WO2018045751A1

WO2018045751A1 - Camera and manufacturing method thereof, and terminal

Info

Publication number: WO2018045751A1
Application number: PCT/CN2017/080478
Authority: WO
Inventors: 黄秋月; 康南波; 靳林芳
Original assignee: 华为技术有限公司
Priority date: 2016-09-06
Filing date: 2017-04-13
Publication date: 2018-03-15
Also published as: CN106550177A

Abstract

A camera, at least comprising: an image sensor, a flexible printed circuit board (FPC), and a substrate: the FPC is mounted on the substrate, and a position of the FPC is hollowed out; the image sensor is fixed onto the substrate corresponding to the hollowed out position of the FPC; and the image sensor is connected to the FPC by means of a signal line. By means of hollowing out the FPC in a position corresponding to the image sensor and mounting same on the substrate, the image sensor being fixed onto the substrate corresponding to the hollowed out position of the FPC, the present solution can reduce the overall thickness of the camera by at least the height of one FPC (120 um).

Description

Camera, manufacturing method thereof and terminal

Technical field

The present invention relates to the field of optics, and in particular to a camera, a method of manufacturing the same, and a terminal.

Background technique

“Thin” is one of the main fashion elements of the current smart terminal design, and the end consumers are pursuing “thin”. Terminal manufacturers and suppliers are increasingly pursuing manufacturing and providing thinner terminals. The thickness of the terminal generally depends on the maximum thickness of the terminal, and the terminal with camera or camera function generally depends on the thickness of the camera. Since the camera contains many components, in general, the voice coil motor (Voil Coil Motor, referred to as VCM, which includes accessories such as coils and magnets), filter, image sensor, and printed circuit board (Printed) are integrated inside the module. Circuit Board (referred to as PCB), Flexible Printed Circuit Board (FPC), etc., therefore, the key to making a thinner terminal with camera or camera function depends on the design of the camera. The existing camera structure is usually: the image sensor is connected to the PCB through a bonding wire, the bottom of the PCB is connected to the FPC, and the FPC is connected to the terminal motherboard. The structural design of the camera makes the thickness of the camera large, and the assembly into the terminal necessarily affects the overall thickness of the terminal; if the overall reduction of the terminal causes the camera to be convex, it greatly affects the overall aesthetics of the terminal.

Moreover, the heat consumption of the camera with the camera or camera function terminal is generally large, the temperature of the terminal housing corresponding to the camera is high, and the end user has a poor thermal experience. In the prior art, the camera is generally cooled by adding additional components. Additional components generally increase the thickness of the terminal.

Summary of the invention

In order to solve the above problem, an embodiment of the present invention provides a camera, a manufacturing method thereof, and a terminal. The image sensor is fixed by hollowing out a position of a corresponding image sensor (FPC) and placing it on a substrate. On the substrate corresponding to the position where the FPC is hollowed out, the thickness of the camera is reduced, so that the thickness of the terminal having the imaging function is reduced.

The first aspect provides a camera, wherein the camera includes at least: an image sensor, a flexible printed circuit board (FPC), and a substrate;

Wherein the FPC is disposed on the substrate, and the FPC has a position hollowed out;

The image sensor is fixed on the substrate corresponding to a position where the FPC is hollowed out;

The image sensor is connected to the FPC via a signal trace.

In conjunction with the first aspect, in a first possible implementation manner of the first aspect, the substrate is a high thermal conductivity substrate, and the high thermal conductivity substrate has a thermal conductivity higher than or equal to 40 W/mk.

In conjunction with the first possible implementation of the first aspect, in a second possible implementation manner of the first aspect, the image sensor is adhered to the high thermal conductive substrate by using a high thermal conductive adhesive, the high thermal conductive adhesive The thermal conductivity is higher than or equal to 0.2 W/mk; the image sensor is connected to the FPC by a gold wire.

