WO2018097525A3 - Method for manufacturing printed circuit board and printed circuit board manufactured thereby - Google Patents

Method for manufacturing printed circuit board and printed circuit board manufactured thereby Download PDF

Info

Publication number
WO2018097525A3
WO2018097525A3 PCT/KR2017/012758 KR2017012758W WO2018097525A3 WO 2018097525 A3 WO2018097525 A3 WO 2018097525A3 KR 2017012758 W KR2017012758 W KR 2017012758W WO 2018097525 A3 WO2018097525 A3 WO 2018097525A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
sheet
preparing
manufacturing
Prior art date
Application number
PCT/KR2017/012758
Other languages
French (fr)
Korean (ko)
Other versions
WO2018097525A2 (en
Inventor
단성백
Original Assignee
주식회사 아모그린텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아모그린텍 filed Critical 주식회사 아모그린텍
Publication of WO2018097525A2 publication Critical patent/WO2018097525A2/en
Publication of WO2018097525A3 publication Critical patent/WO2018097525A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

Provided is a method for manufacturing a printed circuit board in which a plurality of base sheets having an adhesive layer and an electrode formed on a hard film having a low dielectric constant are stacked to minimize dielectric loss due to high frequency signals and prevent the loss of the high frequency signals; and a circuit board manufactured thereby. The disclosed method for manufacturing a printed circuit board comprises the steps of: preparing a base sheet; preparing an adhesive sheet; preparing a flame retardant sheet; and laminating a plurality of base sheets, the adhesive sheet and the flame retardant sheet by applying heat and press, wherein the step of preparing a base sheet comprises the steps of: forming a sheet adhesive layer on one side of a hard polypropylene film; and forming an internal electrode on the other side of the hard polypropylene film.
PCT/KR2017/012758 2016-11-24 2017-11-10 Method for manufacturing printed circuit board and printed circuit board manufactured thereby WO2018097525A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2016-0157718 2016-11-24
KR1020160157718A KR102021144B1 (en) 2016-11-24 2016-11-24 Method for manufacturing circuit board and circuit board manufactured by the method

Publications (2)

Publication Number Publication Date
WO2018097525A2 WO2018097525A2 (en) 2018-05-31
WO2018097525A3 true WO2018097525A3 (en) 2018-08-09

Family

ID=62195314

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2017/012758 WO2018097525A2 (en) 2016-11-24 2017-11-10 Method for manufacturing printed circuit board and printed circuit board manufactured thereby

Country Status (2)

Country Link
KR (1) KR102021144B1 (en)
WO (1) WO2018097525A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070292668A1 (en) * 2003-09-19 2007-12-20 Satoru Amou Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
KR20080031793A (en) * 2006-10-06 2008-04-11 히다치 가세고교 가부시끼가이샤 The polybutadiene resin composition which controlled the phase separation and printed wiring board using the resin composition
US20100307803A1 (en) * 2006-08-08 2010-12-09 Sankar Paul Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
US20110214906A1 (en) * 2010-03-04 2011-09-08 Rogers Corporation Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
KR20120072691A (en) * 2010-12-24 2012-07-04 엘지이노텍 주식회사 Flexible printed circuit board and the method for manufacturing the same

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160097948A (en) 2015-02-10 2016-08-18 삼성전기주식회사 Flexible printed circuit board and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070292668A1 (en) * 2003-09-19 2007-12-20 Satoru Amou Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof
US20100307803A1 (en) * 2006-08-08 2010-12-09 Sankar Paul Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith
KR20080031793A (en) * 2006-10-06 2008-04-11 히다치 가세고교 가부시끼가이샤 The polybutadiene resin composition which controlled the phase separation and printed wiring board using the resin composition
US20110214906A1 (en) * 2010-03-04 2011-09-08 Rogers Corporation Dielectric bond plies for circuits and multilayer circuits, and methods of manufacture thereof
KR20120072691A (en) * 2010-12-24 2012-07-04 엘지이노텍 주식회사 Flexible printed circuit board and the method for manufacturing the same

Also Published As

Publication number Publication date
WO2018097525A2 (en) 2018-05-31
KR20180058573A (en) 2018-06-01
KR102021144B1 (en) 2019-09-11

Similar Documents

Publication Publication Date Title
WO2020092334A3 (en) Flexible hybrid interconnect circuits
PH12014000075A1 (en) Laminated electronic component and manufacturing method for the same
TW201613040A (en) Integration of embedded thin film capacitors in package substrates
WO2013033402A8 (en) Method of manufacturing a high definition heater system
WO2014153391A3 (en) Dielectric waveguide and method of manufacture
CA2891524C (en) Making a multilayer article, blank, and insulating cup
WO2011155750A3 (en) Voice film having multi-layer structure for plate-type speaker
CN103906379A (en) Press fit method for multi-layer printed circuit board
WO2018070801A3 (en) Multilayered carrier film, element transfer method using same, and electronic product manufacturing method for manufacturing electronic product by using same element transfer method
MY193835A (en) Production method for printed wiring board having dielectric layer
WO2014131071A3 (en) Semi-finished product for the production of a printed circuit board and method for producing the same
EP4155052A4 (en) Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed circuit board, dielectric sheet, and substrate for high-frequency printed circuit board
MX2019004507A (en) Asymmetric laminates comprising asymmetric multiple layer interlayer.
EP3683050A4 (en) High-frequency circuit laminate, method for manufacturing same, and b-stage sheet
WO2018035536A3 (en) Method for producing a printed circuit board
TW200606968A (en) Method for manufacturing multilayer electronic component
WO2009063936A1 (en) Adhesive sheet and laminate thereof
EP3403801A4 (en) Frp precursor, laminated plate, metal-clad laminate, printed circuit board, semiconductor package, and method for producing same
JP2013111980A5 (en)
WO2008111309A1 (en) Recognition mark, and circuit substrate manufacturing method
TW200741770A (en) Production method of multilayer ceramic electronic device
MY165848A (en) Parallel stacked symmetrical and differential inductor
EA202190254A1 (en) METHOD FOR MANUFACTURING PANELS FROM PLATE, PRESSURE PLATE, METHOD FOR MANUFACTURING PLATE AND PLATE
EP3915779A4 (en) Double-sided metal-clad laminate and production method therefor, insulating film, and electronic circuit base board
TW200606967A (en) Method for manufacturing multilayer electronic component

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17874183

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17874183

Country of ref document: EP

Kind code of ref document: A2