WO2018053979A1 - 一种光感器件的装配结构 - Google Patents

一种光感器件的装配结构 Download PDF

Info

Publication number
WO2018053979A1
WO2018053979A1 PCT/CN2017/072600 CN2017072600W WO2018053979A1 WO 2018053979 A1 WO2018053979 A1 WO 2018053979A1 CN 2017072600 W CN2017072600 W CN 2017072600W WO 2018053979 A1 WO2018053979 A1 WO 2018053979A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
sensing device
light sensing
sensing
assembly structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2017/072600
Other languages
English (en)
French (fr)
Inventor
周敏
曾燕玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yulong Computer Telecommunication Scientific Shenzhen Co Ltd
Original Assignee
Yulong Computer Telecommunication Scientific Shenzhen Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yulong Computer Telecommunication Scientific Shenzhen Co Ltd filed Critical Yulong Computer Telecommunication Scientific Shenzhen Co Ltd
Publication of WO2018053979A1 publication Critical patent/WO2018053979A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Definitions

  • the present invention relates to the field of hardware and electronic technologies, and in particular, to an assembly structure of a light sensing device.
  • mobile terminals With the rapid development of mobile communication, mobile terminals have become an indispensable part of people's work and life.
  • the design of mobile terminal housings such as mobile phones, tablet computers, PDAs (Personal Digital Assistants), etc. Value.
  • the housing In the housing design of the mobile terminal, in order to achieve an elegant appearance, the housing sometimes requires a small circular optical opening on the screen cover, but the old light sensing device directly attached to the mobile terminal motherboard cannot satisfy the requirements.
  • the requirement of a small circular light-sensing opening requires the use of a new type of light-sensing device to meet this opening requirement.
  • the light sensing device 10 can be mounted on the flexible circuit board FPC flexible board 20, and the light sensing bracket 30 can be bonded by using the double-sided tape.
  • the light sensing bracket 30 can support the FPC flexible board 20.
  • the distance from the upper surface of the main board 40 to the inner surface of the screen cover 50 is A, then in order to ensure that the upper surface of the light sensing device 10 is away from the inner surface gap B of the screen cover 50, the bottom of the light sensing device 10 and the main board can be made.
  • the pitch of the upper surface of 40 is C, and since the light sensing device 10 cannot be directly attached to the main board 40, the light sensing bracket 30 is required to support the FPC flexible board 20 at a height D, and the sum of the thickness of the D and the FPC soft board 20. For C.
  • the embodiment of the invention provides an assembly structure of a light sensing device, which is used for simplifying the assembly process of the light sensing device, reducing the cumulative tolerance during the assembly process of the light sensing device, and reducing the development cost.
  • the first aspect of the present invention provides an assembly structure of a light sensing device, which may include:
  • the assembly structure comprises a bottom case and a light-sensitive flexible circuit board FPC;
  • the upper surface of the light-sensing FPC is provided with a light-sensing device, and the lower surface of the patch area corresponding to the light-sensing FPC is provided with a reinforcing panel;
  • the bottom case is provided with a light-sensing support surface, and the light-sensing support surface is used for fixing the reinforcing panel.
  • an assembly structure of a light sensing device may include a bottom case and a light-sensitive flexible circuit board FPC, wherein the upper surface of the light-sensing FPC is attached with a light-sensing device, and the light-sensing FPC corresponds to light.
  • the lower surface of the patch area of the sensing device is provided with a reinforcing panel, and the reinforcing panel can be fixed on the light sensing supporting surface of the bottom shell.
  • the distance between the light sensing device and the screen cover can pass
  • the thickness of the light-sensing FPC, the thickness of the reinforcing panel, and the thickness of the light-sensitive supporting surface of the bottom case are controlled, and the reinforcing panel can be respectively connected to the light-sensing FPC and the light-sensing supporting surface of the bottom case, thereby simplifying the assembly process.
  • the structural support surface of the bottom case and the structural design of the reinforcing panel are beneficial to reduce the cumulative tolerance during assembly.
  • the structure of the reinforcing panel relative to the light-sensing bracket is simple and the convenience of installation is favorable to reduce the development cost.
  • FIG. 1 is a schematic view showing an assembly structure of a light sensing device in the prior art
  • FIG. 2 is a schematic overall view of an assembly structure of a light sensing device according to an embodiment of the present invention
  • FIG 3 is a partial schematic view showing an assembly structure of a light sensing device according to an embodiment of the present invention.
  • the embodiment of the invention provides an assembly structure of a light sensing device, which is used for simplifying the assembly process of the light sensing device, reducing the cumulative tolerance during the assembly process of the light sensing device, and reducing the development cost.
  • an embodiment of the assembly structure of the light sensing device in the embodiment of the present invention includes:
  • the assembly structure may include a bottom case 60 and a light-sensitive flexible circuit board FPC20;