In combination with the first aspect or the first possible implementation of the first aspect or the second possible implementation of the first aspect, in a third possible implementation manner of the first aspect, the signal trace may be fixed on the substrate Used to consolidate signal traces to prevent signal trace breaks

A camera provided by the embodiment of the present invention hollows out the FPC at a position corresponding to the image sensor and is disposed on the substrate. The image sensor is fixed on the substrate corresponding to the position where the FPC is hollowed out, thereby reducing the overall thickness of the camera, at least one lowering. The height of the FPC (120 um) reduces the thickness of the terminal having the camera function; further, the substrate is made of a highly thermally conductive material, and the heat generated by the image sensor can be transmitted through the substrate, which can improve the heat dissipation performance of the camera.

The second aspect provides a terminal, including at least: a camera; wherein the camera includes at least: an image sensor, an FPC, and a substrate;

The image sensor is connected to the FPC through a signal trace;

The FPC is connected to a motherboard of the terminal;

The substrate is fixedly connected to the screen or the middle frame of the terminal; or the screen or the middle frame of the terminal is used as a substrate, and the middle frame of the terminal is a frame structure supporting the terminal.

In conjunction with the second aspect, in a first possible implementation manner of the second aspect, the substrate has at least one extended edge; a side of the screen is provided with a groove, and the substrate is embedded in the The manner of the groove is fixedly connected to the screen; or the side of the middle frame is provided with a groove, and the substrate is fixed in the groove by the extended edge and the middle frame is fixed connection.

In conjunction with the second aspect or the first possible implementation of the second aspect, in a second possible implementation manner of the second aspect, the inner surface of the screen or the middle frame is provided with a dimple, the concave The bottom surface area of the pit matches the area of the lower surface of the substrate, and the substrate is fixed to the inner surface of the screen of the terminal by being embedded in the inner surface of the screen or the pit on the middle frame Or on the middle frame.

With reference to the second aspect, or the first possible implementation of the second aspect, or the second possible implementation of the second aspect, in a third possible implementation manner of the second aspect, the substrate is a The high thermal conductivity substrate has a thermal conductivity higher than or equal to 40 W/mk.

In conjunction with the third possible implementation of the second aspect, in a fourth possible implementation manner of the second aspect, the image sensor is adhered to the high thermal conductive substrate by using a high thermal conductive adhesive, the high thermal conductive adhesive The thermal conductivity is higher than or equal to 0.2 W/mk; the image sensor is connected to the FPC via a gold wire for signal transmission.

According to an embodiment of the present invention, the FPC is disposed on the substrate and the FPC is hollowed out at a certain position, and the image sensor is fixed on the substrate corresponding to the position where the FPC is hollowed out, thereby reducing the overall thickness of the camera, at least one lowering. The height of the FPC (120 um) reduces the ultra-thickness of the terminal having the camera function; further, the substrate is made of a highly thermally conductive material, and the substrate is fixedly connected to the terminal screen or the middle frame, thereby improving the diffusion of the heat consumption of the camera; further The structure of the screen embedded in the terminal or the middle frame reduces the thickness of the camera, and at the same time, the heat generated by the camera can be transmitted to the inner surface or the middle frame of the terminal through the substrate, and then uniformly spread through the screen or the middle frame.

The third aspect provides a method for manufacturing a camera, which includes:

Hollowing out a position of the FPC and placing the FPC on the substrate;

Fixing the image sensor to the substrate corresponding to the position where the FPC is hollowed out;

The image sensor is connected to the FPC via a signal trace.

With reference to the third aspect, in a first implementation manner of the third aspect, the substrate is made of a high thermal conductive material, and the thermal conductivity of the high thermal conductive material is higher than or equal to 40 W/mk;

The image sensor is adhered to the substrate using a high thermal conductive adhesive having a thermal conductivity higher than or equal to 0.2 W/mk.

A method for manufacturing a camera according to an embodiment of the present invention, the position of the image sensor corresponding to the FPC is hollowed out and placed on the substrate, and the image sensor is fixed on the substrate corresponding to the position where the FPC is hollowed out, and the height of at least one FPC can be reduced. The overall thickness of the camera reduces the thickness of the terminal having the camera function.

