WO2018078057A1 - Appliance for manufacturing a three-dimensional object by means of an additive manufacturing method, and associated additive manufacturing method - Google Patents

Appliance for manufacturing a three-dimensional object by means of an additive manufacturing method, and associated additive manufacturing method Download PDF

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Publication number
WO2018078057A1
WO2018078057A1 PCT/EP2017/077522 EP2017077522W WO2018078057A1 WO 2018078057 A1 WO2018078057 A1 WO 2018078057A1 EP 2017077522 W EP2017077522 W EP 2017077522W WO 2018078057 A1 WO2018078057 A1 WO 2018078057A1
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WO
WIPO (PCT)
Prior art keywords
powder
additive manufacturing
layer
sectors
plates
Prior art date
Application number
PCT/EP2017/077522
Other languages
French (fr)
Inventor
Gilles WALRAND
Tiberiu Minea
Didier VALENTIN
Jean-Claude Aperce
Original Assignee
Addup
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Addup filed Critical Addup
Publication of WO2018078057A1 publication Critical patent/WO2018078057A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/30Process control
    • B22F10/32Process control of the atmosphere, e.g. composition or pressure in a building chamber
    • B22F10/322Process control of the atmosphere, e.g. composition or pressure in a building chamber of the gas flow, e.g. rate or direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/20Direct sintering or melting
    • B22F10/28Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40Radiation means
    • B22F12/44Radiation means characterised by the configuration of the radiation means
    • B22F12/45Two or more
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/38Housings, e.g. machine housings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/40Radiation means
    • B22F12/49Scanners
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/90Means for process control, e.g. cameras or sensors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2202/00Treatment under specific physical conditions
    • B22F2202/06Use of electric fields
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02Details
    • H01J2237/022Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02Details
    • H01J2237/026Shields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02Details
    • H01J2237/028Particle traps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency

Definitions

  • the present invention relates to selective additive manufacturing.
  • Selective additive manufacturing consists in producing three-dimensional objects by consolidating selected areas on successive layers of powder material (metal powder, ceramic powder, etc.). The consolidated areas correspond to successive sections of the three-dimensional object.
  • the consolidation is done, layer by layer, by a total or partial selective melting carried out with a source of consolidation.
  • This source is conventionally a source of radiation (for example a high power laser beam) or a source of particle beam (for example an electron beam - technology called EBM or "Electron Beam Melting" according to the English terminology generally used in the field).
  • the primary source is an electron gun, which is used to perform the selective fusion at the heart of the object.
  • a secondary source which is a laser source and which is used, layer after layer, to carry out the selective fusion at the level of the skin or border zones.
  • An example in this sense is for example described in the patent application WO2013 / 092997.
  • the vapor in the atomic state or in the form of clusters of atoms up to the powder (also called “clusters"), is produced by the vaporization of the surface under the effect of the primary beam (electrons or laser) intense providing the energy necessary for the melting of the powders.
  • This steam It is essentially neutral, because the evaporation process takes place, in general, at thermodynamic equilibrium.
  • the charged vapor thus formed has a high capacity to deposit (condensation) on any solid material with which this vapor comes into contact, and in particular on all metals but also on dielectric materials (ceramics, glass, plastic, etc.) or semiconductors (silicon, germanium, GaAs, etc.).
  • the particles of this vapor thus propagate to the walls in a ballistic manner at low pressure or diffusive up to atmospheric pressure.
  • the deposits that result are particularly harmful.
  • a general object of the invention is to overcome these problems of deposition.
  • the invention provides a solution for greatly limiting the deposits of vapor loaded into the selective additive manufacturing enclosure.
  • the invention proposes a solution that does not have the disadvantages of the solutions of the prior art.
  • the invention proposes an apparatus for manufacturing a three-dimensional object by selective additive manufacturing comprising in an enclosure:
  • a dispensing arrangement adapted to apply a layer of powder to said support or a previously consolidated layer, - at least one energy source adapted for the selective consolidation of a layer of powder applied by the dispensing arrangement, characterized in it comprises at least one protection element adapted to trap by electric polarization the charged vapor (in the form of positive or negative ions) in the chamber, said element being made of a material capable of being electrically polarized and being located in the vicinity of at least one module and / or optical / electronic component to protect deposits, the apparatus further comprising an electrical polarization fitting adapted to ensure the establishment of an electric field in and around said protection element during additive manufacturing operations.
  • said polarization protection element is a plate or sector of a heat shield that extends at least partially around the area on which the powder layers are applied.
  • said heat shield may comprise a conductive frame on which plates or sectors are reported on the one hand isolated from said chassis and on the other mutually isolated, said chassis being connected to ground or constituting a potential reference for the polarization assembly.
  • the invention relates to a selective additive manufacturing process in which a layer of additive manufacturing powder is applied to a previously consolidated plate or layer and a selective consolidation is implemented by total or partial fusion of the layer of powder applied by means of at least one consolidation source, characterized in that a protective element is electrically biased, said element being made of a material capable of being electrically polarized and being situated in the vicinity of at least one module and / or optical / electronic component to protect deposits between at least two sectors or at least two of said sectors, said polarization trapping vapor ions charged into the enclosure.
  • the method is for example implemented using such a device.
  • the apparatus and / or the method may comprise the following features, taken alone or in any of their technically possible combinations:
  • said polarization protection element is a plate or sector of a heat shield which extends at least partially around the area on which the powder layers are applied,
  • said heat shield comprises a conductive frame on which plates or sectors are reported on the one hand electrically insulated from said chassis and on the other mutually isolated, said chassis being connected to ground or constituting a potential reference for mounting of polarization, the frame is of truncated-pyramidal shape and comprises four uprights interconnected at their ends by two frames and in that the sectors comprise four plates attached to the uprights of said chassis,
  • the voltage between two plates or sectors is less than 100
  • the voltage between two plates or sectors is less than 75 V
  • the voltage between two plates or sectors is such that it can transmit to the free electrons an energy of 15 eV or greater
  • the electric field generated by the polarization circuit is substantially parallel, for example parallel, to the general plane of the support plate,
  • the manufacturing chamber is at atmospheric pressure or at a lower pressure or is under vacuum
  • FIG. 1 is a schematic representation of a selective additive manufacturing apparatus according to a possible embodiment of the invention.
  • FIGS. 2 and 3 illustrate two possible embodiments for the heat shield and the polarization circuit of an apparatus of the type of FIG. 1. DESCRIPTION OF ONE OR MORE MODES OF IMPLEMENTATION AND REALIZATION
  • the selective additive manufacturing apparatus 1 of FIG. 1 comprises: a support such as a horizontal plate 3 on which are deposited successively the various layers of additive manufacturing powder (metal powder, ceramic powder, etc.) allowing to make a three-dimensional object (object 2 in the shape of fir in the figure),
  • a support such as a horizontal plate 3 on which are deposited successively the various layers of additive manufacturing powder (metal powder, ceramic powder, etc.) allowing to make a three-dimensional object (object 2 in the shape of fir in the figure)
  • this arrangement 4 comprising in particular a squeegee 5 for spreading the different successive layers of powder (displacement along the double arrow A),
  • control unit 9 which controls the various components of the apparatus 1 according to pre-stored information (memory M),
  • the set 8 comprises two sources of consolidation:
  • the assembly 8 may comprise only one source, for example a source of energy operating under vacuum or at low pressure: electron gun, laser source, etc.
