WO2018047751A1 - Electronic component package, electronic control device, and servo motor - Google Patents

Electronic component package, electronic control device, and servo motor Download PDF

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Publication number
WO2018047751A1
WO2018047751A1 PCT/JP2017/031697 JP2017031697W WO2018047751A1 WO 2018047751 A1 WO2018047751 A1 WO 2018047751A1 JP 2017031697 W JP2017031697 W JP 2017031697W WO 2018047751 A1 WO2018047751 A1 WO 2018047751A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
fixing member
mounting body
insertion port
body according
Prior art date
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PCT/JP2017/031697
Other languages
French (fr)
Japanese (ja)
Inventor
有晃 佐藤
洪偉 甄
隆平 渡部
千石谷 善一
Original Assignee
パナソニックIpマネジメント株式会社
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Application filed by パナソニックIpマネジメント株式会社 filed Critical パナソニックIpマネジメント株式会社
Publication of WO2018047751A1 publication Critical patent/WO2018047751A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/04Mountings specially adapted for mounting on a chassis

Definitions

  • the present invention relates to an electronic component mounting body, an electronic control device, and a servo motor, and more particularly to improvement of vibration resistance of an electronic component mounted on a substrate.
  • the electronic part vibrates starting from the joint with the board. At this time, the greater the distance from the substrate of the electronic component, the greater the swing width. Therefore, even if the fixture is arranged near the substrate and the electronic component is fixed, it is difficult to suppress vibration of the electronic component.
  • the present invention aims to solve the above problems.
  • the electronic component mounting body includes a substrate having a mounting surface, an electronic component mounted on the mounting surface of the substrate, and a fixing member.
  • the fixing member is disposed apart from the mounting surface, and has an insertion port for inserting the electronic component, and a peripheral portion that is disposed so as to surround the insertion port and presses and fixes the electronic component inserted into the insertion port.
  • An electronic control device includes an electronic component mounting body and a housing that covers the electronic component mounting body.
  • a servo motor includes an electric motor and the electronic control device.
  • an electronic component mounting body having excellent vibration resistance can be obtained by a fixing member having a simple structure.
  • FIG. 1 is a perspective view schematically showing an electronic component mounting body according to an embodiment of the present invention.
  • FIG. 2A is a side view schematically showing a part of the example of the electronic component mounting body according to the embodiment of the present invention.
  • FIG. 2B is a side view schematically showing a part of another example of the electronic component mounting body according to the exemplary embodiment of the present invention.
  • FIG. 2C is a side view schematically showing a part of still another example of the electronic component mounting body according to the exemplary embodiment of the present invention.
  • FIG. 3A is a perspective view illustrating a fixing member according to the first embodiment.
  • 3B is a cross-sectional view showing an example of 3B-3B in FIG. 3A.
  • FIG. 3C is a cross-sectional view showing an example of 3C-3C in FIG. 3A.
  • FIG. 4A is a perspective view illustrating a fixing member according to the second embodiment.
  • FIG. 4B is a top view illustrating a part of the fixing member according to the second embodiment.
  • FIG. 4C is a top view illustrating another part of the fixing member according to the second embodiment.
  • FIG. 5A is a perspective view illustrating a fixing member according to a third embodiment.
  • FIG. 5B is a top view illustrating a part of the fixing member according to the third embodiment.
  • FIG. 6A is a perspective view illustrating a fixing member according to a fourth embodiment. 6B is a cross-sectional view taken along line 6B-6B in FIG. 6A.
  • FIG. 7A is a perspective view illustrating a fixing member according to a fifth embodiment.
  • FIG. 7B is a cross-sectional view taken along line 7B-7B in FIG. 7A.
  • FIG. 8 is a perspective view schematically showing an electronic component mounting body including the fixing member according to the fifth embodiment.
  • FIG. 9A is a perspective view illustrating a fixing member according to a sixth embodiment. 9B is a cross-sectional view taken along line 9B-9B in FIG. 9A.
  • FIG. 10A is a perspective view illustrating a fixing member according to a seventh embodiment. 10B is a cross-sectional view taken along line 10B-10B in FIG. 10A.
  • FIG. 11 is a perspective view schematically showing an electronic component mounting body including the fixing member according to the seventh embodiment.
  • FIG. 11 is a perspective view schematically showing an electronic component mounting body including the fixing member according to the seventh embodiment.
  • FIG. 12 is a perspective view schematically showing the electronic control device according to the embodiment of the present invention.
  • FIG. 13 is a perspective view schematically showing another electronic control device according to the embodiment of the present invention.
  • FIG. 14 is a block diagram illustrating the configuration of the servo motor according to the embodiment of the present invention.
  • An electronic component mounting body includes a substrate having a mounting surface, an electronic component mounted on the mounting surface of the substrate, and a fixing member for fixing the electronic component. .
  • the fixing member is disposed away from the mounting surface.
  • the fixing member has a main surface facing the mounting surface, a sub surface opposite to the main surface, and an insertion port for inserting an electronic component.
  • the electronic component is inserted into the insertion port of the fixing member, and is fixed by being pressed by the peripheral portion arranged so as to surround the insertion port.
  • the fixing member is disposed away from the substrate. Therefore, the fixing member can fix a portion where the swing width of the electronic component is larger (a portion away from the substrate of the electronic component). Further, even if the substrate vibrates, the fixing member is not easily affected. Therefore, the effect of suppressing vibration of the electronic component is high. Further, the electronic component is pressed by the peripheral edge portion of the insertion port provided in the fixing member. In other words, at least a part of the peripheral portion of the fixing member is in contact with the electronic component. The electronic component vibrates when a vibration that matches the natural frequency (resonance frequency) of the electronic component is transmitted. However, when the fixing member is in contact with the electronic component, the natural frequency of the electronic component changes, and the electronic component is less likely to vibrate. That is, the fixing member according to the embodiment of the present invention makes it difficult for the electronic component to vibrate, and even if it vibrates, the vibration is suppressed.
  • FIG. 1 is a perspective view schematically showing an electronic component mounting body 100 according to an embodiment of the present invention.
  • FIG. 2A is a side view schematically showing a part of the example of the electronic component mounting body 100 according to the embodiment of the present invention.
  • FIG. 2B is a side view schematically showing a part of another example of electronic component mounting body 100 according to the exemplary embodiment of the present invention.
  • FIG. 2C is a side view schematically showing a part of still another example of the electronic component mounting body 100 according to the exemplary embodiment of the present invention.
  • the electronic component mounting body 100 includes a substrate 110 having a mounting surface 110x, an electronic component 120 mounted on the mounting surface 110x of the substrate 110, and a fixing member 130 that fixes the electronic component 120.
  • the fixing member 130 is disposed away from the mounting surface 110x.
  • the fixing member 130 includes a main surface 130x facing the mounting surface 110x, a sub surface 130y opposite to the main surface 130x, and an insertion port 1301 (see FIG. 3 and the like) into which the electronic component 120 is inserted.
  • the electronic component 120 is a capacitor
  • the end of the electronic component 120 that is not bonded to the mounting surface 110x may be covered with the cap 140.
  • the fixing member 130 fixes the electronic component 120 at a position of a height HF (hereinafter referred to as a fixed height HF) from the mounting surface 110x.
  • the fixed height HF is not particularly limited. Among these, the higher the fixed height HF, the better the vibration is easily suppressed.
  • the fixed height HF is 1/2 of the height HE of the electronic component 120. The above is preferable.
  • the height HE of the electronic component 120 is a distance from the mounting surface 110x to the highest position of the electronic component 120.
  • the fixed height HF is a distance from the mounting surface 110x to a pressing portion P (a portion corresponding to a part of a peripheral portion 130p described later) by the fixing member 130 of the electronic component 120.
  • FIG. 3A is a perspective view illustrating a fixing member according to the first embodiment.
  • 3B is a cross-sectional view showing an example of 3B-3B in FIG. 3A.
  • 3C is a cross-sectional view showing an example of 3C-3C in FIG. 3A.
  • the fixed height HF may be a distance from the mounting surface 110x to the main surface 130x of the fixing member 130.
  • the fixing member 130 includes the support wall 1304 (FIG.
  • the fixing height HF is equal to the distance HF1 from the mounting surface 110x to the main surface 130x and the mounting surface 110x, as shown in FIG. 2B. And the distance HF2 from the support wall 1304 to the end of the support wall 1304.
  • the fixing height HF is measured with reference to the main surface 130x of the fixing member 130 arranged closest to the mounting surface 110x. It only has to be done. At this time, the fixed height HF of the fixing member 130 arranged closest to the mounting surface 110x may be 1 / (n + 1) or more (n is a natural number of 2 or more) of the height HE. Considering the thickness of the entire fixing member 130, the vibration of the electronic component 120 is easily suppressed by setting the fixing height HF of the fixing member 130 disposed closest to the mounting surface 110x within the above range.
  • the plurality of fixing members 130 may be installed at equal intervals in the stacking direction.
  • the fixed height HF of the fixing member 130 disposed closest to the mounting surface 110x is 1 / (n + 1) of the height HE.
  • the remaining fixing members 130 are arranged such that the interval between the respective fixing heights HF is 1 / (n + 1) of the height HE.
  • the two fixing members 131 and 132 are installed at equal intervals in the direction in which they are stacked.
  • the fixing height HF of the fixing member 131 is 1/3 of the height HE.
  • the fixing height HF of the fixing member 132 is 2/3 of the height HE.
  • it is preferable that all the fixing height HF of the some fixing member 130 is 1/2 or more of the height HE of the electronic component 120 at the point which a vibration is easy to be suppressed.
  • the electronic component 120 is inserted into the insertion port 1301 provided in the fixing member 130. At this time, the electronic component 120 and at least a part of the peripheral portion 130p surrounding the insertion port 1301 of the fixing member 130 are in contact with each other. Then, the electronic component 120 is pressed and fixed to the fixing member 130 at the place where the electronic component 120 is in contact with the peripheral portion 130p.
  • the shape of the peripheral portion 130p is not particularly limited, and various modes are conceivable. Hereinafter, specific examples of the shape of the peripheral portion 130p will be described with reference to the drawings.
  • FIG. 3A is a perspective view showing a fixing member 130A of the first embodiment.
  • 3B is a cross-sectional view showing an example of 3B-3B in FIG. 3A.
  • 3C is a cross-sectional view showing an example of 3C-3C in FIG. 3A.
  • the peripheral portion 130p of the first embodiment has an end surface including an inclined surface that narrows the opening area of the insertion port 1301 from the main surface 130x of the fixing member 130 toward the sub surface 130y.
  • at least a part of the end face of the peripheral portion 130p is tapered.
  • the opening area on the side of the sub surface 130y is made substantially the same as the area when viewed from the normal direction of the mounting surface 110x of the electronic component 120.
  • the electronic component 120 is pressed by a part of the end surface in the vicinity of the sub surface 130y and is fixed to the fixing member 130.
  • the end surface 130t of the peripheral portion 130p includes, for example, an inclined surface 130ts and a vertical surface 130tv, as shown in FIG. 3B.
  • the inclined surface 130ts is inclined so as to narrow the opening area of the insertion port 1301 from the main surface 130x toward the sub surface 130y. That is, the insertion port 1301 is gradually narrowed in the direction D1 from the main surface 130x toward the sub surface 130y.
  • the acute angle ⁇ 1 formed by the inclined surface 130ts and the main surface 130x is not particularly limited, but is, for example, 30 to 75 degrees.
  • the vertical surface 130tv is, for example, perpendicular to the main surface 130x.
  • an acute angle (not shown) formed by the vertical surface 130tv and the main surface 130x is preferably larger than the acute angle ⁇ 1 and less than 90 degrees.
  • the electronic component 120 comes into contact with the vertical surface 130tv and is pressed by the pressing portion P where the electronic component 120 and the vertical surface 130tv come into contact.
  • the end surface 130t of the peripheral portion 130p may be formed by only the inclined surface 130ts as shown in FIG. 3C, for example.
  • the electronic component 120 is pressed in contact with, for example, the inclined surface 130ts in the vicinity of the sub surface 130y.
  • an insertion port 1301 whose opening area becomes narrower from the main surface 130x toward the sub surface 130y may be formed.
  • the end face 130t is a face of the peripheral part 130p that faces the inserted electronic component 120.
  • the peripheral edge portion 130p is inserted from the main surface 130x facing the mounting surface 110x toward the sub surface 130y opposite to the main surface 130x.
  • the electronic device 120 is fixed to the fixing member 130 by being pressed by a part of the end surface 130t.
  • FIG. 4A is a perspective view showing a fixing member 130B of the second embodiment.
  • FIG. 4B is a top view showing a part of the fixing member 130B of the second embodiment.
  • FIG. 4C is a top view showing another part of the fixing member 130B of the second embodiment.
  • the shape of the insertion port 1301 and the shape of the electronic component 120 are different. Therefore, the electronic component 120 is pressed by making point contact with the peripheral portion 130 p and is fixed to the fixing member 130.
  • the shape (hereinafter, upper surface shape E) when viewed from the normal direction of the mounting surface 110x of the electronic component 120 is circular, whereas the shape of the insertion port 1301 (hereinafter, upper surface shape I) is square. It is. Therefore, the electronic component 120 is pressed by the four pressing portions P in the peripheral portion 130p and fixed to the fixing member 130B.
  • the upper surface shape E and the upper surface shape I are not limited to this.
  • examples of the upper surface shape I include an ellipse, a polygon such as a triangle, a quadrangle, and a hexagon.
  • the upper surface shape I is a shape which can press the electronic component 120 with the three or more press parts P at the point where the electronic component 120 is fixed more firmly.
  • the difference between the upper surface shape E and the upper surface shape I includes the case where the directions are different even if they are the same shape.