A fourth aspect provides a method for installing a camera, wherein the method includes:

A pit is dug on the inner surface or the middle frame of the terminal, and the bottom surface area of the pit matches the area of the lower surface of the substrate to be embedded in the camera; the matching means that the substrate is embedded in the recess to enable the substrate and the terminal The screen or the middle frame is firmly fixedly connected;

The substrate to be embedded is embedded in the above-mentioned pit.

With reference to the fourth aspect, in the first achievable manner of the fourth aspect, the adhesive is applied to the surface of the substrate or the inner surface of the pit on the substrate before the substrate to be embedded is embedded in the recess; Strengthen the fixing of the substrate to the screen or the middle frame.

In the embodiment of the invention, by inserting the substrate of the camera into the inner surface of the screen or the digging of the middle frame, the camera is mounted on the terminal, which can strengthen the fixing of the camera and the terminal, and can reduce or even eliminate the assembly parts such as screws.

A fifth aspect provides a camera installation method, the method comprising:

A groove is formed on a side of the screen or the middle frame of the terminal, and the groove matches the size of the substrate to be embedded in the camera. The matching means that the substrate is embedded in the groove to enable the substrate and the terminal screen or the middle frame to be firmly fixed. Fixed connection

The substrate to be embedded is embedded in the above groove.

With reference to the fifth aspect, in a first possible implementation manner of the fifth aspect, the adhesive is applied to the surface of the substrate or the inner surface of the groove on the substrate before the substrate to be embedded is embedded in the groove; Strengthen the fixing of the substrate to the screen or the middle frame.

In the embodiment of the invention, by inserting the substrate of the camera into the screen of the terminal or the recess of the middle frame, the camera is mounted on the terminal, which can strengthen the fixing of the camera and the terminal and can reduce or even eliminate the assembly parts such as screws.

DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, a brief description of the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description It is a certain embodiment of the present invention, and other drawings can be obtained from those skilled in the art without any inventive labor.

Figure 1a is a side view of a camera structure according to an embodiment of the present invention;

Figure 1b is a top plan view of a camera structure according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of an intelligent terminal according to an embodiment of the present invention;

FIG. 3a is a side view showing a fixed connection between a camera and a screen or a middle frame of the terminal;

FIG. 3b is a top view showing a fixed connection between a camera and a screen or a middle frame of the terminal;

FIG. 4a is a side view showing a fixed connection between a camera and a terminal screen or a middle frame according to an embodiment of the present invention; FIG.

FIG. 4b is a top view showing a fixed connection between a camera and a screen or a middle frame of the terminal;

Figure 5a is a side view of a substrate or a middle frame as a substrate;

FIG. 5b is a top view of a terminal screen or a middle frame as a substrate according to an embodiment of the present invention; FIG.

FIG. 6 is a flowchart of a method for manufacturing a camera according to an embodiment of the present invention;

FIG. 7 is a flowchart of a method for installing a camera according to an embodiment of the present invention;

Figure 8 is a flowchart of a camera mounting method according to an embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. It is a partial embodiment of the invention, and not all of the embodiments. It should be noted that, based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts and in the embodiments and embodiments of the present invention without conflicts The mutual combination of the various modes is within the scope of protection of the present invention.

1a and FIG. 1b are schematic diagrams showing the structure of a camera according to an embodiment of the present invention. FIG. 1a is a side view of the structure of the camera, and FIG. 1b is a top view of the structure of the camera. The camera according to the present invention is not limited to the camera structure adopted in the present embodiment. As shown in FIG. 1a and FIG. 1b, the embodiment provides a camera including at least an image sensor 1, a flexible printed circuit board (FPC), and a substrate 3. The FPC 2 is used. In the data transmission between the image sensor 1 and the terminal motherboard, the substrate 3 refers to a flat structure that functions as a support for other components or substrates of the camera, such as a PCB (Printed Circuit Board). PCB); wherein the FPC 2 is placed on the substrate 3, and the FPC 2 is hollowed out at a position, the shape of the hollowed out is consistent with the image sensor 1, and the size of the hollowed out portion is slightly larger than that of the image sensor 1; the image sensor 1 is fixed at the position where the substrate 3 corresponds to the hollowing out of the FPC 2, so that the optical path transmitted to the image sensor 1 is not affected, and the height of the FPC 2 can be lowered by the camera (about 120 um); the image sensor 1 is routed by the signal Connected to the FPC 2, signals are transmitted to each other; further, the above signal traces can be fixed on the substrate 3 for consolidating the signal traces to prevent signal trace breakage.

