WO2018098910A1 - 一种液体浸没式芯片散热器 - Google Patents

一种液体浸没式芯片散热器 Download PDF

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Publication number
WO2018098910A1
WO2018098910A1 PCT/CN2017/074711 CN2017074711W WO2018098910A1 WO 2018098910 A1 WO2018098910 A1 WO 2018098910A1 CN 2017074711 W CN2017074711 W CN 2017074711W WO 2018098910 A1 WO2018098910 A1 WO 2018098910A1
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chip
oil collecting
flow
heat sink
grooves
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PCT/CN2017/074711
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English (en)
French (fr)
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肖玮
徐凌燕
赵阳
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广东合一新材料研究院有限公司
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Publication of WO2018098910A1 publication Critical patent/WO2018098910A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air

Definitions

  • the present invention relates to the field of heat dissipation and cooling of electronic devices, and more particularly to a liquid immersion chip heat sink.
  • the electronic chip heat sink is formed of a metal material, and is thermally conducted by contact with the electronic chip, and then forced air convection cooling by a fan or the like, which not only increases the power consumption of the fan, but also increases the noise, and affects the use environment of the high-power electronic device.
  • Air cooling is required to reduce the ambient temperature to about 25 °C to ensure that the surface temperature of the chip is within a suitable range.
  • the air conditioner consumes a large amount of energy and the energy saving effect is poor.
  • forced cooling by the fan requires high air cleanliness.
  • the liquid working medium in the liquid spray cooling has a short contact time with the chip, less heat absorption, and low efficiency of use of the liquid working medium.
  • the object of the present invention is to provide a liquid immersion chip heat sink, which solves the problems that the liquid working medium and the chip have short contact time, low heat absorption and low liquid working efficiency in the prior liquid spray cooling.
  • a liquid immersion chip heat sink includes a housing attached to the upper side of the chip; the housing has an oil collecting groove having an open upper end, and the bottom end of the housing is provided with a plurality of flow channels, the flow channel and The oil collecting groove is communicated through the flow hole; the lower side of the flow channel is open, and the lower opening is in contact with the chip; the outer side of the casing is provided with a plurality of overflow grooves, the inner port of the overflow groove and the set The oil grooves are connected, and the outer port opens to the outside of the casing.
  • the oil collecting groove has a bowl shape.
  • the oil collecting groove has a cylindrical shape.
  • the flow hole is a vertical through hole, the upper end is in communication with the bottom of the oil collecting groove, and the lower end is in communication with the flow channel.
  • a plurality of the flow channels are circumferentially arranged, and each of the plurality of flow channels has a tip that is converged to communicate with the flow hole.
  • a plurality of the overflow channels are horizontally arranged.
  • the overflow trough is located at an intermediate portion of the side wall of the casing.
  • the outer contour of the housing is cylindrical.
  • the present invention concentrates the liquid working medium through the oil collecting groove, and finally contacts the chip through the circulation groove, thereby relatively prolonging the contact time between the liquid working medium and the chip. It is beneficial to the surface temperature of the chip, fully dissipate heat, improve the temperature difference between the chip and the oil, thereby improving the use efficiency of the liquid working medium; on the other hand, the liquid working medium is stored in the oil collecting tank for a period of time, and partial warming can be performed to avoid sudden temperature changes. The impact on the chip.
