WO2018043710A1 - Procédé permettant de produire un dispositif organique - Google Patents

Procédé permettant de produire un dispositif organique Download PDF

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Publication number
WO2018043710A1
WO2018043710A1 PCT/JP2017/031594 JP2017031594W WO2018043710A1 WO 2018043710 A1 WO2018043710 A1 WO 2018043710A1 JP 2017031594 W JP2017031594 W JP 2017031594W WO 2018043710 A1 WO2018043710 A1 WO 2018043710A1
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Prior art keywords
substrate
sealing member
organic
sealing
resin film
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PCT/JP2017/031594
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English (en)
Japanese (ja)
Inventor
匡哉 下河原
進一 森島
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住友化学株式会社
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Publication of WO2018043710A1 publication Critical patent/WO2018043710A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Definitions

  • the present invention relates to a method for manufacturing an organic device.
  • the organic device includes a substrate, a first electrode provided on the substrate, an organic functional layer, and a second electrode. Since the organic functional layer contains an organic substance, it easily deteriorates due to moisture or the like. In order to prevent this deterioration, the organic device further includes a sealing member that seals the organic functional layer.
  • Patent Document 1 discloses a sealing member having a metal foil, an adhesive layer, and a resin film. In the sealing member described in Patent Document 1, an adhesive layer is provided on one main surface of the metal foil, and a resin film is provided on the other main surface.
  • an organic device when a member other than a sealing member, that is, a member in which a first electrode, an organic functional layer, and a second electrode are provided on a substrate is referred to as a device substrate, it is described in Patent Document 1.
  • a sealing member that is, a member in which a first electrode, an organic functional layer, and a second electrode are provided on a substrate
  • Patent Document 1 an organic device is manufactured by heat-bonding a sealing member to a device substrate via an adhesive layer.
  • the sealing member may be wrinkled.
  • bubbles are mixed between the sealing member and the device base material, and the quality of the organic device is deteriorated.
  • an object of the present invention is to provide an organic device manufacturing method capable of suppressing wrinkles of a sealing member at the time of heating and bonding between a device substrate and a sealing member.
  • a method for manufacturing an organic device comprising: a device substrate provided with a first electrode, an organic functional layer, and a second electrode on a main surface of a substrate; and the organic functional layer.
  • a step of bonding the device substrate; and the sealing member includes a sealing substrate, an adhesive layer provided on a first main surface of the sealing substrate, and a second of the sealing substrate.
  • the sealing is performed in a state where the main surface of the substrate and the adhesive layer are opposed to each other.
  • the sealing member is applied to the device substrate while pressurizing and heating the stop member and the device substrate. Combined, the heating temperature at the time of (heating temperature) is below the glass transition temperature of the material of the resin film.
  • the sealing member is a laminate of an adhesive layer, a sealing substrate, and a resin film. Since the resin film is laminated on the sealing substrate separately from the adhesive layer, when the sealing member is transported by the roll-to-roll method, the sealing member is hardly wrinkled. Since the sealing member is bonded to the device substrate via the adhesive layer, the heating temperature in the step of bonding the sealing member and the device substrate may be equal to or lower than the glass transition temperature of the resin film. . If it is such a heating temperature, even if the resin film is heated in the bonding step, the shrinkage in the width direction of the resin film is suppressed, so that generation of wrinkles of the sealing member accompanying the shrinkage of the resin film can be suppressed. .
  • the sealing substrate may be a metal foil.
  • the metal foil is sandwiched between the adhesive layer and the resin film. Therefore, oxidation of the metal foil can be suppressed.
  • the thickness of the resin film may be thicker than the sealing substrate.
  • a thicker resin film tends to be less likely to shrink. Therefore, a form in which the thickness of the resin film is thicker than that of the sealing substrate is more advantageous for suppressing wrinkling of the sealing member than when the thickness of the resin film is equal to or less than the thickness of the sealing substrate.
  • the sealing substrate is a metal foil, and when the thickness of the resin film is Tr and the thickness of the sealing substrate is Tm, the thickness of the sealing substrate is equal to the thickness of the resin film.
  • the ratio of Tr / Tm to the thickness may be 1.2 or more.
  • the sealing substrate may be a copper foil or an aluminum foil, for example.
  • the glass transition temperature of the resin film material may be 70 ° C. or higher, and the temperature during the heating may be 50 ° C. to 70 ° C.
  • the material of the resin film may be, for example, polyethylene terephthalate.
  • an organic device manufacturing method capable of suppressing wrinkles of a sealing member at the time of heat bonding between a device substrate and a sealing member.
  • FIG. 1 is a schematic diagram illustrating a configuration of an organic EL device that is an example of an organic device manufactured by an organic device manufacturing method according to an embodiment.
