to dissolve the binder polymer. Next, after adding a phenolphthalein solution as an indicator, the solution was titrated with a 0.1N potassium hydroxide alcohol solution to measure the acid value.
下記表2に示した各成分を配合して感光性樹脂組成物の溶液を調製した。 <Preparation of solution of photosensitive resin composition>
Each component shown in the following Table 2 was blended to prepare a photosensitive resin composition solution.
感光性エレメントの支持フィルムとして、表3に示した支持フィルム(表3中、「フィルム名」)を用意した。各支持フィルムの詳細は下記のとおりである。 <Production of photosensitive element>
As the support film for the photosensitive element, the support film shown in Table 3 (“film name” in Table 3) was prepared. Details of each support film are as follows.
FB-40:PETフィルムと、当該PETフィルムの両面に配置された滑剤層(粒子を含有する樹脂層。含まれる粒子の平均粒径:1μm以下)と、を有する3層構造の二軸配向フィルム;東レ株式会社製
A-1517:PETフィルムと、当該PETフィルムの一方面に配置された第1の滑剤層(粒子を含有する樹脂層)と、前記PETフィルムの他方面に配置された第2の滑剤層(粒子を含有する樹脂層。含まれる粒子の平均粒径:2μm以上)とを有する2層構造の二軸配向フィルム;東洋紡績株式会社製
A-4100:PETフィルムと、当該PETフィルムの一方面に配置された第1の滑剤層(粒子を含有する樹脂層)と、前記PETフィルムの他方面に配置された第2の滑剤層(粒子を含有する樹脂層。含まれる粒子の平均粒径:2μm以上)とを有する2層構造の二軸配向フィルム;東洋紡績株式会社製
G2H:粒子(平均粒径:2μm以上)を含有する単層構造の二軸配向PETフィルム;帝人デュポンフィルム株式会社製 QS series: A biaxially oriented film having a three-layer structure having a PET film and a lubricant layer (resin layer containing particles) disposed on both sides of the PET film. The number of lubricants contained in one lubricant layer is extremely small compared to the other lubricant layer; FB-40 manufactured by Toray Industries, Inc .: PET film and a lubricant layer (resin containing particles) disposed on both sides of the PET film A biaxially oriented film having a three-layer structure having an average particle diameter of particles of 1 μm or less; manufactured by Toray Industries, Inc. A-1517: PET film and a first film disposed on one side of the PET film A lubricant layer (resin layer containing particles) and a second lubricant layer (resin layer containing particles; average particle diameter of contained particles: 2 μm or more) disposed on the other surface of the PET film. A biaxially oriented film having a two-layer structure: A-4100 manufactured by Toyobo Co., Ltd., a PET film, a first lubricant layer (resin layer containing particles) arranged on one surface of the PET film, and the PET film A biaxially oriented film having a two-layer structure having a second lubricant layer (resin layer containing particles; average particle diameter of contained particles: 2 μm or more) disposed on the other side of the rumm; G2H manufactured by Toyobo Co., Ltd. : Biaxially oriented PET film having a single layer structure containing particles (average particle size: 2 μm or more); manufactured by Teijin DuPont Films Ltd.
銅箔(厚さ:35μm)を両面に積層したガラスエポキシ材である両面銅張積層板(日立化成株式会社製、商品名「MLC-E-679」、125mm×200mm角)の銅表面を酸洗及び水洗後、空気流で乾燥した。得られた銅張積層板を80℃に加温した後、保護フィルムを剥離しながら、感光層が銅表面に接するように感光性エレメントをラミネートした。これにより、銅張積層板、感光層及び支持フィルムの順に積層された積層体を得た。ラミネートは、110℃のヒートロールを用いて、0.4MPaの圧着圧力、1.5m/分のロール速度で行った。 <Production of laminate>
The copper surface of a double-sided copper-clad laminate (made by Hitachi Chemical Co., Ltd., trade name “MLC-E-679”, 125 mm × 200 mm square) made of glass epoxy material with copper foil (thickness: 35 μm) laminated on both sides is acidified After washing and washing with water, it was dried with an air stream. The obtained copper-clad laminate was heated to 80 ° C., and then the photosensitive element was laminated so that the photosensitive layer was in contact with the copper surface while peeling off the protective film. Thereby, the laminated body laminated | stacked in order of the copper clad laminated board, the photosensitive layer, and the support film was obtained. Lamination was performed using a 110 ° C. heat roll at a pressure of 0.4 MPa and a roll speed of 1.5 m / min.