  • the light sensing device 10 can be attached to the upper surface of the light sensing FPC 20, and the light sensing FPC 20 can be provided with a reinforcing panel 70 corresponding to the lower surface of the patch region of the light sensing device 10;
  • the bottom case 60 may be provided with a light sensing support surface 80, and the light sensing support surface 80 may be used to fix the reinforcing panel 70.
  • the light sensing device 10 can be utilized in different electronic devices such as mobile phones, tablet computers, etc.
  • the bottom case 60 and the screen cover 50 can be included, and the bottom case 60 and the screen
  • An assembly structure of the light sensing device 10 may be provided in the enclosed space formed by the cover 50.
  • a light-sensing opening may be further provided, and the light-receiving angle of the light-sensing opening should be controlled within a large range as much as possible to reduce the light-receiving angle.
  • the bottom case 60 may be provided with a light-sensing support surface 80.
  • the upper and lower surfaces of the reinforcing panel 70 may be respectively connected with a light-sensing FPC20 and a light-sensing support surface 80, and the light-sensing device 10 may be directly attached.
  • the main board 40 is disposed at a corresponding position on the upper surface of the bottom case 60.
  • the distance between the upper surface of the main board 40 and the inner surface of the screen cover 50 may be A, and the distance between the upper surface of the main board 40 and the bottom of the light sensing device 10 may be C, and since the light-sensing FPC 20 is supported by the reinforcing panel 70 fixed to the light-sensitive supporting surface 80, and the height of the light-sensing device 10 is fixed, the gap B may be the thickness of the light-sensing FPC 20 and the thickness of the reinforcing panel 70.
  • the sum E of the heights of the thicknesses of the light-sensing support faces 80 is controlled.
  • the embodiment simplifies the assembly process by the design of the light-sensitive supporting surface 80 in the reinforcing panel 70 and the bottom shell 60, and only reinforcement is provided during the assembly process.
  • the difference between the panel 70 and the light-sensing FPC 20 and the light-sensing support surface 80 is different.
  • due to the flatness of the structure of the reinforcing panel 70 and the controllability of the thickness of the light-sensing FPC 20 and the light-sensing support surface 80 it is advantageous to reduce the compensation.
  • the cumulative tolerance of the strong panel 70 during the connection process can avoid the situation where the gap B is too large.
  • the embodiment does not need to additionally add the light-sensing bracket 30, and the structural design and installation of the reinforcing panel 70 are relatively simple with respect to the light-sensitive bracket 30, thereby advantageously reducing the development cost.
  • the gap B can be controlled by the sum of the thickness of the photosensitive FPC 20, the thickness of the reinforcing panel 70, and the thickness of the photosensitive supporting surface 80, the thickness of the photosensitive supporting surface 80 and the thickness of the reinforcing panel 70
  • the thickness of the light-sensing FPC20 can be adapted to the package height of the preset light-sensing device, wherein the package height can be the distance between the light-sensitive device 10 and the screen cover 50, that is, the gap B.
  • the gap B is 0.3 mm
  • the height of the photosensitive device 10 is 1 mm
  • the distance A is 1 cm
  • the sum of the thickness of the photosensitive support surface 80, the thickness of the reinforcing panel 70, and the thickness of the light-sensing FPC 20 should be controlled. It is 9.7 mm, and the thickness of the photosensitive support surface 80, the thickness of the reinforcing panel 70, and the thickness of the light-sensing FPC 20 can be designed separately according to 9.7 mm.
  • the light sensing device can be safely A dust jacket is installed.
  • the thickness of the dust jacket should be less than the package height to facilitate the installation of the screen cover 50.
  • the dust jacket can be made of silicone material.
  • the reinforcing panel 70 may be a plate-like structure made of foam.
  • the dust jacket is prepared by using a silica gel material, and in practical applications, other flexible materials can also be used for preparation, such as rubber.
  • the reinforcing panel 70 is not only a plate-like structure made of the foam described above, but in practical applications, other high-strength lightweight materials can also be used to form a plate-like structure, as long as the corresponding effect can be achieved. , specifically here are not limited.
  • the lower surface of the reinforcing panel 70 can also be fixedly connected to the light-sensitive supporting surface 80 by bonding, for further The connection between the reinforcing panel 70 and the light-sensing support surface 80 is enhanced.
  • the light-sensing support surface 80 can be provided with a positioning post 801, and the positioning post 801 can be used for positioning the reinforcing panel 70, and can reach Indirectly locate the role of light perception FPC20.
  • the light sensing FPC 20 and the reinforcing panel 70 may be provided with a groove structure that cooperates with the positioning post 801, so that the positioning post 801 can be positioned in the groove structure to achieve positioning.
  • the light sensing FPC 20 and the reinforcing panel 70 are designed in addition to the groove structure described above, and in practical applications, other structures, such as a through hole structure, may be designed to make the positioning column.
  • the 801 can pass through the through hole to perform positioning, and the specific structure is not limited herein.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Telephone Set Structure (AREA)