  • FIG. 2 is a flowchart of an example of a method for manufacturing the organic EL device shown in FIG.
  • FIG. 3 is a plan view of the device substrate. 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a drawing schematically showing a bonding step between a device substrate and a sealing member.
  • FIG. 6 is a drawing for explaining a bonding step in a method for producing an organic EL device (organic device).
  • an organic EL device 10 manufactured by a method for manufacturing an organic EL device (organic device) according to an embodiment is provided on a main surface 12 a of a substrate 12 with an anode (first Electrode) 14, organic functional layer 18, device base 30 provided with cathode (second electrode) 20, and sealing member 22.
  • the organic EL device 10 is an organic EL lighting panel used for illumination, for example.
  • the organic EL device 10 may include an extraction electrode 16 that is electrically connected to the cathode 20.
  • the organic EL device 10 can take a form in which light is emitted from the substrate 12 side or a form in which light is emitted from the side opposite to the substrate 12. Below, unless otherwise indicated, the form of the organic EL device 10 that includes the extraction electrode 16 and emits light from the substrate 12 side (the anode 14 side in FIG. 1) will be described.
  • the substrate 12 is translucent to light emitted from the organic EL device 10 (including visible light having a wavelength of 400 nm to 800 nm).
  • substrate 12 may exhibit a film form, and the example of the thickness of the board
  • the substrate 12 has flexibility.
  • An example of the substrate 12 is a plastic film or a polymer film.
  • Examples of the material of the substrate 12 include polyethersulfone (PES); polyester resin such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefin resin such as polyethylene (PE), polypropylene (PP), and cyclic polyolefin; polyamide Polyresin resin; Polystyrene resin; Polyvinyl alcohol resin; Saponified ethylene-vinyl acetate copolymer; Polyacrylonitrile resin; Acetal resin; Polyimide resin; Epoxy resin.
  • PES polyethersulfone
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • polyolefin resin such as polyethylene (PE), polypropylene (PP), and cyclic polyolefin
  • polyamide Polyresin resin Polystyrene resin
  • Polyvinyl alcohol resin Saponified ethylene
  • a driving circuit for example, a circuit including a thin film transistor
  • driving the organic EL device 10 may be formed on the substrate 12.
  • Such a drive circuit is usually made of a transparent material.
  • the substrate 12 may further have a moisture barrier layer.
  • the moisture barrier layer is provided on the surface of the substrate 12.
  • the moisture barrier layer may have a function of barriering gas (for example, oxygen) in addition to the function of barriering moisture.
  • the moisture barrier layer can be, for example, a film made of silicon, oxygen and carbon, a film made of silicon, oxygen, carbon and nitrogen, or a film made of a metal oxide.
  • examples of the material of the moisture barrier layer are silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, and the like.
  • An example of the thickness of the moisture barrier layer is not less than 100 nm and not more than 10 ⁇ m.
  • the anode 14 is provided on the main surface 12 a of the substrate 12.
  • an electrode having optical transparency is used.
  • a thin film of metal oxide, metal sulfide, metal or the like having high electrical conductivity can be used, and a thin film having high light transmittance is preferably used.
  • the anode 14 may have a network structure made of a conductor (for example, metal).
  • the thickness of the anode 14 can be determined in consideration of light transmittance, electrical conductivity, and the like.
  • the thickness of the anode 14 is usually 10 nm to 10 ⁇ m, preferably 20 nm to 1 ⁇ m, and more preferably 50 nm to 500 nm.
  • Examples of the material of the anode 14 include indium oxide, zinc oxide, tin oxide, indium tin oxide (Indium Tin Oxide: abbreviated as ITO), indium zinc oxide (Indium Zinc Oxide: abbreviated as IZO), gold, platinum, silver, and copper. Among these, ITO, IZO, or tin oxide is preferable.
  • the anode 14 can be formed as a thin film made of the exemplified materials.
  • organic substances such as polyaniline and derivatives thereof, polythiophene and derivatives thereof may be used. In this case, the anode 14 can be formed as a transparent conductive film.
  • the extraction electrode 16 is provided on the substrate 12 in a state of being separated from the anode 14 and insulated.
  • the extraction electrode 16 is connected to the cathode 20.
  • the extraction electrode 16 can be used to externally connect the cathode 20.
  • the material and thickness of the extraction electrode 16 can be the same as that of the anode 14.
  • the organic functional layer 18 is a functional part that contributes to light emission of the organic EL device 10 such as charge transfer and charge recombination in accordance with power (for example, voltage) applied to the anode 14 and the cathode 20.
  • the organic functional layer 18 is provided so as to cover a part of the anode 14. A part of the organic functional layer 18 is also disposed on the substrate 12 between the anode 14 and the extraction electrode 16 as shown in FIG. Thereby, the short circuit with the anode 14 and other electrodes (for example, the cathode 20 and the extraction electrode 16) is prevented.