  • the upper surface shape I and the upper surface shape E are both square, but when the electronic component 120 is inserted into the insertion port 1301, the positions of the apexes do not overlap. In this case, the electronic component 120 is pressed by the peripheral portion 130p at its four apexes.
  • the upper surface shape I is a shape obtained by enlarging the upper surface shape E and rotating it 90 degrees.
  • a plurality of fixing members 130 ⁇ / b> B having different top surface shapes I may be stacked to form the insertion port 1301 having a shape different from the top surface shape E.
  • the shape of the insertion port 1301 and the shape of the electronic component 120 are different when viewed from the normal direction of the mounting surface 110x. 120 may be pressed by making point contact with the peripheral portion 130p and fixed to the fixing member 130B.
  • FIG. 5A is a perspective view showing a fixing member 130C of the third embodiment.
  • FIG. 5B is a top view illustrating a part of the fixing member 130 ⁇ / b> C according to the third embodiment.
  • the peripheral portion 130p of the third embodiment has a plurality of protrusions 1302 that protrude toward the insertion port 1301 side.
  • the electronic component 120 is pressed by the protrusion and fixed to the fixing member 130.
  • the peripheral portion 130p includes, for example, three protrusions 1302 that protrude toward the insertion port 1301 as shown in FIG. 5B.
  • the electronic component 120 comes into contact with the protrusion 1302 (point contact) and is pressed.
  • three continuous protrusions 1302 are arranged at one place, and the three protrusions 1302 are equally arranged at the peripheral portion 130p.
  • the shape, arrangement, and number of the protrusions 1302 are not limited to this.
  • it is preferable that the protrusion 1302 is equally arrange
  • the peripheral portion 130p has the plurality of protrusions 1302 protruding toward the insertion port 1301, and the electronic component 120 has the protrusion It may be pressed by 1302 and fixed to the fixing member 130C.
  • FIG. 6A is a perspective view showing a fixing member 130D of the fourth embodiment.
  • 6B is a cross-sectional view taken along line 6B-6B in FIG. 6A.
  • the peripheral portion 130p of the fourth embodiment has a plurality of tongue pieces 1303 divided by slits. At this time, the opening area of the insertion port 1301 is made smaller than the area of the electronic component 120. Thereby, the electronic component 120 is inserted into the insertion port 1301 while pushing up the tongue piece 1303. Therefore, the electronic component 120 is pressed by the tongue piece 1303 and fixed to the fixing member 130.
  • a plurality of slits 1303s are formed radially from the center of the insertion port 1301. Thereby, a plurality of tongue pieces 1303 are formed.
  • the opening area of the insertion port 1301 is smaller than the area of the electronic component 120. Therefore, when the electronic component 120 is inserted into the insertion port 1301, the tongue piece 1303 is pushed up by the electronic component 120 as shown in FIG. 6B. Accordingly, the tongue piece 1303 contacts the electronic component 120 and presses the electronic component 120.
  • six slits 1303s are formed in the peripheral portion 130p, and six tongue pieces 1303 are formed. The shape, arrangement, and number of the tongue pieces 1303 are not limited to these.
  • the electronic component 120 it is preferable that three or more identical tongue pieces 1303 are equally arranged on the peripheral edge portion 130p.
  • the length and arrangement of the slits 1303s are not particularly limited, and may be appropriately formed so as to obtain a desired tongue piece 1303.
  • the peripheral portion 130p includes the plurality of tongue pieces 1303 divided by the slits 1303s, and the electronic component 120 includes the tongue pieces 1303. And may be fixed to the fixing member 130D.
  • FIG. 7A is a perspective view showing a fixing member 130E of the fifth embodiment.
  • 7B is a cross-sectional view taken along line 7B-7B in FIG. 7A.
  • the peripheral portion 130p of the fifth embodiment has a support wall 1304 standing in a direction D2 from the sub surface 130y toward the main surface 130x along at least part of the periphery of the insertion port 1301. Thereby, the vibration of the electronic component 120 is further easily suppressed.
  • the inner wall of the support wall 1304 is tapered, a protrusion 1302 is provided on the inner wall, a plurality of slits are formed in the support wall 1304 along the height direction thereof, or a tongue piece is formed, or
  • the shape surrounded by at least one of the insertion port and the inner wall is made to be a shape different from the upper surface shape E. Alternatively, these may be combined. As a result, the electronic component 120 contacts and is pressed against at least a part of the support wall 1304 and is fixed to the fixing member 130E.
  • the support wall 1304 of the fixing member 130E is erected in the direction D2 from the sub surface 130y toward the main surface 130x along the entire circumference of the insertion port 1301. Further, a plurality of protrusions 1302 protruding toward the insertion port 1301 are arranged on the inner wall 1304t of the support wall 1304.
  • the electronic component 120 is inserted into the support wall 1304, the electronic component 120 is brought into point contact with the protrusion 1302 and pressed. Thereby, vibration is suppressed. Further, the support wall 1304 suppresses vibrations to be smaller. Note that the support wall 1304 only needs to be erected along at least a part of the periphery of the insertion port 1301.
  • a plurality of the support walls 1304 are erected intermittently with a width of 1/10 or more of the periphery of the insertion port 1301. It is preferable.
  • FIG. 7B is a perspective view schematically showing an electronic component mounting body 100 including a fixing member 130E according to the fifth embodiment.
  • the support wall 1304 may be erected in a tapered shape such that the diameter increases in the direction D2. Thereby, the electronic component 120 becomes easier to insert.
  • the acute angle ⁇ 2 formed between the inner wall 1304t of the support wall 1304 and the main surface 130x is larger than the acute angle ⁇ 1. Specifically, the acute angle ⁇ 2 is, for example, 70 to 90 degrees.
  • the support wall 1304 may be erected in the direction D1 (not shown).
  • the protrusion 1302 may be disposed in the vicinity of the end of the inner wall 1304t opposite to the mounting surface 110x. This is because the electronic component 120 is easily inserted.
  • the support wall 1304 may be erected in a tapered shape such that the diameter increases in the direction D2.
  • the peripheral portion 130p stands in a direction from the sub surface 130y toward the main surface 130x along at least a part of the periphery of the insertion port 1301.
  • a support wall 1304 may be further provided.
  • FIG. 9A is a perspective view illustrating a fixing member 130F according to the sixth embodiment.
  • 9B is a cross-sectional view taken along line 9B-9B in FIG. 9A.
  • the fixing member 130F of the sixth embodiment includes a tapered support wall 1304.
  • the peripheral portion 130p of the sixth embodiment has a support wall 1304 that stands up in a tapered shape with the diameter decreasing toward the direction D1.
  • the support wall 1304 is erected in a direction D1 from the main surface 130x toward the sub surface 130y along at least a part of the periphery of the insertion port 1301. Therefore, when the electronic component 120 is inserted into the support wall 1304, the electronic component 120 comes into contact with and is pressed near the end portion of the inner wall 1304t opposite to the mounting surface 110x. Thereby, the vibration of the electronic component 120 is suppressed.
  • the support wall 1304 of the fixing member 130F is erected in the direction D1 from the main surface 130x toward the sub surface 130y along the entire circumference of the insertion port 1301.
  • the support wall 1304 is tapered so that the diameter increases in the direction D2. That is, the diameter of the support wall 1304 on the mounting surface 110 x side is larger than the area of the electronic component 120.
  • the diameter of the support wall 1304 opposite to the mounting surface 110x is substantially the same as the area of the electronic component 120. Therefore, when the electronic component 120 is inserted into the support wall 1304, the electronic component 120 comes into contact with and is pressed near the end portion of the inner wall 1304t opposite to the mounting surface 110x. Thereby, the vibration of the electronic component 120 is suppressed.
  • the tapered support wall 1304 may be erected in the direction D2 (not shown). Also in this case, the support wall 1304 is tapered so that the diameter increases in the direction D2.
  • the acute angle ⁇ 3 formed by the inner wall 1304t of the tapered support wall 1304 and the main surface 130x is, for example, the same as the acute angle ⁇ 1. Specifically, the acute angle ⁇ 3 is, for example, 60 to 80 degrees.
  • the peripheral portion 130p extends from the main surface 130x facing the mounting surface 110x along at least a part of the periphery of the insertion port 1301. You may have the support wall 1304 standingly arranged in the direction which goes to the sub surface 130y on the opposite side of the surface 130x.
  • FIG. 10A is a perspective view showing a fixing member 130G of the seventh embodiment.
  • 10B is a cross-sectional view taken along line 10B-10B in FIG. 10A.
  • the peripheral portion 130p of the seventh embodiment includes a support wall 1304 and a projection 1302 disposed on the inner wall 1304t of the support wall 1304.
  • the support wall 1304 is erected in a direction D1 from the main surface 130x toward the sub surface 130y along at least a part of the periphery of the insertion port 1301.
  • the peripheral portion 130p includes a cover 1305 that extends from an end portion of the support wall 1304 opposite to the mounting surface 110x and covers the insertion port 1301.
  • the fixing member 130G includes a support wall 1304 and a protrusion 1302 disposed on the inner wall 1304t of the support wall 1304. Therefore, when the electronic component 120 is inserted into the support wall 1304, as in the fifth embodiment, the electronic component 120 is point-contacted with the protrusion 1302 and pressed to suppress vibration.
  • the support wall 1304 further suppresses vibration.
  • FIG. 11 is a perspective view schematically showing an electronic component mounting body 100 including the fixing member 130G according to the seventh embodiment.
  • the fixing member 130G includes a cover 1305 that extends from the end of the support wall 1304 opposite to the mounting surface 110x and covers the insertion port 1301.
  • the support wall 1304 is erected in the direction D1 along the entire circumference of the insertion port 1301. Therefore, when the electronic component 120 is inserted into the support wall 1304, the support wall 1304 and the cover 1305 cover the end of the electronic component 120 that is not joined to the mounting surface 110x, as shown in FIG. It functions as the cap 140.
  • This aspect is preferable because the number of parts and the number of processes can be reduced.
  • the support wall 1304 may be erected in a tapered shape such that the diameter increases in the direction D2.
  • the support wall 1304 may be erected in the direction D2 (not shown). Also in this case, the cover 1305 extends from the end of the support wall 1304 opposite to the mounting surface 110x so as to cover the insertion port 1301. That is, the cover 1305 is disposed on the same surface as the main surface 130x or the sub surface 130y. Similarly to the above, when the electronic component 120 is inserted into the support wall 1304, the support wall 1304 and the cover 1305 can function as the cap 140 of the electronic component 120.
  • the fixing member 130G may have the cover 1305 extending from the support wall 1304 and covering the insertion port 1301.
  • the electronic component mounting body 100 includes the substrate 110 having the mounting surface 110x, the electronic component 120 mounted on the mounting surface 110x of the substrate 110, and the fixing member 130.
  • the fixing member 130 is disposed apart from the mounting surface 110x, and is disposed so as to surround the insertion port 1301 and the insertion port 1301, and presses the electronic component 120 inserted into the insertion port 1301. And a peripheral edge portion 130p to be fixed.
  • the fixing member 130 fixes the electronic component 120 at a position separated by 1/2 or more of the height HE from the mounting surface 110x.
  • the height of the electronic component 120 from the mounting surface 110x is HE, and n (n is a natural number of 2 or more) fixing members arranged at a predetermined interval in a direction perpendicular to the mounting surface 110x of the substrate 110.
  • the fixing member 130 fixes the electronic component 120 at a position separated from the mounting surface 110x by 1 / (n + 1) or more of the height HE.
  • FIG. 12 is a perspective view schematically showing the electronic control device 200 according to the embodiment of the present invention.
  • FIG. 13 is a perspective view schematically showing another electronic control device 200 according to the embodiment of the present invention.
  • members housed in the casing 210 other than the electronic component mounting body 100 and the heat dissipation member 220 are omitted for convenience.
  • the electronic component mounting body 100 is housed in, for example, a housing 210 and used as an electronic control device 200 for various electronic devices.
  • the electronic control device 200 includes an electronic component mounting body 100 and a housing 210 that covers the electronic component mounting body 100, as shown in FIG.
  • the housing 210 includes an upper case 211 and a lower case 212.
  • the electronic component mounting body 100 is housed in the housing 210 by being housed in the lower case 212 and then being covered with the upper case 211.
  • the fixing member 130 is preferably fixed to a member other than the substrate 110 accommodated in the housing 210. This is because vibration resistance is further enhanced.
  • the fixing member 130 may be fixed to the heat radiating member 220 as shown in FIG.
  • the heat dissipating member 220 is disposed between the substrate 110 and the lower case 212. Therefore, when fixing the fixing member 130 to the heat radiating member 220, a part of the heat radiating member 220 is raised to the upper case 211 side, and the height of the rising portion is set to the height from the mounting surface 110x of the fixing member 130 ( For example, it is the same as the fixed height HF.
  • the fixing member 130 and the heat radiating member 220 can be fixed by the screw 230. That is, in this case, the fixing member 130 can be fixed by an extremely simple assembling method in which screw holes are provided in the fixing member 130 and the heat radiating member 220 and the screws 230 are inserted therein.
  • the fixing member 130 may be fixed to the casing 210. Furthermore, the fixing member 130 may be a part of the casing 210. As shown in FIG. 13, at least a part of the surface of the upper case 211 facing the electronic component 120 is formed by the fixing member 130H. In this case, after the substrate 110 to which the electronic component 120 is bonded is stored in the lower case 212, the upper case 211 including the fixing member 130 ⁇ / b> H is covered, whereby the electronic component mounting body 100 is accommodated in the housing 210 and the electronic component 120 is fixed. It can be performed.