Abstract

提供一种光感器件的装配结构，用于简化光感器件的组装工艺，减少光感器件组装过程中的累计公差，并降低开发成本。装配结构包括底壳（60）和光感柔性电路板FPC（20），其中，光感FPC的上表面贴装有光感器件（10），光感FPC对应光感器件的贴片区域的下表面设有补强面板（70）；底壳设有光感支撑面（80），光感支撑面用于固定补强面板。

Description

一种光感器件的装配结构
本申请要求于2016年9月26日提交中国专利局、申请号为201610851446.4、发明名称为“一种光感器件的装配结构”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及硬件电子技术领域，尤其涉及一种光感器件的装配结构。
背景技术
随着移动通讯的快速发展，移动终端已成为人们工作以及生活必不可少的一部分，诸如手机、平板电脑、PDA(Personal Digital Assistant，个人数字助理)等移动终端壳体的外观设计也逐渐受到人们的重视。
在移动终端的壳体设计中，为了实现外观精致，壳体有时要求在屏幕盖板上丝印较小的圆形光感开孔，然而直接贴片于移动终端主板上的旧型光感器件无法满足足够小的圆形光感开孔的要求，需要用到新型的光感器件才能满足此开孔需求。在现有的光感器件10的装配方式中，如图1所示，可以将光感器件10贴片在柔性电路板FPC软板20上，并可以利用双面胶将光感支架30粘结在主板40上，使得光感支架30可以将FPC软板20进行支撑。其中，主板40的上表面至屏幕盖板50内表面的距离为A，那么为了保证光感器件10的上表面距离屏幕盖板50的内表面间隙B，可以使得光感器件10的底部与主板40的上表面的间距为C，而由于光感器件10不能直接贴片在主板40上，需要光感支架30将FPC软板20进行高度D的支撑，D与FPC软板20的厚度的和为C。
通过以上的装配结构可知，由于需要利用光感支架30使得光感器件10的上表面距离屏幕盖板20的内表面间隙B，那么需要制备适应于光感支架的模具或另外购买光感支架30，则增加了开发成本，同时，光感支架3的组装也额外增加了人工成本。此外，由于主板40需要装配在底壳60上，而底壳60与屏幕盖板50通过点胶或背胶固定，一系列的组装工艺将导致原本设计的 间隙B的累计公差相对较大，而现有定义圆形光感开孔不变的条件下，收光角度会随间隙B增大而减小，同时光串扰会相应增大。
综上所述，有必要提供一种光感器件的装配结构，在降低成本的同时，需要尽量使得间隙B保持原有设计值，以避免累计公差的影响。
发明内容
本发明实施例提供了一种光感器件的装配结构，用于简化光感器件的组装工艺，减少光感器件组装过程中的累计公差，并降低开发成本。
有鉴于此，本发明第一方面提供种光感器件的装配结构，可包括：
该装配结构包括底壳和光感柔性电路板FPC；
其中，光感FPC的上表面贴装有光感器件，光感FPC对应光感器件的贴片区域的下表面设有补强面板；
底壳设有光感支撑面，光感支撑面用于固定补强面板。
从以上技术方案可以看出，本发明实施例具有以下优点：
本实施例中，提供了一种光感器件的装配结构，该装配结构可以包括底壳和光感柔性电路板FPC，其中，光感FPC的上表面贴装有光感器件，光感FPC对应光感器件的贴片区域的下表面则设有补强面板，且补强面板可固定于底壳的光感支撑面上，由上述结构可知，光感器件与屏幕盖板之间的距离可通过光感FPC的厚度、补强面板的厚度以及底壳的光感支撑面的厚度进行控制，而由于补强面板可以分别与光感FPC以及底壳的光感支撑面连接，从而简化了组装工艺，且底壳的光感支撑面以及补强面板的结构设计有利于减少组装过程中的累计公差。此外，补强面板相对于光感支架来说，结构的简单以及安装的便利性，有利于降低开发成本。
附图说明
图1为现有技术中光感器件的装配结构的示意图；
图2为本发明实施例中光感器件的装配结构的整体示意图；
图3为本发明实施例中光感器件的装配结构的部分示意图。
具体实施方式
本发明实施例提供了一种光感器件的装配结构，用于简化光感器件的组装工艺，减少光感器件组装过程中的累计公差，并降低开发成本。
为了使本技术领域的人员更好地理解本发明方案，下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分的实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都应当属于本发明保护的范围。
本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便这里描述的实施例能够以除了在这里图示或描述的内容以外的顺序实施。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元的过程、方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。