  • the organic functional layer 18 has a light emitting layer that is a functional layer that emits light.
  • the thickness of the light emitting layer is, for example, 1 nm to 1 ⁇ m, preferably 2 nm to 500 nm, and more preferably 10 nm to 200 nm.
  • the light emitting layer is usually formed mainly from an organic substance that emits at least one of fluorescence and phosphorescence, or an organic substance and a dopant material that assists the organic substance.
  • the dopant material is added, for example, in order to improve the light emission efficiency or change the light emission wavelength.
  • the organic substance contained in the light emitting layer may be a low molecular compound or a high molecular compound.
  • organic substances that mainly emit at least one of fluorescence and phosphorescence include the following dye materials, metal complex materials, and polymer materials.
  • the dye-based material examples include cyclopentamine or a derivative thereof, tetraphenylbutadiene or a derivative thereof, triphenylamine or a derivative thereof, oxadiazole or a derivative thereof, pyrazoloquinoline or a derivative thereof, distyrylbenzene or a derivative thereof, Styrylarylene or its derivative, pyrrole or its derivative, thiophene ring compound, pyridine ring compound, perinone or its derivative, perylene or its derivative, oligothiophene or its derivative, oxadiazole dimer or its derivative, pyrazoline dimer or its derivative, Examples include quinacridone or a derivative thereof, coumarin or a derivative thereof.
  • the metal complex material examples include rare earth metals such as Tb, Eu, and Dy, or Al, Zn, Be, Pt, Ir, or the like as a central metal, and oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, quinoline. Examples thereof include metal complexes having a structure or the like as a ligand.
  • metal complexes include metal complexes having light emission from triplet excited states such as iridium complexes and platinum complexes, aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzoxazolyl zinc complexes, benzothiazole zinc complexes, azomethyl zinc complexes, A porphyrin zinc complex, a phenanthroline europium complex, etc. are mentioned.
  • Examples of the polymer material include polyparaphenylene vinylene or derivatives thereof, polythiophene or derivatives thereof, polyparaphenylene or derivatives thereof, polysilane or derivatives thereof, polyacetylene or derivatives thereof, polyfluorene or derivatives thereof, polyvinylcarbazole or derivatives thereof, Examples include materials obtained by polymerizing at least one of the dye material and the metal complex material.
  • a dopant material mainly assisting an organic substance that emits at least one of fluorescence and phosphorescence, for example, perylene or a derivative thereof, coumarin or a derivative thereof, rubrene or a derivative thereof, quinacridone or a derivative thereof, squalium or a derivative thereof, porphyrin or a derivative thereof Styryl dye, tetracene or a derivative thereof, pyrazolone or a derivative thereof, decacyclene or a derivative thereof, phenoxazone or a derivative thereof, and the like.
  • the organic functional layer 18 may be a laminate including a light emitting layer and another functional layer.
  • Examples of the functional layer provided between the anode 14 and the light emitting layer include a hole injection layer and a hole transport layer.
  • Examples of the functional layer provided between the cathode 20 and the light emitting layer include an electron transport layer and an electron injection layer. The thicknesses of the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer can be appropriately set according to the device performance of the organic EL device 10 and the like.
  • the hole injection layer is a functional layer having a function of improving hole injection efficiency from the anode 14 to the light emitting layer.
  • a known hole injection material can be used as the material of the hole injection layer.
  • the hole injection material include oxides such as vanadium oxide, molybdenum oxide, ruthenium oxide, and aluminum oxide, phenylamine compounds, starburst amine compounds, phthalocyanine compounds, amorphous carbon, polyaniline, and polyethylenedioxythiophene.
  • polythiophene derivatives such as (PEDOT).
  • the hole transport layer is a functional layer having a function of improving the hole injection efficiency from the portion closer to the anode 14 in the anode 14, the hole injection layer, or the hole transport layer to the light emitting layer.
  • a known hole transport material can be used as the material for the hole transport layer.
  • the material for the hole transport layer include polyvinyl carbazole or derivatives thereof, polysilane or derivatives thereof, polysiloxane or derivatives thereof having an aromatic amine in the side chain or main chain, pyrazoline or derivatives thereof, arylamine or derivatives thereof, stilbene.
  • hole transport layer examples include hole transport layer materials disclosed in, for example, JP-A-2012-144722.
  • the electron transport layer is a functional layer having a function of improving the efficiency of electron injection from the portion closer to the cathode 20 in the cathode 20, the electron injection layer, or the electron transport layer to the light emitting layer.
  • a known material can be used as the electron transport material constituting the electron transport layer.