  • the fixing member 130H When a part of the upper case 211 is configured by the fixing member 130H, the fixing member 130H preferably includes a support wall 1304 standing in the direction D2, as shown in FIG. 7B. However, in this case, unlike FIG. 7B, the fixing member 130H includes a cover 1305 disposed on the same plane as the main surface 130x or the sub surface 130y. That is, the fixing member 130 ⁇ / b> H includes a support wall 1304 and a cover 1305 that can function as the cap 140 of the electronic component 120. Therefore, when the fixing member 130H is used, in the step of covering the upper case 211, the step of covering the electronic component 120 with the cap 140 is performed together with the housing of the electronic component mounting body 100 in the housing 210 and the fixing of the electronic component 120. . Therefore, this aspect further reduces the number of steps.
  • the electronic control device 200 may include the electronic component mounting body 100 described in (1) and the casing 210 that covers the electronic component mounting body 100.
  • the fixing member 130H may be fixed to the housing 210.
  • the electronic control device 200 may include an electronic component mounting body 100 and a casing 210 that covers the electronic component mounting body 100, and the fixing member 130H may constitute a part of the casing 210.
  • the electronic control device 200 is particularly suitable as a servo motor control device.
  • the servo motor according to the embodiment of the present invention includes an electric motor and an electronic control device 200.
  • the servo motor is used for controlling the mechanical position and angle in the servo mechanism.
  • the servo motor control device feeds back information on the rotation angle and rotation speed of the electric motor to control the driving of the electric motor. For this reason, in the control device, it is important from the viewpoint of improving accuracy to suppress the vibration of the electronic component mounted on the board. Since the electronic control device 200 according to the embodiment of the present invention is used as a control device for the servo motor 300 in order to effectively suppress vibration of the electronic component 120, the accuracy is improved.
  • FIG. 14 is a block diagram illustrating the configuration of the servo motor 300 according to the embodiment of the present invention.
  • the electronic control unit 200 is a digital / analog (D / A) converter (not shown) that constitutes a servo amplifier 320, as shown in FIG.
  • the servo amplifier 320 controls the electric motor 330 based on a pulse train output from a PLC (Programmable Logic Controller) 310 and a feedback pulse from the electric motor 330.
  • PLC Programmable Logic Controller
  • the type of the electric motor 330 is not particularly limited, and a conventionally known electric motor can be used as the electric motor of the servo motor.
  • Examples of the motor 330 include a commutator motor, an induction motor, and a synchronous motor.
  • a position detector (not shown) such as a rotation angle sensor (resolver) and an encoder is attached to the electric motor 330.
  • the electronic control device 200 controls the driving of the electric motor 330 based on the information obtained from the position detector.
  • Various machines 400 such as industrial machines are operated by the electric motor 330.
  • the servo motor 300 may include the electric motor 330 and the electronic control device 200 described in (2).
  • the size of the fixing member 130 is not particularly limited, and may be set as appropriate according to the size and number of electronic components 120 inserted into the insertion port 1301.
  • eight insertion ports 1301 are formed in the fixing member 130 and the eight electronic components 120 are fixed together.
  • the present invention is not limited to this.
  • One fixing port 1301 may be formed in the fixing member 130, or two or more insertion ports 1301 may be formed.
  • the material of the fixing member 130 is not particularly limited. Among these, at least the peripheral portion 130p, in particular, the contact portion where the fixing member 130 contacts the electronic component 120 (for example, the end surface 130t, the protrusion 1302, the tongue piece, etc.) in that the electronic component 120 can be securely fixed without being damaged. 1303 or the inner wall 1304t) is preferably formed of a flexible material. Examples of the material having flexibility include high-density polyethylene. In this case, the material of the peripheral portion 130p or the contact portion of the fixing member 130 may be different from the material of other portions.
  • the peripheral portion 130p of the fixing member 130 or the peripheral portion 130p of the fixing member 130 is used from the viewpoint of suppressing vibration and damage to the electronic component 120.
  • the contact portion may be thinner than the other portions.
  • the electronic component 120 mounted on the substrate 110 is not particularly limited, and may be appropriately selected from electronic components necessary for the electronic control device 200.
  • Examples of the electronic component 120 include a capacitor and a relay (relay).
  • the fixing member 130 according to the embodiment of the present invention is useful for improving the vibration resistance of the high-profile electronic component 120.
  • the tall electronic component is, for example, an electronic component in which the height HE from the mounting surface 110x is larger than the short diameter of the electronic component 120 viewed from the normal direction of the mounting surface 110x.
  • the minor axis of the electronic component 120 connects two intersections of the straight line and the outer edge when a straight line passing through a point on the outer edge and the center of the electronic component 120 viewed from the normal direction of the mounting surface 110x is drawn.
  • the length of the shortest straight line is drawn.
  • the fixing member 130 When the fixing member 130 includes the support wall 1304 and the cover 1305, the fixing member 130 is suitable for fixing a capacitor as the electronic component 120. This is because the number of parts and the number of processes can be reduced because the fixing member 130 also functions as a capacitor cap 140.
  • the capacitor is not particularly limited, and examples thereof include a film capacitor, a tantalum capacitor, and an aluminum electrolytic capacitor.
  • FIG. 1 shows a case where a plurality of cylindrical electronic components 120 are arranged on the electronic component mounting body 100, the shape and number of the electronic components 120 are not limited to those in FIG.
  • the height HE from the mounting surface 110x of the electronic component 120 is larger than the minor axis of the electronic component 120 as viewed from the normal direction of the mounting surface 110x. Larger is preferred.
  • the electronic component 120 may be a capacitor.
  • the electronic component mounted on the electronic component mounting body of the present invention is excellent in vibration resistance. Therefore, the electronic component mounting body according to the present invention is suitable as an electronic control device, particularly a servo motor control device.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Abstract

An electronic component package is provided with: a substrate having a mounting surface; an electronic component mounted on the mounting surface of the substrate; and a fixing member. The fixing member includes an insertion opening which is spaced apart from the mounting surface and into which the electronic component is inserted, and a peripheral portion which is disposed so as to surround the insertion opening and which presses and fixes the electronic component inserted into the insertion opening.

Description

電子部品実装体、電子制御装置、およびサーボモータElectronic component mounting body, electronic control device, and servo motor
 本発明は、電子部品実装体、電子制御装置、およびサーボモータに関し、特に、基板に実装される電子部品の耐振動性の向上に関する。 The present invention relates to an electronic component mounting body, an electronic control device, and a servo motor, and more particularly to improvement of vibration resistance of an electronic component mounted on a substrate.
 従来、プリント基板等の基板には、はんだ等の接続材料を介して、電子部品が搭載される。特に大型コンデンサ等の高背の電子部品は、耐振動性を向上させるため、特許文献1および特許文献2に記載されるような固定具を用いて、基板に搭載される。 Conventionally, electronic parts are mounted on a printed circuit board or the like via a connecting material such as solder. In particular, tall electronic components such as large capacitors are mounted on a substrate using a fixture as described in Patent Document 1 and Patent Document 2 in order to improve vibration resistance.
 電子部品が搭載される基板が振動すると、電子部品は、基板との接合部分を起点に振動する。このとき、電子部品の基板から離間した部分ほど、揺れ幅は大きくなる。そのため、固定具を基板の近くに配置して電子部品を固定しても、電子部品の振動を抑制することは困難である。 When the board on which the electronic component is mounted vibrates, the electronic part vibrates starting from the joint with the board. At this time, the greater the distance from the substrate of the electronic component, the greater the swing width. Therefore, even if the fixture is arranged near the substrate and the electronic component is fixed, it is difficult to suppress vibration of the electronic component.
特開2010-123651号公報JP 2010-123651 A 特開2007-173311号公報JP 2007-173111 A
 本発明は、上記の問題を解決することを目的とする。 The present invention aims to solve the above problems.
 本発明の一側面の電子部品実装体は、搭載面を有する基板と、基板の搭載面に搭載される電子部品と、固定部材と、を備える。固定部材は、搭載面から離間して配置されるとともに、電子部品を挿入する挿入口と、挿入口を囲むように配置され、挿入口に挿入された電子部品を押圧して固定する周縁部と、を有する。 The electronic component mounting body according to one aspect of the present invention includes a substrate having a mounting surface, an electronic component mounted on the mounting surface of the substrate, and a fixing member. The fixing member is disposed apart from the mounting surface, and has an insertion port for inserting the electronic component, and a peripheral portion that is disposed so as to surround the insertion port and presses and fixes the electronic component inserted into the insertion port. Have.
 本発明の他の一側面の電子制御装置は、電子部品実装体と、電子部品実装体を覆う筐体と、を備える。 An electronic control device according to another aspect of the present invention includes an electronic component mounting body and a housing that covers the electronic component mounting body.
 本発明のさらに他の一側面のサーボモータは、電動機と、上記電子制御装置と、を備える。 A servo motor according to still another aspect of the present invention includes an electric motor and the electronic control device.
 本発明によれば、シンプルな構造の固定部材により、耐振動性に優れる電子部品実装体を得ることができる。 According to the present invention, an electronic component mounting body having excellent vibration resistance can be obtained by a fixing member having a simple structure.
図1は、本発明の実施の形態に係る電子部品実装体を模式的に示す斜視図である。FIG. 1 is a perspective view schematically showing an electronic component mounting body according to an embodiment of the present invention. 図2Aは、本発明の実施の形態に係る電子部品実装体の例の一部を模式的に示す側面図である。FIG. 2A is a side view schematically showing a part of the example of the electronic component mounting body according to the embodiment of the present invention. 図2Bは、本発明の実施の形態に係る電子部品実装体の他の例の一部を模式的に示す側面図である。FIG. 2B is a side view schematically showing a part of another example of the electronic component mounting body according to the exemplary embodiment of the present invention. 図2Cは、本発明の実施の形態に係る電子部品実装体のさらに他の例の一部を模式的に示す側面図である。FIG. 2C is a side view schematically showing a part of still another example of the electronic component mounting body according to the exemplary embodiment of the present invention. 図3Aは、第1の実施の形態の固定部材を示す斜視図である。FIG. 3A is a perspective view illustrating a fixing member according to the first embodiment. 図3Bは、図3Aにおける、3B-3Bにおける一例を示す断面図である。3B is a cross-sectional view showing an example of 3B-3B in FIG. 3A. 図3Cは、図3Aにおける、3C-3Cにおける一例を示す断面図である。3C is a cross-sectional view showing an example of 3C-3C in FIG. 3A. 図4Aは、第2の実施の形態の固定部材を示す斜視図である。FIG. 4A is a perspective view illustrating a fixing member according to the second embodiment. 図4Bは、第2の実施の形態の固定部材の一部を示す上面図である。FIG. 4B is a top view illustrating a part of the fixing member according to the second embodiment. 図4Cは、第2の実施の形態の固定部材の別の一部を示す上面図である。FIG. 4C is a top view illustrating another part of the fixing member according to the second embodiment. 図5Aは、第3の実施の形態の固定部材を示す斜視図である。FIG. 5A is a perspective view illustrating a fixing member according to a third embodiment. 図5Bは、第3の実施の形態の固定部材の一部を示す上面図である。FIG. 5B is a top view illustrating a part of the fixing member according to the third embodiment. 図6Aは、第4の実施の形態の固定部材を示す斜視図である。FIG. 6A is a perspective view illustrating a fixing member according to a fourth embodiment. 図6Bは、図6Aにおける、6B-6B線における断面図である。6B is a cross-sectional view taken along line 6B-6B in FIG. 6A. 図7Aは、第5の実施の形態の固定部材を示す斜視図である。FIG. 7A is a perspective view illustrating a fixing member according to a fifth embodiment. 図7Bは、図7Aにおける、7B-7B線における断面図である。FIG. 7B is a cross-sectional view taken along line 7B-7B in FIG. 7A. 図8は、第5の実施の形態の固定部材を備える電子部品実装体を模式的に示す斜視図である。FIG. 8 is a perspective view schematically showing an electronic component mounting body including the fixing member according to the fifth embodiment. 図9Aは、第6の実施の形態の固定部材を示す斜視図である。FIG. 9A is a perspective view illustrating a fixing member according to a sixth embodiment. 図9Bは、図9Aにおける、9B-9B線における断面図である。9B is a cross-sectional view taken along line 9B-9B in FIG. 9A. 図10Aは、第7の実施の形態の固定部材を示す斜視図である。FIG. 10A is a perspective view illustrating a fixing member according to a seventh embodiment. 図10Bは、図10Aにおける、10B-10B線における断面図である。10B is a cross-sectional view taken along line 10B-10B in FIG. 10A. 図11は、第7の実施の形態の固定部材を備える電子部品実装体を模式的に示す斜視図である。FIG. 11 is a perspective view schematically showing an electronic component mounting body including the fixing member according to the seventh embodiment. 図12は、本発明の実施の形態に係る電子制御装置を模式的に示す斜視図である。FIG. 12 is a perspective view schematically showing the electronic control device according to the embodiment of the present invention. 図13は、本発明の実施の形態に係る他の電子制御装置を模式的に示す斜視図である。FIG. 13 is a perspective view schematically showing another electronic control device according to the embodiment of the present invention. 図14は、本発明の実施の形態に係るサーボモータの構成を説明するブロック図である。FIG. 14 is a block diagram illustrating the configuration of the servo motor according to the embodiment of the present invention.
 (1)電子部品実装体
 本発明の実施の形態の電子部品実装体は、搭載面を有する基板と、基板の搭載面に搭載される電子部品と、電子部品を固定する固定部材と、を備える。固定部材は、搭載面から離間して配置されている。固定部材は、搭載面に対向する主面と、主面の反対側の副面と、電子部品を挿入する挿入口と、を有する。電子部品は、固定部材の挿入口に挿入されるとともに、挿入口を囲むように配置された周縁部に押圧されることにより固定される。
(1) Electronic component mounting body An electronic component mounting body according to an embodiment of the present invention includes a substrate having a mounting surface, an electronic component mounted on the mounting surface of the substrate, and a fixing member for fixing the electronic component. . The fixing member is disposed away from the mounting surface. The fixing member has a main surface facing the mounting surface, a sub surface opposite to the main surface, and an insertion port for inserting an electronic component. The electronic component is inserted into the insertion port of the fixing member, and is fixed by being pressed by the peripheral portion arranged so as to surround the insertion port.