为便于理解，下面对本发明实施例中的光感器件的装配结构进行具体详细的描述，请参阅图2，本发明实施例中光感器件的装配结构一个实施例包括：
该装配结构可以包括底壳60和光感柔性电路板FPC20；
其中，光感FPC20的上表面可以贴装有光感器件10，光感FPC20对应光感器件10的贴片区域的下表面可以设有补强面板70；
底壳60可以设有光感支撑面80，光感支撑面80可以用于固定补强面板70。
在实际应用中，光感器件10可以在诸如手机、平板电脑等不同的电子设备中得到利用，对于电子设备来说，均可以包括底壳60和屏幕盖板50，且在底壳60和屏幕盖板50形成的封闭空间内可以设有光感器件10的装配结构。具体的，在屏幕盖板50的下方，即内表面，还可以设有光感开孔，光感开孔的收光角度应尽量控制在较大的范围内，以减小由于收光角度过小而导致屏幕盖板50的诸如玻璃表面反射造成的光串扰，而由于光感器件10的顶部与 屏幕盖板50的内表面之间的间隙B过大将导致光感开孔的收光角度减小，从而需要将间隙B需要控制在设定的数值范围内。
本实施例中，如图2所示，底壳60可以设有光感支撑面80，补强面板70的上下表面可以分别连接有光感FPC20和光感支撑面80，光感器件10可以直接贴装于光感FPC20的上表面。其中，底壳60上表面的对应位置设有主板40，主板40的上表面与屏幕盖板50的内表面之间的距离可以为A，主板40的上表面与光感器件10底部的距离可以为C，而由于光感FPC20由固定于光感支撑面80上的补强面板70得到支撑，且光感器件10的高度固定，那么间隙B可由光感FPC20的厚度、补强面板70的厚度以及光感支撑面80的厚度的高度之和E进行控制。相对于现有技术中光感支架30的使用来说，本实施例通过补强面板70以及底壳60中光感支撑面80的设计，简化了组装工艺，且组装过程中，仅存在补强面板70与光感FPC20以及光感支撑面80之间的连接差异，但由于补强面板70结构的平整性，以及光感FPC20与光感支撑面80的厚度可控性，有利于减小补强面板70在连接过程中的累计公差，从而可以避免间隙B过大的情况。同时，本实施例不需要额外增设光感支架30，而相对光感支架30来说，补强面板70的结构设计以及安装均较为简单，从而有利降低开发成本。
在上述结构中，由于间隙B可由光感FPC20的厚度、补强面板70的厚度以及光感支撑面80的厚度之和E进行控制，那么光感支撑面80的厚度、补强面板70的厚度以及光感FPC20的厚度可以与预先设定的光感器件的封装高度相适应，其中，封装高度可以为光感器件10与屏幕盖板50之间的距离，即间隙B。例如，假设间隙B为0.3毫米，光感器件10的高度为1毫米，距离A为1厘米，则光感支撑面80的厚度、补强面板70的厚度以及光感FPC20的厚度之和应该控制为9.7毫米，且光感支撑面80的厚度、补强面板70的厚度以及光感FPC20的厚度可以根据9.7毫米分别进行设计。
可以理解的是，本实施例中上述对应封装高度的设计说明的各个数值仅为举例说明，在实际应用中，可以根据具体的结构需要进行相应的设计与调整，此处不做限定。
进一步的，为了防止光感器件10受到灰尘的不利影响，光感器件可以安 装有防尘套，在实际应用中，防尘套的厚度应该小于封装高度，以利于屏幕盖板50的安装。优选的，防尘套可以为硅胶材质。同时，为了减轻装配结构整体的重量，优选的，补强面板70可以为由泡棉制成的板状结构。
需要说明的是，本实施例中防尘套除了使用硅胶材质进行制备，在实际应用中，也可以采用其它柔性材质进行制备，如橡胶。此外，补强面板70除了为由上述说明的泡棉制成的板状结构，在实际应用中，也可以采用其它高强度的轻质材料制成板状结构，只要能达到相应的效果即可，具体此处均不做限定。
在实际应用中，补强面板70的上表面在与光感FPC20通过粘结方式固定连接后，补强面板70的下表面可以也通过粘结方式与光感支撑面80进行固定连接，为了进一步加强补强面板70与光感支撑面80之间的连接作用，如图3所示，光感支撑面80可以设有定位柱801，定位柱801可以用于定位补强面板70，并可以达到间接定位光感FPC20的作用。相对应的，光感FPC20以及补强面板70可以设有配合定位柱801的凹槽结构，以使得定位柱801可以位于凹槽结构中达到定位作用。
可以理解的是，本实施例中为了配合定位柱，光感FPC20以及补强面板70除了设计上述说明的凹槽结构，在实际应用中，也可以设计其它结构，如通孔结构，使得定位柱801可以穿过通孔起到定位作用，具体结构此处不做限定。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，本说明书中各个实施例采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似部分互相参见即可。
在本申请所提供的几个实施例中，应该理解到，以上实施例仅用以说明本发明的技术方案，而非对其限制；尽管参照前述实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (7)