  • an oxadiazole derivative As an electron transport material constituting the electron transport layer, an oxadiazole derivative, anthraquinodimethane or a derivative thereof, benzoquinone or a derivative thereof, naphthoquinone or a derivative thereof, anthraquinone or a derivative thereof, tetracyanoanthraquinodimethane or a derivative thereof, Examples include fluorenone derivatives, diphenyldicyanoethylene or derivatives thereof, diphenoquinone derivatives, or metal complexes of 8-hydroxyquinoline or derivatives thereof, polyquinoline or derivatives thereof, polyquinoxaline or derivatives thereof, polyfluorene or derivatives thereof, and the like.
  • the electron injection layer is a functional layer having a function of improving the electron injection efficiency from the cathode 20 to the light emitting layer.
  • the electron injection layer may be a part of the cathode 20.
  • a known electron injection material can be used as the material of the electron injection layer. Examples of the material for the electron injection layer include alkali metals, alkaline earth metals, alloys containing one or more of alkali metals and alkaline earth metals, oxides of alkali metals or alkaline earth metals, halides, and carbonates. Or a mixture of these substances.
  • An example of the layer configuration of the organic functional layer 18 including the various functional layers described above is shown below.
  • the anode and the cathode are shown in parentheses in order to show the positional relationship between at least one layer of the organic functional layer 18 and the anode and the cathode.
  • the number of light emitting layers included in the organic functional layer 18 may be one or two or more.
  • the organic functional layer 18 may be configured by directly laminating a plurality of light emitting layers without providing the charge generation layer.
  • the charge generation layer is a layer that generates holes and electrons by applying an electric field. Examples of the charge generation layer include a thin film made of vanadium oxide, ITO, molybdenum oxide, or the like.
  • the cathode 20 is provided on the organic functional layer 18.
  • the cathode 20 is provided on the organic functional layer 18 so as to be connected to the extraction electrode 16.
  • a part of the cathode 20 may be disposed on the substrate 12.
  • the thickness of the cathode 20 varies depending on the material used, and is set in consideration of electrical conductivity, durability, and the like.
  • the thickness of the cathode 20 is usually 10 nm to 10 ⁇ m, preferably 20 nm to 1 ⁇ m, and more preferably 50 nm to 500 nm.
  • the material of the cathode 20 is made from the light emitting layer of the organic functional layer 18 so that light from the organic functional layer 18 (specifically, light from the light emitting layer) is reflected by the cathode 20 and travels toward the anode 14 side.
  • a material having a high reflectance with respect to light (particularly visible light) is preferable.
  • the material of the cathode 20 include alkali metals, alkaline earth metals, transition metals, and Group 13 metals of the periodic table.
  • a transparent conductive electrode made of a conductive metal oxide, a conductive organic material, or the like may be used as the cathode 20 .
  • the sealing member 22 is a member for sealing at least the organic functional layer 18.
  • the sealing member 22 is provided on the cathode 20.
  • the sealing member 22 is provided so as to cover the cathode 20, and a part of the anode 14 and a part of the extraction electrode 16 are provided so as to be exposed from the sealing member 22. .
  • the part located outside the sealing member 22 among the anode 14 and the extraction electrode 16 functions as an external connection region.
  • the sealing member 22 includes a sealing substrate 24, an adhesive layer 26, and a resin film 28.
  • the sealing substrate 24 has at least a barrier function to barrier moisture.
  • the sealing substrate 24 may have a gas barrier function.
  • Examples of the sealing substrate 24 include a metal foil, a barrier film in which a barrier functional layer is formed on the front or back surface of a transparent plastic film, or both surfaces thereof, a thin film glass having flexibility, and a barrier property on a plastic film. Examples include a film in which a metal is laminated.
  • Examples of the barrier functional layer include the moisture barrier layer described above.
  • An example of the thickness of the sealing substrate 24 is 10 ⁇ m to 300 ⁇ m. From the viewpoint of barrier properties, the metal foil is preferably a copper foil, an aluminum foil, or a stainless steel foil, and more preferably a copper foil or an aluminum foil.
  • the thickness of the metal foil is preferably as thick as possible from the viewpoint of suppressing pinholes, but is preferably 10 ⁇ m to 50 ⁇ m from the viewpoint of flexibility.
  • the adhesive layer 26 is provided on the first main surface 24 a of the sealing substrate 24.
  • the pressure-sensitive adhesive layer 26 bonds the sealing base material 24 to the device base material 30 on which the anode 14, the organic functional layer 18, and the cathode 20 are formed on the main surface 12a of the substrate 12, and for a moisture barrier. Used.
  • the adhesive layer 26 only needs to have a thickness capable of embedding a laminated structure including the anode 14, the organic functional layer 18, and the cathode 20.
  • An example of the thickness of the adhesive layer 26 is 5 ⁇ m to 100 ⁇ m.