(最少現像時間の測定)
高圧水銀灯を有する投影露光機(UX-7シリーズ、ウシオ電機株式会社製)を用いて試験片(積層体)の感光層を250mJ/cm2で露光した後、支持フィルムを剥離した。次に、感光層をスプレー現像し、未露光部が完全に除去される時間を測定し、最少現像時間として得た。測定結果を表3に示す。 <Evaluation>
(Measurement of minimum development time)
The photosensitive layer of the test piece (laminate) was exposed at 250 mJ / cm 2 using a projection exposure machine (UX-7 series, manufactured by USHIO INC.) Having a high-pressure mercury lamp, and then the support film was peeled off. Next, the photosensitive layer was spray-developed, and the time during which the unexposed area was completely removed was measured to obtain the minimum development time. Table 3 shows the measurement results.
試験片(積層体)の支持フィルム上に、ネガとして41段ステップタブレットを載置した。そして、高圧水銀灯を有する投影露光機(UX-7シリーズ、ウシオ電機株式会社製)を用いて、現像後のレジスト硬化段数が9段となる所定の照射エネルギー量を求めるため、照射量を調整しつつ感光層を露光した。 (Measurement of light sensitivity)
A 41-step tablet was placed as a negative on the support film of the test piece (laminate). Then, using a projection exposure machine with a high-pressure mercury lamp (UX-7 series, manufactured by Ushio Electric Co., Ltd.), the amount of irradiation is adjusted in order to obtain a predetermined amount of irradiation energy at which the number of resist curing steps after development is nine. While exposing the photosensitive layer.
密着性及び解像度を調べるため、41段ステップタブレットを有するフォトツールと、密着性評価用ネガとしてライン幅/スペース幅が2/6~20/90(単位:μm)の配線パターンを有するガラスクロムタイプのフォトツールと、解像度評価用ネガとしてライン幅/スペース幅が2/2~20/20(単位:μm)の配線パターンを有するガラスクロムタイプのフォトツールと、高圧水銀灯を有する投影露光機(UX-7シリーズ、ウシオ電機株式会社製)とを用いて、41段ステップタブレットの現像後の残存ステップ段数が9段となる照射エネルギー量で前記積層体の感光層の露光を行った。次に、支持フィルムを剥離し、30℃で1質量%炭酸ナトリウム水溶液を最少現像時間の2倍の時間でスプレー現像し、未露光部分を除去して現像を行った。ここで、密着性及び解像度は、現像処理によって未露光部をきれいに除去することができたライン幅間のスペース幅の最も小さい値(単位:μm)により評価した。なお、密着性及び解像度の評価は、数値が小さいほど良好な値である。結果を表3に示した。 (Measurement of adhesion and resolution)
In order to check the adhesion and resolution, a photo tool having a 41-step tablet and a glass chrome type having a wiring pattern with a line width / space width of 2/6 to 20/90 (unit: μm) as a negative for adhesion evaluation , A glass chrome type photo tool having a wiring pattern with a line width / space width of 2/2 to 20/20 (unit: μm) as a negative for resolution evaluation, and a projection exposure machine (UX) having a high-pressure mercury lamp -7 series (manufactured by Ushio Electric Co., Ltd.) was used to expose the photosensitive layer of the laminate with an irradiation energy amount such that the number of remaining steps after development of the 41-step tablet was 9 steps. Next, the support film was peeled off, and a 1% by mass aqueous sodium carbonate solution was spray-developed at 30 ° C. in a time twice as long as the minimum development time, and the unexposed portion was removed for development. Here, the adhesion and resolution were evaluated by the smallest value (unit: μm) of the space width between the line widths in which the unexposed portion could be removed cleanly by the development process. In addition, evaluation of adhesiveness and resolution is so favorable that a numerical value is small. The results are shown in Table 3.