Embodiments of the present invention provide a camera that fixes an image sensor at a position corresponding to the FPC hollowing out of the substrate without affecting image information that the image sensor processes to pass to the image sensor through the FPC hollowing.

Optionally, the substrate 3 is made of a material having high thermal conductivity, that is, a high thermal conductivity substrate. The thermal conductivity of the high thermal conductivity substrate is higher than or equal to 40 W/mk, and the thermal conductivity of the PCB used in the prior art is Below 40W/mk, the heat dissipation performance of the camera with high thermal conductivity substrate is naturally better.

Optionally, the image sensor 1 is adhered to the high thermal conductive substrate by using a high thermal conductive adhesive, and the thermal conductivity of the high thermal conductive adhesive is higher than or equal to 0.2 W/mk; the image sensor 1 is connected to the FPC 2 through the gold wire 4 for signal transmission.

Alternatively, the high thermal conductivity substrate may be any material suitable as a substrate and having a thermal conductivity higher than or equal to 40 W/mk, such as a metal substrate made of metal, a carbon fiber substrate made of carbon fiber, a composite substrate made of a composite material, or the like. By optimizing the material strength and the substrate design structure, the thickness of the high thermal conductive substrate can be reduced, the overall thickness of the camera can be further reduced, and the thickness of the terminal having the imaging function can be reduced.

The camera provided by the embodiment of the present invention hollows out the FPC at the position corresponding to the image sensor and is disposed on the substrate. The image sensor is fixed on the substrate corresponding to the position where the FPC is hollowed out, and the overall thickness of the camera can be reduced, at least the height of one FPC (120 um) is reduced, so that the thickness of the terminal having the camera function is reduced; further, the substrate is made of a highly thermally conductive material. The heat generated by the image sensor can be transmitted to the terminal screen or the middle frame through the high thermal conductivity substrate, which can improve the heat dissipation performance of the camera.

A person skilled in the art can understand that the camera provided by the above embodiments can be applied to any device, product, terminal, etc. having an image capturing, photographing, image capturing or similar functional structure, such as a tablet computer, a driving recorder, etc.; The camera provided in this embodiment can be applied to any device, product, terminal, etc. having a camera, a photograph, an image capture or a similar functional structure, such as a mobile phone with a dual camera, regardless of whether the two cameras are The camera structure provided in this embodiment can be applied to a dual-camera mobile phone by sharing one FPC or a substrate or using one FPC and a substrate.

2 is a schematic structural diagram of an intelligent terminal according to an embodiment of the present invention; wherein the smart terminal includes an RF circuit 1201, a Wi-Fi module 1202, a display unit 1203, an input unit 1204, a first memory 1205, a second memory 1206, and processing. The hardware module such as the device 1207, the power source 1208, the camera 1209, and the GPS module 1210 may be a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), or a vehicle-mounted computer.

Wherein, the RF circuit 1201 is configured to send and receive communication signals;

Wi-Fi module 1202 is used to connect to the network and scan network signals. The RF circuit 1201 and/or the Wi-Fi module 1202 can contact the wireless base station to obtain the current location coordinates of the smart terminal.

The display unit 1203 is used to display a user interaction interface, and the display unit 1203 can be used to display information input by the user or information provided to the user and various menu interfaces of the smart terminal. The display unit 1203 may include a display panel. Alternatively, the display panel may be configured in the form of an LCD (Liquid Crystal Display) or an OLED (Organic Light-Emitting Diode). In a specific implementation, the touch panel covers the display panel to form a touch display screen, and the processor 1207 provides a corresponding visual output on the touch display screen according to the type of the touch event.