  • the pressure-sensitive adhesive layer 26 is a layer made of a pressure-sensitive adhesive, and the pressure-sensitive adhesive means a pressure-sensitive adhesive.
  • An example of the material of the adhesive layer 26 is a thermoplastic resin.
  • examples of the thermoplastic resin for the adhesive layer include olefin elastomers, styrene elastomers, and butadiene elastomers. Unless otherwise specified, in this specification, the concept of “adhesive” does not include the concept of an adhesive. That is, “adhesive” means an adhesive other than a pressure-sensitive adhesive.
  • the resin film 28 is provided on the second main surface (surface opposite to the first main surface 24a) 24b of the sealing substrate 24.
  • An example of the thickness of the resin film 28 is 10 ⁇ m to 100 ⁇ m.
  • the resin film 28 may be thicker than the sealing substrate 24. That is, when the thickness of the resin film 28 is referred to as Tr and the thickness of the sealing substrate 24 is referred to as Tm, in one embodiment, the thickness of the sealing substrate 24 equal to the thickness (Tr) of the resin film 28 is used.
  • the ratio (Tr / Tm) to the thickness (Tm) may exceed 1.
  • the sealing substrate 24 is a metal foil
  • the ratio (Tr / Tm) is preferably greater than 1, and is preferably 1.2 or more.
  • the upper limit of the thickness or ratio (Tr / Tm) of the resin film 28 can be set according to the overall thickness of the organic EL device 10.
  • the upper limit of the ratio (Tr / Tm) is 10.
  • the material of the resin film 28 include PET, polyimide (PI), cycloolefin copolymer (COC), cycloolefin polymer (COP), and polyamide (PA).
  • the manufacturing method of the organic EL device 10 includes a step of forming a device base (hereinafter referred to as “device base formation step”) S10, a device base and a sealing member.
  • the anode 14 and the extraction electrode are respectively provided in each of the plurality of device forming regions 32 set in the longitudinal direction on the long substrate 12.
  • the device base material 30 provided with the organic functional layer 18 and the cathode 20 is formed.
  • the device formation region 32 is a region corresponding to a desired size (for example, product size) of the organic EL device 10.
  • the device substrate forming step S10 includes a step S10A for forming an anode (first electrode), a step S10B for forming an organic functional layer, and a step S10C for forming a cathode (second electrode).
  • a step S10B for forming an organic functional layer for forming an organic functional layer
  • Process S10A, process S10B, and process S10C are referred to as anode formation process S10A, organic functional layer formation process S10B, and cathode formation process S10C.
  • the anode 14 is formed in each of the plurality of device forming regions 32.
  • the extraction electrode 16 is also formed in each device formation region 32 together with the anode 14.
  • the anode 14 and the extraction electrode 16 can be formed by a known method in the manufacture of the organic EL device 10.
  • Examples of the method for forming the anode 14 and the extraction electrode 16 include a vacuum film forming method, an ion plating method, a plating method, and a coating method.
  • Examples of the coating method include an ink jet printing method, but other known coating methods may be used as long as the anode 14 and the extraction electrode 16 can be formed.
  • Known coating methods other than the inkjet printing method include, for example, a micro gravure coating method, a gravure coating method, a bar coating method, a roll coating method, a wire bar coating method, a spray coating method, a screen printing method, a flexographic printing method, and an offset printing method. And a nozzle printing method.
  • the anode 14 and the extraction electrode 16 can be formed, for example, by forming a conductive film on the main surface 12a of the substrate 12 and then patterning the conductive film into patterns of the anode 14 and the extraction electrode 16, respectively.
  • the anode 14 and the extraction electrode 16 may be formed by directly producing a conductive film corresponding to the pattern of each of the anode 14 and the extraction electrode 16.
  • the organic functional layer 18 is formed on the anode 14.
  • the method for forming the light emitting layer include a vacuum film forming method and a coating method.
  • the coating method include an ink jet printing method, but other known coating methods may be used as long as the light-emitting layer can be formed.
  • the coating method exemplified in the description of the case where the anode 14 (or the extraction electrode 16) is formed by the coating method can be given.
  • the functional layers may be formed in order from the anode 14 side according to the layer configuration of the organic functional layer 18.
  • the method for forming each functional layer may be the same as that for the light emitting layer.
  • the cathode 20 is formed on the organic functional layer 18.
  • the cathode 20 can be formed by a method similar to the method for forming the anode 14.
  • the elongate device base material 30 obtained through cathode formation process S10C is wound up in roll shape, it is set as the 1st roll 34 (refer FIG. 6), and the following bonding process S11 is implemented.
  • At least one of the anode forming step S10A, the organic functional layer forming step S10B, and the cathode forming step S10C may be performed by a roll-to-roll method.