  1. 一种光感器件的装配结构，所述装配结构包括底壳和光感柔性电路板FPC，其特征在于，
    所述光感FPC的上表面贴装有所述光感器件，所述光感FPC对应所述光感器件的贴片区域的下表面设有补强面板；
    所述底壳设有光感支撑面，所述光感支撑面用于固定所述补强面板。
  2. 根据权利要求1所述的光感器件的装配结构，其特征在于，所述光感支撑面的厚度、所述补强面板的厚度以及所述光感FPC的厚度与预先设定的所述光感器件的封装高度相适应，所述封装高度为所述光感器件与屏幕盖板之间的距离。
  3. 根据权利要求2所述的光感器件的装配结构，其特征在于，所述光感器件安装有防尘套，所述防尘套的厚度小于所述封装高度。
  4. 根据权利要求3所述的光感器件的装配结构，其特征在于，所述防尘套为硅胶材质。
  5. 根据权利要求1至4中任一项所述的光感器件的装配结构，其特征在于，所述光感支撑面设有定位柱，所述定位柱用于定位所述补强面板。
  6. 根据权利要求5所述的光感器件的装配结构，其特征在于，所述光感FPC以及所述补强面板设有配合所述定位柱的凹槽结构。
  7. 根据权利要求1至6中任一项所述的光感器件的装配结构，其特征在于，所述补强面板为由泡棉制成的板状结构。
PCT/CN2017/072600 2016-09-26 2017-01-25 一种光感器件的装配结构 Ceased WO2018053979A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610851446.4A CN106211565B (zh) 2016-09-26 2016-09-26 一种光感器件的装配结构
CN201610851446.4 2016-09-26