The input unit 1204 can be configured to receive input numeric or character information, receive user switching application interface operations, and generate switching signals, and generate signal inputs related to user settings and function control of the terminal. Specifically, in the embodiment of the present invention, the input unit 1204 may include a touch panel, also referred to as a touch screen, which can collect touch operations on or near the user (such as a user using a finger, a stylus, or the like, any suitable object or accessory). In the operation of the touch panel, the touch panel can be realized by various types such as resistive, capacitive, infrared, and surface acoustic waves. In addition to the touch panel, the input unit 1204 may also include other input devices including, but not limited to, one or more of a physical keyboard, function keys (such as volume control buttons, switch buttons, etc.), trackballs, mice, joysticks, and the like. .

The first memory 1205 stores the preset number of APPs and the interface information of the terminal. It can be understood that the second memory 1206 can be the external storage of the terminal 1200, and the first memory 1205 can be the memory of the smart terminal. The first memory 1205 may be one of an NVRAM nonvolatile memory, a DRAM dynamic random access memory, an SRAM static random access memory, a flash flash memory, and the like; an operating system running on the smart terminal is usually mounted on the first memory 1205. The second memory 1206 can be a hard disk, an optical disk, a USB disk, a floppy disk or a tape drive, a cloud server, or the like. Alternatively, some third party apps may now be installed on the second memory 1206.

The processor 1207 is a control center of the smart terminal, and connects various parts of the entire terminal by using various interfaces and lines, by running or executing software programs and/or modules stored in the first memory 1205, and calling the storage in the first The data in the second memory 1206 performs various functions and processing data of the intelligent terminal. Optionally, the processor 1207 can include one or more processing units.

The power supply 1208 can power the entire terminal, including various types of lithium batteries.

The GPS module 1210 is configured to acquire location coordinates of the smart terminal.

Further, as shown in FIG. 1a and FIG. 1b, the camera 1209 includes at least: an image sensor 1, an FPC 2, and a substrate 3; wherein the FPC 2 is disposed on the substrate 3, and the FPC 2 has a position to be hollowed out, and the hollowed out portion The shape is consistent with the image sensor 1, and the size of the hollowed out portion may be slightly larger than that of the image sensor 1; the image sensor 1 is fixed at a position where the substrate 3 corresponds to the hollowing out of the FPC 2, so that the transfer to the image sensor 1 is not affected. The optical path can reduce the height of the FPC 2 (120 um) by the camera; the image sensor 1 is connected to the FPC 2 through the signal trace to realize mutual transmission of signals; further, the signal trace is fixed on the substrate 3 for consolidating the signal Threading to prevent signal trace breakage; FPC 2 is connected to the motherboard of the terminal for data signal transmission; further, as shown in Figures 3a and 3b or as shown in Figures 4a and 4b, the screen or middle of the substrate 3 and the terminal The frame is fixedly connected, wherein the middle frame is a frame structure supporting the terminal; alternatively, as shown in FIGS. 5a and 5b, the screen or the middle frame 5 of the terminal can be used as the substrate 3.

Further, as shown in FIG. 3a and FIG. 3b, a recess 501 is dug on the inner surface of the screen or the middle frame 5 of the terminal, and the bottom surface area of the recess 501 matches the area of the lower surface of the substrate 3, and the substrate 3 is embedded. Into the screen inner surface of the terminal or the pit 501 dug in the middle frame 5, since the bottom surface area of the pit 501 matches the area of the lower surface of the substrate 3, the substrate 3 is embedded in the pit 501 to be able to be attached to the terminal screen or The middle frame is fixedly connected and secure.