  • a galvanometric mirror 14 makes it possible to orient and move the laser beam coming from the source 12 with respect to the object 2 as a function of the information sent by the control unit 9.
  • Deflection and focusing coils 15 and 16 locally deflect and focus the electron beam on the layer areas to be sintered or fused.
  • the components of the apparatus 1 are arranged inside a sealed enclosure 17 connected to a vacuum pump 18 which maintains a vacuum inside said enclosure 17 (typically around 10 " 2/10 " 3 mbar, even 10 " 4/10 " 6 mbar).
  • the walls of the enclosure 17 are preferably made of steel and are sufficiently thick to protect the operator against X-rays.
  • the enclosure 17 furthermore includes portholes (not shown) enabling the operator to visualize the different areas inside the device, while providing protection against X-rays emitted by the electron gun and against the light rays emitted by the laser source.
  • the apparatus 1 may furthermore comprise temperature measuring means, such as an IR or CCD camera, which are capable of communicating to the control unit 9 information concerning the temperature of the powder layer and making it possible to adjust thereby the operating parameters of the electron gun 11 or the source 12 of the laser type.
  • temperature measuring means such as an IR or CCD camera
  • the laser beam 19 from the source 12 consolidates, layer by layer, the skin or outer edge of the object 2.
  • the electron beam 20 generated by the barrel 11 is meanwhile used to consolidate the inner core of object 2 (heart).
  • the consolidation carried out by the electron beam 20 can be done layer by layer, at the same time as the consolidation at the periphery by the laser beam 19.
  • the rapid displacement of the electron beam 20 makes it possible to sweep and consolidate the central portion of the layer, while the displacement of the laser beam, slower, occurs simultaneously on a shorter path, which is that of the contour of said central portion.
  • Reverse operation can also be envisaged (scanning of the core by the electron beam and an area of periphery by the laser beam).
  • the consolidation by the electron beam 20 can be done in several layers, after each of these layers have been fused at the periphery by the laser beam 19.
  • the apparatus 1 further comprises a heat shield T.
  • This screen T is a material for absorbing radiation from the impact of electron beams on the powder layers.
  • it may have a shape that has an opening allowing the passage of a radiation and / or beam and which extends by flaring from said opening to the support plate.
  • This form is for example a truncated-pyramidal or frustoconical formed by the assembly of several plates or sectors in the material for absorbing radiation.
  • the apparatus 1 further comprises at least one polarized protective element located in the vicinity of at least one module and / or optical / electronic component to be protected, in the path of the vapor (for example charged vapor) that emerges in the vacuum chamber following the consolidation of the powder.
  • at least one polarized protective element located in the vicinity of at least one module and / or optical / electronic component to be protected, in the path of the vapor (for example charged vapor) that emerges in the vacuum chamber following the consolidation of the powder.
  • This element or these polarized protection elements are intended to trap the vapor ions that rise in the chamber before they reach the module and / or optical / electronic component to be protected.
  • Such a protection element is for example a plate or a sector (or a pair of plates or sectors) which can simultaneously fulfill the function of heat shield T.
  • this screen T comprises a frame 25 and four flat plates 21 to 24 attached thereto and electrically insulated on the one hand from said chassis 25 and on the other hand from each other.
  • the frame 25 is of generally pyramidal shape. It consists of four uprights 25a assembled at the corners of a large frame 25b and a small frame 25c.
  • the frame 25 as the plates 21 to 24 are made of an electrically conductive material, for example steel.
  • the plates 21 to 24 are of a shape corresponding to the shape of the faces of the frame and are attached to the frame 25 while being isolated from it by dielectric shims 26.
  • This polarization creates between the plates an electric field E which deflects the charged vapor which comprises at least one elementary charge released from the molten surface, so that it is captured by the plates 21 to 24 and that this vapor is deposited on these instead of being deposited on the various components inside the enclosure 17.
  • This electric field E has a principal component oriented parallel to the general plane of the bed of powder and layers deposited on the plate 3.
  • a more or less significant fraction of the vapor released is in ionized form (positive or negative ions).
  • This force adds a velocity component parallel to the plate 3, that is to say horizontal, inducing the deflection of the ionized vapor with respect to its initial trajectory of ejection of the surface (during vaporization).
  • the ionized vapor is then mostly intercepted by the sectors 21 to 24 of the thermal screen T: the positive ions are guided by the E field towards the sector (s) 21 to 24 where the surface (including the frame) of the screen T is at the lowest potential ('cathode'); the negative ions, just like the free electrons, are guided towards the area or sectors where the surface is at the highest potential ('anode').
  • the fraction of vapor that escapes and passes through the upper opening of the frame (frame 25c) is in any case diverted towards the walls of the enclosure.
  • the optical surfaces of the laser and the various electronic components facing this opening are all the more protected.
  • the source of consolidation is an electron gun (source 11)
  • the rising vapor intersects this beam and is itself ionized.
  • the acceleration caused by the field E on the free electrons (other than those of the EBM primary electron beam) present in the volume delimited by the polarized elements induces itself a vacuum ionization of the vapor at the same time. interaction with it.
  • the voltage between the plates is chosen to correspond for the electrons to an energy greater than 15 eV and preferably of the order of 50 eV.
  • the voltage between two plates 21-24 facing each other is nevertheless chosen so as not to disturb the trajectory of the electrons of the beam EMB 20.
  • the electric field E is continuous or variable in time.
  • the power supply 31 can be a battery, a DC voltage source, a low or high frequency power supply, or a bipolar, multipolar or pulse power.
  • An alternative power supply has the advantage of making it possible to limit the impact of the electric field E on the trajectory of the electrons of the source
  • An impulse supply has the advantage of applying the electric field between the plates only on limited time fractions.
  • a low frequency function generator GPF with a TTL type output
  • the transit time to go back into the vacuum chamber through this heat shield is estimated at 1 ms in the case of charged fine particles.
  • this rise time should be lower because the mass is greater than that of fine particles.
  • a frequency of 1 kHz or less makes it possible to effectively attract the ionized atomic vapor and the charged clusters to the polarized plates during the pulses.
  • the duty cycle of the pulses is for example chosen of the order 1/10, ie a time gate of 0.1 ms.
  • the pulsed supply of the two pairs of polarized plates 21 to 24 can be achieved by means of two GBF generators operating in synchronous mode. They can furthermore be used together to generate polarization pulses of the positive or negative isolated plates.
  • the chassis 25 is maintained at the ground of the supply circuit, while different voltages are applied to the various plates 21 to 24 to generate the electric field E.
  • insulated plates 21 to 24 may, however, be provided for the grounding of insulated plates 21 to 24, at least during the phase during which the pulse is not applied. This can be achieved by a programmable symmetrical power supply or with programmable switches, allowing the insulated plates to be short-circuited and connected to the ground for certain configurations. Other configurations than that described with reference to Figure 2 are of course conceivable.
  • the chassis may not be connected to ground and serve as a floating potential with respect to the voltages applied to the various plates 21 to 24.
  • one of the plates or sectors can itself (itself) be electrically isolated thereby taking a floating potential.
  • the frame 25 is not necessary since the plates or sectors 21 to 24 are assembled electrically isolated from each other. This insulation is for example provided by the amounts used to assemble said plates or said sectors.
  • the heat shield is not trapezoidal, but in the form of a truncated cone, sectors 21 to 24 being sectors of corresponding shape.