Publications (1)

Publication Number Publication Date
WO2018053979A1 true WO2018053979A1 (zh) 2018-03-29

Family

ID=57520697

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/072600 Ceased WO2018053979A1 (zh) 2016-09-26 2017-01-25 一种光感器件的装配结构

Country Status (2)

Country Link
CN (1) CN106211565B (zh)
WO (1) WO2018053979A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114333186A (zh) * 2022-01-17 2022-04-12 盐城鸿石智能科技有限公司 一种支付设备的防拆结构

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106211565B (zh) * 2016-09-26 2019-01-25 宇龙计算机通信科技(深圳)有限公司 一种光感器件的装配结构

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120170284A1 (en) * 2010-12-30 2012-07-05 Anna-Katrina Shedletsky Diffuser and filter structures for light sensors
CN202873185U (zh) * 2012-10-11 2013-04-10 广东欧珀移动通信有限公司 一种光感器件在pcb上的装配结构
CN103327730A (zh) * 2013-05-23 2013-09-25 上海摩软通讯技术有限公司 具有感光功能的电子设备、柔性线路板及插座
CN106211565A (zh) * 2016-09-26 2016-12-07 宇龙计算机通信科技(深圳)有限公司 一种光感器件的装配结构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204291070U (zh) * 2014-11-23 2015-04-22 上海屹熙科技有限公司 距离光感定位机构
CN204791061U (zh) * 2015-07-14 2015-11-18 阿里巴巴集团控股有限公司 一种终端
CN105282283B (zh) * 2015-11-10 2017-11-24 广东欧珀移动通信有限公司 一种移动终端

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120170284A1 (en) * 2010-12-30 2012-07-05 Anna-Katrina Shedletsky Diffuser and filter structures for light sensors
CN202873185U (zh) * 2012-10-11 2013-04-10 广东欧珀移动通信有限公司 一种光感器件在pcb上的装配结构
CN103327730A (zh) * 2013-05-23 2013-09-25 上海摩软通讯技术有限公司 具有感光功能的电子设备、柔性线路板及插座
CN106211565A (zh) * 2016-09-26 2016-12-07 宇龙计算机通信科技(深圳)有限公司 一种光感器件的装配结构

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114333186A (zh) * 2022-01-17 2022-04-12 盐城鸿石智能科技有限公司 一种支付设备的防拆结构

Also Published As

Publication number Publication date
CN106211565A (zh) 2016-12-07
CN106211565B (zh) 2019-01-25

Similar Documents

Publication Publication Date Title
CN108153023B (zh) 显示屏及电子设备
US9380714B2 (en) Portable terminal with crack prevention structure for display device
US10558067B2 (en) Support frame, display device and mounting method thereof
US10168737B2 (en) Display suspension
CN114125103B (zh) 连接圈、中框、电子设备、显示模组及其装配方法
US11005069B2 (en) Display panel and display device
WO2020155396A1 (zh) 双面显示面板的背板结构、双面显示面板及其制作方法
CN103543547B (zh) 电子装置
US9983426B2 (en) Display module and display device comprising display module
CN108886543A (zh) 一种移动终端的框架结构以及包括该框架结构的移动终端
JP2013205551A (ja) 透光性パネル取付構造及び携帯型電子機器
WO2017219405A1 (zh) 触摸屏、显示装置及触摸屏的制备方法
CN108322563A (zh) 电子设备
CN204993512U (zh) 一种屏幕组件及移动终端
KR102168200B1 (ko) 프론트 케이스 프레임을 갖지 않는 전자 장치
WO2019242469A1 (zh) 显示屏结构及移动终端
TW201508381A (zh) 顯示裝置
WO2018053979A1 (zh) 一种光感器件的装配结构
CN106993074A (zh) 一种电子终端
CN105100307B (zh) 一种移动终端芯片补强板的固定结构及移动终端
CN104915055B (zh) 防撞式触控显示装置
CN206302478U (zh) 摄像头模组
TW201947296A (zh) 顯示裝置
CN207039740U (zh) 一种摄像头组件和移动终端
CN209517731U (zh) 终端设备

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17852059

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17852059

Country of ref document: EP

Kind code of ref document: A1