Optionally, as shown in FIG. 4a and FIG. 4b, the substrate 3 has at least one extended side 301; the side of the terminal screen 5 is provided with a groove 502, and the substrate 3 is embedded by the extended side 301 to the side of the screen 5 of the terminal. The groove 502 is fixedly connected to the screen 5, and the groove 502 is matched with the substrate extension edge 301 to enable the substrate 3 to be fixedly connected and fixed to the screen 5. Alternatively, the side of the middle frame 5 is provided with a groove 502, and the substrate 3 is provided. The recess 502 is fixedly connected to the middle frame 5 by the recess 502 which is embedded in the side of the middle frame 5, and the groove 502 is matched with the substrate extension side 301 to enable the substrate 3 to be fixedly connected and fixed to the middle frame 5. Preferably, the thickness of the substrate 3 is smaller than the height of the groove 502 opened on the side of the screen or the middle frame 5 of the terminal, and the height of the groove is the dimension in the vertical direction from the upper surface of the screen or the middle frame to the lower surface, so that the thickness can be reduced. The thickness of one substrate 3 is such that the thickness of the terminal having the imaging function is reduced; at the same time, fixing the substrate 3 on the screen 5 or the middle frame of the terminal can increase the stability of the camera, and the heat consumption of the camera 1209 can pass through the screen of the terminal. Or the middle frame 5 performs uniform heat diffusion to avoid the position temperature of the terminal housing corresponding to the camera 1209 being high, and improving the thermal experience level of the end user. Optionally, the substrate may extend two or three or four extended edges, and is fixedly connected to the screen or the middle frame of the terminal by extending the edge into the groove of the screen of the terminal or the side of the middle frame.

Further, the screen or the middle frame of the terminal is used as the substrate to directly form the camera 1209 on the inner surface of the screen or the middle frame 5. 5a and 5b, wherein FIG. 5a is a side view of the structure of the camera on the inner surface or the middle frame of the terminal, and FIG. 5b is a top view of the structure of the camera on the inner surface or the middle frame of the terminal. . The camera is fabricated on the inner surface of the screen or on the middle frame 5, that is, the inner surface of the screen or the middle frame 5 of the terminal is substituted for the substrate 3 as in Figs. 1a and 1b. Such a design at least reduces the thickness of one substrate 3; further, the FPC 2 and the image sensor 1 of the camera can be embedded in the pits on the inner surface of the terminal screen or the middle frame 5, by reducing the thickness of the FPC 2 and the image sensor Further reduce the thickness of the camera.

Optionally, the substrate 3 is made of a material having high thermal conductivity, that is, a high thermal conductivity substrate; the thermal conductivity of the high thermal conductivity substrate is higher than or equal to 40 W/mk, and the thermal conductivity of the PCB used in the prior art is Below 40W/mk, the heat dissipation performance of the camera with high thermal conductivity substrate is naturally better.

Alternatively, the high thermal conductivity substrate may be any material suitable as a substrate and having a thermal conductivity higher than or equal to 40 W/mk, such as a metal substrate made of metal, a carbon fiber substrate made of carbon fiber, a composite substrate made of a composite material, or the like. The thickness of the high thermal conductive substrate is reduced by the material strength optimization, and the overall thickness of the camera is further reduced, so that the thickness of the terminal having the imaging function is reduced.

An embodiment of the present invention provides a method for manufacturing a camera. As shown in FIG. 6, the method includes:

S100, hollowing out a position of the FPC, and placing the FPC on the substrate;

S110, fixing an image sensor to the substrate corresponding to a position where the FPC is hollowed out;

S120, connecting the image sensor to the FPC through a signal trace.

Optionally, the substrate is made of a high thermal conductive material; the thermal conductivity of the high thermal conductive material is higher than or equal to 40 W/mk;

Optionally, the image sensor 1 is adhered to the substrate by using a high thermal conductive adhesive; the thermal conductivity of the high thermal conductive adhesive is higher than or equal to 0.2 W/mk.

Optionally, the high thermal conductivity substrate may be any material suitable as a substrate and having a thermal conductivity higher than 40 W/mk, such as a metal substrate made of metal, a carbon fiber substrate made of carbon fiber, a composite substrate made of a composite material, or the like. A method for manufacturing a camera provided by an embodiment of the present invention, the FPC is disposed on a substrate and the FPC is hollowed out at a certain position, and the image sensor is fixed on the substrate corresponding to the position where the FPC is hollowed out, thereby reducing the overall thickness of the camera, at least Lowering the height of one FPC (120um) reduces the thickness of the terminal with camera function; the substrate is made of high thermal conductivity material, which can improve the heat dissipation performance of the camera.

The invention provides a method for installing a camera. As shown in FIG. 7, the method includes:

S210, digging a pit on the inner surface or the middle frame of the terminal, the bottom surface area of the pit matching the area of the lower surface of the substrate to be embedded in the camera; matching means that the substrate is embedded in the pit to enable the substrate and The terminal screen or the middle frame is firmly fixedly connected;

S220, inserting the substrate to be embedded into the above-mentioned pit.