  • the organic functional layer formation step S10B may be performed by a roll-to-roll method, or the organic functional layer formation step S10B and the cathode formation step S10C may be continuously performed by a roll-to-roll method.
  • the organic EL device 10 is formed by bonding the device substrate 30 and the sealing member 22 formed in the device substrate forming step S ⁇ b> 10.
  • the roll-to-roll system is employ
  • FIG. That is, as illustrated in FIG. 6, a long sealing member 22 is prepared, and the long sealing member 22 and the long device base material 30 are continuously conveyed in a roll-to-roll manner, These are continuously bonded by applying pressure and heating with the heating roll 38A and the heating roll 38B.
  • the bonding process S11 will be described in detail using FIG. Unless otherwise specified, a direction orthogonal to the longitudinal direction of the device base material 30 and the sealing member 22 is referred to as a width direction.
  • the first roll 34 around which the device base material 30 is wound is set in the first feeding portion 36, and the device base material 30 is fed out from the first roll 34.
  • the fed device base material 30 is conveyed while being guided by the guide roll 40 toward the pair of heating rolls 38A and the heating roll 38B.
  • the device base material 30 is conveyed in the longitudinal direction.
  • the second roll 42 around which the long sealing member 22 is wound is set on the second feeding portion 44, and the sealing member 22 is fed out from the second roll 42.
  • the drawn-out sealing member 22 is conveyed while being guided by the guide roll 46 toward the pair of heating rolls 38A and the heating roll 38B.
  • the sealing member 22 is also conveyed in the longitudinal direction.
  • the heating roll 38A and the heating roll 38B are configured to heat the device substrate 30 and the sealing member 22 carried between them.
  • the heating roll 38 ⁇ / b> A and the heating roll 38 ⁇ / b> B are spaced apart so that they can be pressed with a predetermined pressure when the device substrate 30 and the sealing member 22 are carried between them.
  • the transport path of the device base material 30 and the sealing member 22 is concretely arranged on the main surface 12 a side of the substrate 12 when they are carried between the heating roll 38 ⁇ / b> A and the heating roll 38 ⁇ / b> B.
  • the side of the substrate 12 on which the anode 14, the organic functional layer 18, the cathode 20, and the like are formed and the adhesive layer 26 of the sealing member 22 may be set to face each other.
  • the device base material 30 and the sealing member 22 carried in between the heating roll 38A and the heating roll 38B are bonded by being pressurized and heated by the heating roll 38A and the heating roll 38B.
  • the heating temperature is equal to or lower than the glass transition temperature of the material of the resin film 28.
  • the temperature during heating is preferably normal temperature (for example, 23 ° C.) or more and less than the glass transition temperature of the material of the resin film 28.
  • the temperature during heating (heating temperature) is, for example, preferably 40 ° C. or higher, and more preferably 50 ° C. or higher, from the viewpoint of ease of bonding, reliability, shortening of the bonding step S11, and the like. For example, when the glass transition temperature is 80 ° C.
  • examples of the heating temperature include 40 ° C. to 80 ° C., 50 ° C. More preferred is ⁇ 80 ° C.
  • examples of the heating temperature include 40 ° C. to 70 ° C., and 50 ° C. to 70 ° C. More preferred. It is preferable that the heating temperature is maintained at a predetermined temperature from when the device substrate 30 and the sealing member 22 come into contact with the heating roll 38A and the heating roll 38B, respectively, until the end of the bonding step S11. At the time of heating, it is preferable that the temperature of the sealing member 22 has reached the range of the above heating temperature, but the set temperature of the heating roll 38A and the heating roll 38B may be in the range of the above heating temperature. .
  • the organic EL device 10 is formed in each device formation area 32 by the sealing member 22 being bonded to the device base material 30 by the heating roll 38A and the heating roll 38B. Therefore, the device base with a sealing member that is a bonded body of the sealing member 22 and the device base 30 corresponds to the connection body 48 of the plurality of organic EL devices 10.
  • the connecting body 48 fed out from the pair of heating rolls 38 ⁇ / b> A and the heating rolls 38 ⁇ / b> B may be wound up by the winding unit 50.
  • a cutting step of cutting the connection body 48 for each device forming region 32 may be performed after the bonding step S ⁇ b> 11.
  • the organic EL device 10 having a desired size for example, product size
  • the substrate 12 is cut for each device forming region 32 while conveying the long connecting body 48 after the bonding step S11 in the longitudinal direction.
  • the connecting body 48 in the form in which the connecting body 48 is wound in a roll shape, the connecting body 48 may be drawn out from the roll of the connecting body 48 and the cutting process may be performed.
  • the connecting body 48 obtained in the bonding step S ⁇ b> 11 may be continuously cut while being conveyed by a guide roll without being wound by the winding portion 50.
  • the sealing member 22 included in the organic EL device 10 is a laminate of an adhesive layer 26, a sealing substrate 24, and a resin film 28.