  • Figure 1 is a cross-sectional view of a liquid immersion chip heat sink of the present invention
  • Figure 2 is a schematic view showing the structure of the overflow tank
  • Figure 3 is a schematic view showing the structure of the circulation groove
  • a liquid immersion chip heat sink includes a housing 1 attached to the chip 6, the outer contour of the housing being cylindrical, and the inside of the housing 1 Open the bowl-shaped oil sump with the upper opening 2.
  • the contour of the oil collecting groove 2 can also be a cylindrical body for collecting the liquid working medium dripped above.
  • the upper end opening of the bowl-shaped oil collecting groove 2 is large, and the side wall smoothly transitions to the bottom.
  • a vertical flow hole 4 is opened in the bottom of the oil collecting groove, and twelve flow grooves 5 are communicated in the lower end of the flow hole 4, and the twelve flow grooves 5 are horizontally diverged in a circumferential direction, and the lower side of the flow channel 5 is opened and lowered.
  • the opening is in contact with the chip 6, and the cooling medium in the oil collecting groove 2 enters the flow channel 5 through the flow hole 4, thereby contacting the chip 6, and the liquid working medium is directly in contact with the chip 6 through the heat sink structure and can maintain sufficient Time, the liquid working medium and the chip 6 fully exchange heat, improve the temperature difference between the heat sink entering and leaving the liquid working medium, thereby improving the utilization efficiency of the liquid working medium.
  • a plurality of overflow grooves 3 are formed on the circumferential side of the intermediate portion of the side wall of the casing 1, and the overflow groove 3 uniformly fills the side wall annular surfaces of the casing 1, each overflow groove
  • the inner port of the third port is in communication with the oil collecting groove 2, and the outer port is open to the outside of the casing 1, and the oil collecting groove 2 is communicated with the outer side of the casing 1, so that the liquid working medium inside the oil collecting groove 2 is concentrated to the height of the overflow tank 3.
  • the liquid working fluid flows out of the overflow tank 3.
  • the liquid immersion chip 6 heat sink of the invention can be made of light weight and low cost material, and has high cost performance compared with the existing metal alloy heat sink; at the same time, the use of the fan in the server is avoided, the power consumption is reduced, and the power consumption is reduced. noise.
  • the external sprinkler system When the chip 6 starts to work, the external sprinkler system is opened, and the liquid working fluid sprayed on the upper end is concentrated to the bottom of the casing 1 through the bowl-shaped oil collecting groove 2, so that the liquid level is continuously raised; when the liquid level rises to the height of the overflow tank 3 When the liquid working fluid flows out of the overflow tank 3 to maintain the liquid level; at the same time, the liquid working medium enters the liquid circulation tank 5 through the liquid circulation hole 4 at the bottom, and is in direct contact with the underlying chip 6 through the bottom opening of the liquid circulation tank 5. The heat generated by the heating element is taken away to a distant place, and then the cooled liquid working medium is sprayed again onto the radiator to circulate the above process.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种液体浸没式芯片散热器，包括附着在芯片（6）上方的壳体（1）；壳体内部具有上端开口的集油槽（2），壳体底端设置有多个流通槽（5），流通槽与集油槽通过流通孔（4）连通；流通槽的下侧开口，下开口与芯片接触；壳体周侧开设有多个溢流槽（3），溢流槽的内端口与集油槽连通，外端口通向壳体外侧。通过集油槽将液体工质汇聚，最后经由流通槽与芯片接触，一方面相对延长了液体工质与芯片的接触时间，有利于芯片表面均温，充分散热，提高芯片进出油的温差，从而提高液体工质的使用效率；另一方面液体工质在集油槽内储存一段时间，可以进行部分预热，避免温度急剧变化对芯片的影响。