Optionally, before the substrate to be embedded is embedded in the pit, the surface of the substrate or the inner surface of the pit on the substrate is coated with adhesive; the fixing of the substrate to the screen or the middle frame can be strengthened.

The invention provides a method for installing a camera. As shown in FIG. 8, the method includes:

S310, a groove is formed on a side of the screen or the middle frame of the terminal, and the groove is matched with a size of the substrate to be embedded in the camera, and matching means that the substrate is embedded in the groove to enable the substrate and the terminal screen or the middle frame firmly Fixed connection

S320, inserting the substrate to be embedded into the above groove.

Optionally, before the substrate to be embedded is embedded in the groove, the surface of the substrate or the inner surface of the groove is coated with glue; the fixing of the substrate to the screen or the middle frame can be strengthened.

Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, and are not intended to be limiting; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that The technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or substitutions do not deviate from the technical solutions of the embodiments of the present invention. range.

Claims

A camera, wherein the camera comprises at least: an image sensor, a flexible printed circuit board FPC, and a substrate;

Wherein the FPC is disposed on the substrate, and the FPC has a position hollowed out;

The image sensor is fixed on the substrate corresponding to a position where the FPC is hollowed out;

The image sensor is connected to the FPC via a signal trace.
The camera of claim 1 wherein said substrate is a highly thermally conductive substrate, said thermally conductive substrate having a thermal conductivity greater than or equal to 40 W/mk.
The camera of claim 2 wherein:

The image sensor is adhered to the high thermal conductive substrate by a high thermal conductive adhesive, and the thermal conductivity of the high thermal conductive adhesive is higher than or equal to 0.2 W/mk;

The image sensor is connected to the FPC by a gold wire.
A terminal equipped with a camera, wherein the camera comprises: an image sensor, an FPC, and a substrate;

Wherein the FPC is disposed on the substrate, and the FPC has a position hollowed out;

The image sensor is fixed on the substrate corresponding to a position where the FPC is hollowed out;

The image sensor is connected to the FPC through a signal trace;

The FPC is connected to a motherboard of the terminal;

The substrate is fixedly connected to the screen or the middle frame of the terminal; or the screen or the middle frame of the terminal is used as a substrate, and the middle frame is a frame structure supporting the terminal.
The terminal according to claim 4, wherein said substrate has at least one extended side;

The side of the screen is provided with a groove, and the substrate is fixedly connected to the screen by the way that the extended edge is embedded in the groove;

Alternatively, the side of the middle frame is provided with a groove, and the substrate is fixedly connected to the middle frame by the manner in which the extended edge is embedded in the groove.
The terminal according to claim 4, wherein a recess is formed in the inner surface or the middle frame of the screen, and a bottom surface area of the recess matches an area of a lower surface of the substrate, the substrate It is fixed on the inner surface or the middle frame of the terminal by being embedded in the inner surface of the screen or the pit on the middle frame.
The terminal according to any one of claims 4-6, wherein the substrate is a high thermal conductivity substrate, and the high thermal conductivity substrate has a thermal conductivity higher than or equal to 40 W/mk.
The terminal of claim 7 wherein:

The image sensor is adhered to the high thermal conductive substrate by a high thermal conductive adhesive, and the thermal conductivity of the high thermal conductive adhesive is higher than or equal to 0.2 W/mk;

The image sensor is connected to the FPC by a gold wire.
A method of manufacturing the camera of claim 1 including:

Hollowing out a position of the FPC and placing the FPC on the substrate;

Fixing the image sensor to the substrate corresponding to the position where the FPC is hollowed out;

The image sensor is connected to the FPC via a signal trace.
The method according to claim 9, wherein the substrate is made of a highly thermally conductive material, and the thermal conductivity of the highly thermally conductive material is higher than or equal to 40 W/mk;

The image sensor is adhered to the substrate using a high thermal conductive adhesive having a thermal conductivity higher than or equal to 0.2 W/mk.