  • the sealing substrate 24 is sandwiched between the adhesive layer 26 and the resin film 28. Yes. Since the resin film 28 is laminated on the sealing substrate 24 separately from the adhesive layer 26, the sealing member 22 is continuously bonded to the device substrate 30 by a roll-to-roll method. Even if 22 is conveyed in the longitudinal direction, the sealing member 22 is not easily wrinkled during the conveyance process.
  • the sealing substrate 24 is a metal foil
  • oxidation of the metal foil surface can be suppressed by the resin film 28.
  • the sealing substrate 24 is a copper foil or an aluminum foil, oxidation is likely to occur, so that the oxidation suppression by the resin film 28 is effective.
  • the sealing member 22 Since the sealing member 22 is bonded to the device base material 30 via the adhesive layer 26, the sealing member 22 and the device base material 30 can be stacked and pressed to be bonded.
  • pressure is applied to the sealing member 22 and the device base material 30, the followability of the adhesive layer 26 to the unevenness on the device base material 30 is improved by heating, and the adhesive layer 26 is applied to the device base material 30. Adhesion is also improved.
  • the heating at the time of bonding of the sealing member 22 and the device base material 30 is mainly for improving the uneven follow-up property of the adhesive layer 26 and improving the adhesion.
  • An adhesive layer made of an adhesive that does not include the concept of an adhesive is often heated at a temperature higher than the glass transition temperature of the material of the resin film 28 in order to improve adhesion.
  • the sealing member 22 of the present embodiment employs the adhesive layer 26, the uneven followability of the adhesive layer 26 is improved and adhesion is improved even at a temperature equal to or lower than the glass transition temperature of the material of the resin film 28. Can be made.
  • the heating temperature can be set to be equal to or lower than the glass transition temperature of the material of the resin film 28, shrinkage in the width direction of the resin film 28 included in the sealing substrate 24 is suppressed, and the sealing member 22 is not easily wrinkled. . Therefore, when the sealing member 22 and the device base material 30 are bonded, bubbles are hardly mixed between the sealing member 22 and the device base material 30 due to the wrinkles of the sealing member 22. Deterioration of the organic EL device 10 can be suppressed.
  • the roll-to-roll system is employ
  • the warpage of the sealing member 22 and the device base material 30 in the conveying direction can be suppressed by adjusting the tension applied to the sealing member 22 and the device base material 30.
  • the thicker resin film 28 tends to suppress thermal shrinkage in the width direction when heated. Therefore, in the form in which the resin film 28 is thicker than the sealing substrate 24, the generation of wrinkles in the width direction due to heating during bonding can be further suppressed as compared with the case where the resin film 28 is equal to or less than the thickness of the sealing substrate 24. . As a result, bubbles are less likely to be mixed between the sealing member 22 and the device substrate 30.
  • the form in which the resin film 28 is thicker than the sealing base material 24 is more effective when the sealing base material 24 is an aluminum foil that tends to be wrinkled.
  • the ratio (Tr / Tm) of the thickness (Tr) of the resin film 28 to the thickness (Tm) of the sealing substrate 24 is 1.2 or more. Is more effective.
  • the effect of the manufacturing method of the organic EL device 10 was verified by experiments.
  • a verification experiment will be described.
  • a device substrate 30 having a width of 300 mm and a sealing member 22 having a width of 300 mm were prepared.
  • the configuration of the prepared device substrate 30 was as shown in FIGS. 3 and 4.
  • the structure of the organic functional layer 18 the structure of (f) above, that is, a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are stacked in this order from the anode 14 side. Met.
  • the sealing member 22 was a laminate in which a sealing base 24 was sandwiched between an adhesive layer 26 and a resin film 28.
  • a sealing substrate 24 As the sealing substrate 24, an aluminum foil having a thickness of 30 ⁇ m was used.
  • an olefin-based elastomer was used.
  • the thickness of the adhesive layer 26 was 30 ⁇ m.
  • a PET film glass transition temperature: about 70 ° C.
  • the prepared sealing member 22 and the device base material 30 were each conveyed in the longitudinal direction, and bonded with a pair of heating rolls 38A and heating rolls 38B.
  • the conveyance speed of the sealing member 22 and the device base material 30 was 5 m / min.
  • a tension of 30 N was applied per 300 mm, which is the length in the width direction of the sealing member 22 and the device substrate 30.
  • the pressure at the time of pasting was 0.1 MPa, and the heating temperature was 50 ° C.
  • the heating temperature at the time of bonding is equal to or lower than the glass transition temperature of the material of the resin film 28. Therefore, it was verified that the wrinkle of the sealing member 22 could be suppressed by adopting the adhesive layer 26 and setting the heating temperature at the time of bonding to a temperature lower than the glass transition temperature of the material of the resin film 28. .