Description

一种液体浸没式芯片散热器 技术领域
[根据细则91更正 30.03.2017]　
本发明涉及电子器件的散热冷却领域，尤其涉及一种液体浸没式芯片散热器。
背景技术
随着电子元器件的小型化、微小型化，集成电路的高集成化和微组装，元器件的热流密度不断提高，热设计面临严峻挑战。电子功率模块、电子芯片等大功率器件在工作时产生大量的热量，必须被冷却装置带走。目前使用的电子芯片散热器存在以下缺点：
空气冷却中，电子芯片散热器采用金属材料成型，通过与电子芯片接触进行导热，然后采用风扇等强制空气对流冷却，不仅增加了风扇功耗，并且噪声提高，影响大功率电子器件的使用环境。采用空气冷却，要求环境温度降低到25℃左右才能保证芯片表面温度在适宜范围内，空调耗能大，节能效果差。另外由于电子器件的放置环境要求无尘，采用风扇强制冷却对空气清洁度要求较高。
液体喷淋冷却中液体工质与芯片接触时间短，吸热少，液体工质使用效率低。
针对以上缺点，急需发明一种使用在液体喷淋冷却中的散热器，来延长液体工质与芯片的接触时间，充分散热，提高芯片进出油的温差，从而提高液体工质的使用效率。
发明内容
本发明的目的是提供一种液体浸没式芯片散热器，解决现有液体喷淋冷却中液体工质与芯片接触时间短，吸热少，液体工质使用效率低的问题。
为解决上述技术问题，本发明采用如下技术方案：
本发明一种液体浸没式芯片散热器，包括附着在芯片上方的壳体；所述壳体内部具有上端开口的集油槽，所述壳体底端设置有多个流通槽，所述流通槽与所述集油槽通过流通孔连通；所述流通槽的下侧开口，下开口与芯片接触；所述壳体周侧开设有多个溢流槽，所述溢流槽的内端口与所述集油槽连通，外端口通向所述壳体外侧。
进一步的，所述集油槽的轮廓为碗状。
再进一步的，所述集油槽的轮廓为圆柱体。
再进一步的，所述流通孔为竖直通孔，上端与所述集油槽的底部连通，下端与所述流通槽连通。
再进一步的，多个所述流通槽呈圆周排列，多个流通槽均有一个端头汇聚到中间与所述流通孔连通。
再进一步的，多个所述溢流槽水平呈圆周排列。
再进一步的，所述溢流槽位于所述壳体的侧壁中间部位。
再进一步的，所述壳体的外轮廓呈圆柱状。
与现有技术相比，本发明的有益技术效果如下：
本发明与将液体工质直接喷淋至芯片表面的冷却方式相比，通过集油槽将液体工质汇聚，最后经由流通槽与芯片接触，一方面相对延长了液体工质与芯片的接触时间，有利于芯片表面均温，充分散热，提高芯片进出油的温差，从而提高液体工质的使用效率；另一方面液体工质在集油槽内储存一段时间，可以进行部分预热，避免温度急剧变化对芯片的影响。
附图说明
下面结合附图说明对本发明作进一步说明。
图1为本发明液体浸没式芯片散热器剖视图；
图2为溢流槽结构示意图；
图3为流通槽结构示意图；
附图标记说明：1、壳体；2、集油槽；3、溢流槽；4、流通孔；5、流通槽；6、芯片。
具体实施方式
如图1-3所示，一种液体浸没式芯片散热器的其中一种具体实施例，包括附着在芯片6上方的壳体1，壳体的外轮廓为圆柱形，所述壳体1内部开设有上端开口的碗状集油槽 2，其它的实施例中也可以将集油槽2的轮廓开设为圆柱体，用于收集上方滴落的液体工质，碗状集油槽2的上端开口大，侧壁平滑过渡至底部。集油槽底部开设有竖直的流通孔4，流通孔4下端连通有十二个流通槽5，十二个流通槽5水平呈圆周状向四周发散，所述流通槽5的下侧开口，下开口与芯片6接触，集油槽2内的冷却工质经由流通孔4进入流通槽5内，从而与芯片6接触，通过此种散热器结构使液体工质与芯片6直接接触并且可以保持足够的时间，液体工质与芯片6充分换热，提高散热器进出液体工质的温差，从而提高液体工质的利用效率。
除上述技术特征外，所述壳体1的侧壁中间位置周侧开设有多个溢流槽3，溢流槽3将壳体1的侧壁环面均匀排布满，每个溢流槽3的内端口与所述集油槽2连通，外端口通向所述壳体1外侧，将集油槽2与壳体1外侧连通，使集油槽2内部液体工质汇聚到溢流槽3高度时，液体工质从溢流槽3流出。
本发明的液体浸没式芯片6散热器可以采用质量轻、成本低的材质制作，与现有的金属合金散热器相比，性价比高；同时避免了服务器内风扇的使用，降低功耗，减小噪音。
当芯片6开始工作时，外部喷淋系统开启，上端喷淋的液体工质通过碗状集油槽2汇聚到壳体1底部从而液面不断升高；当液面升高到溢流槽3高度时，液体工质从溢流槽3流出来保持液面高度；同时液体工质通过底部的液体流通孔4进入液体流通槽5，并且通过液体流通槽5底部开口，与下面的芯片6直接接触，将发热元件产生的热量带到远处散掉，然后将冷却的液体工质再次喷淋到散热器上，循环上述过程。
以上所述的实施例仅是对本发明的优选方式进行描述，并非对本发明的范围进行限定，在不脱离本发明设计精神的前提下，本领域普通技术人员对本发明的技术方案做出的各种变形和改进，均应落入本发明权利要求书确定的保护范围内。