 固定部材は、基板から離間して配置されている。そのため、固定部材は、電子部品の揺れ幅がより大きい部分(電子部品の基板から離れた部分)を固定することができる。また、基板が振動しても、固定部材はその影響を受け難い。よって、電子部品の振動を抑制する効果が高い。さらに、電子部品は、固定部材に設けられた挿入口の周縁部によって押圧される。言い換えれば、固定部材の周縁部の少なくとも一部は、電子部品に接触している。電子部品は、電子部品の固有振動数(共振周波数)に一致するような振動が伝わることにより、振動する。しかし、固定部材が電子部品に接触していることにより、電子部品の固有振動数は変化して、電子部品は振動し難くなる。すなわち、本発明の実施の形態の固定部材により、電子部品は振動し難くなるとともに、振動した場合であっても、その振動は抑制される。 The fixing member is disposed away from the substrate. Therefore, the fixing member can fix a portion where the swing width of the electronic component is larger (a portion away from the substrate of the electronic component). Further, even if the substrate vibrates, the fixing member is not easily affected. Therefore, the effect of suppressing vibration of the electronic component is high. Further, the electronic component is pressed by the peripheral edge portion of the insertion port provided in the fixing member. In other words, at least a part of the peripheral portion of the fixing member is in contact with the electronic component. The electronic component vibrates when a vibration that matches the natural frequency (resonance frequency) of the electronic component is transmitted. However, when the fixing member is in contact with the electronic component, the natural frequency of the electronic component changes, and the electronic component is less likely to vibrate. That is, the fixing member according to the embodiment of the present invention makes it difficult for the electronic component to vibrate, and even if it vibrates, the vibration is suppressed.
 以下、本発明の実施の形態の電子部品実装体について、図1~図2Cを参照しながら具体的に説明する。図1は、本発明の実施の形態に係る電子部品実装体100を模式的に示す斜視図である。図2Aは、本発明の実施の形態に係る電子部品実装体100の例の一部を模式的に示す側面図である。図2Bは、本発明の実施の形態に係る電子部品実装体100の他の例の一部を模式的に示す側面図である。図2Cは、本発明の実施の形態に係る電子部品実装体100のさらに他の例の一部を模式的に示す側面図である。電子部品実装体100は、搭載面110xを有する基板110と、基板110の搭載面110xに搭載される電子部品120と、電子部品120を固定する固定部材130と、を備える。固定部材130は、搭載面110xから離間して配置されている。固定部材130は、搭載面110xに対向する主面130xと、主面130xの反対側の副面130yと、電子部品120を挿入する挿入口1301(図3等を参照)と、を有する。電子部品120がコンデンサである場合、電子部品120の搭載面110xに接合されていない方の端部は、キャップ140で覆われていてもよい。 Hereinafter, the electronic component mounting body according to the embodiment of the present invention will be specifically described with reference to FIGS. 1 to 2C. FIG. 1 is a perspective view schematically showing an electronic component mounting body 100 according to an embodiment of the present invention. FIG. 2A is a side view schematically showing a part of the example of the electronic component mounting body 100 according to the embodiment of the present invention. FIG. 2B is a side view schematically showing a part of another example of electronic component mounting body 100 according to the exemplary embodiment of the present invention. FIG. 2C is a side view schematically showing a part of still another example of the electronic component mounting body 100 according to the exemplary embodiment of the present invention. The electronic component mounting body 100 includes a substrate 110 having a mounting surface 110x, an electronic component 120 mounted on the mounting surface 110x of the substrate 110, and a fixing member 130 that fixes the electronic component 120. The fixing member 130 is disposed away from the mounting surface 110x. The fixing member 130 includes a main surface 130x facing the mounting surface 110x, a sub surface 130y opposite to the main surface 130x, and an insertion port 1301 (see FIG. 3 and the like) into which the electronic component 120 is inserted. When the electronic component 120 is a capacitor, the end of the electronic component 120 that is not bonded to the mounting surface 110x may be covered with the cap 140.
 図2Aに示すように、固定部材130は、搭載面110xからの高さHF(以下、固定高さHFと称す)の位置で、電子部品120を固定する。固定高さHFは特に限定されない。なかでも、振動が抑制され易い点で、固定高さHFは、高いほどよい。例えば、電子部品120の搭載面110xからの高さがHE(以下、単に電子部品120の高さHEと称す)である場合、固定高さHFは、電子部品120の高さHEの1/2以上であることが好ましい。電子部品120の高さHEとは、搭載面110xから電子部品120の最も高い位置までの距離である。固定高さHFとは、搭載面110xから、電子部品120の固定部材130による押圧部P(後述する周縁部130pの一部に対応する部分)までの距離である。図3Aは、第1の実施の形態の固定部材を示す斜視図である。図3Bは、図3Aにおける、3B-3Bにおける一例を示す断面図である。図3Cは、図3Aにおける、3C-3Cにおける一例を示す断面図である。固定高さHFは、搭載面110xから固定部材130の主面130xまでの距離であり得る。あるいは、後述するように固定部材130が支持壁1304(図2B)を備える場合、固定高さHFは、図2Bに示すように、搭載面110xから主面130xまでの距離HF1と、搭載面110xから支持壁1304の端部までの距離HF2との間である。 As shown in FIG. 2A, the fixing member 130 fixes the electronic component 120 at a position of a height HF (hereinafter referred to as a fixed height HF) from the mounting surface 110x. The fixed height HF is not particularly limited. Among these, the higher the fixed height HF, the better the vibration is easily suppressed. For example, when the height of the electronic component 120 from the mounting surface 110x is HE (hereinafter simply referred to as the height HE of the electronic component 120), the fixed height HF is 1/2 of the height HE of the electronic component 120. The above is preferable. The height HE of the electronic component 120 is a distance from the mounting surface 110x to the highest position of the electronic component 120. The fixed height HF is a distance from the mounting surface 110x to a pressing portion P (a portion corresponding to a part of a peripheral portion 130p described later) by the fixing member 130 of the electronic component 120. FIG. 3A is a perspective view illustrating a fixing member according to the first embodiment. 3B is a cross-sectional view showing an example of 3B-3B in FIG. 3A. 3C is a cross-sectional view showing an example of 3C-3C in FIG. 3A. The fixed height HF may be a distance from the mounting surface 110x to the main surface 130x of the fixing member 130. Alternatively, when the fixing member 130 includes the support wall 1304 (FIG. 2B) as described later, the fixing height HF is equal to the distance HF1 from the mounting surface 110x to the main surface 130x and the mounting surface 110x, as shown in FIG. 2B. And the distance HF2 from the support wall 1304 to the end of the support wall 1304.
 固定部材130をn枚(nは2以上の自然数)積層して配置する場合、固定高さHFは、搭載面110xに最も近接して配置される固定部材130の主面130xを基準にして測定されればよい。このとき、搭載面110xに最も近接して配置される固定部材130の固定高さHFは、高さHEの1/(n+1)以上(nは2以上の自然数)であればよい。固定部材130全体の厚みを考慮すると、搭載面110xに最も近接して配置される固定部材130の固定高さHFを上記の範囲にすることにより、電子部品120の振動は抑制され易くなる。 When n (n is a natural number greater than or equal to 2) fixing members 130 are stacked, the fixing height HF is measured with reference to the main surface 130x of the fixing member 130 arranged closest to the mounting surface 110x. It only has to be done. At this time, the fixed height HF of the fixing member 130 arranged closest to the mounting surface 110x may be 1 / (n + 1) or more (n is a natural number of 2 or more) of the height HE. Considering the thickness of the entire fixing member 130, the vibration of the electronic component 120 is easily suppressed by setting the fixing height HF of the fixing member 130 disposed closest to the mounting surface 110x within the above range.
 複数の固定部材130は、積層される方向に等間隔に設置されてもよい。この場合、搭載面110xに最も近接して配置される固定部材130の固定高さHFは、高さHEの1/(n+1)である。残りの固定部材130は、それぞれの固定高さHFの間隔が高さHEの1/(n+1)になるように配置する。例えば、図2Cでは、2枚の固定部材131、132が積層される方向に等間隔で設置されている。このとき、固定部材131の固定高さHFは、高さHEの1/3である。固定部材132の固定高さHFは、高さHEの2/3である。なかでも、振動が抑制され易い点で、複数の固定部材130の固定高さHFがすべて、電子部品120の高さHEの1/2以上にあることが好ましい。 The plurality of fixing members 130 may be installed at equal intervals in the stacking direction. In this case, the fixed height HF of the fixing member 130 disposed closest to the mounting surface 110x is 1 / (n + 1) of the height HE. The remaining fixing members 130 are arranged such that the interval between the respective fixing heights HF is 1 / (n + 1) of the height HE. For example, in FIG. 2C, the two fixing members 131 and 132 are installed at equal intervals in the direction in which they are stacked. At this time, the fixing height HF of the fixing member 131 is 1/3 of the height HE. The fixing height HF of the fixing member 132 is 2/3 of the height HE. Especially, it is preferable that all the fixing height HF of the some fixing member 130 is 1/2 or more of the height HE of the electronic component 120 at the point which a vibration is easy to be suppressed.
 電子部品120は、固定部材130に設けられた挿入口1301に挿入される。このとき、電子部品120と、固定部材130の挿入口1301を囲む周縁部130pの少なくとも一部とは、接触する。そして、電子部品120は、周縁部130pと接触した箇所で固定部材130に押圧されて、固定される。周縁部130pの形状は特に限定されず、様々な態様が考えられる。以下、周縁部130pの形状の具体例を、図面を参照しながら説明する。 The electronic component 120 is inserted into the insertion port 1301 provided in the fixing member 130. At this time, the electronic component 120 and at least a part of the peripheral portion 130p surrounding the insertion port 1301 of the fixing member 130 are in contact with each other. Then, the electronic component 120 is pressed and fixed to the fixing member 130 at the place where the electronic component 120 is in contact with the peripheral portion 130p. The shape of the peripheral portion 130p is not particularly limited, and various modes are conceivable. Hereinafter, specific examples of the shape of the peripheral portion 130p will be described with reference to the drawings.
 [第1の実施の形態]
 以下、第1の実施の形態の周縁部130pを備える固定部材130Aについて、図3A~図3Cを参照しながら具体的に説明する。図3Aは、第1の実施の形態の固定部材130Aを示す斜視図である。図3Bは、図3Aにおける、3B-3Bにおける一例を示す断面図である。図3Cは、図3Aにおける、3C-3Cにおける一例を示す断面図である。
[First Embodiment]
Hereinafter, the fixing member 130A including the peripheral portion 130p of the first embodiment will be specifically described with reference to FIGS. 3A to 3C. FIG. 3A is a perspective view showing a fixing member 130A of the first embodiment. 3B is a cross-sectional view showing an example of 3B-3B in FIG. 3A. 3C is a cross-sectional view showing an example of 3C-3C in FIG. 3A.
 第1の実施の形態の周縁部130pは、固定部材130の主面130xから副面130yに向かって、挿入口1301の開口面積を狭くする傾斜面を含む端面を有している。言い換えれば、周縁部130pの端面の少なくとも一部は、テーパー状である。このとき、副面130y側の開口面積を、電子部品120の搭載面110xの法線方向からみたときの面積と実質的に同一にする。これにより、電子部品120は、副面130y近傍にある端面の一部により押圧されて、固定部材130に固定される。 The peripheral portion 130p of the first embodiment has an end surface including an inclined surface that narrows the opening area of the insertion port 1301 from the main surface 130x of the fixing member 130 toward the sub surface 130y. In other words, at least a part of the end face of the peripheral portion 130p is tapered. At this time, the opening area on the side of the sub surface 130y is made substantially the same as the area when viewed from the normal direction of the mounting surface 110x of the electronic component 120. Thus, the electronic component 120 is pressed by a part of the end surface in the vicinity of the sub surface 130y and is fixed to the fixing member 130.
 周縁部130pの端面130tは、例えば、図3Bに示すように、傾斜面130tsおよび垂直面130tvを備える。傾斜面130tsは、主面130xから副面130yに向かって挿入口1301の開口面積を狭くするように傾斜している。つまり、挿入口1301は、主面130xから副面130yに向かう方向D1に徐々に狭くなっている。傾斜面130tsと主面130xとの成す鋭角θ1は、特に限定されないが、例えば、30~75度である。垂直面130tvは、例えば、主面130xに対して垂直である。あるいは、垂直面130tvと主面130xとの成す鋭角(図示せず)は、鋭角θ1より大きく、90度未満であることが好ましい。この場合、電子部品120は、例えば、垂直面130tvと接触し、電子部品120と垂直面130tvが接触する押圧部Pにて押圧される。 The end surface 130t of the peripheral portion 130p includes, for example, an inclined surface 130ts and a vertical surface 130tv, as shown in FIG. 3B. The inclined surface 130ts is inclined so as to narrow the opening area of the insertion port 1301 from the main surface 130x toward the sub surface 130y. That is, the insertion port 1301 is gradually narrowed in the direction D1 from the main surface 130x toward the sub surface 130y. The acute angle θ1 formed by the inclined surface 130ts and the main surface 130x is not particularly limited, but is, for example, 30 to 75 degrees. The vertical surface 130tv is, for example, perpendicular to the main surface 130x. Alternatively, an acute angle (not shown) formed by the vertical surface 130tv and the main surface 130x is preferably larger than the acute angle θ1 and less than 90 degrees. In this case, for example, the electronic component 120 comes into contact with the vertical surface 130tv and is pressed by the pressing portion P where the electronic component 120 and the vertical surface 130tv come into contact.