  • the electric field can be created between two adjacent sectors; it can also be created between sectors separated from one or more sectors.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Automation & Control Theory (AREA)
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  • Plasma & Fusion (AREA)
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Abstract

The invention relates to an appliance for manufacturing a three-dimensional object by means of selective additive manufacturing, comprising, in a housing: a support for depositing successive layers of additive manufacturing powder; a distribution arrangement designed to apply a layer of powder to said support or to a previously consolidated layer; and at least one source for the selective consolidation of a layer of powder applied by the distribution arrangement, characterised in that it comprises at least one protection element designed to trap, by electrical polarisation, ions of loaded vapour in the housing, said element consisting of a material designed to be electrically polarised and arranged in the vicinity of at least one optical/electronic module and/or component to be protected from the deposits, the appliance also comprising a polarisation assembly designed to ensure the electrical polarisation of said protection element during additive manufacturing operations.

Description

APPARAEIL DE FABRICATION PAR MÉTHODE DE FABRICATION ADDITIVE D'UN OBJET TRIDIMENSIONNEL ET MÉTHODE DE FABRICATION ADDITIVE ASSOCIÉE  MANUFACTURING APPARATUS BY ADDITIVE MANUFACTURING METHOD OF A THREE DIMENSIONAL OBJECT AND ASSOCIATED ADDITIVE MANUFACTURING METHOD
DOMAINE TECHNIQUE GÉNÉRAL ET ART ANTÉRIEUR GENERAL TECHNICAL FIELD AND PRIOR ART
La présente invention est relative à la fabrication additive sélective. La fabrication additive sélective consiste à réaliser des objets tridimensionnels par consolidation de zones sélectionnées sur des strates successives de matériau pulvérulent (poudre métallique, poudre de céramique, etc.). Les zones consolidées correspondent à des sections successives de l'objet tridimensionnel. La consolidation se fait, couche par couche, par une fusion sélective totale ou partielle réalisée avec une source de consolidation. Cette source est classiquement une source de rayonnement (par exemple un faisceau laser de forte puissance) ou encore une source de faisceau de particules (par exemple un faisceau d'électrons - technologie dite EBM ou « Electron Beam Melting » selon la terminologie anglo-saxonne généralement utilisée dans le domaine). The present invention relates to selective additive manufacturing. Selective additive manufacturing consists in producing three-dimensional objects by consolidating selected areas on successive layers of powder material (metal powder, ceramic powder, etc.). The consolidated areas correspond to successive sections of the three-dimensional object. The consolidation is done, layer by layer, by a total or partial selective melting carried out with a source of consolidation. This source is conventionally a source of radiation (for example a high power laser beam) or a source of particle beam (for example an electron beam - technology called EBM or "Electron Beam Melting" according to the English terminology generally used in the field).
Il a également récemment été proposé des machines hybrides dans lesquelles on utilise plusieurs sources d'énergie pour réaliser la fusion sélective. Par exemple, la source primaire est un canon à électrons, qui est utilisé pour réaliser la fusion sélective au niveau du cœur de l'objet. Il est complété par une source secondaire, qui est une source laser et qui est utilisée, couche après couche, pour réaliser la fusion sélective au niveau des zones de peau ou de bordure. De cette façon, il est possible d'obtenir un objet présentant des propriétés mécaniques ou métallographiques différentes au niveau de sa périphérie (bordure ou peau) et dans son volume (cœur). Un exemple en ce sens est par exemple décrit dans la demande de brevet WO2013/092997.  It has also recently been proposed hybrid machines in which several energy sources are used to achieve selective fusion. For example, the primary source is an electron gun, which is used to perform the selective fusion at the heart of the object. It is supplemented by a secondary source, which is a laser source and which is used, layer after layer, to carry out the selective fusion at the level of the skin or border zones. In this way, it is possible to obtain an object having different mechanical or metallographic properties at its periphery (edge or skin) and in its volume (heart). An example in this sense is for example described in the patent application WO2013 / 092997.
Dans les procédés de fabrication additive sélective, la vapeur, à l'état atomique ou sous forme d'amas d'atomes allant jusqu'à la poudre (également appelés « clusters »), est produite par la vaporisation de la surface sous l'effet du faisceau primaire (électrons ou laser) intense apportant l'énergie nécessaire à la fusion des poudres. Cette vapeur qui s'y dégage est essentiellement neutre, car le processus d'évaporation a lieu, en général, à l'équilibre thermodynamique. In selective additive manufacturing processes, the vapor, in the atomic state or in the form of clusters of atoms up to the powder (also called "clusters"), is produced by the vaporization of the surface under the effect of the primary beam (electrons or laser) intense providing the energy necessary for the melting of the powders. This steam It is essentially neutral, because the evaporation process takes place, in general, at thermodynamic equilibrium.
Or, à la pression atmosphérique ou sous vide, la vapeur chargée ainsi constituée a une forte capacité à se déposer (condensation) sur tout matériau solide avec lequel cette vapeur rentre en contact, et en particulier sur tous les métaux mais également sur les matériaux diélectriques (céramiques, verre, plastique, etc.) ou semi-conducteurs (silicium, germanium, GaAs, etc.).  However, at atmospheric pressure or under vacuum, the charged vapor thus formed has a high capacity to deposit (condensation) on any solid material with which this vapor comes into contact, and in particular on all metals but also on dielectric materials (ceramics, glass, plastic, etc.) or semiconductors (silicon, germanium, GaAs, etc.).
Les particules de cette vapeur se propagent donc vers les parois de manière balistique à basse pression ou diffusive jusqu'à la pression atmosphérique.  The particles of this vapor thus propagate to the walls in a ballistic manner at low pressure or diffusive up to atmospheric pressure.
Les dépôts qui en résultent sont particulièrement néfastes.  The deposits that result are particularly harmful.
Ils conduisent à la formation, sur les éléments optiques à l'intérieur des enceintes de fabrication (miroirs, lentilles, optiques de caméras, etc..) de couches minces qui sont opaques pour des longueurs d'ondes allant de l'ultraviolet à l'infrarouge, donc incluant le visible.  They lead to the formation, on the optical elements inside the manufacturing enclosures (mirrors, lenses, optics of cameras, etc.) of thin layers which are opaque for wavelengths ranging from ultraviolet to ultraviolet light. 'infrared, so including the visible.
Plus généralement, ces dépôts encrassent tous les autres composants et ne sont pas souhaitables.  More generally, these deposits foul all other components and are not desirable.
En outre, ces formations de dépôt sont d'autant plus importantes à basse pression car le libre parcours moyen des espèces est alors très grand, voir comparable avec les dimensions de l'enceinte de la machine.  In addition, these deposition formations are all the more important at low pressure because the average free path of the species is then very large, or comparable with the dimensions of the enclosure of the machine.
Pour lutter contre les effets de ces dépôts, il est déjà connu de prévoir devant les optiques des caméras des films de protection déroulants et sacrificiels, qu'un opérateur peut avancer au fur et à mesure de leur encrassement.  To combat the effects of these deposits, it is already known to provide in front of the optics of the film protection films and sacrificial droplet, that an operator can advance as and when their fouling.
Cette solution n'est pas pleinement satisfaisante.  This solution is not fully satisfactory.
D'un point de vue mécanique, elle est complexe à mettre en œuvre dans une enceinte de fabrication additive.  From a mechanical point of view, it is complex to implement in an additive manufacturing enclosure.
En outre, les films de protection placés devant les optiques empêchent d'obtenir des images optimisées. PRÉSENTATION GÉNÉRALE DE L'INVENTION In addition, the protective films placed in front of the optics prevent obtaining optimized images. GENERAL PRESENTATION OF THE INVENTION
Un but général de l'invention est de pallier ces problématiques de dépôt. A general object of the invention is to overcome these problems of deposition.