走査型電子顕微鏡SU-1500(株式会社日立製作所製)を用いて、前記密着性及び解像度の測定で使用した基板のレジストラインを観察し、2mm2あたりのレジスト欠損の数を評価した。結果を表3に示した。 (Evaluation of resist defect)
Using a scanning electron microscope SU-1500 (manufactured by Hitachi, Ltd.), the resist lines of the substrate used in the measurement of adhesion and resolution were observed, and the number of resist defects per 2 mm 2 was evaluated. The results are shown in Table 3.
Claims (6)
- 支持フィルムと、当該支持フィルム上に配置された感光層と、を備える感光性エレメントであって、
前記感光層が、バインダーポリマーと、エチレン性不飽和結合を有する光重合性化合物と、光重合開始剤と、を含有し、
前記支持フィルムの前記感光層側の表面における直径2μm以上の欠陥の数が2mm2あたり30個以下である、感光性エレメント。 A photosensitive element comprising a support film and a photosensitive layer disposed on the support film,
The photosensitive layer contains a binder polymer, a photopolymerizable compound having an ethylenically unsaturated bond, and a photopolymerization initiator,
Wherein the number of light-sensitive layer side diameter 2μm or more defects in the surface of more than 30 per 2 mm 2, the photosensitive element of the support film. - 前記支持フィルムが、ポリエステルフィルムと、樹脂層と、滑剤層と、を有し、
前記樹脂層が、前記感光層とポリエステルフィルムとの間に配置され、
前記滑剤層が、前記ポリエステルフィルムの前記樹脂層とは反対側に配置されている、請求項1に記載の感光性エレメント。 The support film has a polyester film, a resin layer, and a lubricant layer,
The resin layer is disposed between the photosensitive layer and the polyester film;
The photosensitive element of Claim 1 with which the said lubricant layer is arrange | positioned on the opposite side to the said resin layer of the said polyester film. - 前記支持フィルムの厚さが1~200μmである、請求項1又は2に記載の感光性エレメント。 3. The photosensitive element according to claim 1, wherein the support film has a thickness of 1 to 200 μm.
- 前記支持フィルムのヘーズ値が0.01~1.0%である、請求項1~3のいずれか一項に記載の感光性エレメント。 The photosensitive element according to any one of claims 1 to 3, wherein the support film has a haze value of 0.01 to 1.0%.
- 請求項1~4いずれか一項に記載の感光性エレメントの前記感光層を基板上に積層する積層工程と、
活性光線を前記感光層の所定部分に照射して光硬化部を形成する露光工程と、
前記感光層における前記光硬化部以外の領域を除去する現像工程と、を備える、レジストパターンの形成方法。 A laminating step of laminating the photosensitive layer of the photosensitive element according to any one of claims 1 to 4 on a substrate;
An exposure step of irradiating a predetermined portion of the photosensitive layer with actinic rays to form a photocured portion;
A development step of removing a region other than the photocured portion in the photosensitive layer. - 請求項5に記載のレジストパターンの形成方法により形成されたレジストパターンを有する基板に対して、エッチング処理及びめっき処理からなる群より選ばれる少なくとも1種を施す工程を備える、プリント配線板の製造方法。 A method for producing a printed wiring board, comprising a step of applying at least one selected from the group consisting of etching treatment and plating treatment to a substrate having a resist pattern formed by the method for forming a resist pattern according to claim 5 .
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KR20230096046A (en) | 2021-01-29 | 2023-06-29 | 아사히 가세이 가부시키가이샤 | Photosensitive element and method of forming resist pattern |
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