 周縁部130pの端面130tは、例えば、図3Cに示すように、傾斜面130tsのみにより形成されてもよい。この場合、電子部品120は、例えば、副面130y近傍の傾斜面130tsと接触して、押圧される。また、複数枚の固定部材130を積層することにより、主面130xから副面130yに向かって開口面積が狭くなる挿入口1301を形成してもよい。なお、端面130tは、周縁部130pのうち、挿入された電子部品120に向かい合う面である。 The end surface 130t of the peripheral portion 130p may be formed by only the inclined surface 130ts as shown in FIG. 3C, for example. In this case, the electronic component 120 is pressed in contact with, for example, the inclined surface 130ts in the vicinity of the sub surface 130y. Further, by stacking a plurality of fixing members 130, an insertion port 1301 whose opening area becomes narrower from the main surface 130x toward the sub surface 130y may be formed. The end face 130t is a face of the peripheral part 130p that faces the inserted electronic component 120.
 以上のように、第1の実施の形態の電子部品実装体100においては、周縁部130pは、搭載面110xに対向する主面130xから、主面130xの反対側の副面130yに向かって挿入口1301の開口面積を狭くする傾斜面を含む端面130tを有しており、電子部品120は、端面130tの一部により押圧されて、固定部材130に固定されている。 As described above, in the electronic component mounting body 100 according to the first embodiment, the peripheral edge portion 130p is inserted from the main surface 130x facing the mounting surface 110x toward the sub surface 130y opposite to the main surface 130x. The electronic device 120 is fixed to the fixing member 130 by being pressed by a part of the end surface 130t.
 [第2の実施の形態]
 以下、第2の実施の形態の周縁部130pを備える固定部材130Bについて、図4A~図4Cを参照しながら具体的に説明する。図4Aは、第2の実施の形態の固定部材130Bを示す斜視図である。図4Bは、第2の実施の形態の固定部材130Bの一部を示す上面図である。図4Cは、第2の実施の形態の固定部材130Bの別の一部を示す上面図である。
[Second Embodiment]
Hereinafter, the fixing member 130B including the peripheral portion 130p of the second embodiment will be specifically described with reference to FIGS. 4A to 4C. FIG. 4A is a perspective view showing a fixing member 130B of the second embodiment. FIG. 4B is a top view showing a part of the fixing member 130B of the second embodiment. FIG. 4C is a top view showing another part of the fixing member 130B of the second embodiment.
 第2の実施の形態では、基板110の搭載面110xの法線方向からみたとき、挿入口1301の形状と電子部品120の形状とが異なっている。そのため、電子部品120は、周縁部130pと点接触することにより押圧されて、固定部材130に固定される。 In the second embodiment, when viewed from the normal direction of the mounting surface 110x of the substrate 110, the shape of the insertion port 1301 and the shape of the electronic component 120 are different. Therefore, the electronic component 120 is pressed by making point contact with the peripheral portion 130 p and is fixed to the fixing member 130.
 図4Bでは、電子部品120の搭載面110xの法線方向からみたときの形状(以下、上面形状E)が円形であるのに対して、挿入口1301の形状(以下、上面形状I)は正方形である。そのため、電子部品120は、周縁部130pの中の4箇所の押圧部分Pで押圧されて、固定部材130Bに固定される。上面形状Eおよび上面形状Iは、これに限定されない。例えば、上面形状Eが円形である場合、上面形状Iとしては、楕円形、三角形、四角形、六角形等の多角形等が挙げられる。なかでも、電子部品120がより強く固定される点で、上面形状Iは、電子部品120を3箇所以上の押圧部Pで押圧できる形状であることが好ましい。 In FIG. 4B, the shape (hereinafter, upper surface shape E) when viewed from the normal direction of the mounting surface 110x of the electronic component 120 is circular, whereas the shape of the insertion port 1301 (hereinafter, upper surface shape I) is square. It is. Therefore, the electronic component 120 is pressed by the four pressing portions P in the peripheral portion 130p and fixed to the fixing member 130B. The upper surface shape E and the upper surface shape I are not limited to this. For example, when the upper surface shape E is a circle, examples of the upper surface shape I include an ellipse, a polygon such as a triangle, a quadrangle, and a hexagon. Especially, it is preferable that the upper surface shape I is a shape which can press the electronic component 120 with the three or more press parts P at the point where the electronic component 120 is fixed more firmly.
 上面形状Eおよび上面形状Iが異なるとは、互いに同じ形状であっても、その向きが異なる場合を含む。例えば、図4Cに示すように、上面形状Iおよび上面形状Eの形状がいずれも正方形であるが、挿入口1301に電子部品120を挿入した場合、これらの頂点の位置が重ならない場合を含む。この場合、電子部品120は、自身の4つの頂点において、周縁部130pによって押圧される。なお、図4Cの場合、上面形状Iは、上面形状Eを拡大して、90度回転させた形状である。また、異なる上面形状Iを有する複数枚の固定部材130Bを積層して、上面形状Eと異なる形状の挿入口1301を形成してもよい。 The difference between the upper surface shape E and the upper surface shape I includes the case where the directions are different even if they are the same shape. For example, as illustrated in FIG. 4C, the upper surface shape I and the upper surface shape E are both square, but when the electronic component 120 is inserted into the insertion port 1301, the positions of the apexes do not overlap. In this case, the electronic component 120 is pressed by the peripheral portion 130p at its four apexes. In the case of FIG. 4C, the upper surface shape I is a shape obtained by enlarging the upper surface shape E and rotating it 90 degrees. Alternatively, a plurality of fixing members 130 </ b> B having different top surface shapes I may be stacked to form the insertion port 1301 having a shape different from the top surface shape E.
 以上のように、第2の実施の形態の電子部品実装体100においては、搭載面110xの法線方向からみたとき、挿入口1301の形状と電子部品120の形状とが異なっており、電子部品120は、周縁部130pと点接触することにより押圧されて、固定部材130Bに固定されていてもよい。 As described above, in the electronic component mounting body 100 according to the second embodiment, the shape of the insertion port 1301 and the shape of the electronic component 120 are different when viewed from the normal direction of the mounting surface 110x. 120 may be pressed by making point contact with the peripheral portion 130p and fixed to the fixing member 130B.
 [第3の実施の形態]
 以下、第3の実施の形態の周縁部130pを備える固定部材130Cについて、図5Aおよび図5Bを参照しながら具体的に説明する。図5Aは、第3の実施の形態の固定部材130Cを示す斜視図である。図5Bは、第3の実施の形態の固定部材130Cの一部を示す上面図である。
[Third Embodiment]
Hereinafter, the fixing member 130 </ b> C including the peripheral portion 130 p according to the third embodiment will be specifically described with reference to FIGS. 5A and 5B. FIG. 5A is a perspective view showing a fixing member 130C of the third embodiment. FIG. 5B is a top view illustrating a part of the fixing member 130 </ b> C according to the third embodiment.
 第3の実施の形態の周縁部130pは、挿入口1301側に向かって突出する複数の突起1302を有している。電子部品120は、突起により押圧されて、固定部材130に固定される。 The peripheral portion 130p of the third embodiment has a plurality of protrusions 1302 that protrude toward the insertion port 1301 side. The electronic component 120 is pressed by the protrusion and fixed to the fixing member 130.
 周縁部130pは、例えば、図5Bに示すように、挿入口1301側に向かって突出する複数の突起1302を3か所備える。挿入口1301に電子部品120が挿入されると、電子部品120が突起1302に接触(点接触)して、押圧される。図5Bでは、1箇所に3つの連続する突起1302が配置されており、この突起1302が3か所、周縁部130pに均等に配置されている。突起1302の形状、配置および個数は、これに限定されない。なかでも、電子部品120の振動が抑制され易い点で、突起1302は、周縁部130pに3箇所以上、均等に配置されることが好ましい。 The peripheral portion 130p includes, for example, three protrusions 1302 that protrude toward the insertion port 1301 as shown in FIG. 5B. When the electronic component 120 is inserted into the insertion port 1301, the electronic component 120 comes into contact with the protrusion 1302 (point contact) and is pressed. In FIG. 5B, three continuous protrusions 1302 are arranged at one place, and the three protrusions 1302 are equally arranged at the peripheral portion 130p. The shape, arrangement, and number of the protrusions 1302 are not limited to this. Especially, it is preferable that the protrusion 1302 is equally arrange | positioned at three or more places in the peripheral part 130p at the point which the vibration of the electronic component 120 is easy to be suppressed.
 以上のように、第3の実施の形態の電子部品実装体100においては、周縁部130pは、挿入口1301側に向かって突出する複数の突起1302を有しており、電子部品120は、突起1302により押圧されて、固定部材130Cに固定されていてもよい。 As described above, in the electronic component mounting body 100 according to the third embodiment, the peripheral portion 130p has the plurality of protrusions 1302 protruding toward the insertion port 1301, and the electronic component 120 has the protrusion It may be pressed by 1302 and fixed to the fixing member 130C.
 [第4の実施の形態]
 以下、第4の実施の形態の周縁部130pを備える固定部材130Dについて、図6Aおよび図6Bを参照しながら、具体的に説明する。図6Aは、第4の実施の形態の固定部材130Dを示す斜視図である。図6Bは、図6Aにおける、6B-6B線における断面図である。
[Fourth Embodiment]
Hereinafter, the fixing member 130D including the peripheral edge portion 130p of the fourth embodiment will be specifically described with reference to FIGS. 6A and 6B. FIG. 6A is a perspective view showing a fixing member 130D of the fourth embodiment. 6B is a cross-sectional view taken along line 6B-6B in FIG. 6A.
 第4の実施の形態の周縁部130pは、スリットによって分割された複数の舌片1303を有している。このとき、挿入口1301の開口面積を、電子部品120の面積よりも小さくする。これにより、電子部品120は、舌片1303を押し上げながら、挿入口1301に挿入される。よって、電子部品120は、舌片1303により押圧されて、固定部材130に固定される。 The peripheral portion 130p of the fourth embodiment has a plurality of tongue pieces 1303 divided by slits. At this time, the opening area of the insertion port 1301 is made smaller than the area of the electronic component 120. Thereby, the electronic component 120 is inserted into the insertion port 1301 while pushing up the tongue piece 1303. Therefore, the electronic component 120 is pressed by the tongue piece 1303 and fixed to the fixing member 130.
 周縁部130pには、例えば、図6Aに示すように、挿入口1301の中心から放射状に複数のスリット1303sが形成されている。これにより、複数の舌片1303が形成されている。挿入口1301の開口面積は、電子部品120の面積よりも小さい。そのため、挿入口1301に電子部品120を挿入すると、図6Bに示すように、舌片1303は、電子部品120によって押し上げられる。これにより、舌片1303は、電子部品120に接触するとともに、電子部品120を押圧する。図6Aでは、周縁部130pに6本のスリット1303sが形成されており、6枚の舌片1303が形成されている。舌片1303の形状、配置および個数は、これらに限らない。電子部品120が挿入され易い点で、同形の舌片1303が、周縁部130pに3枚以上、均等に配置されることが好ましい。スリット1303sの長さおよび配置等も特に限定されず、所望の舌片1303が得られるように適宜形成すればよい。 In the peripheral portion 130p, for example, as shown in FIG. 6A, a plurality of slits 1303s are formed radially from the center of the insertion port 1301. Thereby, a plurality of tongue pieces 1303 are formed. The opening area of the insertion port 1301 is smaller than the area of the electronic component 120. Therefore, when the electronic component 120 is inserted into the insertion port 1301, the tongue piece 1303 is pushed up by the electronic component 120 as shown in FIG. 6B. Accordingly, the tongue piece 1303 contacts the electronic component 120 and presses the electronic component 120. In FIG. 6A, six slits 1303s are formed in the peripheral portion 130p, and six tongue pieces 1303 are formed. The shape, arrangement, and number of the tongue pieces 1303 are not limited to these. In terms of easy insertion of the electronic component 120, it is preferable that three or more identical tongue pieces 1303 are equally arranged on the peripheral edge portion 130p. The length and arrangement of the slits 1303s are not particularly limited, and may be appropriately formed so as to obtain a desired tongue piece 1303.
 以上のように、第4の実施の形態の電子部品実装体100においては、周縁部130pは、スリット1303sによって分割された複数の舌片1303を有しており、電子部品120は、舌片1303により押圧されて、固定部材130Dに固定されていてもよい。 As described above, in the electronic component mounting body 100 according to the fourth embodiment, the peripheral portion 130p includes the plurality of tongue pieces 1303 divided by the slits 1303s, and the electronic component 120 includes the tongue pieces 1303. And may be fixed to the fixing member 130D.
 [第5の実施の形態]
 以下、第5の実施の形態の固定部材130Eについて、図7Aおよび図7Bを参照しながら、具体的に説明する。図7Aは、第5の実施の形態の固定部材130Eを示す斜視図である。図7Bは、図7Aの7B-7B線における断面図である。
[Fifth Embodiment]
Hereinafter, the fixing member 130E of the fifth embodiment will be specifically described with reference to FIGS. 7A and 7B. FIG. 7A is a perspective view showing a fixing member 130E of the fifth embodiment. 7B is a cross-sectional view taken along line 7B-7B in FIG. 7A.