Plus particulièrement, l'invention propose une solution permettant de limiter fortement les dépôts de vapeur chargée dans les enceintes de fabrication additive sélective.  More particularly, the invention provides a solution for greatly limiting the deposits of vapor loaded into the selective additive manufacturing enclosure.
Elle propose en outre une solution permettant de protéger contre ces dépôts les optiques utilisées à l'intérieur des enceintes et plus généralement permettant de protéger toute autre surface sensible indépendamment de sa nature.  It also provides a solution to protect against these deposits optics used inside the speakers and more generally to protect any other sensitive surface regardless of its nature.
Également, l'invention propose une solution qui ne présente pas les inconvénients des solutions de l'art antérieur.  Also, the invention proposes a solution that does not have the disadvantages of the solutions of the prior art.
Selon un premier aspect, l'invention propose un appareil pour fabriquer un objet tridimensionnel par fabrication additive sélective comportant dans une enceinte :  According to a first aspect, the invention proposes an apparatus for manufacturing a three-dimensional object by selective additive manufacturing comprising in an enclosure:
- Un support pour le dépôt des couches successives de poudre de fabrication additive,  A support for the deposition of the successive layers of additive manufacturing powder,
Un arrangement de distribution adapté pour appliquer une couche de poudre sur ledit support ou sur une couche précédemment consolidée, - au moins une source d'énergie adaptée à la consolidation sélective d'une couche de poudre appliquée par l'arrangement de distribution, caractérisé en ce qu'il comporte au moins un élément de protection adapté pour piéger par polarisation électrique la vapeur chargée (sous forme d'ions positifs ou négatifs) se trouvant dans l'enceinte, ledit élément étant en un matériau apte à être électriquement polarisé et étant situé au voisinage d'au moins un module et/ou composant optique/électronique à protéger des dépôts, l'appareil comportant en outre un montage de polarisation électrique adapté pour assurer l'établissement d'un champ électrique à l'intérieur et autour dudit élément de protection lors d'opérations de fabrication additive.  A dispensing arrangement adapted to apply a layer of powder to said support or a previously consolidated layer, - at least one energy source adapted for the selective consolidation of a layer of powder applied by the dispensing arrangement, characterized in it comprises at least one protection element adapted to trap by electric polarization the charged vapor (in the form of positive or negative ions) in the chamber, said element being made of a material capable of being electrically polarized and being located in the vicinity of at least one module and / or optical / electronic component to protect deposits, the apparatus further comprising an electrical polarization fitting adapted to ensure the establishment of an electric field in and around said protection element during additive manufacturing operations.
Dans un mode de réalisation, ledit élément de protection par polarisation est une plaque ou un secteur d'un écran thermique qui s'étend au moins partiellement autour de la zone sur laquelle les couches de poudre sont appliquées. Notamment, ledit écran thermique peut comporter un châssis conducteur sur lequel des plaques ou secteurs sont rapportés en étant d'une part isolés dudit châssis et d'autre part isolés entre eux, ledit châssis étant relié à la masse ou constituant une référence de potentiel pour le montage de polarisation. In one embodiment, said polarization protection element is a plate or sector of a heat shield that extends at least partially around the area on which the powder layers are applied. In particular, said heat shield may comprise a conductive frame on which plates or sectors are reported on the one hand isolated from said chassis and on the other mutually isolated, said chassis being connected to ground or constituting a potential reference for the polarization assembly.
Selon un autre aspect encore, l'invention concerne un procédé de fabrication additive sélective dans lequel on applique une couche de poudre de fabrication additive sur un plateau ou sur une couche précédemment consolidée et on met en œuvre une consolidation sélective par fusion totale ou partielle de la couche de poudre appliquée au moyen d'au moins une source de consolidation, caractérisé en ce qu'on polarise électriquement un élément de protection, ledit élément étant en un matériau apte à être électriquement polarisé et étant situé au voisinage d'au moins un module et/ou composant optique/électronique à protéger des dépôts entre au moins deux secteurs ou au moins deux desdits secteurs, ladite polarisation piégeant des ions de vapeur chargée dans l'enceinte.  According to another aspect, the invention relates to a selective additive manufacturing process in which a layer of additive manufacturing powder is applied to a previously consolidated plate or layer and a selective consolidation is implemented by total or partial fusion of the layer of powder applied by means of at least one consolidation source, characterized in that a protective element is electrically biased, said element being made of a material capable of being electrically polarized and being situated in the vicinity of at least one module and / or optical / electronic component to protect deposits between at least two sectors or at least two of said sectors, said polarization trapping vapor ions charged into the enclosure.
Le procédé est par exemple mis en œuvre au moyen d'un tel appareil. L'appareil et/ou le procédé peut comprendre les caractéristiques suivantes, prises seules ou selon l'une quelconque de leurs combinaisons techniquement possibles :  The method is for example implemented using such a device. The apparatus and / or the method may comprise the following features, taken alone or in any of their technically possible combinations:
ledit élément de protection par polarisation est une plaque ou un secteur d'un écran thermique qui s'étend au moins partiellement autour de la zone sur laquelle les couches de poudre sont appliquées,  said polarization protection element is a plate or sector of a heat shield which extends at least partially around the area on which the powder layers are applied,
ledit écran thermique comporte un châssis conducteur sur lequel des plaques ou secteurs sont rapportés en étant d'une part isolés électriquement dudit châssis et d'autre part isolés entre eux, ledit châssis étant relié à la masse ou constituant une référence de potentiel pour le montage de polarisation, le châssis est de forme tronc-pyramidale et comprend quatre montants reliés entre eux à leurs extrémités par deux cadres et en ce que les secteurs comportent quatre plaques rapportées sur les montants dudit châssis, said heat shield comprises a conductive frame on which plates or sectors are reported on the one hand electrically insulated from said chassis and on the other mutually isolated, said chassis being connected to ground or constituting a potential reference for mounting of polarization, the frame is of truncated-pyramidal shape and comprises four uprights interconnected at their ends by two frames and in that the sectors comprise four plates attached to the uprights of said chassis,
la tension entre deux plaques ou secteurs est inférieure à 100 the voltage between two plates or sectors is less than 100
V, V
la tension entre deux plaques ou secteurs est inférieure à 75 V,  the voltage between two plates or sectors is less than 75 V,
la tension entre deux plaques ou secteurs est telle qu'elle puisse transmettre aux électrons libres une énergie de 15 eV ou supérieure,  the voltage between two plates or sectors is such that it can transmit to the free electrons an energy of 15 eV or greater,
le champ électrique généré par le montage de polarisation est sensiblement parallèle, par exemple parallèle, au plan général du plateau support,  the electric field generated by the polarization circuit is substantially parallel, for example parallel, to the general plane of the support plate,
l'enceinte de fabrication est à pression atmosphérique ou à une pression inférieure ou est sous vide,  the manufacturing chamber is at atmospheric pressure or at a lower pressure or is under vacuum,
il comporte à la fois une source de rayonnement et une source de faisceau d'électrons.  it comprises both a radiation source and an electron beam source.