  • the present invention is not limited to a mode in which light is emitted from the substrate side (the anode side in FIG. 1), and can also be applied to an organic EL device that generates light from the opposite side to the substrate (the cathode side in FIG. 1).
  • the present invention is also applicable to organic devices other than organic EL devices, such as organic solar cells, organic photodetectors, and organic transistors.
  • SYMBOLS 10 Organic EL device (organic device), 12 ... Substrate, 12a ... Main surface, 14 ... Anode (first electrode), 18 ... Organic functional layer, 20 ... Cathode (second electrode), 22 ... Sealing member , 22 ... sealing member, 24 ... sealing substrate, 24a ... first main surface, 24b ... second main surface, 26 ... adhesive layer, 28 ... resin film.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Un mode de réalisation de la présente invention concerne un procédé permettant de produire un dispositif organique (10) qui comprend un substrat de dispositif (30) obtenu en fournissant à une surface principale (12a) d'un substrat (12) une première électrode (14), une couche fonctionnelle organique (18) et une seconde électrode (20), et un élément d'étanchéité (22) qui scelle la couche fonctionnelle organique. Ce procédé permettant de produire un dispositif organique comprend une étape consistant à lier en continu un long élément d'étanchéité à un long substrat de dispositif, tout en transportant l'élément d'étanchéité et le substrat de dispositif au moyen d'un système rouleau à rouleau ; et l'élément d'étanchéité comprend un substrat d'étanchéité présentant des première et seconde surfaces principales (24a, 24b) sur lesquelles sont respectivement disposées une couche adhésive et une couche de résine. À l'étape de liaison, l'élément d'étanchéité est lié au substrat de dispositif pendant que la surface principale du substrat et la couche adhésive se font face et qu'une pression et une chaleur sont appliquées à l'élément d'étanchéité et au substrat de dispositif ; et la température de chauffage à l'étape de liaison n'est pas supérieure à la température de transition vitreuse du matériau de la couche de résine.
PCT/JP2017/031594 2016-09-05 2017-09-01 Procédé permettant de produire un dispositif organique WO2018043710A1 (fr)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005298703A (ja) * 2004-04-13 2005-10-27 Mitsui Chemicals Inc 粘着性フィルム、筐体およびそれを用いた有機ｅｌ発光素子
WO2011052630A1 (fr) * 2009-10-28 2011-05-05 コニカミノルタホールディングス株式会社 Procédé de production de panneau électroluminescent organique, et panneau électroluminescent organique
JP2014116115A (ja) * 2012-12-06 2014-06-26 Hitachi Ltd 有機ｅｌ封止装置、封止ロールフィルム製作装置及び有機ｅｌ封止システム
WO2015099079A1 (fr) * 2013-12-26 2015-07-02 日本ゼオン株式会社 Film d'étanchéité, affichage électroluminescent organique, et dispositif semi-conducteur organique
US20150349294A1 (en) * 2014-05-28 2015-12-03 Lg Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US20150380685A1 (en) * 2014-06-25 2015-12-31 Lg Display Co., Ltd. Organic light emitting display apparatus
WO2016063869A1 (fr) * 2014-10-22 2016-04-28 コニカミノルタ株式会社 Substrat d'extraction de lumière, procédé de fabrication d'un substrat d'extraction de lumière, élément électroluminescent organique, et procédé de fabrication d'un élément électroluminescent organique

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005298703A (ja) * 2004-04-13 2005-10-27 Mitsui Chemicals Inc 粘着性フィルム、筐体およびそれを用いた有機ｅｌ発光素子
WO2011052630A1 (fr) * 2009-10-28 2011-05-05 コニカミノルタホールディングス株式会社 Procédé de production de panneau électroluminescent organique, et panneau électroluminescent organique
JP2014116115A (ja) * 2012-12-06 2014-06-26 Hitachi Ltd 有機ｅｌ封止装置、封止ロールフィルム製作装置及び有機ｅｌ封止システム
WO2015099079A1 (fr) * 2013-12-26 2015-07-02 日本ゼオン株式会社 Film d'étanchéité, affichage électroluminescent organique, et dispositif semi-conducteur organique
US20150349294A1 (en) * 2014-05-28 2015-12-03 Lg Display Co., Ltd. Organic light emitting display apparatus and method of manufacturing the same
US20150380685A1 (en) * 2014-06-25 2015-12-31 Lg Display Co., Ltd. Organic light emitting display apparatus
WO2016063869A1 (fr) * 2014-10-22 2016-04-28 コニカミノルタ株式会社 Substrat d'extraction de lumière, procédé de fabrication d'un substrat d'extraction de lumière, élément électroluminescent organique, et procédé de fabrication d'un élément électroluminescent organique

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