 第5の実施の形態の周縁部130pは、挿入口1301の周囲の少なくとも一部に沿って、副面130yから主面130xに向かう方向D2に立設する支持壁1304を有している。これにより、電子部品120の振動がさらに抑制され易くなる。このとき、支持壁1304の内壁をテーパー状にするか、内壁に突起1302を設けるか、支持壁1304に、その高さ方向に沿って複数のスリットを入れて、舌片を形成するか、または、挿入口および内壁の少なくとも一方で囲まれる形状を、上面形状Eとは異なる形状にする。あるいは、これらを組合せてもよい。これにより、電子部品120は、支持壁1304の少なくとも一部に接触して押圧されて、固定部材130Eに固定される。 The peripheral portion 130p of the fifth embodiment has a support wall 1304 standing in a direction D2 from the sub surface 130y toward the main surface 130x along at least part of the periphery of the insertion port 1301. Thereby, the vibration of the electronic component 120 is further easily suppressed. At this time, the inner wall of the support wall 1304 is tapered, a protrusion 1302 is provided on the inner wall, a plurality of slits are formed in the support wall 1304 along the height direction thereof, or a tongue piece is formed, or The shape surrounded by at least one of the insertion port and the inner wall is made to be a shape different from the upper surface shape E. Alternatively, these may be combined. As a result, the electronic component 120 contacts and is pressed against at least a part of the support wall 1304 and is fixed to the fixing member 130E.
 固定部材130Eの支持壁1304は、挿入口1301の全周に沿って、副面130yから主面130xに向かう方向D2に立設している。さらに、支持壁1304の内壁1304tには、挿入口1301に向かって突出する複数の突起1302が配置されている。支持壁1304の内部に電子部品120が挿入されると、電子部品120は突起1302に点接触して、押圧される。これにより、振動が抑制される。さらに、支持壁1304によって、振動がより小さく抑えられる。なお、支持壁1304は、挿入口1301の周囲の少なくとも一部に沿って立設していればよい。支持壁1304が、挿入口1301の周囲の一部に沿って立設する場合、支持壁1304は、挿入口1301の周囲の1/10以上の幅で、断続的に複数、立設していることが好ましい。 The support wall 1304 of the fixing member 130E is erected in the direction D2 from the sub surface 130y toward the main surface 130x along the entire circumference of the insertion port 1301. Further, a plurality of protrusions 1302 protruding toward the insertion port 1301 are arranged on the inner wall 1304t of the support wall 1304. When the electronic component 120 is inserted into the support wall 1304, the electronic component 120 is brought into point contact with the protrusion 1302 and pressed. Thereby, vibration is suppressed. Further, the support wall 1304 suppresses vibrations to be smaller. Note that the support wall 1304 only needs to be erected along at least a part of the periphery of the insertion port 1301. When the support wall 1304 is erected along a part of the periphery of the insertion port 1301, a plurality of the support walls 1304 are erected intermittently with a width of 1/10 or more of the periphery of the insertion port 1301. It is preferable.
 図7Bでは、支持壁1304が、主面130xから方向D2に立設している。つまり、電子部品120は、図7Bに示すように、支持壁1304の搭載面110x側の端部から、支持壁1304の内部に挿入される。そのため、突起1302は、内壁1304tの副面130yの近傍に配置されることが好ましい。電子部品120が、挿入され易くなるためである。図8は、第5の実施の形態の固定部材130Eを備える電子部品実装体100を模式的に示す斜視図である。 7B, the support wall 1304 is erected in the direction D2 from the main surface 130x. That is, as shown in FIG. 7B, the electronic component 120 is inserted into the support wall 1304 from the end of the support wall 1304 on the mounting surface 110x side. Therefore, the protrusion 1302 is preferably arranged in the vicinity of the sub surface 130y of the inner wall 1304t. This is because the electronic component 120 is easily inserted. FIG. 8 is a perspective view schematically showing an electronic component mounting body 100 including a fixing member 130E according to the fifth embodiment.
 支持壁1304は、方向D2に向かって口径が大きくなるようなテーパー状に立設していてもよい。これにより、電子部品120は、より挿入され易くなる。支持壁1304の内壁1304tと、主面130xとの成す鋭角θ2は、鋭角θ1よりも大きい。具体的には、鋭角θ2は、例えば、70~90度である。なお、図7Bでは、支持壁1304は、主面130xの法線方向に沿って(θ2=90°で)立設している。 The support wall 1304 may be erected in a tapered shape such that the diameter increases in the direction D2. Thereby, the electronic component 120 becomes easier to insert. The acute angle θ2 formed between the inner wall 1304t of the support wall 1304 and the main surface 130x is larger than the acute angle θ1. Specifically, the acute angle θ2 is, for example, 70 to 90 degrees. In FIG. 7B, the support wall 1304 is erected along the normal direction of the main surface 130x (at θ2 = 90 °).
 支持壁1304は、方向D1に向かって立設していてもよい(図示せず)。この場合、突起1302は、内壁1304tの搭載面110xとは反対側の端部の近傍に配置してもよい。電子部品120が、挿入され易くなるためである。この場合も、支持壁1304は、方向D2に向かって口径が大きくなるようなテーパー状に立設していてもよい。 The support wall 1304 may be erected in the direction D1 (not shown). In this case, the protrusion 1302 may be disposed in the vicinity of the end of the inner wall 1304t opposite to the mounting surface 110x. This is because the electronic component 120 is easily inserted. Also in this case, the support wall 1304 may be erected in a tapered shape such that the diameter increases in the direction D2.
 以上のように、第5の実施の形態の電子部品実装体100においては、周縁部130pは、挿入口1301の周囲の少なくとも一部に沿って、副面130yから主面130xに向かう方向に立設する支持壁1304をさらに有してもよい。 As described above, in the electronic component mounting body 100 according to the fifth embodiment, the peripheral portion 130p stands in a direction from the sub surface 130y toward the main surface 130x along at least a part of the periphery of the insertion port 1301. A support wall 1304 may be further provided.
 [第6の実施の形態]
 以下、第6の実施の形態の固定部材130Fについて、図9Aおよび図9Bを参照しながら、具体的に説明する。図9Aは、第6の実施の形態の固定部材130Fを示す斜視図である。図9Bは、図9Aにおける、9B-9B線における断面図である。第6の実施の形態の固定部材130Fは、テーパー状の支持壁1304を備える。
[Sixth Embodiment]
Hereinafter, the fixing member 130F according to the sixth embodiment will be specifically described with reference to FIGS. 9A and 9B. FIG. 9A is a perspective view illustrating a fixing member 130F according to the sixth embodiment. 9B is a cross-sectional view taken along line 9B-9B in FIG. 9A. The fixing member 130F of the sixth embodiment includes a tapered support wall 1304.
 第6の実施の形態の周縁部130pは、方向D1に向かって口径が小さくなるテーパー状に立設する支持壁1304を有する。支持壁1304は、挿入口1301の周囲の少なくとも一部に沿って、主面130xから副面130yに向かう方向D1に立設している。そのため、支持壁1304の内部に電子部品120が挿入されると、電子部品120は、内壁1304tの搭載面110xとは反対側の端部の近傍に接触して、押圧される。これにより、電子部品120の振動が抑制される。 The peripheral portion 130p of the sixth embodiment has a support wall 1304 that stands up in a tapered shape with the diameter decreasing toward the direction D1. The support wall 1304 is erected in a direction D1 from the main surface 130x toward the sub surface 130y along at least a part of the periphery of the insertion port 1301. Therefore, when the electronic component 120 is inserted into the support wall 1304, the electronic component 120 comes into contact with and is pressed near the end portion of the inner wall 1304t opposite to the mounting surface 110x. Thereby, the vibration of the electronic component 120 is suppressed.
 固定部材130Fの支持壁1304は、挿入口1301の全周に沿って、主面130xから副面130yに向かう方向D1に立設している。支持壁1304は、方向D2に向かって口径が大きくなるようなテーパー状をしている。つまり、支持壁1304の搭載面110x側の口径は、電子部品120の面積よりも大きい。支持壁1304の搭載面110xとは反対側の口径は、電子部品120の面積と実質的に同一である。そのため、支持壁1304の内部に電子部品120が挿入されると、電子部品120は、内壁1304tの搭載面110xとは反対側の端部の近傍に接触して、押圧される。これにより、電子部品120の振動が抑制される。テーパー状の支持壁1304は、方向D2に向かって立設していてもよい(図示せず)。この場合も、支持壁1304は、方向D2に向かって口径が大きくなるようなテーパー状にする。 The support wall 1304 of the fixing member 130F is erected in the direction D1 from the main surface 130x toward the sub surface 130y along the entire circumference of the insertion port 1301. The support wall 1304 is tapered so that the diameter increases in the direction D2. That is, the diameter of the support wall 1304 on the mounting surface 110 x side is larger than the area of the electronic component 120. The diameter of the support wall 1304 opposite to the mounting surface 110x is substantially the same as the area of the electronic component 120. Therefore, when the electronic component 120 is inserted into the support wall 1304, the electronic component 120 comes into contact with and is pressed near the end portion of the inner wall 1304t opposite to the mounting surface 110x. Thereby, the vibration of the electronic component 120 is suppressed. The tapered support wall 1304 may be erected in the direction D2 (not shown). Also in this case, the support wall 1304 is tapered so that the diameter increases in the direction D2.
 テーパー状の支持壁1304の内壁1304tと、主面130xとの成す鋭角θ3は、例えば、鋭角θ1と同じである。具体的には、鋭角θ3は、例えば、60~80度である。 The acute angle θ3 formed by the inner wall 1304t of the tapered support wall 1304 and the main surface 130x is, for example, the same as the acute angle θ1. Specifically, the acute angle θ3 is, for example, 60 to 80 degrees.
 以上のように、第6の実施の形態の電子部品実装体100においては、周縁部130pは、挿入口1301の周囲の少なくとも一部に沿って、搭載面110xに対向する主面130xから、主面130xの反対側の副面130yに向かう方向に立設する支持壁1304を有してもよい。 As described above, in the electronic component mounting body 100 according to the sixth embodiment, the peripheral portion 130p extends from the main surface 130x facing the mounting surface 110x along at least a part of the periphery of the insertion port 1301. You may have the support wall 1304 standingly arranged in the direction which goes to the sub surface 130y on the opposite side of the surface 130x.
 [第7の実施の形態]
 以下、第7の実施の形態の固定部材130Gについて、図10Aおよび図10Bを参照しながら、具体的に説明する。図10Aは、第7の実施の形態の固定部材130Gを示す斜視図である。図10Bは、図10Aにおける、10B-10B線における断面図である。
[Seventh Embodiment]
Hereinafter, the fixing member 130G of the seventh embodiment will be specifically described with reference to FIGS. 10A and 10B. FIG. 10A is a perspective view showing a fixing member 130G of the seventh embodiment. 10B is a cross-sectional view taken along line 10B-10B in FIG. 10A.
 第7の実施の形態の周縁部130pは、支持壁1304と、支持壁1304の内壁1304tに配置された突起1302と、を備える。支持壁1304は、挿入口1301の周囲の少なくとも一部に沿って、主面130xから副面130yに向かう方向D1に立設している。周縁部130pは、支持壁1304の搭載面110xとは反対側の端部から延出し、挿入口1301を覆うカバー1305を備える。 The peripheral portion 130p of the seventh embodiment includes a support wall 1304 and a projection 1302 disposed on the inner wall 1304t of the support wall 1304. The support wall 1304 is erected in a direction D1 from the main surface 130x toward the sub surface 130y along at least a part of the periphery of the insertion port 1301. The peripheral portion 130p includes a cover 1305 that extends from an end portion of the support wall 1304 opposite to the mounting surface 110x and covers the insertion port 1301.
 固定部材130Gは、支持壁1304と、支持壁1304の内壁1304tに配置された突起1302と、を有する。そのため、支持壁1304の内部に電子部品120が挿入されると、第5の実施の形態と同様に、電子部品120は、突起1302に点接触して、押圧されることにより、振動が抑制される。支持壁1304によって、さらに、振動は抑制される。 The fixing member 130G includes a support wall 1304 and a protrusion 1302 disposed on the inner wall 1304t of the support wall 1304. Therefore, when the electronic component 120 is inserted into the support wall 1304, as in the fifth embodiment, the electronic component 120 is point-contacted with the protrusion 1302 and pressed to suppress vibration. The The support wall 1304 further suppresses vibration.
 図11は、第7の実施の形態の固定部材130Gを備える電子部品実装体100を模式的に示す斜視図である。固定部材130Gは、支持壁1304の搭載面110xとは反対側の端部から延出し、挿入口1301を覆うカバー1305を備える。支持壁1304は、挿入口1301の全周に沿って、方向D1に立設している。よって、支持壁1304の内部に電子部品120が挿入されると、図11に示すように、支持壁1304およびカバー1305は、電子部品120の搭載面110xに接合されていない方の端部を覆うキャップ140として、機能する。この態様は、部品点数および工程数が削減できるため、好ましい。 FIG. 11 is a perspective view schematically showing an electronic component mounting body 100 including the fixing member 130G according to the seventh embodiment. The fixing member 130G includes a cover 1305 that extends from the end of the support wall 1304 opposite to the mounting surface 110x and covers the insertion port 1301. The support wall 1304 is erected in the direction D1 along the entire circumference of the insertion port 1301. Therefore, when the electronic component 120 is inserted into the support wall 1304, the support wall 1304 and the cover 1305 cover the end of the electronic component 120 that is not joined to the mounting surface 110x, as shown in FIG. It functions as the cap 140. This aspect is preferable because the number of parts and the number of processes can be reduced.
 突起1302が、内壁1304tの搭載面110xとは反対側の端部の近傍に配置されると、電子部品120が挿入され易くなる。一方、突起1302が、内壁1304tの搭載面110x側の端部の近傍に配置されると、耐振動性がさらに向上する。この場合も、支持壁1304は、方向D2に向かって口径が大きくなるようなテーパー状に立設していてもよい。 When the protrusion 1302 is disposed in the vicinity of the end of the inner wall 1304t opposite to the mounting surface 110x, the electronic component 120 is easily inserted. On the other hand, if the protrusion 1302 is disposed in the vicinity of the end of the inner wall 1304t on the mounting surface 110x side, the vibration resistance is further improved. Also in this case, the support wall 1304 may be erected in a tapered shape such that the diameter increases in the direction D2.