PRÉSENTATION DES FIGURES PRESENTATION OF FIGURES
D'autres caractéristiques et avantages de l'invention ressortiront encore de la description qui suit, laquelle est purement illustrative et non limitative, et doit être lue en regard des figures annexées sur lesquelles :  Other characteristics and advantages of the invention will emerge from the description which follows, which is purely illustrative and nonlimiting, and should be read with reference to the appended figures in which:
- la figure 1 est une représentation schématique d'un appareil de fabrication additive sélective conforme à un mode de réalisation possible de l'invention ;  - Figure 1 is a schematic representation of a selective additive manufacturing apparatus according to a possible embodiment of the invention;
- les figures 2 et 3 illustrent deux modes de réalisation possibles pour l'écran thermique et le montage de polarisation d'un appareil du type de celui de la figure 1. DESCRIPTION D'UN OU PLUSIEURS MODES DE MISE EN ŒUVRE ET DE RÉALISATION FIGS. 2 and 3 illustrate two possible embodiments for the heat shield and the polarization circuit of an apparatus of the type of FIG. 1. DESCRIPTION OF ONE OR MORE MODES OF IMPLEMENTATION AND REALIZATION
Généralités Overview
L'appareil 1 de fabrication additive sélective de la figure 1 comprend : - un support tel qu'un plateau horizontal 3 sur lequel sont déposées successivement les différentes couches de poudre de fabrication additive (poudre métallique, poudre de céramique, etc..) permettant de fabriquer un objet tridimensionnel (objet 2 en forme de sapin sur la figure),  The selective additive manufacturing apparatus 1 of FIG. 1 comprises: a support such as a horizontal plate 3 on which are deposited successively the various layers of additive manufacturing powder (metal powder, ceramic powder, etc.) allowing to make a three-dimensional object (object 2 in the shape of fir in the figure),
- un réservoir 7 de poudre situé au-dessus du plateau 3,  a reservoir 7 of powder situated above the plate 3,
- un arrangement 4 pour la distribution de ladite poudre métallique sur le plateau, cet arrangement 4 comportant notamment une raclette 5 pour étaler les différentes couches successives de poudre (déplacement selon la double flèche A),  an arrangement 4 for the distribution of said metal powder on the plate, this arrangement 4 comprising in particular a squeegee 5 for spreading the different successive layers of powder (displacement along the double arrow A),
- un ensemble 8 de sources d'énergie pour le la fusion totale ou partielle) des couches fines étalées,  a set 8 of energy sources for the total or partial melting) of the spread thin layers,
- une unité de contrôle 9 qui assure le pilotage des différents composant de l'appareil 1 en fonction d'informations pré-mémorisées (mémoire M),  a control unit 9 which controls the various components of the apparatus 1 according to pre-stored information (memory M),
- un mécanisme 10 pour permettre de descendre le support du plateau 3 au fur et à mesure du dépôt des couches (déplacement selon la double flèche B).  a mechanism 10 for enabling the support of the plate 3 to be lowered as the layers are deposited (displacement along the double arrow B).
Dans l'exemple décrit en référence à la figure 1, l'ensemble 8 comprend deux sources de consolidation :  In the example described with reference to FIG. 1, the set 8 comprises two sources of consolidation:
- un canon à faisceau d'électrons 11 et  an electron beam gun 11 and
- une source 12 de type laser.  a source 12 of the laser type.
En variante, l'ensemble 8 peut ne comprendre qu'une source, par exemple une source d'énergie opérant sous vide ou à basse pression : canon à électrons, source laser, etc..  As a variant, the assembly 8 may comprise only one source, for example a source of energy operating under vacuum or at low pressure: electron gun, laser source, etc.
Un miroir galvanométrique 14 permet d'orienter et de déplacer le faisceau laser issu de la source 12 par rapport à l'objet 2 en fonction des informations envoyées par l'unité de contrôle 9.  A galvanometric mirror 14 makes it possible to orient and move the laser beam coming from the source 12 with respect to the object 2 as a function of the information sent by the control unit 9.
Tout autre système de déviation peut bien entendu être envisagé. Des bobines 15 et 16 de déflection et de focalisation permettent de défléchir et de focaliser localement le faisceau d'électrons sur les zones de couches à fritter ou fusionner. Any other deflection system can of course be considered. Deflection and focusing coils 15 and 16 locally deflect and focus the electron beam on the layer areas to be sintered or fused.
Les composants de l'appareil 1 sont agencés à l'intérieur d'une enceinte étanche 17 reliée à une pompe à vide 18 qui maintient un vide à l'intérieur de ladite enceinte 17 (typiquement environ 10"2 / 10"3 mbar, voire 10"4 / 10"6 mbar). The components of the apparatus 1 are arranged inside a sealed enclosure 17 connected to a vacuum pump 18 which maintains a vacuum inside said enclosure 17 (typically around 10 " 2/10 " 3 mbar, even 10 " 4/10 " 6 mbar).
Les parois de l'enceinte 17 sont de préférence en acier et sont suffisamment épaisses pour assurer la protection de l'opérateur contre les rayons X. L'enceinte 17 comporte par ailleurs des hublots (non représentés) permettant à l'opérateur de visualiser les différentes zones à l'intérieur de l'appareil, tout en assurant la protection contre les rayons X émis par le canon à électrons et contre les rayons lumineux émis par la source laser.  The walls of the enclosure 17 are preferably made of steel and are sufficiently thick to protect the operator against X-rays. The enclosure 17 furthermore includes portholes (not shown) enabling the operator to visualize the different areas inside the device, while providing protection against X-rays emitted by the electron gun and against the light rays emitted by the laser source.
L'appareil 1 peut en outre comprendre des moyens de mesure de la température, tels une caméra IR ou CCD qui sont aptes à communiquer à l'unité de contrôle 9 des informations concernant la température de la couche de poudre et permettent d'ajuster ainsi les paramètres de fonctionnement du canon d'électrons 11 ou de la source 12 de type laser.  The apparatus 1 may furthermore comprise temperature measuring means, such as an IR or CCD camera, which are capable of communicating to the control unit 9 information concerning the temperature of the powder layer and making it possible to adjust thereby the operating parameters of the electron gun 11 or the source 12 of the laser type.
Dans un exemple d'utilisation possible, le faisceau laser 19 en provenance de la source 12 consolide, couche par couche, la peau ou bordure extérieure de l'objet 2. Le faisceau d'électrons 20 généré par le canon 11 est quant à lui utilisé pour consolider la partie centrale intérieure de l'objet 2 (cœur).  In an example of possible use, the laser beam 19 from the source 12 consolidates, layer by layer, the skin or outer edge of the object 2. The electron beam 20 generated by the barrel 11 is meanwhile used to consolidate the inner core of object 2 (heart).
La consolidation réalisée par le faisceau d'électrons 20 peut se faire couche par couche, en même temps que la consolidation en périphérie par le faisceau laser 19. Le déplacement rapide du faisceau d'électrons 20 permet en effet de balayer et consolider la partie centrale de la couche, tandis que le déplacement du faisceau laser, plus lent, s'effectue simultanément sur un trajet plus court, qui est celui du contour de ladite partie centrale. Un fonctionnement inverse peut également être envisagé (balayage du cœur par le faisceau d'électrons et d'une zone de périphérie par le faisceau laser). En variante, la consolidation par le faisceau d'électrons 20 peut se faire sur plusieurs couches, après que chacune de ces couches aient été fusionnées en périphérie par le faisceau laser 19. The consolidation carried out by the electron beam 20 can be done layer by layer, at the same time as the consolidation at the periphery by the laser beam 19. The rapid displacement of the electron beam 20 makes it possible to sweep and consolidate the central portion of the layer, while the displacement of the laser beam, slower, occurs simultaneously on a shorter path, which is that of the contour of said central portion. Reverse operation can also be envisaged (scanning of the core by the electron beam and an area of periphery by the laser beam). Alternatively, the consolidation by the electron beam 20 can be done in several layers, after each of these layers have been fused at the periphery by the laser beam 19.