Claims (8)

  1. 一种液体浸没式芯片散热器，其特征在于：包括附着在芯片(6)上方的壳体(1)；所述壳体(1)内部具有上端开口的集油槽(2)，所述壳体(1)底端设置有多个流通槽(5)，所述流通槽(5)与所述集油槽(2)通过流通孔(4)连通；所述流通槽(5)的下侧开口，下开口与芯片(6)接触；所述壳体(1)周侧开设有多个溢流槽(3)，所述溢流槽(3)的内端口与所述集油槽(2)连通，外端口通向所述壳体(1)外侧。
  2. 根据权利要求1所述的液体浸没式芯片散热器，其特征在于：所述集油槽(2)的轮廓为碗状。
  3. 根据权利要求1所述的液体浸没式芯片散热器，其特征在于：所述集油槽(2)的轮廓为圆柱体。
  4. 根据权利要求2或3所述的液体浸没式芯片散热器，其特征在于：所述流通孔(4)为竖直通孔，上端与所述集油槽(2)的底部连通，下端与所述流通槽(5)连通。
  5. 根据权利要求4所述的液体浸没式芯片散热器，其特征在于：多个所述流通槽(5)呈圆周排列，多个流通槽(5)均有一个端头汇聚到中间与所述流通孔(4)连通。
  6. 根据权利要求1所述的液体浸没式芯片散热器，其特征在于：多个所述溢流槽(3)水平呈圆周排列。
  7. 根据权利要求6所述的液体浸没式芯片散热器，其特征在于：所述溢流槽(3)位于所述壳体(1)的侧壁中间部位。
  8. 根据权利要求1所述的液体浸没式芯片散热器，其特征在于：所述壳体(1)的外轮廓呈圆柱状。
PCT/CN2017/074711 2016-11-29 2017-02-24 一种液体浸没式芯片散热器 WO2018098910A1 (zh)

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CN106409791B (zh) * 2016-11-29 2020-05-22 广东合一新材料研究院有限公司 一种液体浸没式芯片散热器
CN108966611B (zh) * 2018-09-11 2024-05-28 广东西江数据科技有限公司 一种液体浸没冷却式交换机及交换机组
CN110473847A (zh) * 2019-07-15 2019-11-19 广东合一新材料研究院有限公司 一种适用于喷淋液冷服务器的平放式芯片散热器
CN111965520A (zh) * 2020-07-24 2020-11-20 武汉锐科光纤激光技术股份有限公司 一种芯片测试设备
CN111948513A (zh) * 2020-07-24 2020-11-17 武汉锐科光纤激光技术股份有限公司 一种芯片控温设备
CN111965519A (zh) * 2020-07-24 2020-11-20 武汉锐科光纤激光技术股份有限公司 一种芯片测试设备

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