 支持壁1304は、方向D2に向かって立設していてもよい(図示せず)。この場合も、カバー1305は、支持壁1304の搭載面110xの反対側の端部から、挿入口1301を覆うように延出する。つまり、カバー1305は、主面130xあるいは副面130yと同一面上に配置される。そして、上記と同様に、支持壁1304の内部に電子部品120が挿入されると、支持壁1304およびカバー1305は、電子部品120のキャップ140として機能し得る。 The support wall 1304 may be erected in the direction D2 (not shown). Also in this case, the cover 1305 extends from the end of the support wall 1304 opposite to the mounting surface 110x so as to cover the insertion port 1301. That is, the cover 1305 is disposed on the same surface as the main surface 130x or the sub surface 130y. Similarly to the above, when the electronic component 120 is inserted into the support wall 1304, the support wall 1304 and the cover 1305 can function as the cap 140 of the electronic component 120.
 以上のように、第7の実施の形態の電子部品実装体100においては、固定部材130Gは、支持壁1304から延出し、挿入口1301を覆うカバー1305を有してもよい。 As described above, in the electronic component mounting body 100 according to the seventh embodiment, the fixing member 130G may have the cover 1305 extending from the support wall 1304 and covering the insertion port 1301.
 以上のように、本発明の実施の形態の電子部品実装体100は、搭載面110xを有する基板110と、基板110の搭載面110xに搭載される電子部品120と、固定部材130と、を備える。固定部材130は、搭載面110xから離間して配置されるとともに、電子部品120を挿入する挿入口1301と、挿入口1301を囲むように配置され、挿入口1301に挿入された電子部品120を押圧して固定する周縁部130pと、を有する。 As described above, the electronic component mounting body 100 according to the embodiment of the present invention includes the substrate 110 having the mounting surface 110x, the electronic component 120 mounted on the mounting surface 110x of the substrate 110, and the fixing member 130. . The fixing member 130 is disposed apart from the mounting surface 110x, and is disposed so as to surround the insertion port 1301 and the insertion port 1301, and presses the electronic component 120 inserted into the insertion port 1301. And a peripheral edge portion 130p to be fixed.
 これにより、シンプルな構造の固定部材により、耐振動性に優れる電子部品実装体を得ることができる。 Thus, it is possible to obtain an electronic component mounting body with excellent vibration resistance by a fixing member having a simple structure.
 また、固定部材130は、搭載面110xからの高さHEの1/2以上、離間した位置で、電子部品120を固定することが好ましい。 In addition, it is preferable that the fixing member 130 fixes the electronic component 120 at a position separated by 1/2 or more of the height HE from the mounting surface 110x.
 また、電子部品120の搭載面110xからの高さがHEであり、基板110の搭載面110xに垂直な方向に所定間隔を隔てて配置されたn枚(nは2以上の自然数)の固定部材130を備える場合、固定部材130は、各々搭載面110xから高さHEの1/(n+1)以上、離間した位置で、電子部品120を固定することが好ましい。 In addition, the height of the electronic component 120 from the mounting surface 110x is HE, and n (n is a natural number of 2 or more) fixing members arranged at a predetermined interval in a direction perpendicular to the mounting surface 110x of the substrate 110. When 130 is provided, it is preferable that the fixing member 130 fixes the electronic component 120 at a position separated from the mounting surface 110x by 1 / (n + 1) or more of the height HE.
 (2)電子制御装置
 以下、本発明の実施の形態の電子制御装置200について、図12および図13を参照しながら、具体的に説明する。図12は、本発明の実施の形態に係る電子制御装置200を模式的に示す斜視図である。図13は、本発明の実施の形態に係る他の電子制御装置200を模式的に示す斜視図である。なお、図12および図13では、便宜上、電子部品実装体100および放熱部材220以外の筺体210に収容される部材を省略している。
(2) Electronic Control Device Hereinafter, the electronic control device 200 according to the embodiment of the present invention will be specifically described with reference to FIGS. 12 and 13. FIG. 12 is a perspective view schematically showing the electronic control device 200 according to the embodiment of the present invention. FIG. 13 is a perspective view schematically showing another electronic control device 200 according to the embodiment of the present invention. In FIGS. 12 and 13, members housed in the casing 210 other than the electronic component mounting body 100 and the heat dissipation member 220 are omitted for convenience.
 電子部品実装体100は、例えば、筺体210に収容されて、各種電子機器の電子制御装置200として用いられる。 The electronic component mounting body 100 is housed in, for example, a housing 210 and used as an electronic control device 200 for various electronic devices.
 電子制御装置200は、図12に示すように、電子部品実装体100と、電子部品実装体100を覆う筐体210と、を備える。筺体210は、アッパー(upper)ケース211とロア(lower)ケース212とを備える。電子部品実装体100は、ロアケース212に収められた後、アッパーケース211で覆われることにより、筺体210に収容される。 The electronic control device 200 includes an electronic component mounting body 100 and a housing 210 that covers the electronic component mounting body 100, as shown in FIG. The housing 210 includes an upper case 211 and a lower case 212. The electronic component mounting body 100 is housed in the housing 210 by being housed in the lower case 212 and then being covered with the upper case 211.
 固定部材130は、筺体210に収容される基板110以外の部材に固定されることが好ましい。耐振動性がさらに高まるためである。固定部材130は、図12に示すように、放熱部材220に固定されてもよい。通常、放熱部材220は、基板110とロアケース212との間に配置される。そこで、固定部材130を放熱部材220に固定する場合、放熱部材220の一部をアッパーケース211側に立ち上げて、その立ち上がり部の高さを、固定部材130の搭載面110xからの高さ(例えば、固定高さHF)と同じにする。これにより、固定部材130と放熱部材220とは、ビス230によって固定することができる。つまり、この場合、固定部材130および放熱部材220にビス穴を設け、そこにビス230を挿入するという、極めてシンプルな組み付け方法により、固定部材130を固定することができる。 The fixing member 130 is preferably fixed to a member other than the substrate 110 accommodated in the housing 210. This is because vibration resistance is further enhanced. The fixing member 130 may be fixed to the heat radiating member 220 as shown in FIG. Usually, the heat dissipating member 220 is disposed between the substrate 110 and the lower case 212. Therefore, when fixing the fixing member 130 to the heat radiating member 220, a part of the heat radiating member 220 is raised to the upper case 211 side, and the height of the rising portion is set to the height from the mounting surface 110x of the fixing member 130 ( For example, it is the same as the fixed height HF. Thereby, the fixing member 130 and the heat radiating member 220 can be fixed by the screw 230. That is, in this case, the fixing member 130 can be fixed by an extremely simple assembling method in which screw holes are provided in the fixing member 130 and the heat radiating member 220 and the screws 230 are inserted therein.
 固定部材130は、筺体210に固定されてもよい。さらには、固定部材130を、筺体210の一部としてもよい。図13に示すように、アッパーケース211の電子部品120に対向する面の少なくとも一部を、固定部材130Hにより形成する。この場合、電子部品120を接合した基板110をロアケース212に収めた後、固定部材130Hを含むアッパーケース211を被せることにより、電子部品実装体100の筺体210への収容とともに、電子部品120の固定を行うことができる。 The fixing member 130 may be fixed to the casing 210. Furthermore, the fixing member 130 may be a part of the casing 210. As shown in FIG. 13, at least a part of the surface of the upper case 211 facing the electronic component 120 is formed by the fixing member 130H. In this case, after the substrate 110 to which the electronic component 120 is bonded is stored in the lower case 212, the upper case 211 including the fixing member 130 </ b> H is covered, whereby the electronic component mounting body 100 is accommodated in the housing 210 and the electronic component 120 is fixed. It can be performed.
 アッパーケース211の一部を固定部材130Hにより構成させる場合、固定部材130Hは、図7Bに示すような、方向D2に立設する支持壁1304を備えることが好ましい。ただし、この場合、図7Bとは異なり、固定部材130Hは、主面130xあるいは副面130yと同一面上に配置されるカバー1305を備える。つまり、固定部材130Hは、電子部品120のキャップ140として機能し得る支持壁1304とカバー1305とを備える。よって、固定部材130Hを用いる場合、アッパーケース211を被せる工程において、電子部品実装体100の筺体210への収容および電子部品120の固定とともに、電子部品120へのキャップ140を被せる工程が実行される。よって、この態様は、工程数がさらに削減される。 When a part of the upper case 211 is configured by the fixing member 130H, the fixing member 130H preferably includes a support wall 1304 standing in the direction D2, as shown in FIG. 7B. However, in this case, unlike FIG. 7B, the fixing member 130H includes a cover 1305 disposed on the same plane as the main surface 130x or the sub surface 130y. That is, the fixing member 130 </ b> H includes a support wall 1304 and a cover 1305 that can function as the cap 140 of the electronic component 120. Therefore, when the fixing member 130H is used, in the step of covering the upper case 211, the step of covering the electronic component 120 with the cap 140 is performed together with the housing of the electronic component mounting body 100 in the housing 210 and the fixing of the electronic component 120. . Therefore, this aspect further reduces the number of steps.
 以上のように、本発明の実施の形態の電子制御装置200は、(1)に記載の電子部品実装体100と、電子部品実装体100を覆う筐体210と、を備えてもよい。 As described above, the electronic control device 200 according to the embodiment of the present invention may include the electronic component mounting body 100 described in (1) and the casing 210 that covers the electronic component mounting body 100.
 また、電子制御装置200において、固定部材130Hは、筐体210に固定されていてもよい。 Further, in the electronic control device 200, the fixing member 130H may be fixed to the housing 210.
 また、電子制御装置200は、電子部品実装体100と、電子部品実装体100を覆う筐体210と、を備え、固定部材130Hは、筐体210の一部を構成してもよい。 Further, the electronic control device 200 may include an electronic component mounting body 100 and a casing 210 that covers the electronic component mounting body 100, and the fixing member 130H may constitute a part of the casing 210.
 (3)サーボモータ
 電子制御装置200は、特に、サーボモータの制御装置として好適である。本発明の実施の形態のサーボモータは、電動機と、電子制御装置200とを備える。サーボモータは、サーボ機構において、機械的な位置および角度などを制御するために用いられる。サーボモータの制御装置は、電動機の回転角および回転速度の情報をフィードバックさせて、電動機の駆動を制御する。そのため、制御装置において、基板に搭載される電子部品の振動を抑制することは、精度向上の観点から重要である。本発明の実施の形態の電子制御装置200は、電子部品120の振動を効果的に抑制するため、サーボモータ300の制御装置として用いると、精度が向上する。
(3) Servo Motor The electronic control device 200 is particularly suitable as a servo motor control device. The servo motor according to the embodiment of the present invention includes an electric motor and an electronic control device 200. The servo motor is used for controlling the mechanical position and angle in the servo mechanism. The servo motor control device feeds back information on the rotation angle and rotation speed of the electric motor to control the driving of the electric motor. For this reason, in the control device, it is important from the viewpoint of improving accuracy to suppress the vibration of the electronic component mounted on the board. Since the electronic control device 200 according to the embodiment of the present invention is used as a control device for the servo motor 300 in order to effectively suppress vibration of the electronic component 120, the accuracy is improved.
 図14は、本発明の実施の形態に係るサーボモータ300の構成を説明するブロック図である。サーボモータ300において、電子制御装置200は、図14に示すように、サーボアンプ320を構成するデジタル/アナログ(D/A)コンバータ(図示せず)である。サーボアンプ320は、PLC(Programmable Logic Controller)310から出力されたパルス列、および、電動機330からのフィードバックパルスに基づいて、電動機330を制御する。 FIG. 14 is a block diagram illustrating the configuration of the servo motor 300 according to the embodiment of the present invention. In the servo motor 300, the electronic control unit 200 is a digital / analog (D / A) converter (not shown) that constitutes a servo amplifier 320, as shown in FIG. The servo amplifier 320 controls the electric motor 330 based on a pulse train output from a PLC (Programmable Logic Controller) 310 and a feedback pulse from the electric motor 330.
 電動機330の種類は特に限定されず、サーボモータの電動機として従来公知の電動機を用いることができる。電動機330としては、例えば、整流子電動機、誘導電動機、および同期電動機等が挙げられる。電動機330には、回転角センサ(レゾルバ)、エンコーダ等の位置検出器(図示せず)が取り付けられている。電子制御装置200は、位置検出器から得られた情報に基づいて、電動機330の駆動を制御する。電動機330によって、産業用機械等の各種機械400が動作する。 The type of the electric motor 330 is not particularly limited, and a conventionally known electric motor can be used as the electric motor of the servo motor. Examples of the motor 330 include a commutator motor, an induction motor, and a synchronous motor. A position detector (not shown) such as a rotation angle sensor (resolver) and an encoder is attached to the electric motor 330. The electronic control device 200 controls the driving of the electric motor 330 based on the information obtained from the position detector. Various machines 400 such as industrial machines are operated by the electric motor 330.
 以上のように、本発明の実施の形態のサーボモータ300は、電動機330と、(2)に記載の電子制御装置200と、を備えてもよい。 As described above, the servo motor 300 according to the embodiment of the present invention may include the electric motor 330 and the electronic control device 200 described in (2).
 (固定部材)
 以下、固定部材130(130A~130Hを含む)の大きさおよび材質、電子部品120の種類について、説明する。
(Fixing member)
Hereinafter, the size and material of the fixing member 130 (including 130A to 130H) and the type of the electronic component 120 will be described.
 固定部材130の大きさは特に限定されず、挿入口1301に挿入される電子部品120の大きさおよび個数に応じて、適宜設定すればよい。なお、図1および図3Aでは、固定部材130には8つの挿入口1301が形成されており、8つの電子部品120をまとめて固定する場合を示しているが、これに限定されない。固定部材130には、挿入口1301が1つ形成されていてもよいし、2以上の挿入口1301が形成されていてもよい。 The size of the fixing member 130 is not particularly limited, and may be set as appropriate according to the size and number of electronic components 120 inserted into the insertion port 1301. In FIG. 1 and FIG. 3A, eight insertion ports 1301 are formed in the fixing member 130 and the eight electronic components 120 are fixed together. However, the present invention is not limited to this. One fixing port 1301 may be formed in the fixing member 130, or two or more insertion ports 1301 may be formed.