Le fonctionnement d'un tel appareil, ainsi que le dimensionnement et paramétrage de ses différents composants sont par exemple du type de ceux envisagés dans la demande WO2013/092997.  The operation of such an apparatus, as well as the sizing and parameterization of its various components are for example of the type envisaged in the application WO2013 / 092997.
L'appareil 1 comporte en outre un écran thermique T.  The apparatus 1 further comprises a heat shield T.
Cet écran T est en un matériau destiné à absorber les radiations issues de l'impact des faisceaux d'électrons sur les couches de poudre.  This screen T is a material for absorbing radiation from the impact of electron beams on the powder layers.
À titre illustratif, il peut se présenter avec une forme qui présente une ouverture permettant le passage d'un rayonnement et/ou faisceau et qui s'étend en s'évasant de ladite ouverture vers le plateau support.  By way of illustration, it may have a shape that has an opening allowing the passage of a radiation and / or beam and which extends by flaring from said opening to the support plate.
Cette forme est par exemple une forme tronc-pyramidale ou tronconique constituée par l'assemblage de plusieurs plaques ou secteurs dans le matériau destiné à absorber les radiations.  This form is for example a truncated-pyramidal or frustoconical formed by the assembly of several plates or sectors in the material for absorbing radiation.
Il peut être disposé au-dessus du plateau 2 et de la zone où les couches de poudre sont appliquées, avec un espace permettant le passage de la raclette 5. Montage de polarisation électrique  It can be placed above the plate 2 and the zone where the layers of powder are applied, with a space allowing the passage of the squeegee 5. Installation of electric polarization
L'appareil 1 comporte en outre au moins un élément de protection polarisé situé au voisinage d'au moins un module et/ou composant optique/électronique à protéger, sur le trajet de la vapeur (par exemple de la vapeur chargée) qui se dégage dans l'enceinte à vide suite à la consolidation de la poudre. The apparatus 1 further comprises at least one polarized protective element located in the vicinity of at least one module and / or optical / electronic component to be protected, in the path of the vapor (for example charged vapor) that emerges in the vacuum chamber following the consolidation of the powder.
Cet élément ou ces éléments de protection polarisés sont destinés à piéger les ions de vapeur qui remontent dans l'enceinte avant qu'ils n'atteignent le module et/ou composant optique/électronique à protéger.  This element or these polarized protection elements are intended to trap the vapor ions that rise in the chamber before they reach the module and / or optical / electronic component to be protected.
Un tel élément de protection est par exemple une plaque ou un secteur (ou une paire de plaques ou secteurs) qui peuvent remplir simultanément la fonction d'écran thermique T.  Such a protection element is for example a plate or a sector (or a pair of plates or sectors) which can simultaneously fulfill the function of heat shield T.
Il peut être en tout matériau susceptible d'être polarisé. Dans l'exemple de la figure 2, cet écran T comprend un châssis 25 et quatre plaques planes 21 à 24 rapportés sur celui-ci et électriquement isolées d'une part dudit châssis 25 et d'autre part les unes des autres. It can be any material likely to be polarized. In the example of FIG. 2, this screen T comprises a frame 25 and four flat plates 21 to 24 attached thereto and electrically insulated on the one hand from said chassis 25 and on the other hand from each other.
Le châssis 25 est de forme générale pyramidale. Il est constitué de quatre montants 25a assemblés aux coins d'un grand cadre 25b et d'un petit cadre 25c.  The frame 25 is of generally pyramidal shape. It consists of four uprights 25a assembled at the corners of a large frame 25b and a small frame 25c.
Le châssis 25 comme les plaques 21 à 24 sont en un matériau électriquement conducteur, par exemple en acier.  The frame 25 as the plates 21 to 24 are made of an electrically conductive material, for example steel.
Les plaques 21 à 24 sont de forme correspondant à la forme des faces du châssis et sont rapportées sur le châssis 25 en étant isolées de celui-ci par des cales diélectriques 26.  The plates 21 to 24 are of a shape corresponding to the shape of the faces of the frame and are attached to the frame 25 while being isolated from it by dielectric shims 26.
Elles sont deux à deux en regard et sont polarisées par une alimentation électrique 31.  They are two by two opposite and are polarized by a power supply 31.
Cette polarisation crée entre les plaques un champ électrique E qui dévie la vapeur chargée qui comporte au moins une charge élémentaire libérée de la surface en fusion, pour qu'elle soit captée par les plaques 21 à 24 et que cette vapeur se dépose sur celles-ci au lieu de se déposer sur les différents composants à l'intérieur de l'enceinte 17.  This polarization creates between the plates an electric field E which deflects the charged vapor which comprises at least one elementary charge released from the molten surface, so that it is captured by the plates 21 to 24 and that this vapor is deposited on these instead of being deposited on the various components inside the enclosure 17.
Ce champ électrique E a une composante principale orientée parallèlement au plan général du lit de poudre et des couches déposées sur le plateau 3.  This electric field E has a principal component oriented parallel to the general plane of the bed of powder and layers deposited on the plate 3.
Lors de la vaporisation du matériau déposé (métal, céramique, etc..) sous l'effet d'un faisceau ou rayonnement énergétique, une fraction plus ou moins importante de la vapeur libérée se trouve sous forme ionisée (ions positifs ou négatifs).  During the vaporization of the deposited material (metal, ceramic, etc.) under the effect of a beam or energy radiation, a more or less significant fraction of the vapor released is in ionized form (positive or negative ions).
Le champ électrique E de polarisation agit sur les ions de vapeur chargée (ions monoatomiques, agrégats) avec une force de type électrostatique (F = qE), sensiblement parallèle au plateau. Cette force ajoute une composante de vitesse parallèle au plateau 3, c'est-à-dire horizontale, induisant la déflexion de la vapeur ionisée par rapport à sa trajectoire initiale d'éjection de la surface (lors de la vaporisation). La vapeur ionisée est alors majoritairement interceptée par les secteurs 21 à 24 de l'écran thermique T : les ions positifs sont guidés par le champ E vers le(s) secteur(s) 21 à 24 où la surface (y compris le châssis) de l'écran T est au potentiel le plus bas ('cathode') ; les ions négatifs, tout comme les électrons libres, sont guidés vers le ou les secteurs où la surface est au potentiel le plus élevé ('anode'). The electric field E of polarization acts on the charged vapor ions (monoatomic ions, aggregates) with a force of the electrostatic type (F = qE), substantially parallel to the plateau. This force adds a velocity component parallel to the plate 3, that is to say horizontal, inducing the deflection of the ionized vapor with respect to its initial trajectory of ejection of the surface (during vaporization). The ionized vapor is then mostly intercepted by the sectors 21 to 24 of the thermal screen T: the positive ions are guided by the E field towards the sector (s) 21 to 24 where the surface (including the frame) of the screen T is at the lowest potential ('cathode'); the negative ions, just like the free electrons, are guided towards the area or sectors where the surface is at the highest potential ('anode').