 固定部材130の材質も特に限定されない。なかでも、電子部品120を損傷することなく、確実に固定できる点で、少なくとも周縁部130p、特には、固定部材130が電子部品120と接触する接触部分(例えば、端面130t、突起1302、舌片1303、あるいは内壁1304t)は、柔軟性を有する材質により形成されることが好ましい。柔軟性を有する材質としては、高密度ポリエチレン等が挙げられる。この場合、固定部材130の周縁部130pあるいは接触部分の材質と、それ以外の部分の材質とは、異なっていてもよい。また、固定部材130の周縁部130pあるいは接触部分の材質とそれ以外の部分の材質とが同じである場合、振動性および電子部品120の損傷を抑制する観点から、固定部材130の周縁部130pあるいは接触部分を、それ以外の部分よりも薄くしてもよい。 The material of the fixing member 130 is not particularly limited. Among these, at least the peripheral portion 130p, in particular, the contact portion where the fixing member 130 contacts the electronic component 120 (for example, the end surface 130t, the protrusion 1302, the tongue piece, etc.) in that the electronic component 120 can be securely fixed without being damaged. 1303 or the inner wall 1304t) is preferably formed of a flexible material. Examples of the material having flexibility include high-density polyethylene. In this case, the material of the peripheral portion 130p or the contact portion of the fixing member 130 may be different from the material of other portions. Further, when the material of the peripheral portion 130p or the contact portion of the fixing member 130 is the same as the material of other portions, the peripheral portion 130p of the fixing member 130 or the peripheral portion 130p of the fixing member 130 is used from the viewpoint of suppressing vibration and damage to the electronic component 120. The contact portion may be thinner than the other portions.
 (電子部品)
 基板110に搭載される電子部品120は、特に限定されず、電子制御装置200として必要な電子部品の中から、適宜選択すればよい。電子部品120としては、コンデンサ、リレー(継電器)等が挙げられる。なかでも、本発明の実施の形態の固定部材130は、高背の電子部品120の耐振動性を向上させるのに有用である。高背の電子部品とは、例えば、搭載面110xからの高さHEが、搭載面110xの法線方向からみた電子部品120の短径よりも大きい電子部品である。電子部品120の短径は、搭載面110xの法線方向からみた電子部品120の任意の外縁上の点と中心とを通る直線を引いたとき、当該直線と外縁との2点の交点を結ぶ最も短い直線の長さである。
(Electronic parts)
The electronic component 120 mounted on the substrate 110 is not particularly limited, and may be appropriately selected from electronic components necessary for the electronic control device 200. Examples of the electronic component 120 include a capacitor and a relay (relay). Among these, the fixing member 130 according to the embodiment of the present invention is useful for improving the vibration resistance of the high-profile electronic component 120. The tall electronic component is, for example, an electronic component in which the height HE from the mounting surface 110x is larger than the short diameter of the electronic component 120 viewed from the normal direction of the mounting surface 110x. The minor axis of the electronic component 120 connects two intersections of the straight line and the outer edge when a straight line passing through a point on the outer edge and the center of the electronic component 120 viewed from the normal direction of the mounting surface 110x is drawn. The length of the shortest straight line.
 固定部材130が支持壁1304およびカバー1305を備える場合、固定部材130は、電子部品120としてのコンデンサを固定するのに適している。固定部材130が、コンデンサのキャップ140としての機能を兼ねることにより、部品点数および工程数が削減できるためである。コンデンサは、特に限定されず、例えば、フィルムコンデンサ、タンタルコンデンサ、およびアルミ電解コンデンサ等を例示することができる。なお、図1では、電子部品実装体100に、複数個の円筒形の電子部品120が配置される場合を示しているが、電子部品120の形状および個数は、図1に限定されない。 When the fixing member 130 includes the support wall 1304 and the cover 1305, the fixing member 130 is suitable for fixing a capacitor as the electronic component 120. This is because the number of parts and the number of processes can be reduced because the fixing member 130 also functions as a capacitor cap 140. The capacitor is not particularly limited, and examples thereof include a film capacitor, a tantalum capacitor, and an aluminum electrolytic capacitor. Although FIG. 1 shows a case where a plurality of cylindrical electronic components 120 are arranged on the electronic component mounting body 100, the shape and number of the electronic components 120 are not limited to those in FIG.
 以上のように、本発明の実施の形態の電子部品実装体100において、電子部品120の搭載面110xからの高さHEは、搭載面110xの法線方向からみた電子部品120の短径よりも大きいことが好ましい。 As described above, in the electronic component mounting body 100 according to the embodiment of the present invention, the height HE from the mounting surface 110x of the electronic component 120 is larger than the minor axis of the electronic component 120 as viewed from the normal direction of the mounting surface 110x. Larger is preferred.
 また、電子部品120は、コンデンサであってもよい。 Further, the electronic component 120 may be a capacitor.
 本発明の電子部品実装体に搭載される電子部品は、耐振動性に優れる。そのため、本発明の電子部品実装体は、電子制御装置、特にはサーボモータの制御装置として好適である。 The electronic component mounted on the electronic component mounting body of the present invention is excellent in vibration resistance. Therefore, the electronic component mounting body according to the present invention is suitable as an electronic control device, particularly a servo motor control device.
 100  電子部品実装体
 110  基板
 110x  搭載面
 120  電子部品
 130,131,132,130A,130B,130C,130D,130E,130F,130G,130H  固定部材
 130x  主面
 130y  副面
 130p  周縁部
 130t  端面
 130ts  傾斜面
 130tv  垂直面
 1301  挿入口
 1302  突起
 1303  舌片
 1303s  スリット
 1304  支持壁
 1304t  内壁
 1305  カバー
 140  キャップ
 200  電子制御装置
 210  筺体
 211  アッパーケース
 212  ロアケース
 220  放熱部材
 230  ビス
 300  サーボモータ
 310  PLC
 320  サーボアンプ
 330  電動機
 400  各種機械
DESCRIPTION OF SYMBOLS 100 Electronic component mounting body 110 Board | substrate 110x Mounting surface 120 Electronic component 130,131,132,130A, 130B, 130C, 130D, 130E, 130F, 130G, 130H Fixing member 130x Main surface 130y Subsurface 130p Peripheral portion 130t End surface 130ts Inclined surface 130tv Vertical surface 1301 Insertion slot 1302 Protrusion 1303 Tongue piece 1303s Slit 1304 Support wall 1304t Inner wall 1305 Cover 140 Cap 200 Electronic control unit 210 Housing 211 Upper case 212 Lower case 220 Heat radiation member 230 Screw 300 Servo motor 310 PLC
320 Servo amplifier 330 Electric motor 400 Various machines

Claims (16)

  1. 搭載面を有する基板と、
    前記基板の前記搭載面に搭載される電子部品と、
    前記搭載面から離間して配置されるとともに、前記電子部品を挿入する挿入口と、前記挿入口を囲むように配置され、前記挿入口に挿入された前記電子部品を押圧して固定する周縁部と、を有する固定部材と、
    を備える、電子部品実装体。
    A substrate having a mounting surface;
    Electronic components mounted on the mounting surface of the substrate;
    An insertion port for inserting the electronic component and a peripheral portion that is disposed so as to surround the insertion port and presses and fixes the electronic component inserted into the insertion port while being spaced apart from the mounting surface And a fixing member having
    An electronic component mounting body comprising:
  2. 前記電子部品の前記搭載面からの高さがHEである場合、
    前記固定部材は、前記搭載面からの前記高さHEの1/2以上、離間した位置で、前記電子部品を固定する、
    請求項1に記載の電子部品実装体。
    When the height of the electronic component from the mounting surface is HE,
    The fixing member fixes the electronic component at a position separated from the mounting surface by 1/2 or more of the height HE;
    The electronic component mounting body according to claim 1.
  3. 前記電子部品の前記搭載面からの高さがHEであり、前記基板の前記搭載面に対して垂直な方向に所定間隔を隔てて配置されたn枚(nは2以上の自然数)の前記固定部材を備える場合、
    前記固定部材は、各々前記搭載面から前記高さHEの1/(n+1)以上、離間した位置で、前記電子部品を固定する、
    請求項1に記載の電子部品実装体。
    The height of the electronic component from the mounting surface is HE, and the n pieces (n is a natural number of 2 or more) of the fixed pieces arranged at a predetermined interval in a direction perpendicular to the mounting surface of the substrate. When equipped with a member,
    The fixing member fixes the electronic component at a position separated from the mounting surface by 1 / (n + 1) or more of the height HE.
    The electronic component mounting body according to claim 1.
  4. 前記周縁部は、前記搭載面に対向する主面から、前記主面の反対側に位置する副面に向かって、前記挿入口の開口面積を狭くする傾斜面を含む端面を有しており、
    前記電子部品は、前記端面の一部により押圧されて、前記固定部材に固定されている、
    請求項1~3のいずれか一項に記載の電子部品実装体。
    The peripheral portion has an end surface including an inclined surface that narrows an opening area of the insertion port from a main surface facing the mounting surface toward a sub surface located on the opposite side of the main surface;
    The electronic component is pressed by a part of the end surface and fixed to the fixing member.
    The electronic component mounting body according to any one of claims 1 to 3.
  5. 前記搭載面の法線方向からみたとき、前記挿入口の形状と前記電子部品の形状とが異なっており、
    前記電子部品は、前記周縁部と点接触することにより押圧されて、前記固定部材に固定されている、
    請求項1~3のいずれか一項に記載の電子部品実装体。
    When viewed from the normal direction of the mounting surface, the shape of the insertion port is different from the shape of the electronic component,
    The electronic component is pressed by making point contact with the peripheral edge, and is fixed to the fixing member.
    The electronic component mounting body according to any one of claims 1 to 3.
  6. 前記周縁部は、前記挿入口側に向かって突出する複数の突起を有しており、
    前記電子部品は、前記突起により押圧されて、前記固定部材に固定されている、
    請求項1~3のいずれか一項に記載の電子部品実装体。
    The peripheral portion has a plurality of protrusions protruding toward the insertion port side,
    The electronic component is pressed by the protrusion and fixed to the fixing member.
    The electronic component mounting body according to any one of claims 1 to 3.
  7. 前記周縁部は、スリットによって分割された複数の舌片を有しており、
    前記電子部品は、前記舌片により押圧されて、前記固定部材に固定されている、
    請求項1~3のいずれか一項に記載の電子部品実装体。
    The peripheral portion has a plurality of tongue pieces divided by slits,
    The electronic component is pressed by the tongue piece and fixed to the fixing member.
    The electronic component mounting body according to any one of claims 1 to 3.
  8. 前記周縁部は、前記挿入口の周囲の少なくとも一部に沿って、前記副面から前記主面に向かう方向に立設する支持壁をさらに有する、
    請求項4~7のいずれか一項に記載の電子部品実装体。
    The peripheral portion further includes a support wall that is erected in a direction from the sub surface toward the main surface along at least a part of the periphery of the insertion port.
    The electronic component mounting body according to any one of claims 4 to 7.
  9. 前記周縁部は、前記挿入口の周囲の少なくとも一部に沿って、前記主面から前記副面に向かう方向に立設する支持壁をさらに有する、
    請求項4~7のいずれか一項に記載の電子部品実装体。
    The peripheral portion further includes a support wall that is erected in a direction from the main surface toward the sub surface along at least part of the periphery of the insertion port.
    The electronic component mounting body according to any one of claims 4 to 7.
  10. 前記固定部材は、前記支持壁から延出し、前記挿入口を覆うカバーを有する、
    請求項9に記載の電子部品実装体。
    The fixing member has a cover that extends from the support wall and covers the insertion port.
    The electronic component mounting body according to claim 9.
  11. 前記電子部品の前記搭載面からの高さHEは、前記搭載面の法線方向からみた前記電子部品の短径よりも大きい、
    請求項1~10のいずれか一項に記載の電子部品実装体。
    The height HE of the electronic component from the mounting surface is larger than the minor axis of the electronic component viewed from the normal direction of the mounting surface.
    The electronic component mounting body according to any one of claims 1 to 10.
  12. 前記電子部品は、コンデンサである、
    請求項1~11のいずれか一項に記載の電子部品実装体。
    The electronic component is a capacitor.
    The electronic component mounting body according to any one of claims 1 to 11.
  13. 請求項1~12のいずれか一項に記載の電子部品実装体と、
    前記電子部品実装体を覆う筐体と、
    を備える、電子制御装置。
    The electronic component mounting body according to any one of claims 1 to 12,
    A housing covering the electronic component mounting body;
    An electronic control device.
  14. 前記固定部材は、前記筐体に固定されている、
    請求項13に記載の電子制御装置。
    The fixing member is fixed to the housing;
    The electronic control device according to claim 13.
  15. 請求項8に記載の電子部品実装体と、
    前記電子部品実装体を覆う筐体と、を備え、
    前記固定部材は、前記筐体の一部を構成する、
    電子制御装置。
    The electronic component mounting body according to claim 8,
    A housing that covers the electronic component mounting body,
    The fixing member constitutes a part of the housing;
    Electronic control device.
  16. 電動機と、
    請求項13~15のいずれか一項に記載の電子制御装置と、
    を備える、サーボモータ。
    An electric motor,
    An electronic control device according to any one of claims 13 to 15,
    Servo motor equipped with.
PCT/JP2017/031697 2016-09-07 2017-09-04 Electronic component package, electronic control device, and servo motor WO2018047751A1 (en)

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