La fraction de vapeur qui le cas échéant s'échappe et traverse l'ouverture haute du châssis (cadre 25c) est en tout état de cause déviée vers les parois de l'enceinte. Les surfaces optiques du laser et les différents composants électroniques en regard de cette ouverture s'en trouvent d'autant plus protégés.  The fraction of vapor that escapes and passes through the upper opening of the frame (frame 25c) is in any case diverted towards the walls of the enclosure. The optical surfaces of the laser and the various electronic components facing this opening are all the more protected.
On notera en outre que lorsque la source de consolidation est un canon d'électrons (source 11), la vapeur qui remonte croise ce faisceau et se trouve elle-même ionisée. Également, l'accélération entraînée par le champ E sur les électrons libres (autres que ceux du faisceau d'électrons primaires EBM) présents dans le volume délimité par les éléments polarisés induit elle-même une ionisation sous vide de la vapeur lors de l'interaction avec celle-ci.  Note also that when the source of consolidation is an electron gun (source 11), the rising vapor intersects this beam and is itself ionized. Also, the acceleration caused by the field E on the free electrons (other than those of the EBM primary electron beam) present in the volume delimited by the polarized elements induces itself a vacuum ionization of the vapor at the same time. interaction with it.
Ceci augmente la fraction de vapeur ionisée et le rendement de capture de l'ensemble.  This increases the fraction of ionized vapor and the capture efficiency of the whole.
À cet effet, la tension entre les plaques est choisie pour correspondre pour les électrons à une énergie supérieure à 15 eV et de préférence de l'ordre de 50 eV.  For this purpose, the voltage between the plates is chosen to correspond for the electrons to an energy greater than 15 eV and preferably of the order of 50 eV.
La tension entre deux plaques 21-24 en regard est néanmoins choisie pour ne pas perturber la trajectoire des électrons du faisceau 20 EMB.  The voltage between two plates 21-24 facing each other is nevertheless chosen so as not to disturb the trajectory of the electrons of the beam EMB 20.
Elle est à cet effet typiquement inférieure à 100 V, et plus particulièrement inférieure à 75 V.  It is for this purpose typically less than 100 V, and more particularly less than 75 V.
Le champ électrique E est continu ou variable dans le temps.  The electric field E is continuous or variable in time.
De nombreuses configurations sont à cet effet envisageables pour l'alimentation électrique 31 : celle-ci peut être une pile, une source de tension continue, une alimentation basse ou haute fréquence, ou encore une alimentation bipolaire, multipolaire ou impulsionnelle.  Many configurations are for this purpose possible for the power supply 31: it can be a battery, a DC voltage source, a low or high frequency power supply, or a bipolar, multipolar or pulse power.
Une alimentation alternative à l'avantage de permettre de limiter l'impact du champ électrique E sur la trajectoire des électrons de la source Une alimentation impulsionnelle a l'avantage de n'appliquer le champ électrique entre les plaques que sur des fractions de temps limité. On utilise à cet effet par exemple un générateur de fonctions basses fréquences (GBF avec une sortie type TTL). An alternative power supply has the advantage of making it possible to limit the impact of the electric field E on the trajectory of the electrons of the source An impulse supply has the advantage of applying the electric field between the plates only on limited time fractions. For this purpose, for example, a low frequency function generator (GBF with a TTL type output) is used.
Pour un écran thermique T d'une hauteur de l'ordre de 50 cm, le temps de transit pour remonter dans l'enceinte sous vide à travers cet écran thermique est estimé à 1 ms dans le cas de particules fines chargées. Pour des gouttelettes ou des gros amas d'atomes, ce temps de remontée devrait être inférieur, car la masse y est supérieure à celle des particules fines.  For a thermal screen T of a height of the order of 50 cm, the transit time to go back into the vacuum chamber through this heat shield is estimated at 1 ms in the case of charged fine particles. For droplets or large clusters of atoms, this rise time should be lower because the mass is greater than that of fine particles.
Ainsi, une fréquence de 1 kHz ou inférieure permet d'attirer efficacement la vapeur atomique ionisée et les amas chargés vers les plaques polarisées lors des impulsions.  Thus, a frequency of 1 kHz or less makes it possible to effectively attract the ionized atomic vapor and the charged clusters to the polarized plates during the pulses.
Pour une fréquence de répétition de 1 kHz, le rapport cyclique des impulsions est par exemple choisi de l'ordre 1/10, soit une porte temporelle de 0,1 ms. Ainsi, 90% du temps les plaques latérales 21 à 24 ne sont pas polarisées ; le faisceau d'électrons 20 en provenance du canon 11 fonctionne sans perturbation.  For a repetition frequency of 1 kHz, the duty cycle of the pulses is for example chosen of the order 1/10, ie a time gate of 0.1 ms. Thus, 90% of the time the side plates 21 to 24 are not polarized; the electron beam 20 from the barrel 11 operates without disturbance.
On notera que l'alimentation impulsionnelle des deux couples de plaques 21 à 24 polarisés peut être réalisée au moyen de deux générateurs GBF fonctionnant en mode synchrone. Ils peuvent en outre être utilisés ensemble pour générer des impulsions de polarisation des plaques isolées positives ou négatives.  It will be noted that the pulsed supply of the two pairs of polarized plates 21 to 24 can be achieved by means of two GBF generators operating in synchronous mode. They can furthermore be used together to generate polarization pulses of the positive or negative isolated plates.
Dans l'exemple illustré sur la figure 2, le châssis 25 est maintenu à la masse du circuit d'alimentation, tandis que différentes tensions sont appliquées sur les différentes plaques 21 à 24 pour générer le champ électrique E.  In the example illustrated in FIG. 2, the chassis 25 is maintained at the ground of the supply circuit, while different voltages are applied to the various plates 21 to 24 to generate the electric field E.
Il peut être néanmoins prévu la remise à la masse des plaques 21 à 24 isolées, au moins pendant la phase pendant laquelle l'impulsion n'est pas appliquée. Ceci peut être réalisé par une alimentation symétrique programmable ou avec des switchs programmables, permettant de court- circuiter les plaques isolées et les relier à la masse pour certaines configurations. D'autres configurations que celle décrite en référence à la figure 2 sont bien entendu envisageables. It may, however, be provided for the grounding of insulated plates 21 to 24, at least during the phase during which the pulse is not applied. This can be achieved by a programmable symmetrical power supply or with programmable switches, allowing the insulated plates to be short-circuited and connected to the ground for certain configurations. Other configurations than that described with reference to Figure 2 are of course conceivable.
Notamment, le châssis peut ne pas être relié à la masse et servir de potentiel flottant par rapport aux tensions appliquées aux différentes plaques 21 à 24.  In particular, the chassis may not be connected to ground and serve as a floating potential with respect to the voltages applied to the various plates 21 to 24.
En variante également, ainsi qu'illustré sur la figure 3, l'une des plaques ou des secteurs peut elle-même (lui-même) être isolée électriquement prenant ainsi un potentiel flottant. Dans ce dernier cas, le châssis 25 n'est pas nécessaire dès lors que les plaques ou secteurs 21 à 24 sont assemblés en étant électriquement isolés les uns par rapport aux autres. Cette isolation est par exemple assurée par les montants qui servent à l'assemblage desdites plaques ou desdits secteurs.  Alternatively also, as illustrated in Figure 3, one of the plates or sectors can itself (itself) be electrically isolated thereby taking a floating potential. In the latter case, the frame 25 is not necessary since the plates or sectors 21 to 24 are assembled electrically isolated from each other. This insulation is for example provided by the amounts used to assemble said plates or said sectors.
Dans l'exemple de cette figure 3, l'écran thermique n'est pas trapézoïdal, mais en tronc de cône, les secteurs 21 à 24 étant des secteurs de forme correspondante.  In the example of this FIG. 3, the heat shield is not trapezoidal, but in the form of a truncated cone, sectors 21 to 24 being sectors of corresponding shape.
Par ailleurs, dans d'autres variantes encore, le champ électrique peut être créé entre deux secteurs adjacents ; il peut également être créé entre des secteurs séparés de un ou plusieurs secteurs.  Moreover, in still other variants, the electric field can be created between two adjacent sectors; it can also be created between sectors separated from one or more sectors.
Par ailleurs, on s'est principalement placé dans ce qui précède dans le cas d'une fabrication additive sélective dans une enceinte sous vide.  In addition, the above has mainly been the case in the case of selective additive manufacturing in a vacuum chamber.
De façon plus générale, des pressions de travail inférieures à la pression atmosphérique, voire égales à celle-ci peuvent être envisagées. Des pressions de travail inférieures facilitent toutefois l'ionisation de la vapeur du fait de l'application d'un champ électrique.  More generally, working pressures lower than atmospheric pressure, or even equal to it, can be envisaged. Lower working pressures, however, facilitate the ionization of the vapor due to the application of an electric field.

Claims

REVENDICATIONS
Appareil pour fabriquer un objet tridimensionnel par fabrication additive sélective comportant dans une enceinte : Apparatus for manufacturing a three-dimensional object by selective additive manufacturing comprising in an enclosure:
- Un support pour le dépôt des couches successives de poudre de fabrication additive,  A support for the deposition of the successive layers of additive manufacturing powder,
Un arrangement de distribution adapté pour appliquer une couche de poudre sur ledit support ou sur une couche précédemment consolidée,  A dispensing arrangement adapted to apply a layer of powder on said support or on a previously consolidated layer,
- au moins une source adaptée à la consolidation sélective d'une couche de poudre appliquée par l'arrangement de distribution, caractérisé en ce qu'il comporte au moins un élément de protection adapté pour piéger par polarisation électrique des ions de vapeur chargée se trouvant dans l'enceinte, ledit élément étant en un matériau apte à être électriquement polarisé et étant situé au voisinage d'au moins un module et/ou composant optique/électronique à protéger des dépôts, l'appareil comportant en outre un montage de polarisation adapté pour assurer la polarisation électrique dudit élément de protection lors d'opérations de fabrication additive.  at least one source adapted to the selective consolidation of a layer of powder applied by the distribution arrangement, characterized in that it comprises at least one protective element adapted to trap by electric polarization ions of charged vapor lying in the enclosure, said element being made of a material capable of being electrically polarized and being situated in the vicinity of at least one module and / or optical / electronic component to protect deposits, the apparatus further comprising a suitable polarization mounting for providing electrical polarization of said protection element during additive manufacturing operations.
Appareil selon la revendication 1, caractérisé en ce que ledit élément de protection par polarisation est une plaque ou un secteur d'un écran thermique qui s'étend au moins partiellement autour de la zone sur laquelle les couches de poudre sont appliquées. Apparatus according to claim 1, characterized in that said polarization protection element is a plate or sector of a heat shield which extends at least partially around the area on which the powder layers are applied.
Appareil selon la revendication 2, caractérisé en ce que ledit écran thermique comporte un châssis conducteur sur lequel des plaques ou secteurs sont rapportés en étant d'une part isolés électriquement dudit châssis et d'autre part isolés entre eux, ledit châssis étant relié à la masse ou constituant une référence de potentiel pour le montage de polarisation. Appareil selon la revendication 3, caractérisé en ce que le châssis est de forme tronc-pyramidale et comprend quatre montants reliés entre eux à leurs extrémités par deux cadres et en ce que les secteurs comportent quatre plaques rapportées sur les montants dudit châssis. Apparatus according to claim 2, characterized in that said heat shield comprises a conductive frame on which plates or sectors are reported being on the one hand electrically insulated from said frame and on the other hand insulated from each other, said frame being connected to the ground or constituting a potential reference for the polarization circuit. Apparatus according to claim 3, characterized in that the frame is of truncated-pyramidal shape and comprises four uprights interconnected at their ends by two frames and in that the sectors comprise four plates attached to the uprights of said frame.
Appareil selon l'une des revendications 2 à 4, caractérisé en ce que la tension entre deux plaques ou secteurs est inférieure à 100 V. Apparatus according to one of claims 2 to 4, characterized in that the voltage between two plates or sectors is less than 100 V.
Appareil selon la revendication 5, caractérisé en ce que la tension entre deux plaques ou secteurs est inférieure à 75 V. Apparatus according to claim 5, characterized in that the voltage between two plates or sectors is less than 75 V.
Appareil selon l'une des revendications 2 à 6, caractérisé en ce que la tension entre deux plaques ou secteurs est telle qu'elle puisse transmettre aux électrons libres une énergie de 15 eV ou supérieure. Apparatus according to one of claims 2 to 6, characterized in that the voltage between two plates or sectors is such that it can transmit to the free electrons an energy of 15 eV or higher.
Appareil selon l'une des revendications précédentes, caractérisé en ce que le champ électrique généré par le montage de polarisation est sensiblement parallèle au plan général du plateau support. Apparatus according to one of the preceding claims, characterized in that the electric field generated by the polarization circuit is substantially parallel to the general plane of the support plate.
Appareil selon l'une des revendications précédentes, caractérisé en ce que l'enceinte de fabrication est à pression atmosphérique ou à une pression inférieure ou est sous vide. Apparatus according to one of the preceding claims, characterized in that the manufacturing chamber is at atmospheric pressure or at a lower pressure or is under vacuum.
Appareil selon l'une des revendications précédentes, caractérisé en ce qu'il comporte à la fois une source de rayonnement et une source de faisceau d'électrons. Apparatus according to one of the preceding claims, characterized in that it comprises both a radiation source and an electron beam source.
Procédé de fabrication additive sélective dans lequel on applique une couche de poudre de fabrication additive sur un support ou sur une couche précédemment consolidée et on met en œuvre une consolidation sélective par fusion totale ou partielle de la couche de poudre appliquée au moyen d'au moins une source de consolidation, caractérisé en ce qu'on polarise électriquement un élément de protection, ledit élément étant en un matériau apte à être électriquement polarisé et étant situé au voisinage d'au moins un module et/ou composant optique/électronique à protéger des dépôts entre au moins deux secteurs, ladite polarisation piégeant des ions de vapeur issus de la poudre de fabrication se trouvant dans l'enceinte. A selective additive manufacturing process in which a layer of additive manufacturing powder is applied to a previously consolidated support or layer and a selective consolidation is implemented by total or partial melting of the applied powder layer by means of at least one a source of consolidation, characterized in that a protection element is electrically biased, said element being made of a material capable of being electrically polarized and being situated in the vicinity of at least one module and / or optical / electronic component to protect deposits between at least two sectors, said polarization trapping vapor ions from the manufacturing powder in the chamber.
PCT/EP2017/077522 2016-10-26 2017-10-26 Appliance for manufacturing a three-dimensional object by means of an additive manufacturing method, and associated additive manufacturing method WO2018078057A1 (en)

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CN117532016A (en) * 2024-01-09 2024-02-09 西安赛隆增材技术股份有限公司 Heat shield for powder bed electron beam 3D printer and printer
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CN110899700A (en) * 2019-12-30 2020-03-24 西安赛隆金属材料有限责任公司 Powder bed electron beam vibration material disk equipment
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